Semiconductor process device

Abstract

Provided is a semiconductor process device, comprising: a process chamber (100); and a plurality of connection groups (301, 302) respectively arranged in one-to-one correspondence with a plurality of wafer boats (201, 202). Each connection group (301, 302) comprises connection structures, the connection structures are configured to be electrically connected to respective boat pieces (203) in the corresponding wafer boat (201, 202), and every two adjacent boat pieces (203) are configured to have opposite polarities. The connection structures of every two adjacent connection groups (301, 302) are electrically connected between two adjacent wafer boats (201, 202). The connection group close to a second furnace door (105) is provided with a first electrode connection end (A) and a second electrode connection end (B) at the side facing the second furnace door (105). The semiconductor process device solves the problem of radio frequency introduction structures in the related art being complex and prone to experiencing contact anomalies, as well as the problems of maintenance difficulties and reduced productivity due to the machine needing to be cooled and shutdown during maintenance and replacement.

Description

semiconductor process equipment Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular, to a semiconductor process equipment. Background Art

[0002] In the manufacturing of crystalline silicon solar cells, surface passivation and anti-reflection processes can increase light absorption and reduce carrier recombination, thereby improving the photovoltaic conversion efficiency of solar cells. Currently, the industry generally uses tubular plasma-enhanced chemical vapor deposition (PECVD) equipment to prepare silicon nitride (SiNx) passivation and anti-reflection films. PECVD equipment places a wafer (i.e., a silicon wafer) between two graphite boats of opposite polarity, introduces reactive gases into the process chamber, and applies a radio frequency voltage between the two graphite boats to excite the reactive gases to form a plasma, ultimately producing a thin film of silicon nitride on the wafer surface.

[0003] With the rapid development of the photovoltaic industry and the increasing demand for production capacity in the coating process, PECVD equipment has transitioned from the traditional single-boat mode to the dual-boat mode, that is, two carrier boats are placed in one process chamber, and RF is introduced into the two carrier boats through an RF feeding structure. At present, dual-boat PECVD equipment uses a dual-RF introduction method to introduce RF into the two carrier boats, that is, RF is introduced from the furnace mouth side of the process chamber and the tail side opposite to the furnace mouth. Specifically, the RF introduction structure introduced from the tail of the process chamber is electrically connected to the carrier boat near the tail through an electrode rod, while the RF introduction structure introduced from the furnace mouth of the process chamber is electrically connected by overlapping the boat foot of the carrier boat near the furnace mouth on the electrode seat of the RF electrode.

[0004] However, the RF introduction structure introduced from the furnace mouth of the process chamber needs to span the entire wafer carrier boat. Due to the space limitation of the process chamber, multiple avoidances need to be considered when designing the RF introduction structure, resulting in a complex RF introduction structure. Moreover, when the boat foot is overlapped on the electrode seat of the RF electrode to achieve electrical connection, as the number of operations in the process increases, powder and fragments of the reaction products (such as silicon nitride) will fall on the electrode seat, affecting the contact effect between the boat foot and the electrode seat. As a result, abnormal RF voltage and current, abnormal discharge, and other phenomena will occur due to abnormal contact, resulting in a short service life of the electrode seat and the need for frequent cooling and shutdown for maintenance. In addition, the above-mentioned RF dual introduction method requires the machine to be cooled and shut down for maintenance and replacement, which makes maintenance difficult and affects production capacity. Summary of the Invention

[0005] The present application aims to solve at least one of the technical problems existing in the prior art, and proposes a semiconductor process equipment, which can solve the problems in the related technology that the RF introduction structure is complex, contact abnormalities are prone to occur, and the machine needs to be cooled and shut down during maintenance and replacement, resulting in maintenance difficulties and reduced production capacity.

[0006] To achieve the purpose of this application, a semiconductor process equipment is provided, comprising:

[0007] A process chamber, wherein the process chamber has a first furnace door and a second furnace door disposed opposite to each other in a first direction, the first furnace door being configured to be openable or closable, and a carrying device disposed in the process chamber, the carrying device being configured to carry a plurality of wafer boats, the plurality of wafer boats being spaced apart along the first direction, each of the wafer boats comprising a plurality of wafers spaced apart;

[0008] A plurality of connection groups are provided corresponding to the plurality of wafer boats, and each connection group includes a connection structure, wherein the connection structure is configured to electrically connect to each wafer in the corresponding wafer boat, and to make the polarities of each two adjacent wafer boats opposite; and the connection structures of each two adjacent connection groups are electrically connected between the two adjacent wafer boats; the connection structure of the connection group near the second furnace door is provided with a first electrode connection end and a second electrode connection end on a side opposite to the second furnace door;

[0009] The first electrode introduction assembly and the second electrode introduction assembly are arranged through the second furnace door and are electrically connected to the first electrode connection end and the second electrode connection end respectively, so as to load the radio frequency voltage to each of the boat slices in the wafer carrier boat through the connection structure corresponding to the connection group.

[0010] In some embodiments, the boats in each of the wafer boats include at least one first boat, at least one second boat, and at least one third boat; wherein,

[0011] The first boat piece and the second boat piece each have three boat ears, wherein two boat ears and the other boat ear are respectively located on both sides of the first boat piece or the second boat piece in the first direction, and the side where the two boat ears of the first boat piece are located is opposite to the side where the two boat ears of the second boat piece are located; the third boat piece has two boat ears, and the two boat ears are respectively located on both sides of the third boat piece in the first direction;

[0012] Each of the connection structures is used to achieve opposite polarities of two adjacent boats by being electrically connected to the boat ears of the at least one first boat piece, the at least one second boat piece, and the at least one third boat piece.

[0013] In some embodiments, in each of the wafer boats, the first boat piece and the second boat piece are adjacent to each other; the plurality of third boat pieces are divided into a first group and a second group, the first group is located on a side of the second boat piece away from the first boat piece, and the second group is located on a side of the first boat piece away from the second boat piece; all the boat pieces are arranged along the spacing direction of the boat pieces and are arranged in order from the first group to the second group;

[0014] Each of the connection structures includes a first connection component and a second connection component; wherein the first connection component is located on one side of the corresponding wafer boat in the first direction, and is configured to electrically connect the third boat pieces with odd numbers in the first group located on that side to the second boat piece with a first polarity, and to electrically connect the third boat pieces with even numbers to the first boat piece with a second polarity; and to electrically connect the third boat pieces with odd numbers in the second group located on that side to each other with the first polarity, and to electrically connect the third boat pieces with even numbers to the first boat piece with a second polarity; the first polarity is opposite to the second polarity;

[0015] The second connecting assembly is located on the other side of each wafer boat in the first direction, and is configured to electrically connect the third boats with odd numbers in the first group located on the other side to the second boat with the first polarity, and electrically connect the third boats with even numbers to each other with the second polarity; and electrically connect the third boats with odd numbers in the second group located on the other side to the second boat with the first polarity, and electrically connect the third boats with even numbers to the first boat with the second polarity;

[0016] The first connecting components of the two wafer carrier boats are located on one side of the first furnace door and the second furnace door respectively in the first direction, and the second connecting components of the two wafer carrier boats are located between the two wafer carrier boats and are electrically connected; the first connecting component corresponding to the wafer carrier boat close to the second furnace door is provided with the first electrode connecting end and the second electrode connecting end.

[0017] In some embodiments, the first connecting assembly includes a first-side first connecting member and a first-side second connecting member, wherein,

[0018] The first connecting member on the first side is located at a first height position in the second direction, and is used to electrically connect the boat ears at the corresponding heights of the third boat pieces with odd numbers in the first group to the boat ears at the corresponding heights of the second boat piece, and to electrically connect the boat ears at the corresponding heights of the third boat pieces with even numbers in the second group to the boat ears at the corresponding heights of the first boat piece, and to electrically insulate the boat ears at the corresponding heights of the first boat piece from the boat ears at the corresponding heights of the second boat piece; the second direction is perpendicular to the horizontal plane;

[0019] The second connecting member on the first side is located at a second height position in the second direction, and is used to electrically connect the boat ears of the corresponding height of the third boat piece with an even number in the first group with the boat ears of the corresponding height of the first boat piece, and to electrically connect the boat ears of the corresponding height of the third boat piece with an odd number in the second group, and to electrically insulate the boat ears of the corresponding height of the first boat piece from the boat ears of the corresponding height of the third boat piece in the second group closest to the first boat piece; the second height position is different from the first height position.

[0020] In some embodiments, the first side first connector includes a first side first conductive block, a first side first insulating block, and a first side second conductive block, which are arranged in sequence from the first group to the second group along the spacing arrangement direction of the boat sheet and are fixedly connected together, wherein:

[0021] The first conductive block on the first side is plugged into and electrically connected to the boat ears at a height corresponding to the third boat piece with an odd sequence number in the first group and the boat ears at a height corresponding to the second boat piece;

[0022] The second conductive block on the first side is plugged into and electrically connected to the boat ears at a height corresponding to the third boat piece with an even sequence number in the second group and the boat ears at a height corresponding to the first boat piece;

[0023] The first insulating block on the first side is located between the boat ear at a corresponding height of the first boat piece and the boat ear at a corresponding height of the second boat piece, and electrically insulates the two;

[0024] The second electrode connection end is provided on the second conductive block on the first side corresponding to the wafer boat close to the second furnace door.

[0025] In some embodiments, the first-side second connecting member includes a first-side third conductive block, a first-side second insulating block, and a first-side fourth conductive block, which are arranged in sequence from the first group to the second group along the spacing arrangement direction of the boat sheet and are fixedly connected together, wherein:

[0026] The third conductive block on the first side is plugged into and electrically connected to the boat ears at a height corresponding to the third boat piece with an even sequence number in the first group and the boat ears at a height corresponding to the first boat piece;

[0027] The fourth conductive block on the first side is plugged into the boat ears at the corresponding height of the third boat pieces with odd serial numbers in the second group, and are electrically connected;

[0028] The second insulating block on the first side is located between the boat ear at a corresponding height of the first boat piece and the boat ear at a corresponding height of the third boat piece closest to the first boat piece in the second group, and electrically insulates the two;

[0029] The first electrode connection end is provided on the fourth conductive block on the first side corresponding to the wafer boat close to the second furnace door.

[0030] In some embodiments, the second connecting assembly includes a second-side first connecting member and a second-side second connecting member, wherein:

[0031] The first connecting member on the second side is located at the first height position, and is used to electrically connect the boat ears at corresponding heights of the third boat pieces with even numbers in the first group, and electrically connect the boat ears at corresponding heights of the third boat pieces with odd numbers in the second group with the boat ears at corresponding heights of the second boat piece, and electrically insulate the boat ears at corresponding heights of the third boat piece in the first group that is closest to the second boat piece from the boat ears at corresponding heights of the second boat piece;

[0032] The second connecting member on the second side is located at the second height position, and is used to electrically connect the boat ears at the corresponding height of the third boat pieces with odd serial numbers in the first group with the boat ears at the corresponding height of the second boat piece, and to electrically connect the boat ears at the corresponding height of the third boat pieces with even serial numbers in the second group with the boat ears at the corresponding height of the first boat piece, and to electrically insulate the boat ears at the corresponding height of the first boat piece from the boat ears at the corresponding height of the second boat piece.

[0033] In some embodiments, the second-side first connector includes a second-side first conductive block, a second-side first insulating block, and a second-side second conductive block, which are arranged in sequence from the first group to the second group along the spacing arrangement direction of the boat sheet and are fixedly connected together, wherein:

[0034] The first conductive block on the second side is plugged into the boat ear at a corresponding height of the third boat piece with an even sequence number in the first group, and is electrically connected;

[0035] The second conductive block on the second side is plugged into and electrically connected to the boat ears at a corresponding height of the odd-numbered third boat pieces in the second group and the boat ears at a corresponding height of the second boat pieces;

[0036] The first insulating block on the second side is located between a boat ear at a corresponding height of a third boat sheet closest to the second boat sheet in the first group and a boat ear at a corresponding height of the second boat sheet, and electrically insulates the two.

[0037] In some embodiments, the second side second connector includes a second side third conductive block, a second side second insulating block, and a second side fourth conductive block, which are arranged in sequence from the first group to the second group along the spacing arrangement direction of the boat sheet and are fixedly connected together, wherein:

[0038] The third conductive block on the second side is plugged into and electrically connected to the boat ears at a height corresponding to the third boat piece with an odd sequence number in the first group and the boat ears at a height corresponding to the second boat piece;

[0039] The fourth conductive block on the second side is plugged into and electrically connected to the boat ears at a corresponding height of the third boat piece with an even sequence number in the second group and the boat ears at a corresponding height of the first boat piece;

[0040] The second insulating block on the second side is located between the boat ear at a corresponding height of the first boat piece and the boat ear at a corresponding height of the second boat piece, and electrically insulates the two.

[0041] In some embodiments, the device further comprises a wire assembly, the wire assembly comprising a first wire and a second wire, wherein two ends of the first wire are respectively plugged into the third conductive blocks on the second side corresponding to two adjacent wafer boats and are electrically connected;

[0042] Two ends of the second wire are respectively plugged into the second-side fourth conductive blocks corresponding to two adjacent wafer boats and are electrically connected.

[0043] In some embodiments, the second height position is lower than the first height position.

[0044] In some embodiments, the first electrode introduction assembly and the second electrode introduction assembly both include an electrode body disposed on the side of the second furnace door facing away from the interior of the process chamber, and an electrode connecting rod, wherein the electrode body is used to be electrically connected to the RF power supply; one end of the electrode connecting rod is electrically connected to the electrode body, and the other end passes through the second furnace door and extends to the interior of the process chamber, and is plugged into the first electrode connecting end or the second electrode connecting end, and is electrically conductive.

[0045] In some embodiments, the boats in each of the wafer carrier boats are divided into a plurality of boat groups along the direction in which the boats are spaced apart, and the number of the boat groups corresponding to the two wafer carrier boats is the same and corresponds one to one;

[0046] There are a plurality of connection structures in each connection group, and each connection structure is configured to be electrically connected to a plurality of boats in each boat group in a one-to-one correspondence, and the polarities of each two adjacent boats are opposite;

[0047] The plurality of connection structures in the connection group close to the second furnace door are all provided with the first electrode connection end and the second electrode connection end; the connection structures in each of two adjacent connection groups are electrically connected one-to-one between two adjacent wafer boats;

[0048] The number of the first electrode introduction components is the same as the number of the first electrode connection terminals, and they are electrically connected one-to-one; the number of the second electrode introduction components is the same as the number of the second electrode connection terminals, and they are electrically connected one-to-one.

[0049] In some embodiments, an insulating sheet is provided between each adjacent two boat-sheet groups in each wafer carrier boat;

[0050] An insulating member is provided between each two adjacent connection structures.

[0051] In some embodiments, the supporting device includes two support columns, which are arranged opposite to each other in the spacing arrangement direction of the boat pieces and extend along the first direction, and the two ends of each support column are fixedly connected to the first furnace door and the second furnace door respectively;

[0052] Each of the support columns is provided with an insulating structure for electrically insulating the support column from the two wafer boats.

[0053] This application has the following beneficial effects:

[0054] The semiconductor process equipment provided by the present application has a first electrode introduction component and a second electrode introduction component for introducing radio frequency voltage, both of which are arranged through the second furnace door, and are electrically connected to the first electrode connection end and the second electrode connection end of the connection group corresponding to the wafer boat close to the second furnace door, so that the radio frequency voltage can be loaded to each boat piece in the wafer boat close to the second furnace door through the connection group, and the polarity of each two adjacent boat pieces is opposite; at the same time, by electrically connecting the connection structure of each two adjacent connection groups between two adjacent wafer boats, the radio frequency voltage can be transmitted to each boat piece in each wafer boat through the two electrically connected connection structures, and the polarity of each two adjacent boat pieces is opposite, so that the radio frequency voltage can be loaded on multiple wafer boats at the same time. Since the first electrode introduction assembly and the second electrode introduction assembly are both introduced from the same side of the process chamber (i.e., the second furnace door side), and only need to be electrically connected to the first electrode connection end and the second electrode connection end of the connection group corresponding to the wafer boat near the second furnace door, this is easier to simplify the structure compared to the structure in the related art that needs to span the entire wafer boat, and it is convenient to design a more mature and reliable connection method such as plug-in to achieve the electrical connection between the first electrode introduction assembly and the second electrode introduction assembly and the first electrode connection end and the second electrode connection end of the connection group, thereby solving the problem of abnormal RF voltage and current, abnormal discharge, etc. caused by abnormal contact in the related art, and thus reducing the frequency of equipment maintenance. In addition, since the first electrode introduction assembly and the second electrode introduction assembly are both introduced from the same side of the process chamber (i.e., the second furnace door side), during maintenance and replacement, it is only necessary to move the wafer boat out of the process chamber and remove the first electrode introduction assembly and the second electrode introduction assembly from the second furnace door. The chamber does not need to be cooled, manual maintenance and replacement time is short, and operation safety is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] FIG1 is an overall structural diagram of a semiconductor process equipment provided by an embodiment of the present application from one viewing angle;

[0056] FIG2 is a diagram showing the positional relationship between the connection structure of two connection groups and two slide boats used in an embodiment of the present application;

[0057] FIG3 is a partial enlarged view of the second furnace door of the semiconductor process equipment provided in an embodiment of the present application;

[0058] FIG4 is an overall structural diagram of the semiconductor process equipment provided by an embodiment of the present application from another perspective;

[0059] FIG5 is a structural diagram of one of the wafer boats used in an embodiment of the present application;

[0060] FIG6 is a structural diagram of a wafer boat assembly in one of the wafer boats used in an embodiment of the present application;

[0061] FIG7 is a structural diagram of a first boat used in an embodiment of the present application;

[0062] FIG8 is a structural diagram of a third boat used in an embodiment of the present application;

[0063] FIG9 is a top plan view of one of the wafer boats used in an embodiment of the present application;

[0064] FIG10 is a side plan view of one of the wafer boats used in an embodiment of the present application from a first side;

[0065] FIG11 is a partial enlarged view of a wafer boat assembly on the first side of one of the wafer boats used in an embodiment of the present application;

[0066] FIG12 is a side plan view of one of the wafer boats used in an embodiment of the present application from the second side;

[0067] FIG13 is a schematic diagram of a transmission path of a radio frequency current of a first polarity between two wafer carrier boats used in an embodiment of the present application;

[0068] FIG14 is a schematic diagram of a transmission path of a radio frequency current of a second polarity between two wafer carrier boats used in an embodiment of the present application;

[0069] FIG15 is a partial enlarged view of a wafer boat assembly on the second side of one of the wafer boats used in an embodiment of the present application;

[0070] FIG16 is a diagram showing the process of the robot arm used in an embodiment of the present application lifting two wafer boats;

[0071] FIG17 is a side view of a first wafer boat used in an embodiment of the present application from a first side;

[0072] FIG18 is a side view of the first wafer boat used in an embodiment of the present application from the second side;

[0073] FIG19 is a connection diagram of the first conductive wire and the second conductive wire used in an embodiment of the present application. DETAILED DESCRIPTION

[0074] In order to enable those skilled in the art to better understand the technical solution of the present application, the semiconductor process equipment provided by the present application is described in detail below with reference to the accompanying drawings.

[0075] The present invention provides a semiconductor process equipment, which is used, for example, in a tubular plasma enhanced chemical vapor deposition (PECVD) apparatus. Specifically, referring to FIG1 , the semiconductor process equipment includes a process chamber 100, a plurality of connection groups, and a first electrode introduction assembly 101 and a second electrode introduction assembly 102. The process chamber 100 is configured to provide a vacuum process environment. The chamber of the process chamber 100 is, for example, a quartz tube, which can be horizontal or vertical. The process chamber 100 is provided with a first furnace door 103 and a second furnace door 105 at both ends in a first direction (i.e., the X direction) thereof, respectively, for sealing the interior space of the process chamber 100 to form a sealed space. Furthermore, the first furnace door 103 (also known as the front furnace door) is sealedly connected to the chamber of the process chamber 100, for example, via a front flange 104. The first furnace door 103 is configured to be openable or closable to allow a wafer boat to be moved in or out of the furnace opening before or after processing.

[0076] Furthermore, the process chamber 100 is provided with a carrying device for carrying a plurality of wafer boats, for example, two wafer boats (201, 202), wherein the two wafer boats (201, 202) are spaced apart along a first direction (i.e., the X direction), and each wafer boat (201 / 202) includes a plurality of spaced apart boat pieces, for example, spaced apart along a Y direction perpendicular to the first direction. Taking the process chamber 100 as a horizontal chamber as an example, the first direction (i.e., the X direction) and the Y direction are both parallel to a horizontal plane and perpendicular to each other. In some embodiments, the carrying device includes at least two support columns 106. For example, if there are two support columns 106, the two support columns 106 are arranged opposite each other in the Y direction and both extend along the first direction. The two ends of each support column 106 are fixedly connected to the front flange of the first furnace door 103 and the second furnace door 105, respectively, for supporting the two wafer boats (201, 202). Furthermore, each support column 106 is provided with an insulating structure for electrically insulating the support column 106 from the boat legs 208 of the two wafer carrier boats (201, 202). This insulating structure can be of various types, for example, including eight insulating sleeves 107, four of which are sleeved on the two support columns 106 corresponding to the positions of the four boat legs of one wafer carrier boat; and another four of which are sleeved on the two support columns 106 corresponding to the positions of the four boat legs 208 of the other wafer carrier boat. The insulating sleeves 107 are, for example, ceramic sleeves. The boat legs 208 are, for example, ceramic boat legs.

[0077] Multiple connection groups are provided in a one-to-one correspondence with multiple wafer boats, and each connection group includes a connection structure, which is configured to electrically connect to each wafer in the corresponding wafer boat, and to make the polarity of each adjacent wafer opposite; and the connection structure of each adjacent two connection groups is electrically connected between the two adjacent wafer boats. Taking the example of two connection groups and two wafer boats, the two connection groups are respectively provided to correspond to the two wafer boats (201, 202), and each connection group includes a connection structure, i.e., the structure formed by the two dotted boxes on both sides of each wafer boat (201 / 202) shown in FIG2, which is configured to electrically connect to each wafer 203 in the corresponding wafer boat, and to make the polarity of each adjacent wafer 203 opposite; and the connection structure of the two connection groups is electrically connected between the two wafer boats (201, 202), so as to achieve electrical connection between the two wafer boats (201, 202). Furthermore, the connection group near the second furnace door 105 is provided with a first electrode connection terminal and a second electrode connection terminal on the side opposite to the second furnace door 105. The first electrode introduction assembly 101 and the second electrode introduction assembly 102 are provided through the second furnace door 105 and are electrically connected to the first electrode connection terminal and the second electrode connection terminal, respectively, to apply radio frequency voltage to each wafer 203 in the two wafer boats (201, 202) through the connection structure of the two connection groups.

[0078] Specifically, the first electrode introduction assembly 101 and the second electrode introduction assembly 102 are used to electrically connect to the two polarity connection terminals (positive and negative) of the radio frequency source, and respectively introduce the positive and negative radio frequency currents output by the radio frequency source into the process chamber 100, and load them onto the respective boats 203 in the two wafer carrier boats (201, 202) through the connection structures of the two connection groups. When performing processes such as PECVD, it is often necessary to continuously switch the polarity of the two polarity connection terminals of the radio frequency source. In this case, the polarity of the radio frequency currents respectively introduced by the first electrode introduction assembly 101 and the second electrode introduction assembly 102 is also continuously switched, and thus the polarity of each adjacent two boats 203 is also continuously switched, but the polarity always remains opposite.

[0079] The semiconductor process equipment provided by the embodiment of the present application has a first electrode introduction component 101 and a second electrode introduction component 102 for introducing radio frequency voltage, which are both arranged through the second furnace door 105 and electrically connected to the first electrode connection end and the second electrode connection end of the connection group corresponding to the wafer boat near the second furnace door 105, so that the radio frequency voltage can be loaded onto each boat piece 203 in the wafer boat near the second furnace door 105 through the connection group, and the polarity of each two adjacent boat pieces 203 is opposite; at the same time, by electrically connecting each two adjacent connection groups between two adjacent wafer boats (201, 202), the radio frequency voltage can be transmitted to each boat piece 203 in each wafer boat through the two electrically connected connection groups, and the polarity of each two adjacent boat pieces 203 is opposite, thereby realizing the simultaneous loading of radio frequency voltage on multiple wafer boats. Since the above-mentioned first electrode introduction component 101 and the second electrode introduction component 102 are both introduced from the same side of the process chamber (i.e., the side of the second furnace door 105), and only need to be electrically connected to the first electrode connection end and the second electrode connection end of the connection group corresponding to the wafer boat close to the second furnace door 105, this is easier to simplify the structure compared with the structure in the related art that needs to span the entire wafer boat, and it is convenient to design a more mature and reliable connection method such as plug-in to achieve the electrical connection between the first electrode introduction component 101 and the second electrode introduction component 102 and the first electrode connection end and the second electrode connection end of the connection group, thereby solving the problem of abnormal RF voltage and current, abnormal discharge, etc. caused by abnormal contact in the related art, and thus reducing the frequency of equipment maintenance. In addition, since the above-mentioned first electrode introduction assembly 101 and the second electrode introduction assembly 102 are both introduced from the same side of the process chamber (i.e., the side of the second furnace door 105), during maintenance and replacement, it is only necessary to move the wafer boat out of the process chamber 100 and disassemble the above-mentioned first electrode introduction assembly 101 and the second electrode introduction assembly 102 from the second furnace door 105. The chamber does not need to be cooled, the manual maintenance and replacement time is short, and the operation safety is higher.

[0080] In some embodiments, as shown in FIG3 , the first electrode introduction assembly 101 and the second electrode introduction assembly 102 each include an electrode body disposed on a side of the second furnace door 105 facing away from the interior of the process chamber 100, and an electrode connecting rod 108, wherein the electrode body is used to be electrically connected to the RF power supply; one end of the electrode connecting rod 108 is electrically connected to the electrode body, and the other end passes through the second furnace door 105 and extends into the interior of the process chamber 100, and is plugged into the first electrode connection terminal A or the second electrode connection terminal B, and is electrically conductive. The specific structure for plugging the electrode connecting rod 108 into the first electrode connection terminal A or the second electrode connection terminal B is, for example, a socket and a plug that cooperate with each other. The technology of this plug-in method is more mature and reliable, and the life of the electrode introduction structure is longer, thereby solving the problem of abnormal RF voltage and current, abnormal discharge, etc. caused by abnormal contact in the related technology, and reducing the frequency of equipment maintenance. In addition, an observation window 109 is provided on the second furnace door 105 for observing the situation inside the process chamber 100 , for example, observing the connection between the electrode connecting rod 108 and the first electrode connection terminal A or the second electrode connection terminal B.

[0081] In some embodiments, in order to prevent the wafers from being burned due to excessive RF current, and to increase the number of wafers 203 in the wafer carrier boat, thereby facilitating the development of high-capacity wafer carrier boats, the wafers 203 in the wafer carrier boat can be partitioned, and RF voltage can be introduced into the wafers 203 in each partition. Specifically, the wafers 203 in each wafer carrier boat are divided into multiple wafer groups along the Y direction, and the number of wafer groups in multiple wafer carrier boats is the same and corresponds one to one. Each connection group contains multiple connection structures, each of which is configured to be electrically connected to the multiple wafers 203 in each wafer group, with the polarities of each adjacent wafer 203 being opposite. The multiple connection structures in the connection group near the second furnace door 105 are each provided with a first electrode connection terminal A and a second electrode connection terminal B. Each connection structure in each of two adjacent connection groups is electrically connected one to one between two adjacent wafer carrier boats (201, 202). The number of first electrode lead-in assemblies 101 is the same as the number of first electrode connection terminals A, and they are electrically connected in a one-to-one correspondence; the number of second electrode lead-in assemblies 102 is the same as the number of second electrode connection terminals B, and they are electrically connected in a one-to-one correspondence. The first electrode lead-in assemblies 101 and the second electrode lead-in assemblies 102 are arranged in pairs. As shown in Figures 3 and 4, taking two wafer boats, and the wafers 203 in each wafer boat (201 / 202) are divided into two wafer groups (C1, C2) along the Y direction as an example, the wafer boat close to the second furnace door 105 is the first wafer boat 201, and the wafer boat away from the second furnace door 105 is the second wafer boat 202. The two wafer groups (C1, C2) of the first wafer boat 201 correspond to the two wafer groups (C1, C2) of the second wafer boat 202. Each connection group contains two connection structures, each of which is configured to electrically connect to multiple boats 203 in each boat group, with the polarity of each adjacent boat 203 being opposite. The two connection structures in the connection group corresponding to the first wafer boat 201 are each provided with a first electrode connection terminal A and a second electrode connection terminal B. In this case, as shown in FIG3 , the first electrode lead-in assembly 101 and the second electrode lead-in assembly 102 are arranged in pairs, with two pairs in total, and each pair of first electrode lead-in assembly 101 and second electrode lead-in assembly 102 is electrically connected to the corresponding first electrode connection terminal A and second electrode connection terminal B.

[0082] Furthermore, in order to separate each adjacent two boat-piece groups from each other and to electrically insulate them, in some embodiments, as shown in FIG5 and FIG6 , an insulating sheet 204 is provided between each adjacent two boat-piece groups of each of the two wafer carrier boats (201, 202) for electrically insulating each adjacent two boat-piece groups; and an insulating member 205 is provided between each adjacent two connecting structures for electrically insulating each adjacent two connecting structures. Specifically, as shown in FIG6 , the insulating sheet 204 is, for example, a ceramic sheet, and its structure and size can be similar to those of the boat sheet 203, and the ceramic sheet has a plurality of insulating boat ears on both sides in the first direction (i.e., the X direction). On this basis, the insulating member 205 is, for example, fixedly connected to each adjacent two connecting structures (the specific connection method is described in detail below), and the insulating boat ears of the insulating sheet 204 can be inserted into the insulating member 205, thereby achieving relative fixation of the insulating sheet 204 and the boat sheet 203.

[0083] In addition, in some embodiments, as shown in FIG5 , a spacer 206 is provided between each adjacent boat 203 and between the insulating sheet 204 and the adjacent boat 203 for electrically isolating the two adjacent boats 203 and maintaining a certain distance in the Y direction, and for electrically isolating the insulating sheet 204 from the adjacent boat 203 and maintaining a certain distance in the Y direction. The spacer 206 is, for example, a ceramic cylinder. All corresponding ceramic cylinders in the Y direction are connected in series via a ceramic column. The ceramic column passes through each boat 203 and the insulating sheet 204 and is threadedly connected to ceramic nuts 207 at both ends via external threads. The two ceramic nuts 207 are used to lock the boats 203, the insulating sheet 204, and all ceramic cylinders located therebetween together. Multiple ceramic columns are spaced apart in the first direction. The ceramic cylinders on the multiple ceramic columns are spaced apart at different positions on each boat 203 along the first direction to ensure that the distance between adjacent boats 203 is equal at all locations in the first direction.

[0084] In some embodiments, the boat pieces 203 in each wafer carrier boat include at least one first boat piece, at least one second boat piece, and at least one third boat piece; wherein each of the first and second boat pieces has three boat ears, wherein two boat ears and the other boat ear are located on opposite sides of the first or second boat piece in the first direction, and the two boat ears of the first boat piece are located on the opposite side of the two boat ears of the second boat piece. In other words, the first boat piece has two boat ears on one side and one boat ear on the other side; the second boat piece has two boat ears on one side and one boat ear on the other side; and the two boat ears of the first boat piece are located on a different side than the two boat ears of the second boat piece. The third boat piece has two boat ears, one located on either side of the third boat piece in the first direction.

[0085] Each connecting structure is used to achieve opposite polarity between two adjacent boat pieces by electrically connecting to each boat lug of at least one first boat piece, at least one second boat piece, and at least one third boat piece. Each boat piece 203 includes a boat body and at least two boat lugs disposed at the edge of the boat body. The boat body of the first, second, and third boat pieces has the same structure and size, while the number and position of the boat lugs vary. By using multiple boat pieces 203 with different numbers and positions of boat lugs, the connecting structure can be used in conjunction with the connecting structure of the connecting group to achieve electrical connection between the connecting structure and each boat piece 203, and to achieve opposite polarity between two adjacent boat pieces 203.

[0086] There are various ways to configure the number and positions of the boat ears to achieve the above-mentioned function. For example, the total number of boats 203 in each wafer carrier boat is an even number greater than or equal to 4, and the even number of boats 203 includes a first boat 203a, a second boat, and a plurality of third boats 203c. The first boat 203a and the second boat are adjacent. In a specific embodiment, as shown in Figure 7, the above-mentioned first boat piece 203a has three boat ears (203a1, 203a2, 203a3), two of which are located on the same side of the boat piece body, and the other boat ear 203a3 is located on the opposite side of two of the boat ears (203a1, 203a2) in the first direction, and the two boat ears (203a1, 203a2) located on the same side are spaced apart in the second direction, and the second direction is perpendicular to the plane where the first direction and the Y direction are located. For example, the second direction is the vertical direction (i.e., the Z direction). Taking the second direction as the vertical direction as an example, the two boat ears (203a1, 203a2) on the same side are located at different heights, and the boat ear 203a3 located on the opposite side has the same height as the boat ear 203a1, which is the higher of the two boat ears (203a1, 203a2) on the same side.

[0087] Similar to the first boat piece 203a, the second boat piece also has three lugs, two of which are located on the same side of the boat piece body, and one lug is located on the opposite side of the two lugs in the first direction. The two lugs on the same side are spaced apart in the second direction, and the lug on the opposite side is the same height as the taller of the two lugs on the same side. Furthermore, the side of the second boat piece having two lugs is opposite the side of the adjacent first boat piece 203a having two lugs. In other words, if the two lugs (203a1, 203a2) on the same side of the first boat piece 203a in FIG7 are located on the left side of the boat piece body, then the two lugs on the same side of the second boat piece adjacent to the first boat piece 203a are located on the right side of the boat piece body. The number and structure of the lugs on the second boat piece are similar to those of the first boat piece 203a in FIG7, with only the lug positions differing.

[0088] As shown in FIG8 , the third boat piece 203c has two boat ears ( 203c1 , 203c2 ), one located on either side of the boat piece body in the first direction and staggered relative to the other in the second direction. For example, with the second direction being the vertical direction, the two boat ears ( 203c1 , 203c2 ) are at different heights. Furthermore, the boat ears on the same side of two adjacent third boat pieces 203c are at different heights.

[0089] It should be noted that the embodiments of the present application are not limited to the three types of boat pieces 203 with the above-mentioned number and position of boat ears. In actual applications, boat pieces 203 with other numbers and positions of boat ears can be used according to the connection structure of different connection groups, as long as the connection structure can be electrically connected to each boat piece 203 and the polarities of each adjacent boat piece 203 are opposite.

[0090] Various connection structures can be used to achieve electrical connection with each boat piece 203 and to ensure that the polarities of two adjacent boat pieces 203 are opposite. For example, as shown in FIG9 , a plurality of third boat pieces 203 c are divided into a first group D1 and a second group D2. The first group D1 is located on the side of the second boat piece away from the first boat piece 203 a, and the second group D2 is located on the side of the first boat piece 203 a away from the second boat piece. An even number of boat pieces 203 are arranged in sequence from the first group D1 to the second group D2 along the direction in which the boat pieces are arranged (i.e., the Y direction). In other words, the first group D1 of the third boat piece 203 c, the second boat piece, the first boat piece 203 a, and the second group D2 of the third boat piece 203 c are arranged in sequence in the Y direction. Taking the example where the boats 203 in each wafer carrier boat are divided into two boat groups (C1, C2) along the Y direction, the total number of boats 203 in each wafer carrier boat is 24, and the number of boats 203 in each boat group (C1 / C2) is 12. For each boat group (C1 / C2), the 12 boats 203 are numbered 1 to 12 from the first group D1 to the second group D2 (i.e., from top to bottom in FIG9 ), among which the first group D1 has 4 third boats 203 c, numbered 1 to 4; the second boat is numbered 5; the first boat 203 a is numbered 6; and the second group D2 has 6 third boats 203 c, numbered 7 to 12.

[0091] As shown in FIG2 , each connection structure includes a first connection component 301 and a second connection component 302 ; wherein, as shown in FIG10 , the first connection component 301 is located on one side of the corresponding wafer boat in the first direction (hereinafter referred to as the first side) and is configured to electrically connect the third boat pieces 203 c with odd numbers in the first group D1 located on the first side to the second boat piece with a first polarity, and to electrically connect the third boat pieces 203 c with even numbers to the first boat piece 203 a with a second polarity; and to electrically connect the third boat pieces 203 c with odd numbers in the second group D2 located on the first side with a first polarity, and to electrically connect the third boat pieces 203 c with even numbers to the first boat piece 203 a with a second polarity. The first polarity is opposite to the second polarity.

[0092] Taking the 12 boats 203 in each boat group as an example, as shown in Figures 10 and 11, on the first side of each wafer carrier boat, the odd-numbered third boats 203c in the first group D1 are two third boats 203c, numbered 1 and 3, both of which are electrically connected to the second boat 203c, numbered 5, via the first connecting assembly 301, and have the first polarity (negative in Figure 10). The even-numbered third boats 203c in the first group D1 are two third boats 203c, numbered 2 and 4, both of which are electrically connected to the first boat 203a, numbered 6, via the first connecting assembly 301, and have the second polarity (positive in Figure 10). The odd-numbered third boats 203c in the second group D2 are three third boats 203c, numbered 7, 9, and 11, which are electrically connected to each other via the first connecting assembly 301, and have the first polarity. The even-numbered third boats 203 c in the second group D2 are three third boats 203 c numbered 8, 10, and 12, which are all electrically connected to the first boat 203 a numbered 6 through the first connecting assembly 301 and have the second polarity.

[0093] As shown in Figures 12 and 15, the second connecting component 302 is located on the other side of each carrier boat in the first direction (hereinafter referred to as the second side), and is configured to electrically connect the third boat pieces 203c with odd numbers in the first group D1 located on the second side to the second boat piece, and the polarity is the first polarity, and electrically connect the third boat pieces 203c with even numbers to each other, and the polarity is the second polarity; and electrically connect the third boat pieces 203c with odd numbers in the second group D2 located on the second side to the second boat piece, and the polarity is the first polarity, and the third boat pieces 203c with even numbers to the first boat piece 203a, and the polarity is the second polarity.

[0094] Continuing with the example of the twelve boats 203 in each boat group, as shown in Figures 12 and 15 , on the second side of the wafer boat, the odd-numbered third boats 203c in the first group D1 are two third boats 203c, numbered 1 and 3, both of which are electrically connected to the second boat 5 via the second connecting assembly 302, and have a first polarity (negative in Figure 12 ). The even-numbered third boats 203c in the first group D1 are two third boats 203c, numbered 2 and 4, which are electrically connected to each other, and have a second polarity (positive in Figure 12 ). The odd-numbered third boats 203c in the second group D2 are three third boats 203c, numbered 7, 9, and 11, which are electrically connected to the second boat 5 via the second connecting assembly 302, and have a first polarity (negative in Figure 12 ). The even-numbered third boats 203c in the second group D2 are three third boats 203c numbered 8, 10, and 12, which are all electrically connected to the first boat 203a numbered 6 through the second connecting assembly 302, and have the second polarity (positive in FIG. 12 ).

[0095] On this basis, as shown in FIG2 , the first connecting components 301 of the two wafer carrier boats (201, 202) are located on one side close to the first furnace door 103 and the second furnace door 105 respectively in the first direction, and the second connecting components 302 of the two wafer carrier boats (201, 202) are both located between the two wafer carrier boats (201, 202) and are electrically connected; the first connecting component 301 corresponding to the wafer carrier boat close to the second furnace door 105 (i.e., the first wafer carrier boat 201) is provided with a first electrode connecting end (i.e., the first electrode connecting end A shown in FIG10 ) and a second electrode connecting end (i.e., the second electrode connecting end B shown in FIG10 ). For example, as shown in Figures 10 and 11, for the first wafer boat 201, the first electrode connection terminal A is electrically connected to the three third boat pieces 203c numbered 7, 9, and 11 in the second group D2; the second electrode connection terminal B is electrically connected to the three third boat pieces 203c numbered 8, 10, and 12 in the second group D2 and the first boat piece 203a numbered 6.

[0096] In this case, as shown in FIG13 , the radio frequency current of the first polarity (negative polarity in FIG10 ) passes through the first electrode introduction component 101 and the first electrode connection terminal A in sequence to reach the first connection component 301 on the first side of the first wafer boat 201, and then reaches the three third boat pieces 203 c numbered 7, 9, and 11 (as shown in FIG11 ) through the first connection component 301. Since the three third boat pieces 203c with serial numbers 7, 9, and 11 are electrically connected to the second boat piece with serial number 5 through the second connecting component 302 on the second side of the first wafer boat 201 (as shown in Figure 15), and the second boat piece with serial number 5 is electrically connected to the two third boat pieces 203c with serial numbers 1 and 3 through the second connecting component 302 on the second side of the first wafer boat 201 (as shown in Figure 15), it is possible to achieve electrical connection between all 6 boat pieces 203 with odd serial numbers (i.e., serial numbers 1, 3, 5, 7, 9, and 11) in the 12 boat pieces 203 of each boat piece group in the first wafer boat 201, and the polarity is all the first polarity.

[0097] As shown in FIG14 , a radio frequency current of the second polarity (positive in FIG10 ) passes sequentially through the second electrode introduction assembly 102 and the second electrode connection terminal B to the first connecting assembly 301 on the first side of the first wafer boat 201, and then passes through the first connecting assembly 301 to the three third boats 203 c numbered 8, 10, and 12 and the first boat 203 a numbered 6 (as shown in FIG11 ). Since the first boat 203 a numbered 6 is electrically connected to the two third boats 203 c numbered 2 and 4 on the first side of the first wafer boat 201 via the first connecting assembly 301 (as shown in FIG11 ), all six even-numbered boats 203 (i.e., numbered 2, 4, 6, 8, 10, and 12) of the twelve boats 203 in each boat group in the first wafer boat 201 are electrically connected, and all six of the second polarity are connected, thereby achieving opposite polarity between each pair of adjacent boats 203 among the twelve boats 203.

[0098] It is easy to understand that the connection method between the first connecting component 301 and the second connecting component 302 corresponding to the second wafer carrier boat 202 and each boat piece 203 in the second wafer carrier boat 202 is the same as the above-mentioned connection method. The difference is that, contrary to the first wafer carrier boat 201, the first side of the second wafer carrier boat 202 (i.e., the side where the first connecting component 301 is located) is located on the side away from the second furnace door 105, while the second side (i.e., the side where the second connecting component 302 is located) is located on the side close to the second furnace door 105.

[0099] Moreover, in order to realize that the second connecting components 302 of the two wafer carrier boats (201, 202) are both located between the two wafer carrier boats (201, 202) and electrically connected, continuing to take the 12 wafer carriers 203 of each wafer carrier group as an example, as shown in FIG13 , on the second side of the first wafer carrier boat 201, the wafer carriers 203 with serial numbers 1, 3, and 5 of the first wafer carrier boat 201 are electrically connected via the second connecting component 302 (as shown in FIG15 ), and correspondingly, on the second side of the second wafer carrier boat 202, the wafer carriers 203 with serial numbers 1, 3, and 5 of the second wafer carrier boat 202 are electrically connected via the second connecting component 302. In this case, the two wafer carrier boats (201, 202) can be electrically connected by the second connecting components 302. To electrically connect the boat slices 203 with serial numbers 1, 3, and 5 of the first wafer boat 201 with the boat slices 203 with serial numbers 1, 3, and 5 of the second wafer boat 202, so as to transmit the radio frequency current with the first polarity to the boat slices 203 with serial numbers 1, 3, and 5 of the second wafer boat 202, and then the second connecting component 302 and the first connecting component 301 of the second wafer boat 202 can adopt the same connection method as the second connecting component 302 and the first connecting component 301 of the above-mentioned first wafer boat 201 to realize electrical connection between all 6 boat slices with odd numbers (i.e., serial numbers 1, 3, 5, 7, 9, and 11) in the 12 boat slices 203 of each boat slice group in the second wafer boat 202, and the polarity is all the first polarity. At the same time, as shown in FIG14 , on the second side of the first wafer boat 201, the wafers numbered 6, 8, 10, and 12 of the first wafer boat 201 are electrically connected via the second connecting assembly 302, and correspondingly, on the second side of the second wafer boat 202, the wafers numbered 6, 8, 10, and 12 of the second wafer boat 202 are electrically connected via the second connecting assembly 302. In this case, the wafers numbered 6, 8, 10, and 12 of the first wafer boat 201 can also be electrically connected to the wafers numbered 6, 8, 10, and 12 of the second wafer boat 202 via the second connecting assembly 302 of the two wafer boats (201, 202), thereby electrically connecting the wafers numbered 6, 8, 10, and 12 of the first wafer boat 201 to the wafers numbered 6, 8, 10, and 12 of the second wafer boat 202, thereby electrically connecting the wafers numbered 6, 8, 10, and 12 of the second wafer boat 202. The radio frequency current of the second polarity is transmitted to the boat slices numbered 6, 8, 10, and 12 of the second wafer boat 202, and then the second connecting component 302 and the first connecting component 301 of the second wafer boat 202 can adopt the same connection method as the second connecting component 302 and the first connecting component 301 of the first wafer boat 201 to realize electrical connection between all 6 boat slices with even numbers (i.e., the numbers (2, 4, 6, 8, 10, 12)) in the 12 boat slices 203 of each boat slice group in the second wafer boat 202, and the polarity is all the second polarity, thereby realizing that the polarity between each adjacent two boat slices 203 in the 12 boat slices 203 is opposite.

[0100] As shown in FIG16 , in the process of currently using an automated manipulator to pick up and place two wafer boats (201, 202), the two first pick-up and placement parts 401 of the manipulator are used to lift the two wafer boats (201, 202) away from the boat ears with higher heights of each boat piece on each side of each other, and the second pick-up and placement part 402 of the manipulator is located between the two wafer boats (201, 202) and is used to lift the boat ears with higher heights of each boat piece located between the two wafer boats (201, 202). This requires that the electrical connection position of the second connection component 302 of the two wafer boats (201, 202) can avoid the second pick-up and placement part 402 of the manipulator. In this regard, in some embodiments, the electrical connection position of the second connection component 302 of the two wafer boats (201, 202) can be set at a position at the same height as the boat ears with lower heights of each boat piece 203 between the two wafer boats (201, 202), such as position E shown in FIG16 , to avoid the second pick-up and placement part 402 of the manipulator. In this case, in order to avoid the second pick-and-place portion 402 of the manipulator at the electrical connection position, and at the same time transmit the positive and negative RF currents from the lower boat ears of the corresponding boat segments in the first wafer carrier boat 201 to the lower boat ears of the corresponding boat segments in the second wafer carrier boat 202 at the height of the electrical connection position (the height of the position E shown in FIG16 ), and to make the polarities between the two adjacent boat segments opposite, the first connecting assembly 301 and the second connecting assembly 302 can adopt the following structures:

[0101] Specifically, for each wafer boat, as shown in Figures 11 and 12, the first connecting component 301 includes a first-side first connecting member 301a and a first-side second connecting member 301b, wherein the first-side first connecting member 301a is located at a first height position in the second direction, and is used to electrically connect the boat ears of the corresponding heights of the third boat pieces 203c with odd serial numbers in the first group D1 (i.e., the boat ears located at the first height position) to the boat ears of the second boat piece located at the first height position, and to electrically connect the boat ears of the third boat pieces 203c with even serial numbers in the second group D2 located at the first height position to the boat ears of the first boat piece 203a located at the first height position, and to electrically insulate the boat ears of the first boat piece 203a located at the first height position from the boat ears of the second boat piece located at the first height position. In addition, the second connecting member 301b on the first side is located at a second height position in the second direction, and is used to electrically connect the boat ears of the corresponding height of the third boat piece 203c with an even number in the first group D1 (that is, the boat ears located at the second height position) to the boat ears of the first boat piece 203a located at the second height position, and electrically connect the boat ears of the third boat piece 203c with an odd number in the second group D2 at the second height position, and electrically insulate the boat ears of the first boat piece 203a (that is, the boat piece with the serial number 6) located at the second height position from the boat ears of the second group D2 that are closest to the first group D1 at the second height position (that is, the boat ears of the boat piece with the serial number 7); the second height position is different from the first height position. For example, when the above-mentioned second height position is lower than the first height position, the positive and negative RF currents can be transferred from the boat ears with lower heights of the corresponding boat pieces 203 in the first wafer boat 201 to the boat ears with lower heights of the corresponding boat pieces 203 in the second wafer boat 202. Of course, in actual applications, according to different requirements, if it is necessary to set the electrical connection position of the second connecting assembly 302 of the two wafer carrier boats (201, 202) at the same height as the higher boat ears of each boat sheet 203 between the two wafer carrier boats (201, 202), the second height position can also be made higher than the first height position, so as to achieve the transmission of the positive and negative RF currents from the higher boat ears of the corresponding boat sheet 203 in the first wafer carrier boat 201 to the higher boat ears of the corresponding boat sheet 203 in the second wafer carrier boat 202. The embodiments of the present application have no particular limitation on this.

[0102] Continuing with the example of the 12 boats in each boat group, and with the second height position lower than the first height position, on the first side of the wafer carrier boat, as shown in Figures 10 and 11 , the boat ears of the odd-numbered third boats 203c (i.e., boats numbered 1 and 3) in the first group D1 and the boat ears of the second boat (i.e., boat numbered 5) are both located at the first height position and electrically connected via the first-side first connector 301a. Furthermore, the boat ears of the even-numbered third boats 203c (i.e., boats numbered 8, 10, and 12) in the second group D2 and the boat ears of the first boat 203a (i.e., boat numbered 6) are both located at the first height position and electrically connected via the first-side first connector 301a. On this basis, since the polarity of the boat ears of the second boat piece (i.e., the boat piece with serial number 5) is opposite to that of the boat ears of the first boat piece 203a (i.e., the boat piece with serial number 6), it is also necessary to electrically insulate the boat ears at the corresponding height of the first boat piece 203a from the boat ears at the corresponding height of the second boat piece through the first connecting member 301a on the first side to avoid the transmission of radio frequency current between the two.

[0103] Furthermore, on the first side of the wafer boat, the boat ears of the even-numbered third boat pieces 203c (i.e., boat pieces numbered 2 and 4) in the first group D1 and the boat ears of the first boat piece 203a (i.e., boat piece numbered 6) are both located at the second height position and are electrically connected via the first-side second connector 301b. Furthermore, the boat ears of the odd-numbered third boat pieces 203c (i.e., boat pieces numbered 7, 9, and 11) in the second group D2 are both located at the second height position and are electrically connected via the first-side second connector 301b. On this basis, since the polarity of the boat ear of the first boat piece 203a (i.e., the boat piece with serial number 6) is opposite to the polarity of the boat ear of the third boat piece 203c with serial number 7, it is also necessary to electrically insulate the boat ear of the first boat piece 203a (i.e., the boat piece with serial number 6) from the boat ear of the third boat piece 203c with serial number 7 through the second connecting piece 301b on the first side to avoid the transmission of radio frequency current between the two.

[0104] The first side first connector 301a for realizing the above-mentioned function can have a variety of structures. For example, as shown in Figures 11 and 17, the first side first connector 301a includes a first side first conductive block 301a1, a first side first insulating block 301a2 and a first side second conductive block 301a3, which are arranged in sequence from the first group D1 to the second group D2 along the Y direction and fixedly connected together, that is, all three are located at the above-mentioned first height position and arranged in sequence along the Y direction, wherein the first side first conductive block 301a is plugged into the boat ear of the third boat piece 203c with an odd number in the first group D1 (that is, the boat pieces with numbers 1 and 3) and the boat ear of the second boat piece (that is, the boat piece with number 5) located at the first height position, and are electrically conductive.

[0105] The above-mentioned plug-in method can specifically be that the boat piece 203 is inserted into the first-side first conductive block 301a1, and / or the boat piece 203 is inserted into one side of the first-side first conductive block 301a1 in the Y direction. For example, the boat pieces numbered 1 and 5 are respectively located on both sides of the first-side first conductive block 301a1 in the Y direction, while the boat piece numbered 3 is inserted into the first-side first conductive block 301a1. The first-side first conductive block 301a1 is an integrated structure, but the embodiment of the present application is not limited to this. In actual applications, the first-side first conductive block 301a1 can also be a split structure, for example, including two connecting blocks, each connecting block is located between the boat ears of two adjacent boat pieces in the boat pieces numbered 1, 3, and 5, and the two connecting blocks can be fixedly connected by an insulating fixing member (which will be described in detail later).

[0106] The first-side second conductive block 301a3 is plugged into and electrically connected to the lugs at the first height of the even-numbered third boat pieces 203c (i.e., boat pieces numbered 8, 10, and 12) in the second group D2, as well as the lugs at the first height of the first boat piece 203a (i.e., boat piece numbered 6). This plugging method can be similar to that of the first-side first conductive block 301a1, and the first-side second conductive block 301a3 can also be an integrated structure or a split structure.

[0107] The first-side first insulating block 301a2 is located between the second boat piece (i.e., boat piece numbered 5) and the boat lug located at the first height of the first boat piece 203a (i.e., boat piece numbered 6), and electrically insulates the two. It is easy to understand that if the two boat lugs are respectively inserted into the first-side first conductive block 301a1 and the first-side second conductive block 301a3, the first-side first insulating block 301a2 is located between the first-side first conductive block 301a1 and the first-side second conductive block 301a3, thereby preventing the transmission of radio frequency current therebetween.

[0108] In addition, a second electrode connection terminal B is provided on the second conductive block 301 a 3 on the first side corresponding to the first wafer boat 201 close to the second furnace door 105 , so as to be connected to the second electrode introduction assembly 102 .

[0109] In some embodiments, since the first-side first conductive block 301a1, the first-side first insulating block 301a2, and the first-side second conductive block 301a3 in all boat assemblies are located at the first height and arranged sequentially along the Y direction, the insulating fixing member can be a plurality of insulating posts that sequentially penetrate the first-side first conductive block 301a1, the first-side first insulating block 301a2, and the first-side second conductive block 301a3 in all boat assemblies along the Y direction. Each insulating post has external threads at both ends and is threadedly connected to two insulating nuts. The two insulating nuts can lock the first-side first conductive block 301a1, the first-side first insulating block 301a2, and the first-side second conductive block 301a3 in all boat assemblies between the two insulating nuts. In addition, the insulating member 205 located between each adjacent two connecting structures can also be located at the first height and arranged between the above components to be fixed to the above components via the insulating posts.

[0110] Similar to the structure of the first connecting member 301a on the first side, the second connecting member 301b on the first side that realizes the above-mentioned function includes a first-side third conductive block 301b1, a first-side second insulating block 301b2 and a first-side fourth conductive block 301b3, which are arranged in sequence from the first group D1 to the second group D2 along the Y direction and fixedly connected together, that is, all three are located at the above-mentioned second height position and are arranged in sequence along the Y direction, wherein the first-side third conductive block 301b1 is plugged into the boat ear of the third boat piece 203c with an even number in the first group D1 (that is, the boat pieces 203 with numbers 2 and 4) located at the second height position and the boat ear of the first boat piece 203a (that is, the boat piece 203 with number 6) located at the second height position, and is electrically conductive. The first-side fourth conductive block 301b3 is plugged into and electrically connected to the boat ears of the odd-numbered third boat pieces 203c in the second group D2 (i.e., boat pieces 203 numbered 7, 9, and 11). The first-side third conductive block 301b1 and the first-side fourth conductive block 301b3 can be plugged into the boat ears in a manner similar to the first-side first conductive block 301a1. Furthermore, the first-side third conductive block 301b1 and the first-side fourth conductive block 301b3 can also be an integrated structure or a split structure. The split structure, for example, includes at least two connecting blocks, and the fixing method of the at least two connecting blocks can also be similar to that of the first-side first conductive block 301a1, which will not be further described here.

[0111] The second insulating block 301b2 on the first side is located between the boat ear at the second height position of the first boat piece 203a (i.e., the boat piece with serial number 6) and the boat ear at the second height position closest to the first group D1 in the second group D2 (i.e., the boat ear of the boat piece with serial number 7), and electrically insulates the two.

[0112] In addition, a first electrode connection terminal A is provided on the fourth conductive block 301 b 3 on the first side to facilitate corresponding connection with the second electrode introduction component 102 .

[0113] For each wafer boat, as shown in Figures 12 and 15, the second connecting assembly 302 includes a second-side first connecting member 302a and a second-side second connecting member 302b, wherein the second-side first connecting member 302a is located at a first height position, and is used to electrically connect the boat ear of the third boat piece 203c with an even number in the first group D1 and located at the first height position, and to electrically connect the boat ear of the third boat piece 203c with an odd number in the second group D2 and located at the first height position with the boat ear of the second boat piece and located at the first height position, and to electrically connect the boat ear of the third boat piece closest to the second boat piece in the first group D1 and located at the first height position (i.e., the boat ear of the boat piece with the number 4) boat ears) are electrically insulated from the boat ears of the second boat piece located at the first height position (that is, the boat ears of the boat piece with serial number 5); the second connecting piece 302b on the second side is located at the second height position, and is used to electrically connect the boat ears of the third boat piece 203c with serial number 5 in the first group D1 and located at the first height position with the boat ears of the second boat piece located at the first height position, and to electrically connect the boat ears of the third boat piece 203c with serial number 5 in the second group D2 and located at the first height position with the boat ears of the first boat piece 203a and located at the first height position, and to electrically insulate the boat ears of the first boat piece 203a and located at the first height position from the boat ears of the second boat piece. The above-mentioned second connecting component 302 is used in conjunction with the first connecting component 301 to realize the electrical connection of each boat piece 203 in the corresponding carrier boat, and to make the polarity between each adjacent boat piece 203 opposite, and to transmit the positive radio frequency current and the negative radio frequency current from the boat ears with lower heights of the corresponding boat piece 203 in the first carrier boat 201 to the boat ears with lower heights of the corresponding boat piece 203 in the second carrier boat 202, and to make the polarity between each adjacent boat piece 203 opposite.

[0114] Continuing with the example of the twelve boats 203 in each boat group, and with the second height position lower than the first height position, on the second side of the wafer carrier boat, as shown in Figures 12 and 15 , the boat lugs of the even-numbered third boats 203c (i.e., boats 2 and 4) in the first group D1 are all located at the first height position and are electrically connected via the second-side first connector 302a. Furthermore, the boat lugs of the odd-numbered third boats 203c (i.e., boats 203 2 and 11) in the second group D2 are all located at the first height position and are electrically connected via the second-side first connector 302a. On this basis, since the polarity of the boat ear of the second boat piece (i.e., the boat piece with serial number 5) is opposite to the polarity of the boat ear of the third boat piece 203c with serial number 4, it is also necessary to electrically insulate the boat ear of the second boat piece (i.e., the boat piece with serial number 5) from the boat ear of the third boat piece 203c with serial number 4 through the first connecting piece 302a on the second side to avoid the transmission of radio frequency current between the two.

[0115] Furthermore, on the second side of the wafer boat, as shown in Figures 12 and 15 , the boat ears of the odd-numbered third boat pieces 203c (i.e., boat pieces 203 numbered 1 and 3) are both located at the second height position and electrically connected to the second boat piece (i.e., boat piece numbered 5) via the second-side first connector 302a. Furthermore, the even-numbered third boat pieces 203c in the second group D2 (i.e., boat pieces numbered 8, 10, and 12) are both located at the second height position and electrically connected to the first boat piece 203a (i.e., boat piece numbered 6) via the second-side first connector 302a. On this basis, since the polarity of the boat ear of the second boat piece (i.e., the boat piece with serial number 5) is opposite to that of the boat ear of the first boat piece 203a (i.e., the boat piece with serial number 6), it is also necessary to electrically insulate the boat ear of the second boat piece (i.e., the boat piece with serial number 5) from the boat ear of the first boat piece 203a (i.e., the boat piece with serial number 6) through the first connecting piece 302a on the second side to avoid the transmission of radio frequency current between the two.

[0116] The second-side first connector 302a for realizing the above-mentioned function can have various structures. For example, as shown in FIG18 , the second-side first connector 302a includes a second-side first conductive block 302a1, a second-side first insulating block 302a2, and a second-side second conductive block 302a3, which are arranged in sequence from the first group D1 to the second group D2 along the Y direction and fixedly connected together. That is, all three are located at the above-mentioned first height position and are arranged in sequence along the Y direction. Among them, the second-side first conductive block 302a1 is plugged into the boat ears of the even-numbered third boat pieces 203c (i.e., boat pieces numbered 2 and 4) in the first group D1 and are located at the first height position, and are electrically conductive; the second-side second conductive block 302a3 is plugged into the boat ears of the odd-numbered third boat pieces 203c (i.e., boat pieces numbered 7, 9, and 11) in the second group D2 and the boat ears of the second boat piece (i.e., boat piece numbered 5) and are located at the first height position, and are electrically conductive. The second-side first conductive block 302a1 and the second-side second conductive block 302a3 can be plugged into the boat ear in a manner similar to the first-side first conductive block 301a1. Furthermore, the second-side first conductive block 302a1 and the second-side second conductive block 302a3 can also be an integrated structure or a split structure. The split structure, for example, includes at least two connecting blocks, and the fixing method of the at least two connecting blocks can also be similar to that of the first-side first conductive block 301a1, which will not be further described here.

[0117] The first insulating block 302a2 on the second side is located between the boat ear of the third boat piece closest to the second boat piece in the first group D1 (i.e., the boat ear of the boat piece numbered 4) located at the first height position and the boat ear of the second boat piece (i.e., the boat ear of the boat piece numbered 5) located at the first height position, and electrically insulates the two.

[0118] The second connecting member 302b on the second side that realizes the above-mentioned function includes the third conductive block 302b1 on the second side, the second insulating block 302b2 on the second side, and the fourth conductive block 302b3 on the second side, which are arranged in sequence from the first group D1 to the second group D2 along the Y direction and fixedly connected together. That is, all three are located at the second height position and are arranged in sequence along the Y direction. Among them, the third conductive block 302b1 on the second side and the third boat piece 203c ( The fourth conductive block 302b3 on the second side is plugged into the lugs at the second height position of the third boat pieces 203c (i.e., boat pieces numbered 8, 10, and 12) in the second group D2, and the lugs at the second height position of the first boat piece 203a (i.e., the lugs of the boat piece numbered 6), and are electrically connected. The manner in which the third conductive block 302b1 on the second side and the fourth conductive block 302b3 on the second side are plugged into the lugs can be similar to that of the first conductive block 301a1 on the first side, and the third conductive block 302b1 on the second side and the fourth conductive block 302b3 on the second side can also be an integrated structure or a split structure. The split structure includes, for example, at least two connecting blocks. The fixing method of the at least two connecting blocks may be similar to that of the first conductive block 301 a 1 on the first side, which will not be described in detail here.

[0119] The second insulating block 302b2 on the second side is located between the boat ear of the second boat piece at the second height position (i.e., the boat ear of the boat piece numbered 5) and the boat ear of the first boat piece 203a at the second height position (i.e., the boat ear of the boat piece numbered 6), and electrically insulates the two.

[0120] On this basis, as shown in FIG15 and FIG17, between the two wafer carrier boats (201, 202), since the boat ears of the third boat pieces 203c (i.e., the boat pieces with serial numbers 1 and 3) with odd numbers and the second boat piece (i.e., the boat piece with serial number 5) are both located at the second height position, the second side third conductive blocks 302b1 of the two wafer carrier boats (201, 202) electrically connected to these boat pieces 203 can realize that the radio frequency current with the first polarity is transmitted from the first wafer carrier boat 203c to the second wafer carrier boat 203c through electrical connection. 1 is transferred to the second wafer boat 202; similarly, since the boat ears of the even-numbered third boat pieces 203c (i.e., boat pieces numbered 8, 10, and 12) are all located at the second height position with respect to the first boat piece 203a (i.e., boat piece numbered 6), the second-side fourth conductive blocks 302b3 of the two wafer boats (201, 202) electrically connected to these boat pieces can achieve the transmission of the radio frequency current of the second polarity from the first wafer boat 201 to the second wafer boat 202 through electrical connection. In this way, the positive and negative radio frequency currents can be transferred from the lower boat ears of the corresponding boat piece 203 in the first wafer boat 201 to the lower boat ears of the corresponding boat piece 203 in the second wafer boat 202, and the polarities between the two adjacent boat pieces 203 are opposite, thereby avoiding the second pick-and-place portion 402 of the robot.

[0121] In some embodiments, the semiconductor processing equipment further includes a wire assembly, as shown in FIG19 , which includes a first wire 501 and a second wire 502. The two ends of the first wire 501 are respectively plugged into the second-side third conductive blocks 302b1 corresponding to two adjacent wafer boats (e.g., two wafer boats (201, 202)) and are electrically connected; the two ends of the second wire 502 are respectively plugged into the second-side fourth conductive blocks 302b3 corresponding to the two adjacent wafer boats and are electrically connected. The specific structure for plugging the first wire 501 into the second-side third conductive block 302b1 and the specific structure for plugging the second wire 502 into the second-side fourth conductive block 302b3 are, for example, mating slots and plugs. This plug-in method is more mature and reliable, and the life of the electrode lead-in structure is longer, thereby resolving the problem of abnormal RF voltage and current, abnormal discharge, and other phenomena caused by abnormal contact in related technologies, thereby reducing the frequency of equipment maintenance.

[0122] In some embodiments, the first wire 501 and the second wire 502 are, for example, high-temperature resistant flexible wires to achieve a flexible connection between the two wafer boats (201, 202), thereby allowing the two wafer boats (201, 202) to move relative to each other within a certain range, thereby preventing the two wafer boats (201, 202) from being damaged by external forces during transportation, processing, etc. It is easy to understand that when the boats 203 in each wafer boat are divided into multiple boat groups along the Y direction, the number of the above-mentioned wire assemblies is the same as the number of boat groups, and they are arranged in a one-to-one correspondence.

[0123] In summary, in the semiconductor process equipment provided by the embodiment of the present application, the first electrode introduction component 101 and the second electrode introduction component 102 are both introduced from the same side of the process chamber (i.e., the side of the second furnace door 105), and only need to be electrically connected to the first electrode connection end and the second electrode connection end of the connection group corresponding to the wafer boat close to the second furnace door 105. This is easier to simplify the structure than the structure in the related art that needs to span the entire wafer boat, and it is convenient to design a more mature and reliable connection method such as plug-in to achieve the electrical connection between the first electrode introduction component 101 and the second electrode introduction component 102 and the first electrode connection end and the second electrode connection end of the connection group, thereby solving the problem of abnormal RF voltage and current, abnormal discharge, etc. caused by abnormal contact in the related art, and thus reducing the frequency of equipment maintenance. In addition, since the above-mentioned first electrode introduction assembly 101 and the second electrode introduction assembly 102 are both introduced from the same side of the process chamber (i.e., the side of the second furnace door 105), during maintenance and replacement, it is only necessary to move the wafer boat out of the process chamber 100 and disassemble the above-mentioned first electrode introduction assembly 101 and the second electrode introduction assembly 102 from the second furnace door 105. The chamber does not need to be cooled, the manual maintenance and replacement time is short, and the operation safety is higher.

[0124] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present application, and the present application is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present application, and such modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. A semiconductor process equipment, characterized in that: include: A process chamber, wherein a first furnace door and a second furnace door are arranged opposite to each other in a first direction, wherein the first furnace door is configured to be openable or closable, and a carrying device is arranged in the process chamber, wherein the carrying device is used to carry a plurality of wafer boats, and the plurality of wafer boats are arranged at intervals along the first direction, and each of the wafer boats includes a plurality of wafers arranged at intervals; A plurality of connection groups are arranged corresponding to the plurality of wafer carrier boats, and each of the connection groups includes a connection structure, the connection structure is arranged to be electrically connected to each of the boat slices in the corresponding wafer carrier boat, and the polarities of each two adjacent boat slices are opposite; and the connection structures of each two adjacent connection groups are electrically connected between the two adjacent wafer carrier boats; the connection structure of the connection group close to the second furnace door is provided with a first electrode connection terminal and a second electrode connection terminal on a side opposite to the second furnace door; The first electrode introduction assembly and the second electrode introduction assembly are arranged through the second furnace door and are electrically connected to the first electrode connection end and the second electrode connection end respectively, so as to load the radio frequency voltage to each of the boat slices in the wafer boat through the connection structure corresponding to the connection group.

2. The semiconductor process equipment according to claim 1, characterized in that: The boat pieces in each of the wafer-carrying boats include at least one first boat piece, at least one second boat piece and at least one third boat piece; wherein, The first boat piece and the second boat piece each have three boat ears, wherein two boat ears and another boat ear are respectively located on both sides of the first boat piece or the second boat piece in the first direction, and a side where the two boat ears of the first boat piece are located is opposite to a side where the two boat ears of the second boat piece are located; the third boat piece has two boat ears, which are respectively located on both sides of the third boat piece in the first direction; Each of the connection structures is used to realize opposite polarities of two adjacent boat pieces by being electrically connected to the boat ears of the at least one first boat piece, the at least one second boat piece and the at least one third boat piece.

3. The semiconductor process equipment according to claim 2, characterized in that: In each of the wafer boats, the first boat sheet and the second boat sheet are adjacent to each other; the plurality of the third boat sheets are divided into a first group and a second group, the first group is located on a side of the second boat sheet away from the first boat sheet, and the second group is located on a side of the first boat sheet away from the second boat sheet; all the boat sheets are arranged along the spacing direction of the boat sheets, and are arranged in sequence from the first group to the second group; Each of the connection structures comprises a first connection component and a second connection component; wherein the first connection component is located on one side of the corresponding wafer boat in the first direction, and is configured to electrically connect the third boat pieces with odd numbers in the first group located on the side to the second boat piece, and the polarity is the first polarity, and the third boat pieces with even numbers are electrically connected to the first boat piece, and the polarity is the second polarity; and to electrically connect the third boat pieces with odd numbers in the second group located on the side, and the polarity is the first polarity, and the third boat pieces with even numbers are electrically connected to the first boat piece, and the polarity is the second polarity; the first polarity is opposite to the second polarity; The second connecting assembly is located at the other side of each of the wafer boats in the first direction, and is configured to electrically connect the third boat pieces with odd numbers in the first group located on the side to the second boat piece, and the polarity is the first polarity, and the third boat pieces with even numbers are electrically connected to each other, and the polarity is the second polarity; and to electrically connect the third boat pieces with odd numbers in the second group located on the side to the second boat piece, and the polarity is the first polarity, and the third boat pieces with even numbers are electrically connected to the first boat piece, and the polarity is the second polarity; The first connecting components of the two wafer boats are located on one side of the first furnace door and the second furnace door respectively in the first direction, and the second connecting components of the two wafer boats are located between the two wafer boats and are electrically connected; the first connecting component corresponding to the wafer boat close to the second furnace door is provided with the first electrode connecting end and the second electrode connecting end.

4. The semiconductor process equipment according to claim 3, characterized in that: The first connection assembly includes a first-side first connection member and a first-side second connection member, wherein: The first connecting member on the first side is located at a first height position in the second direction, and is used to electrically connect the boat ears at the corresponding heights of the third boat pieces with odd numbers in the first group to the boat ears at the corresponding heights of the second boat pieces, and to electrically connect the boat ears at the corresponding heights of the third boat pieces with even numbers in the second group to the boat ears at the corresponding heights of the first boat pieces, and to electrically insulate the boat ears at the corresponding heights of the first boat pieces from the boat ears at the corresponding heights of the second boat pieces; the second direction is perpendicular to the horizontal plane; The second connecting member on the first side is located at a second height position in the second direction, and is used to electrically connect the boat ears at the corresponding height of the third boat pieces with even numbers in the first group to the boat ears at the corresponding height of the first boat piece, and to electrically connect the boat ears at the corresponding height of the third boat pieces with odd numbers in the second group, and to electrically insulate the boat ears at the corresponding height of the first boat piece from the boat ears at the corresponding height of the third boat piece in the second group that is closest to the first boat piece; the second height position is different from the first height position.

5. The semiconductor process equipment according to claim 4, characterized in that: The first side first connector includes a first side first conductive block, a first side first insulating block and a first side second conductive block which are arranged in sequence from the first group to the second group along the spacing arrangement direction of the boat sheet and are fixedly connected together, wherein: The first conductive block on the first side is plugged with a boat ear at a corresponding height of the third boat piece with an odd sequence number in the first group and a boat ear at a corresponding height of the second boat piece, and is electrically conductive; The second conductive block on the first side is plugged with a boat ear at a corresponding height of a third boat sheet with an even sequence number in the second group and a boat ear at a corresponding height of the first boat sheet, and is electrically conductive; The first insulating block on the first side is located between the boat ear at a corresponding height of the first boat piece and the boat ear at a corresponding height of the second boat piece, and electrically insulates the two; The second electrode connection end is arranged on the second conductive block on the first side corresponding to the wafer boat close to the second furnace door.

6. The semiconductor process equipment according to claim 4, characterized in that: The first-side second connector includes a first-side third conductive block, a first-side second insulating block and a first-side fourth conductive block which are arranged in sequence from the first group to the second group along the spacing arrangement direction of the boat sheet and are fixedly connected together, wherein: The third conductive block on the first side is plugged with a boat ear at a corresponding height of the third boat piece with an even sequence number in the first group and a boat ear at a corresponding height of the first boat piece, and is electrically conductive; The fourth conductive block on the first side is plugged into the boat ears at the corresponding height of the third boat pieces with odd serial numbers in the second group, and they are electrically connected; The second insulating block on the first side is located between a boat ear at a corresponding height of the first boat piece and a boat ear at a corresponding height of a third boat piece closest to the first boat piece in the second group, and electrically insulates the two; The first electrode connection end is arranged on the fourth conductive block on the first side corresponding to the wafer boat close to the second furnace door.

7. The semiconductor process equipment according to claim 4, characterized in that: The second connection assembly includes a second-side first connection member and a second-side second connection member, wherein: The first connecting member on the second side is located at the first height position, and is used to electrically connect the boat ears at the corresponding heights of the third boat pieces with even numbers in the first group, and to electrically connect the boat ears at the corresponding heights of the third boat pieces with odd numbers in the second group with the boat ears at the corresponding heights of the second boat pieces, and to electrically insulate the boat ears at the corresponding heights of the third boat pieces in the first group that are closest to the second boat pieces from the boat ears at the corresponding heights of the second boat pieces; The second connecting member on the second side is located at the second height position, and is used to electrically connect the boat ears at the corresponding height of the third boat pieces with odd numbers in the first group to the boat ears at the corresponding height of the second boat piece, and to electrically connect the boat ears at the corresponding height of the third boat pieces with even numbers in the second group to the boat ears at the corresponding height of the first boat piece, and to electrically insulate the boat ears at the corresponding height of the first boat piece from the boat ears at the corresponding height of the second boat piece.

8. The semiconductor process equipment according to claim 7, characterized in that: The second side first connector includes a second side first conductive block, a second side first insulating block, and a second side second conductive block which are arranged in sequence from the first group to the second group along the spacing arrangement direction of the boat sheet and are fixedly connected together, wherein: The first conductive block on the second side is plugged into a boat ear at a corresponding height of a third boat sheet with an even sequence number in the first group, and is electrically connected; The second conductive block on the second side is plugged with the boat ears at a corresponding height of the odd-numbered third boat pieces in the second group and the boat ears at a corresponding height of the second boat pieces, and is electrically conductive; The first insulating block on the second side is located between a boat ear at a corresponding height of a third boat sheet closest to the second boat sheet in the first group and a boat ear at a corresponding height of the second boat sheet, and electrically insulates the two.

9. The semiconductor process equipment according to claim 7, characterized in that: The second side second connector includes a second side third conductive block, a second side second insulating block, and a second side fourth conductive block which are arranged in sequence from the first group to the second group along the spacing arrangement direction of the boat sheet and are fixedly connected together, wherein: The third conductive block on the second side is plugged with a boat ear at a corresponding height of the third boat piece with an odd sequence number in the first group and a boat ear at a corresponding height of the second boat piece, and is electrically conductive; The fourth conductive block on the second side is plugged with a boat ear at a corresponding height of the third boat piece with an even sequence number in the second group and a boat ear at a corresponding height of the first boat piece, and is electrically conductive; The second insulating block on the second side is located between the boat ear at a corresponding height of the first boat piece and the boat ear at a corresponding height of the second boat piece, and electrically insulates the two.

10. The semiconductor process equipment according to claim 9, characterized in that: It also includes a wire assembly, the wire assembly includes a first wire and a second wire, wherein two ends of the first wire are respectively plugged into the third conductive blocks of the second side corresponding to two adjacent wafer boats, and are electrically connected; Two ends of the second conductive wire are respectively plugged into the fourth conductive blocks on the second side corresponding to two adjacent wafer boats and are electrically connected.

11. The semiconductor process equipment according to claim 4, characterized in that: The second height position is lower than the first height position.

12. The semiconductor process equipment according to claim 1, characterized in that: The first electrode introduction assembly and the second electrode introduction assembly both include an electrode body disposed on the side of the second furnace door away from the interior of the process chamber, and an electrode connecting rod, wherein the electrode body is used to be electrically connected to a radio frequency power supply; one end of the electrode connecting rod is electrically connected to the electrode body, and the other end passes through the second furnace door and extends to the interior of the process chamber, and is plugged into the first electrode connecting end or the second electrode connecting end, and is electrically conductive.

13. The semiconductor process equipment according to any one of claims 1 to 12, characterized in that: The boats in each of the wafer carrier boats are divided into a plurality of boat groups along the direction in which the boats are arranged at intervals, and the number of the boat groups corresponding to the two wafer carrier boats is the same and corresponds one to one; There are a plurality of connection structures in each connection group, and each connection structure is configured to be electrically connected to a plurality of boats in each boat group in a one-to-one correspondence, and the polarities of two adjacent boats are opposite; The first electrode connection end and the second electrode connection end are provided for the plurality of connection structures in the connection group close to the second furnace door; the connection structures in each of two adjacent connection groups are electrically connected one by one between two adjacent wafer boats; The number of the first electrode introduction components is the same as the number of the first electrode connection terminals, and they are electrically connected one-to-one; the number of the second electrode introduction components is the same as the number of the second electrode connection terminals, and they are electrically connected one-to-one.

14. The semiconductor process equipment according to claim 13, characterized in that: An insulating sheet is provided between each adjacent two boat sheet groups in each of the wafer carrier boats; An insulating member is arranged between each two adjacent connection structures.

15. The semiconductor process equipment according to claim 1, characterized in that: The bearing device comprises two support columns, which are arranged opposite to each other in the spacing arrangement direction of the boat pieces and are both extended along the first direction, and both ends of each support column are fixedly connected to the first furnace door and the second furnace door respectively; An insulating structure is provided on each of the support columns for electrically insulating the support column from the two wafer boats.

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