Electrode introduction device and semiconductor process apparatus

Abstract

An electrode introduction device (200) and a semiconductor process apparatus. The semiconductor process apparatus comprises a carrier boat (100). The electrode introduction device (200) comprises an electrode body (220) and an electrical connection assembly (230). The electrode body (220) comprises a first conductive portion (221), a second conductive portion (222), and an elastic electrical connection portion (223). The electrical connection assembly (230) is connected to the first conductive portion (221) or the second conductive portion (222) for electrically connecting the electrode body (220) to a power source. The first conductive portion (221) and the second conductive portion (222) are respectively used for coming into conductive contact with a set of boat legs of the carrier boat (100). The first conductive portion (221) and the second conductive portion (222) are electrically connected by means of the elastic electrical connection portion (223). The elastic electrical connection portion (223) is used for pulling the first conductive portion (221) and the second conductive portion (222), such that the surfaces of the first conductive portion (221) and the second conductive portion (222) are attached to the surfaces of the set of boat legs of the carrier boat (100). The surfaces of the first conductive portion (221) and the second conductive portion (222) are less prone to the adhering to a film layer, thereby avoiding the problems of poor contact or even a short circuit between the electrode body (220) and the boat legs of the carrier boat (100), and thus improving the efficiency and the yield of the coating process.

Description

Electrode introduction device and semiconductor process equipment Technical Field

[0001] The present application relates to the technical field of coating equipment, and in particular to an electrode introduction device and semiconductor process equipment. Background Art

[0002] PECVD (Plasma-Enhanced Chemical Vapor Deposition) is a commonly used method for preparing thin film materials in semiconductor manufacturing processes. It is used to deposit semiconductor materials such as silicon dioxide and silicon nitride. In related technologies, an electrode introduction device is used to introduce radio frequency power into the reaction chamber, and the electrode located in the reaction chamber is in conductive contact with the carrier boat to complete the coating. However, there is a problem of poor bonding between the electrode and the carrier boat, resulting in a large gap between the electrode and the carrier boat. After a long period of high temperature environment and coating environment, a film layer will adhere to the surface of the electrode exposed in the gap, resulting in poor contact or even short circuit between the electrode and the carrier boat, thereby affecting the efficiency and yield of the coating process. Summary of the Invention

[0003] The present application discloses an electrode introduction device and semiconductor process equipment to solve the problem in the related art that a large gap exists between the electrode and the carrier boat, resulting in poor contact or even short circuit between the electrode and the carrier boat.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of the present application disclose an electrode introduction device, which is applied to semiconductor process equipment, wherein the semiconductor process equipment includes a carrier boat, and the disclosed electrode introduction device includes an electrode body and an electrical connection assembly;

[0006] The electrode body comprises a first conductive portion, a second conductive portion and an elastic electrical connection portion, wherein the first conductive portion and the second conductive portion are respectively used for electrically contacting with a group of boat legs of the carrying boat;

[0007] The first conductive portion and the second conductive portion are electrically connected via the elastic electrical connection portion, and the elastic electrical connection portion is used to pull the first conductive portion and the second conductive portion so that the surfaces of the first conductive portion and the second conductive portion are in contact with the surfaces of a group of boat legs of the carrying boat;

[0008] The electrical connection assembly is electrically connected to the first conductive portion or the second conductive portion, and is used to electrically connect the electrode body to a power source.

[0009] In the second aspect, an embodiment of the present application discloses a semiconductor process equipment, which includes a reaction chamber, a carrier boat, a bracket and the electrode introduction device mentioned above. The bracket is arranged in the reaction chamber, and the carrier boat is placed on the bracket when the process is carried out. The electrode body is arranged on the bracket, and a group of boat feet of the carrier boat are in conductive contact with the electrode body.

[0010] The technical solution adopted in this application can achieve the following technical effects:

[0011] The electrode introduction device disclosed in the embodiment of the present application improves the relevant technology. The electrode body is connected to the power supply through an electrical connection component. The electrode body includes a first conductive part, a second conductive part and an elastic electrical connection part. The first conductive part and the second conductive part are electrically connected through the elastic electrical connection part. Under the pulling action of the elastic electrical connection part, the surfaces of the first conductive part and the second conductive part can be fitted with the surfaces of a group of boat feet of the supporting boat. The surfaces of the first conductive part and the second conductive part are not easy to adhere to the film layer, thereby avoiding the problem of poor contact or even short circuit between the electrode body and the group of boat feet of the supporting boat, thereby improving the efficiency and yield of the coating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] FIG1 is a schematic structural diagram of an electrode introduction device disclosed in an embodiment of the present application;

[0013] FIG2 is a schematic diagram of an assembly structure of a conductive support member and an electrode body disclosed in an embodiment of the present application;

[0014] FIG3 is a second schematic diagram of an assembly structure of a conductive support member and an electrode body disclosed in an embodiment of the present application;

[0015] FIG4 is a schematic structural diagram of a semiconductor process equipment disclosed in an embodiment of the present application;

[0016] FIG5 is a schematic diagram of an assembly structure of a carrying boat and a bracket disclosed in an embodiment of the present application.

[0017] Explanation of the accompanying drawings: 100-carrying boat, 110-first boat, 111-first boat foot, 112-second boat foot, 120-second boat, 121-third boat foot, 122-fourth boat foot; 200-electrode introduction device, 210-bracket, 211-support rod, 212-insulating sleeve, 220-electrode body, 221-first conductive part, 2211-bending part, 222-second conductive part, 223-elastic electrical connecting part, 230-electrical connection assembly, 231-conductive support, 2311-connecting part, 2312-adjusting part, 2313-main body, 2314-elastic main body, 2315-rigid main body, 232-insulating layer, 2321-sub-insulating layer, 2322-protective layer; 300-reaction chamber, 310-opening, 320-electrode rod. DETAILED DESCRIPTION

[0018] To make the objectives, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0019] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "first," "second," and the like generally distinguish objects of a class and do not limit the number of objects. For example, the first object may be one or more.

[0020] The technical solutions disclosed in various embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0021] Please refer to Figures 1 to 5. An embodiment of the present application discloses an electrode introduction device 200, which is applied to semiconductor process equipment. The semiconductor process equipment includes a carrier boat 100. The carrier boat 100 serves as a carrier for chemical vapor deposition and is mainly used to carry the parts to be plated. The carrier boat 100 can be made of high-temperature resistant conductive materials such as graphite. The parts to be plated can be chips, solar cells, etc. For example, PECVD (Plasma-enhanced Chemical Vapor Deposition) technology is used in the processing of solar cells. A layer of dark blue silicon nitride film, i.e., an anti-reflection film, is deposited on the surface of the solar cell through the carrier boat 100, a radio frequency power supply, and an appropriate amount of reaction gas, which can significantly improve the photoelectric conversion efficiency of the solar cell.

[0022] The carrier boat 100 is provided with legs, which electrically contact the electrode introduction device 200 to achieve circuit continuity. The specific number of legs can be selected based on the specific structure of the electrode introduction device 200. Generally, there are at least two groups of legs, one for connecting to the positive pole of the power supply and the other for connecting to the negative pole of the power supply. Each group of legs includes at least one leg. To increase the conductive area between the carrier boat 100 and the electrode introduction device 200, the number of legs in each group can be appropriately increased, such as including two legs per group. Alternatively, the carrier boat 100 can be connected to the positive pole of the power supply solely through the electrode introduction device 200, and connected to the negative pole of the power supply by plugging the electrode rod 320 into the electrode hole. Alternatively, the carrier boat 100 can be connected to the negative pole of the power supply solely through the electrode introduction device 200, and connected to the positive pole of the power supply by plugging the electrode rod 320 into the electrode hole. As long as the power circuit can be connected, this is not limited in this embodiment of the application.

[0023] As shown in Figures 1 to 5, the electrode introduction device 200 includes an electrode body 220 and an electrical connection assembly 230. The electrode body 220 can specifically include a first conductive portion 221, a second conductive portion 222, and an elastic electrical connection portion 223. The first conductive portion 221 and the second conductive portion 222 are respectively used to electrically contact a set of boat legs of the carrier boat 100. Specifically, the first conductive portion 221 and the second conductive portion 222 form two conductive contact surfaces with two of the boat legs of the carrier boat 100. Compared to the solution using a single conductive contact surface, in this embodiment of the application, the conductive contact area between the electrode body 220 and the carrier boat 100 is larger, the contact resistance is lower, and the occurrence of heat generation problems can be reduced. The first conductive portion 221 and the second conductive portion 222 can be made of metal material and have a certain degree of elasticity.

[0024] The first conductive part 221 and the second conductive part 222 are electrically connected through the elastic electrical connection part 223. The elastic electrical connection part 223 can be a structure with a certain elasticity such as a spring or a spring, and the elastic electrical connection part 223 is made of a conductive material. The connection method between the first conductive part 221 and the second conductive part 222 and the elastic electrical connection part 223 can be welding, bolt connection, etc.

[0025] The electrical connection component 230 is used to electrically connect the electrode body 220 to a power source, which may be a radio frequency power source. The electrical connection component 230 may be a conductive cable, a steel rod, or the like. In a specific electrical connection method, the electrical connection component 230 is electrically connected to the first conductive part 221 or the second conductive part 222, and the first conductive part 221 and the second conductive part 222 are electrically connected via an elastic electrical connection part 223. The connection method between the electrical connection component 230 and the first conductive part 221 or the second conductive part 222 may be welding, bolt connection, or the like.

[0026] From the above description, it can be seen that the electrode introduction device 200 disclosed in the embodiment of the present application improves the relevant technology. The electrode body 220 is connected to the power supply through the electrical connection component 230, and can be in conductive contact with a group of boat feet of the carrier boat 100, which facilitates the disassembly and maintenance of the electrode body 220; the electrode body 220 includes a first conductive part 221, a second conductive part 222 and an elastic electrical connection part 223. The first conductive part 221 and the second conductive part 222 are electrically connected through the elastic electrical connection part 223. Under the pulling action of the elastic electrical connection part 223, the surfaces of the first conductive part 221 and the second conductive part 222 can be fitted with the surfaces of a group of boat feet of the carrier boat 100. The surfaces of the first conductive part 221 and the second conductive part 222 are not easily adhered to the film layer, thereby avoiding the problem of poor contact or even short circuit between the electrode body 220 and a group of boat feet of the carrier boat 100, thereby improving the efficiency and yield of the coating process.

[0027] Furthermore, the semiconductor processing equipment may further include a support 210, which is used to support the carrier boat 100. The legs of the carrier boat 100 are overlapped on the support 210, and the electrode body 220 is also overlapped on the support 210. That is, the first conductive portion 221 and the second conductive portion 222 are respectively overlapped on the support 210. The electrode body 220 is located between a set of legs of the carrier boat 100 and the support 210. The electrode body 220 and the support 210 are insulated contact, and the electrode body 220 and the set of legs of the carrier boat 100 are in conductive contact. In an embodiment (described in detail below) in which the support 210 includes two support rods 211 extending along the length of the carrier boat and parallel to each other, each set of legs of the carrier boat 100 includes two legs arranged opposite each other along the width of the carrier boat 100, each leg supported by one of the two support rods 211; the first conductive portion 221 and the second conductive portion 222 are respectively overlapped on the two support rods 211. The first conductive portion 221 and the second conductive portion 222 are respectively located between two boat legs in a group of boat legs of the carrier boat 100 and the two support rods 211. The first conductive portion 221 and the second conductive portion 222 are respectively insulated from the two support rods 211, and are respectively in conductive contact with the two boat legs in a group of boat legs of the carrier boat 100. Furthermore, the two boat legs in a group of boat legs are electrically connected via the first conductive portion 221, the second conductive portion 222, and the elastic electrical connection portion 223.

[0028] By providing the bracket 210, on the one hand, the electrode body 220 and the carrying boat 100 can be stably supported; on the other hand, since the electrode body 220 is overlapped on the bracket 210, it is convenient to adjust the position of the electrode body 220 to improve flexibility. At the same time, it is also convenient to disassemble and maintain the electrode body 220 and the bracket 210 separately.

[0029] In some embodiments, as shown in Figures 2 to 3, the structures of the first conductive portion 221 and the second conductive portion 222 can be the same or different. When the structures of the first conductive portion 221 and the second conductive portion 222 are the same, the structures are described using the first conductive portion 221 or the second conductive portion 222 as an example. The first conductive portion 221 or the second conductive portion 222 may include a plurality of bent portions 2211, which are connected in sequence. The plurality of bent portions 2211 may be formed by pre-bending the first conductive portion 221 or the second conductive portion 222, or the plurality of bent portions 2211 may be made separately and then joined together by welding. The elastic electrical connection portion 223 is connected to the bent portions 2211 at the end of the plurality of bent portions 2211, thereby pulling the plurality of bent portions 2211 to bend along the docking position, which is the docking position between each two adjacent bent portions 2211. The elastic electrical connection portion 223 and the bent portions 2211 at the end of the plurality of bent portions 2211 can be connected by welding, bolting, etc. Because the first conductive portion 221 or the second conductive portion 222 adopts a multi-stage bending design, the elastic electrical connection portion 223 can be more easily bent and adjusted, thereby better fitting the surface of the boat foot of the carrier boat 100.

[0030] In a further scheme, as shown in Figures 1 to 5, the semiconductor process equipment includes two electrode introduction devices 200, and the electrode bodies 220 included in the two electrode introduction devices 200 are arranged at intervals along the length direction of the bracket 210 (for example, the length direction of the support rod 211), and the carrying boat 100 is provided with two groups of boat feet spaced apart along its own length direction (parallel to the length direction of the bracket 210). The two groups of boat feet can be respectively arranged at the two ends of the carrying boat 100 along its own length direction, and the electrode body 220 included in each electrode introduction device 200 is in conductive contact with a group of boat feet of the carrying boat 100. According to the functional division, one of the two groups of boat feet of the same supporting boat 100 is the anode boat foot, and the other group is the cathode boat foot. In order to improve the stability of the electrical connection, each group of boat feet (anode boat feet or cathode boat feet) can have two or more electrical contact points with the same electrode body 220. For example, each group of boat feet (anode boat feet or cathode boat feet) has two electrical contact points with the same electrode body 220, and the two electrical contact points are respectively in conductive contact with the first conductive part 221 and the second conductive part 222 in the same electrode body 220, that is, the first conductive part 221 and the second conductive part 222 of the electrode body 220 included in each electrode introduction device 200 are respectively in conductive contact with two boat feet in the corresponding group of boat feet, and these two boat feet are both anode boat feet or cathode boat feet.

[0031] In some embodiments, the electrode body 220 included in one of the two electrode introduction devices 200 is electrically connected to the positive electrode of the power supply via the electrical connection assembly 230 therein, forming an anode circuit; the electrode body 220 included in the other of the two electrode introduction devices 200 is electrically connected to the negative electrode of the power supply via the electrical connection assembly 230 therein, forming a cathode circuit. The carrier boat 100 is connected to the positive and negative electrodes of the power supply via the two electrode introduction devices 200, respectively, to achieve conductivity of the power supply circuit.

[0032] In some embodiments, as shown in Figures 1 to 5 , each electrode introduction device 200 includes an electrical connection assembly 230 comprising a conductive support member 231, which is attached to a side support 210 (e.g., one of the two support rods 211). When the conductive support member 231 electrically connects the electrode body 220 to the positive terminal of a power source, an anode circuit is formed between the power source and the carrier boat 100; when the conductive support member 231 electrically connects the electrode body 220 to the negative terminal of the power source, a cathode circuit is formed between the power source and the carrier boat 100. In an embodiment where the semiconductor processing equipment includes two electrode introduction devices 200, the electrode bodies 220 included in the two electrode introduction devices 200 correspond to the positions of the two sets of boat legs of the carrier boat 100, and the two sets of boat legs are respectively arranged at the two ends of the carrier boat 100 along its own length. To achieve connection with the electrode bodies 220 included in the two electrode introduction devices 200, the conductive support members 231 included in the two electrode introduction devices 200 have different lengths along the length of the support 210. The difference in the length of the conductive support members 231 of the two electrode introduction devices 200 is consistent with the distance between the two sets of boat legs along the length of the carrier boat 100. The conductive support members 231 not only enable electrical connection between the electrode bodies 220 and the power supply, but also serve to stabilize the electrode bodies 220 attached to the support 210 to prevent the electrode bodies 220 from slipping off the support 210.

[0033] In a further embodiment, as shown in Figures 1 to 3, the conductive support member 231 can be a telescopic rod or a structure with a certain elastic expansion and contraction function, which can be extended or shortened along the length of the bracket 210, thereby driving the electrode body 220 to move along the length of the bracket 210, thereby achieving a good fit with the position of the boat foot of the carrier boat 100 and improving the accuracy of the conductive contact between the electrode body 220 and the boat foot of the carrier boat 100. When replacing a carrier boat 100 of a different specification, the position of the electrode body 220 along the length of the bracket 210 can be adjusted by simply adjusting the length of the conductive support member 231 accordingly, thereby increasing the adaptability of the electrode introduction device 200.

[0034] In some embodiments, as shown in Figures 1 to 3, the conductive support member 231 may include a connecting portion 2311, an adjusting portion 2312, and a main portion 2313. The connecting portion 2311 is used to connect to the positive or negative pole of a power source. The connection between the connecting portion 2311 and the positive or negative pole of the power source may be bolted, plugged, or snapped together. The main portion 2313 is electrically connected to the connecting portion 2311 and the electrode body 220, respectively, to introduce current into the electrode body 220. The connecting portion 2311 and the main portion 2313 are connected by the adjusting portion 2312. The adjusting portion 2312 can be extended or shortened along the length of the support 210, thereby allowing the conductive support member 231 to extend or shorten along the length of the support 210. It should be noted that the connecting portion 2311, the adjusting portion 2312, and the main portion 2313 all utilize conductive structures, and the adjusting portion 2312 may include a bolt and a nut.

[0035] For example, a nut can be provided on one of the connecting portion 2311 and the main body 2313, and a bolt can be provided on the other of the connecting portion 2311 and the main body 2313, and the screwing length of the bolt and the nut can be adjusted to realize the telescopic function of the adjustment portion 2312; a slide rail can also be provided on one of the connecting portion 2311 and the main body 2313, and a slider can be provided on the other of the connecting portion 2311 and the main body 2313, and the telescopic function can be realized by utilizing the sliding cooperation of the slide rail and the slider, etc., which is not limited to the embodiments of the present application.

[0036] In some embodiments, as shown in Figures 2 to 5, the main body 2313 includes an elastic body 2314 and a rigid body 2315. The elastic body 2314 can be a structure capable of providing a certain amount of elastic deformation, such as a cable or elastic conductive sheet. The rigid body 2315 can be a structure that is relatively strong and resistant to deformation, such as a steel rod. One end of the elastic body 2314 is connected to the connecting portion 2311 via an adjustment portion 2312, and the other end of the elastic body 2314 is connected to the rigid body 2315 via another adjustment portion 2312. The end of the rigid body 2315 facing away from the elastic body 2314 is connected to the first conductive portion 221 or the second conductive portion 222. The rigid body 2315 is primarily used to ensure the overall strength of the conductive support member 231 and provide sufficient support for the electrode body 220. The elastic body 2314 is primarily used to provide a certain amount of deformation buffering to prevent local fracture or damage of the conductive support member 231 due to thermal expansion, thereby improving durability.

[0037] In a further solution, as shown in Figures 1 to 3, in order to avoid safety accidents caused by electric arcs between the conductive support member 231 and the carrying boat 100, an insulating layer 232 can be wrapped around the outside of the connecting part 2311, the adjusting part 2312 and the main body 2313 respectively. The insulating layer 232 can be made of high-temperature resistant materials such as ceramics and glass.

[0038] In some embodiments, as shown in Figures 1 to 3, when the length of the insulating layer 232 is large, considering the difficulty of production and assembly issues, the insulating layer 232 can be designed in segments, that is, the insulating layer 232 includes multiple sub-insulating layers 2321, and the joints of adjacent sub-insulating layers 2321 are covered with a protective layer 2322, and the protective layer 2322 is wrapped in the exposed area between adjacent sub-insulating layers 2321. The materials of the protective layer 2322 and the sub-insulating layer 2321 can be the same or different.

[0039] Please refer to Figures 1 to 5. The embodiments of the present application also disclose a semiconductor process equipment. The disclosed semiconductor process equipment may include a reaction chamber 300, a carrier boat 100, a bracket 210, and the electrode introduction device 200 described in the above embodiment. The reaction chamber 300 is used to provide a closed vacuum chamber for the chemical vapor deposition process. The bracket 210 is arranged in the reaction chamber 300, and can be specifically overlapped on the inner wall or other structural parts of the reaction chamber 300. The carrier boat 100 can be placed on the bracket 210 or detached from the bracket 210 through a transfer mechanism. The conductive support member 231 is attached to the bracket 210, and the electrode body 220 is arranged on the bracket 210, and can be specifically overlapped on the bracket 210. The boat foot of the carrier boat 100 is in conductive contact with the electrode body 220.

[0040] As can be seen from the above description, the semiconductor process equipment disclosed in the embodiment of the present application improves the relevant technology. The electrode body 220 in the semiconductor process equipment is overlapped on the bracket 210 and is connected to the power supply through the electrical connection component 230, so that it can be in conductive contact with a group of boat feet of the carrier boat 100, which facilitates the disassembly and maintenance of the electrode body 220; the electrode body 220 includes a first conductive part 221, a second conductive part 222 and an elastic electrical connection part 223. The first conductive part 221 and the second conductive part 222 are electrically connected through the elastic electrical connection part 223. Under the pulling action of the elastic electrical connection part 223, the surfaces of the first conductive part 221 and the second conductive part 222 can be fitted with the surface of the boat feet of the carrier boat 100. The surfaces of the first conductive part 221 and the second conductive part 222 are not easily adhered to the film layer, thereby avoiding the problem of poor contact or even short circuit between the electrode body 220 and a group of boat feet of the carrier boat 100, thereby improving the efficiency and yield of the coating process.

[0041] In some embodiments, the reaction chamber 300 has an opening 310 through which components such as the carrier boat 100 and the electrode body 220 can enter and exit the reaction chamber 300. To improve production efficiency, two carrier boats 100 are provided, including a first boat 110 and a second boat 120. The first boat 110 and the second boat 120 are placed on a support 210, with a predetermined distance between the first boat 110 and the second boat 120. The first boat 110 is positioned proximate to the opening 310 of the reaction chamber 300, while the second boat 120 is positioned distally. A first set of boat legs 111 is provided at the end of the first boat 110 proximate to the opening 310 of the reaction chamber 300, a second set of boat legs 112 is provided at the end of the first boat 110 distally to the opening 310 of the reaction chamber 300, a third set of boat legs 121 is provided at the end of the second boat 120 proximate to the opening 310 of the reaction chamber 300, and a fourth set of boat legs 122 is provided at the end of the second boat 120 distally to the opening 310 of the reaction chamber 300.

[0042] The semiconductor process equipment includes two groups of electrode introduction devices 200 corresponding to the first boat 110 and the second boat 120 respectively. Each group of electrode introduction devices 200 includes two electrode introduction devices 200, and there are four electrode introduction devices 200 in total. The electrode bodies 220 included in the four electrode introduction devices 200 are arranged at intervals along the length direction of the bracket 210. The electrode bodies 220 included in the four electrode introduction devices 200 are respectively in conductive contact with the first group of boat feet 111, the second group of boat feet 112, the third group of boat feet 121 and the fourth group of boat feet 122. Correspondingly, one of the two electrode introduction devices 200 that are in conductive contact with the first group of boat pins 111 and the second group of boat pins 112 includes an electrode body 220 that is electrically connected to the positive pole of the power supply through the conductive support 231 therein, and the other includes an electrode body 220 that is electrically connected to the negative pole of the power supply through the conductive support 231 therein; one of the two electrode introduction devices 200 that are in conductive contact with the third group of boat pins 121 and the fourth group of boat pins 122 includes an electrode body 220 that is electrically connected to the positive pole of the power supply through the conductive support 231 therein, and the other includes an electrode body 220 that is electrically connected to the negative pole of the power supply through the conductive support 231 therein.

[0043] The first boat 110 and the second boat 120 can be powered by the same power source, or by two separate power sources. It should be noted that the conductive supports 231 included in the four electrode introduction devices 200 have different lengths, and the specific length can be selected based on the positions of the first, second, third, and fourth groups of boat legs 111, 112, 121, and 122.

[0044] The dual-boat solution can carry more parts to be plated, which can improve the efficiency of the coating process. The first boat 110 and the second boat 120 both use the electrode introduction device 200 including the electrode body 220 and the electrical connection component 230 to achieve circuit conduction. Since the electrode body 220 is overlapped on the bracket 210, it is easy to disassemble and maintain, which greatly improves efficiency.

[0045] In other embodiments, as shown in Figures 1 to 5, the carrier boat 100 includes a first boat 110 close to the opening 310 of the reaction chamber 300 and a second boat 120 away from the opening 310 of the reaction chamber 300; a first group of boat legs 111 is provided at one end of the first boat 110 close to the opening 310 of the reaction chamber 300, and a second group of boat legs 112 is provided at one end of the first boat 110 away from the opening 310 of the reaction chamber 300. The semiconductor process equipment includes two electrode introduction devices 200, and the two electrode introduction devices 200 include electrode bodies 22 0 are arranged at intervals along the length direction of the bracket 210 itself, and the electrode bodies 220 included in the two electrode introduction devices 200 are in conductive contact with the first group of boat legs 111 and the second group of boat legs 112 respectively. Correspondingly, the electrode body 220 included in one of the two electrode introduction devices 200 is electrically connected to the positive pole of the power supply through the electrical connection component 230 therein to form an anode loop, and the electrode body 220 included in the other of the two electrode introduction devices 200 is electrically connected to the negative pole of the power supply through the electrical connection component 230 therein to form a cathode loop.

[0046] The second boat 120 and the first boat 110 utilize a different method for connecting to the power supply. Specifically, the second boat 120 has an electrode hole on the side facing away from the opening 310 of the reaction chamber 300. This electrode hole is used to plug and electrically connect with an electrode rod 320 inserted into the reaction chamber 300. It should be noted that there are two electrode holes and two electrode rods 320, each plugged into a one-to-one correspondence. One of the two electrode rods 320 is electrically connected to the positive terminal of the power supply, and the other of the two electrode rods 320 is electrically connected to the negative terminal of the power supply. The positive and negative electrode rods 320 are respectively plugged into the two electrode holes of the second boat 120 to achieve electrical circuit conductivity. The first boat 110 and the second boat 120 can be powered by the same power supply or by two separate power supplies. Compared to the method of introducing current through the opening 310 of the reaction chamber 300 using the electrode body 220 and the conductive support member 231, the second boat 120 uses a more stable electric field and avoids the problem of uncontrollable displacement caused by the excessive extension of the conductive support member 231.

[0047] In a further solution, as shown in Figures 1 and 5, a third group of boat feet 121 is provided at one end of the second boat 120 close to the opening 310 of the reaction chamber 300, and a fourth group of boat feet 122 is provided at one end of the second boat 120 away from the opening 310 of the reaction chamber 300. The bracket 210 may include two parallel support rods 211, and each support rod 211 is provided with four groups of insulating sleeves 212 at intervals along its own length direction. The two insulating sleeves in each group of insulating sleeves 212 are relatively sleeved on the outer surfaces of the two support rods 211. The four groups of insulating sleeves 212 are respectively used to support one boat foot in the first group of boat feet 111, one boat foot in the second group of boat feet 112, one boat foot in the third group of boat feet 121 and one boat foot in the fourth group of boat feet 122. The insulating sleeves 212 can be made of ceramic or glass. It is easy to understand that the first group of boat legs 111, the second group of boat legs 112, the third group of boat legs 121, and the fourth group of boat legs 122 each include two boat legs arranged opposite each other along the width direction of the first boat 110 or the second boat 120, and each boat leg is supported by an insulating sleeve 212 on one of the two support rods 211. The electrode body 220 included in the electrode introduction device 200 is mounted on the insulating sleeve 212.

[0048] Regarding the solution in which the first boat 110 and the second boat 120 are connected to the power supply in different ways, since the first group of boat feet 111 and the second group of boat feet 112 of the first boat 110 are supported by the electrode body 220 and the insulating sleeve 212, the third group of boat feet 121 and the fourth group of boat feet 122 of the second boat 120 are not supported by the electrode body 220 and the insulating sleeve 212, which will cause a height difference between the first boat 110 and the second boat 120. In order to compensate for the height difference between the first boat 110 and the second boat 120, the wall thickness of the insulating sleeve 212 can be designed differently.

[0049] Specifically, the wall thickness of the insulating sleeve 212 provided at the first group of boat feet 111 and the second group of boat feet 112 can be made smaller than the wall thickness of the insulating sleeve 212 provided at the third group of boat feet 121 and the fourth group of boat feet 122, and the difference in wall thickness is consistent with the thickness value of the first conductive part 221 or the second conductive part 222 in the electrode body 220. By utilizing the differentiated wall thickness design of the insulating sleeve 212 at different positions, the first boat 110 and the second boat 120 can be at the same height, thereby ensuring the consistency of the first boat 110 and the second boat 120 during the process, such as the chemical vapor deposition process.

[0050] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different technical features between the various embodiments are not contradictory, they can be combined to form more specific embodiments. Considering the simplicity of the text, they will not be repeated here.

[0051] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. An electrode introduction device, applied to semiconductor process equipment, wherein the semiconductor process equipment includes a carrier boat, characterized in that: The electrode introduction device comprises an electrode body and an electrical connection assembly; The electrode body comprises a first conductive portion, a second conductive portion and an elastic electrical connection portion, wherein the first conductive portion and the second conductive portion are respectively used for conductive contact with a group of boat feet of the carrying boat; The first conductive part and the second conductive part are electrically connected via the elastic electrical connection part, and the elastic electrical connection part is used to pull the first conductive part and the second conductive part so that the surfaces of the first conductive part and the second conductive part are in contact with the surfaces of a group of boat feet of the carrying boat; The electrical connection assembly is electrically connected to the first conductive part or the second conductive part, and is used to electrically connect the electrode body to a power source.

2. The electrode introduction device according to claim 1, characterized in that: At least one of the first conductive part and the second conductive part includes a plurality of bending parts, and the plurality of bending parts are connected in sequence. The elastic electrical connection part is connected to the bending part located at the end position among the plurality of bending parts to pull the plurality of bending parts to bend along the docking position.

3. The electrode introduction device according to claim 1, characterized in that: The electrical connection assembly includes a conductive support member, and the conductive support member is used to electrically connect the electrode body to the positive electrode or the negative electrode of the power source.

4. The electrode introduction device according to claim 3, characterized in that: The conductive support member can be extended or shortened along the length direction of the carrying boat to drive the electrode body to move along the length direction of the carrying boat.

5. The electrode introduction device according to claim 4, characterized in that: The conductive support member includes a connecting portion, an adjusting portion and a main body portion. The connecting portion is used to connect the positive or negative pole of the power source. The connecting portion and the main body portion are connected via the adjusting portion. The adjusting portion can be extended or shortened along the length direction of the carrying boat.

6. The electrode introduction device according to claim 5, characterized in that: The main body includes an elastic body and a rigid body, one end of the elastic body is connected to the connecting part through an adjusting part, the other end of the elastic body is connected to the rigid body through another adjusting part, and the end of the rigid body facing away from the elastic body is connected to the first conductive part or the second conductive part.

7. The electrode introduction device according to claim 5, characterized in that: The outer sides of the connecting part, the adjusting part and the main body are all wrapped with an insulating layer.

8. The electrode introduction device according to claim 7, characterized in that: The insulating layer comprises a plurality of sub-insulating layers arranged at intervals, and a protective layer is sleeved at the connection between adjacent sub-insulating layers.

9. A semiconductor process equipment, characterized in that: It comprises a reaction chamber, a carrying boat, a bracket and the electrode introduction device according to any one of claims 1 to 8, wherein the bracket is arranged in the reaction chamber, the carrying boat is placed on the bracket when the process is carried out, the electrode body is arranged on the bracket, and a group of boat feet of the carrying boat are in conductive contact with the electrode body.

10. The semiconductor process equipment according to claim 9, characterized in that: The electrode introduction device includes a first conductive part and a second conductive part which are respectively overlapped on the bracket.

11. The semiconductor process equipment according to claim 10, characterized in that: The semiconductor process equipment comprises two electrode introduction devices, and the electrode bodies included in the two electrode introduction devices are arranged at intervals along the length direction of the bracket; The carrying boat is provided with two groups of boat feet at intervals along its length direction, and the electrode body included in each of the electrode introduction devices is in conductive contact with a group of boat feet of the carrying boat; The electrode body included in one of the two electrode introduction devices is electrically connected to the positive pole of the power supply through the electrical connection component therein, and the electrode body included in the other of the two electrode introduction devices is electrically connected to the negative pole of the power supply through the electrical connection component therein.

12. The semiconductor process equipment according to claim 11, characterized in that: The electrical connection assembly included in each of the electrode introduction devices includes a conductive support member, and the conductive support members included in the two electrode introduction devices are used to electrically connect the electrode bodies included in the two electrode introduction devices to the positive and negative electrodes of the power supply respectively, wherein along the length direction of the bracket, the lengths of the conductive support members included in the two electrode introduction devices are different.

13. The semiconductor process equipment according to claim 10 or 12, characterized in that: Also included is an insulating sleeve; The bracket includes two support rods arranged in parallel, and a group of insulating sleeves are relatively sleeved on the outer surfaces of the support rods, wherein the group of insulating sleeves includes two insulating sleeves; The first conductive portion and the second conductive portion are respectively overlapped on the set of insulating sleeves.

14. The semiconductor process equipment according to claim 13, characterized in that: The carrying boat comprises a first boat close to the opening of the reaction chamber and a second boat far from the opening of the reaction chamber; A first group of boat feet is disposed at one end of the first boat close to the opening of the reaction chamber, a second group of boat feet is disposed at one end of the first boat away from the opening of the reaction chamber, a third group of boat feet is disposed at one end of the second boat close to the opening of the reaction chamber, and a fourth group of boat feet is disposed at one end of the second boat away from the opening of the reaction chamber; Each of the support rods is provided with four insulating sleeves at intervals along its length direction, and the insulating sleeves are sleeved on the outer side surface of the support rod, and the four insulating sleeves are respectively used to support one boat foot in the first group of boat feet, one boat foot in the second group of boat feet, one boat foot in the third group of boat feet and one boat foot in the fourth group of boat feet, and the outer side surfaces of the insulating sleeves for supporting one boat foot in the first group of boat feet and one boat foot in the second group of boat feet are overlapped with the electrode body, wherein the wall thickness of the insulating sleeves for supporting one boat foot in the first group of boat feet and one boat foot in the second group of boat feet is smaller than the wall thickness of the insulating sleeves for supporting one boat foot in the third group of boat feet and one boat foot in the fourth group of boat feet.

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