Joining resin and method for producing same

Abstract

Provided is joining resin with which it is possible to accurately, easily and firmly combine a plurality of baseboards with each other; and also provided is a method for producing said resin.　Joining resin (1) has a first resin plate (2) and a second resin plate (3). The first resin plate (2) has a first joining surface (21) for integral joining with the second resin plate (3). The second resin plate (3) has a second joining surface (31) for integral joining with the first resin plate (2). An outer peripheral part (22) and a projection (4) are formed on at least one of the first resin plate (2) and the second resin plate (3), and the first resin plate (2) and the second resin plate (3) are positioned by the projection (4).

Description

Bonding resin and its manufacturing method

[0001] The present invention relates to a bonding resin and a method for producing the same.

[0002] Bonding resins, which are produced by bonding two or more substrates, are used in a variety of fields, including, for example, microchannel chips used in fields such as medical analysis, compound synthesis, and environmental measurement.

[0003] A microchannel chip is a chip formed by joining two substrates, at least one of which has a fine microchannel groove formed therein, to form a channel through which reagents and the like can flow. By injecting a reagent or specimen into this channel and performing separation, analysis, or detection on the reagent or the like, necessary information can be obtained.

[0004] As a known technique for this microchannel chip, for example, Patent Document 1 below discloses a technique for firmly bonding substrates together. In this technique, pins are formed in one substrate and through-holes are formed in the other substrate through which the pins pass, and the substrates are firmly bonded together by passing the pins through the through-holes.

[0005] Japanese Patent Application Laid-Open No. 2008-224431

[0006] However, when combining concaves and convexes such as pins and through-holes as in the technology described in Patent Document 1, there is a problem that the design must be highly accurate. For example, when a resin is used for the substrate (resin substrate), the resin substrate is generally formed using a mold such as a die, but deformation of the resin substrate that occurs when the mold is released after this forming cannot be ignored, and problems remain in terms of bonding accuracy.

[0007] Furthermore, when two sheets of resin are joined together, there is a problem that they tend to peel off when force is applied to the outer periphery.

[0008] In view of the above, an object of the present invention is to provide a bonding resin that can accurately, easily, and firmly join multiple substrates together, and a method for manufacturing the same.

[0009] A bonding resin according to one aspect of the present invention that solves the above-mentioned problems comprises a first resin plate and a second resin plate, wherein the first resin plate has a first bonding surface for overlapping and bonding together with the second resin plate, and the second resin plate has a second bonding surface for overlapping and bonding together with the first resin plate, and at least one of the first resin plate and the second resin plate has an outer periphery and a protrusion, and the first resin plate and the second resin plate are positioned by the protrusion.

[0010] In addition, in this respect, although not limited thereto, it is preferable that at least one of the first resin plate and the second resin plate is disposed so as to engage with the protrusion.

[0011] In addition, in this respect, although not limited thereto, it is preferable that a plurality of protrusions are provided.

[0012] Furthermore, in this respect, although not limited thereto, it is preferable that the height of at least one of the plurality of protrusions is the maximum height of the first resin plate.

[0013] In addition, although not limited to this aspect, it is preferable that the protrusion is tapered at least in one location.

[0014] Furthermore, in this respect, although not limited thereto, it is preferable that at least three or more protrusions are provided so that the extensions of the boundary lines form a closed shape.

[0015] In addition, in this respect, although not limited thereto, it is preferable that at least one of the first resin and the second resin is any one of polycarbonate, polymethyl methacrylate, cycloolefin polymer, cyclic olefin copolymer, polystyrene, polyethylene terephthalate, and silicone rubber.

[0016] Another aspect of the present invention relates to a method for manufacturing a bonding resin for bonding a first resin plate and a second resin plate, characterized in that the first resin plate has a first bonding surface for overlapping and bonding the second resin plate together, and the second resin plate has a second bonding surface for overlapping and bonding the first resin plate together, and at least one of the first resin plate and the second resin plate has an outer periphery and a protrusion, and the first resin plate and the second resin plate are positioned by the protrusion.

[0017] As described above, the present invention can provide a bonding resin that can accurately, easily, and firmly join a plurality of substrates together, and a method for manufacturing the same.

[0018] 1 is a perspective view of a bonding resin according to an embodiment; FIG. 2 is a plan view of a bonding resin according to an embodiment; FIG. 3 is a plan view of one resin plate (first resin plate) of the bonding resin according to an embodiment; FIG. 4 is a plan view of one resin plate (second resin plate) of the bonding resin according to an embodiment; FIG. 5 is a partially enlarged view of the periphery of a protrusion formed on the first resin plate of the bonding resin according to an embodiment; FIG. 6 is a partially enlarged view of a side surface when the first resin plate and the second resin plate of the bonding resin according to an embodiment are bonded; FIG. 7 is a plan view of another example of the bonding resin according to an embodiment; FIG. 8 is a side view of the bonding resin according to an embodiment; FIG. 9 is a diagram illustrating an image of a closed region formed by boundaries of a plurality of protrusions according to an embodiment; FIG. 10 is a schematic view of another example of the bonding resin according to an embodiment; FIG. 11 is a schematic view of another example of the bonding resin according to an embodiment; FIG. 12 is an image illustrating the effect of protrusions on aligning a pair of resin plates of the bonding resin according to an embodiment; FIG. 13 is a diagram illustrating an image of molding a resin plate using the bonding resin according to an embodiment; FIG. 14 is a diagram illustrating an image of molding a resin plate using a known example of the bonding resin; FIG. 15 is a diagram illustrating another example of the bonding resin according to an embodiment; FIG. 16 is a diagram illustrating another example of the bonding resin according to an embodiment.

[0019] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention can be embodied in many different forms and is not limited to the specific examples described in the following embodiments and examples.

[0020] 1 to 4 are schematic diagrams illustrating a bonding resin 1 according to this embodiment (hereinafter referred to as "this bonding resin") 1. Specifically, Fig. 1 is a perspective view of this bonding resin 1, Fig. 2 is a plan view of this bonding resin 1 (as viewed from the first resin plate 2 side), Fig. 3 is a plan view of one resin plate (first resin plate 2) (as viewed from the first bonding surface 21), and Fig. 4 is a plan view of the other resin plate (second resin plate 3) (as viewed from the second bonding surface 31).

[0021] As shown in these figures, the present bonding resin 1 comprises a first resin plate 2 and a second resin plate 3, the first resin plate 2 having a first bonding surface 21 for overlapping and bonding together with the second resin plate 3, the second resin plate 3 having a second bonding surface 31 for overlapping and bonding together with the first resin plate 2, and at least one of the first resin plate 2 and the second resin plate 3 having an outer periphery 22, 32 and a protrusion 4 (the examples in Figures 1 to 4 show an example in which an outer periphery and a protrusion are formed on both the first resin plate 2 and the second resin plate 3), and the first resin plate 2 and the second resin plate 3 are positioned by the protrusion 4.

[0022] As is clear from the above description, the present bonding resin 1 is formed by bonding together a first resin plate 2 and a second resin plate 3. The present bonding resin 1 is not particularly limited as long as it is formed by bonding together a plurality of resin plates in this manner, but a typical example is a microchannel chip used in fields such as medical analysis, compound synthesis, and environmental measurement.

[0023] As described above, the first resin plate 2 in the present bonding resin 1 is combined with the second resin plate 3 and is literally a plate-like member formed of resin. The first resin plate 2 has a first bonding surface 21 for overlapping and integrally bonding with the second resin plate 3, and a first outer peripheral portion 22 on the outside thereof.

[0024] As is clear from the above description, the first bonding surface 21 of the first resin plate 2 is a flat surface formed on the first resin plate 2. This flat bonding surface enables the first resin plate 2 to be bonded to the second resin plate 3. Specifically, the second resin plate 3 also has a second bonding surface 31 similar to the first bonding surface 21, and these bonding surfaces can be bonded to each other to form an integrated structure. As will be described later, it is preferable that a flow channel 211 or the like is formed on the first bonding surface 21.

[0025] On the other hand, as described above, the second resin plate 3 in the present bonding resin 1 is combined with the first resin plate 2, has a second bonding surface 31 that is bonded to the first bonding surface 21, and is provided with an outer periphery 32 on the outside thereof. That is, the first resin plate 2 and the second resin plate 3 have this configuration in common (however, if the resin plate does not have the protrusions 4, the outer periphery may not be provided).

[0026] In the present bonding resin 1, the first resin plate 2 and the second resin plate 3 have in common the fact that they have a bonding surface and, in some cases, an outer periphery, as described above, and the only difference between them is the shape and arrangement of the formed flow channels, protrusions, etc. In other words, the "first" and "second" in the first resin plate 2 and the second resin plate 3 are merely ordinal numerals used to distinguish the combined resin plates and do not have any special technical meaning; if one is arbitrarily designated as the first resin plate 2, the other automatically becomes the second resin plate 3. However, in this embodiment, for ease of explanation, the first resin plate 2 and the second resin plate 3 will be specifically identified and described. The meanings of "first" and "second" also apply to the bonding surface and the outer periphery.

[0027] As described above, the first resin plate 2 and the second resin plate 3 are made of resin. The resin may be a thermoplastic resin or a thermosetting resin, but a thermoplastic resin is preferred because it can be softened by applying heat, poured into a predetermined mold, solidified by cooling, or the like, and then removed (released) from the mold to easily form the desired shape. The thermoplastic resin can be adjusted appropriately depending on the dimensions and application, but is preferably at least one of polycarbonate, polymethyl methacrylate, cycloolefin polymer, cyclic olefin copolymer, polystyrene, polyethylene terephthalate, and silicone rubber.

[0028] In addition, in the present bonding resin 1, a flow channel 211 is preferably formed on the first bonding surface 21 of the first resin plate 2. Forming the flow channel 211 allows a flow channel to be formed when the first resin plate 2 is bonded to the second resin plate 3, and by flowing a reagent or the like through this flow channel, desired processing such as separation, analysis, or detection can be performed on the reagent or the like. In addition to the flow channel 211, a recess 212 that serves as a closed groove space not connected to the inlet 23, outlet 24, or the like may also be formed on the first bonding surface 21 of the first resin plate 2. In the examples of FIGS. 1 to 4, an example is shown in which no flow channel or recess is formed on the second bonding surface 31 of the second resin plate 3, but it is of course possible to provide a flow channel or recess thereon.

[0029] Furthermore, the first resin plate 2 of the present bonding resin 1 preferably has an inlet 23 and an outlet 24 connected to the flow channel 211. By connecting the inlet 23 and the outlet 24 to the flow channel 211, it becomes possible to flow (inject and discharge) reagents and the like from outside the present bonding resin 1. When the inlet 23 and the outlet 24 are provided, in order to connect the flow channel 211 to the outside of the present bonding resin 1, the inlet 23 and the outlet 24 are preferably formed so as to penetrate the surface of the first resin plate 2 on which the flow channel 211 is formed, opposite the surface on which the first bonding surface 21 is formed (corresponding to the example shown in FIGS. 1 to 4 ). However, the inlet 23 and the outlet 24 do not necessarily have to be formed on the side on which the flow channel 211 is formed. As long as they can be connected to the flow channel 211, they may be formed on the side of the second resin plate 3 opposite the first resin plate 2 on which the flow channel 211 is formed. In this case, it is preferable to form the inlet and the outlet connected to the flow channel so as to penetrate the surface on the side opposite the second connecting surface 31 of the second resin plate 3.

[0030] Furthermore, the first resin plate 2 of the present bonding resin 1 has a first outer periphery 22 formed thereon. Here, the "first outer periphery" refers to the portion of the surface of the first resin plate 2 on which the first bonding surface 21 is formed, other than the first bonding surface 21, which is not bonded to the second resin plate 3, and is also the portion where the protrusions 4 are formed. Specifically, the first bonding surface 21 of the first resin plate 2 is bonded to the second bonding surface 31 of the second resin plate 3 at its central portion, and therefore the remaining portion, i.e., the peripheral portion of the first resin plate 2 not used for bonding to the second resin plate 3, is referred to as the first outer periphery. Note that, as mentioned above, "first" may also be formed on the second resin plate 3, and therefore is an ordinal numeral used to distinguish between them and does not have any special technical meaning. In other words, the second bonding surface 31 of the second resin plate 3 is bonded to the first bonding surface 21 of the first resin plate 2 at its central portion, and therefore the remaining portion, i.e., the peripheral portion of the second resin plate 3 not used for bonding to the first resin plate 2, is referred to as the second outer periphery. However, as will be clear from the description below, if the protrusions 4 are not formed, the resin plate does not necessarily need to have an outer periphery.

[0031] Furthermore, protrusions 4 are arranged on the first resin plate 2 of the present bonding resin 1, more specifically, on the first outer periphery 22. By providing the protrusions 4 on the first outer periphery 22, the protrusions 4 are configured to intermittently surround the first bonding surface 21 and the second bonding surface 31, thereby ensuring the positioning of the first resin plate 2 and the second resin plate 3 and ensuring the stability of their bonding. Here, the term "protrusion" refers to a portion that rises higher than the first bonding surface 21 and the second bonding surface 31. Fig. 5 shows a partial enlarged view of the vicinity of the protrusions 4 formed on the first resin plate 2, and Fig. 6 shows a partial enlarged view of the side surface when the first resin plate 2 and the second resin plate 3 are bonded together.

[0032] As described above, the first resin plate 2 and the second resin plate 3 are positioned by the protrusions 4 of the bonding resin 1. This positioning is not limited, but it is preferable that at least one of the first resin plate 2 and the second resin plate 3 be positioned so as to engage with the protrusions 4. More specifically, if the protrusions 4 are formed on the first resin plate 2, they are preferably positioned so as to engage with the second resin plate 3, and if the protrusions 4 are formed on the second resin plate 3, they are preferably positioned so as to engage with the first resin plate 2. This allows the protrusions 4 to engage with the resin plate facing the resin plate on which the protrusions 4 are formed, thereby restricting the positions of the resin plates and enabling positioning. More specifically, the protrusions 4 preferably have a clear boundary line 41 at their raised portions. The boundary line 41 allows the position to be more reliably determined, allowing the other resin plate to be aligned along this boundary line 41. Here, the "boundary line" refers to the line formed by the base of the protrusions 4. Of course, it is also preferable that the protrusions 4 are provided on both the first resin plate 2 and the second resin plate 3.

[0033] Furthermore, since the protrusion 4 of the present bonding resin 1 positions the first resin plate 2 and the second resin plate 3, it is preferable to provide multiple protrusions rather than just one. This allows the positions of the first resin plate 2 and the second resin plate 3 to be controlled from multiple directions, thereby enabling the first resin plate 2 and the second resin plate 3 to be positioned. While the examples in Figures 1 to 4 show examples in which two protrusions are provided on each of the first resin plate 2 and the second resin plate 3, as shown in the examples in Figures 7 and 8, the outer periphery 32 and the protrusion 4 may be provided on only one of the resin plates (for example, only the second resin plate 3). Note that Figure 7 is a plan view of another example of the present bonding resin 1, and Figure 8 is a side view thereof.

[0034] Furthermore, although not limited thereto, it is preferable that the number of protrusions 4 of the present bonding resin 1 be at least three so that the extensions of their boundary lines 41 form a closed shape. Furthermore, it is more preferable that these three or more protrusions 4 be provided on one of the resin plates. This creates a closed area surrounded by the extensions 411 of the boundary lines 41 of the protrusions 4, and the other resin plate is stably positioned within this closed area. For example, in the example shown in Figures 7 and 8, the boundary lines 41 of the multiple protrusions 4 form a closed rectangle S. An image of this case is shown in Figure 9. Note that, when the boundary lines 41 of the protrusions 4 formed on both the first resin plate 2 and the second resin plate 3 are provided, it is preferable that the extensions form a closed shape when the boundary lines 41 of the protrusions 4 formed on both the first resin plate 2 and the second resin plate 3 are combined.

[0035] As another example of the present bonding resin 1, Fig. 10 shows a case where the first resin plate 2 and the second resin plate 3 are disk-shaped and a circular protrusion 4 is provided on the outer periphery of the second resin plate 3. In the figure, (A) shows a perspective view of the entire structure, (B) shows a plan view of the first resin plate 2, and (C) shows a plan view of the second resin plate 3. By doing so, the same effect as the above example can be obtained. In this figure, the protrusion 4 is formed on the entire outer periphery of the second resin plate 3.

[0036] As another example of the present bonding resin 1, FIG. 11 shows a case in which the first resin plate 2 and the second resin plate 3 are trapezoidal and multiple (three) protrusions 4 are provided on the second outer periphery 32 of the second resin plate 3. (A) shows a perspective view of the entire structure, (B) shows a plan view of the first resin plate 2, and (C) shows a plan view of the second resin plate 3. This configuration also achieves the same effects as the above example. In other words, the present bonding resin 1 can be formed in various shapes, and the arrangement and number of the protrusions 4 can be adjusted appropriately depending on the shape, etc. In the example shown in this figure, the first resin plate 2 does not have a first outer periphery 21.

[0037] Furthermore, in the present bonding resin 1, it is preferable that the protrusions 4 are tapered in at least one location. More specifically, it is preferable that the cross section (a cross section cut along a direction perpendicular to the extension direction of the protrusions 4) be triangular or trapezoidal. By doing so, for example, when the other resin plate (first resin plate 2) comes into contact with the triangular slope of the protrusion 4 of the second resin plate 3, the first resin plate 2 slides down the triangular slope and is firmly guided to its base. An image of this case is shown in Figure 12.

[0038] Furthermore, in the present bonding resin 1, it is preferable that the height of at least one of the multiple protrusions 4 is the maximum height of the resin plates on which the protrusions 4 are formed. This is important for positioning the resin plates relative to each other, but it also has a significant effect on manufacturing. Specifically, resin plates are formed by injecting softened resin into a mold. When the resin plate is removed from the mold (released), the resin inevitably bends. This bending can affect the precision of the resin plate (e.g., it can affect the flatness of the bonding surface and the outer periphery). However, if the protrusions 4 are the last part of the resin plate that remains in contact with the mold, the stress generated during release can be concentrated on the protrusions 4, making it less likely to cause distortion in other parts, such as the bonding surface. An example of this is shown in Figure 13. However, it is preferable that the height of the protrusions 4 is thinner than the thickness of the opposing resin plate. If the protrusions 4 are thicker than the opposing resin plates, they will be higher than the opposing resin plates during bonding, posing a problem of requiring a smaller area for pressing the resin plates together. By making the protrusions 4 thinner than the opposing resin plates, it becomes possible to press the resin plates together with a pressing mechanism with an area larger than the area of ​​the resin plates. As mentioned above, when removing the resin from the mold, there is a risk of the resin bending due to the resistance at the contact point between the mold and the resin. An example of this situation is shown in Figure 14. If the protrusions of the mold are located in the center of the resin and are large, bending and deformation of the resin will occur on both sides of the recess formed. In other words, by ensuring that the height of at least one of the multiple protrusions 4 is the maximum height of the resin plates on which the protrusions 4 are formed, as in the present bonding resin 1, this bending can be suppressed.

[0039] (Method for Manufacturing Bonding Resin) Here, a method for manufacturing the present bonding resin 1 (hereinafter referred to as "the present manufacturing method") will be described. As is clear from the above description, the present manufacturing method is a method for manufacturing a bonding resin for bonding a first resin plate 2 and a second resin plate 3, in which the first resin plate 2 has a first bonding surface 21 for overlapping and integrally bonding with the second resin plate 3, the second resin plate 3 has a second bonding surface 31 for overlapping and integrally bonding with the first resin plate 2, and at least one of the first resin plate 2 and the second resin plate 3 has outer peripheries 22, 23 and protrusions 4, and the protrusions 4 position the first resin plate 2 and the second resin plate 3. In this manner, the present bonding resin 1 can be manufactured.

[0040] As described above, the present bonding resin provides a bonding resin and a manufacturing method thereof that can accurately, easily, and firmly join multiple substrates. More specifically, the protrusions allow for accurate positioning by engaging with the other resin plate. Moreover, positioning is easy because it can be achieved simply by placing the other resin plate against the protrusions, eliminating the labor required in conventional techniques that require providing pins and through holes in different resin plates and then precisely fitting them together. Furthermore, by forming the protrusions on the periphery, the risk of distortion being concentrated when forming the resin plates using a mold or the like, which could affect the joining surface near the center, is reduced. This has the advantage of maintaining higher precision.

[0041] As described above, the present bonding resin can be configured in various patterns, and it goes without saying that in addition to the examples shown above, combinations of resin plates such as those shown in Figures 15 and 16 are also possible. In each figure, (A) shows an overall perspective view, (B) shows a plan view of the first resin plate 2, and (C) shows a plan view of the second resin plate 3. In the example shown in this figure, the first resin plate 2 does not have protrusions 4 and the first bonding surface is H-shaped with a pair of recesses, while the second resin plate 3 has these recesses as a second outer periphery 31 and protrusions 4 are formed on this outer periphery 31.

[0042] The present invention has industrial applicability as a bonding resin and a method for producing the same.

[0043] DESCRIPTION OF SYMBOLS 1... Bonding resin 2... First resin plate 21... First bonding surface 211... Flow channel 212... Recess 22... First outer peripheral portion 23... Inlet 24... Outlet 3... Second resin plate 31... Second bonding surface 32... Second outer peripheral portion 4... Protrusion 41... Boundary line 411... Extension line

Claims

1. A bonding resin comprising a first resin plate and a second resin plate, wherein the first resin plate has a first joining surface for overlapping and joining the second resin plate together, and the second resin plate has a second joining surface for overlapping and joining the first resin plate together, and at least one of the first resin plate and the second resin plate has an outer periphery and a protrusion, and the first resin plate and the second resin plate are positioned by the protrusion.

2. The bonding resin according to claim 1, wherein at least one of said first resin plate and said second resin plate is disposed so as to engage with said projection.

3. The bonding resin according to claim 1, wherein a plurality of said projections are provided.

4. The bonding resin according to claim 3, wherein the height of at least one of the plurality of protrusions is the maximum height of the first resin plate or the second resin plate.

5. The bonding resin according to claim 1, wherein said projection is tapered at least at one location.

6. The bonding resin according to claim 3, wherein at least three of said projections are provided so that the extensions of the boundary line form a closed shape.

7. A manufacturing method of a bonding resin for bonding a first resin plate and a second resin plate, wherein the first resin plate has a first bonding surface for overlapping and bonding to the second resin plate, and the second resin plate has a second bonding surface for overlapping and bonding to the first resin plate, an outer periphery and a protrusion are formed on at least one of the first resin plate and the second resin plate, and the first resin plate and the second resin plate are positioned by the protrusion.

Images