Display panel and display device
By providing the second organic film layer in the first frame area of the display panel with the first organic film layer, or the second inorganic film layer with the first inorganic film layer, the problem of film layer peeling is solved, and a stronger film layer adhesion effect and strength of the frame region are achieved.
Patent Information
- Application Number
- PCT/CN2024/127394
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-11-28
- Filing Date
- 2024-10-25
- Publication Date
- 2025-06-05
AI Technical Summary
In the display panel that integrates the display structure and the touch structure, the adhesion performance between the film layers is not strong, and the film layer peeling is easily caused during the reliability test.
The adhesion effect between the film layers is enhanced by providing the second organic film layer in the first frame area of the display panel with the first organic film layer, or the second inorganic film layer with the first inorganic film layer. The specific implementation method includes setting a plurality of hollow structures or recesses in the wiring setting area to ensure the increase and strengthening of the contact points of the membrane layer.
The film adhesion effect of the first frame area is improved, the strength of the frame area is enhanced, and the film peeling caused by impact is prevented.
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Figure CN2024127394_05062025_PF_FP_ABST
Abstract
Description
Display panel and display device
[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 28, 2023, with application number 202311605099.3 and invention name “Display Panel and Display Device”, the contents of which should be understood as incorporated into this application by reference. Technical Field
[0002] This article relates to but is not limited to the field of display technology, and in particular to a display panel and a display device. Background Art
[0003] Organic Light Emitting Diodes (OLEDs) are active light-emitting display devices with advantages such as self-luminescence, wide viewing angles, high contrast, low power consumption, and extremely fast response times. With the continuous advancement of display technology, display devices using OLEDs as light-emitting devices and thin-film transistors (TFTs) for signal control have become mainstream products in the display field.
[0004] Summary of the Invention
[0005] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
[0006] This embodiment provides a display panel and a display device.
[0007] In one aspect, this embodiment provides a display panel comprising: a substrate, a display structure layer, and a touch structure layer. The substrate comprises a display area and a first frame region located to one side of the display area. The display structure layer is located on the substrate and comprises at least a first organic film layer and a first inorganic film layer, with the first organic film layer located on a side of the first inorganic film layer away from the substrate. The touch structure layer is located on a side of the display structure layer away from the substrate and comprises at least a second organic film layer and a second inorganic film layer, with the second organic film layer located on a side of the second inorganic film layer away from the display structure layer. In the first frame region, a portion of the second organic film layer contacts the first organic film layer, or a portion of the second inorganic film layer contacts the first inorganic film layer.
[0008] In some exemplary embodiments, the first border area includes: a first signal access area and a routing area located on a side of the first signal access area close to the display area. The routing area includes at least a plurality of touch transmission lines, the first signal access area includes at least a plurality of touch contact pads, and at least one of the plurality of touch transmission lines is connected to at least one touch contact pad. The second inorganic film layer includes: a plurality of first hollow structures in the routing area, and the second organic film layer contacts the first organic film layer through the plurality of first hollow structures. At least one of the plurality of first hollow structures is located on at least one side of at least one of the plurality of touch transmission lines.
[0009] In some exemplary embodiments, the plurality of first hollow structures include at least one of the following: a plurality of inorganic holes, a plurality of inorganic grooves.
[0010] In some exemplary embodiments, the first organic film layer includes in the wiring setting area: a plurality of recessed portions, the plurality of recessed portions are connected to the plurality of first hollow structures in a one-to-one correspondence, the orthographic projections of the recessed portions on the substrate cover the orthographic projections of the corresponding first hollowed structures on the substrate, and the orthographic projections of the second inorganic film layer on the substrate partially overlap with the orthographic projections of the recessed portions on the substrate.
[0011] In some exemplary embodiments, the wiring arrangement area further includes: at least one first power supply line, the first power supply line being located on a side of the plurality of touch transmission lines close to the substrate, the orthographic projection of the first power supply line on the substrate partially overlapping the orthographic projections of the plurality of touch transmission lines on the substrate, and at least one of the plurality of inorganic trenches extending along an edge of the first power supply line.
[0012] In some exemplary embodiments, the display panel further includes a cutting edge located on one side of the first power supply line, and at least one of the plurality of inorganic grooves extends along the cutting edge.
[0013] In some exemplary embodiments, the wiring arrangement area includes: a first edge area, a first wiring area, a middle area, a second wiring area, and a second edge area, arranged sequentially along a first direction; the plurality of touch transmission lines are located in the first wiring area and the second wiring area; the wiring arrangement area is located on one side of the display area along a second direction, where the first direction intersects the second direction; and the plurality of first hollow structures are located in at least one of the first edge area, the middle area, and the second edge area.
[0014] In some exemplary embodiments, the first border area includes: a first signal access area and a wiring arrangement area located on a side of the first signal access area close to the display area. The wiring arrangement area includes at least a plurality of touch transmission lines, and the first signal access area includes at least a plurality of touch contact pads, at least one of the plurality of touch transmission lines being connected to at least one touch contact pad. The first organic film layer includes: a plurality of second hollow structures in the wiring arrangement area, and the second inorganic film layer contacts the first inorganic film layer via the plurality of second hollow structures. The plurality of second hollow structures are located on at least one side of the plurality of touch transmission lines.
[0015] In some exemplary embodiments, the plurality of second hollow structures include at least one of the following: a plurality of organic holes, and a plurality of organic grooves.
[0016] In some exemplary embodiments, the display panel further includes: a plurality of isolation columns located in the wiring setting area, the second hollow structure covering the orthographic projection of at least one isolation column on the substrate; the isolation columns are located between the second inorganic film layer and the first inorganic film layer.
[0017] In some exemplary embodiments, the display structure layer includes at least: a first source-drain metal layer and a second source-drain metal layer sequentially disposed on the substrate, and the isolation column is located in the second source-drain metal layer.
[0018] In some exemplary embodiments, the isolation column includes: a first metal layer, a second metal layer, and a third metal layer arranged in sequence along a direction away from the substrate, the orthographic projection of the third metal layer on the substrate covers the orthographic projections of the second metal layer and the first metal layer on the substrate, and the edge of the third metal layer protrudes from the edge of the second metal layer and the first metal layer.
[0019] In some exemplary embodiments, the routing setting area also includes: at least one first power supply line, the first power supply line is located on a side of the multiple touch transmission lines close to the substrate, the orthographic projection of the first power supply line on the substrate partially overlaps with the orthographic projection of the multiple touch transmission lines on the substrate; at least one isolation column among the multiple isolation columns extends along an edge of the first power supply line.
[0020] In some exemplary embodiments, the first border region further includes a bending region, and the wiring setting region is connected to the bending region and is located on a side of the bending region away from the display region.
[0021] In some exemplary embodiments, the display structure layer includes at least a first source / drain metal layer, a passivation layer, a first planarization layer, a second source / drain metal layer, and a second planarization layer disposed on the substrate. The first inorganic film layer includes at least the passivation layer; and the first organic film layer includes at least the second planarization layer and the first planarization layer.
[0022] In some exemplary embodiments, the touch structure layer includes at least: a touch buffer layer, a first touch conductive layer, a touch interlayer insulating layer, a second touch conductive layer, and a touch protection layer, arranged in that order. The second inorganic film layer includes: the touch buffer layer and the touch interlayer insulating layer; and the second organic film layer includes: the touch protection layer.
[0023] On the other hand, this embodiment provides a display device including the display panel as described above.
[0024] On the other hand, this embodiment provides a display panel comprising: a substrate. The substrate includes a display area and a first frame area located on one side of the display area. The first frame area includes at least: a first inorganic film layer, a first organic film layer, a second inorganic film layer, a second organic film layer, and a plurality of touch transmission lines disposed on the substrate; the first organic film layer is located on a side of the first inorganic film layer away from the substrate, the second inorganic film layer is located on a side of the first organic film layer away from the substrate, and the second organic film layer is located on a side of the second inorganic film layer away from the substrate. The second inorganic film layer includes a plurality of first hollow structures, the second organic film layer contacts the first organic film layer via the plurality of first hollow structures, and the distance between the first hollow structures and the touch transmission lines on the orthographic projection of the substrate is greater than zero; or the first organic film layer includes a plurality of second hollow structures, the second inorganic film layer contacts the first inorganic film layer via the plurality of second hollow structures, and the distance between the second hollow structures and the touch transmission lines on the orthographic projection of the substrate is greater than zero.
[0025] In some exemplary embodiments, the plurality of first hollow structures include at least one of the following: a plurality of inorganic holes, a plurality of inorganic grooves.
[0026] In some exemplary embodiments, the plurality of second hollow structures include at least one of the following: a plurality of organic holes, and a plurality of organic grooves.
[0027] Still other aspects will become apparent upon reading and understanding the accompanying drawings and detailed description.
[0028] Summary of the Figures
[0029] The accompanying drawings are used to provide an understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.
[0030] FIG1 is a schematic diagram of a display panel according to at least one embodiment of the present disclosure;
[0031] FIG2 is a partial cross-sectional schematic diagram of a display area of a display panel according to at least one embodiment of the present disclosure;
[0032] FIG3 is a partial plan view of a touch structure layer according to at least one embodiment of the present disclosure;
[0033] FIG4 is a partial schematic diagram of a first frame area according to at least one embodiment of the present disclosure;
[0034] FIG5 is a partial enlarged schematic diagram of area C1 in FIG4 ;
[0035] FIG6 is a schematic partial cross-sectional view along the Q1-Q1' direction in FIG5;
[0036] FIG7 is a schematic partial cross-sectional view along the Q2-Q2' direction in FIG5;
[0037] FIG8 is another partial schematic diagram of the first frame area according to at least one embodiment of the present disclosure;
[0038] FIG9 is a partial enlarged schematic diagram of area C2 in FIG8 ;
[0039] FIG10A is a schematic partial cross-sectional view along the Q3-Q3' direction in FIG9;
[0040] FIG10B is another partial cross-sectional schematic diagram along the Q3-Q3' direction in FIG9;
[0041] FIG11 is another partial schematic diagram of the first border area according to at least one embodiment of the present disclosure;
[0042] FIG12 is a partial enlarged schematic diagram of area C3 in FIG11 ;
[0043] FIG13A is a schematic partial cross-sectional view along the Q4-Q4' direction in FIG12;
[0044] FIG13B is another partial cross-sectional schematic diagram along the Q4-Q4' direction in FIG12;
[0045] FIG14 is another partial schematic diagram of the first frame area according to at least one embodiment of the present disclosure;
[0046] FIG15 is a partial enlarged schematic diagram of area C4 in FIG14 ;
[0047] FIG16 is a schematic partial cross-sectional view along the Q5-Q5' direction in FIG15;
[0048] FIG17 is another partial schematic diagram of the first border area according to at least one embodiment of the present disclosure;
[0049] FIG18 is another partial schematic diagram of the first border area according to at least one embodiment of the present disclosure;
[0050] FIG19 is a partial enlarged schematic diagram of area C5 in FIG18 ;
[0051] FIG20 is a schematic partial cross-sectional view along the Q6-Q6' direction in FIG19;
[0052] FIG21 is another schematic diagram of a display panel according to at least one embodiment of the present disclosure;
[0053] FIG. 22 is a schematic diagram of a display device according to at least one embodiment of the present disclosure.
[0054] Details
[0055] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The embodiments can be implemented in a variety of different forms. A person skilled in the art can easily understand that the method and content can be transformed into other forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other in any manner.
[0056] In the drawings, the size of one or more components, layer thicknesses, or regions may be exaggerated for clarity. Therefore, one embodiment of the present disclosure is not necessarily limited to these dimensions, and the shapes and sizes of one or more components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate idealized examples, and one embodiment of the present disclosure is not limited to the shapes or values shown in the drawings.
[0057] In this specification, ordinal numbers such as "first," "second," and "third" are provided to avoid confusion among constituent elements, and are not intended to limit the number. "Multiple" in this disclosure means two or more.
[0058] In this specification, for convenience, words and phrases indicating orientation or positional relationships, such as "middle," "upper," "lower," "front," "back," "vertical," "horizontal," "top," "bottom," "inside," and "outside," are used to illustrate the positional relationships of constituent elements with reference to the accompanying drawings. This is merely for the purpose of facilitating the description of this specification and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present disclosure. The positional relationships of constituent elements may be appropriately changed depending on the orientation of the constituent elements being described. Therefore, the present disclosure is not limited to the words and phrases described in the specification and may be appropriately replaced depending on the circumstances.
[0059] In this specification, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, removable connections, or integral connections; they can refer to mechanical connections or connections; they can refer to direct connections, indirect connections through intermediaries, or internal communication between two components. Those skilled in the art will understand the meaning of these terms in this disclosure based on the circumstances.
[0060] In this specification, "electrically connected" includes components connected together via an element having some electrical function. There are no particular limitations on the "element having some electrical function" as long as it enables transmission of electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.
[0061] In this specification, a transistor refers to a device that includes at least three terminals: a gate, a drain, and a source. A transistor has a channel region between the drain (drain electrode terminal, drain region, or drain electrode) and the source (source electrode terminal, source region, or source electrode), and current can flow through the drain, channel region, and source. In this specification, the channel region refers to the region through which current primarily flows.
[0062] In this specification, the first electrode can be referred to as the drain and the second electrode as the source, or vice versa. The functions of "source" and "drain" are sometimes interchanged when using transistors with opposite polarity or when the direction of current changes during circuit operation. Therefore, in this specification, the terms "source" and "drain" can be interchanged. Furthermore, the gate electrode can also be referred to as the control electrode.
[0063] In this specification, "parallel" refers to a state where the angle formed by two straight lines is greater than -10° and less than 10°, and thus also includes a state where the angle is greater than -5° and less than 5°. Furthermore, "perpendicular" refers to a state where the angle formed by two straight lines is greater than 80° and less than 100°, and thus also includes a state where the angle is greater than 85° and less than 95°.
[0064] In this specification, circles, ellipses, triangles, rectangles, trapezoids, pentagons or hexagons are not in the strict sense, but may be approximate circles, approximate ellipses, approximate triangles, approximate rectangles, approximate trapezoids, approximate pentagons or approximate hexagons, etc. There may be some small deformations caused by tolerances, such as chamfers, arc edges and deformations.
[0065] In this disclosure, the terms "approximately" and "substantially" are used without strict boundaries, allowing for process and measurement errors. In this disclosure, "substantially the same" means that the values differ by no more than 10%. In this disclosure, the term "symmetrical" is used without strict boundaries, allowing for approximately symmetric values within the range of process and measurement errors.
[0066] In this disclosure, "A extends along direction B" means that A may include a main portion and a secondary portion connected to the main portion, the main portion being a line, line segment, or strip, extending along direction B, and the length of the main portion extending along direction B being greater than the length of the secondary portion extending along other directions. In this disclosure, "A extends along direction B" means "the main portion of A extends along direction B." In this disclosure, "A and B are an integral structure" means that A and B are interconnected and integrally formed.
[0067] In some implementations, the display panel may be integrated with a touch structure. The display panel may include: a liquid crystal display (LCD) substrate, or an organic light emitting diode (OLED) display substrate, or a plasma display device (PDP) display substrate, or an electrophoretic display (EPD) display substrate. For example, the display panel may include an OLED display substrate and a touch structure. The touch structure may be provided on the encapsulation layer of the display substrate to form a touch structure on thin film encapsulation (Touch on Thin Film Encapsulation, referred to as Touch on TFE) structure. The display structure and the touch structure are integrated together, which has the advantages of being light, thin, and foldable, and can meet the product requirements of flexible folding, narrow bezels, etc., and is widely used in display fields such as mobile phones and televisions (TVs).
[0068] In some examples, the Touch on TFE structure mainly includes a Flexible Multi-Layer On Cell (FMLOC) structure and a Flexible Single-Layer On Cell (FSLOC) structure. The FMLOC structure is based on the working principle of mutual capacitance detection. Generally, two layers of metal are used to form the drive (Tx) electrode and the sense (Rx) electrode. The touch integrated circuit (IC) realizes touch action by detecting the mutual capacitance between the drive electrode and the sense electrode. The FSLOC structure is based on the working principle of self-capacitance (or voltage) detection. Generally, a single layer of metal is used to form the touch electrode. The touch integrated circuit realizes touch action by detecting the self-capacitance (or voltage) of the touch electrode.
[0069] During their research, the inventors noticed that the adhesion between the film layers of the display panel integrating the display structure and the touch structure was not strong. During the reliability test process (such as the drop test), peeling of the film layer was prone to occur in the lower frame area of the display panel. For example, peeling was prone to occur between the touch structure and the display structure in the lower frame area.
[0070] This embodiment provides a display panel comprising: a substrate, a display structure layer, and a touch structure layer. The substrate comprises a display area and a first frame region located on one side of the display area. The display structure layer comprises at least a first organic film layer and a first inorganic film layer, with the first organic film layer located on the side of the first inorganic film layer facing away from the substrate. The touch structure layer is located on the side of the display structure layer facing away from the substrate and comprises at least a second organic film layer and a second inorganic film layer. The second organic film layer is located on the side of the second inorganic film layer facing away from the display structure layer. In the first frame region, a portion of the second organic film layer contacts the first organic film layer, or a portion of the second inorganic film layer contacts the first inorganic film layer.
[0071] The display panel provided in this embodiment can improve the adhesion effect between the display structure layer and the touch structure layer in the first frame area by setting the second organic film layer in the first frame area to contact the first organic film layer, or the second inorganic film layer to contact the first inorganic film layer, thereby enhancing the strength of the first frame area and preventing the occurrence of film peeling due to impact.
[0072] In some exemplary embodiments, the first border area may include a first signal access area and a wiring arrangement area located on a side of the first signal access area proximal to the display area. The wiring arrangement area may include at least a plurality of touch transmission lines, and the first signal access area may include at least a plurality of touch contact pads. At least one of the plurality of touch transmission lines may be connected to at least one touch contact pad. The second inorganic film layer may include a plurality of first hollow structures in the wiring arrangement area, and the second organic film layer may contact the first organic film layer via the plurality of first hollow structures. At least one first hollow structure may be located on at least one side of the at least one touch transmission line. For example, the plurality of first hollow structures may be located on one side or both sides of the plurality of touch transmission lines; alternatively, the at least one first hollow structure may be located between two adjacent touch transmission lines. In some examples, the plurality of first hollow structures may include at least one of the following: a plurality of inorganic holes or a plurality of inorganic grooves. For example, the plurality of first hollow structures may include a plurality of inorganic holes, or a plurality of inorganic grooves, or a combination of a plurality of inorganic holes and a plurality of inorganic grooves. In this example, the second inorganic film layer within the first hollow structure can be removed, exposing the surface of the first organic film layer away from the substrate, allowing the surface of the second organic film layer closer to the substrate to contact the surface of the first organic film layer away from the substrate. By providing multiple first hollow structures, this example achieves contact between the second organic film layer and the first organic film layer in the first frame area. This improves the adhesion between the display structure layer and the touch structure layer in the first frame area, thereby enhancing the strength of the first frame area and preventing film peeling due to impact.
[0073] In some exemplary embodiments, the first organic film layer may include: a plurality of recessed portions in the wiring setting area, and the plurality of recessed portions may be connected to the plurality of first hollow structures in a one-to-one correspondence. The orthographic projection of the recessed portion on the substrate may cover the orthographic projection of the corresponding first hollow structure on the substrate, and the orthographic projection of the second inorganic film layer on the substrate may partially overlap with the orthographic projection of the recessed portion on the substrate. For example, the plurality of recessed portions may include: a plurality of first recessed portions corresponding to a plurality of inorganic holes; or, the plurality of recessed portions may include: a plurality of second recessed portions corresponding to a plurality of inorganic grooves. The first organic film layer in the recessed portion may be removed so that the minimum distance between the surface of the recessed portion away from the substrate and the substrate may be less than the minimum distance between the surface of the area outside the recessed portion away from the substrate and the substrate. In this example, the second organic film layer may be filled in the recessed portion formed by the first organic film layer and the first hollow structure formed by the second inorganic film layer, thereby forming a Dingmao structure, which may further increase the bonding force between the second organic film layer and the first organic film layer.
[0074] In some exemplary embodiments, the wiring arrangement area may further include: at least one first power supply line. The first power supply line may be located on a side of the multiple touch transmission lines close to the substrate, and the orthographic projection of the first power supply line on the substrate may partially overlap with the orthographic projection of the multiple touch transmission lines on the substrate. At least one of the multiple inorganic grooves may extend along an edge of the first power supply line. In this example, by providing the inorganic groove along the edge of the first power supply line, it is possible to block the extension path of the crack. Furthermore, the inorganic groove can increase the bonding strength between the second organic film layer and the first organic film layer.
[0075] In some exemplary embodiments, the display panel may further include a cutting edge located on one side of the first power supply line, and at least one of the plurality of inorganic grooves may extend along the cutting edge. Providing the inorganic groove along the cutting edge in this example can help prevent cracks from extending toward the center of the first border region. Furthermore, the inorganic groove can enhance the bonding strength between the second organic film layer and the first organic film layer.
[0076] In some exemplary embodiments, the wiring arrangement area may include: a first edge area, a first wiring area, a middle area, a second wiring area, and a second edge area, arranged in sequence along a first direction. Multiple touch transmission lines may be located in the first wiring area and the second wiring area. The wiring arrangement area may be located on one side of the display area along the second direction. The first direction and the second direction may intersect, for example, the first direction may be perpendicular to the second direction. Multiple first hollow structures may be located in at least one of the first edge area, the middle area, and the second edge area. For example, the multiple first hollow structures may be located in the first edge area, or in the second edge area, or in the middle area, or in the first edge area and the middle area, or in the second edge area and the middle area, or in the first edge area, the second edge area, and the middle area. The arrangement of the first hollow structures in this example allows etching of the second inorganic film layer in the area where the first organic film layer remains, thereby achieving contact between the second organic film layer and the first organic film layer, thereby increasing the bonding strength between the two.
[0077] In some exemplary embodiments, the first frame area may include: a first signal access area and a routing arrangement area located on a side of the first signal access area close to the display area. The routing arrangement area may include at least a plurality of touch transmission lines, the first signal access area may include at least a plurality of touch contact pads, and at least one of the plurality of touch transmission lines is connected to at least one touch contact pad. The first organic film layer may include: a plurality of second hollow structures in the routing arrangement area, and the second inorganic film layer may contact the first inorganic film layer through the plurality of second hollow structures. The plurality of second hollow structures may be located on at least one side of the plurality of touch transmission lines. For example, the plurality of second hollow structures may be located on one side of the plurality of touch transmission lines, or may be located on both sides of the plurality of touch transmission lines. In some examples, the plurality of second hollow structures may include at least one of the following: a plurality of organic holes, a plurality of organic grooves. For example, the plurality of second hollow structures may include a plurality of organic holes, or may include a plurality of organic grooves, or may include a plurality of organic holes and a plurality of organic grooves. In this example, the first organic film layer within the second hollow structure can be removed, exposing the surface of the first inorganic film layer away from the substrate, so that the surface of the second inorganic film layer closer to the substrate can contact the surface of the first inorganic film layer away from the substrate. In this example, by providing multiple second hollow structures to achieve contact between the second inorganic film layer and the first inorganic film layer in the first frame area, the adhesion between the display structure layer and the touch structure layer in the first frame area can be improved, thereby enhancing the strength of the first frame area and preventing the film layer from peeling off due to impact.
[0078] In some exemplary embodiments, the display panel may further include: a plurality of spacer pillars located in the wiring arrangement area, wherein the orthographic projection of the second hollow structure on the substrate may overlap the orthographic projection of at least one spacer pillar on the substrate. The spacer pillars are located between the second inorganic film layer and the first inorganic film layer. In some examples, the spacer pillars may be located in the second source / drain metal layer. In this example, by providing the spacer pillars within the second hollow structure, the bonding strength between the second inorganic film layer and the first inorganic film layer can be further enhanced.
[0079] In some exemplary embodiments, the spacer pillars may include: a first metal layer, a second metal layer, and a third metal layer sequentially arranged in a direction away from the substrate; the orthographic projection of the third metal layer on the substrate may overlap the orthographic projections of the second metal layer and the first metal layer on the substrate; and the edge of the third metal layer may protrude beyond the edges of the second metal layer and the first metal layer. In this example, the spacer pillars may form a T-shaped structure in contact with the first inorganic film layer, thereby further increasing the bonding strength between the second inorganic film layer and the first inorganic film layer.
[0080] The solution of this embodiment is illustrated below through multiple examples.
[0081] Figure 1 is a schematic diagram of a display panel of at least one embodiment of the present disclosure. Figure 1 shows a planar schematic diagram of the display panel before the bending process is performed. In some examples, as shown in Figure 1, the display panel may include: a display area AA, and a border area BB surrounding the periphery of the display area AA. For example, the border area BB may include: a first border area B1 located on one side of the display area AA, and border areas located on the other side of the display area AA (for example, including a second border area B2, a third border area B3 and a fourth border area B4). Among them, the first border area B1 may be, for example, the lower border area of the display panel, the second border area B2 may be, for example, the upper border area of the display panel, the third border area B3 may be, for example, the left border area of the display panel, and the fourth border area B4 may be, for example, the right border area of the display panel.
[0082] In some examples, as shown in FIG1 , the display area AA may be a flat area including a plurality of sub-pixels PX constituting a pixel array, and the plurality of sub-pixels PX may be configured to display a dynamic image or a still image. The display area AA may be referred to as an active area. In some examples, the display area AA may be a rectangle. However, this embodiment is not limited thereto. For example, the display area AA may be a circular or elliptical shape, or other shapes. In some examples, the display panel may be a flexible panel, and thus the display panel may be deformable, such as being curled, bent, folded, or rolled up.
[0083] In some examples, as shown in FIG1 , the display area AA may further include: a plurality of gate lines GL and a plurality of data lines DL. The plurality of gate lines GL may extend along a first direction X, and the plurality of data lines DL may extend along a second direction Y. The orthographic projections of the plurality of gate lines GL and the plurality of data lines DL on the substrate may intersect to form a plurality of sub-pixel regions, and a sub-pixel PX may be provided in each sub-pixel region. The plurality of data lines DL may be electrically connected to the plurality of sub-pixels PX, and the plurality of data lines DL may be configured to provide data signals to the plurality of sub-pixels PX. The plurality of gate lines GL may be electrically connected to the plurality of sub-pixels PX, and the plurality of gate lines GL may be configured to provide gate control signals to the plurality of sub-pixels PX. In some examples, the gate control signal may include a scan signal and a light-emitting control signal, or may include a scan signal, or may include a scan signal, a reset control signal, and a light-emitting control signal.
[0084] In some examples, as shown in FIG1 , the first direction X may be an extending direction (e.g., a row direction) of the gate lines GL in the display area AA, and the second direction Y may be an extending direction (e.g., a column direction) of the data lines DL in the display area AA. The first direction X and the second direction Y may intersect each other, for example, may be perpendicular to each other.
[0085] In some examples, a pixel unit in display area AA may include three sub-pixels, where the three sub-pixels are respectively a red sub-pixel, a green sub-pixel, and a blue sub-pixel. However, this embodiment is not limited to this. In some examples, a pixel unit may include four sub-pixels, where the four sub-pixels are respectively a red sub-pixel, a green sub-pixel, a blue sub-pixel, and a white sub-pixel. Alternatively, a pixel unit may include four sub-pixels, where the four sub-pixels may include one red sub-pixel, one blue sub-pixel, and two green sub-pixels.
[0086] In some examples, a sub-pixel may include: a pixel circuit and a light-emitting element electrically connected to the pixel circuit. The pixel circuit may include multiple transistors and at least one capacitor. For example, the pixel circuit may have a 3T1C, 4T1C, 5T1C, 5T2C, 6T1C, 7T1C, or 8T1C structure. In the above circuit structure, T refers to a thin-film transistor, C refers to a capacitor, the number before T represents the number of thin-film transistors in the circuit, and the number before C represents the number of capacitors in the circuit.
[0087] In some examples, the multiple transistors in the pixel circuit can be P-type transistors or N-type transistors. Using the same type of transistors in the pixel circuit can simplify the process flow, reduce the difficulty of manufacturing the display substrate, and improve the product yield. In other examples, the multiple transistors in the pixel circuit can include P-type transistors and N-type transistors.
[0088] In some examples, multiple transistors in the pixel circuit may use low-temperature polysilicon thin-film transistors, or may use oxide thin-film transistors, or may use low-temperature polysilicon thin-film transistors and oxide thin-film transistors. The active layer of the low-temperature polysilicon thin-film transistor uses low-temperature polysilicon (LTPS), and the active layer of the oxide thin-film transistor uses oxide semiconductor (Oxide). Low-temperature polysilicon thin-film transistors have the advantages of high mobility and fast charging, and oxide thin-film transistors have the advantages of low leakage current. Integrating low-temperature polysilicon thin-film transistors and oxide thin-film transistors on a display panel, that is, an LTPS+Oxide (LTPO for short) display panel, can take advantage of the advantages of both, achieve low-frequency driving, reduce power consumption, and improve display quality.
[0089] In some examples, the shape of the light-emitting elements of a sub-pixel can be rectangular, rhombus, pentagonal, or hexagonal. When a pixel unit includes three sub-pixels, the light-emitting elements of the three sub-pixels can be arranged horizontally, vertically, or in a triangular pattern; when a pixel unit includes four sub-pixels, the light-emitting elements of the four sub-pixels can be arranged horizontally, vertically, or in a square pattern. However, this embodiment is not limited to this.
[0090] In some examples, the light-emitting element may be any one of a light-emitting diode (LED), an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QLED), a micro-LED (including mini-LED or micro-LED), etc. For example, the light-emitting element may be an OLED, which may emit red light, green light, blue light, or white light, etc. when driven by its corresponding pixel circuit. The color of the light emitted by the light-emitting element may be determined as needed. In some examples, the light-emitting element may include: an anode, a cathode, and an organic light-emitting layer located between the anode and the cathode. The anode of the light-emitting element may be electrically connected to the corresponding pixel circuit. However, this embodiment is not limited to this.
[0091] FIG2 is a partial cross-sectional schematic diagram of the display area of the display panel of at least one embodiment of the present disclosure. FIG2 is an example of the structure of a sub-pixel in the display area. In this example, the same type of multiple transistors in the pixel circuit is used as an example for explanation. For example, the multiple transistors in the pixel circuit can all use low-temperature polysilicon thin-film transistors or oxide thin-film transistors. In other examples, the multiple transistors in the pixel circuit can use low-temperature polysilicon thin-film transistors and oxide thin-film transistors. In addition, this example is explained by taking the display panel integrating a mutual capacitance touch structure to form an FMLOC structure as an example.
[0092] In some examples, as shown in FIG2 , in a direction perpendicular to the display panel, the display area of the display panel may include: a substrate 10, and a circuit structure layer 20, a light-emitting structure layer 30, an encapsulation structure layer 40, and a touch structure layer 50 sequentially disposed on the substrate 10. The display structure layer may include at least the circuit structure layer 20 and the light-emitting structure layer 30. The circuit structure layer 20 may include at least pixel circuits for multiple sub-pixels, each of which may include multiple transistors and at least one capacitor. The light-emitting structure layer 30 may include at least light-emitting elements for multiple sub-pixels.
[0093] In some examples, FIG2 illustrates a pixel circuit of each sub-pixel including a thin film transistor 21 and a capacitor 22 as an example. In some examples, the circuit structure layer 20 of the display area may include: a semiconductor layer, a first gate metal layer, a second gate metal layer, a first source-drain metal layer, and a second source-drain metal layer provided on the substrate 10. A buffer layer 101 may be provided between the semiconductor layer and the substrate 10, a first gate insulating layer 102 may be provided between the semiconductor layer and the first gate metal layer, a second gate insulating layer 103 may be provided between the first gate metal layer and the second gate metal layer, an interlayer insulating layer 104 may be provided between the second gate metal layer and the first source-drain metal layer, a passivation layer 105 and a first flat layer 106 may be provided between the first source-drain metal layer and the second source-drain metal layer, and a second flat layer 107 may be provided on the side of the second source-drain metal layer away from the substrate 10. The buffer layer 101 can prevent harmful substances in the substrate 10 from invading the interior of the display panel and can also increase the adhesion of the film layer in the display panel to the substrate. In some examples, the buffer layer 101, the first gate insulating layer 102, the second insulating layer 103, the interlayer insulating layer 104, and the passivation layer 105 may be inorganic insulating layers, and the first planar layer 106 and the second planar layer 107 may be organic insulating layers. However, this embodiment is not limited to this. In other examples, a bottom shielding metal layer (BSM) may be provided on the side of the buffer layer close to the substrate, and the bottom shielding metal layer may be configured to at least partially cover the active layer of the thin film transistor of the pixel circuit to prevent external light from affecting the performance of the thin film transistor. In other examples, the passivation layer may be omitted between the first source and drain metal layer and the second source and drain metal layer, and only the first planar layer may be provided between the first source and drain metal layer and the second source and drain metal layer. In other examples, the first planar layer may be omitted between the first source and drain metal layer and only the passivation layer may be provided. In other examples, a third source and drain metal layer may be provided on the side of the second planar layer away from the substrate, and a third planar layer may be provided on the side of the third source and drain metal layer away from the substrate, and the second planar layer and the third planar layer may be organic insulating layers.
[0094] In some examples, as shown in FIG2 , the semiconductor layer in the display area may include at least an active layer 210 of a thin film transistor 21. The active layer 210 of the thin film transistor 21 may include a first region 2101, a second region 2102, and a channel region 2100 located between the first region 2101 and the second region 2102. The first gate metal layer may include at least a gate electrode 213 of the thin film transistor 21 and a first plate 221 of the capacitor 22. The orthographic projection of the gate electrode 213 of the thin film transistor 21 on the substrate 10 may overlap the orthographic projection of the channel region 2100 of the active layer 210 on the substrate 10. The second gate metal layer may include at least a second plate 222 of the capacitor 22. The orthographic projections of the second plate 222 and the first plate 221 of the capacitor 22 on the substrate 10 may at least partially overlap, for example, they may coincide. The first source / drain metal layer may include at least a source electrode 211 and a drain electrode 212 of the thin film transistor 21. The interlayer insulating layer 104 may have multiple vias (e.g., including a first pixel via and a second pixel via) in the display area. The interlayer insulating layer 104, second gate insulating layer 103, and first gate insulating layer 102 within the first pixel via can be removed, exposing at least a portion of the surface of the first region 2101 of the active layer 210. The interlayer insulating layer 104, second gate insulating layer 103, and first gate insulating layer 102 within the second pixel via can be removed, exposing at least a portion of the surface of the second region 2102 of the active layer 210. The source electrode 211 of the thin-film transistor 21 may be electrically connected to the first region 2101 of the active layer 210 through the first pixel via, and the drain electrode 212 may be electrically connected to the second region 2102 of the active layer 210 through the second pixel via. The second source-drain metal layer may include at least a first transfer electrode 231. The first transfer electrode 231 can be electrically connected to the drain 212 of the thin film transistor 21 of the pixel circuit through the third pixel via hole opened in the passivation layer 105 and the first flat layer 106. The first transfer electrode 231 can be electrically connected to the first electrode 301 (for example, an anode) of the light-emitting element through the fourth pixel via hole opened in the second flat layer 107. In this example, the electrical connection between the pixel circuit and the light-emitting element can be achieved through the first transfer electrode 231. In other examples, when the circuit structure layer includes a third source-drain metal layer, the third source-drain metal layer can include at least a second transfer electrode, and the second transfer electrode is electrically connected to the first transfer electrode and the first electrode of the light-emitting element. This embodiment is not limited to this.
[0095] In some examples, the gate lines of the display area may be located in the first gate metal layer, the data lines of the display area may be located in the second source / drain metal layer, and the high-potential power lines of the display area may be located in the second source / drain metal layer. This embodiment is not limited to this. The circuit structure layer of this example may include two source / drain metal layers, which can avoid arranging a large number of traces within a single source / drain metal layer, thereby facilitating the realization of a narrow frame structure. In other examples, the circuit structure layer may include three or more source / drain metal layers.
[0096] In some examples, as shown in FIG2 , the light-emitting structure layer 30 may include a pixel definition layer 304 and multiple light-emitting elements. For example, each light-emitting element may include a stacked first electrode 301, an organic light-emitting layer 302, and a second electrode 303. The first electrode 301 of the light-emitting element may be an anode. The first electrode 301 may be disposed on the second planar layer 107 and electrically connected to the first transfer electrode 231 through a fourth pixel via provided in the second planar layer 107. The pixel definition layer 304 is disposed on the first electrode 301 and the second planar layer 107. The pixel definition layer 304 may have multiple pixel openings, each of which may expose at least a portion of the surface of a corresponding first electrode 301. At least a portion of the organic light-emitting layer 302 may be disposed within a pixel opening and connected to the corresponding first electrode 301. The second electrode 303 may be disposed on the organic light-emitting layer 302 and connected to the organic light-emitting layer 302. Driven by the first electrode 301 and the second electrode 303, the organic light-emitting layer 302 may emit light of a corresponding color. An isolation column layer may be further provided on a side of the pixel definition layer 304 away from the substrate 10 , and the isolation column layer may include a plurality of isolation columns (PS).
[0097] In some examples, the organic light-emitting layer 302 of the light-emitting element may include an emitting layer (EML), and one or more film layers including a hole injection layer (HIL), a hole transport layer (HTL), a hole blocking layer (HBL), an electron blocking layer (EBL), an electron injection layer (EIL), and an electron transport layer (ETL). Under the voltage drive of the first electrode 301 and the second electrode 303, the light-emitting characteristics of the organic material can be used to emit light according to the required grayscale.
[0098] In some examples, the light-emitting layers of light-emitting elements of different colors may be different. For example, a red light-emitting element includes a red light-emitting layer, a green light-emitting element includes a green light-emitting layer, and a blue light-emitting element includes a blue light-emitting layer. In order to reduce the difficulty of the process and improve the yield, the hole injection layer and the hole transport layer on one side of the light-emitting layer may adopt a common layer, and the electron injection layer and the electron transport layer on the other side of the light-emitting layer may adopt a common layer. In some examples, any one or more layers of the hole injection layer, the hole transport layer, the electron injection layer and the electron transport layer can be made by a one-time process (a one-time evaporation process or a one-time inkjet printing process), and isolation is achieved by means of a surface step difference of the formed film layer or by surface treatment. For example, any one or more layers of the hole injection layer, the hole transport layer, the electron injection layer and the electron transport layer corresponding to adjacent sub-pixels can be isolated. In some examples, the organic light-emitting layer can be formed by evaporation using a fine metal mask (FMM) or an open mask (Open Mask), or by inkjet technology.
[0099] In some examples, as shown in FIG2 , the encapsulation structure layer 40 may include a stacked first encapsulation layer 401, a second encapsulation layer 402, and a third encapsulation layer 403. The first encapsulation layer 401 and the third encapsulation layer 403 may be made of inorganic materials, and the second encapsulation layer 402 may be made of organic materials. The second encapsulation layer 402 may be disposed between the first encapsulation layer 401 and the third encapsulation layer 403 to prevent external moisture from entering the light-emitting element. However, this embodiment is not limited to this. For example, the encapsulation structure layer may have a five-layer stacked structure of inorganic / organic / inorganic / organic / inorganic.
[0100] Figure 3 is a partial plan view of a touch structure layer according to at least one embodiment of the present disclosure. In some examples, as shown in Figure 3, the touch structure layer in the display area may include: a plurality of first touch units 530 and a plurality of second touch units 540. The first touch units 530 may be arranged in a linear shape along a first direction X, and the plurality of first touch units 530 may be arranged sequentially along a second direction Y. The second touch units 540 may be arranged in a linear shape along the second direction Y, and the plurality of second touch units 540 may be arranged sequentially along the first direction X. Each first touch unit 530 may include a plurality of first touch electrodes 531 and first connecting portions 532 arranged sequentially along the first direction X. The first touch electrodes 531 and the first connecting portions 532 may be arranged alternately and sequentially connected. Each second touch unit 540 may include a plurality of second touch electrodes 541 arranged sequentially along the second direction Y. The plurality of second touch electrodes 541 may be arranged at intervals, and adjacent second touch electrodes 541 may be connected to each other via second connecting portions 542. In some examples, the film layer where the second connection portion 542 is located may be different from the film layer where the first touch electrode 531 and the second touch electrode 541 are located.
[0101] In some examples, as shown in FIG2 , in a direction perpendicular to the display panel, the touch structure layer 50 in the display area may include: a touch buffer layer (TBL) 501, a first touch conductive layer 511, a touch interlayer insulating layer (TLD) 502, a second touch conductive layer 512, and a touch protection layer (TOC) 503, arranged in sequence. The touch buffer layer 501 and the touch interlayer insulating layer 502 may be inorganic insulating layers, and the touch protection layer 503 may be an organic insulating layer. However, this embodiment is not limited to this. In other examples, the touch buffer layer may be omitted.
[0102] In some examples, as shown in Figures 2 and 3, multiple first touch electrodes 531, multiple second touch electrodes 541, and multiple first connecting portions 532 can be arranged in the same layer on the first touch conductive layer 511 and can be formed through the same patterning process. The first touch electrodes 531 and the first connecting portions 532 can be interconnected as a single unitary structure. The second connecting portions 542 can be arranged in the second touch conductive layer 512 and can be interconnected with adjacent second touch electrodes 221 via vias provided in the touch interlayer insulating layer 502. In other examples, the multiple first touch electrodes 531, multiple second touch electrodes 541, and multiple second connecting portions 542 can be arranged in the same layer on the first touch conductive layer 511. The second touch electrodes 541 and the second connecting portions 542 can be interconnected as a single unitary structure. The first connecting portions 532 can be arranged in the second touch conductive layer 512 and can be interconnected with adjacent first touch electrodes 531 via vias provided in the touch interlayer insulating layer 502. In some examples, the first touch electrode 531 may be a driving (Tx) electrode, and the second touch electrode 541 may be a sensing (Rx) electrode. Alternatively, the first touch electrode 531 may be a sensing (Rx) electrode, and the second touch electrode 541 may be a driving (Tx) electrode. This embodiment is not limited to this.
[0103] In some examples, as shown in FIG3 , the first touch electrode 531 and the second touch electrode 541 may have a rhombus shape, such as a regular rhombus, a horizontally elongated rhombus, or a vertically elongated rhombus. In other examples, the first touch electrode 531 and the second touch electrode 541 may have any one or more of a triangle, a square, a trapezoid, a parallelogram, a pentagon, a hexagon, and other polygonal shapes, which are not limited in the present embodiment.
[0104] In some examples, as shown in FIG3 , the first touch electrodes 531 and the second touch electrodes 541 can be in the form of transparent conductive electrodes. In other examples, the first touch electrodes 531 and the second touch electrodes 541 can be in the form of a metal mesh. The metal mesh can be formed by interweaving multiple metal wires. The metal mesh can include multiple mesh patterns, and the mesh pattern can be a polygon formed by multiple metal wires. The metal mesh-type first touch electrodes 531 and the second touch electrodes 541 have advantages such as low resistance, small thickness, and fast response speed.
[0105] In some examples, as shown in FIG1 , the display structure layers of the third frame area B3 and the fourth frame area B4 of the display panel may each include: a peripheral circuit area, a power line area, a crack dam area, and a cutting area arranged in sequence along a direction away from the display area AA. The peripheral circuit area is connected to the display area AA and may include at least a gate drive circuit (for example, including a plurality of cascaded shift registers). The plurality of shift registers may be electrically connected to the plurality of gate lines GL in the display area AA and may be configured to provide gate control signals to the plurality of gate lines GL. The power line area is connected to the peripheral circuit area and may include at least a low-potential power line. The low-potential power line may extend in a direction parallel to the edge of the display area AA and be connected to the cathode of the light-emitting element of the display area AA. The crack dam area may be connected to the power line area and may include at least a plurality of cracks provided on the composite insulating layer. The cutting area may be connected to the crack dam area and may include at least a cutting groove provided on the composite insulating layer. The cutting groove may be configured so that after all the film layers of the display panel are prepared, the cutting arrangement may be cut along the cutting groove respectively.
[0106] In some examples, as shown in FIG1 , the touch structure layers of the third and fourth border regions B3 and B4 of the display panel may each include: a plurality of touch leads 252 . The plurality of touch leads 252 may be electrically connected to the first touch unit and the second touch unit, respectively. The plurality of touch leads 252 may all be located in the first touch conductive layer, or all be located in the second touch conductive layer; or the plurality of touch leads 252 may be arranged alternately in the first and second touch conductive layers. However, this embodiment is not limited to this.
[0107] In some examples, as shown in FIG1 , the first border region B1 of the display panel may include: a fan-out routing region B11, a bend region B12, a routing region B13, a second signal access region B15, and a first signal access region B14, arranged in a direction away from the display area AA. FIG1 illustrates only a few routing lines within the first border region B1. This embodiment does not limit the number of routing lines in the first border region B1.
[0108] In some examples, as shown in Figure 1, the fan-out routing area B11 can be connected to the display area AA. The fan-out routing area B11 can be provided with at least a first power fan-out line, a second power fan-out line, a plurality of display fan-out lines, and a plurality of touch lead-out lines 252. The second power fan-out line can be configured to connect a high-potential power line in the display area AA, and the first power fan-out line can be configured to connect a low-potential power line in the third frame area B13 and the fourth frame area B14. The plurality of display fan-out lines can include at least: a plurality of data fan-out lines, a plurality of drive fan-out lines (not shown). The plurality of data fan-out lines can be electrically connected to the plurality of data lines DL in the display area AA. For example, the plurality of data fan-out lines and the plurality of data lines DL can be electrically connected in a one-to-one correspondence. The plurality of data fan-out lines can extend from the fan-out routing area B11 to the bending area B12 in a fan-out routing manner. Multiple drive fan-out lines can extend from the third frame area B3 and the fourth frame area B4 to the fan-out routing area B11. The multiple drive fan-out lines can be electrically connected to the gate drive circuit in the third frame area B3 and the fourth frame area B4. The multiple drive fan-out lines can be configured to provide control signals to the gate drive circuit. For example, the control signals can include a start signal, a clock signal, etc. Multiple touch lead lines 252 can extend from the third frame area B3 and the fourth frame area B4 to the fan-out routing area B11 and can be located on the side of the multiple display fan-out lines away from the substrate.
[0109] In some examples, as shown in Figure 1, the bending area B12 is connected between the fan-out routing area B11 and the routing setting area B13, and can be configured so that the routing setting area B13 bends to the back of the display area AA. The bending area B12 can be provided with multiple bending connection lines, for example, it can include multiple data bending connection lines, multiple drive bending connection lines (not shown), multiple touch bending connection lines 253, a first power bending connection line (not shown) and a second power bending connection line (not shown). The first power bending connection line can be electrically connected to the first power fan-out line, and the second power bending connection line can be electrically connected to the second power fan-out line. Multiple data bending connection lines can be electrically connected to multiple data fan-out lines, multiple drive bending connection lines can be electrically connected to multiple drive fan-out lines, and multiple touch bending connection lines 253 are electrically connected to multiple touch lead-out lines 252.
[0110] In some examples, as shown in FIG1 , the plurality of zigzag connection lines may all extend along the second direction Y. In some examples, the plurality of zigzag connection lines may be arranged in the same layer. In some examples, the plurality of zigzag touch connection lines 253 may be located on opposite sides of the plurality of zigzag data connection lines and the plurality of zigzag drive connection lines in the first direction X. This embodiment is not limited thereto.
[0111] In some examples, as shown in FIG1 , the routing area B13 may be provided with multiple signal transmission lines, such as multiple touch transmission lines 251 and multiple data transmission lines. The multiple data transmission lines may be electrically connected to multiple data zigzag connection lines, for example, in a one-to-one correspondence, and may be connected to multiple data fan-out lines via the multiple data zigzag connection lines. The multiple touch transmission lines 251 may be electrically connected to multiple touch zigzag connection lines 253, for example, in a one-to-one correspondence. The multiple touch transmission lines 251 may be connected to multiple touch lead-out lines 252 within the fan-out routing area B11 via the multiple touch zigzag connection lines 253.
[0112] In some examples, as shown in Figure 1, the first border area B1 may include: at least one first signal access area B14 and at least one second signal access area B15. This example is illustrated by taking one first signal access area B14 and one second signal access area B15 as an example. In other examples, the display panel may be a large-size panel, and the display panel may include multiple first signal access areas B14 and multiple second signal access areas B15. The multiple first signal access areas B14 may be arranged in sequence along the first direction X, and the multiple second signal access areas B15 may be arranged in sequence along the first direction X. The first signal access area B14 may be located on the side of the second signal access area B15 away from the display area AA. In other words, the second signal access area B15 may be located on the side of the first signal access area B14 close to the bending area B12 in the second direction Y.
[0113] In some examples, as shown in FIG1 , the second signal access area B15 may also be referred to as a driver chip placement area. The second signal access area B15 may be provided with a plurality of contact pads, which may be configured to be bound and connected to at least one driver chip. The driver chip may be configured to generate a drive signal required to drive the sub-pixels and provide the drive signal to the data lines of the display area. For example, the drive signal may include a data signal that drives the sub-pixels.
[0114] In some examples, as shown in Figure 1, the first signal access area B14 can also be called a circuit binding area. The first signal access area B14 can be provided with a plurality of contact pads (for example, including a plurality of touch contact pads 254). The plurality of contact pads can be arranged in a row along the first direction X, for example. The plurality of contact pads can be configured to be bound and connected to at least one circuit board (for example, a flexible printed circuit (FPC)). For example, the external circuit board can be configured to generate a touch signal provided to the touch structure layer and to receive a touch sensing signal. The plurality of touch transmission lines 251 in the routing setting area B13 can be connected to the plurality of touch contact pads 254. For example, one touch transmission line 251 can be connected to at least one touch contact pad 254.
[0115] Figure 4 is a partial schematic diagram of the first border area of at least one embodiment of the present disclosure. In some examples, as shown in Figure 4, the wiring arrangement area B13 of the first border area B1 may include: first power supply lines 62a and 62b, a second power supply line 61, multiple touch transmission lines, and multiple data transfer lines (not shown). The multiple touch transmission lines can be divided into a first group of touch transmission lines 251a and a second group of touch transmission lines 251b.
[0116] In some examples, as shown in FIG4 , the first power supply lines 62a and 62b may be located on opposite sides of the second power supply line 61 in the first direction X. The second power supply line 61 may be connected to the second power fan-out line in the fan-out routing area B11 via at least three second power bend connection lines. The two ends of the second power supply line 61 may be respectively connected to at least one second power contact pad in the first signal access area B14. The first power supply line 62a may be connected to the first power fan-out line in the fan-out routing area B11 via at least two first power bend connection lines, and the first power supply line 62b may be connected to the first power fan-out line in the fan-out routing area B11 via at least two first power bend connection lines. The second signal access area B15 may be located on the side of the second power supply line 61 away from the bend area B12.
[0117] In some examples, as shown in FIG4 , the first power supply lines 62 a and 62 b can be roughly zigzag-shaped and extend along the second direction Y. The first power supply lines 62 a and 62 b can be designed with unequal widths. The second power supply line 61 can be roughly N-shaped. The touch control transmission line can be roughly zigzag-shaped and extend along the second direction Y.
[0118] In some examples, as shown in FIG4 , the first group of touch transmission lines 251a can be connected to the multiple touch lead-out lines 252 in the fan-out routing area B11 via multiple touch zigzag lines in the zigzag area B12, and the second group of touch transmission lines 251b can be connected to the multiple touch lead-out lines 252 in the fan-out routing area B11 via multiple touch zigzag lines in the zigzag area B12. The multiple touch zigzag lines connected to the first group of touch transmission lines 251a can be located between two first power zigzag lines connected to the first power supply line 62a, and the multiple touch zigzag lines connected to the second group of touch transmission lines 251b can be located between two first power zigzag lines connected to the first power supply line 62b.
[0119] In some examples, as shown in FIG4 , the orthographic projection of the first group of touch transmission lines 251a on the substrate may partially overlap with the orthographic projection of the first power supply line 62a on the substrate, and the orthographic projection of the second group of touch transmission lines 251b on the substrate may partially overlap with the orthographic projection of the first power supply line 62b on the substrate. The first group of touch transmission lines 251a may be located on a side of the first power supply line 62a away from the substrate, and the second group of touch transmission lines 251b may be located on a side of the first power supply line 62a away from the substrate. The orthographic projections of the first group of touch transmission lines 251a and the second group of touch transmission lines 251b on the substrate may not overlap with the orthographic projections of the second power supply line 61 on the substrate.
[0120] In some examples, as shown in FIG4 , the multiple contact pads within the first signal access area B14 may include: multiple first power contact pads, multiple second power contact pads, and multiple touch contact pads (touch contact pads 254 shown in FIG1 ). The two ends of the second power supply line 61 may be respectively connected to at least one second power contact pad, the first power supply line 62a may be connected to at least one first power contact pad, the first power supply line 62b may be connected to at least one first power contact pad, and multiple touch transmission lines may be connected to multiple touch contact pads. Within the first signal access area B14, the first power contact pad may be located on a side of the second power contact pad away from the second signal access area B15, and the touch contact pad may be located on a side of the first power contact pad away from the second power contact pad. The multiple contact pads within the second signal access area B15 may include multiple input contact pads and multiple output contact pads, and the multiple output contact pads may be located on a side of the multiple input contact pads close to the display area. The multiple output contact pads can be connected to the multiple data transmission lines in the routing area B13, and the multiple input contact pads can be connected to the multiple intermediate contact pads in the first signal access area B14 via multiple pin connection lines. The multiple intermediate contact pads in the first signal access area B14 can be located between the multiple second power contact pads in the first direction X.
[0121] In some examples, as shown in Figures 4 and 5, the wiring arrangement area B13 may include: a first edge area B161, a first wiring area B164, a middle area B162, a second wiring area, and a second edge area B163, which are arranged in sequence along the first direction X. The first wiring area B164 may be provided with a first group of touch transmission lines 251a and a first power supply line 62a, and the second wiring area may be provided with a second group of touch adapter lines 251b and a first power supply line 62b. The second power supply line 61 may be located in the middle area B162. The middle area B162 may be located on the side of the second signal access area B15 close to the bending area B12.
[0122] Figure 5 is a partial enlarged schematic diagram of area C1 in Figure 4. Figure 6 is a partial cross-sectional schematic diagram along the Q1-Q1' direction in Figure 5. Figure 7 is a partial cross-sectional schematic diagram along the Q2-Q2' direction in Figure 5.
[0123] In some examples, as shown in Figures 4 to 7, the first routing area B164 may include: a first power supply line 62a and a first group of touch transmission lines 251a sequentially arranged on the substrate 10. The edge of the first routing area B164 in the first direction X may be the edge of the first power supply line 62a in the first direction X. The first edge region B161 may be located on a side of the first power supply line 62a close to the left edge of the display panel, and the middle region B162 may be located on a side of the first power supply line 62a away from the first edge region B161. At least a portion of the second power supply line 61 is located within the middle region B162.
[0124] In some examples, as shown in Figures 5 to 7, the second power supply line 61 may include: a first voltage trace 61-1 and a second voltage trace 61-2 that are interconnected. The second voltage trace 61-2 may be located on a side of the first voltage trace 61-1 away from the substrate 10. The orthographic projection of the second voltage trace 61-2 on the substrate may at least partially overlap with the orthographic projection of the first voltage trace 61-1 on the substrate. For example, the orthographic projection of the second voltage trace 61-2 on the substrate may cover the orthographic projection of the first voltage trace 61-1 on the substrate. For example, the first voltage trace 61-1 may be located in the first source-drain metal layer, and the second voltage trace 61-2 may be located in the second source-drain metal layer. The second voltage trace 61-2 may be connected to the first voltage trace 61-1 through a via or groove provided in the first planar layer 106 and the passivation layer 105. In this example, by providing the second power supply line with a double-layer trace design, the impedance of the second power supply line can be reduced.
[0125] In some examples, as shown in Figures 6 and 7, the first power supply line 62a can include a third voltage trace 62a-1 and a fourth voltage trace 62a-2 that are interconnected. The fourth voltage trace 62a-2 can be located on a side of the third voltage trace 62a-1 that is away from the substrate 10. The orthographic projection of the fourth voltage trace 62a-2 on the substrate can at least partially overlap with the orthographic projection of the third voltage trace 62a-1 on the substrate. For example, the orthographic projection of the fourth voltage trace 62a-2 on the substrate can cover the orthographic projection of the third voltage trace 62a-1 on the substrate. For example, the third voltage trace 62a-1 can be located in the first source / drain metal layer, and the fourth voltage trace 62a-2 can be located in the second source / drain metal layer. The fourth voltage trace 62a-2 can be connected to the third voltage trace 62a-1 through a via or groove defined in the first planarization layer 106 and the passivation layer 105. In this example, by configuring the first power supply line with a double-layer trace design, the impedance of the first power supply line can be reduced.
[0126] In some examples, as shown in Figures 5 to 7, the first group of touch transmission lines 251a may include multiple touch adapter lines. At least one touch transmission line may include: a first touch trace 2511 and a second touch trace 2512, which are interconnected. The second touch trace 2512 may be located on a side of the first touch trace 2511 away from the substrate 10. The orthographic projection of the second touch trace 2512 on the substrate may at least partially overlap with the orthographic projection of the first touch trace 2511 on the substrate. For example, the orthographic projection of the second touch trace 2512 on the substrate may cover the orthographic projection of the first touch trace 2511 on the substrate. For example, the second touch trace 2512 may be located in the second touch conductive layer, and the first touch trace 2511 may be located in the first touch conductive layer. The second touch trace 2512 may be connected to the first touch trace 2511 through a via or groove provided in the touch interlayer insulating layer 502. In this example, a double-layer routing design is used for the touch transmission line, which can help reduce the impedance of the touch transmission line.
[0127] In some examples, as shown in Figures 4 to 7, the first organic film layer of the display structure layer may include a first planar layer 106 and a second planar layer 107, and the first inorganic film layer may include a buffer layer 101, a first gate insulating layer 102, a second gate insulating layer 103, an interlayer insulating layer 104, and a passivation layer 105, sequentially disposed on the substrate 10. The second organic film layer of the touch structure layer may include a touch protection layer 503, and the second inorganic film layer may include a touch buffer layer 501 and a touch interlayer insulating layer 502. However, this embodiment is not limited to this. In other examples, the touch buffer layer may be omitted, and the second inorganic film layer may include a touch interlayer insulating layer. In other examples, the first planar layer may be omitted, and the first organic film layer may include a second planar layer. In other examples, a third planar layer may be disposed on the side of the second planar layer away from the substrate, and the first organic film layer may include a third planar layer, a second planar layer, and a first planar layer.
[0128] In some examples, as shown in Figures 4 to 6, the first edge area B161 may be provided with a first hollow structure 651. For example, the edge shape of the first hollow structure 651 may be substantially the same as the shape of the first edge area B161. The second inorganic film layer (including the touch buffer layer 501 and the touch interlayer insulating layer 502) in the first edge area B161 may be removed to form a first hollow structure 651 that exposes a portion of the surface of the second flat layer 107 away from the substrate 10. The touch protection layer 503 of the first edge area B161 may be in direct contact with the surface of the second flat layer 107 away from the substrate 10 through the first hollow structure 651, thereby improving the adhesion effect of the display structure layer and the touch structure layer. For example, the second inorganic film layer in the first edge area B161 may be completely removed.
[0129] In some examples, as shown in Figures 4, 5 and 7, a first hollow structure 652 can be provided in the middle area B162. For example, the edge shape of the first hollow structure 652 can be substantially the same as the shape of the middle area B162. The second inorganic film layer (including the touch buffer layer 501 and the touch interlayer insulating layer 502) in the first hollow structure 652 can be removed to form a first hollow structure 652 that exposes a portion of the surface of the second flat layer 107 away from the substrate 10. The touch protection layer 503 in the middle area B162 can be in direct contact with the surface of the second flat layer 107 away from the substrate 10 through the first hollow structure 652, thereby improving the adhesion effect of the display structure layer and the touch structure layer. For example, the second inorganic film layer in the middle area B162 can be completely removed. Similarly, a first hollow structure can be formed in the second edge area B163 by removing the second inorganic film layer (including the touch buffer layer 501 and the touch interlayer insulating layer 502), so that the touch protection layer 503 in the second edge area B163 can directly contact the surface of the second flat layer 107 away from the substrate 10 through the first hollow structure.
[0130] In some examples, the second flat layer in the first signal access area B14 and the second signal access area B15 can be removed to ensure connection between the contact pads and the corresponding circuits or signal traces. The first and second flat layers in the bending area B12 can also be removed to improve bending performance by reducing the film thickness in the bending area B12.
[0131] In this example, the second inorganic film layer in the first edge area, the middle area, and the second edge area of the wiring setting area is removed to form a first hollow structure that exposes the first organic film layer, thereby achieving a large-area overlap between the touch protection layer and the second flat layer, thereby improving the adhesion effect between the display structure layer and the touch structure layer. In other examples, the second inorganic film layer in at least two areas of the first edge area, the middle area, and the second edge area can be removed to increase the adhesion between the second organic film layer and the first organic film layer. In other examples, the second inorganic film layer in one area of the first edge area, the middle area, and the second edge area can be removed to increase the adhesion between the second organic film layer and the first organic film layer.
[0132] Figure 8 is another partial schematic diagram of the first border region of at least one embodiment of the present disclosure. Figure 9 is a partial enlarged schematic diagram of region C2 in Figure 8. Figure 10A is a partial cross-sectional schematic diagram along the Q3-Q3' direction in Figure 9. Figure 10B is another partial cross-sectional schematic diagram along the Q3-Q3' direction in Figure 9.
[0133] In some examples, as shown in Figures 8 to 10A, the first power supply line 62b can include a third voltage trace 62b-1 and a fourth voltage trace 62b-2 that are interconnected. The fourth voltage trace 62b-2 can be located on a side of the third voltage trace 62b-1 that is away from the substrate 10. The orthographic projection of the fourth voltage trace 62b-2 on the substrate can at least partially overlap with the orthographic projection of the third voltage trace 62b-1 on the substrate. For example, the orthographic projection of the fourth voltage trace 62b-2 on the substrate can cover the orthographic projection of the third voltage trace 62b-1 on the substrate. For example, the third voltage trace 62b-1 can be located in the first source / drain metal layer, and the fourth voltage trace 62b-2 can be located in the second source / drain metal layer. The fourth voltage trace 62b-2 can be connected to the third voltage trace 62b-1 through a via or groove defined in the first planarization layer 106 and the passivation layer 105. In this example, by employing a double-layer routing design for the first power supply line, the impedance of the first power supply line can be reduced.
[0134] In some examples, as shown in Figures 8 to 10A, the first edge area, the second edge area, and the middle area of the wiring setting area B13 may be provided with multiple first hollow structures. The multiple first hollow structures of this example may include multiple inorganic holes (for example, multiple first inorganic holes V1). The multiple first inorganic holes V1 in the first edge area, the second edge area, and the middle area may be arranged regularly, or may be partially arranged in an array and partially arranged irregularly. In the middle area, the orthographic projection of the multiple first inorganic holes V1 on the substrate may overlap with the orthographic projection of the second power supply line 61 on the substrate. In some examples, as shown in Figure 8, the orthographic projection of the first inorganic hole V1 on the substrate may be a rounded rectangle, a circle, or an ellipse. However, this embodiment is not limited to this.
[0135] In some examples, as shown in FIG10A , the second inorganic film layer (including the touch interlayer insulating layer 502 and the touch buffer layer 501) within the plurality of first inorganic holes V1 can be removed, exposing a portion of the surface of the second planar layer 107 away from the substrate 10. The touch protection layer 503 can directly contact the surface of the second planar layer 107 away from the substrate 10 through the plurality of first inorganic holes V1, thereby increasing adhesion by overlapping with the surface of the second planar layer 107.
[0136] In some examples, as shown in Figures 8 and 9, multiple inorganic holes (e.g., including multiple second inorganic holes V2) can be provided in the second routing area where the touch transmission line 251 and the first power supply line 62b are provided. For example, the multiple second inorganic holes V2 can be located between two adjacent touch transmission lines 251, or can be located on one side of the multiple touch transmission lines 251. The orthographic projections of the multiple second inorganic holes V2 on the substrate may not overlap with the orthographic projections of the touch transmission line 251 on the substrate, but may overlap with the orthographic projections of the first power supply line 62b on the substrate. The second inorganic film layer (including the touch interlayer insulating layer 502 and the touch buffer layer 501) within the multiple second inorganic holes V2 can be removed, exposing a portion of the surface of the second planar layer 107 away from the substrate 10. The touch protection layer 503 can directly contact the surface of the second planar layer 107 away from the substrate 10 through the multiple second inorganic holes V2, thereby increasing the adhesion between the touch protection layer 503 and the second planar layer 107. The structure of the first routing area can refer to the description of the structure of the second routing area, so it will not be repeated here.
[0137] In some examples, as shown in FIG10B , the first organic film layer (including the second flat layer 107 and the first flat layer 106) in the first edge region, the second edge region, and the middle region of the wiring arrangement area B13 may be provided with multiple recesses (e.g., including multiple first recesses 653). The multiple first recesses 653 and the multiple first inorganic holes V1 may correspond one to one, and each first recess 653 may be connected to the corresponding first inorganic hole V1. The minimum distance between the surface of the first recess 653 away from the substrate 10 and the substrate 10 may be less than the minimum distance between the surface of the first organic film layer away from the substrate 10 and the substrate 10 other than the first recess 653. The orthographic projection of the first recess 653 on the substrate 10 may overlap the orthographic projection of the corresponding first inorganic hole V1 on the substrate 10. The orthographic projection of the second inorganic film layer on the substrate 10 and the orthographic projection of the first recess 653 on the substrate may partially overlap.
[0138] In some examples, when etching the touch interlayer insulating layer 502, by increasing the etching depth, a portion of the second planar layer 107 (or the second planar layer 107 and a portion of the first planar layer 106) can be overetched, thereby forming a first inorganic hole V1 in the second inorganic film layer and simultaneously forming a first recess 653 in the first organic film layer that is connected to the first inorganic hole. The second organic film layer (including the touch protection layer 503) can fill the first recess 653 and the first inorganic hole V1, forming a Dingmao structure, thereby further increasing the bonding strength between the second organic film layer and the first organic film layer.
[0139] The rest of the description about the display panel of this example can refer to the description of the aforementioned embodiment, so it will not be repeated here.
[0140] Figure 11 is another partial schematic diagram of the first border region of at least one embodiment of the present disclosure. Figure 12 is a partial enlarged schematic diagram of region C3 in Figure 11. Figure 13A is a partial cross-sectional schematic diagram along the Q4-Q4' direction in Figure 12. Figure 13B is another partial cross-sectional schematic diagram along the Q4-Q4' direction in Figure 12.
[0141] In some examples, as shown in Figures 11 to 13A, the wiring setting area B13 can be provided with a plurality of first hollow structures. The plurality of first hollow structures in this example can include a plurality of inorganic grooves (for example, a plurality of first inorganic grooves K1, a plurality of second inorganic grooves K2, a plurality of third inorganic grooves K3, and a plurality of fourth inorganic grooves K4). The plurality of first inorganic grooves K1, the plurality of second inorganic grooves K2, and the plurality of fourth inorganic grooves K4 can be located in the first edge area and the second edge area, and the plurality of third inorganic grooves K3 can be located in the middle area. The plurality of first inorganic grooves K1 can extend along the edge of the first power supply line. For example, the plurality of first inorganic grooves K1 in the second edge area can extend along the edge of the first power supply line 62b close to the right edge of the display panel. The plurality of second inorganic grooves K2 can extend along the second direction Y and be regularly arranged in the first edge area and the second edge area along the first direction X. The plurality of fourth inorganic grooves K4 can extend along the cutting edge on one side of the wiring setting area. For example, the fourth inorganic groove K4 in the first edge area can extend along the cutting edge B32 on the left side of the wiring setting area B13 of the display panel, and the fourth inorganic groove K4 in the second edge area can extend along the cutting edge B31 on the right side of the wiring setting area B14 of the display panel. In the first edge area and the second edge area, the plurality of second inorganic grooves K2 can be surrounded by the plurality of first inorganic grooves K1 and the plurality of fourth inorganic grooves K4. The plurality of third inorganic grooves K3 in the middle area can extend along the edge of the first power supply line close to the second power supply line 61. For example, the plurality of third inorganic grooves K3 in the middle area shown in Figure 12 can extend along the edge of the first power supply line 62a close to the second power supply line 61. However, this embodiment is not limited to this.
[0142] In some examples, the orthographic projections of the first inorganic trench K1, the third inorganic trench K3, and the fourth inorganic trench K4 on the substrate may be approximately in the shape of a broken line extending along the second direction Y, and the orthographic projection of the second inorganic trench K2 on the substrate may be approximately in the shape of a straight line extending along the second direction Y. However, this embodiment is not limited to this. For example, the second inorganic trench may extend along the first direction; or the second inorganic trench may extend along a third direction that intersects both the first and second directions.
[0143] In some examples, as shown in FIG13A , the second inorganic film layer (including the touch interlayer insulating layer 502 and the touch buffer layer 501) within the plurality of first inorganic grooves K1 can be removed, exposing a portion of the surface of the second flat layer 107. The touch protection layer 503 can directly contact the surface of the second flat layer 107 away from the substrate 10 through the plurality of first inorganic grooves K1, thereby increasing the adhesion between the touch protection layer 503 and the second flat layer 107. The structures of the second inorganic grooves K2, the third inorganic grooves K3, and the fourth inorganic grooves K4 are similar to those of the first inorganic grooves K1, so they are not described here. In this example, by providing a plurality of inorganic grooves in the first edge region and the second edge region, cracks can be isolated from extending from the edge of the display panel to the middle.
[0144] In some examples, as shown in FIG13B , the first organic film layer (including the second planar layer 107 and the first planar layer 106) in the first edge region, the second edge region, and the middle region of the wiring arrangement area B13 may be provided with multiple recesses (e.g., including multiple second recesses 654). The multiple second recesses 654 may correspond to multiple inorganic trenches (including multiple first inorganic trenches K1, multiple second inorganic trenches K2, multiple third inorganic trenches K3, and multiple fourth inorganic trenches K4). Each second recess 654 may be connected to a corresponding inorganic trench. The minimum distance between the surface of the second recess 654 facing away from the substrate 10 and the substrate 10 may be less than the minimum distance between the surface of the first organic film layer facing away from the substrate 10 and the substrate 10 excluding the second recess 654. The orthographic projection of the second recess 654 on the substrate 10 may overlap the orthographic projection of the corresponding inorganic trench (e.g., the first inorganic trench K1, the second inorganic trench K2, the third inorganic trench K3, or the fourth inorganic trench K4) on the substrate 10. The orthographic projection of the second inorganic film layer on the substrate 10 and the orthographic projection of the second recessed portion 654 on the substrate may partially overlap.
[0145] In some examples, when etching the touch interlayer insulating layer 502, by increasing the etching amount, a portion of the second flat layer 107 (or the second flat layer 107 and a portion of the first flat layer 106) can be overetched, thereby forming a plurality of inorganic grooves in the second inorganic film layer, and at the same time forming a second recessed portion 654 in communication with the inorganic grooves in the first organic film layer. The second organic film layer (including the touch protection layer 503) can fill the second recessed portion 654 and the inorganic grooves to form a Dingmao structure, thereby further increasing the bonding force between the second organic film layer and the first organic film layer. The remaining description of the display panel of this example can refer to the description of the aforementioned embodiment, so it will not be repeated here.
[0146] In other examples, the middle region may further include at least one of the following: a plurality of fifth inorganic grooves extending along the first direction, a plurality of sixth inorganic grooves extending along the second direction, and a plurality of seventh inorganic grooves extending along a third direction intersecting the first and second directions. The structures of the fifth, sixth, and seventh inorganic grooves can refer to the structure of the first inorganic groove and are not further described here.
[0147] In other examples, the middle area of the wiring setting area can be provided with an inorganic groove as shown in Figure 13A, and the first edge area and the second edge area can be provided with an inorganic groove and a recessed portion as shown in Figure 13B. In other examples, the middle area of the wiring setting area can be provided with multiple inorganic holes as shown in Figure 10A, and the first edge area and the second edge area can be provided with an inorganic groove and a recessed portion as shown in Figure 13. In other examples, the second inorganic film layer in the middle area of the wiring setting area can be removed, and the first edge area and the second edge area can be provided with multiple inorganic holes and multiple recessed portions, or multiple inorganic grooves and multiple recessed portions can be provided. However, this embodiment is not limited to this.
[0148] Figure 14 is another partial schematic diagram of the first border region of at least one embodiment of the present disclosure. Figure 15 is a partial enlarged schematic diagram of region C4 in Figure 14. Figure 16 is a partial cross-sectional schematic diagram along the Q5-Q5' direction in Figure 15.
[0149] In some examples, as shown in Figures 14 to 16, a plurality of second hollow structures may be provided in the wiring setting area B13. The plurality of second hollow structures in this example may include a plurality of organic grooves (for example, a plurality of first organic grooves K11, a plurality of second organic grooves K12, a plurality of third organic grooves K13, and a plurality of fourth organic grooves K14). The plurality of first organic grooves K11 and the plurality of second organic grooves K12 may be located in the first edge area and the second edge area, and the plurality of third organic grooves K13 and the plurality of fourth organic grooves K14 may be located in the middle area. The plurality of first organic grooves K11 may extend along the edge of the first power supply line. For example, the plurality of first organic grooves K11 in the second edge area may extend along the edge of the first power supply line 62b close to the right edge of the display panel. The plurality of second organic grooves K12 may extend along the second direction Y and be regularly arranged in the first edge area and the second edge area along the first direction X. The plurality of third organic trenches K13 in the middle region may extend along an edge of the first power supply line. For example, the plurality of third organic trenches K13 in the middle region may extend along an edge of the first power supply line 62 a close to the second power supply line 61 , and the plurality of fourth organic trenches K14 may extend along the second direction Y. The orthographic projections of the plurality of organic trenches in the middle region on the substrate may not overlap with the orthographic projections of the second power supply line 61 on the substrate.
[0150] In some examples, the orthographic projections of the first organic trench K11 and the third organic trench K13 onto the substrate may be approximately zigzag lines extending along the second direction Y, and the orthographic projections of the second organic trench K12 and the fourth organic trench K14 onto the substrate may be approximately straight lines extending along the second direction Y. However, this embodiment is not limited to this. For example, the second organic trench may extend along the first direction; or the fourth organic trench may extend along the first direction; or the second and fourth organic trenches may extend along the first direction; or at least one of the second and fourth organic trenches may extend along a third direction intersecting both the first and second directions.
[0151] In some examples, as shown in Figure 16, the first organic film layer (including the second flat layer 107 and the first flat layer 106) in the multiple organic grooves can be removed to expose a portion of the surface of the first inorganic film layer, for example, exposing a portion of the surface of the passivation layer 105 away from the substrate 10. The second inorganic film layer (including the touch buffer layer 501 and the touch interlayer insulating layer 502) can be in direct contact with the surface of the first inorganic film layer away from the substrate through the organic groove, thereby increasing the adhesion between the second inorganic film layer and the first inorganic film layer. For example, the touch buffer layer 501 can be in direct contact with the portion of the surface of the passivation layer 105 away from the substrate 10 through the organic groove, and the touch interlayer insulating layer 502 can be filled in multiple organic grooves. However, this embodiment is not limited to this. In other examples, the organic groove can expose a portion of the surface of the passivation layer 105 and the interlayer insulating layer 104, so that the second inorganic film layer can be in direct contact with the passivation layer 105 and the interlayer insulating layer 104.
[0152] In other examples, the organic trenches in the first and second edge regions may further include a plurality of fifth organic trenches extending along the cut edges of the display panel's wiring arrangement region. The arrangement of the organic trenches can refer to the arrangement of the inorganic trenches in the aforementioned embodiment, and will not be further described here.
[0153] The rest of the description about the display panel of this example can refer to the description of the aforementioned embodiment, so it will not be repeated here.
[0154] Figure 17 is another partial schematic diagram of the first border area of at least one embodiment of the present disclosure. In some examples, as shown in Figure 17, a plurality of second hollow structures may be provided in the first edge area, the second edge area and the middle area of the wiring setting area B13. The plurality of second hollow structures of this example may include a plurality of organic holes (for example, a plurality of first organic holes V11). The plurality of first organic holes V11 in the first edge area, the second edge area and the middle area may be arranged regularly, or may be partially arranged in an array and partially arranged irregularly. In the middle area, the orthographic projection of the plurality of first organic holes V11 on the substrate may not overlap with the orthographic projection of the second power supply line 61 on the substrate. In some examples, the orthographic projection of the first organic hole V11 on the substrate may be a rounded rectangle, a circle, or an ellipse. However, this embodiment is not limited to this.
[0155] In some examples, the first organic film layer (including the second planarizing layer 107 and the first planarizing layer 106) within the plurality of first organic holes V11 can be removed, exposing a portion of the surface of the passivation layer away from the substrate. The second inorganic film layer can then directly contact the surface of the first inorganic film layer away from the substrate through the plurality of first organic holes V11, thereby increasing the adhesion between the second inorganic film layer and the first inorganic film layer. The cross-sectional structure of the organic holes can refer to the cross-sectional structure of the organic trench shown in Figure 16, and therefore will not be further described here.
[0156] In other examples, a plurality of organic holes may be provided in the middle area of the wiring setting area, and a plurality of organic grooves may be provided in the first edge area and the second edge area. In other examples, a plurality of organic grooves may be provided in the middle area of the wiring setting area, and a plurality of organic holes may be provided in the first edge area and the second edge area. In other examples, a plurality of inorganic grooves or a plurality of inorganic holes may be provided in the middle area of the wiring setting area, and a plurality of organic holes or a plurality of organic grooves may be provided in the first edge area and the second edge area. In other examples, a plurality of organic holes or a plurality of organic grooves may be provided in the middle area of the wiring setting area, and a plurality of inorganic holes or a plurality of inorganic grooves may be provided in the first edge area and the second edge area.
[0157] The rest of the description about the display panel of this example can refer to the description of the aforementioned embodiment, so it will not be repeated here.
[0158] Figure 18 is another partial schematic diagram of the first border region of at least one embodiment of the present disclosure. Figure 19 is a partial enlarged schematic diagram of region C5 in Figure 18. Figure 20 is a partial cross-sectional schematic diagram along the Q6-Q6' direction in Figure 19.
[0159] In some examples, as shown in Figures 18 to 20, the wiring arrangement area B13 can be provided with multiple second hollow structures and multiple isolation pillars (for example, including multiple first isolation pillars 661, multiple second isolation pillars 662, multiple third isolation pillars 663, and multiple fourth isolation pillars 664). The multiple second hollow structures in this example can include multiple organic grooves, for example, the organic grooves shown in Figure 14.
[0160] In some examples, multiple isolation columns may be located in multiple organic grooves. For example, one isolation column may be provided in each organic groove. For example, the first isolation column 661 may be located in the first organic groove, the second isolation column 662 may be located in the second organic groove, the third isolation column 663 may be located in the third organic groove, and the fourth isolation column 664 may be located in the fourth organic groove. The orthographic projections of the first isolation column 661 and the third isolation column 663 on the substrate may be roughly in the shape of a broken line, and the orthographic projections of the second isolation column 662 and the fourth isolation column 664 on the substrate may be roughly in the shape of a strip extending along the second direction Y. However, this embodiment is not limited to this. In other examples, multiple isolation columns arranged along the extension direction of the organic groove may be provided in at least one organic groove; or, multiple isolation columns arranged in a direction cross-to-extension direction of the organic groove may be provided in at least one organic groove.
[0161] In some examples, as shown in FIG20 , the first isolation column 661 is used as an example for illustration. The first isolation column 661 can be located in the second source-drain metal layer and can be in the same layer structure as the first power supply line 62 b - 2. The second source-drain metal layer can adopt a three-layer metal stacking structure. For example, the first isolation column 661 can include a first metal layer 6611, a second metal layer 6612, and a third metal layer 6613 arranged in sequence along a direction away from the substrate 10, and the second metal layer 6612 is located between the first metal layer 6611 and the third metal layer 6613, and is in direct contact with the first metal layer 6611 and the third metal layer 6613. The materials of the first metal layer 6611 and the third metal layer 6613 can be the same, such as titanium (Ti), and the material of the second metal layer 6612 can be aluminum (Al).
[0162] In some examples, as shown in FIG20 , the cross-sectional shape of the first isolation column 661 can be approximately T-shaped. The cross-sectional shape of the first isolation column 661 refers to a plane perpendicular to the plane of the substrate and perpendicular to the extension direction of the first isolation column 661. The orthographic projection of the third metal layer 6613 of the first isolation column 661 on the substrate can cover the orthographic projections of the second metal layer 6612 and the first metal layer 6611 on the substrate. The edge of the third metal layer 6613 can protrude from the edges of the second metal layer 6612 and the first metal layer 6611. The second inorganic film layer (including the touch buffer layer 501 and the touch interlayer insulating layer 502) can cover the edge portion of the third metal layer 6613 protruding from the second metal layer 6612, the edges of the second metal layer 6612 and the first metal layer 6611, and the second inorganic film layer can also contact the surface of the passivation layer 105 of the first inorganic film layer away from the substrate. This example can form a T-shaped structure between the second inorganic film layer, the spacer, and the first inorganic film layer, which can increase the adhesion between the first and second inorganic film layers. The structures of the second to fourth spacers can refer to the structure of the first spacer, so they will not be repeated here.
[0163] In other examples, the cross-sectional shape of the isolation column can be roughly rectangular or trapezoidal, for example, the orthographic projection of the first metal layer on the substrate can cover the orthographic projection of the second metal layer on the substrate, and the orthographic projection of the second metal layer on the substrate can cover the orthographic projection of the third metal layer on the substrate.
[0164] In other examples, the cross-sectional shape of the isolation column can be roughly an inverted trapezoid, for example, the orthographic projection of the third metal layer on the substrate can cover the orthographic projection of the second metal layer on the substrate, and the orthographic projection of the second metal layer on the substrate can cover the orthographic projection of the first metal layer on the substrate.
[0165] The rest of the description about the display panel of this example can refer to the description of the aforementioned embodiment, so it will not be repeated here.
[0166] The above embodiments may be combined with one another. In some examples, a plurality of inorganic trenches or inorganic holes may be provided in the middle region of the wiring arrangement area, and a plurality of inorganic trenches and a plurality of isolation pillars may be provided in the first and second edge regions. In other examples, the second inorganic film layer in the middle region of the wiring arrangement area may be removed, and a plurality of inorganic trenches and a plurality of isolation pillars may be provided in the first and second edge regions. However, this embodiment is not limited to this.
[0167] Figure 21 is another schematic diagram of the display panel of at least one embodiment of the present disclosure. In some examples, as shown in Figure 21, the first border area B1 of the display panel may include: a fan-out routing area B11, a routing setting area B13, a second signal access area B15, and a first signal access area B14 arranged in a direction away from the display area AA. The fan-out routing area B11 of this example is connected to the routing setting area B13. The touch lead line 252 located in the fan-out routing area B11 can be connected to the touch transmission line 251 in the routing setting area B13, and the touch transmission line 251 can be connected to the touch contact pad 254 in the first signal access area B14. The structure of the routing setting area of this example can refer to the description of the structure of the routing setting area in the aforementioned embodiment, so it will not be repeated here.
[0168] This embodiment also provides a display panel, comprising: a substrate. The substrate includes a display area and a first frame area located on one side of the display area. The first frame area includes at least: a first inorganic film layer, a first organic film layer, a second inorganic film layer, a second organic film layer, and a plurality of touch transmission lines disposed on the substrate; the first organic film layer is located on a side of the first inorganic film layer away from the substrate, the second inorganic film layer is located on a side of the first organic film layer away from the substrate, and the second organic film layer is located on a side of the second inorganic film layer away from the substrate. The second inorganic film layer includes a plurality of first hollow structures, the second organic film layer is in contact with the first organic film layer via the plurality of first hollow structures, and the distance between the first hollow structures and the orthographic projection of the touch transmission lines on the substrate is greater than 0; in other words, the first hollow structures and the orthographic projection of the touch transmission lines on the substrate do not overlap. Alternatively, the first organic film layer includes multiple second hollow structures, the second inorganic film layer contacts the first inorganic film layer through the multiple second hollow structures, and the distance between the second hollow structures and the orthographic projection of the touch transmission line on the substrate is greater than 0; in other words, the second hollow structures and the orthographic projection of the touch transmission line on the substrate do not overlap.
[0169] The display panel provided in this embodiment, by setting a first hollow structure on the second inorganic film layer, or setting a second hollow structure on the first organic film layer, makes the second organic film layer contact with the first organic film layer, or the second inorganic film layer and the first inorganic film layer structure, thereby enhancing the adhesion effect between the film layers in the first frame area, enhancing the strength of the first frame area, and preventing the occurrence of film peeling caused by impact.
[0170] In some examples, the plurality of first hollow structures may include at least one of the following: a plurality of inorganic holes, a plurality of inorganic grooves.
[0171] In some examples, the plurality of second hollow structures may include at least one of the following: a plurality of organic holes, a plurality of organic grooves.
[0172] The relevant structure of the display panel of this embodiment can be referred to the description of the aforementioned embodiment, and thus will not be described again here.
[0173] Figure 22 is a schematic diagram of a display device according to at least one embodiment of the present disclosure. As shown in Figure 22, this embodiment provides a display device 91 comprising a display panel 910 according to the aforementioned embodiment. In some examples, display panel 910 may be an OLED display panel, such as an OLED display panel with an integrated touchscreen structure. Display device 91 may be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system, or may be a product or component with both touchscreen and display functions.
[0174] The drawings in this disclosure only relate to the structures involved in this disclosure, and other structures can refer to the general design. In the absence of conflict, the embodiments of the present disclosure, that is, the features in the embodiments, can be combined with each other to obtain new embodiments. It should be noted that the above-mentioned embodiments or implementation methods are merely exemplary and not restrictive. Therefore, the present disclosure is not limited to the contents shown and described in detail herein. Various modifications, replacements or omissions can be made to the form and details of the implementation without departing from the scope of this disclosure.
Claims
1. A display panel, comprising: A substrate, comprising a display area and a first frame area located on one side of the display area; A display structure layer, located on the substrate, comprising at least a first organic film layer and a first inorganic film layer, wherein the first organic film layer is located on a side of the first inorganic film layer away from the substrate; A touch structure layer, located on a side of the display structure layer away from the substrate, comprising at least a second organic film layer and a second inorganic film layer, wherein the second organic film layer is located on a side of the second inorganic film layer away from the display structure layer; In the first frame region, a portion of the second organic film layer contacts the first organic film layer, or a portion of the second inorganic film layer contacts the first inorganic film layer.
2. The display panel according to claim 1, wherein: The first frame area includes: a first signal access area and a wiring setting area located on a side of the first signal access area close to the display area; The wiring setting area includes at least a plurality of touch transmission lines, the first signal access area includes at least a plurality of touch contact pads, and at least one touch transmission line among the plurality of touch transmission lines is connected to at least one touch contact pad among the plurality of touch contact pads; The second inorganic film layer comprises, in the wiring arrangement area: a plurality of first hollow structures, and the second organic film layer is in contact with the first organic film layer through the plurality of first hollow structures; At least one first hollow structure among the plurality of first hollow structures is located at at least one side of at least one touch transmission line among the plurality of touch transmission lines.
3. The display panel according to claim 2, wherein: The plurality of first hollow structures include at least one of the following: a plurality of inorganic holes, and a plurality of inorganic grooves.
4. The display panel according to claim 3, wherein: The first organic film layer includes in the wiring setting area: a plurality of recessed portions, the plurality of recessed portions are connected with the plurality of first hollow structures in a one-to-one correspondence, the orthographic projection of the recessed portion on the substrate covers the orthographic projection of the corresponding first hollowed structure on the substrate, and the orthographic projection of the second inorganic film layer on the substrate partially overlaps with the orthographic projection of the recessed portion on the substrate.
5. The display panel according to claim 3, wherein: The routing setting area also includes: at least one first power supply line, the first power supply line is located on a side of the multiple touch transmission lines close to the substrate, the orthographic projection of the first power supply line on the substrate overlaps with the orthographic projection of the multiple touch transmission lines on the substrate; at least one inorganic groove among the multiple inorganic grooves extends along the edge of the first power supply line.
6. The display panel according to claim 5, further comprising: A cutting edge is located on one side of the first power supply line, and at least one of the plurality of inorganic grooves extends along the cutting edge.
7. The display panel according to claim 2, wherein: The wiring arrangement area includes: a first edge area, a first wiring area, a middle area, a second wiring area and a second edge area arranged in sequence along a first direction; the plurality of touch transmission lines are located in the first wiring area and the second wiring area; the wiring arrangement area is located at one side of the display area along the second direction, and the first direction intersects with the second direction; The plurality of first hollow structures are located in at least one of the first edge region, the middle region, and the second edge region.
8. The display panel according to claim 1, wherein: The first frame area includes: a first signal access area and a wiring setting area located on a side of the first signal access area close to the display area; The wiring setting area includes at least a plurality of touch transmission lines, and the first signal access area includes at least a plurality of touch A touch contact pad, wherein at least one touch transmission line among the plurality of touch transmission lines is connected to at least one touch contact pad among the plurality of touch contact pads; The first organic film layer includes in the wiring setting area: a plurality of second hollow structures, and the second inorganic film layer is in contact with the first inorganic film layer through the plurality of second hollow structures; the plurality of second hollow structures are located on at least one side of the plurality of touch transmission lines.
9. The display panel according to claim 8, wherein: The plurality of second hollow structures include at least one of the following: a plurality of organic holes, and a plurality of organic grooves.
10. The display panel according to claim 8, further comprising: A plurality of isolation pillars located in the wiring setting area, wherein the orthographic projection of the second hollow structure on the substrate covers the orthographic projection of at least one isolation pillar on the substrate; The isolation column is located between the second inorganic film layer and the first inorganic film layer.
11. The display panel according to claim 10, wherein: The display structure layer at least includes: a first source-drain metal layer and a second source-drain metal layer sequentially arranged on the substrate, and the isolation column is located in the second source-drain metal layer.
12. The display panel according to claim 10, wherein: The isolation column includes: a first metal layer, a second metal layer and a third metal layer arranged in sequence along a direction away from the substrate, the orthographic projection of the third metal layer on the substrate covers the orthographic projections of the second metal layer and the first metal layer on the substrate, and the edge of the third metal layer protrudes from the edge of the second metal layer and the first metal layer.
13. The display panel according to claim 10, wherein: The routing setting area also includes: at least one first power supply line, the first power supply line is located on a side of the multiple touch transmission lines close to the substrate, the orthographic projection of the first power supply line on the substrate overlaps with the orthographic projection of the multiple touch transmission lines on the substrate; at least one isolation column among the multiple isolation columns extends along the edge of the first power supply line.
14. The display panel according to any one of claims 2 to 13, wherein: The first frame area further includes: a bending area, the wiring setting area is connected to the bending area, and is located on a side of the bending area away from the display area.
15. The display panel according to claim 1, wherein: The display structure layer at least includes: a first source-drain metal layer, a passivation layer, a first planarization layer, a second source-drain metal layer, and a second planarization layer disposed on the substrate; The first inorganic film layer at least includes: the passivation layer; the first organic film layer at least includes: the second planarization layer and the first planarization layer.
16. The display panel according to claim 1, wherein: The touch structure layer at least includes: a touch buffer layer, a first touch conductive layer, a touch interlayer insulating layer, a second touch conductive layer and a touch protection layer which are arranged in sequence; The second inorganic film layer includes: the touch buffer layer and the touch interlayer insulating layer; the second organic film layer includes: the touch protection layer.
17. A display device comprising the display panel according to any one of claims 1 to 16.
18. A display panel, comprising: The substrate comprises a display area and a first frame area located on one side of the display area. The first frame region at least includes: a first inorganic film layer, a first organic film layer, a second inorganic film layer, a second organic film layer and a plurality of touch transmission lines arranged on the substrate; the first organic film layer is located on a side of the first inorganic film layer away from the substrate, the second inorganic film layer is located on a side of the first organic film layer away from the substrate, and the second organic film layer is located on a side of the second inorganic film layer away from the substrate; The second inorganic film layer includes a plurality of first hollow structures, the second organic film layer is in contact with the first organic film layer through the plurality of first hollow structures, and the first hollow structures and the touch transmission line are in the orthographic projection of the substrate The distance between them is greater than 0; or, the first organic film layer includes a plurality of second hollow structures, the second inorganic film layer contacts the first inorganic film layer through the plurality of second hollow structures, and the distance between the second hollow structures and the orthographic projection of the touch transmission line on the substrate is greater than 0.
19. The display panel according to claim 18, wherein: The plurality of first hollow structures include at least one of the following: a plurality of inorganic holes, and a plurality of inorganic grooves.
20. The display panel according to claim 18, wherein: The plurality of second hollow structures include at least one of the following: a plurality of organic holes, and a plurality of organic grooves.
Citation Information
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