Electrode sheet and purification and dust removal device

Abstract

An electrode sheet, comprising a body (100), the body (100) comprising conductive layers (102) located inside semiconductor layers (101); a plurality of fixed mounting positions (105) and a plurality of clearance ports (106) are provided on edges of the body (100) in the length direction thereof; the body (100) further comprises an insulating layer (108), the semiconductor layers (101) being arranged on two sides of the insulating layer (108), and the conductive layers (102) being located inside the semiconductor layers (101). Further provided is a purification and dust removal device, comprising a frame body (300); a plurality of grounding electrode sheets and high-voltage electrode sheets which are alternately stacked are arranged in the frame body (300). The present invention can solve the technical problems existing in the prior art that a thin dust layer forming on a dust collection surface causes a back corona phenomenon, repels the capture of particulate matter and affects purification efficiency.

Description

Electrode sheet and purification and dust removal device Technical Field

[0001] The invention belongs to the technical field of air purification, and in particular relates to an electrode sheet and a purification and dust removal device. Background Art

[0002] Currently, the mainstream technologies for air purification are categorized as filtration and electrostatic. Filtration purifies the air by filtering or adsorbing pollutants in the air through fibers and fiber-based filter materials. The technology is mature and its operation is relatively stable. However, labor costs, material costs, operating costs, and maintenance costs are very high, and improper maintenance can pose certain safety risks. Because the filter material continuously intercepts pollutants in the air, the gaps between the fibers are constantly clogged, and wind resistance continues to increase. Therefore, the filter material needs to be frequently cleaned and replaced. At the same time, bacteria and viruses in the air are trapped in the filter material, causing bacterial growth, mold, and odor. Electrostatic technology charges particles in the gas through the ionization module. The charged particles are then adsorbed by the electric field formed by the dust collection module, completing the purification process.

[0003] Various high-voltage electrostatic dust removal devices developed and designed using the technical principles of electrostatic technology can complete the purification of a wider flow rate and a more complete range of particle pollution, can achieve relatively stable use under different temperature, humidity and other environments, and can be well used in air filtration treatment in household, commercial, industrial, tunnel, subway and other fields. It has the technical characteristics of long service life, high purification efficiency, low operating cost and low maintenance cost.

[0004] Purification devices made of dust collecting plates made of conductive material wrapped in insulating material can create a large surface area for collecting dust because the distance between the dust collecting plates can be made very close, so that the dust collecting plates can capture more particulate matter and other pollutants. In the dust collecting module formed of conductive material wrapped in insulating material, as the amount of particulate matter accumulates in the later stages of operation, a thin layer of dust forms on the dust collecting surface. The thin layer of dust produces a back corona phenomenon, forming an electric charge accumulation with the same charge as the particulate matter on the surface of the thin layer of dust, which in turn repels the capture of particulate matter and affects the purification efficiency of the dust collecting module. Currently, there is a lack of a new dust collecting module structure that can quickly transfer the charge of captured particulate matter, making the dust collecting module more efficient and durable, and extending the maintenance cycle. Summary of the Invention

[0005] In view of the various deficiencies in the prior art, an electrode sheet and a purification and dust removal device are proposed to solve the technical problem in the prior art that the thin dust layer formed on the dust collecting surface produces a back corona phenomenon, thereby repelling the capture of particulate matter and affecting the purification efficiency of the purification and dust removal device.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] In a first aspect, the present invention provides an electrode sheet, comprising a body, the body comprising a conductive layer located within a semiconductor layer, the edge of the body being provided with a plurality of fixed mounting positions and a plurality of avoidance ports along its length;

[0008] The body further includes an insulating layer, the semiconductor layer is provided on both sides of the insulating layer, and the conductive layer is located inside the semiconductor layer.

[0009] The technical solution is further configured such that one end portion of the body serves as a power connection end, and the power connection end is provided with a closed-end power connection port.

[0010] The technical solution is further configured such that the length of the conductive layer is smaller than the length of the semiconductor layer, and the conductive layer extends to the power connection end.

[0011] The technical solution is further configured such that the area of ​​the end portion of the conductive layer located at the power connection end is smaller than the area of ​​the other end portion of the conductive layer.

[0012] The technical solution is further configured such that a process circular hole is provided at the end of the body, and the distance between the process circular hole and the end of the body is 2-5 mm.

[0013] The technical solution is further configured such that the fixed installation position and the avoidance port are respectively configured as a slot-shaped opening and / or a semicircular opening.

[0014] The technical solution is further configured such that a groove facing the avoidance port is provided inside the fixed installation position.

[0015] The technical solution is further configured such that the distances between the edge of the conductive layer and the fixed installation position and the avoidance port are equal.

[0016] The present technical solution is further configured as follows: the conductive layer is made of a conductive material and an additive, the conductive material includes graphite, graphene or conductive ink, the additive includes silicone, the semiconductor layer is made of a polymer material and a thermally conductive material, the polymer material includes polyvinyl chloride, polyethylene, polypropylene, ABS plastic or polytetrafluoroethylene, the thermally conductive material includes one or a combination of aluminum oxide, silicon dioxide, metal powder, silicon nitride, aluminum nitride, zinc oxide, calcium oxide, graphite, and graphene, and the insulating layer is made of one or more of polypropylene, ABS plastic, polyamide, polyoxymethylene, polytetrafluoroethylene or polycarbonate.

[0017] The technical solution is further configured such that the thickness of the insulating layer is 0.1-1.0 mm, the thickness of the semiconductor layer is 0.05-0.5 mm, and the thickness of the conductive layer is 0.005-0.03 mm.

[0018] The technical solution is further configured such that an adhesive layer is provided between the semiconductor layer and the insulating layer and the conductive layer.

[0019] In a second aspect, the present invention provides a purification and dust removal device, comprising a frame, wherein a plurality of grounding electrode sheets and high-voltage electrode sheets alternately stacked are provided inside the frame, and both the grounding electrode sheets and the high-voltage electrode sheets adopt the electrode sheets described above.

[0020] The technical solution is further configured such that the ground electrode sheet and the high-voltage electrode sheet are respectively connected to fixed isolation members, and the fixed isolation members are insulating glue and / or rigid insulating members.

[0021] The technical solution is further configured such that an insulating adhesive layer is provided between the frame and the end of the electrode sheet, and the insulating adhesive layer covers the process circular hole at the end of the electrode sheet.

[0022] The technical solution is further configured such that the ground electrode sheet and the high-voltage electrode sheet are staggered 180°, and there is a gap between the ends of the two, and the insulating adhesive layer does not cover or covers the gap.

[0023] The technical solution is further configured such that the thickness of the semiconductor layer of the dust collecting layer electrode sheet is smaller than the thickness of the semiconductor layer of the non-dust collecting layer electrode sheet.

[0024] The technical solution is further configured to further include a high-voltage power supply, which is located on the inner side or the outer side of the frame.

[0025] The beneficial effects of the present invention are:

[0026] 1. By adding an insulating layer in the middle of the electrode sheet, the strength and stability of the electrode sheet are improved. The semiconductor layer on the dust collecting surface of the electrode sheet has both the insulation of the insulating material and the conductivity of the conductive material. Therefore, while ensuring electrical safety, it can quickly transfer the charge of the captured particles, reduce the occurrence of back corona, increase the dust holding capacity, and extend the maintenance cycle.

[0027] 2. The design of the avoidance port can stagger the connection between the grounding electrode sheet and the high-voltage electrode sheet and the fixed isolation piece to avoid the formation of leakage current between the grounding electrode sheet and the high-voltage electrode sheet, which affects the capture of particulate matter, while maintaining the stability of the purification and dust removal device structure and extending the maintenance cycle.

[0028] 3. The electrode sheets of this structure are used to make a purification and dust removal device, which can not only improve the stability of the purification and dust removal device and ensure the normal use of the purification and dust removal device, but also effectively reduce the distance between the electrode sheets, increase the dust collection area, so as to capture more pollutants, improve purification efficiency, and increase dust holding capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a top view of an electrode sheet according to an embodiment of the present invention;

[0030] FIG2 is a side view of an electrode sheet according to an embodiment of the present invention;

[0031] FIG3 is a top view of another embodiment of the electrode sheet according to the present invention;

[0032] FIG4 is a top view of another embodiment of the electrode sheet according to the present invention;

[0033] FIG5 is a top view of another embodiment of the electrode sheet according to the present invention;

[0034] FIG6 is a top view of another embodiment of the electrode sheet according to the present invention;

[0035] FIG7 is a top view of another embodiment of the electrode sheet according to the present invention;

[0036] FIG8 is a top view of another embodiment of the electrode sheet according to the present invention;

[0037] FIG9 is a top view of another embodiment of the electrode sheet according to the present invention;

[0038] FIG10 is a top view of another embodiment of the electrode sheet according to the present invention;

[0039] FIG11 is a top view of another embodiment of the electrode sheet according to the present invention;

[0040] FIG12 is a schematic diagram of a purification and dust removal device according to an embodiment of the present invention;

[0041] FIG13 is an exploded view of a purification and dust removal device according to an embodiment of the present invention;

[0042] FIG14 is a partial schematic diagram of point A in FIG13 .

[0043] In the drawings: 100, body; 200, fixed spacer; 300, frame; 400, conductor; 500, insulating layer; 600, wire; 700, electrode sheet; 800, gap;

[0044] 101. Semiconductor layer; 102. Conductive layer; 103. Process circular hole; 104. Insulation gap; 105. Fixed installation position; 106. Avoidance port; 107. Power connection port; 108. Insulation layer; 109. First electrical safety area; 110. Second electrical safety area; 111. Groove. DETAILED DESCRIPTION

[0045] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention is clearly and completely described below in conjunction with the drawings of the present invention. Based on the embodiments in this application, other similar embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application. In addition, the directional words mentioned in the following embodiments, such as "up", "down", "left", "right", etc., are only reference to the directions of the drawings. Therefore, the directional words used are used to illustrate rather than limit the invention.

[0046] According to an embodiment of the present invention, an electrode sheet is provided, as shown in Figures 1 and 2 , including a body 100 , wherein the body 100 includes a conductive layer 102 located within a semiconductor layer 101 , and the edge of the body 100 is provided with a plurality of fixed mounting positions 105 and a plurality of avoidance ports 106 along its length.

[0047] The body 100 further includes an insulating layer 108 . The semiconductor layer 101 is disposed on both sides of the insulating layer 108 . The conductive layer 102 is located inside the semiconductor layer 101 .

[0048] It should be noted that by adding an insulating layer to the middle of the electrode sheet, the strength and stability of the electrode sheet are improved. The semiconductor layer on the dust collecting surface of the electrode sheet has both the insulation of the insulating material and the conductivity of the conductive material. Therefore, while ensuring electrical safety, the charge of the captured particulate matter can be quickly transferred, the occurrence of back corona can be reduced, the dust holding capacity can be increased, and the maintenance cycle can be extended. The design of the avoidance port can stagger the connection between the grounding electrode sheet and the high-voltage electrode sheet with the fixed isolation piece to avoid the formation of leakage current between the grounding electrode sheet and the high-voltage electrode sheet, which affects the capture of particulate matter, while maintaining the stability of the structure of the purification and dust removal device and extending the maintenance cycle. The purification and dust removal device made of electrode sheets with this structure can not only improve the stability of the purification and dust removal device and ensure the normal use of the purification and dust removal device, but also effectively reduce the spacing between the electrode sheets, increase the dust collecting area, so as to capture more pollutants, improve purification efficiency, and increase dust holding capacity.

[0049] Specifically, the conductive layer 102 is configured as a strip, which can be configured as one strip or multiple strips.

[0050] In the electrode sheet of this embodiment, please refer to FIG. 1 . One end of the body 100 serves as a power connection end, and the power connection end is provided with a closed power connection port 107 .

[0051] It should be noted that the power connection is achieved by inserting a metal wire / rod into the power connection port 107 , and the closed-end power connection port 107 exerts an inward force on the metal wire / rod, so that the metal wire / rod and the conductive layer 102 have a higher fit.

[0052] Referring to Figure 1 , the closed-end power connection port 107 includes an open end and a closed end, with a protruding end disposed between the open and closed ends. The metal wire / rod enters the power connection port 107 from the open end. The cross-section of the closed-end power connection port 107 is an isosceles trapezoid, with the upper base of the isosceles trapezoid serving as the open end, the lower base of the isosceles trapezoid serving as the closed end, and the waist of the isosceles trapezoid serving as the protruding end. The protruding end exerts an inward force on the metal wire / rod, achieving a snap connection between the power connection port 107 and the metal wire / rod.

[0053] Preferably, the angle between the protruding end and the horizontal direction is 10-25°. When the angle is less than 10°, the power connection port 107 and the metal wire / rod are easier to engage, but the secureness after engagement is poor. When the angle is greater than 25°, the power connection port 107 and the metal wire / rod are more difficult to engage, but the secureness after engagement is good. When the angle is 15°, the power connection port 107 and the metal wire / rod are easier to engage, and the secureness after engagement is good.

[0054] In addition, an arc matching the metal wire / rod can be provided at the protruding end, so that after the metal wire / rod is inserted into the power connection port 107 , a portion of the metal wire / rod falls into the arc, making the connection tighter.

[0055] Please refer to Figure 3. The cross-section of the closed-end power connection port 107 is in the shape of an arc. The contact area between the arc and the metal wire / rod is increased, and the power connection stability is better. Preferably, the arc is a superior arc. The diameter of the metal wire / rod matches the arc, and the gap is 0.2-1mm. When the gap is less than 0.2mm, the gap between the metal wire / rod and the arc is too small, making it difficult to connect, and the production and processing technology requirements are too high. When the gap is greater than 1mm, the gap between the metal wire / rod and the arc is too large, and it will become loose after connecting, resulting in poor power connection stability.

[0056] In the electrode sheet of this embodiment, referring to FIG. 1 , the length of the conductive layer 102 is smaller than the length of the semiconductor layer 101 , and the conductive layer 102 extends to the electrical connection end.

[0057] It should be noted that one end of the conductive layer 102 is flush with the end of the semiconductor layer 101 to achieve stable electrical connection, and the other end of the conductive layer 102 is not flush with the end of the semiconductor layer 101.

[0058] In this embodiment, the area of ​​the conductive layer 102 at the power connection end is smaller than the area of ​​the other end of the conductive layer 102 to enhance electrical safety. During assembly, several electrode sheets are docked inside the frame to form a purification and dust removal device. Furthermore, the ends of the body 100 are insulated from the frame, reducing the area of ​​the conductive layer 102 at the power connection end. This prevents the conductive layer 102 from coming too close to the frame for an electrical safety reason, which could affect stable operation later on.

[0059] Please refer to Figure 5. The end of the conductive layer 102 located at the power connection end is inclined from the entrance of the power connection port 107 toward the direction away from the power connection end. A first electrical safety area 109 is present between the power connection end and the conductive layer 102. Two first electrical safety areas 109 are symmetrically arranged, and the first electrical safety areas 109 are triangular. The symmetrical structural design can maintain the uniformity of the electrical safety distance.

[0060] Referring to Figure 6 , conductive layer 102 has a notch at the end of the power connection, forming a second electrical safety zone 110. Two second electrical safety zones 110 are symmetrically arranged, each in a square shape. This symmetrical design maintains a uniform electrical safety distance. Specifically, conductive layer 102 extends to the area between the notch and power connection port 107.

[0061] In the electrode sheet of this embodiment, please refer to Figures 1 and 4. A process circular hole 103 is provided at the end of the body 100. The distance between the process circular hole 103 and the end of the body 100 is 2-5 mm. At this time, the process circular hole 103 also serves as an electrical connection port 107.

[0062] It should be noted that the process circular hole 103 is moved to the end of the main body 100. During assembly, several electrode sheets are docked inside the frame to form a purification and dust removal device. At the same time, the end of the main body 100 and the frame are insulated, and the insulating glue can cover the process circular hole 103 to solve the purification blind spot generated near the process circular hole 103.

[0063] 1 , the process hole 103 is far away from the end of the body 100 . After assembly, the process hole 103 is exposed. An insulating gap 104 is provided between the process hole 103 and the conductive layer 102 to form a safe distance.

[0064] In the electrode sheet of this embodiment, referring to FIG. 1 , the fixed installation position 105 and the avoidance port 106 are respectively configured as a slot-shaped opening and / or a semicircular opening.

[0065] Specifically, referring to Figure 1 , the fixed mounting position 105 is configured as a shallow arc, and the escape port 106 is configured as a slot. Referring to Figure 7 , the fixed mounting position 105 is configured as a shallow arc, and the escape port 106 is configured as a semicircular opening. Alternatively, both the fixed mounting position 105 and the escape port 106 can be configured as slots. Referring to Figure 8 , both the fixed mounting position 105 and the escape port 106 are configured as slots, and the bottom surface of the fixed mounting position 105 is further configured with a semicircular, deeper opening.

[0066] In the electrode sheet of this embodiment, referring to FIG. 1 and FIG. 9 , a groove 111 facing the avoidance port 106 is defined inside the fixed installation position 105 .

[0067] It should be noted that the groove 111 increases the contact area between the fixed mounting position 105 and the colloid, which can realize vertical gluing of the purification and dust removal module. The vertical gluing can be carried out on two sides at the same time, and the production speed is faster. The design of the groove 111 allows more colloid to be immersed in the groove 111 when vertically gluing, and a combination of the colloid and the electrode sheet can be formed in the groove 111, resulting in a larger contact area and better firmness.

[0068] In the electrode sheet of this embodiment, referring to FIG. 11 , the distances between the edge of the conductive layer 102 and the fixed installation position 105 and the avoidance port 106 are equal.

[0069] It should be noted that the edge shape of the conductive layer 102 is designed based on the shape of the fixed installation position 105 and the avoidance port 106, so as to make full use of the effective area of ​​the main body 100 and maximize the proportion of the conductive layer 102 without affecting electrical safety. This helps to increase the area of ​​the purification and dust removal device (or electrode plate) for capturing particulate matter, increase the action time on particulate matter, improve the purification efficiency of particulate matter, and correspondingly increase the dust holding capacity of the purification and dust removal device.

[0070] 11 , the fixing position 105 and the avoidance port 106 are both semicircular, so the edge of the conductive layer 102 is wavy. 10 , the avoidance port 106 is a slot, so the edge of the conductive layer 102 is rectangular.

[0071] In order to verify whether conductive layers of different shapes affect the purification efficiency of the purification and dust removal device, the inventors conducted the following experiment to compare purification and dust removal devices with a length of 500 mm, a width of 400 mm, and a thickness of 50.8 mm. When the front end had the same ionization device and ionization voltage, and under the same environment, the PM2.5 purification efficiency of the purification and dust removal device was compared at two wind speeds. The experimental data are shown in Table 1.

[0072] Table 1:

[0073] Table 1 shows that the wavy conductive layer 102 (see Figure 11) has the largest proportion and achieves the highest PM2.5 purification efficiency at both wind speeds. The square conductive layer 102 (see Figure 10) has a proportion second only to the wavy conductive layer and also has a relatively high PM2.5 purification efficiency. At high wind speeds of 4 m / s, the standard conductive layer 102 (see Figure 7) has the smallest proportion, and the efficiency gap between it and the wavy and square conductive layers is the largest and most significant. Therefore, increasing the proportion of conductive layer 102 is beneficial to ensuring the PM2.5 purification efficiency of the dust removal device, and this efficiency increase will also increase the dust holding capacity of the dust removal device.

[0074] In the electrode sheet of this embodiment, please refer to Figures 1 and 2. The conductive layer 102 is made of conductive material and additives. The conductive material includes graphite, graphene or conductive ink, and the additive includes silicone, which can increase the material's heat resistance, water repellency and corona resistance.

[0075] The semiconductor layer 101 is made of a polymer material and a thermally conductive material. The polymer material includes polyvinyl chloride, polyethylene, polypropylene, ABS plastic, or polytetrafluoroethylene. The thermally conductive material includes one or a combination of aluminum oxide, silicon dioxide, metal powder, silicon nitride, aluminum nitride, zinc oxide, calcium oxide, graphite, and graphene. To achieve wide applicability while taking into account production and processing, and material costs, polyethylene (PE) is preferred. It has excellent low-temperature resistance and maintains good mechanical properties at -60°C. It is tasteless, odorless, non-toxic, matte, and milky white waxy particles with a melting point of 100-130°C. It is insoluble in water, remains flexible at low temperatures, has high electrical insulation, and has high thermal conductivity.

[0076] The insulating layer 108 is made of one or more of polypropylene, ABS plastic, polyamide, polyoxymethylene, polytetrafluoroethylene, or polycarbonate. The insulating layer 108 is made of a rigid material, leveraging its insulating and supportive properties to maintain the stiffness of the electrode sheet. Polycarbonate, also known as PC plastic, is preferred. It is colorless and transparent, heat-resistant, impact-resistant, and has excellent mechanical properties. It is flame-retardant grade BI, has a melting point of 220-230°C, and is flame-retardant and antioxidant.

[0077] In the electrode sheet of this embodiment, please refer to Figures 1 and 2. The thickness of the insulating layer 108 is 0.1-1.0mm, preferably 0.3mm. If the insulating layer 108 is too thin, such as less than 0.1mm, the supporting strength is insufficient and the electrode sheet is easily deformed. If the insulating layer 108 is too thick, such as greater than 1mm, the thickness of the electrode sheet is thicker under the condition that the dimensions of other layers are the same, the effective ventilation area per unit area of ​​the corresponding purification and dust removal device will be smaller, and the purification efficiency and dust holding capacity will be reduced. The range of 0.1-1mm can take into account both the support and the control of the electrode sheet thickness. The thickness of the semiconductor layer 101 is 0.05-0.5mm, preferably 0.15mm. If the semiconductor layer 101 is too thin, for example, less than 0.05mm, it will be difficult to process during production and prone to breakage during actual operation, affecting stability. If the semiconductor layer 101 is too thick, for example, greater than 0.5mm, the electrode sheet will be thicker, while the dimensions of other layers remain the same. This will reduce the effective ventilation area per unit area of ​​the corresponding dust removal device, resulting in reduced purification efficiency and dust holding capacity. A thickness of 0.05-0.5mm can achieve both conductivity and control of the electrode sheet thickness. The thickness of the conductive layer 102 is 0.005-0.03mm, preferably 0.01mm.

[0078] Specifically, an adhesive layer is provided between the semiconductor layer 101 , the insulating layer 108 and the conductive layer 102 , and the conductive layer 102 , the insulating layer 108 and the semiconductor layer 101 are integrated into one body by using the adhesive layer.

[0079] According to an embodiment of the present invention, a purification and dust removal device is provided, as shown in Figure 12, including a frame 300, wherein a plurality of grounding electrode sheets and high-voltage electrode sheets alternately stacked are provided inside the frame 300, and the grounding electrode sheets and the high-voltage electrode sheets both use the electrode sheets 700.

[0080] In the purification and dust removal device of this embodiment, please refer to FIG. 12 , the ground electrode sheet and the high-voltage electrode sheet are respectively connected to a fixed isolation member 200 , and the fixed isolation member 200 is an insulating glue and / or a rigid insulating member.

[0081] Specifically, insulating glue has high bonding strength and can withstand high and low temperature impacts, such as PUR glue on the market; hot melt glue can also be used for fixing. The application field of purification and dust removal devices fixed with hot melt glue is limited. It cannot be used in environments with large temperature differences throughout the year or large temperature differences between morning and evening. Hot melt glue easily becomes soft when exposed to high temperatures and cracks when exposed to low temperatures.

[0082] Among them, after the shallow arc opening is perfused with insulating glue and fixed, an approximately circular colloid is formed, and the circular colloid forms an equidistant safety distance with the avoidance port 106. At the same time, the size of the shallow arc opening is adapted to the amount of glue, and the colloid is flush with the edge of the electrode sheet, or slightly lower than the edge of the electrode sheet, that is, part of the colloid is in the shallow arc opening, and part is combined with the electrode sheet to form an approximately circular colloid, maintaining surface flatness and aesthetics. Alternatively, the fixed installation position 105 is a semicircular opening, and the avoidance port 106 is a deep arc opening. After the semicircular opening is perfused with insulating glue and fixed, an approximately circular colloid is formed, and the circular colloid forms an equidistant safety distance with the avoidance port 106. At the same time, the size of the semicircular opening is adapted to the amount of glue, and after the glue is applied, the colloid is flush with the edge of the electrode sheet, or slightly lower than the edge of the electrode sheet, that is, part of the colloid is in the semicircular opening, and part is combined with the electrode sheet to form an approximately circular colloid, maintaining surface flatness and aesthetics. The design of equidistant safety distance utilizes the natural sedimentation of insulating glue and the combination of insulating glue and electrode sheets to form a nearly circular colloid, which mainly includes the two forms mentioned above; the design of equidistant safety distance can maximize the proportion of the conductive layer of the electrode sheet, thereby improving the purification efficiency and dust holding capacity of the purification and dust removal device, and extending the maintenance cycle; the design of equidistant safety distance, in the later stage of the operation of the purification and dust removal device, a layer of dust will adhere to the surface of the colloid and the surface of the electrode sheet. The dust will have a certain conductivity when encountering high humidity and other environments, indirectly reducing the safety distance of the purification and dust removal device. At this time, the electrode sheets and colloids connected with different potential voltages will generate leakage current due to the reduction of the electrical safety distance, thereby reducing the purification efficiency of the purification and dust removal device and reducing the maintenance cycle.

[0083] Specifically, at the point where the rigid insulating member contacts the electrode sheet, the rigid insulating member increases in width along the length of the electrode sheet. Simultaneously, the rigid insulating member provides a gap between the electrode sheets to better secure the electrode sheets, increasing the fixed contact area for the electrode sheets and maintaining the stability of the spacing between the electrode sheets. Furthermore, insulating adhesive can be combined with the rigid insulating member, with one side of the electrode sheet secured with the rigid insulating member and the other side secured with insulating adhesive. Furthermore, after the rigid insulating member is secured to the electrode sheet, insulating adhesive is then used to secure it, increasing stability.

[0084] In the purification and dust removal device of this embodiment, please refer to Figures 1, 12 and 13. A conductor 400 and an insulating adhesive layer 500 are provided between the frame 300 and the end of the electrode sheet 700, and the insulating adhesive layer 500 covers the process circular hole 103 and the conductive port 107 at the end of the electrode sheet.

[0085] Specifically, the conductor 400 is located at the end of the electrode sheet 700 and is embedded in the power port 107. The insulating adhesive layer 500 is located between the conductor 400 and the frame 300 and covers the process circular hole 103 and the conductive port 107. At the same time, the ground electrode sheet and the high-voltage electrode sheet are electrically connected to the frame 300 via wires 600.

[0086] Specifically, referring to Figure 14, the ground electrode sheet and the high-voltage electrode sheet are staggered 180 degrees, and there is a gap 800 between their ends. The insulating adhesive layer does not cover the gap 800. In addition, the insulating adhesive layer may also cover the gap 800.

[0087] Specifically, the thickness of the semiconductor layer of the dust collecting layer electrode sheet is the same as the thickness of the semiconductor layer of the non-dust collecting layer electrode sheet, which is conducive to processing and production.

[0088] It should be noted that the dust collecting layer and non-dust collecting layer of the electrode sheet are related to the high voltage electricity supplied by the purification and dust removal device, as well as the high voltage electricity supplied by the front-end ionization device. Specifically, the electrical voltage is designed at the beginning, the high voltage power supply is matched, and the electrode sheets are matched accordingly during production. For example, the ionization device is a DC positive high voltage, and the particulate matter will be positively charged after passing through the ionization device. The electrode sheets of the purification and dust removal device are staggered and stacked, and the power supplied by some electrode sheets is a DC positive high voltage, and the power supplied by the other electrode sheets is connected to the ground electrode. For the purification and dust removal device, the electrode sheet that supplies DC positive high voltage is the non-dust collecting layer electrode sheet, and the grounded electrode sheet is the dust collecting layer electrode sheet.

[0089] Specifically, the thickness of the semiconductor layer of the dust collecting layer electrode sheet is smaller than the thickness of the semiconductor layer of the non-dust collecting layer electrode sheet.

[0090] It should be noted that, while ensuring electrical safety, the semiconductor layer thickness of the dust collecting layer electrode sheets is thinner than that of the non-dust collecting layer electrode sheets. In the initial stages of operation, the accumulation of particulate matter on the dust collecting surface is limited and has no impact on purification efficiency. As operation progresses, particulate matter accumulation increases, and the dust layer thickness increases. The thinned semiconductor layer quickly conducts away the particle charge, preventing the formation of back corona and ensuring purification efficiency.

[0091] In order to verify whether the difference in thickness of the semiconductor layer on the dust collecting surface and the non-dust collecting surface affects the purification efficiency of the purification and dust removal device, the inventors conducted the following experiment to compare purification and dust removal devices with a length of 500 mm, a width of 300 mm, and a thickness of 50.8 mm. When the ionization device and ionization voltage at the front end were the same, and under the same environment, the changes in PM2.5 purification efficiency were compared under two wind speeds during long-term operation of the purification and dust removal devices. The experimental data are shown in Table 2.

[0092] Table 2:

[0093] It can be intuitively concluded from Table 2 that when the thickness of the semiconductor layer on the dust collecting surface is smaller than that on the non-dust collecting surface, the semiconductor layer on the dust collecting surface is thinner, which is more conducive to the rapid transfer of charge of the captured particulate matter, and the back corona is not easily formed, which is more conducive to ensuring the purification efficiency of the purification and dust removal device and increasing the dust holding capacity.

[0094] In the purification and dust removal device of this embodiment, please refer to Figures 1, 12 and 13, it also includes a high-voltage power supply, which is located inside or outside the frame 300, that is, the high-voltage power supply can be built-in or external.

[0095] The present invention has been described in detail above. The above description is only a preferred embodiment of the present invention and should not limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made within the scope of this application should still fall within the scope of the present invention.

Claims

1. An electrode sheet, comprising a body, characterized in that: The body comprises a conductive layer located inside the semiconductor layer, and the edge of the body is provided with a plurality of fixed installation positions and a plurality of avoidance ports along its length direction; The body further comprises an insulating layer, the semiconductor layer is arranged on both sides of the insulating layer, and the conductive layer is located inside the semiconductor layer.

2. An electrode sheet according to claim 1, characterized in that: One end of the body is used as a power connection end, and the power connection end is provided with a closed power connection port.

3. An electrode sheet according to claim 2, characterized in that: The length of the conductive layer is shorter than that of the semiconductor layer, and the conductive layer extends to the power connection end.

4. An electrode sheet according to claim 3, characterized in that: The area of ​​the end portion of the conductive layer located at the power connection end is smaller than the area of ​​the other end portion of the conductive layer.

5. The electrode sheet according to claim 1, characterized in that: A technical round hole is provided at the end of the body, and the distance between the technical round hole and the end of the body is 2-5 mm.

6. The electrode sheet according to claim 1, characterized in that: The fixed installation position and the avoidance port are respectively configured as a slot-shaped opening and / or a semicircular opening.

7. The electrode sheet according to claim 1, characterized in that: The distances between the edge of the conductive layer and the fixed installation position and the avoidance port are equal.

8. The electrode sheet according to claim 1, characterized in that: The conductive layer is made of conductive material and additives, the conductive material includes graphite, graphene or conductive ink, the additive includes silicone, the semiconductor layer is made of polymer material and thermal conductive material, the polymer material includes polyvinyl chloride, polyethylene, polypropylene, ABS plastic or polytetrafluoroethylene, the thermal conductive material includes one or a combination of aluminum oxide, silicon dioxide, metal powder, silicon nitride, aluminum nitride, zinc oxide, calcium oxide, graphite, graphene, and the insulating layer is made of one or more of polypropylene, ABS plastic, polyamide, polyoxymethylene, polytetrafluoroethylene or polycarbonate.

9. An electrode sheet according to claim 8, characterized in that: The thickness of the insulating layer is 0.1-1.0 mm, the thickness of the semiconductor layer is 0.05-0.5 mm, and the thickness of the conductive layer is 0.005-0.03 mm.

10. The electrode sheet according to claim 1, characterized in that: An adhesive layer is provided between the semiconductor layer, the insulating layer and the conductive layer.

11. A purification and dust removal device, comprising a frame, characterized in that: A plurality of alternately stacked grounding electrode sheets and high-voltage electrode sheets are arranged inside the frame, and the grounding electrode sheets and the high-voltage electrode sheets are both electrode sheets according to any one of claims 1-10.

12. A purification and dust removal device according to claim 11, characterized in that: The grounding electrode sheet and the high-voltage electrode sheet are respectively connected to fixed isolating members, and the fixed isolating members are insulating glue and / or rigid insulating members.

13. A purification and dust removal device according to claim 12, characterized in that: An insulating adhesive layer is provided between the frame and the end of the electrode sheet, and the insulating adhesive layer covers the process circular hole at the end of the electrode sheet.

14. A dust removal device according to claim 13, characterized in that: The grounding electrode sheet and the high-voltage electrode sheet are staggered at 180°, and there is a gap between the ends of the grounding electrode sheet and the high-voltage electrode sheet. The insulating adhesive layer does not cover or covers the gap.

15. The purification and dust removal device according to claim 11, characterized in that: The thickness of the semiconductor layer of the dust collecting layer electrode sheet is smaller than the thickness of the semiconductor layer of the non-dust collecting layer electrode sheet.

16. The purification and dust removal device according to claim 11, characterized in that: It also includes a high-voltage power supply, which is located inside or outside the frame.

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