Electronic apparatus, electronic component state estimating system, and electronic component state estimating method

Abstract

This electronic apparatus comprises: an electronic circuit including a plurality of electronic components; and a microcomputer including a CPU and a storage device. The storage device stores design information relating to the electronic circuit and performance degradation characteristic information indicating characteristics of performance degradation of each electronic component. The CPU calculates time-series data of normalized electric stress values of each electronic component when the electronic circuit is operating, on the basis of the design information relating to the electronic circuit and output data output to the electronic circuit, calculates time-cumulative stress information on the basis of the calculated time-series data of the normalized electric stress values, and stores the time-cumulative stress information in the storage device. The CPU calculates an estimated performance value of each electronic component, indicating the performance degradation state of the electronic component, on the basis of the time-cumulative stress information and the performance degradation characteristic information.

Description

Electronic device, state estimation system for electronic component, and state estimation method for electronic component

[0001] The present invention relates to an electronic device, a state estimation system for an electronic component, and a state estimation method for an electronic component.

[0002] Long-term stable operation of electronic devices, which require high performance and reliability, is an important product value for customers and also an important social value for reducing environmental impact. Long-term stable operation of electronic devices requires maintenance, inspection, and replacement. To perform these tasks at the appropriate time, it is necessary to estimate the condition (deterioration state) of each electronic component that makes up the electronic device.

[0003] Patent Document 1 discloses a state estimation device (hereinafter referred to as the "conventional device") that estimates the state of equipment. The conventional device acquires time series data of the AC voltage and AC current of the equipment from sensors, and acquires time series data of the power supply voltage applied to the equipment and the current consumed by the equipment from the acquired time series data of the AC voltage and AC current of the equipment. The conventional device extracts, from the time series data of the current consumed by the equipment, the current consumed during a time interval to be analyzed, in which the power supply voltage corresponds to a predetermined reference or state. The conventional device estimates the state of the equipment during the time interval to be analyzed from the current consumed during the time interval to be analyzed, based on the relationship between the current consumed by the equipment and the deterioration state of the equipment. The conventional device performs filtering processing on the estimated state of the equipment during the time interval, corresponding to the time rate of change of the state change to be estimated, to estimate the state change of the equipment.

[0004] Patent No. 6874843

[0005] Conventional devices require a current sensor and a voltmeter (voltage sensor) to monitor the voltage applied to the equipment and the current flowing through the equipment. In other words, conventional devices require dedicated sensors to determine (detect) the state of electronic components. Furthermore, conventional devices cannot estimate the state of each electronic component that makes up the electronic equipment.

[0006] The present invention has been made to solve the above-mentioned problems. That is, one object of the present invention is to provide an electronic device, an electronic component state estimation system, and an electronic component state estimation method that can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component.

[0007] In order to solve the above problem, the electronic device of the present invention is an electronic device comprising an electronic circuit having a plurality of electronic components, and a computer having an arithmetic unit and a storage device, wherein the storage device stores design information of the electronic circuit and performance degradation characteristic information indicating the performance degradation characteristics of each electronic component, the arithmetic unit calculates time series data of stress evaluation parameters for each electronic component when the electronic circuit is operating, based on the design information of the electronic circuit and output data to or input data from the electronic circuit, calculates time series data of the stress evaluation parameters for each electronic component by normalizing the calculated time series data of the stress evaluation parameters for each electronic component, calculates accumulated stress time information indicating the accumulated time that each electronic component has actually operated in each of a plurality of stress level ranges, and stores this in the storage device, and calculates an estimated performance value of each electronic component, indicating the performance degradation state of each electronic component, based on the accumulated stress time information and the performance degradation characteristic information.

[0008] The degradation state estimation system for electronic components of the present invention is a system for estimating a degradation state of electronic components, comprising: an electronic device including an electronic circuit having a plurality of electronic components and a computer; and a management server having an arithmetic unit and a storage device, wherein the storage device stores design information of the electronic circuit and performance degradation characteristic information indicating the characteristics of performance degradation of each electronic component of the electronic device, and the arithmetic unit acquires output data from the electronic device to the electronic circuit or input data from the electronic circuit, and determines that the electronic circuit is operating based on the design information of the electronic circuit and the acquired output data to the electronic circuit or the acquired input data from the electronic circuit. the time series data of the stress evaluation parameters of each electronic component is calculated, the calculated time series data of the stress evaluation parameters of each electronic component is normalized to calculate time series data of normalized electric stress values ​​of each electronic component, stress cumulative time information indicating the cumulative time that each electronic component of the electronic device has actually operated in each of a plurality of stress level ranges is calculated based on the time series data of the normalized electric stress values ​​of each electronic component, and the calculated stress cumulative time information is stored in the storage device, and an estimated performance value of each electronic component indicating the performance degradation state of each electronic component of the electronic device is calculated based on the stress cumulative time information and the performance degradation characteristic information.

[0009] The method for estimating a degradation state of an electronic component of the present invention is a degradation state estimation method for estimating a degradation state of each electronic component of an electronic device, using at least one arithmetic device inside or outside the electronic device and at least one storage device inside or outside the electronic device, wherein the storage device stores design information of the electronic circuit and performance degradation characteristic information indicating the performance degradation characteristics of each electronic component of the electronic device, the arithmetic device calculates time series data of stress evaluation parameters for each electronic component when the electronic circuit is operating, based on the design information of the electronic circuit and output data to or input data from the electronic circuit, calculates time series data of the calculated stress evaluation parameters for each electronic component by normalizing the calculated time series data of the stress evaluation parameters for each electronic component, calculates accumulated stress time information indicating the accumulated time that each electronic component of the electronic device has actually operated in each of a plurality of stress level ranges, and stores the calculated information in the storage device, and calculates an estimated performance value of each electronic component, indicating the performance degradation state of each electronic component of the electronic device, based on the accumulated stress time information and the performance degradation characteristic information.

[0010] According to the present invention, it is possible to estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component. Note that the effects described herein are not necessarily limited to those described herein, and may be any of the effects described in this disclosure.

[0011] FIG. 1 is a diagram illustrating an example of an electronic device according to a first embodiment of the present invention. FIG. 2 is a diagram illustrating an example of the hardware configuration of a microcomputer. FIG. 3 is a diagram illustrating performance degradation characteristic information of an electronic component. FIG. 4A is a diagram illustrating stress cumulative time information. FIG. 4B is a diagram illustrating degradation evaluation point information. FIG. 5 is a diagram illustrating performance degradation information of an electronic component. FIG. 6 is a flowchart illustrating a processing flow executed by a CPU of a microcomputer. FIG. 7 is a flowchart illustrating a processing flow executed by a CPU of a microcomputer. FIG. 8 is a flowchart illustrating a processing flow executed by a CPU of a microcomputer. FIG. 9 is a diagram illustrating an example of the system configuration of a degradation state estimation system for an electronic component according to a fourth embodiment of the present invention. FIG. 10 is a flowchart illustrating a processing flow executed by a CPU of a management server. FIG. 11 is a flowchart illustrating a processing flow executed by the CPU of the management server. FIG. 12 is a flowchart illustrating a processing flow executed by the CPU of the management server. FIG. 13 is a diagram illustrating an example of an electronic device according to a seventh embodiment of the present invention.

[0012] Hereinafter, each embodiment of the present invention will be described with reference to the drawings. Note that in all drawings of the embodiments, the same or corresponding parts may be assigned the same reference numerals. In the following description, various information may be described using expressions such as "table," "record," "column," "row," and "graph," but the various information may be expressed using data structures other than these. Furthermore, when describing identification information, expressions such as "identification number" and "name" are used, but these are interchangeable.

[0013] <<First Embodiment>> An electronic device 100 according to a first embodiment of the present invention will be described. Fig. 1 is a diagram for explaining an example of the electronic device 100 according to the first embodiment of the present invention. As shown in Fig. 1, the electronic device 100 includes a microcomputer 110, a DAC 120, an IV conversion circuit 130, a switching filter 140, an amplifier circuit 150, a first drive circuit 160, a second drive circuit 170, and a power load 180. The microcomputer 110 may also be referred to as a "computer."

[0014] 2 is a diagram showing an example of the hardware configuration of the microcomputer 110. The microcomputer 110 includes a CPU 111, a ROM 112, a RAM 113, a non-volatile storage device 114 that can read and write data, a network interface 115, and an input / output interface 116. These are connected to each other via a bus 117 so as to be able to communicate with each other. The CPU 111 may also be referred to as a "computing device."

[0015] The CPU 111 loads various programs stored in the ROM 112 and / or storage device 114 into the RAM 113 and executes the programs loaded into the RAM 113 to realize various functions. As described above, various programs to be executed by the CPU 111 are loaded into the RAM 113, and data used when the CPU 111 executes the various programs is temporarily stored therein. The ROM 112 and / or storage device 114 are non-volatile storage media, and various programs are stored in the ROM 112 and / or storage device 114.

[0016] The storage device 114 stores (memorizes, saves) design information of the electronic circuit, performance degradation characteristic information 300 shown in Fig. 3 (described later), stress cumulative time information 400 shown in Fig. 4A, degradation evaluation point information 410 shown in Fig. 4B, and performance degradation information 500 of the electronic component shown in Fig. 5. Details of these pieces of information will be described later.

[0017] The network interface 115 is an interface for connecting the electronic device 100 to a network (not shown). The input / output interface 116 is an interface for connecting to a keyboard, a display device, etc. The display device is a display capable of displaying images.

[0018] Instead of the microcomputer 110, a hardware device configured in part or in whole by an FPGA (Field Programmable Gate Array) or the like may be used.

[0019] The DAC 120 is a digital-to-analog converter, a device that converts digital signals into analog signals. Analog signals are information represented by continuous currents. The IV conversion circuit 130 is a circuit that converts current signals into voltage signals. The switching filter 140 passes the input voltage signal within a specific frequency range and suppresses frequency components outside of that range. The switching filter 140 is used to selectively pass or block frequencies of the voltage signal. The amplifier circuit 150 amplifies the input voltage signal and generates an output voltage signal.

[0020] The first drive circuit 160 and the second drive circuit 170 are electronic circuits for controlling and appropriately operating the electronic device 100. Each of the first drive circuit 160 and the second drive circuit 170 generates a control signal and supplies the signal to the power load 180 to cause the power load 180 to perform a predetermined operation. The power load 180 is a component that consumes power, such as a motor.

[0021] Each of the IV conversion circuit 130, the switching filter 140, the amplifier circuit 150, the first drive circuit 160, and the second drive circuit 170 is composed of a plurality of electronic components. The electronic components are, for example, resistors, capacitors, transistors, etc. For convenience of explanation, the plurality of electronic components are referred to as electronic component 1, electronic component 2, ..., electronic component N. In the following explanation, electronic components 1 to N are referred to as "electronic components" unless there is a need to particularly distinguish between them.

[0022] 3 is a diagram illustrating electronic component performance degradation characteristic information 300. Electronic component performance degradation characteristic information 300 is information showing the performance degradation characteristics of each electronic component constituting electronic device 100 (electronic circuit) over time for each electrical stress. Specifically, electronic component performance degradation characteristic information 300 includes graphs Gr1 to GrN. Each of graphs Gr1 to GrN is a graph that represents, as a line (referred to as a "performance degradation curve"), the change over time in performance value (e.g., a parameter indicating that the larger the value, the more advanced the degradation) for each electrical stress of electronic component 1 to electronic component N.

[0023] Graph Gr1 includes performance degradation curves a1, a2, and a3. Performance degradation curve a1 shows the change over time in performance value when the electrical stress of electronic component 1 is 30%. Performance degradation curve a2 shows the change over time in performance value when the electrical stress of electronic component 1 is 60%. Performance degradation curve a3 shows the change over time in performance value when the electrical stress of electronic component 1 is 60%. Note that graphs Gr2 to GrN each use a performance degradation curve similar to graph Gr1 to represent the change over time in performance degradation for each electrical stress of the corresponding electronic component. The performance degradation characteristic information 300 of electronic components is created in advance, for example, by conducting accelerated experiments and / or simulations, and is stored in storage device 114.

[0024] FIG. 4A is a diagram illustrating accumulated stress time information 400. As shown in FIG. 4A, accumulated stress time information 400 includes columns (columns) for storing information (values): component number 401 and stress L1 402a1 to stress L10 402a10. In accumulated stress time information 400, which is represented as a single table, information corresponding to each column relating to the accumulated stress time of an electronic component at a certain time tn is associated with each other and stored as row-based information (records). Specifically, component number 401 stores an identification number for identifying the electronic component. Each of stress L1 402a1 to stress L10 402a10 stores the accumulated time that the corresponding electronic component actually operated within each stress level range. In this example, there are ten stress level ranges. For example, stress level 1 (stress L1 402a1) is a level range of 0 to 10%, stress level 2 (stress L2 402a2) is a range of more than 10% to 20%, stress level 3 (stress L3 402a3) is a range of more than 20% to 30%, stress level 4 (stress L4 402a4) is a range of more than 30% to 40%, stress level 5 (stress L5 402a5) is a range of more than 40% to 50%, stress level 6 (stress L6 402a6) is a range of more than 50% to 60%, stress level 7 (stress L7 402a7) is a range of more than 60% to 70%, stress level 8 (stress L8 402a8) is a range of more than 70% to 80%, and stress level 9 (stress L9 Stress level 10 (stress L1 402a9) is in the range of more than 80% and less than or equal to 90%, and stress level 10 (stress L1 402a10) is in the range of more than 90% and less than or equal to 100%. The lower the stress level, the lower the electrical stress. Note that the stress cumulative time information 400 at each time point is calculated every time a predetermined time has elapsed, and the storage device 114 stores the stress cumulative time information 400 corresponding to each time point (i.e., multiple pieces of stress cumulative time information 400).

[0025] 4B is a diagram illustrating degradation evaluation point information 410. As shown in FIG. 4B, degradation evaluation point information 410 includes a part number 411 and a degradation evaluation point 412 as columns for storing information (values). In degradation evaluation point information 410, information corresponding to each column related to the degradation evaluation points of electronic components is associated with each other and stored as row-based information (records). Specifically, part number 401 stores an identification number for identifying the electronic component. Degradation evaluation point 412 stores a degradation evaluation point, which is the evaluation result of evaluating the degradation state of the corresponding electronic component.

[0026] 5 is a diagram illustrating electronic component performance degradation information 500. Electronic component performance degradation information 500 is information indicating changes over time in estimated performance values ​​(e.g., parameters indicating that the larger the value, the more advanced the degradation) of each electronic component constituting electronic device 100 when it is actually operating. Specifically, electronic component performance degradation information 500 includes graphs GR1 to GRN. Each of graphs GR1 to GRN is a graph in which the time change in the estimated performance value of each electronic component, electronic component 1 to electronic component N, is represented by a line (referred to as an "estimated performance degradation curve").

[0027] Graph GR1 is a graph that represents the change over time in the estimated performance value of electronic component 1 using an estimated performance degradation curve b1. Note that graphs Gr2 to GrN also represent the change over time in the estimated performance value of the corresponding electronic component using an estimated performance degradation curve similar to graph GR1. Note that, for convenience of explanation, performance degradation curves a1 to a3 of Gr1 in Fig. 3 are depicted in graph GR1 in Fig. 5, but these performance degradation curves a1 to a3 may be omitted.

[0028] <Overview> Based on design information of the electronic circuit provided in the electronic device 100 and output data D1 output from the microcomputer 110 to the DAC 120, the microcomputer 110 periodically calculates stress evaluation parameters (e.g., voltage, current, power, bias conditions, heat generation temperature, etc. of each electronic component) at predetermined time intervals as information for evaluating the electrical stress of each electronic component constituting the circuit during actual operation.

[0029] Design information for electronic circuits includes, for example, a circuit diagram including information on the power supply, signal paths, and layout of each electronic component, a list of electronic components, information on the specifications of each electronic component, and information including design specifications such as the performance, operating conditions, signal requirements, and safety requirements of the electronic component. Information on the specifications of each electronic component indicates how each electronic component operates and under what conditions it can be used. For example, in the case of a resistor, information on the specifications of the electronic component is information indicating the rated resistance, tolerance, power rating, temperature coefficient, etc.; in the case of a capacitor, information indicating the capacitance, tolerance, rated voltage, temperature characteristics, etc.; and in the case of a transistor, information indicating the characteristic polarity and rated voltage of the transistor.

[0030] The output data D1 is, for example, a digital signal output from a signal-generating processing unit (for example, the CPU 111). The microcomputer 110 calculates stress evaluation parameters using the design information of the electronic circuit and the output data D1, thereby making it possible to calculate and acquire the stress evaluation parameters without providing (adding) a dedicated sensor for detecting the stress evaluation parameters.

[0031] For example, at a certain time tn, the microcomputer 110 calculates time-series data of stress evaluation parameters for each electronic component for a predetermined time interval using design information for the electronic circuit and output data D1 for a predetermined time interval.

[0032] The microcomputer 110 calculates time series data of normalized electric stress values ​​for a predetermined time interval at time tn by normalizing the calculated time series data of the stress evaluation parameters for each electronic component by converting them into a ratio to the rated design value of each electronic component based on the design information. That is, the microcomputer 110 normalizes the stress evaluation parameters for each electronic component using the formula: electric stress normalized value (%) = {stress evaluation parameter of electronic component ÷ rated design value of stress evaluation parameter} × 100 (%), and calculates time series data of normalized electric stress values. Note that the normalized values ​​of the stress evaluation parameters are referred to as "normalized electric stress values."

[0033] To explain this in more detail using an example, for example, if the stress evaluation parameter for a certain electronic component N is voltage, the voltage Vn applied to the electronic component N calculated based on the design information is voltage, and the rated design value of the electronic component N known based on the design information is "rated Vn," the normalized electric stress value can be calculated by applying these to the above formula, as follows: normalized electric stress value (%) = {voltage Vn ÷ rated Vn} × 100%.

[0034] The microcomputer 110 calculates the time during which the electronic component operates in each stress level range of stress L1 402a1 to stress L10 402a10 in a predetermined time period based on the time series data of the normalized electric stress values ​​in the predetermined time period.

[0035] The microcomputer 110 calculates the cumulative time spent operating in each stress level range at time tn based on the calculated time spent operating in each stress level range during the specified time interval and the cumulative stress time information 400 up to time tn.

[0036] The microcomputer 110 creates accumulated stress time information 400 at time tn based on the accumulated time of operation in each stress level range at time tn, and stores (preserves, memorizes) it in the storage device 114. By storing accumulated stress time information 400 in the storage device 114 rather than storing the time-series data of the stress evaluation parameters themselves in the storage device 114, the microcomputer 110 can reduce the amount of stored data required to estimate (evaluate) the deterioration state of each electronic component.

[0037] The microcomputer 110 acquires the stress cumulative time and performance degradation curve for each stress level range corresponding to the electronic component from the electronic component performance degradation characteristic information 300 and the stress cumulative time information 400, and estimates the performance value of the electronic component based on the acquired stress cumulative time and performance degradation curve for each stress level range of the electronic component, thereby calculating time-series data of the estimated performance value of each electronic component up to a certain time tn. The microcomputer 110 performs these calculations for each of the electronic components, thereby calculating electronic component performance degradation information 500 that indicates the performance degradation state of each electronic component.

[0038] For example, in FIG. 5 , when a certain time tn is t10, the estimated performance value of the electronic component at time t10 can be calculated using Σ(calculated performance value Pn). Note that n = 1 to 10, and the calculated performance value Pn is a value calculated based on the cumulative time at stress level Ln and the performance degradation curve of the electronic component at stress level Ln. The relationship is: "time from time 0 to time t10" = (cumulative time at stress level L1 + cumulative time at stress level L2 + . . . + cumulative time at stress level L10). Performance degradation curves d1 to d10 of the electronic components at stress levels L1 to 10 shown in block BR1 in FIG. 5 can be estimated based on performance degradation curves a1 to a3.

[0039] For example, if, at a certain time t10, the cumulative time of stress level L1 is x1 hours, the cumulative time of stress level L2 is x2 hours, the cumulative time of stress level L3 is x3, and the cumulative times of the other stress levels are 0 hours, the estimated performance value of the electronic component at a certain time t10 can be obtained by adding "a calculated performance value P1 based on the performance degradation curve of the electronic component at x1 hour and stress level L1 (the performance value corresponding to time x1 on the performance degradation curve d1)" + "a calculated performance value P2 based on the performance degradation curve of the electronic component at x2 hour and stress level L2 (the performance value corresponding to time x2 on the performance degradation curve d2)" + "a calculated performance value P3 based on the performance degradation curve of the electronic component at x3 hour and stress level L3 (the performance value corresponding to time x3 on the performance degradation curve d3)."

[0040] Furthermore, the microcomputer 110 calculates a degradation evaluation score (%) for each electronic component at the current time based on the estimated performance value at the current time. For example, if the current time is time t10, the performance value at time t10 is y1%, and the threshold value for the estimated performance value is yth%, then the degradation evaluation score (= (y1 ÷ yth) × 100) % corresponding to y1% is calculated. The microcomputer 110 stores the calculated degradation evaluation score in the degradation evaluation score information 410 and updates the degradation evaluation score information 410.

[0041] In response to the output command, the microcomputer 110 outputs the electronic component performance degradation information 500, the degradation evaluation point information 410 for each electronic component, and the like to an external device. For example, if the external device is a display device, the display device displays the electronic component performance degradation information 500 and the degradation evaluation point information 410 output from the microcomputer 110. Note that the microcomputer 110 may output processed information such as the electronic component performance degradation information 500 and the degradation evaluation point information 410 for each electronic component to the external device and display it on the display device.

[0042] The user can determine the timing of maintenance, inspection, and replacement of each electronic component, as well as the priority of maintenance, inspection, and replacement, based on the electronic component performance degradation information 500 and degradation evaluation point information 410 (or information processed from these) displayed on the display device. Based on the results of this determination, the user can take appropriate measures against the degradation of each electronic component, or plan appropriate countermeasures against the degradation of each electronic component.

[0043] In addition, the microcomputer 110 may calculate the timing of maintenance, inspection, and replacement of each electronic component, or the priority of maintenance, inspection, and replacement of each electronic component, based on the electronic component performance degradation information 500 and / or the degradation evaluation point information 410, and output the calculation results to an external device.

[0044] <Specific Operation> Fig. 6 is a flowchart showing the processing flow executed by the CPU 111 of the microcomputer 110. The CPU 111 executes the processing flow shown in Fig. 6 every time a predetermined time has elapsed. When the CPU 111 starts processing from step 600, it sequentially executes the processing of steps 605 to 630 described below, and then proceeds to step 635.

[0045] Step 605: The CPU 111 calculates time-series data of stress evaluation parameters for each electronic component during circuit operation based on the output data D1 for a predetermined time interval (for example, the output data D1 (digital signal) for a predetermined time output from the microcomputer 110 to the DAC 120) and the design information. Note that the type of stress evaluation parameter to be calculated (voltage, current, power, etc.) is set for each electronic component.

[0046] Step 610: The CPU 111 normalizes the time-series data of the stress evaluation parameters using the normalization parameter to calculate the time-series data of the normalized electrical stress value. For example, if the stress evaluation parameter of a certain electronic component is the voltage of the electronic component, the normalization parameter is the rated voltage value of the electronic component. In this case, normalization is performed by (voltage of the electronic component ÷ rated voltage value of the electronic component) × 100%.

[0047] Step 615: As described above, the CPU 111 calculates the cumulative time for each stress level using the time series data of the normalized electrical stress value for a predetermined time period, and stores the stress cumulative time information 400 in the storage device 114.

[0048] Step 620: The CPU 111 calculates an estimated performance degradation curve up to the present time point using the above-described method based on the stress cumulative time information 400 and the electronic component performance degradation characteristic information 300, thereby calculating electronic component performance degradation information 500, and stores the electronic component performance degradation information 500 in the storage device 114.

[0049] Step 625: The CPU 111 calculates the deterioration evaluation score of each electronic component using the method described above, and stores the calculated deterioration evaluation score of each electronic component in the deterioration evaluation score information 410.

[0050] When the CPU 111 proceeds to step 630, it determines whether or not there is a data output command. If there is no data output command, the CPU 111 determines "NO" in step 630, proceeds to step 695, and temporarily ends this processing flow.

[0051] If there is a data output command, the CPU 111 determines "YES" in step 630 and proceeds to step 635, where it outputs the performance degradation information 500 and the degradation evaluation point information 410 to the external device for which output has been requested. Thereafter, the CPU 111 proceeds to step 695, where it temporarily ends this processing flow.

[0052] In the flowchart of FIG. 6, step 630 may be omitted, and the CPU 111 may periodically perform the process of step 635.

[0053] <Effects> As described above, the electronic device 100 according to the first embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component.

[0054] Second Embodiment An electronic device 100 according to a second embodiment of the present invention will now be described. The electronic device 100 according to the second embodiment differs from the electronic device 100 according to the first embodiment only in the following respects: The electronic device 100 according to the second embodiment periodically monitors the performance of the electronic device 100, and reflects the monitoring results in performance degradation characteristic information 300 (performance degradation curve) of the electronic component.

[0055] The following description will focus on this difference. <Overview> As in the first embodiment, the microcomputer 110 periodically calculates stress evaluation parameters every time a predetermined time period elapses based on the design information and output data D1 of the electronic circuit included in the electronic device 100. As in the first embodiment, the microcomputer 110 calculates time-series data of normalized electric stress values ​​for a predetermined time period at time tn. As in the first embodiment, the microcomputer 110 calculates the time during which the electronic component operated in each stress level range, from stress L1 402a1 to stress L10 402a10, during the predetermined time period based on the time-series data of normalized electric stress values ​​for the predetermined time period. The microcomputer 110 calculates the cumulative time during which the electronic component operated in each stress level range at time tn based on the calculated time during which the electronic component operated in each stress level range during the predetermined time period and the cumulative stress time information 400 up to time tn.

[0056] The microcomputer 110 creates accumulated stress time information 400 at time tn based on the accumulated time spent operating in each stress level range at time tn, and stores (preserves, memorizes) it in the storage device 114 .

[0057] The microcomputer 110 measures performance evaluation parameters indicating the performance of the electronic circuit of the electronic device 100 at predetermined time intervals, and calculates time-series data of the performance values ​​of the electronic circuit of the electronic device 100 based on the time-series data of the measured performance evaluation parameters. Examples of performance evaluation parameters indicating the performance of the electronic circuit of the electronic device 100 include operating frequency, power consumption, noise, and gain. The microcomputer 110 calculates (estimates) an actual performance degradation curve of each electronic component based on the time-series data of the performance values ​​of the electronic circuit of the electronic device 100 and the accumulated stress time information 400. This estimation can be made using, for example, simulation results or AI.

[0058] The microcomputer 110 corrects the performance degradation characteristic information 300 of the electronic components using the measured performance degradation curve of each electronic component. By correcting the performance degradation characteristic information 300 of the electronic components based on the measured values, the microcomputer 110 can more accurately estimate the degradation state of the electronic components. For example, the microcomputer 110 compares the performance degradation curve of the performance degradation characteristic information 300 with the measured performance degradation curve and derives a correction function or correction coefficient using a mathematical method to align the performance degradation curve with the measured performance degradation polarity. The microcomputer 110 corrects the performance degradation curve of the performance degradation characteristic information 300 using the derived correction function or correction coefficient. This allows the performance degradation characteristic information 300 (the performance degradation curve of the performance degradation characteristic information 300) to match the measured performance degradation curve as closely as possible.

[0059] The microcomputer 110 obtains, for each electronic component, the stress cumulative time and performance degradation curve for each stress level range corresponding to that electronic component from the corrected electronic component performance degradation characteristic information 300 and stress cumulative time information 400, and estimates the performance value of the electronic component at a certain time tn based on the obtained stress cumulative time and performance degradation curve for each stress level range of the electronic component, thereby calculating time-series data of the estimated performance value of each electronic component up to the certain time tn. The microcomputer 110 performs these calculations for each of the electronic components, thereby calculating electronic component performance degradation information 500 that indicates the performance degradation state of each electronic component.

[0060] Furthermore, similar to the first embodiment, the microcomputer 110 calculates the current degradation evaluation score (%) of each electronic component based on the current estimated performance value, stores the calculated degradation evaluation score (%) in the degradation evaluation score information 410, and updates the degradation evaluation score information 410.

[0061] Similar to the first embodiment, the microcomputer 110 outputs the electronic component performance degradation information 500 and the degradation evaluation point information 410 of each electronic component to an external device in response to an output command. Note that similar to the first embodiment, the microcomputer 110 may calculate the respective timings of maintenance, inspection, and replacement of each electronic component, or the respective priorities of maintenance, inspection, and replacement of each electronic component, based on the electronic component performance degradation information 500 and / or the degradation evaluation point information 410, and output the calculation results to an external device.

[0062] In response to an output command, the microcomputer 110 may also output to an external device time-series data of the performance values ​​of the electronic circuit of the electronic device 100. The user can reflect the results of viewing the time-series data of the performance values ​​of the electronic circuit of the electronic device 100 and the performance degradation information 500 in the design of the electronic device 100.

[0063] In addition, the microcomputer 110 may use AI or the like to analyze time-series data of the performance values ​​of the electronic circuit of the electronic device 100, calculate design information for the electronic circuit of the electronic device 100 that has been optimized based on the analysis results, and output the calculated design information to an external device.

[0064] <Specific Operation> Figure 7 is a flowchart showing the processing flow executed by the CPU 111 of the microcomputer 110. The CPU 111 executes the processing flow shown in Figure 7 every time a predetermined time has elapsed. The processing flow in Figure 7 is the same as the processing flow shown in the flowchart in Figure 6, except that steps 627 and 629 have been added between steps 625 and 630 in the flowchart in Figure 6. Therefore, the following will only explain these different steps 627 and 629, and will not explain the processing of the other steps.

[0065] Step 627: The CPU 111 measures the performance of the electronic circuit of the electronic device 100. That is, as described above, the CPU 111 measures time-series data of performance evaluation parameters that indicate the performance of the electronic circuit of the electronic device 100, and calculates time-series data of the performance value of each electronic component based on the measured performance evaluation parameters. The CPU 111 calculates the measured performance degradation curve of each electronic component based on the time-series data of the performance value of each electronic component and the stress cumulative time information 400.

[0066] Step 629: The CPU 111 feeds back (reflects) the measurement results of the performance of the electronic device 100 to the performance degradation curve of each electronic component in the performance degradation characteristic information 300. That is, the CPU 111 corrects the electronic component performance degradation characteristic information 300 using the measured performance degradation curve of each electronic component calculated in step 627. Note that the corrected electronic component performance degradation characteristic information 300 is used in subsequent processing.

[0067] As described above, electronic device 100 according to the second embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component. Furthermore, electronic device 100 according to the second embodiment can correct performance degradation characteristic information 300 of the electronic component based on actual measurements, and can more accurately estimate the state of degradation of each electronic component by using the corrected performance degradation characteristic information 300 of the electronic component.

[0068] <<Third Embodiment>> An electronic device 100 according to a third embodiment of the present invention will be described. The electronic device 100 according to the third embodiment differs from the electronic device 100 according to the first embodiment only in the following respects. The electronic device 100 according to the third embodiment estimates performance changes of each electronic component by calculation, and calculates stress evaluation parameters taking into account the estimated performance changes of each electronic component.

[0069] The following description will focus on this difference. <Overview> The microcomputer 110 periodically calculates stress evaluation parameters every predetermined time based on the design information and output data D1 of the electronic circuit included in the electronic device 100. In this calculation, the microcomputer 110 estimates performance changes of each electronic component based on the accumulated stress time information 400 and calculates the stress evaluation parameters taking the estimated performance changes into consideration. Specifically, for example, the microcomputer 110 acquires parameters necessary for calculating the stress evaluation parameters from the design information, corrects the acquired parameters necessary for calculating the stress evaluation parameters to values ​​corresponding to the performance changes estimated based on the accumulated stress time information 400, and calculates the stress evaluation parameters using the corrected values.

[0070] For example, if the parameter required to calculate the stress evaluation parameter is voltage, the voltage is corrected to a value estimated based on the stress cumulative time information 400, and the corrected value is used to calculate the stress evaluation parameter.

[0071] This correction is performed, for example, using the relationship between the stress cumulative time information 400, which is known in advance from experiments / simulations, and the parameters necessary for calculating the stress evaluation parameters of each electronic component. Note that, apart from the above points, the electronic device is the same as the electronic device 100 according to the first embodiment, and therefore a detailed description of other points will be omitted.

[0072] <Specific Operation> Figure 8 is a flowchart showing a processing flow executed by the CPU 111 of the microcomputer 110. The CPU 111 executes the processing flow shown in Figure 8 every time a predetermined time has elapsed. The processing flow in Figure 8 is the same as the processing flow shown in the flowchart in Figure 6, except that steps 827 and 829 have been added between steps 625 and 630 in the flowchart in Figure 6. Therefore, the following will explain these different steps 827 and 829, and will not explain the processing of the other steps.

[0073] Step 827: The CPU 111 estimates the performance change of the electronic component using the method described above. That is, the CPU 111 acquires the parameters necessary for calculating the stress evaluation parameters from the design information of each electronic component using the relationship between the stress cumulative time information 400 and the parameters necessary for calculating the stress evaluation parameters of each electronic component, and corrects the acquired parameters necessary for calculating the stress evaluation parameters to values ​​corresponding to the performance change estimated based on the stress cumulative time information 400.

[0074] Step 829: As described above, the CPU 111 reflects the performance change of the electronic component in the calculation of the next stress evaluation parameter. That is, in the subsequent step 605, the stress evaluation parameter of each electronic component is calculated by the above-described method.

[0075] <Effects> As described above, electronic device 100 according to the third embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component. Furthermore, electronic device 100 according to the third embodiment can estimate the performance change of the electronic component and more accurately estimate the state of deterioration of each electronic component by using stress evaluation parameters that reflect the estimated performance change of the electronic component.

[0076] <<Fourth Embodiment>> A system for estimating the degradation state of an electronic component according to a fourth embodiment of the present invention will now be described. Fig. 9 is a diagram showing an example of the system configuration of the system for estimating the degradation state of an electronic component according to the fourth embodiment. As shown in Fig. 9, the system for estimating the degradation state of an electronic component according to the fourth embodiment includes a plurality of electronic devices 900 and a management server 910. The plurality of electronic devices 900 and the management server 910 are connected via a network NW1 so as to be able to send and receive information to and from each other.

[0077] In the first embodiment, the degradation state estimation system for electronic components uses a management server 910 to execute the estimation of the degradation state of electronic components constituting the electronic device 900, which is executed by the electronic device 900. The electronic device 900 is similar to the electronic device 100 of the first embodiment except that it does not have a function for estimating the degradation state of electronic components. Therefore, the storage device 114 of the electronic device 900 does not store the performance degradation characteristic information 300 shown in Fig. 3 , the stress cumulative time information 400 shown in Fig. 4A , the degradation evaluation point information 410 shown in Fig. 4B , and the electronic component performance degradation information 500 shown in Fig. 5 , which are required to estimate the degradation state of electronic components.

[0078] The management server 910 includes a CPU 911, a ROM 912, a RAM 913, a non-volatile storage device 914 that can read and write data, a network interface 915, an input / output interface 916, and the like. These are connected to each other so that they can communicate with each other via a bus (not shown). The CPU 911 may be referred to as a "computing device." The management server 910 may be composed of multiple servers, or may be a virtual computer built on the cloud.

[0079] The CPU 911 realizes various functions by loading various programs stored in the ROM 912 and / or storage device 914 into the RAM 913 and executing the programs loaded into the RAM 913. As described above, various programs to be executed by the CPU 911 are loaded into the RAM 913, and data used when the CPU 911 executes the various programs is temporarily stored therein. The ROM 912 and / or storage device 914 are non-volatile storage media, and various programs are stored in the ROM 912 and / or storage device 914.

[0080] The storage device 914 stores (memorizes, saves) design information (not shown) of the electronic circuit of the electronic device 900, performance degradation characteristic information 300 shown in FIG. 3, stress cumulative time information 400 shown in FIG. 4A, degradation evaluation point information 410 shown in FIG. 4B, and performance degradation information 500 of the electronic component shown in FIG. 5.

[0081] The network interface 915 is an interface for connecting the management server 910 to the network NW1. The input / output interface 916 is an interface for connecting to a keyboard, a display device, etc. The display device is a display capable of displaying images. The management server 910 may use a hardware device configured in part or in whole using an FPGA (Field Programmable Gate Array) or the like.

[0082] <Overview> The microcomputer 110 of the electronic device 900 sequentially transmits output data D1 to the management server 910. The management server 910 uses the received output data D1 to perform an operation similar to the operation performed by the microcomputer 110 of the electronic device 100 in the first embodiment.

[0083] That is, the management server 910 periodically calculates the stress evaluation parameters every time a predetermined time elapses, based on the design information of the electronic circuit and the output data D1.

[0084] The management server 910 calculates time series data of the normalized electrical stress values ​​by normalizing the calculated time series data of the stress evaluation parameters of each electronic component by converting them into a ratio to the rated design value of each electronic component based on the design information.

[0085] Based on the time-series data of the normalized electric stress value, the management server 910 calculates which stress level range, from stress L1 402a1 to stress L10 402a10 in the accumulated stress time information 400, the normalized electric stress value falls into, and calculates the time spent operating in that stress level range. The management server 910 further calculates the accumulated time spent operating in that stress level range.

[0086] The management server 910 updates the stress cumulative time information 400 based on the calculated stress level range and the cumulative time spent operating within that stress level range.

[0087] The management server 910 calculates the time series data of the normalized electric stress value. The management server 910 creates the accumulated stress time information 400 based on the time series data of the normalized electric stress value and stores (preserves, memorizes) it in the storage device 814.

[0088] The management server 910 acquires the stress cumulative time and performance degradation curve for each stress level range corresponding to an electronic component from the electronic component performance degradation characteristic information 300 and the stress cumulative time information 400, and estimates the performance value of the electronic component based on the acquired stress cumulative time and performance degradation curve for each stress level range of the electronic component, thereby calculating time-series data of the estimated performance value of each electronic component up to a certain time tn. The management server 910 performs these calculations for each of the electronic components, thereby calculating electronic component performance degradation information 500 that indicates the performance degradation state of each electronic component.

[0089] Furthermore, the management server 910 calculates the current degradation evaluation score (%) of each electronic component based on the current estimated performance value, and stores the calculated degradation evaluation score in the degradation evaluation score information 410 .

[0090] In response to an output command, the management server 910 outputs the electronic component performance degradation information 500 and the degradation evaluation point information 410 of each electronic component to an external device. Note that the management server 910 may calculate the respective timings for maintenance, inspection, and replacement of each electronic component, or the respective priorities for maintenance, inspection, and replacement of each electronic component, based on the electronic component performance degradation information 500 and / or the degradation evaluation point information 410, and output the calculation results to an external device.

[0091] Based on the performance degradation information 500 and degradation evaluation point information 410 (or information processed from these) of the electronic components of all the electronic devices 900 displayed on the display device, the user can determine the timing of maintenance, inspection, and replacement of each electronic component of all the electronic devices 900, as well as the priority of maintenance, inspection, and replacement of each electronic component. Based on the determination results, the user can take appropriate measures against the degradation of each electronic component and plan appropriate countermeasures against the degradation of each electronic component. Based on the prediction results, the user can collectively manage each electronic component in all the electronic devices 900 when determining the priority of maintenance, inspection, and replacement and taking countermeasures based on the performance degradation information 500 and degradation evaluation point information 410 (or information processed from these) of the electronic components of all the electronic devices 900 displayed on the display device.

[0092] In addition, when calculating the estimated performance value of each electronic component, the management server 910 may improve the accuracy of the calculation results of the estimated performance value by correcting the calculation results of the same electronic component or similar electronic components present in all electronic devices 900 using a statistical processing method.

[0093] 10 is a flowchart showing the processing flow executed by the CPU 911 of the management server 910. The CPU 911 executes the processing flow shown in FIG. 10 every time a predetermined time elapses. When the CPU 911 starts processing from step 1000, it sequentially executes the processing of steps 1005 to 1030 described below, and then proceeds to step 1035.

[0094] Step 1005: The CPU 911 receives output data D1 from each electronic device 900. Step 1010: The CPU 911 calculates time-series data of stress evaluation parameters for each electronic component during circuit operation based on the output data D1 for a predetermined time period and the design information. Step 1015: The CPU 911 normalizes the time-series data of the stress evaluation parameters using the normalization parameters to calculate time-series data of normalized electrical stress values. Step 1020: As described above, the CPU 911 calculates the cumulative time for each stress level using the time-series data of normalized electrical stress values ​​for a predetermined time period, and stores the cumulative stress time information 400 in the storage device 914. Step 1025: The CPU 911 calculates an estimated performance degradation curve up to the present time based on the cumulative stress time information 400 and the performance degradation characteristic information 300 using the method described above to calculate performance degradation information 500 of the electronic component, and stores the performance degradation information 500 in the storage device 914. Step 1030: The CPU 911 calculates the deterioration evaluation score of each electronic component using the method described above, and stores the calculated deterioration evaluation score of each electronic component in the deterioration evaluation score information 410.

[0095] When the CPU 911 proceeds to step 1035, it determines whether or not there is a data output command. If there is no data output command, the CPU 911 determines "NO" in step 1035, proceeds to step 1095, and temporarily ends this processing flow.

[0096] If there is a data output command, the CPU 911 determines "YES" in step 1035 and proceeds to step 1040, where it outputs the performance degradation information 500 and the degradation evaluation point information 410 to the external device for which output has been requested. Thereafter, the CPU 911 proceeds to step 1095, where it temporarily ends this processing flow.

[0097] In the flowchart of FIG. 10, step 1035 may be omitted, and the CPU 911 may periodically perform the process of step 1040.

[0098] <Effects> As described above, the deterioration state estimation system for electronic components according to the fourth embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component.

[0099] Fifth Embodiment A degradation state estimation system for electronic components according to a fifth embodiment of the present invention will be described. The degradation state estimation system for electronic components according to the fifth embodiment differs from the degradation state estimation system for electronic components according to the fourth embodiment only in the following respects: The degradation state estimation system for electronic components according to the fifth embodiment periodically monitors the performance of electronic devices 900 and reflects the monitoring results in performance degradation characteristic information 300 (performance degradation curve) of the electronic components.

[0100] The following description will focus on this difference. <Overview> The microcomputer 110 of the electronic device 900 periodically transmits output data D1 to the management server 910 every time a predetermined time has elapsed. The management server 910 uses the received output data D1 to perform an operation similar to that performed by the microcomputer 110 in the second embodiment. This operation has already been described in the second embodiment, so its description will be omitted. As in the first embodiment, when calculating the estimated performance value of each electronic component, the management server 910 may improve the accuracy of the calculation results of the estimated performance value by correcting the calculation results of the same electronic component or similar electronic components present in all the electronic devices 900 using a statistical processing method. In addition, the management server 910 may store (memorize, save) time-series data of performance evaluation parameters indicating the performance of the electronic circuits of all electronic devices 900 in the storage device 914, and by analyzing this stored data (big data), calculate criteria for determining the timing of maintenance, inspection, and replacement of each electronic component of the electronic device 900, or criteria for determining the priority of maintenance, inspection, and replacement of each electronic component, and output the calculated results to an external device.

[0101] <Specific Operation> Figure 11 is a flowchart showing the processing flow executed by the CPU 911 of the management server 910. The CPU 911 executes the processing flow shown in Figure 11 every time a predetermined time period has elapsed. The processing flow in Figure 11 is the same as the processing flow shown in the flowchart in Figure 10, except that steps 1032 and 1034 have been added between steps 1030 and 1035 in the flowchart in Figure 10. Therefore, the following will explain these different steps 1032 and 1034, and will not explain the processing of the other steps.

[0102] Step 1032: The CPU 911 measures the performance of the electronic device 900. That is, as described above, the CPU 911 measures time-series data of performance evaluation parameters that indicate the performance of the electronic circuit of the electronic device 900, and calculates time-series data of the performance value of each electronic component based on the measured performance evaluation parameters. The CPU 911 calculates the measured performance degradation curve of each electronic component based on the time-series data of the performance value of each electronic component and the stress cumulative time information 400.

[0103] Step 1034: The CPU 911 feeds back (reflects) the measurement results of the performance of the electronic circuit of the electronic device 900 to the performance degradation curve of each electronic component in the performance degradation characteristic information 300. That is, the CPU 911 corrects the electronic component performance degradation characteristic information 300 using the measured performance degradation curve of each electronic component calculated in step 1032. Note that the corrected electronic component performance degradation characteristic information 300 is used in subsequent processing.

[0104] <Effects> As described above, the degradation state estimation system according to the fifth embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component. Furthermore, the degradation state estimation system according to the fifth embodiment corrects the performance degradation characteristic information 300 of the electronic component based on actual measurements, and by using the corrected performance degradation characteristic information 300 of the electronic component, can more accurately estimate the state of degradation of each electronic component.

[0105] <<Sixth Embodiment>> A deterioration state estimation system for electronic components according to a sixth embodiment of the present invention will be described. The deterioration state estimation system for electronic components according to the sixth embodiment differs from the deterioration state estimation system for electronic components according to the fourth embodiment only in the following respects: The deterioration state estimation system for electronic components according to the sixth embodiment estimates performance changes of each electronic component and calculates stress evaluation parameters taking into account the estimated performance changes of each electronic component.

[0106] The following description will focus on this difference. <Overview> The microcomputer 110 of the electronic device 900 periodically transmits output data D1 to the management server 910 every time a predetermined time has elapsed. The management server 910 uses the received output data D1 to perform an operation similar to that executed by the microcomputer 110 in the third embodiment. This operation has already been described in the third embodiment, so its description will be omitted. As in the first embodiment, when calculating the estimated performance value of each electronic component, the management server 910 may improve the accuracy of the calculation results of the estimated performance value by correcting the calculation results of the same electronic component or similar electronic components present in all the electronic devices 900 using a statistical processing method.

[0107] <Specific Operation> Figure 12 is a flowchart showing the processing flow executed by the CPU 911 of the management server 910. The CPU 911 executes the processing flow shown in Figure 12 every time a predetermined time period has elapsed. The processing flow in Figure 12 is the same as the processing flow shown in the flowchart in Figure 10, except that steps 1232 and 1234 have been added between steps 1030 and 1035 in the flowchart in Figure 10. Therefore, the following will explain these different steps 1232 and 1234, and will not explain the processing of the other steps.

[0108] Step 1232: The CPU 911 estimates the performance change of the electronic component using the method described above. That is, the CPU 911 acquires the parameters necessary for calculating the stress evaluation parameters from the design information of each electronic component using the relationship between the stress cumulative time information 400 and the parameters necessary for calculating the stress evaluation parameters of each electronic component, and corrects the acquired parameters necessary for calculating the stress evaluation parameters to values ​​corresponding to the performance change estimated based on the stress cumulative time information 400.

[0109] Step 1234: As described above, the CPU 911 reflects the performance change of the electronic component in the calculation of the next stress evaluation parameter. That is, in the subsequent step 1010, the stress evaluation parameter of each electronic component is calculated by the above-described method.

[0110] <Effects> As described above, the degradation state estimation system according to the sixth embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component. Furthermore, the degradation state estimation system according to the sixth embodiment can estimate a change in performance of the electronic component and more accurately estimate the state of degradation of each electronic component by using stress evaluation parameters that reflect the estimated performance change of the electronic component.

[0111] <<Seventh Embodiment>> An electronic device 1300 according to a seventh embodiment of the present invention will be described. The electronic device 1300 according to the seventh embodiment differs from the electronic device 100 according to the first embodiment only in the following respects: The electronic device 1300 according to the seventh embodiment calculates stress evaluation parameters (e.g., voltage, current, power, bias conditions, heat generation temperature, etc. of each electronic component) for each electronic component constituting a circuit based on input data D2.

[0112] 13 is a diagram illustrating an example of an electronic device 1300 according to a seventh embodiment of the present invention. As shown in FIG. 13, the electronic device 1300 includes a microcomputer 1310, a sensor 1320, an IV conversion circuit 1330, a first amplifier circuit 1340, a second amplifier circuit 1350, and an ADC 1360.

[0113] The microcomputer 1310 has a configuration similar to that of the microcomputer 110 according to the first embodiment, and similar to the first embodiment, design information, performance degradation characteristic information 300, stress cumulative time information 400, degradation evaluation point information 410, and electronic component performance degradation information 500 are stored (memorized, saved) in the storage device 114.

[0114] The sensor 1320 is a device that collects information from the surrounding environment and converts it into an electrical signal or data. The sensor 1320 is, for example, a temperature sensor. The IV conversion circuit 1330 is a circuit that converts a current signal into a voltage signal. The first amplifier circuit 1340 amplifies the input voltage signal and generates an output voltage signal. The second amplifier circuit 1350 amplifies the input voltage signal and generates an output voltage signal. The ADC 1360 is an analog-to-digital converter, a device that converts an analog signal into a digital signal.

[0115] The microcomputer 1310 calculates stress evaluation parameters (such as the voltage, current, power, bias conditions, and heat generation temperature of each electronic component) every time a predetermined time elapses as information for evaluating the electrical stress of each electronic component constituting the circuit during actual operation, based on design information of the electronic circuit provided in the electronic device 1300 and input data D2 input to the microcomputer 1310. Other than the above, the present embodiment is the same as the first embodiment, and therefore a description thereof will be omitted.

[0116] <Effects> As described above, the electronic device 1300 according to the seventh embodiment of the present invention can estimate the state of each electronic component without providing a dedicated sensor for determining (detecting) the state of the electronic component. Note that the features of the electronic device 100 according to the second embodiment may be applied to the electronic device 1300 according to the seventh embodiment. The features of the electronic device 100 according to the third embodiment may be applied to the electronic device 1300 according to the seventh embodiment.

[0117] <<Modifications>> The present invention is not limited to the above-described embodiments, and various modifications can be adopted within the scope of the present invention. Furthermore, the above-described embodiments can be combined with each other without departing from the scope of the present invention.

[0118] In the fourth to sixth embodiments, another electronic device (which differs from the electronic device 1300 only in that the performance degradation characteristic information 300 shown in FIG. 3 , the stress cumulative time information 400 shown in FIG. 4A , the degradation evaluation point information 410 shown in FIG. 4B , and the electronic component performance degradation information 500 shown in FIG. 5 ) may be used instead of the electronic device 900. In this case, the management server 910 operates in the same manner as in the fourth to sixth embodiments, except that it receives input data D2 instead of output data D1 from the electronic device.

[0119] In each embodiment, a threshold value may be set for the estimated performance value, and when the estimated performance value exceeds the threshold value, the user may be notified via (using) an external device (e.g., a user terminal) that the electronic component is deteriorating, for example, by sound, image, etc.

[0120] In each embodiment, a threshold value may be set for the degradation evaluation point, and when the degradation evaluation point exceeds the threshold value, the user may be notified that the electronic component has deteriorated, for example, by sound, image, etc., via (using) an external device (e.g., a user terminal, etc.).

[0121] The present invention can also have the following configuration. [1] A degradation state estimation method for estimating a degradation state of each electronic component of an electronic device comprising an electronic circuit having a plurality of electronic components, using at least one arithmetic device inside or outside the electronic device and at least one storage device inside or outside the electronic device, wherein the storage device stores design information of the electronic circuit and performance degradation characteristic information indicating the characteristics of performance degradation of each electronic component of the electronic device, the arithmetic device: calculates time series data of stress evaluation parameters of each electronic component when the electronic circuit is operating based on the design information of the electronic circuit and output data to or input data from the electronic circuit, and calculates time series data of normalized electric stress values ​​of each electronic component by normalizing the calculated time series data of the normalized electric stress values ​​of each electronic component, calculates accumulated stress time information indicating the accumulated time that each electronic component of the electronic device has actually operated in each of a plurality of stress level ranges based on the time series data of the normalized electric stress values ​​of each electronic component, and stores the calculated information in the storage device, and calculates an estimated performance value of each electronic component indicating the performance degradation state of each electronic component of the electronic device based on the accumulated stress time information and the performance degradation characteristic information. a processing unit that calculates a performance change of the electronic component, and calculates the time-series data of the stress evaluation parameters based on design information of the electronic circuit and the output data or the input data, so as to reflect the calculated performance change.

[0122] 100...electronic device, 110...microcomputer, 111...CPU, 114...storage device, 300...performance degradation characteristic information, 400...stress cumulative time information, 410...degradation evaluation point information, 500...performance degradation information, 900...electronic device, 910...management server, 911...CPU, 914...storage device, D1...output data, D2...input data

Claims

1. An electronic device comprising: an electronic circuit having a plurality of electronic components; and a computer having an arithmetic unit and a storage device, wherein the storage device stores design information of the electronic circuit and performance degradation characteristic information indicating performance degradation characteristics of each electronic component, the arithmetic unit calculates time series data of stress evaluation parameters of each electronic component when the electronic circuit is operating based on the design information of the electronic circuit and output data to the electronic circuit or input data from the electronic circuit, calculates time series data of electric stress normalized values ​​of each electronic component by normalizing the calculated time series data of the stress evaluation parameters of each electronic component, calculates stress cumulative time information indicating the cumulative time that each electronic component actually operated in each of a plurality of stress level ranges based on the time series data of the electric stress normalized values ​​of each electronic component and stores the calculated stress cumulative time information in the storage device, and calculates an estimated performance value of each electronic component indicating a performance degradation state of each electronic component based on the stress cumulative time information and the performance degradation characteristic information.

2. An electronic device according to claim 1, wherein the arithmetic device is configured to measure a degradation state of the electronic circuit when the electronic device is actually operating, correct the performance degradation characteristic information of each electronic component based on the measured degradation state of the electronic circuit, and calculate the estimated performance value of each electronic component using the corrected performance degradation characteristic information.

3. An electronic device according to claim 1, wherein the arithmetic device is configured to calculate a performance change of the electronic component, and when calculating time series data of the stress evaluation parameters based on design information of the electronic circuit and the output data or the input data, calculate the time series data of the stress evaluation parameters so as to reflect the calculated performance change.

4. An electronic device according to claim 1, wherein the arithmetic unit is configured to store the calculated estimated performance value of each electronic component as performance degradation information in the storage device.

5. An electronic device according to claim 4, wherein the arithmetic device is configured to calculate a degradation assessment point for each electronic component to evaluate the degradation state of each electronic component based on the estimated performance value, and to store degradation assessment point information indicating the calculated degradation assessment point for each electronic component in the storage device.

6. An electronic device according to claim 5, wherein the arithmetic device is configured to output at least one of the performance degradation information and the degradation evaluation point information, or information based on at least one of the performance degradation information and the degradation evaluation point information, to an external device.

7. An electronic device according to claim 1, wherein the computing device is configured to determine whether the estimated performance value of each electronic component is equal to or greater than a threshold value, and if so, to use an external device to notify a user that the electronic component is deteriorating.

8. An electronic device according to claim 2, wherein the arithmetic device is configured to analyze the measured deterioration state of the electronic circuit of the electronic device, calculate optimized design information for the electronic circuit of the electronic device based on the analysis results, and output the design information to an external device.

9. A degradation state estimation system for electronic components, comprising: an electronic device including an electronic circuit having a plurality of electronic components and a computer; and a management server having an arithmetic unit and a storage device, wherein the storage device stores design information of the electronic circuit and performance degradation characteristic information indicating the characteristics of performance degradation of each electronic component of the electronic device; the arithmetic unit acquires output data from the electronic device to the electronic circuit or input data from the electronic circuit, calculates time series data of stress evaluation parameters for each electronic component when the electronic circuit is operating based on the design information of the electronic circuit and the acquired output data to the electronic circuit or the acquired input data from the electronic circuit, and calculates time series data of electric stress normalized values ​​for each electronic component by normalizing the calculated time series data of the stress evaluation parameters for each electronic component, calculates stress cumulative time information indicating the cumulative time that each electronic component of the electronic device actually operated in each of a plurality of stress level ranges based on the time series data of the electric stress normalized values ​​of each electronic component, and stores the calculated stress cumulative time information in the storage device, and calculates an estimated performance value of each electronic component indicating the performance degradation state of each electronic component of the electronic device based on the stress cumulative time information and the performance degradation characteristic information. The deterioration state estimation system for electronic components is configured as follows.

10. A system for estimating the deterioration state of an electronic component as described in claim 9, wherein the arithmetic device is configured to measure the deterioration state of the electronic circuit when the electronic device is actually operating, correct the performance degradation characteristic information of each electronic component based on the measured deterioration state of the electronic circuit, and calculate the estimated performance value of each electronic component using the corrected performance degradation characteristic information.

11. A system for estimating the deterioration state of an electronic component as described in claim 9, wherein the arithmetic device is configured to calculate a performance change of the electronic component, and when calculating time series data of the stress evaluation parameters based on design information of the electronic circuit and the output data or the input data, calculate the time series data of the stress evaluation parameters so as to reflect the calculated performance change.

12. A degradation state estimation method for estimating a degradation state of each electronic component of an electronic device having an electronic circuit having a plurality of electronic components, using at least one of an internal and external arithmetic device of the electronic device and at least one of an internal and external storage device of the electronic device, wherein the storage device stores design information of the electronic circuit and performance degradation characteristic information indicating the characteristics of performance degradation of each electronic component of the electronic device, the arithmetic device calculates time series data of stress evaluation parameters of each electronic component when the electronic circuit is operating based on the design information of the electronic circuit and output data to the electronic circuit or input data from the electronic circuit, and calculates time series data of electric stress normalized values ​​of each electronic component by normalizing the calculated time series data of the stress evaluation parameters of each electronic component, calculates stress cumulative time information indicating the cumulative time that each electronic component of the electronic device actually operated in each of a plurality of stress level ranges based on the time series data of the electric stress normalized values ​​of each electronic component, and stores the calculated stress cumulative time information in the storage device, and calculates an estimated performance value of each electronic component indicating the performance degradation state of each electronic component of the electronic device based on the stress cumulative time information and the performance degradation characteristic information. A method for estimating the degradation state of electronic components.

13. A method for estimating the deterioration state of electronic components as described in claim 12, comprising the steps of: measuring, by the arithmetic device, the deterioration state of the electronic circuit when the electronic device is actually operating; correcting the performance degradation characteristic information of each electronic component based on the measured deterioration state of the electronic circuit; and calculating the estimated performance value of each electronic component using the corrected performance degradation characteristic information.

14. A method for estimating the deterioration state of an electronic component as described in claim 12, further comprising the steps of: calculating a performance change of the electronic component by the arithmetic device; and, when calculating time series data of the stress evaluation parameters based on design information of the electronic circuit and the output data or the input data, calculating the time series data of the stress evaluation parameters so as to reflect the calculated performance change.

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