Optical module cold plate type liquid cooling assembly and network switching equipment

Abstract

The invention provides an optical module cold plate type liquid cooling assembly and network switching equipment, and relates to the technical field of network equipment heat dissipation. The optical module cold plate type liquid cooling assembly comprises a cold plate main body which extends along a first direction and comprises a first side and a second side which are opposite to each other; the floating heat conduction blocks are connected to the first side of the cold plate body and can float in the second direction perpendicular to the first direction; the floating heat conduction blocks are arranged at intervals in the first direction and are used for making contact with the optical modules sequentially arranged in the first direction. The heat conduction pad is arranged between the cold plate main body and the floating heat conduction block and is in contact with the cold plate main body and the floating heat conduction block; and the at least one liquid cooling pipe is arranged on the second side of the cold plate main body. The optical module cold plate type liquid cooling assembly is in close contact with the optical module inserted into the connector of the network switching equipment, heat generated during operation of the optical module can be smoothly and timely led out, the heat dissipation efficiency is high, and the heat dissipation effect is good.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of network equipment, and in particular to an optical module cold plate liquid cooling assembly and a network switching device. Background Art

[0002] Optical modules are optoelectronic devices that perform photoelectric and electro-optical conversion and are crucial components in 4G / 5G communications equipment and data centers. As communication speeds and loads continue to increase, the power consumption and number of installed optical modules are also increasing, making heat dissipation of optical modules particularly important.

[0003] In related technologies, air cooling is commonly used to dissipate heat from optical modules. This is accomplished by installing the optical module in an optical module connector and creating a window at the top of the connector, allowing the optical module to partially contact the heat sink. Heat is then transferred from the optical module to the heat sink's fins, where air flowing over the fins dissipates the heat into the surrounding environment.

[0004] However, when the optical module is cooled by air cooling, the heat dissipation efficiency is low and the heat dissipation effect is poor. Summary of the Invention

[0005] The present application provides an optical module cold plate liquid cooling assembly and a network switching device. The optical module cold plate liquid cooling assembly is in close contact with the optical module in the connector inserted into the network switching device, and can smoothly and timely discharge the heat generated by the optical module during operation, with high heat dissipation efficiency and good heat dissipation effect.

[0006] One aspect of the present application provides an optical module cold plate liquid cooling assembly, comprising:

[0007] a cold plate body extending along a first direction and comprising a first side and a second side opposite to each other;

[0008] A plurality of floating heat-conducting blocks are connected to a first side of the cold plate body and are capable of floating along a second direction perpendicular to the first direction; each floating heat-conducting block is arranged at intervals along the first direction and is used to contact each optical module arranged sequentially along the first direction;

[0009] A thermal pad is provided between the cold plate body and the floating thermal block and is in contact with the cold plate body and the floating thermal block;

[0010] At least one liquid cooling tube is disposed on the second side of the cold plate body.

[0011] The optical module cold plate liquid cooling assembly provided by the present application includes a cold plate body, a plurality of floating heat-conducting blocks, a thermal pad, and at least one liquid cooling tube. The cold plate body extends along a first direction, the floating heat-conducting blocks are arranged on a first side of the cold plate body and spaced apart along the first direction, the thermal pad is attached between the floating heat-conducting blocks and the cold plate body, and the liquid cooling tube is arranged on a second side of the cold plate body. Through the contact between the floating heat-conducting blocks and the optical modules, the heat generated by the optical modules is transferred to the cold plate body via the floating heat-conducting blocks and the thermal pad, and the heat is carried away by the coolant in the liquid cooling tube to dissipate heat from the optical modules. The floating heat-conducting blocks can float along a second direction perpendicular to the first direction, and the thermal pad can deform with the movement of the floating heat-conducting blocks, always closely attached to the floating heat-conducting blocks and the cold plate body. In this way, on the basis of using liquid cooling to dissipate heat from the optical modules, it can be ensured that the floating heat-conducting blocks are always in close contact with the optical modules, reducing the contact thermal resistance between the optical module cold plate liquid cooling assembly and the optical modules, thereby improving the heat dissipation efficiency and effect.

[0012] In one possible implementation, the optical module cold plate liquid cooling assembly further includes:

[0013] The elastic member is connected between each floating heat-conducting block and the cold plate body and can be stretched and retracted along the second direction.

[0014] An elastic member is provided between the floating thermal block and the cold plate body, which drives the floating thermal block to float in the second direction. The elastic member has a strong elastic force and elastic deformation capability, reliably driving the floating thermal block and increasing the pressure between the floating thermal block and the optical module, ensuring close contact between the floating thermal block and the optical module.

[0015] In a possible implementation, two elastic members are connected between the floating heat-conducting block and the cold plate body. The two elastic members are respectively located at two ends of the floating heat-conducting block, and the thermal pad is located between the two elastic members.

[0016] By connecting two elastic members at both ends of the floating thermal block, the elastic members exert a strong and balanced force on the floating block, ensuring good contact between the floating block and the cold plate. Furthermore, by placing the thermal pad between the two elastic members, the pad occupies sufficient space and fits snugly within the main area of ​​the floating block, improving its thermal conductivity and effectiveness.

[0017] In one possible implementation, the cold plate body includes:

[0018] The main support plate extends along a first direction; the floating heat conductive block is located on a first side of the support plate, and the liquid cooling pipe is located on a second side of the main support plate;

[0019] The stop assembly is connected to the outside of the main support plate and forms a floating groove together with the main support plate; the floating groove is located on both sides of the main support plate, and the notches of the floating grooves on both sides are opposite, and the two ends of the floating heat conductive block are inserted into the floating grooves on both sides.

[0020] The stopper assembly and the main support plate together form the cold plate body. The floating groove formed between the two forms the mounting base for the floating heat transfer block, securing the floating heat transfer block to the cold plate body while limiting its travel. This also facilitates the design and processing of the main support plate and the assembly of the liquid cold plate, reducing the costs of the processing and assembly of the liquid cold plate.

[0021] In a possible implementation, the stop assembly includes stoppers connected to opposite sides of the main support plate, and the second side of the main support plate is exposed to the outside.

[0022] By installing stoppers on opposite sides of the main support plate, the two side stoppers and the main support plate together form floating grooves to secure and limit the floating heat transfer block. Furthermore, the second side of the main support plate is exposed, facilitating the installation of liquid cooling pipes. This shortens the heat transfer path of the entire liquid cooling assembly and improves thermal efficiency.

[0023] In a possible implementation, the stopper includes a main body portion and a stopper portion that are connected to each other, the main body portion is connected to the main support plate, and the stopper portion is disposed at an end portion of the floating heat conductive block.

[0024] In a possible implementation, a plurality of stoppers are spaced apart along the first direction, and each stopper stops at least one floating heat conducting block.

[0025] In a possible implementation, there is only one liquid cooling pipe, and the liquid cooling pipe passes through both ends of the cold plate body along the first direction.

[0026] In a possible implementation, the liquid cooling pipe extends from one end of the cold plate body along a wavy line to the other end of the liquid cooling plate.

[0027] Another aspect of the present application provides a network switching device, comprising:

[0028] At least one board;

[0029] At least one connector group, each connector group including a plurality of connectors arranged in sequence along a first direction, each connector being electrically connected to the board; wherein each connector in at least one connector group has a contact window, and the contact window is located on a mounting side of the connector group;

[0030] At least one optical module cold plate liquid cooling assembly as described above is arranged on the installation side of the connector group, and each floating heat conductive block of the optical module cold plate liquid cooling assembly is used to pass through the contact window and contact the optical module inserted in the connector.

[0031] The network switching device provided by the present application includes at least one board, at least one connector group and at least one optical module cold plate liquid cooling assembly. The connectors in the connector group are arranged in sequence along a first direction and are all electrically connected to the board. The connectors of at least one connector group have a contact window on the installation side. The optical module cold plate liquid cooling assembly is arranged on the installation side of the connector group. The optical module cold plate liquid cooling assembly includes a cold plate body, a plurality of floating heat-conducting blocks, a thermal pad and at least one liquid cooling tube. The cold plate body extends along the first direction. The floating heat-conducting blocks are arranged on the first side of the cold plate body and are spaced apart along the first direction. The thermal pad is attached between the floating heat-conducting blocks and the cold plate body. The liquid cooling tube is arranged on the second side of the cold plate body. The floating heat-conducting blocks contact the optical modules through the contact windows of the connectors. The heat generated by the optical modules is conducted to the cold plate body via the floating heat-conducting blocks and the thermal pads, and the heat is taken away by the coolant in the liquid cooling tube to dissipate heat from the optical modules. The floating thermal block floats in a second direction perpendicular to the first direction, and the thermal pad deforms as the floating block moves, maintaining a tight fit with the floating block and the cold plate. This ensures that the floating block maintains close contact with the optical module while dissipating heat through liquid cooling. This reduces the contact thermal resistance between the optical module cold plate and the optical module, improving both heat dissipation efficiency and effectiveness.

[0032] In a possible implementation, at least two connector groups are spaced apart along a second direction perpendicular to the first direction, each connector in each connector group has a contact window, and each connector group is correspondingly provided with an optical module cold plate liquid cooling assembly.

[0033] When at least two connector groups are spaced apart along the second direction, each connector group is equipped with an optical module cold plate liquid cooling assembly, and each connector in each connector group is provided with a contact window. The liquid cooling assembly passes through the contact windows of each connector in the corresponding connector group and contacts the optical modules inserted in each connector. This allows heat to be promptly and quickly removed from all optical modules, achieving a good heat dissipation effect for each optical module.

[0034] In one possible embodiment, there is one board, and the connector group includes two inner connector groups and two outer connector groups. The two inner connector groups are respectively connected to two side surfaces of the board, and the two outer connector groups are respectively located on a side of the two inner connector groups facing away from the board, and both outer connector groups are electrically connected to the board.

[0035] There are four optical module cold plate liquid cooling assemblies, and each optical module cold plate liquid cooling assembly is respectively arranged on the installation side of each connector group.

[0036] By electrically connecting four connector groups on a single board, the optoelectronic connection module provides a larger number of connectors, allowing for a greater number of pluggable optical modules, thereby increasing the module's capacity and transmission power. Furthermore, since only a single board is required, the module's control is simpler and signal transmission efficiency is higher.

[0037] In one possible implementation, the installation side of each connector group is the side of the connector group facing away from the board, and the optical module cold plate liquid cooling assembly includes two inner liquid cooling assemblies and two outer liquid cooling assemblies;

[0038] The two inner liquid cooling components are respectively located between the inner connector group and the outer connector group on each side, and the inner liquid cooling plate is used to contact the optical module inserted in the inner connector group; the two outer liquid cooling components are respectively located on the side of the outer connector group on each side away from the board, and the outer liquid cooling components are used to contact the optical module inserted in the outer connector group.

[0039] By using the side of each connector group facing away from the board as the installation side of the connector group, the contact window of each connector is located on the side of the connector group facing away from the board, and each liquid cooling component is arranged on the side of the corresponding connector group facing away from the board. The board will not interfere with the contact window of the connector and the installation space of the liquid cooling component, thereby ensuring stable contact between the liquid cooling component and the optical module inserted in the connector.

[0040] Furthermore, two inner liquid-cooling assemblies are sandwiched between the inner and outer connector groups on each side, while two outer liquid-cooling assemblies are located on opposite sides of the outer connector groups. Each liquid-cooling assembly generates pressure toward the board, ensuring reliable contact between the liquid-cooling assembly and the optical module inserted into the connector group. The pressure generated by the liquid-cooling assemblies on both sides is balanced, ensuring balanced force across the entire optoelectronic connection module.

[0041] In a possible implementation, each connector of the outer connector group has a bracket, the bracket extends toward and is connected to the board, and the outer liquid cooling assembly covers at least a portion of the bracket.

[0042] The connectors in the outer connector assembly are connected to the board via brackets, which increase the surface area of ​​each connector in the outer connector assembly. By allowing the outer liquid cooling assembly to cover at least a portion of the brackets, the outer liquid cooling assembly has a larger heat conduction area, resulting in higher heat dissipation efficiency and effectiveness. Furthermore, the outer liquid cooling assembly has a larger contact area with the outer connector assembly, exerting greater pressure on the outer connector assembly, thereby improving the overall stability and reliability of the optoelectronic connection module.

[0043] In addition to the technical problems solved by the embodiments of the present application, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the network switching device provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0045] Figure 1 A schematic diagram of the structure of a network switching device provided in an embodiment of the present application;

[0046] Figure 2 for Figure 1 The decomposition diagram of the network switching equipment in;

[0047] Figure 3 for Figure 1 Partial structural diagram of the network switching equipment in;

[0048] Figure 4 A schematic diagram of the structure of the optoelectronic connection module provided in an embodiment of the present application;

[0049] Figure 5 A schematic diagram of the structure of the optoelectronic connection module provided in an embodiment of the present application after removing the mounting frame;

[0050] Figure 6 for Figure 5 A breakdown diagram of the optoelectronic connection module from one perspective;

[0051] Figure 7 for Figure 5 Another perspective of the decomposition structure diagram of the optoelectronic connection module;

[0052] Figure 8 A schematic structural diagram of an outer liquid cooling assembly provided in an embodiment of the present application from one perspective;

[0053] Figure 9 for Figure 8 A schematic diagram of the structure of the outer liquid cooling component from another perspective;

[0054] Figure 10 for Figure 8 A partial cross-sectional structural diagram of the outer liquid cooling component;

[0055] Figure 11 A schematic structural diagram of an inner liquid cooling assembly according to an embodiment of the present application from one perspective;

[0056] Figure 12 for Figure 11 A schematic structural diagram of the inner liquid cooling component from another perspective;

[0057] Figure 13 for Figure 11 A partial cross-sectional structural diagram of the inner liquid cooling component.

[0058] Description of reference numerals:

[0059] 10-Network switching equipment;

[0060] 100-chassis;

[0061] 110-installation port;

[0062] 200- photoelectric connection module;

[0063] 210 - board; 220 - connector assembly; 220a - inner connector assembly; 220b - outer connector assembly; 230 - liquid cooling assembly; 230a - inner liquid cooling assembly; 230b - outer liquid cooling assembly; 240 - mounting bracket;

[0064] 221 - Connector; 231 - Liquid cooling pipe; 232 - Cold plate body; 233 - Floating heat conducting block; 234 - Thermal pad; 235 - Elastic member; 241 - Main frame; 242 - Front frame;

[0065] 2211 - contact window; 2212 - bracket; 2321 - main support plate; 2322 - stop assembly; 2322a - stop member; 2323 - floating groove; 2421 - grip;

[0066] 23221-main body; 23222-stopper;

[0067] 300-control module;

[0068] 310-control board; 320-baseboard management controller; 330-bus;

[0069] 400-heat dissipation module;

[0070] 410-Fan. DETAILED DESCRIPTION

[0071] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0072] An optical module, consisting of optoelectronic components, functional circuits, and optical interfaces, performs photoelectric and electro-optical conversion. It consists of two parts: a transmitter and a receiver. The transmitter converts electrical signals into optical signals, which are then transmitted through optical fibers. The receiver then converts the optical signals back into electrical signals.

[0073] As described in the relevant technology, air cooling is currently commonly used to dissipate heat from optical modules. A window is opened on the top of the optical module connector set on the switch, so that the optical module inserted into the optical module connector is partially in contact with the heat sink, so that the heat of the optical module is transferred to the cooling fins of the heat sink, and the air flowing through the surface of the cooling fins dissipates the heat to the external environment.

[0074] However, as the power consumption and number of optical modules continue to increase, air-cooling, with its overall thermal resistance approaching its limits, is no longer able to meet the heat dissipation needs of optical modules. Furthermore, due to the fixed fit between the optical module and the heat sink, and the small contact area between the two, the thermal resistance between the optical module and the heat sink is high, resulting in temperature rise. Furthermore, when there are many optical modules and the installation space is relatively tight, especially when optical modules are arranged in multiple rows, the heat sink installation space is limited, resulting in low heat dissipation efficiency and poor heat dissipation.

[0075] In view of this, embodiments of the present application provide an optical module cold plate liquid cooling assembly and network switching equipment. The optical module cold plate liquid cooling assembly includes a cold plate body, multiple floating heat conductive blocks, a thermal pad, and at least one liquid cooling tube. The cold plate body extends along a first direction, the floating heat conductive blocks are disposed on a first side of the cold plate body and spaced apart along the first direction, the thermal pad is affixed between the floating heat conductive blocks and the cold plate body, and the liquid cooling tube is disposed on a second side of the cold plate body. Through contact between the floating heat conductive blocks and the optical modules, heat generated by the optical modules is conducted to the cold plate body via the floating heat conductive blocks and the thermal pads, and then removed by the coolant in the liquid cooling tube to dissipate heat from the optical modules. The floating heat conductive blocks can float in a second direction perpendicular to the first direction, and the thermal pads can deform with the movement of the floating heat conductive blocks, maintaining a tight fit with the floating heat conductive blocks and the cold plate body. In this way, on the basis of using liquid cooling to dissipate heat for the optical module, it can ensure that the floating heat conductive block is always in close contact with the optical module, reducing the contact thermal resistance between the optical module cold plate liquid cooling component and the optical module, and improving the heat dissipation efficiency and heat dissipation effect.

[0076] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0077] An embodiment of the present application provides a network switching device. The network switching device can be any type of switch, such as an access layer switch, an aggregation layer switch, or a core layer switch. For example, the network switching device can be a switch with a height of 4U. Wherein, U is a unit representing external dimensions, 1U equals 4.445 centimeters, and 4U equals 17.78 centimeters. Furthermore, the network switching device of the embodiment of the present application can be applied to any scenario requiring a network system, such as a data center.

[0078] The following describes in detail the network switching device and the optical module cold plate liquid cooling assembly according to the embodiment of the present application, taking the network switching device as an aggregation layer switch used in a data center as an example.

[0079] Figure 1 A schematic diagram of the structure of a network switching device provided in an embodiment of the present application. Figure 2 for Figure 1 Exploded structure diagram of network switching equipment in . Figure 3 for Figure 1 Partial structural diagram of the network switching equipment in .

[0080] Reference Figure 1 and Figure 2 As shown, the network switching device 10 of an embodiment of the present application may include a chassis 100 and an optical / electrical connection module 200. The chassis 100 serves as the installation base, and the other components of the network switching device 10 can be installed in the chassis 100. The network switching device 10 is assembled into a whole through the chassis 100, which facilitates the movement of the network switching device 10 and the placement in the data center. The optical / electrical connection module 200 is installed in the chassis 100 and is used to connect an optical module (not shown in the figure) to the network switching device 10 to realize data transmission between the network switching device 10 and other network devices (such as servers or transceivers).

[0081] The optoelectronic connection module 200 includes at least one board 210 and several connectors 221, all located on the surface of the board 210. The connectors 221 are used to connect optical modules to the network switching device 10. The board 210 serves as a support for the connectors 221, securing them and providing electrical signals to them. The end of the connector 221 facing the outside of the chassis 100 serves as the interface end. Optical modules are inserted into this interface end of the connector 221 to establish an electrical connection between the optical modules and the optoelectronic connection module 200.

[0082] The board 210 may be provided with a chip and electrical channels. The electrical channels are electrically connected to the chip, and the connectors 221 provided on the board 210 are electrically connected to the electrical channels. This allows signals to be transmitted between the chip and the connectors 221 via the electrical channels. When an optical module is inserted into the connector 221, signals can be transmitted between the optical module and the optoelectronic connection module 200.

[0083] Illustratively, the optoelectronic connection module 200 may include one board 210, the plurality of connectors 221 are all disposed on the board 210, and the electrical channels connected to the plurality of connectors 221 are all arranged on the board 210. Alternatively, the optoelectronic connection module 200 may include two or more boards 210, the plurality of connectors 221 are respectively disposed on each board 210, and the electrical channels connected to each connector 221 are respectively arranged on the corresponding board 210.

[0084] The board 210 may be a printed circuit board (PCB), which may be provided with a metal conductive layer that forms an electrical path between the chip and the connector 221. The metal conductive layer may be formed of, but is not limited to, conductive materials such as copper, aluminum, copper alloy, and aluminum alloy, and this embodiment does not impose any specific restrictions on this.

[0085] Reference Figure 2 As shown, in this embodiment, the optical / electrical connection module 200 can be configured as a removable switch module (RSM). The optical / electrical connection module 200 as a whole can be removably mounted on the chassis 100 as a standalone module. This configuration allows the network switching device 10 to be designed with a universal chassis 100 that can accommodate different types of optical / electrical connection modules 200. Different optical / electrical connection modules 200 can be replaced in the network switching device 10 to suit different application scenarios without the need to design and produce additional chassis 100, thereby reducing the design, production, and testing costs of the chassis 100.

[0086] The different types of optoelectronic connection modules 200 may refer to different numbers, models, etc. of connectors 221 of the optoelectronic connection modules 200 . Different optoelectronic connection modules 200 may have different transmission powers.

[0087] One end of the chassis 100 can be open, forming a mounting opening 110 for the optical / electrical connection module 200. The optical / electrical connection module 200 can be installed within the chassis 100 through this mounting opening 110, with the interface ends of the connectors 221 on the optical / electrical connection module 200 exposed outside the chassis 100, facilitating the connection of the optical module with the interface ends of the connectors 221. For example, if the chassis 100 is a rectangular parallelepiped, the mounting opening 110 of the chassis 100 can be located at one end of the chassis 100 in its longitudinal direction, and the optical / electrical connection module 200 can be installed at this end of the chassis 100 in its longitudinal direction.

[0088] Reference Figure 3 As shown, the network switching device 10 may further include a control module 300, which may be disposed within the chassis 100. The optical / electrical connection module 200 may be electrically connected to the control module 300 so that the control module 300 controls the operation of the optical / electrical connection module 200. The board 210 of the optical / electrical connection module 200 may be electrically connected to the control module 300, enabling signal transmission between the control module 300 and each connector 221 via the board 210. The control module 300 may include a control board 310, a baseboard management controller (BMC) 320 disposed on the control board 310, a bus 330, and other components. The control board 310 may be, for example, a printed circuit board.

[0089] In addition, the network switching device 10 may further include a heat dissipation module 400, which is mainly used to dissipate heat for the heat-generating components in the chassis 100 and may also be used to dissipate heat for the optoelectronic connection module 200 to ensure the normal operation of the network switching device 10. For example, the heat dissipation module 400 may include at least one fan 410 to dissipate heat for the heat-generating components in the chassis 100 and may also be used to dissipate heat for the optoelectronic connection module 200 to ensure the normal operation of the network switching device 10. Figure 3 As shown in FIG, for example, the heat dissipation module 400 includes three fans 410. The high-speed rotation of the fans 410 dissipates the heat of the network switching device 10 to the external environment in a timely and effective manner.

[0090] The heat dissipation module 400 can be positioned near the edge of the chassis 100, or in other words, can be positioned on the side of the chassis 100. This facilitates communication between the heat dissipation module 400 and the outside world, thereby dissipating heat from the network switching device 10. Furthermore, since the heat dissipation module 400 is positioned at the edge of the chassis 100, a larger space can be left inside the chassis 100, facilitating the layout of the interior of the chassis 100. For example, the heat dissipation module 400 can be positioned opposite the optoelectronic connection module 200, with the heat dissipation module 400 and the optoelectronic connection module 200 respectively positioned at opposite ends of the chassis 100.

[0091] Figure 4 This is a schematic diagram of the structure of the optoelectronic connection module provided in the embodiment of the present application. Figure 4 As shown, in the optoelectronic connection module 200 of this embodiment, the connectors 221 are regularly arranged in the form of connector groups 220. The optoelectronic connection module 200 includes at least one connector group 220, each connector group 220 including multiple connectors 221 sequentially arranged along a first direction (the Y direction in the figure), and each connector 221 is electrically connected to the board 210. When the optoelectronic connection module 200 includes two or more connector groups 220, the connector groups 220 are spaced apart and arranged along a second direction (the Z direction in the figure), which is perpendicular to the first direction.

[0092] Taking the optoelectronic connection module 200 installed at one end of the chassis 100 in the length direction as an example, the first direction in which the connectors 221 in each connector group 220 are arranged in sequence can be the width direction of the chassis 100, and the second direction in which the connector groups 220 are arranged at intervals can be the height direction of the chassis 100.

[0093] When multiple connector groups 220 are arranged at intervals along the second direction in the optoelectronic connection module 200, the optoelectronic connection module 200 can be provided with only one board card 210, and all connector groups 220 are connected to the board card 210; or, the optoelectronic connection module 200 can also be provided with more than two boards 210, and all connector groups 220 are connected to different boards 210 respectively.

[0094] Continue to refer to Figure 4 As shown, in order to form the optoelectronic connection module 200 into an independent and detachable module, the optoelectronic connection module 200 may further include a mounting frame 240. The aforementioned board 210 may be fixedly connected to the mounting frame 240. The board 210, the connector 221 on the board 210, and the mounting frame 240 are assembled together to form the optoelectronic connection module 200. The provision of the mounting frame 240 allows the optoelectronic connection module 200 to be assembled into an independent structure. In particular, when the optoelectronic connection module 200 includes multiple boards 210, the mounting frame 240 can assemble the multiple boards 210 into a whole.

[0095] In addition, the optoelectronic connection module 200 can be assembled with the chassis 100 through the mounting bracket 240. In other words, by connecting the mounting bracket 240 to the mounting port 110 of the chassis 100, the optoelectronic connection module 200 can be installed on the chassis 100 to assemble and form the network switching device 10.

[0096] For example, the mounting bracket 240 may be provided with a gripping portion 2421, which may extend, for example, from a surface of the optoelectronic connection module 200 facing away from the interior of the chassis 100. An operator may grip the gripping portion 2421 on the mounting bracket 240 to move the optoelectronic connection module 200, thereby facilitating installation and removal of the optoelectronic connection module 200 from the chassis 100.

[0097] For example, the mounting frame 240 may include a main frame 241 and a front frame 242. The main frame 241 may be positioned corresponding to the board 210, and the board 210 may be fixedly connected to the main frame 241. When the optoelectronic connection module 200 includes multiple boards 210, the main frame 241 secures the multiple boards 210 together to form a monolithic structure. The front frame 242 may be connected to the side of the main frame 241 facing away from the interior of the chassis 100 and may be exposed within the mounting opening 110 of the chassis 100. The interface ends of each connector 221 may extend beyond the front end of the board 210 and be accommodated within mounting slots (not shown) formed in the front frame 242. The front frame 242 may be positioned at the front end of the board 210 to protect the board 210. The front frame 242 surrounds the interface ends of each connector 221, shielding and protecting them and enhancing the appearance of the optoelectronic connection module 200. The gripping portion 2421 may be provided on the front frame 242 .

[0098] Figure 5 This is a schematic structural diagram of the optoelectronic connection module provided in an embodiment of the present application after removing the mounting frame. Figure 6 for Figure 5 A breakdown diagram of the optoelectronic connection module from one perspective. Figure 7 for Figure 5 Another perspective of the decomposition structure diagram of the optoelectronic connection module.

[0099] Reference Figure 5 As shown, to maintain a suitable operating temperature for the optical module, in addition to the heat dissipation module 400 installed in the chassis 100, this embodiment also utilizes liquid cooling to dissipate heat from the optical module, thereby removing heat generated by the optical module and maintaining the operating temperature of the optical module within a suitable range. Liquid cooling is used to dissipate heat from the optical module when the optical module is inserted into the connector 221 of the optoelectronic connection module 200, thereby dissipating heat and reducing the temperature of the optical module.

[0100] Specifically, the optoelectronic connection module 200 also includes at least one optical module cold plate liquid cooling assembly (hereinafter referred to as the liquid cooling assembly). The liquid cooling assembly 230 is provided in correspondence with the connector group 220 and dissipates heat from each connector 221 in the corresponding connector group 220. For the connector group 220 equipped with the liquid cooling assembly 230, when an optical module is inserted into a connector 221 of the connector group 220, the liquid cooling assembly 230 can come into contact with the optical module. Heat generated by the optical module is transferred to the liquid cooling assembly 230, where it is carried away by the coolant flowing through the liquid cooling assembly 230, thereby dissipating heat from the optical module.

[0101] The liquid cooling assembly 230 is disposed on one side of the extension direction of the connector group 220, and the liquid cooling assembly 230 can extend along the extension direction of the connector group 220. When the connectors 221 in the connector group 220 are arranged sequentially along a first direction, it is equivalent to the connector group 220 extending along the first direction. In this case, the liquid cooling assembly 230 can also extend along the first direction. Taking the example of the optoelectronic connection module 200 being disposed at one end of the chassis 100 in the longitudinal direction, when the connector group 220 extends along the width direction of the chassis 100, the liquid cooling assembly 230 can also extend along the width direction of the chassis 100. In addition, the liquid cooling assembly 230 is disposed on one side of the connector group 220 in the height direction of the chassis 100.

[0102] It should be noted that to reserve sufficient installation space for the liquid cooling assembly 230 and ensure that the liquid cooling assembly 230 can be installed on one side of the connector assembly 220, in this embodiment, the connector 221 can be mounted on the board 210 along the board surface of the board 210. In other words, the extension direction of the connector 221 can be parallel to the board surface of the board 210, and the insertion and removal direction of the optical module is parallel to the board surface of the board 210. In this way, the board 210 does not limit the space on both sides of the connector assembly 220, and there is sufficient space on the sides of the connector assembly 220 to install the liquid cooling assembly 230.

[0103] For ease of description, this embodiment defines the side where the liquid cooling assembly 230 is located as the installation side of the connector assembly 220. Figure 6 or Figure 7 As shown, for the connector group 220 provided with a liquid cooling component 230, in order to enable the liquid cooling component 230 to contact the optical module inserted into the connector 221, each connector 221 in the connector group 220 can have a contact window 2211, and the contact window 2211 is located on the installation side of the connector group 220. The liquid cooling component 230 passes through the contact window 2211 of each connector 221 and contacts the optical module inserted in the connector 221.

[0104] When the optoelectronic connection module 200 includes multiple connector groups 220, a liquid cooling assembly 230 can be provided for each connector group 220, with each liquid cooling assembly 230 in contact with an optical module inserted into each connector group 220. This ensures that all optical modules inserted into the optoelectronic connection module 200 are in direct contact with the liquid cooling assembly 230, allowing for timely and rapid heat removal from the optical modules, resulting in effective heat dissipation for each optical module.

[0105] Specifically, when two or more connector groups 220 are spaced apart along the second direction in the optoelectronic connection module 200, a liquid cooling assembly 230 is provided on the mounting side of each connector group 220. Each connector 221 in each connector group 220 has a contact window 2211 located on the mounting side of the connector group 220. The liquid cooling assembly 230 passes through the contact window 2211 of each connector 221 and contacts the optical module inserted into each connector 221.

[0106] Continue to refer to Figure 6 or Figure 7 As a specific embodiment, in the optoelectronic connection module 200, the number of the board 210 can be one, and the number of the connector groups 220 can be four. The four connector groups 220 can include two inner connector groups 220a and two outer connector groups 220b. The two inner connector groups 220a are respectively connected to the two sides of the board 210, and the two outer connector groups 220b are respectively located on the side of the two inner connector groups 220a facing away from the board 210. Both outer connector groups 220b are electrically connected to the board 210.

[0107] By electrically connecting four connector groups 220 to a single board 210, a larger number of connectors 221 can be provided within the optoelectronic connection module 200. This allows for a greater number of optical modules to be plugged into the optoelectronic connection module 200, thereby increasing the capacity and transmission power of the optoelectronic connection module 200. Furthermore, since only one board 210 is present, control of the optoelectronic connection module 200 by the control module 300 can be achieved by simply electrically connecting the board 210 to the control module 300 within the chassis 100. This simplifies the control approach and improves signal transmission efficiency.

[0108] Because the outer connector group 220b is located on the side of the inner connector group 220a facing away from the board 210, the outer connector group 220b can be connected to the board 210 via a bracket 2212 to achieve connection between the outer connector group 220b and the board 210. Each connector 221 in the outer connector group 220b has a bracket 2212. The bracket 2212 of the connector 221 extends toward the board 210, and the connector 221 is connected to the board 210 by the bracket 2212.

[0109] Since the end of the connector 221 extending outside the board 210 is its interface end, to prevent the bracket 2212 from blocking the interface end of the connector 221, the bracket 2212 can be connected to the end of the connector 221 facing the board 210. In this case, when a liquid cooling assembly 230 is provided between the outer connector group 220b and the inner connector group 220a, the liquid cooling assembly 230 can be provided at the front end of the bracket 2212 of each connector 221 in the outer connector group 220b, so that the liquid cooling assembly 230 can correspond to the main portion of the connector 221, ensuring that the liquid cooling assembly 230 contacts the optical module inserted into the connector 221.

[0110] The number of liquid cooling assemblies 230 corresponding to the connector groups 220 can be four. Each liquid cooling assembly 230 is respectively arranged on the installation side of each connector group 220, and the liquid cooling assembly 230 can be closely attached to the corresponding connector group 220, so that the liquid cooling assembly 230 can contact the optical module inserted into each connector 221 of the connector group 220. Specifically, for the connector group 220 on a single side of the board 210, there is a gap between the outer connector group 220b and the inner connector group 220a, so that the liquid cooling assembly 230 can be installed between the outer connector group 220b and the inner connector group 220a.

[0111] In some examples, the installation side of each connector group 220 can be the side of the connector group 220 facing away from the board 210, that is, the contact window 2211 on the connector 221 in each connector group 220 is located on the side of the connector group 220 facing away from the board 210.

[0112] The contact windows 2211 on the connectors 221 of the two inner connector groups 220a face away from each other and are both located on the side of the connector group 220 facing away from the board 210. This allows the liquid cooling assemblies 230 corresponding to the two inner connector groups 220a to be located on either side of the board 210. The board 210 does not interfere with the liquid cooling assemblies 230, and sufficient space is reserved between the inner connector group 220a and the outer connector group 220b on the same side for the liquid cooling assemblies 230. Furthermore, the board 210 does not interfere with the contact windows 2211 on the connectors 221 of the inner connector group 220a. The contact windows 2211 are fully exposed on the side of the connector 221 facing away from the board 210, ensuring stable contact between the liquid cooling assemblies 230 and the optical modules inserted into the connectors 221.

[0113] The contact windows 2211 on the connectors 221 of the two outer connector groups 220b face away from each other. The contact windows 2211 on the connectors 221 of the outer connector group 220b face the same direction as the contact windows 2211 on the connectors 221 of the inner connector group 220a on the same side. Thus, the liquid cooling assemblies 230 corresponding to the two outer connector groups 220b can be installed on the side of each outer connector group 220b facing away from the board 210.

[0114] For ease of explanation, in this embodiment, the liquid cooling assembly 230 corresponding to the inner connector group 220a is defined as inner liquid cooling assembly 230a. Inner liquid cooling assembly 230a is located between the inner connector group 220a and the outer connector group 220b on the same side. The liquid cooling assembly 230 corresponding to the outer connector group 220b is defined as outer liquid cooling assembly 230b. Outer liquid cooling assembly 230b is located on the side of the outer connector group 220b facing away from the inner connector group 220a on the same side.

[0115] With this arrangement, the two inner liquid-cooling assemblies 230a are sandwiched between the inner connector group 220a and the outer connector group 220b on each side, respectively. The two outer liquid-cooling assemblies 230b are located on opposite sides of the outer connector group 220b. The inner liquid-cooling assembly 230a can be clamped between the inner connector group 220a and the outer connector group 220b on the same side, while the outer liquid-cooling assembly 230b can be in close contact with the outer connector group 220b. Both the inner liquid-cooling assembly 230a and the outer liquid-cooling assembly 230b on the same side generate pressure toward the board 210, ensuring reliable contact between the liquid-cooling assembly 230 and the optical module inserted into the corresponding connector group 220. Furthermore, the pressure generated by the liquid-cooling assemblies 230 on both sides is balanced, ensuring force balance across the entire optoelectronic connection module 200 and improving its stability and reliability.

[0116] When the connectors 221 in the outer connector assembly 220b are connected to the board 210 via the brackets 2212, the outer liquid cooling assembly 230b can cover at least a portion of the brackets 2212. Because the brackets 2212 are additional components of the connectors 221, they increase the surface area of ​​the connectors 221 in the outer connector assembly 220b. Consequently, the outer liquid cooling assembly 230b can be larger than the inner liquid cooling assembly 230a. This increases the heat transfer area of ​​the outer liquid cooling assembly 230b, resulting in higher heat dissipation efficiency and a better heat dissipation effect. Moreover, for the outer liquid cooling component 230b arranged in the outermost layer, the contact area between the outer liquid cooling component 230b and the outer connector group 220b is larger, the pressure of the outer liquid cooling component 230b on the outer connector group 220b is also greater, and the outer liquid cooling component 230b is in closer contact with the optical module inserted in the connector 221, and the overall stability and reliability of the optoelectronic connection module 200 are better.

[0117] The liquid cooling assembly 230 in the optoelectronic connection module 200 is described in detail below.

[0118] Figure 8 A schematic structural diagram of the outer liquid cooling assembly provided in an embodiment of the present application from one perspective. Figure 9 for Figure 8 Schematic diagram of the structure of the outer liquid cooling component from another perspective. Figure 10 for Figure 8 A partial cross-sectional structural diagram of the outer liquid cooling component.

[0119] Combine Figure 8 and Figure 9 As shown, the outer layer liquid cooling assembly 230b includes a liquid cooling plate and at least one liquid cooling tube 231. One side surface of the liquid cooling plate faces the corresponding outer layer connector group 220b, and this side surface of the liquid cooling plate is used to contact the optical modules inserted in each connector 221 in the outer layer connector group 220b. The liquid cooling tube 231 is arranged on the other side surface of the liquid cooling plate, and the liquid cooling tube 231 is used to provide a flow space for the cooling liquid. The heat generated by the optical module is transferred to the liquid cooling plate, and the liquid cooling plate transfers the heat to the liquid cooling tube 231. The cooling liquid in the liquid cooling tube 231 exchanges heat with the liquid cooling plate, and the cooling liquid absorbs the heat to achieve heat dissipation of the optical module.

[0120] Reference Figure 9 As shown, in some embodiments, the outer liquid-cooling assembly 230b may include a liquid-cooling tube 231. This liquid-cooling tube 231 may extend along the first direction of the liquid-cooling plate and pass through both ends of the liquid-cooling plate. This way, the liquid-cooling tube 231 passes through all areas along the extension direction of the liquid-cooling plate, and heat from all areas of the liquid-cooling plate can be quickly transferred to the liquid-cooling tube 231. This improves the heat dissipation efficiency of the liquid-cooling assembly 230 and ensures uniform heat dissipation.

[0121] For example, in the first direction of extension of the liquid cooling plate, the liquid cooling tube 231 can extend along a wavy line from one end of the liquid cooling plate to the other end. This allows the liquid cooling tube 231 to extend longer on the liquid cooling plate and evenly cover the center and edges of the liquid cooling plate. This improves the heat transfer efficiency and uniformity between the liquid cooling plate and the liquid cooling tube 231, thereby enhancing the heat dissipation efficiency and effectiveness of the outer liquid cooling assembly 230b.

[0122] In other embodiments, the outer layer liquid cooling assembly 230b may include more than two liquid cooling tubes 231, and each liquid cooling tube 231 may be arranged in sequence so that all liquid cooling tubes 231 can cover each area in the first direction of extension of the liquid cooling plate, thereby ensuring the heat dissipation effect of the outer layer liquid cooling assembly 230b.

[0123] Reference Figure 10 As shown, the liquid cold plate includes a cold plate body 232, multiple floating heat conductive blocks 233, and a thermal pad 234. The cold plate body 232 is the main support structure of the liquid cold plate. It extends along a first direction, which is the direction in which the connector assembly 220 extends. The cold plate body 232 has two sides in the thickness direction, namely a first side and a second side. The multiple floating heat conductive blocks 233 are arranged on the first side of the cold plate body 232, and the floating heat conductive blocks 233 are spaced apart along the first direction. Each floating heat conductive block 233 corresponds to a connector 221 in the connector assembly 220. The floating heat conductive blocks 233 are designed to pass through the contact window 2211 of the connector 221 and contact the optical module inserted into the connector 221. The thermal pad 234 is arranged between the cold plate body 232 and the floating heat conductive blocks 233. The two side surfaces of the thermal pad 234 are in contact with the cold plate body 232 and the floating heat conductive blocks 233, respectively. The liquid cooling tube 231 is arranged on the second side of the cold plate body 232.

[0124] The floating thermal block 233 can float along a second direction, perpendicular to the first direction, which can be the thickness direction of the liquid cold plate. The thermal pad 234, located between the floating thermal block 233 and the cold plate body 232, is elastic and deforms with the movement of the floating thermal block 233, ensuring that both sides of the thermal pad 234 remain in close contact with the cold plate body 232 and the floating thermal block 233.

[0125] This configuration creates significant pressure between floating thermal block 233 and the optical module inserted into connector 221, ensuring close contact between the floating thermal block 233 and the optical module. This reduces the thermal resistance between the liquid cooling plate and the optical module, improving the heat dissipation efficiency and effectiveness of liquid cooling assembly 230. Furthermore, because floating thermal block 233 can float up and down, the liquid cooling plate can accommodate optical modules of varying sizes and models, expanding the application range of liquid cooling assembly 230 and enhancing its versatility.

[0126] In addition, by arranging a compressible thermal pad 234 between the floating thermal block 233 and the cold plate body 232, the floating thermal block 233, the thermal pad 234 and the cold plate body 232 are in close contact in sequence, and the three can form a stable and reliable heat conduction path, which can ensure that the heat generated by the optical module can be conducted to the cold plate body 232 through the floating thermal block 233 and the thermal pad 234 in sequence, and then conducted to the liquid cooling tube 231 by the cold plate body 232, and finally the heat is taken away by the coolant in the liquid cooling tube 231.

[0127] By placing a floating thermal block 233 in contact with the optical module within connector 221 and positioning a thermal pad 234 between the cold plate body 232 and the floating thermal block 233, the floating thermal block 233 exhibits high structural strength. This ensures stable and reliable contact between the floating thermal block 233 and the optical module, even with repeated insertion and removal of the optical module. Furthermore, the cold plate body 232 and the floating thermal block 233 enclose the thermal pad 234, protecting it and extending its service life.

[0128] In one embodiment, the liquid cold plate may include an integral thermal pad 234, with all floating thermal blocks 233 in contact with the pad. Movement of each floating thermal block 233 causes deformation of the corresponding portion of the pad 234. In another embodiment, the liquid cold plate may include multiple thermal pads 234, each corresponding to a floating thermal block 233, with a thermal pad 234 positioned between each floating thermal block 233 and the cold plate body 232.

[0129] In this embodiment, both the cold plate body 232 and the floating heat conductive block 233 can be metal components to ensure the thermal conductivity of the cold plate body 232 and the floating heat conductive block 233, meet the overall structural strength requirements of the liquid cold plate, and ensure the reliability of the liquid cold plate. For example, the cold plate body 232 can be made of a metal material such as aluminum, an aluminum alloy, titanium, a titanium alloy, or alloy steel. The floating heat conductive block 233 can be made of a metal material such as copper or aluminum. For example, the floating heat conductive block 233 can be a copper plate, which can improve the thermal conductivity of the floating heat conductive block 233.

[0130] The liquid cooling tube 231 can also be made of metal material to improve the heat conduction efficiency between the cold plate body 232 and the liquid cooling tube 231, and the liquid cooling tube 231 has high structural strength and good reliability. For example, the liquid cooling tube 231 can be a metal tube such as a copper tube or an aluminum tube.

[0131] Since the thermal pad 234 needs to be elastic and compressible, the thermal pad 234 can be a flexible pad and can be made of a flexible material. For example, the material of the thermal pad 234 can be polyamide (PA) or polypropylene (PP).

[0132] Continue to refer to Figure 10 In addition to providing a thermal pad 234 between the floating heat conductive block 233 and the cold plate body 232, the liquid cooling plate may further include an elastic member 235 connected between each floating heat conductive block 233 and the cold plate body 232. The elastic member 235 can extend and retract along the aforementioned second direction to drive the floating heat conductive block 233 to float along the second direction. The elastic member 235 has a large elastic force and strong elastic deformation capability. Using the elastic member 235 as the main driving structure can reliably drive the floating heat conductive block 233 to float. Furthermore, the elastic force of the elastic member 235 acts on the optical module through the floating heat conductive block 233, which can increase the pressure between the floating heat conductive block 233 and the optical module, ensure close contact between the floating heat conductive block 233 and the optical module, reduce the contact thermal resistance between the floating heat conductive block 233 and the optical module, and improve the heat dissipation efficiency and effect of the liquid cooling assembly 230.

[0133] In some examples, two elastic members 235 can be connected between the floating thermal block 233 and the cold plate body 232, with the two elastic members 235 located at either end of the floating thermal block 233. This allows the two elastic members 235 to exert a strong elastic force on the floating thermal block 233, increasing the pressure between the floating thermal block 233 and the optical module, ensuring close contact between the floating thermal block 233 and the optical module. Furthermore, the two elastic members 235 exert pressure on both ends of the floating thermal block 233, ensuring the balance of the floating thermal block 233 and good contact between the floating thermal block 233 and the optical module.

[0134] In this case, the thermal pad 234 can be placed between the two elastic members 235. The large space between the two elastic members 235 at both ends of the floating thermal block 233 allows for ample space for the thermal pad 234, ensuring that it has sufficient surface area. Furthermore, the thermal pad 234 fits snugly within the main body of the floating thermal block 233. This allows the thermal pad 234 to quickly and completely transfer heat from the floating thermal block 233 to the cold plate body 232.

[0135] Continue to refer to Figure 10In some embodiments, the cold plate body 232 may include a main support plate 2321 and a stopper assembly 2322. The main support plate 2321 is the main structure of the cold plate body 232 and may extend along the aforementioned first direction. The floating heat conductive block 233 is located on a first side of the main support plate 2321, and the liquid cooling tube 231 is located on a second side of the main support plate 2321. The stopper assembly 2322 is connected to the outer side of the main support plate 2321. The stopper assembly 2322 and the main support plate 2321 together form a floating groove 2323. The floating groove 2323 may be located on both sides of the main support plate 2321, with the notches of the floating grooves 2323 on both sides facing each other. The ends of the floating heat conductive block 233 are inserted into the floating grooves 2323 on both sides to limit the movement of the floating heat conductive block 233.

[0136] The stopper assembly 2322 and the main support plate 2321 together form the cold plate body 232. The floating groove 2323 formed between the two forms the mounting base for the floating heat conductive block 233, securing the floating heat conductive block 233 to the cold plate body 232 and limiting its travel range. This allows the main support plate 2321 to be generally flat, facilitating its production and processing. This also facilitates assembly of the liquid cold plate, reducing costs associated with its processing and assembly.

[0137] The stopper assembly 2322 may include stoppers 2322a connected to opposite sides of the main support plate 2321. The stopper assembly 2322 does not cover the second side of the main support plate 2321, leaving the second side of the main support plate 2321 exposed. Thus, the stoppers 2322a and the main support plate 2321 together form floating grooves 2323 on either side, allowing the ends of the floating heat conductive block 233 to be inserted into the floating grooves 2323. This also facilitates installation of the liquid cooling tube 231 on the second side of the main support plate 2321, shortening the overall heat conduction path of the liquid cooling assembly 230 and improving heat conduction efficiency.

[0138] For example, taking the stopper 2322a on one side of the main support plate 2321 as an example, a plurality of stoppers 2322a may be arranged at intervals along the first direction in which the main support plate 2321 extends (see FIG. Figure 8 As shown, each stopper 2322a corresponds to at least one floating heat conductive block 233. Multiple stoppers 2322a can be provided along the first direction in which the main support plate 2321 extends to support and secure all floating heat conductive blocks 233, with one stopper 2322a corresponding to only some of the floating heat conductive blocks 233. This facilitates assembly of the floating heat conductive blocks 233 and the stoppers 2322a on the main support plate 2321 and facilitates removal and replacement of the floating heat conductive blocks 233.

[0139] Among them, reference Figure 10The stopper 2322a may include a main body 23221 and a stopper 23222. The main body 23221 is the main structure of the stopper 2322a, and the stopper 2322a is connected to the main support plate 2321 via the main body 23221. The stopper 23222 may be located at the end of the main body 23221, with a gap between the stopper 23222 and the main support plate 2321. The stopper 23222, the main body 23221, and the main support plate 2321 collectively form a floating groove 2323, and the stopper 23222 is preferably located at the end of the floating heat conductive block 233.

[0140] With respect to the outer liquid-cooling assembly 230b, due to the larger area, specifically the width, of the liquid cooling plate of the outer liquid-cooling assembly 230b, the side of the main support plate 2321 facing the board 210 can extend beyond the floating heat conductive block 233. In this case, a stopper 2322a located on the side of the main support plate 2321 facing away from the board 210 can be connected to the sidewall of the main support plate 2321. The main body 23221 of the stopper 2322a extends along the sidewall of the main support plate 2321, and the stopper portion 23222 of the stopper 2322a can be perpendicular to the main body 23221. The stopper 2322a located on the side of the main support plate 2321 facing the board 210 can be connected to the board surface of the main support plate 2321, the main body 23221 of the stopper 2322a extends along the board surface of the main support plate 2321, and the stopper 23222 of the stopper 2322a can be parallel to the main body 23221.

[0141] Figure 11 A schematic structural diagram of the inner liquid cooling assembly provided in an embodiment of the present application from one perspective. Figure 12 for Figure 11 Schematic diagram of the structure of the inner liquid cooling component from another perspective. Figure 13 for Figure 11 A partial cross-sectional structural diagram of the inner liquid cooling component.

[0142] Combine Figure 11 and Figure 12 As shown, similar to the outer liquid cooling assembly 230b, the inner liquid cooling assembly 230a also includes a liquid cooling plate and at least one liquid cooling tube 231. One side of the liquid cooling plate faces the corresponding inner connector group 220a and is configured to contact the optical modules inserted into the connectors 221 in the inner connector group 220a. The liquid cooling tube 231 is provided on the other side of the liquid cooling plate to provide a flow space for the cooling liquid.

[0143] Reference Figure 13As shown, similar to the liquid cooling plate of the outer liquid cooling assembly 230b, the liquid cooling plate of the inner liquid cooling assembly 230a may also include a cold plate body 232, a plurality of floating heat conductive blocks 233, and a thermal pad 234. The plurality of floating heat conductive blocks 233 are all disposed on a first side of the cold plate body 232, and the floating heat conductive blocks 233 are spaced apart along a first direction. Each floating heat conductive block 233 corresponds to a connector 221 in the connector assembly 220. The floating heat conductive block 233 is configured to pass through the contact window 2211 of the connector 221 and contact the optical module inserted into the connector 221. The thermal pad 234 is disposed between the cold plate body 232 and the floating heat conductive blocks 233. The two side surfaces of the thermal pad 234 are in contact with the cold plate body 232 and the floating heat conductive blocks 233, respectively. The liquid cooling tube 231 is disposed on a second side of the cold plate body 232.

[0144] The floating heat-conducting block 233 can float along the second direction. The thermal pad 234 arranged between the floating heat-conducting block 233 and the cold plate body 232 is elastic. The thermal pad 234 can deform with the movement of the floating heat-conducting block 233 so that the two sides of the thermal pad 234 are always close to the cold plate body 232 and the floating heat-conducting block 233.

[0145] Furthermore, the liquid cooling plate of the inner liquid cooling assembly 230a may also include an elastic member 235, which is connected between each floating heat conductive block 233 and the cold plate body 232. For example, two elastic members 235 may be connected between the floating heat conductive block 233 and the cold plate body 232, with the two elastic members 235 located at either end of the floating heat conductive block 233, and the thermal pad 234 may be disposed between the two elastic members 235. This description will not be repeated here.

[0146] In addition, continue to refer to Figure 13 Similar to the cold plate body 232 of the outer liquid-cooling assembly 230b, the cold plate body 232 of the inner liquid-cooling assembly 230a may also include a main support plate 2321 and a stopper assembly 2322. The stopper assembly 2322 is connected to the outer side of the main support plate 2321, and the stopper assembly 2322 and the main support plate 2321 together form a floating groove 2323. The stopper assembly 2322 may include stoppers 2322a connected to opposite sides of the main support plate 2321, and the second side of the main support plate 2321 is exposed to the outside. Taking the stopper 2322a on one side of the main support plate 2321 as an example, a plurality of stoppers 2322a may be arranged at intervals along the first direction in which the main support plate 2321 extends (see Figure 11 As shown in FIG. 2 , each stopper 2322a corresponds to at least one floating heat conductive block 233. The stopper 2322a may include a main body 23221 and a stopper 23222 connected to each other. The stopper 23222, the main body 23221, and the main support plate 2321 collectively form a floating groove 2323. The stopper 23222 is preferably located at the end of the floating heat conductive block 233.

[0147] Unlike the outer liquid-cooling assembly 230b, the inner liquid-cooling assembly 230a has a smaller liquid cooling plate area, specifically a smaller width, so the width of the main support plate 2321 can be roughly equivalent to the width of the floating heat conductive block 233. In this case, the stoppers 2322a on both sides of the main support plate 2321 can be connected to the sidewalls of the main support plate 2321, and the main bodies 23221 of the stoppers 2322a on both sides can extend along the corresponding sidewalls of the main support plate 2321, and the stoppers 23222 on both sides of the stoppers 2322a can be perpendicular to the main bodies 23221.

[0148] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0149] The terms "first," "second," "third," "fourth," and the like (if any) in the description and claims of the embodiments of the present application and in the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. In addition, the terms "including" and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or inherent to the process, method, product, or apparatus.

[0150] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module cold plate liquid cooling assembly, characterized in that: include: a cold plate body extending along a first direction and comprising a first side and a second side opposite to each other; a plurality of floating heat-conducting blocks connected to a first side of the cold plate body and capable of floating along a second direction perpendicular to the first direction; the floating heat-conducting blocks are spaced apart along the first direction and are configured to contact the optical modules sequentially arranged along the first direction; a thermal pad, disposed between the cold plate body and the floating thermal block, and in contact with the cold plate body and the floating thermal block; At least one liquid cooling tube is disposed on the second side of the cold plate body.

2. The optical module cold plate liquid cooling assembly according to claim 1, characterized in that: Also includes: The elastic member is connected between each of the floating heat-conducting blocks and the cold plate body and can be stretched and retracted along the second direction.

3. The optical module cold plate liquid cooling assembly according to claim 2, characterized in that: Two elastic members are connected between the floating heat-conducting block and the cold plate body. The two elastic members are respectively located at two ends of the floating heat-conducting block, and the thermal pad is located between the two elastic members.

4. The optical module cold plate liquid cooling assembly according to any one of claims 1 to 3, characterized in that: The cold plate body comprises: A main support plate extending along the first direction; the floating heat conductive block is located on a first side of the support plate, and the liquid cooling pipe is located on a second side of the main support plate; The stop assembly is connected to the outer side of the main support plate and forms a floating groove together with the main support plate; the floating groove is located on both sides of the main support plate, and the notches of the floating grooves on both sides are opposite to each other, and the two ends of the floating heat conductive block are inserted into the floating grooves on both sides.

5. The optical module cold plate liquid cooling assembly according to claim 4, characterized in that: The stopper assembly includes stoppers connected to opposite sides of the main support plate, and the second side of the main support plate is exposed to the outside.

6. The optical module cold plate liquid cooling assembly according to claim 5, characterized in that: The stopper comprises a main body portion and a stopper portion connected to each other, the main body portion is connected to the main support plate, and the stopper portion is disposed at an end portion of the floating heat conductive block.

7. The optical module cold plate liquid cooling assembly according to claim 5, characterized in that: A plurality of stoppers are arranged at intervals along the first direction, and each stopper stops at least one floating heat conductive block.

8. The optical module cold plate liquid cooling assembly according to any one of claims 1 to 3, characterized in that: The number of the liquid cooling pipe is one, and the liquid cooling pipe passes through both ends of the cold plate body along the first direction.

9. The optical module cold plate liquid cooling assembly according to claim 8, characterized in that: The liquid cooling pipe extends from one end of the cold plate body along a wavy line to the other end of the liquid cooling plate.

10. A network switching device, characterized in that: include: At least one board; At least one connector group, each connector group comprising a plurality of connectors arranged in sequence along a first direction, each connector being electrically connected to the board; wherein each connector in at least one connector group has a contact window, and the contact window is located on a mounting side of the connector group; At least one optical module cold plate liquid cooling assembly according to any one of claims 1 to 9, wherein the optical module cold plate liquid cooling assembly is arranged on the installation side of the connector group, and each floating heat conductive block of the optical module cold plate liquid cooling assembly is used to pass through the contact window and contact the optical module inserted in the connector.

11. The network switching device according to claim 10, wherein: At least two connector groups are spaced apart along a second direction perpendicular to the first direction, each connector in each connector group has a contact window, and each connector group is correspondingly provided with one optical module cold plate liquid cooling assembly.

12. The network switching device according to claim 11, wherein: There is one board, and the connector group includes two inner connector groups and two outer connector groups, the two inner connector groups are respectively connected to two side surfaces of the board, and the two outer connector groups are respectively located on the side of the two inner connector groups facing away from the board, and both the outer connector groups are electrically connected to the board; The number of the optical module cold plate liquid cooling components is four, and each of the optical module cold plate liquid cooling components is respectively arranged on the installation side of each of the connector groups.

13. The network switching device according to claim 12, wherein: The installation side of each connector group is the side of the connector group facing away from the board, and the optical module cold plate liquid cooling assembly includes two inner liquid cooling assemblies and two outer liquid cooling assemblies; The two inner layer liquid cooling components are respectively located between the inner layer connector group and the outer layer connector group on each side, and the inner layer liquid cooling plate is used to contact the optical module inserted in the inner layer connector group; the two outer layer liquid cooling components are respectively located on the side of the outer layer connector group on each side away from the board, and the outer layer liquid cooling components are used to contact the optical module inserted in the outer layer connector group.

14. The network switching device according to claim 13, wherein: Each connector of the outer layer connector group has a bracket, the bracket extends toward the board and is connected to the board, and the outer layer liquid cooling assembly covers at least a portion of the bracket.

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