Lens module and control method and control apparatus therefor, and electronic device

By introducing the airbag cavity mechanism into the lens module, adjusting the distance between the chip and the lens, the problem that the existing lens module cannot fine-tune the optical path adaptability is solved, and the performance of the lens module is optimized.

WO2025119141A1PCT designated stage expired Publication Date: 2025-06-12VIVO MOBILE COMM CO LTD
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Patent Information

Application Number
PCT/CN2024/136166
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-12-06
Filing Date
2024-12-02
Publication Date
2025-06-12

AI Technical Summary

Technical Problem

The existing lens modules are designed with fixed object distance and fixed focal length, and cannot adaptively fine-tune the optical path, affecting the performance of the lens module.

Method used

A lens module is designed, including lenses, chips, circuit boards, support components and adjustment parts. Through the expansion and contraction of the airbag cavity, the distance between the chip and the lens is adjusted to achieve adaptive fine adjustment of the optical path.

Benefits of technology

Through the adaptive fine-tuning of the optical path, the working performance of the lens module is ensured and the optical path path is avoided due to deformation of the external structure.

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Abstract

The present application discloses a lens module and a control method and control device therefor, and an electronic device. The lens module is used in an electronic device, and comprises: a lens; a chip, which is arranged opposite the lens; a circuit board, which is located on the side of the chip facing away from the lens; a support assembly, which is arranged on the circuit board and located between the circuit board and the chip, the support assembly and the circuit board enclosing an air pocket cavity, and the chip being supported in the air pocket cavity; and an adjustment member, which is electrically connected to the circuit board, and can expand the air pocket cavity in a direction approaching the lens so as to move the chip close to the lens, or can shrink the air pocket cavity in a direction away from the lens so as to move the chip away from the lens.
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Description

Lens module, control method thereof, control device and electronic equipment

[0001] Cross-references

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on December 6, 2023, with application number 202311659308.2 and invention name “Lens module and its control method, control device and electronic device”. The entire contents of the application are incorporated by reference into this application. Technical Field

[0003] The present application belongs to the technical field of electronic equipment, and specifically relates to a lens module and a control method, a control device and an electronic device thereof. Background Art

[0004] In related art, lens modules are designed with a fixed object distance and focal length, and the optical path is fixed when the device leaves the factory. However, during actual user use, phenomena such as battery expansion and screen deformation may affect the factory optical path state. Because the lens module in related art is designed with a fixed object distance and focal length, adaptive fine-tuning of the optical path is impossible, affecting the performance of the lens module. Summary of the Invention

[0005] The present application aims to provide a lens module and its control method, control device and electronic equipment, at least to solve the problem in the related art that the lens module cannot perform adaptive fine-tuning of the optical path, thereby affecting the performance of the lens module.

[0006] In the first aspect, an embodiment of the present application proposes a lens module for use in an electronic device, wherein the lens module includes: a lens; a chip, arranged opposite to the lens; a circuit board, located on the side of the chip facing away from the lens; a support assembly, wherein the support assembly is arranged on the circuit board and is located between the circuit board and the chip, wherein the support assembly and the circuit board enclose an airbag cavity, and the chip is supported in the airbag cavity; an adjustment member, electrically connected to the circuit board, wherein the adjustment member can expand the airbag cavity toward the lens to drive the chip toward the lens, or shrink the airbag cavity toward the lens to drive the chip away from the lens.

[0007] On the second aspect, an embodiment of the present application proposes a control method for a lens module, which is used for a lens module as proposed in any of the above items. The control method includes: obtaining status information of the lens module; determining the height compensation amount between the chip and the lens based on the status information; and controlling the adjustment part to operate based on the height compensation amount so that the airbag cavity drives the chip to move the height compensation amount.

[0008] On the third aspect, an embodiment of the present application proposes a control device for a lens module, which is used for a lens module as proposed in any of the above items, including: an acquisition module, used to obtain status information of the lens module; a control module, used to determine the height compensation amount between the chip and the lens based on the status information; and according to the height compensation amount, controlling the operation of the adjustment part to enable the airbag cavity to drive the chip to move the height compensation amount.

[0009] In a fourth aspect, an embodiment of the present application proposes an electronic device, comprising: a lens module as proposed in any one of the above items.

[0010] In an embodiment of the present application, a lens module includes a lens, a chip, a circuit board, a support assembly and an adjustment member. The chip and the lens are arranged opposite to each other, and the circuit board is arranged on the side of the chip away from the lens. Light enters the chip from the lens to realize the imaging function of the lens module. The support assembly is arranged on the circuit board, and the support assembly and the circuit board enclose an airbag cavity. The chip is arranged on the airbag cavity, and then the airbag cavity can drive the chip to move when it is deformed. Among them, the adjustment member is electrically connected to the circuit board to realize the control of the adjustment member through the circuit board, and then the airbag cavity is deformed by controlling the adjustment member, and then the airbag cavity is moved in a direction close to the lens or away from the lens. When the airbag cavity expands in the direction close to the lens, the airbag cavity can drive the chip close to the lens. When the airbag cavity shrinks in the direction away from the lens, it can drive the chip away from the lens to adjust the optical focal length of the lens module, achieve the effect of adaptive adjustment of the optical path, thereby ensuring the working performance of the lens module and avoiding the deformation of the external structure and other situations that affect the optical path.

[0011] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] FIG1 is a schematic structural diagram of a lens module according to an embodiment of the present application;

[0014] FIG2 is a second structural schematic diagram of a lens module according to an embodiment of the present application;

[0015] FIG3 is a third structural diagram of a lens module according to an embodiment of the present application;

[0016] FIG4 is a fourth structural diagram of a lens module according to an embodiment of the present application;

[0017] FIG5 is a fifth structural diagram of a lens module according to an embodiment of the present application;

[0018] FIG6 is a sixth structural diagram of a lens module according to an embodiment of the present application;

[0019] FIG7 is a seventh structural diagram of a lens module according to an embodiment of the present application;

[0020] FIG8 is an eighth structural diagram of a lens module according to an embodiment of the present application;

[0021] FIG9 is a ninth structural diagram of a lens module according to an embodiment of the present application;

[0022] FIG10 is a tenth structural diagram of a lens module according to an embodiment of the present application;

[0023] FIG11 is a schematic structural diagram of an elastic support member according to an embodiment of the present application;

[0024] FIG12 is a schematic block diagram of a temperature adjustment member according to an embodiment of the present application;

[0025] FIG13 is a flow chart of a method for controlling a lens module according to an embodiment of the present application;

[0026] FIG14 is a second flow chart of a method for controlling a lens module according to an embodiment of the present application;

[0027] FIG15 is a schematic block diagram of a control device for a lens module according to an embodiment of the present application;

[0028] FIG16 is a schematic block diagram of an electronic device according to an embodiment of the present application;

[0029] FIG17 is a second schematic block diagram of an electronic device according to an embodiment of the present application.

[0030] Figure numerals: 10 lens, 11 chip, 110 bonding layer, 12 circuit board, 13 support assembly, 130 elastic support member, 1302 elastic support sheet, 1304 hard support sheet, 132 sealing part, 134 airbag cavity, 136 support column, 14 adjustment part, 140 temperature adjustment part, 142 heating part, 144 cooling part, 16 filter, 17 gold wire. DETAILED DESCRIPTION

[0031] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0032] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected objects.

[0033] In the description of this application, it should be understood that the terms "upper", "lower", "vertical", "horizontal", "top", "bottom", "inside", "outside", "circumferential", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0034] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0035] The following describes the lens module and its control method, control device and electronic device according to the embodiments of the present application in conjunction with Figures 1 to 17.

[0036] As shown in Figures 1, 2 and 7, according to some embodiments of the present application, the present application proposes a lens module for use in electronic devices, the lens module comprising: a lens 10; a chip 11, arranged opposite to the lens 10; a circuit board 12, located on the side of the chip 11 away from the lens 10; a support assembly 13, the support assembly 13 is arranged on the circuit board 12, located between the circuit board 12 and the chip 11, the support assembly 13 and the circuit board 12 enclose an airbag cavity 134, and the chip 11 is supported in the airbag cavity 134; an adjusting member 14, electrically connected to the circuit board 12, the adjusting member 14 can make the airbag cavity 134 expand in a direction close to the lens 10 to drive the chip 11 close to the lens 10, or make the airbag cavity 134 shrink in a direction away from the lens 10 to drive the chip 11 away from the lens 10.

[0037] In an embodiment of the present application, the lens module includes a lens 10, a chip 11, a circuit board 12, a support assembly 13 and an adjustment member 14. The chip 11 is arranged opposite to the lens 10, and the circuit board 12 is arranged on the side of the chip 11 away from the lens 10. Light enters the chip 11 from the lens 10 to realize the imaging function of the lens module. The support assembly 13 is arranged on the circuit board 12, and the support assembly 13 and the circuit board 12 enclose an airbag cavity 134. The chip 11 is arranged on the airbag cavity 134, and the airbag cavity 134 can drive the chip 11 to move when it is deformed. Among them, the adjustment member 14 is electrically connected to the circuit board 12 to realize the control of the adjustment member 14 through the circuit board 12, and then the airbag cavity 134 is deformed by controlling the adjustment member 14, so that the airbag cavity 134 moves in the direction close to the lens 10 or away from the lens 10. When the airbag cavity 134 expands toward the direction of the lens 10, the airbag cavity 134 can drive the chip 11 toward the lens 10. When the airbag cavity 134 contracts toward the direction away from the lens 10, it can drive the chip 11 away from the lens 10 to adjust the optical focal length of the lens module and achieve the effect of adaptive adjustment of the optical path, thereby ensuring the working performance of the lens module and avoiding the influence of the optical path due to deformation of the external structure.

[0038] It is understandable that the chip 11 is electrically connected to the circuit board 12. Optionally, the chip 11 is electrically connected to the circuit board 12 via a gold wire 17.

[0039] Optionally, the chip 11 is bonded to the airbag cavity 134 via a bonding adhesive layer 110 .

[0040] Optionally, a filter 16 is provided on the side of the chip 11 facing the lens 10 .

[0041] According to some embodiments of the present application, the adjusting member 14 includes: a temperature adjusting member 140, which is electrically connected to the circuit board 12, and is used to heat or cool the airbag cavity 134; when the temperature adjusting member 14 heats the airbag cavity 134, the airbag cavity 134 expands toward the direction close to the lens 10; when the temperature adjusting member 14 cools the airbag cavity 134, the airbag cavity 134 contracts toward the direction away from the lens 10.

[0042] In this embodiment, as shown in Figure 8, when the temperature regulating member 140 heats the airbag cavity 134, the air in the airbag cavity 134 will expand, the pressure will increase, and then expand toward the direction close to the lens 10, driving the chip 11 to move toward the direction close to the lens 10; as shown in Figure 9, when the temperature regulating member 140 cools the airbag cavity 134, the air in the airbag cavity 134 will contract, the pressure will decrease, and then contract toward the direction away from the lens 10, thereby driving the chip 11 away from the lens 10.

[0043] In some possible designs, the adjusting member 14 can also be an inflation and suction device. When the adjusting member 14 inflates the airbag cavity 134, the airbag cavity 134 can be expanded; when the adjusting member 14 sucks air into the airbag cavity 134, the airbag cavity 134 can be contracted.

[0044] As shown in FIG. 12 , according to some embodiments of the present application, the temperature adjustment member 140 includes a heating portion 142 and a cooling portion 144 .

[0045] In this embodiment, the temperature regulating member 140 includes a heating portion 142 and a cooling portion 144. The heating portion 142 is used to heat the airbag cavity 134, so that the temperature of the air in the airbag cavity 134 increases, thereby causing the air in the airbag cavity 134 to expand, and driving the chip 11 to move toward the direction close to the lens 10; the cooling portion 144 is used to cool the airbag cavity 134, so that the air in the airbag cavity 134 contracts, and thereby driving the chip 11 to move away from the lens 10.

[0046] According to some embodiments of the present application, the heating portion 142 includes a heating wire, and the cooling portion 144 includes a cooling fin.

[0047] In this embodiment, the heating unit 142 includes a heating wire, which can heat the air in the airbag cavity 134 when the heating wire is turned on. The cooling unit 144 includes a cooling fin, which can cool the air in the airbag cavity 134 when the cooling fin is turned on.

[0048] In a specific application, the cooling fin includes a cold end and a hot end, wherein the cold end of the cooling fin is arranged corresponding to the airbag cavity 134 to achieve cooling of the air in the airbag cavity 134 .

[0049] Optionally, the heating portion 142 may also be a hot end of a refrigeration fin. The cooling portion 144 may also be a water-cooled structure, a condenser, or the like.

[0050] As shown in Figures 3, 4, 5, 6 and 7, according to some embodiments of the present application, the support assembly 13 also includes: a sealing portion 132, which is provided on the circuit board 12; an elastic support member 130, the elastic support member 130 is supported on the sealing portion 132, the elastic support member 130, the sealing portion 132 and the circuit board 12 together enclose an airbag cavity 134, and the chip 11 is provided on the elastic support member 130; when the airbag cavity 134 expands, the elastic support member 130 bulges toward the direction close to the lens 10, and when the airbag cavity 134 contracts, the elastic support member 130 is recessed toward the direction away from the lens 10.

[0051] In this embodiment, the support assembly 13 further includes a sealing portion 132 and an elastic support member 130. The elastic support member 130 is supported by the sealing portion 132 and, together with the sealing portion 132 and the circuit board 12, forms an airbag cavity 134. When the airbag cavity 134 expands, the elastic support member 130 bulges toward the lens 10, pulling the chip 11 toward the lens 10. When the airbag cavity 134 contracts, the elastic support member 130 recesses away from the lens 10, pulling the chip 11 away from the lens 10.

[0052] In a specific application, the adjustment member 14 includes a temperature adjustment member 140, which is disposed in the airbag cavity 134. The circuit board 12 is electrically connected to the temperature adjustment member 140 and is used to adjust the temperature value of the temperature adjustment member 140, thereby achieving heating or cooling the airbag cavity 134. When heating or cooling the airbag cavity 134, the pressure of the gas in the airbag cavity 134 will change. Since the elastic support member 130 has a deformable property, when the pressure in the airbag cavity 134 changes, the elastic support member 130 will deform, thereby causing the elastic support member 130 to bulge toward the direction of the lens 10 or to be concave away from the lens 10, thereby driving the chip 11 to move, so as to adjust the distance between the chip 11 and the lens 10.

[0053] In a specific application, as shown in Figure 8, when the temperature adjustment member 140 heats the airbag cavity 134, the air in the airbag cavity 134 will expand and the pressure will increase, and then the elastic support member 130 will bulge toward the direction close to the lens 10, driving the chip 11 to move toward the direction close to the lens 10; as shown in Figure 9, when the temperature adjustment member 140 cools the airbag cavity 134, the air in the airbag cavity 134 will contract and the pressure will decrease, and then the elastic support member 130 will be recessed in the direction away from the lens 10, thereby driving the chip 11 away from the lens 10.

[0054] As shown in FIG. 4 and FIG. 10 , according to some embodiments of the present application, the support assembly 13 further includes a support column 136 , which is disposed on the circuit board 12 and located within the airbag cavity 134 .

[0055] In this embodiment, the support assembly 13 also includes a support column 136, which is arranged in the airbag cavity 134 to achieve support and limitation of the elastic support member 130, thereby preventing the elastic support member 130 from being too sunken and causing imaging failure.

[0056] As shown in FIG. 7 , according to some embodiments of the present application, the airbag cavity 134 has an initial state; when the airbag cavity 134 is in the initial state, there is a gap between the elastic support member 130 and the end of the support column 136 away from the circuit board 12 .

[0057] In this embodiment, the airbag cavity 134 has an initial state. When the airbag cavity 134 is in the initial state, there is a gap between the elastic support member 130 and the support column 136 at one end away from the circuit board 12, thereby providing movement space for the elastic support member 130 and the chip 11 in a direction away from the lens 10, thereby realizing the adjustment of the distance between the chip 11 and the lens 10.

[0058] In a specific application, when the airbag cavity 134 is in an initial state, the elastic support member 130 is in a flat state.

[0059] According to some embodiments of the present application, there are multiple support columns 136 , and the multiple support columns 136 are arranged at intervals.

[0060] In this embodiment, there are multiple support columns 136 , which are arranged at intervals, and can limit the elastic support member 130 at various positions to ensure that there is enough space in the airbag cavity 134 .

[0061] It can be understood that the spaces between adjacent support columns 136 are filled with air.

[0062] Optionally, the support column 136 may be strip-shaped, such as a long strip extending in one direction, or may be point-shaped, such as having multiple support columns 136 along one direction so that each support column 136 is distributed in a point-shaped manner, such as a cylindrical shape.

[0063] As shown in Figures 7, 8, 9 and 11, according to some embodiments of the present application, the elastic support member 130 includes: a stacked elastic support sheet 1302 and a hard support sheet 1304, the elastic support sheet 1302 protrudes from the edge of the hard support sheet 1304 along the circumference, the portion of the elastic support sheet 1302 protruding from the edge of the hard support sheet 1304 is connected to the sealing portion 132, and the chip 11 is arranged on the hard support sheet 1304; the portion of the elastic support sheet 1302 protruding from the hard support sheet 1304 can be deformed to drive the hard support sheet 1304 closer to or away from the lens 10.

[0064] In this embodiment, the elastic support member 130 includes a laminated elastic support sheet 1302 and a rigid support sheet 1304. The elastic support sheet 1302 is deformable, and the rigid support sheet 1304 can ensure support for the chip 11. The elastic support sheet 1302 protrudes from the edge of the rigid support sheet 1304 along the circumference, and the portion of the elastic support sheet 1302 protruding from the edge of the rigid support sheet 1304 is connected to the sealing portion 132. In this way, both the elastic support member 130 and the chip 11 are deformed. Specifically, the portion of the elastic support sheet 1302 protruding from the rigid support sheet 1304 can deform, thereby driving the rigid support sheet 1304 toward or away from the lens 10, thereby adjusting the distance between the lens 10 and the chip 11.

[0065] The hard support sheet 1304 can be arranged on a side of the elastic support sheet 1302 close to the lens 10 , or on a side of the elastic support sheet 1302 away from the lens 10 .

[0066] Optionally, the size of the hard support piece 1304 is smaller than the size of the sealing portion 132. In this way, the elastic support piece 1302 protrudes from the portion of the hard support piece 1304, a portion of which is connected to the sealing portion 132 and the other portion is used to deform, thereby realizing the deformation of the elastic support member 130.

[0067] Optionally, the portion where the elastic support piece 1302 and the hard support piece 1304 are connected may be a hard structure or an elastic structure.

[0068] As shown in FIG. 7 to FIG. 9 , according to some embodiments of the present application, the hard support sheet 1304 is located on a side of the elastic support sheet 1302 close to the lens 10 , and the chip 11 is disposed on the hard support sheet 1304 .

[0069] In this embodiment, the hard support sheet 1304 is arranged on the side of the elastic support sheet 1302 close to the lens 10, and the chip 11 is arranged on the hard support sheet 1304, thereby supporting the chip 11 and improving the supporting effect of the chip 11.

[0070] In specific applications, the present application provides a fingerprint module design scheme, which adds an airbag cavity mechanism to the fingerprint module, and adjusts the height position of the chip 11 in the fingerprint module by controlling the height change caused by the expansion or contraction of the airbag cavity, thereby adjusting the optical focal length and achieving the function of adaptive fine-tuning of the optical fingerprint light path.

[0071] The present application adds a temperature-adjustable circuit to the flexible printed circuit (FPC) at the bottom of the chip 11 (e.g., a fingerprint chip), and a strip-shaped support column 136 is provided at the upper end of the corresponding circuit. The above design forms an adjustment structure of the airbag cavity, which ensures stable support for the chip 11 when it is attached. A support sheet (e.g., an elastic support member 130) with a sealing rubber ring (e.g., a sealing portion 132) is added to the support column 136 to enclose the adjustment circuit and the support column 136 in a closed cavity (e.g., the airbag cavity 134). There is air between the support columns 136 in the cavity, and the air can expand, contract, etc. under the temperature regulation of the circuit. The fingerprint chip is attached to the support sheet and moves up and down as a whole during the airbag adjustment, achieving a more consistent overall movement of the chip 11. Whether the circuit of the cavity is connected can be determined by evaluating the performance system software of the fingerprint module, and adjusted according to the set step steps. The expansion height is adjusted according to the condition of the photoelectric fingerprint to achieve the purpose of dynamically adjusting the focal length of the chip 11, and ultimately achieving the purpose of ensuring the performance of the photoelectric fingerprint in the best state.

[0072] Specifically, the FPC at the bottom of the fingerprint chip incorporates a heating / cooling circuit. Support columns 136 are added to the circuit layer, which can be either bar-shaped or dot-shaped. A support sheet is added to support columns 136 to secure the chip 11. The support sheet is composed of a composite of a rigid support film and a flexible support film, such as a rigid PET (Polyethylene terephthalate) film and a flexible PET film. The support sheet is surrounded by a sealed plastic frame, which, when assembled, forms a sealed airbag cavity.

[0073] According to one embodiment of the present application, a control method for a lens module is also proposed, which is used for the lens module proposed in any of the above embodiments.

[0074] As shown in FIG13 , a control method of a lens module according to an embodiment of the present application is shown. The control method includes:

[0075] S202: Obtaining status information of the lens module;

[0076] S204: Determine the height compensation between the chip and the lens according to the status information;

[0077] S206: According to the height compensation amount, the adjustment member is controlled to operate so that the airbag cavity drives the chip to move by the height compensation amount.

[0078] In this embodiment, the control method includes obtaining status information of the lens module, and determining whether the distance between the chip and the lens needs to be adjusted based on the status information. When adjustment is required, the height compensation amount between the chip and the lens is determined, and then the adjustment part is controlled to operate so that the airbag cavity moves and the chip moves the height compensation amount, thereby adjusting the distance between the chip and the lens and making the optical path in the lens module accurate.

[0079] It should be noted that the height compensation amount can be set according to actual conditions. For example, the distance between the chip and the lens is calculated as the first distance, and the distance between the chip and the lens needs to be controlled within the second distance range. Therefore, the distance that the chip needs to move can be determined based on the first distance and the second distance range, that is, the height compensation amount can be determined.

[0080] It is understandable that in the environment where the lens module is located, when the structure changes due to collision or prolonged use, the optical path of the lens module will change. Therefore, the status information of the lens module can be the status information of the environment where the lens module is located, such as the change in the optical path between the display screen and the lens of the electronic device where the lens module is located, the distance value between the chip and the lens caused by the expansion of the battery of the whole machine, and other status information; it can also be the imaging information of the lens module. For example, when the imaging quality is relatively blurred, the distance between the chip and the lens can be adjusted by the control method of the lens module proposed in this application to improve the imaging quality.

[0081] According to some embodiments of the present application, the control method of the lens module also includes: after the step of controlling the adjustment part to operate so that the airbag cavity drives the chip to move the height compensation amount, it also includes: returning to the step of obtaining the status information of the lens module to perform cyclic detection on the lens module.

[0082] In this embodiment, the control method of the lens module also includes, after the control adjustment part works and the chip position is adjusted, returning to the step of obtaining the status information of the lens module, adjusting the position of the chip multiple times, realizing cyclic detection of the lens module, and ensuring the optimal performance of the lens module.

[0083] According to some embodiments of the present application, before the step of obtaining the status information of the lens module, it also includes: obtaining the on / off status of the electronic device, and when the electronic device is in the on state, entering the step of obtaining the status information of the lens module; or obtaining the number of times the lens module is used, and when the number of times the lens module is used is greater than or equal to the target number of times, entering the step of obtaining the status information of the lens module.

[0084] In this embodiment, the on / off state of the electronic device is obtained, and when the electronic device is in the on state, the status information of the lens module is detected, and then the position of the chip is adjusted; or when the number of times the lens module has been used reaches the target number of times, the status information of the lens module is detected, and then the position of the chip is adjusted to achieve adaptive fine-tuning of the optical path.

[0085] It should be noted that the target number of times can be set according to actual conditions, such as 1,000 times, 10,000 times, etc.

[0086] According to some embodiments of the present application, the electronic device includes a display screen, and the status information includes a distance value between the display screen and the lens.

[0087] In this embodiment, the status information may be the distance between the display screen and the lens. For example, when the display screen of the electronic device is deformed or the battery expands, the distance between the display screen and the lens changes, thereby causing a change in the optical path.

[0088] Optionally, the height compensation amount can be determined based on the imaging information of the lens module, for example, by acquiring a first image, comparing the first image with a preset image, and then determining the compensation amount, and adjusting the distance between the lens and the chip according to the compensation amount, thereby adjusting the focal length of the lens module.

[0089] In specific applications, electronic devices include mobile phones. As shown in Figure 14, when the mobile phone is turned on or the number of fingerprint uses reaches the set detection number, the system automatically starts the fingerprint module's application environment change detection, calculates the hardware (chip height) compensation amount based on the previously detected data, sets the electrical requirements for connecting the heating circuit, and realizes the function of self-adjusting the optical focal length. This function can be used as a cyclic test function to ensure the optimal fingerprint usage environment. If combined with software functions, the adjustment space can be increased, and better results can be presented.

[0090] As shown in Figure 15, according to some embodiments of the present application, a control device 600 for a lens module is proposed, which is used for a lens module as proposed in any of the above items, including: an acquisition module 602, used to obtain status information of the lens module; a control module 604, used to determine the height compensation amount between the chip and the lens based on the status information; and according to the height compensation amount, controlling the operation of the adjustment part to enable the airbag cavity to drive the chip to move the height compensation amount.

[0091] In the embodiment proposed in the present application, the control device 600 of the lens module includes an acquisition module 602 and a control module 604. The acquisition module 602 is used to obtain the status information of the lens module. The control module 604 can determine whether the distance between the chip and the lens needs to be adjusted based on the status information. When adjustment is required, the height compensation amount between the chip and the lens is determined, and then the adjustment part is controlled to operate, so that the airbag cavity moves, the chip moves the height compensation amount, and the distance between the chip and the lens is adjusted, so that the optical path in the lens module is accurate.

[0092] It should be noted that the height compensation amount can be set according to actual conditions. For example, the distance between the chip and the lens is calculated as the first distance, and the distance between the chip and the lens needs to be controlled within the second distance range. Therefore, the distance that the chip needs to move can be determined based on the first distance and the second distance range, that is, the height compensation amount can be determined.

[0093] It is understandable that in the environment where the lens module is located, when the structure changes due to collision or prolonged use, the optical path of the lens module will change. Therefore, the status information of the lens module can be the status information of the environment where the lens module is located, such as the change in the optical path between the display screen and the lens of the electronic device where the lens module is located, the distance value between the chip and the lens caused by the expansion of the battery of the whole machine, and other status information; it can also be the imaging information of the lens module. For example, when the imaging quality is relatively blurred, the distance between the chip and the lens can be adjusted by the control method of the lens module proposed in this application to improve the imaging quality.

[0094] According to some embodiments of the present application, after controlling the adjustment member to enable the airbag cavity to drive the chip to move a height compensation amount, the control module 604 is also used to: return to the step of obtaining the status information of the lens module to perform a cyclic detection on the lens module.

[0095] In this embodiment, the control method of the lens module also includes, after the control adjustment part works and the chip position is adjusted, returning to the step of obtaining the status information of the lens module, adjusting the position of the chip multiple times, realizing cyclic detection of the lens module, and ensuring the optimal performance of the lens module.

[0096] According to some embodiments of the present application, before the step of obtaining the status information of the lens module, the control module 604 is also used to: obtain the on / off status of the electronic device, and when the electronic device is in the on state, enter the step of obtaining the status information of the lens module; or obtain the number of times the lens module is used, and when the number of times the lens module is used is greater than or equal to the target number of times, enter the step of obtaining the status information of the lens module.

[0097] In this embodiment, the on / off state of the electronic device is obtained, and when the electronic device is in the on state, the status information of the lens module is detected, and then the position of the chip is adjusted; or when the number of times the lens module has been used reaches the target number of times, the status information of the lens module is detected, and then the position of the chip is adjusted to achieve adaptive fine-tuning of the optical path.

[0098] It should be noted that the target number of times can be set according to actual conditions, such as 1,000 times, 10,000 times, etc.

[0099] According to some embodiments of the present application, the electronic device includes a display screen, and the status information includes a distance value between the display screen and the lens.

[0100] In this embodiment, the status information may be the distance value between the display screen and the lens. For example, when the display screen of the electronic device is deformed or the battery is expanded, the distance between the display screen and the lens changes, thereby causing a change in the optical path.

[0101] The device in the embodiment of the present application can be an electronic device or a component in an electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal or other device other than a terminal. For example, the electronic device can be a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a mobile Internet device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc. It can also be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc., and the embodiment of the present application does not specifically limit it.

[0102] The device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android operating system, an iOS operating system, or other possible operating systems, which are not specifically limited in the embodiment of the present application.

[0103] The device provided in the embodiment of the present application can implement each process implemented in the method embodiment of Figure 13. To avoid repetition, they will not be described here.

[0104] As shown in Figure 16, according to some embodiments of the present application, an electronic device 700 is proposed, including: a processor 702 and a memory 704, the memory 704 stores programs or instructions that can be run on the processor 702, and when the programs or instructions are executed by the processor 702, the steps of the control method of the lens module proposed in any of the above items are implemented.

[0105] It should be noted that the electronic device 700 in the embodiment of the present application includes the above-mentioned mobile electronic device and non-mobile electronic device.

[0106] FIG17 is a schematic diagram of the hardware structure of an electronic device 800 implementing an embodiment of the present application.

[0107] The electronic device 800 includes but is not limited to components such as a radio frequency unit 801 , a network module 802 , an audio output unit 803 , an input unit 804 , a sensor 805 , a display unit 806 , a user input unit 807 , an interface unit 808 , a memory 809 , and a processor 810 .

[0108] Those skilled in the art will appreciate that the electronic device 800 may further include a power source (e.g., a battery) for powering various components. The power source may be logically connected to the processor 810 via a power management system, thereby enabling the power management system to manage charging, discharging, and power consumption. The electronic device structure shown in FIG17 does not limit the electronic device. The electronic device may include more or fewer components than shown, or may combine certain components, or have different component arrangements, which will not be described in detail here.

[0109] Among them, the processor 810 is used to obtain the status information of the lens module; determine the height compensation between the chip and the lens based on the status information; and control the adjustment part to work according to the height compensation so that the airbag cavity drives the chip to move the height compensation amount.

[0110] In this embodiment, the processor 810 obtains the status information of the lens module, and can determine whether the distance between the chip and the lens needs to be adjusted based on the status information. When adjustment is required, the height compensation amount between the chip and the lens is determined, and then the adjustment part is controlled to operate, so that the airbag cavity moves and the chip moves the height compensation amount, thereby adjusting the distance between the chip and the lens and making the optical path in the lens module accurate.

[0111] It should be noted that the height compensation amount can be set according to actual conditions. For example, the distance between the chip and the lens is calculated as the first distance, and the distance between the chip and the lens needs to be controlled within the second distance range. Therefore, the distance that the chip needs to move can be determined based on the first distance and the second distance range, that is, the height compensation amount can be determined.

[0112] It is understandable that in the environment where the lens module is located, when the structure changes due to collision or prolonged use, the optical path of the lens module will change. Therefore, the status information of the lens module can be the status information of the environment where the lens module is located, such as the change in the optical path between the display screen and the lens of the electronic device where the lens module is located, the distance value between the chip and the lens caused by the expansion of the battery of the whole machine, and other status information; it can also be the imaging information of the lens module. For example, when the imaging quality is relatively blurred, the distance between the chip and the lens can be adjusted by the control method of the lens module proposed in this application to improve the imaging quality.

[0113] According to some embodiments of the present application, after controlling the adjustment member to enable the elastic support member to drive the chip to move a height compensation amount, the processor 810 is also used to: return to the step of obtaining status information of the lens module to perform cyclic detection on the lens module.

[0114] In this embodiment, the control method of the lens module also includes, after the control adjustment part works and the chip position is adjusted, returning to the step of obtaining the status information of the lens module, adjusting the position of the chip multiple times, realizing cyclic detection of the lens module, and ensuring the optimal performance of the lens module.

[0115] According to some embodiments of the present application, before the step of obtaining the status information of the lens module, the processor 810 is also used to: obtain the on / off status of the electronic device, and when the electronic device is in the on state, enter the step of obtaining the status information of the lens module; or obtain the number of times the lens module is used, and when the number of times the lens module is used is greater than or equal to the target number of times, enter the step of obtaining the status information of the lens module.

[0116] In this embodiment, the on / off state of the electronic device is obtained, and when the electronic device is in the on state, the status information of the lens module is detected, and then the position of the chip is adjusted; or when the number of times the lens module has been used reaches the target number of times, the status information of the lens module is detected, and then the position of the chip is adjusted to achieve adaptive fine-tuning of the optical path.

[0117] It should be noted that the target number of times can be set according to actual conditions, such as 1,000 times, 10,000 times, etc.

[0118] According to some embodiments of the present application, the electronic device includes a display screen, and the status information includes a distance value between the display screen and the lens.

[0119] In this embodiment, the status information may be the distance between the display screen and the lens. For example, when the display screen of the electronic device is deformed or the battery is expanded, the distance between the display screen and the lens changes, thereby causing a change in the optical path.

[0120] It should be understood that in an embodiment of the present application, the input unit 804 may include a graphics processing unit (GPU) 8041 and a microphone 8042, and the graphics processor 8041 processes the image data of a static picture or video obtained by an image capture device (such as a camera) in a video capture mode or an image capture mode. The display unit 806 may include a display panel 8061, and the display panel 8061 may be configured in the form of a liquid crystal display, an organic light emitting diode, etc. The user input unit 807 includes a touch panel 8071 and at least one of other input devices 8072. The touch panel 8071 is also called a touch screen. The touch panel 8071 may include two parts: a touch detection device and a touch controller. Other input devices 8072 may include, but are not limited to, a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which will not be repeated here.

[0121] The memory 809 can be used to store software programs and various data. The memory 809 may mainly include a first storage area for storing programs or instructions and a second storage area for storing data, wherein the first storage area may store an operating system, applications or instructions required for at least one function (such as a sound playback function, an image playback function, etc.). In addition, the memory 809 may include a volatile memory or a non-volatile memory, or the memory 809 may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be random access memory (RAM), static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDRSDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), and direct RAM bus random access memory (DRRAM). The memory 809 in the embodiment of the present application includes but is not limited to these and any other suitable types of memory.

[0122] Processor 810 may include one or more processing units. Optionally, processor 810 integrates an application processor and a modem processor. The application processor primarily handles operations related to the operating system, user interface, and application programs, while the modem processor primarily processes wireless communication signals, such as a baseband processor. It is understood that the modem processor may not be integrated into processor 810.

[0123] The processor 810 is the processor in the electronic device in the above embodiment.

[0124] An embodiment of the present application further provides a chip, which includes a processor and a communication interface, which is coupled to the processor. The processor is used to run programs or instructions to implement the various processes of the above-mentioned lens module control method embodiment, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0125] It should be understood that the chip mentioned in the embodiments of the present application can also be called a system-level chip, a system chip, a chip system or a system-on-chip chip, etc.

[0126] An embodiment of the present application provides a computer program product, which is stored in a storage medium. The program product is executed by at least one processor to implement the various processes of the above-mentioned lens module control method embodiment and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0127] According to some embodiments of the present application, a readable storage medium is proposed, on which a program or instruction is stored, wherein when the program or instruction is executed by a processor, a control method of the lens module as proposed in any of the above items is executed.

[0128] The readable storage medium includes a computer-readable storage medium, such as a computer read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0129] According to some embodiments of the present application, an electronic device is proposed, including: a lens module as proposed in any one of the above items.

[0130] According to some embodiments of the present application, the lens module includes any one of a camera module and a fingerprint module.

[0131] In this embodiment, the lens module can be any one of a camera module and a fingerprint module.

[0132] In specific applications, fingerprint modules include lens-type photoelectric fingerprints and ultra-thin photoelectric fingerprint modules.

[0133] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0134] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A lens module for an electronic device, the lens module comprising: lens; A chip, arranged opposite to the lens; A circuit board, located on a side of the chip facing away from the lens; A support component, the support component is arranged on the circuit board and is located between the circuit board and the chip. The support component and the circuit board enclose an airbag cavity, and the chip is supported in the airbag cavity; An adjusting member is electrically connected to the circuit board, and the adjusting member can expand the airbag cavity toward the lens to drive the chip toward the lens, or shrink the airbag cavity toward the lens to drive the chip away from the lens.

2. The lens module according to claim 1, wherein: The adjusting member comprises: A temperature regulating member, electrically connected to the circuit board, for heating or cooling the airbag cavity; When the temperature regulating member supplies heat to the airbag cavity, the airbag cavity expands in a direction approaching the lens; when the temperature regulating member cools the airbag cavity, the airbag cavity contracts in a direction away from the lens.

3. The lens module according to claim 1 or 2, wherein: The support assembly also includes: A sealing portion, provided on the circuit board; An elastic support member, wherein the elastic support member is supported by the sealing portion, the elastic support member, the sealing portion and the circuit board together enclose the airbag cavity, and the chip is disposed on the elastic support member; When the airbag cavity expands, the elastic support member bulges toward the direction approaching the lens, and when the airbag cavity contracts, the elastic support member sinks toward the direction away from the lens.

4. The lens module according to claim 3, wherein: The support assembly also includes: A support column is arranged on the circuit board and is located in the airbag cavity.

5. The lens module according to claim 4, wherein: The airbag cavity has an initial state; When the airbag cavity is in the initial state, a gap exists between the elastic support member and an end of the support column away from the circuit board.

6. The lens module according to claim 4, wherein: There are multiple support columns, and the multiple support columns are arranged at intervals.

7. The lens module according to claim 3, wherein: The elastic support member comprises: An elastic support sheet and a hard support sheet are stacked, wherein the elastic support sheet protrudes from the edge of the hard support sheet along the circumference, a portion of the elastic support sheet protruding from the edge of the hard support sheet is connected to the sealing portion, and the chip is arranged on the hard support sheet; The portion of the elastic support sheet protruding from the hard support sheet can be deformed to drive the hard support sheet to move closer to or away from the lens.

8. The lens module according to claim 7, wherein: The hard supporting sheet is located on a side of the elastic supporting sheet close to the lens, and the chip is arranged on the hard supporting sheet.

9. A method for controlling a lens module, used for the lens module according to any one of claims 1 to 8, the method comprising: Obtaining status information of the lens module; Determine a height compensation amount between the chip and the lens according to the state information; According to the height compensation amount, the adjusting member is controlled to operate so that the airbag cavity drives the chip to move by the height compensation amount.

10. The control method of the lens module according to claim 9, wherein: After the step of controlling the adjusting member to work so that the airbag cavity drives the chip to move the height compensation amount, the method further includes: Return to the step of obtaining the status information of the lens module to perform a cyclic detection on the lens module.

11. The control method of the lens module according to claim 9, wherein: Before the step of obtaining the status information of the lens module, the method further includes: Acquire the on / off state of the electronic device, and when the electronic device is in the on state, proceed to the step of acquiring the state information of the lens module; or The number of times the lens module is used is obtained, and when the number of times used is greater than or equal to the target number of times, the step of obtaining the status information of the lens module is entered.

12. The control method of the lens module according to claim 9, wherein the electronic device comprises a display screen, wherein: The state information includes a distance value between the display screen and the lens.

13. A control device for a lens module, used for the lens module according to any one of claims 1 to 8, comprising: An acquisition module, used to acquire status information of the lens module; The control module is used to determine the height compensation amount between the chip and the lens according to the state information; and control the adjustment member to work according to the height compensation amount so that the airbag cavity drives the chip to move the height compensation amount.

14. An electronic device, comprising: The lens module according to any one of claims 1 to 8.

15. The electronic device according to claim 14, wherein: The lens module includes any one of a camera module and a fingerprint module.

16. A chip, comprising a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run a program or instruction to implement the control method of the lens module according to any one of claims 9 to 12. 17 . A computer program product, wherein the program product is stored in a non-volatile storage medium and is executed by at least one processor to implement the control method of the lens module as claimed in any one of claims 9 to 12.

18. A readable storage medium having a program or instruction stored thereon, wherein the program or instruction, when executed by a processor, performs the control method of the lens module as described in any one of 9 to 12.

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