Cover and electronic device on which cover is mounted

Abstract

An electronic device on which a cover is mounted, according to one embodiment of the present disclosure, comprises: an input device for receiving sound; and a housing having a first opening through which the sound transmitted to the input device passes, wherein the cover includes: a first cover hole formed at a position overlapping the first opening; an arrangement space which is formed between a first side surface of the housing having the first opening and a first cover side surface of the cover having the first cover hole, and in which an external device can be arranged; and a partition wall facing the first side surface and covering a portion of the arrangement space region, and the arrangement space region not covered by the partition wall can extend from the first opening to the first cover hole.

Description

Covers and electronic devices with covers

[0001] The present disclosure relates to a cover and an electronic device equipped with the cover.

[0002] An electronic device (e.g., a portable electronic device) may be equipped with a cover (e.g., a protective cover). The cover may be positioned on the electronic device so as to surround the perimeter of the electronic device. The cover may serve to protect the electronic device from external impact.

[0003] The cover may include a space into which an external device (e.g., a digital pen) may be inserted. The cover may be mounted on the electronic device and the external device may be inserted and positioned within the cover.

[0004] The above information may be provided as background information to aid in understanding the present disclosure. None of the above is claimed to be prior art related to the present disclosure, nor can it be used to determine prior art.

[0005] An electronic device equipped with a cover according to one embodiment of the present disclosure may include a cover and an electronic device.

[0006] In one embodiment, the electronic device may include a housing having an input device for receiving sound and a first opening through which sound transmitted to the input device passes.

[0007] In one embodiment, the cover may include a first cover hole, a placement space, and a bulkhead.

[0008] In one embodiment, the first cover hole may be formed at a position overlapping the first opening.

[0009] In one embodiment, a placement space is formed between a first side of a housing in which a first opening is formed and a first cover side of a cover in which a first cover hole is formed, and an external device can be placed therein.

[0010] In one embodiment, the bulkhead faces the first side and may cover a portion of the deployment space.

[0011] In one embodiment, an area of ​​the deployment space not covered by the bulkhead may extend from the first opening to the first cover hole.

[0012] A cover that can be mounted on an electronic device according to one embodiment of the present disclosure may include a first cover hole, a placement space, and a partition wall.

[0013] In one embodiment, the first cover hole may be formed at a position that overlaps a first opening of the electronic device through which sound transmitted to the electronic device passes.

[0014] In one embodiment, the placement space may include an external device.

[0015] In one embodiment, the bulkhead may face the first side of the electronic device and may cover a portion of the placement space.

[0016] In one embodiment, when the cover is mounted on the electronic device, an area of ​​the placement space not covered by the bulkhead may extend from the first opening to the first cover hole.

[0017] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0018] FIGS. 2A and 2B are perspective views of an electronic device according to one embodiment of the present disclosure.

[0019] FIGS. 3A and 3B are diagrams showing an electronic device according to one embodiment of the present disclosure.

[0020] FIGS. 4A, 4B, and 4C are drawings showing a cover and an electronic device equipped with the cover according to one embodiment of the present disclosure.

[0021] FIG. 5 is a drawing showing an external device according to one embodiment of the present disclosure.

[0022] FIGS. 6A and 6B are diagrams showing an electronic device, a cover, and an external device according to one embodiment of the present disclosure.

[0023] FIG. 7 is a drawing showing a groove formed in a cover according to one embodiment of the present disclosure.

[0024] FIGS. 8A and 8B are drawings showing a placement space and a groove according to one embodiment of the present disclosure.

[0025] FIGS. 9A and 9B are drawings showing a first home and a second home according to one embodiment of the present disclosure.

[0026] FIG. 10 is a drawing showing a second cover hole according to one embodiment of the present disclosure.

[0027] FIG. 11 is a drawing showing a second cover hole according to one embodiment of the present disclosure.

[0028] FIGS. 12a, 12b and 12c are diagrams showing a passage according to one embodiment of the present disclosure.

[0029] FIGS. 13A and 13B are diagrams showing an external device according to one embodiment of the present disclosure.

[0030] FIG. 14 is a drawing showing a protrusion according to one embodiment of the present disclosure.

[0031] FIG. 15 is a first graph showing the sound pressure level of sound measured in an input device according to one embodiment of the present disclosure.

[0032] FIG. 16 is a second graph showing the sound pressure level of sound generated from an audio output device according to one embodiment of the present disclosure.

[0033] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment. Referring to FIG. 1 , in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0034] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0035] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0036] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0037] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0038] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0039] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0040] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0041] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0042] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0043] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0044] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0046] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0047] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0048] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0049] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0050] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0051] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0052] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0053] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0054] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0055] FIG. 2A is a perspective view of the front of an electronic device (200) according to one embodiment of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device (200) of FIG. 2A according to one embodiment of the present disclosure.

[0056] The electronic device (200) of FIGS. 2A and 2B may be at least partially similar to the electronic device (101) of FIG. 1 or may include at least some of the components of the electronic device (101) of FIG. 1.

[0057] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may also refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0058] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0059] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0060] The display (201) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0061] The input device (203) may include a microphone. In some embodiments, the input device (203) may include multiple microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).

[0062] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (201) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0063] Camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0064] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0065] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element may provide a light source that is linked to the operation of the camera module (205), for example. The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0066] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device. Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). According to one embodiment, the display (201) and the camera module (205) The facing area may be formed as a transparent area having a certain transmittance as a part of the area displaying the content. In one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. This transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (201) may include an area having a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device.For example, in this case, the area of ​​the display (201) facing the sensor module may not require a perforated opening.

[0067] FIG. 3A and FIG. 3B are drawings showing an electronic device (300) according to one embodiment of the present disclosure.

[0068] FIG. 3a is a perspective view showing the front side of an electronic device (300) according to one embodiment. FIG. 3b is a perspective view showing the rear side of an electronic device (300) according to one embodiment.

[0069] The electronic device (300) illustrated in FIGS. 3A and 3B may refer to the electronic device (101) illustrated in FIG. 1, or may include at least some of the components of the electronic device (101) illustrated in FIG. 1.

[0070] The electronic device (300) illustrated in FIGS. 3a and 3b may refer to the electronic device (200) illustrated in FIGS. 2a and 2b, or may include at least some of the components of the electronic device (200) illustrated in FIGS. 2a and 2b.

[0071] In describing an electronic device (300) according to one embodiment of the present disclosure, the width direction of the electronic device (300) may mean the X-axis direction, and the length direction of the electronic device (300) may mean the Y-axis direction. The height direction of the electronic device (300) may mean the Z-axis direction.

[0072] Referring to FIGS. 3A and 3B, an electronic device (300) according to one embodiment may include a housing (310), a display (320), a key input device (333), and / or a camera module (335).

[0073] In one embodiment, the housing (310) may be substantially identical to the housing (210) of FIGS. 2A and 2B.

[0074] In one embodiment, the housing (310) may include a first side (310A), a second side (310B), and a side surface (310C) enclosing a space between the first side (310A) and the second side (310B).

[0075] In one embodiment, the housing (310) may refer to a structure forming a portion of a first side (310A), a second side (310B), and a side surface (310C).

[0076] In one embodiment, the side surface (310C) of the housing (310) may include a first side surface (311), a second side surface (312), a third side surface (313), and / or a fourth side surface (314). The second side surface (312) may be a side facing in an opposite direction to the first side surface (311). The fourth side surface (314) may be a side facing in an opposite direction to the third side surface (313). The first side surface (311), the second side surface (312), the third side surface (313), and the fourth side surface (314) may be formed separately or integrally.

[0077] In one embodiment, the housing (310) may form the exterior of the electronic device (300). In one embodiment, at least some of the components of the electronic device (300) may be arranged inside the housing (310).

[0078] In one embodiment, the display (320) may be disposed in the housing (310). For example, the display (320) may be disposed on a first side (310A) of the housing (310). Alternatively, the display (320) may be disposed such that at least a portion of it is exposed to the outside through the first side (310A) of the housing (310).

[0079] In one embodiment, the display (320) can visually present information to an external party (e.g., a user) of the electronic device (300). In one embodiment, the display (320) can include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the strength of a force generated by a touch.

[0080] In one embodiment, the electronic device (300) may include at least one key input device (333). The key input device (333) may be positioned on a side (310C) of the housing (310).

[0081] In one embodiment, the electronic device (300) may not include some or all of the plurality of key input devices (333). For example, in one embodiment, the key input device (333) may be implemented using a pressure sensor included in the display (320).

[0082] In one embodiment, the camera module (335) can capture still images and videos. According to one embodiment, the camera module (335) may include one or more lenses, image sensors, image signal processors, or flashes. In one embodiment, the camera module (335) may be exposed to the outside of the electronic device (300) on the second side (310B) of the housing (310).

[0083] FIGS. 4A, 4B and 4C are drawings showing a cover (400) and an electronic device (300) equipped with the cover (400) according to one embodiment of the present disclosure.

[0084] FIG. 4A is a drawing showing a cover (400) according to one embodiment. FIG. 4B is a drawing showing an electronic device (300) equipped with a cover (400) according to one embodiment. FIG. 4C is a drawing showing an external device hole (491) of an electronic device (300) equipped with a cover (400).

[0085] In describing a cover (400) according to one embodiment of the present disclosure, the width direction of the cover (400) may mean the X-axis direction, and the length direction of the cover (400) may mean the Y-axis direction. The height direction of the cover (400) may mean the Z-axis direction.

[0086] Referring to FIG. 4A, a cover (400) according to one embodiment may include a support surface (405), a cover upper surface (407), a side surface (410), a partition wall (420), a placement space (430), a groove (460), a protrusion (470), an external device hole (491), a port hole (495), a camera hole (497), and an input portion (498).

[0087] In one embodiment, the support surface (405) may mean a surface of the cover (400) that is substantially perpendicular to the height direction (e.g., Z-axis direction) of the cover (400).

[0088] In one embodiment, the support surface (405) and the cover side (410) may be formed substantially vertically. In one embodiment, the support surface (405) and the cover side (410) may be formed integrally.

[0089] In one embodiment, the cover side (410) may include a first cover side (411), a second cover side (412), a third cover side (413), and / or a fourth cover side (414).

[0090] In one embodiment, the cover (400) may include a partition wall (420). In one embodiment, the partition wall (420) may be formed to face the first cover side (411).

[0091] In one embodiment, the support surface (405), the cover side (410), and the partition wall (420) may form a seating space (408). The seating space (408) may be a space surrounded by the support surface (405), the cover side (410), and the partition wall (420).

[0092] In one embodiment, the electronic device (300, see FIG. 3A) may be placed in the mounting space (408) of the cover (400). When the electronic device (300, see FIG. 3A) is placed in the mounting space (408) of the cover (400), at least a portion of the support surface (405) may come into contact with a second surface (310B, see FIG. 3B) of the housing (310, see FIG. 3B) of the electronic device (300, see FIG. 3A).

[0093] In one embodiment, the cover (400) may include a placement space (430) in which an external device (500, see FIG. 5) may be placed. The external device (500, see FIG. 5) may be inserted through an external device hole (491) and placed in the placement space (430).

[0094] In one embodiment, the bulkhead (420) may serve to support an external device (500, see FIG. 5) inserted into the cover (400). The bulkhead (420) may support the external device (500, see FIG. 5) inserted into the cover (400) to maintain a fixed position.

[0095] In one embodiment, the deployment space (430) may be surrounded by a first cover side (411), a cover top surface (407), and a partition wall (420).

[0096] In one embodiment, the bulkhead (420) may be formed in a form in which at least a portion thereof is removed. For example, a portion of the bulkhead (420) facing the first cover side (411) may be removed.

[0097] In one embodiment, the partition wall (420) may be formed to cover only a portion of the placement space (430). For example, referring to FIG. 4, a length of the placement space (430) extending in the width direction of the cover (400) (e.g., in the X-axis direction) may be a first length (L1). A length of the partition wall (420) extending in the width direction of the cover (400) (e.g., in the X-axis direction) may be a second length (L2) that is smaller than the first length (L1). Only a portion of the placement space (430) may be covered by the partition wall (420), and the remaining portion may not be covered by the partition wall (420).

[0098] In one embodiment, an area of ​​the placement space (430) that is not covered by the bulkhead (420) may be exposed toward the settling space (408).

[0099] In one embodiment, a groove (460) may be formed on a portion of the surface surrounding the placement space (430). The groove (460) may be formed in a concave shape on a portion of the surface surrounding the placement space (430). The groove (460) may serve to expand the acoustic duct (AD, see FIG. 6b).

[0100] In one embodiment, a protrusion (470) may be formed in the placement space (430). The protrusion (470) may serve to fix the position of an external device (500, see FIG. 5) placed on the cover (400).

[0101] In one embodiment, the protrusion (470) may be formed in an area of ​​the placement space (430) that is not covered by the bulkhead (420).

[0102] Referring to FIG. 4B, a cover (400) may be mounted on the electronic device (300). The cover (400) may be mounted on the electronic device (300) so as to surround the second side (310B, see FIG. 3B) and the side surface (310C, see FIG. 3B) of the housing (310) of the electronic device (300).

[0103] In one embodiment, when a cover (400) is mounted on an electronic device (300), a first side (311, see FIG. 3b) of the housing (310) may be positioned facing the first cover side (411), and a second side (312, see FIG. 3b) of the housing (310) may be positioned facing the second cover side (412).

[0104] In one embodiment, when the cover (400) is mounted on the electronic device (300), the second side (310B, see FIG. 3B) of the housing (310) may face at least a portion of the support surface (405) of the cover (400).

[0105] Referring to FIG. 4B, an electronic device (300) according to one embodiment may include a connector hole (337). The connector hole (337) may accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device.

[0106] In one embodiment, a port hole (495) may be formed in the cover side (410). For example, the port hole (495) may be formed in the second cover side (412). Referring to FIG. 4B, the port hole (495) may be formed at a location corresponding to the connector hole (337) of the electronic device (300).

[0107] In one embodiment, when the cover (400) is mounted on the electronic device (300), the camera hole (497) may be positioned to correspond to the camera module (335, see FIG. 3B) of the electronic device (300). The camera module (335, see FIG. 3B) of the electronic device (300) may be exposed to the outside of the cover (400) through the camera hole (497).

[0108] In one embodiment, when the cover (400) is mounted on the electronic device (300), the input unit (498) can be positioned to correspond to a key input device (333, see FIG. 3A) of the electronic device (300). Pressure applied to the input unit (498) can be transmitted to the key input device (333, see FIG. 3A).

[0109] Referring to FIG. 4c, a cover (400) may be mounted on an electronic device (300). The cover (400) may be placed on the electronic device (300) so as to surround the periphery of the electronic device (300). The display (320) may be exposed to the outside of the electronic device (300) to which the cover (400) is mounted.

[0110] Referring to FIG. 4c, in one embodiment, an external device hole (491) may be formed in a portion of the cover (400). The external device hole (491) may include an opening shape so that an external device (500, see FIG. 5) may be inserted into the cover (400).

[0111] In one embodiment, the external device hole (491) may be formed to face the width direction (e.g., X-axis direction) of the cover (400). In one embodiment, the external device hole (491) may extend along the width direction (e.g., X-axis direction) of the cover (400) in a portion of the cover (400).

[0112] In one embodiment, an external device (500, see FIG. 5) can be inserted into the cover (400) through an external device hole (491). For example, the external device (500, see FIG. 5) can be inserted through the external device hole (491) in the width direction (e.g., X-axis direction) of the cover (400).

[0113] In one embodiment, an external device (500, see FIG. 5) can be detachably placed on the cover (400) through an external device hole (491).

[0114] FIG. 5 is a drawing showing an external device (500) according to one embodiment of the present disclosure.

[0115] An external device (500) according to one embodiment of the present disclosure may include a body (510) and / or a pen tip (520).

[0116] In one embodiment, the external device (500) may be a digital pen. For example, the external device (500) may be a digital pen that serves to transmit input by a user to an electronic device (300, see FIG. 3A).

[0117] In one embodiment, the body (510) may be formed to extend in one direction. The body (510) forms the exterior of the external device (500) and may serve as a housing that surrounds components of the external device (500).

[0118] In one embodiment, the pen tip (520) may be formed to protrude from the body (510). The pen tip (520) may include a dielectric tip. The pen tip (520) may come into contact with a display (320, see FIG. 3A) of an electronic device (300, see FIG. 3A).

[0119] In one embodiment, the external device (500) may be placed in a placement space (430, see FIG. 4A) of the cover (400, see FIG. 4A). For example, the external device (500) may be detachably placed in the cover (400, see FIG. 4A) through an external device hole (491, see FIG. 4A).

[0120] FIG. 6A and FIG. 6B are drawings showing an electronic device (300), a cover (400), and an external device (500) according to one embodiment of the present disclosure.

[0121] FIG. 6A is a drawing showing an electronic device (300), a cover (400), and an external device (500) according to one embodiment. FIG. 6A may be a drawing showing a state in which a cover (400) is mounted on an electronic device (300) and an external device (500) is placed on the cover (400).

[0122] FIG. 6b is a drawing showing an acoustic duct (AD) formed in a placement space (430) according to one embodiment.

[0123] FIGS. 6A and 6B may be drawings showing an electronic device (300), a cover (400), and an external device (500) viewed along line AA of FIG. 4B.

[0124] Referring to FIG. 6a, the electronic device (400) may include an input device (340).

[0125] In one embodiment, the input device (340) may include a microphone. The input device (340) may serve to receive sounds generated from outside the electronic device (300) and the cover (400).

[0126] In one embodiment, a first opening (360) may be formed in a first side (311) of the housing (310).

[0127] In one embodiment, the first opening (360) may include a first portion (361) and / or a second portion (362). The first portion (361) may be a formed portion formed on the surface of the first side (311). The second portion (362) may be a portion having a smaller width than the first portion (361) and extending in a direction toward the input device (340).

[0128] In one embodiment, the electronic device (300) may include a first conduit (365) extending toward the input device (340). The first conduit (365) may extend through the mechanism (380) of the electronic device (300) toward the input device (340).

[0129] In one embodiment, sound generated externally of the electronic device (300) may be transmitted to the input device (340) along the first opening (360) and the first conduit (365).

[0130] In one embodiment, when the cover (400) is mounted on the electronic device (300), the second side (310B) of the housing (310) may be positioned to face at least a portion of the support surface (405).

[0131] In one embodiment, the cover (400) may include a first cover hole (440). The first cover hole (440) may be formed on the first cover side (411).

[0132] In one embodiment, when the cover (400) is mounted on the electronic device (300), the first opening (360) and the first cover hole (440) may be positioned to be aligned with each other. For example, when viewed in the longitudinal direction of the cover (400) (e.g., the Y-axis direction), the first opening (360) and the first cover hole (440) may be positioned to overlap each other.

[0133] In one embodiment, the external device (500) may be placed in the placement space (430) of the cover (400).

[0134] Referring to FIGS. 6A and 6B, an acoustic conduit (AD) may be formed in the placement space (430). When an external device (500) is placed on the cover (400), the acoustic conduit (AD) may be formed around the external device (500). For example, the acoustic conduit (AD) may be formed in the placement space (430) located between the external device (430) and the support surface (405) and between the external device (430) and the top surface (407) of the cover. The acoustic conduit (AD) may be formed through the first cover hole (440), the periphery of the external device (500), the first opening (360), and the first conduit (365). Sound generated from the outside of the electronic device (300) and the cover (400) may travel through the acoustic conduit (AD) and be transmitted to the input device (340).

[0135] In one embodiment, the partition wall (420, see FIG. 4A) of the cover (400) may be formed so as not to overlap with the first opening (360). For example, the partition wall (420, see FIG. 4A) of the cover (400) may be formed so as not to overlap with the first portion (361) of the first opening (360). Since the partition wall (420, see FIG. 4A) of the cover (400) does not overlap with the first opening (360), the acoustic conduit (AD) connected to the first opening (360) may be relatively expanded.

[0136] FIG. 7 is a drawing showing a groove (460) formed in a cover (400) according to one embodiment of the present disclosure.

[0137] FIG. 7 may be a drawing showing an electronic device (300), a cover (400), and an external device (500) according to one embodiment, viewed along line AA of FIG. 4b.

[0138] In one embodiment, a groove (460) may be formed in at least a portion of the cover (400). The groove (460) may be formed in a portion of a surface surrounding an area of ​​the placement space (430) that is not covered by the bulkhead (420).

[0139] In one embodiment, the home (460) may be formed such that a portion of the cover (400) is finer than the other portion.

[0140] In one embodiment, the groove (460) may be formed in the support surface (405) and the first cover side (411). For example, the groove (460) may be formed to extend from the support surface (405) to the first cover hole (440) formed in the first cover side (411).

[0141] In one embodiment, a home (460) is formed and the size of the acoustic conduit (AD, see FIG. 6b) can be expanded. As the size of the acoustic conduit (AD, see FIG. 6b) is expanded, it may be easier for externally generated sounds to be transmitted to the input device (340) of the electronic device (300).

[0142] FIG. 8a and FIG. 8b are drawings showing a placement space (430) and a groove (460) according to one embodiment of the present disclosure.

[0143] FIG. 8A is a drawing showing a placement space (430) and a groove (460) of a cover (400) according to one embodiment. FIG. 8A may be a drawing of the groove (460) of the cover (400) according to one embodiment, viewed along line BB of FIG. 7.

[0144] FIG. 8b is a drawing showing a placement space (430) and a groove (560) of a cover (400) according to one embodiment. FIG. 8b may be a drawing that omits the electronic device (300, see FIG. 3a).

[0145] Referring to FIG. 8A, when a cover (400) is mounted on an electronic device (300), a first side (311) of the electronic device (300) may face a first cover side (411) of the cover (400). When the cover (400) is mounted on the electronic device (300), a first cover hole (440) formed on the first cover side (411) may be arranged to be aligned with a first opening (360) formed on the first side (311).

[0146] Referring to FIG. 8a, a groove (460) of a cover (400) according to one embodiment may extend at least partially between the first opening (360) and the first cover hole (440) when viewed in the height direction (e.g., Z-axis direction) of the cover (400).

[0147] Referring to FIG. 8A, the arrangement space (430) may include a first space (431) and / or a second space (432). The first space (431) may be an area of ​​the arrangement space (430) that is not covered by the partition wall (420). The second space (432) may be an area of ​​the arrangement space (430) that is covered by the partition wall (420).

[0148] Referring to FIG. 8A, a groove (460) of a cover (400) according to one embodiment may be formed in a first space (431). The groove (460) of the cover (400) may be formed in a fine shape as part of a support surface (405) surrounding the first space (431).

[0149] Referring to FIGS. 8A and 8B, the cover (400) may include a dummy hole (493). In one embodiment, the cover (400) may include a plurality of dummy holes (493). In one embodiment, the dummy holes (493) may be holes formed to convey an aesthetic feeling to a user of the cover (400).

[0150] In one embodiment, a plurality of dummy holes (493) may be formed in the first cover side (411) of the cover (400).

[0151] In one embodiment, a plurality of dummy holes (493) may be spaced apart from the first cover hole (440). For example, the plurality of dummy holes (493) may be spaced apart from the first cover hole (440) in the width direction (e.g., X-axis direction) of the cover (400), respectively.

[0152] Referring to FIG. 8B, the groove (660) of the cover (400) according to one embodiment may be formed in an expanded shape compared to the groove (460) of the cover (400) of FIG. 8A. For example, the groove (460) of FIG. 8A may have a first width (W1), and the groove (660) of FIG. 8B may have a second width (W2) that is longer than the first width (W1).

[0153] Referring to FIG. 8b, a groove (660) of a cover (400) according to one embodiment may be formed in a first space (431). The groove (660) of the cover (400) may be formed in a fine shape as part of a support surface (405) surrounding the first space (431).

[0154] Referring to FIG. 8B, the groove (660) of the cover (400) according to one embodiment may be formed to extend to at least one dummy hole (493). For example, when viewed in the height direction of the cover (400) (e.g., Z-axis direction), at least a portion of the groove (660) of the cover (400) may extend to a position where it overlaps with at least one dummy hole (493).

[0155] In one embodiment, a home (660) is formed and the size of the acoustic conduit (AD, see FIG. 6b) can be expanded. As the size of the acoustic conduit (AD, see FIG. 6b) is expanded, it may be easier for externally generated sounds to be transmitted to the input device (340, see FIG. 6b) of the electronic device (300, see FIG. 6b).

[0156] FIG. 9a and FIG. 9b are drawings showing a first groove (461) and a second groove (462) according to one embodiment of the present disclosure.

[0157] FIGS. 9A and 9B may be drawings showing an electronic device (300), a cover (400), and an external device (500) according to one embodiment, viewed along line AA of FIG. 4B.

[0158] In one embodiment, the home (460) may include a first home (461) and / or a second home (462).

[0159] Referring to FIG. 9a, a cover (400) according to one embodiment may include a first groove (461) and a second groove (462).

[0160] In one embodiment, the first groove (461) may be formed in a first direction (e.g., the negative Z-axis direction) with respect to the placement space (430). The second groove (462) may be formed in a second direction (e.g., the positive Z-axis direction) opposite to the first direction with respect to the placement space (430).

[0161] In one embodiment, the first groove (461) and the second groove (462) may be formed such that a portion of the surface of the cover (400) is formed in a fine shape compared to other portions.

[0162] In one embodiment, the first groove (461) may be formed in the support surface (405) and the first cover side surface (411). For example, the first groove (461) may be formed to extend from the support surface (405) to the first cover hole (440) formed in the first cover side surface (411).

[0163] In one embodiment, the second groove (462) may be formed on the cover upper surface (407) and the first cover side surface (411). For example, the second groove (462) may be formed to extend from the cover upper surface (407) to the first cover hole (440) formed on the first cover side surface (411).

[0164] In one embodiment, the first groove (461) and the second groove (462) are formed simultaneously, and the size of the acoustic conduit (AD, see FIG. 6b) can be expanded. As the size of the acoustic conduit (AD, see FIG. 6b) is expanded, it may be easier for sounds generated externally to be transmitted to the input device (340) of the electronic device (300).

[0165] Referring to FIG. 9B, the cover (400) according to one embodiment may include only the second groove (462). For example, the cover (400) according to one embodiment may not include the first groove (461) formed on the support surface (405), and may only include the second groove (462) formed on the cover upper surface (407).

[0166] FIG. 10 is a drawing showing a second cover hole (450) according to one embodiment of the present disclosure.

[0167] In one embodiment, the electronic device (300) may include an audio output device (350).

[0168] In one embodiment, the audio output device (350) may be a device that generates sound. For example, the audio output device (350) may include a speaker that generates sound.

[0169] In one embodiment, the electronic device (300) may include a second opening (370). The second opening (370) may be formed in a second side (312) of a housing (310) of the electronic device (300). Sound generated from the sound output device (350) may be transmitted to the outside of the electronic device (300) through the second opening (370).

[0170] In one embodiment, the electronic device (300) may include a second conduit (375) extending toward the audio output device (350). The second conduit (375) may be connected to the second opening (370) and may extend toward the audio output device (350).

[0171] In one embodiment, sound generated from the sound output device (350) may be transmitted to the outside of the electronic device (300) through the second conduit (375) and the second opening (370). For example, sound generated from the sound output device (350) may be transmitted through the second conduit (375) and the second opening (370) along the sound transmission path (AS).

[0172] In one embodiment, the cover (400) may include a second cover hole (450). The second cover hole (450) may be formed on a second cover side (412) of the cover (400).

[0173] In one embodiment, when the cover (400) is mounted on the electronic device (300), the second opening (370) of the electronic device (300) and the second cover hole (450) of the cover (400) may be positioned to be aligned with each other. For example, when viewed in the longitudinal direction of the cover (400) (e.g., the Y-axis direction), the second opening (370) and the second cover hole (450) may be positioned to overlap each other.

[0174] In one embodiment, a plurality of second cover holes (450) may be formed. The plurality of second cover holes (450) may be formed to be spaced apart from each other in the width direction (e.g., X-axis direction) of the cover (400).

[0175] In one embodiment, the second cover hole (450) may be positioned to face the second side (312) of the housing (310) in which the second opening (370) is formed.

[0176] In one embodiment, at least some of the second cover holes (450) among the plurality of second cover holes (450) may be formed to have a different length from the remaining some of the second cover holes (450). For example, the 2-2 cover hole (450-2) located at one end (e.g., the positive X-axis direction end) of the plurality of second cover holes (450) may be formed to be longer than the 2-1 cover hole (450-1) located at the other end (e.g., the negative X-axis direction end). For example, the 2-1 cover hole (450-1) may have a third length (L3) in the height direction (e.g., the Z-axis direction) of the cover (400), and the 2-2 cover hole (450-2) may have a fourth length (L4) longer than the third length (L3) in the height direction (e.g., the Z-axis direction) of the cover (400). In one embodiment, the third length (L3) may be approximately 3.5 to 4.0 mm. The fourth length (L4) may be approximately 5.0 to 5.5 mm.

[0177] In one embodiment, the length of the plurality of second cover holes (450) extending in the height direction (e.g., Z-axis direction) of the cover (400) may increase as it extends in the width direction (e.g., X-axis direction) of the cover (400). For example, referring to FIG. 10, the length of the second cover holes (450) may increase as the second cover holes (450) are positioned in the positive X-axis direction.

[0178] In one embodiment, when the length of the second cover hole (450) is increased, the acoustic performance of the electronic device (300) equipped with the cover (400) may be improved. For example, the sound tremor phenomenon measured in the electronic device (300) equipped with the cover (400) having the first cover hole (450) formed therein may be improved. The sound pressure level of the high-frequency band measured in the electronic device (300) equipped with the cover (400) having the first cover hole (450) formed therein may be improved.

[0179] FIG. 11 is a drawing showing a second cover hole (650) according to one embodiment of the present disclosure.

[0180] In one embodiment, the cover (400) may include one second cover hole (650). For example, referring to FIG. 11, one second cover hole (650) may be formed extending from the second cover side (412) of the cover (400).

[0181] In one embodiment, the second cover hole (650) may extend in the width direction (e.g., X-axis direction) and height direction (e.g., Z-axis direction) of the cover (400).

[0182] In one embodiment, the second cover hole (650) may be formed such that one end and the other end have different lengths. For example, referring to FIG. 11, the length by which one end (e.g., the positive X-axis direction end) of the second cover hole (650) extends in the height direction (e.g., the Z-axis direction) of the cover (400) may be longer than the length by which the other end (e.g., the negative X-axis direction end) of the second cover hole (650) extends in the height direction (e.g., the Z-axis direction) of the cover (400). For example, one end of the second cover hole (650) may have a fourth length (L4), and the other end of the second cover hole (650) may have a third length (L3) that is shorter than the fourth length (L4).

[0183] In one embodiment, the second cover hole (650) is formed so that the lengths of one end and the other end are different, and the size of the second cover hole (650) can be relatively expanded. For example, the size of the second cover hole (650) can be relatively expanded compared to a case where the lengths of both ends are formed to be the third length (L3).

[0184] In one embodiment, when the size of the second cover hole (650) is expanded, the acoustic performance of the electronic device (300) equipped with the cover (400) may be improved. For example, the sound tremor phenomenon measured in the electronic device (300) equipped with the cover (400) having the second cover hole (650) formed therein may be improved. The sound pressure level of the high-frequency band measured in the electronic device (300) equipped with the cover (400) having the second cover hole (650) formed therein may be improved.

[0185] FIGS. 12a, 12b and 12c are drawings showing passages (481, 482) according to one embodiment of the present disclosure.

[0186] In one embodiment, the electronic device (300) and the cover (400) may form passages (481, 482). For example, a portion of the cover (400) facing the first side (311) of the housing (310) may be spaced apart from the first side (311) of the housing (310), thereby forming passages (481, 482).

[0187] In one embodiment, the passages (481, 482) are connected to the placement space (430) and can be exposed to the outside of the electronic device (300) equipped with the cover (400).

[0188] In one embodiment, the passages (481, 482) may include a first passage (481) and / or a second passage (482).

[0189] Referring to FIG. 12A, a cover (400) according to one embodiment may form a first passage (481). In one embodiment, a cover upper surface (407) of the cover (400) may be formed to be spaced apart from a first side surface (311) of a housing (310) of an electronic device (300) by a predetermined length. For example, a portion of the cover upper surface (407) may be removed so that the cover upper surface (407) is spaced apart from the first side surface (311) by a predetermined length. The cover upper surface (407) may be spaced apart from the first side surface (311) by a predetermined length to form a first passage (481). The first passage (481) may be connected to a placement space (430) and may be exposed to the outside of an electronic device (300) having the cover (400) mounted thereon.

[0190] Referring to FIG. 12B, a cover (400) according to one embodiment may form a second passage (482). In one embodiment, a support surface (405) of the cover (400) may be formed to be spaced apart from a first side (311) of a housing (310) of an electronic device (300) by a predetermined length. For example, a portion of the support surface (405) may be removed so that the support surface (405) is spaced apart from the first side (311) by a predetermined length. The support surface (405) may be spaced apart from the first side (311) by a predetermined length to form a second passage (482). The second passage (482) may be connected to the placement space (430) and may be exposed to the outside of the electronic device (300) having the cover (400) mounted thereon.

[0191] Referring to FIG. 12C, a cover (400) according to one embodiment may form a first passage (481) and a second passage (482) at the same time. A portion of the cover upper surface (407) and the support surface (405) may be removed so that the cover upper surface (407) and the support portion (405) are spaced apart from the first side (311) by a predetermined length, thereby forming a first passage (481) and a second passage (482). The first passage (481) and the second passage (482) may be connected to the arrangement space (430) and may be exposed to the outside of the electronic device (300) on which the cover (400) is mounted.

[0192] In one embodiment, the passages (481, 482) may be formed in the form of holes in a portion of the cover (400). For example, the passages (481, 482) may be formed in the form of holes penetrating the support surface (405) and / or the cover upper surface (407).

[0193] In one embodiment, the passages (481, 482) may provide the effect of expanding the acoustic duct (AD) through which sound is transmitted. For example, since the passages (481, 482) are connected to the arrangement space (430) in which the acoustic duct (AD) is formed, the effect of expanding the acoustic duct (AD) may be provided. As the acoustic duct (AD) expands, externally generated sounds may be more easily transmitted to the input device (340) of the electronic device (300).

[0194] FIG. 13a and FIG. 13b are drawings showing an external device (500) according to one embodiment of the present disclosure.

[0195] FIG. 13a is a drawing showing an external device (500) including a passage hole (530) according to one embodiment. FIG. 13b is a drawing showing an external device (500) including a concave area (540) according to one embodiment.

[0196] An external device (500) according to one embodiment of the present disclosure may include a body (510) and / or a pen tip (520).

[0197] In one embodiment, the body (510) may form the exterior of the external device (500). At least some of the components of the external device (500) may be disposed on the body (510). The body (510) may be relatively long in one direction.

[0198] In one embodiment, a pen tip (520) may be formed at the end of the body (510). The pen tip (520) may contact the display (320) of the electronic device (300) and serve to transmit an input signal to the electronic device (300).

[0199] Referring to FIG. 13a, an external device (500) according to one embodiment may include a passage hole (530). The passage hole (530) may be formed by penetrating a portion of the body (510).

[0200] In one embodiment, the pass-through hole (530) may be formed at a position corresponding to the first opening (360, see FIG. 6A) of the electronic device (300, see FIG. 6A) and the first cover hole (440, see FIG. 6A) of the cover (400, see FIG. 6A). For example, when the cover (400, see FIG. 6A) is mounted on the electronic device (300, see FIG. 6A) and the external device (500) is placed on the cover (400, see FIG. 6A), the pass-through hole (530), the first opening (360, see FIG. 6A) and the first cover hole (440, see FIG. 6A) may be arranged to be aligned with each other.

[0201] In one embodiment, the passage hole (530), the first opening (360, see FIG. 6a), and the first cover hole (440, see FIG. 6a) are aligned, and the sound transmission path (AD, see FIG. 6b) can be further expanded. As the sound path (AD, see FIG. 6b) is expanded, sound can be more easily transmitted to the input device (340, see FIG. 6a) of the electronic device (300, see FIG. 6a).

[0202] Referring to FIG. 13b, an external device (500) according to one embodiment may include a concave region (540). The concave region (540) may be formed in a shape in which a portion of the body (510) is concave compared to other portions.

[0203] In one embodiment, the concave area (540) may be formed at a position corresponding to the first opening (360, see FIG. 6A) of the electronic device (300, see FIG. 6A) and the first cover hole (440, see FIG. 6A) of the cover (400, see FIG. 6A). For example, when the cover (400, see FIG. 6A) is mounted on the electronic device (300, see FIG. 6A) and the external device (500) is placed on the cover (400, see FIG. 6A), the concave area (540), the first opening (360, see FIG. 6A), and the first cover hole (440, see FIG. 6A) may be arranged to be aligned with each other.

[0204] In one embodiment, the concave region (540), the first opening (360, see FIG. 6A), and the first cover hole (440, see FIG. 6A) are aligned, and the sound transmission path (AD, see FIG. 6B) can be further expanded. As the sound path (AD, see FIG. 6B) is expanded, sound can be more easily transmitted to the input device (340, see FIG. 6A) of the electronic device (300, see FIG. 6A).

[0205] FIG. 14 is a drawing showing a protrusion (470) according to one embodiment of the present disclosure.

[0206] In one embodiment, the cover (400) may include a protrusion (470). Referring to FIG. 14, the protrusion (470) may be formed in the placement space (430) of the cover (400).

[0207] In one embodiment, the protrusion (470) may be formed by protruding a portion of a surface surrounding the placement space (430). For example, a portion of the support surface (405) surrounding the placement space (430) may be formed by protruding compared to other portions, thereby forming the protrusion (470).

[0208] In one embodiment, the protrusion (470) may serve to fix the position of an external device (500, see FIG. 5) placed on the cover (400). For example, when the external device (500, see FIG. 5) is placed on the cover (400), the protrusion (470) may be inserted into at least a portion of the external device (500, see FIG. 5) to fix the position of the external device (500, see FIG. 5). In one embodiment, the external device (500, see FIG. 5) may include a concave groove (not shown) formed in a shape corresponding to the protrusion (470).

[0209] In Fig. 14, the protrusion (470) is illustrated as being formed by a portion of the support surface (405) protruding compared to other portions, but this is exemplary, and the position at which the protrusion (470) is formed may not be limited thereto. For example, the protrusion (470) may be formed by a portion of the cover upper surface (407) and / or the first cover side surface (411) protruding.

[0210] Referring to Fig. 14, a groove (660) may be formed in a portion of the support surface (405). The groove (660) may be formed by concavely sculpting a portion of the support surface (405). In one embodiment, the groove (660) may be formed to overlap the first cover hole (440) and the dummy hole (493). When the groove (660) is formed in a portion of the support surface (405), the acoustic conduit (AD, Fig. 6b) may be expanded.

[0211] FIG. 15 is a first graph (1500) showing the sound pressure level of sound measured in an input device (340) according to one embodiment of the present disclosure.

[0212] The horizontal axis (X1) of the first graph (1500) illustrated in FIG. 15 may mean the frequency (e.g., hertz (Hz)) of the sound transmitted to the input device (340).

[0213] The vertical axis (X2) of the first graph (1500) illustrated in FIG. 15 may be an indicator representing the acoustic performance of the input device (340). For example, the vertical axis (X2) of the first graph (1500) may mean the sound pressure level (SPL) (e.g., decibel (dB)) of the sound measured in the input device (340).

[0214] The first graph (1500) of FIG. 15 may include a first measurement line (1501), a second measurement line (1502), a third measurement line (1503), and a fourth measurement line (1504).

[0215] In one embodiment, the first measurement line (1501) may represent a sound pressure level received by the input device (340) when the cover (400) is not mounted on the electronic device (300).

[0216] In one embodiment, the second measurement line (1502) may represent a sound pressure level measured at the input device (340) when the electronic device (300) is equipped with a conventional cover other than the cover (400) according to an embodiment of the present disclosure.

[0217] In one embodiment, the third measurement line (1503) may mean a sound pressure level measured by the input device (340) when the electronic device (300) is equipped with a cover (400) having a home (460) formed therein according to one embodiment of the present disclosure.

[0218] In one embodiment, the fourth measurement line (1504) may represent a sound pressure level measured at the input device (340) when the electronic device (300) is equipped with a cover (400) having a home (660) formed therein according to one embodiment of the present disclosure.

[0219] Referring to the first graph (1500) of FIG. 15, when a cover (400) according to an embodiment of the present disclosure is mounted on an electronic device (300), the acoustic performance of the electronic device (300) may be improved compared to when a conventional cover is mounted on the electronic device (300). For example, referring to the first observation area (P1), the sound pressure level values ​​of the third measurement line (1503) and the fourth measurement line (1504) when the cover (400) according to an embodiment of the present disclosure is mounted on the electronic device (300) may be greater than the sound pressure level value of the second measurement line (1502) when the conventional cover is mounted on the electronic device (300). The frequency range of the first observation area (P1) may be 1 kHz to 3 kHz. The sound pressure level value of the fourth measurement line (1504) in the first observation area (P1) may be greater than the sound pressure level value of the second measurement line (1502) by approximately 5 dB. Referring to the second observation area (P2), the sound pressure level values ​​of the third measurement line (1503) and the fourth measurement line (1504) when the cover (400) according to the embodiment of the present disclosure is mounted on the electronic device (300) may be smaller than the sound pressure level value of the first measurement line (1501) when the cover (400) is not mounted on the electronic device (300), but may be larger than the sound pressure level value of the second measurement line (1502) when the existing cover is mounted on the electronic device (300). The frequency range of the second observation area (P2) may be 6 kHz to 9 kHz. The sound pressure level value of the fourth measurement line (1504) in the second observation area (P2) may be larger than the sound pressure level value of the second measurement line (1502) by approximately 10 dB.

[0220] FIG. 16 is a second graph (1600) showing the sound pressure level of sound generated from an audio output device (350) according to one embodiment of the present disclosure.

[0221] The horizontal axis (X3) of the second graph (1600) illustrated in FIG. 16 may mean the frequency (e.g., hertz (Hz)) of sound generated from the sound output device (350).

[0222] The vertical axis (X4) of the second graph (1600) illustrated in FIG. 16 may be an indicator representing the acoustic performance of the acoustic output device (350). For example, the vertical axis (X2) of the second graph (1600) may represent the sound pressure level (SPL) (e.g., decibel (dB)) of the sound generated from the acoustic output device (350).

[0223] The second graph (1600) of FIG. 16 may include a fifth measurement line (1601) and a sixth measurement line (1602).

[0224] In one embodiment, the fifth measurement line (1601) may be a value measured from outside the electronic device (300) of the sound pressure level of sound generated from the sound output device (350) when the electronic device (300) is equipped with a conventional cover other than the cover (400) according to the embodiment of the present disclosure.

[0225] In one embodiment, the sixth measurement line (1602) may be a value measured from the outside of the electronic device (300) at the sound pressure level of sound generated from the sound output device (350) when the electronic device (300) is equipped with a cover (400) having a second cover hole (450) formed therein according to an embodiment of the present disclosure.

[0226] Referring to the second graph (1600) of FIG. 16, when a cover (400) having a second cover hole (450) formed according to an embodiment of the present disclosure is mounted on an electronic device (300), the acoustic performance of the electronic device (300) in a high-frequency band can be improved compared to when an existing cover is mounted on the electronic device (300).

[0227] Referring to the second graph (1600) of FIG. 16, when the cover (400) having the second cover hole (450) formed according to the embodiment of the present disclosure is mounted on the electronic device (300), the sixth measurement line (1602) may be horizontally shifted (Hm) compared to the fifth measurement line (1601) when the existing cover is mounted on the electronic device (300). For example, referring to the third observation area (P3), the sixth measurement line (1602) may be horizontally shifted (Hm) by approximately 170 Hz compared to the fifth measurement line (1601). The horizontal shift (Hm) of the sixth measurement line (1602) compared to the fifth measurement line (1601) may mean that the sound pressure level value of the sixth measurement line (1602) is greater than the sound pressure level value of the fifth measurement line (1601) in the high frequency band.

[0228] Referring to the second graph (1600) of FIG. 16, the sixth measurement line (1602) may move horizontally (Hm) compared to the fifth measurement line (1601), and in a high frequency band (e.g., 9000 to 10000 Hz), the sixth measurement line (1602) may move vertically (Vm) compared to the fifth measurement line (1601). For example, referring to the fourth observation area (P4), in a high frequency band (e.g., 9000 to 10000 Hz), the sixth measurement line (1602) may move vertically (Vm) with respect to the fifth measurement line (1601), and thus the sound pressure level value of the sixth measurement line (1602) may appear greater than the sound pressure level value of the fifth measurement line (1601).

[0229] When a cover is mounted on an electronic device, a portion of the cover may block the electronic device's sound duct, thereby degrading the electronic device's sound performance.

[0230] When an external device (e.g., a digital pen) is placed on the cover while the cover is attached to the electronic device, the external device (e.g., the digital pen) may cause the acoustic tract to be shortened, thereby degrading the acoustic performance of the electronic device.

[0231] The cover includes a cover hole (e.g., a second cover hole) through which sound generated from an audio output device (e.g., a speaker) can pass, but since the sound path becomes longer by the thickness of the cover, the audio performance of the electronic device may be degraded.

[0232] An electronic device (300) equipped with a cover (400) according to one embodiment of the present disclosure may include a cover (400) and an electronic device (300).

[0233] In one embodiment, the electronic device (300) may include a housing (310) having an input device (340) for receiving sound and a first opening (360) formed therein through which sound transmitted to the input device (340) passes.

[0234] In one embodiment, the cover (400) may include a first cover hole (440), a placement space (430), and a bulkhead (420).

[0235] In one embodiment, the first cover hole (440) may be formed at a position overlapping the first opening (360).

[0236] In one embodiment, a placement space (430) is formed between a first side (311) of a housing (310) in which a first opening (360) is formed and a first cover side (411) of a cover (400) in which a first cover hole (440) is formed, and an external device (500) can be placed therein.

[0237] In one embodiment, the bulkhead (420) faces the first side (311) and may cover a portion of the placement space (430).

[0238] In one embodiment, the area of ​​the deployment space (430) that is not covered by the bulkhead (420) may extend from the first opening (360) to the first cover hole (440).

[0239] An electronic device (300) equipped with a cover (400) according to one embodiment of the present disclosure can expand an acoustic duct (AD) corresponding to a first opening (360) of the electronic device (300) by removing a portion of a partition wall (420) formed on the cover (400).

[0240] In one embodiment, the electronic device (300) may include an audio output device (350).

[0241] In one embodiment, the electronic device (300) may include a second opening (370) through which sound generated from the audio output device (350) passes.

[0242] In one embodiment, the cover (400) may include a plurality of second cover holes (450) formed spaced apart from each other on a second cover side (412) of the cover (400) that overlaps the second opening (370) and faces the second side (312) of the housing where the second opening (370) is formed.

[0243] In one embodiment, the plurality of second cover holes (450) may be formed with different lengths.

[0244] In one embodiment, the length of the plurality of second cover holes (450) extending in the height direction of the cover (400) may increase or decrease as it goes in the length direction of the cover (400).

[0245] An electronic device (300) equipped with a cover (400) according to one embodiment of the present disclosure can have improved acoustic performance by being configured to extend the length of at least some of a plurality of second cover holes (450) corresponding to the second opening (370) of the electronic device (300).

[0246] In one embodiment, the cover (400) may include a groove (460, 660) formed on a portion of a surface surrounding an area of ​​the placement space (430) that is not covered by the bulkhead (420).

[0247] In one embodiment, the home (460) may extend at least partially between the first opening (360) and the first cover hole (440) when viewed in the height direction of the cover (400).

[0248] In one embodiment, the cover (400) may include a dummy hole (493) spaced apart from the first cover hole (440).

[0249] In one embodiment, the home (660) may extend at least partially to the dummy hole (493) when viewed in the height direction of the cover (400).

[0250] In one embodiment, the home (460) may include a first home (461) formed in a first direction relative to the placement space (430) and a second home (462) formed in a second direction opposite to the first direction relative to the placement space.

[0251] An electronic device (300) equipped with a cover (400) according to one embodiment of the present disclosure may have a portion of a placement space (430) for placing an external device (500) in the cover (400) formed in a concave shape to expand an acoustic duct (AD) corresponding to a first opening (360) of the electronic device (300).

[0252] In one embodiment, a portion of the cover (400) facing the first side (311) of the housing (310) may be spaced apart from the first side (311) of the housing (310) to form a passage (481, 482). The passage (481, 482) extends from the placement space (430) and may be exposed to the outside of the electronic device (300) on which the cover (400) is mounted.

[0253] An electronic device (300) equipped with a cover (400) according to one embodiment of the present disclosure can improve the acoustic performance of the electronic device (300) by forming a passage (681, 682) extending from an acoustic conduit (AD).

[0254] In one embodiment, the cover (400) may include a second cover hole (650) formed in a second cover side (412) of the cover (400) that overlaps the second opening (370) and faces the second side (312) of the housing (310) where the second opening (370) is formed.

[0255] In one embodiment, the second cover hole (650) may be formed such that one end and the other end have different lengths.

[0256] In one embodiment, the cover (400) is formed on at least a portion of a surface surrounding an area not covered by the bulkhead (420) in the placement space (430), and may further include a protrusion (470) for fixing an external device (500).

[0257] A cover (400) according to one embodiment of the present disclosure may include a protrusion (470) for fixing an external device (500), thereby making it easy to fix the external device (500) to the cover (400).

[0258] In one embodiment, the external device (500) may include a pass-through hole (530).

[0259] In one embodiment, when the external device (500) is placed in the cover (400), the passage hole (530) may be arranged to be aligned with the first opening (360) and the first cover hole (440).

[0260] An external device (500) according to one embodiment of the present disclosure can extend an acoustic duct (AD) of an electronic device (300) by including a through hole (530) arranged to be aligned with a first opening (360) and a first cover hole (440).

[0261] In one embodiment, the first opening (360) may include a first portion (361) positioned on a first side (311) of the housing (310) and a second portion (362) having a smaller width than the first portion (361) and extending in a direction toward the input device (340).

[0262] In one embodiment, the bulkhead (420) of the cover (400) may be formed so as not to overlap the first portion (361).

[0263] In one embodiment, the second side (312) of the housing (310) may be a side located opposite the first side (311) of the housing (310).

[0264] A cover (400) that can be mounted on an electronic device (300) according to one embodiment of the present disclosure may include a first cover hole (440), a placement space (430), and a partition wall (420).

[0265] In one embodiment, the first cover hole (440) may be formed at a position that overlaps with the first opening (360) of the electronic device (300) through which sound transmitted to the electronic device (300) passes.

[0266] In one embodiment, the placement space (430) may be configured to accommodate an external device (500).

[0267] In one embodiment, the bulkhead (420) may face the first side (311) of the electronic device (300) and cover a portion of the placement space (430).

[0268] In one embodiment, when the cover (400) is mounted on the electronic device (300), an area of ​​the placement space (430) that is not covered by the partition wall (420) may extend from the first opening (360) to the first cover hole (440).

[0269] According to one embodiment of the present disclosure, a cover (400) can expand an acoustic duct (AD) corresponding to a first opening (360) of an electronic device (300) by removing a portion of a partition wall (420) formed on the cover (400).

[0270] In one embodiment, a plurality of second cover holes (450) may be formed spaced apart from each other on a second cover side (412) that overlaps with a second opening (370) of an electronic device (300) through which sound passes, and faces a second side (312) of the electronic device (300) in which the second opening (370) is formed. The plurality of second cover holes (450) may be formed with different lengths.

[0271] In one embodiment, when the external device (500) is placed in the cover (400), the pass-through hole (530) may be placed so as to be aligned with the first cover hole (440).

[0272] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0273] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0274] Electronic devices according to embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0275] It should be understood that the embodiments of the present disclosure and the terminology used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0276] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0277] An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0278] According to one embodiment, a method according to one embodiment of the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0279] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the above-described components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in a manner identical to or similar to that performed by the corresponding component among the plurality of components prior to the integration.

[0280] According to one embodiment, the operations performed by a module, program or other component may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (300) equipped with a cover (400), The above electronic device, An input device (340) for receiving sound; and It includes a housing (310) in which a first opening (360) is formed through which sound transmitted to the input device passes, The above cover, A first cover hole (440) formed at a position overlapping the first opening; A placement space (430) formed between the first side (311) of the housing where the first opening is formed and the first cover side (411) of the cover where the first cover hole is formed, in which an external device (500) can be placed; and Facing the first side, it includes a bulkhead (420) covering a portion of the arrangement space, An electronic device having a cover extending from the first opening to the first cover hole, the area of ​​the above arrangement space not covered by the bulkhead.

2. In paragraph 1, The above electronic device, It further includes a sound output device (350) and a second opening (370) through which sound generated from the sound output device passes. The above cover, An electronic device further comprising a plurality of second cover holes (450) formed spaced apart from each other on a second cover side (412) of the cover, which overlaps with the second opening and faces the second side (312) of the housing where the second opening is formed.

3. In paragraph 2, An electronic device equipped with a cover in which the plurality of second cover holes are formed with different lengths.

4. In paragraph 2, An electronic device equipped with a cover in which the length of the plurality of second cover holes extending in the height direction of the cover increases or decreases as it goes in the length direction of the cover.

5. In paragraph 1, The above cover, An electronic device further comprising a groove (460, 660) formed on a portion of a surface surrounding an area not covered by the bulkhead in the above arrangement space.

6. In paragraph 5, The above home, An electronic device having a cover, at least a portion of which extends between the first opening and the first cover hole when viewed in the height direction of the cover.

7. In paragraph 5, The above cover, It further includes a dummy hole (493) spaced apart from the first cover hole. The above home, An electronic device having a cover, at least a portion of which extends to the dummy hole when viewed in the height direction of the cover.

8. In paragraph 5, The above home, A first groove (461) formed in a first direction based on the above arrangement space; and An electronic device equipped with a cover including a second groove (462) formed in a second direction opposite to the first direction based on the above arrangement space.

9. In paragraph 1, The portion of the cover facing the first side is spaced apart from the first side to form a passage (481, 482). The above passage, An electronic device having a cover extending from the above-mentioned arrangement space and exposed to the exterior of the electronic device having the cover.

10. In paragraph 1, The above electronic device, It further includes a sound output device (350) and a second opening (370) through which sound generated from the sound output device passes. The above cover, An electronic device comprising a second cover hole (650) formed on a second cover side (412) of the cover, overlapping the second opening and facing the second side (312) of the housing where the second opening is formed.

11. In paragraph 10, The above second cover hole, An electronic device having a cover formed with different lengths at one end and the other end.

12. In paragraph 1, The above cover, An electronic device equipped with a cover formed on at least a portion of a surface surrounding an area not covered by the bulkhead among the above-mentioned arrangement spaces, and further including a protrusion (470) for fixing the external device.

13. In paragraph 1, The above external device includes a passage hole (530), An electronic device equipped with a cover, wherein the passage hole is arranged to be aligned with the first opening and the first cover hole, when the external device is placed in the cover.

14. In paragraph 1, The above first opening, A first part (361) located on the first side; and It has a width smaller than that of the first portion and includes a second portion (362) extending in a direction toward the input device. The bulkhead of the above cover is, An electronic device having a cover formed so as not to overlap with the first portion.

15. In paragraph 2, An electronic device having a cover, wherein the second side is a side located opposite to the first side.

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