Heat dissipation substrate, vapor chamber, and functional module

Abstract

This heat dissipation substrate is provided with a base material. The base material has: a first plate having a mounting region for a heat source; a second plate positioned in the Z-direction of the first plate; an internal space positioned between the first plate and the second plate; and a support column that is positioned in the internal space and connects the first plate and the second plate along the Z-direction. The support column has a first portion in which a cross-sectional area perpendicular to the Z-direction increases partially within a range including a connected position with the first plate. The mounting region overlaps at least a part of an expanded portion, of the first portion, in which the cross-sectional area of the support column increases in a plan perspective view.

Description

Heat dissipation substrate, vapor chamber and functional module

[0001] The present disclosure relates to a heat dissipation substrate, a vapor chamber, and a functional module.

[0002] There is a vapor chamber that efficiently dissipates heat by moving a heat transfer medium between a liquid phase and a gas phase at high speed. JP 2017-044356 A discloses a shape in which supports are positioned to avoid the mounting position of electronic components that are the target of heat dissipation, in order to reduce deformation of the base while not interfering with heat dissipation.

[0003] One aspect of the present disclosure is a heat dissipation substrate comprising: [1] a base including: a first plate having a mounting area for a heat source; a second plate located in a first direction of the first plate; an internal space located between the first plate and the second plate; and a support pillar located in the internal space and connecting the first plate and the second plate along the first direction, wherein the support pillar has a first portion whose cross-sectional area perpendicular to the first direction is partially increased in an area including a connection position with the first plate, and the mounting area overlaps, in a planar perspective, at least a part of the expanded portion of the support pillar in the first portion where the cross-sectional area is increased. [2] The heat dissipation substrate of [1], wherein the rate of increase in the cross-sectional area in the first portion is nonlinear with respect to position change in the first direction. [3] The heat dissipation substrate of [2], wherein the surface shape of the first portion is an arc shape when viewed in a cross section along the first direction. [4] The heat dissipation substrate of [1] or [2], wherein the support pillar has a non-uniform increase in cross-section in plan view, and the mounting region overlaps a portion of the extended portion with a smaller increase in cross-section in plan view. [5] The heat dissipation substrate of [1] or [2], wherein the support pillar has a non-uniform increase in cross-section in plan view, and the mounting region overlaps a portion of the extended portion with a larger increase in cross-section in plan view. [6] The heat dissipation substrate of [1] or [2], wherein the support pillar has a second portion where the cross-sectional area is partially increased in a range including a connection portion with the second plate. [7] The heat dissipation substrate of [6], wherein the increase in cross-section of the second portion is smaller than the increase in cross-section of the first portion. [8] The heat dissipation substrate of any one of [1] to [7], comprising a wick located in the internal space. [9] A vapor chamber comprising the heat dissipation substrate of [8] and a heat transfer medium located in the internal space.

[10] A functional module comprising: a heat-generating functional component; and the vapor chamber according to [9], in which the functional component is mounted.

[0004] 5A . A horizontal cross-sectional view of a vapor chamber including a heat dissipation substrate. A vertical cross-sectional view of a vapor chamber. A view showing a cross-section of a wick. An enlarged view showing a cross-section of a wick. A cross-sectional view showing the range from the first plate to the second plate of the hollow portion. An enlarged view of a portion of one powder particle constituting the wick. A view showing a cross-section taken along line B1-B1 of FIG. 5A. A cross-sectional view illustrating the positional relationship between the shape of the support pillar and the heat source of this embodiment. A cross-sectional view illustrating the positional relationship between the shape of the support pillar and the heat source of this embodiment. A cross-sectional view illustrating the positional relationship between the shape of the support pillar and the heat source of this embodiment. A cross-sectional view illustrating the positional relationship between the shape of the support pillar and the heat source of this embodiment. A schematic plan view perspective of an example of the positional relationship between the support pillar and the area ... FIG. 1 is a schematic plan view perspective diagram showing an example of the positional relationship between a heat source and supports when the heat source is supported by a plurality of supports. FIG. 1 is a schematic plan view perspective diagram showing an example of the positional relationship between a heat source and supports when the heat source is supported by a plurality of supports. FIG. 1 is a cross-sectional view showing another example of an extended portion. FIG. 1 is a cross-sectional view showing another example of an extended portion. FIG. 1 is a diagram showing another example of an extended portion. FIG. 1 is a cross-sectional view illustrating the positional relationship between an extended portion and powder particles according to the radius of curvature. FIG. 1 is a cross-sectional view illustrating the positional relationship between an extended portion and powder particles according to the radius of curvature. FIG. 1 is a schematic plan view perspective diagram showing another example of the shape of an extended portion. FIG. 1 is a ... a cross-section of a support in a vapor chamber. FIG. 1 is a diagram showing a functional module according to a second embodiment of the present disclosure. FIG. 2 is a diagram showing a functional module according to a third embodiment of the present disclosure. FIG. 2 is a diagram showing a functional module according to a fourth embodiment of the present disclosure. FIG. 3 is a diagram showing a functional module according to a fifth embodiment of the present disclosure. FIG. 3 is a diagram showing a functional module according to a sixth embodiment of the present disclosure.

[0005] Hereinafter, an embodiment will be described with reference to the drawings. Fig. 1A shows a horizontal cross-sectional view of a vapor chamber 1 including a heat dissipation substrate 10 of this embodiment. Fig. 1B shows a vertical cross-sectional view of the vapor chamber 1. The horizontal cross-sectional view of Fig. 1A is a cross-sectional view taken along a plane that passes through the center in the Z direction, which is the height direction, and is parallel to the first surface 101. The Z direction represents the first direction in this embodiment. The vertical cross-sectional view of Fig. 1B is a cross-sectional view taken along the cross-sectional line AA in Fig. 1A.

[0006] The heat dissipation substrate 10 of the vapor chamber 1 includes a base 11 having an internal space 110. The base 11 may be a rectangular parallelepiped. Alternatively, the outer edge of the base 11 may have each side or corner chamfered. A support 12 and a wick 13 are located in the internal space 110. For example, the center of the corresponding range 111 overlaps in planar perspective with a mounting area 103 for an electronic component or the like that is a heat source to be dissipated. Note that the corresponding range 111 does not have to be square in planar view. The planar shape of the corresponding range 111 may be various shapes that conform to the shape of the component that is the heat source.

[0007] The base 11 seals the internal space 110. The base 11 is made of a thermally conductive material and may include, for example, a metal such as copper or aluminum. Alternatively, the base 11 may be ceramic or a mixture of ceramic and metal. The base 11 includes a first plate 112 located on the mounting area 103 side, i.e., the +Z side, and a second plate 113 located on the -Z side opposite the mounting area 103. In addition to mounting electronic components that serve as heat sources in the mounting area 103 on the outer surface of the first plate 112, wiring and connection pads connected to the electronic components may also be located on the outer surface of the first plate 112. Side walls surrounding the internal space 110 are connected to the peripheral portions of the first plate 112 and the second plate 113.

[0008] The support pillars 12 extend in a direction perpendicular to the first surface 101, which includes the mounting area 103, within the internal space 110 in a planar perspective view. The support pillars 12 may include support pillars with rounded corners and a substantially rectangular horizontal cross section. Alternatively, instead of a rectangular shape with rounded corners, the support pillars 12 may include support pillars shaped like two semicircles connected by a rectangle. The support pillars 12 may be integral with the first plate 112 and may be a separate member from the second plate 113. The second plate 113 may be joined to the first plate 112, the support pillars 12, and other parts, including the sidewalls, using brazing material or the like. The number of support pillars 12 shown in FIG. 1A is limited for illustrative purposes, and the actual number may be greater than the number shown.

[0009] The wick 13 is located in the portion of the internal space 110 where the support 12 is not present. The wick 13 may be, for example, a porous body in which powder containing multiple particles is bonded together, with voids between the particles. Hereinafter, each powder particle will be referred to as a powder particle. In this case, at least some of the voids are connected, allowing the heat transfer medium W in a liquid or gas state to flow through. The multiple powder particles may each be spherical, have other shapes, or be irregular. The term "spherical" does not necessarily mean a strict sphere or an oblate spheroid, but rather includes spheres with distortions or small irregularities. Furthermore, the surface of the powder particle 50 may have small protrusions 51 (see FIG. 3). Such powder particles 50 may be formed, for example, by an atomization method. Furthermore, other portions of the powder particles 50 may have other shapes, such as protruding in a certain direction. Alternatively, the wick 13 may be a mesh-like member in which linear members are woven into a mesh, or a structure in which multiple films with numerous pores are stacked at intervals. The wick may be a single or multiple structure and may be metallic or ceramic, or a combination thereof.

[0010] The wick 13 may have a structure in which a plurality of powder particles 50 are fixed together as a whole by bonding portions of adjacent powder particles 50 together. Each powder particle 50 may be made of a metal such as copper. Bonding between adjacent powder particles 50 may be achieved by a sintering process to an extent that does not promote densification of the plurality of powder particles 50. The particle size of the powder particles 50 may be 1 μm to 1000 μm, 10 μm to 700 μm, or 20 μm to 500 μm. The particle size of the powder particles 50 may be 20 μm, 100 μm, or 200 μm. The particle size refers to the average of the major axis and the minor axis. The particle size refers to the median particle size of the particle size distribution.

[0011] The wick 13 may be fixed to the internal space 110 so as to be in contact with the first plate 112. The wick 13 may be fixed to the internal space 110 so as to be in contact with the inner surface of the base 11 and the side surface of the support 12. This fixing may be achieved by bonding the first plate 112 and the side surface to some of the powder particles 50 in contact therewith. This bonding may be achieved by a sintering process to an extent that the densification of the multiple powder particles 50 does not proceed.

[0012] The bonding between the powder particles 50 in the wick 13 and the bonding between the first plate 112 and the powder particles 50 may be achieved by the same sintering process.

[0013] <Details of Void G 1> Fig. 2 is a diagram showing a cross section of the wick 13. In the wick 13, a plurality of powder particles 50 are positioned with voids G. Hatching of the cross section of the powder particles 50 is omitted in Fig. 2. The plurality of voids G included in the wick 13 may include a first void G1 having a width wG larger than the average particle size w50 of the powder particles 50 in the cross section. The above cross section may be a cross section in any direction.

[0014] In the cross-sectional photograph, the voids G are easily identifiable because their contrast is significantly different from that of the powder particles 50. Therefore, the size and cross-sectional shape of the voids G can be observed from the cross-sectional photograph. Almost all of the voids G are connected in three-dimensional space. However, by dividing the voids G into blocks in the cross-sectional photograph, the connected voids G can be considered as a collection of multiple voids G. Individual voids G in the cross section are defined as follows: First, the maximum width of the linearly continuous void region in a direction perpendicular to the linear direction is determined. Next, the area connected to the void region and having a width of 1 / 5 or less of the maximum width is defined as the periphery of one void G. With this definition, the area including the void region having the maximum width and surrounded by the powder particles 50 and the periphery can be identified as one void G. The width of each void G can then be determined.

[0015] By observing the surface of the wick 13 with a scanning electron microscope (SEM), individual powder particles 50 can be easily identified. The particle size of each powder particle 50 can be determined from the surface observation. The particle size is the average of the major axis and the minor axis. Furthermore, by selecting multiple dispersed regions and taking statistics of the particle sizes of the powder particles 50 in each region, the average particle size of the multiple powder particles 50 that make up the wick 13 can be determined.

[0016] According to the above configuration, the first gap G1 having a width wG larger than the average particle size w50 of the powder particles 50 is included, thereby improving the ease of movement of the heat transfer medium W in the liquid or gas phase through the first gap G1. Therefore, such a wick 13 contributes to the good heat dissipation characteristics of the vapor chamber 1 by allowing the heat transfer medium W to function as a refrigerant.

[0017] <Details of the Void G 2> As shown in Fig. 2, in the cross section of the wick 13, there may be four or more connection points cn between the first void G1 and another void G. The number of connection points cn may be five or more, or may be six or more. When the boundaries of each void G and the first void G1 are defined by the above definitions, the first void G1 in Fig. 2 is connected to another adjacent void G via six connection points cn.

[0018] According to this configuration, the large first gap G1 is connected to another gap G at four or more connection points cn in the cross section, which further improves the ease of movement of the heat transfer medium W in the liquid or gas phase through the first gap G1. The presence of more connection points cn further improves the ease of movement of the heat transfer medium W. This contributes to the good heat dissipation characteristics of the vapor chamber 1.

[0019] <Details of the Gaps g Between Powder Particles 50> Figure 3 is an enlarged view showing the cross section of the wick 13. Hatching of the cross section of the powder particles 50 is omitted in Figure 3. Each powder particle 50 in the wick 13 has a gap g between the fine protrusions 51. In the cross section of the wick 13, the width wg of the gap g between the powder particles 50 may be smaller than the width wG of the voids G connected to the gap g. This configuration results in the wick 13 including voids G of various sizes and gaps g having widths wg even smaller than the width of the voids G. Therefore, the voids G improve the mobility of the heat transfer medium W, while the capillary force of the gaps g improves the retention of the heat transfer medium W. This reduces localized drying of the wick 13 and facilitates phase transition of the heat transfer medium W and exchange between the liquid and gas phases of the heat transfer medium W. This contributes to the excellent heat dissipation characteristics of the vapor chamber 1.

[0020] The multiple powder particles 50 may include adjacent first particles 50A and second particles 50B, and the gaps gA between the first particles 50A and the gaps gB between the second particles 50B may be in contact. That is, the protrusions 51a, 51a of the first particles 50A, which sandwich the gap gA, and the protrusions 51b, 51b of the second particles 50B, which sandwich the gap gB, are bonded by a sintering process, resulting in a structure in which the gaps gA and gB are in contact with each other. This configuration allows the fine gaps gA and gB to continue for a long period of time, allowing more heat transfer medium W to be held in the gaps g. This further reduces localized drying of the wick 13, contributing to the excellent heat dissipation characteristics of the vapor chamber 1.

[0021] Furthermore, the direction in which the gap gA between the first particles 50A expands may intersect with the direction in which the gap gB between the second particles 50B expands. That is, the gaps gA and gB may be in contact with each other so that an imaginary plane extending along the gap gA between the first particles 50A intersects with an imaginary plane extending along the gap gB between the second particles 50B. With this configuration, the narrow gap G between the first particles 50A and the second particles 50B communicates with the gaps gA and gB, and a strong capillary force can be generated in this portion.

[0022] <Overall structure of wick> Fig. 4 is a cross-sectional view showing the range from the first plate 112 to the second plate 113 of the internal space 110. In Fig. 4, the cross section of the powder particle 50 is shown in white, and the void portion G is shown in hatching.

[0023] In this cross-sectional view, the wick 13 may have a communication path V that connects from the first plate 112 to the end on the opposite side of the first plate 112 via a gap G. This configuration allows the gas-phase heat transfer medium W to be smoothly transported from the first plate 112 side of the wick 13 to the opposite side via the communication path V. Furthermore, the wick 13 can smoothly transport the liquid-phase heat transfer medium W from the opposite side of the first plate 112 of the wick 13 to the first plate 112 side due to the capillary force of small gaps G located around the communication path V or gaps g between the powder particles 50. Therefore, heat is smoothly transported due to the phase transition of the heat transfer medium W, contributing to the good heat dissipation characteristics of the vapor chamber 1.

[0024] In the cross section of the wick 13, the plurality of gaps G may include second gaps G2 that are in contact with the first plate 112 and have a width wG2 that is greater than the average particle size w50 of the powder particles 50 in the normal direction to the inner surface of the first plate 112. This configuration can increase the amount of liquid-phase heat transfer medium W that is returned to the first plate 112 side. Therefore, the amount of phase transition of the heat transfer medium W in the first plate 112 can be increased, and the amount of heat absorbed via the first plate 112 can be increased.

[0025] The gaps g between the powder particles 50 may be adjacent to the region 110B where the wick 13 is not located. In other words, if the region 110B is considered to be a flow path for the gaseous heat transfer medium W, the gaps g between the powder particles 50 may be adjacent to the flow path. If the liquid-phase transfer path is adjacent to the flow path for the gaseous heat transfer medium W, localized drying of the liquid-phase transfer path is likely to occur in that area. On the other hand, providing an unnecessary wall to separate the two narrows the internal space 110. In this embodiment, the flow path for the gaseous heat transfer medium W is adjacent to the minute gaps g where strong capillary forces are generated, thereby reducing the occurrence of the localized drying. Therefore, the wick 13 allows the flow of the gaseous heat transfer medium W and the reflux of the liquid-phase heat transfer medium W countercurrent to the flow to be performed smoothly, contributing to the excellent heat dissipation characteristics of the vapor chamber 1.

[0026] <Details of Powder Particles> FIG. 5A is an enlarged view of a portion of one powder particle constituting the wick. FIG. 5B is a view showing a cross section taken along line B1-B1 in FIG. 5A. The powder particle 50 may have a smoother outer shape than the powder in its raw material form. Specifically, among the multiple powder particles 50 constituting the wick 13, each having protrusions 51 may have multiple valleys 57 located between the multiple protrusions 51, and 20% or more of the multiple valleys 57 exposed on the surface may be gentle valleys 57a having rounded bottoms. As shown in FIG. 5B, the gentle valleys 57a are valleys having rounded bottoms like U-shaped grooves. The proportion of the multiple valleys 57 exposed on the surface that are gentle valleys 57a may be 50% or more, or may be 80% or more.

[0027] It is difficult to count the proportion of the gentle valley portions 57a for all powder particles 50 in the wick 13. The proportion of the gentle valley portions 57a may be calculated by randomly selecting multiple regions from the photograph obtained by SEM and counting the number of valley portions 57 and gentle valley portions 57a in the selected regions.

[0028] The gentle valley portion 57 a can be generated by controlling the sintering temperature and time in the sintering process for fixing the plurality of powder particles 50 in the internal space 110 .

[0029] The gentle valley portions 57a act to increase the ease of movement of the liquid-phase heat transfer medium W. By including the gentle valley portions 57a in the surface valley portions 57 at the above-mentioned ratio, the transport capacity of the heat transfer medium W held in the wick 13 can be increased, and better heat dissipation characteristics of the vapor chamber 1 can be obtained.

[0030] The vapor chamber 1 has a heat transfer medium W in the internal space 110. That is, the heat transfer medium W is located in the voids of the wick 13. The heat transfer medium W is a fluid that undergoes a phase transition between gas and liquid. The heat transfer medium W is a fluid at normal temperatures, and it is sufficient that it has a boiling point at which it evaporates and becomes gas when it receives heat from a heat source. The heat transfer medium W is, for example, water. Alternatively, the heat transfer medium W may be another material, such as acetone, methanol, or ammonia.

[0031] The heat transfer medium W vaporizes near the mounting area 103, i.e., mainly on the +Z side of the corresponding range 111, due to heat transferred from the heat source H, and moves away from the vicinity of the mounting area 103. The vaporized heat transfer medium W liquefies by dissipating heat to the second plate 113 on the -Z side. The liquefied heat transfer medium W flows through the gaps in the wick 13 by capillary force and returns to the vicinity of the mounting area 103. This circulating flow of the heat transfer medium W is faster than thermal conduction through metals, etc., and absorbs the heat generated by the heat source H from the first plate 112 side and quickly dissipates it to the second plate 113 side. At this time, the region within the wick 13 where the gas moves away from the corresponding range 111 and the region where the liquid moves toward the corresponding range 111 are separated.

[0032] In this embodiment, the wick 13 is located throughout the entire internal space 110, but there may be regions without a wick 13. Such regions are regions through which the vaporized heat transfer medium W selectively flows. For example, as shown in FIG. 1A , four support columns 12 may extend radially in all directions from the corresponding range 111. Wicks 13 may be located in two of the spaces between these four support columns 12, allowing liquid to flow toward the corresponding range 111, while the other two spaces may not have wicks 13, allowing gas to flow outward from the corresponding range 111.

[0033] 6A to 6C are cross-sectional views illustrating the shape of the support pillars 12 of this embodiment and the positional relationship of the heat source H. These cross-sectional views are taken along the Z direction and pass through the center of one of the support pillars 12.

[0034] As shown in FIG. 6A , the support 12 has a beam-like structure in which the cross-sectional area perpendicular to the Z direction is partially increased in a range including the connection position with the first plate 112. Hereinafter, the planar perspective range of the support 12 in the portion where the cross-sectional area is not increased will be referred to as the central portion 122. Furthermore, the planar perspective range of the beam-like structure of the support 12 in which the cross-sectional area is increased will be referred to as the extended portion 121. The extended portion 121 partially surrounds the outside of the central portion 122 in the Z direction in planar perspective. The extended portion 121 and the part of the central portion 122 surrounded by the extended portion 121 form a first portion 125 that forms the beam-like structure. The first portion 125 improves the strength of the support 12 against forces applied to the first surface 101 even if the entire support 12 is not thick.

[0035] The surface shape of the side surface of the first portion 125 may be curved in a cross-sectional view passing through the center of the support 12. The curve may be such that the rate of increase in the cross-sectional area of ​​the first portion 125 increases in the +Z direction. That is, the rate of increase in the cross-sectional area may be nonlinear with respect to position change in the Z direction. In particular, the curve may be an arc shape with a predetermined radius of curvature r. When the wick 13 is obtained by bonding powder, each powder particle is more likely to come into contact with and bond to the recesses of the extension portion 121 more widely. Therefore, a vapor chamber 1 using a heat dissipation substrate 10 having this extension portion 121 has improved heat transfer efficiency.

[0036] The heat source H and the mounting area 103 in which the heat source H is mounted are positioned to include a portion of width C that overlaps with the central portion 122 in a planar perspective view and a portion of increased width T that overlaps with the expanded portion 121. The increased width T represents the distance that the side position of the support 12 extends outward from the outer edge of the central portion 122 in a cross-sectional view passing through the center of the support 12. Because the corresponding range 111 of the mounting area 103 overlaps with the expanded portion 121, heat transferred from the heat source H to the expanded portion 121, which is thin in the +Z direction and has a large surface area, is quickly transferred to the heat transfer medium W in the wick 13 and dissipated. In other words, in this embodiment, both improved strength and improved heat dissipation efficiency of the vapor chamber 1 are achieved.

[0037] 6B , the corresponding range 111 may be positioned so as to overlap with the extension portion 121 but not with the central portion 122. In this positional relationship, the heat from the heat source H is transferred to the heat transfer medium W more quickly, while the extension portion 121 can stably support the heat source H.

[0038] 6C , the extension portion 121 may have overlapping corresponding ranges 111 corresponding to the plurality of heat sources H. That is, the heat dissipation substrate 10 may be used in common for the plurality of heat sources H.

[0039] 7A to 7D are schematic planar perspective views showing examples of the positional relationship between the support 12 and the corresponding range 111. A U-axis direction is defined based on the orientation along the long axis of the support 12, and a V-axis direction is defined perpendicular to the U-axis direction.

[0040] 7A , the corresponding range 111 may overlap the portion of the extended portion 121 located at the tip of the long side of the support 12. If the corresponding range 111 is not too large in the U-axis direction and the V-axis direction compared to the short side length and the increased width T of the support 12, the heat source H can be stably supported in such a positional relationship. The width in this disclosure refers to the distance from each point of the extended portion 121 to the center portion 122.

[0041] 7B , the multiple corresponding ranges 111 may overlap with the extension portions 121 located on both ends of the long side of the support 12. Also, one or both of the multiple corresponding ranges 111 may overlap with the central portion 122. Even with this positional relationship, both the efficiency of heat dissipation from the heat source H and more stable support of the heat source H can be achieved.

[0042] 7C , the corresponding range 111 may overlap with an extension portion 121 along the long side of the support column 12. This allows the support range of the corresponding range 111 by the extension portion 121 to be set longer. Therefore, when the width of the heat source H is long, for example, the heat source H can be supported more stably by the extension portion 121.

[0043] 7D , the multiple corresponding areas 111 may overlap with the extension portions 121 on both sides along the long side of the support 12. The length of one or both of the corresponding areas 111 may be longer than the length of the long side of the support 12. Furthermore, one or both of the corresponding areas 111 may overlap with the central portion 122. Even if the corresponding areas 111 are larger than the width of the support 12, the heat source H is appropriately supported by the extension portions 121.

[0044] 8A to 8C are schematic planar perspective views showing examples of the positional relationship between the heat source H and the support columns 12 when the heat source H is supported by a plurality of support columns 12. FIG.

[0045] 8A , both ends of the corresponding range 111 may overlap with the mutually facing portions of the extension portions 121a, 121b of the supports 12a, 12b that extend parallel to each other in the U-axis direction. Since both ends of the heat source H are supported by the extension portions 121 of the supports 12, the support strength is effectively improved. At the same time, the heat from the heat source H is efficiently transferred to the heat transfer medium W in the wick 13 and quickly dissipated.

[0046] As shown in Fig. 8B, two support columns 12a and 12b may be positioned at right angles. The corresponding area 111 overlaps with a portion of the extended portion 121a of one support column 12a along the long side thereof and with a portion of the extended portion 121b of the other support column 12b along the end thereof. The corresponding area 111 may overlap with one or both of the central portions 122a and 122b of the two support columns 12a and 12b.

[0047] As shown in FIG. 8C , three support columns 12a to 12c may be positioned radially at 120-degree intervals. The corresponding range 111 overlaps with the extension portions 121a to 121c of the three support columns 12a to 12c, respectively. The intersection of the extension lines of the three support columns 12a to 12c may coincide with the center of the corresponding range 111. Some or all of the central portions 122a to 122c of the three support columns 12a to 12c may overlap with the corresponding range 111. In this way, by increasing the number of support columns 12 supporting the heat source H, the periphery of the heat source H can be supported more stably, while heat can be efficiently transferred from the heat source H to the heat transfer medium W.

[0048] 9A and 9B are cross-sectional views showing other examples of the expansion portion 121. The cross-sectional positions are the same as those in FIGS. 6A to 6C. As shown in FIG. 9A, the expansion portion 121 may have a tapered shape or a truncated cone-like side shape in which the cross-sectional area expands substantially uniformly. Alternatively, as shown in FIG. 9B, the expansion portion 121 may have a stepped structure. The stepped structure may have multiple steps. When the wick 13 is a bond of powder, the width of the steps may be approximately the diameter of each powder particle that makes up the wick 13. This allows each powder particle to fit into the recesses of the steps, allowing heat to be efficiently transferred from the heat source H to the heat transfer medium W via the expansion portion 121.

[0049] The width of the expanded portion 121 in plan view may not be uniform around the central portion 122. That is, the expanded portion 121 may have a non-uniform increased width T in cross section. For example, the increased width T may become smaller depending on the distance to other nearby supports 12. Figures 10A and 10B are diagrams showing other examples of the expanded portion 121.

[0050] As shown in the plan view of FIG. 10A , in two parallel columns 12a and 12b extending in the U-axis direction, the opposing portions of the expansion sections 121a and 121b may be narrower than the portions of the expansion sections 121a and 121b that are farther from the other columns. When the expansion sections 121a and 121b have the curved shape of the above embodiment in cross section, the curvature of the curve may be larger in the portion where the increase width T is narrower, i.e., the radius of curvature r may be small, such as r1. As a result, the portion where the increase width T in the cross-sectional area is small and the expansion sections 121a and 121b are narrow overlaps with the mounting area 103, i.e., the corresponding range 111, in planar perspective. Note that in the figures following FIG. 10A , the increase width T is shown to vary only depending on the distance between the columns 12 shown, but this is not limited to this. If there are other columns 12 in the internal space 110, the increase width T at each position of the expansion section 121 may be determined depending on the distance to the other columns 12.

[0051] The cross-sectional view of Figure 10B is a cross-sectional view taken along the line DD in Figure 10A. The opposing expansion portions 121 of the two support columns 12 have a smaller height than the other expansion portions 121, as well as an increased width T, in the corresponding range 111, thereby increasing the spatial volume in which the wick 13 is located in the space between the columns. The radius of curvature r of the outer surface of the expansion portion 121 may also be reduced to a radius of curvature r1. The ratio r1:r may be less than 1:2, such as 3:4 or 5:6. That is, r1 / r may be greater than or equal to 1 / 2.

[0052] 11A and 11B are cross-sectional views illustrating the positional relationship between the extended portions 121 and the powder particles 50 when the powder particles of the wick 13 contact and bond with the extended portions 121 having different curvature radii r. Here, the powder particles 50 are shown as being spherical. For simplicity, the cross section passes through the centers of two of the powder particles 50.

[0053] As shown in Figure 11A, as the radius of curvature r increases, the space S between the powder particle 50 and the wall surface of the expansion section 121 approaches the gap between two powder particles placed on a flat surface. On the other hand, as shown in Figure 11B, when the radius of curvature r is small, the volume of the space S between the powder particle 50 and the wall surface increases because the wall surface of the expansion section 121 protrudes in a direction away from the powder particle 50. Therefore, when the radius of curvature is small and the curvature is large, the heat transfer medium W flows more easily along the wall surface of the expansion section 121 with low resistance. As a result, heat dissipation proceeds more efficiently. Note that, when the radius of the powder particle 50 is rp, r / rp may be in the range of 2 to 40, or even in the range of 5 to 10.

[0054] In this way, when the wick 13 has a bonded structure of the powder particles 50, the radius of curvature r of the expansion portion 121 is partially reduced, which makes it easier for the wall surface of the expansion portion 121 and the powder to bond together, while widening the space S between the wall surface and the powder. This makes it easier for the heat transfer medium W to flow through this space S with low resistance. As a result, the efficiency of heat dissipation in the vapor chamber 1 is improved.

[0055] 12A and 12B are schematic diagrams showing other examples of the shape of the extension portion 121 in planar perspective. One or more support columns 12 may be located near a single support column 12 but in different orientations. For example, as shown in FIG. 12A , two support columns 12a and 12b may extend in the U-axis direction and the V-axis direction, respectively, and be perpendicular to each other. In this case, support column 12a is closest to support column 12b near the center of one side along the long axis direction parallel to the U-axis direction. Therefore, the extension portion 121a along the side may have a shape that narrows in width at the center and widens toward both ends.

[0056] As shown in FIG. 12B , two supports 12b and 12c may be positioned extending perpendicularly in the V-axis direction to the support 12a extending in the U-axis direction. The +V-side ends of each of the supports 12b and 12c are closest to the ends of the support 12a in the U-axis direction, which is the long axis direction. As a result, the support 12a may have a shape in which the increase width T of the expanded portion 121a is smaller near both ends of one side along the long axis direction and the width increases toward the center. In FIG. 12B , the supports 12b and 12c are parallel to each other, so the increase width T of the expanded portions 121b and 121c is smaller on the two opposing sides than on the opposite sides of those two sides.

[0057] 13A to 13C, 14A, and 14B are diagrams showing other examples of the expanded portion 121. Contrary to the above, the expanded portion 121 may have a small cross-sectional increase width T in the portion that does not overlap with the corresponding range 111, and the width of the expanded portion 121 may be narrow. In other words, the portion of the expanded portion 121 where the cross-sectional increase width T is large may overlap with the corresponding range 111.

[0058] 13A , the corresponding range 111 is positioned so as to overlap one end of the support 12. The width of the extended portion 121 may be narrower near the end opposite the end that overlaps with the corresponding range 111. This allows the wider extended portion 121 to more stably support the heat source H. On the other hand, in the portion not required for support, the range of the wick 13 is expanded by the narrower width of the extended portion 121, making it easier for the heat transfer medium W to flow.

[0059] In the example of the plan view shown in Figure 13B, the pillars 12a and 12b are arranged parallel to each other and extend in the U-axis direction. The corresponding range 111 is located between the pillars 12a and 12b, including the opposing portions of the extended portions 121a and 121b. The extended portions 121a and 121b have narrower widths along the long sides of the pillars 12a and 12b that do not overlap with the corresponding range 111.

[0060] Figure 13C shows a cross-sectional view taken along the cross-sectional line EE in Figure 13B. Contrary to the example shown in Figure 10B, the radius of curvature r of the outer surfaces of the expansion portions 121a and 121b in the corresponding range 111 may be larger than the radius of curvature r1 of the outer surfaces of the expansion portions 121a and 121b outside the corresponding range 111. Therefore, the proportion of the increase width T1 is larger than that in the corresponding range 111. This allows for more stable support of the heat source H. Meanwhile, the increase width T2 outside the corresponding range 111 is smaller than the increase width T1 within the corresponding range 111. This makes it less likely that the flow of the heat transfer medium W will be obstructed in areas that do not support the heat source H.

[0061] 12B, when the support columns 12b and 12c extend perpendicular to the support column 12a, the extension portions 121 closer to the support columns 12b and 12c have an uneven width. This allows the heat source H to be more stably supported by the wider extension portions 121a and 121b. On the other hand, in the portions not supporting the heat source H, the width of the extension portions 121 is narrow, allowing the heat transfer medium W to flow easily.

[0062] As shown in the plan view of Figure 14A, three or more pillars 12b to 12d may be positioned relative to pillar 12a. The extended portion 121a located on the longer side of pillar 12a nearer to pillars 12b to 12d may have extremely narrow and extremely wide portions alternately positioned depending on the distance from pillar 12b to 12d. Pillar 12c is sandwiched between pillars 12b and 12d, and the portion of extended portion 121c along the longer side may be narrower in width as well as the end on the pillar 12a side.

[0063] 14B, the support columns 12b may be positioned at an arbitrary angle relative to the support columns 12a. In this case, the widths of the expansion portions 121 may be distributed asymmetrically with respect to the position of the minimum width.

[0064] FIG. 15 is a diagram showing another example of the cross section of the support 12 in the vapor chamber 1. In addition to the expansion portion 121 on the first plate 112 side, the support 12 may also have an expansion portion 123 on the second plate 113 side. That is, the support 12 has a second portion 126 in which the cross-sectional area perpendicular to the Z direction is partially increased in a range including the connection position with the second plate 113. The radius of curvature r of the expansion portion 121 and the radius of curvature r2 of the expansion portion 123 may be the same. Also, as shown in FIG. 15, the radius of curvature r2 of the expansion portion 123 may be smaller than the radius of curvature r of the expansion portion 121. That is, the increase in the cross section of the entire expansion portion 123 in the +Z direction may be smaller than the increase in the cross section of the expansion portion 121 in the +Z direction. The reduction in the width represents the distance from the side position of the expansion portion 123 to the outer edge of the central portion 122 in a cross-sectional view. Alternatively, the height of the extension portion 123 in the Z direction may be smaller than the height of the extension portion 121 in the Z direction.

[0065] In this way, by having the extension portions 121, 123 at both ends of the support 12, a higher support strength can be obtained compared to the diameter of the central portion 122 of the support 12. In addition, since the diameter of the central portion 122 can be made smaller, the size of the wick 13 can be expanded accordingly. Therefore, the heat transport efficiency is improved, and heat is discharged from the heat source H more quickly.

[0066] In this case, the extended portion 123 of the support 12 does not have to be made of the same material as the support 12. For example, the extended portion 123 may be a fillet or the like that is generated when the support is joined to the bottom plate on the second surface 102 side with brazing material or the like.

[0067] (Functional Module) Figures 16A to 17C are diagrams showing functional modules according to Embodiments 2 to 6 of the present disclosure, respectively. Functional modules 400A to 400E according to Embodiments 2 to 6 each include a functional component 410A to 410E as a heat source H that generates heat, and a vapor chamber 1 according to Embodiment 2 in which the functional component 410A to 410E is mounted. Specific examples of functional modules 400A to 400E are described below, but the following structure is merely an example, and various modifications are possible to the detailed structure, etc. Detailed illustration of the internal structure of the vapor chamber 1 is omitted in Figures 16A to 17C.

[0068] (Functional Module of Embodiment 2) The functional module 400A of Embodiment 2 may be a light source module, and the functional component 410A may be a light emitting element such as an LED (Light Emitting Diode) or an LD (Laser Diode). The LD may be configured to output laser light for processing or laser light for illumination.

[0069] The functional component 410A may be mounted on the vapor chamber 1 via a submount 420. The submount 420 is a substrate smaller than the vapor chamber 1 and may be made of ceramics such as silicon nitride, silicon carbide, aluminum nitride, or aluminum oxide. Multiple functional components 410A may be mounted on the mounting portion 401. In this case, the submount 420 may correspond to the heat source H.

[0070] The vapor chamber 1 has a sidewall 430 that surrounds the mounting portion 401 of the base 11, and the mounting portion 401 may be located on the inner bottom surface of a recess 431 surrounded by the sidewall 430. The opening of the recess 431 may be covered with a light-transmitting member 432 such as a lens. The light-transmitting member 432 may be bonded to the sidewall 430 to seal the recess 431. The sidewall 430 has a horizontal through-hole 433, and a conductive member 434 that transmits operating power to the functional component 410A is located in the through-hole 433, and glass may be bonded to seal the space between the through-hole 433 and the conductive member 434. A cooling mechanism (not shown) may be located below the base 11.

[0071] According to the functional module 400A of the second embodiment, a large amount of heat can be dissipated from the functional component 410A, which is a light-emitting element, through the vapor chamber 1. Therefore, the functional component 410A, which is a light-emitting element, can stably emit light with high brightness. Furthermore, when the functional module 400A has multiple functional components 410A, which are light-emitting elements, the high heat dissipation properties of the vapor chamber 1 can ensure uniform heat distribution among the multiple functional components 410A, thereby ensuring uniform brightness among the multiple functional components 410A.

[0072] (Functional Module of Embodiment 3) The functional module 400B of Embodiment 3 may be a wireless module that transmits wireless signals via a wireless base station or the like. The functional component 410B may be a signal processing circuit such as a beam forming integrated circuit (BFIC) that transmits wireless signals with directionality via an array antenna. Multiple functional components 410B may be mounted on the mounting section 401. The functional component 410B, which is a signal processing circuit, may be connected to an antenna substrate 441, such as a phased array antenna module (PAAM) substrate, on which an array antenna is mounted. That is, multiple functional components 410B may be mounted on the mounting section 401, an antenna substrate 441 may be located above the multiple functional components 410B, and multiple antennas 441a (e.g., patch antennas) may be located above the antenna substrate 441.

[0073] The vapor chamber 1 may be located between an antenna substrate 441 and another substrate 443 located below the antenna substrate 441 via a spacer 442. Furthermore, a shield case 444 may be located below the substrate 443. The substrate 443 may have an opening 443a, and a heat dissipation component 445 such as a heat pipe embedded in the shield case 444 may extend inside and outside the shield case 444. The heat dissipation component 445 may contact the vapor chamber 1 from below via the opening 443a, and may conduct heat from the vapor chamber 1 to the outside of the shield case 444.

[0074] According to the functional module 400B of the third embodiment, a large amount of heat can be dissipated from the functional component 410B, which is a signal processing circuit, via the vapor chamber 1. This allows for stable transmission of wireless signals, which contributes to increasing the power of the wireless signals, i.e., increasing the output of wireless radio waves, and reducing the module volume.

[0075] (Functional Module of Fourth Embodiment) The functional module 400C of the fourth embodiment may be a computer module in which a computing LSI (Large Scale Integration) is used as a functional component 410C. The functional component 410C may be an LSI for AI (Artificial Intelligence) processing, an LSI for cloud processing, an LSI for display calculation, an LSI for calculation mounted on a workstation, or any of a variety of other LSIs. In addition to the above LSI, the functional component 410C may also include a memory IC (Integrated Circuit) used by the LSI.

[0076] One or more functional components 410C may be mounted on a module substrate 451, such as a PCB (Printed Circuit Board), while the vapor chamber 1 may be incorporated so that it contacts the functional components 410C from the side opposite the module substrate 451. Here, "contact" does not necessarily mean direct contact but also includes connection via a material 452 with high thermal conductivity, such as a heat transfer sheet or thermal grease. In this case, the material 452 may be included in the heat source H. A heat dissipation component 453, such as a heat pipe 453a and a cooling fin 453b connected to the heat pipe 453a, may be connected below the base 11 of the vapor chamber 1. Furthermore, the functional module 400C may include a cooling device 454, such as a fan, that cools the heat dissipation component 453.

[0077] According to the functional module 400C of the fourth embodiment, a large amount of heat can be dissipated from the functional components 410C, such as the LSI and memory IC, via the vapor chamber 1. This allows stable computational processing by the functional components 410C. This allows for the high computing power of the LSI to be accommodated, resulting in a functional module 400C with high computing power. Furthermore, the vapor chamber 1 can dissipate heat from the functional components 410C, such as the LSI and memory IC, in response to increased heat generation due to miniaturization of wiring within the LSI, high-speed operation, and the like, as well as increased heat generation due to the three-dimensional mounting of the LSI and memory IC.

[0078] (Functional Module of Embodiment 5) The functional module 400D of Embodiment 5 may be a sensor module in which an image sensor is used as the functional component 410D. The vapor chamber 1 may have a convex portion 461 formed by a portion of the base 11 protruding, and the mounting portion 401 may be located on top of the convex portion 461.

[0079] The functional module 400D, which is a sensor module, may have a package 462 that seals the functional component 410D and a light-transmitting member 463 such as a lens. The package 462 may have an opening 464 in a portion thereof, and the vapor chamber 1 and the package 462 may be joined so that the convex portion 461 fits into the opening 464. The package 462 may have built-in wiring for transmitting electrical signals and power, and electrical signals and power may be transmitted between the functional component 410D and the outside of the package 462 via the wiring. A cooling mechanism (not shown) may be located below the vapor chamber 1.

[0080] According to the functional module 400D of the fifth embodiment, a large amount of heat can be dissipated from the functional component 410D, which is an image sensor, via the vapor chamber 1. Therefore, a high-performance image sensor that generates a large amount of heat and performs high-speed information processing can be applied as the functional component 410D, which contributes to improving the functionality of the functional module 400D.

[0081] (Functional Module of Embodiment 6) The functional module 400E of Embodiment 6 may be a power module in which a power semiconductor for power control is used as the functional component 410E. The power semiconductor may be a switching element or a diode. The functional module 400E includes multiple vapor chambers 1 and multiple functional components 410E, and the multiple vapor chambers 1 may be mounted on a single insulating plate 471. The insulating plate 471 may be made of ceramics such as silicon nitride, silicon carbide, aluminum nitride, or aluminum oxide. A heat dissipation fin 475 may be attached to the underside of the insulating plate 471 via a metal heat dissipation plate 474. The vapor chambers 1 and the heat dissipation plate 474 may be bonded to the insulating plate 471 via a bonding material 472. The upper wall of the vapor chamber 1 may be a conductive member, and a wiring member 476 may be electrically connected to the upper wall, and the functional component 410E may be electrically connected so that current flows through the wiring member 476 and the upper wall. The periphery of the vapor chamber 1 , the functional component 410E, the insulating plate 471 and the heat sink 474 may be sealed with a molding material 473 .

[0082] According to the functional module 400E of the sixth embodiment, a large amount of heat can be dissipated from the functional component 410E, which is a power semiconductor, via the vapor chamber 1. Therefore, a high-output power semiconductor that generates a large amount of heat can be used as the functional component 410E, and further, the functional module 400E can be highly integrated and miniaturized.

[0083] As described above, the heat dissipation substrate 10 of this embodiment includes a base 11. The base 11 has a first plate 112, a second plate 113, an internal space 110 located between the first plate 112 and the second plate 113, and support posts 12. The first plate 112 has a mounting area 103 for a heat source H. The second plate 113 is located in the -Z direction from the first plate 112. The support posts 12 are located in the internal space 110 and connect the first plate 112 and the second plate 113 along the Z direction. The support posts 12 have a first portion 125 whose cross-sectional area perpendicular to the Z direction is partially increased in a range including the connection position with the first plate 112. In a planar perspective view, the mounting area 103 overlaps at least a portion of an expanded portion 121 of the first portion 125 where the cross-sectional area of ​​the support posts 12 is increased. In this way, the support posts 12 have a beam-like structure, and the mounting area 103 is positioned so as to overlap the extended portion 121 of the beam-like structure in a planar perspective view, so that the heat dissipation substrate 10 can reduce distortion of the heat dissipation substrate 10 and stably support the heat source H. On the other hand, since the entire support posts 12 do not need to have a cross-sectional area on the same level as the beam-like structure, the space occupied by the wick 13 can be expanded. Therefore, by using the heat dissipation substrate 10, heat dissipation is more effective.

[0084] The rate of increase in the cross-sectional area of ​​the first portion 125 may be nonlinear with respect to the change in position in the Z direction, which makes it easier to obtain the extended portion 121. Furthermore, when the wick 13 is formed by bonding a plurality of powder particles 50, the powder particles 50 and the wall surface of the extended portion 121 are more easily bonded to each other, which makes heat transfer more efficient.

[0085] The surface shape of the first portion 125 may have a predetermined radius of curvature r in a cross-sectional view along the Z direction. Such a uniform recess shape facilitates bonding between the powder particles 50 and the wall surface of the extension portion 121 on average, thereby making heat transfer more efficient.

[0086] Furthermore, the support 12 may have a non-uniform cross-sectional increase in width in plan view. In this case, the mounting area 103 may overlap a portion of the support 12 with a small cross-sectional increase in width in plan view. This allows the heat source H to be supported by a beam-like structure while expanding the area occupied by the wick 13 directly below it. Therefore, the heat dissipation substrate 10 can achieve both reduced deformation and heat dissipation performance.

[0087] Alternatively, the mounting area 103 may overlap the portion of the support 12 where the cross-section is greatly increased in width in a planar perspective view. This allows the heat dissipation board 10 to more stably support the heat source H by the extended portion 121. Therefore, deformation of the heat dissipation board 10 can be further reduced.

[0088] Furthermore, the support 12 may have a second portion 126 in which the cross-sectional area perpendicular to the Z direction is partially increased in a range including the connection portion with the second plate 113. By having a beam-like structure also on the side of the joint portion with the second plate 113, the support 12 can be made more stable, and distortion of the base 11 corresponding to the force acting on the first surface 101 can be reduced.

[0089] Furthermore, the width of the cross-section reduction of second portion 126 may be smaller than the width of the cross-section increase of first portion 125. By providing a larger beam-like structure on the side of first plate 112 having first surface 101 that is directly subjected to external force, it is possible to more appropriately achieve both reduction in distortion of base 11 and maintenance of heat dissipation performance.

[0090] The heat dissipation substrate 10 may also include a wick 13 located in the internal space. The wick 13 allows the liquid heat transfer medium W to flow quickly, making the heat dissipation substrate 10 suitable for use in a vapor chamber.

[0091] The vapor chamber 1 of this embodiment also includes the heat dissipation substrate 10 and a heat transfer medium W located in the internal space 110. This vapor chamber 1 can achieve both reduced deformation of the base 11 and high heat dissipation efficiency.

[0092] Furthermore, the functional modules 400A-400E of this embodiment include heat-generating functional components 410A-410E and the vapor chamber 1 described above in which the functional components 410A-410E are mounted. These functional modules 400A-400E are capable of quickly dissipating the heat generated by the functional components 410A-410E. This allows the functional modules 400A-400E to be mounted with functional components 410A-410E that generate a large amount of heat, thereby enabling the functional modules 400A-400E to have high functionality.

[0093] The above-described embodiment is merely an example, and various modifications are possible. For example, the wall surfaces of the first portion 125 and the second portion 126 may have more complex or irregular shapes than those in the examples given above. Furthermore, when these wall surfaces have an arc shape in cross section, the radii of curvature r, r1, and r2 may be average values. The curvature of the wall surface may also change along the way.

[0094] In addition, although the above example shows that all the columns 12 have a beam-like structure, this is not limiting. Some of the columns 12 may not have a beam-like structure. The columns 12 that do not have a beam-like structure may not overlap the corresponding range 111, and some of the columns 12 that overlap the corresponding range 111 may not have a beam-like structure.

[0095] Furthermore, the beam-like structure does not have to surround the entire periphery of the central portion 122 of the support 12. The beam-like structure may be provided only on a portion of the periphery of the central portion 122.

[0096] The increase in the width of the second portion 126 may also be non-uniform. Also, a part or all of the increase in the width of the second portion 126 may not be smaller than the increase in the width of the first portion 125.

[0097] Although the above description has been given with reference to an example in which the wick 13 is positioned over the entire surface in the Z direction, this is not limiting. The wick 13 may have a gap between the first plate 112 and the second plate 113 in the +Z direction as long as the wick 13 is in contact with the first plate 112 and the second plate 113 and the portion in contact with the first plate 112 is connected to the portion in contact with the second plate 113.

[0098] Furthermore, the above describes the relationship between the wick 13, which is made up of multiple powder particles 50 bonded together, and the wall shape of the expansion portion 121. However, even if the wick 13 has a mesh structure, the shape of the wick 13 may be adapted to match the wall shape of the expansion portion 121.

[0099] Furthermore, the above disclosure may be divided or combined as desired within the scope of not being contradictory to each other. Furthermore, the specific details of the structure, configuration, materials, size, etc. shown in the above embodiments may be appropriately modified within the scope of not departing from the spirit of this disclosure. The scope of the present invention includes the scope of the invention described in the claims and its equivalents.

[0100] The present disclosure can be used for heat dissipation substrates and vapor chambers.

[0101] DESCRIPTION OF SYMBOLS 1 Vapor chamber 10 Heat dissipation substrate 103 Mounting area 11 Base 110 Internal space 111 Corresponding range 12, 12a to 12d Support 13 Wick 121, 121a to 121c, 123 Extension portion 122, 122a to 122c Center portion 400A to 400E Functional module 401 Mounting portion 410A to 410E Functional component 420 Submount 430 Side wall portion 431 Recess 432 Light-transmitting member 433 Through hole 434 Conductive member 441 Antenna substrate 441a Antenna 442 Spacer 443 Substrate 443a Opening 444 Shield case 445 Heat dissipation component 451 Module substrate 452 Material 453 Heat dissipation component 453a Heat pipe 453b Cooling fin 454 Cooling device 461 Convex portion 462 Package 463 Light-transmitting member 464 Opening 471 Insulating plate 472 Bonding material 473 Molding material 474 Heat sink 475 Heat dissipation fin 476 Wiring member 50 Powder particle 50A First particle 50B Second particle G Void portion g, gA, gB Gap H Heat source S Space V Connecting path W Heat transfer medium

Claims

1. A heat dissipation substrate comprising a base having: a first plate having a mounting area for a heat source; a second plate located in a first direction of the first plate; an internal space located between the first plate and the second plate; and a support located in the internal space and connecting the first plate and the second plate along the first direction, wherein the support has a first portion having a cross-sectional area perpendicular to the first direction partially increased in an area including a connection position with the first plate, and the mounting area overlaps with at least a part of the extended portion of the first portion where the cross-sectional area of ​​the support is increased in a planar perspective view.

2. The heat dissipation board according to claim 1, wherein the rate of increase of said cross-sectional area in said first portion is nonlinear with respect to the change in position in said first direction.

3. The heat dissipation board according to claim 2, wherein the surface shape of said first portion is an arc shape when viewed in cross section along said first direction.

4. A heat dissipation board as claimed in claim 1 or 2, wherein the support has a non-uniform increase in cross section in plan view, and the mounting area overlaps with a portion of the extended portion having a smaller increase in cross section in plan view.

5. A heat dissipation board as claimed in claim 1 or 2, wherein the support has a non-uniform increased width in cross section in plan view, and the mounting area overlaps with a portion of the extended portion having a larger increased width in plan view.

6. The heat dissipation board according to claim 1 or 2, wherein said support has a second portion in which the cross-sectional area is partially increased in an area including a connection portion with said second plate.

7. The heat dissipation board according to claim 6, wherein the increased width of the cross section of said second portion is smaller than the increased width of the cross section of said first portion.

8. A heat dissipation substrate according to any one of claims 1 to 7, comprising a wick located in the internal space.

9. A vapor chamber comprising: the heat dissipation substrate according to claim 8; and a heat transfer medium located in the internal space.

10. A functional module comprising: a heat-generating functional component; and the vapor chamber according to claim 9 in which the functional component is mounted.

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