Power supply module and server

Abstract

The present application relates to the technical field of servers, and discloses a power supply module and a server. The power supply module comprises a plurality of power supply chips, a plurality of input capacitors, a plurality of output inductors and a first printed circuit board; the plurality of power supply chips are arranged on the upper surface of the first printed circuit board at intervals, and input ends of the plurality of power supply chips are connected into an input power supply; the plurality of input capacitors are fixedly arranged on the first printed circuit board, and the plurality of input capacitors are connected to the input ends of the plurality of power supply chips in a one-to-one correspondence mode; and the plurality of output inductors and the plurality of power supply chips are stacked vertically by means of the first printed circuit board, input ends of the plurality of output inductors are connected to output ends of the plurality of power supply chips in a one-to-one correspondence mode, output ends of the plurality of output inductors are connected to a load by means of a via hole in a third printed circuit board and are used for supplying power to the load, and the plurality of output inductors are located on the lower surface of the third printed circuit board.

Description

Power modules and servers

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on November 30, 2023, with application number 202311620091.4 and application name “Power Module and Server,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to a power supply module and a server. Background Art

[0004] The role of a multiphase power supply is to convert external DC input voltage into a DC operating voltage level suitable for the actuators of devices such as servers, ensuring stable power supply and smooth operation. The Central Processing Unit (CPU), the "brain" of a server, is the primary metric for measuring server performance. With the rise of technologies such as 5G, big data, cloud computing, and artificial intelligence, CPU power demands are continuously increasing, and the issue of increased current loss in server power supply paths is a growing concern.

[0005] Traditional server CPU power supply architectures utilize a 12V horizontal power supply. Specifically, multi-phase power supplies utilize a method where the power chip is separated from the output inductor and placed on the same horizontal plane as the load (e.g., the CPU). The inventors recognized that in this approach, power needs to be transmitted from the output inductor to the load. This results in a long transmission path, high transmission impedance, and significant losses, leading to low efficiency in multi-phase power supply designs.

[0006] Summary of the Invention

[0007] According to various embodiments disclosed herein, in a first aspect, the present application provides a power supply module comprising a plurality of power chips, a plurality of input capacitors, a plurality of output inductors, and a first printed circuit board; the plurality of power chips are spaced apart on the upper surface of the first printed circuit board, the input terminals of the plurality of power chips being connected to an input power source; the plurality of input capacitors are fixedly mounted on the first printed circuit board, the plurality of input capacitors being connected one-to-one with the input terminals of the plurality of power chips; the plurality of output inductors are stacked vertically with the plurality of power chips via the first printed circuit board, the input terminals of the plurality of output inductors being connected one-to-one with the output terminals of the plurality of power chips, and the output terminals of the plurality of output inductors being connected to a load via vias on a third printed circuit board for supplying power to the load, wherein the plurality of output inductors are located on the lower surface of the third printed circuit board, and the load is located on the upper surface of the third printed circuit board; a first area of ​​the input capacitors, the power chips, and the output inductors is smaller than an area of ​​the upper surface of the first printed circuit board, and an area of ​​the first printed circuit board is smaller than an area of ​​the third printed circuit board; the first area is the surface area of ​​the input capacitors, the power chips, and the output inductors on a side close to the first printed circuit board.

[0008] According to an embodiment of the present application, in a second aspect, a server is provided, comprising a third printed circuit board; a load, disposed on the upper surface of the third printed circuit board; a plurality of power supply modules according to the first aspect or any corresponding embodiment thereof, spaced apart on the lower surface of the third printed circuit board, wherein the plurality of power supply modules are connected to the load through vias on the third printed circuit board for supplying power to the load.

[0009] The details of one or more embodiments of the present application are set forth in the accompanying drawings and the description below. Other features and advantages of the present application will become apparent from the description, drawings, and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the specific implementation methods of this application or the technical solutions in related technologies, the following is a brief introduction to the drawings required for use in the specific implementation methods or related technical descriptions. Obviously, the drawings described below are some implementation methods of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] FIG1 is a schematic diagram of a top view of a traditional power supply architecture;

[0012] FIG2 is a schematic diagram of the main structure of a traditional power supply architecture;

[0013] FIG3 is a schematic diagram of the main structure of a power module according to one or more embodiments of the present application;

[0014] FIG4 is a schematic top view of a power module according to one or more embodiments of the present application;

[0015] FIG5 is a schematic diagram of the main structure of a power module according to another one or more embodiments of the present application;

[0016] FIG6 is a schematic top view of a power module according to one or more other embodiments of the present application;

[0017] FIG7 is a circuit diagram of a power supply module according to one or more embodiments of the present application;

[0018] FIG8 is a schematic structural diagram of welding points of an output inductor according to one or more embodiments of the present application;

[0019] FIG9 is a schematic diagram of the main structure of a power supply module whose output inductor is a coupled inductor according to one or more embodiments of the present application;

[0020] FIG10 is a schematic diagram of the main structure of a power supply module with an embedded input capacitor according to one or more embodiments of the present application;

[0021] FIG11 is a schematic structural diagram of a power chip according to one or more embodiments of the present application;

[0022] FIG12 is a schematic diagram of input voltage conversion according to one or more embodiments of the present application;

[0023] FIG13 is a schematic top view of a configuration of an output capacitor according to one or more embodiments of the present application;

[0024] FIG14 is a schematic diagram of a front view of a configuration of an output capacitor according to one or more other embodiments of the present application;

[0025] FIG15 is a schematic top view of a configuration of an output capacitor according to one or more other embodiments of the present application;

[0026] FIG16 is a schematic diagram of the main structure of a server according to one or more embodiments of the present application;

[0027] FIG17 is a circuit diagram of a server according to one or more embodiments of the present application;

[0028] FIG18 is a schematic top view of a ball planting structure according to one or more embodiments of the present application;

[0029] FIG19 is a schematic diagram of the front structure of a power module with ball implantation according to one or more embodiments of the present application;

[0030] FIG20 is a schematic diagram of the front view of the connection between the power module and the load according to one or more embodiments of the present application;

[0031] FIG21 is a schematic diagram of a front view of a connection method between a power module and a load according to another embodiment or embodiments of the present application;

[0032] FIG22 is a schematic diagram of the front view of a heat dissipation device of a server according to one or more embodiments of the present application;

[0033] FIG23 is a schematic diagram of the front view of a heat dissipation device of a server according to another embodiment or embodiments of the present application;

[0034] FIG24 is a schematic structural diagram of a server having a controller according to one or more embodiments of the present application;

[0035] Figure 25 is a schematic diagram of the hardware structure of the server of one or more embodiments of the present application.

[0036] Reference numerals: 10, multi-phase power supply; 100, power supply module; 110, power supply chip; 111, first pulse width modulation signal port; 112, first current signal port; 113, first temperature signal port; 120, input capacitor; 130, output inductor; 131, magnetic core; 132, coil; 133, welding point; 140, first printed circuit board; 141, ball implantation; 150, second printed circuit board; 160, output capacitor; 170, copper busbar; 200, load; 300, printed circuit board; 400, heat sink; 500, third printed circuit board; 510, through hole; 520, blind hole; 530, buried hole; 600, first heat dissipation device; 610, first substrate; 611, screw; 612, nut; 620, first heat dissipation fin; 700, second heat dissipation device; 710, second substrate; 720, second heat dissipation fin; 800, controller; 810, second pulse width modulation signal port; 820, second current signal port; 830, second temperature signal port; 2510, processor; 2520, memory; 2530, communication interface. DETAILED DESCRIPTION

[0037] To make the purpose, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of this application.

[0038] A server is a high-performance computer that provides various services on the Internet. It provides computing or application services to other clients (such as computers, smartphones, terminals such as Automatic Teller Machines (ATMs), and even large equipment such as train systems) on the network. As a node in the network, the server stores and processes 80% of the data and information on the network, and is therefore also called the soul of the network.

[0039] Servers and regular computers have similar functions. However, they have higher requirements for stability, security, data throughput, scalability, and performance. Therefore, their CPU, chipset, memory, disk system, network, and other hardware differ from those of regular computers.

[0040] Servers are also core infrastructure for cloud computing and data centers. As server and rack power continue to increase, 48V power architectures are gaining popularity due to their higher conversion efficiency and lower losses compared to traditional 12V power supply architectures. Under the same load power, a 48V architecture increases voltage by four times while reducing current by a quarter, significantly reducing transmission losses. This makes 48V an effective way to optimize server system energy consumption.

[0041] As the "brain" of a server, the CPU is the primary indicator of server performance. As CPU power continues to increase, the issue of increased current loss in the server power supply path is becoming increasingly concerning. Traditional server CPU power supply architectures utilize a horizontal power supply architecture, with multi-phase power supplies utilizing a separate solution to power the load. Specifically, the voltage regulator (VR), including input capacitors, power chips, and output inductors, is separated. Specifically, as shown in Figures 1 and 2 , the multiple power chips 110, multiple input capacitors 120, and multiple output inductors 130 in a multi-phase power supply 10 are separately arranged and positioned on the same horizontal plane as the load 200 on a printed circuit board 300 to power the load 200. Furthermore, it should be noted that due to the high power draw of the load, to ensure normal operation, a heat sink 400 may be provided on the multiple power chips 110 and the load 200 to dissipate heat.

[0042] In the above solution, there is a large distance between the multi-phase power supply 10 and the load 200 in horizontal space. The power chip 110 needs to transmit power from the output inductor 130 end to the load 200. The intermediate power transmission path is long, the transmission impedance is large, and there is a large loss, resulting in low working efficiency of the multi-phase power supply 10 and affecting the performance of the server.

[0043] In view of this, the present application provides a power supply module that can shorten the power transmission path and improve the power density of the server.

[0044] The power supply module provided in this application is described in detail below with reference to the accompanying drawings.

[0045] As shown in FIG. 3 to FIG. 7 , the power module 100 includes a plurality of power chips 110 , a plurality of input capacitors 120 , a plurality of output inductors 130 and a first printed circuit board 140 .

[0046] Among them, multiple power chips 110 are arranged at intervals on the upper surface of the first printed circuit board 140, multiple input capacitors 120 are fixed to the first printed circuit board 140, and the multiple input capacitors 120 can be placed in the intervals between the multiple power chips 110. Multiple output inductors 130 are stacked vertically with the multiple power chips 110 through the first printed circuit board 140.

[0047] Specifically, multiple power chips 110 are power supply chips for the power module 100, and internally integrate metal oxide semiconductor field effect transistors (MOSFETs) and drive units. As shown in FIG7 , the input terminals of the multiple power chips 110 are all connected to the input power supply (voltage) VIN. The input terminals of the multiple power chips 110 are connected one-to-one with multiple input capacitors 120, that is, one end of the input capacitor 120 is connected to the input terminal of the corresponding power chip 110, and the other end of the input capacitor 120 is grounded. The input capacitor 120 is used to filter out high-frequency interference signals from the connected power chip 110 to prevent the power chip 110 from being broken down by high voltage. The output terminals of the multiple power chips 110 are connected one-to-one with the input terminals of the multiple output inductors 130 to realize the output power supply (voltage) VOUT. The output voltage VOUT is used to power a load. That is, the output terminals of the multiple power chips 110 are connected in series with the corresponding output inductors 130 to form the output voltage VOUT for powering the load. That is, a plurality of separate power chips 110 and a plurality of output inductors 130 and other VR devices are stacked in a vertical direction through the first printed circuit board 140 to integrate a power module 100 .

[0048] Furthermore, as shown in FIG16 , the output ends of the plurality of output inductors 130 are connected to the load 200 through vias on the third printed circuit board 500 to supply power to the load 200. The plurality of output inductors 130 are located on the bottom surface of the third printed circuit board 500, and the load 200 is located on the top surface of the third printed circuit board 500. A first area of ​​the input capacitors 120, the power chip 110, and the output inductors 130 is smaller than the top surface of the first printed circuit board 140. The area of ​​the first printed circuit board 140 is smaller than the area of ​​the third printed circuit board 500. The first area is the surface area of ​​the input capacitors 120, the power chip 110, and the output inductors 130 on a side close to the first printed circuit board 140. That is, the area of ​​the bottom surface of the power chip 110, the bottom surface of the input capacitors 120, and the top surface of the output inductors 130 are smaller than the top surface of the first printed circuit board 140.

[0049] It should be noted that, for ease of understanding, this document specifically describes the connection method between the power module 100 and the load 200 in the relevant embodiments of the server, which will not be described here.

[0050] For example, the plurality of power chips 110 may be arranged on the upper surface of the first printed circuit board 140 at equal intervals, or may be arranged on the upper surface of the first printed circuit board 140 at non-equal intervals.

[0051] Exemplarily, the load may be a CPU, a graphics processing unit (GPU), or a data processing unit (DPU).

[0052] It should be understood that the input capacitor 120 can be a filter capacitor. Specifically, a filter capacitor refers to an energy storage device installed at both ends of the rectifier circuit to reduce the AC ripple coefficient and improve the efficient and smooth DC output. Since the filter circuit requires the energy storage capacitor to have a large capacitance, the most commonly used electrolytic capacitors are hundreds to thousands of microfarads. The positive terminal of the electrolytic capacitor is connected to the positive terminal of the rectifier output circuit, and the negative terminal of the electrolytic capacitor is connected to the negative terminal of the circuit. The provision of a filter capacitor will make the working performance of the electronic circuit more stable, and also reduce the interference of the alternating ripple on the electronic circuit.

[0053] To achieve good filtering, capacitor discharge must be slow. The slower the capacitor discharges, the smoother the output voltage and the better the filtering effect. The speed of capacitor discharge depends on the capacitor's capacitance (C) and the load (R). The larger the C and R, the slower the capacitor discharges. Furthermore, to adapt to different frequencies, electrolytic capacitors are divided into high-frequency and low-frequency capacitors. High-frequency is a relative term. Low-frequency filter capacitors are primarily used for mains filtering or filtering after transformer rectification, with an operating frequency of 50 Hz. High-frequency filter capacitors are primarily used for filtering after switching power supply rectification, with an operating frequency of several thousand to tens of thousands of Hz. The sawtooth voltage frequency can reach tens of thousands of Hz, even tens of megahertz. The quality of high-frequency aluminum electrolytic capacitors is measured by their "impedance-frequency" characteristics, requiring low equivalent impedance within the operating frequency of the switching power supply and good filtering of high-frequency spikes generated by semiconductor devices.

[0054] A printed circuit board (PCB), also known as a printed circuit board or printed wiring board, is called a "printed" circuit board because it is made using electronic printing technology. A printed circuit board is a substrate used to assemble electronic components. It uses an insulating board as a base material, cut into a certain size, and has at least one conductive pattern attached to it. It is also covered with holes (such as component holes, fastening holes, metallized holes, etc.) and is used to replace the chassis used to install electronic components. The main function of a printed circuit board is to connect various electronic components to form a predetermined circuit, acting as a relay transmission. It is a key electronic interconnection component in electronic products and is known as the "mother of electronic products." As a substrate and key interconnection component for loading electronic components, a printed circuit board is required for any electronic device or product.

[0055] It should be noted that in this embodiment, there is no limitation on the number of power chips 110, input capacitors 120, and output inductors 130. For example, the number can be 3, 5, 8, or 10. The number of power chips 110 and output inductors 130 is the same, and the number of power chips 110 and input capacitors 120 can be the same or different. For example, the number of input capacitors 120 is greater than the number of power chips 110.

[0056] In this embodiment, multiple output inductors 130 are stacked vertically with multiple power chips 110 via a first printed circuit board 140. The power module 100 can be directly placed on the load 200 via a third printed circuit board, supplying power to the load 200 vertically. This shortens the intermediate transmission path between the power module 100 and the load 200, reduces transmission impedance, reduces copper loss in the circuit board path, and improves the power density of the power module 100. This also helps reduce server system power consumption and improve energy efficiency, thereby helping users save electricity costs. In addition, compared with traditional power supplies, the present application can also significantly reduce the area of ​​the circuit board required to be occupied by the power supply module 100, and reclaim the space around the CPU, thereby minimizing the power delivery network (PDN) loss and reducing transmission loss. It is also beneficial to reduce the size of circuit boards and servers, reduce circuit board processing costs and data center land costs, and at the same time, can free up more circuit board area for high-speed input / output (I / O) interfaces and memories, promote maximization of system resource utilization, provide optimized space for signal wiring, and help improve signal quality and anti-interference capabilities, thereby enhancing system operation reliability.

[0057] Specifically, the output inductor 130 can be arranged on the first printed circuit board 140 or inside the first printed circuit board 140, which is not limited in this application. The specific arrangement of the output inductor 130 is described in detail below with reference to the accompanying drawings.

[0058] In some embodiments, as shown in Figures 3 and 4, the power module 100 further includes a second printed circuit board 150. The second printed circuit board 150 and the first printed circuit board 140 are connected via a copper busbar 170 for signal transmission. The output inductor 130 has one end in the vertical direction, which is closer to the corresponding power chip 110, connected to the bottom surface of the first printed circuit board 140, and one end in the vertical direction, which is farther from the corresponding power chip 110, connected to the top surface of the second printed circuit board 150. In other words, the output inductor 130 is disposed between the first printed circuit board 140 and the second printed circuit board 150. The first printed circuit board 140, the output inductor 130, and the second printed circuit board 150 are stacked, with the two ends of the output inductor 130 in the vertical direction connected to the bottom surface of the first printed circuit board 140 and the top surface of the second printed circuit board 150, respectively.

[0059] It should be noted that this embodiment does not limit the number of output inductors 130 . In FIG. 3 and FIG. 4 , it is taken as an example that the power module includes two output inductors 130 .

[0060] In this embodiment, the power chip 110 , the first printed circuit board 140 , the output inductor 130 corresponding to the power chip 110 , and the second printed circuit board 150 are stacked in sequence in a vertical direction to form an integrated power module 100 , thereby ensuring the structural stability of the power module 100 .

[0061] Furthermore, as shown in FIG8 , the welding points 133 of the output inductor 130 are provided at both ends of the output inductor 130 in the vertical direction, and the output inductor 130 is connected to the first printed circuit board 140 and the second printed circuit board 150 through the welding points. That is, one welding point of the output inductor 130 is connected to the lower surface of the first printed circuit board 140 , and the other welding point of the output inductor 130 is connected to the upper surface of the second printed circuit board 150 .

[0062] In this embodiment, the welding points of the output inductor 130 are arranged at both ends of the output inductor 130 in the vertical direction, so that the output inductor 130 can be directly interconnected with the first printed circuit board 140 and the second printed circuit board 150, thereby achieving the shortest current path and effectively improving the conversion efficiency of the power module 100.

[0063] For example, as shown in Figure 9, in order to further reduce the volume of the power supply module 100 and lower the height of the power supply module 100, the output inductor 130 can be set as a coupled inductor. The two coils inside the coupled inductor can be coupled in the same direction to mutually enhance the magnetic field strength, thereby achieving the effect of further reducing the inductance.

[0064] It should be understood that inductors are also called self-inductors. If the magnetic flux generated by two or more coils intersects with the magnetic flux generated by the other coil, these coils are said to have magnetic coupling or mutual induction. If the coils are assumed to be stationary and the resistance in the coils and the distributed capacitance between turns are ignored, the magnetically coupled coils can be represented as idealized coupled inductors, or coupled inductors for short.

[0065] In another optional embodiment, as shown in Figures 5 and 6 , the first printed circuit board 140 has a multi-layer structure, and the output inductor 130 includes a magnetic core 131 and a coil 132. The magnetic core 131 is embedded in the first printed circuit board 140, and the coil 132 is formed by winding wires on the copper surface of each layer of the first printed circuit board 140. Specifically, the copper surface of each layer within the first printed circuit board 140 is arranged in the pattern of an inductor coil, and all layers are connected using blind and buried vias to form the coil 132.

[0066] It should be understood that the layer of the printed circuit board refers to the copper layer, and the printed circuit board can be formed by laminating the copper layer and the substrate. This application does not limit the number of layers of the first printed circuit board 140. For example, the first printed circuit board 140 is a four-layer printed circuit board or a six-layer printed circuit board.

[0067] Specifically, PCBs can be categorized by the number of circuit layers: single-sided, double-sided, and multi-layer. Common multi-layer boards typically have four or six layers, while complex multi-layer boards can have dozens of layers. Single-sided boards are the most basic PCBs, with components concentrated on one side and wiring on the other. PCBs with wiring only on one side are called single-sided. Double-sided boards have wiring on both sides, but to utilize the wiring on both sides, a proper circuit connection must exist between the two sides. This "bridge" between the circuits is called a via. A via is a small hole in the PCB, filled or coated with metal, that connects to the wiring on both sides. Because double-sided boards have twice the area of ​​single-sided boards, they eliminate the difficulty of interlaced wiring in single-sided boards (vias can be used to connect to the other side), making them more suitable for more complex circuits than single-sided boards. Multi-layer boards have more wiring area. Multi-layer boards can be a combination of single-layer and double-layer boards. For example, a printed circuit board with one double-sided board as the inner layer and two single-sided boards as the outer layer, which are alternately connected by a positioning system and insulating adhesive materials, and the conductive patterns are interconnected according to the design requirements, becomes a four-layer printed circuit board, also known as a multi-layer printed circuit board. For another example, a printed circuit board with two double-sided boards as the inner layer and two single-sided boards as the outer layer, which are alternately connected by a positioning system and insulating adhesive materials, and the conductive patterns are interconnected according to the design requirements, is a six-layer printed circuit board.

[0068] It's important to note that the number of layers in a board doesn't necessarily represent the number of independent wiring layers. In special cases, blank layers are added to control board thickness. Typically, the number of layers is an even number, including the two outermost layers. Most motherboards have 4 to 8 layers, but technically, PCBs with nearly 100 layers are possible.

[0069] In addition, this embodiment does not limit the number of output inductors 130, for example, it can be 2, 4 or 5, etc. Figures 5 and 6 take the power module 100 including two output inductors 130 as an example to illustrate the specific structure of the output inductor of this application.

[0070] In this embodiment, by embedding the output inductor 130 in the first printed circuit board 140 , the height of the power module 100 can be significantly reduced, the volume of the power module 100 can be further reduced, and the power density of the power module 100 can be improved.

[0071] Specifically, the input capacitor 120 can be set on the first printed circuit board 140 or inside the first printed circuit board 140, which is not limited in this application. The specific setting method of the input capacitor 120 is described in detail below with reference to the accompanying drawings.

[0072] In some embodiments, as shown in Figures 3 to 5, the input capacitor 120 can be fixedly arranged on the upper surface of the first printed circuit board 140, and the input capacitor 120 is located on at least one side of the power chip 110, that is, the input capacitor 120 can be set on one side of one of the power chips 110, or the input capacitor 120 can be set on both sides of the power chip 110.

[0073] It should be noted that this embodiment does not limit the number of the input capacitors 120 . In FIG. 3 to FIG. 5 , it is taken as an example that the power module 100 includes three input capacitors 120 .

[0074] In this embodiment, the input capacitor 120 is directly disposed on the upper surface of the first printed circuit board 140 , which can improve the efficiency of manufacturing the power module 100 .

[0075] In another optional embodiment, as shown in FIG. 10 , the first printed circuit board 140 is a multi-layer structure, and the input capacitor 120 is embedded between the ground layer and the output power layer of the first printed circuit board 140 .

[0076] Specifically, taking the first printed circuit board 140 as a six-layer printed circuit board as an example, the setting method of the input capacitor 120 is described. The input capacitor 120 is embedded between the L3 layer and the L4 layer, replacing the glass fiber epoxy resin copper clad board (FR4) material between the original layers. Among them, the L3 layer is the ground layer GND, the L4 layer is the output power layer, and the positive and negative terminals of the input capacitor 120 are connected to the L4 layer and the L3 layer respectively.

[0077] It should be understood that FR4 material is a glass fiber reinforced epoxy laminate that looks like a thin woven cloth board. FR stands for flame retardant, and the number 4 refers to the code for the flame retardant material grade. It means that the resin material must be able to extinguish itself after burning. The glass fiber structure provides structural stability for the material. The glass fiber layer is covered with flame-retardant epoxy resin, which brings durability and strong mechanical properties to the material. Due to its high strength and flame retardancy, most printed circuit boards choose FR4 material as the base material.

[0078] In this embodiment, the input capacitor 120 originally placed on the surface of the first printed circuit board 140 is embedded inside the first printed circuit board 140 , which can reduce the board area and further improve the power density.

[0079] For example, as shown in FIG11 , a first pulse width modulation (PWM) signal port 111 is provided on the power chip 110. The first pulse width modulation signal port 111 is connected to the front-end controller. The power chip 110 is used to receive a pulse width modulation signal from the controller through the first pulse width modulation signal port 111, and to adjust the output voltage according to the pulse width modulation signal to achieve normal operation.

[0080] Specifically, pulse width modulation (PWM) can be understood as a technique that modulates the width of a series of pulses to equivalently obtain a desired waveform (including shape and amplitude). PWM is most widely used in inverter circuits. Its basic principle is to control the on / off switching of the inverter circuit's switching devices, producing a series of pulses of equal amplitude at the output, which replace the desired sine wave waveform. Specifically, multiple pulses are generated during half a cycle of the output waveform, ensuring that the equivalent voltage of each pulse is a sinusoidal waveform. The resulting output is smooth and has few low-order harmonics. By modulating the width of each pulse according to a specific rule, both the inverter circuit's output voltage and the output frequency can be varied. Furthermore, in a PWM waveform, the amplitude of each pulse is equal. To change the amplitude of the equivalent output sine wave, the width of each pulse is simply adjusted by the same proportional factor.

[0081] Furthermore, as shown in FIG11 , the power chip 110 is further provided with a first current (IMON) signal port 112 and / or a first temperature (Temp) signal port 113. That is, the power chip 110 may be provided with only the first current signal port 112 or the first temperature signal port 113, or may be provided with both the first current signal port 112 and the first temperature signal port 113. Specifically, the first current signal port 112 and the first temperature signal port 113 are also connected to the front-end controller, and the power chip 110 is further used to send a detection current to the controller via the first current signal port 112; and / or, the power chip 110 is further used to send a detection temperature to the controller via the first temperature signal port 113.

[0082] For example, the first temperature signal ports 113 corresponding to multiple power chips 110 can be connected together to send the maximum temperature among the multiple detected temperatures to the controller. For example, if the power module 100 includes two power chips 110, and the first temperature signal port 113 of the first power chip obtains a detected temperature of 25 degrees Celsius (°C), and the first temperature signal port 113 of the second power chip obtains a detected temperature of 30°C, then the detected temperature obtained by the first temperature signal port 113 of the second power chip is sent to the controller.

[0083] In this embodiment, by setting the first current signal port 112 to send the detection current to the controller, the controller can conveniently monitor the current of the power chip 110 to avoid current overload affecting the normal operation of the power chip 110. By setting the first temperature signal port 113 to send the detection temperature to the controller, the controller can conveniently monitor the temperature of the power chip 110 to avoid excessive temperature affecting the normal operation of the power chip 110.

[0084] In some optional implementations, to further reduce the volume of the output inductor 130 and the height of the power module 100, this embodiment can reduce the traditional 12V input voltage to an input voltage of approximately 5V to power the power module 100. Specifically, as shown in FIG12 , the system input voltage is 54V, which is converted by the 54V power module into an intermediate voltage of approximately 5V to power the power module, ultimately outputting an operating voltage that meets the load requirements to the load.

[0085] In this embodiment, the traditional 12V input voltage is changed to a 5V input voltage, which is beneficial to improving the conversion efficiency of the power module 100. At the same time, by reducing the input voltage, the inductance value can be reduced, which is beneficial to further reducing the volume of the power module 100.

[0086] In some optional embodiments, in order to meet the dynamic performance requirements of the load, the power supply module 100 also includes an output capacitor, which is used to store electrical energy to provide sufficient energy for the load 200 during dynamic performance, thereby avoiding excessive fluctuations in the output voltage of the power supply module 100 and affecting the normal operation of the load 200.

[0087] The following describes in detail the configuration of the output capacitor with reference to the accompanying drawings.

[0088] As shown in FIG. 13 , in some embodiments, the output capacitor 160 may be directly disposed on the upper surface of the third printed circuit board 500 and located between the spaces between the plurality of power modules 100 .

[0089] In this embodiment, the output capacitor 160 is directly disposed on the upper surface of the third printed circuit board 500 , which can improve the manufacturing efficiency of the power module 100 and reduce the manufacturing cost of the power module 100 .

[0090] As shown in FIG. 14 and FIG. 15 , in another optional embodiment, the first printed circuit board 140 of the power module 100 is a multi-layer structure, and the output capacitor 160 is embedded between the ground layer and the output power layer of the first printed circuit board 140 .

[0091] Specifically, taking the first printed circuit board 140 as a six-layer printed circuit board as an example, the setting method of the output capacitor 160 is described. The output capacitor 160 is embedded between the L3 layer and the L4 layer, replacing the glass fiber epoxy resin copper clad board (FR4) material between the original layers. Among them, the L3 layer is the ground layer GND, the L4 layer is the output power supply layer, and the positive and negative terminals of the output capacitor 160 are connected to the L4 layer and the L3 layer respectively.

[0092] In this embodiment, the output capacitor 160 originally placed on the surface of the third printed circuit board 500 is embedded in the first printed circuit board 140. This eliminates the need to reserve capacitor space on the third printed circuit board 500. This reduces the distance between two adjacent power modules 100 on the third printed circuit board 500, significantly reducing board area and improving power density.

[0093] The present application also provides a server, which will be described in detail below with reference to the accompanying drawings.

[0094] As shown in Figure 16, the server provided in the present application includes multiple power modules 100, loads 200 and a third printed circuit board 500 described in the above embodiments, wherein the multiple power modules 100 are arranged at intervals on the lower surface of the third printed circuit board 500, the load 200 is arranged on the upper surface of the third printed circuit board 500, and the multiple power modules 100 are connected to the load 200 through vias on the third printed circuit board 500.

[0095] Specifically, as shown in FIG17 , the input terminals of the multiple power modules 100 are all connected to the input voltage VIN, and the output terminals of the multiple power modules 100 are connected in parallel to form an output voltage VOUT to supply power to the load 200 .

[0096] For example, this embodiment does not limit the number of power modules included in the server. For example, the server may include 2, 3, 8, or other numbers of power modules 100. The multiple power modules 100 may be arranged evenly (with equal spacing between adjacent power modules) or unevenly (with unequal spacing between adjacent power modules) on the upper surface of the third printed circuit board 500. This application does not specifically limit this.

[0097] The present application does not limit the number of layers of the third printed circuit board, which may be a single-layer board, a double-layer board, or a multi-layer board.

[0098] The server provided in this embodiment integrates separate voltage inverter components, such as input capacitor 120, power chip 110, and output inductor 130, into a power module 100. Multiple integrated power modules 100 are directly attached to the back of a load 200, allowing the power module 100, third printed circuit board 500, and load 200 to be stacked vertically. Compared to traditional power supply architectures, this significantly shortens the power supply path, reduces transmission impedance, and reduces copper loss in the printed circuit board path, thereby reducing server system power consumption and improving energy efficiency, thereby helping users save electricity costs. Furthermore, it significantly reduces the board area occupied by power supply components, increases server power density, and helps reduce the size of printed circuit boards and servers, reducing printed circuit board processing costs and data center land costs. Furthermore, it frees up more printed circuit board area for high-speed input and output interfaces and memory, maximizing system resource utilization, providing optimized space for signal wiring, improving signal quality and anti-interference capabilities, and enhancing system operational reliability.

[0099] As shown in Figures 18 and 19, in some optional embodiments, a ball 141 is provided on the lower surface of the first printed circuit board 140 or the lower surface of the second printed circuit board 150 of the power module 100 using a ball planting process. Multiple power modules 100 are connected to the load 200 via the ball 141 and vias on the third printed circuit board 500. Specifically, the output ends of the multiple output inductors 130 are connected to the load 200 via the ball and vias on the third printed circuit board 500. In this embodiment, the ball 141 allows for faster and more convenient electrical connection between the power modules 100 and the load 200, which are arranged on opposite surfaces of the third printed circuit board 500.

[0100] Specifically, the via holes on the third printed circuit board 500 include at least one of through holes, buried vias, and blind vias.

[0101] It should be understood that blind vias are located on the top and bottom surfaces of a printed circuit board (PCB) and have a certain depth. They are used to connect the surface circuits of the PCB to the inner circuits below. The depth of the holes usually does not exceed a certain ratio (aperture diameter). Buried vias are connection holes located on the inner layers of the PCB and do not extend to the surface of the PCB. Similar to connecting traces between inner layers of the PCB, buried vias are not visible from the surface of the PCB. Through holes extend through the PCB and can be used to achieve internal interconnections or serve as mounting holes for components.

[0102] The specific manner in which the multiple power modules 100 are connected to the load 200 via the ball implantation and the third printed circuit board 500 will be described below with reference to the accompanying drawings.

[0103] As shown in FIG. 20 , in some optional embodiments, the third printed circuit board 500 is provided with a through hole 510 , and the plurality of power modules 100 are connected to the load 200 by fitting the implant balls 141 with the through holes 510 .

[0104] In this embodiment, different power modules 100 can be customized for different loads 200. In this case, the back pin definitions of the power module 100 are exactly the same as the through-hole definitions drilled when the load 200 is attached to the third printed circuit board 500. The back bumps 141 of the power module 100 can completely align with the through-holes on the third printed circuit board 500, further improving the reliability of the connection between the load 200 and the power module 100.

[0105] As shown in FIG. 21 , in some other optional embodiments, the third printed circuit board 500 is provided with blind vias 520 and buried vias 530 , and the plurality of power modules 100 are connected to the load 200 through the blind vias 520 and buried vias 530 .

[0106] In this embodiment, the load 200 and the power module 100 are connected by means of blind vias 520 and buried vias 530 , and the differences in vias between different loads 200 can be ignored, so that different loads 200 can share the same power module 100, thereby improving the versatility of the power module 100.

[0107] As shown in Figures 20 and 21 , since load 200 has a high power, in some optional embodiments, to avoid affecting the normal operation of load 200, a first heat sink 600 is provided on load 200. The first heat sink 600 is used to dissipate heat from load 200. Specifically, the first heat sink 400 can be secured to the third printed circuit board 500 using screws 611 and nuts 612.

[0108] Because the power module 100 and the load 200 are arranged vertically, there are essentially no heat dissipation controls or airflow required for heat dissipation. However, the power module 100 is a power device, and current flows through it, generating a large amount of heat. Without a heat dissipation environment, the operating temperature of the power module 100 will be too high, affecting the conversion efficiency of the power module 100 and even causing the power module 100 to overheat and power down. The heat dissipation device of the power module 100 in this application is described in detail below with reference to the accompanying drawings.

[0109] As shown in Figure 22, the server includes a first heat dissipation device 600 and a second heat dissipation device 700. Specifically, the first heat dissipation device 600 includes a first substrate 610, which is arranged on a side of the load 200 away from the third printed circuit board 500. The second heat dissipation device 700 includes a second substrate 710, which is arranged on a side of the power module 100 away from the third printed circuit board 500. The first substrate 610 and the second substrate 710 are connected by screws 611 and nuts 612.

[0110] Specifically, the nut 612 has screw holes at both ends along the vertical direction. A screw 611 on the first substrate 610 is installed in one screw hole of the nut 612, and a screw 611 on the second substrate 710 is installed in the other screw hole of the nut 612. Through heat conduction between the screw 611 and the nut 612, the temperature of the power module 100 is transferred to the first heat sink 600 of the load 200. The screw 611 and nut 612 not only position the two heat sinks, reducing the impact of the additional positioning screw holes on the layout and wiring of the third printed circuit board 500, but also provide heat conduction.

[0111] In this embodiment, the first substrate 610 and the second substrate 710 are connected by screws 611 and nuts 612. The temperature of the power module 100 can be transferred to the first heat dissipation device 600 of the load 200 for heat dissipation by means of heat conduction of the screws 611 and nuts 612, thereby dissipating the heat of the power module 100 in a limited space, thereby preventing the power module 100 from being overheated and affecting the normal operation of the power module 100.

[0112] For example, in order to enhance heat dissipation, the screw 611 and the nut 612 may be made of a material with a strong heat conduction capability. For example, the screw 611 and the nut 612 may be made of copper or aluminum.

[0113] Furthermore, as shown in Figures 22 and 23, in some optional embodiments, in order to improve the heat dissipation capacity of the heat dissipation device, the first heat dissipation device 600 also includes a first heat dissipation fin 620 extending vertically from the first substrate 610, and the second heat dissipation device 700 also includes a second heat dissipation fin 720 connected to the second substrate 710.

[0114] Fins are fundamental heat transfer elements, serving to expand the heat exchange area and improve heat transfer efficiency. Fins can be considered extensions and expansions of the baffles. Different fin configurations can create strong turbulence within the flow path, disrupting and reorganizing the flow and thermal boundary layers, thereby enhancing heat transfer. Fins can also improve the overall strength of heat sinks, effectively expanding their application range.

[0115] This application does not limit the arrangement of the heat dissipation fins. The heat dissipation method of the heat dissipation fins is described in detail below with reference to the accompanying drawings.

[0116] 22 , the first heat dissipating fins 620 extend outward from the first base plate 610, and the second heat dissipating fins 720 extend outward from the second base plate 710. That is, when the vertical direction is the vertical direction, the first heat dissipating fins 620 can extend upward from the first base plate 610, and the second heat dissipating fins 720 can extend downward from the second base plate 710.

[0117] It should be noted that in this embodiment, the second heat sink 700 must meet the lower height limit requirement of the third printed circuit board 500. In other words, the sum of the vertical height of the power module 100, the vertical height of the second substrate 710, and the vertical height of the second heat sink 720 must be less than the lower height limit of the third printed circuit board 500. The lower height limit is a preset value and can be a height specified by the designer.

[0118] In another optional embodiment, as shown in FIG23 , the second substrate 710 can be extended to one side of the third printed circuit board 500 so that the second heat dissipating fins 720 extend in the same direction as the first heat dissipating fins 620. For example, when the vertical direction is vertical, the second substrate 710 can be extended to the left or right side of the third printed circuit board 500 so that the second heat dissipating fins 720 extend in the same direction as the first heat dissipating fins 620. For example, the second heat dissipating fins 720 extend upward from the second substrate 710.

[0119] In this embodiment, the second substrate 710 is extended to one side of the third printed circuit board 500, and the extension direction of the second heat dissipation fins 720 is made the same as the extension direction of the first heat dissipation fins 620, so that the second heat dissipation fins 720 can receive wind flow from the side direction, thereby improving the heat dissipation efficiency.

[0120] In addition, this embodiment does not impose any restrictions on the shape of the heat dissipation fins. For example, the first heat dissipation fins 620 and the second heat dissipation fins 720 can be straight fins, louvered fins, serrated fins, porous fins, corrugated fins, or fins of other shapes. The shapes of the first heat dissipation fins 620 and the second heat dissipation fins 720 can be the same or different. For example, the first heat dissipation fins 620 and the second heat dissipation fins 720 can both be straight fins, or one can be a straight fin and the other a serrated fin.

[0121] In this embodiment, there is no limitation on the number of power modules included in the server, such as 2, 3, or 5. The accompanying drawings take the example of a server including six power modules.

[0122] In some optional embodiments, as shown in Figure 24, the server also includes a controller 800, and the controller 800 is provided with a second pulse width modulation signal port 810. The controller 800 sends a pulse width modulation signal to the power module 100 through the second pulse width modulation signal port 810, and the pulse width modulation signal is used to adjust the output voltage of the power module 100.

[0123] Specifically, the controller 800 is connected to the first pulse width modulation signal port 111 of the power module 100 via the second pulse width modulation signal port 810 , and transmits a pulse width modulation signal to control the output voltage of the power module 100 .

[0124] Furthermore, the controller 800 also includes a second current signal port 820 and / or a second temperature signal port 830, and the controller 800 is also used to obtain a detection current from the power module 100 through the second current signal port 820; and / or, the controller 800 is also used to obtain a detection temperature from the power module 100 through the second temperature signal port 830.

[0125] In this embodiment, by setting the second current signal port 820 to send the detection current to the controller 800, the controller 800 can conveniently monitor the current of the power module 100 to avoid current overload affecting the normal operation of the power module 100. By setting the second temperature signal port 830 to send the detection temperature to the controller, the controller 800 can conveniently monitor the temperature of the power module 100 to avoid excessively high temperature affecting the normal operation of the power module 100.

[0126] Exemplarily, the first temperature signal ports corresponding to the multiple power modules 100 may be connected together and then connected to the controller 800 , and the controller 800 obtains the maximum temperature among the multiple detected temperatures.

[0127] An embodiment of the present application also provides a server having the power supply module shown in the above embodiment.

[0128] Please refer to Figure 25, which is a structural diagram of a server provided by an optional embodiment of the present application. As shown in Figure 25, the server includes: one or more processors 2510, a memory 2520, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common motherboard or installed in other ways as needed. The processor can process instructions executed within the server, including instructions stored in or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple servers can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Figure 25 takes a processor 2510 as an example.

[0129] Processor 2510 may be a central processing unit (CPU), a network processor (NPU), or a combination thereof. Processor 2510 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a combination thereof. The programmable logic device may be a complex programmable logic device (CPLD), a field programmable gate array (FPGA), a general purpose array logic (GAL), or any combination thereof.

[0130] The memory 2520 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and application programs required for at least one function; the data storage area may store data created based on the use of the server, etc. In addition, the memory 2520 may include a high-speed random access memory and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 2520 may optionally include a memory remotely located relative to the processor 2510, and these remote memories may be connected to the server via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0131] Memory 2520 may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as flash memory, hard disk or solid state drive; memory 20 may also include a combination of the above types of memory.

[0132] The server also includes a communication interface 2530 for the server to communicate with other devices or communication networks.

[0133] In the description of this specification, the description with reference to the terms "this embodiment", "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are mutually inconsistent.

[0134] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0135] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0136] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0137] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, and simple improvements made to the essential content of the present application shall be included in the scope of protection of the present application.

Claims

1. A power module, characterized in that: It includes a plurality of power chips, a plurality of input capacitors, a plurality of output inductors and a first printed circuit board; The plurality of power chips are arranged at intervals on the upper surface of the first printed circuit board, and the input ends of the plurality of power chips are connected to the input power supply; The plurality of input capacitors are fixedly arranged on the first printed circuit board, and the plurality of input capacitors are connected to the input terminals of the plurality of power chips in a one-to-one correspondence; as well as The multiple output inductors are stacked in a vertical direction with the multiple power chips through the first printed circuit board, the input ends of the multiple output inductors are connected to the output ends of the multiple power chips in a one-to-one correspondence, and the output ends of the multiple output inductors are connected to the load through the vias on the third printed circuit board, so as to supply power to the load, wherein the multiple output inductors are located on the lower surface of the third printed circuit board, the load is located on the upper surface of the third printed circuit board, the first area of ​​the input capacitor, the power chip and the output inductor is smaller than the area of ​​the upper surface of the first printed circuit board, the area of ​​the first printed circuit board is smaller than the area of ​​the third printed circuit board, and the first area is the surface area of ​​the input capacitor, the power chip and the output inductor on a side close to the first printed circuit board.

2. The power module according to claim 1, characterized in that: The power module further includes a second printed circuit board, wherein the second printed circuit board is connected to the first printed circuit board via a copper busbar; and The output inductor has one end close to the corresponding power chip in the vertical direction connected to the lower surface of the first printed circuit board, and one end away from the corresponding power chip in the vertical direction connected to the upper surface of the second printed circuit board.

3. The power module according to claim 2, characterized in that: The welding points of the output inductor are arranged at two ends of the output inductor in the vertical direction, and the output inductor is connected to the first printed circuit board and the second printed circuit board through the welding points.

4. The power module according to claim 2, characterized in that: A planting ball is provided on the lower surface of the second printed circuit board, and the second printed circuit board is arranged on the lower surface of the third printed circuit board through the planting ball. The output ends of the multiple output inductors are connected to the load through the planting ball and the via holes on the third printed circuit board.

5. The power module according to claim 1, characterized in that: The first printed circuit board is a multi-layer structure, and the output inductor includes a magnetic core and a coil; The magnetic core is embedded in the first printed circuit board; and The coil is formed by winding the copper surface of each layer in the first printed circuit board.

6. The power module according to claim 5, characterized in that: A planting ball is provided on the lower surface of the first printed circuit board, and the first printed circuit board is arranged on the lower surface of the third printed circuit board through the planting ball. The output ends of the multiple output inductors are connected to the load through the planting ball and the via holes on the third printed circuit board.

7. The power module according to claim 4 or 6, characterized in that: The via hole includes at least one of a through hole, a buried hole and a blind hole.

8. The power module according to any one of claims 1 to 6, characterized in that: The first printed circuit board is a multi-layer structure, and the input capacitor is embedded between the ground layer and the output power layer of the first printed circuit board.

9. The power module according to any one of claims 1 to 6, characterized in that: The power supply module also includes a plurality of output capacitors, and the plurality of output capacitors are used to supplement energy for the dynamic performance of the load.

10. The power module according to claim 9, characterized in that: The output capacitor is arranged on the lower surface of the third printed circuit board.

11. The power module according to claim 9, characterized in that: The first printed circuit board is a multi-layer structure, and the output capacitor is embedded between the ground layer and the output power layer of the first printed circuit board.

12. The power module according to any one of claims 1 to 6, characterized in that: The power chip is provided with a first pulse width modulation signal port; and The power chip is used to receive a pulse width modulation signal from a controller through the first pulse width modulation signal port, and to adjust the output voltage according to the pulse width modulation signal.

13. The power module according to claim 12, characterized in that: The power chip is also provided with a first current signal port and / or a first temperature signal port; The power chip is further used to send a detection current to the controller through the first current signal port; and / or, The power chip is also used to send the detected temperature to the controller through the first temperature signal port.

14. The power module according to any one of claims 1 to 6, characterized in that: The output inductor is a coupled inductor.

15. The power module according to any one of claims 1 to 6, characterized in that: The input voltage of the input power supply is 5V.

16. A server, characterized in that: The server comprises: a third printed circuit board; a load, disposed on an upper surface of the third printed circuit board; and A plurality of power modules as claimed in any one of claims 1 to 15 are arranged at intervals on the lower surface of the third printed circuit board, and the plurality of power modules are connected to the load through vias on the third printed circuit board to supply power to the load.

17. The server according to claim 16, characterized in that The server further comprises a first heat dissipation device and a second heat dissipation device; The first heat dissipation device comprises a first substrate, and the first substrate is arranged on a side of the load away from the third printed circuit board; and The second heat dissipation device includes a second substrate, which is arranged on a side of the power module away from the third printed circuit board, and the first substrate and the second substrate are connected by screws and nuts.

18. The server according to claim 17, characterized in that: The first heat dissipation device further includes a first heat dissipation fin extending upward from the first substrate; and The second heat dissipation device also includes second heat dissipation fins connected to the second substrate.

19. The server according to claim 18, characterized in that The second substrate extends to one side of the third printed circuit board in the horizontal direction, and an extending direction of the second heat dissipation fins is the same as an extending direction of the first heat dissipation fins.

20. The server according to claim 16, characterized in that The server also includes a controller; The controller is provided with a second pulse width modulation signal port, and the controller sends a pulse width modulation signal to the power module through the second pulse width modulation signal port, and the pulse width modulation signal is used to adjust the output voltage of the power module.

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