Chip packaging device

Abstract

A chip packaging device, comprising: a housing (1), air systems (2), a frame body (3) located in the housing (1), and coating machines (4) located on the frame body (3). The frame body (3) comprises a partition plate (31), the partition plate (31) divides the space of the housing (1) into an upper chamber (11) and a lower chamber (12), the coating machines (4) are arranged in the upper chamber (11), and a plurality of through holes (310) enabling the upper chamber (11) to be communicated with the lower chamber (12) are formed in the partition plate (31); the air systems (2) provide a positive pressure environment for the upper chamber (11); and the chip packaging device is further provided with exhaust systems (5) and a buffer plate (6).

Description

Chip packaging equipment

[0001] This application is based on the Chinese patent application with application number 202311816668.9 and application date December 27, 2023, and claims the priority of the Chinese patent application. The entire content of the above patent application is hereby introduced into this application as a reference. Technical Field

[0002] The present invention relates to the technical field of chip packaging, in particular to a chip packaging device. Background Art

[0003] Photoresist coating is a crucial step in the chip packaging process, typically performed using a spin coating method. A silicon wafer is typically placed on a flat metal carrier plate with small holes connected to a vacuum tube. This allows the silicon wafer to be sucked onto the plate, allowing it to rotate with the plate. The coating process generally consists of three steps: 1. Spraying the photoresist solution onto the surface of the silicon wafer; 2. Accelerating the rotation of the metal carrier plate (silicon wafer) until the desired speed is reached; 3. Once the desired speed is reached, the rotation is maintained for a certain period of time, using the centrifugal force of the rotation to force the photoresist toward the periphery of the wafer, ultimately forming a uniform layer of photoresist. Because the photoresist on the silicon wafer's surface is moved toward the periphery by the centrifugal force of the rotation, the coating process is also called spin coating.

[0004] After the photoresist is thrown out, how to prevent the thrown-out photoresist from affecting the photoresist layer formed on the carrier plate is a problem that needs to be solved. Summary of the Invention

[0005] The purpose of the present invention is to provide a chip packaging device to address the deficiencies in the prior art. The device can promptly transfer the gas mixture generated during wafer coating to a lower chamber and can be promptly extracted by the exhaust system of the lower chamber, thereby avoiding the influence of the gas mixture on the wafer being coated in the working chamber. A buffer plate is also provided in the lower chamber to allow the airflow to enter the transition chamber more evenly and controllably, thereby avoiding the vaporized photoresist from being pulverized when the vaporized mixture hits the bottom of the transition chamber at high speed.

[0006] The chip packaging equipment provided by the present invention includes: a housing, an air system arranged in the housing, a frame arranged in the housing, and a coating machine arranged on the frame;

[0007] The frame includes a partition plate, which divides the space inside the shell into an upper chamber and a lower chamber. The coating machine is arranged in the upper chamber. The partition plate is provided with a plurality of through holes connecting the upper chamber and the lower chamber.

[0008] The air system provides a positive pressure environment for the upper chamber; the chip packaging equipment also has an exhaust system and a buffer plate, the exhaust system includes an air inlet located in the lower chamber, the opening direction of the air inlet is perpendicular to the opening direction of the through hole, the buffer plate is arranged in the lower chamber and divides the lower chamber into a buffer chamber and a transition chamber; the air inlet is connected to the transition chamber, and a number of filter holes are evenly distributed on the buffer plate.

[0009] Furthermore, the buffer plate is arranged at a position close to the bottom of the lower chamber, and the air inlet is arranged at a position close to the bottom of the shell.

[0010] Furthermore, the buffer plate is detachably mounted and fixed on the shell.

[0011] Furthermore, the air system includes an air outlet arranged at the top of the upper chamber, an air duct connected to the air outlet, and a filter unit arranged at the air duct or the air outlet.

[0012] Furthermore, the pore size of the filter holes ranges from 2 to 5 mm, and the interval between adjacent filter holes does not exceed 6 mm.

[0013] Furthermore, a plurality of coating machines are arranged in the upper chamber, the number of the air systems is consistent with the number of the coating machines, and the positions of the air systems and the coating machines correspond one to one in the vertical direction.

[0014] Furthermore, the upper chamber includes a working chamber and a storage chamber arranged in parallel, the coating machine is arranged in the working chamber, and the chip packaging equipment also has a robotic arm arranged between the working chamber and the storage chamber, and the robotic arm is used to transport the wafers in the working chamber to the storage chamber; an air curtain is arranged between the storage chamber and the working chamber.

[0015] Furthermore, the wind curtain includes a left wind curtain and a right wind curtain. From top to bottom, the left wind curtain is tilted to the right, and the right wind curtain is tilted to the left. The adjacent left wind curtain and the right wind curtain are cross-arranged, and the position where the left wind curtain and the right wind curtain are cross-arranged is opposite to the position of the robotic arm.

[0016] Furthermore, the through hole on the buffer plate is arranged in the working chamber, and there is no communication between the material storage chamber and the lower chamber via the through hole.

[0017] Furthermore, the chip packaging equipment further comprises a suction unit communicated with the working chamber, and the suction unit is positioned opposite to the coating machine.

[0018] Compared with the prior art, the present invention can transfer the gas mixture generated during wafer coating into the lower chamber and can be promptly extracted by the exhaust system of the lower chamber, thereby avoiding the influence of the gas mixture on the wafer being coated in the working chamber. In addition, a buffer plate is provided in the lower chamber, and a plurality of filter holes are evenly arranged on the buffer plate. The filter holes on the buffer plate can reduce the speed of the vaporized fluid, so that the airflow enters the transition chamber more evenly and controllably, thereby avoiding the vaporized photoresist from being pulverized when the vaporized mixture hits the bottom of the transition chamber at high speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] FIG1 is a schematic structural diagram of a chip packaging device disclosed in an embodiment of the present invention;

[0020] FIG2 is a front view of a chip packaging device disclosed in an embodiment of the present invention;

[0021] FIG3 is a cross-sectional view taken along the AA direction in FIG2 ;

[0022] FIG4 is a top view of a chip packaging device disclosed in an embodiment of the present invention;

[0023] FIG5 is a cross-sectional view taken along the line BB in FIG4 ;

[0024] FIG6 is a schematic diagram of the installation structure of the buffer plate in the chip packaging device disclosed in an embodiment of the present invention;

[0025] FIG7 is a schematic diagram of the installation structure of the partition plate in the chip packaging device disclosed in an embodiment of the present invention;

[0026] Description of reference numerals: 1-shell, 11-upper chamber, 111-working chamber, 112-storage chamber,

[0027] 12-lower chamber, 121-buffer chamber, 122-transition chamber, 113-air curtain, 1131-left air curtain, 1132-right air curtain, 2-air system, 3-frame, 31-partition plate, 310-through hole, 4-coating machine, 5-exhaust system, 6-buffer plate, 60-filter hole, 7-suction unit. DETAILED DESCRIPTION

[0028] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention.

[0029] An embodiment of the present invention discloses a chip packaging device, which is mainly used in the coating process of wafers. With the continuous improvement of process requirements, in order to ensure that the photoresist formed on the wafer surface has sufficient flatness, the environmental requirements for the coating process are also becoming increasingly higher. The existing coating process mainly achieves uniform arrangement of photoresist on the wafer surface by dispensing glue and spinning glue. The photoresist thrown out during the spinning glue process is easily splashed back onto the wafer surface, thereby affecting the coating effect and further affecting the subsequent process steps.

[0030] As shown in FIG1-7 , the chip packaging device disclosed in this embodiment includes: a housing 1 , an air system 2 disposed in the housing 1 , a frame 3 disposed in the housing 1 , and a coating machine 4 disposed on the frame 3 ;

[0031] As shown in FIG3 , the frame 3 includes a partition plate 31 , which divides the space inside the housing 1 into an upper chamber 11 and a lower chamber 12 . The coating machine 4 is disposed in the upper chamber 11 . The partition plate 31 is provided with a plurality of through holes 310 that connect the upper chamber 11 and the lower chamber 12 .

[0032] The air system 2 provides a positive pressure environment for the upper chamber 11; the chip packaging equipment also has an exhaust system 5 and a buffer plate 6, the exhaust system 5 includes an air inlet located in the lower chamber 12, the opening direction of the air inlet is perpendicular to the opening direction of the through hole 310, the buffer plate 6 is arranged in the lower chamber 12 and divides the lower chamber 12 into a buffer chamber 121 and a transition chamber 122; the air inlet is connected to the transition chamber 122, and a number of filter holes 60 are evenly distributed on the buffer plate 6.

[0033] The air system 2 provides a positive pressure environment for the upper chamber 11, which can prevent external debris and other impurities from entering the upper chamber 11, thereby providing a purer and cleaner environment for photoresist coating, thereby better improving the coating effect. In this embodiment, the air system 2 is arranged at the top of the upper chamber 11. The positive pressure provided by the air system 2 causes the gas in the upper chamber 11 to have a downward movement trend. In this way, the photoresist ejected from the coating machine 4 will mix with some vaporized liquid and volatile components in the photoresist after vaporization. These mixtures will have a downward movement trend after mixing. The plurality of through holes 310 provided on the partition plate 31 used to support the coating machine can transfer these vaporized mixed substances from the upper chamber 11 to the lower chamber 12. Transferring the ejected vaporized photoresist to the lower chamber 12 can effectively prevent the photoresist from splashing back onto the photoresist layer, and the photoresist and other liquids transferred to the lower chamber 12 can be promptly extracted by the exhaust system 5 of the lower chamber 12.

[0034] During the downward transfer of the vaporized mixed material, if it strikes the bottom wall of the lower chamber 12 at a relatively high flow rate, the photoresist is likely to be pulverized. The pulverized photoresist is likely to adhere to and accumulate in the lower chamber 12, which can easily affect the coating process. For example, the pulverized photoresist is likely to adhere to the inner wall of the housing 1, making it difficult to clean and also risking back-splashing into the working chamber 111. To reduce the pulverization of the photoresist, in this embodiment, a buffer plate 6 is provided in the lower chamber 12, and a plurality of filter holes 60 are evenly arranged on the buffer plate 6. During the downward transfer of the vaporized photoresist by the air system 2, the filter holes 60 on the buffer plate 6 can reduce the speed of the vaporized fluid, thereby allowing the airflow to enter the transition chamber 122 in a more uniform and controllable manner, and then be extracted by the exhaust system 5 in the transition chamber 122. This also prevents the vaporized photoresist from being pulverized during the violent impact when the vaporized mixture strikes the bottom of the transition chamber 122 at high speed.

[0035] In this embodiment, the spacing between adjacent filter holes 60 does not exceed 6 mm. When the spacing between adjacent filter holes 60 is large, vaporized photoresist is likely to collide with the buffer plate 6, causing excessive photoresist to pulverize on the buffer plate 6. In this embodiment, the filter holes on the buffer plate 6 are made sufficiently dense that only a small amount of photoresist will collide with the buffer plate 6, reducing the pulverization of photoresist on the buffer plate 6. The small amount of photoresist that is pulverized on the buffer plate 6 can be removed from the lower chamber 12 by regularly replacing the buffer plate, thereby reducing the maintenance cycle of the equipment and improving the efficiency of production and use.

[0036] In this embodiment, the distance between adjacent filter holes 60 is 5 mm. The pore size of the filter holes 60 ranges from 2 to 5 mm. When the pore size of the filter holes 60 exceeds 5 mm, the larger pores 60 are more likely to cause the gas in the transition chamber 122 to affect the upper chamber 11, while the smaller pores 60 are more likely to cause excessive photoresist to pulverize on the buffer plate 6, increasing the wear of the buffer plate 6.

[0037] The buffer plate 6 is disposed near the bottom of the lower chamber 12, and the air inlet is disposed near the bottom of the housing 1. Positioning the buffer plate 6 as close to the bottom as possible allows the suction force of the exhaust system 5 to be more concentrated at the bottom, thereby better aspirating the vaporized photoresist that passes through the buffer plate 6. Furthermore, the suction force of the exhaust system 5 also minimizes the impact on the air flow in the upper chamber 11, thereby maintaining a more stable temperature in the upper chamber 11 and improving the coating effect.

[0038] It is understandable that in order to conveniently replace the buffer plate 6 and remove part of the powdered photoresist adhering to the buffer plate 6 , the buffer plate 6 is detachably mounted and fixed on the housing 1 .

[0039] In this embodiment, the buffer plate 6 is set as one, and in other embodiments, the buffer plate 6 can also be set as multiple, and multiple buffer plates 6 are arranged along the vertical direction. By setting up multiple layers of buffer plates 6, the air flow speed can be gradually reduced, so that the vaporized photoresist can be quickly extracted after entering the transition chamber 122.

[0040] In this embodiment, the air system 2 includes an air outlet disposed at the top of the upper chamber 11, an air duct connected to the air outlet, and a filter unit disposed at the air duct or the air outlet. The air system 2 also includes a fan disposed in the air duct.

[0041] A plurality of coating machines 4 are arranged in the upper chamber 11 . The number of the air inlets is consistent with the number of the coating machines 4 , and the positions of the air inlets and the coating machines 4 correspond one to one in the vertical direction.

[0042] In this embodiment, there are two coating machines 4 , which are arranged in parallel. The top of each coating machine 4 is provided with the corresponding air system 2 .

[0043] As shown in Figure 5, the upper chamber 11 includes a working chamber 111 and a storage chamber 112 arranged in parallel. The coating machine 4 is arranged in the working chamber 111. The chip packaging equipment also has a robotic arm arranged between the working chamber 111 and the storage chamber 112. The robotic arm is used to transport the wafers in the working chamber 111 to the storage chamber 112; an air curtain 113 is arranged between the storage chamber 112 and the working chamber 111.

[0044] The wafers coated in the working chamber 111 are transported to the storage chamber 112. During the operation, in order to prevent impurities in the storage chamber 112 from entering the working chamber 111 and affecting the coating of the wafers, an air curtain 113 is provided between the working chamber 111 and the storage chamber 112. The air curtain 113 acts as a barrier, which can effectively reduce the interference of external pollution on the working chamber 111.

[0045] When the robotic arm moves back and forth between the working chamber 111 and the storage chamber 112, the robotic arm will block the wind curtain 113 at the moment of passing through the wind curtain 113, so that particles such as dust or debris from the outside can pass through the wind curtain 113 and move between the working chamber 111 and the storage chamber 112, thereby affecting the environment of the working chamber 111.

[0046] In order to avoid the above problems, as shown in Figure 3, the air curtain 113 includes a left air curtain 1131 and a right air curtain 1132. From top to bottom, the left air curtain 1131 is tilted to the right, and the right air curtain 1132 is tilted to the left. The adjacent left air curtain 1131 and the right air curtain 1132 are arranged to cross each other, and the position where the left air curtain 1131 and the right air curtain 1132 are crossed is opposite to the position of the robotic arm.

[0047] The air curtains 113 are divided into two groups, and both groups of air curtains 113 flow in an oblique direction relative to the horizontal direction. Since the air flow direction of the air curtains 113 is sprayed obliquely, the air curtains 113 will not be completely blocked during the process of the robot arm passing through the air curtains 113, thereby preventing particles such as dust or debris from entering the working chamber 111.

[0048] It is understood that in order to form the left air curtain 1131 and the right air curtain 1132, the chip packaging equipment has a nozzle disposed on the top of the housing 1. The nozzles are provided in two groups, namely a left nozzle group and a right nozzle group. The left nozzle group forms the left air curtain 1131, and the right nozzle group forms the right air curtain 1132. The airflow direction formed by the left nozzle group obliquely intersects with the horizontal direction, and the airflow direction formed by the right nozzle group also obliquely intersects with the horizontal direction. The airflow direction formed by the left nozzle group is toward the robotic arm, and the airflow direction formed by the right nozzle group is also toward the robotic arm. The left and right nozzle groups are generally arranged in a mirror image relative to the robotic arm.

[0049] The through hole 310 on the partition plate 31 is disposed within the working chamber 111, and the storage chamber 112 is not connected to the lower chamber 12 by the through hole 310. The partition plate 31 can actually be divided into two parts: one part is provided with the through hole 310, and the other part is not provided with the through hole 310. The part without the through hole 310 encloses the storage chamber 112, and this part of the partition plate 31 forms a partition separating the upper chamber 11 from the lower chamber 12.

[0050] The partition plate with the through hole 310 forms the working chamber 111, and the coating machine 4 is arranged on the partition plate 31. The partition plate 31 at the bottom of the storage chamber 12 is set to be closed to prevent the gas in the lower chamber 12 from splashing upward into the storage chamber 112.

[0051] The aperture of the through hole 310 is larger than the aperture of the filter hole 60. In this embodiment, the size of the through hole 310 ranges from 3 to 10 mm. When the spatial size of the through hole 310 exceeds 10 mm, it is easy to affect the maintenance of the positive pressure environment of the chamber where the working chamber 111 is located, causing the pressure in the working chamber 111 to be uncontrollable. The excessive size of the through hole 310 actually connects the working chamber 111 with the lower chamber 12. This structural arrangement causes the air system 2 in the working chamber 111 to provide a positive pressure environment for both the working chamber 111 and the lower chamber 12. This not only causes the environment to be uncontrollable, but also makes it difficult to form an air pressure difference between the working chamber 111 and the lower chamber 12, making it difficult to transfer the volatilized mixture from the working chamber 111 to the lower chamber 12.

[0052] When the size of the through hole 310 is small, it will easily cause the air pressure in the working chamber 111 to be higher. The higher air pressure can easily penetrate the wind curtain 113, thereby causing the volatile mixed substance to transfer from the working chamber 111 to the storage chamber 112, and after the transfer, it will affect the coated wafers in the storage chamber 112.

[0053] When the door of the storage chamber 112 is opened, in order to prevent external dust or debris particles from entering the storage chamber 112, a positive pressure environment is maintained in the storage chamber 112, and the air system 2 is also provided on the top of the storage chamber 112.

[0054] The chip packaging apparatus further includes a suction unit 7 in communication with the working chamber 111 and positioned opposite the coating station 4. The suction unit 7 is capable of promptly removing some of the chemical solution volatiles, some of the photoresist volatiles, and some of the vaporized photoresist within the working chamber 111. Multiple suction units 7 are provided, and the number of suction units 7 corresponds one-to-one with the number of coating stations 4.

[0055] The above describes in detail the structure, features and effects of the present invention based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present invention, but the scope of implementation of the present invention is not limited to what is shown in the drawings. Any changes made in accordance with the concept of the present invention, or modifications to equivalent embodiments with equivalent changes, which do not exceed the spirit covered by the description and drawings, should be within the scope of protection of the present invention.

Claims

1. A chip packaging device, characterized in that, Comprising: A housing, an air system disposed in the housing, a frame disposed in the housing, and a coating machine platform disposed on the frame; The frame includes a partition plate that divides the space inside the housing into an upper chamber and a lower chamber. The coating machine platform is disposed in the upper chamber, and a plurality of through holes communicating the upper chamber and the lower chamber are provided on the partition plate; The air system provides a positive pressure environment for the upper chamber; the chip packaging device further has an exhaust system and a buffer plate. The exhaust system includes an air inlet located in the lower chamber, and the opening direction of the air inlet is perpendicular to the opening direction of the through hole. The buffer plate is disposed in the lower chamber and divides the lower chamber into a buffer chamber and a transition chamber; the air inlet communicates with the transition chamber, and a plurality of filter holes are uniformly distributed on the buffer plate.

2. The chip packaging device according to claim 1, wherein: The buffer plate is disposed at a position near the bottom of the lower chamber, and the air inlet is disposed at a position near the bottom of the housing.

3. The chip packaging device according to claim 2, wherein: The buffer plate is detachably mounted and fixed on the housing.

4. The chip packaging device according to claim 3, wherein: The air system includes an air outlet disposed at the top of the upper chamber, an air duct communicating with the air outlet, and a filtering unit disposed at the position of the air duct or the air outlet.

5. The chip packaging device according to claim 1, wherein: The aperture range of the filter holes is 2 - 5 mm; the interval between adjacent filter holes does not exceed 6 mm.

6. The chip packaging device according to claim 1, wherein: A plurality of the coating machine platforms are disposed in the upper chamber. The number of the air systems is the same as the number of the coating machine platforms, and the air systems and the coating machine platforms are in one-to-one correspondence in the vertical direction.

7. The chip packaging device according to claim 1, wherein: The upper chamber includes a working chamber and a storage chamber arranged in parallel. The coating machine platform is disposed in the working chamber. The chip packaging device further has a robotic arm disposed between the working chamber and the storage chamber. The robotic arm is used to transport the wafers in the working chamber to the storage chamber; an air curtain is disposed between the storage chamber and the working chamber.

8. The chip packaging device according to claim 7, characterized in that: The air curtain includes a left air curtain and a right air curtain. In the direction from top to bottom, the left air curtain is inclined to the right, the right air curtain is inclined to the left, and the adjacent left air curtain and right air curtain are arranged in a crossed manner, and the position where the left air curtain and the right air curtain are arranged in a crossed manner is opposite to the position of the robotic arm.

9. The chip packaging device according to claim 7, wherein: The through holes on the buffer plate are disposed in the working chamber, and there is no through hole communicating the storage chamber and the lower chamber.

10. The chip packaging device according to claim 7, wherein: The chip packaging device further has a suction unit communicating with the working chamber, and the suction unit is opposite to the coating machine platform in position.

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