Lighting device
The lighting device addresses the issue of vibrations affecting connecting portions by using a silicone rubber vibration damping member, effectively preventing loosening and ensuring reliable operation in vibrating environments.
Patent Information
- Application Number
- PCT/JP2024/042896
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-05
- Filing Date
- 2024-12-04
- Publication Date
- 2025-06-12
AI Technical Summary
Lighting devices installed in environments with vibrations, such as roads, experience issues with the connecting portions being affected by these vibrations, leading to potential loosening and reduced performance.
The lighting device incorporates a vibration damping member made of silicone rubber that covers at least a part of the enlarged diameter portion of the light source unit, effectively suppressing the influence of vibrations on the connecting portions.
The vibration damping member successfully prevents the loosening of connections due to external vibrations, ensuring the lighting device remains securely attached and functions properly even in vibrating environments.
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Figure JP2024042896_12062025_PF_FP_ABST
Abstract
Description
lighting equipment
[0001] The present invention relates to a lighting device.
[0002] 2. Description of the Related Art Lamps such as fluorescent lamps, high-pressure mercury lamps, metal halide lamps, and sodium lamps are widely used as lighting devices for roadways and the like.
[0003] Patent Document 1 describes a road lighting device that includes a plurality of LED elements, a sub-lens that focuses diffused light beams from the LED elements in the road width direction and thereby emits a fan-shaped focused light beam that spreads along the road longitudinal direction, and a main lens that is provided below the sub-lens and emits the focused light beam focused by the sub-lens toward the illumination area, and refracts part of the focused light beam along the road longitudinal direction and emits it in the direction of the far end area within the illumination area.
[0004] JP 2009-99492 A
[0005] The inventors have found through their research that when a lighting device is installed in an environment where vibrations occur, such as on a road, the vibrations affect the connecting parts of the lighting device. One example of an object of the present invention is to provide a lighting device that can suppress the effects of vibrations on the connecting parts.
[0006] According to the present invention, the following lighting device is provided.
[0007] [1] A lighting device comprising: a light source unit having a light-emitting module and a terminal electrically connected to the light-emitting module; a socket connected to the terminal and receiving the terminal; and a vibration-damping member covering the terminal and the socket, wherein the light source unit has an expanding portion in a region between the terminal and the light-emitting module or in the terminal, the diameter of which increases as the light-emitting module approaches the light-emitting module, and the vibration-damping member covers at least a portion of the expanding portion. [2] The lighting device described in [1], further comprising: a housing that houses the light-emitting module and has the expanding portion, the housing having a first opening, and the vibration-damping member not covering at least a portion of the first opening. [3] The lighting device described in [2], wherein the first opening is provided in the expanding portion, and the vibration-damping member has a second opening that overlaps at least a portion of the first opening. [4] The lighting device described in [2] or [3], wherein the housing further has a ventilation fan for ventilating the interior of the housing. [5] The lighting device described in [1] or [2], wherein the vibration-damping member includes silicone rubber. [6] The lighting device according to [1] or [2], wherein the light source unit includes a CSP in which an LED is incorporated and packaged to a chip size. [7] The lighting device according to [1] or [2], which is installed on a highway.
[0008] According to the present invention, there is provided a lighting device that can suppress the influence of vibration on a connecting portion.
[0009] 5 is a schematic diagram of an illumination device according to the present embodiment. FIG. 5 is a cross-sectional view taken along line A-A' in FIG. 1. FIG. 5 is a plan view of an illumination device according to the present embodiment as viewed from above. FIG. 5 is a side view of an illumination device according to the present embodiment. FIG. 5 is a perspective view of a light source unit according to the present embodiment. FIG. 5 is a perspective view of a light source unit with a light distribution adjustment unit removed. FIG. 5 is a cross-sectional view taken along line B-B' in FIG. 5. FIG. 5 is an enlarged view of a body on the terminal side. FIG. 5 is a view showing a state in which a terminal is screwed into a socket. FIG. 5 is a view showing an example of a vibration-damping member as viewed from the side. FIG. 5 is a view showing an example of a vibration-damping member as viewed from the socket side. FIG. 5 is a view showing a joint portion of a terminal having a vibration-damping member and a socket. FIG. 5 is a first view showing a modified example of a vibration-damping member. FIG. 5 is a second view showing a modified example of a vibration-damping member. FIG. 5 is a schematic view showing a relationship between a first opening and a second opening. FIG. 5 is a first view showing a method of attaching a vibration-damping member. FIG. 5 is a second view showing a method of attaching a vibration-damping member. FIG. 5 is a third view showing a method of attaching a vibration-damping member. FIG. 5 is a fourth view showing a method of attaching a vibration-damping member. FIG. 5 is a plan view of a light-emitting module as viewed from a perpendicular direction. FIG. 5 is a schematic view of a phosphor substrate. FIG. 5 is a view showing the light-emitting operation of a light-emitting module.
[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, like components are designated by like reference numerals, and the description thereof will be omitted as appropriate.
[0011] The lighting device 100 according to this embodiment will be described with reference to the drawings. FIG. 1 is an example of a plan view of the lighting device 100 according to this embodiment as seen from below. FIG. 2 is a cross-sectional view taken along line A-A' in FIG. 1. FIG. 3 is a plan view of the lighting device 100 as seen from above. FIG. 4 is a side view of the lighting device 100. The lighting device 100 is installed on a road, for example. An example of this road is a motorway such as an expressway, but is not limited to this.
[0012] As shown in FIG. 1, the lighting device 100 includes a housing and a light source unit 10 housed within the housing. As shown in FIGS. 1 to 4, the housing includes a lower main body case 101 and an upper main body case 102. By combining these, a space a for housing the light source unit 10 is formed inside, as shown in FIG. 2. As shown in FIGS. 3 and 4, the upper main body case 102 further includes a first case portion 102a located on the front side in the direction of light emission and a second case portion 102b located on the rear side. In FIG. 1, the left side of the lighting device 100 faces the road. Furthermore, a pole coupling portion 103 for coupling to a pole is provided on the right side of the lighting device 100.
[0013] As shown in Figures 1 and 2, a window 104 is provided on the lower surface 101b of the lower main body case 101. This allows light from the light source unit 10 to be irradiated onto the road surface. The window 104 can be made of a light-transmitting material, such as glass or resin. Here, light-transmitting means that the light emitted by the light source unit 10 passes through. A number of grooves 101a for heat dissipation are formed on the side surface of the lower main body case 101.
[0014] The components of the lighting device 100 will be described in detail below.
[0015] [Light Source Unit 10] FIG. 5 is a perspective view of the light source unit 10. FIG. 6 is a perspective view of the light source unit 10 with the luminous intensity distribution adjustment unit 14 removed, and the luminous intensity distribution adjustment unit 14. FIG. 7 is a cross-sectional view taken along the line B-B' of FIG. 5. As shown in FIGS. 5 and 6, the light source unit 10 includes a light-emitting module 12, a housing 11 that houses the light-emitting module 12, and a luminous intensity distribution adjustment unit 14 that is detachably attached to the housing 11. The housing 11 with the luminous intensity distribution adjustment unit 14 attached has a substantially cylindrical shape. However, this shape is not limited to a cylindrical shape. The housing 11 also includes a body 18 and a ventilation fan 19 attached to one end of the body 18. Note that the ventilation fan 19 is usually covered with a cover (not shown) to ensure the air volume of the ventilation fan 19, i.e., to control the air flow. The light source unit 10 also includes a terminal 18a at the other end of the body 18 for electrically connecting the light-emitting module 12. The weight of the light source unit is, for example, 200 g or more and 1000 g or less.
[0016] 5 and 6 , the body 18 has a generally cylindrical shape with the portion corresponding to the luminous intensity distribution adjustment unit 14 removed, and has a portion in the longitudinal center that is recessed radially inward. The bottom surface of the recessed portion forms a flat surface, and the light-emitting module 12 is mounted (fixed) to this bottom surface. The length of the body 18 is, for example, 100 mm or more and 250 mm or less, and the width W of the recessed portion is, for example, 60 mm or more and 150 mm or less. This recessed portion is covered by the luminous intensity distribution adjustment unit 14.
[0017] The body 18 has an internal space, and as shown in Fig. 7, a heat sink 16 is provided in the internal space. The heat sink 16 has a plurality of fins and is in contact with the phosphor substrate of the light-emitting module 12. Furthermore, a power supply drive circuit and a temperature sensor are provided in the internal space, and the drive circuit controls the drive of a ventilation fan 19, thereby controlling the temperature inside the light source unit 10 to be within a desired range.
[0018] The drive circuit includes an LED driver IC, a capacitor, etc., and controls the on-duty (off-duty) of the drive element Q through switching operation using PWM (Pulse Width Modulation) to control the current flowing through the LED chip to a desired value.
[0019] The body 18 can be made of resin or metal.
[0020] [Light distribution adjustment unit 14] The light distribution adjustment unit 14 is attached so as to cover the light-emitting module 12, and has a convex shape that faces outward from the light-emitting module 12 side. That is, the outer surface of the light distribution adjustment unit 14 has a shape that projects outward from the light-emitting module 12 side. The relationship between the outer and inner surfaces of the light distribution adjustment unit 14 is arbitrary, but it is preferable that it has a so-called concave lens shape. This makes it possible to diffuse the light emitted from the light-emitting module 12 and emit (irradiate) it outward.
[0021] The shape of the light distribution adjuster 14 may be a curved shape such as a dome shape, a cylindrical shape, or a Fresnel lens shape.
[0022] The light distribution adjustment unit 14 receives light emitted from the light-emitting module 12 and emits the received light to the outside. Examples of the light distribution adjustment unit 14 include a transparent cover and a transparent lens. The light distribution adjustment unit 14 can be made of a material that is transparent to the emission wavelength of the light-emitting diode elements (LEDs, etc.). Examples of such transparent materials include thermoplastic resin, thermosetting resin, and glass, and it is preferable that the material has high heat resistance so as to be able to withstand the temperature rise inside the light source unit 10 due to heat generation by the light-emitting diode elements.
[0023] Furthermore, light distribution adjustment section 14 is detachable from housing 11 of light source unit 10. Specific means for configuring light distribution adjustment section 14 to be detachable include, for example, providing claw portions (not shown) on light distribution adjustment section 14 and providing an engagement portion (not shown) made up of a notch, recess, or protrusion on body 18 of light source unit 10.
[0024] Furthermore, from the viewpoint of moldability, light distribution adjustment unit 14 is preferably made of a thermoplastic resin or a thermosetting resin, such as polycarbonate, polyimide, polyacrylate, polysulfone, polyarylsulfone, aromatic polyamide, aromatic polyetheramide, polyphenylene sulfide, polyaryletherketone, polyamideimide, liquid crystalline polyester, or polytetrafluoroethylene. Light distribution adjustment unit 14 may contain a diffusing agent, an ultraviolet absorber, an antioxidant, or the like. When light distribution adjustment unit 14 is made of resin, it can be manufactured by injection molding, compression molding, transfer molding, cast molding, or the like.
[0025] [Terminal 18a] The terminal 18a has a screw thread 3 on its side, which allows it to be screwed into a screw hole of a socket 200 provided on the support column coupling portion 103 side inside the lower main body case 101. In this way, the light source unit 10 can be removably attached to the lower main body case 101, and further, the screwed terminal 18a is electrically connected to the light-emitting module 12.
[0026] FIG. 8 shows an enlarged view of the body portion 18 on the terminal 18a side. As shown in FIG. 8 , the region of the body portion 18 between the terminal 18a and the light-emitting module 12 includes an expanded diameter portion 18b whose diameter expands as it approaches the light-emitting module 12. The angle θ1 between the side surface of the expanded diameter portion 18b and the longitudinal direction of the body portion 18 is preferably, for example, 60° to 80° or 30° to 70°. Also, as shown in FIG. 8 , the expanded diameter portion 18b may have first openings 1 for ventilating the interior of the housing 11. The first openings 1 may be arranged at equal intervals around the circumference of the expanded diameter portion 18b, or may be arranged irregularly. While a larger area of the first openings 1 is preferable from the viewpoint of ventilation inside the housing 11, it is preferable that the area of the first openings 1 be 50% to 90% of the entire area of the expanded diameter portion 18b, taking into account the mechanical strength of the housing 11.
[0027] 9 shows the state in which the terminal 18a is screwed into the socket 200. The socket 200 is provided, for example, on the support column coupling portion 103 side of the lower main body case 101 in a state in which it is connected to a power source. The socket 200 has a concave shape, and inside the concave shape there is a screw hole for screwing onto the thread 3 of the terminal 18a, and is electrically connected to the screwed terminal 18a.
[0028] In this way, power is supplied to the light-emitting module 12. However, a simple screw connection between the terminal 18a and the socket 200, as shown in Fig. 9, is prone to loosening due to external vibrations. The lighting device 100 according to this embodiment can solve this problem by including the vibration-damping member 300 described below.
[0029] [Vibration Damping Member 300] Fig. 10 is an example of the vibration damping member 300 as seen from the side. Fig. 11 is a view of the vibration damping member 300 as seen from the socket 200 side. As shown in Fig. 10, the vibration damping member 300 may have a socket covering portion 300a, a tapered portion 300b, and a barrel covering portion 300c. The socket covering portion 300a covers at least a portion of the socket 200, the tapered portion 300b covers at least a portion of the expanded diameter portion 18b, and the barrel covering portion 300c covers at least a portion of the barrel 18. The socket covering portion 300a and the barrel covering portion 300c are substantially cylindrical. The inner diameter of the socket covering portion 300a is smaller than the inner diameter of the barrel covering portion 300c. The tapered portion 300b connecting these portions has a tapered shape. The edge of the tapered portion 300b may be curved or straight when viewed from the side, as shown in FIG.
[0030] The shape of the vibration-damping member 300 is designed to match the sizes of the body 18, the expanded diameter portion 18b, and the socket 200. The inner diameter W1 of the socket covering portion 300a is designed to be, for example, 0.7 to 0.9 times the width of the socket 200, and the inner diameter W2 of the body covering portion 300c is designed to be, for example, 0.7 to 0.9 times the width of the body 18. This allows the vibration-damping member 300 to fasten and tightly attach the body 18, the expanded diameter portion 18b, and the socket 200. Furthermore, it is preferable that the length T3 of the body covering portion 300c be designed to be a length that does not overlap the light distribution adjustment portion 14 when the vibration-damping member 300 is attached. Specifically, for example, the length T1 of the socket covering portion 300a is 30 mm to 80 mm. Furthermore, the length T3 of the body covering portion 300c is 10 mm to 30 mm. When viewed from the side, the angle θ2 of the tapered portion 300b with respect to the horizontal direction at the center in the height direction is, for example, not less than 25° and not more than 80°.
[0031] Fig. 12 shows the joint between the terminal 18a and the socket 200, which has the vibration-damping member 300. By including the vibration-damping member 300, the lighting device 100 according to this embodiment can prevent loosening of the screw engagement between the terminal 18a and the socket 200 due to vibration. Note that Fig. 12 shows the outline of the vibration-damping member 300, and it is preferable that the socket covering portion 300a and the socket 200 are in close contact with each other, and it is also preferable that the body covering portion 300c and the body 18 are in close contact with each other. Furthermore, the tapered portion 300b may also be in close contact with at least a portion of the expanded diameter portion 18b.
[0032] The thickness of the vibration damping member 300 is, for example, 2 mm to 6 mm. As shown in Fig. 10, the edge portions of the socket covering portion 300a and the trunk covering portion 300c may be thicker than the other regions.
[0033] 13 and 14 show modified examples of the vibration damping member 300. The vibration damping member 300 shown in Fig. 13 does not include a trunk covering portion 300c. The vibration damping member 300 covers only a portion of the enlarged diameter portion 18b, and does not cover at least a portion of the first opening 1. This makes it possible to effectively ventilate the inside of the housing 11 while preventing the screw engagement between the terminal 18a and the socket 200 from loosening.
[0034] The vibration-damping member 300 shown in FIG. 14 has a second opening 2 and a connection portion 4 that connects the body portion 18 and the terminal 18a. At least a portion of the second opening 2 of the vibration-damping member 300 overlaps at least a portion of the first opening 1 of the enlarged diameter portion 18b, thereby preventing loosening of the screw connection between the terminal 18a and the socket 200 and effectively ventilating the interior of the housing 11. While it is preferable to design the vibration-damping member 300 so that the entire area of the first opening 1 of the enlarged diameter portion 18b overlaps the second opening 2 of the vibration-damping member 300, from the viewpoint of the mechanical strength of the vibration-damping member 300, the connection portion 4 may be designed to overlap a portion of the first opening 1. The vibration-damping member 300 is designed, for example, so that the area of the second opening 2 is 0.8 to 1.2 times the area of the connection portion 4.
[0035] FIG. 15 is a schematic diagram showing the relationship between the first opening 1 and the second opening 2 in the expanded diameter portion 18b shown in FIG. 14 . In the example shown in FIG. 15 , both the first opening 1 and the second opening 2 are trapezoidal. The maximum circumferential length T21 of the second opening 2 is longer than the maximum circumferential length T11 of the first opening 1, and the radial length T12 of the first opening 1 is longer than the radial length T22 of the second opening 2. However, the length T11 may be longer than the length T21, or the length T22 may be longer than the length T12. It is more preferable that the number of second openings 2 corresponding to each first opening 1 is the same as the number of first openings 1.
[0036] The material that constitutes the vibration-damping member 300 is not particularly limited as long as it has flexibility, and examples thereof include elastomers such as fluororubber and silicone rubber.
[0037] The vibration-damping member 300 can be manufactured by molding the above-mentioned materials using a molding method such as transfer molding, 3D printing, RIM molding, or injection molding.
[0038] 16 to 19, a method for attaching the vibration damping member 300 will be described. First, as shown in FIG. 16, the socket covering portion 300a of the vibration damping member 300 is arranged to cover the socket 300.
[0039] Next, as shown in Figure 17, the vibration damping member 300 is turned back toward the socket 300 so that the inner surface of the vibration damping member 300 faces outward. For example, the portion of the vibration damping member 300 located at the tapered portion 300b is bent outward, and the vibration damping member 300 is turned back so that the inner surface of the trunk covering portion 300c faces outward. The shaded portion in Figure 17 indicates the inner surface of the vibration damping member 300.
[0040] Next, as shown in Fig. 18, the threads 3 of the terminal 18a are screwed into the screw holes of the socket 300. Thereafter, as shown in Fig. 19, the turned-up portion is returned to its original position, thereby allowing the vibration damping member 300 to be attached.
[0041] [Light-emitting module 12] The light-emitting module 12 is not particularly limited as long as it can emit light, and a fluorescent lamp, a high-pressure mercury lamp, a metal halide lamp, a sodium lamp, or the like can be used, but it is preferable that the light-emitting module 12 is configured from a phosphor substrate 20 and a plurality of light-emitting elements (LED chips) 30 mounted on the phosphor substrate 20. In the following explanation, the light-emitting module 12 will be described as being configured from a phosphor substrate 20 and a plurality of light-emitting elements (LED chips) 30 mounted on the phosphor substrate 20.
[0042] Fig. 20 is a plan view of the light-emitting module 12 as viewed from a perpendicular direction, and Fig. 21 is a cross-sectional view taken along the line DD' in Fig. 20. As shown in Fig. 20, the light-emitting module 12 has a plurality of light-emitting elements 30 arranged in a lattice pattern on a phosphor substrate 20. However, the arrangement of the light-emitting elements 30 is not limited to a lattice pattern.
[0043] [Phosphor Substrate 20] A plurality of light-emitting elements 30 are arranged on the phosphor substrate 20. The phosphor substrate 20 serves to hold these elements. As shown in FIG. 21 , the phosphor substrate 20 includes a phosphor layer 21, a circuit pattern layer 22, an insulating layer 23, and a back pattern layer 24. These layers are stacked in this order starting from the side on which the light-emitting elements 30 are provided. The phosphor layer 21 is made of a phosphor material and serves to emit light using light emitted by the light-emitting elements 30 as excitation light. The circuit pattern layer 22 and the back pattern layer 24 are provided to supply power to the light-emitting elements 30. The insulating layer 23 is made of an insulating material and supports the above-mentioned components while preventing the circuit pattern layers 22 and the back pattern layers 24 from shorting out with each other.
[0044] <Phosphor Layer 21> The phosphor layer 21 is formed so as to cover the circuit pattern layer 22. The phosphor layer 21 is formed, for example, in at least a part of the area of the circuit pattern layer 22 excluding the area where the light emitting elements 30 are arranged. In other words, the phosphor layer 21 is formed in the area surrounding the area where the light emitting elements 30 are arranged in the circuit pattern layer 22. It is preferable that the phosphor layer 21 is formed in most of the above-mentioned area.
[0045] The phosphor layer 21 is, for example, composed of a phosphor and a binder, which will be described later. The phosphor contained in the phosphor layer 21 is fine particles dispersed and held in the binder, and has the property of exciting the light emitted from the light-emitting element 30 using the light as excitation light. The binder may be, for example, an epoxy-based, acrylate-based, or silicone-based binder, as long as it has insulating properties equivalent to those of the binder contained in the solder resist.
[0046] The phosphor contained in the phosphor layer 21 of this embodiment may be, for example, one or a combination of two or more selected from an α-type sialon phosphor containing Eu, a β-type sialon phosphor containing Eu, a CASN phosphor containing Eu, and a SCASN phosphor containing Eu. In addition to these, phosphors such as YAG, LuAG, BOS, and other visible light-excited phosphors may also be included.
[0047] The α-sialon phosphor containing Eu has the general formula: M x EU y Si 12-(m+n) Al (m+n) O n N 16-n In the above general formula, M is one or more elements selected from the group consisting of Li, Mg, Ca, Y, and lanthanide elements (excluding La and Ce), including at least Ca, and when the valence of M is a, ax+2y=m, where x is 0<x≦1.5, 0.3≦m<4.5, and 0<n<2.25.
[0048] The β-type sialon phosphor containing Eu has the general formula: Si 6-z Al z O z N 8-z (z=0.005 to 1) and divalent europium (Eu 2+ ) is a solid solution phosphor.
[0049] Furthermore, examples of nitride phosphors include Eu-containing CASN phosphors and Eu-containing SCASN phosphors.
[0050] A CASN phosphor containing Eu (an example of a nitride phosphor) is, for example, represented by the formula CaAlSiN 3 :Eu 2+ and Eu 2+ The term "CASN phosphor" refers to a red phosphor that uses as an activator an alkaline earth silicon nitride crystal as a matrix. Note that the definition of a CASN phosphor containing Eu in this specification excludes a SCASN phosphor containing Eu.
[0051] A SCASN phosphor containing Eu (an example of a nitride phosphor) is, for example, represented by the formula (Sr, Ca)AlSiN 3 :Eu 2+ and Eu 2+ This refers to a red phosphor that uses as an activator an alkaline earth silicon nitride crystal as a matrix.
[0052] <Circuit Pattern Layer 22, Back Pattern Layer 24> The circuit pattern layer 22 according to this embodiment is a conductive layer formed on the front side of the insulating layer 23, and the back pattern layer 24 is a conductive layer provided on the back side of the insulating layer 23. The materials constituting the circuit pattern layer 22 and the back pattern layer 24 are not particularly limited as long as they are conductive, and are, for example, copper.
[0053] The area on the surface of the insulating layer 23 where the circuit pattern layer 22 is arranged is, for example, 60% or more of the area of the surface of the insulating layer 23 .
[0054] <Insulating Layer 23> The insulating layer 23 according to this embodiment maintains each component and also plays a role in preventing short circuits between the circuit pattern layers 22 and the back surface pattern layers 24. The material constituting the insulating layer 23 is not particularly limited as long as it has insulating properties, but for example, an insulating material such as a prepreg obtained by impregnating a fiber substrate such as glass cloth with a resin such as bismaleimide resin can be used.
[0055] [Light-emitting element 30] The light-emitting element 30 includes general light-emitting elements such as fluorescent lamps and LEDs, but a CSP (chip scale package) incorporating a flip-chip LED 32 (hereinafter referred to as LED 32) is particularly preferred (see FIG. 21). As shown in FIG. 21, the CSP is preferably such that the entire periphery (five sides) of the LED 32, excluding the bottom surface, is covered with a phosphor encapsulating layer 31 containing a phosphor. When covered with the phosphor encapsulating layer 31, the light from the LED 32 is color-converted by the phosphor of the phosphor encapsulating layer 31 and irradiated to the outside.
[0056] [Light Emitting Operation of Light Emitting Module 12] Next, the light emitting operation of the lighting device for growing a plant 10 of this embodiment will be described with reference to FIG.
[0057] First, when an activation switch (not shown) that activates the plurality of light-emitting elements 30 is turned on, power supply from an external power source (not shown) to the circuit pattern layer 22 begins via a connector (not shown), and the plurality of light-emitting elements 30 emit light L radially, and part of the light L reaches the phosphor layer 21 of the phosphor substrate 20. Below, the behavior of the emitted light L will be explained according to the traveling direction of the light L.
[0058] A portion of the light L emitted from each light-emitting element 30 is emitted to the outside without entering the phosphor layer 21. In this case, the wavelength of the light L remains the same as the wavelength of the light L when it is emitted from each light-emitting element 30.
[0059] Furthermore, a portion of the light L emitted from the light-emitting element 30 is incident on the phosphor layer 21. Here, the "portion of light L" includes light that has not been color-converted by the phosphor of the light-emitting element 30 (phosphor sealing layer 31), i.e., light from the LED 32 itself (e.g., blue light (wavelength of approximately 470 nm)). When a portion of the light L emitted from the light-emitting element 30 collides with the phosphor dispersed in the phosphor layer 21, the phosphor is excited and emits light. As a result, a portion of the energy of the light L is used to excite the phosphor, resulting in a loss of some of the energy of the light L. As a result, the wavelength of the light L is converted (wavelength conversion is performed). For example, depending on the type of phosphor in the phosphor layer 21 (e.g., when red-based CASN is used as the phosphor), the wavelength of the light L becomes longer (e.g., 650 nm). Furthermore, while some of the light emitted by the excitation of the phosphor layer 21 exits the phosphor layer 21 as is, a portion of the light travels toward the underlying circuit pattern layer 22. A portion of the light is reflected by the circuit pattern layer 22 and emitted to the outside. As described above, when the wavelength of light emitted by the excitation of the phosphor in the phosphor layer 21 is 600 nm or longer, a reflective effect can be achieved even if the circuit pattern layer 22 is made of Cu. Note that the wavelength of the light L may differ from the above example depending on the type of phosphor in the phosphor layer 21, but in either case, wavelength conversion of the light L is achieved. For example, when the wavelength of light emitted by the excitation of the phosphor layer 21 is less than 600 nm, a reflective effect can be achieved by plating the circuit pattern layer 22 or its surface with Ag (plated). Alternatively, a similar effect can be achieved by providing a white reflective layer below the phosphor layer 21 (on the insulating layer 23 side). The reflective layer can be formed, for example, from a white paint such as titanium oxide filler.
[0060] By the above operation, the light emitted from the light-emitting module 12 passes through the light distribution adjustment unit 14 and is irradiated from the lighting device 100.
[0061] Although the embodiments of the present invention have been described above with reference to the drawings, these are merely examples of the present invention, and various other configurations can also be adopted.
[0062] As described above, the lighting device 100 according to this embodiment has the vibration-damping member 300 at the connecting portion between the threaded portion 18a and the socket 200, and therefore can suppress the influence of vibrations on the connecting portion.
[0063] The present invention will be described in detail below with reference to examples, but the present invention is not limited to the descriptions of these examples.
[0064] [Manufacturing of the vibration-damping member 300] The vibration-damping member 300 shown in Fig. 11 was manufactured by molding silicone rubber using a 3D printer. The dimensions were as follows: T1: 34.5, T2: 37, T3: 21.5, W1: 53, W2: 82, and average thickness: 2 to 3 mm.
[0065] [Evaluation] Next, an LED lamp (Retro Fit LED Lamp, manufactured by CS Corporation) was attached to a socket as is as a comparative example, and an LED lamp attached to a socket using the manufactured vibration-damping member 300 was prepared as an example. Then, with the socket fixed, vibrations of 800 vibrations per minute and an amplitude of 3 mm were applied for 5 minutes to check for loosening of the threaded connection between the LED lamp and the socket for the example and comparative example. As a result, the LED lamp in the comparative example was rotated by approximately 90 degrees, while no loosening of the threaded connection was confirmed for the example. Furthermore, it was confirmed that the example continued to light up without any abnormalities even after the vibrations were applied.
[0066] As described above, it has been confirmed that the present invention provides a lighting device that can suppress the influence of vibrations on the connecting portion.
[0067] Although the embodiments and examples of the present invention have been described with reference to the drawings, these are merely examples of the present invention, and various configurations other than those described above can also be adopted.
[0068] This application claims priority based on Japanese Patent Application No. 2023-205484, filed December 5, 2023, the disclosure of which is incorporated herein by reference in its entirety.
[0069] REFERENCE SIGNS LIST 100 Illumination device 101 Lower main body case 101a Groove 102 Upper main body case 102a First case portion 102b Second case portion 103 Post joint portion 104 Window portion 10 Light source unit 11 Main body 12 Light-emitting module 14 Light distribution adjustment portion 14a Light-receiving surface 14b Emission surface 16 Heat sink 18 Body portion 18a Screw portion 19 Ventilation fan 20 Phosphor substrate 21 Phosphor layer 22 Circuit pattern layer 23 Insulation layer 24 Back surface pattern layer 30 Light-emitting element 32 LED
Claims
1. A lighting device comprising: a light source unit having a light-emitting module and a terminal electrically connected to the light-emitting module; a socket connected to and receiving the terminal; and a vibration-damping member covering the terminal and the socket, wherein the light source unit has an expanding portion in a region between the terminal and the light-emitting module or in the terminal, the expanding portion expanding in diameter as it approaches the light-emitting module, and the vibration-damping member covers at least a portion of the expanding portion.
2. The lighting device according to claim 1, further comprising a housing that houses the light-emitting module and has the expanded diameter portion, the housing having a first opening, and the vibration-damping member does not cover at least a portion of the first opening.
3. The lighting device according to claim 2, wherein the first opening is provided in the expanded diameter portion, and the vibration-damping member has a second opening that overlaps with at least a portion of the first opening.
4. The lighting device according to claim 2 or 3, wherein the housing further comprises a ventilation fan for ventilating the inside of the housing.
5. The lighting device according to claim 1 or 2, wherein the vibration-damping member includes silicone rubber.
6. The lighting device according to claim 1 or 2, wherein the light source unit includes a CSP in which an LED is incorporated and packaged to a chip size.
7. The lighting device according to claim 1 or 2, which is installed on a highway.
Citation Information
Patent Citations
LED lamp
JP2016119228A
LED lamp
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Light source unit and road illumination device equipped with light source unit
WO2022202399A1