Airtight packaging structure of optical module
The combined structure of optical fiber, optical chip, electrical chip, circuit board, elastic connector and cover solves the cracking risk and maintenance difficulties of the ceramic substrate packaging structure, realizes the hermetic packaging and flexible maintenance of multi-channel optical modules, and is suitable for large-scale multi-channel applications.
Patent Information
- Application Number
- CN202510669665.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-23
- Publication Date
- 2025-09-19
AI Technical Summary
Due to the limitations of ceramic substrates, the existing optical module packaging structure has the risk of large-scale cracking and is difficult to repair, making it difficult to apply to large-scale multi-channel applications. Different functional modules require customization of different ceramic substrates, resulting in large limitations in the packaging structure.
It adopts a combined structure of optical fiber, optical chip, electrical chip, circuit board, elastic connector, tube shell and cover plate, forms an airtight cavity through welding, utilizes the multi-channel design of elastic connector to realize radio frequency and low frequency signal transmission, and supports the replacement and maintenance of module functions through the elastic interconnection between elastic connector and circuit board.
It realizes the hermetic packaging of multi-channel optical modules, reduces external environmental interference, improves the reliability and life of the modules, supports flexible replacement and maintenance of module functions, and is suitable for various application scenarios.
Smart Images

Figure CN120669362A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of optoelectronic hybrid integrated packaging, and in particular to an optical module airtight packaging structure. Background Art
[0002] As electronic information systems develop towards highly integrated, high-frequency, and broadband systems, optical modules are playing an increasingly important role due to their high-frequency and broadband performance. However, the optical and electrical chips used in optical modules are very sensitive to the external environment. To reduce interference from harsh external environments and improve the reliability and service life of optical modules, a hermetic packaging structure is usually adopted.
[0003] Currently, optical module products mainly use a ceramic substrate + metal tube shell packaging structure to achieve airtight packaging and board-level interconnection. Due to the limitations of the ceramic substrate's own characteristics, large-size ceramic substrates have the risk of cracking. Therefore, the packaging structure of ceramic substrate + metal tube shell is limited in large-scale multi-channel scenarios. In addition, the ceramic substrate needs to be welded to the tube shell to form an airtight structure. Optical modules with different functions require customized different ceramic substrates for welding, resulting in a very limited packaging structure and difficulty in maintenance. Therefore, further improvements are needed on this basis. Summary of the Invention
[0004] In order to solve the technical problems existing in the above background technology, the present invention proposes an optical module hermetic packaging structure.
[0005] To achieve the above object, the present invention provides the following technical solutions:
[0006] An optical module airtight packaging structure, characterized in that it includes: an optical fiber, an optical chip, an electrical chip, a circuit board, an elastic connector, a tube shell and a cover plate; wherein: the optical fiber passes through the side wall of the tube shell and is welded to the side wall of the tube shell, the optical chip and the electrical chip are integrated on the circuit board, the elastic connector is welded to the tube shell, an elastic contact is provided on the top of the elastic connector and contacts the solder pad at the bottom of the circuit board, the cover plate is welded to the tube shell to form an airtight cavity, and the elastic connector includes a metal shell, a glass medium and an inner conductor, wherein: the top of the inner conductor is connected to the bottom of the elastic contact, the glass medium is welded to the bottom of the metal shell, the inner conductor is welded to the cavity of the glass medium and passes through the cavity and is welded to the bottom of the metal shell to form an airtight passage between the inside and outside of the airtight cavity.
[0007] Preferably, the interior of the metal shell is filled with an insulating medium, the insulating medium is located on top of the glass medium, and the elastic contact includes a fur button arranged inside the insulating medium and a stepped hard needle installed on the top of the fur button.
[0008] Preferably, it further comprises an elastic pressure ring, which is arranged on the top of the metal shell, arranged in a circular array along the axis of the elastic contacts and in contact with the pads at the bottom of the circuit board.
[0009] Preferably, the device further comprises: an RF channel of an elastic connector consisting of a metal shell, a wool button, a glass dielectric, an inner conductor, a stepped hard needle, and an elastic pressure ring; wherein: the glass dielectric is welded to the bottom of the metal shell, the inner conductor is welded into the cavity of the glass dielectric, the bottom of the inner conductor is plated with metal to form a bottom pad and welded to the bottom of the metal shell, the bottom of the wool button is connected to the top of the inner conductor, the top of the wool button passes through the top wall of the metal shell and is equipped with a stepped hard needle, the elastic pressure ring is arranged at the top of the metal shell, and the stepped hard needle and the elastic pressure ring are elastically connected to the bottom pad of the circuit board to transmit RF signals;
[0010] A low-frequency channel of an elastic connector consisting of a metal shell, a wool button, a glass dielectric, an inner conductor, and a stepped hard needle; there is at least one low-frequency channel, wherein: the bottom of the wool button is connected to the top of the inner conductor, the top of the wool button passes through the top wall of the metal shell and is installed with a stepped hard needle, the glass dielectric is welded to the bottom of the metal shell, the inner conductor is welded in the cavity of the glass dielectric, and the bottom of the inner conductor is metal-plated to form a bottom pad and welded to the bottom of the metal shell to transmit low-frequency signals.
[0011] Preferably, an insulating medium is also included, which is filled in the metal shell and located above the glass medium. The insulating medium covers the wool button to improve the electrical insulation performance and structural stability of the wool button.
[0012] Preferably, it also includes: a low-frequency channel of an elastic connector composed of a metal shell, a wool button, a glass medium and an inner conductor, and there are multiple low-frequency channels, wherein: the bottom of the wool button is connected to the top of the inner conductor, the top of the wool button passes through the top wall of the metal shell and is installed with a stepped hard needle, the glass medium is welded to the bottom of the metal shell, the inner conductor is welded in the cavity of the glass medium and the bottom of the inner conductor is metal-plated to form a bottom pad and welded to the bottom of the metal shell to transmit low-frequency signals.
[0013] Preferably, the wool button, insulating medium, inner conductor, glass medium, elastic pressure ring and metal shell inside the elastic connector form a quasi-coaxial structure, wherein: the glass medium is welded to the bottom of the metal shell, the insulating medium is filled inside the metal shell and is located above the glass medium, the inner conductor is welded in the cavity of the glass medium and the bottom of the inner conductor is metal-plated to form a bottom pad and welded to the bottom of the metal shell, the bottom of the wool button is connected to the top of the inner conductor and is concentrically arranged, and the top of the wool button passes through the top wall of the metal shell.
[0014] Compared with the existing technology, the cover plate of the present invention is welded to the tube shell by parallel sealing welding or laser welding, and the optical fiber and the elastic connector with airtight performance are welded to the tube shell by solder to form an airtight packaging structure, which can reduce the interference of the harsh external environment on the internal components of the optical module.
[0015] The elastic connector of the present invention has multiple elastic contacts on the top, which are elastically interconnected with the bottom pads of the circuit board. The bottom of the elastic connector has multiple pads for input and output of electrical signals. The glass dielectric, inner conductor and connector shell inside the elastic connector are welded to form an airtight structure, taking into account the flexible use of the elastic connector and the airtight characteristics of the glass insulator.
[0016] The present invention uses an elastic connector to interconnect electrical signals inside the tube shell. The elastic connector shell is metal, and the conductor, glass medium and metal shell inside the connector are welded to each other. The multi-channel elastic connector is not easy to crack, and the number of radio frequency and low-frequency channels is not limited by the risk of connector cracking. It can be suitable for large-scale multi-channel application scenarios.
[0017] The internal electrical chip and optical chip of the present invention are mounted on a circuit board, which is elastically connected to an elastic connector. By replacing the circuit board and the chip thereon, the module function can be replaced or repaired. The same elastic connector and tube shell can be used in a variety of occasions such as analog reception, analog transmission, analog transceiver, digital transceiver, and optoelectronic hybrid integration, and is universal and easy to repair.
[0018] The elastic connector of the present invention comprises a quasi-coaxial structure composed of a wool button, insulating dielectric, inner conductor, glass dielectric, elastic pressure ring, and metal shell, enabling high-frequency, high-speed signal transmission and high-frequency, high-speed interconnection capabilities. The bottom pad of the elastic connector of the present invention can interconnect internal and external signals via an external elastic connector, or signal transmission can be achieved via BGA, PGA, surface mount, or other methods, thus providing a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is a schematic diagram of the structure of the airtight packaging structure of the optical module proposed in the present invention;
[0020] Figure 2 This is a schematic diagram of the structure of the optical chip, electrical chip and circuit board in the airtight packaging structure of the optical module proposed by the present invention;
[0021] Figure 3 This is a schematic diagram of the first structure of the elastic connector in the airtight packaging structure of the optical module proposed by the present invention;
[0022] Figure 4 This is a second structural schematic diagram of the elastic connector in the optical module airtight packaging structure proposed by the present invention;
[0023] Figure 5 This is a third structural schematic diagram of the elastic connector in the optical module hermetic packaging structure proposed by the present invention.
[0024] In the figure: 1-optical fiber, 2-optical chip, 3-electrical chip, 4-circuit board, 5-elastic connector, 51-metal shell, 52-wool button, 53-insulating medium, 54-glass medium, 55-inner conductor, 56-bottom pad, 57-step hard needle, 58-elastic pressure ring, 6-tube shell, 7-cover plate. DETAILED DESCRIPTION
[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0026] like Figure 1-Figure 5 As shown, this embodiment provides an optical module airtight packaging structure, characterized in that it includes: an optical fiber 1, an optical chip 2, an electrical chip 3, a circuit board 4, an elastic connector 5, a tube shell 6 and a cover plate 7; wherein: the optical fiber 1 passes through the side wall of the tube shell 6 and is welded to the side wall of the tube shell 6, the optical chip 2 and the electrical chip 3 are integrated on the circuit board 4, the elastic connector 5 is welded to the tube shell 6, an elastic contact is provided on the top of the elastic connector 5 and contacts the soldering pad at the bottom of the circuit board 4, the cover plate 7 is welded to the tube shell 6 to form an airtight cavity, and the elastic connector 5 includes a metal shell 51, a glass medium 54 and an inner conductor 55, wherein: the top of the inner conductor 55 is connected to the bottom of the elastic contact, the glass medium 54 is welded to the bottom of the metal shell 51, the inner conductor 55 is welded to the cavity of the glass medium 54 and passes through the cavity and is welded to the bottom of the metal shell 51 to form an airtight channel between the inside and the outside of the airtight cavity.
[0027] On the whole, the elastic connector 5 is welded to the tube shell 6, and the elastic contact arranged on the top of the elastic connector 5 is elastically connected to the soldering pad at the bottom of the circuit board 4. The optical fiber 1 passes through the side wall of the tube shell 6 and is welded to the side wall of the tube shell 6. One end of the optical fiber 1 passes through the tube shell 6 and is interconnected with the optical chip 2 on the circuit board 4. The cover plate 7 and the tube shell 6 form an airtight cavity. The bottom of the elastic contact is connected to the top of the inner conductor 55. The inner conductor 55 is welded in the cavity of the glass medium 54. The bottom of the glass medium 54 and the inner conductor 55 are both welded to the bottom of the metal shell 51 to form an airtight channel between the inside and outside of the airtight cavity. While ensuring the signal transmission of the optical module, it can also improve the sealing effect of the airtight cavity and reduce the interference of the harsh external environment on the internal components of the optical module.
[0028] The optical fiber 1 can be one optical fiber 1 or multiple optical fibers 1, which can couple input light into the optical chip 2, or couple the output light of the optical chip 2 for output. The surface of the optical fiber 1 is plated with a metallized layer and is soldered to the tube shell 6 by solder.
[0029] The optical chip 2 can be one or more detector chips, modulator chips, laser chips, etc. that realize photoelectric conversion. The electrical chip 3 can be one or more analog or digital chips such as driver chips, amplifier chips, acquisition chips, and processing chips.
[0030] The optical chip 2 and the electrical chip 3 can be interconnected with the top pad of the circuit board 4 by flip-chip bonding. The optical chip 2 and the electrical chip 3 can also be interconnected with the top pad of the circuit board 4 by bonding.
[0031] The circuit board 4 can be a printed board or microstrip board for realizing circuit interconnection, such as a ceramic substrate, a PCB board, a glass substrate, etc. The circuit board 4 is fixed to the tube shell 6 by screws or soldering.
[0032] like Figure 3-Figure 4 As shown, in this embodiment, the metal shell 51 is filled with an insulating medium 53, the insulating medium 53 is located on top of the glass medium 54, and the elastic contact includes a wool button 52 arranged inside the insulating medium 53 and a stepped hard needle 57 installed on the top of the wool button 52.
[0033] Specifically, the metal shell 51 is filled with an insulating medium 53, and the elastic contact is located inside the insulating medium 53, including a wool button 52 arranged inside the insulating medium 53 and a step hard needle 57 installed on the top of the wool button 52. One end of the wool button 52 is connected to the inner conductor 55, and the other end is in contact with the soldering pad at the bottom of the circuit board 4; the step hard needle 57 is installed on the top of the wool button 52, and the wool button 52 and the step hard needle 57 form an elastic contact and are elastically connected to the soldering pad at the bottom of the circuit board 4 to realize signal transmission.
[0034] like Figure 3 As shown, in this embodiment, an elastic pressure ring 58 is also included. The elastic pressure ring 58 is arranged at the top of the metal shell 51. The elastic pressure ring 58 is arranged in an annular array along the axial direction of the elastic contact and contacts the pads at the bottom of the circuit board 4.
[0035] Specifically, it also includes an elastic pressure ring 58, which is arranged in a circular array along the axial direction of the elastic contact. The pad at the bottom of the circuit board 4 is elastically connected to the step hard needle 57 and the elastic pressure ring 58 to achieve signal transmission.
[0036] like Figure 3As shown, in this embodiment, it also includes: an RF channel of the elastic connector 5 composed of a metal shell 51, a wool button 52, a glass dielectric 54, an inner conductor 55, a stepped hard needle 57 and an elastic pressure ring 58; wherein: the glass dielectric 54 is welded to the bottom of the metal shell 51, the inner conductor 55 is welded in the cavity of the glass dielectric 54, and the bottom of the inner conductor 55 is metal-plated to form a bottom soldering pad 56 and is welded to the bottom of the metal shell 51, the bottom of the wool button 52 is connected to the top of the inner conductor 55, the top of the wool button 52 passes through the top wall of the metal shell 51 and is installed with a stepped hard needle 57, the elastic pressure ring 58 is set at the top of the metal shell 51, and the stepped hard needle 57 and the elastic pressure ring 58 are elastically connected to the bottom soldering pad of the circuit board 4 to transmit RF signals;
[0037] The low-frequency channel of the elastic connector 5 consists of a metal shell 51, a wool button 52, a glass dielectric 54, an inner conductor 55, and a stepped hard needle 57; there is at least one low-frequency channel, wherein: the bottom of the wool button 52 is connected to the top of the inner conductor 55, the top of the wool button 52 passes through the top wall of the metal shell 51 and is installed with a stepped hard needle 57, the glass dielectric 54 is welded to the bottom of the metal shell 51, the inner conductor 55 is welded in the cavity of the glass dielectric 54, and the bottom of the inner conductor 55 is metal-plated to form a bottom pad 56 and welded to the bottom of the metal shell 51 to transmit low-frequency signals.
[0038] Specifically, the elastic connector 5 includes a radio frequency channel and at least one low-frequency channel, wherein the radio frequency channel is composed of a metal shell 51, a wool button 52, an insulating medium 53, a glass medium 54, an inner conductor 55, a bottom solder pad 56, a step hard needle 57 and an elastic pressure ring 58. The step hard needle 57 and the wool button 52 are located inside the insulating medium 53. The step hard needle 57 is installed on the top of the wool button 52. The bottom of the wool button 52 is elastically connected to the top of the inner conductor 55. The elastic pressure ring 58 is located on the side of the step hard needle 57 and is elastically connected to the metal shell 51. The wool button 52, the step hard needle 57 and the elastic pressure ring 58 together form a quasi-coaxial structure, which is elastically connected to the bottom solder pad of the circuit board 4 to transmit radio frequency signals. The inner conductor 55 is welded in the glass medium 54, and the glass medium 54 is welded on the metal shell 51 to form an airtight channel. The bottom of the inner conductor 55 is metal-plated to form a bottom solder pad 56, which forms a quasi-coaxial structure with the metal shell 51 to transmit radio frequency signals. The low-frequency channel consists of a metal shell 51, a wool button 52, an insulating medium 53, a glass medium 54, an inner conductor 55, a bottom solder pad 56 and a stepped hard needle 57. The stepped hard needle 57 and the wool button 52 are located inside the insulating medium 53. The stepped hard needle 57 is installed on the top of the wool button 52. The bottom of the wool button 52 is elastically connected to the top of the inner conductor 55. The wool button 52 and the stepped hard needle 57 together form an elastic connection structure, which is elastically connected to the bottom solder pad of the circuit board 4 to transmit low-frequency signals. The inner conductor 55 is welded in the glass medium 54, and the glass medium 54 is welded on the metal shell 51 to form an airtight channel. The bottom of the inner conductor 55 is metal-plated to form a bottom solder pad 56 to transmit low-frequency signals.
[0039] like Figure 3-5 As shown, in this embodiment, an insulating medium 53 is also included. The insulating medium 53 is filled in the metal shell 51 and is located above the glass medium. The insulating medium 53 covers the wool button 52 to improve the electrical insulation performance and structural stability of the wool button.
[0040] By providing the insulating medium 53 , the insulating isolation effect can be enhanced and the stability of the overall structure can be effectively improved, and a certain moisture-proof, dust-proof and corrosion-proof effect can also be achieved.
[0041] like Figure 4-5 As shown, in this embodiment, it also includes: a low-frequency channel of the elastic connector 5 composed of a metal shell 51, a wool button 52, a glass medium 54 and an inner conductor 55. There are multiple low-frequency channels, among which: the bottom of the wool button 52 is connected to the top of the inner conductor 55, the top of the wool button 52 passes through the top wall of the metal shell 51 and is installed with a stepped hard needle 57, the glass medium 54 is welded to the bottom of the metal shell 51, the inner conductor 55 is welded in the cavity of the glass medium 54, and the bottom of the inner conductor 55 is metal-plated to form a bottom welding pad 56 and welded to the bottom of the metal shell 51 to transmit low-frequency signals.
[0042] Specifically, the low-frequency channel consists of a metal shell 51, a wool button 52, an insulating medium 53, a glass medium 54, an inner conductor 55 and a bottom pad 56. The wool button 52 is located inside the insulating medium 53, the bottom of the wool button 52 is elastically connected to the top of the inner conductor 55, and the top of the wool button 52 is elastically connected to the bottom pad of the circuit board 4 to transmit low-frequency signals. The inner conductor 55 is welded in the glass medium 54, and the glass medium 54 is welded on the metal shell 51 to form an airtight channel. The bottom of the inner conductor 55 is metal-plated to form a bottom pad 56 to transmit low-frequency signals.
[0043] The low-frequency channel can also be composed of a metal shell 51, a wool button 52, an insulating medium 53, a glass medium 54, an inner conductor 55, a bottom solder pad 56 and a stepped hard needle 57. The stepped hard needle 57 and the wool button 52 are located inside the insulating medium 53. The stepped hard needle 57 is installed on the top of the wool button 52. The bottom of the wool button 52 is elastically connected to the top of the inner conductor 55. The wool button 52 and the stepped hard needle 57 together form an elastic connection structure, which is elastically connected to the bottom solder pad of the circuit board 4 to transmit low-frequency signals. The inner conductor 55 is welded in the glass medium 54, and the glass medium 54 is welded on the metal shell 51 to form an airtight channel. The bottom of the inner conductor 55 is metal-plated to form a bottom solder pad 56 to transmit low-frequency signals.
[0044] like Figure 3-Figure 5 As shown, in this embodiment, the wool button 52, insulating medium 53, inner conductor 55, glass medium 54, elastic pressure ring 58 and metal shell 51 inside the elastic connector 5 form a coaxial structure, wherein: the glass medium 54 is welded to the bottom of the metal shell 51, the insulating medium 53 is filled in the metal shell 51 and is located above the glass medium 54, the inner conductor 55 is welded in the cavity of the glass medium 54 and the bottom of the inner conductor 55 is metal-plated to form a bottom pad 56 and welded to the bottom of the metal shell 51, the bottom of the wool button 52 is connected to the top of the inner conductor 55 and is concentrically arranged, and the top of the wool button 52 passes through the top wall of the metal shell 51.
[0045] By forming a quasi-coaxial structure of the wool button 52, insulating medium 53, inner conductor 55, glass medium 54, elastic pressure ring 58 and metal shell 51 inside the elastic connector 5, high-frequency and high-speed signal transmission is performed, and high-frequency and high-speed interconnection capabilities are achieved.
[0046] Of course, it will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, but also encompasses the same or similar structures that can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and it is intended that all variations that fall within the meaning and range of equivalents of the claims be encompassed within the present invention. Any reference signs in the claims should not be construed as limiting the claim to which they relate.
[0047] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.
Claims
1. An optical module hermetic packaging structure, characterized in that: include: Optical fiber (1), optical chip (2), electrical chip (3), circuit board (4), elastic connector (5), tube shell (6) and cover plate (7); The optical fiber (1) passes through the side wall of the tube shell (6) and is welded to the side wall of the tube shell (6); the optical chip (2) and the electric chip (3) are integrated on the circuit board (4); the elastic connector (5) is welded to the tube shell (6); the top of the elastic connector (5) is provided with an elastic contact and contacts the welding pad at the bottom of the circuit board (4); the cover plate (7) and the tube shell (6) are welded to form an airtight cavity; the elastic connector (5) comprises a metal shell (51), a glass medium (54) and an inner conductor (55), wherein: the glass medium (54) is welded to the bottom of the metal shell (51); the top of the inner conductor (55) is connected to the bottom of the elastic contact; the inner conductor (55) is welded to the cavity of the glass medium (54) and passes through the cavity to be welded to the bottom of the metal shell (51), so as to form an airtight passage between the inside and the outside of the airtight cavity.
2. The optical module airtight packaging structure according to claim 1, characterized in that: The metal shell (51) is filled with an insulating medium (53), which is located on top of a glass medium (54). The elastic contact comprises a fur button (52) arranged inside the insulating medium (53) and a stepped hard needle (57) installed on the top of the fur button (52).
3. The optical module airtight packaging structure according to claim 2, characterized in that: It also includes an elastic pressure ring (58), which is arranged on the top of the metal shell (51). The elastic pressure ring (58) is arranged in an annular array along the axial direction of the elastic contact and contacts the pad at the bottom of the circuit board (4).
4. The optical module airtight packaging structure according to claim 3, characterized in that: Also includes: A radio frequency channel of an elastic connector (5) consisting of a metal shell (51), a hair button (52), a glass medium (54), an inner conductor (55), a stepped hard needle (57) and an elastic pressure ring (58); wherein: the glass medium (54) is welded to the bottom of the metal shell (51), the inner conductor (55) is welded in the cavity of the glass medium (54), and the bottom of the inner conductor (55) is plated with metal to form a bottom pad (56) and welded to the bottom of the metal shell (51), the bottom of the hair button (52) is connected to the top of the inner conductor (55), the top of the hair button (52) passes through the top wall of the metal shell (51) and is equipped with a stepped hard needle (57), the elastic pressure ring (58) is arranged at the top of the metal shell (51), the stepped hard needle (57) and the elastic pressure ring (58) are elastically connected to the bottom pad of the circuit board (4) to transmit radio frequency signals; A low-frequency channel of an elastic connector (5) consisting of a metal shell (51), a hair button (52), a glass medium (54), an inner conductor (55), and a stepped hard needle (57); there is at least one low-frequency channel, wherein: the bottom of the hair button (52) is connected to the top of the inner conductor (55), the top of the hair button (52) passes through the top wall of the metal shell (51) and is equipped with a stepped hard needle (57), the glass medium (54) is welded to the bottom of the metal shell (51), the inner conductor (55) is welded in the cavity of the glass medium (54), and the bottom of the inner conductor (55) is metal-plated to form a bottom pad (56) and welded to the bottom of the metal shell (51) to transmit low-frequency signals.
5. The optical module airtight packaging structure according to claim 4, characterized in that: The invention also includes an insulating medium (53), which is filled in the metal shell (51) and located above the glass medium. The insulating medium (53) covers the wool button (52) to improve the electrical insulation performance and structural stability of the wool button.
6. The optical module airtight packaging structure according to claim 3, characterized in that: Also includes: A low-frequency channel of an elastic connector (5) consisting of a metal shell (51), a wool button (52), a glass medium (54) and an inner conductor (55); A plurality of low-frequency channels are provided, wherein: the bottom of the hair button (52) is connected to the top of the inner conductor (55), the top of the hair button (52) passes through the top wall of the metal shell (51) and is installed with a stepped hard needle (57), the glass medium (54) is welded to the bottom of the metal shell (51), the inner conductor (55) is welded in the cavity of the glass medium (54), and the bottom of the inner conductor (55) is metal-plated to form a bottom pad (56) and welded to the bottom of the metal shell (51) to transmit low-frequency signals.
7. The optical module airtight packaging structure according to claim 4 or 6, characterized in that: The hair button (52), insulating medium (53), inner conductor (55), glass medium (54), elastic pressure ring (58) and metal shell (51) inside the elastic connector (5) form a quasi-coaxial structure, wherein: the glass medium (54) is welded to the bottom of the metal shell (51), the insulating medium (53) is filled in the metal shell (51) and is located above the glass medium (54), the inner conductor (55) is welded in the cavity of the glass medium (54), and the bottom of the inner conductor (55) is plated with metal to form a bottom pad (56) and welded to the bottom of the metal shell (51), the bottom of the hair button (52) is connected to the top of the inner conductor (55) and is concentrically arranged, and the top of the hair button (52) passes through the top wall of the metal shell (51).
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