Process chamber and gas inlet assembly thereof

Abstract

The present application relates to the field of semiconductor manufacturing, and provides a process chamber and a gas inlet assembly thereof. The gas inlet assembly comprises a first cavity and a second cavity, both the first cavity and the second cavity are ring-shaped, and the second cavity is arranged in the first cavity; the second cavity is internally provided with a flow uniformizing cavity, and a buffer cavity is formed between the outer wall of the second cavity and the inner wall of the first cavity; the first cavity is provided with a plurality of first gas outlet holes distributed in the circumferential direction of the first cavity, and the first gas outlet holes are used for communicating the interior of the buffer cavity with the interior of the process chamber; the second cavity is provided with a plurality of second gas outlet holes, and the second gas outlet holes are used for communicating the flow uniformizing cavity with the buffer cavity; the second cavity is provided with a gas inlet used for communication of the flow uniformizing cavity. The whole gas inlet assembly is ring-shaped, has a simple structure, and is easy to machine, mount and dismount; moreover, secondary flow uniformizing can be achieved, thereby improving the uniformity of distribution of gas in the circumferential direction of the first cavity, improving the uniformity of a gas flow field in the process chamber, improving the consistency and yield of processing.

Description

Process chamber and its gas inlet components Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular, to a process chamber and an air intake assembly thereof. Background Art

[0002] Semiconductor integrated circuits are continuously developing towards higher device integration, higher computing efficiency, and lower operating power consumption. As chip unit feature sizes continue to shrink, the requirements for etching, film deposition, patterning, and other processes are becoming increasingly stringent. During semiconductor wafer processing, the uniformity of processing within a single wafer directly impacts the consistency and yield of chip processing, resulting in an increasingly stringent requirement for processing uniformity within this field.

[0003] Etching and coating processes place increasingly stringent demands on plasma distribution and process uniformity. The uniformity of the gas flow field distribution within the chamber directly impacts plasma distribution. To achieve uniform plasma distribution, plasma chemical vapor deposition (CCVD) and etching equipment typically use top-chamber gas inlet, chamber edge gas inlet, or both to introduce reactive gases into the chamber. A corresponding uniform flow chamber is also designed to ensure uniform distribution of process gases within the chamber.

[0004] Existing uniform flow chambers often have complex structures, requiring high machining precision. Once installed, they are extremely difficult to disassemble and clean. Furthermore, the design of more chamber air inlets further increases structural complexity and machining difficulty, making it difficult to effectively ensure uniform airflow. This structural complexity increases the risk of particle generation, impacting chip yield.

[0005] Therefore, how to provide an air intake assembly with a simple structure and good airflow field uniformity is a technical problem that those skilled in the art urgently need to solve. Summary of the Invention

[0006] The present application aims to solve at least one of the technical problems existing in the prior art, and proposes a process chamber and an air inlet assembly thereof, which can achieve a simple structure and can make the air flow field distribution more uniform.

[0007] To achieve the purpose of the present application, an air intake assembly is provided for supplying gas to a process chamber. The air intake assembly includes a first cavity and a second cavity. The first cavity and the second cavity are both annular. The second cavity is disposed in the first cavity.

[0008] The second cavity has a uniform flow cavity extending along its circumference, and a buffer cavity is formed between the outer wall of the second cavity and the inner wall of the first cavity;

[0009] The first cavity has a plurality of first gas outlet holes distributed along its circumference, and the first gas outlet holes are used to connect the buffer cavity and the interior of the process chamber;

[0010] The second cavity has a plurality of second air outlet holes distributed along its circumference, and the second air outlet holes communicate with the flow-uniform cavity and the buffer cavity;

[0011] The second cavity has an air inlet for communicating with the flow-uniform cavity.

[0012] In some embodiments, the plurality of second air outlet holes are symmetrically distributed about a predetermined diameter of the second cavity, and the predetermined diameter passes through the center of the air inlet;

[0013] In the circumferential direction of the second cavity, the distance between two adjacent second air outlets decreases from the air inlet to a direction away from the air inlet; and / or

[0014] In the circumferential direction of the second cavity, the aperture of the second air outlet tends to increase from the air inlet to a direction away from the air inlet.

[0015] In some embodiments, the plurality of first air outlet holes are evenly distributed along the circumference of the first cavity; and / or

[0016] Multiple second air outlet holes are distributed along the circumference of the second cavity to form at least one second air outlet hole group. When the number of second air outlet hole groups is greater than or equal to two groups, more than two second air outlet hole groups are distributed at different positions of the second cavity in the axial direction of the second cavity.

[0017] In some embodiments, the first air outlet is located on a side wall of the first cavity facing the axis of the first cavity, and the second air outlet is located on a side wall of the second cavity facing away from the first air outlet.

[0018] In some embodiments, the system further includes an air inlet pipe, one end of the air inlet pipe being connected to the air inlet of the second cavity, the first cavity having a bypass hole for avoiding the air inlet pipe, and the other end of the air inlet pipe passing through the bypass hole for communicating with an air source;

[0019] The outer wall of the air intake pipe is sealed and connected to the avoidance hole.

[0020] In some embodiments, it further includes a plurality of injection conduits connected to the first cavity, wherein the plurality of injection conduits correspond one-to-one to the positions of the plurality of first air outlets; the injection conduits are used to limit the flow direction of the gas output from the first air outlet.

[0021] In some embodiments, the diameter of the second air outlet hole is greater than or equal to 0.1 mm.

[0022] In some embodiments, the distance between the outer wall of the second cavity and the inner wall of the first cavity is greater than or equal to 0.1 mm.

[0023] In some embodiments, the injection conduit includes a connecting portion and an output portion distributed along its axial direction, the connecting portion is located in the first air outlet, the output portion is located outside the first air outlet, and the output portion is used to communicate with the process chamber; the outer diameter of the output portion is larger than the outer diameter of the connecting portion to form a limiting surface that fits with the outer wall of the first cavity.

[0024] In some embodiments, a side wall of the injection conduit is provided with an injection hole.

[0025] The present application also provides a process chamber, comprising a chamber body and any one of the above-mentioned air inlet components;

[0026] The air inlet assembly is fixed to the cavity wall of the chamber body, and the plurality of first air outlet holes are communicated with the interior of the chamber body. The plurality of first air outlet holes are used to provide gas to the interior of the chamber body.

[0027] This application has the following beneficial effects:

[0028] The air intake assembly provided in the present application is used to provide gas to the process chamber. The air intake assembly includes a first cavity and a second cavity. The first cavity and the second cavity are both annular, and the second cavity is arranged in the first cavity; the second cavity has a uniform flow cavity extending along its circumference, and a buffer cavity is formed between the outer wall of the second cavity and the inner wall of the first cavity; the first cavity has a plurality of first air outlet holes distributed along its circumference, and the first air outlet holes are used to connect the buffer cavity and the interior of the process chamber; the second cavity has a plurality of second air outlet holes distributed along its circumference, and the second air outlet holes connect the uniform flow cavity and the buffer cavity; the second cavity has an air inlet for connecting the uniform flow cavity.

[0029] The air intake assembly is annular in shape as a whole, with a simple structure, which is easy to process and disassemble. In addition, the first cavity and the second cavity are annular, which is easy to process, thus ensuring high processing accuracy and avoiding the influence of processing errors on the uniformity of gas distribution. The uniform flow cavity can fully diffuse the gas along its circumference, thereby improving the uniformity of gas distribution around the second cavity. In combination with the use of multiple second air outlets, the gas can enter the buffer cavity from multiple positions around the buffer cavity, thereby improving the uniformity of gas intake in the buffer cavity. In combination with the use of the buffer cavity to diffuse the gas along its circumference, secondary uniform flow can be achieved, thereby improving the uniformity of gas distribution around the first cavity, thereby improving the uniformity of the gas flow field in the process chamber, and thus improving the consistency and yield of processing.

[0030] The present application also provides a process chamber comprising the above-mentioned air inlet assembly, and having the above-mentioned advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] FIG1 is a cross-sectional view along line AA in FIG2 ;

[0032] FIG2 is a side view of an air intake assembly provided in a specific embodiment of the present application;

[0033] FIG3 is a schematic structural diagram of an air intake assembly provided in a specific embodiment of the present application;

[0034] FIG4 is an exploded view of an air intake assembly provided in a specific embodiment of the present application;

[0035] FIG5 is a cross-sectional view of a first cavity of an air intake assembly provided in a specific embodiment of the present application;

[0036] FIG6 is a top view of the second cavity of the air intake assembly provided in a specific embodiment of the present application;

[0037] FIG7 is an enlarged view of area I in FIG1 ;

[0038] FIG8 is a schematic structural diagram of an air jet duct;

[0039] FIG9 is a partial enlarged view of an air intake assembly provided in another specific embodiment of the present application;

[0040] FIG10 is a schematic structural diagram of a process chamber provided in a specific embodiment of the present application.

[0041] Among them, the figure marks in Figures 1 to 10 are: 100, first cavity; 101, installation cavity; 102, avoidance hole; 103, buffer cavity; 104, first air outlet; 105, first cavity sealing plate; 110, injection duct; 111, output part; 112, connecting part; 113, injection hole; 200, second cavity; 201, uniform flow cavity; 202, air inlet; 203, second air outlet; 204, air inlet pipe; 301, top air inlet; 302, first RF coil; 303, second RF coil; 304, air inlet channel; 305, tray; 306, base; 307, exhaust port. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the technical solution of the present application, the process chamber and the air intake assembly provided by the present application are described in detail below with reference to the accompanying drawings.

[0043] The air intake assembly provided in the present application is used to transport gas into the interior of the process chamber to ensure that the gas flow field is evenly distributed inside the process chamber. As shown in Figure 1, the air intake assembly includes a first cavity 100 and a second cavity 200. The first cavity 100 and the second cavity 200 are both annular. The second cavity 200 is arranged in the first cavity 100. Specifically, the first cavity 100 has, for example, an installation cavity 101 extending along its circumference. The installation cavity 101 is annular. The second cavity 200 is arranged in the installation cavity 101 and extends along the circumference of the installation cavity 101. During the assembly process, the first cavity 100 has an opening for the second cavity 200 to pass through. The second cavity 200 is installed into the installation cavity 101 from the opening and then the opening is closed. Specifically, as shown in Figure 4, the first cavity 100 includes a first cavity body and a first cavity sealing plate 105 arranged at the bottom of the first cavity body. The bottom of the first cavity body has an opening for the second cavity 200 to pass through. The first cavity sealing plate 105 is used to seal the opening, so that the installation cavity 101 can be sealed after the second cavity 200 is installed in the installation cavity 101.

[0044] The second cavity 200 has a uniform flow chamber 201 extending along its circumference. The outer wall of the second cavity 200 is a certain distance away from the inner wall of the first cavity 100, thereby forming a buffer chamber 103 between the inner walls of the second cavity 200 and the first cavity 100. The buffer chamber 103 is the space between the outer wall of the second cavity 200 and the inner wall of the first cavity 100 in the installation cavity 101. As shown in Figures 4 and 6, the second cavity 200 has an air inlet 202 for connecting to the uniform flow chamber 201. The air inlet pipe 204 for conveying gas is connected to the uniform flow chamber 201 through the air inlet 202. The second cavity 200 has multiple second air outlet holes 203 distributed along its circumference, each of which connects the uniform flow chamber 201 and the buffer chamber 103. Gas enters the uniform flow chamber 201 through the air inlet 202 and diffuses in the uniform flow chamber 201 along the circumference of the second cavity 200. The gas in the uniform flow chamber 201 then enters the buffer chamber 103 through a plurality of second air outlets 203 distributed circumferentially along the second cavity 200. The uniform flow chamber 201 enables the gas to fully diffuse along its circumference, thereby improving the uniformity of the gas distribution circumferentially within the second cavity 200. Combined with the use of the plurality of second air outlets 203, the gas can enter the buffer chamber 103 from multiple positions along its circumference, thereby improving the uniformity of the gas intake into the buffer chamber 103. Combined with the use of the buffer chamber 103 to diffuse the gas circumferentially, secondary uniform flow can be achieved, thereby improving the uniformity of the gas distribution circumferentially within the first cavity 100.

[0045] The first chamber 100 has a plurality of first gas outlets 104 distributed along its circumference. These first gas outlets 104 connect the buffer chamber 103 with the interior of the process chamber. Gas within the buffer chamber 103 enters the interior of the process chamber through each of the first gas outlets 104. The distribution of the first gas outlets 104 can be customized to ensure that gas within the buffer chamber 103 enters the interior of the process chamber evenly.

[0046] In this embodiment, the air intake assembly has a simple structure. As shown in Figures 2 and 3, its overall structure is annular, with the first cavity 100 and the second cavity 200 also being annular. This reduces the processing difficulty, thereby ensuring high processing accuracy and preventing the uniformity of gas distribution from being affected by processing errors. The air intake assembly provided in this embodiment of the application, due to its simple structure, is easy to disassemble, assemble, and maintain, while also reducing the processing accuracy requirements for the first air outlet 104 and the second air outlet 203.

[0047] On this basis, by combining the uniform flow chamber 201, multiple second air outlet holes 203 and the buffer chamber 103, secondary uniform flow can be achieved, thereby improving the uniformity of the gas distribution in the circumferential direction of the first cavity 100, and then improving the uniformity of the air flow field in the process chamber, thereby improving the consistency and yield of processing.

[0048] After entering the uniform flow chamber 201 from the air inlet 202, the gas diffuses along the circumference of the second cavity 200 toward both sides of the air inlet 202. The predetermined diameter of the second cavity 200 (as indicated by the dashed line in FIG6 ) passes through the center of the air inlet 202, and the diffusion rate of the gas on both sides of this predetermined diameter is approximately the same. In some embodiments, the plurality of second air outlet holes 203 are symmetrically distributed about the predetermined diameter of the second cavity 200. This allows the gas to reach the two symmetrical second air outlet holes 203 at approximately the same time. The gas enters the buffer cavity 103 symmetrically on both sides of the predetermined diameter, thereby improving the uniformity of the gas intake into the buffer cavity 103.

[0049] As the gas flows away from the gas inlet 202, some of the gas enters the buffer chamber 103 through the second gas outlet 203, and the pressure of the remaining gas gradually decreases. As the distance from the gas inlet 202 increases, the gas outlet area per unit length of the second cavity 200 gradually increases, thereby compensating for the uneven gas distribution caused by the decrease in gas pressure and improving the uniformity of the gas flow when entering the buffer chamber 103.

[0050] In some embodiments, as shown in FIG6 , the distance between two adjacent second outlet holes 203 decreases along the circumference of the second cavity 200, moving away from the air inlet 202. That is, the second outlet holes 203 become increasingly densely distributed as the distance from the air inlet 202 increases. The denser the distribution of the second outlet holes 203, the larger the outlet area in the corresponding region. This allows the outlet area per unit length of the circumference of the second cavity 200 to gradually increase, thereby ensuring uniform gas distribution.

[0051] In some embodiments, the diameter of the second outlet holes 203 increases from the air inlet 202 toward the direction away from the air inlet 202 along the circumference of the second cavity 200. That is, the diameter of the second outlet holes 203 gradually increases as the distance from the air inlet 202 increases. The larger the diameter of the second outlet holes 203, the larger the air outlet area in the corresponding region. This allows the air outlet area per unit length of the circumference of the second cavity 200 to gradually increase, thereby ensuring uniform gas distribution.

[0052] 5 , the plurality of first gas outlet holes 104 are evenly distributed along the circumference of the first chamber 100 , and each first gas outlet hole 104 has the same aperture. The even distribution of the plurality of first gas outlet holes 104 can improve the uniformity of gas distribution in the process chamber.

[0053] Furthermore, in some embodiments, the plurality of second gas outlet holes 203 are distributed along the circumference of the second cavity 200 to form at least one second gas outlet hole group. The number of second gas outlet hole groups can be one or two or more. When the number of second gas outlet hole groups is two or more, the two or more second gas outlet hole groups are distributed at different positions in the axial direction of the second cavity 200. Multiple second gas outlet hole groups can further improve the uniformity of gas distribution within the buffer cavity 103, thereby improving the uniformity of gas distribution within the process chamber.

[0054] In some embodiments, as shown in Figures 3 and 4, the first gas outlet 104 is located on the side wall of the first cavity 100 facing the central axis of the first cavity 100, so that the gas can pass through each first gas outlet 104 and enter the interior of the process chamber from the inner side of the first cavity 100. As shown in Figures 4 and 7, the second gas outlet 203 is located on the side wall of the second cavity 200 away from the first gas outlet 104. After passing through the second gas outlet 203, the gas needs to bypass the outer wall of the second cavity 200 and finally enter the interior of the process chamber from the first gas outlet 104. The distribution method of the first gas outlet 104 and the second gas outlet 203 can extend the transportation time of the gas in the buffer cavity 103, thereby further allowing the gas to fully diffuse in the buffer cavity 103 and improving the uniformity of the gas distribution in the buffer cavity 103.

[0055] In some embodiments, the diameter of the second air outlet 203 is greater than or equal to 0.1 mm. This relatively large diameter can reduce resistance to gas entering the buffer chamber 3, ensuring smooth flow of process gas, thereby ensuring uniform flow of the air inlet assembly. Furthermore, the large diameter of the second air outlet 203 ensures high machining accuracy even when certain errors occur during machining, thereby reducing the machining difficulty of the second air outlet 203. Of course, the diameter of the second air outlet 203 can also be set according to user needs and is not limited here.

[0056] In some embodiments, the distance between the outer wall of the second cavity 200 and the inner wall of the first cavity 100 is greater than or equal to 0.1 mm. As shown in Figure 7, the first cavity 100 and the second cavity 200 can be coaxially arranged, and the distance between the outer wall of the second cavity 200 and the inner wall of the first cavity 100 at various positions is approximately equal. The larger distance between the outer wall of the second cavity 200 and the inner wall of the first cavity 100 can not only reduce the difficulty of processing, but also provide sufficient space for the gas to diffuse in the buffer cavity 103, reduce the resistance of the gas to flow in the buffer cavity 103, and thus improve the uniformity of the gas distribution in the buffer cavity 103. Of course, the distance between the outer wall of the second cavity 200 and the inner wall of the first cavity 100 can also be set according to the needs of the user, which is not limited here.

[0057] In some embodiments, as shown in FIG4 , the air intake assembly further includes an air intake pipe 204, one end of which is connected to the air inlet 202 of the second chamber 200. The air intake pipe 204 may be perpendicular to the plane of the second chamber 200. The first chamber 100 has a bypass hole 102 for bypassing the air intake pipe 204. The bypass hole 102 and the air intake pipe 204 are arranged in a direction perpendicular to the plane of the second chamber 200. The other end of the air intake pipe 204 passes through the bypass hole 102 and is connected to an air source, such as an air supply line for utility gas. The outer wall of the air intake pipe 204 is sealed to the bypass hole 102 to prevent gas leakage from the air intake assembly. Furthermore, the bypass hole 102 may be provided with a positioning groove, and the outer wall of the air intake pipe 204 may be provided with a positioning protrusion. The positioning groove and the positioning protrusion cooperate to position the second chamber 200, ensuring that the second chamber 200 is concentric with the first chamber 100. The avoidance hole 102 is fixedly connected to the air inlet pipe 204 and can also position the second cavity 200 in a direction perpendicular to the plane where the first cavity 100 is located.

[0058] Furthermore, in some embodiments, a support structure may be provided within the mounting cavity 101 to support the second cavity 200, thereby enabling the second cavity 200 to be coaxially arranged with the first cavity 100. The support structure may be a support column, a support protrusion, etc. The shape and distribution of the support structure can be set according to user needs and are not limited here.

[0059] Gas enters the interior of the process chamber through the first gas outlet 104. The direction of the first gas outlet 104 affects the direction of gas flow. However, the sidewall thickness of the first chamber 100 is relatively thin, resulting in less restriction of the gas flow direction by the first gas outlet 104. After entering the process chamber, the gas diffuses freely, easily forming turbulence and causing uneven gas distribution. To address this problem, in some embodiments, as shown in Figures 8 and 9, the gas inlet assembly also includes multiple injection conduits 110, which are connected to the first chamber 100. The multiple injection conduits 110 correspond one-to-one to the positions of the multiple first gas outlets 104. Each injection conduit 110 is used to restrict the flow direction of the gas output from the first gas outlet 104. Furthermore, in some embodiments, each injection conduit 110 can form the same preset angle with the horizontal plane, with the preset angle ranging from greater than -90° to less than +90°. Each injection conduit 110 can extend radially along the first chamber 100 to prevent the formation of circular flow within the process chamber. The injection pipes 110 output gas synchronously, which can quickly fill the interior of the process chamber with gas, thereby improving the uniformity of gas distribution in the radial direction of the process chamber.

[0060] Furthermore, in some embodiments, as shown in FIG8 , the injection conduit 110 includes a connecting portion 112 and an output portion 111 distributed along its axial direction. The connecting portion 112 is located in the first gas outlet 104, and the output portion 111 is located outside the first gas outlet 104. The output portion 111 is used to communicate with the process chamber and to transport gas into the process chamber. The outer diameter of the output portion 111 is larger than the outer diameter of the connecting portion 112 to form a limiting surface between the connecting portion 112 and the output portion 111. During installation, the connecting portion 112 is inserted into the first gas outlet 104 and is sealed to the first gas outlet 104 by welding or interference fit. The limiting surface is in contact with the outer wall of the first cavity 100 to form a limit. As shown in FIG9 , the length of the connecting portion 112 is generally not greater than the wall thickness of the first cavity 100, thereby preventing the connecting portion 112 from affecting the flow of gas in the buffer cavity 103. In some embodiments, the inner diameters of the connecting portion 112 and the output portion 111 are the same to ensure smooth passage of gas. Of course, in practical applications, according to specific needs, the inner diameter of the output portion 111 can also be designed to be larger or smaller than the inner diameter of the connecting portion 112. Of course, the shape of the injection conduit 110 can also be set according to user needs and is not limited here.

[0061] After the gas is ejected from the injection conduits 110, its velocity is relatively high. When the gas encounters resistance during its flow, it changes direction and enters the space between the injection conduits 110, forming turbulent flow. To address this issue, in some embodiments, the sidewall of the output portion 111 is provided with an injection hole 113. The injection hole 113 extends through the sidewall of the output portion 111 along the circumference of the first cavity 100. The injection hole 113 connects the interior and exterior of the output portion 111. When the gas flows within the output portion 111, its velocity is relatively high. The gas can pass through the injection hole 113 and enter between two adjacent injection conduits 110, thereby increasing the gas pressure between the two adjacent injection conduits 110. Due to the increased gas pressure between the two adjacent injection conduits 110, the gas ejected from the injection conduits 110 encounters resistance and is unable to enter between the two adjacent injection conduits 110, thereby preventing the formation of gas turbulence. It should be noted that the embodiments of the present application are not limited to being provided on the sidewall of the output portion 111. If the injection conduits 110 are also provided with other structures not shown in the figures, the injection hole 113 can also be provided on such structures.

[0062] The present application also provides a process chamber, comprising a chamber body and an air inlet assembly provided by any of the above-described embodiments. The air inlet assembly is fixed to a cavity wall of the chamber body, and a plurality of first air outlet holes 104 are connected to the interior of the chamber body, and the plurality of first air outlet holes 104 are used to supply gas to the interior of the chamber body.

[0063] In the embodiment shown in Figure 10 , the top of the chamber body is provided with a top air inlet 301 and a first RF coil 302 disposed around the top air inlet 301. A second RF coil 303 is disposed on the sidewall of the chamber body. A base 306 is disposed within the chamber body for supporting wafers. A tray 305 is mounted on the base 306, upon which the wafers are placed. An exhaust port 307 is disposed at the bottom of the chamber body. An air inlet assembly is located below the second RF coil 303, and its height is greater than the height of the top surface of the base 306. An air inlet channel 304 is also disposed on the sidewall of the chamber body. One end of the air inlet channel 304 is connected to the air inlet pipe 204 of the air inlet assembly, and the other end of the air inlet channel 304 is connected to a gas source. The air inlet assembly and the top air inlet 301 cooperate to deliver gas into the process chamber, where the first and second RF coils 302 and 303 ionize the gas to form a plasma. Plasma is used to process wafers. Byproduct gases and unreacted gases generated during the process are exhausted through exhaust port 307 to avoid disrupting the process. The gas inlet assembly enables more uniform gas distribution within the process chamber, thereby improving product yield. Of course, the process chamber can also have other structures, which are not limited here.

[0064] Furthermore, in some embodiments, the chamber body may include a first chamber body and a second chamber body located below the first chamber body, with the air intake assembly disposed between the first and second chamber bodies. The chamber body adopts a split structure to facilitate installation of the air intake assembly, and the user may also configure the installation method of the air intake assembly as needed, which is not limited here.

[0065] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present application, and the present application is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present application, and such modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. A gas inlet assembly for providing gas to a process chamber, characterized in that: The air intake assembly comprises a first cavity and a second cavity, the first cavity and the second cavity are both annular, and the second cavity is arranged in the first cavity; The second cavity has a uniform flow cavity extending along its circumference, and a buffer cavity is formed between the outer wall of the second cavity and the inner wall of the first cavity; The first cavity has a plurality of first gas outlet holes distributed along its circumference, and the first gas outlet holes are used to connect the buffer cavity and the interior of the process chamber; The second cavity has a plurality of second air outlet holes distributed along its circumference, and the second air outlet holes communicate with the flow-uniforming cavity and the buffer cavity; The second cavity has an air inlet for communicating with the flow-uniform cavity.

2. The air intake assembly according to claim 1, characterized in that: The plurality of second air outlet holes are symmetrically distributed about a preset diameter of the second cavity, and the preset diameter passes through the center of the air inlet; In the circumferential direction of the second cavity, the distance between two adjacent second air outlets tends to decrease from the air inlet to a direction away from the air inlet; and / or In the circumferential direction of the second cavity, the aperture of the second air outlet tends to increase from the air inlet to a direction away from the air inlet.

3. The air intake assembly according to claim 1, characterized in that: The plurality of first air outlet holes are evenly distributed along the circumference of the first cavity; and / or A plurality of the second air outlet holes are distributed along the circumference of the second cavity to form at least one second air outlet hole group. When the number of the second air outlet hole groups is greater than or equal to two groups, more than two second air outlet hole groups are distributed at different positions of the second cavity in the axial direction of the second cavity.

4. The air intake assembly according to claim 1, characterized in that: The first air outlet is located on a side wall of the first cavity facing the axis of the first cavity, and the second air outlet is located on a side wall of the second cavity facing away from the first air outlet.

5. The air intake assembly according to claim 1, characterized in that: It also includes an air intake pipe, one end of which is connected to the air inlet of the second cavity, the first cavity has a evacuation hole for evading the air intake pipe, and the other end of the air intake pipe passes through the evacuation hole for communicating with an air source; The outer wall of the air intake pipe is sealed and connected to the avoidance hole.

6. The air intake assembly according to any one of claims 1 to 5, characterized in that: It also includes a plurality of injection conduits connected to the first cavity, wherein the plurality of injection conduits correspond to the positions of the plurality of first air outlets one by one; and the injection conduits are used to limit the flow direction of the gas output from the first air outlets.

7. The air intake assembly according to any one of claims 1 to 5, characterized in that: The diameter of the second air outlet is greater than or equal to 0.1 mm.

8. The air intake assembly according to any one of claims 1 to 5, characterized in that: The distance between the outer wall of the second cavity and the inner wall of the first cavity is greater than or equal to 0.1 mm.

9. The air intake assembly according to claim 6, characterized in that: The injection conduit includes a connecting portion and an output portion distributed along its axial direction, the connecting portion is located in the first air outlet, the output portion is located outside the first air outlet, and the output portion is used to communicate with the process chamber; the outer diameter of the output portion is larger than the outer diameter of the connecting portion to form a limiting surface that fits with the outer wall of the first cavity.

10. The air intake assembly according to claim 6, characterized in that The side wall of the injection conduit is provided with an injection hole.

11. A process chamber, characterized in that: comprising a chamber body and an air intake assembly according to any one of claims 1 to 10; The air inlet assembly is fixed to the cavity wall of the chamber body, and the plurality of first air outlet holes are communicated with the interior of the chamber body, and the plurality of first air outlet holes are used to provide gas to the interior of the chamber body.

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