Computing device

Abstract

A computing device. The computing device comprises: a housing (100), a first air duct having first air inlets (141) and first air outlets (111) being defined in the housing (100); a circuit board (200) provided in the first air duct; and a fan assembly (300) provided in the first air duct, wherein in the wind direction in the first air duct, the circuit board (200) is located in an upwind direction, the fan assembly (300) is located in a downwind direction, the fan assembly (300) comprises a drivable impeller (310), and the circuit board (200) is located on one side of the impeller (310) in the radial direction. The problem of air cross-leakage can be avoided, thereby improving the heat dissipation performance of the computing device, and reducing the arrangement number of air duct pieces in the first air duct, making the structure simpler.

Description

computing devices

[0001] This application claims priority to Chinese patent application number 2023233931390, filed with the China Patent Office on December 12, 2023, entitled “Computing Device,” the entire contents of which are incorporated herein by reference.

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on December 12, 2023, with application number 2023117080021 and titled “Computing Device,” the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the technical field of electronic devices, and in particular to a computing device. Background Art

[0004] In related art, electronic devices, such as computing devices, are often equipped with air ducts. Air flowing through these ducts removes heat generated by the electronic device's internal components. However, this airflow within the ducts can easily cause crossflow, which can affect the electronic device's heat dissipation performance.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide a computing device to solve or alleviate one or more technical problems in the prior art.

[0007] As one aspect of an embodiment of the present application, the embodiment of the present application provides a computing device, including: a shell, a first air duct having a first air inlet and a first air outlet is defined in the shell; a circuit board is arranged in the first air duct; a fan assembly is arranged in the first air duct, and along the wind direction in the first air duct, the circuit board is located in the upwind direction and the fan assembly is located in the downwind direction, the fan assembly includes a drivable impeller, and the circuit board is located on one side of the impeller in the radial direction.

[0008] In one embodiment, the first air inlet is provided on any side panel of the shell, and the first air outlet is provided on the top panel of the shell.

[0009] In one embodiment, the shell includes a top plate and a bottom plate arranged opposite to each other, two first side plates arranged opposite to each other, and two second side plates arranged opposite to each other, the first side plate is located in the axial direction of the fan assembly, wherein the first air inlet is arranged on one of the two second side plates, and the first air outlet is arranged on the top plate.

[0010] In one embodiment, the fan assembly further includes a driver, which is transmission-connected to one axial end of the impeller.

[0011] In one embodiment, the fan assembly includes a fan housing, and a second air duct having a second air inlet and a second air outlet is defined in the fan housing. The second air inlet is arranged opposite to the circuit board, and the second air outlet is arranged opposite to the first air outlet.

[0012] In one embodiment, the fan assembly includes a fan housing, the impeller is located in the fan housing, and the driver is mounted on the fan housing.

[0013] In one embodiment, the computing device further includes: a control module electrically connected to both the fan assembly and the circuit board, and the control module is disposed at one axial end of the fan assembly.

[0014] In one embodiment, the driver of the fan assembly is electrically connected to the control module.

[0015] In one embodiment, the control module includes a power connector, a reset controller and a switch controller; wherein the power connector corresponds to the power interface set on the shell, the reset controller corresponds to the reset interface set on the shell, and the switch controller corresponds to the switch interface set on the shell.

[0016] In one embodiment, the power interface, the reset interface, and the switch interface are arranged on the top plate of the housing.

[0017] In one embodiment, the circuit board includes a first surface and a second surface that are opposite to each other, and a plurality of heat-generating components are arranged in an array on the first surface.

[0018] In one embodiment, the areas of the plurality of heat-generating components are equal, and / or the device types of the plurality of heat-generating components are the same.

[0019] In one embodiment, the computing device further includes a heat sink, which is disposed on the first surface and / or the second surface.

[0020] In one embodiment, the radiator includes a liquid cooling tube and a plurality of heat dissipating fins arranged at intervals, the extension direction of each heat dissipating fin is the same as the wind direction in the first air duct, and the liquid cooling tube is passed through the plurality of heat dissipating fins along the arrangement direction of the plurality of heat dissipating fins.

[0021] In one embodiment, the radiator includes a first radiator and a second radiator, the first radiator is arranged on the first surface, and the second radiator is arranged on the second surface, wherein along the arrangement direction of the multiple heat dissipation fins, the size of the second radiator is larger than the size of the first radiator.

[0022] In one embodiment, the heat sink further includes a heat dissipation substrate, a plurality of heat dissipation fins are disposed on the heat dissipation substrate, and the heat dissipation substrate is connected to the circuit board.

[0023] In one embodiment, along the wind direction in the first air duct, the size of at least part of the first heat dissipation fins is smaller than the size of at least part of the remaining heat dissipation fins; the first heat dissipation fins are heat dissipation fins corresponding to the connection area between the heat dissipation substrate and the circuit board.

[0024] In one embodiment, the second heat sink is connected to the housing via fasteners.

[0025] In one embodiment, the second heat sink is used to support the weight of the circuit board and the first heat sink.

[0026] In one embodiment, the top of the first air inlet is flush with the top of the radiator, and the bottom of the first air inlet is flush with the bottom of the radiator.

[0027] In one embodiment, the distance between two adjacent heat dissipation fins is 3 mm to 6 mm.

[0028] In one embodiment, the housing includes a mounting location in which the display assembly is mounted.

[0029] In one embodiment, the first air outlet is in communication with a heat recovery system.

[0030] The embodiment of the present application adopts the above-mentioned technical solution to avoid the problem of air leakage, thereby improving the heat dissipation performance of the computing device, and can reduce the number of air duct components arranged in the first air duct, making the structure simpler.

[0031] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0033] FIG1 is a schematic top view of a computing device according to an embodiment of the present application;

[0034] FIG2 shows a cross-sectional view along line AA in FIG1 ;

[0035] 3 and 4 illustrate exploded views of a computing device according to an embodiment of the present application;

[0036] FIG5 is a schematic diagram showing a partial structure of a housing according to an embodiment of the present application;

[0037] FIG6 is a schematic diagram showing a partial structure of a computing device according to an embodiment of the present application;

[0038] FIG. 7 illustrates an exploded view of the computing device shown in FIG. 6 .

[0039] Description of reference numerals: 10: computing device; 100: Housing; 110: Top plate; 111: First air outlet; 120: Bottom plate; 130: First side plate; 140: Second side plate; 141: First air inlet; 150: Mounting hole; 160: Pressure plate; 170: Display assembly; 10a: Power interface; 10b: Reset interface; 10c: Switch interface; 200: Circuit board; 210: First surface; 211: Heat-generating components; 220: Second surface; 300: Fan assembly; 310: Impeller; 320: Driver; 330: Fan housing; 331: Second air inlet; 332: Second air outlet; 400: Radiator; 410: First radiator; 420: Second radiator; 430: Liquid cooling pipe; 440: Heat dissipation fins; 450: Heat dissipation substrate; 500: Control module; 510: Power connector; 520: Reset controller; 530: Switch controller. DETAILED DESCRIPTION

[0040] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0041] The following describes a computing device according to an embodiment of the present application in conjunction with Figures 1 to 7.

[0042] Figure 1 shows a top view of a computing device 10 according to an embodiment of the present invention; Figure 2 shows a cross-sectional view taken along line AA in Figure 1; and Figures 3 and 4 show exploded views of the computing device 10 according to an embodiment of the present invention. As shown in Figures 1-4, the computing device 10 includes a housing 100, a circuit board 200, and a fan assembly 300.

[0043] Specifically, the housing 100 defines a first air duct having a first air inlet 141 and a first air outlet 111. A circuit board 200 is disposed within the first air duct. A fan assembly 300 is disposed within the first air duct, with the circuit board 200 positioned upwind and the fan assembly 300 positioned downwind in the direction of wind within the first air duct. The fan assembly 300 includes a drivable impeller 310, with the circuit board 200 positioned radially to one side of the impeller 310.

[0044] It should be noted that the phrase "along the wind direction in the first air duct, the circuit board 200 is located upwind, and the fan assembly 300 is located downwind" means that, along the wind direction in the first air duct, the circuit board 200 is located upwind relative to the fan assembly 300, and the fan assembly 300 is located downwind relative to the circuit board 200. In other words, when the wind flows in the air duct, the wind first passes through the circuit board 200 and then passes through the fan assembly 300.

[0045] Among them, "upwind direction" and "downwind direction" should be understood in a broad sense in this application, and "up" and "down" do not refer to "up" and "down" in physical orientation, but refer to the relative position relationship in the wind direction within the first air duct. For example: in the first air duct, if the wind flows from left to right, then the left side of the first air duct can be described as upwind direction, and the right side of the first air duct is downwind direction. At this time, "the circuit board 200 is located in the upwind direction, and the fan assembly 300 is located in the downwind direction" means that the circuit board 200 is located on the left side of the fan assembly 300, and the fan assembly 300 is located on the right side of the circuit board 200. If the wind flows from bottom to top, then the lower side of the first air duct can be described as upwind direction, and the upper side of the air duct is downwind direction. At this time, "the circuit board 200 is located in the upwind direction, and the fan assembly 300 is located in the downwind direction" means that the circuit board 200 is located on the lower side of the fan assembly 300, and the fan assembly 300 is located on the upper side of the circuit board 200.

[0046] Exemplarily, the fan assembly 300 may further include a driver 320, which is transmission-connected to one axial end of the impeller 310 for driving the impeller 310 to rotate. For example, the driver 320 may be a driving motor. In this case, the driver 320 may include a driving body and a power output shaft provided on the driving body, and the power output shaft may be rotatable relative to the driving body. The power output shaft may be transmission-connected to the impeller 310. Optionally, the material of the impeller 310 may be metal such as aluminum alloy, or plastic, which is not limited in this application. When the driver 320 is working, the driver 320 drives the impeller 310 to rotate. Under the action of the impeller 310, cold air enters the first air duct from the first air inlet 141, then flows through the circuit board 200, generates heat exchange with the circuit board 200, and takes away the heat generated during the operation of the circuit board 200. The hot air flowing through the circuit board 200 enters the fan assembly 300 from the air inlet of the fan assembly 300 , then flows from the air outlet of the fan assembly 300 to the first air outlet 111 , and finally flows out from the first air outlet 111 .

[0047] In this embodiment, since the circuit board 200 is located upwind and the fan assembly 300 is located downwind, the fan assembly 300 is an exhaust-type fan, which can avoid the problem of crossflow, thereby improving the heat dissipation performance of the computing device 10 and reducing the number of air duct components arranged in the first air duct, thereby simplifying the structure. In addition, since the circuit board 200 is located on one side of the impeller 310 in the radial direction, the hot air flowing through the circuit board 200 enters the impeller 310 in the radial direction. The fan assembly 300 is a cross-flow fan. While ensuring the fan assembly 300's high energy efficiency, quietness, and ease of maintenance and installation, there is no need to consider the size of the fan assembly 300's air outlet, thereby improving the space utilization of the computing device 10.

[0048] For example, the first air outlet 111 may be connected to a heat recovery system, so that the hot air outputted from the first air outlet 111 can be reused, thereby improving energy efficiency, reducing carbon emissions, and lowering energy costs.

[0049] Optionally, a rubber pad structure may be provided at the installation position of the fan assembly 300 to absorb vibration and impact generated during the operation of the fan assembly 300 .

[0050] For example, the first air outlet 111 can be connected to the indoor space or the interior of the vehicle through a heat recovery system, so that the hot air output by the first air outlet 111 can increase the indoor or interior air temperature to achieve a heating function. Compared with using a heater for heating, this can save electricity, improve resource utilization efficiency, and reduce negative impacts on the environment.

[0051] It should be noted that the term "heat recovery system" in this application should be broadly understood to refer to a system for recovering heat energy. For example, if the first air outlet 111 is directly connected to the indoor space so that the hot air output from the first air outlet 111 is used for heating, the heat recovery system is the house.

[0052] In one embodiment, the first air inlet 141 can be provided on any side panel of the housing 100, and the first air outlet 111 can be provided on the top panel of the housing 100. Thus, when the hot air outputted from the first air outlet 111 is used for heating, the first air outlet 111 provided on the top panel can avoid being blocked by furniture, curtains, or other objects, thereby ensuring the circulation of hot air and fully meeting the heating needs of the user.

[0053] Figure 5 shows a schematic diagram of a partial structure of a housing 100 according to an embodiment of the present application. In one embodiment, in conjunction with Figures 2, 3, and 5, the housing 100 may include a top plate 110 and a bottom plate 120 disposed opposite each other, two first side plates 130 disposed opposite each other, and two second side plates 140 disposed opposite each other. The first side plates 130 are located axially of the fan assembly 300, wherein the first air inlet 141 is disposed on one of the two second side plates 140, and the first air outlet 111 is disposed on the top plate 110. As a result, the housing 100 has a simple structure, is easy to process, and can effectively improve assembly and disassembly efficiency.

[0054] For example, with reference to Figures 2, 3 and 5, the housing 100 can be roughly formed into a rectangular parallelepiped structure. The two first side panels 130 can be the first left panel and the first right panel, respectively. The two second side panels 140 can be the second front panel and the second rear panel, respectively. The fan assembly 300 is arranged near the second front panel, and the circuit board 200 is arranged near the second rear panel. The first air inlet 141 can be arranged on the second rear panel. Among them, the top panel 110, the two first side panels 130 and the two second side panels 140 can be an integral structure of the upper shell to facilitate assembly and disassembly.

[0055] In one embodiment, as shown in Figures 2 and 3, the fan assembly 300 may further include a fan housing 330. The fan housing 330 defines a second air duct having a second air inlet 331 and a second air outlet 332. The second air inlet 331 is disposed opposite the circuit board 200, and the second air outlet 332 is disposed opposite the first air outlet 111. The second air inlet 331 is the air inlet of the fan assembly 300, and the second air outlet 332 is the air outlet of the fan assembly 300.

[0056] In this embodiment, the fan housing 330 can define a second air duct, thereby playing an effective wind-guiding role, so that the hot air flowing through the circuit board 200 can enter from the second air inlet 331, flow along the second air duct, and finally flow from the second air outlet 332 to the first air outlet 111, effectively improving the efficiency of the fan assembly 300 and reducing energy waste.

[0057] In one embodiment, the fan assembly 300 may further include a fan housing 330, the impeller 310 is located in the fan housing 330, and the driver 320 is installed in the fan housing 330. For example, when the driver 320 is a drive motor, the drive body can be fixedly connected to the fan housing 330. When the driver 320 is working, the power output shaft drives the impeller 310 to rotate. Under the action of the impeller 310, cold air enters the first air duct from the first air inlet 141, then flows through the circuit board 200, generates heat exchange with the circuit board 200, and takes away the heat generated during the operation of the circuit board 200. The hot air flowing through the circuit board 200 enters the second air duct from the second air inlet 331, then flows from the second air outlet 332 to the first air outlet 111, and finally flows out from the first air outlet 111.

[0058] In this embodiment, the fan housing 330 can effectively protect the impeller 310 from damage caused by foreign objects or impurities entering the impeller 310, thereby extending the service life of the entire fan assembly 300. In addition, the fan housing 330 can also improve operational safety and reduce the noise generated by the rotation of the impeller 310.

[0059] In one embodiment, the surfaces of the top plate 110, bottom plate 120, first side plate 130, and second side plate 140 may all be planar. "Planar surface" may be understood to mean that the area of ​​the surface where no components or holes are located is a planar surface. For example, the planar surface of the top plate 110 means that the area of ​​the surface of the top plate 110 where the first air outlet 111 is not located is a planar surface.

[0060] In this embodiment, the portion of the top plate 110 corresponding to the fan assembly 300 and the portion of the top plate 110 corresponding to the circuit board 200 can be flush with each other and located in the same plane; the portion of the bottom plate 120 corresponding to the fan assembly 300 and the portion of the bottom plate 120 corresponding to the circuit board 200 can be flush with each other and located in the same plane; the portion of the first side plate 130 corresponding to the fan assembly 300 and the portion of the first side plate 130 corresponding to the circuit board 200 can be flush with each other and located in the same plane; the portion of the second side plate 140 corresponding to the fan assembly 300 and the portion of the second side plate 140 corresponding to the circuit board 200 can be flush with each other and located in the same plane, which can avoid the formation of a step structure on the surfaces of the top plate 110, the bottom plate 120, the first side plate 130 and the second side plate 140, thereby improving the flatness of the outer shape and the space utilization of the shell 100, thereby improving the integrity of the computing device 10.

[0061] Figure 6 shows a schematic diagram of the partial structure of a computing device 10 according to an embodiment of the present application; Figure 7 shows an exploded view of the computing device 10 shown in Figure 6. In one embodiment, as shown in Figures 2, 6 and 7, the circuit board 200 may include a first surface 210 and a second surface 220 that are arranged relative to each other, and a plurality of heat-generating components 211 arranged in an array are arranged on the first surface 210 to realize the computing function of the computing device. Exemplarily, the areas of the plurality of heat-generating components 211 may be equal, and / or the device types of the plurality of heat-generating components 211 may be the same, so as to facilitate the arrangement of the heat-generating components 211 on the circuit board 210. For example, the plurality of heat-generating components 211 may all be chips.

[0062] In one embodiment, the computing device 10 may further include a heat sink 400. The heat sink 400 is disposed on the first surface 210 and / or the second surface 220. In other words, the heat sink 400 may be disposed on the first surface 210 of the circuit board 200, while the heat sink 400 may not be disposed on the second surface 220 of the circuit board 200; or the heat sink 400 may be disposed on the second surface 220 of the circuit board 200, while the heat sink 400 may not be disposed on the first surface 210 of the circuit board 200; or the heat sink 400 may be disposed on both the first surface 210 and the second surface 220 of the circuit board 200.

[0063] In this way, the heat generated by the heat-generating components 211 on the circuit board 200 during operation can be transferred to the heat sink 400. When the fan assembly 300 is in operation, external cold air can flow from the first air inlet 141 into the first air duct and then flow through the heat sink 400, thereby removing the heat from the heat sink 400, effectively reducing the temperature of the circuit board 200 and ensuring the normal operation of the heat-generating components 211.

[0064] For example, when there is only one heat sink 400, the heat sink 400 can be disposed on the first surface 210 of the circuit board 200 or on the second surface 220 of the circuit board 200. When there are multiple heat sinks 400, the multiple heat sinks 400 can all be disposed on the first surface 210 of the circuit board 200; or, the multiple heat sinks 400 can all be disposed on the second surface 220 of the circuit board 200; or, some of the multiple heat sinks 400 can be disposed on the first surface 210 of the circuit board 200, and another portion of the multiple heat sinks 400 can be disposed on the second surface 220 of the circuit board 200. When the heat sink 400 is disposed on the first surface 210 of the circuit board 200, the heat sink 400 can be in direct contact with the heat-generating component 211 or in indirect contact with the heat-generating component 211 via a thermally conductive material (such as silicone grease). A rivet nut standoff can be disposed on the base plate 120, and the heat sink 400 can be fixedly connected to the rivet nut standoff via fasteners such as bolts, thereby achieving installation of the heat sink 400.

[0065] In one embodiment, referring to Figures 2, 6, and 7, the heat sink 400 includes a liquid cooling tube 430 and a plurality of heat dissipating fins 440 arranged at intervals. The direction in which each heat dissipating fin 440 extends is the same as the wind direction in the first air duct. The liquid cooling tube 430 is provided through the plurality of heat dissipating fins 440 along the arrangement direction of the plurality of heat dissipating fins 440. In the description of this application, "plurality" means two or more.

[0066] For example, the heat dissipation fins 440 can be perpendicular to the first surface 210 and the second surface 220 of the circuit board 200. A heat dissipation channel can be defined between two adjacent heat dissipation fins 440. Since the extension direction of each heat dissipation fin 440 is the same as the wind direction in the first air duct, the extension direction of the heat dissipation channel is the same as the wind direction in the first air duct. A coolant, such as water, is provided in the liquid cooling tube 430. The heat generated during the operation of the heat-generating component 211 can be conducted to the heat dissipation fins 440. Since the liquid cooling tube 430 is passed through multiple heat dissipation fins 440, the heat dissipation fins 440 can conduct part of the heat to the coolant in the liquid cooling tube 430, thereby exchanging heat with the coolant. When the fan assembly 300 is working, external cold air can flow into the first air duct from the first air inlet 141, and then flow through the heat dissipation channel, thereby achieving heat exchange with the radiator 400, reducing the temperature of the radiator 400 and the circuit board 200, and achieving normal operation of the heat-generating component 211. The hot air after heat exchange can flow out from the first air outlet 111 under the action of the fan assembly 300.

[0067] In this embodiment, since the direction of extension of the heat sink fins 440 is the same as the wind direction within the first air duct, the cold air can better remove heat when passing through the heat sink fins 440, effectively improving heat dissipation efficiency. Moreover, by providing the liquid cooling tube 430, the coolant within the liquid cooling tube 430 has better thermal conductivity, which can more quickly absorb and transfer heat, further improving heat dissipation efficiency. By locating both the circuit board 200 and the fan assembly 300 within the air duct, the internal structure of the computing device 10 is made more compact, improving the space utilization within the housing 100, and making the appearance of the computing device 10 more regular, while also improving the safety of the user's heating.

[0068] In one embodiment, referring to Figures 2, 6, and 7, the heat sink 400 includes a first heat sink 410 and a second heat sink 420. The first heat sink 410 is disposed on the first surface 210, and the second heat sink 420 is disposed on the second surface 220. In the arrangement direction of the plurality of heat sink fins 440, the size of the second heat sink 420 is larger than the size of the first heat sink 410. For example, Figures 6 and 7 illustrate two heat sinks 400, namely the first heat sink 410 and the second heat sink 420.

[0069] In this embodiment, by providing the above-mentioned first heat sink 410 and second heat sink 420, heat from the first surface 210 of the circuit board 200 can be effectively transferred to the first heat sink 410, and heat from the second surface 220 of the circuit board 200 can be effectively transferred to the second heat sink 420. When wind blows from the first air inlet 141 of the first air duct to the first air outlet 111, heat from the first heat sink 410 and the second heat sink 420 can be effectively removed, thereby achieving effective heat dissipation of the circuit board 200. In addition, since functional modules (such as sensors) with relatively high height are generally provided on the first surface 210 of the circuit board 200, by making the size of the second heat sink 420 larger than that of the first heat sink 410, the smaller first heat sink 410 can effectively avoid the heat, which is beneficial for the overall installation of the computing device 10. At the same time, the larger second heat sink 420 has a better heat dissipation effect, thereby effectively reducing the temperature of the heat-generating component 211, ensuring the normal operation of the heat-generating component 211 and extending its service life.

[0070] In one embodiment, referring to Figures 2, 6 and 7, the heat sink 400 may further include a heat dissipation substrate 450, a plurality of heat dissipation fins 440 are arranged on the heat dissipation substrate 450, and the heat dissipation substrate 450 is connected to the circuit board 200; wherein, along the wind direction in the first air duct, the size of at least part of the first heat dissipation fins 440 is smaller than the size of at least part of the remaining heat dissipation fins 440; the first heat dissipation fins 440 are the heat dissipation fins 440 corresponding to the connection area between the heat dissipation substrate 450 and the circuit board 200.

[0071] It should be noted that “the heat dissipation fins 440 corresponding to the connection area between the heat dissipation substrate 450 and the circuit board 200 ” refer to the heat dissipation fins 440 corresponding to the connection area between the heat dissipation substrate 450 and the circuit board 200 in the wind direction within the first air duct.

[0072] Among them, the above-mentioned "the size of at least part of the first heat dissipation fins 440 is smaller than the size of at least part of the remaining heat dissipation fins 440" may include the following four situations: the first: the size of each first heat dissipation fin 440 is smaller than the size of all other heat dissipation fins 440; the second: the size of each first heat dissipation fin 440 is smaller than the size of the remaining heat dissipation fins 440; the third: the size of some first heat dissipation fins 440 is smaller than the size of all other heat dissipation fins 440; the fourth: the size of some first heat dissipation fins 440 is smaller than the size of the remaining heat dissipation fins 440.

[0073] For example, the computing device 10 may further include a first fastener, such as a bolt. The first fastener may sequentially pass through the heat dissipation substrate 450 of the first heat sink 410 and the circuit board 200 before being connected to the heat dissipation substrate 450 of the second heat sink 420, or sequentially pass through the heat dissipation substrate 450 of the first heat sink 410, the circuit board 200, and the heat dissipation substrate 450 of the second heat sink 420 before being connected to the second fastener. The second fastener may be a nut.

[0074] In this embodiment, by making the size of at least part of the first heat dissipating fins 440 smaller than the size of at least part of the remaining heat dissipating fins 440 along the wind direction in the first air duct, the first heat dissipating fins 440 can play an effective avoidance role, so that the connection area between the heat dissipating substrate 450 and the circuit board 200 can be used for arranging fasteners, thereby realizing the assembly of the first heat sink 410, the circuit board 200 and the second heat sink 420.

[0075] In one embodiment, the second radiator 420 can be connected to the housing 100 by fasteners. In this way, the second radiator 420 can be used to support the weight of the circuit board 200 and the first radiator 410. Since the size of the second radiator 420 is larger than the size of the first radiator 410, the second radiator 420 has a larger support area, which helps to disperse the weight of the circuit board 200 and the first radiator 410, achieves uniform distribution of loads, reduces the risk of single-point concentration, and helps to improve the load-bearing capacity and vibration resistance of the entire computing device 10. Moreover, since the second radiator 420 is usually made of solid metal or other high-strength materials, it can provide better structural stability when used as a support structure. In addition, the second radiator 420 used as a support structure can effectively reduce the stress of the circuit board 200 when it is subjected to mechanical shock or vibration, reduce its force burden, and thus extend the service life of the circuit board 200.

[0076] In one embodiment, the top of the first air inlet 141 is flush with the top of the radiator 400, and the bottom of the first air inlet 141 is flush with the bottom of the radiator 400. For example, the top of the first air inlet 141 can be flush with the top of the first radiator 410, and the bottom of the first air inlet 141 can be flush with the bottom of the second radiator 420. This ensures that air flowing from the first air inlet 141 to the first air outlet 111 can flow through the radiator 220, effectively dissipating heat from the circuit board 200. At the same time, the risk of air flowing into the gap between the radiator 220 and the housing 100 can be reduced, thereby preventing air leakage and crossflow.

[0077] It should be noted that: in the above scheme, flush refers to the situation with obvious height difference, for example, the height difference between the two surfaces is more than 2 cm. The flush here can be understood as: the top of the first air inlet 141 and the top of the radiator 400 are in the same plane or have a certain deviation distance, but the visual effect is almost flush, and the bottom of the first air inlet 141 and the bottom of the radiator 400 are in the same plane or have a certain deviation distance, but the visual effect is almost flush; those skilled in the art can understand that the first air inlet 141 and the radiator 400 in the above scheme may not be strictly flush due to screws, protective layer structure, reinforcement structure or paint, but as long as they are basically flush, they are within the protection scope defined by "flush with each other" in this application.

[0078] In an optional embodiment, the distance between two adjacent heat sinks 440 may be 3 mm to 6 mm (including endpoint values). Exemplarily, the distance between two adjacent heat sinks 440 may be 3 mm or 6 mm, but is not limited thereto. Specifically, for example, when the distance between two adjacent heat sinks 440 is less than 3 mm, the distance between the two adjacent heat sinks 440 is too small, resulting in an excessively high density of the heat sinks 440, an excessively small heat dissipation space between the two adjacent heat sinks 440, excessively high wind resistance, and severe dust accumulation; when the distance between two adjacent heat sinks 440 is greater than 6 mm, the distance between the two adjacent heat sinks 440 is too large, reducing the total surface area of ​​the heat sinks 440 and affecting the heat dissipation effect.

[0079] In this embodiment, by setting the distance between two adjacent heat dissipation fins 440 to 3mm to 6mm, wind resistance can be reduced, ventilation volume can be increased, dust accumulation can be improved, and the heat dissipation area of ​​the heat dissipation fins 440 can be relatively large, thereby effectively dissipating the heat generated by multiple heat-generating components 211 during operation.

[0080] In one embodiment, as shown in Figures 3, 6, and 7, the computing device 10 may further include a control module 500. The control module 500 is electrically connected to both the fan assembly 300 and the circuit board 200. The control module 500 is disposed at one axial end of the fan assembly 300. For example, during installation, the control module 500 may be first connected to the fan assembly 300 using fasteners such as screws. The heat sink 400 may then be connected to the base plate 120 using fasteners such as screws, and the fan assembly 300 may also be connected to the base plate 120 using fasteners such as screws. Finally, the entire upper housing structure may be assembled using fasteners such as screws.

[0081] In this embodiment, by providing the aforementioned control module 500, the control module 500 can control the operation of the circuit board 200 and the fan assembly 300, thereby ensuring heat dissipation while achieving computing functions, thereby improving the reliability and long-term stability of the computing device 10. Furthermore, by arranging the control module 500 at one axial end of the fan assembly 300, the arrangement of the control module 500 is more rational, making the distance between the control module 500, the fan assembly 300, and the circuit board 200 closer, thereby facilitating the routing of the control module 500 and the fan assembly 300, as well as between the control module 500 and the circuit board 200.

[0082] In one embodiment, the driver 320 of the fan assembly 300 is electrically connected to the control module 500. In this way, the control module 500 can control the driver 320 to operate, so that the driver 320 drives the impeller 310 to rotate, so that air can flow in the direction from the first air inlet 141 to the first air outlet 111. Exemplarily, the control module 500 may include a fan interface, which is connected to the fan assembly 300 so that the control board can control the operation of the fan assembly 300. For example, the fan interface can be connected to the driver 320 of the fan assembly 300. The circuit board 200 can be provided with a first signal socket, and the control module 500 can include a second signal socket, and the first signal socket is connected to the second signal socket so that the control module 500 can control the operation of the circuit board 200.

[0083] In one embodiment, as shown in Figures 3 and 4, the control module 500 may include a power connector 510, a reset controller 520, and a switch controller 530. The power connector 510 corresponds to the power interface 10a provided on the housing 100, the reset controller 520 corresponds to the reset interface 10b provided on the housing 100, and the switch controller 530 corresponds to the switch interface 10c provided on the housing 100. With this configuration, a user can control the reset controller 520 via the reset interface 10b on the housing 100, thereby resetting the computing device 10 and ensuring normal operation of the computing device 10. Similarly, a user can control the switch controller 530 via the switch interface 10c on the housing 100, thereby turning the computing device 10 on when it is off, and turning it off when it is on. Furthermore, a user can connect the power connector 510 via the power interface 10a to enable power transmission. For example, the power connector 510 may be a Type-C interface, but is not limited thereto.

[0084] In one embodiment, the power interface 10a, the reset interface 10b, and the switch interface 10c can be provided on the top plate of the housing 100. In this way, the user can directly find and perform corresponding operations on the top plate, for example, it is more convenient to plug and unplug the power cord through the power interface 10a, perform a reset operation through the reset interface 10b, and control the switch of the computing device 10 through the switch interface 10c, saving time and energy. Moreover, arranging the power interface 10a, the reset interface 10b, and the switch interface 10c on the top plate of the housing 100 can reduce the risk of misoperation, allowing the user to more clearly observe the position of the power interface 10a, the reset interface 10b, and the switch interface 10c, avoiding accidentally inserting fingers or other objects into the wrong position, thereby improving the safety and reliability of the computing device 10. In addition, centrally arranging the power interface 10a, the reset interface 10b, and the switch interface 10c on the top plate helps to improve the aesthetic appearance of the computing device 10.

[0085] In one embodiment, the housing 100 may further include a mounting location, in which the display assembly 170 is mounted.

[0086] For example, the display component 170 can be used to cyclically play information such as Internet Protocol (IP), air inlet temperature, air outlet temperature, computing power, power consumption, etc. The pressing plate 160 can be in a long strip shape.

[0087] In one example, referring to Figures 4 and 5 , the mounting location can be a through-hole 150, through which the display assembly 170 is exposed, allowing a user to observe the image information or text information displayed on the display assembly 170 from the outside. For example, the mounting hole 150 can penetrate the top plate of the housing 100 along the wall thickness direction of the housing 100. At least a portion of the display assembly 170 is located within the first air duct.

[0088] In another example, the mounting location may be a mounting slot (not shown), with the display assembly 170 positioned within the mounting slot. In this case, the user can also observe the image or text displayed on the display assembly 170 from the outside. For example, the mounting slot may be formed by an inwardly recessed portion of the housing 100. The display assembly 170 may be positioned outside the first air duct.

[0089] In one embodiment, the computing device 10 may further include a pressure plate 160, which is fixedly connected to the housing 100, and the display assembly 170 is pressed between the pressure plate 160 and the inner wall of the housing 100. For example, the pressure plate 160 may be formed into a runway-shaped structure. The computing device 10 may include a third fastener. During installation, the third fastener may pass through the pressure plate 160 and be fixedly connected to the top plate of the housing 100. Furthermore, there may be two third fasteners, and the two third fasteners may be respectively located at both ends of the pressure plate 160. In this embodiment, through the above arrangement, while ensuring that the user can observe the information displayed by the display assembly 170 from the outside, the structural stability and reliability of the display assembly 170 can also be ensured.

[0090] In this embodiment, through the above arrangement, while ensuring that the user can observe the information displayed by the display component 170 from the outside, the structure of the display component 170 is made more stable and reliable.

[0091] Other components of the computing device 10 in the above embodiment may adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0092] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on this application.

[0093] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or to implicitly indicate the quantity of the technical features indicated. Thus, features defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0094] In this application, unless otherwise expressly specified or limited, terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0095] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0096] The disclosure above provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described above. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0097] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily conceive of various modifications or substitutions within the technical scope disclosed in this application, and such modifications or substitutions should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A computing device, characterized in that include: A housing, wherein a first air duct having a first air inlet and a first air outlet is defined in the housing; A circuit board is arranged in the first air duct; The fan assembly is arranged in the first air duct, and along the wind direction in the first air duct, the circuit board is located in the upwind direction, the fan assembly is located in the downwind direction, the fan assembly includes a drivable impeller, and the circuit board is located on one side of the impeller in the radial direction.

2. The computing device according to claim 1, wherein: The first air inlet is arranged on any side plate of the shell, and the first air outlet is arranged on the top plate of the shell.

3. The computing device according to claim 2, characterized in that The shell includes a top plate and a bottom plate arranged opposite to each other, two first side plates arranged opposite to each other, and two second side plates arranged opposite to each other, wherein the first side plates are located in the axial direction of the fan assembly, wherein the first air inlet is arranged at one of the two second side plates, and the first air outlet is arranged at the top plate.

4. The computing device according to claim 1, wherein: The fan assembly also includes a driver, which is transmission-connected to one axial end of the impeller.

5. The computing device of claim 1, wherein: The fan assembly includes a fan housing, and a second air duct having a second air inlet and a second air outlet is defined in the fan housing. The second air inlet is arranged opposite to the circuit board, and the second air outlet is arranged opposite to the first air outlet.

6. The computing device according to claim 4, characterized in that The fan assembly comprises a fan housing, the impeller is located in the fan housing, and the driver is installed on the fan housing.

7. The computing device according to claim 1, wherein: Also includes: The control module is electrically connected to the fan assembly and the circuit board, and the control module is arranged at one axial end of the fan assembly.

8. The computing device according to claim 7, characterized in that The driver of the fan assembly is electrically connected to the control module.

9. The computing device according to claim 7, characterized in that The control module includes a power connector, a reset controller and a switch controller; wherein the power connector corresponds to the power interface set on the shell, the reset controller corresponds to the reset interface set on the shell, and the switch controller corresponds to the switch interface set on the shell.

10. The computing device according to claim 9, characterized in that The power interface, the reset interface and the switch interface are arranged on the top plate of the housing.

11. The computing device according to claim 1, wherein: The circuit board comprises a first surface and a second surface which are arranged opposite to each other, and a plurality of heat generating components are arranged in an array on the first surface.

12. The computing device according to claim 11, characterized in that The areas of the multiple heat-generating components are equal, and / or the device types of the multiple heat-generating components are the same.

13. The computing device according to claim 11, characterized in that The computing device further includes a heat sink disposed on the first surface and / or the second surface.

14. The computing device according to claim 13, characterized in that The radiator includes a liquid cooling tube and a plurality of heat dissipating fins arranged at intervals, the extension direction of each of the heat dissipating fins is the same as the wind direction in the first air duct, and the liquid cooling tube is passed through the plurality of heat dissipating fins along the arrangement direction of the plurality of heat dissipating fins.

15. The computing device according to claim 14, characterized in that The heat sink includes a first heat sink and a second heat sink, wherein the first heat sink is disposed on a first surface, and the second heat sink is disposed on a second surface, wherein along an arrangement direction of the plurality of heat sink fins, a size of the second heat sink is larger than a size of the first heat sink.

16. The computing device according to claim 15, characterized in that The heat sink further comprises a heat dissipation substrate, the plurality of heat dissipation fins are arranged on the heat dissipation substrate, and the heat dissipation substrate is connected to the circuit board.

17. The computing device according to claim 16, characterized in that in, Along the wind direction in the first air duct, the size of at least part of the first heat dissipation fins is smaller than the size of at least part of the remaining heat dissipation fins; the first heat dissipation fins are heat dissipation fins corresponding to the connection area between the heat dissipation substrate and the circuit board.

18. The computing device according to claim 15, characterized in that The second heat sink is connected to the housing via fasteners.

19. The computing device according to claim 18, characterized in that The second heat sink is used to support the weight of the circuit board and the first heat sink.

20. The computing device of claim 13, wherein: The top of the first air inlet is flush with the top of the radiator, and the bottom of the first air inlet is flush with the bottom of the radiator.

21. The computing device of claim 14, wherein: The distance between two adjacent heat dissipation fins is 3 mm to 6 mm.

22. The computing device of claim 1, wherein: The housing comprises a mounting position in which a display assembly is mounted.

23. The computing device according to any one of claims 1 to 22, characterized in that: The first air outlet is communicated with a heat recovery system.

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