Optical transceiver

Abstract

An optical transceiver (1), comprising: a transistor base (10), the transistor base (10) comprising a first base portion (100) and a second base portion (101) which intersect and are connected to each other, as well as a first side portion (102) and a second side portion (103) which are spaced apart from each other in a first direction (X), and the first side portion (102) and the second side portion (103) being both connected to the first base portion (100) and the second base portion (101) and defining an accommodating cavity (104) having a first opening (105); a transistor cap (20), connected to the transistor base (10) and covering the first opening (105); a photoelectric chip (30), arranged in the accommodating cavity (104), the photoelectric chip (30) being arranged on the first base portion (100); and an electrical connector (40), passing through the second base portion (101) and extending into the accommodating cavity (104), one end of the electrical connector (40) passing through the accommodating cavity (104) and being electrically connected to the photoelectric chip (30), and the other end of the electrical connector being located outside the accommodating cavity (104).

Description

An optical transceiver

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 27, 2023, with application number 202311589919.4 and invention name “An Optical Transceiver”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application belongs to the field of lasers, and specifically relates to an optical transceiver. Background Art

[0003] In an airtight Transistor Outline (TO) coaxial package, the cap and socket are usually welded on the same plane. Since the large surface of the socket needs to be connected to the pins, the side of the socket is required to dissipate heat. However, the side area of ​​the socket is small and the distance from the packaged chip is also far, which cannot achieve good heat dissipation effect. Summary of the Invention

[0004] Purpose of the invention: The embodiments of the present application provide an optical transceiver to solve the above-mentioned problems.

[0005] Technical solution: An optical transceiver according to an embodiment of the present application includes:

[0006] A tube socket, the tube socket comprising a first base portion and a second base portion that intersect and connect with each other, and a first side portion and a second side portion that are spaced apart in a first direction, wherein the first side portion and the second side portion are both connected to the first base portion and the second base portion and enclose a receiving cavity having a first opening;

[0007] a pipe cap connected to the pipe base and covering the first opening;

[0008] an optoelectronic chip, the optoelectronic chip being disposed in the accommodating cavity and on the first base;

[0009] An electrical connector passes through the second base and extends into the accommodating cavity. One end of the electrical connector passes through the accommodating cavity and is electrically connected to the optoelectronic chip, and the other end is located outside the accommodating cavity.

[0010] In some embodiments, the tube seat has a first welding end face surrounding the first opening, the tube cap has a second welding end face, the first welding end face and the second welding end face are located in the same plane, and the tube seat and the tube cap are sealed and connected through the first welding end face and the second welding end face.

[0011] In some embodiments, the first base has a first welding sub-surface facing the tube cap, the second base has a second welding sub-surface facing the tube cap, the first side has a third welding sub-surface facing the tube cap, and the second side has a fourth welding sub-surface facing the tube cap. The first welding sub-surface, the second welding sub-surface, the third welding sub-surface and the fourth welding sub-surface are located in the same plane and are connected in sequence to form the first welding end surface.

[0012] In some embodiments, the tube cap includes a first cap portion, a second cap portion, and a third side portion and a fourth side portion spaced apart in the first direction. The third side portion and the fourth side portion are both connected to the first cap portion and the second cap portion and enclose an optical path cavity having a second opening. The optical path cavity is connected to the accommodating cavity, and the second welding end surface surrounds the second opening.

[0013] The first cap portion has a fifth welding sub-surface facing the first base portion, the second cap portion has a sixth welding sub-surface facing the second base portion, the third side portion has a seventh welding sub-surface facing the first side portion, and the fourth side portion has an eighth welding sub-surface facing the second side portion. The fifth welding sub-surface, the sixth welding sub-surface, the seventh welding sub-surface and the eighth welding sub-surface are located in the same plane and are connected in sequence to form the second welding end surface.

[0014] In some embodiments, the first cap portion is provided with a first coupling portion extending along a side facing away from the second cap portion, the first coupling portion having a first coupling surface facing the first welding sub-surface and a first extrusion surface facing away from the first welding sub-surface, the first coupling surface and the fifth welding sub-surface are located in the same plane and connected, and the first extrusion surface is parallel to the first welding sub-surface;

[0015] The second cap portion is provided with a second coupling portion extending along a side away from the first cap portion, the second coupling portion having a second coupling surface facing the second welding sub-surface and a second extrusion surface away from the second welding sub-surface, the second coupling surface and the sixth welding sub-surface are located in the same plane and are connected, and the second extrusion surface is parallel to the second welding sub-surface.

[0016] In some embodiments, the first base has a first surface and a second surface corresponding to each other in the second direction, the second base has a third surface and a fourth surface corresponding to each other in the third direction, and the second surface is connected to the third surface;

[0017] The first cap portion is opposite to the third surface in the third direction, the second cap portion is opposite to the second surface in the second direction, and the first direction, the second direction and the third direction intersect each other.

[0018] In some embodiments, the tube cap is provided with an optical port, the optical port faces the optoelectronic chip, the optical port is sealed with a first optical window, and the optoelectronic chip is used to emit or receive laser light toward the first optical window.

[0019] In some embodiments, the tube cap is provided with an observation port, and the observation port is sealed with a second light window.

[0020] In some embodiments, the optical transceiver further comprises:

[0021] A lens is provided on a side of the first light window facing away from the optoelectronic chip, and is used for coupling the laser light emitted or received by the optoelectronic chip.

[0022] In some embodiments, the optical transceiver further comprises:

[0023] A monitoring chip is disposed in the accommodating cavity and connected to the second base portion. The monitoring chip is electrically connected to the optoelectronic chip and the electrical connector, respectively.

[0024] Beneficial effect: The optical transceiver of the embodiment of the present application includes a tube seat, which includes a first base and a second base that intersect and are connected to each other, and a first side and a second side that are spaced apart in a first direction, the first side and the second side are both connected to the first base and the second base and form a accommodating cavity with a first opening; a tube cap, which is connected to the tube seat and covers the first opening; an optoelectronic chip, which is arranged in the accommodating cavity and is at least connected to the first base; an electrical connector, which is connected to the second base, and one end of the electrical connector is passed through the accommodating cavity and electrically connected to the optoelectronic chip, that is, the optoelectronic chip is arranged on the first base to be spaced apart from the electrical connector on the second base, so that the optoelectronic chip has a larger heat dissipation area and improves the heat dissipation performance. At the same time, the first side and the second side can also be used to contact the optoelectronic chip and serve as the heat dissipation surface of the optoelectronic chip, which is conducive to further improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0026] FIG1 is a schematic structural diagram of an optical transceiver according to Example 1 of the present application;

[0027] FIG2 is a schematic diagram of the internal cross-sectional structure of the optical transceiver according to Example 1 of the present application;

[0028] FIG3 is a schematic structural diagram of a tube holder, an optoelectronic chip, an electrical connector, and a monitoring chip according to Example 1 of the present application;

[0029] FIG4 is a schematic structural diagram of a tube socket according to Example 1 of the present application;

[0030] FIG5 is a schematic structural diagram of a tube cap according to Example 1 of the present application;

[0031] FIG6 is a schematic structural diagram of an optical transceiver with a coupling lens according to Example 1 of the present application;

[0032] FIG7 is a schematic structural diagram of an optical transceiver with a coupling lens according to Example 2 of the present application;

[0033] Figure numerals: 1, optical transceiver; 10, tube seat; 100, first base; 1000, first surface; 1001, second surface; 1002, extension portion; 1003, support portion; 101, second base; 1010, third surface; 1011, fourth surface; 102, first side portion; 103, second side portion; 104, accommodating cavity; 105, first opening; 106, first welding end surface; 1060, first welding sub-surface; 1061, second welding sub-surface; 1062, third welding sub-surface; 1063, fourth welding sub-surface; 20, tube cap; 200, first cap portion; 2000, first joining portion; 2001, first joining surface; 2002, first extrusion surface; 201, second cap portion; 2010, second Joint; 2011, second joint surface; 2012, second extrusion surface; 202, third side; 203, fourth side; 204, optical path cavity; 205, second opening; 206, second welding end surface; 2060, fifth welding sub-surface; 2061, sixth welding sub-surface; 2062, seventh welding sub-surface; 2063, eighth welding sub-surface; 207, welding protrusion; 208, optical port; 209, observation port; 30, optoelectronic chip; 300, laser; 301, pad; 40, electrical connector; 400, insulating portion; 401, connecting portion; 50, first light window; 60, second light window; 70, lens; 80, monitoring chip; 90, positioning groove; X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0035] In the description of the present application, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "multiple" means two or more, and at least one means one, two or more, unless otherwise clearly and specifically defined.

[0036] It should also be noted that in the description of this application, "vertical" means completely vertical at 90° or almost completely vertical, for example, an angle within the range of 80° to 100° is considered vertical. Similarly, "parallel" means completely parallel or almost completely parallel, for example, an angle within 10° of completely parallel is considered parallel.

[0037] The applicant noted that with the rising demand for 1550nm LiDAR and the application of silicon photonics technology in optical modules, high-power lasers are being used to achieve better heat dissipation at a low cost, which will positively impact the output power of the light sources of 1550nm LiDAR and silicon photonics modules. The traditional hermetic transistor outline (TO) is a coaxial package, with the metal cap and header welded together on the same plane. The larger bottom surface of the header is mostly used for pinouts and flexible board soldering, which does not provide good heat dissipation. Heat can only be dissipated from the side of the header, but the side surface is small and far from the chip, resulting in poor heat dissipation performance.

[0038] In view of this, an embodiment of the present application discloses an optical transceiver, which can solve at least one of the above-mentioned defects.

[0039] Example 1:

[0040] Referring to Figures 1 to 5 , an optical transceiver 1 is oriented in a first direction X and includes a socket 10, a cap 20, an optoelectronic chip 30, and an electrical connector 40. The socket 10 includes a first base 100 and a second base 101 that intersect and connect with each other, as well as a first side 102 and a second side 103 spaced apart in the first direction X. The first side 102 and the second side 103 are connected to the first base 100 and the second base 101 and define a receiving cavity 104 having a first opening 105. The cap 20 is connected to the socket 10 and covers the first opening 105. The optoelectronic chip 30 is disposed in the receiving cavity 104 and is connected to at least the first base 100. The electrical connector 40 is connected to the second base 101. One end of the electrical connector 40 passes through the receiving cavity 104 and is electrically connected to the optoelectronic chip 30, while the other end is located outside the receiving cavity 104.

[0041] The optoelectronic chip 30 is arranged on the first base 100 to be spaced from the electrical connector 40 on the second base 101, so that the optoelectronic chip 30 has a larger heat dissipation area and improves the heat dissipation performance. At the same time, the first side 102 and the second side 103 can also be used to contact the optoelectronic chip 30 and serve as the heat dissipation surface of the optoelectronic chip 30, which is conducive to further improving the heat dissipation effect.

[0042] It should be noted that in this embodiment, the intersection of the first base portion 100 and the second base portion 101 refers to an angle between the first base portion 100 and the second base portion 101 that is not 0° or 180°. This structurally separates the electrical connector 40 and the optoelectronic chip 30, preventing the electrical connector 40 from occupying the heat dissipation surface of the optoelectronic chip 30. Furthermore, after the first side portion 102 and the second side portion 103 are connected to the tube cap 20, neither the first side portion 102 nor the second side portion 103 is occupied by the electrical connector 40. This means that the optoelectronic chip 30 can still thermally contact the first side portion 102 and / or the second side portion 103, further expanding the contact heat dissipation surface and thus improving the overall heat dissipation effect.

[0043] Further, referring to Figures 1 to 5 , in some embodiments, the tube base 10 has a first weld end surface 106 surrounding the first opening 105, and the tube cap 20 has a second weld end surface 206. The first weld end surface 106 and the second weld end surface 206 are parallel to each other and connected to each other. In this embodiment, the tube base 10 and the tube cap 20 each have a wedge-shaped structure, and the two are sealed together via the first weld end surface 106 and the second weld end surface 206.

[0044] In addition, this embodiment takes the arrangement of the optoelectronic chip 30 in the accommodating cavity 104 as an example. It can be understood that the optoelectronic chip 30 can include a laser 300 and a detector (not shown in the figure) integrated in the accommodating cavity 104 to complete the reception and transmission of optical signals. In other embodiments, if this product is only a light transmitter, that is, the optoelectronic chip 30 can be set as a laser 300; if this product is only a light receiver, that is, the optoelectronic chip 30 can be set as a detector.

[0045] Specifically, referring to Figures 2, 3, and 4, the optical transceiver 1 further has a second direction Y and a third direction Z, and the first direction X, the second direction Y, and the third direction Z intersect in pairs. The first base 100 has a corresponding first surface 1000 and a corresponding second surface 1001 in the second direction Y. The second base 101 has a corresponding third surface 1010 and a fourth surface 1011 in the third direction Z, with the second surface 1001 connected to the third surface 1010. The first base 100 has a first welding sub-surface 1060 facing the tube cap 20, the second base 101 has a second welding sub-surface 1061 facing the tube cap 20, the first side portion 102 has a third welding sub-surface 1062 facing the tube cap 20, and the second side portion 103 has a fourth welding sub-surface 1063 facing the tube cap 20. The first welding sub-surface 1060, the second welding sub-surface 1061, the third welding sub-surface 1062, and the fourth welding sub-surface 1063 are sequentially connected to form a first welding end surface 106.

[0046] 2 and 5 , in some embodiments, the tube cap 20 includes a first cap portion 200 and a second cap portion 201 connected to each other, and a third side portion 202 and a fourth side portion 203 spaced apart in a first direction X. The third side portion 202 and the fourth side portion 203 connect the first cap portion 200 and the second cap portion 201 and enclose an optical path cavity 204. The optical path cavity 204 communicates with the accommodating cavity 104. A second welding end surface 206 surrounds the second opening 205. The first cap portion 200 is opposite to the third surface 1010 in the third direction Z, and the second cap portion 201 is opposite to the second surface 1001 in the second direction Y.

[0047] Specifically, the first cap portion 200 has a fifth welding sub-surface 2060 facing the first base portion 100, the second cap portion 201 has a sixth welding sub-surface 2061 facing the second base portion 101, the third side portion 202 has a seventh welding sub-surface 2062 facing the first side portion 102, and the fourth side portion 203 has an eighth welding sub-surface 2063 facing the second side portion 103. The fifth welding sub-surface 2060, the sixth welding sub-surface 2061, the seventh welding sub-surface 2062 and the eighth welding sub-surface 2063 are connected in sequence to form an integral second welding end face 206.

[0048] It should be noted that, referring to FIG5 , in order to increase the contact surface between the first cap portion 200 , the third side portion 202 , and the fourth side portion 203 and the tube socket 10 , the first cap portion 200 , the third side portion 202 , and the fourth side portion 203 extend on the plane where the second welding end surface 206 is located to provide a first coupling portion 2000 . The first coupling portion 2000 has a first coupling surface 2001 facing the first welding sub-surface 1060 and a first extrusion surface 2002 facing away from the first welding sub-surface 1060 . The first coupling surface 2001 and the fifth welding sub-surface 2060 are located in the same plane and are connected. The first extrusion surface 2002 is parallel to the first welding sub-surface 1060 . The fifth welding sub-surface 2060 actually includes the side surface of the first coupling portion 2000 facing the tube socket 10 .

[0049] Similarly, the second cap portion 201, the third side portion 202 and the fourth side portion 203 extend the second joint portion 2010 on the plane where the second welding surface is located. The second joint portion 2010 has a second joint surface 2011 facing the second welding sub-surface 1061 and a second extrusion surface 2012 away from the second welding sub-surface 1061. The second joint surface 2011 and the sixth welding sub-surface 2061 are located in the same plane and are connected to each other. The second extrusion surface 2012 is parallel to the second welding sub-surface 1061. The above-mentioned sixth welding sub-surface 2061 actually includes the side of the second joint portion 2010 facing the tube seat 10.

[0050] It should be noted that the integral tube socket 10 can be formed by machining or stamping a metal material with a high thermal conductivity. Specifically, metal materials such as copper, aluminum, silver, and tungsten can be flexibly used according to actual needs. The first base portion 100, the second base portion 101, the first side portion 102, and the second side portion 103 of the tube socket 10 can actually be integrally formed. In this case, the first welding end surface 106 is formed during the molding of the tube socket 10.

[0051] Similarly, the integral pipe cap 20 can also be processed by metal craftsmanship or stamping. Specifically, metal materials such as copper and aluminum can be flexibly used according to actual needs. The first cap portion 200, the second cap portion 201, the third side portion 202, the fourth side portion 203, the first joint portion 2000 and the second joint portion 2010 of the pipe cap 20 can actually be formed as one piece. At this time, the second welding end face 206 is formed when the pipe cap 20 is formed; the pipe cap 20 is usually also subjected to surface treatment, such as tin plating, nickel plating, etc., to improve its corrosion resistance and connection performance.

[0052] In this embodiment, the first side portion 102, the second side portion 103, the third side portion 202 and the fourth side portion 203 are arranged to form a first welding end face 106 and a second welding end face 206 that are parallel to each other. While being compatible with traditional resistance welding tube holder 10 and tube cap 20 equipment, a higher airtightness yield and reliability can be achieved. Compared with only providing the first base portion 100, the second base portion 101, the first cap portion 200 and the second cap portion 201, the need for multiple welding surfaces at the same time during welding is avoided, the resistance welding process requirements are reduced, and the welding reliability and production efficiency are improved.

[0053] In order to facilitate the connection of the tube seat 10 and the tube cap 20 by resistance welding, the first extrusion surface 2002 and the second extrusion surface 2012 are used for abutment by the resistance welding equipment, which is conducive to making the first joint surface 2001, the second joint surface 2011 and the overall second welding end surface 206 stably abut against the first welding end surface 106.

[0054] 5 , in some embodiments, the tube cap 20 encloses an optical path cavity 204 having a second opening 205. The second welding end surface 206 is provided with a welding protrusion 207 facing the first welding end surface 106. The welding protrusion 207 surrounds the second opening 205. In this embodiment, the tube cap 20 and the tube base 10 are welded using a resistance welding process to ensure the airtightness of the accommodating cavity 104 and the optical path cavity 204. The welding protrusion 207 improves the sealing effect when the two are connected by resistance welding.

[0055] For example, referring to Figures 2 and 3 , a support portion 1003 is formed on the second surface 1001 of the socket 10. The optoelectronic chip 30 includes a laser diode 300 (LD) and a laser diode submount 301 (LD SM). The submount 301 is fixed to the support portion 1003, and the laser 300 is fixed to the submount 301. Specifically, the laser 300 can be connected to the submount 301 using gold soldering, and the submount 301 can be fixed to the support portion 1003 using silver glue or gold soldering.

[0056] The spacer 301 provides mechanical support and protection for the laser 300, protecting it from external shocks or vibrations, thereby extending the lifespan and stability of the laser 300. Simultaneously, the spacer 301 dissipates heat from the laser 300 in a timely manner to maintain a stable operating temperature. Furthermore, the spacer 301 has precise dimensions and geometry, enabling accurate optical positioning for precise placement of the laser 300, thereby ensuring precise alignment between the laser diode and other optical components for high-quality laser output.

[0057] In some embodiments, referring to Figures 1, 2, and 3, the electrical connector 40 is configured as a pin extending through the second base portion 101. An insulating portion 400 is provided between the outer side of the pin and the second base portion 101. The insulating portion 400 can be a glass insulator secured to the stem 10 by high-temperature sintering. In this embodiment, the electrical connector 40 is electrically connected to the pad 301 via the connecting portion 401, thereby electrically connecting to the laser 300. The connecting portion 401 can be made of a gold-tin solder sheet, solder paste, or the like. Alternatively, the electrical connector 40 can be directly connected to the pad 301 via gold wire bonding. In other embodiments, the electrical connector 40 can also be formed of a multilayer ceramic substrate, which will not be described in detail here.

[0058] In addition, in some embodiments, referring to FIG3 , the optical transceiver 1 further includes a monitoring chip 80 (Monitor Photodiode, MPD for short). The monitoring chip 80 is disposed in the accommodating cavity 104 and connected to the third surface 1010 . The monitoring chip 80 can be fixed to the third surface 1010 using silver glue. The monitoring chip 80 can be electrically connected to the optoelectronic chip 30 and the electrical connector 40 by welding only. The monitoring chip 80 can monitor the backlight intensity output by the laser 300 , that is, by being installed on the back side of the laser 300 and converting the optical signal into an electrical signal to monitor the backlight intensity of the laser 300 in real time, thereby providing a feedback signal for controlling and adjusting the output power and stability of the laser 300 .

[0059] In addition, in order to further improve the heat dissipation effect of the laser 300, in other embodiments, a semiconductor cooler (TEC) can be added to the support portion 1003 for connecting the laser 300 and the pad 301. Components such as thermistors can also be provided to detect the temperature of the laser 300 in real time to improve the stability of use.

[0060] In some embodiments, referring to Figures 1, 2 and 5, the first cap portion 200 is provided with an optical port 208, which faces the laser 300, and the optical port 208 is sealed with a first optical window 50. The laser 300 can emit laser light toward the first optical window 50 so that the laser light can be smoothly guided out of the optical path cavity 204.

[0061] Furthermore, the second cap portion 201 defines an observation port 209, which faces the laser 300 and is enclosed by a second optical window 60. The observation port 209 and the second optical window 60 allow for observation of components within the housing cavity 104, such as the laser 300, facilitating high-precision placement of external components and improving coupling efficiency with external optical elements.

[0062] It should be noted that the first light window 50 and the second light window 60 can be made of glass light window material having a thermal expansion coefficient intersecting with the tube cap 20 , and can be sealed with the tube cap 20 by gold soldering or glass solder high-temperature sintering.

[0063] In some embodiments, referring to Figures 2 and 6, the optical transceiver 1 further includes a lens 70 (Lens), which is disposed on a side of the first optical window 50 facing away from the laser 300. The lens 70 is used to couple the laser light emitted or received by the optoelectronic chip 30. For example, the vertical and horizontal divergence angles of the laser light emitted by the laser 300 can be adjusted by the lens 70, thereby coupling and matching with external optical components.

[0064] It should be noted that the included angle between the first base 100 and the second base 101 is limited to between 60° and 135°. Within this angle range, the first base 100 supports the optoelectronic chip 30 and the second base 101 supports the electrical connector 40 without interfering with each other, and the first base 100 has sufficient space for heat dissipation from the optoelectronic chip 30. When the included angle between the first base 100 and the second base 101 is less than 60°, the space between the second surface 1001 and the third surface 1010 is narrow, making it difficult to install the optoelectronic chip 30. When the included angle is greater than 135°, the electrical connector 40 extending through the second base 101 may affect the installation of the first base 100 and the entire optical transceiver 1. Therefore, the included angle between the first base 100 and the second base 101 is preferably between 60° and 135°.

[0065] In this embodiment, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other, that is, the first base 100 and the second base 101 are perpendicular to each other, and the first cap 200 and the second cap 201 are also perpendicular to each other, so that the optoelectronic chip 30 and the electrical connector 40 are independent of each other, and the internal space layout of the optical transceiver 1 is more reasonable, with better heat dissipation effect and sufficient installation space.

[0066] 2 , the interconnected ends of the first base 100 and the second base 101 are provided with a positioning groove 90 penetrating the first surface 1000 and the fourth surface 1011 . The positioning groove 90 is intended to correspond to and adapt to the coaxial packaging equipment to quickly position and install the tube seat 10 .

[0067] In addition, this embodiment takes a single-channel laser 300 as an example. In other embodiments, multiple lasers 300 and multiple optical signal channels can also be used. At the same time, in other embodiments, an optical receiver can be provided or the laser 300 and the optical receiver can be arranged in an integrated manner in the accommodating cavity 104, which will not be described one by one here.

[0068] Example 2:

[0069] 7 , the difference between this embodiment and embodiment 1 is that, illustratively, one end of the first base 100 away from the second base 101 is connected to an extension portion 1002 in the third direction Z. Correspondingly, a smaller lens 70 than that in embodiment 1 can be used and directly coupled to the extension portion 1002 to adapt to different process methods.

[0070] In addition, in other embodiments, the lens 70 may also be directly built into the tube cap 20 , which will not be described in detail here.

[0071] The above is a detailed introduction to an optical transceiver provided in an embodiment of the present application, and specific examples are used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and core idea of ​​the present application; ordinary technicians in this field should understand that: they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not cause the essence of the corresponding technical solution to deviate from the scope of the technical solution of each embodiment of the present application.

Claims

1. An optical transceiver (1), characterized in that: include: A tube seat (10), the tube seat (10) comprising a first base (100) and a second base (101) intersecting and connected to each other, and a first side portion (102) and a second side portion (103) spaced apart in a first direction (X), the first side portion (102) and the second side portion (103) both connecting the first base (100) and the second base (101) and enclosing a receiving cavity (104) having a first opening (105); A pipe cap (20), the pipe cap (20) being connected to the pipe base (10) and covering the first opening (105); an optoelectronic chip (30), the optoelectronic chip (30) being disposed in the accommodating cavity (104), and the optoelectronic chip (30) being disposed on the first base (100); An electrical connector (40), the electrical connector (40) passing through the second base (101) and extending into the accommodating cavity, one end of the electrical connector (40) passing through the accommodating cavity (104) and electrically connected to the optoelectronic chip (30), and the other end being located outside the accommodating cavity.

2. The optical transceiver (1) according to claim 1, characterized in that: The tube seat (10) has a first welding end surface (106) surrounding the first opening (105), and the tube cap (20) has a second welding end surface (206), the first welding end surface (106) and the second welding end surface (206) are located in the same plane, and the tube seat (10) and the tube cap (20) are sealed and connected via the first welding end surface (106) and the second welding end surface (206).

3. The optical transceiver (1) according to claim 2, characterized in that: The first base (100) has a first welding sub-surface (1060) facing the tube cap (20), the second base (101) has a second welding sub-surface (1061) facing the tube cap (20), the first side portion (102) has a third welding sub-surface (1062) facing the tube cap (20), and the second side portion (103) has a fourth welding sub-surface (1063) facing the tube cap (20), and the first welding sub-surface (1060), the second welding sub-surface (1061), the third welding sub-surface (1062) and the fourth welding sub-surface (1063) are located in the same plane and are sequentially connected to form the first welding end surface (106).

4. The optical transceiver (1) according to claim 3, characterized in that: The tube cap (20) comprises a first cap portion (200), a second cap portion (201) connected to each other, and a third side portion (202) and a fourth side portion (203) arranged at intervals in the first direction (X); the third side portion (202) and the fourth side portion (203) are both connected to the first cap portion (200) and the second cap portion (201) and enclose an optical path cavity (204) having a second opening; the optical path cavity (204) is connected to the accommodating cavity (104); and the second welding end surface (206) surrounds the second opening (205); The first cap portion (200) has a fifth welding sub-surface (2060) facing the first base portion (100), the second cap portion (201) has a sixth welding sub-surface (2061) facing the second base portion (101), the third side portion (202) has a seventh welding sub-surface (2062) facing the first side portion (102), the fourth side portion (203) has an eighth welding sub-surface (2063) facing the second side portion (103), and the fifth welding sub-surface (2060), the sixth welding sub-surface (2061), the seventh welding sub-surface (2062) and the eighth welding sub-surface (2063) are located in the same plane and are sequentially connected to form the second welding end surface (206).

5. The optical transceiver (1) according to claim 4, characterized in that: The first cap portion (200) is provided with a first combining portion (2000) extending along a side away from the second cap portion (201); the first combining portion (2000) has a first combining surface (2001) facing the first welding sub-surface (1060) and a first extrusion surface (2002) away from the first welding sub-surface (1060); the first combining surface (2001) and the fifth welding sub-surface (2060) are located in the same plane and connected to each other, and the first extrusion surface (2002) is parallel to the first welding sub-surface (1060); The second cap portion (201) is provided with a second joining portion (2010) extending along a side away from the first cap portion (200), the second joining portion (2010) having a second joining surface (2011) facing the second welding sub-surface (1061) and a second extrusion surface (2012) away from the second welding sub-surface (1061), the second joining surface (2011) and the sixth welding sub-surface (2061) are located in the same plane and are connected, and the second extrusion surface (2012) is parallel to the second welding sub-surface (1061).

6. The optical transceiver (1) according to claim 4, characterized in that: The first base (100) has a corresponding first surface (1000) and a second surface (1001) in the second direction (Y), the second base (101) has a corresponding third surface (1010) and a fourth surface (1011) in the third direction (Z), and the second surface (1001) is connected to the third surface (1010); The first cap portion (200) is opposite to the third surface (1010) in the third direction (Z), the second cap portion (201) is opposite to the second surface (1001) in the second direction (Y), and the first direction (X), the second direction (Y) and the third direction (Z) intersect each other.

7. The optical transceiver (1) according to claim 1, characterized in that: The tube cap (20) is provided with an optical port (208), the optical port (208) faces the optoelectronic chip (30), the optical port (208) is sealed with a first optical window (50), and the optoelectronic chip (30) is used to emit or receive laser light toward the first optical window (50).

8. The optical transceiver (1) according to claim 1, characterized in that: The tube cap (20) is provided with an observation port (209), and the observation port (209) is sealed with a second light window (60).

9. The optical transceiver (1) according to claim 7, characterized in that: The optical transceiver (1) further comprises: A lens (70), wherein the lens (70) is arranged on a side of the first light window (50) facing away from the optoelectronic chip (30), and the lens (70) is used to couple laser light emitted or received by the optoelectronic chip (30).

10. The optical transceiver (1) according to claim 1, characterized in that: The optical transceiver (1) further comprises: A monitoring chip (80), the monitoring chip (80) being arranged in the accommodating cavity (104), the monitoring chip (80) being connected to the second base (101), and the monitoring chip (80) being electrically connected to the optoelectronic chip (30) and the electrical connector (40) respectively.

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