Fan module and electronic device

Abstract

Provided in the embodiments of the present application are a fan module and an electronic device, which are used for ameliorating the problem in the related art of an electronic device having an excessive thickness. The electronic device comprises a housing, a fan shell and a fan body. The housing comprises a first structural member and a second structural member, the second structural member surrounding the edge of the first structural member. The fan shell is fitted over outside of the fan body; a first part of the fan shell and the first structural member jointly form a flat plate structure, and the flat plate structure and the second structural member jointly enclose a mounting space, the fan body being located in the mounting space. The first part of the fan shell comprises a first surface, and the first structural member comprises a second surface; the first surface and the second surface are both located on the side of an appearance flat plate away from the mounting space, and the second surface and the first surface are located in the same plane, thus helping reduce the assembly distance between the fan shell and the first structural member, and thereby reducing the thickness of the electronic device.

Description

Fan module and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202311692885.1, filed on December 8, 2023, and entitled "Fan module and electronic device", the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] Embodiments of the present application relate to the technical field of electronic products, and in particular to a fan module and an electronic device. BACKGROUND

[0003] With the progress of technology, electronic devices nowadays are developing towards multi-function, high speed and small size. Some chips in electronic devices, such as system on chip (SOC), are becoming more and more integrated, and the amount of computation in data processing is also increasing. As a result, the heat generated by the processor per unit area will increase significantly, becoming a high heat generating element. The working heat of the high heat generating element will affect the performance and life of the processor and other components in the electronic device.

[0004] At present, the heat dissipation technology adopted by electronic devices mainly uses a combination of heat dissipation components and fans to improve the heat dissipation capacity of the whole machine. However, the electronic device using the air cooling heat dissipation device is relatively thick, which is not conducive to the realization of the light and thin electronic device.

[0005] SUMMARY

[0006] Embodiments of the present application provide a fan module and an electronic device to improve the problem that the thickness of the electronic device in the related art is relatively large, which is not conducive to the realization of the light and thin electronic device.

[0007] To achieve the above-mentioned purpose, embodiments of the present application provide the following solutions:

[0008] In one aspect, a fan module is provided, which includes a housing, a fan shell and a fan body. The housing includes a first structural member and a second structural member arranged around an edge of the first structural member. The fan shell covers an outside of the fan body, and includes a first part and a second part. The first part and the first structural member jointly form a flat plate structure, and the flat plate structure and the second structural member jointly enclose a mounting space. The fan body and the second part are located in the mounting space. Here, the flat plate structure can be used as a main appearance plate of an electronic device or as part of a main frame of the electronic device. Here, the first part and the first structural member jointly form the flat plate structure can be understood as follows: the first part and the first structural member are integrally formed, and the integrally formed structure is the flat plate structure, or the first part is connected to the first structural member, so that the first part and the first structural member connected together jointly form the flat plate structure. The first part and the first structural member can have a certain assembly gap or assembly step difference.

[0009] The first part includes a first surface, and the first structural member includes a second surface. The first surface and the second surface are located on a side of the appearance flat plate away from the mounting space, and the second surface and the first surface are located in the same plane. Here, the plane can be understood as a surface having absolute flatness or a surface having approximate flatness. The surface having approximate flatness can have slight undulations, and the acceptable deviation range of the surface having approximate flatness can be, for example, a deviation within 5%. Through the above arrangement, the first part and the first structural member form the flat plate structure, which is beneficial to reducing the assembly gap between the fan shell and the first structural member and the space occupied by the fan shell in the mounting space, and is further beneficial to reducing the thickness of the electronic device and facilitating the thinning of the electronic device.

[0010] In some implementations, the fan body includes a shaft seat, a fan blade and a stator assembly. The shaft seat is connected to the first part, the stator assembly is connected to the shaft seat, and the fan blade is rotatably connected to the shaft seat. The fan blade includes a magnetic element. The fan shell further includes a communication hole, and the electronic device further includes a circuit board. The circuit board is located in the mounting space, extends into the fan shell through the communication hole, and is electrically connected to the stator assembly. Through the above arrangement, the main board can control the circuit board to supply power to the stator coil. The stator coil generates a rotating electromagnetic field after being powered.

[0011] In some implementations, the first part has a protruding structure on a side close to the mounting space. The protruding structure has a first sub-surface on a side close to the mounting space. The first sub-surface is arranged opposite to the first surface, and the first sub-surface is recessed towards a side close to the first surface to form a mounting groove. The shaft seat is mounted in the mounting groove. Through the above arrangement, the fan body can be mounted on the first part through the protruding structure. By locally increasing the thickness of the first part, the connection strength of the fan body is improved.

[0012] In some implementations, the first sub-surface is parallel to the first surface and perpendicular to the rotation axis of the fan blade. With the above arrangement, interference between the fan blade and the first sub-surface during rotation of the fan blade is avoided, which helps to improve the phenomenon of scratching of the fan blade.

[0013] In some implementations, the first portion further comprises a second sub-surface adjacent to the protruding structure, the second sub-surface is opposite to the first surface, the second sub-surface is parallel to the first surface and perpendicular to the rotation axis of the fan blade. With the above arrangement, interference between the fan blade and the first sub-surface during rotation of the fan blade is avoided, which helps to improve the phenomenon of scratching of the fan blade. In addition, with the above arrangement, the volume of the mounting space enclosed by the first portion, the first structural member and the second structural member is ensured, and the mounting space is increased.

[0014] In some implementations, the first structural member has a third sub-surface on the side close to the mounting space, the third sub-surface is opposite to the second surface, and at least part of the third sub-surface is in the same plane as at least part of the second sub-surface. With the above arrangement, the regularity of the first structural member is improved, and the volume of the mounting space enclosed by the first portion, the first structural member and the second structural member is further ensured, and the mounting space is increased.

[0015] In some implementations, the circuit board comprises a first board portion, a second board portion and a bending portion, the first board portion is connected to the first sub-surface, the second board portion is connected to the second sub-surface and passes through the communication hole, and the bending portion is connected between the first board portion and the second board portion. With the above arrangement, the circuit board can be mounted on the first portion, and the space occupied by the circuit board in the mounting space is reduced. In addition, the second board portion can also pass through the communication hole, so that the second board portion can extend out of the fan housing and be electrically connected to the main board of the electronic device.

[0016] In some implementations, the first portion and the first structural member are an integral structure. By arranging the first portion and the first structural member as an integral structure, the connection strength of the first portion and the first structural member is improved.

[0017] In some implementations, the second portion comprises a frame and a cover plate, the frame is located between the first portion and the cover plate, the frame is arranged around the edges of the first portion and the cover plate, and the frame and the cover plate are an integral structure. By arranging the frame and the cover plate as an integral structure, the connection strength between the frame and the cover plate is improved, and the overall structural strength of the second portion is improved. At the same time, the frame and the cover plate being an integral structure also improves the sealing between the frame and the cover plate, and helps to form a closed air outlet channel between the second portion and the first portion, prevent air backflow, and improve the heat dissipation capacity of the fan assembly.

[0018] In some implementations, the frame is detachably connected to the first structural member at a side close to the mounting space; and the fan module further comprises a sealing structure located between the first portion and the frame. With the above arrangement, the second portion and the first portion form a closed air outlet channel, preventing air backflow and improving the heat dissipation capacity of the fan assembly.

[0019] In some implementations, the side of the first portion close to the mounting space further has a recessed structure, the recessed structure and the frame jointly define a communication hole, part of the sealing structure is located in the communication hole, and the circuit board is located between the sealing structure and the recessed structure. With the above arrangement, the sealing effect between the circuit board and the frame is improved, and compared with arranging the circuit board between the sealing structure and the frame, arranging the circuit board between the sealing structure and the recessed structure helps to avoid damage to the circuit board caused by the frame.

[0020] In some implementations, the first structural member has a mounting opening penetrating therethrough, and at least part of the first portion is located in the mounting opening. With the above arrangement, the first structural member and the first portion jointly form a flat structure, which helps to reduce the assembly spacing between the fan housing and the first structural member, and the thickness of part of the first structural member, thereby helping to reduce the thickness of the electronic device and facilitate the thinning of the electronic device.

[0021] In some implementations, the first structural member comprises a bottom plate and a lap joint block, the bottom plate has a mounting opening penetrating therethrough, the side of the bottom plate away from the mounting space has a second surface, the bottom plate further has a side surface adjacent to the second surface, and the side surface surrounds the mounting opening. The lap joint block is connected to the side of the bottom plate close to the mounting space, and in a direction parallel to the second surface and pointing to the rotation axis of the fan blade, the lap joint block exceeds the side surface, the surface of the lap joint block adjacent to the side surface is a lap joint surface, and the lap joint surface is in contact with the side of the first portion close to the mounting space.

[0022] In some implementations, part of the bottom plate and part of the first portion jointly form a welding block, the side of the welding block away from the mounting space has a third surface, at least part of the third surface, at least part of the first surface, and at least part of the second surface are located in the same plane. With the above arrangement, the lap joint block can limit the movement of the first portion in the direction close to the mounting space. At the same time, since the lap joint block is connected to the side of the bottom plate close to the mounting space, when the fan housing is mounted, the fan housing can be inserted into the mounting space from the outside of the housing, and the first portion can be in contact with the lap joint surface, facilitating the mounting and fixing of the fan housing.

[0023] In some embodiments, the second part includes a frame and a cover plate, the frame is located between the first part and the cover plate, the frame is arranged around the edge of the cover plate, and the frame has a preset distance from the side surface in a direction parallel to the second surface and pointing to the rotation axis of the fan blade. Through the above arrangement, the distance between the welding position and the frame is ensured, the high temperature in the welding process is prevented from affecting the frame, and the structural reliability of the frame is improved.

[0024] In some embodiments, the fan module can further include a decorative layer, the decorative layer is located on the side of the first part away from the mounting space. By arranging the decorative layer, the appearance of the electronic device is improved. In the embodiment in which part of the bottom plate and part of the first part jointly constitute the welding block, the decorative layer also covers the welding block, so that the welding block is not exposed, and the appearance of the electronic device is further improved.

[0025] In one aspect, an electronic device is provided, including a mainboard and the fan module in any of the above embodiments, the mainboard is connected with the fan body of the fan module. The electronic device provided by the embodiment of the present application includes the fan module as described above, and therefore has all the beneficial effects described above, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0026] FIG. 1 is a cross-sectional view of an electronic device in some embodiments;

[0027] FIG. 2 is a structural view of a fan module in some embodiments;

[0028] FIG. 3 is a cross-sectional view of an electronic device provided by an embodiment of the present application;

[0029] FIG. 4 is a cross-sectional view of a fan module provided by an embodiment of the present application;

[0030] FIG. 5 is a cross-sectional view of a flat plate structure in the electronic device in FIG. 4;

[0031] FIG. 6 is a partial enlarged view of A in the electronic device in FIG. 4;

[0032] FIG. 7 is a cross-sectional view of another electronic device provided by an embodiment of the present application;

[0033] FIG. 8 is a cross-sectional view of another fan module provided by an embodiment of the present application;

[0034] FIG. 9 is a cross-sectional view of a first structural member in the electronic device in FIG. 8;

[0035] FIG. 10 is a cross-sectional view of a first part in the electronic device in FIG. 8;

[0036] FIG. 11 is a cross-sectional view of a first structural member before welding provided by an embodiment of the present application;

[0037] Fig. 12 is a cross-sectional view of a first part being partially lapped behind a first structural member according to an embodiment of the present application;

[0038] Fig. 13 is a cross-sectional view of a first part being welded to a first structural member according to an embodiment of the present application;

[0039] Fig. 14 is a cross-sectional view of a first part being ground to a first structural member according to an embodiment of the present application;

[0040] Fig. 15 is a cross-sectional view of a first part having a surface sprayed with a decorative layer according to an embodiment of the present application. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments of the present application.

[0042] Hereinafter, the terms "first", "second", and the like are used only for the purpose of description and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second", and the like can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0043] In the embodiments of the present application, the words "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design presented as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or advantageous than other embodiments or design solutions. Rather, the use of "exemplary" or "for example" is intended to present concepts in a concrete manner.

[0044] In the embodiments of the present application, for example, the directions of the structure and movement of the different components in the present application are indicated by the directions of up, down, left, right, front, and back, which are relative. When the components are in the positions shown in the drawings, these indications are appropriate. However, if the positions of the components change, these direction indications will also change accordingly.

[0045] As used herein, "parallel," "perpendicular" include the stated condition and conditions that are approximately the stated condition, the range of approximation being within an acceptable range of deviation as determined by one of ordinary skill in the art taking into account the measurements at issue and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable range of deviation for approximately parallel can be, for example, a deviation of within 5%; similarly, "perpendicular" includes absolute perpendicular and approximately perpendicular, where the acceptable range of deviation for approximately perpendicular can be, for example, a deviation of within 5%.

[0046] Embodiments of the present application provide an electronic device. The electronic device can be a mobile phone, a pad, a television, a smart wearable product (e.g., a smart watch, a smart bracelet), a vehicle-mounted computer, or the like. Embodiments of the present application do not specially limit the specific form of the electronic device.

[0047] In some embodiments, the electronic device can be a 2in1 computer, that is, the electronic device can be used as a common pad and can also be used as a notebook computer, thereby meeting different use requirements. FIG. 1 is a cross-sectional view of an electronic device 1' in some embodiments. As shown in FIG. 1, the electronic device 1' can include a housing 11, which can include a first structural member 111 and a second structural member 112, for example. The second structural member 112 can be disposed around the edge of the first structural member 111. For example, the first structural member 111 can be substantially a rectangular plate, and the second structural member 112 can be a plate structure disposed along the edge of the rectangular plate. The first structural member 111 and the second structural member 112 can be enclosed to form a box structure.

[0048] In some embodiments of the present application, the first structural member 111 and the second structural member 112 can be an integral structure and collectively constitute the outer shell of the electronic device 1'. For example, the materials of the first structural member 111 and the second structural member 112 can include metal, such as magnesium alloy, stainless steel, or the like, and the first structural member 111 and the second structural member 112 can be integrally formed by a stamping process. In addition, the materials of the first structural member 111 and the second structural member 112 can also include plastic, glass, ceramic, or the like, and embodiments of the present application do not specially limit the materials of the first structural member 111 and the second structural member 112.

[0049] In some embodiments, the electronic device 1' can also include a display module 20 mounted on the second structural member 112. The display module 20 is used to display images. The display module 20 has a display surface for displaying images and a back surface away from the display surface. The back surface of the display module 20 can face the first structural member 111.

[0050] In some embodiments of the present application, the display module 20 can be a liquid crystal display module. In this case, the display module 20 includes a liquid crystal display (LCD) and a back light unit (BLU) located at the back of the liquid crystal display (away from the side surface b1 of the LCD used for displaying pictures). The BLU can provide a light source for the liquid crystal display, so that each sub-pixel in the liquid crystal display can emit light to realize image display. Alternatively, in some other embodiments of the present application, the display module 20 can be an organic light emitting diode (OLED) display screen. Since an electroluminescent layer is arranged in each sub-pixel of the OLED display screen, the OLED display screen can realize self-luminescence after receiving a working voltage. In this case, the display module 20 with the OLED display screen does not need to be provided with the above-mentioned BLU.

[0051] Based on the above structure, the first structure 111, the second structure 112 and the display module 20 can surround the mounting space 101 for accommodating electronic components, which can include sensors, cameras, microphones, batteries, etc. Of course, the electronic components in the electronic device 1' are not limited to the above-mentioned several examples.

[0052] In some embodiments, the electronic device 1' can further include a main board 80 mounted in the mounting space 101 and a heat generating component 81 mounted on the main board 80. The heat generating component 81 can be a system on chip (SOC), a central processing unit (CPU) or a graphics processing unit (GPU). The main board 80 can be a printed circuit board (PCB). Other components such as capacitors can also be mounted on the main board 80, which is not limited in the embodiments of the present application. The above-mentioned main board 80 is electrically connected to the driving circuit on the display module 20, so that the display module 20 can be controlled by the processor on the PCB to realize image display.

[0053] On this basis, in order to ensure the heat dissipation efficiency of the above-mentioned heat generating component 81, the electronic device 1' adopts a heat dissipation technology mainly in the form of a cooling heat dissipation device combined with the heat dissipation assembly and the fan module 30'.

[0054] In some embodiments, a heat dissipation assembly can be arranged on one side of the heat generating element 81, and the heat dissipation assembly can include a metal heat conduction plate 82 and a heat dissipation device 83, and the metal heat conduction plate 82 can be arranged between the heat generating element 81 and the heat dissipation device 83. The heat dissipation device 83 can be, for example, a vapor-chamber (VC) heat dissipation device. Through the above arrangement, the heat dissipation device 83 can efficiently conduct the heat of the heat generating element 81 into the mounting space 101, thereby avoiding the temperature of the heat generating element 81 from being too high.

[0055] In some embodiments, as shown in FIG. 1, the electronic device 1' can further include a fan module 30'. FIG. 2 is a structural diagram of the fan module 30' in some embodiments. As shown in FIG. 2, the fan module 30' can include a fan housing 32 and a fan body 31, and the fan housing 32 can be arranged outside the fan body 31 so as to protect the fan body 31. The fan housing 32 has an air inlet opening M and an air outlet opening N, the air inlet opening M can be in communication with the mounting space 101, and the air outlet opening N is in communication with the external environment. Through the above arrangement, the airflow carrying heat can be introduced into the fan housing 32 through the air inlet opening M of the fan housing 32, and then discharged to the external space through the air outlet opening N, thereby conducting the heat from the heat dissipation assembly to the outside of the electronic device 1'.

[0056] In some embodiments, the fan module 30' can be installed in the mounting space 101. For example, the air inlet of the fan housing 32 can be arranged on the side close to the display module 20, so that there is a certain distance (i.e., d2 in FIG. 1) between the fan module 30' and the display module 20. Based on the above structure, the fan housing 32 can be connected to the first structural member 111 by a threaded fastener such as a bolt, so that there is also a certain assembly distance (i.e., d4 in FIG. 1) between the fan housing 32 and the first structural member 111.

[0057] In order to ensure the heat dissipation efficiency in the electronic device 1', it is usually required to ensure the thickness of the fan module 30' (i.e. d3 in FIG. 1) arranged in the electronic device 1', and to ensure the spacing between the display module 20 and the fan module 30' (i.e. d2 in FIG. 1). The thickness of the electronic device 1' can include the thickness of the display module 20 (i.e. d1 in FIG. 1), the spacing between the display module 20 and the fan module 30' (i.e. d2 in FIG. 1), the thickness of the fan module 30' (i.e. d3 in FIG. 1), the spacing between the fan module 30' and the first structural member 111 (i.e. d4 in FIG. 1), and the thickness of the first structural member 111 (i.e. d5 in FIG. 1). However, in the mounting mode of the fan module 30' described above, the thickness of the electronic device 1' is large, which makes it difficult to ensure the thinness of the electronic device 1'. Here, the "thickness" can be understood as the dimension in the direction perpendicular to the display surface of the display module 20.

[0058] FIG. 3 is a structural diagram of an electronic device 1 according to an embodiment of the present application. FIG. 4 is a sectional view of a fan module 30 according to an embodiment of the present application. With reference to FIGS. 3 and 4, in the electronic device 1 according to an embodiment of the present application, the fan housing 32 can include a first portion 321 and a second portion 322, the first portion 321 is connected to the first structural member 111, and the first portion 321 and the first structural member 111 together constitute a flat plate structure 13. Here, the "flat plate structure 13" can be used as the main appearance plate of the electronic device 1, or as a part of the main frame of the electronic device 1. Here, the "first portion 321 and the first structural member 111 together constitute the flat plate structure 13" can be understood as that the first portion 321 and the first structural member 111 are integrally formed, and the integrally formed structure is the flat plate structure 13, or the first portion 321 is connected to the first structural member 111, so that the first portion 321 and the first structural member 111 connected together together constitute the flat plate structure 13, wherein the first portion 321 and the first structural member 111 can have a certain assembly gap or assembly step difference. For example, the first portion 321 can be substantially flat, and the structure of the first structural member 111 can also be substantially flat, and the two flat plates are connected together, so that the first portion 321 and at least part of the first structural member 111 together constitute the flat plate structure 13.

[0059] Continuing to refer to FIG. 3, the plate structure 13 and the second structural member 112 can jointly enclose the mounting space 101, and the fan body 31 can be located in the mounting space 101, and the second portion 322 is located in the mounting space 101. Exemplarily, the plate structure 13 and the second structural member 112 jointly enclose a recess, and the space in the recess is the mounting space 101. In the embodiment in which the electronic device 1 further includes the display module 20, the display module 20 can block the recess, that is, the display module 20, the plate structure 13 and the second structural member 112 jointly enclose the mounting space 101.

[0060] In the embodiment, referring to FIG. 4, the first portion 321 includes a first surface a1, and the first structural member 111 includes a second surface a2, the first surface a1 and the second surface a2 are located on the side of the plate structure 13 away from the mounting space 101, and the second surface a2 and the first surface a1 are located in the same plane. Here, the "second surface a2 and the first surface a1 are located in the same plane" can be understood as that part of the second surface a2 can be located in the same plane as the first surface a1, or part of the second surface a2 and part of the first surface a1 are located in the same plane, or the second surface a2 and part of the first surface a1 are located in the same plane. Here, the "plane" can be understood as a surface with absolute flatness or a surface with approximate flatness, and the surface with approximate flatness can have slight undulations, and the acceptable deviation range of the surface with approximate flatness can be, for example, a deviation within 5%. Through the above arrangement, the first portion 321 and the first structural member 111 constitute the plate structure 13, which is beneficial to reduce the assembly space between the fan housing 32 and the first structural member 111 (that is, d4 in FIG. 1) and the space occupied by the fan housing 32 in the mounting space 101, and is further beneficial to reduce the thickness of the electronic device 1 and facilitate the thinning of the electronic device 1.

[0061] In the embodiment, referring to FIG. 2 and FIG. 4, the second portion 322 can include a frame 3221 and a cover plate 3223, wherein the frame 3221 can be located between the first portion 321 and the cover plate 3223, and the frame 3221 is arranged around the edge of the cover plate 3223. Exemplarily, the frame 3221 can be arranged around the edge of the first portion 321, so that the first portion 321, the frame 3221 and the cover plate 3223 enclose a containing space 103, and the fan body 31 is located in the containing space 103.

[0062] The second part 322 is sealingly connected with the first part 321, and the second part 322 has an air inlet opening M, and the second part 322 and the first part 321 define an air outlet opening N. For example, the first part 321 and the cover plate 3223 can be substantially circular plates, and the first part 321 and the cover plate 3223 are oppositely arranged, and the frame 3221 can be arranged along the edges of the first part 321 and the cover plate 3223, that is, the frame 3221, the first part 321 and the cover plate 3223 can jointly define an opening, and the opening is the air outlet opening N. Meanwhile, the cover plate 3223 can have the air inlet opening M. Through the above arrangement, the gas in the installation space 101 can enter the containing space 103 through the air inlet opening M and be blown to the external environment through the air outlet opening N. Since the second part 322 is sealingly connected with the first part 321, the second part 322 and the first part 321 can form a closed air outlet channel, which can prevent air backflow and improve the heat dissipation capacity of the fan assembly.

[0063] Continuing to refer to FIG. 4, the fan body 31 can include a shaft seat 315, a fan blade 311 and a stator assembly 313. The shaft seat 315 is connected with the first part 321, the stator assembly 313 is connected with the shaft seat 315, and the fan blade 311 is rotatably connected with the shaft seat 315.

[0064] For example, the shaft seat 315 can include a mounting seat 3151, a rotating shaft 3152 and a rotating bearing 3153. The mounting seat 3151 can be mounted on the first part 321, and the end of the mounting seat 3151 away from the first part 321 has a groove 3150. The rotating shaft 3152 and the rotating bearing 3153 are located in the groove 3150, and the rotating bearing 3153 is connected between the rotating shaft 3152 and the groove wall of the groove 3150. For example, the rotating shaft 3152 can be in interference fit with the inner ring of the rotating bearing 3153, and the groove wall of the groove 3150 can be in interference fit with the outer ring of the rotating bearing 3153. Through the above arrangement, the rotating shaft 3152 can rotate relative to the mounting seat 3151.

[0065] In some embodiments, the shaft seat 315 can further include a wear pad 3155 between the rotating shaft 3152 and the bottom of the groove 3150. The material of the wear pad 3155 can include, for example, peek (polyether ether ketone). By providing the wear pad 3155, it is beneficial to avoid wear of the rotating shaft 3152 on the mounting seat 3151. In some embodiments, the shaft seat 315 can further include an oil seal cover 3154 sealingly connected between the rotating shaft 3152 and the mounting seat 3151. It can be understood that the groove 3150 is usually filled with lubricating oil or grease to reduce the frictional resistance during rotation of the rotating shaft 3152. By providing the oil seal cover 3154, it is beneficial to avoid leakage of the lubricating oil or grease in the groove 3150, thereby avoiding contamination of the fan body 31.

[0066] In some embodiments, the stator assembly 313 can be, for example, a stator coil, which can be sleeved on the shaft seat 315. Accordingly, the electronic device 1 can further include a circuit board 70 located in the mounting space 101, and accordingly, the fan housing 32 can further include a communication hole 104, through which the circuit board 70 extends into the mounting space 101 and is electrically connected with the stator assembly 313. In combination with FIG. 1, the circuit board 70 can also be electrically connected with the mainboard 80 in the electronic device 1'. For example, the circuit board 70 can be electrically connected with the stator assembly 313 through a metal lead. Through the above arrangement, the mainboard 80 can control the circuit board 70 to supply power to the stator coil, and the stator coil generates a rotating electromagnetic field after being powered on.

[0067] Based on the above structure, the fan blade 311 can be connected with the rotating shaft 3152, and the fan blade 311 includes a magnetic element to enable the fan blade 311 to rotate relative to the shaft seat 315. For example, the central axis of the rotating shaft 3152 can be the rotation axis L of the fan blade 311. The fan blade 311 can include a plurality of blades, which can be forward-inclined blades, or the blades can also be backward-inclined blades. The magnetic element can be, for example, a permanent magnetic ring. When the stator coil is powered on, the permanent magnetic ring is repulsed by the rotating electromagnetic field to drive the fan blade 311 to rotate relative to the shaft seat 315, so that the space in the mounting space 101 is entered into the accommodation space 103 from the air inlet opening M, and the airflow flows to the air outlet opening N under the drive of the blades and is discharged from the air outlet opening N.

[0068] It can be understood that the shape of the shaft seat 315 and the stator coil can be designed according to the actual motion requirements of the fan blade 311, which is not limited in the embodiments of the present application. In addition, the fan body 31 can further include other structures, and the driving mode of the fan blade 311 is not limited to the repulsion between the magnetic elements. The specific structure of the fan body 31 and the driving mode of the fan blade 311 are not limited in the embodiments of the present application.

[0069] FIG. 5 is a sectional view of the flat plate structure 13 in the electronic device 1 of FIG. 4. In combination with FIGS. 4 and 5, in some embodiments, the first portion 321 has a protruding structure 131 near one side of the mounting space 101, the protruding structure 131 has a first sub-surface 1311 near one side of the mounting space 101, the first sub-surface 1311 is arranged opposite to the first surface a1, the first sub-surface 1311 is recessed toward the side near the first surface a1 to form a mounting groove 1313, and the shaft seat 315 is mounted in the mounting groove 1313. For example, the protruding structure 131 can be substantially in a cylindrical structure, and the upper surface of the cylindrical structure is the first sub-surface 1311. The shape of the mounting groove 1313 can be set according to the shape of the mounting seat 3151 of the shaft seat 315, so that the mounting seat 3151 can be mounted in the mounting groove 1313. In some examples, the material of the mounting seat 3151 can include metal, such as copper, aluminum, stainless steel, etc. For example, when the materials of the first portion 321 and the mounting seat 3151 are both metal, the mounting seat 3151 can be riveted in the mounting groove 1313 of the first portion 321, and glue can be added between the mounting seat 3151 and the mounting groove 1313 to further increase the connection strength between the mounting seat 3151 and the first portion 321. Through the above arrangement, the fan body 31 can be mounted on the first portion 321 through the protruding structure 131, and the connection strength of the fan body 31 can be improved by locally increasing the thickness of the first portion 321.

[0070] In some embodiments, the first sub-surface 1311 can be parallel to the first surface a1 and perpendicular to the rotation axis L of the fan blade 311. For example, the fan blade 311 can rotate relative to the rotation axis 3152, and the center line of the rotation axis 3152 is the rotation axis L of the fan blade 311. The first sub-surface 1311 can be perpendicular to the center line of the rotation axis 3152, that is, the first sub-surface 1311 can be perpendicular to the rotation axis L of the fan blade 311. Through the above arrangement, interference between the fan blade 311 and the first sub-surface 1311 during rotation of the fan blade 311 can be avoided, and the phenomenon of scratching of the fan blade 311 can be improved.

[0071] In some examples, the flatness of the first sub-surface 1311 can be less than or equal to 0.2 mm, for example, the flatness of the first sub-surface 1311 can be 0.1 mm, 0.15 mm, or 0.2 mm. Here, the "flatness" can be understood as the deviation of the actual plane of the first sub-surface 1311 from the ideal plane. By limiting the flatness of the first sub-surface 1311, the flatness of the first sub-surface 1311 can be further improved, and interference between the fan blade 311 and the first sub-surface 1311 during rotation of the fan blade 311 can be further avoided.

[0072] In some embodiments, the first portion 321 can further include a second sub-surface 1315 adjacent to the protruding structure 131, the second sub-surface 1315 is opposite to the first surface a1, the second sub-surface 1315 is parallel to the first surface a1, and the second sub-surface 1315 is perpendicular to the rotation axis L of the fan blade 311. For example, the second sub-surface 1315 can surround the edge of the protruding structure 131. The distance between the second sub-surface 1315 and the first surface a1 is less than the distance between the first sub-surface 1311 and the first surface a1. By the above arrangement, the interference between the fan blade 311 and the first sub-surface 1311 during rotation of the fan blade 311 is avoided, which is conducive to improving the scratching of the fan blade 311. Moreover, by the above arrangement, the volume of the installation space 101 surrounded by the first portion 321, the first structure 111 and the second structure 112 is ensured, and the installation space 101 is increased.

[0073] In some examples, the flatness of the second sub-surface 1315 can be less than or equal to 0.2 mm, for example, the flatness of the second sub-surface 1315 can be 0.1 mm, 0.15 mm or 0.2 mm. Here, the "flatness" can be understood as the deviation of the actual plane of the second sub-surface 1315 from the ideal plane. By limiting the flatness of the second sub-surface 1315, the flatness of the second sub-surface 1315 is further improved, and the interference between the fan blade 311 and the second sub-surface 1315 during rotation of the fan blade 311 is further avoided.

[0074] In some embodiments, the first structure 111 can have a third sub-surface 1321 adjacent to the installation space 101, the third sub-surface 1321 is opposite to the second surface a2, and at least part of the third sub-surface 1321 and at least part of the second sub-surface 1315 are in the same plane. Here, "at least part of the third sub-surface 1321 and at least part of the second sub-surface 1315 are in the same plane" can be understood as: part of the third sub-surface 1321 and the second sub-surface 1315 are in the same plane; or part of the third sub-surface 1321 and part of the second sub-surface 1315 are in the same plane; or the third sub-surface 1321 and part of the second sub-surface 1315 are in the same plane. Here, the "plane" can be understood as a surface with absolute flatness or a surface with approximate flatness, wherein the surface with approximate flatness can have slight fluctuations, and the acceptable deviation range of the surface with approximate flatness can be, for example, a deviation within 5%.

[0075] As described in the above embodiments, the second sub-surface 1315 can be parallel to the first surface a1, and since at least part of the third sub-surface 1321 is in the same plane as at least part of the second sub-surface 1315, and at least part of the first surface a1 and at least part of the second surface a2 are in the same plane, at least part of the third sub-surface 1321 can be parallel to the second surface a2, thereby facilitating the regularity of the first structural member 111, facilitating further guaranteeing the volume of the installation space 101 surrounded by the first part 321, the first structural member 111 and the second structural member 112, and increasing the installation space 101.

[0076] In some examples, the flatness of the third sub-surface 1321 can be less than or equal to 0.2 mm, for example, the flatness of the third sub-surface 1321 can be 0.1 mm, 0.15 mm or 0.2 mm. Here, the "flatness" can be understood as the deviation value of the actual plane of the third sub-surface 1321 from the ideal plane. By limiting the flatness of the third sub-surface 1321, it is advantageous to further improve the flatness of the third sub-surface 1321 and further improve the regularity of the first structural member 111.

[0077] Based on the above structure, the circuit board 70 can include a first plate portion 71, a second plate portion 72 and a bending portion 73, the first plate portion 71 can be connected to the first sub-surface 1311, the second plate portion 72 can be connected to the second sub-surface 1315, and the bending portion 73 can be connected between the first plate portion 71 and the second plate portion 72. For example, the circuit board 70 can be a flexible printed circuit (FPC), the first plate portion 71 can be bonded to the first sub-surface 1311, the second plate portion 72 can be bonded to the second sub-surface 1315, and the bending portion 73 can be bonded to the circumferential surface of the protruding structure 131 and connected between the first plate portion 71 and the second plate portion 72. Through the above arrangement, the circuit board 70 can be mounted on the first part 321, and the space occupied by the circuit board 70 in the installation space 101 can be reduced. Furthermore, the second plate portion 72 can also pass through the communication hole 104, so that the second plate portion 72 can extend out of the fan housing 32 through the communication hole 104 and be electrically connected to the main board 80 of the electronic device 1.

[0078] In some embodiments, continuing to refer to FIG. 4, the first part 321 and the first structural member 111 can be an integral structure. For example, the first part 321 and the second structural member 112 can be an integral metal plate. The material of the metal plate may, for example, include magnesium alloy, stainless steel, etc. By setting the first part 321 and the first structural member 111 as an integral structure, the connection strength of the first part 321 and the first structural member 111 can be improved.

[0079] The surface of the metal plate can be planarly milled by a computer numerical control (CNC) machine. For example, the second sub-surface 1315 of the first portion 321 and the third sub-surface 1321 of the first structural member 111 can be located in the same plane by planar milling, and the plane is parallel to the plane in which the first surface a1 and the second surface a2 are located. At the same time, the first sub-surface 1311 of the first portion 321 can be parallel to the plane in which the first surface a1 and the second surface a2 are located by planar milling, and a groove can be milled on the first sub-surface 1311 by increasing the milling depth. In some implementations, the flatness of the first sub-surface 1311, the second sub-surface 1315, and the third sub-surface 1321 can be adjusted by adjusting the accuracy of planar milling.

[0080] As described in the above embodiments, referring to FIG. 4, the second portion 322 can include a frame 3221 and a cover plate 3223. Based on the above structure, the frame 3221 and the cover plate 3223 can be an integrated structure. For example, the frame 3221 and the cover plate 3223 can be an integrated structure formed by pressing the same piece of metal plate. By setting the frame 3221 and the cover plate 3223 as an integrated structure, the connection strength between the frame 3221 and the cover plate 3223 can be improved, and the structural strength of the second portion 322 as a whole can be improved. At the same time, the frame 3221 and the cover plate 3223 as an integrated structure can improve the sealing between the frame 3221 and the cover plate 3223, and the second portion 322 and the first portion 321 can form a closed air outlet channel, prevent air backflow, and improve the heat dissipation capacity of the fan module.

[0081] In addition, when the frame 3221 and the cover plate 3223 are an integrated metal structure, the thickness of the second portion 322 can be reduced under the premise of ensuring the structural strength of the second portion 322 as a whole, and the space occupied by the fan module 30 in the electronic device 1 can be reduced, and the space utilization in the electronic device 1 can be improved.

[0082] In some embodiments, the frame 3221 can be detachably connected to the first structural member 111 near the side of the mounting space 101. For example, as shown in FIGS. 4 and 5, the side of the first structural member 111 near the mounting space 101 can have a mounting boss 132 that can be threadedly connected to the frame 3221. For example, the mounting boss 132 can be provided on the third sub-surface 1321 of the first structural member 111, and the mounting boss 132 can have a counterbore 1323 with an inner threaded hole on the hole wall. Correspondingly, the frame 3221 can also have a threaded hole arranged opposite to the counterbore 1323, and a threaded fastener such as a bolt can be arranged in the threaded hole and the counterbore 1323 to threadedly connect the mounting boss 132 and the frame 3221. Through the above arrangement, detachable connection between the frame 3221 and the first structural member 111 can be achieved, which facilitates replacement or maintenance of the fan body 31 at any time.

[0083] Of course, in the embodiments of the present application, the frame 3221 and the cover plate 3223 can also be two independent structures, and the frame 3221 and the cover plate 3223 can be connected together by welding or adhesion.

[0084] Based on the above structure, as shown in FIG. 4, the fan module 30 can further include a sealing structure 34 located between the first portion 321 and the frame 3221. The sealing structure 34 can include a sealing ring, sealing glue, etc. As described in the above embodiments, the frame 3221 can be arranged along part of the edge of the first portion 321 and the cover plate 3223, and correspondingly, the sealing structure 34 can also be arranged around part of the edge of the first portion 321 and the frame 3221, so that the frame 3221 and the first portion 321 are sealingly connected, which is conducive to forming a closed air outlet channel between the second portion 322 and the first portion 321, preventing air backflow, and improving the heat dissipation capacity of the fan assembly.

[0085] FIG. 6 is a partial enlarged view of position A in the electronic device 1 in FIG. 4. As shown in FIG. 6, in some embodiments, the side of the first portion 321 near the mounting space 101 also has a recessed structure 135 that cooperates with the frame 3221 to define the through hole 104. Part of the second sub-surface 1315 can be recessed to form the recessed structure 135 in the direction close to the first surface a1. For example, a groove can be machined on part of the second sub-surface 1315 by plane milling, and the groove is the recessed structure 135. As described in the above embodiments, the second board portion 72 of the circuit board 70 can also be bent in the direction close to the recessed structure 135 and arranged in the through hole 104. Through the above arrangement, the circuit board 70 can extend into the fan housing 32 from the through hole 104 and be electrically connected to the stator assembly 313.

[0086] As described in the above embodiments, the sealing structure 34 is located between the frame 3221 and the first portion 321. The sealing structure 34 can be located between the frame 3221 and the recessed structure 135, that is, the sealing structure 34 can be located in the communication hole 104, and the circuit board 70 can be located between the sealing structure 34 and the recessed structure 135. Through the above arrangement, the sealing effect between the circuit board 70 and the frame 3221 is improved, and compared with the arrangement that the circuit board 70 is arranged between the sealing structure 34 and the frame 3221, the arrangement that the circuit board 70 is arranged between the sealing structure 34 and the recessed structure 135 is beneficial to avoid that the frame 3221 is pressed and damaged on the circuit board 70.

[0087] In some examples, the fan module 30 can further include a sealing layer 35, which can be located between the second plate portion 72 of the circuit board 70 and the recessed structure 135, and between the second plate portion 72 of the circuit board 70 and the sealing structure 34. The material of the sealing layer 35 can include, for example, foam. Through the arrangement of the sealing layer 35, the sealing effect between the circuit board 70 and the communication hole 104 is further improved, and the second portion 322 and the first portion 321 form a closed air outlet channel, which is beneficial to prevent air backflow and improve the heat dissipation capacity of the fan module.

[0088] FIG. 7 is a structural diagram of another electronic device 1 provided by an embodiment of the present application. FIG. 8 is a structural diagram of another fan module 30 provided by an embodiment of the present application. As shown in FIGS. 7 and 8, in some examples, the first structure 111 can have a mounting opening 137 penetrating the first structure 111, and at least part of the first portion 321 can be located in the mounting opening 137. The shape of the mounting opening 137 can be arranged according to the shape of the first portion 321. For example, the mounting opening 137 can be a circular opening, and correspondingly, the cross-sectional shape of the first portion 321 in the plane parallel to the first surface a1 can be circular, so that at least part of the first portion 321 can be located in the mounting opening 137. Here, “at least part of the first portion 321 can be located in the mounting opening 137” can be understood as follows: when the thickness of the first portion 321 is less than or equal to the thickness of the first structure 111, the first portion 321 is located in the mounting opening 137; when the thickness of the first portion 321 is greater than the thickness of the first structure 111, part of the first portion 321 protrudes from the mounting opening 137, and part of the first portion 321 is located in the mounting opening 137.

[0089] Based on the above structure, in the mounting process of the fan module 30 in the embodiment of the present application, the fan body 31 can be first mounted in the fan shell 32, the fan shell 32 is mounted on the first structural member 111, and the first part 321 is located in the mounting opening 137 of the first structural member 111, so that the first part 321 and the first structural member 111 jointly constitute the flat plate structure 13. The first part 321 and the first structural member 111 can be welded together, or the first part 321 and the first structural member 111 can also be bonded together, and the embodiment of the present application does not specifically limit the connection mode between the first part 321 and the first structural member 111.

[0090] In summary, at least part of the first part 321 can be located in the mounting opening 137, so that the first structural member 111 and the first part 321 jointly constitute the flat plate structure 13, which is beneficial to reduce the assembly spacing between the fan shell 32 and the first structural member 111, and the thickness of part of the first structural member 111, and further beneficial to reduce the thickness of the electronic device 1, and facilitate the thinning of the electronic device 1.

[0091] As shown in FIG. 8, in the embodiment of the present application, the frame 3221 and the cover plate 3223 in the second part 322 can be two independent structures, and can be assembled on the first part 321 in sequence to form the fan shell 32. For example, the frame 3221 can be formed on the first part 321 by injection molding process, and the frame 3221 is arranged around the edge of the first part 321. The frame 3221 formed by the injection molding process has good sealing and connection strength with the first part 321. After the frame 3221 is formed, the cover plate 3223 can be bonded on the side of the frame 3221 away from the first part 321, thereby forming the fan shell 32. In the process of forming the frame 3221 on the first part 321 by injection molding process, the structure of the injection mold can be adjusted so that the frame 3221 formed has the communication hole 104, so that the circuit board 70 extends into the fan shell 32 through the communication hole 104 and is electrically connected with the stator assembly 313.

[0092] Of course, in some other embodiments, the frame 3221 and the cover plate 3223 can also be an integral structure, and the embodiment of the present application does not specifically limit this.

[0093] Fig. 9 is a sectional view of the first structural member 111 in the electronic device 1 in Fig. 8; Fig. 10 is a sectional view of the first part 321 in the electronic device 1 in Fig. 8. In combination of Figs. 8, 9 and 10, in some embodiments, the first structural member 111 can include a bottom plate 1113 and a lap block 1115, the bottom plate 1113 has a mounting opening 137 therethrough, the side of the bottom plate 1113 away from the mounting space 101 has a second surface a2, the bottom plate 1113 also has a side surface b1 adjacent to the second surface a2, the side surface b1 surrounds the mounting opening 137, and the lap block 1115 is connected to the side of the bottom plate 1113 close to the mounting space 101, and in a direction parallel to the second surface a2 and pointing to the rotation axis L of the fan blade 311 (e.g., the X direction in Fig. 9), the lap block 1115 exceeds the side surface b1.

[0094] For example, the bottom surface of the bottom plate 1113 can be the second surface a2, the top surface of the bottom plate 1113 is the surface of the side of the bottom plate 1113 close to the mounting space 101, and the lap block 1115 can be connected to the top surface of the bottom plate 1113. In this case, the mounting opening 137 can be a circular opening, i.e., the side surface b1 surrounding the mounting opening 137 can be an annular surface. Accordingly, the cross-sectional shape of the lap block 1115 in a direction parallel to the second surface a2 can be annular, the central axis of the lap block 1115 can coincide with the central axis of the mounting opening 137, and the central axis of the mounting opening 137 can also coincide with the rotation axis L of the fan blade 311. In a direction parallel to the second surface a2 and pointing to the rotation axis L of the fan blade 311 (e.g., the X direction in Fig. 9), the distance D1 between the lap block 1115 and the rotation axis L of the fan blade 311 is less than the distance D2 between the side surface b1 and the rotation axis L of the fan blade 311, so that the lap block 1115 exceeds the side surface b1.

[0095] Based on the above arrangement, the surface of the lap block 1115 adjacent to the side surface b1 is a lap surface b2, and the lap surface b2 contacts the side of the first part 321 close to the mounting space 101. For example, the first part 321 can further include a fourth sub-surface 1317, the fourth sub-surface 1317 is located on the side of the first part 321 close to the mounting space 101 and on the side of the second sub-surface 1315 away from the first sub-surface 1311. In this case, the fourth sub-surface 1317 can be parallel to the first surface a1, and the distance D4 between the fourth sub-surface 1317 and the first surface a1 can be less than the distance D3 between the second sub-surface 1315 and the first surface a1. The fourth sub-surface 1317 can contact the lap block 1115, so that the lap block 1115 can limit the movement of the first part 321 in the direction close to the mounting space 101.

[0096] Meanwhile, since the overlapping block 1115 is connected to the bottom plate 1113 near the side close to the installation space 101, when the fan shell 32 is installed, the fan shell 32 can be extended into the installation space 101 from the outside of the shell 11, and the first part 321 can be in contact with the overlapping surface b2, so as to facilitate the installation and fixation of the fan shell 32.

[0097] Of course, in some other embodiments, the first part 321 can also omit the fourth sub-surface 1317, and the second sub-surface 1315 of the first part 321 is in contact with the overlapping block 1115. Alternatively, in some other embodiments, the overlapping block 1115 can also be connected to the second surface a2 of the bottom plate 1113, and the embodiments of the present application do not make specific limitations in this regard.

[0098] In some embodiments, continuing to refer to FIG. 8, the part of the bottom plate 1113 and the part of the first part 321 jointly constitute a welding block 139, and the side of the welding block 139 away from the installation space 101 has a third surface a3, and at least part of the third surface a3, at least part of the first surface a1 and at least part of the second surface a2 are located in the same plane. For example, the materials of the bottom plate 1113 and the first part 321 can include metal, and the part of the second surface a2 of the bottom plate 1113 and the part of the first surface a1 of the first part 321 are welded together by a welding process, so as to jointly constitute the welding block 139. Through the above arrangement, the bottom plate 1113 and the first part 321 are welded together, which is conducive to improving the connection strength between the bottom plate 1113 and the first part 321. Meanwhile, since the third surface a3 of the welding block 139 can be formed by welding the part of the second surface a2 of the bottom plate 1113 and the part of the first surface a1 of the first part 321, the welding process can be operated from the outside of the shell 11, which is conducive to improving the operation space of the welding process and reducing the welding difficulty. Moreover, at least part of the third surface a3, at least part of the first surface a1 and at least part of the second surface a2 are located in the same plane, which is also conducive to further improving the flatness of the shell 11 and the aesthetic appearance of the shell 11.

[0099] In some embodiments, the frame 3221 has a preset distance H from the side surface b1 in a direction parallel to the second surface a2 and pointing to the rotation axis L of the fan blade 311 (e.g., the X direction in FIG. 8). It can be understood that, in the process of welding the bottom plate 1113 and the first part 321 together, the contact surface between the bottom plate 1113 and the first part 321 is usually welded. Based on the above-mentioned embodiments, that is, the side surface b1 of the bottom plate 1113 and the peripheral surface of the first part 321 are welded, by adjusting the preset distance H between the frame 3221 and the side surface b1, the distance between the welding position and the frame 3221 can be ensured, the influence of high temperature in the welding process on the frame 3221 can be avoided, and the structural reliability of the frame 3221 can be improved.

[0100] For example, the preset distance H between the frame 3221 and the side surface b1 in a direction parallel to the second surface a2 and pointing to the rotation axis L of the fan blade 311 (e.g., the X direction in FIG. 8) can be greater than or equal to 10 cm, for example, the preset distance H between the frame 3221 and the side surface b1 can be 10 cm, 12 cm or 14 cm. When the preset distance H approaches 10 cm, the volume of the fan module 30 can be increased, and the heat dissipation performance of the electronic device 1 can be ensured. As the preset distance H increases, the influence of the welding process on the frame 3221 is smaller, and the reliability of the frame 3221 can be further improved; at the same time, the volume of the fan module 30 in the installation space 101 is smaller, and the space utilization of the installation space 101 can be improved. In some embodiments, the electronic device 1 can further include a decorative layer 60, which can be located on the side of the bottom plate 1113 and the first part 321 away from the installation space 101. For example, the decorative layer 60 can be a plate layer structure attached to the bottom plate 1113 and the first part 321, or the decorative layer 60 can also be a coating structure sprayed on the surface of the first part 321 of the bottom plate 1113. By providing the decorative layer 60, the appearance of the electronic device 1 can be improved. In embodiments in which part of the bottom plate 1113 and part of the first part 321 jointly constitute the welding block 139, the decorative layer 60 also covers the welding block 139, so that the welding block 139 is not exposed, and the appearance of the electronic device 1 can be further improved.

[0101] Referring to FIGS. 11-14, the mounting process between the first part 321 of the fan housing 32 and the first structural member 111 of the housing 11 in the embodiments of the present application will be briefly described.

[0102] FIG. 11 is a cross-sectional view of a first structure 111 before welding according to an embodiment of the present application. As shown in FIG. 11, the bottom plate 1113 of the first structure 111 further has a first welding boss 1117 protruding away from the side of the mounting space 101, and the first welding boss 1117 can be adjacent to the side surface b1, and the surface of the first welding boss 1117 facing the mounting opening 137 can be coplanar with the side surface b1.

[0103] FIG. 12 is a cross-sectional view of a first part 321 after being overlapped on the first structure 111 according to an embodiment of the present application. Accordingly, as shown in FIG. 12, the first part 321 further has a second welding boss 1319 protruding away from the side of the mounting space 101, and the second welding boss 1319 is in contact with the first welding boss 1117.

[0104] FIG. 13 is a cross-sectional view of the first part 321 and the first structure 111 after welding according to an embodiment of the present application. As shown in FIG. 13, the surfaces of the first structure 111 and the first part 321 in contact with each other can be welded using an automatic laser welding process, so as to connect the first structure 111 and the first part 321 together. For example, the first welding boss 1117 and the second welding boss 1319 are recessed towards the direction of the mounting space 101 after welding. The automatic laser welding process has the advantages of fast welding speed, uniform welding seam, and no cracking. During the automatic laser welding process, if there is a slight deformation in the welding seam, the stress residue of the welding can be removed by laser engraving. Of course, other welding processes can also be used to weld the first structure 111 and the first part 321 together in the embodiment of the present application, and the present application does not make a specific limitation in this regard.

[0105] FIG. 14 is a cross-sectional view of the first part 321 and the first structure 111 after grinding according to an embodiment of the present application. As shown in FIG. 14, after the first structure 111 and the first part 321 are welded together, the side surface b1 of the first structure 111 and the first part 321 away from the mounting space 101 can be ground to form the first surface a1, the second surface a2, and the third surface a3 in the same plane, wherein the first surface a1 is the surface of the first part 321 away from the mounting space 101, the second surface a2 is the surface of the first structure 111 away from the mounting space 101, and the third surface a3 is the surface of the welding block 139 away from the mounting space 101.

[0106] In some examples, the grinding can be performed multiple times to ensure the flatness of the first surface a1, the second surface a2 and the third surface a3. For example, a first grinding operation can be performed first to remove the oxides on the first structural member 111 surface and the first portion 321 surface using a coarse grinding wheel. After the first grinding operation, a second grinding operation can be performed to grind the first structural member 111, the welding block 139 and the first portion 321 flat using a fine grinding wheel. After the second grinding operation, a third grinding operation can be performed to polish the surfaces using a polishing wheel.

[0107] FIG. 15 is a cross-sectional view of a first portion 321 and a first structural member 111 after a surface of the first portion 321 and the first structural member 111 is sprayed with a decorative layer 60. As shown in FIG. 15, after the first structural member 111 and the first portion 321 are ground on the side surface b1 facing away from the installation space 101, a spraying process can be used to form the decorative layer 60. The spraying process can be performed multiple times to ensure the reliability of the decorative layer 60. For example, a primer coating, a mid-coat coating and a top-coat coating can be sprayed in sequence using a three-time spraying process. The primer coating is used to enhance the adhesion of the decorative layer 60, the mid-coat coating is used to achieve a coloring effect, and the top-coat coating is used to provide a protective effect.

[0108] In some examples, continuing to refer to FIG. 15, during the assembly of the first structural member 111 and the first portion 321, a protective cover 50 can also be provided on the fan module 30. The protective cover 50 is connected to the first structural member 111 near the side facing the installation space 101 and covers the outside of the second portion 322 of the fan housing 32. For example, the protective cover 50 can include a cover body having a vacuum cavity inside. The cover body can be made of metal such as stainless steel. Through the above arrangement, during the formation of the decorative layer 60 using the spraying process, paint can be prevented from splashing onto the second portion 322. In addition, during the welding of the first structural member 111 and the first portion 321 using a welding process, the protective cover 50 can also be used to prevent the baking temperature from affecting the performance of the second portion 322 and the fan body 31, thereby improving the reliability of the fan module 30.

[0109] The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or replacements within the technical scope disclosed by the present application can be easily thought of by those skilled in the art, and should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A fan module, characterized in that, include: The housing includes a first structural member and a second structural member, wherein the second structural member is disposed around the edge of the first structural member; The fan housing and the fan body are provided. The fan housing covers the outside of the fan body. The fan housing includes a first part and a second part. The first part and the first structural member together form a flat plate structure. The flat plate structure and the second structural member together enclose an installation space. The fan body and the second part are located within the installation space. The first part includes a first surface, the first structural member includes a second surface, the first surface and the second surface are both located on the side of the flat plate structure away from the mounting space, and the second surface and the first surface are located in the same plane.

2. The fan module according to claim 1, characterized in that, The fan body includes a bearing, fan blades, and a stator assembly. The bearing is connected to the first part, the stator assembly is connected to the bearing, and the fan blades are rotatably connected to the bearing. The fan blades include magnetic elements. The fan housing also includes a connecting hole, and the electronic device also includes a circuit board located within the mounting space. The circuit board extends into the fan housing through the connecting hole and is electrically connected to the stator assembly.

3. The fan module according to claim 2, characterized in that, The first part has a protruding structure on the side near the mounting space, and the protruding structure has a first sub-surface on the side near the mounting space. The first sub-surface is disposed opposite to the first surface, and the first sub-surface is recessed on the side near the first surface to form a mounting groove, and the bearing is installed in the mounting groove.

4. The fan module according to claim 3, characterized in that, The first sub-face is parallel to the first surface and perpendicular to the rotation axis of the fan blade.

5. The fan module according to claim 3 or 4, characterized in that, The first part further includes a second sub-surface adjacent to the protrusion structure. The second sub-surface is disposed opposite to the first surface, and is parallel to the first surface and perpendicular to the rotation axis of the fan blade.

6. The fan module according to claim 5, characterized in that, The first structural member has a third sub-surface on the side near the mounting space. The third sub-surface is disposed opposite to the second surface, and the third sub-surface and the second sub-surface are located in the same plane.

7. The fan module according to claim 6, characterized in that, The circuit board includes a first board portion, a second board portion, and a bending portion. The first board portion is connected to the first sub-surface, the second board portion is connected to the second sub-surface and passes through a connecting hole, and the bending portion is connected between the first board portion and the second board portion.

8. The fan module according to any one of claims 2-7, characterized in that, The first part and the first structural component are an integral structure.

9. The fan module according to claim 8, characterized in that, The second part includes a frame and a cover plate. The frame is located between the first part and the cover plate. The frame is arranged around the edges of the first part and the cover plate, and the frame and the cover plate are an integral structure.

10. The fan module according to claim 9, characterized in that, The frame is detachably connected to the side of the first structural member near the mounting space; the fan module also includes a sealing structure located between the first part and the frame.

11. The fan module according to claim 10, characterized in that, The first part also has a recessed structure on the side near the installation space. The recessed structure and the frame together enclose the communicating hole. Part of the sealing structure is located in the communicating hole, and the circuit board is located between the sealing structure and the recessed structure.

12. The fan module according to any one of claims 2-11, characterized in that, The first structural member has a through mounting opening, and at least a portion of the first part is located within the mounting opening.

13. The fan module according to claim 12, characterized in that, The first structural component includes a base plate and an overlapping block. The base plate has a through mounting opening. The side of the base plate facing away from the mounting space has a second surface. The base plate also has a side surface adjacent to the second surface, and the side surface surrounds the mounting opening. The overlapping block is connected to the side of the base plate near the mounting space. In a direction parallel to the second surface and pointing from the side surface to the rotation axis of the fan blade, the overlapping block extends beyond the side surface. The surface of the overlapping block adjacent to the side surface is the overlapping surface, and the overlapping surface contacts the side of the first part near the mounting space.

14. The fan module according to claim 13, characterized in that, The base plate and the first part together constitute a welding block. The welding block has a third surface on the side opposite to the installation space. The third surface, the first surface, and the second surface are located in the same plane.

15. The fan module according to claim 14, characterized in that, The second part includes a frame and a cover plate. The frame is located between the first part and the cover plate. The frame is arranged around the edge of the cover plate. In a direction parallel to the second surface and pointing from the side surface to the rotation axis of the fan blade, the frame and the side surface have a preset distance.

16. The fan module according to any one of claims 13-15, characterized in that, The electronic device may also include a decorative layer located on the side of the base plate and the first portion facing away from the mounting space.

17. An electronic device, characterized in that, It includes a motherboard and a fan module as described in any one of claims 1-16, wherein the motherboard is connected to the fan body of the fan module.

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