Slidable electronic device including contact structure for antenna

Abstract

This electronic device may comprise: a housing including a first housing part, which includes a conductive portion, and a second housing part, which is slidably engaged with the first housing part; a flexible display including a bendable part that is configured so that at least a portion bends toward the conductive portion within the first housing part due to the sliding of the second housing part; a printed circuit board that is disposed inside the first housing part and includes a through-hole; and a conductive plate that is disposed between the printed circuit board and the conductive portion. The conductive plate can be electrically connected to the conductive portion within a region overlapping the through-hole.

Description

A slideable electronic device comprising a contact structure for an antenna

[0001] The present disclosure relates to a sliderable electronic device including a contact structure for an antenna.

[0002] Beyond the typical bar-type, electronic devices with a sliderable form factor that can expand or contract are being developed. These sliderable electronic devices can offer high usability and portability through flexible displays that can expand the screen. Meanwhile, the sliderable electronic devices can incorporate a conductive portion of the housing that forms the device's exterior as an antenna for wireless communication.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] In one embodiment, an electronic device may include a housing including a first housing part including a conductive portion and a second housing part slidably engaged to the first housing part, a flexible display including a bendable part configured to bend at least a portion of the first housing part toward the conductive portion upon sliding of the second housing part, a printed circuit board disposed within the first housing part and including a through hole, and a conductive plate disposed between the printed circuit board and the conductive portion. The conductive plate may be electrically connected to the conductive portion within a region overlapping the through hole.

[0005] In one embodiment, an electronic device (101) may include a first housing part including a first edge part including a first conductive portion, and a support part extending inwardly from the first edge part and including a second conductive portion, a second housing part slidably coupled to the first housing part, a first part having a front surface that is visible from the outside of the electronic device and expands or contracts according to sliding of the second housing part, a flexible display including a bending part in the first housing part that extends from the first part and bends toward the first edge part, a printed circuit board disposed on the support part and including a first through hole and a second through hole, a wireless communication circuit, a first conductive plate electrically connecting the wireless communication circuit and the first conductive portion of the first edge part, and a second conductive plate electrically connecting a ground of the printed circuit board and the second conductive portion of the support part. The first conductive plate may be disposed on the printed circuit board and connected to the first conductive portion within an area overlapping the first through hole. The second conductive plate may be disposed on the printed circuit board and connected to the second conductive portion within an area overlapping the second through hole.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2A is a top plan view of an exemplary electronic device in a first state.

[0008] FIG. 2b is a bottom view of an exemplary electronic device within the first state.

[0009] Figure 2c is a plan view of an exemplary electronic device within a second state.

[0010] FIG. 2d is a bottom view of an exemplary electronic device within the second state.

[0011] FIG. 3A is an exemplary exploded perspective view of an electronic device according to one embodiment.

[0012] FIG. 3b is an exemplary exploded perspective view of an electronic device according to one embodiment.

[0013] FIG. 3c is an exemplary exploded perspective view of an electronic device according to one embodiment.

[0014] FIG. 4a is an exemplary plan view of a frame (311) and a second PCB (352) according to one embodiment.

[0015] FIG. 4b is an exemplary plan view of a frame (311) and a second PCB (352) according to one embodiment.

[0016] FIG. 5A is an exemplary drawing showing an electrical contact structure according to one embodiment.

[0017] FIG. 5b is a plan view showing a conductive plate according to one embodiment.

[0018] FIG. 6A is a plan view showing examples of conductive plates according to various embodiments.

[0019] FIG. 6b is a plan view showing examples of conductive plates according to various embodiments.

[0020] FIG. 6c is a plan view showing examples of conductive plates according to various embodiments.

[0021] FIG. 7a is a plan view showing examples of conductive plates according to various embodiments.

[0022] FIG. 7b is a plan view showing examples of conductive plates according to various embodiments.

[0023] FIG. 7c is a plan view showing examples of conductive plates according to various embodiments.

[0024] FIG. 8 is an exemplary drawing showing an electrical contact structure according to one embodiment.

[0025] FIG. 9a is a plan view showing a second PCB according to one embodiment.

[0026] FIG. 9b is a plan view showing a second PCB according to one embodiment.

[0027] FIG. 9c is an exemplary drawing showing a frame according to one embodiment.

[0028] FIG. 10A is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0029] FIG. 10b is an exemplary cross-sectional view of an electronic device according to one embodiment.

[0030] FIG. 11 is a drawing showing an electronic device according to a comparative example and an electronic device according to an embodiment.

[0031] Figure 12 is a graph showing the radiation efficiency of an electronic device according to an embodiment and an electronic device according to a comparative example.

[0032] FIG. 13 is a drawing showing a second PCB according to one embodiment.

[0033] FIG. 14 is a drawing showing a second PCB according to one embodiment.

[0034] FIG. 15 is a drawing showing a second PCB according to one embodiment.

[0035] FIG. 16 is a drawing showing a manufacturing process of an electronic device according to one embodiment.

[0036] FIG. 17 is a diagram illustrating a reworking process of an electronic device according to one embodiment.

[0037] FIG. 18 is a diagram illustrating a reworking process of an electronic device according to one embodiment.

[0038] FIG. 19 is a drawing showing a manufacturing process of an electronic device according to one embodiment.

[0039] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0040] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0041] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0042] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0043] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0044] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0045] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0046] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0047] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0048] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0050] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0052] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0053] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0054] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0055] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0056] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0057] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0058] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0059] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0060] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0061] FIG. 2A is a top plan view of an exemplary electronic device in a first state. FIG. 2B is a bottom view of the exemplary electronic device in the first state. Referring to FIGS. 2A and 2B , an electronic device (101) according to an embodiment may include a housing (201), a display (230) (e.g., the display module (160) of FIG. 1 ), a first image sensor (250-1), and a second image sensor (250-2).

[0062] In one embodiment, the housing (201) may include a structure whose size can be changed. For example, the housing (201) may include a first housing part (210) and a second housing part (220) that are relatively movable to each other. The size of the housing (201) may be changed depending on the relative movement of the first housing part (210) and the second housing part (220). The description of the relative movement of the first housing part (210) and the second housing part (220) provided below is based on the movement of the second housing part (220) with respect to the stationary first housing part (210).

[0063] In one embodiment, the second housing part (220) can move relative to the first housing part (210). For example, the second housing part (220) can move relative to the first housing part (210) in a first direction (261) or a second direction (262). For example, the first direction (261) can be substantially parallel to a longitudinal direction (e.g., y-axis direction) of the electronic device (101), and the second direction (262) can be a direction opposite to the first direction (261). In FIG. 2A, the electronic device (101) in the first state is illustrated as having a rectangular shape in which the longitudinal direction (e.g., y-axis direction) is longer than the width direction (e.g., x-axis direction), but is not limited thereto. For example, the longitudinal direction and the width direction of the electronic device (101) in the first state may be substantially the same, or the width direction may be greater than the longitudinal direction.

[0064] In one embodiment, the first housing part (210) may include a first plate (212). The second housing part (220) may include a second plate (224). The first plate (212) and the second plate (224) may at least partially form a rear surface (e.g., a surface facing the fourth direction (264)) of the electronic device (101) in the first state.

[0065] In one embodiment, the display (230) may be provided within the housing (201). For example, the display (230) may be at least partially disposed within a space defined by the housing (201). In one embodiment, the display (230) may include a display area that is visible from outside the electronic device (101) (e.g., through the front of the electronic device (101)) and on which visual information is output. In one embodiment, the display (230) may include a flexible display or a rollable display that is at least partially bendable or rollable.

[0066] In one embodiment, the first image sensor (250-1) (e.g., the camera module (180) of FIG. 1) may be arranged with respect to the display area (230a). For example, the first image sensor (250-1) may receive light through a portion of the display area (230a) or an opening formed within the display area (230a). In one embodiment, the first image sensor (250-1) may be disposed on or within the second housing part (220) so as to face a third direction (263). The third direction (263) may be perpendicular to the first direction (261) and the second direction (262). The third direction (263) may be substantially parallel to a thickness direction (e.g., z-axis direction) of the electronic device (101). The first image sensor (250-1) may be implemented as one image sensor or as a plurality of image sensors.

[0067] In one embodiment, the second image sensor (250-2) (e.g., the camera module (180) of FIG. 1) may be disposed on or within the second housing part (220) so as to face a fourth direction (264) opposite to the third direction (263). The second image sensor (250-2) may be exposed through an opening formed in the second plate (224) of the second housing part (220) so as to receive light from the outside. The second image sensor (250-2) may be implemented as one image sensor or as multiple image sensors.

[0068] FIG. 2C is a plan view of an exemplary electronic device in a second state. FIG. 2D is a bottom view of the exemplary electronic device in the second state. Various states of the electronic device (101) will be described with reference to FIGS. 2C and 2D, along with FIGS. 2A and 2B.

[0069] In one embodiment, the electronic device (101) may include a plurality of states. For example, the electronic device (101) may include the first state (e.g., FIGS. 2A and 2B) and the second state (e.g., FIGS. 2C and 2D). Although not shown, the electronic device (101) may include intermediate states between the first state and the second state.

[0070] In one embodiment, the state of the electronic device (101) may change depending on the movement of the second housing part (220) with respect to the first housing part (210). For example, the electronic device (101) in the first state may change to the second state as the second housing part (220) moves in the first direction (261) with respect to the first housing part (210). For example, the electronic device (101) in the second state may change to the first state as the second housing part (220) moves in the second direction (262) with respect to the first housing part (210).

[0071] In one embodiment, within the first state, the second housing part (220) can move in a first direction (261) among the first direction (261) and the second direction (262). For example, within the first state, the second housing part (220) may not be able to move in the second direction (262). For example, within the first state, movement of the second housing part (220) in the second direction (262) may be restricted. Within the second state, the second housing part (220) may be able to move in a second direction (262) among the first direction (261) and the second direction (262). For example, within the second state, the second housing part (220) may not be able to move in the first direction (261). For example, within the second state, movement of the second housing part (220) in the first direction (261) may be restricted.

[0072] The first state may be referred to as a slide-in state or a closed state in that at least a portion of the second housing part (220) is retracted into the first housing part (210). The second state may be referred to as a slide-out state or an open state in that at least a portion of the second housing part (220) is withdrawn out of the first housing part (210).

[0073] In one embodiment, depending on the state of the electronic device (101), the size of the display area of ​​the display (230) visually exposed from the outside may vary. For example, in the first state, the display (230) may provide a display area (230a) having the smallest size. For example, in the second state, the display (230) may provide a display area (230c) having the largest size. The display area (230c) may include a display area (203b) in addition to the display area (230a). The display area (203b) may be positioned inside the housing (201) so as not to be exposed to the outside in the first state. As the state changes from the first state to the second state, the display area (203b) may be visually exposed to the outside of the electronic device (101).

[0074] The first state may be referred to as a reduced state in that the display (230) provides a display area (e.g., display area (230a)) of a smaller size than the second state. The second state may be referred to as an expanded state in that the display (230) provides a display area (e.g., display area (230c)) of a larger size than the first state.

[0075] In one embodiment, the first image sensor (250-1) may move together with the display area (230a) of the display (230) according to a change in the state of the electronic device (101). For example, when the state of the electronic device (101) changes from the first state to the second state, the first image sensor (250-1) may move with respect to the first housing part (210), but the relative position of the first image sensor (250-1) with respect to the display area (230a) may not change. In one embodiment, the second image sensor (250-2) may move together with the second housing part (220) according to a change in the state of the electronic device (101).

[0076] In one embodiment, the second housing part (220) may include a first plate (222). The first plate (212) of the first housing part (210), the first plate (222) of the second housing part (220), and the second plate (224) of the second housing part (220) may form a rear surface (e.g., a surface facing the fourth direction (264)) of the electronic device (101) in the second state. In one embodiment, the first plate (222) of the second housing part (220) may be covered by the first plate (212) of the first housing part (210) in the first state and may not be exposed to the outside. In one embodiment, the first plate (222) of the second housing part (220) may be exposed to the outside in the second state.

[0077] FIGS. 3A, 3B, and 3C are exemplary exploded perspective views of an electronic device according to one embodiment.

[0078] Referring to FIGS. 3a, 3b, and 3c, an electronic device (101) according to one embodiment may include a first printed circuit board (PCB) (350), a second PCB (352), a support member (331), and a driving unit (360).

[0079] In one embodiment, various components of the electronic device (101) may be arranged on the first PCB (350) and / or the second PCB (352). For example, at least one of the components of FIG. 1 (e.g., a processor (120) and a communication module (190)) may be arranged on the first PCB (350) and / or the second PCB (352).

[0080] In one embodiment, the first PCB (350) may be connected to the second PCB (352). For example, the first PCB (350) and the second PCB (352) may be connected via a connecting member (354), such as a flexible printed circuit board. The connecting member (354) may be at least partially bendable to accommodate a change in distance between the first PCB (350) and the second PCB (352) due to a change in the state of the electronic device (101). The electronic device (101) according to one embodiment may further include another PCB (356) for connecting the connecting member (354) and the second PCB (352). In one embodiment, the first PCB (350) may be disposed within the second housing part (220), and the second PCB (352) may be disposed within the first housing part (210).

[0081] In one embodiment, the first housing part (210) may include a first frame (311) and a frame cover (313). For example, the first frame (311) may at least partially form a side portion of the exterior of the electronic device (101). In one embodiment, at least a portion of the frame (311) may be positioned between the first plate (212) and the frame cover (313). For example, the frame cover (313) may be disposed on the front side of the frame (311) facing the third direction (263), and the first plate (212) may be disposed on the rear side of the frame (311) facing the fourth direction (264). The first plate (212) can be coupled to one side of the frame (311) (e.g., the fourth direction (264)), and the frame cover (313) can be coupled to the other side of the frame (311) (e.g., the third direction (263)).

[0082] In one embodiment, a second PCB (352) may be positioned between the frame (311) and the first plate (212). For example, the second PCB (352) may be positioned within the interior space of the frame (311). For example, the second PCB (352) may be positioned on a surface of the frame (311) facing the fourth direction (264). The second PCB (352) may be covered by the first plate (212).

[0083] In one embodiment, a battery (189) may be positioned between the frame (311) and the frame cover (313). For example, the battery (189) may be supported by the frame cover (313). In one embodiment, the frame cover (313) and the battery (189) may be at least partially surrounded by the display (230).

[0084] In one embodiment, the second housing part (220) may include a cover (321). The cover (321) may be at least partially wrapped by the display (230). For example, the cover (321) may be coupled with at least a portion of the display (230) that wraps around the cover (321) such that the display (230) moves along the second housing part (220).

[0085] In one embodiment, the cover (321) can support the first PCB (324). The cover (321) can support the second image sensor (250-2). The first plate (222) of the second housing part (220) can be disposed on a surface of the cover (321) facing the fourth direction (264). The first plate (222) can be coupled to the cover (321) so as to cover the first PCB (350). In one embodiment, the first plate (222) can have an opening formed therein, which is aligned with the second image sensor (250-2). In one embodiment, the second plate (224) can be disposed on the first plate (222). For example, the second plate (224) may be placed on a surface of the first plate (222) facing the fourth direction (264) and may be coupled to the first plate (222). The second plate (224) may include an area aligned with the second image sensor (250-2), and the area may be formed to be substantially transparent.

[0086] In one embodiment, the electronic device (101) may include a support member (331) for supporting at least a portion of the display (230). For example, the support member (331) may include a plurality of bars coupled to each other. The support member (331) may support the back surface of the display (230).

[0087] In one embodiment, the driving unit (360) may include a motor (361) and a rack gear (362). The motor (361) may be fixed to the cover (321) or the frame cover (313), and the rack gear (362) may be fixed to the frame cover (313) or the cover (321). A pinion gear (not shown) connected to the shaft of the motor (361) may be connected to the rack gear (362). Based on the driving force of the motor (361), the rack gear (362) may move in the first direction (261) or the second direction (262). By the movement of the rack gear (362), the second housing part (220) may move in the first direction (261) or the second direction (262).

[0088] FIGS. 4A and 4B are exemplary plan views of a frame (311) and a second PCB (352) according to one embodiment. FIG. 4A may be a view of the frame (311) viewed in a third direction (263). FIG. 4B may be a view of the frame (311) viewed in a fourth direction (264). FIGS. 4A and 4B illustrate a state in which the second PCB (352) is placed on the frame (311).

[0089] Referring to FIGS. 4A and 4B, the frame (311) may include a side wall portion (411) that at least partially forms the side surface of the electronic device (101) and a support portion (412) extending inwardly from the side wall portion (411).

[0090] In one embodiment, the frame (311) may include a conductive portion formed of a conductive material (e.g., a conductive metal), or a non-conductive portion formed of a non-conductive material (e.g., a plastic).

[0091] In one embodiment, the sidewall portion (411) can include at least one non-conductive portion disposed between a plurality of conductive portions. For example, the sidewall portion (411) can include a first conductive portion (421) and / or a second conductive portion (422). A first non-conductive portion (431) can be disposed between the first conductive portion (421) and the second conductive portion (422). The first non-conductive portion (431) can be in contact with the first conductive portion (421) and the second conductive portion (422). The first conductive portion (421) and the second conductive portion (422) can be at least partially spaced apart from each other with the first non-conductive portion (431) therebetween. In one embodiment, the plurality of conductive portions of the sidewall portion (411) can form an antenna for transmitting or receiving a radio frequency (RF) signal.

[0092] In one embodiment, the support portion (412) may extend from an inner surface of the side wall portion (411) (e.g., an opposite surface of the side of the electronic device (101)). The support portion (412) may be at least partially surrounded by the side wall portion (411).

[0093] In one embodiment, the support portion (412) may include a conductive portion (440) and a non-conductive portion (450). For example, the conductive portion (440) may extend from at least some of the plurality of conductive portions of the side wall portion (411). For a non-limiting example, the conductive portion (440) may be formed integrally with the plurality of conductive portions of the side wall portion (411). For a non-limiting example, the non-conductive portion (450) of the support portion (412) may be formed integrally with at least one non-conductive portion of the side wall portion (411).

[0094] In one embodiment, the support portion (412) may include at least one opening extending through the support portion (412). For example, the support portion (412) may include a first opening (412a), at least one second opening (412b), and / or a third opening (412c). The first opening (412a) may be formed along the sidewall portion (411). The first opening (412a) may be formed in the conductive portion (440) of the support portion (412). A non-conductive portion (450) may be disposed within the first opening (412a). The non-conductive portion (450) may partially fill the first opening (412a). For example, at least one second opening (412b) may be formed in a non-conductive portion (450) located within the first opening (412a). For example, a third opening (412c) may be formed in a conductive portion (440) of the support portion (412) so as to be spaced apart from the first opening (412a). For example, a portion of the second PCB (352) may pass through the third opening (412c). For example, but not limited to, an inner surface of the first opening (412a) may be formed only by the support portion (412), or may be formed by the support portion (412) and the side wall portion (411). For example, but not limited to, the inner surface of at least one second opening (412b) may be formed solely by the support portion (412), or may be formed by the support portion (412) and the side wall portion (411).

[0095] In one embodiment, the frame (311) (or support portion (412)) may include a first side (412A) facing the third direction (263) and a second side (412B) facing the fourth direction (264). For example, a second PCB (352) may be disposed on the second side (412B) of the support portion (412). The second PCB (352) may cover at least one second opening (412b) of the support portion (412). Within the at least one second opening (412b), a portion of the components disposed on the second PCB (352) may be positioned.

[0096] An electronic device (101) according to one embodiment may include an electrical contact structure for electrically connecting a conductive portion of a second PCB (352) and a frame (311). In FIG. 5A, the electrical contact structure is illustrated.

[0097] FIG. 5A is an exemplary diagram illustrating an electrical contact structure according to an embodiment. FIG. 5B is a plan view illustrating a conductive plate according to an embodiment. FIG. 5B may be a drawing projecting the conductive plate (510) along the direction (B) of FIG. 5A. In FIG. 5B, a through hole (560), a first conductive pad (551), and a second conductive pad (552) are illustrated together, overlapping the conductive plate (510).

[0098] Referring to FIGS. 5a and 5b, an electrical contact structure for electrically connecting the frame (311) and the second PCB (352) is illustrated.

[0099] In one embodiment, the second PCB (352) may include a first side (352A) and a second side (352B) opposite to the first side (352A). In one embodiment, the first side (352A) of the second PCB (352) may face the frame (311). For example, the first side (352A) of the second PCB (352) may face the second side (412B) of the frame (311). In one embodiment, a conductive plate (510) may be disposed on the first side (352A) of the second PCB (352).

[0100] In one embodiment, the frame (311) may include a conductive portion (520). The conductive portion (520) may include the conductive portions of the side wall portion (411) of FIG. 4A (e.g., the first and second conductive portions (421, 422)) and / or the conductive portion (440) of the support portion (412).

[0101] In one embodiment, the electronic device (101) may include a conductive plate (510) disposed between the second PCB (352) and the frame (311). At least a portion of the conductive plate (510) may be disposed between the second PCB (352) and the conductive portion (520). For example, the conductive plate (510) may be interposed between the second PCB (352) and the conductive portion (520). For example, the conductive plate (510) may be disposed between a surface of the second PCB (352) (e.g., the first surface (352A)) and a surface of the conductive portion (520) (e.g., the second surface (412B)). In one embodiment, the conductive plate (510) may include, but is not limited to, nickel silver, nickel-plated stainless steel, tin-plated stainless steel, or tin-plated steel. The conductive plate (510) may be referred to as a conductive sheet, a metal sheet, or a metal plate.

[0102] In one embodiment, the second PCB (352) may be formed with one or more through holes. For example, the second PCB (352) may include a through hole (560). The through hole (560) may extend from the first side (352A) to the second side (352B) of the second PCB (352). For example, the through hole (560) may overlap the conductive plate (510). The one or more through holes may include, for example, a plated through hole (PTH) or a non-plated through hole (NPTH).

[0103] In one embodiment, the second PCB (352) may include one or more conductive pads. For example, the one or more conductive pads may be positioned around a through hole (560). For example, the conductive pads may include a first conductive pad (551) and a second conductive pad (552). The through hole (560) may be positioned between the first conductive pad (551) and the second conductive pad (552).

[0104] In one embodiment, the conductive plate (510) may include a first portion (511) and a second portion (512). The first portion (511) may overlap or cover the through hole (560). The second portion (512) may extend from the first portion (511) so as to at least partially surround the first portion (511). The second portion (512) may face the first conductive pad (551) and the second conductive pad (552) of the second PCB (352).

[0105] In one embodiment, the conductive plate (510) can be electrically connected to the conductive portion (520) of the frame (311) within an area overlapping the through hole (560). For example, the first portion (511) of the conductive plate (510) can be electrically connected to the conductive portion (520).

[0106] In one embodiment, the conductive plate (510) can be connected or coupled to the conductive portion (520) within an area overlapping the through hole (560). In one embodiment, the conductive plate (510) can be joined to the conductive portion (520) within an area overlapping the through hole (560). For example, the first portion (511) of the conductive plate (510) can be physically and chemically bonded to the conductive portion (520). For example, the first portion (511) of the conductive plate (510) can be combined to the conductive portion (520) via a method such as laser welding. In one embodiment, the first portion (511) of the conductive plate (510) can be welded to the conductive portion (520) at at least one point. Figures 5a and 5b illustrate examples of joining at multiple points.

[0107] In one embodiment, the conductive plate (510) may include beads (570). The beads (570) may be formed by welding the conductive plate (510) and the conductive portion (520). Since the conductive plate (510) and the conductive portion (520) are joined through the through hole (560), the beads (570) may be positioned within the through hole (560). The beads (570) may not protrude outside the through hole (560).

[0108] In one embodiment, the conductive plate (510) may be electrically connected to the first conductive pad (551) and the second conductive pad (552) of the second PCB (352), respectively. For example, the second portion (512) of the conductive plate (510) may be electrically connected to the first conductive pad (551) and the second conductive pad (552). For example, the conductive plate (510) may be connected to the first conductive pad (551) and the second conductive pad (552) by a method such as soldering.

[0109] Referring to FIG. 5B, in one embodiment, the conductive plate (510) may have a rectangular shape including a long side (513) and a short side (515). A first conductive pad (551), a through hole (560), and a second conductive pad (552) may be positioned along the long side (513) of the conductive plate (510). However, the present invention is not limited thereto, and the conductive plate (510) may also have a polygonal shape other than a square or rectangle.

[0110] Referring to FIGS. 6a, 6b, 6c, 7a, 7b, and 7c below, various examples of conductive plates (510) and conductive pads and through holes overlapping the conductive plates are described.

[0111] Figures 6a, 6b, and 6c are plan views illustrating examples of conductive plates according to various embodiments. Figures 6a, 6b, and 6c illustrate a conductive plate and conductive pads and through holes overlapping the conductive plate, in the same manner as Figure 5b.

[0112] Referring to FIG. 6A together with FIG. 5B, the short side (515-1) of the conductive plate (510-1) may be formed to be longer than the short side (515) of the conductive plate (510). Accordingly, the length of the first conductive pad (551-1) along the short side (515-1) may be formed to be longer than the first conductive pad (551), and the length of the second conductive pad (552-1) along the short side (515-1) may be formed to be longer than the second conductive pad (552). The length of the short side (515-1) of the through hole (560-1) may be formed to be longer than the through hole (560). The area of ​​the through hole (560-1) overlapped with the conductive plate (510-1) may be larger than the through hole (560). Accordingly, the number of bonding points within the through hole (560-1) may be greater than the number of bonding points within the through hole (560).

[0113] Referring to FIG. 6A and FIG. 6B, the length of the long side (513-2) and the short side (515-2) of the conductive plate (510-2) may be substantially the same as the length of the long side (513-1) and the short side (515-1) of the conductive plate (510-1). Accordingly, the length of the short side (515-2) of the first conductive pad (551-2) may be substantially the same as that of the first conductive pad (551-1). The length of the short side (515-2) of the second conductive pad (552-2) may be substantially the same as that of the second conductive pad (552-1). The length of the long side (513-2) of the first conductive pad (551-2) may be smaller than that of the first conductive pad (551-1). The length of the second conductive pad (552-2) along the long side (513-2) may be shorter than that of the second conductive pad (552-1). The length of the through hole (560-2) along the short side (515-2) may be substantially the same as that of the through hole (560-1). The length of the through hole (560-2) along the long side (513-2) may be longer than that of the through hole (560-1). The area of ​​the through hole (560-2) overlapped with the conductive plate (510-2) may be larger than that of the through hole (560-1). Accordingly, the number of bonding points within the through hole (560-2) may be greater than the number of bonding points within the through hole (560-1).

[0114] Referring to FIG. 6C together with FIG. 6B, the length of the long side (513-3) and the short side (515-3) of the conductive plate (510-3) may be substantially the same as the length of the long side (513-2) and the short side (515-2) of the conductive plate (510-2). The length of the short side (515-3) of the first conductive pad (551-3) may be substantially the same as that of the first conductive pad (551-2). The length of the short side (515-3) of the second conductive pad (552-3) may be substantially the same as that of the second conductive pad (552-2). The length of the long side (513-3) of the first conductive pad (551-3) may be smaller than that of the first conductive pad (551-2). The length of the second conductive pad (552-3) along the long side (513-3) may be shorter than that of the second conductive pad (552-2). The length of the through hole (560-3) along the short side (515-3) may be substantially the same as that of the through hole (560-2). The length of the through hole (560-3) along the long side (513-3) may be longer than that of the through hole (560-2). The area of ​​the through hole (560-3) overlapped with the conductive plate (510-3) may be larger than that of the through hole (560-2). Accordingly, the number of bonding points within the through hole (560-3) may be greater than the number of bonding points within the through hole (560-2). In one embodiment, as the number of bonding points increases, the bonding strength may be improved.

[0115] Figures 7a, 7b, and 7c are plan views illustrating examples of conductive plates according to various embodiments. Figures 7a, 7b, and 7c illustrate a conductive plate and conductive pads and through holes overlapping the conductive plate, in the same manner as Figure 5b.

[0116] Referring to FIG. 7A together with FIG. 5B, the length of the short side (515-4) and the long side (513-4) of the conductive plate (510-4) may be substantially the same as the length of the short side (515) and the long side (513) of the conductive plate (510). The length of the first conductive pad (551-4) along the short side (515-4) may be substantially the same as the length of the first conductive pad (551). The length of the first conductive pad (551-4) along the long side (513-4) may be smaller than the first conductive pad (551). The length of the second conductive pad (552-4) along the short side (515-4) may be substantially the same as the length of the second conductive pad (552). The length along the long side (513-4) of the second conductive pad (552-4) may be smaller than that of the second conductive pad (552).

[0117] According to one embodiment, the second PCB (352) may include a first through hole (761), a second through hole (762), and a third conductive pad (753). The first through hole (761), the second through hole (762), and the third conductive pad (753) may be positioned between the first conductive pad (551-4) and the second conductive pad (552-4) and may overlap the conductive plate (510-4). The third conductive pad (753) may be positioned between the first through hole (761) and the second through hole (762). For example, unlike a plurality of welding points formed in the through hole (560), one welding point may be formed in each of the first through hole (761) and the second through hole (762).

[0118] Referring to FIG. 7A and FIG. 7B, in one embodiment, the length of the long side (513-5) of the conductive plate (510-5) may be substantially the same as that of the conductive plate (510-4). The length of the short side (515-5) of the conductive plate (510-5) may be greater than that of the conductive plate (510-4).

[0119] In one embodiment, the length of the first conductive pad (551-5) along the short side (515-5) may be greater than that of the first conductive pad (551-4). The length of the first conductive pad (551-5) along the long side (513-5) may be substantially the same as that of the first conductive pad (551-4). The length of the second conductive pad (552-5) along the short side (515-5) may be greater than that of the second conductive pad (552-4). The length of the second conductive pad (552-5) along the long side (513-5) may be substantially the same as that of the second conductive pad (552-4). The length of the third conductive pad (753-1) along the short side (515-5) may be greater than that of the third conductive pad (753). The length along the long side (513-5) of the third conductive pad (753-1) may be substantially the same as that of the third conductive pad (753).

[0120] According to one embodiment, the second PCB (352) may further include a third through hole (763) and a fourth through hole (764). The first through hole (761) and the third through hole (763) may be arranged along the short side (515-5) of the conductive plate (510-5) and positioned between the first conductive pad (551-5) and the third conductive pad (753-1). The second through hole (762) and the fourth through hole (764) may be arranged along the short side (515-5) of the conductive plate (510-5) and positioned between the third conductive pad (753-1) and the second conductive pad (552-5).

[0121] In one embodiment, one bonding point may be formed in each of the first through hole (761), the second through hole (762), the third through hole (763), and the fourth through hole (764).

[0122] Referring to FIG. 7c along with FIG. 7b, in one embodiment, the length of the long side (513-6) and the short side (515-6) of the conductive plate (510-6) may be substantially equal to the length of the long side (513-5) and the short side (515-5) of the conductive plate (510-5).

[0123] According to one embodiment, the second PCB (352) may include a fourth conductive pad (754), a fifth conductive pad (755), and a fifth through hole (765). The fifth through hole (765) may be positioned between the fourth conductive pad (754) and the fifth conductive pad (755). The fourth conductive pad (754), the fifth through hole (765), and the fifth conductive pad (755) may be arranged along the short side (515-6). For example, the fourth conductive pad (754), the fifth through hole (765), and the fifth conductive pad (755) may form a column parallel to the short side (515-6). In one embodiment, the first through hole (761) and the third through hole (763) may be positioned between the first conductive pad (551-5) and the row parallel to the short side (515-6). In one embodiment, the second through hole (762) and the fourth through hole (764) may be positioned between the second conductive pad (552-5) and the row parallel to the short side (515-6).

[0124] In one embodiment, one bonding point may be formed in each of the first through hole (761), the second through hole (762), the third through hole (763), the fourth through hole (764), and the fifth through hole (765).

[0125] FIG. 8 is an exemplary drawing showing an electrical contact structure according to one embodiment. Referring to FIG. 8, according to one embodiment, a second PCB (352) may include a third conductive pad (801) electrically connected to a first conductive pad (551), and a fourth conductive pad (802) electrically connected to a second conductive pad (552).

[0126] In one embodiment, the second PCB (352) may include a first electrical path (805) for routing the first conductive pad (551) and the third conductive pad (801). For example, the first electrical path (805) may include a conductive line (or conductive trace) parallel to the second PCB (352) and / or a conductive via perpendicular to the second PCB (352).

[0127] In one embodiment, the second PCB (352) may include a second electrical path (806) for routing the second conductive pad (552) and the fourth conductive pad (802). For example, the second electrical path (806) may include a conductive line (or conductive trace) parallel to the second PCB (352) and / or a conductive via perpendicular to the second PCB (352).

[0128] It is possible to check whether the electrical connection formed by the conductive plate (510) is normal through the third conductive pad (801) and the fourth conductive pad (802). When the first conductive pad (551) and the second conductive pad (552) are used as contacts for powering the conductive portion (520) that operates as an antenna, the third conductive pad (801) and the fourth conductive pad (802) can be used for the purpose of measuring the antenna performance using the conductive portion (520).

[0129] Figures 9a and 9b are plan views illustrating a second PCB according to one embodiment. Figure 9a is a plan view illustrating a second side (352B) of the second PCB (352), and Figure 9b is a plan view illustrating a first side (352A) of the second PCB (352).

[0130] Referring to FIGS. 9A and 9B , according to one embodiment, a plurality of conductive plates (910) may be arranged on a first surface (352A) of a second PCB (352). In one embodiment, the description of the conductive plate (510) may be substantially identically applied to each of the plurality of conductive plates (910).

[0131] In one embodiment, as shown in the illustration of FIG. 9A, when looking at the second side (352B) of the second PCB (352), a plurality of conductive plates (910) arranged on the first side (352A) of the second PCB (352) can be seen through a plurality of through holes (e.g., the through holes (560) of FIG. 5A) of the second PCB (352).

[0132] In one embodiment, the plurality of conductive plates (910) may include a first group of plates (921), a second group of plates (922), and a third group of plates (923). The first group of plates (921) may be positioned adjacent to an edge of the second PCB (352). The first group of plates (921) may be arranged in parallel along the edge.

[0133] In one embodiment, the plates of the second group (922) may be positioned between the plates of the first group (921) and the plates of the third group (923). For a non-limiting example, the plates of the second group (922) may be arranged in a parallel direction parallel to the edge. For a non-limiting example, the plates of the third group (923) may be arranged in a parallel direction parallel to the edge.

[0134] FIG. 9C is an exemplary drawing showing a frame according to one embodiment. In FIG. 9C, the plurality of conductive plates (910) of FIG. 9B are illustrated together with the frame (311). In FIG. 9C, for convenience of explanation, only the conductive portion of the frame (311) is illustrated, and the non-conductive portion is omitted.

[0135] Referring to FIG. 9c, the frame (311) may include a first edge part (920) forming a portion of a side surface of the electronic device (101). The first edge part (920) may extend in a direction substantially perpendicular to the first direction (261).

[0136] In one embodiment, the first group of plates (921) may include at least one of the first to eighth conductive plates (911, 912, 913, 914, 915, 916, 917, 918). For example, the first to eighth conductive plates (911, 912, 913, 914, 915, 916, 917, 918) may be sequentially positioned along the sidewall portion (411). For example, the first conductive plate (911) may be in contact with the first conductive portion (421). For example, the second conductive plate (912) may be in contact with an end of the first conductive portion (421) facing the second conductive portion (422). For example, the third conductive plate (913) may be in contact with a first end of the second conductive portion (422) facing the first conductive portion (421). For example, the fourth conductive plate (914) and the fifth conductive plate (915) may be in contact with the second conductive portion (422), respectively. For example, the sixth conductive plate (916) may be in contact with a second end of the second conductive portion (422) facing the third conductive portion (423). For example, the seventh conductive plate (917) may be in contact with an end of the third conductive portion (423) facing the second conductive portion (422). For example, the eighth conductive plate (918) may be in contact with the third conductive portion (423).

[0137] In one embodiment, each of the plates (921) of the first group can be electrically connected to a conductive portion of the first edge part (920). In one embodiment, each of the plates (921) of the first group can be used as a power supply or ground portion for the conductive portion of the first edge part (920).

[0138] For example, but not limited to, the first conductive plate (911) can be electrically connected to the first conductive portion (421). For example, but not limited to, the first conductive plate (911) can form a ground for the first conductive portion (421). For example, but not limited to, the first conductive portion (421) can be electrically connected to a ground of the electronic device (101) via the first conductive plate (911). The ground can be formed by at least one of a conductive portion included in the frame (311), a conductive area provided by the second PCB (352), and / or another component of the electronic device (101) formed of a conductive material.

[0139] For example, but not limited to, the second conductive plate (912) can be electrically connected to the first conductive portion (421). For example, but not limited to, the second conductive plate (912) can form a power supply for the first conductive portion (421). For example, but not limited to, the first conductive portion (421) can be electrically connected to a wireless communication module (or wireless communication circuit) of the electronic device (101) (e.g., the wireless communication module (192) of FIG. 1) via the second conductive plate (912). The wireless communication module can transmit and receive electrical signals via the second conductive plate (912) electrically connected to the first conductive portion (421). For example, the wireless communication module can transmit or receive RF signals using the first conductive portion (421).

[0140] For example, but not limited to, the third conductive plate (913) can be electrically connected to the second conductive portion (422). For example, but not limited to, the third conductive plate (913) can form a power supply for the second conductive portion (422). For example, but not limited to, the second conductive portion (422) can be electrically connected to the wireless communication module of the electronic device (101) via the third conductive plate (913). The wireless communication module can transmit and receive electrical signals via the third conductive plate (913) electrically connected to the second conductive portion (422). For example, the wireless communication module can transmit or receive RF signals using the second conductive portion (422).

[0141] For example, but not limited to, the fourth conductive plate (914) may be electrically connected to the second conductive portion (422). For example, but not limited to, the fourth conductive plate (914) may form a ground for the second conductive portion (422). For example, but not limited to, the second conductive portion (422) may be electrically connected to a ground of the electronic device (101) via the fourth conductive plate (914).

[0142] For example, but not limited to, the fifth conductive plate (915) can be electrically connected to the second conductive portion (422). For example, but not limited to, the fifth conductive plate (915) can form a feed portion for the second conductive portion (422). For example, but not limited to, the second conductive portion (422) can be electrically connected to the wireless communication module of the electronic device (101) via the fifth conductive plate (915). The wireless communication module can transmit and receive electrical signals via the fifth conductive plate (915) electrically connected to the second conductive portion (422). For example, the wireless communication module can transmit or receive RF signals using the second conductive portion (422).

[0143] For example, but not limited to, the sixth conductive plate (916) can be electrically connected to the second conductive portion (422). For example, but not limited to, the sixth conductive plate (916) can form a feed portion for the second conductive portion (422). For example, but not limited to, the second conductive portion (422) can be electrically connected to the wireless communication module of the electronic device (101) via the sixth conductive plate (916). The wireless communication module can transmit and receive electrical signals via the sixth conductive plate (916) electrically connected to the second conductive portion (422). For example, the wireless communication module can transmit or receive RF signals using the second conductive portion (422).

[0144] For example, but not limited to, the seventh conductive plate (917) can be electrically connected to the third conductive portion (423). For example, but not limited to, the seventh conductive plate (917) can form a power supply for the third conductive portion (423). For example, but not limited to, the third conductive portion (423) can be electrically connected to the wireless communication module of the electronic device (101) via the seventh conductive plate (917). The wireless communication module can transmit and receive electrical signals via the seventh conductive plate (917) electrically connected to the third conductive portion (423). For example, the wireless communication module can transmit or receive RF signals using the third conductive portion (423).

[0145] For example, the eighth conductive plate (918) may be electrically connected to the third conductive portion (423). For example, the eighth conductive plate (918) may form a ground for the third conductive portion (423). For example, the third conductive portion (423) may be electrically connected to a ground of the electronic device (101) via the eighth conductive plate (918).

[0146] In one embodiment, the plates (922, 923) of the second group and the third group can be in contact with the support portion (412). The plates (922, 923) of the second group and the third group can be electrically connected to the support portion (412). In one embodiment, the support portion (412) can be electrically connected to the ground of the second PCB (352) through the plates (922, 923) of the second group and the third group. In one embodiment, by electrically connecting the support portion (412) and the ground of the second PCB (352), the performance of an antenna that at least partially utilizes the first edge part (920) can be improved.

[0147] In one embodiment, the first group of plates (921) and the second group of plates (922) may be spaced apart by a distance (D). The distance (D) may be a distance based on a direction parallel to the first direction (261). In one embodiment, the performance of the antenna using the first edge part (920) may vary depending on an increase or decrease in the distance (D). This may be because the second group of plates (922), which are electrically connected to the support portion (412), provide a ground for the antenna. In one embodiment, the distance (D) may be about 3 mm to 7 mm, but is not limited thereto.

[0148] In one embodiment, a plurality of conductive plates (910) may provide a mechanical connection between the second PCB (352) and the frame (311). For the mechanical connection, a fixing member such as a screw may be used. However, the head of the screw may result in unnecessary space wasted and an increase in the overall thickness of the electronic device (101). In addition, if the screw is formed of a conductive material, it may have a negative impact on the performance of the antenna. Although a step may be formed on the second PCB (352) to prevent the screw head from protruding, this is difficult to apply considering the constraints on the thickness of the second PCB (352), the decrease in mechanical rigidity of the second PCB (352) due to the formation of the step, and the waste of unnecessary costs due to a complex additional process. In one embodiment, the plurality of conductive plates (910) may stably fix the second PCB (352) on the frame (311) without an increase in thickness.

[0149] In one embodiment, the lengths of the second and third groups of plates (922, 923) for ground contact and the first group of plates (921) for antenna contact along the first direction (261) may be different from each other. For example, the lengths of the second and third groups of plates (922, 923) along the first direction (261) may be smaller than the lengths of the first group of plates (921).

[0150] FIGS. 10A and 10B are exemplary cross-sectional views of an electronic device according to one embodiment. FIGS. 10A and 10B may be cross-sectional views taken along line AA' of FIG. 3B.

[0151] Referring to FIG. 10A, according to one embodiment, a display (230) may include a first part (1031) and a second part (1032). The second part (1032) may include a rolled part (1033). For example, a portion of the second part (1032) may be a rolled part (1033) depending on the state of the electronic device (101). The first part (1031) may include a portion of the display (230) that is visible from the outside, and the second part (1032) may be a portion of the display (230) that is located within the first housing part (210) and / or the second housing part (220) and is not visually exposed from the outside. In one embodiment, the first part (1031) may be connected to the cover (321) so that the display (230) can be pulled out of the first housing part (210) as the second housing part (220) moves. In one embodiment, the front side of the first part (1031) may be visually exposed through the exterior (e.g., the front side) of the electronic device (101). The first part (1031) may form or include, for example, the display area (e.g., the display area (230a) of FIG. 2B or the display area (230c) of FIG. 2C) of the display (230). The second part (1032) positioned within the first housing part (210) may face the first part (1031). For example, the second part (1032) may face the back side of the first part (1031). For example, the second part (1032) may face the back surface of the first part (1031) with the battery (189) therebetween. In one embodiment, the dried part (1033) positioned within the first housing part (210) may extend from the first part (1031). In one embodiment, the dried part (1033) may surround a curved portion of a bar (1035) extending in a direction perpendicular to the first direction (261). The dried part (1033) may be positioned between the first edge part (920) and the bar (1035).In one embodiment, the dried part (1033) may face the first edge part (920) of the side wall portion (411). For example, the dried part (1033) may face the conductive portion of the first edge part (920). In one embodiment, the dried part (1033) may be configured such that at least a portion of the display (230) bends toward the first edge part (920) in response to sliding of the first housing part (210). In this respect, the dried part (1033) may be referred to as a bendable part.

[0152] In one embodiment, the battery (189) may be at least partially surrounded by the display (230) (or support member (331)).

[0153] In one embodiment, the second PCB (352) may face the second part (1032) with the support portion (412) therebetween. The second PCB (352) may be positioned on or within the frame (311). For example, the second PCB (352) may be placed on the support portion (412).

[0154] According to one embodiment, the electronic device (101) may include a first conductive plate (1021), a second conductive plate (1022), and a third conductive plate (1023). In one embodiment, the first conductive plate (1021) (e.g., conductive plate (510) of FIG. 5A) may be any one of the plates (921) of the first group of FIG. 9C. For example, the first conductive plate (1021) may be electrically connected to a conductive portion of the first edge part (920) (e.g., sidewall portion (411) of FIG. 4A). In one embodiment, the first conductive plate (1021) may be at least partially surrounded by a conductive portion and / or a non-conductive portion of the frame (311). For example, as illustrated in FIG. 10a, the first conductive plate (1021) may be surrounded only by the conductive portion of the first edge part (920). For another example, as illustrated in FIG. 10b, the first conductive plate (1021) may be surrounded by the non-conductive portion (1060) of the first edge part (920) and / or the non-conductive portion (450) of the support portion (412) together with the conductive portion of the first edge part (920).

[0155] In one embodiment, the second PCB (352) may include a first area (A1) on which a first conductive plate (1021) is disposed, and a second area (A2) extending from the first area (A1). The first area (A1) may extend from an edge (E) of the second PCB (352) facing the second direction (262) to the second area (A2). On the second area (A2), a conductive portion and / or a non-conductive portion of the first housing part (210) may be disposed to cover the conductive plate (1021). The second PCB (352) may include a third area (A3) extending from the second area (A2) and on which a component (1050) is disposed. The third area (A3) may cover the opening (1012b). The second area (A2) may be located between the first area (A1) and the third area (A3).

[0156] In one embodiment, the second conductive plate (1022) (e.g., the conductive plate (510) of FIG. 5A) may be any one of the plates (922) of the second group of FIG. 9C. For example, the second conductive plate (1022) may electrically connect the conductive portion (440) of the support portion (412) and the ground of the second PCB (352). In one embodiment, the third conductive plate (1023) (e.g., the conductive plate (510) of FIG. 5A) may be any one of the plates (923) of the third group of FIG. 9C. For example, the third conductive plate (1023) may electrically connect the conductive portion (440) of the support portion (412) and the ground of the second PCB (352). The description of the aforementioned conductive plate (510) can be substantially equally applied to each of the first conductive plate (1021), the second conductive plate (1022), and the third conductive plate (1023).

[0157] According to one embodiment, the electronic device (101) may include a component (1050) disposed on a first surface (352A) of a second PCB (352). For example, but not limited to, the component (1050) may include an RF switch. In one embodiment, the component (1050) may be positioned within an opening (1012b) formed within the frame (311) (or the support portion (412)) (e.g., at least one second opening (412b) of FIG. 4A).

[0158] FIG. 11 is a drawing showing an electronic device according to a comparative example and an electronic device according to an embodiment.

[0159] Referring to FIG. 11, an electronic device (1103) according to a comparative example may include a frame (1111) and a connecting member (1121) for supplying power to the frame (1111). The connecting member (1121) may include, for example, a C-clip.

[0160] According to one embodiment, the first conductive plate (1021) may have a smaller volume than the connecting member (1121) of the comparative example. For example, the first conductive plate (1021) may have a smaller height than the connecting member (1121). Accordingly, the distance from the rolled part (1033) of the display (230) may increase. For example, the distance (D1) between the first conductive plate (911) and the rolled part (1033) may be greater than the distance (D2) between the connecting member (1121) and the rolled part (1033). As the first conductive plate (1021) forming the feeding portion moves away from the display (230), the performance of the antenna using the frame (311) may be improved. In addition, since the absolute volume of the first conductive plate (1021) is smaller than that of the connecting member (1121), the space occupied may be reduced while the performance of the antenna may be improved.

[0161] In the comparative example, since the connecting member (1121) is in contact with the frame (1111) in the second direction (262), there may be a limit to moving the position of the connecting member (1121) in the second direction (262). In contrast, since the first conductive plate (1021) is in contact with the frame (311) in the third direction (263), it may be able to move further in the second direction (262) than the connecting member (1121). For example, the distance (D1) between the first conductive plate (1021) and the display (230) may be further increased.

[0162] The connecting member (1121) of the comparative example may be a component that is surface-positioned on the PCB (1152), such as a C-clip. Therefore, an opening (1112b) of the frame (1111) in which the connecting member (1121) of the comparative example is positioned may be necessary. Alternatively, according to one embodiment, the first conductive plate (1021) may be positioned on the first side (352A) of the second PCB (352) and welded through the second side (352B) (e.g., through hole (560)). Accordingly, as illustrated in FIGS. 10A and 10B , the first conductive plate (1021) may be surrounded by a conductive portion and / or a non-conductive portion of the frame (311). Accordingly, the distance (D3) between the first conductive plate (1021) and the conductive portion (440) of the support portion (412) may be smaller than the distance (D4) between the connecting member (1121) and the conductive portion (1140). For example, the degree of design freedom of the distance (e.g., distance (D) of FIG. 9c) between the conductive plate (e.g., second conductive plate (1022) of FIG. 10a) electrically connecting the conductive portion (440) to the ground of the second PCB (352) and the first conductive plate (1021) may be increased. In the case where there is a constraint due to the connecting member (1121), such as the distance (D4) of the comparative example, it may be difficult to satisfy the distance (e.g., distance (D) of FIG. 9c) for improving antenna performance (e.g., when the required distance is smaller than the distance (D4)). Accordingly, the performance of the antenna using the frame (311) may be easily adjusted.

[0163] According to one embodiment, the size of the opening (412b) may be smaller than the opening (1112b) of the comparative example. This may be because the opening (412b) according to one embodiment only needs to provide a space in which the element (1050) is positioned. According to one embodiment, the first conductive plate (1021) may be surrounded by a conductive portion and / or a non-conductive portion of the frame (311). Accordingly, the mechanical properties (e.g., rigidity) of the frame (311) may be improved.

[0164] FIG. 12 is a graph showing the radiation efficiency of an electronic device according to an embodiment and an electronic device according to a comparative example. In FIG. 12, the radiation efficiency (1210) for the electronic device according to the comparative example (e.g., the electronic device (1140) of FIG. 11) and the radiation efficiency (1220) for the electronic device according to an embodiment (e.g., the electronic device (101) of FIG. 11) are shown.

[0165] Referring to FIG. 12, the radiation efficiency (1220) according to an embodiment may be higher than the radiation efficiency (1210) according to a comparative example. For example, at about 0.8 GHz, the radiation efficiency (1220) according to an embodiment may be about -6.79 dB, and the radiation efficiency (1210) according to the comparative example may be about -8.17 dB. For example, since an antenna requires a physically longer length as the frequency band decreases, it may be difficult to implement an antenna having such a long length within a complex structure including an expandable display (230), such as an electronic device (101). The electronic device (101) according to an embodiment may implement an antenna for a low band (e.g., below 1 GHz), even if it includes a complex configuration, such as a display (230) having a rolled part (1033), which occupies a large internal space of the electronic device (101) and affects antenna performance.

[0166] FIG. 13 is a drawing illustrating a second PCB according to an embodiment. Referring to FIG. 13, the second PCB (352) according to an embodiment may be at least partially bendable. For example, the second PCB (352) may include a first flexible portion (1311). The first flexible portion (1311) may connect a connector (1330) of the second PCB (352) to a first rigid portion (1301). A plurality of conductive plates (e.g., plates (922, 923) of the second group and the third group of FIG. 9B) may be arranged on the first rigid portion (1301).

[0167] For example, the second PCB (352) may include second to seventh flexible portions (1312, 1313, 1314, 1315, 1316, 1317). The second to seventh flexible portions (1312, 1313, 1314, 1315, 1316, 1317) may each extend from the first rigid portion (1301). The second flexible portion (1302) may connect the first rigid portion (1301) and the second rigid portion (1302). The third flexible portion (1303) may connect the first rigid portion (1301) and the third rigid portion (1303). The fourth flexible portion (1304) can connect the first rigid portion (1301) and the fourth rigid portion (1304). The fifth flexible portion (1305) can connect the first rigid portion (1301) and the fifth rigid portion (1305). The sixth flexible portion (1306) can connect the first rigid portion (1301) and the sixth rigid portion (1306). The seventh flexible portion (1307) can connect the first rigid portion (1301) and the seventh rigid portion (1307). In one embodiment, each of the second to seventh rigid portions (1302, 1303, 1304, 1305, 1306, 1307) may have at least one conductive plate (e.g., at least one of the plates of the first group of FIG. 9b) disposed thereon.

[0168] In one embodiment, the second PCB (352) is configured to be at least partially flexible, thereby dispersing external impact. Accordingly, damage to the second PCB (352) due to external impact, such as dropping, can be reduced or prevented. In a comparative example, referring to FIG. 11, the connecting member (1121) can be in elastic contact with the frame (1111) along the third direction (263). When the PCB (1152) of the comparative example includes a flexible portion, the elastic force of the connecting member (1121) can be applied to the flexible portion. This can hinder tight contact between the connecting member (1121) and the frame (1111). On the other hand, according to one embodiment, the first conductive plate (1021) can be bonded to the frame (311), unlike the elastic contact of the comparative example. Therefore, according to one embodiment, the first conductive plate (1021) can maintain close contact with the frame (311), regardless of the flexible portion of the second PCB (352).

[0169] FIGS. 14 and 15 are diagrams illustrating a second PCB according to an embodiment. Referring to FIGS. 14 and 15 , the electronic device (101) according to an embodiment may include at least one adhesive member. The at least one adhesive member may include, but is not limited to, double-sided tape and / or hook-and-loop fasteners.

[0170] For example, as illustrated in FIG. 14, the electronic device (101) may include a first adhesive member (1410) and / or a second adhesive member (1420). The first adhesive member (1410) and the second adhesive member (1420) may be disposed on the first surface (352A) of the second PCB (352), avoiding conductive plates (e.g., the plurality of conductive plates (910) of FIG. 9B). For example, the first adhesive member (1410) and the second adhesive member (1420) may be disposed on the first rigid portion (1301). In one embodiment, the first adhesive member (1410) and the second adhesive member (1420) may be spaced apart from the edge of the second PCB (352).

[0171] For example, as illustrated in FIG. 15, the electronic device (101) may include an adhesive member (1510). The adhesive member (1510) may be disposed on the first surface (352A) of the second PCB (352), avoiding the conductive plates. For example, the adhesive member (1510) may at least partially enclose the conductive plates. For example, the adhesive member (1510) may extend along the perimeter (or edge) of the first rigid portion (1301).

[0172] FIG. 16 is a diagram illustrating a manufacturing process of an electronic device according to an embodiment. Referring to FIG. 16, first, a plurality of conductive plates (1610) (e.g., a plurality of conductive plates (910) of FIG. 9B) may be mounted on a first surface (352A) of a second PCB (352). Thereafter, using a surface mount device (SMD), each of the plurality of conductive plates (1610) may be soldered to one or more corresponding conductive pads. Thereafter, the first surface (352A) of the second PCB (352) may be mounted on a frame (311). Thereafter, each of the plurality of conductive plates (1610) may be welded (e.g., laser welded) to the frame (311) through one or more corresponding through-holes (e.g., through-holes (560) of FIG. 5A).

[0173] FIG. 17 and FIG. 18 are diagrams illustrating a reworking process of an electronic device according to an embodiment. Referring to FIG. 17, first, a conductive plate (1710) (e.g., the conductive plate (510) of FIG. 5A) may be mounted on a second PCB (352) having through holes formed therein. Then, conductive pads provided on the conductive plate (1710) and the second PCB (352) may be soldered. Then, the second PCB (352) may be mounted on a frame (311). Then, by irradiating a laser only to some of the through holes (e.g., the first through hole (1705)), the conductive plate (1710) and the frame (311) may be welded. Then, if reworking is necessary, the second PCB (352) may be removed from the frame (311), and a surface treatment process (e.g., cleaning, polishing, etc.) of the frame (311) may be performed. Thereafter, the second PCB (352) can be placed on the frame (311) again. Thereafter, the conductive plate (1710) and the frame (311) can be welded by irradiating a laser to another part of the through holes (e.g., the second through hole (1715)).

[0174] Unlike the above, referring to FIG. 18, by irradiating a laser to all of the through holes (1805) of the second PCB (352), the conductive plate (1710) and the frame (311) can be welded. Thereafter, if reworking is required, the second PCB (352) can be removed from the frame (311), and the surface treatment process of the frame (311) can be performed. Thereafter, the second PCB (352) can be re-mounted on the frame (311). Thereafter, by irradiating a laser again to the through holes (1805), the conductive plate (1710) and the frame (311) can be welded.

[0175] FIG. 19 is a drawing showing a manufacturing process of an electronic device according to one embodiment.

[0176] Referring to FIG. 19, first, a conductive plate (1710) can be mounted on a frame (311). Thereafter, by irradiating a laser to points (1905) corresponding to the through holes of the second PCB (352), the conductive plate (1710) can be welded to the frame (311). Thereafter, conductive pads (1950) (e.g., the first conductive pad (551) of FIG. 5A) and the second PCB (352) can be sequentially mounted on the conductive plate (1710). Thereafter, by heating and pressurizing the second PCB (352) using a hot bar jig (1910), the conductive pads (1950) can be soldered to the conductive plate (1710).

[0177] If rework is required, the second PCB (352) can be removed from the conductive plate (1710) by melting the solder between the conductive pads (1950) and the conductive plate (1710) using the hot bar jig (1910) again. Thereafter, the conductive pads (1950) can be re-soldered to the conductive plate (1710) by heating and pressurizing the second PCB (352) using the hot bar jig (1910). For non-limiting examples, a free solder (e.g., lead-free solder) or a self-aligning film can be used as a bonding material for the hot bar jig (1910).

[0178] With reference to FIGS. 17, 18, and 19, the process using laser soldering and hot bar methods has been described, but is not limited thereto. For example, solder ball jetting or intensive pulsed light (IPL) methods may also be used.

[0179] In one embodiment, an electronic device (e.g., an electronic device (101) of FIG. 1) comprises a flexible display (e.g., a first housing part (210) of FIG. 2A) including a conductive portion forming a part of an exterior of the electronic device, a second housing part (e.g., a second housing part (220) of FIG. 2A) slidably coupled to the first housing part, a first part (e.g., a first part (1031) of FIG. 10A) having a front surface visible from the outside of the electronic device, a second part (e.g., a second part (1302) of FIG. 10A) facing a back surface of the first part, and a rolled part (e.g., a rolled part (1033) of FIG. 10A) positioned within the first housing part so as to face the conductive portion and extend from the first part to the second part. The display (230)) may include a printed circuit board (e.g., a second PCB (352) of FIG. 5A) disposed within the first housing part so as to face the second part and including a through hole (e.g., a through hole (560) of FIG. 5A), and a conductive plate (e.g., a conductive plate (510) of FIG. 5A) covering the through hole and disposed between a surface of the printed circuit board and a surface of the conductive portion. The conductive plate may be electrically connected to the conductive portion within a region overlapping the through hole.

[0180] In one embodiment, an electronic device (e.g., an electronic device (101) of FIG. 1) comprises a housing (e.g., a housing (201) of FIG. 2A) including a first housing part (e.g., a first housing part (210) of FIG. 2A) including a conductive portion and a second housing part (e.g., a second housing part (220) of FIG. 2A) slidably coupled to the first housing part, a flexible display (e.g., a display (230) of FIG. 10A) including a bending part (e.g., a rolled part (1033) of FIG. 10A) configured to bend at least a portion of the first housing part toward the conductive portion according to sliding of the second housing part), a printed circuit board (e.g., a second PCB (352) of FIG. 5A) disposed within the first housing part and including a through hole (e.g., a through hole (560) of FIG. 5A), and the printed circuit board A conductive plate (e.g., conductive plate (510) of FIG. 5A) may be disposed between the circuit board and the conductive portion. The conductive plate may be electrically connected to the conductive portion within an area overlapping the through hole.

[0181] In one embodiment, the conductive plate can be bonded to the conductive portion within an area overlapping the through hole.

[0182] In one embodiment, the printed circuit board may include a conductive pad (e.g., the first conductive pad (551) or the second conductive pad (552) of FIG. 5A) in contact with the conductive plate.

[0183] In one embodiment, the printed circuit board may include a conductive pad (e.g., the first conductive pad (551) or the second conductive pad (552) of FIG. 5A) covered by the conductive plate and electrically connected to the conductive plate.

[0184] In one embodiment, the conductive pad may be a first conductive pad (e.g., the first conductive pad (551) of FIG. 5A).

[0185] In one embodiment, the printed circuit board includes a second conductive pad (e.g., the second conductive pad (552) of FIG. 5A) in contact with the conductive plate, and the through hole may be positioned between the first conductive pad and the second conductive pad.

[0186] In one embodiment, the printed circuit board may include a second conductive pad (e.g., the second conductive pad (552) of FIG. 5A) covered by the conductive plate and electrically connected to the conductive plate. The through hole may be positioned between the first conductive pad and the second conductive pad.

[0187] In one embodiment, the printed circuit board may include a plurality of through holes including the through hole. The plurality of through holes may be positioned between the first conductive pad and the second conductive pad and may be covered by the conductive plate. The conductive plate may be bonded to the conductive portion within regions overlapping each of the plurality of through holes.

[0188] In one embodiment, the printed circuit board may include a plurality of through holes including the through hole. The plurality of through holes overlapping the conductive plate may be positioned between the first conductive pad and the second conductive pad. The conductive plate may be electrically connected to the conductive portion within regions overlapping each of the plurality of through holes.

[0189] In one embodiment, the conductive plate may be electrically connected to the conductive portion at each of a plurality of points within the area overlapping the through hole.

[0190] In one embodiment, the conductive plate can be bonded to the conductive portion at a plurality of points within an area overlapping the through hole.

[0191] In one embodiment, the conductive plate may include at least one weld bead (e.g., beads (570) of FIG. 5A) positioned within the through hole.

[0192] In one embodiment, the conductive plate may include at least one weld bead (e.g., beads (570) of FIG. 5A) formed on the conductive plate, positioned within the through hole. The conductive plate may be electrically connected to the conductive portion via the at least one weld bead. For example, the conductive plate may be electrically connected to the conductive portion at at least one point where the at least one weld bead is formed.

[0193] In one embodiment, the printed circuit board may include another conductive pad disposed on a surface opposite to the surface on which the conductive pad is disposed, and a conductive via (e.g., the first electrical path (805) or the second electrical path (806) of FIG. 5A) electrically connecting the conductive pad and the other conductive pad.

[0194] In one embodiment, the conductive portion may include a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) electrically connected to the conductive portion via the conductive plate. The wireless communication circuit may be configured to transmit or receive a radio frequency (RF) signal using the conductive portion.

[0195] In one embodiment, the electronic device may include a feeding contact of an antenna for the RF signal, the feeding contact utilizing the conductive portion. The feeding contact may include the conductive plate in contact with the conductive portion.

[0196] In one embodiment, the first housing part may include a support portion (e.g., support portion (412) of FIG. 4A) extending inwardly from the conductive portion. The printed circuit board may be disposed on the support portion.

[0197] In one embodiment, the support portion may include another conductive portion (e.g., conductive portion (440) of FIG. 4A). The printed circuit board may include another through hole. The electronic device may include another conductive plate disposed between the other conductive portion and the printed circuit board so as to overlap the other through hole. The other conductive plate may be electrically connected to the other conductive portion within an area overlapping the other through hole.

[0198] In one embodiment, the support portion may include another conductive portion (e.g., conductive portion (440) of FIG. 4A). The printed circuit board may include another through hole. The electronic device may include another conductive plate covering the another through hole and positioned between a surface of the another conductive portion and the printed circuit board. The another conductive plate may be electrically connected to the another conductive portion within a region overlapping the another through hole.

[0199] In one embodiment, the printed circuit board may include a third conductive pad and a fourth conductive pad. The third conductive pad and the fourth conductive pad may be electrically connected to the other conductive plate. The other through hole may be located between the third conductive pad and the fourth conductive pad.

[0200] In one embodiment, the other conductive plate can electrically connect the ground of the printed circuit board and the other conductive portion.

[0201] In one embodiment, the first housing part may include a first edge part (e.g., the first edge part (920) of FIG. 9c) that extends in a first direction and at least partially includes the conductive portion. A distance between the conductive plate and the other conductive plate may be greater than or equal to 3 mm and less than or equal to 7 mm. The distance may be based on a direction perpendicular to the first direction (e.g., the first direction (261) of FIG. 9c).

[0202] In one embodiment, the conductive portion and the other conductive portion may be formed integrally.

[0203] In one embodiment, an adhesive member (e.g., the first adhesive member (1410), the second adhesive member (1420) of FIG. 14 or the adhesive member (1510) of FIG. 15) may be interposed between the printed circuit board and the support portion.

[0204] In one embodiment, the flexible display may include a first part (e.g., a first part (1031) of FIG. 10A) visible from the outside of the electronic device. The bending part may extend from the first part to the inside of the housing. The printed circuit board may include a first side (e.g., a first side (352A) of FIG. 5A) facing the first part of the flexible display and a second side (e.g., a second side (352B) of FIG. 5A) opposite to the first side. The surface of the printed circuit board on which the conductive plate is disposed may include the first side.

[0205] In one embodiment, the first housing part may include a non-conductive portion. The surface of the printed circuit board may include a first region and a second region extending from the first region. The first region may be located between an edge of the printed circuit board and the second region. The conductive plate may be disposed on the first region. A portion of the second region in contact with the first region may overlap at least one of the conductive portion or the non-conductive portion of the first housing part. For example, a portion of the second region in contact with the first region may be covered by at least one of the conductive portion or the non-conductive portion of the first housing part.

[0206] In one embodiment, the printed circuit board may include a component (e.g., component (1050) of FIG. 10A) disposed on the surface. The surface of the printed circuit board may include a third region extending from the second region and in which the component is disposed. The support portion may include an opening (e.g., opening (1012b) of FIG. 10A) covered by the third region. The component may be positioned within the opening.

[0207] In one embodiment, the conductive plate may be soldered to the conductive pad.

[0208] In one embodiment, the through hole may include a plated through hole (PTH) or a non-plated through hole (NPTH).

[0209] In one embodiment, an electronic device (e.g., an electronic device (101) of FIG. 1) comprises a first housing part (e.g., a first edge part (920) of FIG. 9c) including a first conductive portion (e.g., a first conductive portion (421) of FIG. 4a), and a support part (e.g., a support part (412) of FIG. 4a) extending inwardly from the first edge part and including a second conductive portion (e.g., a conductive portion (440) of FIG. 4a); a second housing part (e.g., a second housing part (220) of FIG. 2a) slidably coupled to the first housing part; A flexible display (e.g., display (230) of FIG. 10A) comprising a first part having a front surface visible from the outside of the electronic device (e.g., first part (1031) of FIG. 10A), a second part facing a back surface of the first part (e.g., second part (1032) of FIG. 10A), and a rolled part (e.g., rolled part (1033) of FIG. 10A) positioned within the first housing part so as to extend from the first part to the second part and face the first edge part); a printed circuit board (e.g., second PCB (352) of FIG. 5A) disposed on the support part and including a first through hole (e.g., through hole (560) of FIG. 5A) and a second through hole, wherein the support part is positioned between the printed circuit board and the second part of the flexible display; It may include a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1); a first conductive plate (e.g., a conductive plate (510) of FIG. 5A) electrically connecting the wireless communication circuit and the first conductive portion of the first edge part; and a second conductive plate electrically connecting the ground of the printed circuit board and the second conductive portion of the support part.The first conductive plate may be disposed on the printed circuit board so as to cover the first through hole, and may be connected to the first conductive portion within an area overlapping the first through hole. The second conductive plate may be disposed on the printed circuit board so as to cover the second through hole, and may be connected to the second conductive portion within an area overlapping the second through hole.

[0210] According to one embodiment, an electronic device (101) includes a first housing part (e.g., the first housing part (210) of FIG. 2a) including a first edge part (e.g., the first edge part (920) of FIG. 9c) including a first conductive portion (e.g., the first conductive portion (421) of FIG. 4a), and a support part (e.g., the support part (412) of FIG. 4a) extending inwardly from the first edge part and including a second conductive portion (e.g., the conductive portion (440) of FIG. 4a); a second housing part (e.g., the second housing part (220) of FIG. 2a) slidably coupled to the first housing part; A flexible display (e.g., display (230) of FIG. 10A) comprising a first part (e.g., first part (1031) of FIG. 10A) having a front surface that is visible from the outside of the electronic device and expands or contracts according to sliding of the second housing part, a bending part (e.g., curled part (1033) of FIG. 10A) within the first housing part that extends from the first part and bends toward the first edge part; a printed circuit board (e.g., second PCB (352) of FIG. 5A) disposed on the support part and including a first through hole (e.g., through hole (560) of FIG. 5A) and a second through hole; a wireless communication circuit (e.g., wireless communication module (192) of FIG. 1); a first conductive plate (e.g., conductive plate (510) of FIG. 5A) electrically connecting the wireless communication circuit and the first conductive portion of the first edge part; And it may include a second conductive plate that electrically connects the ground of the printed circuit board and the second conductive portion of the support part. The first conductive plate may be disposed on the printed circuit board and connected to the first conductive portion within an area overlapping the first through hole.The second conductive plate may be disposed on the printed circuit board and connected to the second conductive portion within an area overlapping the second through hole.

[0211] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0212] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0213] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0214] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0215] According to one embodiment, the method according to the various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0216] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, A housing comprising a first housing part including a conductive portion and a second housing part slidably engaged to the first housing part; A flexible display including a bendable part configured to bend at least a portion of the first housing part toward the conductive portion according to sliding of the second housing part; a printed circuit board disposed within the first housing part and including a through hole; and A conductive plate is included, which is positioned between the printed circuit board and the conductive portion. The conductive plate is electrically connected to the conductive portion within an area overlapping the through hole. Electronic devices.

2. In claim 1, The printed circuit board includes a conductive pad in contact with the conductive plate. Electronic devices.

3. In claim 2, The above-mentioned conductive pad is a first conductive pad, The printed circuit board includes a second conductive pad in contact with the conductive plate, The above through hole is located between the first conductive pad and the second conductive pad. Electronic devices.

4. In claim 3, The above printed circuit board includes a plurality of through holes including the through hole, The plurality of through holes overlapping the conductive plate are positioned between the first conductive pad and the second conductive pad, The conductive plate is electrically connected to the conductive portion within regions overlapping each of the plurality of through holes. Electronic devices.

5. In claim 3, The conductive plate is electrically connected to the conductive portion at each of a plurality of points within the area overlapping the through hole. Electronic devices.

6. In any one of claims 1 to 5, comprising at least one welding bead positioned within the through hole and formed on the conductive plate; The conductive plate is electrically connected to the conductive portion through at least one welding bead. Electronic devices.

7. In any one of claims 2 to 5, The above printed circuit board: another conductive pad arranged on a surface opposite to the surface on which the above conductive pad is arranged; and Including a conductive via electrically connecting the above conductive pad and the other conductive pad, Electronic devices.

8. In any one of claims 2 to 7, A wireless communication circuit electrically connected to the conductive portion through the conductive plate, The above wireless communication circuit is configured to transmit or receive an RF (radio frequency) signal using the conductive portion. Electronic devices.

9. In claim 8, Including a feeding contact of the antenna for the RF signal, utilizing the above-mentioned conductive portion, The above power contact comprises the conductive plate in contact with the conductive portion, Electronic devices.

10. In any one of claims 1 to 9, The above first housing part includes a support portion extending inwardly from the conductive portion, The above printed circuit board is placed on the support portion, Electronic devices.

11. In claim 10, The above support portion includes another challenging portion, The above printed circuit board includes different through holes, The electronic device comprises another conductive plate disposed between the other conductive portion and the printed circuit board so as to overlap the other through hole, The other conductive plate is electrically connected to the other conductive portion within an area overlapping the other through hole. Electronic devices.

12. In claim 11, The above printed circuit board includes a third conductive pad and a fourth conductive pad, The third conductive pad and the fourth conductive pad are electrically connected to the other conductive plate, The above other through hole is located between the third conductive pad and the fourth conductive pad. Electronic devices.

13. In claim 11 or claim 12, The above other conductive plate electrically connects the ground of the printed circuit board and the above other conductive portion. Electronic devices.

14. In any one of claims 11 to 13, The first housing part includes a first edge part extending in a first direction and at least partially including the conductive portion, The distance between the above conductive plate and the other conductive plate is 3 mm or more and 7 mm or less, The above distance is based on the direction perpendicular to the first direction. Electronic devices.

15. In any one of claims 11 to 14, The above-mentioned conductive portion and the other conductive portion are formed integrally, Electronic devices.

Images