Method for using heat sink manufacturing apparatus

Abstract

The method for using a heat sink manufacturing apparatus according to the present invention includes: (a) setting a pre-processing condition in the heat sink manufacturing apparatus; (b) performing a pre-cutting process on an object dedicated to heat dissipation on a sample seating part on the basis of the pre-processing condition by using the heat sink manufacturing apparatus; (c) setting a processing condition in the heat sink manufacturing apparatus; (d) rotating the sample seating part on the basis of the processing condition by using the heat sink manufacturing apparatus; (e) performing zero point adjustment of the sample seating part by using the heat sink manufacturing apparatus; (f) performing cutting process on the object dedicated for heat dissipation on the basis of the processing condition by using the heat sink manufacturing apparatus; and (g) identifying whether a final processed surface of the sample seating part has arrived by using an upper heat sink manufacturing apparatus.

Description

Method of using a heat sink manufacturing device

[0001] The present invention relates to a method of using a heat sink manufacturing device that processes a heat sink-only object to manufacture the heat sink-only object into a heat sink fin cluster heat sink.

[0002] Recently, heat sinks have been manufactured to be attached to electric vehicle inverters. They absorb heat generated by the inverter, evenly distribute it throughout the entire heat sink, and facilitate heat dissipation into the air via water-cooled or cooling fans, thereby improving the vehicle's performance. To achieve this, these heat sinks have a large surface area and, when combined with a cooling fan, are designed to facilitate the escape of air from the fan.

[0003] According to the prior art, the heat sink has heat sink fins on a base plate by cutting an object using a skiving machine. That is, the skiving machine uses a cutting tool to cut an object to form a base plate from a portion of the object and form heat sink fins from the remainder of the object. Since the heat sink has a base plate and individual heat sink fins made of the same material as the object, there is no contact thermal resistance between the base plate and the individual heat sink fins, thereby maximizing heat flow.

[0004] However, the above-mentioned skiving equipment repeatedly requires the user's intervention to measure or adjust the bed inclination before placing the object, and repeatedly requires the user's intervention again to adjust the bed inclination when a shape error occurs between the machined heat sink fins and the design-required heat sink fins on the bed after placing the object. In addition, the above-mentioned skiving equipment has a large and heavy bed and a complex shape around the bed to adjust the bed inclination.

[0005] Therefore, the method of using the above-mentioned skiving equipment requires the user to handle the bed, and it is difficult to maintain the bed's inclination at a constant level over the life of the skiving equipment, requiring skilled operators. Meanwhile, a method of using the above-mentioned skiving equipment is similarly disclosed as prior art in Japanese Patent Application Laid-Open No. 2002-292516.

[0006] The present invention has been devised to solve the problems of the related art, and aims to provide a method of using a heat sink manufacturing device suitable for minimizing user intervention in measuring and adjusting the inclination of a sample mounting portion before or after mounting a heat sink-only object, and minimizing user intervention in measuring the thickness, height, and pitch of heat sink fins in a heat sink cluster heat sink when determining whether an error occurs in the processed shape of the heat sink fins and the design-provided shape.

[0007] A method of using a heat sink manufacturing device according to the present invention comprises: (a) setting preliminary processing conditions in the heat sink manufacturing device to process a heat-dissipation-only object to manufacture the heat-dissipation-only object into a heat sink fin cluster heat sink, (b) performing preliminary cutting processing on the heat-dissipation-only object on a sample mounting portion based on the preliminary processing conditions using the heat sink manufacturing device, (c) setting processing conditions in the heat sink manufacturing device, (d) rotating the sample mounting portion based on the processing conditions using the heat sink manufacturing device, (e) performing zero point adjustment of the sample mounting portion using the heat sink manufacturing device, (f) performing cutting processing on the heat-dissipation-only object based on the processing conditions using the heat sink manufacturing device, and (g) confirming whether the final processing surface of the sample mounting portion has been reached using the heat sink manufacturing device, wherein the cutting processing is characterized in that it makes the heat-dissipation-only object into the heat sink fin cluster heat sink.

[0008] When the heat sink manufacturing device includes a base that is horizontally long and located on a lower side of the heat sink manufacturing device; the sample mounting portion that slides along the base on the base; a slide portion that is vertically long and located with respect to the base on an upper side of the heat sink manufacturing device; and a cutting mechanism portion that slides along the slide portion, the sample mounting portion and the cutting mechanism portion may gather around or move away from an edge between the base and the slide portion during operation of the heat sink manufacturing device.

[0009] When the sample mounting portion has a motor and a polygonal mounting base linked to the rotation of a rotation shaft in the motor, setting the preliminary processing conditions may include positioning the heat dissipation-only target on the mounting base, inputting the condition probe thickness, the pitch provided in the design drawing, the height provided in the design drawing, the condition probe compression ratio, and the total number of condition probe pins into a user interface of the heat sink manufacturing device, and using a control unit of the heat sink manufacturing device to tilt the mounting base at a first angle with respect to the base based on the condition probe thickness, the pitch provided in the design drawing, and the condition probe compression ratio.

[0010] The above condition probe thickness is a one-time movement distance of the cutting mechanism on the slide, the design drawing provided pitch is a one-time movement distance of the sample mounting portion on the base, and the condition probe thickness and the condition probe compression ratio can be obtained from usage experience data of the heat sink manufacturing device.

[0011] The above first angle can be derived from the angle extraction formula in the operation program of the control unit of the heat sink manufacturing device, θ1 = arctan(t1 / p / ε1) (wherein t1; conditional probe thickness, p; pitch provided in the design drawing, ε1; conditional probe compression ratio).

[0012] When a preliminary cutting process is performed by having a mounting plate in the sample mounting portion, having a cutting tool in the cutting mechanism portion, and receiving a preliminary heat dissipation fin condition probe thickness, a design drawing-provided pitch, a design drawing-provided height, a condition probe compression ratio, and a condition probe total number of fins in the user interface of the heat dissipation plate manufacturing device, using a control portion of the heat dissipation plate manufacturing device, gathering the sample mounting plate and the cutting mechanism portion around an edge between the base and the slide plate, and using the control portion to repeatedly contact the cutting tool with the heat dissipation-only target object of the mounting portion while cutting a portion of the processing area of ​​the heat dissipation-only target object by the condition probe total number of fins, thereby manufacturing a heat dissipation fin-partially dense heat dissipation plate.

[0013] When manufacturing a heat dissipation fin-dense heat dissipation plate from the heat dissipation-only target object on the heat dissipation plate, the processing conditions are set by: bringing the cutting tool into contact with an individual first heat dissipation fin among the first heat dissipation fins positioned on a first heat dissipation substrate in the heat dissipation fin-dense heat dissipation plate, using a thickness sensor of the heat dissipation plate manufacturing device, measuring the thickness of the individual first heat dissipation fin among the first heat dissipation fins in the heat dissipation fin-dense heat dissipation plate; using the thickness sensor of the heat dissipation plate manufacturing device, measuring the penetration depth of the tip edge of the cutting tool under the individual first heat dissipation fin between the first heat dissipation substrate and the individual first heat dissipation fin; and receiving the thickness of the individual first heat dissipation fin and the penetration depth of the tip edge as numerical values ​​from the thickness sensor in the control unit of the heat dissipation plate manufacturing device, so as to obtain the compressibility of the heat dissipation-only target object.

[0014] The above compression ratio can be derived from the compression ratio extraction formula in the operation program of the control unit of the heat sink manufacturing device, ε2 = t2 / d (wherein t2 is the thickness of the individual first heat sink fin, d is the penetration depth of the leading edge, and ε2 is the compression ratio of the heat sink-only object).

[0015] The method may further include taking a picture of the mounting plate using a camera of the heat sink manufacturing device, and receiving a picture of the mounting plate from the camera in the control unit of the heat sink manufacturing device and storing the total number of processing surfaces of the mounting plate as a number.

[0016] When the sample mounting portion has a mounting base, the cutting mechanism portion has a cutting tool, and the control portion of the heat sink manufacturing device receives a numerical value of the penetration depth of the cutting tool's tip edge together with the thickness of each first heat sink fin from the control portion of the heat sink manufacturing device to obtain the compression ratio of the heat sink-only object, rotating the sample mounting base may include, in a state where the design drawing-provided pitch and the design drawing-provided height have already been input in the control portion of the heat sink manufacturing device when performing the step (a), tilting the mounting base at a second angle based on the thickness of the first heat sink fin and the compression ratio of the heat sink-only object together with the design drawing-provided pitch using the control portion of the heat sink manufacturing device.

[0017] The above second angle can be derived from the angle extraction formula in the calculation program of the control unit of the heat sink manufacturing device, θ2 = arctan(t2 / p / ε2) (wherein t2; thickness of the first heat sink fin, p; pitch provided in the design drawing, ε2; compression ratio of the heat sink-only object).

[0018] When the mounting plate is tilted at a second angle using the control unit of the heat sink manufacturing device, the zero point adjustment is performed by reading a point as (x, y) in the XY rectangular coordinate system dividing the mounting plate into four parts before tilting at the second angle in the control unit of the heat sink manufacturing device, reading a point as (x', y') in the X'-Y' rectangular coordinate system dividing the mounting plate into four parts after tilting at the second angle, and confirming the 'θ3' movement of the X'-Y' rectangular coordinate system with respect to the XY rectangular coordinate system by matching the origins of the XY rectangular coordinate system and the X'-Y' rectangular coordinate system, using the control unit of the heat sink manufacturing device through a calculation program, two coordinate transformation formulas based on trigonometric functions, x' = xcos(θ3) - ysin(θ3), y' = xsin(θ3) + ycos(θ3) are used to convert the X'-Y' rectangular coordinate system into the XY rectangular coordinate system. Coordinate systems can be synchronized.

[0019] When the sample mounting portion has a mounting base, the cutting mechanism portion has a cutting tool, and the heat dissipation fin-dense heat dissipation plate is on the mounting base, performing the cutting process includes repeatedly contacting the cutting tool with the heat dissipation fin-dense heat dissipation plate using a control portion of the heat dissipation plate manufacturing device to form the heat dissipation fin-dense heat dissipation plate into a heat dissipation fin cluster heat dissipation plate through cutting of the remaining processing area of ​​the first heat dissipation substrate from the heat dissipation fin-dense heat dissipation plate, and the heat dissipation fin cluster heat dissipation plate may have second heat dissipation fins on a second heat dissipation substrate.

[0020] When the sample mounting portion has a mounting base, the cutting mechanism portion has a cutting tool, and another heat-radiating-only object is positioned next to the heat-radiating-fin-dense heat-radiating plate on the mounting base, performing the cutting process includes repeatedly contacting the cutting tool with the heat-radiating-fin-dense heat-radiating plate using a control portion of the heat-radiating plate manufacturing device to form the heat-radiating-only object into a heat-radiating-fin cluster heat-radiating plate through cutting of a processing area of ​​the heat-radiating-only object, and the heat-radiating-fin cluster heat-radiating plate may have second heat-radiating fins on a second heat-radiating substrate.

[0021] Confirming whether the final processing surface of the sample mounting portion has been reached may include comparing the rotation number history of the mounting portion and the total number of processing surfaces of the mounting portion using a control unit of the heat dissipation plate manufacturing device while forming a heat dissipation fin cluster heat dissipation plate on the mounting portion.

[0022] If the number of rotations of the mounting plate and the total number of the processing surfaces of the mounting plate are the same, the operation of the heat sink manufacturing device may be terminated.

[0023] If the number of rotations of the above-mentioned mounting plate is smaller than the total number of the above-mentioned processing surfaces of the above-mentioned mounting plate, the control unit of the above-mentioned heat sink manufacturing device may be used to move from the above-mentioned (a) step to the subsequent step.

[0024] The above subsequent steps may include (a) increasing the sequence of the current processing surface of the mounting plate using the heat sink manufacturing device, and (b) checking whether an error occurs in the heat sink fin cluster heat sink using the heat sink manufacturing device.

[0025] Increasing the sequence number of the current processing surface of the above-mentioned mounting plate may include adding '1' to the sequence number of the current processing surface of the above-mentioned mounting plate using the control unit of the above-mentioned heat sink manufacturing device.

[0026] When the control unit of the heat sink manufacturing device stores in advance the design thickness, the design height, and the design pitch in the image pitch of the second heat sink fins of the heat sink fin cluster heat sink, checking whether an error occurs in the heat sink fin cluster heat sink is performed by photographing the heat sink fin cluster heat sink using a camera of the heat sink manufacturing device, and receiving the photographed image of the heat sink fin cluster heat sink from the camera in the control unit of the heat sink manufacturing device, extracting the image thickness, the image height, and the image pitch of the second heat sink fin from the photographed image of the heat sink fin cluster heat sink in the control unit of the heat sink manufacturing device, and comparing the image thickness, the image height, the image pitch, and the design thickness, the design height, and the design pitch in the control unit of the heat sink manufacturing device.

[0027] If the image thickness, the image height, and the image pitch are different from the design-provided thickness, the design-provided height, and the design-provided pitch, the step (a) may include moving to the step (c) and performing the step (d).

[0028] If the image thickness, the image height, and the image pitch are the same as the design-provided thickness, the design-provided height, and the design-provided pitch, the step (a) may include moving on to the step (d) and performing the step (d).

[0029] The above sample mounting portion has a motor and a mounting base that is linked to the rotation of the rotation shaft of the motor, and the mounting base may be formed as a polygon having three or more angles when viewed from one side of the mounting base.

[0030]

[0031] The method of using the heat sink manufacturing device according to the present invention is as follows:

[0032] Having a base and a slide which are positioned perpendicular to each other, and a sample holder and a cutting mechanism which slide along the base and the slide,

[0033] Using the control unit of the heat sink manufacturing device, adjust the inclination of the mounting plate through the motor in the sample mounting section,

[0034] The thickness and processing shape of the heat sink fins in the heat sink cluster heat sink are measured and photographed using the thickness sensor and camera of the heat sink manufacturing device,

[0035] By using the control unit of the heat sink manufacturing device, the positions of the mounting plate before and after rotation are linked to the coordinate transformation formula even though the positions of the mounting plate before and after rotation are different.

[0036] Before or after the mounting of a heat-dissipating object, the user's intervention can be minimized in measuring and adjusting the inclination of the mounting plate in the sample mounting section, and when determining whether there is an error in the processed shape of the heat-dissipating fin and the shape of the cell system, the user's intervention can be minimized in measuring the thickness, height, and pitch of the heat-dissipating fin in the heat-dissipating fin cluster heat-dissipating plate.

[0037] Figure 1 is a flowchart explaining a method of using a heat sink manufacturing device according to the present invention.

[0038] Fig. 2 is a perspective view showing a heat sink manufacturing device according to the present invention.

[0039] Fig. 3 is a perspective view showing a sample mounting portion in the heat sink manufacturing device of Fig. 2.

[0040] Fig. 4 is a side view showing the positional relationship between the sample mounting portion and the cutting mechanism portion during operation of the heat sink manufacturing device of Fig. 2.

[0041] FIG. 5 is a side view showing the positional relationship between the mounting plate, the heat sink fin partial density heat sink, and the cutting tool during the preliminary cutting process during the operation of the heat sink manufacturing device of FIG. 2.

[0042] Fig. 6 is a side view showing the positional relationship between the mounting plate, the heat sink cluster heat sink, and the cutting tool during cutting processing during operation of the heat sink manufacturing device of Fig. 2.

[0043] Fig. 7 is an image showing the positional relationship between the first heat dissipation substrate, the first heat dissipation fin, and the cutting tool in the preliminary cutting processing of Fig. 5.

[0044] Fig. 8 is a cross-sectional view showing two rectangular coordinate systems before and after rotation of the mounting plate in the cutting process of Fig. 6.

[0045] Fig. 9 is a perspective view showing a first modified example of the heat sink manufacturing device of Fig. 2.

[0046] Fig. 10 is a perspective view showing a second modified example of the heat sink manufacturing device of Fig. 2.

[0047] Fig. 11 is a perspective view showing a third modified example of the heat sink manufacturing device of Fig. 2.

[0048] The detailed description of the present invention described above refers to the accompanying drawings, which illustrate specific embodiments in which the present invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention, while different from each other, are not necessarily mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the present invention. Furthermore, it should be understood that the positions or arrangements of individual components within each disclosed embodiment may be modified without departing from the spirit and scope of the present invention. Accordingly, the following detailed description is not intended to be limiting, and the scope of the present invention, if properly described, is limited only by the appended claims, along with the full scope of equivalents to which such claims are entitled. Like reference numerals in the drawings designate the same or similar functions throughout, and lengths, areas, thicknesses, and other shapes may be exaggerated for convenience.

[0049] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings so that a person having ordinary skill in the art to which the present invention pertains can easily practice the present invention.

[0050] FIG. 1 is a flowchart explaining a method of using a heat sink manufacturing device according to the present invention, FIG. 2 is a perspective view showing a heat sink manufacturing device according to the present invention, and FIG. 3 is a perspective view showing a sample mounting portion in the heat sink manufacturing device of FIG. 2.

[0051] FIG. 4 is a side view showing the positional relationship between the sample mounting portion and the cutting mechanism portion during operation of the heat sink manufacturing device of FIG. 2, and FIG. 5 is a side view showing the positional relationship between the mounting portion, the heat sink fin partial density heat sink, and the cutting tool during preliminary cutting processing during operation of the heat sink manufacturing device of FIG. 2.

[0052] FIG. 6 is a side view showing the positional relationship between the mounting plate, the heat dissipation cluster heat dissipation plate, and the cutting tool during the cutting process during the operation of the heat dissipation plate manufacturing device of FIG. 2, and FIG. 7 is an image showing the positional relationship between the first heat dissipation substrate, the first heat dissipation fin, and the cutting tool during the preliminary cutting process of FIG. 5.

[0053] Additionally, Fig. 8 is a cross-sectional view showing two rectangular coordinate systems before and after rotation of the mounting plate in the cutting process of Fig. 6.

[0054] Referring to FIGS. 1 to 8, a method of using a heat sink manufacturing device according to the present invention is performed by processing a heat sink-only object to manufacture the heat sink-only object into a heat sink fin cluster heat sink.

[0055] To this end, the method of using the heat sink manufacturing device is as follows: (a) setting preliminary processing conditions in the heat sink manufacturing device (72) (S1), (b) using the heat sink manufacturing device (72), performing preliminary cutting processing on the heat sink-only target (81) on the sample mounting portion (32 in FIG. 2) based on the preliminary processing conditions (S2),

[0056] (d) Setting processing conditions in the heat sink manufacturing device (72) (S3), (e) Rotating the sample mounting portion (32) based on the processing conditions using the heat sink manufacturing device (72) (S4), (f) Performing zero point adjustment of the sample mounting portion (32) using the heat sink manufacturing device (72) (S5),

[0057] (S6) Using a heat sink manufacturing device (72), cutting is performed on a heat sink-only target object (81) based on processing conditions, and (S7) using a heat sink manufacturing device (72), it includes checking whether the final processing surface of the sample mounting portion (32) has been reached.

[0058] Here, the above cutting process turns the heat dissipation-only object (81) into a heat dissipation fin cluster heat dissipation plate (98).

[0059] When the above heat sink manufacturing device (72) includes, considering FIGS. 2 and 3, a base (10) that is horizontally long and located at the lower side of the heat sink manufacturing device (72), a sample mounting portion (32) that slides along the base (10) on the base (10), a slide (40) that is vertically long and located with respect to the base (10) at the upper side of the heat sink manufacturing device (72), and a cutting mechanism portion (60) that slides along the slide (40),

[0060] The sample mounting portion (32) and the cutting mechanism portion (60), considering FIGS. 2 and 4, are gathered around or moved away from the edge between the base (10) and the slide (40) during the operation of the heat sink manufacturing device (72). When the sample mounting portion (32) has a motor (21), and a polygonal (e.g., square) mounting base (23) that is linked to the rotation (R) of the rotation axis in the motor (21), considering FIG. 3,

[0061] Setting the above preliminary processing conditions (S1) includes, considering FIGS. 2 and 3, positioning a heat-radiating target (81) on a mounting plate (23), inputting the condition probe thickness, the design drawing-provided pitch, the design drawing-provided height, the condition probe compression ratio, and the total number of condition probe pins into a user interface (not shown in the drawing) of a heat sink manufacturing device (72), and, considering FIGS. 4 and 5, tilting the mounting plate (23) at a first angle (θ1) with respect to the base plate (10) based on the condition probe thickness (t1), the design drawing-provided pitch (p), and the condition probe compression ratio (ε1) using a control unit (not shown in the drawing) of the heat sink manufacturing device (72).

[0062] The above condition probe thickness (t1) is, in FIG. 5, a one-time movement distance of the cutting mechanism (60) on the slide (40). The pitch (p) provided in the design drawing is, in FIG. 5, a one-time movement distance of the sample mounting portion (32) on the base (10). The above condition probe thickness (t1) and condition probe compression ratio ε1 are obtained from usage experience data of the heat sink manufacturing device (72).

[0063] The above first angle (θ1), considering Fig. 5, is an angle extraction formula in the operation program of the control unit of the heat sink manufacturing device (72).

[0064] θ1 = arctan(t1 / p / ε1)

[0065] (where t1 is the thickness of the condition probe, p is the pitch provided in the design drawing, and ε1 is the compression ratio of the condition probe)

[0066] is derived from.

[0067] Next, in Fig. 2 or Fig. 3, when the sample mounting portion (32) has a mounting plate (23), the cutting tool (55) is mounted on the cutting mechanism portion (60), and the condition probe thickness (t1) of the spare heat dissipation fin (85), the design drawing-provided pitch (p), the design drawing-provided height (h), the condition probe compression ratio (ε1), and the condition probe total pin count (not shown in the drawing) are input to the user interface of the heat dissipation plate manufacturing device (72),

[0068] Performing the above preliminary cutting processing (S2) includes, considering FIGS. 4 and 5, using a control unit of a heat sink manufacturing device (72), assembling a sample mounting portion (32) and a cutting mechanism portion (60) around an edge between a base (10) and a slide (40), and using the control unit repeatedly bringing a cutting tool (55) into contact with a heat sink-only target object (81) of the mounting portion (23) while cutting a part of a processing area of ​​the heat sink-only target object (81) by the number of condition probe pins to produce a heat sink (94) having a partial heat sink pin density.

[0069] Next, considering FIGS. 4 and 5, when a heat dissipation fin partial density heat dissipation plate (94) is made from a heat dissipation-only object (81) on the mounting base (23) with a mounting base (23) on the sample mounting portion (32) and a cutting tool (55) on the cutting mechanism portion (60),

[0070] Setting the above processing conditions (S3), considering FIGS. 4 to 7, is performed by bringing the cutting tool (55) into contact with the individual first heat dissipation fins (85) among the first heat dissipation fins (85) positioned on the first heat dissipation substrate (83) in the heat dissipation fin partially dense heat dissipation plate (94), and using a thickness sensor (not shown in the drawing) of the heat dissipation plate manufacturing device (72), measuring the thickness (t2) of the individual first heat dissipation fins (85) among the first heat dissipation fins (83) in the heat dissipation fin partially dense heat dissipation plate (94).

[0071] The penetration depth (d) of the tip edge of the cutting tool (55) under the individual first heat dissipation fin (85) is measured between the first heat dissipation substrate (83) and the individual first heat dissipation fin (85) using the thickness sensor of the heat dissipation manufacturing device (72), and the thickness (t2) of the individual first heat dissipation fin (85) and the penetration depth (d) of the tip edge are supplied as numerical values ​​from the thickness sensor in the control unit of the heat dissipation manufacturing device (72) to obtain the compression ratio (ε2) of the heat dissipation-only object (81).

[0072] The above compression ratio (ε2) is

[0073] In the control unit of the heat sink manufacturing device (72), the compression ratio extraction calculation formula in the calculation program is

[0074] ε2 = t2 / d

[0075] (where t2 is the thickness of the individual first heat dissipation fin, d is the penetration depth of the tip edge, and ε2 is the compressibility of the heat dissipation-only object.)

[0076] is derived from.

[0077] In addition, setting the processing conditions (S3) further includes taking a picture of the mounting plate (23) using a camera (not shown in the drawing) of the heat sink manufacturing device (72), and receiving the captured image of the mounting plate (23) from the camera in the control unit of the heat sink manufacturing device (72) to store the total number of processing surfaces of the mounting plate (23) as a numerical value. In this case, the total number of processing surfaces of the mounting plate (23) is 4. The control unit of the heat sink manufacturing device (72) can determine the processing order according to the rotation (R) direction of the total number of processing surfaces of the mounting plate (23).

[0078] Next, considering FIGS. 4 to 7, when the sample mounting portion (32) has a mounting plate (23), the cutting tool (55) is mounted on the cutting mechanism portion (60), and the thickness (t2) of the individual first heat dissipation fin (85) and the penetration depth (d) of the cutting tool (55) are numerically supplied from the control portion of the heat dissipation plate manufacturing device (72) to obtain the compression ratio (ε2) of the heat dissipation-only target object (81),

[0079] Rotating the sample mounting portion (32) (S4) includes tilting the mounting portion (23) at a second angle (θ2) based on the thickness (t2) of the first heat dissipation fin (85) and the compression ratio (ε2) of the heat dissipation-only object (81) together with the pitch (p) provided by the design drawing and the height (h) provided by the design drawing, when the control portion of the heat dissipation manufacturing device (72) performs step (a), considering FIGS. 5 and 6.

[0080] The above second angle (θ2), considering Fig. 6, is an angle extraction formula in the operation program of the control unit of the heat sink manufacturing device (72).

[0081] θ2 = arctan(t2 / p / ε2)

[0082] (Where, t2; thickness of the first heat dissipation fin, p; pitch provided in the design drawing, ε2; compression ratio of the heat dissipation-only object)

[0083] is derived from.

[0084] Here, when the mounting plate (23) is tilted at a second angle (θ2) using the control unit of the heat sink manufacturing device (72), the zero point adjustment is, considering FIG. 8, when the control unit of the heat sink manufacturing device (72) reads one point as (x, y) in the XY rectangular coordinate system that divides the mounting plate (23) into four parts before tilting at the second angle (θ2), and reads one point as (x', y') in the X'-Y' rectangular coordinate system that divides the mounting plate (23) into four parts after tilting at the second angle (θ2), and confirms the 'θ3' movement of the X'-Y' rectangular coordinate system with respect to the XY rectangular coordinate system by matching the origins of the XY rectangular coordinate system and the X'-Y' rectangular coordinate system,

[0085] Using the control unit of the above heat sink manufacturing device, two coordinate transformation formulas based on trigonometric functions are created through a calculation program.

[0086] x'= xcos(θ3) - ysin(θ3)

[0087] y' = xsin(θ3) + ycos(θ3)

[0088] Synchronize the X'-Y' rectangular coordinate system to the XY rectangular coordinate system.

[0089] Here, the control unit of the heat sink manufacturing device (72) can use a coordinate transformation formula to correct or set the positional relationship between the mounting plate (23) and the cutting tool (55) on the mounting plate (23), the moving distance of the cutting tool (55) with respect to the mounting plate (23), or the size of a structure (e.g., a second heat sink fin) to be formed thereafter on the mounting plate (23).

[0090] Next, considering FIGS. 4 to 6, the sample mounting portion (32) has a mounting plate (23),

[0091] When the cutting tool (55) is provided in the cutting mechanism (60) and the heat dissipation fin partial density heat dissipation plate (94) is provided on the mounting plate (23),

[0092] Performing the above cutting process (S6) is, considering FIGS. 4 to 6,

[0093] It includes forming a heat sink cluster heat sink (98) from the heat sink cluster heat sink (94) by repeatedly contacting a cutting tool (55) to the heat sink cluster heat sink (94) using a control unit of a heat sink manufacturing device (72) to cut the remaining processing area of ​​the first heat sink substrate (63) from the heat sink cluster heat sink (94). The heat sink cluster heat sink (98) has second heat sink fins (89) on a second heat sink substrate (87) in FIG. 6.

[0094] In contrast, considering FIGS. 3 to 6, when the sample mounting portion (32) has a mounting base (23), the cutting tool (55) is in the cutting mechanism portion (60), and another heat dissipation-only object (81) is in the mounting base (23) next to the heat dissipation fin-dense heat dissipation plate (94).

[0095] Performing the above cutting process (S6), considering FIGS. 3 to 6, includes repeatedly contacting the cutting tool (55) to the heat-dissipating object (81) using the control unit of the heat-dissipating object manufacturing device (72) to cut the processing area of ​​the heat-dissipating object (91) to form the heat-dissipating object (81) into a heat-dissipating fin cluster heat-dissipating plate (98). The heat-dissipating fin cluster heat-dissipating plate (98) has second heat-dissipating fins (89) on a second heat-dissipating substrate (87).

[0096] Next, checking whether the final processing surface of the sample mounting portion (32) has been reached (S7) includes, considering FIGS. 3 and 6, comparing the number of rotations of the mounting portion (23) and the total number of processing surfaces of the mounting portion (23) using the control unit of the heat dissipation plate manufacturing device (72) in a state where a heat dissipation fin cluster heat dissipation plate (98) is formed on the mounting portion (23).

[0097] Here, if the number of rotations of the mounting plate (23) and the total number of processing surfaces of the mounting plate (23) are the same, the method of using the heat sink manufacturing device includes terminating the operation of the heat sink manufacturing device (72) in FIG. 1.

[0098] In contrast, if the number of rotations of the mounting plate (23) is smaller than the total number of processing surfaces of the mounting plate (23), the method of using the heat sink manufacturing device includes moving from step (4) to the subsequent step using the control unit of the heat sink manufacturing device (72) in FIG. 1.

[0099] The above subsequent steps include, in Fig. 1, (a) increasing the sequence number of the current processing surface of the mounting plate using the heat sink manufacturing device (S8), and (b) checking whether an error occurs in the heat sink fin cluster heat sink using the heat sink manufacturing device (S9). Increasing the sequence number of the current processing surface of the mounting plate (23) (S8) includes adding '1' to the sequence number of the current processing surface of the mounting plate (23) using the control unit of the heat sink manufacturing device (72).

[0100] Next, considering FIGS. 4 and 6, when the control unit of the heat sink manufacturing device (72) stores in advance the design thickness, design height, and design pitch for the image pitch of the second heat sink fins (89) of the heat sink fin cluster heat sink (98),

[0101] Checking whether an error occurs in the above-mentioned heat sink fin cluster heat sink (S9) is, considering FIGS. 4 and 6, using a camera (not shown in the drawing) of a heat sink manufacturing device (92), photographing the heat sink fin cluster heat sink (98), and receiving the photographed image of the heat sink fin cluster heat sink (98) from the camera in the control unit of the heat sink manufacturing device (72), extracting the image thickness, image height, and image pitch of the second heat sink fin (98) from the photographed image of the heat sink fin cluster heat sink (98) in the control unit of the heat sink manufacturing device (72), and comparing the image thickness, image height, and image pitch with the design thickness, design height, and design pitch in the control unit of the heat sink manufacturing device (72).

[0102] Here, if the image thickness and the image height and the image pitch are different from the design-provided thickness and the design-provided height and the design-provided pitch, the method of using the heat sink manufacturing device includes moving from step (a) to step (c) in Fig. 1 and performing step (c). Alternatively, if the image thickness and the image height and the image pitch are the same as the design-provided thickness and the design-provided height and the design-provided pitch, the method of using the heat sink manufacturing device includes moving from step (a) to step (d) in Fig. 1 and performing step (d).

[0103] FIG. 9 is a perspective view showing a first modified example of the heat sink manufacturing device of FIG. 2, FIG. 10 is a perspective view showing a second modified example of the heat sink manufacturing device of FIG. 2, and FIG. 11 is a perspective view showing a third modified example of the heat sink manufacturing device of FIG. 2.

[0104] Referring to FIGS. 9 to 11, the heat sink manufacturing device (72) may be replaced with a heat sink manufacturing device (74 or 76 or 78) according to the first modified example, the second modified example, or the third modified example. In the heat sink manufacturing device (74 or 76 or 78), the sample mounting portion (34 or 36 or 38) has a motor (21), and a mounting base (25 or 27 or 29) that is linked to the rotation of the rotation shaft in the motor (21). Here, the mounting base (25 or 27 or 29) may be formed as a polygon having three or more angles when viewed from one side of the mounting base (25 or 27 or 29).

[0105]

Claims

1. A method of using a heat sink manufacturing device for processing a heat sink-only object and manufacturing the heat sink-only object into a heat sink fin cluster heat sink, (a) Setting preliminary processing conditions in the above heat sink manufacturing device, (I) Using the above heat sink manufacturing device, a test is conducted based on the above preliminary processing conditions. Preliminary cutting processing is performed on the heat dissipation-only target object on the ryo fixing portion, (c) Setting processing conditions in the above heat sink manufacturing device, (a) Using the above heat sink manufacturing device, the above process is performed based on the above processing conditions. Rotate the Ryo anchorage, (b) Perform zero point adjustment of the sample mounting portion using the above heat sink manufacturing device, (b) Using the above heat sink manufacturing device, the above heat sink is manufactured based on the above processing conditions. Perform cutting processing on a heat-only target object, (a) Including checking whether the final processing surface of the sample mounting portion has been reached using the above heat sink manufacturing device, The above cutting process is, A method of using a heat sink manufacturing device to make the above heat-dissipation-only object into the above heat sink fin cluster heat sink.

2. In paragraph 1, The above heat sink manufacturing device, A base plate positioned horizontally and elongated on the lower side of the above heat sink manufacturing device; The sample mounting portion sliding along the base on the base; A slider positioned vertically and elongated relative to the base plate on the upper side of the heat sink manufacturing device; and When including a cutting mechanism that slides along the above slide, The above sample mounting portion and the above cutting mechanism portion, A method of using a heat sink manufacturing device, wherein the heat sink manufacturing device is driven such that the heat sink is gathered around or moves away from an edge between the base and the slide.

3. In paragraph 2, The above sample mounting portion, When the motor has a polygonal mounting plate that is linked to the rotation of the rotation axis of the motor, Setting the above preprocessing conditions is as follows: Position the heat dissipation-only object on the above-mentioned mounting plate, Enter the condition probe thickness, design drawing provided pitch, design drawing provided height, condition probe compression ratio, and condition probe total number of pins into the user interface of the above heat sink manufacturing device, A method of using a heat sink manufacturing device, comprising: using a control unit of the heat sink manufacturing device to tilt the mounting base at a first angle with respect to the base base based on the condition probe thickness, the design drawing provided pitch, and the condition probe compression ratio.

4. In paragraph 3, The above condition probe thickness is, The distance of one movement of the cutting mechanism on the above slide, The pitch provided in the above design drawings is, The distance of one movement of the sample mounting portion on the above base, The above condition probe thickness and the above condition probe compression ratio are, A method of using a heat sink manufacturing device, obtained from usage experience data of the above heat sink manufacturing device.

5. In paragraph 3, The above first angle is, In the control unit of the above heat sink manufacturing device, the angle extraction calculation formula in the calculation program is, θ1 = arctan(t1 / p / ε1) (where t1 is the thickness of the condition probe, p is the pitch provided in the design drawing, and ε1 is the compression ratio of the condition probe) A method of using a heat sink manufacturing device derived from .

6. In paragraph 2, Having a mounting plate in the above sample mounting portion, Having a cutting tool in the above cutting mechanism, When the condition probe thickness and design drawing provided pitch of the spare heat sink fins and the design drawing provided height and the condition probe compression ratio and the condition probe total number of fins are input into the user interface of the above heat sink manufacturing device, Performing the above preliminary cutting process is: Using the control unit of the above heat sink manufacturing device, gather the sample mounting portion and the cutting mechanism portion around the edge between the base and the slide, A method of using a heat sink manufacturing device, comprising: repeatedly contacting the cutting tool with the heat-dissipation-only target object of the mounting plate using the above control unit; cutting a portion of the processing area of ​​the heat-dissipation-only target object with the number of condition probe pins to produce a heat sink with a partial density of heat sink pins.

7. In paragraph 2, Having a mounting plate in the above sample mounting portion, Having a cutting tool in the above cutting mechanism, When making a heat dissipation fin-partially dense heat dissipation plate from the heat dissipation-only target object on the above-mentioned mounting plate, Setting the above processing conditions is as follows: In the above heat dissipation fin partial density heat dissipation plate, the cutting tool is brought into contact with an individual first heat dissipation fin among the first heat dissipation fins positioned on the first heat dissipation substrate, Using a thickness sensor of the above heat sink manufacturing device, the thickness of the first individual heat sink fin among the first heat sink fins in the heat sink partially packed with heat sink fins is measured, Using the thickness sensor of the heat sink manufacturing device, the penetration depth of the leading edge of the cutting tool is measured under the individual first heat sink fin between the first heat sink substrate and the individual first heat sink fin, A method of using a heat sink manufacturing device, wherein the control unit of the heat sink manufacturing device receives the thickness of the individual first heat sink fin and the penetration depth of the tip edge as numerical values ​​from the thickness sensor to obtain the compression ratio of the heat sink-only target object.

8. In paragraph 7, The above compression ratio is, In the control unit of the above heat sink manufacturing device, the compression ratio extraction calculation formula in the calculation program is, ε2 = t2 / d (where t2 is the thickness of the individual first heat dissipation fin, d is the penetration depth of the tip edge, and ε2 is the compressibility of the heat dissipation-only target.) A method of using a heat sink manufacturing device derived from .

9. In paragraph 7, Taking a picture of the mounting plate using the camera of the above heat sink manufacturing device, In the control unit of the above heat sink manufacturing device, the mounting plate is mounted on the camera. A method of using a heat sink manufacturing device, further comprising receiving a photographed image and storing the total number of processing surfaces of the mounting plate as a numerical value.

10. In paragraph 2, Having a mounting plate in the above sample mounting portion, Having a cutting tool in the above cutting mechanism, When the control unit of the above heat sink manufacturing device provides the thickness of each first heat sink fin and the penetration depth of the cutting tool's tip edge as numerical values ​​to obtain the compression ratio of the heat sink-only target object, Rotating the above sample mounting portion, In the control unit of the above heat sink manufacturing device, when performing the step (a), the design drawing provision pitch and design drawing provision height have already been input. A method of using a heat sink manufacturing device, comprising: using the control unit of the heat sink manufacturing device to tilt the mounting base at a second angle based on the thickness of the first heat sink fin and the compressibility of the heat sink-only object together with the pitch provided in the design drawing.

11. In Article 10, The second angle above is, In the control unit of the above heat sink manufacturing device, the angle extraction calculation formula in the calculation program is, θ2 = arctan(t2 / p / ε2) (Where, t2; thickness of the first heat dissipation fin, p; pitch provided in the design drawing, ε2; compression ratio of the heat dissipation-only object) A method of using a heat sink manufacturing device derived from .

12. In paragraph 2, When the control unit of the heat sink manufacturing device is used to tilt the mounting plate at a second angle, The above zero point adjustment is, In the control unit of the heat sink manufacturing device, when reading a point as (x, y) in the XY rectangular coordinate system dividing the mounting plate into four parts before tilting it to the second angle, and reading a point as (x', y') in the X'-Y' rectangular coordinate system dividing the mounting plate into four parts after tilting it to the second angle, and making the origins of the XY rectangular coordinate system and the X'-Y' rectangular coordinate system coincide, and confirming the 'θ3' movement of the X'-Y' rectangular coordinate system with respect to the XY rectangular coordinate system, Using the control unit of the above heat sink manufacturing device, two coordinate transformation formulas based on trigonometric functions are generated through a calculation program. x'= xcos(θ3) - ysin(θ3) y' = xsin(θ3) + ycos(θ3) A method of using a heat sink manufacturing device, which synchronizes the X'-Y' rectangular coordinate system to the XY rectangular coordinate system.

13. In paragraph 2, Having a mounting plate in the above sample mounting portion, Having a cutting tool in the above cutting mechanism, When the heat sink has a partially dense heat sink fin on the above-mentioned mounting plate, Performing the above cutting process is: Using the control unit of the above heat sink manufacturing device, the cutting tool is repeatedly brought into contact with the heat sink partially densely packed with heat sink fins to form the heat sink partially densely packed with heat sink fins into a heat sink cluster heat sink by cutting the remaining processing area of ​​the first heat sink substrate in the heat sink partially densely packed with heat sink fins. The above radiator fin cluster radiator is, A method of using a heat sink manufacturing device having second heat sink fins on a second heat sink substrate.

14. In paragraph 2, Having a mounting plate in the above sample mounting portion, Having a cutting tool in the above cutting mechanism, When having another heat dissipation-only object next to the heat dissipation fin-partially densely packed heat dissipation plate on the above-mentioned mounting base, Performing the above cutting process is: It includes forming the heat dissipation-only object into a heat dissipation fin cluster heat dissipation object by repeatedly contacting the cutting tool to the heat dissipation fin cluster heat dissipation object using the control unit of the heat dissipation plate manufacturing device to cut the processing area of ​​the heat dissipation-only object. The above radiator fin cluster radiator is, A method of using a heat sink manufacturing device having second heat sink fins on a second heat sink substrate.

15. In paragraph 2, To check whether the final processing surface of the above sample mounting part has been reached, In a state where a heat dissipation fin cluster heat dissipation plate is formed on the above-mentioned mounting plate, A method of using a heat sink manufacturing device, comprising comparing the rotation number history of the mounting plate and the total number of processing surfaces of the mounting plate using a control unit of the heat sink manufacturing device.

16. In paragraph 15, If the number of rotations of the above-mentioned anchor and the total number of the above-mentioned processing surfaces of the above-mentioned anchor are equal, A method of using a heat sink manufacturing device, comprising terminating operation of the heat sink manufacturing device.

17. In paragraph 15, If the number of rotations of the above-mentioned anchor is smaller than the total number of the above-mentioned processing surfaces of the above-mentioned anchor, A method of using a heat sink manufacturing device, comprising moving from the step (a) to a subsequent step using the control unit of the heat sink manufacturing device.

18. In paragraph 17, The above subsequent steps are: (A) Using the above heat sink manufacturing device, the current processing surface number of the mounting plate is increased, (Self) A method of using a heat sink manufacturing device, comprising: using the heat sink manufacturing device to check whether an error occurs in the heat sink fin cluster heat sink.

19. In paragraph 18, Increasing the above sequence number of the above current processing surface of the above anchorage is A method of using a heat sink manufacturing device, comprising adding '1' to the sequence number of the current processing surface of the mounting plate using the control unit of the heat sink manufacturing device.

20. In paragraph 18, When the control unit of the above heat sink manufacturing device stores in advance the design thickness, design height and design pitch for the image pitch of the second heat sink fins of the heat sink fin cluster, To check whether there is an error in the above heat sink fin cluster heat sink, Using the camera of the above heat sink manufacturing device, the above heat sink fin cluster heat sink is photographed, The control unit of the above heat sink manufacturing device receives a photographed image of the heat sink fin cluster heat sink from the camera, In the control unit of the above heat sink manufacturing device, the image thickness, image height and image pitch of the second heat sink fin are extracted from the photographed image of the heat sink fin cluster heat sink, A method of using a heat sink manufacturing device, wherein the control unit of the heat sink manufacturing device compares the sizes of the image thickness, the image height, the image pitch, the design-provided thickness, the design-provided height, and the design-provided pitch.

21. In paragraph 20, If the above image thickness and the above image height and the above image pitch are different from the above design provided thickness and the above design provided height and the above design provided pitch, A method of using a heat sink manufacturing device, comprising moving from the above step (a) to the above step (d) and performing the above step (d).

22. In paragraph 20, If the above image thickness and the above image height and the above image pitch are equal to the above design provided thickness and the above design provided height and the above design provided pitch, A method of using a heat sink manufacturing device, comprising moving from the above step (a) to the above step (d) and performing the above step (d).

23. In paragraph 2, The above sample mounting portion is, A motor, and a mounting member that is coupled to the rotation of the shaft of the motor, The above anchorage is, A method of using a heat sink manufacturing device, wherein the device is formed of a polygon with three or more angles when viewed from one side of the above-mentioned mounting plate.

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