Substrate clamping device for substrate chuck and tooling and method for adjusting same

Abstract

Provided in the present application are a substrate clamping device for a substrate chuck and a tooling and method for adjusting same. The substrate clamping device comprises a mounting seat, a positioning portion, a driving portion and a clamping portion. The mounting seat is used for fixing the substrate clamping device to the substrate chuck. The positioning portion is configured to be arranged in a recess, the positioning portion comprising a locking member, a first push rod and a second push rod, the first push rod and the second push rod being movably connected to each other, and the locking member being used for fixing the relative positions of the first push rod and the second push rod; the positioning portion matches the recess in size thus preventing rotation of the positioning portion in the recess. The driving portion is connected to the mounting seat and used for driving the first push rod and the second push rod to move in the recess. The clamping portion is rotationally connected to the mounting seat by means of a rotating shaft; the clamping portion is provided with a contact end and a connecting end, the contact end being configured to come into contact with a substrate, and the connecting end being connected to the first push rod; the movement of the first push rod drives the connecting end to move, and also drives the clamping portion to rotate and drive the contact end to move.

Description

Substrate clamping device for substrate chuck and tooling and method for debugging the same Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a substrate clamping device for a substrate chuck, and a tool and method for debugging the substrate clamping device. Background Art

[0002] In the back cleaning and etching process of a single-chip substrate cleaning machine, a clamping mechanism is usually used to clamp the substrate. The clamping mechanism is set in the groove of the chuck, and the piston rod on the clamping mechanism is in the groove. The outer end of the piston rod is connected to the substrate clamping pin. The angle of the substrate clamping pin can be adjusted by moving the position of the piston rod to clamp or loosen the substrate. When the angle of the substrate clamping pin is determined, the position of the piston rod is fixed by the locking nut located in the groove, so that the angle of the substrate clamping pin is fixed. However, during operation, the locking nut sometimes rotates in the groove, causing the clamping mechanism to be unstable, resulting in problems such as substrate tilt and poor concentricity of the substrate, further leading to problems such as substrate shaking, fragments, liquid splashing, and uneven etching rate on the front edge, affecting the etching effect and cleaning effect. Summary of the Invention

[0003] The technical problem to be solved by the present application is the problem of unstable clamping state of the substrate clamping mechanism during operation.

[0004] To solve the above technical problems, the present application provides a substrate clamping device for a substrate chuck, wherein the substrate chuck has a groove for arranging the substrate clamping device, the groove extending along a first direction, and comprising a mounting seat, a positioning portion, a driving portion and a clamping portion, wherein the mounting seat is used to fix the substrate clamping device to the substrate chuck; the positioning portion is used to be arranged in the groove, the positioning portion comprises a locking member, a first push rod and a second push rod, the first push rod and the second push rod are movably connected, and the locking member is used to fix the relative position of the first push rod and the second push rod, wherein the positioning portion is adapted to the size of the groove so that the positioning portion does not rotate in the groove; the driving portion is connected to the mounting seat and is used to drive the first push rod and the second push rod to move in the groove; the clamping portion is rotatably connected to the mounting seat via a rotating shaft, the clamping portion has a contact end and a connecting end, the contact end is used to contact the substrate, and the connecting end is connected to the first push rod. When the first push rod moves, the connecting end is driven to move, and at the same time, the clamping portion is driven to rotate and the contact end is driven to move.

[0005] In order to solve the above-mentioned technical problems, the present application also provides a tool for debugging a substrate clamping device, including a simulated chuck device and a simulated substrate device. The simulated chuck device is provided with a plurality of clamping device mounting positions, each of the clamping device mounting positions is used to install a substrate clamping device, and the simulated substrate device includes a simulated edge for simulating the edge of the substrate. When debugging the substrate clamping device, the clamping portion of each substrate clamping device is used to clamp the simulated edge.

[0006] In order to solve the above-mentioned technical problems, the present application also provides an adjustment method for a substrate clamping device, which is applied to the substrate clamping device as described above, including: adjusting the relative position of the first push rod and the second push rod, and then adjusting the rotation position of the clamping part, so that the contact end is located at the target position and contacts the edge of the substrate; fixing the relative position of the first push rod and the second push rod by the locking member.

[0007] The locking member and the first push rod in the positioning portion of the substrate clamping device of the present application do not rotate within the groove of the substrate chuck, thereby ensuring that the substrate clamping device does not wobble during operation. The tooling and method of the present application can easily adjust multiple substrate clamping devices to achieve consistent clamping levels, ensuring the stability of the substrate during processing after loading.

[0008] Summary of the Figures

[0009] The features and performance of the present application are further described by the following examples and accompanying drawings. The accompanying drawings are provided to provide a further understanding of the present application and are incorporated into and constitute a part of this application. The accompanying drawings illustrate the embodiments of the present application and, together with this specification, serve to explain the principles of the present application. In the accompanying drawings:

[0010] FIG1 is a schematic structural diagram of a substrate chuck equipped with a substrate clamping mechanism;

[0011] FIG2 is a side view of the substrate clamping mechanism in FIG1 ;

[0012] FIG3 is a schematic diagram showing the positional relationship between the locking nut and the groove when the substrate clamping mechanism in FIG1 is disposed in the groove;

[0013] FIG4 is a cross-sectional view of a substrate clamping device for a substrate chuck according to an embodiment of the present application;

[0014] FIG5 is a perspective schematic diagram of a partial structure of the substrate clamping device in FIG4 ;

[0015] FIG6 is a schematic diagram showing the positional relationship between the locking member and the groove when the substrate clamping device of the present application is disposed in the groove;

[0016] FIG7 is a perspective schematic diagram of a substrate clamping device according to another embodiment of the present application;

[0017] FIG8 is a cross-sectional view of the substrate clamping device of FIG7;

[0018] FIG9 is a perspective schematic diagram of a tool for debugging a substrate clamping device according to an embodiment of the present application;

[0019] 10 is a cross-sectional view of the simulated chuck device and the simulated substrate device in the tooling shown in FIG9 when they are in a separated state;

[0020] FIG11 is a top view of the tooling shown in FIG9 ;

[0021] FIG12 is a cross-sectional view of line CC in FIG11;

[0022] FIG13 is a perspective schematic diagram of a tooling of a substrate clamping device according to another embodiment of the present application;

[0023] 14 and 15 are both perspective schematic diagrams of the simulated chuck device and the simulated substrate device in the tooling shown in FIG. 13 in a separated state;

[0024] FIG16 is a top view of the tooling shown in FIG13;

[0025] FIG17 is a cross-sectional view of line HH in FIG16;

[0026] FIG18 is an exemplary flow chart of a method for adjusting a substrate clamping device according to an embodiment of the present application;

[0027] 19 to 23 are process diagrams showing an adjustment method for a substrate clamping device according to an embodiment of the present application.

[0028] Preferred embodiment of this application

[0029] To more clearly illustrate the technical solutions of the embodiments of this application, the following is a brief introduction to the drawings required for describing the embodiments. Obviously, the drawings described below are merely examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios based on these drawings without inventive effort. Unless otherwise apparent from the context or otherwise noted, the same reference numerals in the figures represent the same structure or operation.

[0030] As used herein, unless the context clearly indicates otherwise, the terms "a," "an," "an," and / or "the" are not intended to refer to the singular but may include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements specifically identified, and these steps and elements do not constitute an exclusive list. A method or apparatus may also include other steps or elements.

[0031] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to actual proportional relationships. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values ​​should be interpreted as being merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0032] In the description of this application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of this application; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0033] For ease of description, spatially relative terms such as "on...", "above...", "on the upper surface of...", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the figures is inverted, the device described as "above" or "on top of" the other devices or structures will be positioned later as "below" or "beneath" the other devices or structures. ” Thus, the exemplary term "above" can encompass both an orientation of "above" and "below." The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0034] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is solely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. Furthermore, while the terms used in this application are selected from commonly known and commonly used terms, some terms mentioned in this specification may have been selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant sections of this description. Furthermore, this application should be understood not only by the actual terms used, but also by the meaning implied by each term.

[0035] Flowcharts are used in this application to illustrate the operations performed by systems according to embodiments of the present application. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, the various steps may be processed in reverse order or simultaneously. Furthermore, other operations may be added to these processes, or one or more operations may be removed from these processes.

[0036] FIG1 is a schematic structural diagram of a substrate chuck equipped with a substrate clamping mechanism. As shown in FIG1 , the substrate chuck 110 is roughly a circular disk with a certain thickness, and has a number of grooves 111 on one surface thereof, and a substrate clamping mechanism 120 is provided in each groove 111. Specifically, there are 6 grooves 111 on the substrate chuck 110, and each groove 111 extends along the radial direction of the substrate chuck 110 and points to the center of the circle. The substrate clamping mechanism 120 is provided at the end near the outer periphery of the groove 111. A positioning hole 112 is provided at this end. The substrate clamping mechanism 120 has a mounting seat 121 and a fixing member 122, and the fixing member 122 is, for example, a screw. The fixing member 122 can pass through the positioning hole 112 and be screwed, so that the substrate clamping mechanism 120 is fixed in the groove 111 through the mounting seat 121.

[0037] FIG2 is a side view of the substrate clamping mechanism in FIG1 . As shown in FIG2 , the substrate clamping mechanism 120 is provided with a connecting block 123 below a mounting base 121. The connecting block 123 is connected to the outer shell of a cylinder 129. The mounting base 121 is also provided with a clamping portion 127, which is connected to the mounting base 121 via a rotating shaft 126. The cylinder 129 has a piston rod 124. The upper end of the clamping portion 127 is used to directly contact the substrate when clamping the substrate, and the lower end is connected to the piston rod 124. When the position of the piston rod 124 changes, it drives the lower end of the clamping portion 127 to move. At the same time, the clamping portion 127 rotates about the rotating shaft 126, thereby adjusting the position of the upper end of the clamping portion 127. Specifically, piston rod 124 typically comprises two push rod sections: an inner push rod 124a, partially located within cylinder 129, and an outer push rod 124b, located outside cylinder 129. The two push rod sections are movably connected and locked in place by a locking nut 125, thereby defining the length of piston rod 124 and the clamping or release position of clamping portion 127. In Figure 2, when cylinder 129 is ventilated, inner push rod 124a moves rightward, driving outer push rod 124b to the right, thereby moving clamping portion 127 leftward to a clamping position to clamp the substrate. Figure 3 shows a schematic diagram of the positional relationship between locking nut 125 and recess 111 when substrate clamping mechanism 120 is positioned within recess 111. Since the sizes of the locking nut 125 and the piston rod 124 are relatively small, during long-term operation, the locking nut 125 may rotate, causing the two push rods of the piston rod 124 to loosen, causing the length of the piston rod 124 to change, which will cause the clamping position of the clamping part 127 to change, resulting in unstable substrate clamping, bringing about adverse consequences such as substrate shaking, fragments, chemical splashing, and uneven front edge etching rate.

[0038] FIG4 is a cross-sectional view of a substrate clamping device for a substrate chuck according to an embodiment of the present application. The substrate clamping device 400 of the present application can be arranged in the groove 111 of the substrate chuck 110 shown in FIG1 , and therefore the following description will be made in conjunction with the substrate chuck 110 in FIG1 . However, the present application does not limit the extension direction of the groove 111, and is not limited to FIG1 , and the extension direction of the groove 111 is defined as the first direction. It should also be noted that the substrate includes a wafer, but the shape of the substrate is not limited to a circular shape, and can also be any shape, so the shape of the substrate chuck 110 is adapted to the shape of the substrate to be processed.

[0039] 4 , the substrate clamping device 400 includes a mounting base 410, a positioning portion 420, a clamping portion 430, and a driving portion 440. The mounting base 410 is used to secure the substrate clamping device 400 as a whole to the substrate chuck 110. The mounting base 410 is structurally compatible with the groove 111. For example, similar to FIG1 , the mounting base 410 can be fixedly disposed in the groove 111 by interfitting between a fixing member 122 and a positioning hole 112 on the groove 111. The positioning portion 420 includes a locking member 421, a first push rod 422, and a second push rod 423. The first push rod 422 and the second push rod 423 are movably connected (e.g., threadedly connected). The locking member 421 is used to secure the relative positions of the first push rod 422 and the second push rod 423. The positioning portion 420 is adapted to the size of the groove 111 so that the positioning member 420 does not rotate within the groove 111. The clamping portion 430 is rotatably connected to the mounting base 410 via a rotating shaft 431. The clamping portion 430 has a contact end 432 and a connecting end 433. The contact end 432 is used to contact the substrate, and the connecting end 433 is connected to the first push rod 422. When the first push rod 422 moves, the connecting end 433 moves, which in turn causes the clamping portion 430 to rotate and the contact end 432 to move. A connecting member 411 is provided below the mounting base 410, and the driving portion 440 is fixed to the bottom of the mounting base 410 via the connecting member 411. After assembly, the positioning portion 420 and the driving portion 440 are both located in the groove 111. The driving portion 440 is used to drive the first push rod 422 and the second push rod 423 to move along the first direction within the groove 111.

[0040] The driving unit 440 in this embodiment is specifically implemented as a cylinder. As shown in Figure 4, one end of the second push rod 423 is disposed inside the cylinder, and the other end is connected to the first push rod 422. When the cylinder is ventilated, the second push rod 423 is pushed to the right, and the spring 441 is compressed. Since the right end of the second push rod 423 abuts the interior of the first push rod 422, it can also push the first push rod 422 to the right. In this example, the first push rod 422 is screwed to the periphery of the second push rod 423. Therefore, by rotating the piston end 422a of the first push rod 422, the relative position of the first push rod 422 and the second push rod 423 can be adjusted. In Figure 4, a locking member 421 is sleeved on the outer periphery of the second push rod 423. Once the relative position of the first push rod 422 and the second push rod 423 is determined, the locking member 421 can be used to lock the first push rod 422, thereby fixing the relative position of the first push rod 422 and the second push rod 423. The first push rod 422 and the second push rod 423 together form a piston rod.

[0041] It should be noted that using a cylinder as the driving part 440 is one implementation method for pushing the first push rod 422 and the second push rod 423 to move. In other embodiments, other mechanical devices can also be used as the driving part to push the first push rod 422 and the second push rod 423 to move.

[0042] FIG5 is a perspective schematic diagram of a partial structure of the substrate clamping device in FIG4 , which includes a locking member 421, a first push rod 422, and a clamping portion 430. Specifically, the locking member 421 is implemented as a locking nut, such as a hexagonal nut. The locking member 421 is disposed at one end 427 of the first push rod 422, specifically at the end away from the piston end 422a. The locking member 421 is also disposed on the periphery of the second push rod 423. Once the relative positions of the first push rod 422 and the second push rod 423 are determined, the relative positions of the first push rod 422 and the second push rod 423 can be fixed by locking the locking member 421.

[0043] As shown in Figure 4, in some embodiments, the first push rod 422 has a threaded hole 424, the second push rod 423 is screwed into the threaded hole 424, and the second push rod 423 also has an external thread. The locking member 421 locks the first push rod 422 or the second push rod 423 through the external thread to fix the relative position of the first push rod 422 and the second push rod 423.

[0044] In some embodiments, as shown in Figure 5, the locking member 421 and the first push rod 422 are fixedly connected by a first fixing member 428. Specifically, the first fixing member 428 can be a jackscrew.

[0045] Figure 6 illustrates the positional relationship between the locking member 421 and the groove 111 when the substrate clamping device 400 of the present application is disposed in the groove 111. In this embodiment, the locking member 421 has a first height H1 and a first width W1, and the groove 111 has a groove depth H0 and a groove width W0. The first width W1 matches the groove width W0, i.e., the first width W1 is less than or equal to the groove width W0, preventing the locking member 421 from rotating relative to the groove 111. When W1 = W0, due to tolerances and other factors, the locking member 421 and the inner wall of the groove 111 may not fit completely together, but rather have a certain gap. The matching of the first width W1 with the groove width W0 means that the gap is sufficiently small to ensure that the locking member 421 does not rotate relative to the groove 111.

[0046] In some embodiments, the first height H1 may be greater than the groove depth H0, so that the locking member 421 protrudes from the groove 111. It should be noted that the bottom of the locking member 421 generally does not contact the bottom of the groove 111.

[0047] In some embodiments, the locking member 421 has two oppositely disposed parallel surfaces 425 and 426, both of which are parallel to the walls of the groove 111. The first width W1 is the distance between the two parallel surfaces 425 and 426. This arrangement further ensures that the locking member 421 does not rotate within the groove 111.

[0048] 5 , the height and width of the first push rod 422 are substantially the same as those of the locking member 421. However, the two may have different outer contours.

[0049] In some embodiments, the cross-sectional area of ​​the first push rod 422 is less than or equal to the cross-sectional area of ​​the locking member 421. Then, when both are placed in the groove 111, since the position of the first push rod 422 is fixed, the locking member 421 and the first push rod 422 are also locked with each other and will not rotate relative to each other. Therefore, by setting the first width of the locking member 421, the first push rod 422 will not rotate in the groove 111.

[0050] In some embodiments, the first push rod 422 has two parallel surfaces arranged opposite to each other. Referring to FIG5 , the two parallel surfaces are parallel to the groove wall of the groove 111. Such an arrangement further ensures that the first push rod 422 does not rotate in the groove 111.

[0051] In other embodiments, the first push rod 422 has a second height H2 and a second width W2, the groove 111 has a groove depth H0 and a groove width W0, and the second width W2 matches the groove width W0, so that the first push rod 422 does not rotate in the groove 111. In these embodiments, the size of the locking member 421 can be smaller than the size of the first push rod 422, and the fact that the first push rod 422 does not rotate ensures that the locking member 421 does not rotate either.

[0052] In some embodiments, the second height H2 is greater than the groove depth H0.

[0053] In some embodiments, the size and shape of the first push rod 422 and the locking member 421 ensure that they cannot rotate in the groove 111 .

[0054] It should be noted that because the first push rod 422 is sleeved around the outer periphery of the second push rod 423, the cross-sectional area of ​​the first push rod 422 is larger than the cross-sectional area of ​​the second push rod 423. The dimensions of the first push rod 422 and / or the locking member 421 can be used to represent the maximum external dimensions of the positioning portion 420. By aligning the dimensions of the first push rod 422 and / or the locking member 421 with the groove 111, the positioning portion 420 as a whole can be prevented from rotating within the groove 111, and the second push rod 423 can also be prevented from rotating. In other embodiments, the right end of the second push rod 423 can be configured to have a structure similar to the left end of the first push rod 422, and the right end of the second push rod 423 can be arranged around the smaller first push rod 422. The right end of the second push rod 423 can then be sized to match the dimensions of the groove 111, preventing the positioning portion 420 from rotating within the groove 111.

[0055] Figures 7 and 8 are cross-sectional views of a three-dimensional view of a substrate clamping device according to another embodiment of the present application. Similar to the embodiment shown in Figure 4, the substrate clamping device 700 of this embodiment also includes a mounting base 710, a positioning portion 720, a clamping portion 730, and a driving portion 750, wherein the driving portion 750 is specifically implemented as a cylinder. The mounting base 710 is connected to the driving portion 750 via a connecting block 711. Specifically, the connecting block 711 is connected to the outer shell of the cylinder. The second push rod 740 in the positioning portion 720 is partially located in the cylinder. The second push rod 740 is movably connected to the first push rod 722. The locking member 721 is sleeved on the second push rod 740 for locking the first push rod 722 and the second push rod 740. The positioning portion 720 further includes a sleeve 723 , which is wrapped around the periphery of the locking member 721 and the first push rod 722 . When the positioning portion 720 is disposed in the groove 111 , the sleeve 723 is disposed in the groove 111 and does not rotate.

[0056] In some embodiments, the sleeve 723 has a third height H3 and a third width W3 , the groove 111 has a groove depth H0 and a groove width W0 , and the third width W3 matches the groove width W0 , so that the sleeve 723 does not rotate in the groove 111 .

[0057] In some embodiments, the third height H3 is greater than the groove depth H0.

[0058] Similar to the locking member 421 and the first push rod 422 , the sleeve 723 may be provided with two oppositely disposed parallel surfaces, one of which, 724 , is shown in FIG7 . Both parallel surfaces are parallel to the groove wall of the groove 111 .

[0059] As shown in Figure 7, the sleeve 723 further includes at least one fixing member 725, which penetrates the wall of the sleeve 723 and is used to fix the sleeve 723 to the outside of the locking member 721 or the first push rod 722. Specifically, the fixing member 725 can be a jackscrew.

[0060] As shown in Figure 8 , a portion of the first push rod 722 is located within the sleeve 723. As shown in Figure 8 , the inner end of the fixing member 725 contacts the outer surface of the first push rod 722, directly fixing the relative position of the first push rod 722 and the sleeve 723. In other embodiments, the inner end of the fixing member 725 may also contact the outer surface of the locking member 721 to directly fix the locking member 721 and the sleeve 723.

[0061] As shown in Figure 8 , in this embodiment, the first push rod 722 has a threaded hole 726, into which the second push rod 740 is threadedly connected. A locking member 721 is disposed on the outer periphery of the second push rod 740 and is used to lock the first push rod 722 or the second push rod 740 to fix the relative position of the first push rod 722 and the second push rod 740. This application does not limit how the locking member 721 is locked. As shown in Figure 8 , in this embodiment, the locking member 721 has an internal thread, and the second push rod 740 is also threadedly connected to the locking member 721.

[0062] As shown in Figures 7 and 8, the cylinder serving as the driving portion 750 is connected to the gas source via a gas interface 751. A portion of the second push rod 740 is disposed within the interior space of the cylinder 750, and a spring 752 is disposed on the periphery of the second push rod 740. When the cylinder is operating, the second push rod 740 is forced to move in the first direction and compress or stretch the spring 752. According to such an embodiment, the cylinder can be used to control the position of the second push rod 740 in the groove 111, thereby controlling the position of the first push rod 722, and further controlling the position of the clamping portion 730, so that the substrate clamping device 700 can clamp or release the substrate as needed. Furthermore, during long-term operation, the positioning portion 720 will not rotate in the groove 111, thereby ensuring stable substrate clamping.

[0063] Before using the above substrate clamping device, it is often necessary to debug the substrate clamping device to determine the position of the clamping portion so as to effectively clamp the substrate. The present application also proposes a tool for debugging the above substrate clamping device.

[0064] FIG9 is a perspective schematic diagram of a tooling for a substrate clamping device according to an embodiment of the present application. FIG10 is a cross-sectional view of the simulated chuck device and the simulated substrate device in the tooling shown in FIG9 when they are in a separated state. FIG11 is a top view of the tooling shown in FIG9. FIG12 is a cross-sectional view taken along line CC in FIG11. As shown in FIG9 to FIG12 , the tooling 900 includes a simulated chuck device 910 and a simulated substrate device 920. The simulated chuck device 910 is provided with a plurality of clamping device mounting positions 911. Each clamping device mounting position 911 is used to mount a substrate clamping device 930. The simulated substrate device 920 includes a simulated edge 921 for simulating the edge of a substrate. When debugging the substrate clamping device 930, the clamping portion 931 of each substrate clamping device 930 is used to clamp the simulated edge 921. In this embodiment, six substrate clamping devices 930 are included, which are evenly spaced and distributed on the circumference of the substrate chuck. It should be noted that the tooling 900 of the present application can be used to debug the substrate clamping device described above in the present application, and can also be used to debug existing or any other substrate clamping device.

[0065] As shown in Figures 9 and 10, a number of fixing blocks 941, 942, and 943 can be used to fix each substrate clamping device 930 on the simulated chuck device 910. This application does not limit the specific installation method. It should be noted that the shape and size of the simulated chuck device 910 are the same as the shape and size of the actual substrate chuck, and the clamping device installation position 911 is the same as the installation position of the substrate clamping device in the actual process. The distance or height between the simulated chuck device 910 and the simulated substrate device 920 is also the same as the actual process requirements. It should be noted that when in use, the simulated substrate device 920 can be set on a horizontal surface to ensure that each substrate clamping device 930 is on the same horizontal plane.

[0066] As shown in Figure 10, there is a first centering part in the center of the simulated chuck device 910, specifically a positioning groove 912, and a second centering part in the center of the simulated substrate device 920, specifically a positioning protrusion 922. The positioning groove 912 and the positioning protrusion 922 can cooperate with each other to align the centers of the simulated chuck device 910 and the simulated substrate device 920.

[0067] As shown in Figure 10, the simulated edge 921 is a circular edge similar to the edge of a substrate, which is used to contact the contact end 932 on the clamping portion 931. The shape of the simulated edge 921 is the same as the shape of the substrate to be simulated. During the debugging process, the relative positions of the first push rod and the second push rod in the positioning portion 933 are adjusted so that the contact end 932 just contacts the simulated edge 921. The relative positions of the first push rod and the second push rod are then fixed by the locking member in the positioning portion 933. The substrate clamping device 930 is then removed from the simulated chuck device 910 and installed on the actual substrate chuck. At this time, the clamping state of the substrate by the substrate clamping device 930 is the same as the clamping state on the tooling.

[0068] As shown in FIG12 , the diameter of the simulated edge 921 is D. In some embodiments, the diameter D of the simulated edge 921 is smaller than the actual diameter of the substrate being simulated, and is used to adjust the position of the clamping portion of the substrate clamping device when the substrate is clamped. In other embodiments, the diameter D of the simulated edge 921 is larger than the actual diameter of the substrate being simulated, and is used to adjust the position of the clamping portion of the substrate clamping device when the substrate is released.

[0069] 9 and 12 , the simulated chuck device 910 in this embodiment is located above the simulated substrate device 920 , and the clamping portion 931 extends downward to clamp the simulated edge 921 .

[0070] Figure 13 is a perspective schematic diagram of a tooling of a substrate clamping device according to another embodiment of the present application. Figures 14 and 15 are both perspective schematic diagrams of the simulated chuck device and the simulated substrate device in the tooling shown in Figure 13 when they are in a separated state. Figure 16 is a top view of the tooling shown in Figure 13. Figure 17 is a cross-sectional view of line HH in Figure 16. As shown in Figures 13 to 17, the tooling 1300 includes a simulated chuck device 1310 and a simulated substrate device 1320. The simulated chuck device 1310 is provided with a plurality of clamping device mounting positions 1311. Each clamping device mounting position 1311 is used to mount a substrate clamping device 1330. The simulated substrate device 1320 includes a simulated edge 1321 for simulating the edge of a substrate. When debugging the substrate clamping device 1330, the clamping portion 1331 of each substrate clamping device 1330 is used to clamp the simulated edge 1321. FIG13 shows several fixing blocks 1341 and 1342 for securing each substrate clamping device 1330 to the simulated chuck device 1310. FIG13 also shows several support legs 1340 for supporting the simulated chuck device 1310. It should be noted that these support legs 1340 should be of the same height to ensure that the simulated chuck device 1310 is level and that each installed substrate clamping device 1330 is on the same horizontal plane.

[0071] As shown in Figure 15 , in this embodiment, the first pair of centers of simulated chuck assembly 1310 are positioning holes 1312 and 1313, and the second pair of centers of simulated substrate assembly 1320 are positioning shafts 1322 and 1323. When engaged, positioning hole 1312 and positioning shaft 1322 have a clearance fit, while positioning hole 1313 and positioning shaft 1323 have a threaded fit, aligning the centers of simulated chuck assembly 1310 and simulated substrate assembly 1320.

[0072] In other embodiments, the first centering portion may be a positioning shaft, and the second centering portion may be a positioning hole.

[0073] As shown in Figures 14 and 17 , a plurality of adjustment posts 1350 are provided on the surface of the simulated chuck assembly 1310 facing the simulated substrate assembly 1320 to adjust the distance d between the simulated chuck assembly 1310 and the simulated substrate assembly 1320. This distance d can be adjusted as needed. After adjustment of distance d is completed, the first and second centering pairs are locked to fix the distance d.

[0074] According to the tooling of the present application, the relative position of the first push rod and the second push rod in the positioning portion can be easily adjusted, thereby adjusting the position of the clamping portion in each substrate clamping device when clamping the substrate or releasing the substrate, and the relative position of the first push rod and the second push rod is fixed by the locking member in the positioning portion.

[0075] FIG18 is an exemplary flow chart of an adjustment method for a substrate clamping device according to an embodiment of the present application. This adjustment method can be used to adjust the substrate clamping device and can be adjusted on the tooling described above. All of the above content regarding the substrate clamping device and tooling can be used to illustrate this adjustment method. However, this adjustment method can also be performed directly on an actual substrate chuck and substrate. As shown in FIG18 , the adjustment method of this embodiment includes the following steps:

[0076] Step S1810: adjusting the relative positions of the first push rod and the second push rod, and thereby adjusting the rotational position of the clamping portion, so that the contact end is located at a target position and contacts the edge of the substrate;

[0077] Step S1820: Fix the relative positions of the first push rod and the second push rod by a locking member.

[0078] The above steps are described below with reference to FIG19 and FIG20.

[0079] Figures 19 to 23 illustrate the process of adjusting a substrate clamping device, specifically the process of adjusting the position of the clamping portion of a substrate clamping device 1900 when the substrate is clamped. The substrate clamping device 1900 shown is merely an example; the method steps can be implemented using the fixture 900 shown in Figure 9 . Because fixture 900 is used, the substrate edge in steps S1810 and S1820 is a simulated edge 921. As shown in Figure 19 , initially, the substrate clamping device 1900 is installed in the fixture's clamping device mounting position. At this point, a large gap G1 exists between the contact end 1931 of the clamping portion 1930 and the simulated edge 921. For embodiments including a pneumatic cylinder, the cylinder 1950 is in an unventilated state. Under the force of the spring 1952, the left end 1941 of the second push rod 1940 abuts against the left side 1951 within the interior space of the cylinder 1950, and the clamping portion 1930 is in its fully released state. As shown in Figure 20 , after cylinder 1950 is ventilated, second push rod 1940 and first push rod 1920 move to the right, spring 1952 is compressed, and left end 1941 of second push rod 1940 abuts right side 1953 within the interior space of cylinder 1950. At this point, contact end 1931 may or may not contact simulated edge 921. In the example shown in Figure 20 , contact end 1931 does not contact simulated edge 921. Specifically, a gap G2 exists between contact end 1931 and simulated edge 921, where G2 is smaller than G1. At this point, step S1810 includes:

[0080] Step S1811: Adjust the position of the locking member 1921 to lock the position of the second push rod 1940. As shown in Figure 21, this step specifically involves moving the locking member 1921 to the right end 1954 of the cylinder 1950 to lock the position of the second push rod 1940 there.

[0081] Step S1812: Move first push rod 1920 so that contact end 1931 contacts simulated edge 921. As shown in Figure 22, first push rod 1920 is moved rightward, further increasing the sum of the lengths L of first push rod 1920 and second push rod 1940, while simultaneously moving contact end 1931 leftward. It should be noted that since substrate clamping requires multiple substrate clamping devices, in this step, each substrate clamping device is adjusted individually or simultaneously to ensure that each contact end 1931 contacts simulated edge 921.

[0082] Step S1813: When contact end 1931 contacts simulated edge 921, adjustment of the position of first push rod 1920 stops. FIG. 22 shows a gap G3, indicating that contact end 1931 and simulated edge 921 are in contact. The horizontal distance of gap G3 can be 0 or a smaller value greater than 0, such as 0.02 to 0.03 mm.

[0083] When using a simulated substrate device for debugging, for example, if the actual diameter of the substrate is 300 mm, the diameter of the simulated edge can be designed to be 299.6 mm, thereby ensuring that the clamping force during use is sufficient and stable.

[0084] The process of adjusting the position of the clamping portion of the substrate clamping device 1900 when the substrate is released is similar to the above process.

[0085] In these embodiments, step S1820 is specifically implemented by moving locking member 1921 to end 1922 of first push rod 1920 adjacent to locking member 1921, and locking locking member 1921. As shown in FIG23 , locking member 1921 abuts end 1922 of first push rod 1920, securing first push rod 1920 in this position, completing the adjustment of the rotational position of clamping portion 1930. During this step, since locking member 1921, first push rod 1920, and second push rod 1940 are all threadedly connected, the cylinder is no longer ventilated, and the relative positions of first push rod 1920 and second push rod 1940 do not change.

[0086] According to the substrate clamping device, the tooling for debugging the substrate clamping device and the debugging method of the present application, the clamping degrees of multiple substrate clamping devices to be used can be adjusted to be consistent before being put on the machine, thereby ensuring the stability of the substrate during the process after being put on the machine.

[0087] The basic concepts have been described above. It will be apparent to those skilled in the art that the above disclosures are merely examples and do not limit the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and revisions to the present application. Such modifications, improvements, and revisions are suggested in the present application and remain within the spirit and scope of the exemplary embodiments of the present application.

[0088] At the same time, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "one embodiment," "an embodiment," or "an alternative embodiment" mentioned twice or multiple times in different locations in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application may be appropriately combined.

[0089] Similarly, it should be noted that, in order to simplify the presentation of this application and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this application sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not mean that the subject matter of this application requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single embodiment disclosed above.

[0090] In some embodiments, numbers are used to describe the quantity of components and attributes. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise stated, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in this application are all approximate values, which may change according to the required characteristics of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the settings of such numerical values ​​are as accurate as possible within the feasible range.

Claims

1. A substrate clamping device for a substrate chuck, wherein the substrate chuck has a groove for arranging the substrate clamping device, and the groove extends along a first direction, characterized in that, It includes a mounting base, a positioning part, a driving part and a clamping part. Among them, the mounting base is used to fix the substrate clamping device to the substrate chuck; the positioning part is used to be arranged in the groove. The positioning part includes a locking part, a first push rod and a second push rod. The first push rod and the second push rod are movably connected. The locking part is used to fix the relative positions of the first push rod and the second push rod. Among them, the size of the positioning part is adapted to the groove so that the positioning part will not rotate in the groove; the driving part is connected to the mounting base and is used to drive the first push rod and the second push rod to move in the groove; the clamping part is rotatably connected to the mounting base through a rotating shaft. The clamping part has a contact end and a connecting end. The contact end is used to contact the substrate. The connecting end is connected to the first push rod. When the first push rod moves, it drives the connecting end to move, and at the same time drives the clamping part to rotate and drives the contact end to move.

2. The substrate clamping device according to claim 1, wherein The locking part has a first width, and the groove has a groove width. The first width is adapted to the groove width so that the locking part will not rotate in the groove.

3. The substrate clamping device according to claim 2, wherein The locking part has two relatively arranged parallel planes, and both of the two parallel planes are parallel to the groove wall.

4. The substrate clamping device according to claim 1 or 2, characterized in that, The first push rod has a second width, and the groove has a groove width. The second width is adapted to the groove width so that the first push rod will not rotate in the groove.

5. The substrate clamping device according to claim 4, wherein, The first push rod has two relatively arranged parallel planes, and both of the two parallel planes are parallel to the groove wall.

6. The substrate clamping device according to claim 1, wherein, The positioning part further includes a sleeve. The sleeve wraps around the outer periphery of the locking part and the first push rod and is arranged in the groove. The size of the sleeve is adapted to the groove so that the sleeve will not rotate in the groove.

7. The substrate clamping device according to claim 6, wherein, The sleeve has a third width, and the groove has a groove width. The third width is adapted to the groove width so that the sleeve will not rotate in the groove.

8. The substrate clamping device according to claim 6, wherein The sleeve has two relatively arranged parallel planes, and both of the two parallel planes are parallel to the groove wall.

9. The substrate clamping device according to claim 6, wherein, A part of the first push rod is located inside the sleeve.

10. The substrate clamping device according to claim 6, wherein, The sleeve further includes at least one fixing part. The at least one fixing part penetrates through the barrel wall of the sleeve and is used to fix the sleeve on the outside of the locking part or the first push rod.

11. The substrate clamping device according to claim 1, characterized in that, The first push rod has a threaded hole, and the second push rod is screwed into the threaded hole. The locking part is arranged on the outer periphery of the second push rod.

12. A tool for debugging a substrate clamping device, characterized in that, It includes a simulation chuck device and a simulation substrate device. A plurality of clamping device mounting positions are arranged on the simulation chuck device. Each clamping device mounting position is used to mount one substrate clamping device. The simulation substrate device includes a simulation edge for simulating the edge of the substrate. When debugging the substrate clamping device, the clamping part of each substrate clamping device is used to clamp the simulation edge.

13. The tooling according to claim 12, wherein The center of the simulation chuck device has a first pair of middle parts, and the center of the simulation substrate device has a second pair of middle parts. The first pair of middle parts and the second pair of middle parts are cooperatively arranged.

14. The tooling according to claim 12, wherein, A plurality of adjusting columns are provided on the surface of the simulation chuck device facing the simulation substrate device, and the plurality of adjusting columns are used to adjust the distance between the simulation chuck device and the simulation substrate device.

15. The tooling according to claim 12, characterized in that, The simulation chuck device is located below the simulation substrate device, and the clamping portion extends upward to clamp the simulation edge.

16. The tooling according to claim 12, characterized in that, The simulation chuck device is located above the simulation substrate device, and the clamping portion extends downward to clamp the simulation edge.

17. The tooling according to claim 12, characterized in that, The diameter of the simulation edge is smaller than the actual diameter of the simulated substrate, and is used to debug the position of the clamping portion of the substrate clamping device when clamping the substrate.

18. The tooling according to claim 12, characterized in that, The diameter of the simulation edge is larger than the actual diameter of the simulated substrate, and is used to debug the position of the clamping portion of the substrate clamping device when releasing the substrate.

19. A method for adjusting a substrate clamping device, which is applied to the substrate clamping device according to any one of claims 1-11, characterized in that, Comprising: Adjust the relative positions of the first push rod and the second push rod, and further adjust the rotation position of the clamping portion so that the contact end is located at the target position and contacts the substrate edge; Fix the relative positions of the first push rod and the second push rod through the locking member.

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