Use of tris-[(methacryloyloxy)-alkyl]-isocyanuric acids in reactive resin compositions and in multicomponent reactive resin systems obtained therefrom

Abstract

The invention relates to the use of tris-[(methacryloyloxy)-alkyl]-isocyanuric acids as radically curable compounds in reactive resin compositions and in multicomponent reactive resin systems obtained therefrom. By using tris-[(methacryloyloxy)-alkyl]-isocyanuric acids as radically curable compounds in the reactive resin component of the multicomponent reactive resin system, the performance of a fastening assembly at high temperatures can be improved, wherein the fastening assembly comprises a reactive resin mortar, which is made of the multicomponent reactive resin system according to the invention, and a fastening means.

Description

Use of tris-[(methacryloyloxy)-alkyl]-isocyanuric acids in reactive resin compositions and in multi-component reactive resin systems obtained therefrom DESCRIPTION The present invention relates to the use of tris-[(methacryloyloxy)-alkyl]-isocyanuric acids as radically curable compounds in reactive resin compositions and in multicomponent reactive resin systems obtained therefrom. The use of tris-[(methacryloyloxy)-alkyl]-isocyanuric acids as radically curable compounds in the reactive resin component of the multicomponent reactive resin system can improve the performance of a fastening assembly at elevated temperatures. The fastening assembly comprises a reactive resin mortar produced from the multicomponent reactive resin system according to the invention and a fastening agent. background The use of chemical fasteners based on radically curable reactive resins has long been known. In the field of fastening technology, the use of reactive resin mixtures as organic binders for chemical fastening technology, e.g., as anchoring compounds, has become established. These are composite compounds formulated as multi-component systems, with one component (the reactive resin component) containing the reactive resin mixture and the other component (the hardener component) containing the curing agent. Other common ingredients, such as fillers, accelerators, stabilizers, solvents, and reactive diluents, may be included in one or both components. By mixing the two components, the curing reaction, i.e. polymerization, is initiated by radical formation and the resin is hardened to form a thermoset. Reactive resins are subject to stringent requirements in chemical fastening technology, e.g., when used as anchoring compounds. This application requires excellent mechanical strength and adhesion to mineral substrates, as well as to other substrates such as glass, steel, and the like. One parameter used to assess mechanical strength and adhesive properties is the so-called failure bond stress. A low failure bond stress indicates low tensile strength and poor adhesion to the substrate. When reactive resin compounds are used as organic binders, particularly for mortar and / or anchoring compounds, high failure bond stresses must be achieved even under stringent conditions. Functionalized acrylates are typically used as reactive resins or base resins in conventional reactive resin systems. WO 2012 / 158887 A1, for example, describes anchoring compounds with a functionalized acrylate as the base resin. However, acrylates have several disadvantages. Those skilled in the art know that acrylates react significantly faster than methacrylates. This is described, for example, in Ballard N., Asua JM, "Radical polymerization of acrylic monomers: An overview," Progress in Polymer Science, Vol. 79, 2018, pp. 40-60. Furthermore, it is known that the performance of chemical mortars is adversely affected by temperature. For example, acrylates have a lower glass transition temperature T gcompared to methacrylates. At elevated temperatures, i.e. at elevated temperatures in the installed state, such as +80°C, the performance of chemical mortars decreases. This is described, for example, in Cook, RA, Konz, RC, "Factors Influencing Bond Strength of Adhesive Anchors", ACI Structural Journal, 2001, 98, 76-86 and in Lahouar, M., Caron, J.-F. , Pinoteau, N., Foret, G., Benzarti, K., "Mechanical behavior of adhesive anchors under high temperature exposure: experimental investigation", International Journal of Adhesion and Adhesives, 2017, 78, 200-211. An increase in temperature leads to a weakening of the polymer network and thus also to a weakening of the chemical mortar. Consequently, the load-bearing capacity of the chemical mortar decreases significantly. Another disadvantage of acrylates is their tendency to hydrolyze under basic conditions, as described in Mallik KL, Das MN, Naturwissenschaften 51 , 37 (1964). The resulting cured mortars thus exhibit low stability under basic conditions. Such basic conditions can occur or develop, for example, when chemically bonding anchors in or to substrates containing calcium oxide, such as concrete or gypsum. Concrete, for example, is characterized by having a surface pH of 13.5, as described in Müller, B. et al. RILEM Technical Letters (2018) 3, 39-45. Furthermore, some members of the acrylate group are hazardous to health and therefore require labeling. This means that reactive resin systems containing these compounds in certain amounts are also subject to labeling requirements, which in turn leads to lower user acceptance of the product. There is therefore a need to enable improved performance of a chemical fastening assembly at elevated temperatures, ie from a temperature of approximately +80°C, while at the same time maintaining the reactivity of the reactive resin system used at room temperature, as well as reducing potential health hazards during manufacture, packaging and processing of the reactive resin system. Object of the invention The object of the invention is therefore to improve the performance of a chemical fastening system at elevated temperatures, i.e., above a temperature of approximately +80°C. At the same time, the reactive resin system used should exhibit a reactivity comparable to conventional systems at room temperature, as well as to reduce potential health risks during both the manufacture and packaging of the reactive resin system, as well as during its processing. Subject of the invention It has now surprisingly been found that the object of the invention can be achieved by incorporating tris-[(methacryloyloxy)-alkyl]-isocyanuric acids into the reactive resin component, which either form the cured network directly through covalent bonding or are incorporated into the cured network together with other reactive resins. The cured network is incorporated into the polymer. Without being bound to any particular theory, it is assumed that the higher number of functional groups in the tris-[(methacryloyloxy)-alkyl]-isocyanuric acids results in greater cross-linking between the resin components of the reactive resin component, leading to a higher cross-linking density. Tris-[(methacryloyloxy)-alkyl]-isocyanuric acids are spatially very demanding molecules, so not only the rigidity of the isocyanurate unit but also steric effects can contribute to the increased stability of the cured network. The invention therefore relates to the use of at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid as a radically curable compound in a reactive resin composition for the chemical fixing of anchoring means in boreholes or for structural bonding according to claim 1. A further subject matter of the invention according to claim 9 is the use of at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid as a radically curable compound in a multi-component reactive resin system for the chemical fastening of anchoring means in boreholes or for structural bonding, wherein the multi-component reactive resin system comprises a reactive resin composition as component (A) containing the at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid, and a curing agent component (B). The subclaims relate to preferred embodiments of these inventive objects. Surprisingly, it has been found that by applying this invention it is possible to provide reactive resin mortars with high performance at temperatures from +80°C, while at the same time maintaining the reactivity of the reactive resin system used at room temperature. In particular, it was surprisingly found that the bond failure stress of the cured reactive resin systems according to the invention could be improved at temperatures above +80°C compared to comparable reactive resin systems from the prior art which did not contain tris-[(methacryloyloxy)-alkyl]-isocyanuric acids. Detailed description of the invention For the purposes of the invention, the terms used mean: - "Alkyl" means a saturated hydrocarbon radical which may be branched or unbranched; preferably a Ci-C?-alkyl, particularly preferably a Ci-C4-alkyl, i.e. an alkyl selected from the group consisting of methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, and tert-butyl; methyl, ethyl, and tert-butyl are particularly preferred, and methyl is most preferably used; - “Accelerator” means a reagent which reacts with the initiator so that larger amounts of radicals are produced by the initiator even at low temperatures, or which catalyzes the decomposition reaction of the initiator; - "a", "an", "another" as an article before a chemical compound class, e.g., before the word "tris-[(methacryloyloxy)alkyl]isocyanuric acid", means one or more compounds falling within this chemical compound class, e.g., various tris-[(methacryloyloxy)alkyl]isocyanuric acids. In a preferred embodiment, this article refers to only a single compound; - "contain," "comprise," and "include" indicate that, in addition to the components mentioned, further components may be present. These terms are meant inclusively and therefore also include "consist of." "Consist of" is meant conclusively and means that no further components may be present. In a preferred embodiment, the terms "contain," "comprise," and "include" mean the term "consist of," - “approximately” or “circa” or “ca.” before a numerical value means a range of ± 5% of that value, preferably ± 2% of that value, more preferably ± 1% of that value, particularly preferably ± 0% of that value (i.e. exactly that value); - ‘epoxy(meth)acrylate’ means an epoxy resin containing acrylate or methacrylate groups and being essentially free of epoxy groups; - ‘curing agent component’ means a composition containing an initiator for the polymerisation of a radically curable compound; the curing agent component may be solid or liquid and may contain, in addition to the initiator, a solvent, fillers and / or additives; typically, the curing agent component is, in addition to the reactive resin component, the other of the two components of a two-component reactive resin chemical fixing system; - ‘hydroxyalkyl’ means an alkyl bearing at least one hydroxyl group as a substituent; - ‘inhibitor’ means a substance which suppresses undesirable radical polymerisation during the synthesis or storage of a resin or resin-containing composition (this substance is also referred to as a ‘stabiliser’ in technical circles) or which delays radical polymerisation of a resin after the addition of an initiator (usually in conjunction with an accelerator) (this substance is also referred to as an ‘inhibitor’ in technical circles; the respective meaning of the term can be determined from the context); - ‘initiator’ means a substance which (usually in combination with an accelerator) forms reaction-initiating radicals; - ‘cold-curing’ means that a reactive resin composition or system can fully cure at room temperature; - ‘multi-component system’ or ‘multi-component reactive resin system’ means a reactive resin system comprising several components stored separately from one another, including a reactive resin component (A) and a hardener component (B), so that the reactive resin contained in the reactive resin component only hardens after all components have been mixed; - "(Meth)acrylic... / ...(meth)acrylic..." means both the "methacrylic... / ...methacrylic..." and the "acrylic... / ...acrylic..." compounds; in the present invention, "methacrylic... / ...methacrylic..." compounds are preferably meant; - "at least one," "at least one," "at least one," numerically "one or more." In a preferred embodiment, this term means numerically "one," "an," "another"; - “-propylene-” means a group which can be either the 1,2-propylene or the 1,3-propylene group, with the 1,2-propylene group being preferred; - ‘reactive resin’ or ‘base resin’ means at least one usually solid or highly viscous radically curable compound which cures by polymerisation; - 'reactive resin component' means a liquid or viscous mixture of reactive resin, one or more reactive diluents, one or more inhibitors, optionally one or more accelerators, fillers, in particular inorganic fillers, and optionally further constituents, e.g. (usually organic) additives; typically, the reactive resin component is one of the two components of a two-component reactive resin system for chemical fixing; - “Reactive resin composition” at least one radically curable compound as reactive resin, optionally one or more reactive diluents, optionally one or more inhibitors, optionally one or more accelerators, optionally fillers and optionally further components, e.g. (mostly organic) additives; - "Reactive thinners" are liquid or low-viscosity monomers and reactive resins which dilute other reactive resins and thereby impart the viscosity necessary for their application, contain functional groups capable of reacting with the reactive resin and, upon polymerization (curing), become predominantly a component of the cured mass (e.g., mortar); reactive thinners are also called copolymerizable monomers; - “Two-component system” or “two-component reactive resin system” means a reactive resin system comprising two components stored separately from one another, a reactive resin component (A) and a hardener component (B), so that the reactive resin contained in the reactive resin component only hardens after the two components have been mixed. All standards mentioned in this text (e.g. DIN standards) were used in the current edition on the filing date of this application. Reactive resin compositions Reactive resin compositions comprise a reactive resin which, as defined above, comprises at least one usually solid or highly viscous radically curable compound which cures by polymerization. In the at least one radically curable According to the invention, the compound is tris-[(methacryloyloxy)-alkyl]-isocyanuric acid. The reactive resin can be composed as follows: a) mixture of various tris-[(methacryloyloxy)-alkyl]-isocyanuric acids; b) a single tris-[(methacryloyloxy)-alkyl]-isocyanuric acid; c) mixture of various tris-[(methacryloyloxy)-alkyl]-isocyanuric acids with other radically curable compounds; or d) mixture of a single tris-[(methacryloyloxy)-alkyl]-isocyanuric acid with other radically curable compounds. A first object of the invention is the use of at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid as a radically curable compound in a reactive resin composition for the chemical fixing of anchoring means in boreholes or for structural bonding. Tris-[(methacryloyloxy)-alkyl]-isocyanuric acids are preferably compounds in which the three alkyl groups are each independently a saturated branched or unbranched hydrocarbon radical. More preferably, the three alkyl groups are each independently a C1-C4 alkyl radical, particularly preferably a C1-C4 alkyl radical, i.e., an alkyl radical selected from the group consisting of methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, and tert-butyl. According to point a), various tris-[(methacryloyloxy)-alkyl]-isocyanuric acids can be used as a mixture as radically curable compounds, which are selected from the group of the tris-[(methacryloyloxy)-alkyl]-isocyanuric acids described above. Particularly preferred according to point b) is a single tris-[(methacryloyloxy)-alkyl]-isocyanuric acid as the radically curable compound, which is selected from the group of tris-[(methacryloyloxy)-alkyl]-isocyanuric acids described above. The use of tris-[2-(methacryloyloxy)-ethyl]-isocyanuric acid as the radically curable compound in a reactive resin composition for the chemical fixing of anchoring agents in drilled holes or for structural bonding is particularly preferred. One embodiment of the invention relates according to point c) to the use of at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid as a radically curable compound in a reactive resin composition, wherein the reactive resin composition comprises at least one further radically curable compound. In this embodiment, the percentage (in wt. % based on the sum of all radically curable compounds) of the at least one tris-[(methacryloyloxy)alkyl]isocyanuric acid is advantageously more than about 20 wt. % and less than 100 wt. %, preferably more than about 40 wt. % and less than 100 wt. %, and particularly preferably more than about 60 wt. % and less than 100 wt. %. The term "sum of all radically curable compounds" means either a mixture of different tris-[(methacryloyloxy)alkyl]isocyanuric acids together with at least one further radically curable compound or a single tris-[(methacryloyloxy)alkyl]isocyanuric acid together with at least one further radically curable compound. In a particularly preferred embodiment of this embodiment, according to point d), a single tris-[(methacryloyloxy)-alkyl]-isocyanuric acid is used as a radically curable compound selected from the group of the tris-[(methacryloyloxy)-alkyl]-isocyanuric acids described above, and very particularly preferably tris-[2-(methacryloyloxy)-ethyl]-isocyanuric acid, in a reactive resin composition, wherein the reactive resin composition comprises at least one further radically curable compound. In this embodiment, the percentage (in wt.% based on the sum of all radically curable compounds) of the only tris-[(methacryloyloxy)-alkyl]-isocyanuric acid, and very particularly preferably of tris-[2-(methacryloyloxy)-ethyl]-isocyanuric acid, is advantageously more than about 20 wt.% and less than 100 wt.%, preferably more than about 40 wt.% and less than 100 wt.%, and particularly preferably more than about 60 wt.% and less than 100 wt.%. According to the invention, ethylenically unsaturated compounds, compounds with carbon-carbon triple bonds and thiol-yn / ene resins, as known to the person skilled in the art, are suitable as further radically curable compounds in addition to the at least one tris-[(methacryloyloxy)alkyl]isocyanuric acid in the reactive resin composition. Of these compounds, the group of ethylenically unsaturated compounds is preferred, which includes styrene and derivatives thereof, (meth)acrylates, vinyl esters, unsaturated polyesters, vinyl ethers, allyl ethers, itaconates, dicyclopentadiene compounds, and unsaturated fats. Of these, unsaturated polyester resins and vinyl ester resins are particularly suitable and are described, for example, in applications EP 1 935 860 A1, DE 195 31 649 A1, and WO 10 / 108939 A1. Vinyl ester resins are most preferred due to their hydrolytic resistance and excellent mechanical properties. Particularly preferred vinyl ester resins are epoxy (meth)acrylates, the dimethacrylates of ethoxylated bisphenols, and urethane (meth)acrylates. Very particular preference is given to vinyl ester urethane resins, especially urethane methacrylates. Preferred resins include the urethane methacrylate resins described in DE 10 2011 017 626 B4.In this regard, DE 10 2011 017 626 B4, and in particular its description of the composition of these resins, in particular in the examples of DE 10 2011 017 626 B4, is incorporated herein by reference. Examples of suitable unsaturated polyesters that can be used in the reactive resin composition of the invention are divided into the following categories, as classified by M. Malik et al. in JMS - Rev. Macromol. Chem. Phys., C40(2 and 3), pp. 139-165 (2000): (1) Ortho resins: these are based on phthalic anhydride, maleic anhydride or fumaric acid and glycols such as 1,2-propylene glycol, ethylene glycol, diethylene glycol, triethylene glycol, 1,3-propylene glycol, dipropylene glycol, tripropylene glycol, neopentyl glycol or hydrogenated bisphenol A; (2) Iso resins: these are made from isophthalic acid, maleic anhydride, or fumaric acid, and glycols. These resins may contain higher proportions of reactive diluents than ortho resins; (3) Bisphenol A fumarates: these are based on ethoxylated bisphenol A and fumaric acid; (4) HET acid resins (hexachloro-endo-methylene-tetrahydrophthalic acid resins): these are resins obtained from chlorine / bromine-containing anhydrides or phenols in the production of unsaturated polyester resins. In addition to these resin classes, the so-called dicyclopentadiene resins (DCPD resins) can also be distinguished as unsaturated polyester resins. The class of DCPD resins are obtained either by modification of one of the above-mentioned resin types by Diels-Alder reaction with cyclopentadiene, or alternatively they are obtained by a first reaction of a diacid, e.g. maleic acid, with dicyclopentadiene, followed by a second reaction, the usual preparation of an unsaturated polyester resin, the latter being referred to as a DCPD maleate resin. The unsaturated polyester resin preferably has a molecular weight M n in the range of 500 to 10,000 Daltons, more preferably in the range of 500 to 5,000 Daltons, and even more preferably in the range of 750 to 4,000 Daltons (according to ISO 13885-1). The unsaturated polyester resin has an acid value in the range of 0 to 80 mg KOH / g resin, preferably in the range of 5 to 70 mg KOH / g resin (according to ISO 2114-2000). If a DCPD resin is used as the unsaturated polyester resin, the acid value is preferably 0 to 50 mg KOH / g resin. For the purposes of the invention, vinyl ester resins are oligomers or polymers with at least one (meth)acrylate end group, so-called (meth)acrylate-functionalized resins, which also include urethane (meth)acrylate resins and epoxy (meth)acrylates. Vinyl ester resins that have unsaturated groups only in the terminal position are obtained, for example, by reacting epoxy oligomers or polymers (e.g., bisphenol A digylcidyl ether, phenol novolak-type epoxides, or tetrabromobisphenol A-based epoxy oligomers) with, for example, (meth)acrylic acid or (meth)acrylamide. Preferred vinyl ester resins are (meth)acrylate-functionalized resins and resins obtained by reacting an epoxy oligomer or polymer with methacrylic acid or methacrylamide, preferably with methacrylic acid. Examples of such compounds are known from US 3297745 A, US 3772404 A, US 4618658 A, GB 2217722 A1, DE 3744390 A1, and DE 4131457 A1. In this context, reference is made to application US 2011 / 0071234 A1. The vinyl ester resin preferably has a molecular weight M nin the range of 500 to 3,000 Daltons, more preferably 500 to 1,500 Daltons (according to ISO 13885-1). The vinyl ester resin has an acid value in the range of 0 to 50 mg KOH / g resin, preferably in the range of 0 to 30 mg KOH / g resin (according to ISO 2114-2000). Particularly suitable as vinyl ester resins are ethoxylated bisphenol A di(meth)acrylate with a degree of ethoxylation of 2 to 10, preferably 2 to 4, difunctional, trifunctional or higher-functional urethane (meth)acrylate oligomers or mixtures of these curable components. Examples of such epoxy(meth)acrylates are those of formula (I) (I), where n is a number greater than or equal to 1 (if mixtures of different molecules with different n values ​​are present and are represented by the formula (I), non-integer numbers are also possible as the mean value). Further examples of the propoxylated or especially ethoxylated aromatic diols, such as bisphenol A, bisphenol F or novolak (especially di-)(meth)acrylates are those of the formula (II) wherein a and b each independently represent a number greater than or equal to 0, with the proviso that preferably at least one of the values ​​is greater than 0, preferably both are 1 or greater (if mixtures of different molecules with different (a and b) values ​​are present and are represented by the formula (II), non-integer numbers are also possible as the mean value). Particularly suitable are the known reaction products of di- or polyisocyanates and hydroxyalkyl methyl acrylates, as described, for example, in DE 2 312 559 A1, adducts of (di)isocyanates and 2,2-propane-bis-[3-(4-phenoxy)-1,2-hydroxypropane-1-methacrylate] according to LIS-PS 3 629 187 as well as the adducts of isocyanates and methacryloyl alkyl ethers, alkoxybenzenes or alkoxycycloalkanes, as described in EP 0 044 352 A1. In this context, reference is made to the DE 2312559 A1, DE 19902685 A1, EP 0 684 906 A1, DE 4111828 A1, and DE 19961342 A1 are also referred to. Of course, mixtures of suitable monomers can also be used. All these resins which can be used according to the invention can be modified according to methods known to those skilled in the art, for example to achieve lower acid numbers, hydroxide numbers or anhydride numbers, or to make them more flexible by incorporating flexible units into the backbone, and the like. In addition, the resin may contain other reactive groups that can be polymerized with a radical initiator, such as peroxides, for example reactive groups derived from itaconic acid, citraconic acid and allylic groups and the like, as described, for example, in WO 2010 / 108939 A1 (itaconic acid esters). The percentage (in wt.% based on the sum of all radically curable compounds) of the at least one further radically curable compound is advantageously less than about 80 wt.%, preferably less than about 60 wt.%, and particularly preferably less than about 40 wt.%. In a particularly preferred embodiment, the at least one further radically curable compound is a methacrylate-functionalized compound. This is due to the higher alkali stability of methacrylate-functionalized compounds compared to acrylate-functionalized compounds. Preferred further radically curable compounds are the further radically curable compounds used in the examples, preferably in approximately the amounts stated in the examples. In an alternative embodiment, the reactive resin composition contains no further radically curable compound, i.e., only the at least one tris-[(methacryloyloxy)alkyl]isocyanuric acid is used as the radically curable compound in the reactive resin composition. In a preferred alternative embodiment, only a single tris-[(methacryloyloxy)alkyl]isocyanuric acid, in particular tris-[2-(methacryloyloxy)ethyl]isocyanuric acid, is used as the radically curable compound in the reactive resin composition. A further preferred embodiment of the invention relates to the use of at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid as a radically curable compound in a reactive resin composition, wherein the reactive resin composition additionally comprises at least one reactive diluent and / or additionally at least one inhibitor and / or additionally at least one accelerator. Particularly preferred is the use of a single tris-[(methacryloyloxy)-alkyl]-isocyanuric acid, in particular tris-[2-(methacryloyloxy)-ethyl]-isocyanuric acid, as a radically curable compound in a reactive resin composition, wherein the reactive resin composition additionally comprises at least one reactive diluent and / or additionally at least one inhibitor and / or additionally at least one accelerator. The percentage (in wt. % of the reactive resin composition, which in addition to the radically curable compounds additionally comprises at least one reactive diluent and / or an inhibitor and / or an accelerator) of the at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid is advantageously more than about 10 wt. % and less than 100 wt. %, preferably from about 20 wt. % to about 50 wt. %, and particularly preferably from about 30 wt. % to about 45 wt. %. In a preferred embodiment, the reactive resin composition comprises, in addition to the radically curable compounds, at least one reactive diluent, at least one inhibitor, optionally one or more accelerators, and (usually organic) additives such as adhesion promoters. Suitable accelerators are described below in connection with the curing system. Reactive thinner In a preferred embodiment of the invention, the reactive resin composition contains, in addition to the radically curable compounds, one or more reactive diluents in order to adjust the viscosity of the radically curable compounds, if necessary. Suitable reactive diluents are described in applications EP 1 935 860 A1 and DE 195 31 649 A1. The reactive resin composition preferably contains a (meth)acrylic acid ester as the reactive diluent, with particular preference being given to aliphatic or aromatic C5-C15 (meth)acrylates. Suitable examples include: 2- and 3-hydroxypropyl (meth)acrylate (HP(M)A), 1,2-ethanediol di(meth)acrylate, 1,3-propanediol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, Trimethylolpropane tri(meth)acrylate, phenethyl(meth)acrylate, tetrahydrofurfuryl(meth)acrylate, / V, / V-dimethylaminoethyl(meth)acrylate, / V, / V-dimethylaminomethyl(meth)acrylate, Acetoacetoxyethyl (meth)acrylate, isobornyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, Methoxypolyethylene glycol mono(meth)acrylate, trimethylcyclohexyl(meth)acrylate, 2-Hydroxyethyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate and / or T ricyclopentadienyldi(meth)acrylat, Bisphenol-A-(meth)acrylat, Novolakepoxidi(meth)acrylat, Tricyclo[5.2.1.0]decandimethanoldi(meth)acrylat Di-[(meth)acryloyl-maleoyl]-tricyclo- 5.2.1.0. 26 -decan, Dicyclopentenyloxyethylcrotonat, 3-(Meth)acryloyl-oxymethyl-tricylo- 5.2.1.0. 26 -decan, 3-(Meth)cyclopentadienyl(meth)acrylat, und Decalyl-2-(meth)acrylat; Solketal(meth)acrylat, Cyclohexyl(meth)acrylat, Phenoxyethyldi(meth)acrylat, Methoxyethyl(meth)acrylat, tert-Butyl(meth)acrylat und Norbornyl(meth)acrylat. Methacrylate sind gegenüber Acrylaten bevorzugt. Besonders bevorzugt sind 2- und 3- Hydroxypropylmethacrylat (HPMA), 1,2-Ethandioldimethacrylat (EGDMA), 1,4-Butanediol dimethacrylate (BDDMA), 1,3-butanediol dimethacrylate, trimethylolpropane trimethacrylate (TMPTMA), acetoacetoxyethyl methacrylate, isobornyl methacrylate (IBoMA), tricyclo[5.2.1.0]decanedimethanol dimethacrylate (TCDDMA), bisphenol A methacrylate, trimethylcyclohexyl methacrylate, 2-hydroxyethyl methacrylate, PEG200 dimethacrylate, and norbornyl methacrylate. Very particular preference is given to 1,4-butanediol dimethacrylate and a mixture of 2- and 3-hydroxypropyl methacrylate (HPMA), or a mixture of these three methacrylates. Most preferred is a mixture of 2- and 3-hydroxypropyl methacrylate (HPMA). In principle, other common radically polymerizable compounds, alone or in admixture with the (meth)acrylic acid esters, can also be used as reactive diluents, e.g. styrene, a-methylstyrene, alkylated styrenes such as tert-butylstyrene, divinylbenzene and vinyl and allyl compounds, with preference given to the non-labeled representatives thereof.Examples of such vinyl or allyl compounds are hydroxybutyl vinyl ether, ethylene glycol divinyl ether,. 1.4-Butanediol divinyl ether, trimethylolpropane divinyl ether, trimethylolpropane trivinyl ether, mono-, di-, tri-, tetra- and polyalkylene glycol vinyl ether, mono-, di-, tri-, tetra- and polyalkylene glycol allyl ether, divinyl adipic ester, trimethylolpropane diallyl ether and trimethylolpropane triallyl ether. In the reactive resin composition, which in addition to the radically curable compounds additionally comprises at least one reactive diluent and optionally an inhibitor and / or an accelerator, the at least one reactive diluent is preferably present in an amount of up to about 60 wt.%, particularly preferably from about 10 wt.% to about 55 wt.%, more preferably from about 20 wt.% to about 50 wt.%, even more preferably from about 30 wt.% to about 45 wt.%, based on the reactive resin composition, which in addition to the radically curable compounds additionally comprises at least one reactive diluent and optionally an inhibitor and / or an accelerator. Preferred reactive diluents are the reactive diluents used in the examples, preferably in approximately the amounts stated in the examples. Inhibitors One or more inhibitors may be present in the reactive resin composition both to stabilize the radically curable compounds or the compositions containing the radically curable compounds and to adjust the resin reactivity. Suitable inhibitors for this purpose are the inhibitors commonly used for radically polymerizable compounds, as known to the person skilled in the art. These inhibitors are preferably selected from phenolic inhibitors and non-phenolic inhibitors, especially phenothiazines. Phenols such as 2-methoxyphenol, 4-methoxyphenol, 2,6-di-tert-butyl-4-methylphenol, 2,4-di-tert-butylphenol, 2,6-di-tert-butylphenol, 2,4,6-trimethylphenol, 2.4.6-Tris(dimethylaminomethyl)phenol, 4,4'-thio-bis(3-methyl-6-tert-butylphenol), 4,4'-isopropylidenediphenol, 6,6'-di-tert-buty 1-4, 4'-bi s(2, 6-d i-tert-buty I phenol), 1,3,5-trimethyl- 2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene, 2,2'-methylene-di-p-cresol, catechols such as catechol, and catechol derivatives such as butylcatechols such as 4-tert-butylcatechol and 4,6-di-tert-butylcatechol, hydroquinones such as hydroquinone, 2-methylhydroquinone, 2-tert-butylhydroquinone, 2,5-di-tert-butylhydroquinone, 2,6-di-tert-butylhydroquinone, 2,6-Dimethylhydroquinone, 2,3,5-Trimethylhydroquinone, Benzoquinone, 2,3,5,6-Tetrachloro-1,4-benzoquinone, Methylbenzoquinone, 2,6-Dimethylbenzoquinone, Naphthoquinone, or mixtures of two or more thereof are suitable. These inhibitors are often components of commercially available radical-curing reactive resin components. Suitable non-phenolic inhibitors are preferably phenothiazines, such as phenothiazine and / or derivatives or combinations thereof, or stable organic radicals, such as galvinoxyl and / V-oxyl radicals, in particular of the piperidinyl-ZV-oxyl or tetrahydropyrrole- / V-oxyl type, such as aluminum-ZV-nitrosophenylhydroxylamine, Diethylhydroxylamine, oximes such as acetaldoxime, acetone oxime, methyl ethyl ketoxime, salicyloxime, benzoxime, glyoxime, dimethylglyoxime, acetone-O-(benzyloxycarbonyl)oxime, TEMPOL, TEMPO and the like. Furthermore, pyrimidinol or pyridinol compounds substituted in the para position to the hydroxyl group, as described in the patent DE 10 2011 077 248 B1, can be used as inhibitors. Stable / V-oxyl radicals that can be used include those described in DE 199 56 509 A1 and DE 195 31 649 A1. Such stable nitroxyl radicals are of the piperidinyl-ZV-oxyl or tetrahydropyrrole- / V-oxyl type, or a mixture thereof. Preferred stable nitroxyl radicals are selected from the group consisting of 1-oxyl-2,2,6,6-tetramethylpiperidine, 1-oxyl-2,2,6,6-tetramethylpiperidin-4-ol (also referred to as TEMPOL), 1-oxyl-2,2,6,6-tetramethylpiperidin-4-one (also referred to as TEMPON), 1-oxyl-2,2,6,6-tetramethyl-4-carboxyl-piperidine (also referred to as 4-carboxy-TEMPO), 1-oxyl-2,2,5,5-tetramethylpyrrolidine, 1-oxyl-2,2,5,5-tetramethyl-3-carboxylpyrrolidine (also referred to as 3-carboxy-PROXYL) and mixtures of two or more of these compounds, wherein 1-Oxyl-2,2,6,6-tetramethylpiperidin-4-ol (TEMPOL) is particularly preferred. Preferably, the inhibitor(s) are selected from the group consisting of / V-oxyl radicals, catechols, catechol derivatives, phenothiazines, and a mixture of two or more thereof. Particularly preferably, the inhibitor(s) are selected from the group consisting of TEMPOL, catechols, and phenothiazines. The inhibitors used in the examples are very particularly preferred, preferably in approximately the amounts indicated in the examples. Depending on the desired properties of the reactive resin, the inhibitors can be used either alone or in combination with two or more of them. A combination of phenolic and non-phenolic inhibitors is preferred. The inhibitor or the inhibitor mixture is added in amounts customary in the art, preferably in an amount of about 0.0005 wt.% to about 2 wt.% (based on the sum of all radically curable compounds), more preferably from about 0.01 wt.% to about 1 wt.% (based on the sum of all radically curable compounds), even more preferably from about 0.05 wt.% to about 1 wt.% (based on the sum of all radically curable compounds). Additional additives In one embodiment, the reactive resin composition may additionally contain additives. In a preferred embodiment, the reactive resin composition additionally contains an adhesion promoter. The use of an adhesion promoter improves the cross-linking of the borehole wall with the dowel compound, thus increasing adhesion in the cured state. This is important for the use of a two-component dowel compound, for example, in boreholes drilled with a diamond drill, and increases the bond stress at failure. Suitable adhesion promoters are selected from the group of silanes, which are functionalized with other reactive organic groups and can be incorporated into the polymer network. This group includes, for example, 3-(meth)acryloxypropyltrimethoxysilane, 3-(meth)acryloxypropyltriethoxysilane, 3-(Meth)acryloxymethyltrimethoxysilane, 3-(Meth)acryloxymethyltriethoxysilane, Vinyltrimethoxysilane, vinyltriethoxysilane, functionalized tetraethoxysilane, functionalized tetramethoxysilane, functionalized tetrapropoxysilane, functionalized ethyl or propyl polysilicate, and mixtures of two or more thereof. In this regard, reference is made to application DE 10 2009 059210 A1, the relevant content of which is hereby incorporated into this application. The adhesion promoter is advantageously present in amounts of about 0.5 wt.% to about 10 wt.% based on the total weight of the reactive resin composition, which, in addition to the radically curable compounds, additionally comprises an adhesion promoter and at least one reactive diluent and / or an inhibitor and / or an accelerator. A further preferred embodiment of the present invention is the use of at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid as a radically curable compound in a reactive resin composition, wherein the reactive resin composition additionally comprises fillers and / or additives. Particularly preferred is the use of a single tris-[(methacryloyloxy)-alkyl]-isocyanuric acid, in particular tris-[2-(methacryloyloxy)-ethyl]-isocyanuric acid, as radically curable compound in a reactive resin composition, wherein the reactive resin composition additionally comprises fillers and / or additives. The reactive resin composition can therefore be a reactive resin component as defined above. It should be noted that some substances can be used both as fillers and, possibly in modified form, as additives. For example, fumed silica in its polar, untreated form serves more as a filler, while its apolar, post-treated form serves more as an additive. In cases where the exact same substance can be used as a filler or additive, its total amount should advantageously not exceed the upper limit for fillers specified herein. To produce a reactive resin component for structural applications, particularly for chemical fastening, conventional fillers can be added to the reactive resin compositions described above. These fillers are typically inorganic fillers, such as those described below. The proportion of all radically curable compounds in the reactive resin component is preferably from about 10 wt.% to about 70 wt.%, more preferably from about 20 wt.% to about 60 wt.%, even more preferably from about 25 wt.% to about 50 wt.%, based on the reactive resin component. Accordingly, the proportion of total fillers and inorganic additives is preferably from about 30 wt% to about 90 wt%, more preferably from about 40 wt% to about 80 wt%, even more preferably from about 50 wt% to about 75 wt%, based on the reactive resin component. Fillers Common fillers are used, preferably mineral or mineral-like fillers, such as quartz, glass, sand, quartz sand, quartz flour, porcelain, corundum, ceramics, talc, silica (e.g. fumed silica, especially polar, untreated fumed silica), silicates, aluminum oxides (e.g. alumina), clay, titanium dioxide, chalk, barite, feldspar, basalt, aluminum hydroxide, granite or sandstone, polymeric fillers such as thermosets, hydraulically hardenable fillers such as gypsum, quicklime or cement (e.g. aluminate cement (often also called alumina cement) or Portland cement), metals such as Aluminum, carbon black, furthermore wood, mineral or organic fibers, or the like, or mixtures of two or more thereof are used. The fillers can be in any desired form, for example as powder or flour, or as shaped bodies, e.g. in cylindrical, ring, spherical, platelet, rod, saddle or crystalline form, or furthermore in fiber form (fibrillar fillers), and the corresponding base particles preferably have a maximum diameter of about 10 mm and a minimum diameter of about 1 nm. That is, the diameter is about 10 mm or any value less than about 10 mm but more than about 1 nm. Preferably, the maximum diameter is a diameter of about 5 mm, more preferably about 3 mm, even more preferably about 0.7 mm. Very particularly preferred is a maximum diameter of about 0.5 mm. The more preferred minimum diameter is about 10 nm, even more preferably about 50 nm, very particularly preferably about 100 nm.Diameter ranges resulting from a combination of these maximum and minimum diameters are particularly preferred. However, globular, inert materials (spherical shape) are preferred and have a significantly stronger reinforcing effect. Core-shell particles, preferably in spherical shape, can also be used as fillers. Preferred fillers are selected from the group consisting of cement, silica, quartz, quartz sand, quartz flour, and mixtures of two or more thereof. For the reactive resin component, fillers selected from the group consisting of cement, fumed silica, in particular untreated, polar fumed silica, quartz sand, quartz flour, and mixtures of two or more thereof are particularly preferred. A mixture of cement (in particular aluminate cement (often also referred to as high-alumina cement) or Portland cement), fumed silica, and quartz sand is very particularly preferred for the reactive resin component. For the hardener component, fumed silica is preferred as the sole filler or as one of several fillers; particularly preferably, one or more further fillers are present in addition to the fumed silica. Other additives Further conceivable additives are rheology additives, such as pyrogenic silica, optionally treated organically or inorganically (if it is not already used as a filler), in particular apolar post-treated pyrogenic silica, bentonites, alkyl and methyl celluloses, castor oil derivatives or the like, plasticizers, such as phthalic acid or sebacic acid esters, stabilizers, antistatic agents, thickeners, flexibilizers, curing catalysts, rheology aids, wetting agents, coloring additives, such as dyes or in particular pigments, for example for different coloring of the components for better control of their mixing, or the like, or mixtures of two or more thereof, are possible. Furthermore, agents for regulating the pH, such as inorganic and / or organic acids according to DE 10 2010 008971 A1, in particular copolymers with acidic groups, e.g. esters of phosphoric acid, can be used. Non-reactive diluents (solvents) can also be present, preferably in an amount of up to 30% by weight, based on the respective component (reactive resin mortar, hardener), for example from 1% by weight to 20% by weight, such as lower alkyl ketones, e.g. acetone, di-lower alkyl-lower alkanoylamides, such as dimethylacetamide, lower alkylbenzenes, such as xylenes or toluene, phthalic acid esters or paraffins, or water, or glycols.In addition, agents for improving the compatibility between resin and hardener components, such as ionic, non-ionic or amphoteric surfactants; soaps, wetting agents, detergents; polyalkylene glycol ethers; salts of fatty acids, mono- or diglycerides of fatty acids, sugar glycerides, lecithin; alkanesulfonates, alkylbenzenesulfonates, fatty alcohol sulfates, fatty alcohol polyglycol ethers, fatty alcohol ether sulfates, sulfonated. fatty acid methyl ester; fatty alcohol carboxylates; alkyl polyglycosides, sorbitan esters, N-methylglucamides, sucrose esters; alkylphenols, alkylphenol polyglycol ethers, alkylphenol carboxylates; quaternary ammonium compounds, esterquats, carboxylates of quaternary ammonium compounds. Furthermore, metal scavengers in the form of surface-modified fumed silicas can be included in the reactive resin component. Preferably, at least one thixotropic agent is present as an additive, particularly preferably an organically or inorganically post-treated fumed silica, very particularly preferably an apolar post-treated fumed silica, e.g., fumed silica post-treated with polydimethylsiloxane (PDMS), particularly preferably the apolar post-treated fumed silica used in the examples. In this respect, reference is made to applications WO 02 / 079341 A1 and WO 02 / 079293 A1 as well as WO 2011 / 128061 A1. In one embodiment, an adhesion promoter can also be added to the reactive resin component. Suitable adhesion promoters have already been described above. The adhesion promoter is advantageously contained in amounts of about 1 wt.% to about 10 wt.% based on the total weight of the reactive resin component. Hardener system A curing agent is used to cure the radically curable compound(s). Preferably, a hardener system is used which comprises the hardener and an accelerator. The accelerator can also be added to the reactive resin composition. The curing of the radically curable compound(s) can be initiated with a peroxide as initiator. Accordingly, in one embodiment, the curing system comprises - as initiator a peroxide and - at least one accelerator commonly used for curing with peroxides. All peroxides known to those skilled in the art that are used to cure epoxy (meth)acrylate resins can be used. Such peroxides include organic and inorganic peroxides, either liquid or solid, and hydrogen peroxide can also be used. Examples of suitable peroxides are peroxycarbonates (of the formula -OC(O)OO-), peroxyesters (of the formula -C(O)OO-), diacyl peroxides (of the formula -C(O)OOC(O)-), dialkyl peroxides (of the formula -OO-), hydroperoxides (of the formula -OOH), and the like. These can be present as oligomers or polymers. A comprehensive range of examples of suitable peroxides is described, for example, in the application US 2002 / 0091214 A1, paragraph

[0018] , described. The peroxides are preferably selected from the group of organic peroxides. Suitable organic peroxides are: tertiary alkyl hydroperoxides, such as tert-butyl hydroperoxide, and other hydroperoxides, such as cumene hydroperoxide, peroxyesters or peracids, such as tert-butyl peresters (e.g., tert-butyl peroxybenzoate), benzoyl peroxide, peracetates and perbenzoates, lauroyl peroxide, including (di)peroxyesters, perethers, such as peroxydiethyl ether, perketones, such as methyl ethyl ketone peroxide. The organic peroxides used as curing agents are often tertiary peresters or tertiary hydroperoxides, i.e., peroxide compounds with tertiary carbon atoms directly bonded to an -OO-acyl or -OOH group. However, mixtures of these peroxides with other peroxides can also be used according to the invention. The peroxides can also be mixed peroxides, i.e., peroxides that have two different peroxide-bearing units in one molecule. In a preferred In this embodiment, benzoyl peroxide (BPO) or tert-butyl peroxybenzoate is used for curing. The peroxide can be used in its pure form or as a component of a mixture. Typically, it is used as a component of a mixture, especially as a component of a hardener component (B) of a reactive resin system, as described in more detail below. The hardener component used in the examples, or a hardener component with the same components, is particularly preferred. The use of organically substituted ammonium persulfates (e.g. N'N'N'N'-tetrabutylammonium or N'N'N'-tricapryl-N'-methylammonium persulfate) is also possible. In addition to the peroxide, the hardener system may also contain a phlegmatizing agent to stabilize the peroxide. Such phlegmatizing agents are known from DE 32 26602 A1, EP 0432 087 A1, and EP 1 371 671 A1. Such a hardener system preferably contains water as a phlegmatizing agent. In addition to water, the hardener system may also contain other phlegmatizing agents, with water being preferred as the sole phlegmatizing agent to avoid introducing compounds that have a plasticizing effect. The peroxide is preferably present in a suspension with water. Suitable suspensions are commercially available in various concentrations, such as the aqueous dibenzoyl peroxide suspensions BP-40-SAQ (United Initiators), Perkadox® 40L-W (Nouryon), Luperox® EZ-FLO (Arkema), or Peroxan BP-40 W (Pergan). In alternative embodiments, the peroxide is combined with a phlegmatizing agent as a powder or paste. Corresponding compositions are commercially available in various concentrations, such as Perkadox® 20S (Akzo Nobel) or Benox B-50 (United Initiators). The peroxide may be present in the hardener system in an amount of 0.1 wt% to 35 wt%, preferably 0.25 wt% to 35 wt%, more preferably 1 wt% to 30 wt%, particularly preferably 5 wt% to 28 wt%, based on the hardener composition. In the described hardener system, an accelerator is used in addition to the peroxide. This accelerates the curing reaction. This accelerator must be stored separately from the peroxide to prevent its premature decomposition. The accelerator is preferably added to the reactive resin composition. Suitable accelerators are known to those skilled in the art. These are preferably amines. Suitable amines are selected from the following compounds, which are described, for example, in the application US 2011 / 0071234 A1: dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, n-propylamine, di-n-propylamine, tri-n-propylamine, isopropylamine, diisopropylamine, triisopropylamine, n-butylamine, isobutylamine, tert-butylamine, di-n-butylamine, diisobutylamine, tri-isobutylamine, pentylamine, isopentylamine, diisopentylamine, hexylamine, octylamine, dodecylamine, laurylamine, stearylamine, aminoethanol, diethanolamine, triethanolamine, aminohexanol, ethoxyaminoethane, dimethyl(2-chloroethyl)amine, 2-ethylhexylamine, bis(2-chloroethyl)amine, 2-ethylhexylamine, bis(2-ethylhexyl)amine, N-methylstearylamine, Dialkylamine, ethylenediamine, N,N'-dimethylethylenediamine, tetramethylethylenediamine, diethylenetriamine, permethyldiethylenetriamine, triethylenetetramine, tetraethylenepentamine, 1,2-diaminopropane, dipropylenetriamine, tripropylenetetramine, 1.4-Diaminobutan, 1 ,6-Diaminohexan, 4-Amino-1-diethylaminopentan, 2,5-Diamino-2,5- dimethylhexan, Trimethylhexamethylendiamin, N,N-Dimethylaminoethanol, 2-(2-Diethylaminoethoxy)ethanol, Bis(2-hydroxyethyl)oleylamin, T ris-[2-(2-hydroxy-ethoxy)- ethyl]amin, 3-Amino-1 -propanol, Methyl(3-aminopropyl)ether, Ethyl-(3-aminopropyl)ether, 1 .4-Butandiol-bis(3-aminopropyl)ether, 3-Dimethylamino-1 -propanol, 1-Amino-2-propanol, 1-Diethylamino-2-propanol, Diisopropanolamin, Methyl-bis(2-hydroxypropyl)amin, Tris(2- hydroxypropyl)amin, 4-Amino-2-butanol, 2-Amino-2-methylpropanol, 2-Amino-2-methyl- propandiol, 2-Amino-2-hydroxymethylpropandiol, 5-Diethylamino-2-pentanon, 3-Methylaminopropionsäurenitril, 6-Aminohexansäure, 11 -Aminoundecansäure, 6-Aminohexansäureethylester, 11-Aminohexansäure-isopropylester, Cyclohexylamin, N-Methylcyclohexylamin, N,N-Dimethylcyclohexylamin, Dicyclohexylamin, N-Ethylcyclohexylamin, N-(2-Hydroxyethyl)-cyclohexylamin, N,N-Bis-(2-hydroxyethyl)- cyclohexylamin, N-(3-Aminopropyl)-cyclohexylamin, Aminomethylcyclohexan, Hexahydrotoluidin, Hexahydrobenzylamin, Anilin, N-Methylanilin, N,N-Dimethylanilin, N,N-Diethylanilin, N,N-Di-propylanilin, iso-Butylanilin, Toluidine, Diphenylamin, Hydroxyethylanilin, Bis(hydroxyethyl)anilin, Chloranilin, Aminophenole, Aminobenzoesäuren und deren Ester, Benzylamin, Dibenzylamin, Tribenzylamin, Methyldibenzylamin, a-Phenylethylamin, Xylidin, Diisopropylanilin, Dodecylanilin, Aminonaphthalin, N-Methylaminonaphthalin, N,N-Dimethylaminonaphthalin, N,N-Dibenzylnaphthalin, Diaminocyclohexane, 4,4'-diamino-dicyclohexylmethane, diamino-dimethyl-dicyclohexylmethane, phenylenediamine, xylylenediamine, diaminobiphenyl, naphthalenediamines, benzidines, 2,2-bis-(aminophenyl)-propane, aminoanisoyl, amino-thiophenols, aminodiphenyl ethers, aminocresoles, morpholine, N-Methylmorpholine, N-Phenylmorpholine, Hydroxyethylmorpholine, N-Methylpyrrolidine, Pyrrolidine, Piperidine, Hydroxyethylpiperidine, Pyrroles, Pyridines, Quinolines, Indoles, Indolenines, Carbazoles, Pyrazoles, Imidazoles, Thiazoles, Pyrimidines, Quinoxalines, Aminomorpholine, Dimorpholinethane, [2,2,2]-diazabicyclooctane and N,N-dimethyl-p-toluidine. Preferred amines are symmetrically or asymmetrically substituted aniline and toluidine derivatives and N,N-bis(hydroxy)alkylarylamines, such as N,N,-dimethylaniline, N,N-diethylaniline, N,N-dimethyl-p-toluidine, N,N-bis(hydroxyalkyl)arylamines, N,N-bis(2-hydroxyethyl)anilines, N,N-bis(2-hydroxyethyl)toluidine, N,N-bis(2-hydroxypropyl)aniline, N,N-bis(2-hydroxypropyl)-p-toluidine, N,N-bis(3-methacryloyl-2-hydroxypropyl)-p-toluidine, N,N-dibutoxyhydroxypropyl-p-toluidine, N-methyl-N-hydroxyethyl-p-toluidine, N-ethyl-N-hydroxyethyl-p-toluidine as well as the analogous o- or m-toluidines and 4,4'-bis(dimethylamino)diphenylmethane and / or the leuco forms of the dyes crystal violet or malachite green. Polymeric amines such as those obtained by polycondensation of N,N-bis(hydroxyalkyl)aniline with dicarboxylic acids or by polyaddition of ethylene oxide and these amines are also suitable as accelerators. Preferred accelerators are N,N-bis(2-hydroxypropyl)toluidine, N,N-bis(2-hydroxyethyl)toluidine and para-toluidine ethoxylate (Bisomer® PTE). In this preferred embodiment, the accelerator may be present in an amount of 0.01 wt.% to 10 wt.%, preferably from 0.1 wt.% to 5 wt.%, particularly preferably from 0.1 wt.% to 3 wt.%, based on the reactive resin component, may be contained in the reactive resin system. Alternatively, a hardener system can be used for curing which is peroxide-free and contains the following components: - at least one manganese compound as accelerator and - a 1,3-dioxo compound as initiator. In this regard, reference is made to DE 10 2011 078 785 A1. Suitable 1,3-dioxo compounds are compounds of the general formula (III) in the R 1 and R 3 each independently of one another is an unbranched or branched, optionally substituted Ci-C4 alkyl group or a Ci-C4 alkoxy group, R 2an unbranched or branched, optionally substituted Ci-C4 alkyl group or a Ci-C4 alkoxy group, or together with R 1 or R 3 forms an optionally substituted five- or six-membered aliphatic ring which optionally comprises heteroatoms in or on the ring. In this hardener system, it is essential that in the compound of formula (III) the carbon atom connecting the two carbonyl groups has exactly one hydrogen atom bonded to this carbon atom. From the group of compounds of general formula (III) a compound of formula (IV) is preferred (iv). in which independently X = CH2, O, n = 1 , 2 and R 3 is an unbranched or branched, optionally substituted C1-C4 alkyl group or a C1-C4 alkoxy group. X is more preferably 0. n is more preferably 1. R 3is more preferably a Ci-C4 alkyl group. Particularly preferred from the group of compounds of formula (III) are 2-methyl-2,4-pentanedione, a-acetylbutyrolactone, ethyl cyclopentanone-2-carboxylate or methyl cyclopentanone-2-carboxylate, with a-acetylbutyrolactone being most preferred. A manganese compound, particularly a manganese salt or a manganese complex, is used as an accelerator. Mixtures of manganese salts and / or manganese complexes can also be used. Manganese salts or manganese complexes, especially those based on 1,3-dioxo compounds such as acetylacetonate (pentane-2,4-dione), and carboxylic acids such as naphthenates, octoates, ethylhexanoates, or saturated fatty acids, have proven particularly suitable. There are no restrictions regarding the manganese compound. The manganese compound is preferably soluble in nonpolar solvents. Mn(II) octoate is particularly suitable. Alternatively, a hardener system can be used for curing, which contains the following components: - at least one metal salt as accelerator and - at least one compound containing thiol and / or thiolester groups as initiator. By combining or mixing the two components, radicals can be formed which, instead of the previously usual radical formers, can trigger a polymerization of non-aromatic double bonds, e.g. olefinic double bonds, for example acrylates or methacrylates. Examples of thiols are thioglycerol, methyl-, ethylmercaptan and higher homologues e.g. dodecylmercaptan; dimercaptans such as dimercaptopropanesulfonic acid, dimercaptosuccinic acid, dithiothreitol; poly(ethylene glycol)dithiols of the general formula HS-[CH2-CH2-O] n-CH2-CH2-SH, where n is a number between 0 and 10; liquid polysulfide polymers with thiol end groups, e.g. Thioplast G types from Akzo Nobel; polymercaptan hardeners and crosslinkers, e.g. SIQ-Amin 999 from SIQ -Kunstharze GmbH; ethoxylated and / or propoxylated alcohols from mono-, di-, tri-, tetra-, penta-, and / or other polyols with thiol end groups, e.g. Capcure 3-800 from Cognis, or the compounds mentioned below as particularly suitable thiols. A particularly suitable thiol ester is octanethiolic acid S-[3(triethoxysilyl)propyl] ester. Examples of particularly suitable thiols are glycol di(3-mercaptopropionate), trimethylolpropane tri(3-mercaptopropionate), pentaerythritol tetra(3-mercaptopropionate), dipentaerythritol hexa-3-mercaptopropionate, ethoxylated trimethylolpropane tris(3-mercaptopropionate) with different degrees of ethoxylation (e.g. ETTMP 700 and ETTMP 1300 from Bruno Bock), tris[2-(3-mercaptopropionyloxy)ethyl]isocyanurate, 3-mercaptopropyltrimethoxysilane. As a further alternative, a hardener system can be used for curing, which contains the following components: - at least one metal salt as accelerator and - at least one CH-acidic compound of formula (V) as initiator wherein (i) -A- for -C(R 1 )(R 2 )- stands, -X- for a bond, -NR 3 -, -(CR 4 R 5 ) P - or -O- stands, -Y- for -NR 6 -, -(CR 7 R 8 ) q - or -O-, where, when X is O, Y is also O; where preferably X is (CR 4 R 5 ) P and Y stands for CR 7 R 8 stands for, or X for NR 3 and Y for NR 6 stands, Z 1stands for O, S, S=O or S(=O)2, Z 2 stands for O, S, S=O or S(=O)2, Z 3 for O, S, S=O or S(=O)2 or for R 9 and R 10 stands, p stands for 1, 2 or 3, preferably for 1 or 2, q stands for 1, 2 or 3, preferably for 1, and the radicals R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 and R 10 independently of one another represent hydrogen, alkyl, aryl, aralkyl, cycloalkyl or cycloalkylalkyl and are each unsubstituted or substituted and / or have heteroatoms (instead of C atoms; preferably selected from O, N, such as NH or N-alkyl, and S), with the proviso that at least one of the radicals R 1 and R 2 hydrogen means, or (ii) open-chain compounds in which the link forming the bridge is -C(=Z 3 )- missing, -A- for -C(R 1 )(R2 )-, X and Y independently of one another represent an unbranched or branched, unsubstituted or substituted, optionally heteroatoms (instead of C atoms; in particular selected from O, N, such as NH or N-alkyl, and S) containing Ci-C4-alkyl group or Ci-C4-alkoxy group or preferably represent an unsubstituted or substituted, optionally heteroatoms (instead of C atoms; in particular selected from O, N, such as NH or N-alkyl, and S) containing Ci-C4-alkoxycarbonylmethyl group or C1-C4-alkylcarbonylmethyl group, R 1 and R 2 both mean hydrogen and Z 1 and Z 2have the meanings given; or X represents a C1-C4 alkyl group, C1-C4 alkoxy group, C1-C4 alkoxycarbonylmethyl group or C1-C4 alkylcarbonylmethyl group, each unbranched or branched, unsubstituted or substituted, optionally containing heteroatoms (instead of C atoms; in particular selected from O, N, such as NH or N-alkyl, and S), Y and Z 2 together with the bonding carbon atom -CN, Z 1 has the meanings set out above, and R 1 and R 2 are each as defined above, with the proviso that at least one of the radicals is hydrogen; and / or salts thereof. Preferred examples of such compounds are barbituric acid (2,4,6-pyrimidinetrione), 2,4,6-pyrimidinetrione derivatives such as 1-benzyl-5-phenylbarbituric acid (1-(phenylmethyl)-5-phenyl-2,4,6-pyrimidinetrione), 5-butylbarbituric acid (5-butyl-2,4,6-pyrimidinetrione), 1-cyclohexyl-5-ethylbarbituric acid (1-cyclohexyl-5-ethyl-2,4,6-pyrimidinetrione) or 2-thiobarbituric acid (4,6-dihydroxy-2-mercaptopyrimidine), 1,3-cyclohexanedione, 2-methyl-1,3-cyclohexanedione, 1,3-cyclopentanedione, 2-methyl-1,3-cyclopentanedione, 4,4-Dimethyl-1,3-cyclohexanedione, 5,5-Dimethyl-1,3-cyclohexanedione (Dimedone), 2,2-Dimethyl-1,3-dioxane-4,6-dione or 2,2,5-trimethyl-1,3-dioxane-4,6-dione, 3-oxoglutaric acid dimethyl ester, and / or diethyl 1,3-acetonedicarboxylate, ethyl cyanoacetate, methyl cyanoacetate or 2-ethylhexyl cyanoacetate, or 1,3-dioxo compounds mentioned in DE 10 2011 078 785 A1. The components used as accelerators in the form of a metal salt, which also includes metal complexes and metal oxides, are in both cases preferably one or more metal salts and in particular salts of organic and / or inorganic acids with metals, e.g. selected from cobalt, zirconium, zinc, cerium, tin, bismuth or preferably vanadium, manganese, copper or iron, or Mixtures of two or more thereof, wherein the organic acids are preferably saturated, wherein vanadium and iron or in particular manganese and copper, optionally in the presence of one or two co-accelerators with a metal portion from the group of the above-mentioned metals, is preferred, in particular in the form of salts or complexes with inorganic acids and / or carboxylate radicals, such as carboxylates with CH3, C2-C2o-alkyl, a C6-C24-aryl radical or CyCso-aralkyl radical, for example octoate, e.g. 2-ethylhexanoate (isooctanoate), furthermore neodecanoate, or acetylacetonate. Particularly preferred are manganese carbonate or carboxylates, such as manganese acetate or manganese octoate, copper carboxylates, such as copper octoate or copper naphthenate, copper quinolates, iron carboxylates, such as iron octoate and / or vanadium carboxylates and / or the group of metal salts with inorganic acids, which includes, for example, iron chloride, iron sulfate and copper chloride. In another alternative, a hardener system can be used for curing, which contains the following components: - at least one metal salt as accelerator and - as initiator at least one aldehyde and / or one ketone and at least one primary amine, and / or - at least one imine which contains one or more imine structural increments of formula (VI): (VI), in which independently Q represents the organic radical of the amine used (in each case), or represents hydrogen; and R 2 and R 3independently of one another denotes hydrogen and / or an unsubstituted or substituted, optionally containing double bonds and / or heteroatoms, singly or multiply branched or straight-chain organic radical which contains at least one aliphatic, heteroaliphatic, alicyclic or heterocyclic molecular structure, or a combination of two or more of the aforementioned molecular structures; and / or salts thereof. The molecular weight of the imines containing the imine structural increments of formula (VI) is preferably 2000 Daltons (g / mol) or lower, for example 1000 Daltons or lower. The aldehydes and / or ketones also preferably have molecular weights in these ranges. This hardener system can be present as a finished hardener composition (for example with microencapsulated components) or preferably only be formed when mixed with other components of a synthetic resin composition (in a sense as a composition (mixture)), for example during use. The aldehydes, ketones, amines, aldimines or ketimines included or used are known or can be prepared / obtained by processes known per se or are preferably obtained thereafter. The imines can be synthesized or obtained before use (e.g. for fastening anchoring elements) or also only “in situ”. Possible processes according to the invention are therefore (t) separate prior preparation and / or (tt) “in situ” preparation, in which the aldehyde / ketone and the primary amine are distributed among different components of the fastening system and mixed, for example, at the site of application and / or (ttt) “in situ” preparation in a component of the fastening system, in which the aldehyde / ketone and the primary amine are mixed together during the preparation of the respective component.In particular, the imines according to (t) are obtained by condensation, with elimination of water, of one or more amine(s) with one or more aldehyde(s) or ketone(s). Corresponding reaction conditions for the separate prior reaction (t) are known to the person skilled in the art. Examples of suitable amines and aldehydes or ketones can be found in particular in DE 10 2004 035 542 A1 , EP 1 329 469 A1 , EP 1 975 190 A1 and EP 2 017 260 A1 . The primary amines added as such or suitable for the synthesis of the imines include, for example, mono-, di-, or polyamines, or mixtures of two or more thereof. The usable mono-, di-, and / or polyamines can be both linear and branched. The molecular framework of the mono-, di-, and / or polyamines can contain aliphatic, heteroaliphatic, alicyclic, heterocyclic, aromatic, aliphatic-aromatic, and silane / siloxane molecular structures, or two or more independently selected ones. Primary and / or secondary and tertiary amino groups can be present in the molecule, but at least one primary amino group (-NH2) must be present to form the aldimine or ketimine. The mono-, di- or polyamines are preferably from the group of alkyl or alkylene (mono or di)amines (such as 2-methylpentanediamine, or 2,2,4- or 2,4,4-trimethylhexamethylenediamine), heteroalkyl or heteroalkylene (mono or di)amines (such as 1,13-diamino-4,7,10-trioxatridecane, commercially available amine-functionalized polyoxyalkylenes [Jeffamines] from Huntsman Corp, or e.g. triethylenetetramine and / or higher homologues), cycloalkyl or cycloalkylene (mono or di)amines (such as isophoronediamine, 1,3-bisaminomethylcyclohexane, TCD-diamine), heterocycloalkyl or heterocycloalkylene (mono or di)amines (such as aminoethylpiperazine), amino or amino alcohols (such as 1 ,3-Diaminopropan-2-ol), and the aliphaticaromatic (mono or di)amines (such as 1,3- or 1,4-benzenedimethanamine), selected and / or from the group of aminosilanized fillers. Furthermore, the mono-, di- or polyamines can preferably be selected from the group of aminoamides, polyaminoamides, Mannich bases and amine adducts (epoxide-amine adducts as described, for example, in EP 0 387 418 A2, isocyanate-amine adducts [for example from unreacted amino groups from imine synthesis or from the above-mentioned aminos - when using the aminos, the conversion to the imine is preferably carried out first, followed by the addition to the isocyanate], Bucherer adducts and Michael addition adducts). Aminoalkylsilanes, which contain at least one hydrolyzable group, such as alkoxy, e.g., methoxy or ethoxy, bonded to the silicon, are also particularly interesting as amines. These can undergo hydrolysis and condensation (due to the reaction water formed or added water), thus forming oligomers containing multiple amino groups that meet the REACH definition of polymers. Imines derived from such aminoalkylsilanes therefore form the basis for particularly preferred compounds. Preferred such aminoalkylsilanes are, for example, selected from the group comprising one or more of the following compounds: aminoalkyltri- or -dialkoxysilanes, such as 3-aminopropyltrimethoxysilane or 3-aminopropyltriethoxysilane, and N-(aminoalkyl)amino-alkyltri- or -dialkoxysilanes, such as N-(2-aminoethyl)-3-aminopropyltrimethoxysilane or N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, and also ureidoalkyltrimethoxysilanes, such as 3-ureidopropyltrimethoxysilane. Furthermore, aminosilanized fillers carrying primary amino groups, such as aminosilane-treated quartz flour (e.g. Silbond AST(R) from Quarzwerke GmbH), aminosilane-treated silica (e.g. Aktisil AM(R) from Hoffmann Mineral), or aminosilane-treated pyrogenic silicas. The aldehydes and ketones added as such or usable or suitable for the synthesis of the aldimines and / or ketimines are in particular those of the formula (VII) wherein R 2 , R 3independently of one another denotes hydrogen and / or an unsubstituted or substituted and / or a mono- or polybranched or straight-chain organic radical which may optionally contain double bonds and / or heteroatoms and which may comprise aliphatic, heteroaliphatic, alicyclic, heterocyclic molecular structures and / or combinations of the aforementioned molecular structures. The aldehydes and / or ketones are preferably compounds that have at least one or more (primary and / or secondary) hydrogen atoms on the carbon atom alpha to the carbonyl group. Examples of such aldehydes are propanal, valeraldehyde, isovaleraldehyde, or methoxyacetaldehyde, or 3,7-dimethyl-6-octenal (citronellal) or 3,7-dimethyl-7-hydroxyoctanal (hydroxycitronellal). Examples of such ketones include methyl isobutyl ketone, acetone, methyl ethyl ketone, or 6-methyl-5-hepten-2-one. The aldehydes and / or ketones are particularly preferably compounds that have a double bond and / or branching at the carbon atom alpha to the carbonyl group. As a result, the particularly preferred aldehydes and / or ketones have only one (tertiary) hydrogen atom at the carbon atom alpha to the carbonyl group. Examples of particularly preferred aldehydes are isobutyraldehyde, 2-ethylhexanal, 2-methylbutanal, 2-ethylbutanal, 2-methylvaleraldehyde, 2,3-dimethylvaleraldehyde, cyclohexylcarboxaldehyde, or 3,7-dimethyl-2,6-octadienal (citral), 3-(4-tert-Butylphenyl)-2-methylpropanal (Lilial, Lysmeral), tetrahydrofuran-3-carboxaldehyde, tetrahydro-2-furancarboxaldehyde, 4-formyltetrahydropyran, tetrahydro-2H-pyran-2- carbaldehyde or tetrahydropyran-3-carbaldehyde. Particularly preferred ketones include, for example, diisopropyl ketone, 3-methyl-2-pentanone, 2-methylcyclohexanone, or betalonone. The above examples of suitable amines, preferred and particularly preferred aldehydes and / or ketones are not intended to limit the scope of suitable amines, aldehydes and / or ketones, but merely to show some example compounds with the above-mentioned structural features defined as suitable, preferred and particularly preferred for illustrative purposes. Also particularly preferred are the aldehydes, ketones or synthesized aldimines and / or ketimines mentioned in the examples and the specific amines, ketones and aldehydes added as such and / or used for the synthesis of the aldimines and / or ketimines, or mixtures of two or more thereof. Multi-component reactive resin system The invention further relates to the use of at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid as a radically curable compound in a multi-component reactive resin system, preferably in a two-component reactive resin system, for the chemical fastening of anchoring agents in boreholes or for structural bonding. The multi-component reactive resin system comprises a reactive resin composition as component (A), which contains the at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid, and a curing agent component (B). The hardener component (B) contains a curing agent (such as a peroxide) for the at least one tris-[(methacryloyloxy)alkyl]isocyanuric acid as an initiator, which initiates polymerization upon mixing of the components. Furthermore, the hardener component may contain fillers and / or additives as described above. According to the invention, component (A) of the multi-component reactive resin system contains a tris-[(methacryloyloxy)-alkyl]-isocyanuric acid or a mixture of two or more tris-[(methacryloyloxy)-alkyl]-isocyanuric acids. Particularly preferred is the use of a single tris-[(methacryloyloxy)-alkyl]-isocyanuric acid, in particular tris-[2-(methacryloyloxy)-ethyl]-isocyanuric acid, as a radically curable compound in a multi-component reactive resin system. Particularly preferred is the use of a single tris-[(methacryloyloxy)-alkyl]-isocyanuric acid, in particular tris-[2-(methacryloyloxy)-ethyl]-isocyanuric acid, as a radically curable compound in a two-component reactive resin system. Components (A) and (B) are preferably mixed in a ratio of component (A) to component (B) of 10:1 to 1:10, particularly preferably 5:1 to 1:5. In a particularly preferred embodiment, the constituents of components (A) and / or (B) are one or more of the constituents mentioned in the individual examples according to the invention. Reactive resin systems in which component (A) and optionally also component (B) contain the same constituents or consist of the same constituents as mentioned in the individual examples according to the invention, preferably in the proportions mentioned therein, are very particularly preferred. Components (A) and (B) are packaged separately from each other until the multi-component reactive resin system is used, so that a reaction only takes place when the two components come into contact with each other. The multi-component reactive resin system can be in the form of a cartridge system, a cartridge system, or a foil bag system. When used as intended, the components are pressed out of the cartridges, cartridges, or foil bags either under mechanical force or gas pressure, mixed together, preferably with the aid of a static mixer through which the components are passed, and introduced into the borehole. Afterward, the devices to be secured, such as threaded anchor rods and the like, are inserted into the borehole filled with the curing reactive resin system and adjusted accordingly. Such a reactive resin system is used primarily in the construction sector, for example for the repair of concrete, as polymer concrete, as a synthetic resin-based coating compound, or as a cold-curing road marking. It is particularly suitable for the chemical fastening of anchoring elements, such as anchors, reinforcing bars, screws, and the like, in drilled holes, especially in drilled holes in various substrates, especially mineral substrates such as those based on concrete, aerated concrete, brickwork, sand-lime brick, sandstone, natural stone, glass, and the like, and metallic substrates such as those made of steel. In one embodiment, the substrate is The borehole is made of concrete, and the anchoring means is made of steel or iron. In another embodiment, the base of the borehole is steel, and the anchoring means is made of steel or iron. The steel borehole preferably has grooves. In particular, the present invention also relates to a corresponding use for increasing the performance of the cured reactive resin system at elevated temperatures. An increase in performance was achieved compared to comparable prior art reactive resin systems that did not contain tris-[(methacryloyloxy)alkyl]isocyanuric acid. Tris-[(methacryloyloxy)-alkyl]-isocyanuric acids can generally be used as monomers for polymerization, so their corresponding use constitutes a further subject of the invention. In particular, tris-[(methacryloyloxy)-alkyl]-isocyanuric acids can be used as monomers for free radical polymerization. The inventors were able to surprisingly show that tris-[2-(methacryloyloxy)-ethyl]-isocyanuric acid, in particular, can be used as a monomer for polymerization, especially free radical polymerization. All described embodiments can be combined with one another within the scope of the invention. The invention is explained in more detail below using a series of examples and comparative examples. All examples support the scope of the claims. However, the invention is not limited to the specific embodiments shown in the examples. EXAMPLES OF IMPLEMENTATION Materials and methods Reactive resin compositions containing tris-[2-(methacryloyloxy)ethyl]isocyanuric acid as a radically curable compound according to the invention and comparative reactive resin compositions without tris-[2-(methacryloyloxy)ethyl]isocyanuric acid were prepared. The exact composition of the reactive resin compositions used as components (A) and the curing components (B) used can be found in Tables 2 and 3 below. The following Table 1 lists the ingredients, their trade names, and sources. Unless otherwise stated, all ingredients listed in Table 1 are commercially available and were used in commercially acceptable quality. The hardener component (B) used in each case was the hardener component of the commercially available injection mortar Hilti HIT-HY200-A (Hilti AG, FL-Schaan). These hardener components contain benzoyl peroxide as a curing agent, fumed silica, other fillers, and water. Table 1: List of ingredients used in the comparative examples and inventive examples (explanation of abbreviations) as well as their trade names and sources In the present invention, the following analytical method was used. Pull-out tests To determine the load values ​​of the cured mass in concrete, pull-out tests were carried out under R1 (24h, RT) and B3 (100°C or 160°C) conditions according to the description of the guideline ETAG 001 Part 5 (Guideline for European technical approval of Metal Anchors for Use in Concrete) replaced by EAD 330499-00-0601. For these tests, high-strength anchor threaded rods (size M12) were installed in a hammer drilled, cleaned borehole (2x compressed air 6 bar, 2x brushing and 2x compressed air 6 bar) with a diameter of 14 mm and a borehole depth of 60 mm in concrete slabs (C20 / 25) with the respective chemical mortar mass at approximately 20°C. After a curing time of 24 hours at room temperature, the load values ​​in Pull-out tests were determined under R1 conditions. For the pull-out tests under B3 (100°C and 160°C) conditions, the concrete slabs were cured for 24 hours in an oven at the target temperature of 100°C or 160°C for 48 hours. Subsequently, the pull-out tests were conducted at the target temperature of 100°C or 160°C. Preparation of component A (reactive resin composition) of comparative examples 1-3 and inventive examples 1-11 Resin mixtures In a plastic beaker, the resins and reactive diluents were mixed with accelerator (DiPpT) and inhibitor and stirred on a magnetic stirrer for 24 hours at 50°C until the solids were completely dissolved. The resin mixture was then cooled to room temperature before the addition of the fillers. Component A The fillers and thickeners were added to the resin mixture in a plastic beaker and pre-stirred by hand using a wooden spatula before component A was homogenized in a dissolver (PC Laborsystem, volume 1 L) for 8.5 min at 3500 rpm and 80 mbar negative pressure. Component B The hardener components of the commercially available product Hilti HIT HY 200 were used as the hardener component (component B). Preparation of mortar and injection into the borehole Components A and B were filled into a hard cartridge in a mixing ratio of 5:1 (mixing ratio A:B in volume (mL of A : mL of B)) for the comparative examples and examples 1 to 10 and in a mixing ratio of 10:1 (mixing ratio A:B in volume (mL of A : mL of B)) for example 11. For injection into the borehole, a static mixer was connected to the hard cartridge, and the mortar was dispensed using a dispenser. The mortar was injected only after the first three trigger pulls to ensure complete mixing of the two components. The results in Tables 2 and 3 show that the inventive use of tris-[2-(methacryloyloxy)-ethyl]-isocyanuric acid as a radically curable compound in component A of a multi-component reactive resin system for the chemical bonding of anchoring elements in boreholes results in bond failure stress values ​​at 22°C and 100°C, respectively, similar to those of the reference systems. Surprisingly, at a further elevated temperature of 160°C, a significant improvement in bond failure stress was achieved compared to the reference systems. At the same time, the reactivity of the reactive resin system was maintained at room temperature. Table 2: Composition of Comparative Examples 1 to 3 and Examples 1 to 6 according to the invention and results of the measurements of the Composite stress Table 3: Composition of the inventive examples 7 to 11 and results of the bond stress measurements

Claims

PATENT CLAIMS 1. Use of at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid as a radically curable compound in a reactive resin composition for the chemical fixing of anchoring agents in drill holes or for structural bonding.

2. Use according to claim 1, wherein the reactive resin composition comprises at least one further radically curable compound.

3. Use according to claim 2, wherein the proportion of the at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid is more than about 20 wt.% and less than 100 wt.% based on the sum of all radically curable compounds in the reactive resin composition.

4. Use according to claim 1, wherein the reactive resin composition does not comprise any further radically curable compound.

5. Use according to one of claims 1 to 4, wherein the reactive resin Composition additionally comprises at least one reactive diluent.

6. Use according to one of claims 1 to 5, wherein the reactive resin Composition additionally comprises at least one inhibitor.

7. Use according to one of claims 1 to 6, wherein the reactive resin Composition additionally comprises at least one accelerator.

8. Use according to one of claims 1 to 7, wherein the reactive resin Composition additionally includes fillers and / or additives.

9. Use of at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid as a radically curable compound in a multi-component reactive resin system for the chemical fixing of anchoring agents in boreholes or for structural bonding, wherein the multi-component reactive resin system comprises a reactive resin composition containing the at least one tris-[(methacryloyloxy)-alkyl]-isocyanuric acid as component (A) and a curing agent component (B).

10. Use according to any one of claims 1 to 9 for increasing the performance of a cured system at elevated temperatures.

11. Use according to any one of claims 1 to 10, wherein the at least one T ris-[(methacryloyloxy)-alkyl]-isocyanuric acid is T ris-[2-(methacryloyloxy)-ethyl]-isocyanuric acid.

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