Vapor chamber and electronic device

Abstract

The present application relates to the technical field of electronic devices. Provided are a vapor chamber and an electronic device, which are used to solve the problem of a heat dissipation performance being poor and thus the heat dissipation effect of internal components of an electronic device being poor due to large thermal resistance of a vapor chamber. The vapor chamber comprises a shell, a first wick and at least one second wick, wherein the shell comprises a first cover plate and a second cover plate, the first cover plate comprising an evaporation region and a condensation region. The first wick is arranged in the shell, the first wick is fitted against the first cover plate and is spaced apart from the second cover plate, and the first wick covers the evaporation region and the condensation region. The second wick is arranged in the shell and covers the evaporation region, and the second wick and the first wick are stacked.

Description

A temperature distribution board and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on December 21, 2023, with application number 202311777226.8 and invention name “A temperature distribution board and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to a temperature vapor chamber and an electronic device. Background Art

[0003] With the continuous development of electronic devices (such as mobile phones), the heat generated by some components within these devices has also continued to increase. Therefore, vapor chambers (VCs) are installed within electronic devices to dissipate heat from these components. However, existing vapor chambers have high thermal resistance, resulting in poor heat dissipation performance and, consequently, poor heat dissipation from components within electronic devices.

[0004] Summary of the Invention

[0005] The embodiments of the present application provide a vapor chamber and an electronic device, which are used to solve the problem that the vapor chamber has a large thermal resistance, resulting in poor heat dissipation performance and poor heat dissipation effect of internal components of the electronic device.

[0006] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0007] In a first aspect, a temperature evaporating plate is provided, comprising a housing, a first wick, and at least one second wick. The housing comprises a first cover plate and a second cover plate, wherein the first cover plate comprises an evaporation region and a condensation region. The first wick is disposed within the housing, affixed to the first cover plate and spaced apart from the second cover plate, and covers both the evaporation region and the condensation region. The second wick is disposed within the housing, covers the evaporation region, and is stacked with the first wick.

[0008] The heat spreader provided in the first aspect of this application, in addition to a first wick disposed within the housing, is provided with at least one second wick at a location corresponding to the evaporation region. Specifically, multiple wicks are stacked within the evaporation region to increase the liquid storage capacity corresponding to the expansion region, thereby absorbing more heat and improving heat dissipation performance. Furthermore, because the multiple wicks are all disposed within the housing, the thermal resistance during heat transfer is low, further improving heat dissipation performance.

[0009] In one possible implementation of the first aspect of the present application, the housing further comprises a plurality of support columns, each of which is disposed on the second cover plate and abuts the first wick. In this configuration, the support columns abut between the first wick and the second cover plate, thereby providing support to prevent the space between the first wick and the second cover plate from being reduced and thereby affecting vapor flow.

[0010] In a possible implementation of the first aspect of the present application, the support columns include a first support column and a second support column, wherein the vertical projection of the first support column on the first cover plate is located within the evaporation region, and the vertical projection of the second support column on the first cover plate is located within the condensation region; and the spacing between two adjacent first support columns is greater than the spacing between two adjacent second support columns. Under this structure, when the liquid working medium evaporates to form steam and flows from the region where the first support column is located to the region where the second support column is located, the cross-sectional area of ​​the steam flow channel is reduced because the spacing between the first support columns is greater than the spacing between the second support columns, thereby increasing the steam flow velocity and facilitating improved steam flow efficiency.

[0011] In a possible implementation of the first aspect of the present application, the diameter of the first support column is greater than the diameter of the second support column. In this structure, the support effect and support reliability of the first support column on the first and second liquid absorbent wicks in the evaporation area can be improved.

[0012] In a possible implementation of the first aspect of the present application, the length of the first support column is greater than the length of the second support column. In this structure, the space corresponding to the evaporation area is increased, thereby being able to accommodate more steam and further improving the evaporation efficiency.

[0013] In one possible implementation of the first aspect of the present application, the second wick includes a first region and a second region, wherein the first region covers the evaporation region, the second region aligns with the condensation region, and the second region extends to the end of the condensation region away from the evaporation region; the second support column is disposed in an area outside the vertical projection of the second region onto the second cover plate. This creates a vapor channel between the second region and the second cover plate, allowing vapor to flow quickly to the condensation region. Furthermore, the second region increases the condensation region's liquid absorption capacity, thereby improving the heat dissipation performance of the vapor chamber.

[0014] In one possible implementation of the first aspect of the present application, the distance between the evaporation region and the second cover plate is a first distance, and the distance between the condensation region and the second cover plate is a second distance, wherein the first distance is greater than the second distance. The first cover plate also includes a transition region, which connects between the evaporation region and the condensation region, and the angle formed between the transition region and the second cover plate is an acute angle. In this structure, the transition region is tilted, which helps reduce the resistance of the portion of the first wick that is attached to the transition region, allowing the liquid working medium in the first wick to flow quickly to the evaporation region, thereby improving heat dissipation efficiency.

[0015] In one possible implementation of the first aspect of the present application, the support column further includes a third support column, wherein the vertical projection of the third support column on the first cover plate is located within the transition region. In this structure, the third support column abuts the first wick attached to the transition region, thereby ensuring a tight fit between the first wick and the transition region.

[0016] In one possible implementation of the first aspect of the present application, the surface of the third support column facing the transition region serves as an abutment surface, and the abutment surface and the transition region are arranged parallel to each other. In this structure, the third support column and the first wick form surface-to-surface contact, thereby increasing the contact area between the two and improving support reliability.

[0017] In one possible implementation of the first aspect of the present application, the abutment surface extends from the edge of the transition region near the evaporation region to the edge of the transition region near the condensation region. With this structure, the contact area between the abutment surface and the first wick can be further increased, thereby further improving support reliability.

[0018] In a possible implementation of the first aspect of the present application, a plurality of third support columns are provided, and the plurality of third support columns are spaced apart along the length direction of the transition region. With this structure, the support reliability can be further improved.

[0019] In a possible implementation of the first aspect of the present application, the portion of the first absorbent core that is in contact with the transition region is fixedly connected to the transition region. For example, the first absorbent core and the transition region may be fixed by spot welding.

[0020] In one possible implementation of the first aspect of the present application, a plurality of heat dissipation holes are provided on the outer wall of the second cover plate. The heat dissipation holes are arranged in a one-to-one correspondence with the support columns, and the heat dissipation holes extend axially along the support columns. This increases the contact area between the second cover plate and the external air, thereby improving heat dissipation efficiency.

[0021] In the second aspect, an electronic device is provided, which includes a shell, a heating element and a temperature averaging plate. The temperature averaging plate is the temperature averaging plate described in any of the above technical solutions. The heating element and the temperature averaging plate are both arranged in the shell. The heating element is attached to the first cover plate of the temperature averaging plate and is located in the evaporation area of ​​the first cover plate.

[0022] The electronic device provided in the second aspect of the present application, because it includes the temperature equalizing plate as described in any of the above technical solutions, can solve the same technical problems and achieve the same technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG1 is a structural diagram of an electronic device provided in an embodiment of the present application;

[0024] FIG2 is an exploded view of an electronic device provided in an embodiment of the present application;

[0025] FIG3 is a structural diagram of a temperature vapor chamber provided in an embodiment of the present application;

[0026] FIG4 is a structural diagram of a laminated vapor chamber assembly provided in an embodiment of the present application;

[0027] FIG5 is a structural diagram of another laminated vapor chamber assembly provided in an embodiment of the present application;

[0028] FIG6 is a structural diagram of another temperature vapor chamber provided in an embodiment of the present application;

[0029] FIG7 is a structural diagram of another temperature vapor chamber provided in an embodiment of the present application;

[0030] FIG8 is a structural diagram of another temperature vapor chamber provided in an embodiment of the present application;

[0031] FIG9 is a schematic diagram of the density of the first and second absorbent wicks provided in an embodiment of the present application;

[0032] FIG10 is a schematic diagram of the spacing between the first support pillars and the second support pillars provided in an embodiment of the present application;

[0033] FIG11 is a structural diagram of a second liquid-absorbing core provided in an embodiment of the present application;

[0034] FIG12 is a structural diagram of a second cover plate provided in an embodiment of the present application;

[0035] FIG13 is a structural diagram of a first cover plate provided in an embodiment of the present application;

[0036] FIG14 is a structural diagram of another first cover plate provided in an embodiment of the present application;

[0037] FIG15 is a partial structural diagram of a connection method between the transition region and the first absorbent core provided in an embodiment of the present application;

[0038] FIG16 is a partial structural diagram of another connection method between the transition region and the first absorbent core provided in an embodiment of the present application;

[0039] FIG. 17 is a partial structural diagram of another connection method between the transition region and the first absorbent core provided in an embodiment of the present application.

[0040] Reference numerals: 10-electronic device; 100-display module; 110-translucent cover; 120-display screen; 200-housing; 210-back cover; 220-frame; 230-middle plate; 300-heat averaging plate; 300a-first heat averaging plate; 300b-second heat averaging plate; 301-lower cover; 301a-first lower cover; 301b-second lower cover; 302-upper cover; 302a-first upper cover; 302b-second upper cover; 303-wick; 303a-wick 1; 303b- Second absorbent core; 304-double-sided tape; 305-middle cover; 309-housing; 310-first cover; 311-evaporation area; 312-condensation area; 313-transition area; 320-second cover; 321-heat dissipation hole; 330-first absorbent core; 340-second absorbent core; 341-first area; 342-second area; 350-support column; 351-first support column; 352-second support column; 353-third support column; 353a-abutment surface; 400-circuit board. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0042] In the following, the terms "first," "second," etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the quantity of the technical features indicated. Therefore, a feature specified as "first," "second," etc. may explicitly or implicitly include one or more of the features.

[0043] In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0044] In this application, unless otherwise specified or limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0045] An embodiment of the present application provides an electronic device. Specifically, the electronic device may be a portable electronic device or other type of electronic device. For example, the electronic device may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a monitor, a camera, a personal computer, a notebook computer, a wearable device, etc. For ease of description, the following examples are all based on the example of a mobile phone as the electronic device.

[0046] Please refer to Figures 1 and 2. Figure 1 is a structural diagram of an electronic device 10 provided in an embodiment of the present application, and Figure 2 is an exploded view of the electronic device 10 provided in an embodiment of the present application. It should be understood that Figures 1 and 2 only schematically illustrate some components included in the electronic device 10, and the actual shape, size, position, and structure of these components are not limited by Figures 1 and 2.

[0047] As can be seen from the above, in this embodiment, the electronic device 10 is a mobile phone, and the electronic device 10 can be in an approximately rectangular plate-shaped structure. The electronic device 10 can include a display module 100, a housing 200, a circuit board 400, and components.

[0048] The above-mentioned display module 100 is used to display images, videos, etc. The display module 100 may include a translucent cover plate 110 and a display screen 120 (English name: panel, also called a display panel), and the translucent cover plate 110 and the display screen 120 are stacked. The material of the translucent cover plate 110 includes but is not limited to glass. For example, the translucent cover plate 110 can adopt an ordinary translucent cover plate 110 to protect the display screen 120 to prevent the display screen 120 from being damaged by external force, and can play a dust-proof role. Alternatively, the translucent cover plate 110 can also adopt a translucent cover plate 110 with a touch function, so that the electronic device 10 has a touch function, which makes it more convenient for users to use. Therefore, the present application does not specifically limit the specific material of the translucent cover plate 110.

[0049] Furthermore, the display screen 120 may be a flexible display screen or a rigid display screen. For example, the display screen 120 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD) display screen.

[0050] The housing 200 is used to protect the electronic components within the electronic device 10. The housing 200 may include a back cover 210 and a frame 220. The back cover 210 is located on the side of the display screen 120 away from the transparent cover plate 110 and is stacked with the transparent cover plate 110 and the display screen 120. The frame 220 is located between the transparent cover plate 110 and the back cover 210. The frame 220 is fixed to the back cover 210. For example, the frame 220 may be fixed to the back cover 210 by bonding, threading, welding, or snapping. Alternatively, the frame 220 may be integrally formed with the back cover 210, i.e., the frame 220 and the back cover 210 form a single structural unit. The transparent cover plate 110 may be fixed to the frame 220 by gluing, so that the transparent cover plate 110, the back cover 210, and the frame 220 define a housing cavity within the electronic device 10. The circuit board assembly and the electronic components are disposed within this housing cavity.

[0051] In some embodiments, the housing 200 may further include a middle plate 230, which is disposed within the housing cavity and located on the side of the display screen 120 away from the light-transmitting cover plate 110. The middle plate 230 is fixedly connected to the frame 220 to form the middle frame of the electronic device 10. For example, the middle plate 230 and the frame 220 may be fixedly connected by gluing, threading, welding, snapping, or the like. Alternatively, the middle plate 230 and the frame 220 may be an integrally molded structure, i.e., the middle plate 230 and the frame 220 form a single structural component. The middle plate 230 divides the housing cavity into two independent spaces, one of which is located between the light-transmitting cover plate 110 and the middle plate 230, and the display screen 120 is located within this space. The other space is located between the middle plate 230 and the back cover 210, and the circuit board assembly is located within this space.

[0052] The circuit board 400 is used to house components within the electronic device 10 and to provide electrical connections between the components. The circuit board 400 can be secured to the midboard 230 by gluing, threading, welding, or snapping. Therefore, this application does not impose any particular restrictions on the securing method for the circuit board 400.

[0053] The above components are used to implement various functions of the electronic device 10. For example, the components may be a control chip (such as a system-on-chip, SOC), a graphics processing unit (GPU), a universal flash storage (UFS), a camera module, a flash module, as well as capacitors, resistors, inductors, etc.

[0054] Among them, some components can generate heat during operation, such as SOC chips. These components that can generate heat can also be called heating elements, and are referred to as heating elements in the following embodiments. To reduce the risk of damage to the heating elements due to excessive heat generation, a heat absorbing plate 300 can be provided in the housing 200 to dissipate heat for the heating elements that generate excessive heat.

[0055] Specifically, please refer to Figure 3, which is a structural diagram of a heat spreader 300 provided in an embodiment of the present application. Heat spreader 300 may include a housing 309 and a wick 303. Housing 309 includes a lower cover 301 and an upper cover 302. Wick 303 is disposed within housing 309 and is filled with a liquid working medium. The heating element is attached to the outer surface of housing 309, i.e., the outer wall of lower cover 301 or upper cover 302.

[0056] When the heating element generates heat, the liquid working medium in the wick 303 absorbs the heat (i.e., the evaporation end). The liquid working medium evaporates and leaves the wick 303, forming steam. The steam can flow within the internal space of the housing 309 and flow to an area away from the heating element (i.e., the condensation end). After releasing heat in this area, the steam condenses again into a liquid (i.e., the liquid working medium) and is absorbed by the wick 303. Finally, the liquid working medium in the wick 303 flows back to the area where the heating element is located, thus forming an evaporative cooling cycle (as shown by the arrows in Figure 3) to achieve heat dissipation.

[0057] To further enhance the heat dissipation performance of the vapor chamber 300, two vapor chambers 300 may be stacked to form a laminated vapor chamber 300 assembly. This assembly can increase the heat storage capacity of the vapor chamber 300 and enhance the heat dissipation performance of the vapor chamber 300. In some embodiments, the laminated vapor chamber assembly may include two vapor chambers 300, with the housings 309 of the two vapor chambers 300 bonded and secured together using double-sided tape 304.

[0058] For example, please refer to Figure 4, which shows the structure of a laminated vapor chamber assembly provided in an embodiment of the present application. The two vapor chambers 300 are respectively a first vapor chamber 300a and a second vapor chamber 300b. The first vapor chamber 300a includes a first lower cover 301a, a first upper cover 302a, and a first wick 303a. The second vapor chamber 300b includes a second lower cover 301b, a second upper cover 302b, and a second wick 303b. The heating element can be attached to the outer wall of the first upper cover 302a.

[0059] When the heating element generates heat, the heat must be transferred sequentially through the first upper cover 302a, wick 1 303a, first lower cover 301a, double-sided tape 304, second upper cover 302b, wick 2 303b, and second lower cover 301b. In other words, the total thermal resistance = the thermal resistance of the first upper cover 302a + the thermal resistance of the wick 1 303a + the thermal resistance of the first lower cover 301a + the thermal resistance of the double-sided tape 304 + the thermal resistance of the second upper cover 302b + the thermal resistance of the wick 2 303b + the thermal resistance of the second lower cover 301b.

[0060] Alternatively, please refer to Figure 5, which is a structural diagram of another laminated temperature equalizing plate assembly provided in an embodiment of the present application. The laminated temperature equalizing plate assembly may include a lower cover 301, an intermediate cover 305 and an upper cover 302. A closed cavity is formed between the lower cover 301 and the intermediate cover 305, and a closed cavity is formed between the upper cover 302 and the intermediate cover 305. A liquid wick 1 303a and a liquid wick 2 303b are respectively provided in the two closed cavities and are filled with liquid working fluid, thereby forming a laminated structure.

[0061] Exemplarily, the heating element is attached to the outer wall of the upper cover 302. When the heating element generates heat, the heat needs to be transferred in sequence through the upper cover 302, the wick 1 303a, the middle cover 305, the wick 2 303b and the lower cover 301. That is, during the heat transfer process, the total thermal resistance = the thermal resistance of the upper cover 302 + the thermal resistance of the wick 1 303a + the thermal resistance of the middle cover 305 + the thermal resistance of the wick 2 303b + the thermal resistance of the lower cover 301.

[0062] It can be seen that during operation, the heat transfer of the laminated vapor chamber 300 assembly has a large thermal resistance, which affects the overall heat dissipation capability and results in poor heat dissipation of the heating elements inside the electronic device 10 .

[0063] To address the above issues, please refer to Figure 6, which shows the structure of another thermal barrier 300 provided in an embodiment of the present application. This thermal barrier 300 can be used in the electronic device 10 described above. Furthermore, this thermal barrier 300 can be secured to the middle frame of the electronic device 10 by methods such as dispensing glue, dispensing glue with adhesive backing, or using adhesive backing over a large area with localized dispensing glue, though this application does not impose any particular limitations on this. This thermal barrier 300 includes a housing 309, a first wick 330, and at least one second wick 340.

[0064] The housing 309 includes a first cover plate 310 and a second cover plate 320. The first cover plate 310 and the second cover plate 320 are interlocked and fixed to each other, forming a cavity therebetween. The first cover plate 310 includes an evaporation region 311 and a condensation region 312. A first wick 330 is disposed within the housing 309. The first wick 330 is in contact with the first cover plate 310 and spaced apart from the second cover plate 320. The first wick 330 covers the evaporation region 311 and the condensation region 312. A second wick 340 is disposed within the housing 309 and covers the evaporation region 311. The second wick 340 is stacked with the first wick 330.

[0065] In some embodiments, please continue to refer to Figure 6. The second wick 340 can also be arranged on the side of the first wick 330 away from the first cover plate 310. Alternatively, please refer to Figure 7, which is a structural diagram of another temperature equalizing plate 300 provided in an embodiment of the present application. The second wick 340 can be arranged between the first wick 330 and the first cover plate 310. And there can be one second wick 340, or there can be multiple second wicks 340 according to actual needs. Therefore, this application does not make any special restrictions on this. In the following embodiments, the example of providing one second wick 340 and setting it between the first wick 330 and the first cover plate 310 is used for explanation.

[0066] In this manner, in addition to the first wick 330 disposed within the housing 309, at least one second wick 340 is positioned at a location corresponding to the evaporation region 311. This means that multiple layers of wicks 303 are stacked within the evaporation region 311 to increase the liquid storage capacity corresponding to the evaporation region 311, thereby absorbing more heat and improving heat dissipation performance. Furthermore, since the multiple layers of wicks 303 are all disposed within the housing 309, the thermal resistance during heat transfer is reduced, further enhancing heat dissipation performance. Furthermore, by only placing the multiple layers of wicks 303 within the space corresponding to the evaporation region 311, the thickness of the first cover plate 310 only needs to be increased at the evaporation region 311, while the size of the condensation region 312 does not need to be increased.

[0067] In some embodiments, referring to FIG. 7 , when the first cover plate 310 and the second cover plate 320 are fastened together to form the housing 309, the distance between the evaporation region 311 of the first cover plate 310 and the second cover plate 320 is a first distance H1, and the distance between the condensation region 312 of the first cover plate 310 and the second cover plate 320 is a second distance H2. The first distance H1 is greater than the second distance H2. That is, the evaporation region 311 and the condensation region 312 are connected by a transition region 313 (see the embodiments below for details).

[0068] In this way, multiple layers of the second liquid absorbent core 340 can be stacked in the evaporation area 311 of the first cover plate 310, thereby increasing the liquid storage capacity of the liquid absorbent core 303 in the evaporation area 311, thereby facilitating the improvement of heat absorption capacity and heat dissipation performance.

[0069] For example, the first cover plate 310 and the second cover plate 320 can be formed by stamping. Specifically, a stamping process is performed on the inner surfaces of the first cover plate 310 and the second cover plate 320 to form a groove structure on the inner surfaces of the first cover plate 310 and the second cover plate 320. When the two cover plates are engaged with each other, a housing 309 with an internal cavity can be formed. When the first cover plate 310 is stamped, the depth of the groove structure formed in the evaporation region 311 can be greater than the depth of the groove in the condensation region 312. Therefore, when the first cover plate 310 and the second cover plate 320 are engaged with each other, the first distance can be greater than the second distance.

[0070] Furthermore, the first cover plate 310 and the second cover plate 320 may be fixed by laser welding. For example, the first cover plate 310 and the second cover plate 320 may be made of stainless steel and fixed by laser welding.

[0071] Alternatively, referring to FIG8 , which is a structural diagram of another temperature homogenizing plate 300 provided in an embodiment of the present application, the first cover plate 310 and the second cover plate 320 may also be formed by etching. Specifically, an etching process is performed on the inner surfaces of the first cover plate 310 and the second cover plate 320 to form a groove structure on the inner surfaces of the first cover plate 310 and the second cover plate 320. When the two cover plates are engaged with each other, a housing 309 with a cavity therein is formed. When the first cover plate 310 is etched, the groove structure of varying depths may be formed, so that when the first cover plate 310 and the second cover plate 320 are engaged with each other, the first distance may be greater than the second distance.

[0072] Furthermore, the first cover plate 310 and the second cover plate 320 may be fixedly connected by solder paste. For example, the first cover plate 310 and the second cover plate 320 may be made of copper and fixedly connected by solder paste.

[0073] Furthermore, the first and second wicks 330, 340 can be fixed to the first cover plate 310 by spot welding, thereby further enhancing the overall structural strength. Furthermore, the first and second wicks 330, 340 can utilize wicks 303 of varying densities (mesh sizes).

[0074] For example, please refer to Figure 9, which is a schematic diagram of the density of the first wick 330 and the second wick 340 provided in an embodiment of the present application. The second wick 340 can use a wick 303 with a high mesh count, while the first wick 330 can use a wick 303 with a low mesh count. As a result, due to the higher mesh count of the second wick 340, the bubbles generated by the evaporation of the liquid working medium in the second wick 340 are smaller, that is, the flow channel space is smaller. In contrast, due to the lower mesh count of the first wick 330, the bubbles generated by the evaporation of the liquid working medium in the first wick 330 are larger, that is, the flow channel space is larger. Consequently, the smaller bubbles generated in the second wick 340 can squeeze the larger bubbles in the first wick 330, thereby promoting the evaporation cycle and improving evaporation efficiency.

[0075] In other possible examples, the second wick 340 can also be a wick 303 with a low mesh count, and the first wick 330 can be a wick with a high mesh count. In this case, since the permeability of the wick 303 decreases with increasing mesh count, i.e., a wick with a high mesh count has a lower permeability, using a low mesh count for the second wick 340 and a high mesh count for the first wick 330 can help reduce flow resistance and thus lower the risk of the wick drying out.

[0076] Because the first wick 330 and the second cover plate 320 are spaced apart, the liquid working medium, after absorbing heat and forming vapor, can flow within the space between the first wick 330 and the second cover plate 320. To prevent the space between the first wick 330 and the second cover plate 320 from gradually decreasing during use, please return to Figures 7 and 8. The heat spreader 300 provided in this embodiment of the application also includes a plurality of support columns 350. The plurality of support columns 350 are disposed on the inner wall of the second cover plate 320, and the free ends of the support columns 350 abut against the first wick 330.

[0077] Based on this, by disposing a plurality of support columns 350 between the second cover plate 320 and the first wick 330, effective support is provided between the second cover plate 320 and the first wick 330, thereby preventing the first cover plate 310 or the second cover plate 320 from sag, which would otherwise reduce the space between the first wick 330 and the second cover plate 320. Furthermore, the abutment of the support columns 350 against the first wick 330 ensures that the first wick 330 and the second wick 340 adhere to the first cover plate 310, preventing separation between the two, thereby ensuring effective heat dissipation.

[0078] In some embodiments, the plurality of support columns 350 include a plurality of first support columns 351 and a plurality of second support columns 352. The vertical projections of the plurality of first support columns 351 on the first cover plate 310 are located within the evaporation region 311, and the vertical projections of the plurality of second support columns 352 on the first cover plate 310 are located within the condensation region 312. The spacing between two adjacent first support columns 351 is greater than the spacing between two adjacent second support columns 352.

[0079] As such, please refer to Figure 10, which illustrates the spacing between the first support columns 351 and the second support columns 352, according to an embodiment of the present application. When steam flows from the area where the first support columns 351 are located to the area where the second support columns 352 are located, the greater spacing between the first support columns 351 than the second support columns 352 reduces the steam flow cross-section, thereby increasing the steam flow rate. Experimental results show that this structure can increase the steam flow rate by 85%. Consequently, heat can flow quickly to the space corresponding to the condensation area 312. Once the steam condenses into liquid, it is absorbed by the wick 303, allowing the steam to continue circulating.

[0080] In addition, the diameter of the first support column 351 can be larger than the diameter of the second support column 352. This structure helps to improve the support strength of the first support column 351, ensuring that the first wick 330 and the second wick 340 are in contact with each other and in contact with the first cover plate 310, thereby ensuring heat absorption and evaporation efficiency.

[0081] Furthermore, the length of the first support column 351 can also be greater than the length of the second support column 352 (as shown in Figure 8). That is, within the area corresponding to the evaporation region 311, the distance between the first wick 330 and the second cover plate 320 is a third distance H3; within the area corresponding to the condensation region 312, the distance between the first wick 330 and the second cover plate 320 is a fourth distance H4, with the third distance H3 being greater than the fourth distance H4. This structure increases the space corresponding to the evaporation region 311, thereby accommodating more vapor and further improving evaporation efficiency.

[0082] In other embodiments, please refer to Figures 11 and 12. Figure 11 is a structural diagram of a second wick provided in an embodiment of the present application, and Figure 12 is a structural diagram of a second cover plate 320 provided in an embodiment of the present application. The second wick 340 may include a first region 341 and a second region 342. The first region 341 covers the evaporation region 311 of the first cover plate 310, and the second region 342 is aligned with the condensation region 312. The second region 342 extends to the end of the condensation region 312 away from the evaporation region 311. The second support columns 352 are each disposed in an area outside the vertical projection of the second region 342 onto the second cover plate 320.

[0083] Thus, by positioning the second region 342 of the second liquid-absorbing wick 340 in the condensation region 312 and omitting the second support column 352 in the corresponding region, a vapor passage is formed between the second region 342 and the second cover plate 320. This second region 342 improves the liquid absorption capacity of the condensation region 312. Furthermore, the absence of vapor resistance within the vapor passage facilitates rapid vapor flow, thereby enhancing the efficiency of the evaporative cooling cycle.

[0084] For example, please continue to refer to Figures 11 and 12. The end of the second area 342 of the second liquid-absorbing core 340 connected to the first area 341 can be set at the position closest to the heat source (i.e., the heating element), so that part of the heat can quickly flow to the condensation area 312 through the steam channel formed between the second area 342 and the second cover plate 320, and be cooled into liquid to improve the circulation efficiency.

[0085] On this basis, because the evaporation region 311 and condensation region 312 of the first cover plate 310 are not in the same plane, the first cover plate 310 further includes a transition region 313 (as shown in Figures 7 and 8). This transition region 313 forms an acute angle with the second cover plate 320, i.e., 0 to 90°. Furthermore, the length of the transition region 313, along the direction from the evaporation region 311 to the condensation region 312, ranges from 0.3 mm to 5 mm.

[0086] For example, please refer to Figure 13, which is a structural diagram of a first cover plate 310 provided in an embodiment of the present application. The transition region 313 can form a straight structure, that is, extending in one direction. Alternatively, please refer to Figure 14, which is a structural diagram of another first cover plate 310 provided in an embodiment of the present application. The transition region 313 can also be a curved structure, that is, extending in multiple directions. Thus, the transition region 313 can separate the first cover plate 310 into the evaporation region 311 and the condensation region 312. Therefore, the specific structure of the transition region 313 of the present application is not particularly limited.

[0087] In this way, the transition area 313 is extended obliquely, so that the portion of the first liquid absorbent core 330 that is attached to the transition area 313 can better fit with the transition area 313, ensuring that the portion of the first liquid absorbent core 330 that is attached to the transition area 313 does not generate large resistance, thereby ensuring that the liquid working medium can flow normally.

[0088] In addition, to avoid a loose fit between the portion of the first wick 330 that is in contact with the transition region 313 and the transition region 313, in some embodiments, referring to FIG15 , which is a partial structural diagram of a connection method between the transition region 313 and the first wick 330 provided in an embodiment of the present application, spot welding can be performed between the transition region 313 and the first wick 330 to ensure a tight fit between the first wick 330 and the transition region 313, so that the liquid working medium in the first wick 330 can absorb heat and evaporate normally.

[0089] In other embodiments, please refer to FIG. 16 , which is a partial structural diagram illustrating another connection method between the transition region 313 and the first wick 330 provided in an embodiment of the present application. The plurality of support columns 350 may further include a third support column 353, the vertical projection of which on the first cover plate 310 is located within the transition region 313. Specifically, the third support column 353 abuts the first wick 330, thereby ensuring a tight fit between the first wick 330 and the transition region 313. Furthermore, the third support column 353 provides support for the transition region 313, further enhancing the reliability of the overall structure.

[0090] For example, the surface of the third support column 353 facing the transition region 313 is a contact surface 353a, which can be arranged parallel to the transition region 313. That is, the third support column 353 and the first absorbent wick 330 can form a surface-to-surface contact, thereby increasing the contact area between the third support column 353 and the first absorbent wick 330, thereby ensuring a tight fit between the first absorbent wick 330 and the transition region 313.

[0091] Furthermore, the third support column 353 may be provided in one or more arrangements. When only one third support column 353 is provided, the third support column 353 may be located in the middle of the transition region 313 to ensure stable support. When multiple third support columns 353 are provided, the third support columns 353 may be spaced apart.

[0092] In addition, please refer to Figure 17, which is a partial structural diagram of another connection method between the transition region 313 and the first liquid-absorbent wick 330 provided in an embodiment of the present application. The abutment surface 353a of the third support column 353 can extend from the edge of the transition region 313 near the evaporation region 311 to the edge of the transition region 313 near the condensation region 312. This can further increase the contact area between the abutment surface 353a and the first liquid-absorbent wick 330, thereby further improving the support effect.

[0093] In some other possible examples, the end of the third support column 353 abutting against the first liquid absorbent core 330 may also be a circular structure, a square structure, etc. Therefore, this application does not impose any special limitation on this.

[0094] Based on this, to further enhance the heat dissipation effect of the vapor chamber 300, a plurality of heat dissipation holes 321 may be provided on the outer wall of the second cover plate 320. These heat dissipation holes 321 are arranged one-to-one with the support columns 350 and extend axially along the support columns 350. In other words, each support column 350 has a hollow structure in the middle, which helps increase the contact area between the outer wall of the second cover plate 320 and the external air, thereby further improving heat dissipation efficiency and enhancing the heat dissipation performance of the vapor chamber 300.

[0095] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0096] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A temperature equalizing plate, characterized in that: include: A housing, the housing comprising a first cover plate and a second cover plate, the first cover plate comprising an evaporation region and a condensation region; A first liquid absorbent core is disposed in the housing, the first liquid absorbent core is in contact with the first cover plate, and is spaced apart from the second cover plate, and the first liquid absorbent core covers the evaporation area and the condensation area; At least one second liquid absorbent core is disposed in the shell and covers the evaporation area; the second liquid absorbent core is stacked with the first liquid absorbent core.

2. The temperature equalizing plate according to claim 1, characterized in that: The housing further comprises a plurality of support columns, which are all arranged on the second cover plate and abut against the first liquid absorbent core.

3. The temperature equalizing plate according to claim 2, characterized in that: The support column includes a first support column and a second support column, the vertical projection of the first support column on the first cover plate is located in the evaporation area, and the vertical projection of the second support column on the first cover plate is located in the condensation area; the spacing distance between two adjacent first support columns is greater than the spacing distance between two adjacent second support columns.

4. The temperature equalizing plate according to claim 3, characterized in that: The diameter of the first support column is greater than the diameter of the second support column.

5. The temperature homogenizing plate according to claim 3, characterized in that: The length of the first supporting column is greater than the length of the second supporting column.

6. The temperature homogenizing plate according to claim 3, characterized in that: The second liquid-absorbing core includes a first area and a second area, the first area covers the evaporation area, the second area is in contact with the condensation area, and the second area extends to an end of the condensation area away from the evaporation area; the second support column is arranged in an area outside the vertical projection of the second area on the second cover plate.

7. The temperature equalizing plate according to any one of claims 2 to 6, characterized in that: The distance between the evaporation region and the second cover plate is a first distance, the distance between the condensation region and the second cover plate is a second distance, and the first distance is greater than the second distance; The first cover plate further includes a transition area, wherein the transition area is connected between the evaporation area and the condensation area, and an angle formed by the transition area and the second cover plate is an acute angle.

8. The temperature equalizing plate according to claim 7, characterized in that: The support column further includes a third support column, and a vertical projection of the third support column on the first cover plate is located in the transition area.

9. The temperature equalizing plate according to claim 8, characterized in that: The surface of the third support column facing the transition region is an abutment surface, and the abutment surface and the transition region are arranged parallel to each other.

10. The temperature homogenizing plate according to claim 9, characterized in that: The abutting surface extends from an edge of the transition region close to the evaporation region to an edge of the transition region close to the condensation region.

11. The temperature homogenizing plate according to claim 10, characterized in that: A plurality of the third support columns are provided, and the plurality of the third support columns are distributed at intervals along the length direction of the transition region.

12. The temperature homogenizing plate according to claim 7, characterized in that: The portion of the first absorbent core that is attached to the transition area is fixedly connected to the transition area.

13. The temperature equalizing plate according to any one of claims 2 to 12, characterized in that: A plurality of heat dissipation holes are arranged on the outer wall of the second cover plate. The heat dissipation holes are arranged in one-to-one correspondence with the support columns, and the heat dissipation holes extend along the axial direction of the support columns.

14. An electronic device, characterized in that: It includes a shell, a heating element and a temperature averaging plate, wherein the temperature averaging plate is the temperature averaging plate according to any one of claims 1 to 13, the heating element and the temperature averaging plate are both arranged in the shell, the heating element is attached to the first cover plate of the temperature averaging plate, and is located in the evaporation area of ​​the first cover plate.

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