Server cooling assembly and server

Abstract

The present application relates to the technical field of server cooling devices, and in particular to a server cooling assembly and a server. In the server cooling assembly, a heat exchange cold plate is connected to a liquid cooling member, the heat exchange cold plate is configured to be arranged on the surface of a heating component of a server, a cooling flow channel configured to allow a coolant to flow therein is provided in the liquid cooling member, the heat exchange cold plate is configured to transfer heat from the heating component to the liquid cooling member by means of heat conduction, and the liquid cooling member is configured to take away heat by means of the flowing of the coolant. When the server cooling assembly is used, the heat exchange cold plate continuously transfers heat from the heating component to the liquid cooling member by means of heat conduction, the coolant continuously flows through the cooling flow channel in the liquid cooling member, and the coolant exchanges heat with the heat exchange cold plate in the cooling flow channel by means of a flow channel wall of the liquid cooling member, thereby taking away the heat generated during the operation of the heating component of the server that is transferred by the heat exchange cold plate, and thus the aim of heat dissipation is achieved. The server cooling assembly can also be used for reducing the risk of a coolant leakage.

Description

Server cooling assembly and server

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on November 30, 2023, with application number 202311629024.9 and application name “A Server Cooling Component and Server”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the technical field of server cooling devices, and in particular to a server cooling assembly and a server. Background Art

[0004] A server is a type of computer that provides computing or application services to other clients (such as PCs (personal computers), smartphones, ATMs (automated teller machines), and even large-scale equipment such as train systems) on a network. With the rapid development of information and data technologies and their applications, higher performance requirements are being placed on servers, key components of data centers. To meet the demand for high-performance servers, the performance of core server components such as the CPU (central processing unit) and GPU (graphics processing unit) is being significantly improved, and their power consumption and heat generation are also increasing exponentially. To ensure the normal operation of the server, it is necessary to dissipate heat from the server components, especially the high-power, heat-generating components such as the CPU, GPU, and memory. Servers include cold plate liquid cooling, which uses a liquid-cooled cold plate in direct contact with the server's heat-generating components to dissipate heat. The cooling principle is that coolant continuously flows through the internal flow channel of the cold plate. The coolant in the flow channel passes through the cold plate wall to exchange heat with the server's heat-generating components, thereby removing the heat generated by the server's heat-generating components to achieve the purpose of heat dissipation.

[0005] However, the structures of the heat-generating components in the server are different, and the cold plates need to adapt to the heat-generating components with different structures. Multiple cold plates are usually welded and assembled, which leads to the risk of leakage at the cold plates.

[0006] Summary of the Invention

[0007] In view of this, the present application aims to propose a server cooling assembly and a server to solve or partially solve the problem of liquid leakage risk at the cold plate of the existing server.

[0008] To achieve the above objectives, the technical solution of this application is implemented as follows:

[0009] In a first aspect, some embodiments of the present application provide a server cooling assembly, which includes a liquid cooling component and a heat exchange cold plate, the heat exchange cold plate being connected to the liquid cooling component, the heat exchange cold plate being used to be arranged on the surface of the heat-generating component of the server, and a cooling flow channel for the flow of cooling liquid being provided in the liquid cooling component; the heat exchange cold plate is used to transfer the heat of the heat-generating component to the liquid cooling component through heat conduction, and the liquid cooling component is used to take away the heat through the flow of cooling liquid.

[0010] Furthermore, the heat exchange cold plate includes a first heat exchange plate, a second heat exchange plate and a connecting piece. The first heat exchange plate is arranged on one side of the heat-generating component, and the second heat exchange plate is arranged on the other opposite side of the heat-generating component. The connecting piece connects the first heat exchange plate and the second heat exchange plate to connect the first heat exchange plate, the heat-generating component and the second heat exchange plate.

[0011] Furthermore, the heat exchange cold plate includes a third heat exchange plate, a fourth heat exchange plate and a first fastener. The third heat exchange plate and the fourth heat exchange plate are hinged. The heat-generating component is clamped between the third heat exchange plate and the fourth heat exchange plate. The first fastener is used to connect the third heat exchange plate and the fourth heat exchange plate to connect the third heat exchange plate, the heat-generating component and the fourth heat exchange plate.

[0012] Furthermore, the server cooling assembly also includes a first heat pipe, which is connected to the heat exchange cold plate and contacts the heat-generating component.

[0013] Furthermore, the heat-generating component is a memory of the server.

[0014] Furthermore, in the length direction of the memory, at least one end of the heat exchange cold plate is connected to the liquid cooling component.

[0015] Furthermore, a plurality of slots are provided at one end of the heat exchange cold plate, and the slots are suitable for inserting the heat generating components one by one.

[0016] Furthermore, the server cooling assembly also includes a second heat pipe, one end of the second heat pipe is connected to the heat exchange cold plate, and the other end of the second heat pipe is connected to the liquid cooling component.

[0017] Furthermore, the heat exchange cold plate includes an outer shell, which encloses an evaporation and condensation cavity, the groove wall of the slot is the evaporation end, and the end of the heat exchange cold plate connected to the liquid cooling component is the condensation end.

[0018] Furthermore, the heat-generating components include a CPU and memory, at least one memory is provided on one side of the CPU, and at least one memory is also provided on the other side opposite to the CPU. The memories are arranged in parallel and at intervals, and there is a gap between the memory and the CPU; the liquid cooling part has a plate-like structure, and the lower surface of the liquid cooling part is attached to the CPU; a heat exchange cold plate is provided on one side of the liquid cooling part, and a heat exchange cold plate is also provided on the other side opposite to the liquid cooling part; the heat exchange cold plate has a rectangular block structure, and a plurality of card slots are provided at one end of the heat exchange cold plate, the size of the card slots is adapted to the size of the memory, and the lower surface of the heat exchange cold plate is provided with slot openings for the card slots; the heat exchange cold plate is suitable for moving toward the memory so that the card slots are inserted into the memory one by one; the upper surface of the heat exchange cold plate is connected to the upper surface of the liquid cooling part through a second heat conduction pipe; or, the other end of the heat exchange cold plate is provided with an extension extending toward the liquid cooling part, and the lower surface of the extension is connected to the upper surface of the liquid cooling part.

[0019] Furthermore, the server also includes a plug-in frame, in which a heat-generating component is provided; a heat exchange cold plate is connected to both the plug-in frame and the heat-generating component, and the heat exchange cold plate is provided with a plug-in end extending out of the plug-in frame; the plug-in frame is inserted into the server, and the plug-in end contacts the liquid cooling component; the plug-in frame is pulled out of the server, and the plug-in end and the liquid cooling component are separated.

[0020] Furthermore, the server cooling assembly also includes a third heat pipe, which is connected to the heat exchange cold plate; the third heat pipe is in contact with the heat-generating component, and one end of the third heat pipe is connected to the plug end.

[0021] Furthermore, the heat generating component is a hard disk, which is arranged in the plug-in frame and contacts the heat exchange cold plate.

[0022] Furthermore, the server cooling assembly also includes a soft thermal pad, which is arranged between the heat exchange cold plate and the heat-generating component.

[0023] In a second aspect, some embodiments of the present application further provide a server, which includes a heat-generating component and a server cooling assembly, wherein the heat-generating component is connected to the server cooling assembly, and the server cooling assembly is the server cooling assembly as described above.

[0024] This application discloses a server cooling assembly. When in use, a heat exchange plate continuously transfers heat from heat-generating components to a liquid cooling element through heat conduction. Coolant continuously flows through the cooling channel of the liquid cooling element. Within the cooling channel, the coolant passes through the channel walls of the liquid cooling element to exchange heat with the heat exchange plate, thereby removing heat generated by the server's heat-generating components from the heat exchange plate, thereby achieving heat dissipation. In some embodiments of the present application, the server cooling assembly utilizes convection and conduction heat transfer from coolant to liquid cooling element, then to the heat exchange plate, then to the heat-generating components. This significantly increases the heat transfer coefficient and offers the advantage of efficient heat dissipation, preventing server downtime and burnout caused by overheating of heat-generating components within the server.

[0025] In some embodiments of the server cooling assembly of the present application, the heat exchange plate transfers heat from the heat-generating component to the liquid cooling element through heat conduction. The heat exchange plate does not have cooling channels for the flow of coolant, but only the liquid cooling element has cooling channels for the flow of coolant. Compared to the heat exchange plate also having cooling channels, when connecting the heat exchange plate and the liquid cooling element, welding and assembly are required to connect the cooling channels of the heat exchange plate and the cooling channels of the liquid cooling element. In some embodiments of the server cooling assembly of the present application, the coolant only flows within the cooling channels of the liquid cooling element, which can reduce the welding and assembly parts within the server cooling assembly, thereby reducing the risk of coolant leakage.

[0026] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate some embodiments of the present application or technical solutions in the prior art, the following briefly introduces the drawings required for describing some embodiments of the present application.

[0028] FIG1 is a schematic structural diagram of a top view of a server cooling assembly according to some embodiments of the present application;

[0029] FIG2 is a schematic structural diagram of an exploded view of a heat exchange cold plate according to some embodiments of the present application;

[0030] FIG3 is a schematic structural diagram of a first heat exchange plate and a second heat exchange plate in some embodiments of the present application;

[0031] FIG4 is a schematic structural diagram of an exploded view of a heat exchange cold plate according to some other embodiments of the present application;

[0032] FIG5 is a schematic structural diagram of a second heat exchange plate in some embodiments of the present application;

[0033] FIG6 is a schematic structural diagram of a top view of a server cooling assembly according to some embodiments of the present application;

[0034] FIG7 is a first structural diagram of a server cooling assembly according to some embodiments of the present application;

[0035] FIG8 is a second structural diagram of a server cooling assembly according to some embodiments of the present application;

[0036] FIG9 is a third structural diagram of a server cooling assembly according to some embodiments of the present application;

[0037] FIG10 is a schematic structural diagram of a cross-sectional view of a server cooling assembly according to some embodiments of the present application;

[0038] FIG11 is a first structural diagram of a server cooling assembly according to some embodiments of the present application;

[0039] FIG12 is a second structural diagram of a server cooling assembly according to some embodiments of the present application;

[0040] FIG13 is a schematic structural diagram of a liquid cooling element according to some embodiments of the present application;

[0041] FIG14 is a schematic structural diagram of a heat exchange cold plate in some embodiments of the present application;

[0042] FIG15 is a schematic structural diagram of a front view of a liquid cooling element in some embodiments of the present application;

[0043] FIG16 is a schematic diagram of the connection of pipelines of a liquid cooling component in some embodiments of the present application.

[0044] Description of reference numerals:

[0045] 10-liquid cooling element; 11-connection protrusion; 12-pipeline joint;

[0046] 20 - heat exchange cold plate; 21 - first heat exchange plate; 22 - second heat exchange plate; 23 - fixing clip; 24 - third heat exchange plate; 25 - fourth heat exchange plate; 26 - slot; 27 - first heat pipe; 28 - second heat pipe; 29 - outer shell; 30 - evaporation and condensation chamber; 31 - extension portion; 32 - plug end; 33 - connection portion; 34 - first connecting hole; 35 - hinge; 36 - avoidance portion; 37 - second connecting hole; 38 - first pipeline; 39 - second pipeline; 40 - third heat pipe; 41 - heat conduction block; 45 - first infusion pipe; 46 - second infusion pipe; 47 - third infusion pipe; 48 - fourth infusion pipe;

[0047] 51-first diverter column; 52-second diverter column; 53-third diverter column; 54-fourth diverter column;

[0048] 61-memory; 62-CPU; 63-swap frame; 64-hard disk;

[0049] 71 - first fastener; 72 - second fastener; 73 - nut; 74 - fourth fastener; 75 - fifth fastener. DETAILED DESCRIPTION

[0050] Some exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although some exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. Instead, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0051] 1 , which shows a schematic structural diagram of a server cooling assembly provided in some embodiments of the present application. The server cooling assembly is applied to a server to dissipate heat from the server's heat-generating components (such as the CPU 62 , memory 61 , hard disk, etc.) to prevent the heat-generating components in the server from being overheated and causing damage such as downtime or burning.

[0052] The CPU 62 is the central processing unit (CPU), which is the computing and control core of the server and the final execution unit for information processing and program execution. The CPU 62 generates a lot of heat during operation.

[0053] Memory 61 is an important component of the server, also known as internal memory and main memory. It is used to temporarily store the calculation data in the CPU and the data exchanged with external memory such as the hard disk.

[0054] Hard disk 64 is the server's primary storage device. To enhance ease of use, hard disk 64 in the server can be hot-swappable. This allows users to remove and replace a damaged hard disk without shutting down the system or disconnecting power, thereby improving the server's emergency recovery capabilities, scalability, and flexibility.

[0055] Referring to Figure 1, it shows a structural schematic diagram of a top view of a server cooling assembly in some embodiments of the present application. The server cooling group includes a liquid cooling part 10 and a heat exchange cold plate 20. The heat exchange cold plate 20 is connected to the liquid cooling part 10. The heat exchange cold plate 20 is used to be set on the surface of the heat-generating component of the server. A cooling flow channel for the flow of coolant is provided in the liquid cooling part 10; the heat exchange cold plate 20 is used to transfer the heat of the heat-generating component to the liquid cooling part 10 through heat conduction, and the liquid cooling part 10 is used to take away the heat through the flow of coolant.

[0056] When the server cooling assembly of some embodiments of the present application is in use, the heat exchange plate 20 continuously transfers heat from the heat-generating components to the liquid cooling element 10 through heat conduction. The coolant continuously flows through the cooling channel of the liquid cooling element 10. The coolant exchanges heat with the heat exchange plate 20 through the channel walls of the liquid cooling element 10 within the cooling channel, thereby removing the heat generated by the operation of the server's heat-generating components transferred from the heat exchange plate 20 to achieve the purpose of heat dissipation. The server cooling assembly of some embodiments of the present application uses convection heat transfer and heat conduction from coolant to liquid cooling element 10 to heat exchange plate 20 to heat-generating components, greatly increasing the heat transfer coefficient and having the advantage of efficient heat dissipation, which can avoid damage such as downtime and burning caused by excessive temperatures of heat-generating components within the server.

[0057] In the server cooling assembly of some embodiments of the present application, the heat exchange plate 20 transfers heat from the heat-generating components to the liquid cooling element 10 by heat conduction. The heat exchange plate 20 does not have cooling channels for the flow of coolant, and only the liquid cooling element 10 has cooling channels for the flow of coolant. Compared to the heat exchange plate 20 also having cooling channels, when the heat exchange plate 20 and the liquid cooling element 10 are connected, welding and assembly are required to connect the cooling channels of the heat exchange plate 20 and the cooling channels of the liquid cooling element 10. In the server cooling assembly of some embodiments of the present application, the coolant only flows within the cooling channels of the liquid cooling element 10, which can reduce the welding and assembly parts within the server cooling assembly, thereby reducing the risk of coolant leakage.

[0058] Optionally, as shown in Figure 2, the heat exchange cold plate 20 includes a first heat exchange plate 21, a second heat exchange plate 22 and a connecting piece. The first heat exchange plate 21 is arranged on one side of the heat-generating component, and the second heat exchange plate 22 is arranged on the other side opposite to the heat-generating component. The connecting piece connects the first heat exchange plate 21 and the second heat exchange plate 22 to connect the first heat exchange plate 21, the heat-generating component and the second heat exchange plate 22.

[0059] In some embodiments of the present application, the first heat exchange plate 21 and the second heat exchange plate 22 are separate structures, and the first heat exchange plate 21 and the second heat exchange plate 22 are connected by a connector. When the connector connects the first heat exchange plate 21 and the second heat exchange plate 22, the distance between the first heat exchange plate 21 and the second heat exchange plate 22 can be reduced to a minimum, so as to tightly clamp the heat-generating component. When the heat-generating component has a variety of thicknesses, the connection between the first heat exchange plate 21, the second heat exchange plate 22 and the connector can still fix the heat-generating component, which makes the heat exchange cold plate 20 well adaptable to memories 61 of different thicknesses, and the heat exchange cold plate 20 has the advantages of strong versatility and a wide range of applications.

[0060] Optionally, as shown in Figure 2, the connecting member is a fixing clip 23. When the fixing clip 23 is in use, the first heat exchange plate 21, the heat-generating component, and the second heat exchange plate 22 are stacked in sequence, and the fixing clip 23 is used to clamp the first heat exchange plate 21 and the second heat exchange plate 22 to connect the first heat exchange plate 21, the heat-generating component, and the second heat exchange plate 22.

[0061] It is understandable that the connecting member may also be a fastener such as a bolt or a screw.

[0062] In some embodiments of the present application, when the server cooling assembly is in use, as shown in FIG2 , the first and second heat exchange plates 21, 22 are connected to a single memory stick 61. Each memory stick 61 is removable from the first and second heat exchange plates 21, 22. After the first and second heat exchange plates 21, 22, and memory stick 61 are connected, a memory module is formed. The memory module is then inserted into a memory slot on the server motherboard. If a server has multiple memory slots and multiple memory modules are required to be inserted into the multiple memory slots, the multiple memory modules are arranged parallel to each other and spaced apart.

[0063] Optionally, as shown in FIG2 , the first heat exchange plate 21, the second heat exchange plate 22, and the fixing clamp 23 are connected to the liquid cooling element 10 via a second fastener 72. It is understood that some embodiments of the present application do not specifically limit the second fastener 72; for example, the second fastener 72 may be a screw, bolt, or the like.

[0064] Furthermore, as shown in Figure 3, the second heat exchange plate 22 is provided with a connecting portion 33 and a relief portion 36. The connecting portion 33 protrudes from the surface of the second heat exchange plate 22 and is provided with a first connecting hole 34. The relief portion 36 is an arc-shaped structure that encloses a semi-cylindrical structure. The first heat exchange plate 21 is also provided with a relief portion 36, and the relief portion 36 of the first heat exchange plate 21 and the relief portion 36 of the second heat exchange plate 22 have the same shape.

[0065] When the retaining clamp 23 clamps the first and second heat exchange plates 21, 22, the end of the first heat exchange plate 21 rests on the connecting portion 33. The relief portion 36 of the first heat exchange plate 21 and the relief portion 36 of the second heat exchange plate 22 are positioned opposite each other, forming a cylindrical through-hole. The second fastener 72 can pass through the cylindrical through-hole and the first connecting hole 34 to connect to the liquid cooling unit 10.

[0066] Optionally, to enhance the heat transfer capacity of the first and second heat exchange plates 21, 22, a first heat pipe 27 is provided at the location where the first and second heat exchange plates 21, 22 contact the memory 61. The first heat pipe 27 connects the first and second heat exchange plates 21, 22 and contacts the heat-generating component. The structure of the first heat pipe 27 in the first heat exchange plate 21 is similar to that of the second heat exchange plate 22. Taking the second heat exchange plate 22 as an example, as shown in FIG5 , the first heat pipe 27 is embedded in the second heat exchange plate 22, with the left-right direction of the second heat exchange plate 22 being the longitudinal direction of the second heat exchange plate 22. The first heat pipe 27 is parallel to the longitudinal direction of the second heat exchange plate 22, with both ends of the first heat pipe 27 adjacent to the ends of the second heat exchange plate 22. Furthermore, as shown in FIG1 , both ends of the first heat pipe 27 are adjacent to the liquid cooling element 10.

[0067] In some embodiments of the present application, the heat conduction capability of the first heat pipe 27 promotes more and faster transfer of heat from the heat-generating components to the liquid cooling element 10 through the first heat exchange plate 21 and the second heat exchange plate 22, so that the server cooling assembly has better heat dissipation capability.

[0068] Optionally, as shown in Figure 4, the heat exchange cold plate 20 includes a third heat exchange plate 24, a fourth heat exchange plate 25 and a first fastener 71. The third heat exchange plate 24 and the fourth heat exchange plate 25 are hinged, and the heat-generating component is clamped between the third heat exchange plate 24 and the fourth heat exchange plate 25. The first fastener 71 is used to connect the third heat exchange plate 24 and the fourth heat exchange plate 25 to connect the third heat exchange plate 24, the heat-generating component and the fourth heat exchange plate 25.

[0069] In some embodiments of the present application, the heat exchange cold plate 20 of the server cooling assembly is connected to a single memory stick 61, and each memory stick 61 is detachable from the third heat exchange plate 24 and the fourth heat exchange plate 25. The third and fourth heat exchange plates 24, 25 are hingedly connected to form an integrated structure. The hinged connection method of the third and fourth heat exchange plates 24, 25 can be configured according to usage requirements. For example, the third and fourth heat exchange plates 24, 25 are connected by a hinge 35.

[0070] It is understood that some embodiments of the present application do not specifically limit the first fastener 71. For example, the first fastener 71 may be a screw, a bolt, etc. Referring to FIG. 4 , the first fastener 71 may also be used in conjunction with a nut 73. The first fastener 71 passes through the second connection hole 37 and is connected to the nut 73.

[0071] In some embodiments of the present application, as shown in FIG4 , the third heat exchange plate 24 and the fourth heat exchange plate 25 are connected by a hinge. Tightening the first fastener 71 to securely connect the third and fourth heat exchange plates 24, 25 minimizes the distance between the third and fourth heat exchange plates 24, 25, thereby tightly clamping the heat-generating component. When the heat-generating component has various thicknesses, the depth of the heat-generating component between the third and fourth heat exchange plates 24, 25 can be adjusted to position the heat-generating component between the third and fourth heat exchange plates 24, 25. For example, when the heat-generating component is thicker, the portion of the heat-generating component between the third and fourth heat exchange plates 24, 25 is relatively small; when the heat-generating component is thinner, the portion of the heat-generating component between the third and fourth heat exchange plates 24, 25 is relatively large. Therefore, in some embodiments of the present application, the heat exchange cold plate 20 is well adapted to memory devices 61 of varying thicknesses, offering the advantages of high versatility and wide applicability.

[0072] When the server cooling assembly of some embodiments of the present application is in use, the third and fourth heat exchange plates 24, 25 are connected to a single memory stick 61 to form a memory module. The memory module is then inserted into a memory slot on the server motherboard. If a server has multiple memory slots and multiple memory modules are required to be inserted into the slots, the multiple memory modules are arranged parallel to each other and spaced apart.

[0073] Optionally, as shown in FIG4 , after the third heat exchange plate 24 and the fourth heat exchange plate 25 are connected to the first fastener 71, they are connected to the liquid cooling element 10 via a fourth fastener 74. It is understood that some embodiments of the present application do not specifically limit the fourth fastener 74; for example, the fourth fastener 74 may be a screw, bolt, or the like.

[0074] Furthermore, as shown in Figure 4, the structure of the fourth heat exchange plate 25 is the same as that of the second heat exchange plate 22. The fourth heat exchange plate 25 is also provided with a connection portion 33 and a relief portion 36. The connection portion 33 protrudes from the surface of the fourth heat exchange plate 25, and the connection portion 33 is provided with a first connection hole 34. The relief portion 36 is an arc-shaped structure and encloses a semi-cylindrical structure. The structure of the third heat exchange plate 24 is the same as that of the first heat exchange plate 21. The third heat exchange plate 24 is also provided with a relief portion 36. The relief portion 36 of the third heat exchange plate 24 has the same shape as the relief portion 36 of the fourth heat exchange plate 25. When the fourth fastener 74 connects the third heat exchange plate 24 and the fourth heat exchange plate 25, the end of the third heat exchange plate 24 is located on the connection portion 33. The relief portion 36 of the third heat exchange plate 24 is arranged opposite to the relief portion 36 of the fourth heat exchange plate 25, and a cylindrical through hole is enclosed therebetween. The fourth fastener 74 can pass through the through hole of the cylindrical structure and the first connecting hole 34 to be connected to the liquid-cooling element 10 .

[0075] Optionally, in order to enhance the heat transfer capacity of the third heat exchange plate 24 and the fourth heat exchange plate 25, a first heat pipe 27 is also provided at the position where the third heat exchange plate 24 and the fourth heat exchange plate 25 contact the memory 61. The first heat pipe 27 is connected to the third heat exchange plate 24 and the fourth heat exchange plate 25, and the first heat pipe 27 contacts the heat-generating component. The configuration of the first heat pipe 27 on the third heat exchange plate 24 and the fourth heat exchange plate 25 is the same as the configuration of the first heat pipe 27 on the second heat exchange plate 22, and some embodiments of the present application will not be repeated. In some embodiments of the present application, the heat transfer capacity of the first heat pipe 27 promotes more and faster transfer of heat from the heat-generating component through the third heat exchange plate 24 and the fourth heat exchange plate 25 to the liquid cooling component 10, so that the server cooling assembly has better heat dissipation capacity.

[0076] Optionally, the heat generating component is a memory 61 of the server. The memory 61 of the server generates a large amount of heat when working, and the server cooling assembly can be used to dissipate heat from the memory 61.

[0077] Optionally, in the length direction of the memory 61 , at least one end of the heat exchange cold plate 20 is connected to the liquid cooling component 10 .

[0078] Referring further to Figure 1 , the liquid cooling element 10 is an elongated strip. Two liquid cooling elements 10 are arranged side by side, spaced apart, and connected in series via piping. A heat exchange plate 20 is positioned between the two liquid cooling elements 10, with both ends of the heat exchange plate 20 connected to the liquid cooling element 10. It is understood that one end of the heat exchange plate 20 can also be connected to a liquid cooling element 10 to meet the heat dissipation requirements of the heat-generating components within the server and meet spatial layout requirements.

[0079] Optionally, the server cooling assembly further includes a soft thermal pad, which is disposed between the heat exchange cold plate 20 and the heat generating component. The soft thermal pad has good thermal conductivity and is compressible.

[0080] In some embodiments of the present application, a soft thermal pad is provided between the first heat exchange plate 21 and the memory 61, and between the second heat exchange plate 22 and the memory 61. After the fixing clamp 23 clamps the first heat exchange plate 21 and the second heat exchange plate 22, the first heat exchange plate 21 and the second heat exchange plate 22 can be compressed against the soft thermal pad to achieve close contact with the memory 61, thereby avoiding a gap between the first heat exchange plate 21 and the second heat exchange plate 22 and the memory 61, which would otherwise cause a decrease in heat conduction efficiency. At the same time, when the heat-generating components have a variety of thicknesses, the fixing clamp 23 clamping the first heat exchange plate 21 and the second heat exchange plate 22 can also compress the soft thermal pad. By matching the thickness of the soft thermal pad and the memory 61, the heat exchange cold plate 20 can be adapted to memories 61 of different thicknesses. The heat exchange cold plate 20 has good adaptability to memories 61 of different thicknesses, and has the advantages of strong versatility and a wide range of applications.

[0081] In other embodiments of the present application, a soft thermal pad is provided between the third heat exchange plate 24 and the memory 61, and between the fourth heat exchange plate 25 and the memory 61. After the first fastener 71 connects the third heat exchange plate 24 and the fourth heat exchange plate 25, the third heat exchange plate 24 and the fourth heat exchange plate 25 can compress the soft thermal pad to achieve close contact with the memory 61, thereby avoiding the decrease in thermal conductivity caused by the gap between the third heat exchange plate 24 and the fourth heat exchange plate 25 and the memory 61. At the same time, when the heat-generating components have various thicknesses, the heat exchange cold plate 20 can be adapted to memories 61 of different thicknesses by using soft thermal pads of different thicknesses, adjusting the distance between the third heat exchange plate 24 and the fourth heat exchange plate 25, and compressing the soft thermal pad when connected to the memory 61. The heat exchange cold plate 20 has good adaptability to memories 61 of different thicknesses, and has the advantages of strong versatility and a wide range of applications.

[0082] In some embodiments of the present application, the server cooling assembly uses a heat exchange plate 20 for heat exchange of a single memory 61. During use, the heat generated by the memory 61 is transferred to both ends of the heat exchange plate 20 through the heat exchange plate 20 covering it. The heat is then transferred to the liquid cooling element 10 by utilizing the contact between the heat exchange plate 20 and the liquid cooling element 10. Coolant flows through the liquid cooling element 10, absorbing the heat and transferring it to the outside of the server to dissipate heat from the memory 61. The server cooling assembly dissipates heat from the memory 61, with the heat exchange plate 20 transferring the heat from the memory 61 to the liquid cooling element 10. No coolant is required to flow through the heat exchange plate 20, significantly reducing the risk of coolant leakage from the memory 61.

[0083] Optionally, as shown in Figure 7, one end of the heat exchange cold plate 20 is provided with a plurality of slots 26, which are suitable for one-to-one insertion of heat generating components.

[0084] In some embodiments of the present application, a plurality of slots 26 are provided at one end of the heat exchange plate 20. The slots 26 are adapted to receive heat-generating components one by one, allowing the heat exchange plate 20 to be connected to multiple heat-generating components simultaneously. As shown in FIG7 , the slots 26 of the heat exchange plate 20 are tooth-shaped.

[0085] When the heat-generating component is memory 61, the positions of the CPU 62 and memory 61 on the server motherboard are relatively regular. Typically, multiple memory sticks 61 are arranged on both sides of a CPU 62. For example, two or four memory sticks 61 are arranged on both sides of the CPU 62, and the CPU 62 and memory 61 together form a module. When the server cooling assembly of some embodiments of the present application is in use, the multiple memory sticks 61 are first inserted into the memory slots, and then the heat exchange cold plate 20 is moved toward the multiple memory sticks 61, and the card slots 26 are aligned with the memory sticks 61 one by one, and then the memory sticks 61 are inserted into the card slots 26. The heat exchange cold plate 20 is suitable for connecting to the multiple memory sticks 61 on one side of the CPU 62, and at the same time conducts heat to the multiple memory sticks 61 on the side of the CPU 62.

[0086] Optionally, when the server cooling assembly further includes a soft thermal pad, the soft thermal pad is provided on both sides of the memory 61. After the memory 61 is connected to the soft thermal pad, it is inserted into the memory slot of the server motherboard, and then the heat exchange cold plate 20 is inserted and connected toward the memory 61. After the memory 61 is inserted into the card slot 26, the soft thermal pad is located between the memory 61 and the slot wall of the card slot 26. By adjusting the thickness of the soft thermal pad, the sum of the thickness of the memory 61 and the thickness of the soft thermal pad matches the size of the card slot 26, so that the card slot 26 can adapt to memory 61 of different thicknesses. The heat exchange cold plate 20 has good adaptability to memory 61 of different thicknesses, and the heat exchange cold plate 20 has the advantages of strong versatility and a wide range of applications. Moreover, the soft thermal pad can be compressed, and the slot wall of the card slot 26 can also be in close contact with the memory 61 and the soft thermal pad, thereby improving the heat conduction effect between the memory 61, the soft thermal pad, and the heat exchange cold plate 20.

[0087] Optionally, as shown in FIG7 , the server cooling assembly further includes a second heat pipe 28 , one end of which is connected to the heat exchange plate 20 , and the other end of which is connected to the liquid cooling element 10 . The second heat pipe 28 can improve the heat conduction between the heat exchange plate 20 and the liquid cooling element 10 , thereby enhancing the heat dissipation capacity of the server cooling assembly.

[0088] In some embodiments of the present application, the shape of the second heat pipe 28 is not specifically limited. For example, as shown in Figure 7 , the second heat pipe 28 is an annular structure, with one end connected to the heat exchange cold plate 20 and the other end connected to the liquid cooling element 10. It is understood that in some embodiments of the present application, the number of second heat pipes 28 provided is not specifically limited; it can be provided as long as the heat transfer requirements are met.

[0089] Furthermore, the second heat pipe 28 can be directly connected to the liquid cooling element 10. As shown in Figure 7, the second heat pipe 28 can also be connected to the liquid cooling element 10 through a heat conducting block 41. The connection method between the second heat pipe 28 and the liquid cooling element 10 can be set according to the use requirements.

[0090] In some embodiments of the present application, as shown in FIG7 , the server cooling assembly includes a heat exchange plate 20, a second heat pipe 28, and a liquid cooling element 10. When the server cooling assembly is in use, the heat of the memory 61 is transferred to the slot wall of the card slot 26 through the soft thermal pad. After the slot wall of the card slot 26 absorbs the heat, the heat exchange plate 20 transfers the heat to the second heat pipe 28. The heat is then transferred to the liquid cooling element 10 through the second heat pipe 28. Coolant flows in the liquid cooling element 10, and the coolant absorbs the heat and transfers the heat to the outside of the server. The server cooling assembly dissipates heat from the memory 61, and the heat exchange plate 20 transfers the heat of the memory 61 to the liquid cooling element 10. No coolant needs to flow through the heat exchange plate 20, which can greatly reduce the risk of coolant leakage at the memory 61.

[0091] 8 and 10 , the heat exchange cold plate 20 includes an outer shell 29 , which encloses an evaporation-condensation chamber 30 , the slot wall of the slot 26 being the evaporation end, and the end where the heat exchange cold plate 20 is connected to the liquid cooling element 10 being the condensation end.

[0092] Furthermore, as shown in Figure 10, the heat exchange plate 20 is a tooth-shaped structure with an evaporation and condensation chamber 30 inside. The evaporation and condensation chamber 30 is filled with coolant. By evacuating the evaporation and condensation chamber 30, the boiling point of the coolant in the evaporation and condensation chamber 30 is set to a set value (the set value is set according to actual usage requirements, for example, the set value is 60°C). The slot wall of the slot 26 is the evaporation end, which is connected to the memory 61. The other end of the heat exchange plate 20 is connected to the liquid cooling element 10, and the other end of the heat exchange plate 20 is the condensation end. When the memory 61 is in operation, the heat generated by the memory 61 is transferred to the slot wall of the slot 26. The coolant inside the tooth-shaped structure absorbs heat and forms vapor. The vapor rises and is transferred to the condensation end. The condensation end then exchanges heat with the liquid cooling element 10. The vapor cools and releases heat to form coolant, which flows back into the tooth-shaped structure. In this way, the coolant forms a circulation, continuously transferring heat from the memory 61 to the liquid cooling element 10. Cooling liquid flows in the liquid cooling element 10 , and the cooling liquid absorbs heat and conducts the heat to the outside of the server to dissipate heat for the memory 61 .

[0093] It is understandable that the coolant formed at the condensation end can flow evenly into the interior of the tooth structure through guide structures such as guide grooves, so that the coolant inside the tooth structure absorbs heat again to form steam.

[0094] In some embodiments of the present application, as shown in FIG10 , the server cooling assembly includes a heat exchange cold plate 20 and a liquid cooling unit 10. The coolant in the heat exchange cold plate 20 is only contained within the heat exchange cold plate 20. The coolant in the heat exchange cold plate 20 and the coolant in the liquid cooling unit 10 are not connected or in contact with each other. The coolant in the heat exchange cold plate 20 and the coolant in the liquid cooling unit 10 are relatively independent. This significantly reduces the risk of coolant leakage at the memory 61 compared to welding and assembly required to connect the coolant in the heat exchange cold plate 20 and the coolant in the liquid cooling unit 10.

[0095] Optionally, as shown in Figure 9, a second heat pipe 28 is provided on the heat exchange cold plate 20. The heat conduction capacity of the second heat pipe 28 promotes more and faster heat transfer from the heat exchange cold plate 20 to the liquid cooling component 10, so that the server cooling assembly has better heat dissipation capacity.

[0096] Optionally, in some specific embodiments, as shown in Figure 6, the heat-generating component includes a CPU 62 and a memory 61. At least one memory 61 is provided on one side of the CPU 62, and at least one memory 61 is also provided on the other side of the CPU 62. The memories 61 are arranged in parallel and at intervals, and there is a gap between the memory 61 and the CPU 62.

[0097] Optionally, as shown in FIG7 , the liquid cooling element 10 has a plate-like structure, with the lower surface of the liquid cooling element 10 attached to the CPU 62. A heat exchange plate 20 is provided on one side of the liquid cooling element 10, and another heat exchange plate 20 is provided on the opposite side of the liquid cooling element 10. The two heat exchange plates 20 are symmetrically arranged. The liquid cooling element 10 is connected to a first pipeline 38 and a second pipeline 39. One of the first pipeline 38 and the second pipeline 39 serves as an inlet for the coolant, while the other serves as an outlet for the coolant. Coolant flows into the liquid cooling element 10 through the inlet. After absorbing heat within the liquid cooling element 10, the coolant's temperature rises, and the heated coolant flows out through the outlet.

[0098] Optionally, as shown in Figure 7 , the heat exchange plate 20 has a rectangular block structure. The lower end of the heat exchange plate 20 is provided with multiple slots 26. The size of the slots 26 matches the size of the memory 61. The lower surface of the heat exchange plate 20 is provided with slot openings for the slots 26. The heat exchange plate 20 is adapted to move toward the memory 61 so that the slots 26 are inserted into the memory 61 in a one-to-one correspondence. The upper surface of the heat exchange plate 20 is connected to the upper surface of the liquid cooling element 10 via a second heat pipe 28. When the server cooling assembly is in use, the heat exchange plate 20 can simultaneously insert multiple memory sticks 61, which can improve the convenience of connecting the heat exchange plate 20 with multiple memory sticks 61 and save installation time. The heat of the memory 61 is transferred to the slot wall of the card slot 26 through the soft thermal pad. After the slot wall of the card slot 26 absorbs the heat, the heat exchange cold plate 20 transfers the heat to the second heat pipe 28. The heat is then transferred to the liquid cooling element 10 through the second heat pipe 28. There is coolant flowing in the liquid cooling element 10. The coolant absorbs the heat of the second heat pipe 28 and the heat of the CPU 62 at the same time. When the coolant flows out of the liquid cooling element 10, it takes the heat out of the server.

[0099] Optionally, as shown in FIG8 , the heat exchange plate 20 has a rectangular block structure. The lower end of the heat exchange plate 20 is provided with a plurality of slots 26. The size of the slots 26 matches the size of the memory 61, and the lower surface of the heat exchange plate 20 is provided with slot openings for the slots 26. The heat exchange plate 20 is adapted to move toward the memory 61 so that the slots 26 are inserted into the memory 61 in a one-to-one correspondence. The other end of the heat exchange plate 20 is provided with an extension 31 extending toward the liquid cooling element 10. The lower surface of the extension 31 is connected to the upper surface of the liquid cooling element 10. When the server cooling assembly is in use, the heat exchange plate 20 can simultaneously insert multiple memory sticks 61, which can improve the convenience of connecting the heat exchange plate 20 with multiple memory sticks 61 and save installation time. The heat of the memory 61 is transferred to the slot wall of the card slot 26 through the soft thermal pad. After the slot wall of the card slot 26 absorbs the heat, the heat exchange cold plate 20 conducts the heat to the liquid cooling component 10. Coolant flows in the liquid cooling component 10, and the coolant absorbs the heat of the heat exchange cold plate 20 and the heat of the CPU 62 at the same time. When the coolant flows out of the liquid cooling component 10, it takes the heat out to the outside of the server.

[0100] As further shown in FIG. 8 , the extension portion 31 and the liquid cooling element 10 may be connected using a fifth fastener 75 , such as a screw or a threaded rod.

[0101] Optionally, as shown in Figures 11 and 12, the server further includes a plug-in frame 63, in which a heat-generating component is provided; the heat exchange cold plate 20 is connected to both the plug-in frame 63 and the heat-generating component, and the heat exchange cold plate 20 is provided with a plug-in end 32 extending out of the plug-in frame 63; the plug-in frame 63 is inserted into the server, and the plug-in end 32 contacts the liquid cooling part 10; the plug-in frame 63 is pulled out of the server, and the plug-in end 32 and the liquid cooling part 10 are separated.

[0102] Furthermore, the heat exchange plate 20 can be inserted into the server along with the plug-in frame 63, and can also be removed from the server along with the plug-in frame 63. After the heat exchange plate 20 is inserted into the server along with the plug-in frame 63, when the heat-generating components generate heat, the heat exchange plate 20 continuously transfers the heat of the heat-generating components to the liquid cooling element 10 through the plug-in end 32 by heat conduction. The coolant continuously flows through the cooling channel of the liquid cooling element 10, and the coolant exchanges heat with the plug-in end 32 in the cooling channel through the channel wall of the liquid cooling element 10, thereby removing the heat generated by the operation of the heat-generating components of the server to achieve the purpose of heat dissipation.

[0103] In the server cooling assembly of some embodiments of the present application, the heat exchange cold plate 20 transfers the heat of the heat-generating components to the liquid cooling element 10 by heat conduction. No cooling flow channel for the flow of coolant is provided in the heat exchange cold plate 20, and only the cooling flow channel for the flow of coolant is provided in the liquid cooling element 10, which can reduce the risk of leakage of coolant in the server cooling assembly.

[0104] Optionally, the heat generating component is a hard disk 64 , which is disposed in the plug-in frame 63 and in contact with the heat exchange cold plate 20 .

[0105] In this case, the hard drive 64 can be hot-swappable. The heat exchange plate 20 is inserted into the server along with the hard drive 64 and contacts the liquid cooling element 10, dissipating heat from the hard drive 64. The heat exchange plate 20 can also be removed from the server along with the hard drive 64, separating the heat exchange plate 20 from the liquid cooling element 10.

[0106] Optionally, to improve the thermal conductivity of the heat exchange plate 20, a third heat pipe 40 is provided at the location where the heat exchange plate 20 contacts the hard drive 64, as shown in Figures 12 and 14. The third heat pipe 40 is connected to the heat exchange plate 20. Specifically, the third heat pipe 40 is embedded within the heat exchange plate 20. The third heat pipe 40 contacts the hard drive, and one end of the third heat pipe 40 is connected to the plug end 32. The third heat pipe 40 has strong thermal conductivity and can transfer more and faster heat generated by the hard drive during operation to the plug end 32. The heat is then transferred to the liquid cooling element 10 through the plug end 32, thus improving the heat dissipation capability of the server cooling assembly.

[0107] It is understandable that some embodiments of the present application do not specifically limit the shape of the third heat pipe 40 , and the third heat pipe 40 may be curved, U-shaped, or straight.

[0108] Optionally, the plug end 32 is a block-shaped structure, and matching concave and convex structures are provided on the plug end 32 and the liquid cooling element 10 to ensure that the plug end 32 can accurately and securely contact the liquid cooling element 10. For example, as shown in FIG15 , the liquid cooling element 10 is provided with a plug protrusion 11, and the plug end 32 is provided with a plug groove. When the plug end 32 contacts the liquid cooling element 10, the plug protrusion 11 is adapted to be inserted into the plug groove, thereby achieving accurate connection and heat conduction between the heat exchange cold plate 20 and the liquid cooling element 10.

[0109] Optionally, as shown in FIG. 13 , the liquid cooling component 10 is a plate-shaped structural component. A pipe connector 12 is provided on the liquid cooling component 10 . The pipe connector 12 is suitable for connecting to a pipe for conveying the cooling liquid.

[0110] 16 , the server cooling assembly further includes a first liquid infusion pipe 45 , a second liquid infusion pipe 46 , a third liquid infusion pipe 47 , a fourth liquid infusion pipe 48 , a first diverter column 51 , a second diverter column 52 , a third diverter column 53 , and a fourth diverter column 54 . The liquid cooling unit 10 is provided with two pipe connectors 12 .

[0111] One end of the first infusion tube 45 is connected to a pipe connector 12, and the other end of the first infusion tube 45 is connected to a first diverter column 51. One end of the second infusion tube 46 is connected to another pipe connector 12, and the other end of the second infusion tube 46 is connected to a second diverter column 52. One end of the third infusion tube 47 is connected to the first diverter column 51, and the other end of the third infusion tube 47 is connected to a third diverter column 53. One end of the fourth infusion tube 48 is connected to the second diverter column 52, and the other end of the fourth infusion tube 48 is connected to a fourth diverter column 54.

[0112] One of the first and second liquid infusion tubes 45, 46 serves as the coolant inlet, while the other serves as the coolant outlet. For example, the first infusion tube 45 serves as the coolant inlet, and the second infusion tube 46 serves as the coolant outlet. When a large amount of coolant is required within the liquid cooling unit 10, the first diverter column 51 is used to feed coolant into the first infusion tube 45, and the third diverter column 53 feeds coolant into the first diverter column 51 via the third infusion tube 47. Simultaneously, the second diverter column 52 and the fourth diverter column 54 are both used to discharge coolant. When a smaller amount of coolant is required within the liquid cooling unit 10, the first diverter column 51 feeds coolant directly into the first infusion tube 45, or the first diverter column 51 receives coolant from the third diverter column 53 and feeds it into the first infusion tube 45. Simultaneously, the second diverter column 52 or the fourth diverter column 54 is used to discharge coolant.

[0113] That is, the server cooling assembly includes a first liquid infusion tube 45, a second liquid infusion tube 46, a third liquid infusion tube 47, a fourth liquid infusion tube 48, a first diverter column 51, a second diverter column 52, a third diverter column 53 and a fourth diverter column 54, which can adjust the flow rate of the coolant in the liquid cooling component 10 according to the demand of the coolant in the liquid cooling component 10, so that the liquid cooling component 10 meets the cooling demand.

[0114] In the server cooling assembly of some embodiments of the present application, the heat exchange cold plate 20 transfers the heat of the memory 61 to the liquid cooling part 10 by heat conduction. The heat exchange cold plate 20 does not have a cooling channel for the flow of coolant, and only the liquid cooling part 10 has a cooling channel for the flow of coolant, which can reduce the risk of coolant leakage. The heat exchange cold plate 20 is suitable for connecting to memory 61 of different thicknesses, making the server cooling assembly well adaptable to memory 61 of different thicknesses; and when the heat exchange cold plate 20 is connected to the plug-in frame 63, it can also be used to cool hot-swappable hard drives. Therefore, the server cooling assembly has the advantages of strong versatility and a wide range of applications.

[0115] Optionally, the heat exchange cold plate 20 is a structural component capable of heat conduction, and some embodiments of the present application do not specifically limit the material of the heat exchange cold plate 20. For example, the heat exchange cold plate 20 is a metal structural component capable of heat conduction. At this time, when the server cooling assembly is in use, it utilizes the metal heat conduction principle of the heat exchange cold plate 20. When the heat exchange cold plate 20 is connected to the heat pipe, the server cooling assembly also utilizes the metal heat conduction principle and the heat conduction principle of the heat pipe when in use. The server cooling assembly utilizes the heat conduction principle to transfer the heat of the heat-generating component to the liquid cooling part 10, and then the coolant in the liquid cooling part 10 flows to transport the heat to the outside of the server to achieve heat dissipation of the heat-generating component, which has the advantage of high heat dissipation efficiency.

[0116] Some embodiments of the present application further provide a server, which includes a heat-generating component and a server cooling assembly, wherein the heat-generating component is connected to the server cooling assembly, and the server cooling assembly is the server cooling assembly as described above.

[0117] Because the server cooling assembly reduces the risk of coolant leakage, it can prevent coolant leaks from affecting normal server operation or even causing damage. Furthermore, the server cooling assembly offers the advantage of efficient heat dissipation, preventing server downtime, burns, and other hazards caused by overheating of heat-generating components within the server. Therefore, the servers of some embodiments of the present application can improve user satisfaction.

[0118] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0119] Some embodiments in this specification are described in a related manner. Similar portions between some embodiments can be referred to in conjunction with each other. Some embodiments focus on differences from other embodiments. Some embodiments of apparatuses, electronic devices, non-volatile readable storage media, and computer program products containing instructions thereof are described briefly because they are generally similar to method embodiments. For related portions, refer to the description of the method embodiments.

[0120] The above description is only some preferred embodiments of the present application and is not intended to limit the scope of protection of the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application are included in the scope of protection of the present application.

Claims

1. A server cooling assembly, characterized in that: The server cooling assembly comprises a liquid cooling element (10) and a heat exchange cold plate (20), wherein the heat exchange cold plate (20) is connected to the liquid cooling element (10), and the heat exchange cold plate (20) is used to be arranged on the surface of a heat generating component of the server, and a cooling channel for the flow of a cooling liquid is provided in the liquid cooling element (10); the heat exchange cold plate (20) is used to transfer the heat of the heat generating component to the liquid cooling element (10) through heat conduction, and the liquid cooling element (10) is used to carry away the heat through the flow of the cooling liquid.

2. The server cooling assembly according to claim 1, characterized in that: The server further comprises a plug-in frame (63), in which the heat generating component is arranged; the heat exchanging cold plate (20) is connected to both the plug-in frame (63) and the heat generating component, and the heat exchanging cold plate (20) is provided with a plug-in end (32) extending out of the plug-in frame (63); the plug-in frame (63) is inserted into the server, and the plug-in end (32) contacts the liquid cooling component (10); the plug-in frame (63) is pulled out of the server, and the plug-in end (32) and the liquid cooling component (10) are separated; the heat generating component is a hot-swappable hard disk.

3. The server cooling assembly according to claim 1, characterized in that: The heat exchange cold plate (20) comprises a first heat exchange plate (21), a second heat exchange plate (22) and a connecting piece, wherein the first heat exchange plate (21) is arranged on one side of the heat-generating component, and the second heat exchange plate (22) is arranged on the other side opposite to the heat-generating component, and the connecting piece connects the first heat exchange plate (21) and the second heat exchange plate (22) to connect the first heat exchange plate (21), the heat-generating component and the second heat exchange plate (22).

4. The server cooling assembly according to claim 1, characterized in that: The heat exchange cold plate (20) comprises a third heat exchange plate (24), a fourth heat exchange plate (25) and a first fastener (71); the third heat exchange plate (24) and the fourth heat exchange plate (25) are hinged; the heat generating component is clamped between the third heat exchange plate (24) and the fourth heat exchange plate (25); the first fastener (71) is used to connect the third heat exchange plate (24) and the fourth heat exchange plate (25) so as to connect the third heat exchange plate (24), the heat generating component and the fourth heat exchange plate (25).

5. The server cooling assembly according to claim 3 or 4, characterized in that: The server cooling assembly further comprises a first heat conducting pipe (27), wherein the first heat conducting pipe (27) is connected to the heat exchange cold plate (20), and the first heat conducting pipe (27) is in contact with the heat generating component.

6. The server cooling assembly according to claim 3 or 4, characterized in that: The heat generating component is the memory (61) of the server.

7. The server cooling assembly according to claim 6, characterized in that: In the length direction of the memory (61), at least one end of the heat exchange cold plate (20) is connected to the liquid cooling component (10).

8. The server cooling assembly according to claim 1, characterized in that: One end of the heat exchange cold plate (20) is provided with a plurality of slots (26), and the slots (26) are suitable for the heat generating components to be inserted one by one.

9. The server cooling assembly according to claim 8, characterized in that: The server cooling assembly further comprises a second heat conducting pipe (28), one end of the second heat conducting pipe (28) being connected to the heat exchange cold plate (20), and the other end of the second heat conducting pipe (28) being connected to the liquid cooling component (10).

10. The server cooling assembly according to claim 8, characterized in that: The heat exchange cold plate (20) comprises an outer shell (29), the outer shell (29) encloses an evaporation condensation chamber (30), the groove wall of the slot (26) is the evaporation end, and the end of the heat exchange cold plate (20) connected to the liquid cooling component (10) is the condensation end.

11. The server cooling assembly according to claim 8, characterized in that: The heat generating component comprises a CPU (62) and a memory (61), at least one memory (61) is provided on one side of the CPU (62), and at least one memory (61) is also provided on the other side of the CPU (62), the memories (61) are arranged at intervals, and there is a gap between the memories (61) and the CPU (62); The liquid cooling element (10) is in a plate-like structure, and the lower surface of the liquid cooling element (10) is attached to the CPU (62); a heat exchange cold plate (20) is provided on one side of the liquid cooling element (10), and a heat exchange cold plate (20) is also provided on the other side of the liquid cooling element (10); The heat exchange cold plate (20) is in a rectangular block structure, and one end of the heat exchange cold plate (20) is provided with a plurality of the card slots (26), the size of the card slots (26) is adapted to the size of the memory (61), and the lower surface of the heat exchange cold plate (20) is provided with slot openings of the card slots (26); the heat exchange cold plate (20) is suitable for moving toward the memory (61) so that the card slots (26) are inserted into the memory (61) one by one; The upper surface of the heat exchange cold plate (20) is connected to the upper surface of the liquid cooling component (10) via a second heat conduction pipe (28); or, the other end of the heat exchange cold plate (20) is provided with an extension portion (31) extending toward the liquid cooling component (10), and the lower surface of the extension portion (31) is connected to the upper surface of the liquid cooling component (10).

12. The server cooling assembly according to claim 1, wherein: The server further comprises a plug-in frame (63), in which the heat generating component is arranged; the heat exchanging cold plate (20) is connected to both the plug-in frame (63) and the heat generating component, and the heat exchanging cold plate (20) is provided with a plug-in end (32) extending out of the plug-in frame (63); the plug-in frame (63) is inserted into the server, and the plug-in end (32) contacts the liquid cooling component (10); the plug-in frame (63) is pulled out of the server, and the plug-in end (32) and the liquid cooling component (10) are separated.

13. The server cooling assembly according to claim 12, wherein: The server cooling assembly further comprises a third heat conducting pipe (40), wherein the third heat conducting pipe (40) is connected to the heat exchange cold plate (20); the third heat conducting pipe (40) is in contact with the heat generating component, and one end of the third heat conducting pipe (40) is connected to the plug end (32).

14. The server cooling assembly according to claim 12, wherein: The heat generating component is a hard disk (64), the hard disk (64) is arranged in the plug-in frame (63), and the hard disk (64) is in contact with the heat exchange cold plate (20).

15. The server cooling assembly according to claim 1, wherein: The server cooling assembly further comprises a soft thermally conductive pad, which is arranged between the thermally conductive cold plate and the heat generating component.

16. The server cooling assembly according to claim 13, wherein: The third heat conducting pipe (40) is in a curved shape, or in a U shape, or in a straight shape.

17. The server cooling assembly according to claim 3, characterized in that: The connecting piece is a fixing clip (23).

18. The server cooling assembly according to claim 17, wherein: The first heat exchange plate (21), the heat generating component, and the second heat exchange plate (22) are stacked in sequence, and the first heat exchange plate (21) and the second heat exchange plate (22) are clamped by the fixing clamp to connect the first heat exchange plate (21), the heat generating component, and the second heat exchange plate (22).

19. The server cooling assembly according to claim 1, wherein: The liquid cooling element (10) is in the form of a long strip, two of the liquid cooling elements (10) are arranged in parallel and spaced apart, and the two liquid cooling elements (10) are connected in series via a pipeline; the heat exchange cold plate (20) is arranged between the two liquid cooling elements (10), and both ends of the heat exchange cold plate (20) are connected to the liquid cooling element (10).

20. A server, characterized in that: The server comprises a heat generating component and a server cooling assembly, wherein the heat generating component is connected to the server cooling assembly, and the server cooling assembly is the server cooling assembly according to any one of claims 1-20.

Images