Test fixture and device

Abstract

The present application relates to a test fixture (100) and a device. The test fixture (100) comprises a bearing module (110), a pressure head module (120), a plurality of gas paths (121), and a sensing assembly (130), wherein the bearing module (110) is provided with a plurality of bearing areas (111) used for bearing a product to be tested; the pressure head module (120) has a pressed state of abutting against the bearing module (110) and a separated state of being separated from the bearing module (110); the plurality of gas paths (121) are arranged in at least one of the pressure head module (120) and the bearing module (110), and the plurality of gas paths (121) correspond to the plurality of bearing areas (111); and the arrangement of the sensing assembly (130) includes at least one of arranging the sensing assembly (130) in the bearing module (110) and arranging the sensing assembly (130) in the pressure head module (120).

Description

Test fixtures and equipment

[0001] Related applications

[0002] This application claims priority to Chinese patent application number 202311622444.4, filed on November 30, 2023, entitled “Testing fixture and equipment,” the entire text of which is hereby incorporated by reference. Technical Field

[0003] The present application relates to the field of product testing technology, and in particular to a testing fixture and equipment. Background Art

[0004] In manufacturing and modern industrial production, products are tested for performance and quality before being put into use to ensure their compliance. With the rapid increase in market demand for electronic components, chips, for example, are tested for performance before use, i.e., they are tested for temperature, humidity, and air pressure.

[0005] Currently, during the temperature, humidity and air pressure environmental testing of chips, it is impossible to simulate the temperature, humidity and air pressure in the same test environment. Therefore, the temperature, humidity and air pressure tests of the chip need to be carried out separately, resulting in low chip testing efficiency. Moreover, when testing a certain environment of the chip independently, the other two test environments cannot be controlled, resulting in low chip testing accuracy.

[0006] Summary of the Invention

[0007] According to various embodiments of the present application, a test fixture and equipment are provided.

[0008] In a first aspect, a test fixture of the present application comprises:

[0009] A carrying module, wherein the carrying module is provided with a plurality of carrying areas for carrying the product to be tested;

[0010] A pressing head module, wherein the pressing head module has a pressing state in contact with the carrier module and a demoulding state in which the pressing head module is separated from the carrier module;

[0011] a plurality of air paths, the plurality of air paths being provided in at least one of the pressure head module and the carrier module, the plurality of air paths corresponding to the plurality of carrier areas, the air paths being used to blow air having temperature and humidity into the corresponding carrier areas; and

[0012] The sensing component includes at least one of the sensing component being arranged on the carrying module and the sensing component being arranged on the pressure head module, and the sensing component is used to obtain the temperature, humidity and air pressure of the carrying area.

[0013] In one embodiment, the carrying module includes a substrate and a material tray detachably connected to the substrate, and the carrying area is provided on the material tray;

[0014] The sensing component includes a temperature sensor and a humidity sensor, both of which are embedded in the substrate. The temperature sensor protrudes to the surface of the material tray on the side where the supporting area is provided, and the humidity sensor protrudes to the surface of the material tray on the side where the supporting area is provided.

[0015] In one embodiment, the sensing component further includes a control board and a connector, wherein the control board is embedded in the substrate, one end of the connector is electrically connected to the control board, and the other end of the connector is electrically connected to at least one of the temperature sensor and the humidity sensor.

[0016] In one embodiment, the temperature sensor is configured to contact the product to be tested in response to the product to be tested being placed on the carrying area.

[0017] In one embodiment, the humidity sensor is configured to contact the product to be tested in response to the product to be tested being placed on the carrying area.

[0018] In one embodiment, a plurality of adjacent carrying areas share one sensing component.

[0019] In one embodiment, the pressure head module includes a fixed plate and a pressure plate detachably connected to the fixed plate; wherein:

[0020] The pressure plate is provided with the air path and air holes connected to the air path, the multiple air paths are independent of each other, and the multiple air holes correspond to the multiple bearing areas, which are used to blow the gas in the air path to the corresponding bearing areas; wherein, the air path extends in an S shape or a wave shape.

[0021] In one embodiment, the pressure plate is provided with an air inlet and an air outlet, the air inlet is connected to the plurality of air paths, and the air outlet is connected to the plurality of air paths;

[0022] The sensing component further includes an air pressure sensor, which includes at least one of the following: the air pressure sensor is arranged at a position of the fixing plate close to the air inlet and the air pressure sensor is arranged at a position of the fixing plate close to the air outlet.

[0023] In one embodiment, the air inlet includes a first air inlet and a second air inlet, the first air inlet is connected to the plurality of air paths and is used to fill the plurality of air paths with humidified gas, and the second air inlet is connected to the plurality of air paths and is used to fill the plurality of air paths with high-pressure gas;

[0024] The air outlet includes a first air outlet and a second air outlet. The first air inlet is connected to the first air outlet after passing through multiple air paths. The second air inlet is connected to the second air outlet after passing through multiple air paths.

[0025] In one embodiment, the test fixture further includes a temperature and humidity unit and a pressure unit, wherein:

[0026] The temperature and humidity unit is connected to the first air inlet and is in communication with the sensing component, and is used to control the gas temperature and gas humidity of the first air inlet. The pressure unit is connected to the second air inlet and is in communication with the sensing component, and is used to control the gas pressure of the second air inlet.

[0027] In one embodiment, the test fixture further includes a mounting member and a sealing member, wherein:

[0028] The mounting member is arranged at the end of the pressure head module close to the supporting module;

[0029] The sealing member is embedded in the mounting member and an escape space is formed between the sealing member and the mounting member. The sealing member is configured to abut against the carrying module in response to the pressing state.

[0030] In one embodiment, the mounting member is provided with an annular mounting groove, the sealing member is an annular structure, and the sealing member is embedded in the mounting groove; wherein,

[0031] In a cross section perpendicular to an extending direction of the mounting groove, the cross section of the mounting groove is a trapezoid or a triangle.

[0032] In one embodiment, the pressure head module is provided with a first temperature control component, and the first temperature control component is used to control the temperature of the pressure head module.

[0033] In one embodiment, the carrying module is provided with a second temperature control component, and the second temperature control component is used to control the temperature in the carrying area.

[0034] In a second aspect, a testing device of the present application comprises:

[0035] A test fixture as described in any of the above technical solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to better describe and illustrate the embodiments and / or examples of the inventions disclosed herein, reference may be made to one or more of the accompanying drawings. The additional details or examples used to describe the accompanying drawings should not be considered to limit the scope of the disclosed inventions, the presently described embodiments and / or examples, and any of the best modes currently understood for these inventions.

[0037] FIG1 is a schematic diagram of the structure of a test fixture provided in some embodiments.

[0038] FIG. 2 is a top view of a carrier module provided in some embodiments.

[0039] FIG3 is a partial enlarged view of area A in FIG2 .

[0040] FIG4 is a cross-sectional view taken along line BB in FIG2 .

[0041] FIG5 is a partial enlarged view of area C in FIG4 .

[0042] FIG6 is a schematic structural diagram of a pressure head module provided in some embodiments.

[0043] FIG. 7 is a schematic structural diagram of a pressing plate provided in some embodiments.

[0044] FIG8 is a bottom view of a pressure head module provided in some embodiments.

[0045] FIG9 is a partial enlarged view of area D in FIG8 .

[0046] FIG10 is a cross-sectional view taken along the line EE in FIG8 .

[0047] FIG11 is a partial enlarged view of the F area in FIG10 .

[0048] FIG12 is a partial enlarged view of the G area in FIG10 .

[0049] FIG. 13 is an exploded schematic diagram of a pressure head module provided in some embodiments.

[0050] FIG. 14 is an exploded schematic diagram of a carrier module provided in some embodiments.

[0051] Description of reference numerals:

[0052] 100. Test fixture;

[0053] 110, bearing module; 111, bearing area; 112, substrate; 113, tray; 114, second temperature control component; 1141, second heat source; 1142, second heat conductor; 1143, second temperature sensor; 1144, second cold source; 120, pressure head module; 121, air path; 122, fixing plate; 123, pressing plate; 1231, pressing block; 1232, air hole; 1233, air inlet; 1234, air outlet; 1235, first air inlet; 1236, second Air inlet; 1237, first air outlet; 1238, second air outlet; 124, first temperature control component; 1241, first heat source; 1242, first heat conductor; 1243, first temperature sensor; 1244, first cold source; 130, sensing component; 131, temperature sensor; 132, humidity sensor; 133, control board; 134, connector; 135, air pressure sensor; 140, mounting part; 141, mounting groove; 150, sealing part; 151, avoidance space. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0055] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0056] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0057] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0058] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0059] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0060] 1-3 , the present application provides a test fixture 100, which includes a carrier module 110, a pressure head module 120, multiple air paths 121, and a sensing component 130. The test fixture 100 is configured to perform pressure connection tests on chips, electronic control boards, and the like.

[0061] The carrier module 110 is mounted on a frame to secure the carrier module 110 to the frame. Continuing with Figures 3-5 , the carrier module 110 is provided with multiple carrying areas 111 for supporting and placing products to be tested (e.g., chips, electronic control boards, and other components). In this embodiment, the carrying areas 111 may be slot-shaped structures formed on the carrier module 110, with multiple carrying areas 111 arranged in an array on the carrier module 110.

[0062] The ram module 120 is spaced apart from the carrier module 110. The ram module 120 has a pressed state in contact with the carrier module 110 and a demolded state in separation from the carrier module 110. Specifically, as in this embodiment, the ram module 110 is mounted on a frame and spaced apart from the carrier module 110. The frame allows the ram module 120 to be spaced apart from the carrier module 110, and the ram module 120 can be moved on the frame toward or away from the carrier module 110. For example, if a driving element is connected to the pressure head module 120, when a crimping test is required on the product to be tested, the driving element drives the pressure head module 120 to move toward the direction close to the carrier module 110, and when the pressure head module 120 switches to a crimping state in contact with the carrier module 110, the pressure head module 120 is crimped onto the product to be tested and a crimping test is performed on the product to be tested. After the crimping test of the product to be tested is completed, the driving element drives the pressure head module 120 to move toward the direction away from the carrier module 110, and the pressure head module 120 switches to a demolding state separated from the carrier module 110. There is a gap between the pressure head module 120 and the carrier module 110, which is convenient for disassembly and replacement of the product to be tested after the test is completed.

[0063] 6 and 7 , multiple air paths 121 are provided within the pressure head module 120 and / or the carrier module 110. In other words, the multiple air paths 121 may be provided only within the pressure head module 120, the multiple air paths 121 may be provided only within the carrier module 110, or the multiple air paths 121 may be provided partially within the pressure head module 120 and partially within the carrier module 110. The multiple air paths 121 correspond to the multiple carrier areas 111, so that the multiple air paths 121 can blow gas having a certain temperature, humidity, and pressure into the corresponding multiple carrier areas 111 to create a test environment for the product to be tested. Among them, it should be noted that the number of air circuits 121 opened can be the same as the number of load-bearing areas 111, and one air circuit 121 corresponds to one load-bearing area 111, so that each air circuit 121 can blow gas with a certain temperature, humidity and pressure toward the corresponding load-bearing area 111; the number of air circuits 121 opened can also be different from the number of load-bearing areas 111, such as multiple load-bearing areas 111 share one air circuit 121, so that each air circuit 121 can simultaneously blow gas with a certain temperature, humidity and pressure toward the multiple load-bearing areas 111 corresponding to it.

[0064] The sensing component 130 is disposed on the carrier module 110 and / or the pressure head module 120. In other words, the sensing component 130 may be disposed only on the carrier module 110, or only on the pressure head module 120. Furthermore, some components of the sensing component 130 may be disposed on the carrier module 110 and others on the pressure head module 120. The sensing component 130 is used to obtain the temperature, humidity, and air pressure of the carrier area 111, so that the sensing component 130 can provide real-time feedback on the temperature, humidity, and air pressure of the carrier area 111, that is, the sensing component 130 can provide real-time feedback on the test environment of the product under test.

[0065] When the performance test of the product to be tested (such as a chip) is required, the test fixture 100 places the product to be tested in the carrying area 111 and drives the pressure head module 120 to move toward the direction close to the carrying module 110. After the pressure head module 120 and the carrying module 110 are molded together, a gas with a certain temperature, humidity and pressure is blown toward the corresponding carrying area 111 through the air path 121, and the temperature, humidity and air pressure of the carrying area 111 are fed back in real time through the sensing component 130. According to the feedback result of the sensing component 130, the temperature, humidity and air pressure of the gas blown into the carrying area 111 can be accurately controlled. The test fixture 100 provided in this application can test multiple products to be tested at the same time, and simulate the temperature, humidity and air pressure of the products to be tested under the same test environment, thereby improving the test efficiency and accuracy of the products to be tested.

[0066] In one embodiment, referring to Figures 1-3 , the carrier module 110 includes a base plate 112 and a material tray 113. The base plate 112 is connected to the frame by welding, screwing, or other methods to achieve the installation and fixation of the carrier module 110 on the frame. The carrying area 111 is provided on the material tray 113, that is, the material tray 113 is used to support the product to be tested. For example, the material tray 113 is detachably connected to the base plate 112 by means of a snap connection, screwing, or other methods, which facilitates the removal of the material tray 113 and facilitates the replacement of the material tray 113 of different specifications on the base plate 112 for supporting the product to be tested.

[0067] Continuing to refer to Figures 4 and 5, the sensing component 130 includes a temperature sensor 131 and a humidity sensor 132. The temperature sensor 131 and the humidity sensor 132 are both embedded in the substrate 112 to set the sensing component 130 on the carrier module 110. The temperature sensor 131 protrudes to the surface of the tray 113 on the side where the carrier area 111 is provided. When the product to be tested is placed in the carrier area 111, the sensing end of the temperature sensor 131 is flush with the position of the product to be tested, so that during the testing of the product to be tested, the temperature sensor 131 and the product to be tested are in the same test environment. Compared with the traditional temperature sensor that senses the temperature of the test environment of the product to be tested in a non-contact manner, the temperature sensed by the temperature sensor has a deviation from the actual test temperature of the product to be tested. In this application, the temperature sensor 131 and the product to be tested are placed in the same test environment. The temperature sensor 131 has a higher temperature sensing accuracy for the test environment of the product to be tested, which can improve the test accuracy of the product to be tested.

[0068] Similarly, the humidity sensor 132 protrudes from the surface of the tray 113 on the side where the supporting area 111 is provided. When the product to be tested is placed in the supporting area 111, the sensing end of the humidity sensor 132 is flush with the position of the product to be tested, so that during the testing of the product to be tested, the humidity sensor 132 and the product to be tested are in the same test environment. Compared with the traditional humidity sensor that senses the humidity of the test environment of the product to be tested in a non-contact manner, the humidity sensed by the humidity sensor deviates from the actual test humidity of the product to be tested. In this application, the humidity sensor 132 and the product to be tested are placed in the same test environment. The humidity sensor 132 has a higher humidity sensing accuracy for the test environment of the product to be tested, which can also improve the test accuracy of the product to be tested.

[0069] Furthermore, referring to Figures 3 to 5, the sensing assembly 130 also includes a control board 133 and a connector 134. The control board 133 is embedded in the substrate 112, one end of the connector 134 is electrically connected to the control board 133, and the other end of the connector 134 is electrically connected to the temperature sensor 131 and / or the humidity sensor 132, so as to achieve signal conduction between the temperature sensor 131 and the control board 133. The temperature signal of the test environment of the product to be tested obtained by the temperature sensor 131 can be fed back to the control board 133 in a timely manner, and the signal conduction between the humidity sensor 132 and the control board 133 can be fed back to the control board 133 in a timely manner. The humidity signal of the test environment of the product to be tested obtained by the humidity sensor 132 can be fed back to the control board 133 in a timely manner. The control board 133 controls the air supply volume, air supply temperature and humidity in the air circuit 121 to accurately create a test environment for the product to be tested.

[0070] In this embodiment, referring to Figures 1, 4, and 5, the connector 134 is a probe, one end of which is welded to the control board 133, and the other end of which is welded to the temperature sensor 131 and / or the humidity sensor 132. This allows for signal conduction between the temperature sensor 131 and / or the humidity sensor 132 and the control board 133. Furthermore, the probe facilitates positioning the temperature sensor 131 and the humidity sensor 132 so that they protrude from the surface of the tray 113 on the side where the support area 111 is provided. Furthermore, in the event of a malfunction of the temperature sensor 131 or the humidity sensor 132, replacement of the temperature sensor 131 or the humidity sensor 132 is facilitated without having to scrap the entire test fixture 100, thereby reducing the cost of using and maintaining the test fixture 100.

[0071] In one embodiment, referring to Figures 3-5 , the temperature sensor 131 is configured to contact the product to be tested in response to the product to be tested being placed on the support area 111, and / or the humidity sensor 132 is configured to contact the product to be tested in response to the product to be tested being placed on the support area 111. When the temperature sensor 131 is configured to contact the product to be tested in response to the product to be tested being placed on the support area 111, the surface temperature of the product to be tested can be fed back to the temperature sensor 131 via solid conduction, thereby reducing the sensing error of the temperature sensor 131 regarding the test temperature of the product to be tested. As a result, the test environment temperature of the product to be tested can be controlled at a preset test temperature by the control board 133 for testing, thereby improving the test accuracy of the product to be tested. Similarly, when the humidity sensor 132 is configured to contact the product to be tested in response to the product to be tested being placed on the supporting area 111, the surface humidity of the product to be tested can be fed back to the humidity sensor 132 through solid conduction to reduce the sensing error of the humidity sensor 132 with respect to the test humidity of the product to be tested, thereby enabling the test environment humidity of the product to be tested to be controlled at a preset test humidity through the control board 133 for testing, thereby further improving the test accuracy of the product to be tested.

[0072] To further improve the accuracy of the sensing component 130 sensing the temperature, humidity, and air pressure of the load-bearing area 111, in one embodiment, as shown in Figures 2, 3, and 5, multiple adjacent load-bearing areas 111 share a single sensing component 130. To simultaneously batch test multiple products under test, a larger air-filled chamber is formed between the indenter module 120 and the load-bearing module 110 after they are molded together. Multiple products under test are housed within the air-filled chamber. Due to the influence of the external environment of the test fixture 100, the temperature at the edge of the air-filled chamber deviates from that in the center. Multiple carrying areas 111 share a sensing component 130 to divide the air-filled chamber into multiple small areas. Each sensing component 130 independently obtains the temperature, humidity and air pressure in the area, that is, each sensing component 130 independently obtains the temperature, humidity and air pressure in multiple carrying areas 111 arranged near the sensing component 130, thereby improving the sensing accuracy of the sensing component 130 for the temperature, humidity and air pressure of each carrying area 111, and thereby improving the control accuracy of the subsequent control board 133 for the temperature, humidity and air pressure of each carrying area 111.

[0073] In this embodiment, referring to FIG3 , four adjacent carrying areas 111 share one sensing component 130, and the sensing component 130 is disposed in the middle of the four adjacent carrying areas 111. That is, the sensing component 130 disposed between the four adjacent carrying areas 111 can independently obtain the temperature, humidity, and air pressure of the four adjacent carrying areas 111, thereby shortening the distance between the sensing component 130 and the four adjacent carrying areas 111 and improving the sensing accuracy of the sensing component 130 for the temperature, humidity, and air pressure of the four adjacent carrying areas 111. Of course, in other feasible embodiments, five, six, or other numbers of carrying areas 111 may share one sensing component 130. This application does not limit the specific number of carrying areas 111 that share one sensing component 130.

[0074] In order to implement batch crimping tests on multiple products to be tested, as shown in Figures 1, 6, and 7, the pressure head module 120 includes a fixed plate 122 and a pressure plate 123. The fixed plate 122 is movably connected to the frame to connect the pressure head module 120 to the frame, and the fixed plate 122 is moved to drive the pressure plate 123 to move toward or away from the carrier module 110. For example, the pressure plate 123 is detachably connected to the fixed plate 122 by means of a snap connection, a screw connection, etc., which facilitates the disassembly operation of the pressure plate 123. When the number of products to be tested changes, it is convenient to replace the pressure plate 123 of different specifications on the fixed plate 122 to perform crimping tests on different numbers of products to be tested, thereby improving the adaptability of the test fixture 100.

[0075] Continuing to refer to Figures 3, 8, and 9, the pressure plate 123 is provided with a plurality of pressing blocks 1231 protruding therefrom. Exemplarily, the pressing blocks 1231 are integrally formed on the pressure plate 123 by casting, molding, or the like, to enhance the connection strength between the pressure plate 123 and the pressing blocks 1231, prevent the pressing blocks 1231 from breaking from the pressure plate 123 due to excessive force during the crimping process, and simplify the molding process for forming the plurality of pressing blocks 1231 on the pressure plate 123. The plurality of pressing blocks 1231 correspond to the plurality of bearing areas 111, and the pressing blocks 1231 are configured to abut against the product under test in response to the direction in which the pressure head module 120 approaches the bearing module 110, so that the plurality of pressing blocks 1231 can perform crimping tests on the products under test placed in the plurality of bearing areas 111.

[0076] In one embodiment, as shown in Figures 1, 3, 7, and 9, the pressure plate 123 is provided with an air path 121 and air holes 1232 communicating with the air path 121. The plurality of air holes 1232 correspond to the plurality of support areas 111. For example, the air path 121 is a slot-shaped structure formed on the pressure plate 123, and the air holes 1232 are formed on the pressure plate 123, with the air holes 1232 opening on the surface of the pressure plate 123 on the side near the support module 110. The air holes 1232 are used to blow air from the air path 121 into the corresponding support area 111, thereby creating a test environment for the product under test around the corresponding support area 111. The plurality of air paths 121 are independent of each other. Since each air path 121 is connected to an air hole 1232, different test environments can be created around each support area 111 by varying the air flow rate, air temperature, and humidity within each air path 121, allowing multiple products under test to undergo press-fit testing under different test environments. Exemplarily, the gas path 121 extends in an S-shape or a wavy shape. The curved shape of the gas path 121 allows for sufficient gas to be filled within the gas path 121. While ensuring sufficient gas supply, the volume of the pressure plate 123 is reduced, thereby achieving a miniaturized design for the test fixture 100. Of course, in other feasible embodiments, the gas path 121 may also extend in a V-shape or other curved structure. This application does not limit the specific structure of the gas path 121.

[0077] Specifically, as shown in FIG7 , the pressure plate 123 is provided with an air inlet 1233 and an air outlet 1234. The air inlet 1233 is connected to the plurality of air paths 121. In this embodiment, the air inlet 1233 is connected to an external air source (not shown), through which air having a certain temperature, humidity, and pressure is injected into the air paths 121. The air outlet 1234 is connected to the plurality of air paths 121. After the test of the product to be tested is completed, the air within the air paths 121 can be discharged to the outside through the air outlet 1234.

[0078] Continuing to refer to Figures 3, 10 and 11, the sensing component 130 also includes an air pressure sensor 135, which is arranged on the fixed plate 122 near the air inlet 1233 and / or the air outlet 1234. The air pressure sensor 135 can sense the gas pressure at the air inlet 1233 or the air outlet 1234 to obtain the gas pressure blown to the vicinity of the carrying area 111 through the air path 121, and the air pressure sensor 135 can promptly feed back the obtained gas pressure to the control unit or the operator, so that when the test environment near the carrying area 111 deviates from the preset test environment, the gas pressure at the air inlet 1233 can be controlled to adjust the environment around the carrying area 111 to the preset test pressure, thereby improving the test accuracy of the product to be tested. Among them, it should be noted that when air pressure sensors 135 are provided at both the air inlet 1233 and the air outlet 1234, the air pressure at the air inlet 1233 and the air outlet 1234 can be monitored to ensure that the air pressure inside the air path 121 is stable, and to prevent the air pressure around the load-bearing area 111 from deviating from the air pressure at the air inlet 1233 and the air outlet 1234 when air leakage occurs in the test fixture 100, thereby ensuring the reliability of the test pressure in the load-bearing area 111.

[0079] 3 and 7 , the air inlet 1233 includes a first air inlet 1235 and a second air inlet 1236. The first air inlet 1235 is in communication with the plurality of air paths 121 and is used to inject humidified air into the plurality of air paths 121 to control the humidity near the carrier area 111. The second air inlet 1236 is in communication with the plurality of air paths 121 and is used to inject high-pressure air into the plurality of air paths 121 to control the air pressure near the carrier area 111. The air outlet 1234 includes a first air outlet 1237 and a second air outlet 1238. The first air outlet 1237 is connected to the first air inlet 1235 and the plurality of air paths 121 to discharge the humid gas that has entered the air path 121 through the first air inlet 1235. The second air outlet 1238 is connected to the second air inlet 1236 and the plurality of air paths 121 to discharge the high-pressure gas that has entered the air path 121 through the second air inlet 1236. The first air inlet 1235 and the second air inlet 1236 are provided separately to facilitate independent control of the humidity and pressure of the air path 121.

[0080] In addition, referring to Figures 1, 3 and 7, the test fixture 100 also includes a temperature and humidity unit (not shown) and a pressure unit (not shown). The temperature and humidity unit is connected to the first air inlet 1235 and is in communication with the sensing component 130. The temperature and humidity unit is used to control the gas temperature and gas humidity of the first air inlet 1235. Specifically, the temperature and humidity unit can heat and humidify the gas filled into the first air inlet 1235, and control the gas temperature and gas humidity of the first air inlet 1235 according to the temperature and humidity of the test environment around the carrying area 111 fed back by the sensing component 130. The pressure unit is connected to the second air inlet 1236 and is in communication with the sensing component 130. The pressure unit is used to control the gas pressure of the second air inlet 1236. Specifically, the pressure unit can pressurize the gas charged into the second air inlet 1236 and control the gas pressure of the second air inlet 1236 according to the pressure of the test environment around the carrying area 111 fed back by the sensing component 130 .

[0081] The above-mentioned test fixture 100, the temperature and humidity unit and the pressure unit are all communicated with the sensing component 130. The sensing component 130 obtains the temperature, humidity and air pressure of the test environment around the load-bearing area 111, and feeds back the temperature, humidity and air pressure signals of the test environment around the load-bearing area 111 to the temperature and humidity unit and the pressure unit. The temperature, humidity and pressure of the gas entering the air path 121 are controlled by the temperature and humidity unit and the pressure unit to accurately adjust the temperature, humidity and air pressure of the test environment of the load-bearing area 111, thereby improving the test accuracy of the product to be tested.

[0082] In one embodiment, as shown in Figures 1, 12, and 13, the test fixture 100 further includes a mounting member 140 and a sealing member 150. The mounting member 140 is disposed at the end of the indenter module 120 that is adjacent to the carrier module 110. As shown in this embodiment, further referring to Figures 12 and 13, the mounting member 140 is an annular strip structure and is connected to the end surface of the indenter module 120 that faces the carrier module 110 by welding, threading, or other means.

[0083] The seal 150 is set on the mounting member 140 in an embedded manner, and an escape space 151 is formed between the seal 150 and the mounting member 140. The seal 150 is configured to abut against the carrier module 110 in response to the pressing state. The seal 150 can be a sealing ring or a sealing strip. Since the product to be tested is usually accompanied by test environment requirements such as temperature, humidity and air pressure during the compression test, the seal 150 abuts against the carrier module 110 in the pressing state to seal the test environment of the product to be tested, avoid the external environment from interfering with the test environment of the product to be tested, and improve the test reliability of the product to be tested. Because the seal 150 is flexible, the seal 150 is prone to deformation under high temperature and air pressure. During the process of heat deformation of the seal 150, the escape space 151 can provide deformation space for the seal 150, preventing the seal 150 from warping due to heat deformation, or even detaching from the mounting member 140, thereby improving the sealing reliability of the seal 150 for the test environment of the product to be tested.

[0084] In one embodiment, as shown in Figures 1 and 12 , the mounting member 140 is provided with an annular mounting groove 141. For example, the mounting groove 141 extends in the circumferential direction of the pressure head module 120. Exemplarily, the mounting groove 141 is integrally formed on the mounting member 140 by injection molding, extrusion, or other methods, thereby simplifying the molding process for forming the mounting groove 141 on the mounting member 140. The sealing member 150 is also annular in structure and is adapted to fit within the mounting groove 141, allowing the sealing member 150 to be embedded within the mounting groove 141. Among them, in the cross-section perpendicular to the extension direction of the mounting groove 141 (i.e., the cross-section parallel to the paper surface as shown in Figure 12), the cross-section of the mounting groove 141 is one of a trapezoid and a triangle. On the one hand, when the seal 150 is embedded in the mounting groove 141131, the side wall portion of the mounting groove 141 abuts against the outer surface of the seal 150 to achieve the installation and fixation of the seal 150. On the other hand, there is a gap between the other part of the side wall of the mounting groove 141 and the outer surface of the seal 150 to form an avoidance space 151, providing a deformation space for the seal 150, thereby preventing the seal 150 from warping due to heat deformation, or even detaching from the mounting member 140.

[0085] It should be noted that, in a cross section perpendicular to the direction in which the mounting groove 141 extends, the cross section of the mounting groove 141 can also be a diamond, arc, or other special shape, as long as the sidewall portion of the mounting groove 141 abuts against the outer surface of the seal 150, and a gap exists between the other portion of the sidewall of the mounting groove 141 and the outer surface of the seal 150. This application does not impose any restrictions on the specific cross-sectional shape of the mounting groove 141.

[0086] To ensure the reliability of the test environment temperature of the product under test, in one embodiment, as shown in FIG13 , the press head module 120 is provided with a first temperature control component 124, which is used to control the temperature of the pressing plate 123. During the crimping test of the product under test, the press head module 120 needs to abut against the product under test. The first temperature control component 124 can control the temperature difference between the pressing plate 123 and the product under test during the abutment process, thereby preventing the test environment of the product under test from fluctuating due to heat exchange between the pressing plate 123 and the product under test caused by an excessive temperature difference between the pressing plate 123 and the product under test, thereby ensuring the reliability of the test environment temperature of the product under test.

[0087] Specifically, referring to FIG13 , the first temperature control assembly 124 includes a first heat source 1241, a first heat conductor 1242, a first temperature sensor 1243, and a first cold source 1244. The first heat source 1241 is embedded within the fixed plate 122 and is used to provide heat to the pressing plate 123. For example, the first heat source 1241 may be a heating block made of aluminum nitride. Heat generated by the first heat source 1241 is transferred to the pressing plate 123 to control the temperature difference between the pressing plate 123 and the product under test. The first heat conductor 1242 is connected to the first heat source 1241 and in contact with the pressing plate 123, thereby transferring the heat generated by the first heat source 1241 to the pressing plate 123. The first temperature sensor 1243 is used to obtain the heat amount of the pressure plate 123, and the first temperature sensor 1243 is connected to the first cold source 1244 signal. The first temperature sensor 1243 can feed back the obtained heat signal of the pressure plate 123 to the first cold source 1244, and neutralize and adjust the heat generated by the first heat source 1241 through the first cold source 1244, so as to adjust the amount of heat transferred to the pressure plate 123 by the first heat source 1241 when the heat of the pressure plate 123 deviates from the preset temperature.

[0088] Furthermore, referring to FIG13 , the sensing end of the first temperature sensor 1243 is in contact with the pressure plate 123, and the amount of heat on the pressure plate 123 can be obtained by the first temperature sensor 1243 through solid heat conduction, so as to improve the sensing accuracy of the first temperature sensor 1243 for the pressure plate 123, facilitate more precise adjustment of the heat transferred to the pressure plate 123 by the first heat source 1241, further improve the control accuracy of the temperature difference between the pressure plate 123 and the product to be tested, and thereby improve the reliability of the test environment temperature control of the product to be tested.

[0089] To further ensure the reliability of the test environment temperature of the product to be tested, in one embodiment, as shown in Figures 3 and 14, the carrier module 110 is provided with a second temperature control component 114, which is used to control the temperature within the carrier area 111. The second temperature control component 114 monitors the temperature within the carrier area 111 in real time. When the temperature within the carrier area 111 deviates from the preset temperature, the second temperature control component 114 feeds back a temperature deviation signal to the control unit or the operator, and the control unit or the operator adjusts the test environment temperature within the carrier area 111, further ensuring the reliability of the test environment temperature of the product to be tested.

[0090] Specifically, referring to FIG. 14 , the second temperature control assembly 114 includes a second heat source 1141, a second heat conductor 1142, a second temperature sensor 1143, and a second cold source 1144. The second heat source 1141 is embedded in the substrate 112 and is used to provide heat to the material tray 113. For example, the second heat source 1141 may be a heating block made of aluminum nitride. Heat generated by the second heat source 1141 is transferred to the material tray 113 to create a temperature environment for the product under test carried on the material tray 113 during the testing process. The second heat conductor 1142 is connected to the second heat source 1141 and contacts the material tray 113 to transfer the heat generated by the second heat source 1141 to the material tray 113 via the second heat conductor 1142. The second temperature sensor 1143 is connected to the second cold source 1144 signal. The second temperature sensor 1143 can feed back the heat signal of the material tray 113 to the second cold source 1144. The heat generated by the second heat source 1141 is neutralized and adjusted by the second cold source 1144. When the heat of the material tray 113 deviates from the preset temperature, the amount of heat transferred from the second heat source 1141 to the material tray 113 is adjusted, thereby further ensuring the reliability of the test environment temperature of the product to be tested.

[0091] In addition, referring to FIG. 1 , the present application further provides a testing device, which includes a testing fixture 100 according to the above technical solution.

[0092] The above-mentioned testing equipment can test multiple products under test at the same time and simulate the temperature, humidity and air pressure of the products under test under the same test environment, thereby improving the testing efficiency and accuracy of the products under test.

[0093] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A test fixture, characterized in that: The test fixture includes: A carrying module, wherein the carrying module is provided with a plurality of carrying areas for carrying the product to be tested; A pressing head module, wherein the pressing head module has a pressing state in which it abuts against the carrying module and a demoulding state in which it is separated from the carrying module; A plurality of gas paths, the plurality of gas paths being provided in at least one of the pressure head module and the bearing module, the plurality of gas paths corresponding to the plurality of bearing areas, the gas paths being used to blow gas having temperature and humidity toward the corresponding bearing areas; and The sensing component includes at least one of the sensing component being arranged on the bearing module and the sensing component being arranged on the pressure head module, and the sensing component is used to obtain the temperature, humidity and air pressure of the bearing area.

2. The test fixture according to claim 1, characterized in that: The carrying module comprises a substrate and a material tray detachably connected to the substrate, and the carrying area is arranged on the material tray; The sensing component includes a temperature sensor and a humidity sensor, both of which are embedded in the substrate, the temperature sensor protrudes to the surface of the material tray on the side where the carrying area is provided, and the humidity sensor protrudes to the surface of the material tray on the side where the carrying area is provided.

3. The test fixture according to claim 2, characterized in that: The sensing component also includes a control board and a connector, wherein the control board is embedded in the substrate, one end of the connector is electrically connected to the control board, and the other end of the connector is electrically connected to at least one of the temperature sensor and the humidity sensor.

4. The test fixture according to any one of claims 2 or 3, characterized in that: The temperature sensor is configured to contact the product to be tested in response to the product to be tested being placed on the carrying area.

5. The test fixture according to any one of claims 2 or 3, characterized in that: The humidity sensor is configured to contact the product to be tested in response to the product to be tested being placed on the carrying area.

6. The test fixture according to claim 1, characterized in that: A plurality of adjacent bearing areas share one sensing component.

7. The test fixture according to claim 1, characterized in that: The pressure head module comprises a fixing plate and a pressing plate detachably connected to the fixing plate; wherein: The pressure plate is provided with the air path and air holes connected to the air path, the multiple air paths are independent of each other, the multiple air holes correspond to the multiple bearing areas, and are used to blow the gas in the air path to the corresponding bearing areas; wherein the air path extends in an S-shape or a wave-shape.

8. The test fixture according to claim 7, characterized in that: The pressing plate is provided with an air inlet and an air outlet, the air inlet is connected to the plurality of air paths, and the air outlet is connected to the plurality of air paths; The sensing component further includes an air pressure sensor, including at least one of the following: the air pressure sensor is arranged at a position of the fixing plate close to the air inlet and the air pressure sensor is arranged at a position of the fixing plate close to the air outlet.

9. The test fixture according to claim 8, characterized in that: The air inlet includes a first air inlet and a second air inlet, the first air inlet is connected to the plurality of air paths and is used to fill the plurality of air paths with humidified gas, and the second air inlet is connected to the plurality of air paths and is used to fill the plurality of air paths with high-pressure gas; The air outlet includes a first air outlet and a second air outlet, the first air inlet is connected to the first air outlet after passing through a plurality of the air paths; the second air inlet is connected to the second air outlet after passing through a plurality of the air paths.

10. The test fixture according to claim 9, characterized in that: The test fixture also includes a temperature and humidity unit and a pressure unit, wherein: The temperature and humidity unit is connected to the first air inlet and is communicated with the sensing component to control the gas temperature and gas humidity of the first air inlet. The pressure unit is connected to the second air inlet and is communicated with the sensing component to control the gas pressure of the second air inlet.

11. The test fixture according to claim 1, characterized in that: The test fixture further includes a mounting member and a sealing member, wherein: The mounting member is arranged at an end of the pressure head module close to the bearing module; The sealing member is embedded in the mounting member and an escape space is formed between the sealing member and the mounting member. The sealing member is configured to abut against the bearing module in response to the pressing state.

12. The test fixture according to claim 11, characterized in that: The mounting member is provided with an annular mounting groove, the sealing member is an annular structure, and the sealing member is embedded in the mounting groove; wherein, In a cross section perpendicular to the extending direction of the mounting groove, the cross section of the mounting groove is a trapezoid or a triangle.

13. The test fixture according to claim 1, characterized in that: The pressure head module is provided with a first temperature control component, and the first temperature control component is used to control the temperature of the pressure head module.

14. The test fixture according to claim 1, characterized in that: The bearing module is provided with a second temperature control component, and the second temperature control component is used to control the temperature in the bearing area.

15. A testing device, characterized in that: The test equipment includes: A test fixture as described in any one of claims 1 to 14.

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