Low-voltage equipment, transformer substation, and new energy power station

Abstract

Low-voltage equipment, a transformer substation, and a new energy power station, relating to the technical field of energy storage power generation. The low-voltage equipment comprises: a housing, a plurality of accommodating cavities being defined in the housing, and the plurality of accommodating cavities being respectively used for mounting a first-type electronic device, a second-type electronic device, and a third-type electronic device; and a first heat dissipation apparatus, a second heat dissipation apparatus, and a third heat dissipation apparatus, the first heat dissipation apparatus, the second heat dissipation apparatus and the third heat dissipation apparatus being respectively mounted in the accommodating cavities where the first-type electronic device, the second-type electronic device and the third-type electronic device are located.

Description

Low-voltage equipment, substations and new energy power stations

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is based on the Chinese patent application with application number: 202323368517X and application date of December 6, 2023, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby introduced into this application as a reference. Technical Field

[0003] The present application relates to the technical field of energy storage and power generation, and in particular to a low-voltage device, a substation and a new energy power station. Background Art

[0004] Low-voltage equipment is usually equipped with a large number of electronic devices of different types. The electronic devices generate heat during operation, resulting in a higher temperature inside the low-voltage equipment. In related technologies, heat dissipation vents are set on the top or surrounding door panels of the low-voltage equipment, and heat dissipation ducts are formed through the heat dissipation vents to reduce the temperature of the electronic devices. However, due to the different heat generation and operating temperature requirements of different types of electronic devices, this heat dissipation method can easily cause poor heat dissipation effect of some electronic devices, resulting in the inability to reach the required operating temperature, thereby affecting the working efficiency of the electronic devices.

[0005] Summary of the Invention

[0006] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a low-voltage device, a substation, and a new energy power station that can independently dissipate heat by selecting a corresponding heat dissipation solution based on the heat generation and operating temperature requirements of different electronic components, thereby improving the heat dissipation effect within the low-voltage device.

[0007] In a first aspect, the present application provides a low-voltage device, comprising:

[0008] a housing, wherein a plurality of accommodating cavities are defined within the housing, and the plurality of accommodating cavities are respectively used to install the first type of electronic device, the second type of electronic device, and the third type of electronic device;

[0009] A first heat dissipation device, a second heat dissipation device and a third heat dissipation device are respectively installed in the accommodating cavities where the first type of electronic device, the second type of electronic device and the third type of electronic device are located.

[0010] According to the low-voltage equipment provided in the embodiment of the present application, by utilizing the first heat dissipation device, the second heat dissipation device and the third heat dissipation device to dissipate heat for the communication electronic components, the power distribution electronic components and the low-voltage convergence electronic components in the low-voltage equipment respectively, the corresponding heat dissipation scheme can be selected according to the requirements of the heat generation and operating temperature of different electronic components for independent heat dissipation to improve the heat dissipation effect inside the low-voltage equipment.

[0011] According to one embodiment of the present application, the first type of electronic device includes an uninterruptible power supply, and the first heat dissipation device includes:

[0012] An air conditioner, wherein the air inlet and outlet of the air conditioner are both connected to the accommodating cavity where the first type of electronic device is located.

[0013] According to one embodiment of the present application, the second type of electronic device includes a transformer, a wall surface of the accommodating cavity where the second type of electronic device is located is provided with a second air inlet and a second air outlet, and the second heat dissipation device includes:

[0014] A first fan is used to drive air to flow from the second air inlet into the accommodating cavity where the second type of electronic device is located, and to drive air to flow out of the accommodating cavity where the second type of electronic device is located from the second air outlet.

[0015] According to one embodiment of the present application, the second air inlet is located on the back of the accommodating cavity where the second type of electronic device is located, and the second air outlet is located on the bottom of the accommodating cavity where the second type of electronic device is located.

[0016] According to one embodiment of the present application, it further includes:

[0017] a shutter, the shutter being installed at the second air inlet;

[0018] and / or,

[0019] a first filter element, the first filter element being installed at the second air inlet;

[0020] and / or,

[0021] a wire mesh installed at the second air outlet;

[0022] and / or,

[0023] A second filter element is installed at the second air outlet.

[0024] According to one embodiment of the present application, the third type of electronic device includes a circuit breaker, the wall surface of the accommodating cavity where the third type of electronic device is located is provided with a third air inlet and a third air outlet, and the third heat dissipation device includes:

[0025] The second fan is used to drive air to flow from the third air inlet into the accommodating cavity where the third type of electronic device is located, and to flow out of the accommodating cavity where the third type of electronic device is located from the third air outlet.

[0026] According to one embodiment of the present application, the third type of electronic device includes a circuit breaker, and the third heat dissipation device includes:

[0027] A heat exchanger having a first heat exchange path and a second heat exchange path, wherein the first heat exchange path is connected to the accommodating cavity where the third type electronic device is located, and the second heat exchange path is connected to the external environment, and the air in the first heat exchange path is used to exchange heat with the air in the second heat exchange path.

[0028] According to one embodiment of the present application, the third type of electronic device includes a circuit breaker, and the third heat dissipation device includes:

[0029] A third fan is installed in the accommodating cavity where the third type of electronic device is located, and is used to disturb the air in the accommodating cavity where the third type of electronic device is located.

[0030] According to one embodiment of the present application, the first heat dissipation device is installed on the back side of the housing;

[0031] and / or,

[0032] The second heat dissipation device is installed on the back of the housing;

[0033] and / or,

[0034] The third heat dissipation device is installed on the back side of the casing.

[0035] According to one embodiment of the present application, the accommodating cavities corresponding to the first type of electronic devices and the second type of electronic devices are distributed horizontally with the accommodating cavities corresponding to the third type of electronic devices, and the accommodating cavities corresponding to the first type of electronic devices are distributed vertically with the accommodating cavities corresponding to the second type of electronic devices.

[0036] In a second aspect, the present application provides a substation, comprising:

[0037] booster equipment;

[0038] String inverter unit;

[0039] As in any of the above-mentioned low-voltage devices, the low-voltage device is electrically connected to the boost device and the string inverter unit.

[0040] According to the substation provided in the embodiment of the present application, by adopting the low-voltage equipment of any of the above embodiments, the corresponding heat dissipation solution can be selected for independent heat dissipation according to the requirements of the heat generation and operating temperature of different electronic devices, so as to improve the heat dissipation effect inside the low-voltage equipment.

[0041] In a third aspect, the present application provides a new energy power station, which includes:

[0042] A substation as described in any of the above embodiments.

[0043] According to the new energy power station provided in the embodiment of the present application, by adopting the substation of any of the above embodiments, the corresponding heat dissipation solution can be selected for independent heat dissipation according to the heat generation and operating temperature requirements of different electronic devices to improve the heat dissipation effect inside the low-voltage equipment.

[0044] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0046] FIG1 is a schematic diagram of a low-voltage device according to an embodiment of the present invention;

[0047] FIG2 is a second structural diagram of a low-voltage device provided in an embodiment of the present application;

[0048] FIG3 is a schematic diagram of the connection between the low-voltage device and the boost device provided in an embodiment of the present application;

[0049] FIG4 is a third structural diagram of a low-voltage device provided in an embodiment of the present application;

[0050] FIG5 is a left side view of a low voltage device provided in an embodiment of the present application;

[0051] FIG6 is a right side view of a low-voltage device according to an embodiment of the present application;

[0052] FIG7 is a second right side view of the low-voltage device provided in an embodiment of the present application;

[0053] FIG8 is a third right side view of the low voltage device provided in an embodiment of the present application;

[0054] FIG9 is a schematic diagram of a structure of a substation according to an embodiment of the present application;

[0055] FIG10 is a second structural diagram of a substation provided in an embodiment of the present application.

[0056] Figure numerals: low-voltage equipment 100, casing 110, cabinet 111, cabinet door 112, first accommodating chamber 120, first heat dissipation device 121, second accommodating chamber 130, second heat dissipation device 131, third accommodating chamber 140, first circuit breaker 141, second circuit breaker 142, third heat dissipation device 143, partition 150, first sub-partition 151, second sub-partition 152, third sub-partition 153, wire threading opening 160, first wire threading opening 161, second wire threading opening 162, third wire threading opening 163; boosting equipment 200, integrated platform 300, string inverter unit 400, low-voltage cable 500. DETAILED DESCRIPTION

[0057] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0058] The following describes a low-voltage device 100, a substation, and a new energy power station according to an embodiment of the present application with reference to FIG1 to FIG10.

[0059] An embodiment of the present application provides a low-voltage device 100, as shown in Figures 1 to 10, including a housing 110, a communication electronic device, a power distribution electronic device, and a low-voltage bus electronic device electrically connected to each other.

[0060] The housing 110 may be a trapezoidal structure, a truncated cone structure, or other shaped structures. For example, as shown in FIG. 1 to FIG. 10 , the housing 110 may be a rectangular structure.

[0061] As shown in Figures 1 to 10, the interior of the casing 110 is a hollow structure, and the interior of the casing 110 defines a first accommodating chamber 120, a second accommodating chamber 130 and a third accommodating chamber 140. The first accommodating chamber 120, the second accommodating chamber 130 and the third accommodating chamber 140 can all be circular structures, trapezoidal structures or other shape structures. For example, the first accommodating chamber 120, the second accommodating chamber 130 and the third accommodating chamber 140 are all rectangular structures.

[0062] Communication electronic devices, power distribution electronic devices and low-voltage convergence electronic devices are respectively installed in the first accommodating cavity 120, the second accommodating cavity 130 and the third accommodating cavity 140. In the embodiment of the present application, the communication electronic devices are installed in the first accommodating cavity 120, the power distribution electronic devices are installed in the second accommodating cavity 130, and the low-voltage convergence electronic devices are installed in the third accommodating cavity 140.

[0063] Communication electronic components may include uninterruptible power supplies and other electronic components, power distribution electronic components may include transformers and other electronic components, and low-voltage busbar electronic components may include circuit breakers, busbars and other electronic components.

[0064] During the actual implementation process, the casing 110 of the low-voltage equipment 100 defines an independent first accommodating cavity 120, a second accommodating cavity 130 and a third accommodating cavity 140, and the communication electronic device is installed in the first accommodating cavity 120, the power distribution electronic device is installed in the second accommodating cavity 130, and the low-voltage convergence electronic device is installed in the third accommodating cavity 140. The communication electronic device, the power distribution electronic device and the low-voltage convergence electronic device are electrically connected to each other and are electrically connected to corresponding external devices to realize the functions of communication, power distribution and convergence.

[0065] By defining a first accommodating cavity 120, a second accommodating cavity 130 and a third accommodating cavity 140 in the casing 110, and installing communication electronic devices, power distribution electronic devices and low-voltage convergence electronic devices in the first accommodating cavity 120, the second accommodating cavity 130 and the third accommodating cavity 140 respectively, the communication equipment and the power distribution equipment can be integrated into the low-voltage equipment 100, that is, the low-voltage equipment 100 can simultaneously realize the functions of communication, power distribution and convergence, so as to shorten the wiring distance, facilitate unified management and maintenance, reduce operation and maintenance costs, and at the same time reduce the number of electrical wall penetrations generated by the internal and external electrical connections of the low-voltage equipment 100, thereby improving the safety and stability of the low-voltage equipment 100 and the overall system.

[0066] According to the low-voltage equipment 100 provided in the embodiment of the present application, by respectively installing communication electronic components, power distribution electronic components and low-voltage convergence electronic components in the first accommodating cavity 120, the second accommodating cavity 130 and the third accommodating cavity 140 of the casing 110, the low-voltage equipment 100 can simultaneously realize the functions of communication, power distribution and convergence, shorten the wiring distance, facilitate unified management and maintenance, reduce operation and maintenance costs, and at the same time improve the safety and stability of the low-voltage equipment 100 and the overall system.

[0067] In some embodiments, as shown in FIG. 1 , the first accommodating cavity 120 and the second accommodating cavity 130 are both horizontally distributed with the third accommodating cavity 140 , and at least a portion of the first accommodating cavity 120 and the second accommodating cavity 130 are vertically distributed.

[0068] As shown in Figure 1, the first accommodating cavity 120 and the third accommodating cavity 140 can be distributed along the length direction of the casing 110, and the first accommodating cavity 120 and the third accommodating cavity 140 can also be distributed along the width direction or other horizontal directions of the casing 110. The second accommodating cavity 130 and the third accommodating cavity 140 can also be distributed along the length direction of the casing 110, and the second accommodating cavity 130 and the third accommodating cavity 140 can also be distributed along the width direction or other horizontal directions of the casing 110. For example, the first accommodating cavity 120 and the third accommodating cavity 140 are distributed along the length direction of the casing 110, and the second accommodating cavity 130 and the third accommodating cavity 140 are also distributed along the length direction of the casing 110, and the first accommodating cavity 120 and the second accommodating cavity 130 are located on the same side of the third accommodating cavity 140 in the length direction of the casing 110.

[0069] As shown in FIG. 1 , at least a portion of the first accommodating cavity 120 and the second accommodating cavity 130 are distributed along the height direction of the housing 110 .

[0070] By distributing the first accommodating chamber 120 and the second accommodating chamber 130 horizontally with the third accommodating chamber 140, the overall height of the casing 110 can be reduced, making it easier for staff to install or remove electronic devices inside the casing 110. By distributing at least part of the first accommodating chamber 120 and the second accommodating chamber 130 vertically, the horizontal size of the casing 110 can be reduced while providing sufficient space in the first accommodating chamber 120 and the second accommodating chamber 130 for installing communication electronic devices and power distribution electronic devices, respectively, thereby reducing the footprint of the low-voltage equipment 100.

[0071] In some embodiments, as shown in FIG5 , the first accommodating cavity 120 includes a main cavity and a wiring cavity that are connected to each other. The second accommodating cavity 130 is located below the main cavity and is distributed horizontally with the wiring cavity.

[0072] Among them, the second accommodating cavity 130 is located below the main cavity of the first accommodating cavity 120, and the second accommodating cavity 130 can be distributed along the length direction of the casing 110 with the wiring cavity of the first accommodating cavity 120, or can be distributed along the width direction of the casing 110 or other directions with the wiring cavity. For example, as shown in Figure 5, the second accommodating cavity 130 and the wiring cavity are distributed along the width direction of the casing 110, and the second accommodating cavity 130 is located behind the wiring cavity.

[0073] During actual implementation, the communication electronic device is installed in the main cavity of the second accommodating cavity 130. When the power distribution electronic device is electrically connected to the outside through a cable, the cable can pass through the wiring cavity from the lower half of the casing 110, and then enter the main cavity from the wiring cavity to be electrically connected to the communication electronic device.

[0074] Since the power distribution electronic components include heavy electronic components such as transformers, the second accommodating chamber 130 is set to be located below the main cavity of the first accommodating chamber 120, which can reduce the probability of the communication electronic components being squeezed and damaged due to the excessive weight of the power distribution electronic components. At the same time, the wiring cavity and the second accommodating chamber 130 are set to be distributed in the horizontal direction, so that the communication electronic components can be wired at a lower position when connected to the external electrical system, which is convenient for the staff to install the cables.

[0075] In some embodiments, as shown in Figures 1 and 3, the low-voltage equipment 100 also includes a partition 150, which is installed in the casing 110. The internal space of the casing 110 is defined by the partition 150 as a first accommodating chamber 120, a second accommodating chamber 130 and a third accommodating chamber 140.

[0076] The partition 150 may be made of materials including but not limited to sheet metal, epoxy resin, or glass fiber. For example, the partition 150 is made of sheet metal, which can improve the strength and rigidity of the partition 150.

[0077] During the actual implementation process, the partition 150 divides the internal space of the casing 110 into a first accommodating chamber 120, a second accommodating chamber 130 and a third accommodating chamber 140, and the communication electronic components, power distribution electronic components and low-voltage convergence electronic components are respectively installed on the inner walls or partitions 150 of the first accommodating chamber 120, the second accommodating chamber 130 and the third accommodating chamber 140.

[0078] By setting the above-mentioned partition 150, the first accommodating cavity 120, the second accommodating cavity 130 and the third accommodating cavity 140 can be conveniently defined inside the casing 110, while providing certain installation positions for communication electronic components, power distribution electronic components and low-voltage convergence electronic components, thereby improving the installation stability of communication electronic components, power distribution electronic components and low-voltage convergence electronic components.

[0079] In some embodiments, the low-voltage device 100 further includes a heat insulating member installed on the partition 150 .

[0080] The thermal insulation element may be made of materials including but not limited to glass fiber, asbestos, rock wool or silicate. For example, the thermal insulation element is thermal insulation wool.

[0081] A heat insulating member may be provided on each surface of the partition 150 , or may be provided on one of every two opposing surfaces of the partition 150 .

[0082] By setting the above-mentioned thermal insulation component, the probability of condensation in the first accommodating cavity 120, the second accommodating cavity 130 and the third accommodating cavity 140 can be reduced, thereby reducing the probability of condensation affecting communication electronic devices, power distribution electronic devices and low-voltage convergence electronic devices.

[0083] In some embodiments, as shown in FIG. 1 , the partition 150 includes a first sub-partition plate 151 , a second sub-partition plate 152 , and a third sub-partition plate 153 .

[0084] As shown in Figure 1, the first sub-partition 151, the second sub-partition 152 and the third sub-partition 153 are all installed in the casing 110. The first sub-partition 151 extends from one end of the casing 110 vertically to the other end, and the first sub-partition 151 divides the internal space of the casing 110 horizontally. The third accommodating chamber 140 is located on one side of the first sub-partition 151 in the horizontal direction.

[0085] As shown in Figure 1, the two ends of the first sub-partition 151 in the vertical direction are respectively connected to the two end inner walls of the casing 110 in the vertical direction, and the first sub-partition 151 is parallel to the width direction of the casing 110, that is, the two sides of the first sub-partition 151 in the width direction of the casing 110 are respectively connected to the two side inner walls of the casing 110 in the width direction. At this time, the internal space of the casing 110 is divided into two parts along the length direction of the casing 110, one of which is the third accommodating chamber 140.

[0086] As shown in Figure 1, the second sub-partition 152 and the third sub-partition 153 are bent, and the angle between the second sub-partition 152 and the third sub-partition 153 can be 90°, 80° or other angles. For example, the angle between the second sub-partition 152 and the third sub-partition 153 is 90°, and the third sub-partition 153 is connected to the second sub-partition 152 on one side along the width direction of the casing 110.

[0087] As shown in Figure 1, the second sub-partition 152 and the third sub-partition 153 are both installed on the other side of the first sub-partition 151 in the horizontal direction. The side of the second sub-partition 152 facing away from the third sub-partition 153 in the horizontal direction is connected to one side of the casing 110, and the other side is spaced apart from the side opposite to the casing 110.

[0088] As shown in Figure 1, the second sub-partition 152 is arranged parallel to the horizontal direction, and both sides of the second sub-partition 152 along the length direction of the casing 110 are connected to the inner walls of the casing 110 along the length direction. The side of the second sub-partition 152 along the width direction of the casing 110 away from the third sub-partition 153 is connected to the inner wall of the casing 110.

[0089] As shown in Figure 1, the third sub-partition 153 is connected to the inner wall of the casing 110 on both sides along the length direction of the casing 110, the third sub-partition 153 is connected to the inner wall of the casing 110 along the side vertically away from the second sub-partition 152, and the third sub-partition 153 is spaced apart from the inner wall of the casing 110 on both sides along the width direction of the casing 110. At this time, the second sub-partition 152 and the third sub-partition 153 separate the space on the side of the first sub-partition 151 away from the first accommodating cavity 120 into the first accommodating cavity 120 and the second accommodating cavity 130.

[0090] It should be noted that the first sub-partition 151 , the second sub-partition 152 and the third sub-partition 153 may be integrally formed, or may be formed separately and then connected by threaded connection, welding, bonding or other methods.

[0091] The first sub-partition 151 is provided with two through holes, and at least one of the second sub-partition 152 and the third sub-partition 153 is provided with a through hole. The through hole can be provided on the second sub-partition 152, or on the third sub-partition 153, or on both the second sub-partition 152 and the third sub-partition 153. The two through holes on the first sub-partition 151 are respectively used to connect the first accommodating cavity 120 with the third accommodating cavity 140, and the second accommodating cavity 130 with the third accommodating cavity 140, and the through holes on the second sub-partition 152 or the third sub-partition 153 are used to connect the first accommodating cavity 120 and the second accommodating cavity 130.

[0092] The communication electronic devices located in the first accommodating cavity 120 are electrically connected to the power distribution electronic devices located in the second accommodating cavity 130 through waterproof terminal blocks passing through the through holes on the second sub-partition 152 or the third sub-partition 153. The communication electronic devices are electrically connected to the low-voltage convergence electronic devices through waterproof terminal blocks passing through the through holes on the first sub-partition 151 connecting the first accommodating cavity 120 and the third accommodating cavity 140. The power distribution electronic devices are electrically connected to the low-voltage convergence electronic devices through waterproof terminal blocks passing through the through holes on the first sub-partition 151 connecting the second accommodating cavity 130 and the third accommodating cavity 140.

[0093] By setting the above-mentioned first sub-partition 151, second sub-partition 152 and third sub-partition 153, the independence of the first accommodating cavity 120, the second accommodating cavity 130 and the third accommodating cavity 140 can be improved, and the probability of mutual influence between the electronic components in the three accommodating cavities can be reduced. By electrically connecting the electronic components in two accommodating cavities through waterproof terminal blocks, the waterproof performance of each accommodating cavity can be improved.

[0094] In some embodiments, as shown in FIG2 , the housing 110 is provided with a threading opening 160 for passing cables along one side thereof vertically close to the ground. The cables passing through the threading opening 160 are electrically connected to the communication electronic components, the power distribution electronic components and the low-voltage bus electronic components respectively.

[0095] As shown in FIG. 2 , the threading opening 160 may be a circular structure, a trapezoidal structure, or other shaped structures. For example, the threading opening 160 may be a rectangular structure.

[0096] In actual implementation, the wire threading opening 160 is located at the bottom of the housing 110 , and external cables pass through the wire threading opening 160 into the interior of the housing 110 and are electrically connected to corresponding electronic components.

[0097] By arranging the wire threading opening 160 at the bottom of the housing 110 , the overall integrity of the low-voltage device 100 can be improved, while reducing the probability of rainwater, garbage or other impurities entering the housing 110 through the wire threading opening 160 and affecting electronic devices.

[0098] In some embodiments, as shown in Figure 2, the wire threading opening 160 includes a first wire threading opening 160, a second wire threading opening 160 and a third wire threading opening 160. The cable passing through the first wire threading opening 160 is used to be electrically connected to the communication electronic device, the cable passing through the second wire threading opening 160 is used to be electrically connected to the power distribution electronic device, and the low-voltage cable 500 passing through the third wire threading opening 160 is used to be electrically connected to the low-voltage bus electronic device, and the first wire threading opening 160, the second wire threading opening 160 and the third wire threading opening 160 are spaced apart and distributed.

[0099] 2 , the first threading opening 161 , the second threading opening 162 and the third threading opening 163 are spaced apart from each other and are all located at the bottom of the housing 110 .

[0100] The first wire threading opening 161 can be connected to the wiring cavity of the first accommodating cavity 120, and can also be connected to the second accommodating cavity 130. When the first wire threading opening 161 is connected to the wiring cavity of the first accommodating cavity 120, the cable passes through the first wire threading opening 161 and enters the first accommodating cavity 120, and can be directly electrically connected to the communication electronic device located in the first accommodating cavity 120; when the first wire threading opening 161 is connected to the second accommodating cavity 130, the cable passes through the first wire threading opening 161 and enters the second accommodating cavity 130, and then passes through the through hole on the second sub-partition 152 or the third sub-partition 153 to enter the first accommodating cavity 120 and electrically connect to the communication electronic device.

[0101] The second wire threading opening 162 can be in communication with the second accommodating cavity 130 . The cable passing through the second wire threading opening 162 enters the second accommodating cavity 130 and is directly electrically connected to the power distribution electronic device located in the second accommodating cavity 130 .

[0102] The third threading opening 163 can be communicated with the third accommodating cavity 140 . The low-voltage cable 500 passing through the third threading opening 163 enters the third accommodating cavity 140 and is directly electrically connected to the low-voltage busbar electronic device located in the third accommodating cavity 140 .

[0103] By arranging the first wire threading opening 161, the second wire threading opening 162 and the third wire threading opening 163 separately, it is convenient for workers to distinguish the cables electrically connected to communication electronic devices, power distribution electronic devices and low-voltage bus electronic devices, isolate different cables, reduce interference between different cables, and improve the stability and safety of the operation of each electronic device.

[0104] In some embodiments, as shown in Figures 3 and 4, the low-voltage convergence electronic device includes a first circuit breaker 141 and a second circuit breaker 142, and the first circuit breaker 141 and the second circuit breaker 142 are both installed in the third accommodating cavity 140, and the input ends of the first circuit breaker 141 and the second circuit breaker 142 are used to be electrically connected to the string inverter unit 400, and the output ends of the first circuit breaker 141 and the second circuit breaker 142 are converged.

[0105] 3 and 4 , the input ends of the first circuit breaker 141 and the second circuit breaker 142 can both be used to be electrically connected to the string inverter unit 400 , and the output ends of the first circuit breaker 141 and the second circuit breaker 142 are converged and output to the corresponding device.

[0106] As shown in Figures 3 and 4, the input end of the first circuit breaker 141 and the input end of the second circuit breaker 142 are both provided with bus copper bars corresponding to A, B, and C. The three phases of the low-voltage cable 500 are electrically connected to the corresponding bus copper bars respectively. The output end of the first circuit breaker 141 and the output end of the second circuit breaker 142 are also provided with bus copper bars corresponding to A, B, and C after merging.

[0107] It can be understood that if only the first circuit breaker 141 or the second circuit breaker 142 is set, the overall current-carrying capacity of the low-voltage convergence electronic device is relatively small, and more copper bars or other electrical structures are required to cooperate with it. Therefore, through the setting of the above-mentioned first circuit breaker 141 and the second circuit breaker 142, the layout simplicity of each electronic device in the third accommodating cavity 140 can be improved, the use of copper materials can be reduced, and the electrical connection cost of the low-voltage convergence electronic device can be reduced.

[0108] In some embodiments, as shown in Figures 3 and 4, the low-voltage equipment 100 also includes a fixing frame, which is installed on both sides of the third accommodating cavity 140 in the horizontal direction, and the first circuit breaker 141 and the second circuit breaker 142 are respectively installed on the fixing frames on both sides, and the first circuit breaker 141 and the second circuit breaker 142 are arranged back to back.

[0109] 3 and 4 , the fixing brackets can be arranged on both sides of the third accommodating cavity 140 along the width direction of the casing 110, and the first circuit breaker 141 and the second circuit breaker 142 can be respectively installed on the two fixing brackets of the third accommodating cavity 140 along the width direction of the casing 110. The first circuit breaker 141 and the second circuit breaker 142 can be located in the middle position of the third accommodating cavity 140 or arranged close to the top. For example, as shown in FIG3 and 4 , the first circuit breaker 141 and the second circuit breaker 142 are located in the middle position of the third accommodating cavity 140, and the busbars at the input ends of the first circuit breaker 141 and the second circuit breaker 142 are located below the first circuit breaker 141 and the second circuit breaker 142, so that the low-voltage cable 500 can be electrically connected to the busbar after passing through the third wire threading opening 163.

[0110] By arranging the first circuit breaker 141 and the second circuit breaker 142 to be respectively installed on two fixing frames in the horizontal direction of the third accommodating chamber 140, the uniformity of the force on the wall of the third accommodating chamber 140 can be improved, thereby improving the overall balance of the low-voltage equipment 100, improving the utilization rate of the third accommodating chamber 140 and the dispersion of the busbar, so as to reduce the probability of difficulty in heat dissipation due to the concentrated layout of the busbar. At the same time, the first circuit breaker 141 and the second circuit breaker 142 are arranged back to back, so that the front faces of the first circuit breaker 141 and the second circuit breaker 142 can face outward for easy observation by staff.

[0111] An embodiment of the present application further provides a low-voltage device 100 , as shown in FIG. 5 to FIG. 8 . The low-voltage device 100 includes a housing 110 , a first heat dissipation device 121 , a second heat dissipation device 131 and a third heat dissipation device 143 .

[0112] As shown in Figures 5 to 8, the interior of the casing 110 defines a plurality of accommodating cavities, which are used to install first-category electronic devices, second-category electronic devices and third-category electronic devices, respectively. The plurality of accommodating cavities are a first accommodating cavity 120, a second accommodating cavity 130 and a third accommodating cavity 140. The first-category electronic devices are communication electronic devices, the second-category electronic devices are power distribution electronic devices, and the third-category electronic devices are low-voltage convergence electronic devices. Communication electronic devices are installed in the first accommodating cavity 120, power distribution electronic devices are installed in the second accommodating cavity 130, and low-voltage convergence electronic devices are installed in the third accommodating cavity 140.

[0113] The housing 110 may have a trapezoidal structure, a truncated cone structure, or other shaped structures. For example, as shown in FIG. 1 to FIG. 10 , the housing 110 may have a rectangular structure.

[0114] The interior of the casing 110 is a hollow structure, and the first accommodating cavity 120, the second accommodating cavity 130 and the third accommodating cavity 140 can all be circular structures, trapezoidal structures or other shape structures. For example, as shown in Figures 5-8, the first accommodating cavity 120, the second accommodating cavity 130 and the third accommodating cavity 140 are all rectangular structures.

[0115] The first heat dissipation device 121, the second heat dissipation device 131 and the third heat dissipation device 143 are respectively installed in the accommodating cavities where the first type of electronic devices, the second type of electronic devices and the third type of electronic devices are located, that is, the first heat dissipation device 121 is installed in the first accommodating cavity 120, the second heat dissipation device 131 is installed in the second accommodating cavity 130, and the third heat dissipation device 143 is installed in the third accommodating cavity 140.

[0116] During the actual implementation process, communication electronic components and a first heat dissipation device 121 are installed in the first accommodating cavity 120, power distribution electronic components and a second heat dissipation device 131 are installed in the second accommodating cavity 130, and low-voltage convergence electronic components and a third heat dissipation device 143 are installed in the third accommodating cavity 140. The communication electronic components, power distribution electronic components and low-voltage convergence electronic components are independently cooled through the first heat dissipation device 121, the second heat dissipation device 131 and the third heat dissipation device 143 respectively.

[0117] According to the low-voltage equipment 100 provided in the embodiment of the present application, the communication electronic components, power distribution electronic components and low-voltage convergence electronic components in the low-voltage equipment 100 are respectively cooled by utilizing the first heat dissipation device 121, the second heat dissipation device 131 and the third heat dissipation device 143. The corresponding heat dissipation scheme can be selected according to the requirements of the heat generation and operating temperature of different electronic components for independent heat dissipation to improve the heat dissipation effect inside the low-voltage equipment 100.

[0118] In some embodiments, as shown in FIG5 , the first type of electronic device includes an uninterruptible power supply, the first heat dissipation device 121 includes an air conditioner, and the air inlet and outlet of the air conditioner are both connected to the accommodating cavity where the first type of electronic device is located.

[0119] Among them, the first category of electronic devices is communication electronic devices, which include uninterruptible power supplies and other electronic devices that are sensitive to operating temperature.

[0120] As shown in Figure 5, the air conditioner is installed in the first accommodating cavity 120, and the external circulation of the air conditioner is connected to the external environment. The external circulation takes in air from the bottom of the air conditioner and discharges air from the top. The air inlet and outlet of the air conditioner are both connected to the first accommodating cavity 120. The air in the first accommodating cavity 120 flows into the air conditioner from the top and flows out from the bottom of the air conditioner, forming the internal circulation of the air conditioner.

[0121] During the actual implementation process, the air in the first accommodating chamber 120 enters the air conditioner and undergoes heat exchange and cooling in the air conditioner. The cooled cold air flows out of the air conditioner into the first accommodating chamber 120, and the air outlet of the air conditioner is set toward the communication electronic device, that is, the air conditioner blows cold air toward the communication electronic device, and the cold air absorbs the heat generated by the communication electronic device, thereby reducing the temperature of the communication electronic device.

[0122] At the same time, the air conditioner can control the flow of cold air according to the temperature of the communication electronic device. For example, if the temperature of the communication electronic device is high, the air conditioner increases the flow of cold air; if the temperature of the communication electronic device is low, the air conditioner reduces the flow of cold air or turns off the air conditioner.

[0123] By setting the above air conditioner, the temperature of electronic components that are sensitive to operating temperature, such as uninterruptible power supplies, can be adaptively adjusted, thereby improving the heat dissipation efficiency of communication electronic components and reducing the probability that the working efficiency of communication electronic components will be affected by temperature discomfort.

[0124] In some embodiments, as shown in Figure 5, the second type of electronic device includes a transformer, and the wall of the accommodating cavity where the second type of electronic device is located is provided with a first air inlet and a first air outlet, and the second heat dissipation device 131 includes a first fan, and the first fan is used to drive air to flow from the first air inlet into the accommodating cavity where the second type of electronic device is located, and to flow out of the accommodating cavity where the second type of electronic device is located from the first air outlet.

[0125] Among them, the second category of electronic devices is power distribution electronic devices, which include transformers and other electronic devices that generate a lot of heat.

[0126] As shown in Figure 5, the wall of the second accommodating cavity 130 is provided with a first air inlet and a first air outlet. The first fan can be installed at the first air inlet or the first air outlet. The first fan can blow air or inhale air into the second accommodating cavity 130. For example, the first fan is installed at the first air inlet, and the first fan blows air into the second accommodating cavity 130.

[0127] During the actual implementation process, since the distribution electronic components in the second accommodating chamber 130 generate a lot of heat when working, the air temperature in the second accommodating chamber 130 is higher than the external ambient temperature. The first fan drives the low-temperature air of the external environment to flow into the second accommodating chamber 130 from the first air inlet. The low-temperature air flowing into the second accommodating chamber 130 absorbs the heat generated by the distribution electronic components and drives the high-temperature air after absorbing the heat to flow out of the second accommodating chamber 130 from the first air outlet. At this time, the temperature of the distribution electronic components is reduced.

[0128] Since the second accommodating cavity 130 is equipped with power distribution electronic devices that generate a lot of heat, such as transformers, and the protection level requirements of the power distribution electronic devices are lower than those of communication electronic devices, the power distribution electronic devices are cooled by the first fan, which can improve the heat dissipation effect while reducing the heat dissipation cost.

[0129] In some embodiments, the first air inlet is located at the back of the accommodating cavity where the second type of electronic device is located, and the first air outlet is located at the bottom of the accommodating cavity where the second type of electronic device is located.

[0130] The first air inlet is located on a wall surface of the wiring cavity of the second accommodating cavity 130 away from the first accommodating cavity 120 , and the first air outlet is located on a wall surface at the bottom of the second accommodating cavity 130 .

[0131] During the actual implementation process, the first fan drives the low-temperature air of the external environment to flow into the second accommodating chamber 130 from the first air inlet. The low-temperature air flowing into the second accommodating chamber 130 absorbs the heat generated by the power distribution electronic components and drives the high-temperature air after absorbing the heat to flow out of the second accommodating chamber 130 from the first air outlet. At this time, an air duct is formed in the second accommodating chamber 130 from the back of the second accommodating chamber 130 to the bottom.

[0132] Since the power distribution electronic components are usually installed on the bottom surface of the second accommodating cavity 130, the first air inlet is set to be located on the back surface of the second accommodating cavity 130, and the first air outlet is set to be located on the bottom surface of the second accommodating cavity 130. A wind duct facing the power distribution electronic components can be formed in the second accommodating cavity 130. When the first fan drives the low-temperature air to flow into the second accommodating cavity 130 and flows out from the first air outlet, the contact area between the low-temperature air and the power distribution electronic components can be increased, thereby improving the heat dissipation effect and heat dissipation efficiency. In addition, when people pass by the low-voltage equipment 100, they cannot see the first air inlet and the first air outlet in their first field of vision, which can improve the overall neatness of the low-voltage equipment 100.

[0133] In some embodiments, the low-voltage device 100 further includes a shutter installed at the first air inlet.

[0134] The shutters are installed at the first air inlet, and the shutters can be made of materials including but not limited to aluminum alloy, zinc steel, bamboo, wood, etc.

[0135] By setting the above-mentioned shutters, the probability of rain and snow drifting into the low-voltage equipment 100 from the first air inlet in rainy and snowy weather and affecting the distribution electronic components can be reduced, thereby improving the working safety of the distribution electronic components.

[0136] In some embodiments, the low-voltage device 100 further includes a first filter element, which is installed at the first air inlet.

[0137] The first filter element is installed on the side of the shutter facing the second accommodating cavity 130 , and the first filter element can be made of materials including but not limited to synthetic fiber, glass fiber, non-woven fabric, etc.

[0138] By setting the above-mentioned first filter element, some impurities in the external environment can be prevented from entering the second accommodating chamber 130 from the first air inlet, thereby reducing the probability of low working efficiency of the distribution electronic components due to excessive impurities in the second accommodating chamber 130 and improving the working stability of the distribution electronic components.

[0139] In some embodiments, the low-voltage device 100 further includes a wire mesh installed at the first air outlet.

[0140] The wire mesh may be made of materials including but not limited to stainless steel, copper, low carbon steel, etc., and the wire mesh may be installed on the first air outlet by welding, bonding or other methods.

[0141] By setting the above-mentioned wire mesh, the probability of some wild animals entering the second accommodating chamber 130 from the first air outlet can be reduced. For example, the probability of animals such as mice and snakes entering the second accommodating chamber 130 can be reduced, further improving the working stability and safety of the power distribution electronic devices.

[0142] In some embodiments, a second filter element is installed at the first air outlet.

[0143] The second filter element is installed on the side of the wire mesh facing the second accommodating cavity 130 , and the second filter element can be made of materials including but not limited to synthetic fiber, glass fiber, non-woven fabric, etc.

[0144] By setting the above-mentioned second filter element, some impurities in the external environment can be prevented from entering the second accommodating chamber 130 from the first air outlet, thereby reducing the probability of low working efficiency of the distribution electronic components due to excessive impurities in the second accommodating chamber 130 and improving the working stability of the distribution electronic components.

[0145] In some embodiments, as shown in Figure 6, the third type of electronic device includes a circuit breaker, and the wall of the accommodating cavity where the third type of electronic device is located is provided with a second air inlet and a second air outlet, and the third heat dissipation device 143 includes a second fan, and the second fan is used to drive air from the second air inlet into the accommodating cavity where the third type of electronic device is located, and to flow out of the accommodating cavity where the third type of electronic device is located from the second air outlet.

[0146] The third type of electronic components are installed in the third accommodating cavity 140 . The third type of electronic components are low-voltage busbar electronic components. The low-voltage busbar electronic components may include heating components such as circuit breakers and busbars.

[0147] When the overall heat consumption of the low-voltage convergent electronic device is high and the corrosion resistance level requirement is not higher than C4, the wall of the third accommodating cavity 140 is provided with a second air inlet and a second air outlet. The second air inlet can be provided on the back of the third accommodating cavity 140, and the second air outlet can be provided on the bottom of the third accommodating cavity 140.

[0148] As shown in FIG6 , the third heat dissipation device 143 includes a second fan, which is used to drive air to flow into the third accommodating chamber 140 from the second air inlet and to flow out of the third accommodating chamber 140 from the second air outlet.

[0149] As shown in Figure 6, since the second fan needs to suck the air located at the back of the casing 110 into the third accommodating chamber 140, and the air at the back of the casing 110 located at the first accommodating chamber 120 is connected to the external circulation of the air conditioner, the height of the second air inlet and the fan relative to the bottom surface of the casing 110 can be set to be higher or lower than the height of the air conditioner relative to the bottom surface of the casing 110, so as to reduce the probability of the second fan sucking the high-temperature air discharged from the air conditioner into the third accommodating chamber 140, thereby improving the heat dissipation effect of the second fan on the low-voltage convergence electronic components.

[0150] Shutters and filters can also be provided at the second air inlet, and wire mesh and filters can also be provided at the second air outlet.

[0151] Since the overall heat consumption of the low-voltage convergence electronic devices is high and the anti-corrosion level requirement is not higher than C4, a small amount of impurities has little impact on the low-voltage convergence electronic devices. Therefore, by setting a second fan to dissipate heat for the low-voltage convergence electronic devices in the third accommodating cavity 140, the heat dissipation effect can be improved while reducing the heat dissipation cost.

[0152] In some embodiments, as shown in Figure 7, the third type of electronic device includes a circuit breaker, and the third heat dissipation device 143 includes a heat exchanger. The heat exchanger has a first heat exchange path and a second heat exchange path. The first heat exchange path is connected to the accommodating cavity where the third type of electronic device is located, and the second heat exchange path is connected to the external environment. The air in the first heat exchange path is used to exchange heat with the air in the second heat exchange path.

[0153] As shown in FIG7 , when the overall heat consumption of the low-voltage converging electronic components is high and the corrosion resistance level is not lower than C5, the third heat dissipation device 143 includes a heat exchanger.

[0154] As shown in Figure 7, the first heat exchange path of the heat exchanger is connected to the third accommodating chamber 140, and the air in the third accommodating chamber 140 can enter from the lower port of the first heat exchange path and flow out from the upper port of the first heat exchange path; the second heat exchange path of the heat exchanger is connected to the external environment, and the air in the external environment can flow in from the lower port of the second heat exchange path and flow out from the lower port of the second heat exchange path.

[0155] During the actual implementation process, the heat generated by the low-voltage convergence electronic device during operation is transferred to the surrounding air, causing the air temperature around the low-voltage convergence electronic device to rise, and the high-temperature air gradually rises and flows through the first heat exchange path of the heat exchanger. The low-temperature air of the external environment simultaneously flows through the second heat exchange path of the heat exchanger. The high-temperature air in the first heat exchange path and the low-temperature air in the second heat exchange path exchange heat in the heat exchanger. After the heat exchange, the air temperature in the first heat exchange path decreases and flows out from the upper port of the first heat exchange path. The air with lowered temperature will gradually drop until it is located at the low-voltage convergence electronic device and absorbs the heat generated by the low-voltage convergence electronic device. During the entire heat dissipation process, the internal environment of the third accommodating cavity 140 is always isolated from the external environment, that is, the low-voltage convergence electronic device is always in a closed space.

[0156] Since the overall heat consumption of the low-voltage convergence electronic device is high and the corrosion resistance level is not lower than C5, the low-voltage convergence electronic device has high requirements for the sealing degree of the third accommodating cavity 140. Therefore, the low-voltage convergence electronic device is cooled by a heat exchanger. While improving the heat dissipation effect of the low-voltage convergence electronic device, it can improve the sealing of the third accommodating cavity 140 and reduce the probability of low-voltage convergence electronic device being corroded by external impurities, resulting in low working efficiency.

[0157] In some embodiments, as shown in FIG8 , the third type of electronic device includes a circuit breaker, and the third heat dissipation device 143 includes a third fan, which is installed in the accommodating cavity where the third type of electronic device is located, and is used to disturb the air in the accommodating cavity where the third type of electronic device is located.

[0158] As shown in FIG8 , when the overall heat consumption of the low-voltage converged electronic components is low, the third heat dissipation device 143 may include a third fan installed in the third accommodating cavity 140 .

[0159] As shown in FIG. 8 , the third fan may be installed in the middle of the third accommodating chamber 140 , or may be installed in the upper portion of the third accommodating chamber 140 or at other locations.

[0160] The third fan can be arranged toward the low-voltage converging electronic device. For example, as shown in FIG8 , the low-voltage converging electronic device is located below the third fan. Then, the third fan can be arranged downward to form an air duct flowing vertically.

[0161] During the actual implementation process, the third fan can dissipate heat for the low-voltage convergence electronic components by blowing or sucking air. When the third fan blows or sucks air, the high-temperature air near the low-voltage convergence electronic components flows under the action of the third fan, thereby improving the heat dissipation efficiency of the air by increasing the flow speed of the air.

[0162] Since the overall heat consumption of the low-voltage convergence electronic device is low, the heat dissipation demand of the low-voltage convergence electronic device is relatively low. Therefore, by using the third fan to disturb the flow in the third accommodating chamber 140 to dissipate heat for the low-voltage convergence electronic device, the heat dissipation efficiency of the low-voltage convergence electronic device can be improved while reducing the heat dissipation cost. The third accommodating chamber 140 has basically no contact with the external environment, which can reduce the probability of the low-voltage convergence electronic device being corroded by external impurities, resulting in low working efficiency.

[0163] In some embodiments, as shown in FIG. 5 to FIG. 8 , the first heat dissipation device 121 is installed on the back side of the housing 110 .

[0164] The first heat dissipation device 121 includes an air conditioner, which is installed on the inner wall surface of the back of the casing 110 in the first accommodating cavity 120 , that is, the external circulation of the air conditioner is located at the back of the casing 110 .

[0165] By installing the first heat dissipation device 121 on the back of the casing 110, the external circulation of the first heat dissipation device 121 cannot be seen in the first field of vision when people pass by the low-voltage equipment 100, which can improve the overall cleanliness of the casing 110 and reduce the probability of high-temperature air discharged from the external circulation of the air conditioner causing harm to nearby people.

[0166] In some embodiments, as shown in FIG. 5 to FIG. 8 , the second heat dissipation device 131 is installed on the back side of the housing 110 .

[0167] The second heat dissipation device 131 includes a first fan, which is installed on the inner wall surface of the back of the casing 110 in the second accommodating cavity 130 , that is, the first fan and the first air inlet are both located on the back of the casing 110 .

[0168] By installing the second heat dissipation device 131 on the back of the housing 110 , people passing by the low-voltage equipment 100 cannot see the first air inlet and the first air outlet in their first field of vision, thereby improving the overall neatness of the housing 110 .

[0169] In some embodiments, as shown in FIG. 5 to FIG. 8 , the third heat dissipation device 143 is installed on the back side of the housing 110 .

[0170] Among them, when the third heat dissipation device 143 includes a second fan or a heat exchanger, the third heat dissipation device 143 is installed on the inner wall surface of the back of the casing 110 in the third accommodating cavity 140, that is, the second heat exchange path of the second fan and the second air inlet or the heat exchanger is located on the back of the casing 110.

[0171] By installing the third heat dissipation device 143 on the back of the casing 110, people cannot see the second air inlet and the second air outlet in their first field of vision when passing by the low-voltage equipment 100, which can improve the overall cleanliness of the casing 110 and reduce the probability of high-temperature air discharged from the second heat exchange path of the heat exchanger causing harm to nearby people.

[0172] In some embodiments, as shown in Figures 1-8, the accommodating cavities corresponding to the first type of electronic devices and the second type of electronic devices are distributed horizontally with the accommodating cavities corresponding to the third type of electronic devices, and at least part of the accommodating cavities corresponding to the first type of electronic devices are distributed vertically with the accommodating cavities corresponding to the second type of electronic devices.

[0173] The first accommodating cavity 120 and the second accommodating cavity 130 are both distributed in the horizontal direction with the third accommodating cavity 140 , and at least a portion of the first accommodating cavity 120 is distributed in the vertical direction with the second accommodating cavity 130 .

[0174] The first accommodating cavity 120 and the third accommodating cavity 140 can be distributed along the length direction of the casing 110, and the first accommodating cavity 120 and the third accommodating cavity 140 can also be distributed along the width direction or other horizontal directions of the casing 110. The second accommodating cavity 130 and the third accommodating cavity 140 can also be distributed along the length direction of the casing 110, and the second accommodating cavity 130 and the third accommodating cavity 140 can also be distributed along the width direction or other horizontal directions of the casing 110. For example, the first accommodating cavity 120 and the third accommodating cavity 140 are distributed along the length direction of the casing 110, and the second accommodating cavity 130 and the third accommodating cavity 140 are also distributed along the length direction of the casing 110, and the first accommodating cavity 120 and the second accommodating cavity 130 are located on the same side of the third accommodating cavity 140 in the length direction of the casing 110.

[0175] At least a portion of the first accommodating cavity 120 and the second accommodating cavity 130 are distributed along the height direction of the housing 110 .

[0176] By distributing the first accommodating chamber 120 and the second accommodating chamber 130 horizontally with the third accommodating chamber 140, the overall height of the casing 110 can be reduced, making it easier for staff to install or remove electronic devices inside the casing 110. By distributing at least part of the first accommodating chamber 120 and the second accommodating chamber 130 vertically, the horizontal size of the casing 110 can be reduced while providing sufficient space in the first accommodating chamber 120 and the second accommodating chamber 130 for installing communication electronic devices and power distribution electronic devices, respectively, thereby reducing the footprint of the low-voltage equipment 100.

[0177] An embodiment of the present application further provides a substation, as shown in FIG9 and FIG10 , which includes an integrated platform 300 , a low-voltage device 100 as in any of the above embodiments, a boost device 200 , and a string inverter unit 400 .

[0178] As shown in FIG9 and FIG10 , the integrated platform 300 may be a circular structure, a trapezoidal structure, or other shaped structures. For example, the integrated platform 300 may be a rectangular structure.

[0179] As shown in FIG9 and FIG10 , the low-voltage device 100 and the boost device 200 are both installed on the integrated platform 300 , and the low-voltage device 100 is electrically connected to the boost device 200 .

[0180] The boosting device 200 may be a transformer, a ring main unit, or other electrical equipment capable of increasing voltage. For example, in an embodiment of the present application, the boosting device 200 is a transformer.

[0181] The string inverter unit 400 includes multiple inverters, which are electrically connected to each other and the string inverter unit 400 is electrically connected to the low-voltage device 100. The current flows into the low-voltage device 100 after passing through the string inverter unit 400 composed of multiple inverters.

[0182] The string inverter unit 400 is located outside the integrated platform 300 , that is, the string inverter unit 400 is not installed on the integrated platform 300 and is separated from the low-voltage device 100 and the boost device 200 .

[0183] During the actual implementation process, the string inverter unit 400 located outside the integrated platform 300 is electrically connected to the low-voltage device 100 through a low-voltage cable 500. The low-voltage device 100 and the boost device 200 are both installed on the integrated platform 300, and the low-voltage device 100 is electrically connected to the boost device 200. The low-voltage current passes through the string inverter unit 400 and is converged into the low-voltage device 100, and is output from the low-voltage device 100 to the boost device 200 for boosting.

[0184] Since the string inverter unit 400 is composed of multiple inverters, each inverter includes a shell and corresponding electronic components. If the string inverter unit 400 is installed on the integrated platform 300, it will need to occupy a larger space on the integrated platform 300. The cross-sectional area of ​​the integrated platform 300 is usually determined according to the on-site space. On the integrated platform 300 of the same size, the string inverter unit 400 occupies a larger space, and the space of the low-voltage equipment 100 and the boost equipment 200 needs to be compressed. Therefore, the string inverter unit 400 is set to be located outside the integrated platform 300, which can increase the space of the low-voltage equipment 100 and the boost equipment 200 on the integrated platform 300, thereby facilitating the staff to upgrade and increase the capacity of the low-voltage equipment 100 and the boost equipment 200.

[0185] According to the substation provided in the embodiment of the present application, by setting the string inverter unit 400 to be located outside the integrated platform 300, the space for the low-voltage equipment 100 and the boost equipment 200 on the integrated platform 300 can be increased, thereby facilitating the staff to upgrade and increase the capacity of the low-voltage equipment 100 and the boost equipment 200.

[0186] In some embodiments, as shown in FIG. 9 and FIG. 10 , the low-voltage device 100 and the boost device 200 are arranged side by side along the length direction of the integrated platform 300 .

[0187] As shown in FIG9 and FIG10 , the low-voltage device 100 and the boost device 200 are spaced apart and distributed along the length direction of the integrated platform 300 , and the radiator of the boost device 200 may be located between the low-voltage device 100 and the boost device 200 .

[0188] By arranging the low-voltage equipment 100 and the boosting equipment 200 to be distributed along the length direction of the integrated platform 300 , the internal space of the low-voltage equipment 100 and the boosting equipment 200 can be further increased.

[0189] In some embodiments, as shown in Figure 10, the interior of the low-voltage equipment 100 defines multiple accommodating cavities, which are used to install first-class electronic devices, second-class electronic devices, and third-class electronic devices, respectively. The accommodating cavities corresponding to the first-class electronic devices and the second-class electronic devices are distributed horizontally with the accommodating cavities corresponding to the third-class electronic devices, and at least part of the accommodating cavities corresponding to the first-class electronic devices are distributed vertically with the accommodating cavities corresponding to the second-class electronic devices.

[0190] Among them, the interior of the casing 110 defines multiple accommodating cavities, which are respectively used to install first-category electronic devices, second-category electronic devices and third-category electronic devices. The multiple accommodating cavities are respectively a first accommodating cavity 120, a second accommodating cavity 130 and a third accommodating cavity 140. The first-category electronic devices are communication electronic devices, the second-category electronic devices are power distribution electronic devices, and the third-category electronic devices are low-voltage convergence electronic devices. Communication electronic devices are installed in the first accommodating cavity 120, power distribution electronic devices are installed in the second accommodating cavity 130, and low-voltage convergence electronic devices are installed in the third accommodating cavity 140.

[0191] The housing 110 may have a trapezoidal structure, a truncated cone structure, or other shaped structures. For example, as shown in FIG. 1 to FIG. 10 , the housing 110 may have a rectangular structure.

[0192] The interior of the casing 110 is a hollow structure, and the first accommodating cavity 120, the second accommodating cavity 130 and the third accommodating cavity 140 can all be circular structures, trapezoidal structures or other shapes. For example, as shown in Figures 1-10, the first accommodating cavity 120, the second accommodating cavity 130 and the third accommodating cavity 140 are all rectangular structures.

[0193] As shown in Figures 1, 3 and 10, the first accommodating cavity 120 and the third accommodating cavity 140 can be distributed along the length direction of the casing 110, and the first accommodating cavity 120 and the third accommodating cavity 140 can also be distributed along the width direction or other horizontal directions of the casing 110. The second accommodating cavity 130 and the third accommodating cavity 140 can also be distributed along the length direction of the casing 110. The second accommodating cavity 130 and the third accommodating cavity 140 can also be distributed along the width direction or other horizontal directions of the casing 110. For example, the first accommodating cavity 120 and the third accommodating cavity 140 are distributed along the length direction of the casing 110, and the second accommodating cavity 130 and the third accommodating cavity 140 are also distributed along the length direction of the casing 110, and the first accommodating cavity 120 and the second accommodating cavity 130 are located on the same side of the third accommodating cavity 140 in the length direction of the casing 110.

[0194] As shown in FIG. 1 , FIG. 3 and FIG. 10 , at least a portion of the first accommodating cavity 120 and the second accommodating cavity 130 are distributed along the height direction of the housing 110 .

[0195] By distributing the first accommodating chamber 120 and the second accommodating chamber 130 horizontally with the third accommodating chamber 140, the overall height of the casing 110 can be reduced, making it easier for staff to install or remove electronic devices inside the casing 110. By distributing at least part of the first accommodating chamber 120 and the second accommodating chamber 130 vertically, the horizontal size of the casing 110 can be reduced while providing sufficient space in the first accommodating chamber 120 and the second accommodating chamber 130 for installing communication electronic devices and power distribution electronic devices, respectively, thereby reducing the footprint of the low-voltage equipment 100.

[0196] In some embodiments, as shown in Figures 1, 3 and 10, the string inverter unit 400 is electrically connected to the low-voltage bus electronic device of the low-voltage device 100, and the low-voltage bus electronic device is located on one side of the low-voltage device 100 close to the boost device 200 along the length direction of the integrated platform 300.

[0197] As shown in Figures 1, 3 and 10, the first accommodating cavity 120 and the third accommodating cavity 140, the second accommodating cavity 130 and the third accommodating cavity 140 are all distributed along the length direction of the housing 110, that is, the first accommodating cavity 120 and the third accommodating cavity 140, the second accommodating cavity 130 and the third accommodating cavity 140 are all distributed along the length direction of the integrated platform 300.

[0198] As shown in Figure 10, the third accommodating chamber 140 is located on the side of the first accommodating chamber 120 and the second accommodating chamber 130 close to the boosting device 200, that is, the third accommodating chamber 140 is located on the side of the low-voltage device 100 close to the boosting device 200, and the low-voltage convergence electronic device installed in the third accommodating chamber 140 is located on the side of the low-voltage device 100 close to the boosting device 200 along the length direction of the integrated platform 300.

[0199] The substation may further include power supply equipment, and the power distribution electronic components and communication electronic components of the low voltage equipment 100 are electrically connected to the power supply equipment to distribute power to the power supply equipment and realize communication functions.

[0200] During the actual implementation process, the output end of the string inverter unit 400 is electrically connected to the input end of the low-voltage bus electronic device in the low-voltage equipment 100 through the low-voltage cable 500, and the output end of the low-voltage bus electronic device passes through the bus copper bus and passes through the casing 110 of the low-voltage equipment 100 to be electrically connected to the boost device 200.

[0201] By arranging the low-voltage busbar electronic components to be located on the side of the low-voltage device 100 close to the boost device 200 along the length direction of the integrated platform 300, the overall length of the busbar can be shortened, thereby reducing production costs to a certain extent.

[0202] In some embodiments, as shown in FIG. 1 , FIG. 9 and FIG. 10 , the boosting device 200 is provided with an operation and maintenance door for opening or closing the inner space of the boosting device 200 , and the low-voltage device 100 includes a cabinet body 111 and a cabinet door 112 .

[0203] 1 , 9 and 10 , the housing 110 includes a cabinet body 111 and a cabinet door 112 . The cabinet body 111 is mounted on the integrated platform 300 . The cabinet body 111 is a rectangular structure, and one side of the cabinet body 111 has an opening. The cabinet door 112 is mounted on the opening for closing or opening the opening.

[0204] The cabinet door 112 can be rotatably connected to the cabinet body 111 through a hinge, a rotating shaft or other means, or can be movably connected to the cabinet body 111 through a slide rail, a slide groove or other means. When the cabinet door 112 is rotatably connected to the cabinet body 111, the cabinet door 112 can be driven to rotate around the axis to open or close the opening; when the cabinet door 112 is movably connected to the cabinet body 111, the cabinet door 112 can be pushed or pulled to move in a specified direction to open or close the opening.

[0205] The operation and maintenance door body and the boosting device 200 can also be rotatably connected by a hinge, a rotating shaft or other means, or can be movably connected by a slide rail, a slide groove or other means.

[0206] As shown in Figures 1, 9 and 10, the cabinet door 112 and the operation and maintenance door body are respectively located on the same side of the cabinet body 111 and the booster equipment 200, that is, the cabinet door 112 and the operation and maintenance door body face the same side of the integrated platform 300. When maintenance, upgrading or other operations are required on the low-voltage equipment 100 and the booster equipment 200, the staff can operate the low-voltage equipment 100 and the booster equipment 200 respectively on one side of the integrated platform 300 without moving to another direction for operation.

[0207] By setting the cabinet door 112 and the operation and maintenance door body to be located on the same side of the cabinet body 111 and the booster equipment 200 respectively, it is convenient for staff to uniformly maintain or upgrade the low-voltage equipment 100 and the booster equipment 200, thereby improving maintenance efficiency or upgrade efficiency.

[0208] In some embodiments, as shown in Figures 1, 9 and 10, the cabinet door 112 is located on the side of the low-voltage equipment 100 in the width direction of the integrated platform 300, and the operation and maintenance door is located on the side of the booster equipment 200 in the width direction of the integrated platform 300.

[0209] Among them, as shown in Figures 1, 9 and 10, the cabinet door 112 can be located on the first side of the low-voltage equipment 100 in the width direction of the integrated platform 300, and the operation and maintenance door body can also be located on the first side of the boost equipment 200 in the width direction of the integrated platform 300. It should be noted that, according to needs, another cabinet door 112 can be set on the second side of the low-voltage equipment 100 along the width direction of the integrated platform 300, and another operation and maintenance door body can be set on the second side of the boost equipment 200 along the width direction of the integrated platform 300.

[0210] Since the low-voltage equipment 100 and the boost equipment 200 are distributed along the length direction of the integrated platform 300, the cabinet door 112 is set to be located on the side of the low-voltage equipment 100 in the width direction of the integrated platform 300, and the operation and maintenance door body is set to be located on the side of the boost equipment 200 in the width direction of the integrated platform 300. The cabinet door 112 and the operation and maintenance door body can be placed on the same side and both face the outside of the integrated platform 300, so as to facilitate opening of the cabinet door 112 and the operation and maintenance door body.

[0211] In some embodiments, as shown in FIG. 1 and FIG. 10 , the third accommodating chamber 140 of the low-voltage device 100 is located on a side of the low-voltage device 100 close to the boosting device 200 in the horizontal direction.

[0212] Among them, the first accommodating cavity 120 and the third accommodating cavity 140, the second accommodating cavity 130 and the third accommodating cavity 140 are all distributed along the length direction of the housing 110, that is, the first accommodating cavity 120 and the third accommodating cavity 140, the second accommodating cavity 130 and the third accommodating cavity 140 are all distributed along the length direction of the integrated platform 300.

[0213] The third accommodating chamber 140 is located on the side of the first accommodating chamber 120 and the second accommodating chamber 130 close to the boosting device 200, that is, the third accommodating chamber 140 is located on the side of the low-voltage device 100 close to the boosting device 200, and the low-voltage convergence electronic device installed in the third accommodating chamber 140 is located on the side of the low-voltage device 100 close to the boosting device 200 along the length direction of the integrated platform 300.

[0214] During the actual implementation process, the output end of the string inverter unit 400 is electrically connected to the input end of the low-voltage bus electronic device in the low-voltage equipment 100 through the low-voltage cable 500, and the output end of the low-voltage bus electronic device passes through the bus copper bus and passes through the casing 110 of the low-voltage equipment 100 to be electrically connected to the boost device 200.

[0215] By arranging the third accommodating cavity 140 of the low-voltage device 100 to be located on a side of the low-voltage device 100 close to the boost device 200 in the horizontal direction, the overall length of the busbar can be shortened, thereby reducing production costs to a certain extent.

[0216] In some embodiments, the substation further includes a low-voltage busbar, and the low-voltage device 100 and the boosting device 200 are electrically connected via the low-voltage busbar.

[0217] The low-voltage busbar uses a busbar as a conductor, which is fixed and protected by components such as an isolation layer and a bracket. The low-voltage busbar is connected between the low-voltage device 100 and the boost device 200.

[0218] By using a low-voltage busbar to connect the low-voltage device 100 and the boost device 200, the space occupied by the connection between the low-voltage device 100 and the boost device 200 can be reduced, further providing installation space for the low-voltage device 100 and the boost device 200.

[0219] In some embodiments, the substation further includes a third circuit breaker, which is connected between the string inverter unit 400 and the low-voltage cable 500 , and the low-voltage cable 500 is electrically connected to the low-voltage bus electronic device.

[0220] Among them, the third circuit breaker and the string inverter unit 400 can both be installed in other equipment of the substation. For example, the third circuit breaker and the string inverter unit 400 are both installed in the battery cabinet of the substation. The third circuit breaker and the string inverter unit 400 are arranged in series, and the two ends of the low-voltage cable 500 are electrically connected to the third circuit breaker and the low-voltage bus electronic device respectively, that is, the two ends of the low-voltage cable 500 are electrically connected to the third circuit breaker and the first circuit breaker 141 and the second circuit breaker 142 respectively.

[0221] By setting a third circuit breaker in other electrical equipment in the substation and electrically connecting the third circuit breaker to the string inverter unit 400, space in the third accommodating cavity 140 can be saved, so that the first circuit breaker 141 and the second circuit breaker 142 can be installed in the third accommodating cavity 140, while achieving protection for the low-voltage cable 500.

[0222] In some embodiments, as shown in Figure 2, the low-voltage device 100 is provided with a wire threading opening 160 along the side close to the integrated platform 300 in the vertical direction. The low-voltage cable 500 for connecting the string inverter unit 400 and the low-voltage device 100 passes through the wire threading opening 160 and is electrically connected to the low-voltage bus electronic device of the low-voltage device 100.

[0223] As shown in FIG. 2 , the threading opening 160 may be a circular structure, a trapezoidal structure, or other shaped structures. For example, the threading opening 160 may be a rectangular structure.

[0224] In actual implementation, the wire threading opening 160 is located at the bottom of the housing 110 , and external cables pass through the wire threading opening 160 into the interior of the housing 110 and are electrically connected to corresponding electronic components.

[0225] By arranging the wire threading opening 160 at the bottom of the housing 110 , the overall integrity of the low-voltage device 100 can be improved, while reducing the probability of rainwater, garbage or other impurities entering the housing 110 through the wire threading opening 160 and affecting electronic devices.

[0226] In some embodiments, as shown in Figure 2, the wire threading opening 160 includes a first wire threading opening 160, a second wire threading opening 160 and a third wire threading opening 160, the cable passing through the first wire threading opening 160 is used to be electrically connected to the first type of electronic device, the cable passing through the second wire threading opening 160 is used to be electrically connected to the second type of electronic device, and the low-voltage cable 500 passing through the third wire threading opening 160 is used to be electrically connected to the third type of electronic device, and the first wire threading opening 160, the second wire threading opening 160 and the third wire threading opening 160 are spaced apart and distributed.

[0227] 2 , the first threading opening 161 , the second threading opening 162 and the third threading opening 163 are spaced apart from each other and are all located at the bottom of the housing 110 .

[0228] The first wire threading opening 161 can be connected to the wiring cavity of the first accommodating cavity 120, and can also be connected to the second accommodating cavity 130. When the first wire threading opening 161 is connected to the wiring cavity of the first accommodating cavity 120, the cable passes through the first wire threading opening 161 and enters the first accommodating cavity 120, and can be directly electrically connected to the communication electronic device located in the first accommodating cavity 120; when the first wire threading opening 161 is connected to the second accommodating cavity 130, the cable passes through the first wire threading opening 161 and enters the second accommodating cavity 130, and then passes through the through hole on the second sub-partition 152 or the third sub-partition 153 to enter the first accommodating cavity 120 and electrically connect to the communication electronic device.

[0229] The second wire threading opening 162 can be in communication with the second accommodating cavity 130 . The cable passing through the second wire threading opening 162 enters the second accommodating cavity 130 and is directly electrically connected to the power distribution electronic device located in the second accommodating cavity 130 .

[0230] The third threading opening 163 can be communicated with the third accommodating cavity 140 . The low-voltage cable 500 passing through the third threading opening 163 enters the third accommodating cavity 140 and is directly electrically connected to the low-voltage busbar electronic device located in the third accommodating cavity 140 .

[0231] By arranging the first wire threading opening 161, the second wire threading opening 162 and the third wire threading opening 163 separately, it is convenient for workers to distinguish the cables electrically connected to communication electronic devices, power distribution electronic devices and low-voltage bus electronic devices, isolate different cables, reduce interference between different cables, and improve the stability and safety of the operation of each electronic device.

[0232] In some embodiments, as shown in FIG. 1 and FIG. 3 , the substation further includes a partition 150 . The partition 150 is installed in the low-voltage equipment 100 . The internal space of the low-voltage equipment 100 is defined by the partition 150 to form a plurality of accommodating cavities.

[0233] As shown in FIG. 1 and FIG. 3 , the partition 150 may be made of materials including but not limited to sheet metal, epoxy resin, or fiberglass. For example, the partition 150 is a sheet metal member, which can improve the strength and rigidity of the partition 150 .

[0234] During the actual implementation process, the partition 150 divides the internal space of the casing 110 into a first accommodating chamber 120, a second accommodating chamber 130 and a third accommodating chamber 140, and the communication electronic components, power distribution electronic components and low-voltage convergence electronic components are respectively installed on the inner walls or partitions 150 of the first accommodating chamber 120, the second accommodating chamber 130 and the third accommodating chamber 140.

[0235] By setting the above-mentioned partition 150, the first accommodating cavity 120, the second accommodating cavity 130 and the third accommodating cavity 140 can be conveniently defined inside the casing 110, while providing certain installation positions for communication electronic components, power distribution electronic components and low-voltage convergence electronic components, thereby improving the installation stability of communication electronic components, power distribution electronic components and low-voltage convergence electronic components.

[0236] An embodiment of the present application further provides a new energy power station, which includes a substation as described in any of the above embodiments.

[0237] Among them, the new energy power station can be a wind power station, a photovoltaic power station, an energy storage power station or other types of power stations.

[0238] According to the new energy power station provided by the embodiment of the present application, by adopting the substation of any of the above-mentioned embodiments, the low-voltage equipment 100 can simultaneously realize the functions of communication, power distribution and convergence, shorten the wiring distance, facilitate unified management and maintenance, reduce operation and maintenance costs, and at the same time improve the safety and stability of the low-voltage equipment 100 and the overall system. The corresponding heat dissipation solution can be selected according to the heat generation and operating temperature requirements of different electronic components for independent heat dissipation to improve the heat dissipation effect inside the low-voltage equipment 100, and the space of the low-voltage equipment 100 and the boost equipment 200 on the integrated platform 300 can be increased, thereby facilitating the staff to upgrade and increase the capacity of the low-voltage equipment 100 and the boost equipment 200.

[0239] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0240] In the description of this application, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0241] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0242] In the description of this application, “plurality” means two or more.

[0243] In the description of the present application, a first feature being “on” or “under” a second feature may include the first and second features being in direct contact with each other, or the first and second features being in contact with each other not directly but via another feature therebetween.

[0244] In the description of this application, a first feature “on”, “above” and “above” a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0245] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0246] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A low voltage device, characterized in that: include: A housing, wherein a plurality of accommodating cavities are defined inside the housing, and the plurality of accommodating cavities are respectively used to install the first type of electronic device, the second type of electronic device, and the third type of electronic device; A first heat dissipation device, a second heat dissipation device and a third heat dissipation device, wherein the first heat dissipation device, the second heat dissipation device and the third heat dissipation device are respectively installed in the accommodating cavities where the first type of electronic components, the second type of electronic components and the third type of electronic components are located.

2. The low voltage device according to claim 1, characterized in that: The first type of electronic device includes an uninterruptible power supply, and the first heat dissipation device includes: An air conditioner, wherein the air inlet and outlet of the air conditioner are both connected to the accommodating cavity where the first type of electronic device is located.

3. The low voltage device according to claim 1 or 2, characterized in that: The second type of electronic device includes a transformer, a wall surface of the accommodating cavity where the second type of electronic device is located is provided with a second air inlet and a second air outlet, and the second heat dissipation device includes: A first fan, wherein the first fan is used to drive air to flow from the second air inlet into the housing cavity where the second type of electronic components are located, and to flow out of the housing cavity where the second type of electronic components are located from the second air outlet.

4. The low voltage device according to claim 3, characterized in that: The second air inlet is located at the back of the accommodating cavity where the second type of electronic device is located, and the second air outlet is located at the bottom of the accommodating cavity where the second type of electronic device is located.

5. The low voltage device according to claim 3 or 4, characterized in that: Also includes: a shutter, the shutter being installed at the second air inlet; and / or, a first filter element, the first filter element being installed at the second air inlet; and / or, A wire mesh installed at the second air outlet; and / or, A second filter element is installed at the second air outlet.

6. The low voltage device according to any one of claims 1 to 5, characterized in that: The third type of electronic device includes a circuit breaker, the wall surface of the accommodating cavity where the third type of electronic device is located is provided with a third air inlet and a third air outlet, and the third heat dissipation device includes: The second fan is used to drive air to flow from the third air inlet into the accommodating cavity where the third type of electronic device is located, and to flow out of the accommodating cavity where the third type of electronic device is located from the third air outlet.

7. The low voltage device according to any one of claims 1 to 5, characterized in that: The third type of electronic device includes a circuit breaker, and the third heat dissipation device includes: A heat exchanger, wherein the heat exchanger has a first heat exchange passage and a second heat exchange passage, wherein the first heat exchange passage is connected to the accommodating cavity where the third type electronic device is located, and the second heat exchange passage is connected to the external environment, and the air in the first heat exchange passage is used for heat exchange with the air in the second heat exchange passage.

8. The low voltage device according to any one of claims 1 to 5, characterized in that: The third type of electronic device includes a circuit breaker, and the third heat dissipation device includes: A third fan is installed in the accommodating chamber where the third type of electronic device is located, and is used to disturb the air in the accommodating chamber where the third type of electronic device is located.

9. The low voltage device according to any one of claims 1 to 8, characterized in that: The first heat dissipation device is installed on the back side of the housing; and / or, The second heat dissipation device is installed on the back side of the housing; and / or, The third heat dissipation device is installed on the back side of the casing.

10. The low voltage device according to any one of claims 1 to 8, characterized in that: The accommodating cavities corresponding to the first and second types of electronic devices are horizontally distributed with the accommodating cavities corresponding to the third type of electronic devices, and the accommodating cavities corresponding to the first and second types of electronic devices are vertically distributed with the accommodating cavities corresponding to the second type of electronic devices.

11. A substation, characterized in that: include: Booster equipment; String inverter unit; The low-voltage device according to any one of claims 1 to 10, wherein the low-voltage device is electrically connected to the boost device and the string inverter unit.

12. A new energy power station, characterized in that: include: The substation as claimed in claim 11.

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