Laser device and laser system

Abstract

This laser device is accommodated in, for example, an immersion tank that accommodates a cooling liquid, and comprises a plurality of components that are thermally connected to the cooling liquid. The plurality of components include a plurality of semiconductor light sources that each output a laser beam, and an optical combiner that combines the laser beams output from the plurality of semiconductor light sources. The plurality of components may include an optical amplification fiber that is excited by the laser beam from the optical combiner, and may also include a drive circuit that drives the plurality of semiconductor light sources. The laser device may be configured to be attachable to and detachable from the immersion tank, and may be configured to be able to be taken in and out of the immersion tank from an upper opening of the immersion tank.

Description

Laser device and laser system

[0001] The present invention relates to a laser device and a laser system.

[0002] 2. Description of the Related Art Conventionally, as a laser device having components such as a light source, a laser device provided with a cooling mechanism for locally cooling is known (for example, Patent Document 1).

[0003] JP 2021-129069 MR. Pate, ZH Ayub and J. Kohler, "Heat Exchangers for the Air-conditioning and Refrigeration Industry: State-of-the-art Design and technology", Journal of Heat Transfer Engineering, Talor & Francis, Vol.12, Issue 3, pp. 56-70, 1991.

[0004] It would be beneficial for a laser device to further reduce the adverse effects of environmental factors such as dust, salt damage, humidity, vibration, etc. on components such as the light source, etc. It would also be beneficial to reduce the adverse effects of sudden temperature increases.

[0005] It is therefore an object of the present invention to provide a new and improved laser device and laser system that, for example, allows for cooling of components and mitigates adverse effects of environmental factors and rapid temperature rises.

[0006] The laser device of the present invention is, for example, a laser device housed in an immersion tank containing a coolant, and includes a plurality of components thermally connected to the coolant, the plurality of components including a plurality of semiconductor light sources each outputting laser light, and an optical combiner that combines the laser light output from the plurality of semiconductor light sources.

[0007] In the laser device, the plurality of components may include an optical amplification fiber that is pumped with the laser light from the optical combiner.

[0008] In the laser device, the plurality of components may include a drive circuit that drives the plurality of semiconductor light sources.

[0009] The laser device may be configured to be detachable from the immersion tank, and may be configured to be able to be put in and taken out of the immersion tank through an upper opening of the immersion tank.

[0010] The laser device may have a base immersed in the cooling liquid, and the plurality of components may each be supported by the base.

[0011] In the laser device, the base may be thermally connected to the coolant and the component, and may transfer heat between the coolant and the component.

[0012] In the laser device, the base may be provided with an opening through which the cooling liquid passes.

[0013] In the laser device, the surface of the base may be provided with an uneven shape.

[0014] In the laser device, the base may support a plurality of components with different heat generation amounts, and the component with the greatest heat generation amount among the plurality of components may be located in the vertical middle portion of the base or below the middle portion.

[0015] In the laser device, the plurality of components may have a heat dissipation portion that exchanges heat with the cooling liquid.

[0016] In the laser apparatus, the base may be configured to be detachable from the immersion tank.

[0017] The laser system of the present invention includes, for example, the immersion tank and a cooling mechanism that cools the coolant.

[0018] The present invention provides new and improved laser devices and systems that, for example, allow for cooling of components and mitigation of adverse effects from environmental factors.

[0019] FIG. 1 is an exemplary and schematic configuration diagram of a laser device according to a first embodiment. FIG. 2 is an exemplary and schematic configuration diagram of a laser system including the laser device according to the first embodiment. FIG. 3 is an exemplary and schematic perspective view of the laser device according to the first embodiment. FIG. 4 is an exemplary and schematic perspective view of the back side of the laser device of FIG. 3. FIG. 5 is an exemplary and schematic perspective view of a laser device according to a modification of the first embodiment. FIG. 6 is an exemplary and schematic perspective view of a laser device according to another modification of the first embodiment. FIG. 7 is an exemplary and schematic configuration diagram of a laser system according to a second embodiment. FIG. 8 is an exemplary and schematic perspective view of a laser device according to a modification of the second embodiment. FIG. 9 is an exemplary and schematic perspective view of a laser device according to another modification of the second embodiment. FIG. 10 is an exemplary and schematic configuration diagram of a laser device according to a third embodiment. FIG. 11 is an exemplary and schematic configuration diagram of a laser device according to a fourth embodiment. FIG. 12 is an exemplary and schematic configuration diagram of a laser device according to a fifth embodiment. Fig. 13 is an exemplary schematic diagram of a vehicle equipped with a laser system according to a sixth embodiment. Fig. 14 is an exemplary schematic diagram of a vehicle equipped with a laser system according to a seventh embodiment.

[0020] Hereinafter, several exemplary embodiments of the present invention will be disclosed. The configurations of the embodiments shown below, as well as the actions and results (effects) brought about by these configurations, are merely examples. The present invention can also be realized by configurations other than those disclosed in the following embodiments. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derivative effects) obtained by the configurations.

[0021] The following embodiments have similar configurations. Therefore, according to the configurations of each embodiment, similar actions and effects based on the similar configurations can be obtained. Furthermore, in the following, similar configurations are given similar reference numerals, and duplicated descriptions may be omitted.

[0022] In addition, each drawing is a schematic diagram, and the dimensions in the drawing may differ from the actual dimensions. In each drawing, the Z direction, which is approximately vertically upward, is indicated by an arrow Z.

[0023] [First Embodiment] [Laser Apparatus 100] Fig. 1 is a configuration diagram of a laser apparatus 100A (100) according to the first embodiment. In this embodiment, the laser apparatus 100A is configured as an optical fiber laser. The laser apparatus 100A includes, as components, a plurality of semiconductor pumping light sources 101, a plurality of optical fibers 102, a combiner 111, an optical fiber Bragg grating 103 (FBG 103), an amplification optical fiber 104, an FBG 105, the combiner 111, a plurality of optical fibers 106, a plurality of semiconductor pumping light sources 107, and output optical fibers 108, 109, and 110. Each element is connected via an optical fiber as appropriate.

[0024] The semiconductor pumping light sources 101 and 107 each output pumping light to be supplied to the amplification optical fiber 104. The pumping light has a wavelength, for example, 915 nm, that can optically pump the amplification optical fiber 104. The multiple optical fibers 102 and 106 propagate the pumping light output from each of the semiconductor pumping light sources 101 and 107, and output it to the combiner 111. The semiconductor pumping light sources 101 and 107 are examples of semiconductor light sources.

[0025] The combiner 111 is, for example, a known tapered fiber bundle (TFB). The combiner 111 combines the input pumping lights and outputs the combined light to the output optical fiber 109.

[0026] The amplification optical fiber 104 is a YDF (Ytterbium-doped fiber) in which a core made of silica-based glass is doped with ytterbium (Yb) ions, an amplifying material. The amplification optical fiber 104 is a double-clad optical fiber in which an inner cladding layer made of silica-based glass and an outer cladding layer made of resin or the like are sequentially formed around the core. The core of the amplification optical fiber 104 has an NA of, for example, 0.08 and is configured to propagate light emitted by Yb ions, e.g., light having a wavelength of 1070 nm, in a single mode. The absorption coefficient of the core of the amplification optical fiber 104 is, for example, 200 dB / m at a wavelength of 915 nm. The power conversion efficiency from pumping light input to the core to laser oscillation light is, for example, 70%.

[0027] The FBG 103 is connected between the output optical fiber 109 of the combiner 111 on the multiple semiconductor pumping light sources 101 side and the amplification optical fiber 104. The FBG 103 has a center wavelength of, for example, 1070 nm, a reflectance of approximately 100% in a wavelength band of approximately 2 nm around the center wavelength, and transmits almost all light with a wavelength of 915 nm. On the other hand, the FBG 105 is connected between the output optical fiber 109 of the combiner 111 on the multiple semiconductor pumping light sources 107 side and the amplification optical fiber 104. The FBG 105 has a center wavelength of, for example, 1070 nm, which is approximately the same as that of the FBG 103, a reflectance of approximately 10 to 30% at the center wavelength, a full width at half maximum of the reflection wavelength band of approximately 1 nm, and transmits almost all light with a wavelength of 915 nm.

[0028] The FBGs 103 and 105 are arranged at both ends of the amplification optical fiber 104, respectively, and form an optical fiber resonator for light with a wavelength of 1070 [nm].

[0029] In the amplification optical fiber 104, Yb ions in the core are photoexcited by the pumping light, and emit light in a band including a wavelength of 1070 [nm]. The light emitted at a wavelength of 1070 [nm] is lased by the optical amplification action of the amplification optical fiber 104 and the action of the optical resonator formed by the FBGs 103 and 105.

[0030] The output optical fiber 108 is disposed on the opposite side of the combiner 111 from the FBG 105, and is connected to an output optical fiber 110 of the combiner 111. The oscillated laser light (laser oscillation light) is output from the output optical fiber 108. The output optical fiber 108 is connected to, for example, a delivery optical fiber. The laser oscillation light is propagated by the delivery optical fiber for a predetermined application.

[0031] Although not shown in FIG. 1, the laser device 100 may also include components such as a power supply, a drive circuit that drives the semiconductor excitation light source 101, and a control circuit that controls the operation of the drive circuit.

[0032] [Immersion Tank] FIG. 2 is a diagram (partial cross-sectional view) showing the configuration of a laser system 10A (10) equipped with a laser device 100. As shown in FIG.

[0033] 2, the laser system 10 includes an immersion tank 11 that contains a first refrigerant R. The first refrigerant R is in a liquid state at room temperature. The immersion tank 11 includes a container 11a that contains the first refrigerant R in a liquid state, i.e., in a liquid phase, and a lid 11b that detachably covers the upper opening of the container 11a.

[0034] In the housing section 11a, multiple laser devices 100A and 100B are immersed in a liquid-phase first refrigerant R. The laser device 100A is the laser device 100A shown in FIG. 1 . The laser device 100B is a laser device 100B having a different configuration from the laser device 100A shown in FIG. 1 . However, this is not limited thereto, and the multiple laser devices 100 housed in the housing section 11a may be laser devices 100 of the same configuration. The number of laser devices 100 housed in the housing section 11a may be one or three or more. In the example of FIG. 2 , the entire laser devices 100A and 100B are immersed in the liquid-phase first refrigerant R, but this is not limited thereto, and for example, their upper portions may be partially exposed from the liquid-phase first refrigerant R.

[0035] The laser device 100 has a base 100a and a plurality of components 100b supported by the base 100a. The base 100a is, for example, a plate-shaped member, and is supported in the immersion tank 11 in a position extending substantially along the Z direction, in other words, in a position widening substantially along the Z direction and thinning in a direction intersecting the Z direction. The base 100a is preferably made of a material with high thermal conductivity and high corrosion resistance, such as stainless steel.

[0036] The multiple components 100b are attached to the front or back surface of the base 100a. The front or back surface refers to a surface located at an end of the base 100a in the thickness direction. In the case of the laser device 100A of FIG. 1 , the multiple components 100b include, for example, the semiconductor pumping light source 101, the optical fiber 102, the combiner 111, the FBG 103, the amplification optical fiber 104, the FBG 105, the combiner 111, the optical fiber 106, the semiconductor pumping light source 107, and the output optical fibers 108 and 109. The multiple components 100b may also be a subassembly or the like including multiple components from among the above-mentioned components.

[0037] The multiple components 100b include a component 100b that generates heat when activated, such as the semiconductor excitation light source 101. In this embodiment, the multiple components 100b are thermally connected to the liquid-phase first refrigerant R directly or indirectly via a thermally conductive member or the like. Therefore, when an activated component 100b generates heat, heat exchange occurs between the component 100b and the liquid-phase first refrigerant R, thereby cooling the component 100b.

[0038] Furthermore, in this embodiment, a refrigerant that transitions to a gas phase through heat exchange with the components 100b that generate heat is used as the first refrigerant. Therefore, when the liquid-phase first refrigerant R receives heat from the components 100b that generate heat due to operation and transitions to a gas phase, it absorbs the heat of vaporization. This cools the components 100b. The first refrigerant that transitions from the liquid phase to a gas phase rises within the immersion tank 11 and exists above the liquid-phase first refrigerant R at the top of the immersion tank 11.

[0039] In addition to the phase transition property as described above, the first refrigerant preferably has insulating properties and a function of preventing air and water from contacting the laser device 100. An example of such a first refrigerant R is a fluorine-based inert liquid.

[0040] 2, the laser system 10 is provided with a cooling mechanism 12A (12) that cools the first refrigerant. The cooling mechanism 12A is a so-called two-phase cooling mechanism that cools the first refrigerant in the immersion tank 11 via a second refrigerant in a pipe 12a.

[0041] Specifically, the second refrigerant is pumped by the pump 12c and circulates through the pipe 12a. The pipe 12a is provided with two heat exchange portions 12b1 and 12b2.

[0042] One heat exchanger 12b1 is provided outside the immersion tank 11, and the other heat exchanger 12b2 is provided inside the immersion tank 11. Note that the heat exchanger 12b1 is housed in a housing 12e provided outside the immersion tank 11, but is not limited to this.

[0043] In the heat exchange section 12b1, the second refrigerant in the pipe 12a is cooled by the air flow generated by the operation of the fan 12d, i.e., the air flow introduced from outside the housing 12e into the housing 12e through the opening 12f provided in the housing 12e.

[0044] In heat exchanger 12b2, heat exchange takes place between the second refrigerant and the first refrigerant in a gas phase present in the upper part of immersion bath 11. During this heat exchange, the first refrigerant transitions from a gas phase to a liquid phase, imparting heat of liquefaction to the second refrigerant in pipe 12a. The second refrigerant is heated and flows within pipe 12a toward heat exchanger 12b1. In heat exchanger 12b1, the second refrigerant is cooled again as described above.

[0045] [Base and Component Assembly (Laser Device)] Figures 3 and 4 are perspective views showing an example of a laser device 100A1 (100A) configured as an assembly of a base 100a and multiple components 100b. As shown in Figure 3, multiple components 100b1 to 100b3 (100b) are fixed to a surface 100a4 of the plate-shaped base 100a. Also, as shown in Figure 4, multiple components 100b4 (100b) are fixed to a surface 100a5 of the base 100a opposite to the surface 100a4. In this example, the component 100b1 is a subassembly including an FBG 103, an amplification optical fiber 104, and an FBG 105. The FBG 103, the amplification optical fiber 104, and the FBG 105 may be fixed to a support member, covered with a cover, or housed in a housing. The component 100b2 is a combiner 111. The component 100b4 is the semiconductor excitation light source 101. The component 100b3 is a drive circuit that drives the semiconductor excitation light source 101. Because the drive circuit also generates heat when in operation, it is preferable that the drive circuit be thermally connected to the liquid-phase first refrigerant R. The surfaces 100a4 and 100a5 are examples of surfaces of the base 100a.

[0046] 2, an end 100a1 of the base 100a opposite the Z direction is detachably held by a holder provided at the bottom of the accommodation unit 11a of the immersion tank 11. The holder 11c may have, for example, a movable part that moves between a locked position where the base 100a is locked and an unlocked position where the base 100a is unlocked by a predetermined operation. Alternatively, the holder 11c may have a holding part that undergoes elastic deformation. In this case, the base 100a can be attached to or detached from the holder 11c by applying a force to the base 100a in the Z direction that exceeds the elastic holding force of the holding part.

[0047] The immersion tank 11 has a holder 11c to which the base 100a (assembly) can be detached. This means that, for example, if it is discovered that some abnormality has occurred in the laser device 100, the laser device 100 assembly can be removed from the holder 11c with the lid 11b open and taken out through the upper opening of the housing section 11a. Also, with the lid 11b open, a new or repaired laser device 100 assembly can be housed in the housing section 11a through the upper opening and attached to the holder 11c. The position at which the holder 11c is provided is not limited to the bottom of the housing section 11a (immersion tank 11), and it may be on the side or the top (lid 11b).

[0048] As described above, in this embodiment, the component 100b such as the light source is immersed in the liquid-phase first refrigerant R in the immersion tank 11. This reduces the adverse effects of environmental factors such as dust, salt damage, and humidity on the component 100b.

[0049] Furthermore, in this embodiment, a plurality of components 100b included in the laser device 100 are attached to the base 100a to form the assembly of the laser device 100. This makes it easier to house the laser device 100 in the immersion tank 11, attach it to the immersion tank 11, or remove it from the immersion tank 11 and take it out of the immersion tank 11.

[0050] In this embodiment, the base 100a is made of a thermally conductive material and is thermally connected to both the component 100b and the liquid-phase first refrigerant R. That is, the base 100a can transfer heat between the component 100b and the liquid-phase first refrigerant R. As a result, the heated component 100b can exchange heat more efficiently with the liquid-phase first refrigerant R via the base 100a, and the heated component 100b can be cooled more quickly or more efficiently.

[0051] In addition, in this embodiment, the laser system 10 is equipped with a cooling mechanism 12, which can continuously cool the first refrigerant, so that the part 100b can be continuously cooled by the first refrigerant.

[0052] [Modified Assembly] Figure 5 is a perspective view showing a modified example of a laser device 100A2 (100A, 100) configured as an assembly of a base 100a and multiple components 100b. In this modified example, the base 100a is provided with multiple slit-shaped openings 100a2 extending in the Z direction, and the base 100a has a ladder frame shape with multiple crosspieces 100a3 extending in the Z direction. The openings 100a2 are through-holes that penetrate the base 100a in the thickness direction. The components 100b are attached to the crosspieces 100a3. This configuration increases the contact area of ​​each component 100b with the liquid-phase first refrigerant R, enabling the heated components 100b to be cooled more quickly or efficiently. Furthermore, since the liquid-phase first refrigerant R can move through the openings 100a2, the liquid-phase first refrigerant R can move more easily toward the high-temperature portions of the laser device 100, which also makes it possible to cool the heated components 100b more quickly or more efficiently. The base 100a may have a mesh shape.

[0053] FIG. 6 is a perspective view showing another modified example of the laser device 100A3 (100A, 100) configured as an assembly of a base 100a and multiple components 100b. In this modified example, a porous structure, which is a micro-irregular structure, is provided on the surface 100a5 of the base 100a. Examples of porous structures include the structure illustrated in FIG. 2 of Non-Patent Document 1. The porous structure increases the surface area of ​​the surface 100a5, thereby improving the efficiency of heat exchange between the base 100a and the liquid-phase first refrigerant R. This allows for faster or more efficient cooling of the heated components 100b. The porous structure may also be provided on the surface 100a4. Furthermore, the surfaces 100a4 and 100a5 may be provided with an irregular structure larger than the porous structure.

[0054] Second Embodiment FIG. 7 is a configuration diagram (partial cross-sectional view) of a laser system 10C (10) according to a second embodiment. The laser system 10C includes a cooling mechanism 12C (12) different from that of the first embodiment. The cooling mechanism 12C is a so-called single-phase cooling mechanism that directly cools the first refrigerant in the immersion tank 11. In this embodiment, the first refrigerant does not vaporize even when heated by heat generated by the components 100b, but remains liquid, and this liquid first refrigerant R flows through the pipe 12a. The first refrigerant R introduced into the pipe 12a from the top of the immersion tank 11 is cooled by the heat exchanger 12b1 and returned to the bottom of the immersion tank 11. Within the immersion tank 11, a flow of the first refrigerant R occurs as indicated by the dashed arrows, and the first refrigerant R is heated by heat exchange with the heated components 100b. The heated first refrigerant R is introduced into the pipe 12a. The liquid first refrigerant R is an example of a coolant.

[0055] In this embodiment, the first refrigerant R preferably has insulating properties and also has a function of preventing air and water from contacting the laser device 100. An example of such a first refrigerant R is silicone oil.

[0056] In this embodiment, the components 100b such as the light source are also immersed in the first refrigerant R, which is liquid, in the immersion tank 11. This reduces the adverse effects of environmental factors such as dust, salt damage, and humidity on the components 100b.

[0057] Furthermore, in this embodiment, although it is a different type from the first embodiment, the first refrigerant can be continuously cooled by the cooling mechanism 12C, and therefore the part 100b can be continuously cooled by the first refrigerant.

[0058] [Modification of Assembly] Fig. 8 is a side view showing a laser device 100B1 (100B, 100) according to a modification of the second embodiment, configured as an assembly of a base 100a and a plurality of components 100b. In this modification, a heat dissipation unit 100c is attached to the component 100b at a position separate from the base 100a. The heat dissipation unit 100c is in contact with a liquid first refrigerant R and exchanges heat with the first refrigerant R. The heat dissipation unit 100c is, for example, a heat sink having a plurality of pins, fins, or the like. This configuration promotes heat exchange between the heated component 100b and the first refrigerant R, allowing the heated component 100b to be cooled more quickly or efficiently.

[0059] 9 is a perspective view showing a laser apparatus 100A4 (100A, 100) according to another modification of the second embodiment, configured as an assembly of a base 100a and multiple components 100b. In this modification, multiple openings 100a2 are provided at the end of the base 100a opposite the Z direction, i.e., at the bottom end. The openings 100a2 penetrate the base 100a in the thickness direction. Furthermore, when the base 100a is housed in the immersion tank 11, the openings 100a2 are located below the middle of the base 100a in the Z direction (vertical direction), preferably near the bottom of the housing portion 11a. Therefore, the openings 100a2 serve as a passage for the relatively low-temperature first refrigerant R, which allows the relatively low-temperature first refrigerant R to easily reach a wider area inside the immersion tank 11. With this configuration, it is possible to suppress variations in the degree of cooling between the components 100b provided on surface 100a4 and the components 100b provided on surface 100a5, and variations in the degree of cooling among multiple laser devices 100, compared to when opening 100a2 is not provided.

[0060] Furthermore, in the immersion tank 11, the first refrigerant R heated by heat exchange with the components 100b flows upward. That is, the temperature of the first refrigerant R decreases the further downwards in the immersion tank 11. For this reason, if the multiple components 100b include a component 100b that generates more heat than the others, it is preferable that the component 100b that generates more heat be located in the middle of the base 100a in the Z direction (vertical direction) or below this middle part while housed in the immersion tank 11. This arrangement makes it possible to more reliably cool the components 100b that generate more heat.

[0061] The modified assemblies shown in FIGS. 8 and 9 may be applied to the first embodiment, and the assemblies shown in FIGS. 3 to 6 may be applied to the second embodiment.

[0062] [Third Embodiment] Fig. 10 is a configuration diagram of a laser device 100D (100) according to a third embodiment. In this embodiment, the laser device 100D is configured as a direct diode laser (DDL). The laser device 100D includes a plurality of semiconductor laser modules 201, a plurality of optical fibers 202, a combiner 204, and a delivery optical fiber 203. Each element is connected by an optical fiber as appropriate. The semiconductor laser module 201 is an example of a semiconductor light source.

[0063] The plurality of semiconductor laser modules 201 each output laser light having a wavelength of, for example, 1070 nm. The plurality of optical fibers 202 propagate the laser light output from each semiconductor laser module 201 and output the laser light to a combiner 204.

[0064] The combiner 204 combines the laser beams input from the plurality of optical fibers 202 and outputs the combined beam to the delivery optical fiber 203. The delivery optical fiber 203 may be a multimode optical fiber.

[0065] The laser device 100D (100) has a subassembly form such as the above-mentioned embodiments and variations, and has as components 100b a semiconductor laser module 201, an optical fiber 202, a delivery optical fiber 203, a combiner 204, or a subassembly including a plurality of these, and can be housed in an immersion tank 11.

[0066] 11 is a configuration diagram of a laser device 100E (100) according to a fourth embodiment. In this embodiment, the laser device 100E (100) is configured as an optical fiber laser. The laser device 100E includes a seed light source 301, optical isolators 302 and 304, an optical modulator 303, an optical fiber 305, and an optical fiber amplifier 310.

[0067] The seed light source 301 is an excitation light source that outputs seed light. The optical isolators 302 and 304 transmit only the laser light traveling in the forward direction (the direction of the arrow in the figure) and block the laser light traveling in the reverse direction. The optical modulator 303 modulates the intensity and phase of the laser light to generate an optical signal. The optical modulator 303 may also intensity-modulate the laser light to generate pulsed light.

[0068] The optical fiber amplifier 310 has a plurality of semiconductor pumping light sources 306, a plurality of optical fibers 307, a combiner 308, and an amplification optical fiber 309. The semiconductor pumping light sources 306, the optical fibers 307, the combiner 308, and the amplification optical fiber 309 can have the same configurations and functions as the semiconductor pumping light sources 101, the optical fibers 102, the combiner 111, and the amplification optical fibers 104 of the first embodiment, respectively. The semiconductor pumping light sources 306 are an example of a semiconductor light source.

[0069] 12 is a configuration diagram of a laser device 100F (100) according to the fifth embodiment. The laser device 100F differs from the fourth embodiment in that it has multiple stages of optical fiber amplifiers 310. In this embodiment, the laser device 100F (100) also functions as an optical fiber laser.

[0070] The laser devices 100E, 100F (100) each have a subassembly form such as the above-mentioned embodiments and variations, and have as components 100b a seed light source 301, an optical isolator 302, an optical modulator 303, an optical fiber 305, an optical fiber amplifier 310, or a subassembly including a plurality of these, and can be housed in an immersion tank 11.

[0071] Sixth and Seventh Embodiments FIG. 13 is a structural diagram (partial cross-sectional view) of a vehicle 20G (20) according to a sixth embodiment, in which a laser system 10G (10) is mounted. The laser system 10G (10) includes an immersion tank 11, a cooling mechanism 12, a power supply unit 13 that supplies power for operating the laser device 100 and the cooling mechanism 12, and an output optical fiber 14. Because the laser system 10G of this embodiment is mounted on the bed of the vehicle 20G, the laser system 10 can be used in a variety of locations. The vehicle 20G is an example of a mobile object 20. The laser system 10 may also be mounted on a mobile object 20 other than a vehicle, such as a drone or a ship.

[0072] FIG. 14 is a structural diagram (partial cross-sectional view) of a vehicle 20H (20) according to the seventh embodiment, which includes a laser system 10H (10). The laser system 10H of this embodiment includes the same components as the laser system 10G of the sixth embodiment. However, in this embodiment, the immersion tank 11, the cooling mechanism 12, and the power supply unit 13 are housed in a container 15. This configuration has the advantage that the laser system 10H can be moved by transporting the container 15. This allows the laser system 10H to be easily transferred to another vehicle, for example. Furthermore, when maintenance of the laser system 10H is required, the laser system 10H can be easily transported.

[0073] Furthermore, relatively heavy components, such as the immersion tank 11 and the power supply unit 13, are preferably positioned lower than the other components or at the lowest position in the area where the multiple components constituting the laser system 10 are housed or arranged. Specifically, as shown in Figures 13 and 14, the immersion tank 11 and the power supply unit 13 are preferably placed directly on the floor of a loading platform or container, or on a thin or low platform, and then lined up on the floor. In this case, a vibration-reducing element such as an insulator may be interposed between the floor and the components. Note that lighter components may be placed on top of heavier components. This arrangement allows the center of gravity of the laser system 10 to be lowered, thereby suppressing shaking of the laser system 10 even when vibrations occur due to movement of the mobile body 20, etc., and thereby suppressing the adverse effects of vibrations on the laser system 10.

[0074] While the above describes exemplary embodiments of the present invention, the above embodiments are merely examples and are not intended to limit the scope of the invention. The above embodiments can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the spirit of the invention. Furthermore, the specifications of each configuration, shape, and the like (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be appropriately modified and implemented.

[0075] For example, a laser device or laser system may employ a cooling structure that utilizes a coolant flow, such as a microchannel structure or a jet impingement structure. A microchannel structure is a structure that provides numerous fine coolant passages (microchannels) in a thermally conductive base, promoting heat exchange between the base and the coolant passing through the passages, thereby promoting cooling of a component or other object to be cooled. A jet impingement structure is a structure that sprays coolant toward the object to be cooled from numerous discharge holes, promoting heat exchange between the object and the coolant jets, thereby promoting cooling of the object. These structures enable faster and more efficient cooling, even when the amount of heat generated per unit time increases due to an increase in the operating frequency of a heat-generating element, such as a laser element, and thus make it easier to suppress a sudden temperature rise in the laser device.

[0076] The present invention can be used in a laser device and a laser system.

[0077] DESCRIPTION OF SYMBOLS 10, 10A, 10C, 10G, 10H... Laser system 11... Immersion tank 11a... Storage section 11b... Lid 11c... Holder 12, 12A, 12C... Cooling mechanism 12a... Piping 12b1, 12b2... Heat exchange section 12c... Pump 12d... Fan 12e... Housing 12f... Opening 13... Power supply unit 14... Output optical fiber 15... Container 20... Mobile body 20H, 20G... Vehicle 100, 100A, 100A1 to 100A4, 100B, 100B1, 100D, 100E, 100F... Laser device 100a... Base 100a1... End 100a2... Opening 100a3... Crosspiece 100a4, 100a5... Surface (surface) 100b, 100b1 to 100b4...components 100c...heat dissipation section 101...semiconductor pumping light source (semiconductor light source) 102...optical fiber 103...FBG 104...amplifying optical fiber 105...FBG 106...optical fiber 107...semiconductor pumping light source (semiconductor light source) 108...output optical fiber 109...output optical fiber 110...output optical fiber 111...combiner 201...semiconductor laser module (semiconductor light source) 202...optical fiber 203...delivery optical fiber 204...combiner 301...seed light source 302...optical isolator 303...optical modulator 304...optical isolator 305...optical fiber 306...semiconductor pumping light source (semiconductor light source) 307...optical fiber 308...combiner 309...amplifying optical fiber 310...optical fiber amplifier R...first refrigerant (liquid, liquid phase) Z...direction

Claims

1. A laser device housed in an immersion bath containing a coolant, comprising a plurality of components thermally connected to the coolant, the plurality of components including: a plurality of semiconductor light sources each outputting a laser beam; and an optical combiner which combines the laser beams output from the plurality of semiconductor light sources.

2. The laser device according to claim 1, wherein said plurality of components includes an optical amplifying fiber that is excited by the laser light from said optical combiner.

3. The laser device according to claim 1, wherein said plurality of components includes a drive circuit for driving said plurality of semiconductor light sources.

4. The laser device according to claim 1, which is configured to be detachably attached to the immersion tank and can be inserted into and removed from the immersion tank through an upper opening of the immersion tank.

5. The laser device according to claim 1, further comprising a base immersed in the cooling liquid, and each of the plurality of components is supported by the base.

6. The laser apparatus of claim 5, wherein said base is thermally connected to said cooling liquid and to said component, and transfers heat between said cooling liquid and said component.

7. The laser device of claim 6, wherein said base is provided with an opening through which said cooling liquid passes.

8. The laser device according to claim 6, wherein the surface of the base is provided with an uneven shape.

9. The laser device according to claim 5, wherein the base supports a plurality of components with different heat generation amounts, and the component with the greatest heat generation amount among the plurality of components is provided at a vertical middle portion of the base or below the middle portion.

10. The laser device according to claim 5, wherein said plurality of components have heat dissipation sections for exchanging heat with said cooling liquid.

11. The laser device according to claim 5, wherein the base is configured to be detachably attached to the immersion tank.

12. A laser system comprising: a laser device according to any one of claims 1 to 11; the liquid immersion tank; and a cooling mechanism for cooling the cooling liquid.

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