Connector structure

By laminating conductive paint on a flexible base material with a flexible base layer and positioning the rigid housing away from the paint, the issue of stress concentration and paint damage is resolved, ensuring the wiring system's durability.

WO2025141864A1PCT designated stage expired Publication Date: 2025-07-03NISSAN MOTOR CO LTD
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Patent Information

Application Number
PCT/JP2023/047274
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-12-28
Publication Date
2025-07-03

AI Technical Summary

Technical Problem

The deformation of a flexible ceiling base material due to the presence of a rigid housing causes stress concentration on the conductive paint, leading to potential cracks and damage.

Method used

A conductive paint is laminated on a flexible base material via a flexible base layer, with a rigid housing attached away from the conductive paint in the wiring direction, ensuring no rigid member is between the conductive paint and the base material, thereby preventing stress concentration.

Benefits of technology

This configuration prevents damage to the conductive paint by eliminating stress concentration, even when the base material bends, maintaining the integrity of the wiring system.

✦ Generated by Eureka AI based on patent content.

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    Figure JP2023047274_03072025_PF_FP_ABST
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Abstract

[Problem] To prevent damage to a conductive paint. [Solution] According to the present invention, conductive paint 30 is laminated on a flexible base material 10 via a base layer, and a rigid housing 50 is attached to a region spaced away from the conductive paint in side view seen from a side surface in the wiring direction of the conductive paint.
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Description

Connector Structure

[0001] The present invention relates to a connector structure.

[0002] Automobiles are sometimes fitted with wire harnesses on the ceiling of the vehicle to supply power and electrical signals to equipment components such as lamps, speakers, switches, etc. One technology related to such harnesses is a vehicle ceiling module equipped with a wiring circuit made of conductive paint applied to the back side of a ceiling substrate, in which the ceiling substrate is formed with a porous material as a core material, a base material layer is formed on the back side of the ceiling substrate with a predetermined width along the wiring circuit, and conductive paint is applied to the top surface of the base material layer and solidified at room temperature (see Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2019-26102

[0004] When deformation occurs in the flexible ceiling substrate due to the presence of a rigid housing between the flexible ceiling substrate and the conductive paint, the area where it is bonded to the rigid housing does not deform, but the soft ceiling substrate below the boundary between the flexible insulating material and the rigid housing deforms at an angle, causing stress to concentrate in the conductive paint above it, which can cause cracks.

[0005] An object of the present invention is to prevent damage to the conductive paint.

[0006] In one aspect of the present invention, conductive paint is laminated on a flexible substrate via a flexible underlayer, and a rigid housing is attached in an area away from the conductive paint when viewed from the side in the wiring direction of the conductive paint.

[0007] The connector structure described above can prevent damage to the conductive paint.

[0008] Fig. 1 is a schematic cross-sectional view showing a connector structure according to a first embodiment; Fig. 2 is a schematic cross-sectional view showing a connector structure according to a first modified example of the first embodiment; Fig. 3 is a schematic cross-sectional view showing a connector structure according to a second modified example of the first embodiment; Fig. 4 is a schematic cross-sectional view showing a connector structure according to a first modified example of the second embodiment; Fig. 5 is a schematic cross-sectional view showing a connector structure according to a second modified example of the second embodiment;

[0009] First Embodiment Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. In the drawings, the same components are denoted by the same reference numerals, and duplicate explanations will be omitted. In the drawings, the size and proportions of each component are exaggerated to facilitate understanding of the embodiment, and may differ from the actual size and proportions.

[0010] Fig. 1 is a schematic cross-sectional view showing a connector structure 100 according to a first embodiment. As shown in Fig. 1, the connector structure 100 according to this embodiment includes a substrate 10, an insulating material 20, conductive paint 30, terminals 40, a housing 50, an insulating material 60, and an insulating sheet 70. The connector structure 100 can be used, for example, in a ceiling module, etc. This will be described in detail below.

[0011] Components such as lamps, speakers, sensors, etc. may be attached to substrate 10. Substrate 10 can be used as a flexible circuit board for automotive or non-automotive applications by using insulating sheet 70 in place of either or both of insulating material 20, insulating material 60.

[0012] The insulating material 20 is provided so that the substrate 10 is not electrically connected to the conductive paint 30. The insulating material 20 is disposed on the substrate 10. There are no particular limitations on the specific material of the insulating material 20 as long as it can exhibit electrical insulation. The insulating material 60 is disposed on the conductive paint 30, which will be described later, and can be configured in the same manner as the insulating material 20.

[0013] The conductive paint 30 is disposed adjacent to the insulating material 20 in the stacking direction. The conductive paint 30 is disposed (laminated) on the substrate 10 via the insulating material 20 and insulating sheet 70, which are underlying layers. In this embodiment, the conductive paint 30 is disposed so as to be spaced apart from the housing 50 in the surface direction. The conductive paint 30 can be made of copper, silver, or the like.

[0014] The terminals 40 are configured to be able to come into contact with external terminals that can be connected to the housing 50. The terminals 40 can be made of a metal material such as copper plated with tin or the like. The terminals 40 are configured to come into contact with the conductive paint 30 on the insulating material 20 and insulating sheet 70, which correspond to the base layer. This configuration ensures a reliable electrical connection between the conductive paint 30 and the terminals 40.

[0015] The housing 50 is configured as a portion for connecting external terminals. When viewed from the side in the wiring direction of the conductive paint 30, the housing 50 is not positioned between the conductive paint 30 and the substrate 10, but is attached to an area separated from the conductive paint 30. This configuration eliminates the presence of a rigid member between the conductive paint 30 and the substrate 10, and prevents stress concentration in the conductive paint 30 even if the substrate 10 bends in a direction intersecting the wiring direction.

[0016] Furthermore, by arranging the housing 50 and the conductive paint 30 at a distance, the housing 50 does not apply a load to the conductive paint 30, preventing damage to the conductive paint 30. The housing 50 can be made of an insulating material such as synthetic resin. The housing 50 can be integrated with an adjacent member, in this embodiment, the insulating material 20, by fitting with an adhesive or claws.

[0017] The insulating sheet 70 is formed by constructing the insulating materials 20, 60, etc. on a sheet and placing it on the base material 10. The insulating sheet 70 can be placed on the same surface as the insulating material 20 so that it is connected to the insulating material 20 in the stacking direction. A terminal unit N can be formed by placing terminals 40 and housings 50 on the insulating sheet 70. The conductive paint 30 and terminals 40 can be connected on the insulating sheet 70 by placing the insulating material 20 on the base material 10, placing the terminal unit N so that the insulating sheet 70 forms a base layer with the insulating material 20, and then laminating the conductive paint 30 on the base layer or the terminals 40.

[0018] With this configuration, the terminal unit N and the base material 10 can be attached with the terminals 40 attached to the insulating sheet 70. This allows the terminals 40 and the insulating sheet 70 to be adhered to each other, preventing the terminals from becoming uneven, and eliminating the need to attach each terminal to the insulating material when attaching a connector, as opposed to attaching terminals to the insulating material.

[0019] (Variation 1 of First Embodiment) Figure 2 is a schematic cross-sectional view showing a connector structure 100a according to Variation 1 of the first embodiment. In the first embodiment, the terminal unit N is configured by arranging the terminals 40 and the housing 50 on the insulating sheet 70. However, the terminal unit Na can also be configured by only the housing 50 and the terminals 40. In this case, an insulating material 20a serving as a base layer is arranged on the substrate 10, the terminal unit Na is arranged on the insulating material 20a, and the conductive paint 30 and the insulating material 60 are sequentially arranged (laminated) on the insulating material 20 or the terminals 40 serving as the base layer. The conductive paint 30 and the terminals 40 are connected on the insulating material 20.

[0020] In this way, the base layer can be constructed at relatively low cost by being constructed only from the insulating material 20. Note that, since the configuration other than the insulating material 20a and the terminal unit Na is the same as that of the first embodiment, the same components are denoted by the same reference numerals and description thereof will be omitted.

[0021] (Second Modification of First Embodiment) Figure 3 is a schematic cross-sectional view showing a connector structure 100b according to a second modification of the first embodiment. In the first embodiment, the housing 50 is disposed on the insulating sheet 70, and in the first modification, the housing 50 is disposed on the insulating material 20a, but the housing 50 may also be disposed on the substrate 10. Furthermore, in the first embodiment, the insulating material 60 is disposed on the conductive paint 30, but the insulating material 60 does not have to be disposed on the conductive paint 30 (see Figure 3).

[0022] 4 is a schematic cross-sectional view showing a connector structure 100c according to a second embodiment. In the first modification of the first embodiment, the terminal unit Na is configured from the rigid housing 50 and the flexible terminals 40. However, the terminal unit can be configured as follows.

[0023] In this embodiment, the terminal unit Nc can be composed of a rigid housing 50c and terminals 40c that protrude from the housing 50c and have contacts above the conductive paint 30. In this embodiment, the base layer can be composed of an insulating material 20. The terminals 40c penetrate a flexible insulating material 60c applied on the conductive paint 30 and contact the conductive paint 30 on the upper surface of the conductive paint 30. The terminals 40c are configured to be able to come into contact with external terminals, as in the first embodiment.

[0024] This configuration allows contact to be obtained regardless of the state of the wiring surface. The housing 50c can be made of a more elastic material than in the first embodiment, such as plastic or metal. Furthermore, by configuring the terminals 40c to protrude from the housing 50c, repairs can be made easier. Furthermore, compared to the first embodiment, the cost can be reduced because the insulating sheet 70 is not used as the base layer.

[0025] 5 is a cross-sectional view showing a connector structure 100d according to a first modification of the second embodiment. In the second embodiment, the terminal unit Nc is configured with a rigid housing 50c and terminals 40c that protrude from the housing 50c and have contacts above the conductive paint 30. However, the terminal unit can be configured as follows.

[0026] That is, as shown in FIG. 5, the terminal unit Nd can be composed of a rigid housing 50c and a terminal 40d that protrudes from the housing 50c and has contacts above the conductive paint 30. The insulating material 60 has a portion near the rigid housing 50c where no insulating material is applied, and the terminal 40d is configured to contact the conductive paint 30 at the upper surface, such as the end of the conductive paint 30, where no insulating material is applied. The terminal 40d is configured to be able to contact an external terminal, as in the first embodiment. This configuration allows the terminal to contact the conductive paint 30 without damaging the conductive paint 30.

[0027] The present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the claims. Fig. 6 is a cross-sectional view showing a connector structure 100e according to a second modification of the second embodiment. In the first modification of the second embodiment, the insulating material 60 is disposed on the conductive paint 30, but the insulating material 60 does not have to be disposed on the conductive paint 30.

[0028] 100, 100a, 100b, 100c, 100d, 100e Connector structure, 10 Base material, 20, 60 Insulating material, 30 Conductive paint, 40, 40c, 40d Terminal, 50, 50c Housing. 70 Insulating sheet, N, Na, Nc, Nd Terminal unit.

Claims

1. A connector structure in which a conductive paint is laminated on a flexible substrate via an underlayer, and a rigid housing is attached to a region away from the conductive paint in a side view seen from the side surface in the wiring direction of the conductive paint.

2. The connector structure according to claim 1, wherein the underlayer is disposed on the substrate, a conductive paint and a flexible terminal are disposed on the underlayer, and the conductive paint and the terminal can be electrically connected on the underlayer.

3. The underlayer includes a flexible insulating material disposed on the substrate and a flexible insulating sheet disposed so as to be connected to the insulating material. A terminal unit is constituted by the insulating sheet, the housing disposed on the insulating sheet, and the terminal extending from the housing. The terminal unit is disposed on the substrate so as to form the underlayer, and the conductive paint is disposed on the underlayer or the terminal. The connector structure according to claim 2.

4. The underlayer includes a flexible insulating material disposed on the substrate. A terminal unit is constituted by the housing and the terminal extending from the housing. The terminal unit is disposed on the underlayer, and the conductive paint is disposed on the underlayer or the terminal. The connector structure according to claim 2.

5. The underlayer includes a flexible insulating material disposed on the substrate. The housing and a flexible terminal that protrudes from the housing and obtains a contact at the upper part of the conductive paint constitute a terminal unit. The connector structure according to claim 1.

6. The terminal constituting the terminal unit penetrates the insulating material disposed on the conductive paint and is in contact with the conductive paint on the upper surface of the conductive paint. The connector structure according to claim 5.

7. The terminal is disposed so as to be in contact with the conductive paint on the upper surface of the conductive paint. The connector structure according to claim 5.

Citation Information

Patent Citations

  • Connector surface mounting mechanism

    JP1995211409A

  • Printed wiring board and manufacturing method of the same

    JP2013140830A

  • Vehicular ceiling module and method for manufacturing the same

    JP2019026102A

  • Electronic device

    WO2023135733A1