Analyte monitoring device
The analytical monitoring device addresses the stability and connectivity issues in continuous blood glucose monitoring by using a contact holding and bonding holding mechanism with a flexible contact portion, resulting in improved performance and reliability for long-term use.
Patent Information
- Application Number
- PCT/KR2024/019187
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-28
- Filing Date
- 2024-11-28
- Publication Date
- 2025-06-05
AI Technical Summary
Conventional continuous blood glucose monitoring devices face technical challenges in stably fixing sensors and accurately connecting sensors with circuits, leading to reduced performance and reliability, as well as difficulties in commercialization and patient convenience.
The analytical monitoring device incorporates a contact holding portion and a bonding holding portion to securely fix the sensor and contact portion, enhancing connectivity and stability through a flexible contact portion that bends to establish contact with the sensor terminal.
This solution ensures consistent measurement results over a long period by providing a strong and stable connection between the sensor and circuit, improving the device's performance, reliability, and commercial viability.
Smart Images

Figure KR2024019187_05062025_PF_FP_ABST
Abstract
Description
Analytical monitoring device
[0001] The present invention relates to a device for inserting into a body to monitor analytes.
[0002] Continuous Glucose Monitoring (CGM) devices are systems that continuously measure blood sugar levels by inserting tiny sensors into the skin of diabetic patients. These devices consist of a sensor and an electronic device, which processes and records the analyte (blood sugar) measured by the sensor, providing patients with real-time blood sugar information. CGM devices are typically attached to the skin and can continuously monitor blood sugar levels for 7 to 15 days, allowing patients to manage their blood sugar levels more precisely.
[0003] However, conventional continuous glucose monitoring devices have technical limitations. Specifically, designing miniaturized devices presents technical challenges in stably securing the sensor and accurately connecting the sensor to the circuit. These technical challenges can reduce the device's performance and reliability, negatively impacting its commercialization and patient convenience.
[0004] Therefore, there is a need to develop a technology that can improve the connectivity between sensors and circuits and stably fix the sensors in miniaturized devices for monitoring analytes (blood sugar).
[0005] The purpose of the present invention is to improve the connectivity of a sensor and a circuit in a miniaturized device for monitoring analytes and to stably fix the sensor.
[0006] The purpose of the present invention is to provide consistent measurement results even during long-term use by adding a contact retaining portion and a coupling retaining portion to more strongly fix the sensor and the contact portion.
[0007] The purpose of the present invention is to provide consistent measurement results even during long-term use by adding a contact-retaining portion and a sensor fixing portion to more strongly fix the sensor and the contact portion.
[0008] The analyte monitoring device of the present invention comprises a housing forming an internal space, a sensor unit including a connecting portion located in the internal space and a sensing portion extending from the connecting portion and exposed to the outside of the housing, and a circuit unit including a contact portion located in the internal space and in contact with the connecting portion, wherein the contact portion is formed of a flexible material and extends horizontally from a portion adjacent to a body portion of the circuit unit and can be formed to bend upward or downward by contact with the connecting portion.
[0009] In one embodiment of the present invention, the body portion may be formed of a rigid circuit board.
[0010] In one embodiment of the present invention, the body portion may be formed of a circuit board including a plurality of laminated layers, and the contact portion may be formed of a flexible conductive member extending from at least one of the plurality of layers.
[0011] In one embodiment of the present invention, the contact portion may be a flexible circuit board coupled to the body portion.
[0012] In one embodiment of the present invention, the contact portion may include a horizontal extension portion adjacent to the body portion and extending in a horizontal direction, and a bending portion extending from an end of the horizontal extension portion and bent upward or downward by contact with the connecting portion.
[0013] In one embodiment of the present invention, the contact portion may further include a contact extension portion extending from an end of the bending portion and extending in parallel to the connecting portion.
[0014] In one embodiment of the present invention, the connecting portion may be formed in a plate shape that is erected in a vertical direction.
[0015] In one embodiment of the present invention, the connecting portion includes a sensor terminal formed on a surface opposite to the contact portion, the contact portion includes a contact terminal formed on a lower surface, and the contact portion is bent upward by contact with the connecting portion, so that the sensor terminal and the contact terminal can come into contact.
[0016] In one embodiment of the present invention, the connecting portion may include a first sensor terminal formed on a first surface, and a second sensor terminal formed on a second surface opposite the first surface, and the contact portion may include a first contact portion extending from a first end of the body portion in the direction of the first surface and making contact with the first sensor terminal, and a second contact portion extending from a second end of the body portion in the direction of the second surface and making contact with the second sensor terminal.
[0017] In one embodiment of the present invention, a contact maintenance portion that maintains a contact state between the connecting portion and the contact portion may be further included.
[0018] In one embodiment of the present invention, the contact maintenance portion may include an extension portion extending from the housing to the internal space, and a coupling portion coupled to the extension portion such that the connection portion and the contact portion are positioned in contact with each other between the extension portion and the internal space.
[0019] In one embodiment of the present invention, the extension portion includes a protrusion protruding from the housing and in contact with one of the connecting portion and the contact portion, and a separation portion protruding from the housing and spaced apart from the protrusion, and the coupling portion is coupled between the protrusion and the separation portion, and contacts the other of the connecting portion and the contact portion, and can bring the connecting portion and the contact portion into close contact with each other.
[0020] In one embodiment of the present invention, the extension portion includes a protrusion that protrudes from the housing and comes into contact with one of the connecting portion and the contact portion, and the engaging portion rotates around a rotational axis to be adjacent to the protrusion, so as to come into contact with the other of the connecting portion and the contact portion, and can bring the connecting portion and the contact portion into close contact with each other.
[0021] In one embodiment of the present invention, the extension portion may include a first protrusion protruding from the housing and contacting a second surface of a first part of the connection portion, and a second protrusion protruding from the housing and contacting a first surface of a second part of the connection portion, and the coupling portion may include a first coupling portion coupled with the second protrusion in the first surface direction and maintaining a contact state between the first sensor terminal and the first contact portion, and a second coupling portion coupled with the first protrusion in the second surface direction and maintaining a contact state between the second sensor terminal and the second contact portion.
[0022] In one embodiment of the present invention, a joint maintenance part that maintains the joint state of the extension part and the joint part may be further included.
[0023] The analyte monitoring device of the present invention may include a housing forming an internal space, a sensor unit located in the internal space and including a connecting portion having at least one sensor terminal formed thereon and a sensing unit extending from the connecting portion and exposed to the outside of the housing, a circuit unit located in the internal space and including a signal processing unit, and a sensor holder including a first contact portion and a second contact portion that contact a first surface and a second surface of the connecting portion, respectively, and electrically connecting the sensor terminal and the circuit unit.
[0024] In one embodiment of the present invention, at least one of the first contact portion and the second contact portion may be a transmission contact portion including a signal transmission portion connected to the sensor terminal and the circuit portion.
[0025] In one embodiment of the present invention, the transmission contact portion is formed of a resin material containing an additive that is non-conductive but changes to conductive when light under specific conditions is irradiated, and includes a light-irradiated area in which the additive changes to conductive when light under the specific conditions is irradiated to a portion of the surface, and the transmission contact portion may be a plating layer bonded to the light-irradiated area.
[0026] In one embodiment of the present invention, the sensor holder may further include a contact maintenance portion that maintains the first contact portion and the second contact portion in a close contact state with the connection portion therebetween.
[0027] In one embodiment of the present invention, the sensor holder forms a sensor receiving space that receives a portion of the connecting portion adjacent to the sensing portion, and a through hole through which the sensing portion passes may be formed in a portion of the housing located at the lower portion of the sensor receiving space.
[0028] The present invention has the advantage of improving the connectivity of a sensor and a circuit in a miniaturized device for monitoring analytes and stably fixing the sensor.
[0029] The present invention has the advantage of providing consistent measurement results even when used for a long period of time by adding a contact retaining portion and a coupling retaining portion to more strongly fix the sensor and the contact portion.
[0030] The present invention has the advantage of providing consistent measurement results even when used for a long period of time by adding a contact-retaining portion and a sensor fixing portion to more strongly fix the sensor and the contact portion.
[0031] FIG. 1 is a perspective view of an analysis monitoring device according to one embodiment of the present invention.
[0032] FIG. 2 is a bottom perspective view of an analysis monitoring device according to one embodiment of the present invention.
[0033] Figure 3 is an exploded perspective view of an analysis monitoring device according to one embodiment of the present invention.
[0034] Figure 4 is a perspective view of a circuit unit according to one embodiment of the present invention.
[0035] Figure 5 is a cross-sectional view of a circuit portion according to one embodiment of the present invention.
[0036] Figure 6 is a perspective view of a state before the lower housing and sensor unit are combined according to one embodiment of the present invention.
[0037] Figure 7 is a perspective view of a state before the lower housing and circuit unit are combined according to one embodiment of the present invention.
[0038] Figure 8 is a perspective view of a state in which a lower housing and a circuit unit are combined according to one embodiment of the present invention.
[0039] Figure 9 is a cross-sectional view of a state in which a lower housing and a circuit unit are combined according to one embodiment of the present invention.
[0040] Figure 10 is a perspective view of a state in which a lower housing, a circuit portion, and a contact holding portion are formed according to one embodiment of the present invention.
[0041] Fig. 11 is a cross-sectional view of a state in which a lower housing, a circuit portion, and a contact holding portion are formed according to one embodiment of the present invention.
[0042] Fig. 12 is a perspective view of a state in which a lower housing, a circuit portion, a contact holding portion, and a joint holding portion are combined according to one embodiment of the present invention.
[0043] Fig. 13 is a cross-sectional view of a state in which a lower housing, a circuit portion, a contact holding portion, and a joint holding portion are combined according to one embodiment of the present invention.
[0044] Fig. 14 is a perspective view of a state in which a lower housing and a circuit unit are combined according to one embodiment of the present invention.
[0045] Fig. 15 is a perspective view of a state in which a lower housing, a circuit portion, and a contact holding portion are combined according to one embodiment of the present invention.
[0046] FIG. 16 is a cross-sectional view of a state in which a lower housing, a circuit portion, a contact holding portion, a coupling holding portion, and an upper housing are combined according to one embodiment of the present invention.
[0047] Fig. 17 is a cross-sectional view of a sensor unit including a sensor terminal according to one embodiment of the present invention.
[0048] Fig. 18 is a perspective view of a state in which a lower housing and a circuit unit are combined according to one embodiment of the present invention.
[0049] Fig. 19 is a cross-sectional view of a state in which a lower housing and a circuit unit are combined according to one embodiment of the present invention.
[0050] FIG. 20 is a perspective view of a state in which a lower housing, a circuit portion, and a contact holding portion are combined according to one embodiment of the present invention.
[0051] Figure 21 is a perspective view of the lower surface of the upper housing according to one embodiment of the present invention.
[0052] FIG. 22 is a cross-sectional view of a state in which a lower housing, a circuit portion, a contact holding portion, a coupling holding portion, and an upper housing are combined according to one embodiment of the present invention.
[0053] FIG. 23 is a perspective view of an analysis monitoring device according to one embodiment of the present invention.
[0054] Figure 24 is a bottom perspective view of an analysis monitoring device according to one embodiment of the present invention.
[0055] Figure 25 is an exploded perspective view of an analysis monitoring device according to one embodiment of the present invention.
[0056] Figure 26 is a drawing showing both sides of a sensor unit according to one embodiment of the present invention.
[0057] Figure 27 is an exploded perspective view of a contact portion according to one embodiment of the present invention.
[0058] Figure 28 is an exploded perspective view of a first contact portion, a second contact portion, and a sensor portion according to one embodiment of the present invention.
[0059] Figure 29 is a perspective view of a state in which a first contact portion, a second contact portion, and a sensor portion are combined according to one embodiment of the present invention.
[0060] Figure 30 is a partially exploded perspective view of a sensor unit, a contact unit, and a contact holding unit according to one embodiment of the present invention.
[0061] Fig. 31 is a perspective view of a combined state of a sensor unit, a contact unit, and a contact-maintaining unit according to one embodiment of the present invention.
[0062] Figure 32 is a partially exploded perspective view of a sensor unit, a sensor holder, and a sensor fixing unit according to one embodiment of the present invention.
[0063] Figure 33 is a cross-sectional view of a sensor unit, a sensor holder, and a sensor fixing unit combined according to one embodiment of the present invention.
[0064] Figure 34 is an exploded perspective view of an analysis monitoring device according to one embodiment of the present invention with the upper housing open.
[0065] Figure 35 is an exploded perspective view of an analysis monitoring device according to one embodiment of the present invention.
[0066] Figure 36 is an exploded perspective view of a contact portion according to another embodiment of the present invention.
[0067] Figure 37 is a perspective plan view of a contact portion according to another embodiment of the present invention.
[0068] Figure 38 is an exploded perspective view of a sensor unit and a contact unit according to another embodiment of the present invention.
[0069] Fig. 39 is a perspective view of a state in which a sensor unit and a sensor holder are combined according to another embodiment of the present invention.
[0070] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing reference numerals, identical or similar components will be assigned the same reference numerals, and redundant descriptions thereof will be omitted. Furthermore, when describing embodiments disclosed in this specification, if a detailed description of a related known technology is judged to obscure the gist of the embodiments disclosed in this specification, the detailed description thereof will be omitted.
[0071] Terms that include ordinal numbers, such as first, second, etc., may be used to describe various components, but the components are not limited by these terms. These terms are used solely to distinguish one component from another.
[0072] Singular expressions include plural expressions unless the context clearly indicates otherwise.
[0073] In this application, each step described may be performed regardless of the listed order, except in cases where a special causal relationship requires that the steps be performed in the listed order.
[0074] In this application, terms such as “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.
[0075]
[0076] The analyte monitoring device of the present invention may be a device attached to a user's body to measure and monitor biometric data. The analyte monitoring device of the present invention may be primarily used to analyze specific analytes within or on the body. For example, the analyte monitoring device of the present invention may be equipped with a sensor portion inserted into the user's skin, and may measure glucose, etc., in interstitial fluid within the user's body through the sensor portion.
[0077] The analyte monitoring device of the present invention may include a sensor unit for measuring an analyte, a signal processing unit for processing data measured by the sensor unit, and a communication unit for transmitting the processed signal to another device. In addition, the analyte monitoring device of the present invention may include a housing for stably housing the sensor unit, signal processing unit, and communication unit.
[0078] In the description of the present invention, "upper" means a portion facing away from the skin to which the analyte monitoring device of the present invention is attached. Furthermore, in the description of the present invention, "lower" means a portion facing closer to the skin to which the analyte monitoring device of the present invention is attached.
[0079] In the description of the present invention, "horizontal direction" refers to a direction roughly parallel to the skin to which the analyte monitoring device of the present invention is attached. Here, it is assumed that the skin to which the analyte monitoring device is attached is flat. Since the analyte monitoring device of the present invention has a lower surface of the housing in close contact with the skin, "horizontal direction" may refer to a direction parallel to the lower surface of the housing.
[0080]
[0081] Hereinafter, the present invention will be described with reference to the attached drawings.
[0082] FIG. 1 is a perspective view of an analyte monitoring device according to one embodiment of the present invention, FIG. 2 is a bottom perspective view of an analyte monitoring device according to one embodiment of the present invention, and FIG. 3 is an exploded perspective view of an analyte monitoring device according to one embodiment of the present invention.
[0083] Referring to FIGS. 1 to 3, the analysis monitoring device according to the present embodiment may include a housing (100), a sensor unit (200), a circuit unit (300), a contact holding unit (400), and a bonding holding unit (500).
[0084] The housing (100) may include an upper housing (110) and a lower housing (120). The housing (100) may form an internal space between the upper housing (110) and the lower housing (120). Components such as a sensor unit (200), a circuit unit (300), a contact maintenance unit (400), and a coupling maintenance unit (500) may be accommodated in the internal space.
[0085] The upper housing (110) and the lower housing (120) can be joined together at the side portion of the analysis material monitoring device to form an internal space. The upper housing (110) and the lower housing (120) can be joined together watertightly to form the internal space waterproof from the outside.
[0086] The upper housing (110) may include a top surface and a side surface extending downward from the edge portion of the top surface. The top surface of the upper housing (110) may correspond to the top surface of the analyte monitoring device. The side surface of the upper housing (110) may be coupled to the lower housing (120).
[0087] An upper opening (111) may be formed on the upper surface of the upper housing (110). A fixing member (250) for fixing the sensor unit (200) may be coupled to the upper opening (111). The fixing member (250) may be coupled to the sensor unit (200) to prevent the sensor unit (200) from moving.
[0088] The fixing part (250) may include a holder (251) and a packing holder (252). The holder (251) may be coupled with the sensor part (200) to fix the sensor part (200). A packing holder (252) may be coupled to the inside of the holder (251). The packing holder (252) may be formed with a width corresponding to the width of the sensor part (200) to fix the sensor part (200). In addition, the packing holder (252) may be pressurized by a needle embedded in an applicator (a device that attaches an analyte monitoring device to a user's skin) penetrating therethrough.
[0089] The lower housing (120) may include a lower surface and a side surface extending upward from the edge of the lower surface. The lower surface of the lower housing (120) corresponds to the lower surface of the analyte monitoring device and may come into contact with the user's skin. The lower surface of the lower housing (120) may be attached with adhesive tape or coated with adhesive, thereby allowing the analyte monitoring device to be attached to the user's skin.
[0090] A lower opening (121) may be formed in the lower housing (120). The lower opening (121) may be formed in a position facing the upper opening (111) in the vertical direction. When the sensor unit (200) is coupled to the lower housing (120), the sensor unit (200) may pass through the lower opening (121) so that the sensing unit (220) of the sensor unit (200) may be exposed to the outside.
[0091] A portion of the sensor unit (200) may be located within the internal space of the housing (100), and the remaining portion may be exposed to the outside through the lower opening (121). The sensor unit (200) may measure analytes within the body and transmit data related to the measurement to the circuit unit (300).
[0092] The sensor unit (200) may include a connection unit (210) and a sensing unit (220). The connection unit (210) may be located in the internal space of the housing (100). The sensing unit (220) may extend from the connection unit (210) and be exposed to the outside of the housing (100). The sensor unit (200) may measure analytes inside the body through the sensing unit (220).
[0093] The circuit unit (300) may be located in the internal space of the housing (100). The circuit unit (300) may process data measured through the sensor unit (200) and transmit the processed data to another device.
[0094] The circuit unit (300) may include a body unit (310) and a contact unit (320). The body unit (310) may be equipped with various circuit elements (313) related to processing data and transmitting the processed data to other devices. In addition, a battery (350) for driving these circuit elements (313) may be coupled to the body unit (310).
[0095] The battery (350) can be connected to the circuit unit (300) via a battery connection member (351). The battery connection member (351) is connected to the battery (350) and the circuit unit (300) to supply power from the battery (350) to the circuit unit (300).
[0096] The contact portion (320) may extend from the body portion (310). The contact portion (320) may contact the connecting portion (210). The contact portion (320) may be formed of a flexible material and may extend horizontally from a portion adjacent to the body portion (310), and may be formed to bend upward or downward upon contact with the connecting portion (210).
[0097] The circuit portion (300) can be formed of various materials and shapes.
[0098] According to one embodiment of the present invention, the circuit portion (300) may be formed as a rigid-flexible connecting board (Rigid Flexible PCB). Specifically, the body portion (310) may correspond to the rigid portion of the Rigid Flexible PCB, and the contact portion (320) may correspond to the flexible portion of the Rigid Flexible PCB. This embodiment will be described in detail below with reference to FIGS. 4 to 13.
[0099] According to another embodiment of the present invention, the circuit portion (300) may be formed in the form of a combination of a rigid circuit board and a flexible circuit board. Specifically, the body portion (310) may be formed of a rigid circuit board, and the contact portion (320) may be formed of a flexible circuit board (Flexible PCB) coupled to the body portion (310). This embodiment will be described in detail below with reference to FIGS. 14 to 16.
[0100] According to another embodiment of the present invention, the circuit portion (300) may be formed as a flexible circuit board. Specifically, the body portion (310) and the contact portion (320) may be formed as a single flexible circuit board. This embodiment will be described in detail below with reference to FIGS. 17 to 22.
[0101] The contact maintenance unit (400) may be located in the internal space of the housing (100). The contact maintenance unit (400) may maintain contact between the sensor unit (200) and the contact unit (320). Specifically, the contact maintenance unit (400) may maintain contact by bringing the connection unit (210) of the sensor unit (200) and the contact unit (320) into close contact with each other in a direction facing each other.
[0102] The coupling retaining portion (500) may be located in the internal space of the housing (100). The coupling retaining portion (500) may maintain the coupling state of the contact retaining portion (400), thereby strengthening the contact state between the sensor portion (200) and the contact portion (320).
[0103]
[0104] Hereinafter, with reference to FIGS. 4 to 13, an analysis monitoring device according to one embodiment of the present invention will be described.
[0105] Figure 4 is a perspective view of a circuit unit (300) according to one embodiment of the present invention.
[0106] Referring to Fig. 4, the circuit portion (300) may include a body portion (310) and a contact portion (320). In Fig. 4, the circuit portion (300) is illustrated as a circle, but is not limited thereto and may be formed in various shapes.
[0107] The body portion (310) may include various configurations. Specifically, the body portion (310) may include a battery receiving groove (316) in which at least a portion of the battery (350) is received. In addition, the body portion (310) may include a fixing portion coupling groove (317) to which the fixing portion (250) is coupled.
[0108] A groove (315) for accommodating a sensor portion (200) may be formed in the body portion (310). The connection portion (210) of the sensor portion (200) may be accommodated in the groove portion (315), so that the connection portion (210) may come into contact with the contact portion (320).
[0109] The contact portion (320) may extend horizontally from the groove portion (315) of the body portion (310). The contact portions (320) may be formed in the same number as the number of sensor terminals (230) of the sensor portion (200). Referring to Fig. 4, three contact portions (320) are formed spaced apart from each other.
[0110] As illustrated in FIG. 4, the plurality of contact portions (320) may extend from one side of the groove portion (315) of the body portion (310). However, in some cases, the plurality of contact portions (320) may extend from opposite sides of the groove portion (315).
[0111] The contact portion (320) may be formed of a flexible material. Therefore, the shape of the contact portion (320) may be changed by contact with the connecting portion (210). Fig. 4 illustrates the shape of the contact portion (320) before it comes into contact with the connecting portion (210). The contact portion (320) may extend horizontally in a portion adjacent to the body portion (310) before coming into contact with the connecting portion (210). In some cases, the contact portion (320) may bend downward due to its own weight before coming into contact with the connecting portion (210), but may generally remain extended horizontally.
[0112]
[0113] Fig. 5 is a cross-sectional view schematically illustrating the laminated structure of the circuit portion (300) illustrated in Fig. 4 taken along line AA'. Referring to Fig. 5, the configuration of the circuit portion (300) formed as a rigid flexible PCB will be described in detail. Fig. 5 is an exemplary drawing for explaining the configuration of the circuit portion (300). The laminated form of the wiring layer and resin layer of the circuit portion (300) is not limited to that illustrated in Fig. 5.
[0114] The body portion (310) corresponds to the rigid portion of the Rigid Flexible PCB. The body portion (310) is formed in a form in which multiple layers are laminated. Specifically, the body portion (310) may be formed by laminating wiring layers (3002, 3004, 3007), resin layers (3003, 3005, 3006), and solder resist layers (3001, 3008). Since the body portion (310) is formed by laminating rigid wiring layers (3002, 3007) and rigid resin layers (3003, 3006), the body portion (310) can be formed as a rigid substrate as a whole.
[0115] The contact portion (320) may correspond to a flexible portion of a rigid flexible PCB. The contact portion (320) may extend from a portion of the body portion (310). The contact portion (320) may extend from a portion of a plurality of laminated layers constituting the body portion (310).
[0116] Specifically, the contact portion (320) may be an extension of the intermediate wiring layer (3004) and the resin layer (3005) of the body portion (310). Here, the intermediate wiring layer (3004) may be formed relatively thinner than the other wiring layers (3003, 3006) and thus may have a flexible characteristic. In addition, the resin layer (3005), unlike the other resin layers (3003, 3006), may be formed of a flexible resin material (such as polyimide) and thus may have a flexible characteristic. Therefore, the contact portion (320) may be formed as a flexible substrate as a whole.
[0117] Although not shown in the drawing, in some cases, a non-conductive coverlay layer (not shown) or the like may be added to the surface of the wiring layer (3004) of the contact portion (320).
[0118]
[0119] Figure 6 is a perspective view of the lower housing (120), sensor unit (200), and circuit unit (300) in an exploded state according to one embodiment of the present invention.
[0120] The lower housing (120) may be formed with an extension (410) extending upward from the lower surface (122). The extension (410) may include a protrusion (411) and a separation portion (412) that are spaced apart from each other and protrude.
[0121] The protrusion (411) may be formed in a shape that protrudes upward from the lower surface (122). Specifically, the protrusion (411) may be formed in the shape of a wall that protrudes upward from the lower surface (122). The connecting portion (210) of the sensor unit (200) may be in contact with one surface of the protrusion (411). One surface of the connecting portion (210) may be supported by being in contact with the protrusion (411).
[0122] The separation portion (412) may be formed in a shape that protrudes upward from the lower surface (122). The separation portion (412) may be positioned at a position spaced apart from the protrusion (411). The protrusion (411) and the separation portion (412) may be formed to be spaced apart from each other by a predetermined interval. The connecting portion (210) of the sensor portion (200) is coupled between the protrusion (411) and the separation portion (412).
[0123] The separation portion (412) may be formed in a plurality of numbers. Referring to FIG. 6, four separation portions (412) are positioned at a predetermined interval from each other. A contact portion (320) may pass between adjacent separation portions (412).
[0124] The sensor unit (200) may include a connection unit (210) and a sensing unit (220).
[0125] The connecting portion (210) may be positioned in the internal space of the housing (100). Specifically, the connecting portion (210) may be formed in a plate shape that is vertically erected in the internal space of the housing (100). The connecting portion (210) may include at least one sensor terminal (230). Referring to FIG. 6, three sensor terminals (230) are formed on one surface of the connecting portion (210).
[0126] The sensing portion (220) extends from the connecting portion (210). The sensing portion (220) may extend downwardly from the end of the connecting portion (210). Accordingly, the sensing portion (220) may extend toward the user's skin.
[0127]
[0128] Fig. 7 is a perspective view of the lower housing (120) and sensor unit (200) combined in the state of Fig. 6.
[0129] As illustrated in FIG. 7, the sensor unit (200) may be coupled to the lower housing (120) before the circuit unit (300). When the sensor unit (200) is coupled to the lower housing (120), the connecting unit (210) may be fitted between the protrusion (411) and the spacer (412) so that the plate-shaped connecting unit (210) may be vertically erected. In addition, the sensor terminal (230) may be exposed laterally through the space between the plurality of spacers (412). When the sensor unit (200) is coupled to the lower housing (120), the sensing unit (220) may penetrate the lower opening (121) so that at least a portion thereof may be exposed to the outside of the housing (100).
[0130]
[0131] Fig. 8 is a perspective view of a state in which a circuit unit (300) is additionally connected to the lower housing (120) and the sensor unit (200) in the state of Fig. 7.
[0132] Referring to Fig. 8, the circuit unit (300) can be additionally coupled after the lower housing (120) and the sensor unit (200) are coupled. The circuit unit (300) can be coupled by descending from the upper portion of the lower housing (120) while the lower housing (120) and the sensor unit (200) are coupled. Accordingly, the sensor unit (200) and the protrusion (411) are positioned between the groove (315) of the circuit unit (300). In addition, a plurality of contact portions (320) can pass between a plurality of separation portions (412).
[0133] As the circuit part (300) is coupled, the contact part (320) comes into contact with the connection part (210). Specifically, the contact terminal (321) formed on the surface of the contact part (320) comes into contact with the sensor terminal. As the contact part (320) comes into contact with the connection part (210), the shape of the contact part (320) may be deformed according to the contact. Specifically, the contact part (320) may be deformed to bend upward.
[0134] Although not shown in the drawing, contrary to what was described above, there may be a case where the circuit portion (300) is coupled to the lower housing (120) before the sensor portion (200), and then the sensor portion (200) is additionally coupled thereafter. In this case, as the contact portion (320) comes into contact with the connecting portion, the contact portion (320) may be deformed to bend downward.
[0135]
[0136] Fig. 9 is a cross-sectional view of the lower housing (120), sensor unit (200), and circuit unit (300) shown in Fig. 8 taken along line AA'.
[0137] The connecting portion (210) of the sensor portion (200) is fitted between the protrusion (411) and the separation portion (412) so that the plate-shaped connecting portion (210) can be erected in a vertical direction. A sensor terminal can be formed on one surface of the connecting portion (210). The other surface of the connecting portion (210) can be supported by contacting the protrusion (411).
[0138] The contact portion (320) may include a horizontal extension portion (322), a bending portion (323), and a contact extension portion (324). The horizontal extension portion (322) may be a portion adjacent to the body portion (310) and extending in a horizontal direction. The bending portion (323) may extend from an end of the horizontal extension portion (322) and may bend upward or downward by contact with the connecting portion (210). The contact extension portion (324) may extend from an end of the bending portion (323) and may extend in parallel by contacting the connecting portion (210).
[0139] The contact portion (320) may include a contact terminal (321). The contact terminal (321) may be formed on the lower surface of the contact extension portion (324). The contact terminal (321) may be brought into contact with the corresponding sensor terminal (230).
[0140] The contact portion (320) may be formed of a material that is flexible and has a predetermined restoring force. Accordingly, although the contact portion (320) is in an upwardly bent state, it may have a property of recovering in a horizontal direction. Depending on this restoring force, the contact terminal (321) may be brought into close contact with the sensor terminal (230) and maintain a contact state.
[0141]
[0142] Fig. 10 is a perspective view of a state in which a contact maintenance part (400) is additionally connected to the state in Fig. 8. Fig. 11 is a cross-sectional view of the lower housing (120), sensor part (200), circuit part (300), and contact maintenance part (400) shown in Fig. 10 taken along line AA'.
[0143] Referring to FIGS. 10 and 11, a contact maintenance portion (400) may be additionally coupled to maintain the contact state between the contact portion (320) and the connection portion (210).
[0144] The contact maintenance portion (400) may include an extension portion (410) and a coupling portion (420). The extension portion (410) is configured to extend from the lower housing (120) and is described above with reference to FIG. 6. The extension portion (410) may include a protrusion portion (411) and a separation portion (412).
[0145] The coupling portion (420) is configured to be coupled with the extension portion (410). The coupling portion (420) is formed as a separate configuration from the housing (100), and can be additionally coupled after the sensor portion (200) and the circuit portion (300) are coupled to the lower housing (120). As an example, the contact maintenance portion (400) can be formed as a protrusion (411), a separation portion (412), and a fitting clip coupled from above between the protrusion (411) and the separation portion (412).
[0146] Specifically, the coupling portion (420) may include an insertion portion (421) that is inserted and coupled between the protrusion portion (411) and the separation portion (412). When the insertion portion (421) is inserted between the protrusion portion (411) and the separation portion (412), the contact portion (320) and the connection portion (210) are positioned between the insertion portion (421) and the protrusion portion (411). The contact portion (320) and the connection portion (210) may be maintained in close contact with each other between the insertion portion (421) and the protrusion portion (411).
[0147] The insertion portion (421) can be fitted between the protrusion portion (411) and the separation portion (412) in a force-fit manner. Specifically, the thickness of the insertion portion (421) is formed to be greater than the space between the contact portion (320) and the separation portion (412), so that the space between the protrusion portion (411) and the separation portion (412) is widened by the force-fit of the insertion portion (421), and the insertion portion (421) can be fitted. In this case, due to the restoring force of the protrusion portion (411) and the separation portion (412), the insertion portion (421) can press the contact portion (320) in a horizontal direction toward the connection portion (210). Accordingly, the press-fit state between the contact portion (320) and the connection portion (210) can be maintained more strongly.
[0148] The separation portion (412) may include an inclined portion (413) formed in a direction facing the protrusion (411). When the coupling portion (420) is coupled to the separation portion (412), the coupling portion (420) may be coupled while descending along the inclined portion (413).
[0149] Due to the angle of the inclined portion (413), a self-locking effect can be generated at the coupling portion (420) that prevents the coupling from being loosened by an external force. Through this, the degree of adhesion between the connection portion (210) and the contact portion (320) can be improved. When the contact portion (320) includes a plurality of spaced apart contact portions (320), the spaced portion (412) can be positioned between the plurality of contact portions (320).
[0150] In FIG. 10 and FIG. 11, the connecting portion (210) is shown in contact with the protrusion (411), and the contact portion (320) is shown in contact with the joining portion (420), so that they are in close contact with each other. However, conversely, it is also possible for the contact portion (320) to be in contact with the protrusion (411), and the connecting portion (210) to be in contact with the joining portion (420), so that they are in close contact with each other.
[0151]
[0152] Fig. 12 is a perspective view of a state in which a joint maintenance part (500) is additionally connected to the state of Fig. 10. Fig. 13 is a cross-sectional view of the lower housing (120), sensor part (200), circuit part (300), contact maintenance part (400), and joint maintenance part (500) shown in Fig. 12 taken along line AA'.
[0153] Referring to FIGS. 12 and 13, in order to maintain the engagement state of the engagement retaining member (500), an additional engagement retaining member (500) may be engaged.
[0154] The coupling retaining member (500) can maintain the coupling state of the extension member (410) and the coupling member (420). Specifically, the coupling retaining member (500) is located between the upper housing (110) and the contact retaining member (400), and can prevent the coupling member (420) from moving upward and separating from the extension member (410).
[0155] The joint retaining member (500) may include a flexible member positioned between the lower surface of the upper housing (110) and the contact retaining member (400). The flexible member may be, for example, a cushion tape, a foam tape, or a poron member.
[0156] The coupling retaining portion (500) may be positioned on the upper surface of the coupling portion (420). Specifically, the coupling retaining portion (500) may be positioned in the space between the upper housing (110) and the coupling portion (420). When the upper housing (110) is coupled to the lower housing (120), the coupling retaining portion (500) may be compressed between the upper housing (110) and the coupling portion (420). Accordingly, the coupling retaining portion (500) may press the coupling portion (420) in the direction of the extension portion (410).
[0157] The coupling retaining member (500) may be attached to the lower side of the upper surface of the upper housing (110). When the coupling retaining member (500) is attached to the upper housing (110), the coupling retaining member (500) may be positioned in the space between the upper housing (110) and the coupling member (420) as it is coupled to the lower housing (120). To this end, a location where the coupling retaining member (500) is to be attached may be specified on the lower side of the upper surface of the upper housing (110).
[0158]
[0159] Hereinafter, with reference to FIGS. 14 to 16, an analysis monitoring device according to another embodiment of the present invention will be described.
[0160] FIG. 14 is a perspective view of a lower housing (120), a sensor unit (200), and a circuit unit (300-1) combined according to another embodiment of the present invention.
[0161] The circuit portion (300-1) may be formed in the form of a combination of a rigid circuit board and a flexible circuit board. Specifically, the body portion (310-1) may be formed of a rigid circuit board, and the contact portion (320-1) may be formed of a flexible circuit board (Flexible PCB) coupled to the body portion (310-1).
[0162] The contact portion (320-1) can be coupled to the upper surface of the body portion (310-1). The contact portion (320-1) is coupled to be electrically connected to the body portion (310-1), so that measurement data of the sensor portion (200) can be transmitted to the body portion (310-1) through the contact portion (320-1).
[0163]
[0164] Fig. 15 is a perspective view of a state in which a contact maintenance part (400-1) is additionally attached to the state in Fig. 14. Fig. 16 is a cross-sectional view of the lower housing (120), sensor part (200), circuit part (300-1), and contact maintenance part (400-1) shown in Fig. 15 taken along line AA'.
[0165] Referring to FIGS. 15 and 16, a contact maintenance portion (400-1) may be additionally coupled to maintain the contact state between the contact portion (320-1) and the connection portion (210).
[0166] The contact maintenance portion (400-1) may include an extension portion (410-1) and a coupling portion (420-1).
[0167] The extension (410-1) may include a protrusion (411-1), a rotation axis (414), and a fixed pin (415).
[0168] The protrusion (411-1) may be formed in the form of a wall protruding upward from the lower surface (122). The connecting portion (210) of the sensor unit (200) may be in contact with one surface of the protrusion (411-1). One surface of the connecting portion (210) may be supported by being in contact with the protrusion (411-1).
[0169] The rotation axis (414) may be formed in the shape of a column protruding upward from the lower surface (122). The rotation axis (414) may be located at a position spaced apart from the protrusion (411).
[0170] The coupling member (420-1) may be a rotating member that can rotate around a rotation axis (414). The coupling member (420-1) may include an insertion hole into which the rotation axis (414) is inserted. The coupling member (420-1) may rotate and move to be adjacent to the protrusion (411-1).
[0171] The fixed pin (415) can fix the connecting portion (420-1) adjacent to the protrusion (411). Specifically, the connecting portion (420-1) can be rotated adjacent to the protrusion (411-1) and fitted into the fixed pin (415). The connecting portion can be prevented from rotating away from the protrusion (411-1) by the fixed pin (415).
[0172] When the connecting portion (420-1) and the protrusion (411-1) are fixed in an adjacent state, the contact portion (320-1) and the connecting portion (210) can be maintained in a state of close contact with each other between the connecting portion (420-1) and the protrusion (411-1). As the connecting portion (420-1) is fixed by the fixing pin (415), the connecting portion (420-1) can close the contact portion (320-1) in a horizontal direction toward the connecting portion (210). Accordingly, the close contact state between the contact portion (320-1) and the connecting portion (210) can be maintained more strongly.
[0173] Referring to Fig. 16, the connecting portion (420-1) may be in contact with the contact portion (320-1), thereby bringing the connecting portion (210) and the contact portion (320-1) into close contact with each other. In some cases, the connecting portion (420-1) may be formed in a shape in which at least a portion thereof is extended toward the contact portion (320-1), as illustrated in Fig. 16. However, the connecting portion (420-1) is not limited to the shape illustrated in Fig. 16 and may be implemented in various shapes.
[0174] The coupling retaining member (500) may be located in the internal space of the housing (100-1). The coupling retaining member (500) may be attached to the lower side of the upper surface of the upper housing (110-1). When the coupling retaining member (500) is attached to the upper housing (110-1), the coupling retaining member (500-1) may be positioned in the space between the upper housing (110-1) and the coupling member (420-1) as it is coupled to the lower housing (120-1). To this end, a location where the coupling retaining member (500-1) is to be attached may be specified on the lower side of the upper surface of the upper housing (110-1).
[0175] Hereinafter, with reference to FIGS. 17 to 22, an analysis monitoring device according to another embodiment of the present invention will be described.
[0176] Fig. 17 is a drawing showing both sides of a sensor unit (200) according to another embodiment of the present invention. Fig. 18 is a perspective view showing a state in which a lower housing (120), a sensor unit (200), and a circuit unit (300-2) are combined according to another embodiment of the present invention. Fig. 19 is a cross-sectional view taken along line AA' of Fig. 18.
[0177] Referring to Fig. 17, the sensor terminal (230) may be formed on the first surface (211a) or the second surface (211b) of the connecting portion (210). Here, the first surface (211a) and the second surface (211b) may be opposite surfaces of the connecting portion (210). As illustrated in Fig. 17, two first sensor terminals (230a) may be formed on the first surface (211a) of the connecting portion (210), and one second sensor terminal (230b) may be formed on the second surface (211b) opposite to the first surface (211a). The number of the first sensor terminals (230a) and the second sensor terminals (230b) may vary.
[0178] The first sensor terminal (230a) and the second sensor terminal (230b) may be formed in different parts of the sensor unit (200). Specifically, the first sensor terminal (230a) may be formed on the first surface (211a) of the first part of the connection unit (210), and the second sensor terminal (230b) may be formed on the second surface (211b) of the second part of the connection unit (210). Here, the first and second parts of the connection unit (210) may not face each other. Accordingly, the first sensor terminal (230a) and the second sensor terminal (230b) may be positioned so as not to face each other in the connection unit (210).
[0179] Referring to Fig. 18, the circuit portion (300-2) may be formed as a flexible circuit board. Specifically, the body portion (310-2) and the contact portion (320-2) may be formed as one flexible circuit board.
[0180] The contact portion (320-2) may be formed to correspond to the sensor terminal (230) of the sensor portion (200) described above. Specifically, the contact portion (320-2) may include a first contact portion (320-2a) and a second contact portion (320-2b). The first contact portion (320-2a) may extend from the first end (312a) of the body portion (310-2) toward the first surface (211a) and may come into contact with the first sensor terminal (230a). The second contact portion (320-2b) may extend from the second end (312b) of the body portion (310-2) toward the second surface (211b) and may come into contact with the second sensor terminal (230b).
[0181] Referring to FIGS. 18 and 19, the extension (410-2) may include a protrusion protruding from the lower housing (120). The protrusion may include a first protrusion (411-2a) and a second protrusion (411-2b) spaced apart from each other.
[0182] The first protrusion (411-2a) can be in contact with the second surface (211b) of the first portion of the connecting portion (210). A first sensor terminal (230a) can be formed on the first surface (211a) of the first portion of the connecting portion (210). Accordingly, the first protrusion (411a) can support the opposite surface of the first sensor terminal (230a).
[0183] The second protrusion (411-2b) can be in contact with the first surface (211a) of the second portion of the connecting portion (210). A second sensor terminal (230b) can be formed on the second surface (211b) of the second portion of the connecting portion (210). Accordingly, the second protrusion (411-2b) can support the opposite surface of the second sensor terminal (230b).
[0184] As illustrated in Fig. 18, a plurality of first protrusions (411-2a) and second protrusions (411-2b) may be formed. Accordingly, when the sensor unit (200) is coupled to the lower housing (120), the second sensor terminal (230b) may be exposed between the plurality of first protrusions (411-2a), and the first sensor terminal (230a) may be exposed between the plurality of second protrusions (411-2b). Thereafter, when the circuit part (300-2) is coupled to the lower housing (120), the first contact part (320-2a) can come into contact with the first sensor terminal (230a) while passing between the plurality of second protrusions (411-2b), and the second contact part (320-2b) can come into contact with the second sensor terminal (230b) while passing between the plurality of first protrusions (411-2a).
[0185] The circuit portion (300-2) may be a flexible circuit board in which the body portion (310-2) and the contact portion (320-2) are formed integrally. In this case, the contact portion (320-2) may protrude and extend horizontally from a portion of the body portion (310-2).
[0186] Specifically, when the circuit portion (300-2) is a flexible circuit board formed integrally, the thicknesses of the body portion (310-2) and the contact portion (320-2) may be the same. That is, unlike in FIG. 11, where the contact portion (320) is formed by extending between the body portion (310) (formed thin), in FIG. 19, the contact portion (320-2) may be formed integrally with the body portion (310-2) (formed with the same thickness as the body portion).
[0187]
[0188] Referring to FIG. 20, the contact maintenance portion (400-2) includes a protrusion (410-2) and a coupling portion (420-2). The coupling portion (420-2) may include a first coupling portion (420-2a) and a second coupling portion (420-2b).
[0189] The first connecting portion (420-2a) can be connected to the second protrusion (411-2b). Specifically, the first connecting portion (420-2a) can be connected to the second protrusion (411-2b) in the direction of the first surface (211a). When the first connecting portion (420-2a) is connected to the second protrusion (411-2b), the first contact portion (320-2a) and the first sensor terminal (230a) can be brought into close contact.
[0190] As illustrated in Fig. 20, one first connecting portion (420-2a) can be connected to a plurality of second protrusions (411-2b). To this end, the first connecting portion (420-2a) can be formed with connecting grooves corresponding to the number of second protrusions (411-2b).
[0191] The second connecting portion (420-2b) can be connected to the first protrusion (411-2a). Specifically, the second connecting portion (420-2b) can be connected to the first protrusion (411-2a) in the direction of the second surface (211b). The second connecting portion (420-2b) can be connected to the first protrusion (411-2a) and bring the second contact portion (320-2b) and the second sensor terminal (230b) into close contact.
[0192] As illustrated in Fig. 20, one second connecting portion (420-2b) can be connected to a plurality of first protrusions (411-2a). To this end, the second connecting portion (420-2b) can be formed with connecting grooves corresponding to the number of first protrusions (411-2a).
[0193] An inclined surface (422) that is coupled with a coupling retaining portion (500-2) may be formed on the upper portion of the coupling portion (420-2). The coupling of the inclined surface (422) with the coupling retaining portion (500-2) will be described with reference to FIGS. 21 and 22 below.
[0194]
[0195] FIG. 21 is a perspective view of the lower surface of the upper housing (110-2) according to one embodiment of the present invention, and FIG. 22 is a cross-sectional view of the state in which the lower housing (120-2), the circuit portion (300-2), the contact holding portion (400-2), the coupling holding portion (500-2), and the upper housing (110-2) are coupled according to one embodiment of the present invention.
[0196] Referring to FIG. 21, the housing (100-2) may include a coupling retaining portion (500-2). As an example, the coupling retaining portion (500-2) may include an upper protrusion (520) that protrudes from the lower surface of the upper housing (110-2) and comes into contact with the coupling portion (420-2). Specifically, the upper protrusion (520) may be formed in a form that protrudes from the lower surface of the upper housing (110-2) and comes into contact with the coupling portion (420-2).
[0197] The upper protrusion (520) may include an opposing inclined surface (521). In FIG. 19, the engaging portion (420-2) of the contact maintaining portion (400-2) may include an inclined surface (422). The opposing inclined surfaces (521) may be formed in a corresponding number at a position opposite to the inclined surface (422) of the engaging portion (420-2). The opposing inclined surfaces (521) may contact the inclined surface (422) to improve the engagement maintaining state of the extension portion (410-2) and the engaging portion (420-2).
[0198] As illustrated in Fig. 22, the sensor unit (200), the circuit unit (300-2), and the contact maintenance unit (400-2) are coupled to the lower housing (120-2), and the lower housing (120-2) and the upper housing (110-2) can be coupled. Specifically, the lower housing (120-2) and the upper housing (110-2) can be coupled with the protrusions (420-2) and the upper protrusions (520) aligned so that they face each other. When the upper housing (110-2) descends and is coupled with the lower housing (120-2), the upper protrusions (520) are coupled with the protrusions (420-2) in the internal space.
[0199] As the upper housing (110-2) descends, the opposite inclined surface (521) descends in contact with the inclined surface (422), and the first connecting portion (420-2a) and the second connecting portion (420-2b) can be brought into close contact with each other in a direction facing each other.
[0200] Specifically, as the lower housing (120-2) and the upper housing (110-2) are coupled, the first coupling portion (420-2a) can be brought into close contact with the first surface (211a) by the upper protrusion (520). Therefore, the close contact between the first contact portion (320-2a) and the first sensor terminal (230a) can be further strengthened. In addition, the second coupling portion (420-2b) can be brought into close contact with the second surface (211b) by the upper protrusion (520). Therefore, the close contact between the second contact portion (320-2b) and the second sensor terminal (230b) can be further strengthened.
[0201]
[0202] Hereinafter, additional embodiments of the present invention will be described with reference to FIGS. 23 to 39. In the additional embodiments described with reference to FIGS. 23 to 39 below, if overlapping drawing symbols are described with the embodiments described with reference to FIGS. 1 to 22, the overlapping drawing symbols will be described based on the contents described in the additional embodiments below.
[0203] In the description of an additional embodiment, "horizontal direction" refers to a direction roughly parallel to the skin to which the analyte monitoring device of the present invention is attached. Here, it is assumed that the skin to which the analyte monitoring device is attached is flat. Since the analyte monitoring device of the present invention has a lower surface of the housing in close contact with the skin, "horizontal direction" may refer to a direction parallel to the lower surface of the housing.
[0204] In the description of an additional embodiment, "vertical direction" means a direction orthogonal to the horizontal direction and away from the skin. Since the analyte monitoring device of the present invention has a lower surface of the housing in close contact with the skin, "vertical direction" may mean a direction perpendicular to the lower surface of the housing.
[0205] FIG. 23 is a perspective view of an analyte monitoring device according to an additional embodiment of the present invention, FIG. 24 is a bottom perspective view of an analyte monitoring device according to an additional embodiment of the present invention, and FIG. 25 is an exploded perspective view of an analyte monitoring device according to an additional embodiment of the present invention.
[0206] Referring to FIGS. 23 to 25, the analysis monitoring device according to the present embodiment may include a housing (100), a sensor unit (200), a circuit unit (300), a sensor holder (400), and a sensor fixing unit (500).
[0207] The housing (100) may include an upper housing (110) and a lower housing (120). The housing (100) may form an internal space between the upper housing (110) and the lower housing (120). Components such as a sensor unit (200), a circuit unit (300), a sensor holder (400), and a sensor fixing unit (500) may be accommodated in the internal space.
[0208] The upper housing (110) and the lower housing (120) can be joined together at the side portion of the analysis material monitoring device to form an internal space. The upper housing (110) and the lower housing (120) can be joined together watertightly to form the internal space waterproof from the outside.
[0209] The upper housing (110) may include a top surface and a side surface extending downward from the edge portion of the top surface. The top surface of the upper housing (110) may correspond to the top surface of the analyte monitoring device. The side surface of the upper housing (110) may be coupled to the lower housing (120).
[0210] An upper opening (111) may be formed on the upper surface of the upper housing (110). A sensor fixing part (500) that fixes the position of the sensor part (200) in the internal space may be positioned in the upper opening (111).
[0211] The lower housing (120) may include a lower surface and a side surface extending upward from the edge of the lower surface. The lower surface of the lower housing (120) corresponds to the lower surface (bottom surface) of the analyte monitoring device and may come into contact with the user's skin. The lower surface of the lower housing (120) may have adhesive tape attached to it or an adhesive applied thereto, so that the analyte monitoring device may be attached to the user's skin.
[0212] A through hole (121) may be formed in the lower housing (120). The through hole (121) may be formed in a position facing the upper opening (111) in the vertical direction. When the sensor unit (200) is coupled to the lower housing (120), the sensor unit (200) may pass through the through hole (121) so that the sensing unit (220) of the sensor unit (200) may be exposed to the outside.
[0213] A portion of the sensor unit (200) may be located in the internal space of the housing (100), and the remaining portion may be exposed to the outside through a through hole (121). The sensor unit (200) may measure analytes inside the body and transmit data related to the measurement to the circuit unit (300).
[0214] The sensor unit (200) may include a connection unit (210) and a sensing unit (220). The connection unit (210) may be located in the internal space of the housing (100). The sensing unit (220) may extend from the connection unit (210) and be exposed to the outside of the housing (100). The sensor unit (200) may measure analytes inside the body through the sensing unit (220).
[0215] The circuit unit (300) may be located in the internal space of the housing (100). The circuit unit (300) may process data measured through the sensor unit (200) and transmit the processed data to another device.
[0216] An opening (301) for accommodating a sensor unit (200) and a sensor holder (400) may be formed in the circuit unit (300). A signal terminal (310) electrically connected to a signal transmission unit (415, 425) may be formed in a portion of the circuit unit (300) adjacent to the opening (301).
[0217] The circuit unit (300) may include terminals on which the sensor unit (200), battery (350), and signal processing unit (not shown) are mounted or coupled. Specifically, the circuit unit (300) may include a signal terminal (310) formed in a portion adjacent to the contact unit. The signal terminal (310) may be electrically connected to the circuit connection terminals (415b, 425b) of the signal transmission unit (415, 425).
[0218] A battery (350) for driving circuit elements, etc. may be coupled to the circuit unit (300). The battery (350) may be coupled to the circuit unit (300) via a battery connection member (351). The battery connection member (351) may be coupled to the battery (350) and the circuit unit (300) to supply power from the battery (350) to the circuit unit (300).
[0219] A signal processing unit (not shown) may be mounted on the circuit unit (300). The signal processing unit may process data sensed by the sensor unit (200). In addition to the signal processing unit, the circuit unit (300) may also be mounted with various components, such as a communication unit (not shown) related to transmitting the processed data to another device.
[0220] The sensor holder (400) can be located in the internal space of the housing (100). The sensor holder (400) can be combined with the sensor unit (200) to fix the position of the sensor unit (200) and transmit data sensed by the sensor unit (200) to the circuit unit (300).
[0221] The sensor holder (400) may include a contact portion (401) and a contact holding portion (430).
[0222] The contact portion (410) may include a first contact portion (410) and a second contact portion (420). The first contact portion (410) and the second contact portion (420) may be in close contact with each other with the connection portion (210) of the sensor portion (200) interposed therebetween. Accordingly, the sensor portion (200) may be fixed between the first contact portion (410) and the second contact portion (420).
[0223] At least one of the first contact portion (410) and the second contact portion (420) may function as a transmission contact portion. The transmission contact portion refers to a component that not only physically contacts the sensor portion (200), but also performs the function of transmitting data sensed by the sensor portion (200) to the circuit portion (300). The component corresponding to the transmission contact portion may include a signal transmission portion (415, 425). The signal transmission portion (415, 425) may electrically connect the sensor portion (200) and the circuit portion (300).
[0224] The close contact maintaining portion (430) can be combined with the contact portion (401) to maintain the first contact portion (410) and the second contact portion (420) in close contact with each other. Specifically, the close contact maintaining portion (543) can apply an external force to the first contact portion (410) and the second contact portion (420) to strengthen the close contact state of the connecting portion (210) of the sensor portion (200) between the first contact portion (410) and the second contact portion (420).
[0225] The sensor fixing unit (500) may be located in the internal space of the housing (100). The sensor fixing unit (500) may be coupled to the sensor unit (200) in the sensor receiving space inside the contact unit (410). The sensor fixing unit (500) may fix the position of the sensor unit (200).
[0226]
[0227] Hereinafter, with reference to FIGS. 26 to 35, an analysis monitoring device according to an additional embodiment of the present invention will be described. FIG. 26 is a drawing showing both sides of a sensor unit according to an additional embodiment of the present invention.
[0228] Referring to Fig. 26, the sensor unit (200) may include a connecting unit (210) and a sensing unit (220). The connecting unit (210) may be located in the internal space of the housing (100). Specifically, the connecting unit (210) may be formed in a plate shape that is vertically erected in the internal space of the housing (100). The connecting unit (210) may include a first surface (211) and a second surface (212) that are vertically erected. The first surface (211) and the second surface (212) may correspond to opposite surfaces.
[0229] The connecting portion (210) may include at least one sensor terminal (230). The sensor terminal (230) may be formed on at least one of the first surface (211) and the second surface (212). Referring to FIG. 4, two first sensor terminals (231, 232) are formed on the first surface (211) of the connecting portion (210), and one second sensor terminal (233) is formed on the second surface (212). The surface and position of the sensor terminal formed on the connecting portion (210) may be variously changed.
[0230] The connecting portion (210) may include a sensor connecting portion (215). The sensor connecting portion (215) may be configured to strengthen the bonding between the connecting portion (210) and the contact portion (401) and to fix the position of the connecting portion (210) between the first contact portion (410) and the second contact portion (420). The sensor connecting portion (215) may be formed as a groove or an opening, etc. The connecting portions (412a, 422a) of the contact portion (401) to be described later may be inserted into and connected to the sensor connecting portion (215). The form in which the sensor connecting portion (215) and the connecting portions (412a, 422a) of the contact portion (401) are connected will be described in more detail below with reference to FIGS. 28 and 29.
[0231] The sensing portion (220) extends from the connecting portion (210). The sensing portion (220) may extend downwardly from the end of the connecting portion (210). Accordingly, the sensing portion (220) may extend toward the user's skin.
[0232]
[0233] Figure 27 is an exploded perspective view of a contact portion according to an additional embodiment of the present invention.
[0234] Referring to Fig. 27, the contact portion (401) may include a first contact portion (410) and a second contact portion (420) that are separated from each other. The first contact portion (410) and the second contact portion (420) may be formed as separate members and then be joined to each other in close contact with each other with the connecting portion (210) interposed therebetween.
[0235] As illustrated in Fig. 27, the contact portion (401) may be formed in a ring shape that forms a space therein. Specifically, the first contact portion (410) and the second contact portion (420) may be formed in a semicircular shape and may be combined with each other to form a ring-shaped structure.
[0236] At least one of the first contact portion (410) and the second contact portion (420) may function as a transmission contact portion. The transmission contact portion refers to a configuration that not only physically contacts the sensor portion (200), but also performs the function of transmitting data sensed by the sensor portion (200) to the circuit portion (300). The transmission contact portion may include a signal transmission portion coupled to the contact portion body. The signal transmission portion is formed of a conductive material and may electrically connect the sensor terminal (230) and the circuit portion (300).
[0237] In Fig. 27, both the first contact portion (410) and the second contact portion (420) are illustrated as functioning as transmission contact portions. However, in some cases, only one of the first contact portion (410) and the second contact portion (420) may function as a transmission contact portion. If only the first contact portion (410) functions as a transmission contact portion and the second contact portion (420) does not function as a transmission contact portion, the second contact portion (420) may not include a signal transmission portion. In addition, a sensor terminal may not be formed on the second surface (212) of the connection portion (210) of the sensor portion (200) that comes into contact with the second contact portion (420).
[0238] In the following, as illustrated in Fig. 27, the description will be based on the assumption that both the first contact portion (410) and the second contact portion (420) function as transmission contact portions.
[0239] Referring to FIG. 27, the first contact portion (410) includes a first contact portion body (411) and a first signal transmission portion (415). The first contact portion body (411) may include a first contact surface (412), a first circuit connection surface (413), and a first coupling surface (414).
[0240] The first contact surface (412) corresponds to the surface that comes into contact with the connection portion (210) of the sensor portion (200). The first contact surface (412) may be formed on one end of the first contact portion body (411). A sensor connection terminal (415a) of the first signal transmission portion (415) is formed on the first contact surface (412). The sensor connection terminal (415a) of the first signal transmission portion (415) comes into contact with the first sensor terminal (231, 232) formed on the first surface (211) of the connection portion (210).
[0241] The first circuit connection surface (413) corresponds to a surface adjacent to the circuit portion (300). The first circuit connection surface (413) may be formed on the other end of the first contact body (411). A circuit connection terminal (415b) of the first signal transmission portion (415) is formed on the first circuit connection surface (413). The first circuit connection surface (413) may be positioned adjacent to the signal terminal (310) of the circuit portion (300).
[0242] The first coupling surface (414) corresponds to a surface that is in contact with and coupled to the second contact portion (420). The first contact portion (410) is coupled to the second contact portion (420) with the sensor portion (200) interposed therebetween at the first contact surface (412) portion, and can be coupled to and directly coupled to the second contact portion (420) at the first coupling surface (414) portion.
[0243] The first signal transmission unit (415) may be coupled to the first contact body (411). The first signal transmission unit (415) may include a sensor connection terminal (415a) at one end and a circuit connection terminal (415b) at the other end. The sensor connection terminal (415a) of the first signal transmission unit (415) may be formed on the first contact surface (412), and the circuit connection terminal (415b) may be formed on the first circuit connection surface (413).
[0244] Referring to Fig. 27, two first signal transmission parts (415) are coupled to a first contact body (411). The two first signal transmission parts (415) spaced apart from each other can each be in contact with two first sensor terminals (231, 232) formed on the first surface (211) of the connecting part (210).
[0245] The first signal transmission unit (415) is formed of a conductive material. Specifically, the first signal transmission unit (415) may be a plating layer bonded to the first contact unit body (411). The plating layer may be formed on the first contact unit (410) in various ways. The plating layer may be formed by selectively plating the first contact unit body (411) formed of a non-conductive material.
[0246] As an example, the first signal transmission unit (415) may be a plating layer formed using the LDS (Laser Direct Structuring) method. The LDS method is a laser direct structuring method in which a laser is selectively irradiated only to a pattern area where a plating layer is to be formed on a base member, and then a plating layer is selectively formed only in the corresponding pattern area.
[0247] In the present invention, the first contact body (411) may be formed of a resin material containing a specific additive. The specific additive may be a material that is non-conductive but changes to conductive when irradiated with light under specific conditions. Thereafter, light (laser) under specific conditions may be irradiated to an area on the surface of the first contact body (411) where the first signal transmission unit (415) is to be formed. Accordingly, the additive in the area irradiated with light may change to conductive. Thereafter, when the first contact body (411) is immersed in a plating solution, a plating layer is selectively formed only on the area on the surface of the first contact body (411) where the light is irradiated.
[0248] As another example, the first signal transmission portion (415) may be a plating layer formed by a selective etching method. Specifically, the first contact portion (410) may be an injection-molded product composed of a first resin material and a second resin material having different chemical properties. The first contact portion (410) composed of these two types of resin materials may be injection-molded by a double injection method. Here, the area of the surface of the first contact portion body (411) where the first signal transmission portion (415) is to be formed may be formed of the first resin material. When the first contact portion (410) is immersed in a specific etching solution, only the area of the first resin material surface that reacts with the specific etching solution is etched. Thereafter, when the selectively etched first contact portion body (411) is immersed in a plating solution, a plating layer is selectively formed only on the etched area of the surface of the first contact portion body (411).
[0249] The first signal transmission unit (415) can be formed as a plating layer bonded to the surface of the first contact body (411) by various methods other than the above-described method.
[0250] The second contact portion (420) may be formed with a structure identical to or similar to that of the first contact portion (410). The second contact portion (420) includes a second contact portion body (421) and a second signal transmission portion (425). The second contact portion body (421) may include a second contact surface (422), a second circuit connection surface (423), and a second coupling surface (424). The description of the structure of the second contact portion (420) will be replaced with the description of the first contact portion (410).
[0251] The contact portion (401) may include a fastening portion (412a, 422a). The fastening portion (412a, 422a) may be a configuration of a portion where the first contact portion (410) and the second contact portion (420) are coupled. Specifically, the first contact portion (410) and the second contact portion (420) may each include a fastening portion (412a, 422a) that is fitted into each other. The fastening portion (412a, 422a) may be formed at a portion where the first contact portion (410) and the second contact portion (420) are in contact with each other.
[0252] Specifically, the fastening portions (412a, 422a) may be formed on the first contact surface (412) and the second contact surface (422). As illustrated in Fig. 27, a first fastening portion (412a) in the form of a protrusion may be formed on the first contact surface (412), and a second fastening portion (422a) in the form of a groove may be formed on the second contact surface (422). When the first contact portion (410) and the second contact portion (420) are coupled, the first and second fastening portions (412a, 422a) may be fitted together.
[0253] In addition, the fastening portions (412a', 422a') may also be formed on the first coupling surface (414) and the second coupling surface (424). As illustrated in FIG. 5, a first fastening portion (412a') in a groove shape may be formed on the first coupling surface (414), and a second fastening portion (422a') in a protrusion shape may be formed on the second coupling surface (424). When the first contact portion (410) and the second contact portion (420) are coupled, the first and second fastening portions (412a', 422a') may be fitted together.
[0254]
[0255] FIG. 28 is an exploded perspective view of a first contact portion, a second contact portion, and a sensor portion according to an additional embodiment of the present invention, and FIG. 29 is a perspective view of a state in which the first contact portion, the second contact portion, and the sensor portion are combined according to an additional embodiment of the present invention.
[0256] Referring to FIGS. 28 and 29, the first contact portion (410) and the second contact portion (420) can be tightly coupled to each other with the connecting portion (210) therebetween. Accordingly, the first surface (211) of the connecting portion (210) comes into contact with the first contact surface (412) of the first contact portion (410), and the second surface (212) comes into contact with the second contact surface (422) of the second contact portion (420).
[0257] The connecting portion (210) may be formed in a plate shape that is vertically erected on the lower surface of the housing (100). In addition, the first contact surface (412) and the second contact surface (422) may also be formed as vertical surfaces that are vertically erected on the lower surface. Accordingly, the first contact surface (412), the connecting portion (210), and the second contact surface (422) may be in close contact with each other in the horizontal direction.
[0258] The first signal transmission unit (415) may extend from the sensor connection terminal (415a) to the circuit connection terminal (415b). The sensor connection terminal (415a) of the first signal transmission unit (415) may be formed on the first contact surface (412). In addition, the circuit connection terminal (415b) may be formed on the first circuit connection surface (413).
[0259] The sensor connection terminal (415a) of the first signal transmission unit (415) is in contact with the first sensor terminal (231, 232) formed on the first surface (211) of the connection unit (210), and the circuit connection terminal (415b) can be connected to the signal terminal (310) of the circuit unit (300). Through this, the first signal transmission unit (415) can electrically connect the first sensor terminal (231, 232) and the circuit unit (300).
[0260] The second signal transmission unit (425) may also be formed in the same manner as the first signal transmission unit (415). The sensor connection terminal (425a) of the second signal transmission unit (425) may be in contact with the second sensor terminal (233) formed on the second surface (212) of the connection unit (210), and the circuit connection terminal (425b) may be connected to the signal terminal (310) of the circuit unit (300). Through this, the second signal transmission unit (425) may electrically connect the second sensor terminal (231) and the circuit unit (300).
[0261] The connecting portion (210) of the sensor portion (200) may include a sensor fastening portion (215). The sensor fastening portion (215) may be coupled with fastening portions (412a, 422a). The sensor fastening portion (215) may be formed in a shape such as a groove or an opening. When the first contact portion (410) and the second contact portion (420) are coupled, the fastening portions (412a, 422a) may be fitted and coupled. When the fastening portions (412a, 422a) are coupled, the first fastening portion (412a) formed in a protruding structure among the fastening portions may be coupled by passing between the sensor fastening portions (215). Due to the combination of the sensor connection part (215) and the connection part (412a, 422a), the position of the connection part (210) can be fixed between the first contact part (410) and the second contact part (420).
[0262] Referring to Fig. 29, when the first contact portion (410) and the second contact portion (420) are combined, a sensor receiving space (402) can be formed inside the contact portion (401). The connecting portion (210) can extend between the first contact surface (412) and the second contact surface (422) to the sensor receiving space (402) and to the sensing portion (220).
[0263] When the first contact portion (410) and the second contact portion (420) are combined, the first circuit connection surface (413) and the second circuit connection surface (423) can be positioned on the same plane. Accordingly, the circuit connection terminals (415b, 425b) formed on the first circuit connection surface (413) and the second circuit connection surface (423) can be combined with a plurality of signal terminals (310) arranged in a row through solder or the like.
[0264]
[0265] FIG. 30 is a partially exploded perspective view of a sensor unit, a contact unit, and a close-contact holding unit according to an additional embodiment of the present invention, and FIG. 31 is a perspective view of a combined state of a sensor unit, a contact unit, and a close-contact holding unit according to an additional embodiment of the present invention.
[0266] Referring to Fig. 30, the sensor holder (400) may include a close-contact retaining portion (430). The close-contact retaining portion (430) may be coupled with the contact portion (401). Specifically, the close-contact retaining portion (430) may maintain a close-contact state of the first contact portion (410) and the second contact portion (420). The close-contact retaining portion (430) may further strengthen the horizontal close contact of the first contact surface (412), the connection portion (210), and the second contact surface (422) by allowing the first contact portion (410) and the second contact portion (420) to be in close contact with each other in a direction facing each other.
[0267] The adhesion maintenance part (430) may include a bracket (431) and an elastic part (433).
[0268] The bracket (431) may be formed in a ring shape that surrounds at least a portion of the contact portion (401). When the contact retaining portion (430) is coupled with the contact portion (401), the bracket (431) may be positioned to surround at least a portion of the contact portion (40) from the outside of the contact portion (401).
[0269] The elastic portion (433) may be located inside the bracket (431). The elastic portion (433) may extend inward from the bracket (431) and may be formed to have elasticity. The elastic portion (433) may be coupled to the elastic portion fastening portion (421a) of the contact portion (401).
[0270] As illustrated in Fig. 31, when the contact portion (430) is coupled with the contact portion (401), the elastic portion (433) may be deformed. The elastic portion (433) may apply an external force to push the contact portion (401) toward the inside of the bracket (431) by means of a restoring force. Accordingly, the first contact portion (410) and the second contact portion (420) may be brought into close contact with each other in a direction facing each other.
[0271] The bracket (431) of the sealing member (430) may be formed with at least one opening (432). The opening (432) may be formed as an opening connecting the inside and the outside of the bracket. When the sealing member (430) is coupled to the contact member (401), at least a portion of the contact member (401) may extend from the inside to the outside of the bracket (431) through the opening (432).
[0272] As illustrated in Fig. 31, the circuit connection surface (413, 423) of the contact portion (401) can extend to the outside of the bracket (431) through the opening portion (432). Through this, the circuit connection surface (413, 423) can be positioned on the outside of the bracket (431) and connected to the circuit portion (300).
[0273]
[0274] FIG. 32 is a partially exploded perspective view of a sensor unit, a sensor holder, and a sensor fixing unit according to an additional embodiment of the present invention, and FIG. 33 is a cross-sectional view of a state in which a sensor unit, a sensor holder, and a sensor fixing unit are combined according to an additional embodiment of the present invention.
[0275] Referring to Fig. 32, when the sensor unit (200) is coupled to the sensor holder (400), a sensor receiving space (402) is formed inside the sensor holder (400). The sensor unit (200) can extend into the sensor receiving space (402).
[0276] Referring to FIGS. 32 and 33, the sensor fixing unit (500) can be inserted into the sensor receiving space (402). The sensor fixing unit (500) can be coupled with the sensor unit (200) in the sensor receiving space (402). The position of the sensor unit (200) can be fixed by the sensor fixing unit (500).
[0277]
[0278] Figure 34 is an exploded perspective view of an analysis monitoring device according to an additional embodiment of the present invention with the upper housing open.
[0279] Referring to Fig. 34, the combination of the sensor unit (200) and the sensor holder (400) can be coupled to the lower housing (120). When the combination of the sensor unit (200) and the sensor holder (400) is coupled to the lower housing (120), the sensing unit (220) of the sensor unit (200) can be exposed to the outside through the through hole (121).
[0280] Additionally, the circuit portion (300) may be coupled to the lower housing (120) so that the opening (301) accommodates the combination of the sensor portion (200) and the sensor holder (400). The signal terminal (310) of the circuit portion (300) may be positioned adjacent to the circuit connection terminals (415b, 425b). The signal terminal (310) of the circuit portion (300) may be electrically connected to the circuit connection terminals (415b, 425b) through solder or the like.
[0281] The sensor fixing unit (500) can be inserted into the sensor receiving space (402). The sensor fixing unit (500) can be combined with the sensor unit (200) in the sensor receiving space (402). The position of the sensor unit (200) can be fixed by the sensor fixing unit (500).
[0282] In Fig. 33, the sensor unit (200), the sensor holder (400), and the sensor fixing unit (500) are first combined, and then the combined body is combined to the lower housing (120). However, in Fig. 34, the sensor unit (200) and the sensor holder (400) are first combined, and then the sensor fixing unit (500) is combined after the combined body is combined to the lower housing (120). The present invention is not limited to the order in which each component is combined.
[0283]
[0284] Figure 35 is an exploded perspective view of an analysis monitoring device according to an additional embodiment of the present invention.
[0285] Referring to Fig. 35, the sensor unit (200), the sensor holder (400), and the fixing unit (500) can be coupled to the lower housing (120). In addition, the circuit unit (300) can also be coupled to the lower housing (120), and the signal terminal (310) and the circuit connection terminals (415b, 425b) can be electrically connected. Through this, the circuit unit (300) can obtain sensing data of the sensor unit (200). Thereafter, the fixing unit cover (530) and the upper housing (110) can be additionally coupled.
[0286] A fixing cover (530) may be coupled to the upper portion of the sensor holder (400) and the fixing portion (500). In addition, an upper housing (110) may be coupled to the lower housing (120). An upper opening (111) may be formed in the upper housing (110). The upper opening (111) may be coupled to the fixing portion cover (530). The edge portion of the fixing portion cover (530) is located below the circumference of the upper opening (111) and may be coupled by a waterproof tape (531) or the like. Accordingly, the internal space of the housing (100) may be maintained in a waterproof state from the outside.
[0287]
[0288] Hereinafter, with reference to FIG. 36, a device for monitoring an analysis substance according to another embodiment of the present invention will be described.
[0289] Fig. 36 is an exploded perspective view of a contact portion according to another embodiment of the present invention. The contact portion (401-1) illustrated in Fig. 36 will be described focusing on differences from the contact portion (401) illustrated in Fig. 27.
[0290] Referring to FIG. 36, the contact portion (401-1) may include a first contact portion (410-1) and a second contact portion (420-1) that are separated from each other. In FIG. 36, both the first contact portion (410-1) and the second contact portion (420-1) are illustrated as functioning as transmission contact portions.
[0291] The first signal transmission unit (415-1) can be coupled to the first contact unit body (411-1). The first signal transmission unit (415-1) is formed of a conductive material. Specifically, the first signal transmission unit (415-1) can be formed as a metal plate that is processed to be bent into a specific shape. The first signal transmission unit (415-1) can be a metal plate that is press-processed so that it can be coupled to the surface of the first contact unit body (411-1). A mounting unit (416) to which the first signal transmission unit (415-1) can be coupled can be formed on the surface of the first contact unit body (411-1). The mounting unit (416) can be formed in a recessed groove shape corresponding to the thickness of the first signal transmission unit (415-1). When the first signal transmission unit (415-1) is formed as a plate made of metal, it can be formed thicker than when formed as a plating layer.
[0292] The second contact portion (420-1) may be formed with a structure identical to or similar to that of the first contact portion (410-1). Specifically, the second signal transmission portion (425-1) may also be formed as a metal plate that is bent into a specific shape. The second signal transmission portion (425-1) may be coupled to the surface of the second contact portion body (421-1).
[0293]
[0294] Hereinafter, with reference to FIG. 37, a device for monitoring an analysis substance according to another embodiment of the present invention will be described.
[0295] Fig. 37 is a perspective plan view of a contact portion according to another embodiment of the present invention. The contact portion (401-2) illustrated in Fig. 37 will be described focusing on differences from the contact portion (401) illustrated in Fig. 27.
[0296] The first signal transmission unit (415-2) can be coupled by being embedded in at least a portion of the first contact body (411-2). Referring to FIG. 37, the sensor connection terminal (415a-2) and the circuit connection terminal (415b-2) portions of the first signal transmission unit (415-2) are exposed to the surface of the first contact body (411-2), but other portions can be embedded and positioned inside the first contact body (411-2).
[0297] The first contact body (411-2) may be formed by injection molding (insert molding) so that the first signal transmission unit (415-2) is inserted therein. In addition, in some cases, the first signal transmission unit (415-2) may be inserted into and coupled to the inside of the first contact body (411-2).
[0298] The second contact portion (420-2) and the second signal transmission portion (425-2) may be formed with the same or similar structure as the first contact portion (410-1) and the first signal transmission portion (415-2). At least a portion of the second signal transmission portion (425-2) may be embedded and coupled to the second contact portion body (421-2). The sensor connection terminal (425a-2) and the circuit connection terminal (425b-2) portions of the second signal transmission portion (425-2) are exposed to the surface of the second contact portion body (421-2), but the other portions may be embedded and positioned inside the second contact portion body (421-2).
[0299]
[0300] Hereinafter, with reference to FIGS. 38 and 39, an analysis monitoring device according to another embodiment of the present invention will be described.
[0301] Fig. 38 is an exploded perspective view of a sensor unit and a contact unit according to another embodiment of the present invention, and Fig. 39 is a perspective view of a coupled state of a sensor unit and a sensor holder according to another embodiment of the present invention.
[0302] Referring to Fig. 38, the contact portion (401-3) may be formed as a single integral structure. The contact portion (401-3) may have a slit formed on one side. The contact portion (401-3) may have a sensor receiving space (402-3) formed therein, and may have a C-shaped structure with the slit portion open.
[0303] In the contact portion (401-3), the first contact portion (412-3) and the second contact portion (422-3) may be formed as contact surfaces that contact both sides of the connecting portion (210). The space between the first contact portion (412-3) and the second contact portion (422-3) may correspond to a slit.
[0304] Referring to Fig. 39, the slit can be closed when the first contact portion (412-3) and the second contact portion (422-3) are in close contact with each other in the contact portion (401-3). The connecting portion (210) is positioned between the slits, so that both sides of the connecting portion (210) can be in close contact with and coupled to the first contact portion (412-3) and the second contact portion (422-3). The sensor receiving space (402-3) inside the contact portion (401-3) can become a horizontally closed space as the slit is closed. The sensor receiving space (402-3) can be extended by the connecting portion (210) and can be extended to the sensing portion (220).
[0305] The close contact member (430-3) may be formed as an opening prevention clip of a slit that is coupled near the first contact member (412-3) and the second contact member (422-3) so that the first contact member (412-3) and the second contact member (422-3) can be in close contact with each other.
[0306]
[0307] The analyte monitoring device of the above-described configuration has the advantage of a sensor unit that is stably attached to the sensor holder, while the sensor unit and circuit unit can be electrically connected in a simple manner. Furthermore, the electrical connection between the sensor holder and the sensor unit, and between the sensor holder and the circuit unit, is simple yet robust, resulting in excellent durability.
[0308]
[0309] The technical features disclosed in each embodiment of the present invention are not limited to that embodiment, and, unless they are mutually incompatible, the technical features disclosed in each embodiment may be combined and applied to different embodiments.
[0310] Therefore, although each embodiment focuses on its own technical features, each technical feature can be applied in combination with each other as long as they are not mutually incompatible.
[0311] The present invention is not limited to the above-described embodiments and the attached drawings, and various modifications and variations are possible within the scope of those skilled in the art. Therefore, the scope of the present invention should be defined not only by the claims of this specification but also by equivalents thereof.
Claims
1. A housing forming an internal space; A sensor unit including a connecting unit located in the internal space and a sensing unit extended from the connecting unit and exposed to the outside of the housing; and A circuit portion including a contact portion located in the above internal space and in contact with the connecting portion, The above contact portion is formed of a flexible material, extends horizontally from a portion adjacent to the body portion of the circuit portion, and is formed to bend upward or downward by contact with the connecting portion. Analytical monitoring device.
2. In paragraph 1, The above body part is formed of a rigid circuit board. Analytical monitoring device.
3. In paragraph 2, The above body part is formed of a circuit board including a plurality of laminated layers, The above contact portion is formed of a flexible conductive member extending from at least one of the plurality of layers. Analytical monitoring device.
4. In paragraph 2, The above contact part is a flexible circuit board connected to the body part. Analytical monitoring device.
5. In paragraph 1, The above contact part, A horizontal extension portion adjacent to the body portion and extending in a horizontal direction; and A bending portion extending from an end of the above horizontal extension portion and bent upward or downward by contact with the connecting portion. Analytical monitoring device.
6. In paragraph 1, The above contact part, It further includes a contact extension portion that extends from an end of the above bending portion and extends parallel to the connecting portion while in contact with it. Analytical monitoring device.
7. In paragraph 1, The above connecting part is formed in the shape of a plate erected in a vertical direction. Analytical monitoring device.
8. In paragraph 7, The above connecting portion includes a sensor terminal formed on a surface opposite to the contact portion, The above contact portion includes a contact terminal formed on the lower surface, The above contact portion is bent upward by contact with the above connecting portion, so that the sensor terminal and the above contact terminal come into contact. Analytical monitoring device.
9. In paragraph 7, The above connecting part, A first sensor terminal formed on the first surface; and Including a second sensor terminal formed on a second surface opposite to the first surface, The above contact part, A first contact portion extending from the first end of the body portion in the first surface direction and contacting the first sensor terminal; and A second contact portion extending from the second end of the body portion in the second surface direction and contacting the second sensor terminal is included. Analytical monitoring device.
10. In paragraph 1, Further comprising a contact maintenance portion that maintains the contact state between the above connecting portion and the above contact portion. Analytical monitoring device.
11. In clause 10, The above contact maintenance part is, an extension extending from the housing into the internal space; and Including a connecting portion that is coupled with the extension portion so that the connecting portion and the contact portion are in contact with each other between the extension portion and the extension portion. Analytical monitoring device.
12. In paragraph 11, The above extension part, A protrusion protruding from the housing and in contact with one of the connecting portion and the contact portion; and A spacer is included that protrudes from the housing and is spaced apart from the protrusion, The above joint is, It is coupled between the above protrusion and the above gap, and contacts the other one of the above connecting portion and the above contact portion, and brings the above connecting portion and the above contact portion into close contact with each other. Analytical monitoring device.
13. In paragraph 11, The above extension part, A protrusion protruding from the housing and in contact with one of the connecting portion and the contact portion, The above joint is, Rotates around the rotation axis to be adjacent to the protrusion, contacts the other one of the connecting portion and the contact portion, and brings the connecting portion and the contact portion into close contact with each other. Analytical monitoring device.
14. In paragraph 11, The above connecting part, A first sensor terminal formed on a first surface of the first part of the above connecting portion; and Including a second sensor terminal formed on a second surface of the second part of the above connecting portion, wherein the first surface and the second surface are opposite surfaces; The above contact part, A first contact portion extending from the first end of the body portion in the first surface direction and contacting the first sensor terminal; and A second contact portion extending from the second end of the body portion in the second surface direction and contacting the second sensor terminal is included. The above extension part, A first protrusion protruding from the housing and contacting the second surface of the first portion; and A second protrusion protruding from the housing and contacting the first surface of the second portion, The above joint is, A first coupling portion coupled with the second protrusion in the first surface direction and maintaining a contact state between the first sensor terminal and the first contact portion; and A second connecting portion is coupled with the first protrusion in the second surface direction and maintains a contact state between the second sensor terminal and the second contact portion. Analytical monitoring device.
15. In Article 11, It further includes a joint maintenance part that maintains the joint state of the extension part and the joint part. Analytical monitoring device.
16. Housing forming the internal space; A sensor unit located in the internal space and including a connecting unit having at least one sensor terminal formed therein and a sensing unit extending from the connecting unit and exposed to the outside of the housing; A circuit unit located in the above internal space and including a signal processing unit; and A sensor holder including a first contact portion and a second contact portion that contact the first and second surfaces of the connecting portion, respectively, and electrically connecting the sensor terminal and the circuit portion. Analytical monitoring device.
17. In paragraph 16, At least one of the first contact portion and the second contact portion, A transmission contact part including a signal transmission part connected to the above sensor terminal and the above circuit part Analytical monitoring device.
18. In paragraph 17, The above-mentioned transmission contact portion is formed of a resin material containing an additive that is non-conductive but changes to conductive when irradiated with light under specific conditions, and includes a light-irradiated area where the additive changes to conductive when light under specific conditions is irradiated to a portion of the surface. The above-mentioned transmission contact part is a plating layer coupled to the above-mentioned light irradiation area. Analytical monitoring device.
19. In paragraph 16, The above sensor holder, The first contact portion and the second contact portion further include a contact maintenance portion that maintains the first contact portion and the second contact portion in contact with each other with the connecting portion interposed therebetween. Analytical monitoring device.
20. In paragraph 16, The above sensor holder forms a sensor receiving space that accommodates a portion of the above connecting portion adjacent to the sensing portion, A through hole through which the sensing part passes is formed in a portion located at the lower part of the sensor receiving space in the housing. Analytical monitoring device.
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