Optical laminate, transparent display including same, and manufacturing method therefor

Abstract

The present invention relates to an optical laminate, a display including same, and a manufacturing method therefor, the optical laminate including: a glass substrate; an adhesive layer formed on the substrate; a metal layer pattern positioned on the adhesive layer; a light-emitting diode (LED) positioned on the metal layer pattern; a transparent cover positioned on the light-emitting diode (LED); and an organic layer formed on the substrate to cover a portion of the metal layer pattern and to partially open a portion of the metal layer pattern, wherein an opening opened by the organic layer is smaller than the metal layer pattern.

Description

Optical laminate, transparent display including same, and method for manufacturing same

[0001] The present invention relates to an optical laminate, a transparent display including the same, and a method for manufacturing the same.

[0002] Recent technological advancements in the display market have led to a growing demand for large-area display devices. Light-emitting diodes (LEDs) are being used as billboards and electronic displays in various locations, including department stores, stores, and shopping malls. Transparent LED displays, in particular, are installed on building exterior walls and windows to display advertisements and various information. Glass- or PET (Polyester)-based transparent LED displays form circuit wiring on the PET film and arrange colored LEDs. When current is applied to the colored LEDs, they emit light. To enhance the transparency and visibility of transparent LED displays, it is necessary to reduce the visibility of the wiring while simultaneously arranging smaller LEDs.

[0003] Republic of Korea Patent No. 10-1789126 also discloses a method for manufacturing a large-area display of an LED display board using a PET substrate.

[0004] However, when mounting LEDs on narrow-pitch metal layer patterns with narrow spacing, especially thick-film patterns, using only conventional technology, short-circuit defects due to solder bridges frequently occur. Therefore, a method is needed to suppress short-circuit defects caused by solder paste flowing into adjacent metal layer patterns depending on the concentration of the solder paste during solder printing or LED mounting in a small LED SMT (Surface Mount Technology) process.

[0005]

[0006] The present invention provides an optical laminate and a transparent display that improve the occurrence of short-circuit defects by forcibly suppressing the phenomenon of solder paste encroaching on an adjacent metal layer pattern by adding an organic layer having a dam structure that keeps the solder paste within a certain area when mounting a light-emitting diode (LED) on a narrow-pitch metal layer pattern, and at the same time improves the fixing strength of the metal layer pattern, thereby preventing deformation and interface peeling of the metal layer pattern during replacement or repair of a light-emitting diode (LED) element, thereby increasing the success rate of replacement and repair and the conversion rate of good products.

[0007] In addition, the present invention aims to provide a method for manufacturing the optical laminate and transparent display.

[0008] The present invention relates to an optical laminate comprising a glass substrate, an adhesive layer formed on the upper portion of the substrate, a metal layer pattern positioned on the adhesive layer, a light emitting diode (LED) positioned on the metal layer pattern, a transparent cover positioned on the light emitting diode (LED), and an organic layer formed on the substrate to cover a portion of the metal layer pattern and to open a portion thereof, wherein an opening opened by the organic layer is smaller than the metal layer pattern.

[0009] In one example of the present invention, the organic layer may be a solder resist.

[0010] In another embodiment of the present invention, the solder resist may be in a solid form.

[0011] In one example of the present invention, the metal layer pattern may include solder paste on the upper side.

[0012] In one example of the present invention, the organic layer may be formed to cover 35% or less of the area of ​​the upper surface of the metal layer pattern.

[0013] In one example of the present invention, the organic layer may be formed to cover 5% or more and 30% or less of the area of ​​the upper surface of the metal layer pattern.

[0014] In one example of the present invention, it may include a ring-shaped sealing portion which is an organic layer formed in an area excluding an opening of the metal layer pattern.

[0015] In another example of the present invention, the shortest width from the outside of the ring to the inside of the ring of the ring-shaped sealing portion may be 1.25% or more of the length of one side of the metal layer pattern and one length selected from the major axis.

[0016] In another example of the present invention, the length of the width measured in the direction inward from any point outside the ring of the annular sealing portion may have a deviation of within 5%.

[0017] In another example of the present invention, the metal layer pattern may have a shear strength of 1 kgf / mm² or more, and the solder paste may have a shear strength of 1 kgf / mm² or more.

[0018] In one example of the present invention, the metal layer pattern may include a distance between the patterns of 60 to 500 μm.

[0019] In one example of the present invention, the metal layer may include at least one selected from the group consisting of copper (Cu), aluminum (Al), nickel (Ni), chromium (Cr), silver (Ag), iron (Fe), gold (Au), cobalt (Co), titanium (Ti), and tungsten (W).

[0020] In one example of the present invention, the glass substrate and the transparent cover may be a transparent display, each independently selected from at least one of glass, quartz, borosilicate, aluminosilicate, non-alkali, soda lime glass, meshed glass, colored glass, magic mirror, and holographic glass.

[0021] In one example of the present invention, when the transparent cover is made of glass, it may be a transparent display further including at least one selected from mesh glass, colored glass, magic mirror, and holographic glass.

[0022] In addition, the present invention comprises a step of preparing a metal film including an adhesive layer formed on one surface of a metal layer, a first protective film provided on one surface of the adhesive layer, and a second protective film provided on the other surface of the metal layer; a step of peeling off the first protective film of the metal film; a step of bonding the metal film so that the adhesive layer is disposed on one surface of a glass substrate; a step of peeling off the second protective film of the metal film;

[0023] The present invention relates to a method for manufacturing an optical laminate, comprising: a step of forming a metal layer pattern by patterning the metal layer; and a step of forming an organic layer in a portion where the metal layer pattern is not formed.

[0024] In one example of the present invention, the step of forming an organic layer in a portion where the metal layer pattern is not formed may include a step of patterning a solder resist on a substrate and a step of applying solder paste to the metal layer pattern.

[0025] In one example of the present invention, the step of forming the metal layer pattern may include: a step of forming a photoresist pattern on one surface of the metal layer; a step of etching an exposed area of ​​the metal layer by the photoresist pattern; and a step of peeling the photoresist pattern.

[0026] In another embodiment of the present invention, in the step of applying solder paste to the metal layer pattern, the solder paste applied on the metal layer pattern may not invade an adjacent metal layer pattern within 60 to 500 μm.

[0027] The optical laminate and transparent display according to the present invention have the effect of significantly reducing the occurrence of short circuits and the defect rate during the manufacture of the optical laminate and display, since LED elements can be stably mounted on a metal layer pattern having a narrow pitch of 60 to 500 μm.

[0028] In addition, the optical laminate and transparent display according to the present invention significantly improve the fixing strength of the metal layer pattern by forming the organic layer with a desirable area and shape, thereby preventing deformation and interface peeling of the metal layer pattern during replacement or repair of a light-emitting diode (LED) element, thereby increasing the success rate of replacement and repair and the conversion rate of good products.

[0029] FIG. 1 is a diagram showing the structure of an optical laminate according to one or more embodiments of the present invention.

[0030] FIG. 2 is a flowchart illustrating a process for manufacturing an organic layer formed to cover a portion of a metal layer pattern and open a portion of the metal layer pattern according to one or more embodiments of the present invention.

[0031] FIG. 3 is a diagram illustrating a phenomenon that occurs when replacing an LED element of an optical laminate according to an embodiment and a comparative example of the present invention.

[0032] Figures 4a to 4c are images of the shape of an optical laminate according to an embodiment and a comparative example of the present invention.

[0033] FIG. 5 is a drawing showing the upper surface of a metal layer pattern of an optical laminate according to an example of the present invention, viewed in a direction perpendicular to the substrate.

[0034] FIG. 6 is a photograph of the top surface of an optical laminate manufactured according to an example of the present invention, taken in a direction perpendicular to the substrate.

[0035] What each symbol represents is as follows:

[0036] 10: Metal layer

[0037] 20: Substrate

[0038] 30: Organic layer

[0039] 40: Solder paste

[0040] 50: Adhesive layer

[0041] 60: Sealing part

[0042]

[0043] The present invention relates to an optical laminate comprising a glass substrate, an adhesive layer formed on the upper portion of the substrate, a metal layer pattern positioned on the adhesive layer, a light-emitting diode (LED) positioned on the metal layer pattern, a transparent cover positioned on the light-emitting diode (LED), and an organic layer formed on the substrate so as to cover a portion of the metal layer pattern and to open a portion thereof, wherein an opening opened by the organic layer is smaller than the metal layer pattern, a display including the same, and a manufacturing method thereof. The optical laminate improves the fixing strength of the metal layer pattern on the substrate, thereby preventing deformation and interface peeling of the metal layer pattern when replacing or repairing a light-emitting diode (LED) element, thereby increasing the success rate of replacement and repair and the conversion rate of good products. In addition, since the LED element can be stably mounted on a metal layer pattern having a narrow pitch of 60 to 500 ㎛, the optical laminate and the display can be significantly reduced in the occurrence of short circuits and the defect rate.

[0044] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention and, together with the contents of the invention described above, serve to further understand the technical concept of the present invention. Therefore, the present invention should not be interpreted as being limited to the matters described in such drawings.

[0045] The terms used herein are for the purpose of describing embodiments and are not intended to limit the present invention. In this specification, singular forms also include plural forms, unless specifically stated otherwise. For example, "protective film" as used herein may refer to at least one of the first protective film and the second protective film.

[0046] As used herein, the terms "comprises" and / or "comprising" are used to mean that they do not exclude the presence or addition of one or more other components, steps, operations, and / or elements other than the components, steps, operations, and / or elements mentioned. Like reference numerals refer to like elements throughout the specification.

[0047] Spatially relative terms such as “below,” “bottom,” “lower,” “above,” “top,” and “upper” can be used to easily describe the relationship between one element or component and other elements or components, as depicted in the drawings. Spatially relative terms should be understood to include different orientations of the elements during use or operation in addition to the orientation depicted in the drawings. For example, if an element depicted in a drawing is flipped over, an element described as “below” or “lower” of another element may end up “above” the other element. Thus, the exemplary term “below” can include both the above and below directions. Elements can also be oriented in other directions, and thus spatially relative terms can be interpreted based on their orientation.

[0048] As used herein, “substantially” may be interpreted to include not only physically identical or identical, but also within the range of error in the measurement or manufacturing process, for example, it may be interpreted to mean an error range of 0.1% or less.

[0049]

[0050] < Optical laminates and transparent displays >

[0051] An optical laminate according to one or more embodiments of the present invention includes a glass substrate, an adhesive layer formed on the upper portion of the substrate, a metal layer pattern positioned on the adhesive layer, a light-emitting diode (LED) positioned on the metal layer pattern, a transparent cover positioned on the light-emitting diode (LED), and an organic layer formed on the substrate to cover a portion of the metal layer pattern and to be open at a portion thereof, wherein an opening opened by the organic layer may be smaller than a portion of the metal layer pattern.

[0052]

[0053] Referring to FIG. 1, which illustrates an example of the present invention, an organic layer (30) is formed to cover a part of a metal layer pattern (10) formed on a substrate (20), and a part thereof is formed to be open. In an optical laminate including a glass substrate (20), a metal layer pattern (10) formed on the glass substrate, a solder paste (40) applied to the metal layer pattern, and an organic layer (30) formed to cover a part of the glass substrate where the metal layer pattern is not formed and a part of the metal layer pattern, a transparent cover is positioned on the entire substrate, and more specifically, may be positioned to cover all of a light emitting diode (LED), a metal layer pattern, and an adhesive layer, and may be positioned at the outermost part of the optical laminate. At this time, the surface of the transparent cover may be the surface of the optical laminate and the transparent display. In FIG. 1, as an example of the present invention, a solder resist is used as the organic layer.

[0054]

[0055] Specifically, the substrate to which the present invention is applied has an organic layer having a dam structure that blocks the flow so that the solder paste is maintained only within a certain area, so that the solder paste can be cleanly applied without forming a solder bridge even after mounting a light-emitting diode (LED) element. The narrower the spacing between the metal layer patterns, the higher the possibility that an unintended path will be formed on the substrate (20), resulting in a short-circuit defect. However, when the present invention is applied, the risk of such a phenomenon is greatly reduced because the flow of the solder paste is physically suppressed. In particular, in the case of the present invention, more effective suppression is possible by the ring-shaped sealing portion, which is an organic layer formed in an area excluding the opening on the upper surface of the metal layer pattern. Specifically, when the present invention is applied, there is no risk of a short-circuit defect even when a light-emitting diode (LED) is mounted on a fine-pitch metal layer pattern with a spacing of 60 to 500 μm. Preferably, a light-emitting diode (LED) can be stably mounted on a fine-pitch metal layer pattern with a spacing of 60 to 500 μm without a short-circuit defect.

[0056]

[0057] Referring to an example shown in FIG. 3, a case of removing an LED element mounted on a substrate using a conventional technique and a case of removing an LED element mounted on a substrate using the present invention as shown in FIG. 2 are compared. In the case of the first schematic diagram using the conventional technique, although the organic layer fills the space between the metal layer patterns in the form of a dam, when the LED element is removed, the metal layer pattern that was fixing the element is pulled upward together, causing deformation and peeling from the adhesive layer. However, in the case of the second schematic diagram applying the present invention, since the organic layer physically protects and fixes not only the space between the metal layer patterns but also the end portion of each metal layer pattern, even if heat is applied to the solder paste to remove the LED element and the element is removed, deformation and peeling of the metal layer pattern do not occur.

[0058] Specifically, Figs. 4a and 4b are metal layer patterns formed on a substrate using a conventional technique. When the substrate is manufactured without an organic layer to protect the metal layer pattern as in Fig. 4b, it can be confirmed that the metal layer pattern is significantly deformed and peeled off and damaged by an attempt to remove the element as in Fig. 4a. On the other hand, Fig. 4c is a metal layer pattern formed on a substrate by applying the present invention, particularly when a solder resist is used as the organic layer. As shown in the photograph, it can be confirmed that the metal layer pattern is physically protected from deformation because the transparent organic layer covers a portion of the metal layer pattern from the corner to the inside. As described above, when the LED element is smoothly removed without damaging the metal layer pattern, the success rate of replacing the LED element increases, the conversion rate to good products increases, and the service life of the display can be extended.

[0059]

[0060] Glass substrate (20)

[0061] The above glass substrate and transparent cover may be made of glass or ceramic, and are not particularly limited as long as they do not impair the optical properties of the optical laminate. For example, they may include oxide glass such as silicate glass, borate glass, or phosphate glass. In this case, there is an advantage in that heat shrinkage does not occur during subsequent processing, and a predetermined hardness can be imparted to the optical laminate.

[0062] In particular, when the glass substrate or transparent cover is made of glass, the glass can be glass with a flat surface and a transmittance of 89% or more, and specifically, quartz, borosilicate, aluminosilicate, non-alkali, soda lime glass, meshed glass, colored glass, magic mirror, and holographic glass can be used without limitation in the scope of application. In this case, the shape can be used without limitation in a specific shape such as a wafer shape or a square flat plate.

[0063] Additionally, when the transparent cover is made of glass, it may further include one or more selected from mesh glass, colored glass, magic mirror, and holographic glass.

[0064] In one or more embodiments, the glass substrate may have a thickness of 0.5 mm to 20 mm. When the thickness of the glass substrate satisfies the above range, the glass substrate can be made thin while having excellent hardness, and can prevent deformation or cracking of the metal layer. Specifically, when the thickness is less than 0.5 mm, it may be difficult to protect the metal layer or other laminated members from external impact, and when it exceeds 20 mm, it may be disadvantageous in terms of thinning or weight reduction.

[0065] In one or more embodiments, the glass substrate may have a single-layer or multi-layer structure. For example, the glass substrate may have a single-layer structure formed by a single glass substrate, but is not necessarily limited thereto, and may have a multi-layer structure in which a plurality of glass substrates are laminated.

[0066]

[0067] Adhesive layer (50)

[0068] In one embodiment, the optical laminate may include an adhesive layer on one surface of the glass substrate.

[0069] The adhesive layer may be manufactured from an adhesive layer composition containing a silicone-based adhesive. The adhesive layer composition of the present invention contains a silicone-based additive and a solvent, and may further contain additives.

[0070] The above additive may be one or more of an anchorage, a cross linker, and a catalyst.

[0071] The above anchorage is added to increase the bonding strength with the metal layer during adhesive layer coating, thereby preventing the adhesive layer from being separated from the metal layer. Generally, there are no particular limitations on the material used as the anchorage, but it is preferable that it does not undergo thermal deformation at temperatures below 200°C.

[0072] The above crosslinking agent is a substance added for chemical bonding between components of the adhesive layer composition, and is preferably a product that does not undergo thermal deformation at 200°C or lower.

[0073] The above catalyst is a component added for curing the adhesive layer composition, and helps the adhesive layer composition transform from a liquid phase to a solid phase. Specific examples include a platinum catalyst, a palladium catalyst, and / or an osmium catalyst.

[0074] It is preferable from the viewpoint of adhesive stability that the additive of the present invention is included in an amount of 0.1% to 10% based on the total weight of the adhesive layer composition.

[0075] The adhesive layer of the present invention may be formed by heating and curing the adhesive layer composition at a temperature of 100°C to 180°C.

[0076] The adhesive layer may have a thickness of 5 µm to 50 µm, preferably 5 µm to 30 µm, and preferably 5 µm to 25 µm. If the thickness of the adhesive layer is less than 5 µm, sufficient adhesive strength with other members cannot be maintained, and if it exceeds 50 µm, there may be a disadvantage in terms of increasing the thickness of the product.

[0077] In one embodiment, the adhesive layer may have an adhesion strength of 5B or greater with respect to a glass substrate. As described above, the adhesive layer includes a silicone-based adhesive, and thus is characterized by excellent adhesion strength with respect to a glass substrate.

[0078] In one embodiment, the adhesion of the adhesive layer to the glass substrate may be evaluated by the measurement standard ISO 2409: Standard Test Methods for Measuring Adhesion by Tape Test.

[0079]

[0080] Metal layer pattern (10)

[0081] The above metal layer pattern may be used as an electrode in an electronic device such as a display device including the optical laminate. For example, a solder paste, which is a conductive material, may be applied onto the metal layer pattern and soldered to electrically connect the electrode of the light-emitting diode to the metal wiring of the substrate.

[0082] The metal layer is not particularly limited as long as it has electrical conductivity, and may include, for example, one or more selected from the group consisting of copper (Cu), aluminum (Al), nickel (Ni), chromium (Cr), silver (Ag), iron (Fe), gold (Au), cobalt (Co), titanium (Ti), and tungsten (W).

[0083] The metal layer on which the above pattern is formed is not particularly limited as long as it has electrical conductivity, and may include, for example, one or more selected from the group consisting of copper (Cu), aluminum (Al), nickel (Ni), chromium (Cr), silver (Ag), iron (Fe), gold (Au), cobalt (Co), titanium (Ti), and tungsten (W).

[0084] The above metal layer pattern can be formed by a known metal film process, for example, by preparing and attaching a metal film, or by using at least one method selected from the group consisting of electroless deposition, electrodeposition, sputtering, thermal evaporation, and electron beam evaporation, but is not limited thereto.

[0085] The above metal layer pattern may preferably have a thickness of 30 μm to 105 μm. If the thickness of the metal layer exceeds 105 μm, it may not be easy to form a uniform metal film or pattern, and if it is less than 30 μm, a problem of not being able to obtain conductivity for smooth operation may occur. In particular, in the case of a metal layer pattern satisfying the above preferred thickness, it may be difficult to form a pattern-to-pattern interval of 50 μm or less, and thus it may be more suitable for forming a thick-film pattern rather than a fine pattern. Therefore, in forming the metal layer pattern of the present invention, it is particularly preferable to form it so that the minimum pattern-to-pattern interval exceeds 50 μm.

[0086]

[0087] Organic layer (30)

[0088] The organic layer is formed on a portion of the adhesive layer where the metal layer pattern is not formed, i.e., on the adhesive layer exposed by etching the metal layer when the metal layer pattern is formed. In addition, the organic layer may be formed to include a portion where the metal layer pattern is not formed and a portion of the metal layer pattern. For example, the organic layer may be formed by filling a portion where the metal layer pattern is not formed, as shown in Fig. 1, and may be formed in a form that is connected to a portion of the adhesive layer where the metal layer pattern is not formed and partially covers the metal layer.

[0089] Specifically, the organic layer covering the area on the substrate where the metal layer pattern is not formed is formed as a dam structure that keeps the solder paste within a certain area, thereby forcibly suppressing the phenomenon of the solder paste encroaching on the adjacent metal layer pattern, thereby improving the occurrence of short-circuit defects. In addition, if the organic layer is formed to partially cover the edge area of ​​the metal layer pattern inward, the metal layer can be effectively protected from deformation of the metal layer shape and interfacial peeling that may occur during an external impact or an attempt to remove the element. When the present invention is applied, an optical laminate and a transparent display with an increased success rate of replacement and repair and a good product conversion rate can be manufactured due to the above-described effects.

[0090] At this time, the metal layer pattern that is not covered or only partially covered by the organic layer may be for mounting a light-emitting diode (LED). In this way, when the organic layer is formed to only partially cover the metal layer pattern, the degree to which the organic layer is formed on the metal layer pattern is not particularly limited as long as it is suitable for mounting a light-emitting diode (LED).

[0091] Furthermore, the organic layer may be formed to cover 35% or less of the area of ​​the upper surface of the metal layer pattern, preferably 30%. Generally, when manufacturing a substrate, solder paste is applied to cover 65% or more of the area of ​​the metal layer pattern. This is because, if the solder paste is applied to less than 65% of the pattern area, the fixing force of the element decreases, increasing the defect rate. Therefore, the area of ​​the organic layer covering the metal layer pattern is not limited, but the opening opened by the organic layer may be smaller than the metal layer pattern. In particular, the organic layer is preferably formed to cover 35% or less of the area of ​​the upper surface from the outside to the inside of the metal layer pattern. In addition, in the process of forming the organic layer to partially cover the metal layer pattern, if the organic layer remains at a location where the element is to be mounted, current cannot flow, so it is preferable that no residual film of the organic layer remains in the opening.

[0092] More preferably, the organic layer may be formed to cover 5% to 30% of the area of ​​the upper surface of the metal layer pattern. When the above range is satisfied, the physical protection and fixation of the metal layer pattern is possible, so that the shear strength increases, thereby suppressing deformation or interface peeling of the pattern. At the same time, the area of ​​the metal layer pattern on which the solder paste can be applied is also sufficient, so that the device mounted on the metal layer pattern can also be stably fixed. For example, according to KEA CG-6818, the solder paste can be said to have effective fixing strength when the measured shear strength is 1 kgf / mm² or more. When the above range is exceeded, the area on which the solder paste can be applied is insufficient, making device mounting impossible or insufficient fixing strength, and when the above range is not satisfied, the shear strength of the metal layer pattern may be very insufficient.

[0093] In addition, referring to FIG. 5, which illustrates the upper surface of the metal layer pattern in a direction perpendicular to the substrate in an optical laminate according to an example of the present invention, the organic layer may include a ring-shaped sealing portion (60), which is an organic layer formed in an area excluding an opening of the metal layer pattern. The sealing portion (60) is formed in a ring shape extending along the edge according to the shape of the metal layer pattern, and since the shape of any metal layer pattern when viewed in the direction perpendicular to the substrate is not limited to a polygon, an irregular shape, a circle, etc., the shape of the ring formed by the sealing portion is also not limited thereto. The polygon includes a shape that is substantially a polygon, and may include, for example, a rounded rectangle having a curved vertex. Since the organic layer includes a sealing portion surrounding the upper edge of the metal layer pattern, the organic layer and the sealing portion can block contact of any metal layer pattern with an adjacent metal layer pattern or contact with solder paste applied to an adjacent metal layer pattern, and can physically fix and protect the metal layer pattern. In particular, when considering the desirable shape, length, and area of ​​the organic layer to be formed on the upper surface of the metal layer pattern, it can be more effective than when the organic layer is formed in the form of a dam only in the area of ​​the substrate where the metal layer pattern is not formed.

[0094] For example, it is preferable that the shortest width from the outside of the ring to the inside of the ring of the above-mentioned ring-shaped sealing portion be at least 1.25% of one selected from the length and major axis of one side of the metal layer pattern.

[0095] In the present invention, the more uniform the width of the annular sealing portion, the more advantageous it is in terms of protection of the metal layer pattern and fixing force. That is, the opening on the metal layer pattern where the annular sealing portion is not formed may have a shape close to a shape in which the area is reduced at the same ratio as the metal layer pattern, and specifically, it is preferable that the length of the width measured inward from any point outside the ring of the annular sealing portion has a deviation of within 5%. If the width of the sealing portion is not uniform, even if the width measured at a specific point is greater, the fixing force may be lower than when the sealing portion has a uniform width overall.

[0096] As an example of the present invention, referring to FIG. 5, which illustrates the upper surface of a metal layer pattern when viewed in a direction perpendicular to a substrate of an optical laminate, when the metal layer pattern is a square with rounded corners, the length of one side is A, and the shortest width from the outside of the ring to the inside of the ring-shaped sealing portion (60) can be B1, B2, B3, or B4. When the shortest width is B1, the length of B1 is preferably 1.25% or more of the length A, and the lengths of B1, B2, B3, and B4 can be uniform, and more preferably, the deviation can be within 5%.

[0097] Referring to FIG. 6, which is an example of the present invention, an organic layer is formed to partially cover the upper surface of a circular metal layer pattern, and the ring-shaped sealing portion may also have a uniform width.

[0098] In addition, by forming the organic layer, it is possible to prevent diffuse reflection caused by the adhesive layer. Specifically, as described above, a metal layer pattern is formed on one surface of the adhesive layer of the present invention, and the metal layer pattern may have a surface roughness (Rz) of 0.1 to 20 μm. At this time, if the adhesive layer includes a silicone-based adhesive layer, and the surface shape of the metal layer is directly reflected in the adhesive layer, when the metal layer is patterned and then peeled off, the exposed adhesive layer surface has irregularities derived from the metal layer having a certain surface roughness, and this causes light scattering and increases haze when applied to a transparent display. Therefore, by providing an organic layer in a portion of the adhesive layer where the metal layer pattern is not formed so that the surface irregularities of the adhesive layer do not appear, diffuse reflection can be prevented, haze can be reduced, and visibility can be improved.

[0099] In this respect, the organic layer may have a surface roughness (Rz) of 5.0 μm or less. If the surface roughness (Rz) exceeds 5.0 μm, diffuse reflection occurs, increasing haze and causing a problem of blurry perception.

[0100] The organic layer may include a solder resist. More specifically, the organic layer may be formed by a solder resist. The solder resist may be formed by any one of thermal curing, photocuring, and thermal curing, and may also be either a liquid type or a film type.

[0101] If the solder resist is of a liquid type, it may be manufactured from a solder resist composition containing a binder resin, a photopolymerizable compound, a photopolymerization initiator, a pigment, a dye, a solvent, and / or other additives. If the solder resist is of a liquid type, the printing and drying processes must be repeated during manufacturing, and therefore, in the present invention, it is more preferable to apply a solid type.

[0102] When the solder resist is of a solid type, more preferably a film type, it may include a protective film, a photosensitive resin layer, and a base film. When the solder resist is of a film type, it is preferable in that air bubbles are unlikely to be mixed between the substrate and the solder resist layer, the film has excellent flatness, so that a light-emitting diode (LED) can be efficiently mounted, and it has a high resolution. The base film includes a polyester film such as polyethylene terephthalate and is used as a support. The protective film functions as a protective layer to prevent damage to the resist, but is not limited thereto. The photosensitive resin layer may use the same components as the liquid type solder resist described above.

[0103] The above organic layer can be patterned using a solder resist using a photolithography method to form a structure that only partially covers the metal layer pattern. Accordingly, a light-emitting diode (LED) can be applied onto the metal layer pattern in a form suitable for mounting. The specific method of photolithography is not particularly limited, but the method described in the following description of the method for manufacturing an optical laminate can be applied without limitation.

[0104] As described above, when the organic layer partially covers the metal layer pattern, the thickness laminated on the metal layer pattern may be 1 µm to 3 mm.

[0105]

[0106] solder paste (40)

[0107] The solder paste (40) of the present invention is applied and soldered on a metal layer pattern, and the electrodes of the light-emitting diode and the metal wiring of the substrate can be electrically connected by the solder paste, and is also called solder cream. The solder paste may contain about 85 wt% to 90 wt% of solder powder in powder form and about 10 wt% to 15 wt% of paste flux. The paste flux may be included to prevent the surface of the metal layer pattern from coming into contact with the air and forming an oxide layer, thereby facilitating the mounting of the device.

[0108] The solder paste can be adjusted in concentration by adding a diluent, and preferably, when the concentration is 100 to 220 Pa·S, the flowability is suitable, which is advantageous in preventing short circuits due to suppression of solder bridge formation. If the solder paste is less than the above concentration range, it is too dilute, and even though an organic layer that functions as a dam between metal layer patterns exists, it is easy to invade the surrounding metal layer patterns, and the density may be low, which may not be suitable in terms of conductivity. In addition, if the solder paste exceeds the above concentration range, the SMT (surface mount technology) process may not be possible.

[0109] Accordingly, the solder paste according to the present invention may optionally further include an organic solvent as a diluent. The organic solvent is specifically a hydrocarbon (e.g., dodecane, tetradecane); an aromatic hydrocarbon (e.g., benzene, toluene, xylene, trimethylbenzene, butyl benzoate, dodecylbenzene); a ketone (e.g., methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone); an ether (e.g., tetrahydrofuran, 1,4-dioxane and tetrahydrofuran, 1,3-dioxalane, dipropylene glycol dimethyl ether); an alcohol (e.g., 2-methoxyethanol, 2-butoxyethanol, methanol, ethanol, isopropanol, α-terpineol, benzyl alcohol, 2-hexyldecanol); Esters (e.g., ethyl acetate, ethyl lactate, butyl acetate, diethyl adipate, diethyl phthalate, diethylene glycol monobutyl acetate, propylene glycol monomethyl ether acetate, ethyl lactate, methyl 2-hydroxyisobutyrate, propylene glycol monomethyl ether acetate); and, amides (e.g., N-methylpyrrolidone, N,N-dimethylformamide, and N,N-dimethylacetamide); glycol derivatives (e.g., cellosolve, butyl cellosolve); glycols (e.g., ethylene glycol; diethylene glycol; dipropylene glycol; triethylene glycol; hexylene glycol; 1,5-pentanediol); glycol ethers (e.g., propylene glycol monomethyl ether, methyl carbitol, butyl carbitol); Rosin-based resin; and petroleum solvents (e.g., petroleum ether, naphtha), etc., and preferably, rosin-based resin can be used, but is not limited thereto.

[0110] The solder paste may optionally further contain auxiliary additives such as a rheology modifier or thickener to give it a creamy form.

[0111]

[0112] Light-emitting diode (LED)

[0113] The light emitting diode (LED) of the present invention can be applied to any known light emitting diode (LED) without limitation. In particular, the present invention may be a light emitting diode (LED) that must be mounted on a substrate having a metal layer pattern with a narrow pitch, particularly a thick film pattern, and preferably, the LED can be applied to a metal layer pattern with a distance between the patterns of 60 to 500 μm. Using the present invention, it is possible to manufacture an optical laminate and display that significantly reduces short-circuit occurrence and defect rate, particularly when mounting a 4-pin to 6-pin light emitting diode.

[0114]

[0115] <Method for manufacturing optical laminates>

[0116] A method for manufacturing an optical laminate according to an embodiment of the present invention may include the steps of: preparing a metal film including a silicone-based adhesive layer formed on one surface of a metal layer, and including a first protective film provided on one surface of the silicone-based adhesive layer and a second protective film provided on the other surface of the metal layer; peeling off the first protective film of the metal film; bonding the metal film so that the adhesive layer is disposed on one surface of a glass substrate; peeling off the second protective film of the metal film; patterning the metal layer to form a metal layer pattern; and forming an organic layer in a portion where the metal layer pattern is not formed.

[0117]

[0118] Steps to prepare a metal film

[0119] The above protective film may be provided to protect the surface of the metal layer and / or the adhesive layer from the outside, and may be provided in the form of, for example, a first protective film formed on one side of the adhesive layer to protect the surface of the adhesive layer, and a second protective film formed on one side of the metal layer to protect the surface of the metal layer.

[0120] In one embodiment, the protective film may be used as a single-layer structure formed of one layer, but is not limited thereto, and may also be used as a multi-layer structure in which one or more protective films are continuously laminated.

[0121] In one embodiment, the protective film may be formed by laminating a second protective film and a first protective film on one surface of the metal layer and the adhesive layer, respectively, using a laminator.

[0122] The above protective film is not particularly limited as long as it is for protecting the surface of the metal layer and / or the adhesive layer, and for example, polyethylene terephthalate (PET), polyethylene isophthalate (PEI), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), diacetyl cellulose, triacetyl cellulose (TAC), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polymethyl acrylate (PMA), polyimide (PI), polymethyl methacrylate (PMMA), polyethyl acrylate (PEA), polyethyl methacrylate (PEMA), and cyclic It may include at least one selected from the group consisting of cyclic olefin polymers (COPs), and in terms of ease of acquisition and processing convenience, polyethylene terephthalate (PET), triacetyl cellulose (TAC), polycarbonate (PC), polyimide (PI), and cyclic olefin polymers (COPs) can be preferably used.

[0123] The thickness of the above protective film is not particularly limited and may be, for example, 10 μm to 200 μm.

[0124] Meanwhile, the metal film described above is exemplified by a metal film having a protective film on one side of the metal layer and the adhesive layer, but is not limited thereto. For example, it may include only one protective film among the protective film formed on one side of the metal layer and the protective film formed on one side of the adhesive layer.

[0125]

[0126] Step of peeling off the first protective film of the metal film

[0127] Specifically, the step of peeling off the first protective film provided on the metal film may be peeling off the first protective film disposed on the lower surface of the adhesive layer of the metal film.

[0128] The peeling of the first protective film can be appropriately performed within a range that does not harm the purpose of the present invention, and a method used in a conventional peeling process of a release film can also be used.

[0129]

[0130] Step of bonding the above metal film

[0131] The step of bonding the metal film so that the adhesive layer is disposed on one surface of the glass substrate may be bonding the surface of the adhesive layer exposed to the outside by peeling off the first protective film onto one surface of the glass substrate.

[0132] Bonding of the above adhesive layer and the glass substrate can be appropriately performed within a range that does not harm the purpose of the present invention, and can be bonded using, for example, a laminator or the like.

[0133]

[0134] Step of peeling off the second protective film of the metal film

[0135] The step of peeling off the second protective film provided on the above metal film may be peeling off the second protective film disposed on the upper surface of the metal layer of the metal film.

[0136] The peeling of the second protective film may be performed by substantially the same method as the peeling of the first protective film.

[0137] Meanwhile, the method for manufacturing the optical laminate described above is described by way of example, a method for manufacturing the optical laminate using a metal film, but is not necessarily limited thereto.

[0138] For example, in another embodiment of the present invention, if the metal film does not have a second protective film, the step of peeling off the second protective film provided on the metal film may be omitted.

[0139]

[0140] Step of forming a metal layer pattern

[0141] The step of forming a metal layer pattern of an optical laminate according to one embodiment of the present invention may include the steps of forming a photoresist pattern on one surface of the metal layer; etching an exposed area of ​​the metal layer by the photoresist pattern; and peeling off the photoresist pattern.

[0142] Specifically, the step of forming a photoresist pattern on one surface of the metal layer may include a step of applying a composition for forming a photoresist pattern onto the metal layer by spin coating, slit coating, inkjet printing, etc., a step of drying and heat-treating the applied composition for forming a photoresist pattern to form a photoresist film, and a step of selectively exposing and developing the photoresist film to dissolve and remove the photoresist film corresponding to an exposed area or a non-exposed area, thereby forming a photoresist pattern.

[0143] The step of forming the above photoresist pattern can be performed by a known method, and details are omitted.

[0144] The step of etching the exposed area of ​​the metal layer by the above photoresist pattern is not particularly limited and may be performed by a dry etching process or a wet etching process.

[0145] In one embodiment, the wet etching process may be performed using an etchant including at least one selected from the group consisting of nitric acid, phosphoric acid, and acetic acid. As described above, the adhesive layer is characterized by including a silicon-based adhesive, and thus has excellent chemical resistance to an etchant including at least one selected from the group consisting of nitric acid, phosphoric acid, and acetic acid. Therefore, when the etching process is performed by wet etching using an etchant including at least one selected from the group consisting of nitric acid, phosphoric acid, and acetic acid, not only is the etching performance for the metal layer excellent, but even if the adhesive layer located under the metal layer is exposed to the etchant, damage (physical and chemical damage and clouding phenomenon) to the adhesive layer may not occur.

[0146] The above dry etching process or wet etching process can be performed by a known method, and details are omitted.

[0147] The step of stripping the above photoresist pattern may be performed by immersing the substrate on which the resist pattern is formed in a resist stripping solution, or by spraying the stripping solution onto the substrate. In addition, in this case, physical processing such as ultrasonic irradiation or contact with a brush that rotates or swings left and right may be used in combination.

[0148] In one embodiment, the resist stripping conditions may be a temperature of about 15°C to 100°C, preferably 30°C to 70°C, and the immersion or spraying time may be preferably about 1 minute to 20 minutes, but is not limited thereto and may be appropriately modified according to the needs of the user.

[0149] In one embodiment, after the resist stripping solution treatment, an additional cleaning process may be performed to remove any stripping solution remaining on the substrate. The cleaning process may be performed in the same manner as the stripping process described above, except that water or isopropyl alcohol is used instead of the stripping solution.

[0150]

[0151] Step of forming an organic layer in a part where a metal layer pattern is not formed

[0152] In addition, according to a method for manufacturing an optical laminate according to an embodiment of the present invention, the step of forming an organic layer in a portion where the metal layer pattern is not formed may include a step of patterning a solder resist on a substrate and a step of applying solder paste on the metal layer pattern.

[0153] In one embodiment of the present invention, the step of forming the organic layer may be a step of forming using either a liquid type or a solid type solder resist, and preferably a step of forming a film type solder resist layer, but the forming method is not particularly limited.

[0154] FIG. 2 is a flowchart illustrating a process for manufacturing an organic layer formed to cover a portion of a metal layer pattern and to leave a portion open, according to one or more embodiments of the present invention. Referring to FIG. 2, a metal layer pattern (10) is formed on a substrate, and a solder resist is applied to an upper portion of the substrate (20). Next, the substrate is exposed to light while partially covering the upper surface of the metal layer pattern (10), and the exposed portion is dissolved and removed. The solder resist is photocured or thermally cured only in a portion that is not selectively exposed by the mask, so that it remains in the form of a dam in a subsequent development process. As a result of the development process, the surface of the substrate is selectively exposed to form an opening, and a dam-like shape is formed with the organic layer (30). In addition, when viewed in a direction perpendicular to the substrate, as illustrated in FIG. 5, the metal layer pattern includes a ring-shaped sealing portion, which is an organic layer formed in an area excluding the opening. Afterwards, through the SMT (surface mount technology) process, a mask is placed on the area except for the area where solder paste is to be applied, and then solder paste is applied using a squeezer. By using the organic layer (30) and the ring-shaped sealing portion filled in the area where the metal layer pattern (10) on the substrate is not formed, solder paste (40) can be applied only to the opening without invading the adjacent metal layer pattern (10).

[0155] In addition, the method for manufacturing an optical laminate according to one embodiment of the present invention may further include a step of mounting a light emitting diode (LED) on the optical laminate described above.

[0156]

[0157] Transparent Display and Manufacturing Method

[0158] The present invention includes a transparent display manufactured using the optical laminate of the present invention described above and a manufacturing method thereof.

[0159] Specifically, the present invention relates to a transparent display including the optical laminate described above and a light emitting diode (LED). Fig. 1 is a diagram showing an example of the transparent display of the present invention. Referring to Fig. 1, the transparent display of the present invention has a form in which a light emitting diode (LED) is formed in an opening in a patterned metal layer of the optical laminate where an organic layer is not formed. More specifically, a portion of the patterned metal layer of the metal film substrate where an organic layer is not formed may further include solder paste, and a light emitting diode (LED) may be mounted through the solder paste. The arrangement interval or density of the light emitting diodes (LED) is not particularly limited, but may be arranged in a grid shape. In this case, the upper, lower, left, and right intervals may be 1 to 50 mm, and the intervals of a plurality of light emitting diodes (LEDs) may be the same or different from each other. When a light emitting diode (LED) is formed on the metal film substrate of the present invention, there is an advantage as a transparent display capable of transmitting and reproducing images on a substrate having transparency.

[0160] The present invention may further include a structure and method including an overcoat layer covering the upper portion of the light-emitting diode (LED) or the entire transparent display. The overcoat layer may be made of any material known in the art without limitation, and its thickness is not particularly limited as long as it is at a level commonly applied by those skilled in the art.

[0161] The optical laminate of the present invention, by exhibiting the above-described characteristics, can be suitably used in display devices requiring large areas and low resistance, and in particular, has the advantage of being particularly suitable for use in devices that can be exposed to the external environment for long periods of time, such as transparent displays, in terms of excellent heat resistance and reliability in high temperature and high humidity environments.

[0162] Hereinafter, experimental examples including specific examples and comparative examples are presented to help understand the present invention, but these are only illustrative of the present invention and do not limit the scope of the appended claims. It will be apparent to those skilled in the art that various changes and modifications to the examples are possible within the scope and technical idea of ​​the present invention, and it is natural that such changes and modifications fall within the scope of the appended claims. In addition, "%" and "part" indicating the content below are based on weight unless specifically stated.

[0163]

[0164] Example I.1 and Comparative Example I.1: Fabrication of optical laminate

[0165] Example I.1

[0166] Silicone (DOWSIL) TM A composition having a silicone adhesive content of 50% was prepared using 96-083 Silicone Adhesive Kit, DOW; solid content 70%), and then the composition was stirred with a stirrer to prepare an adhesive layer composition.

[0167] Afterwards, the adhesive layer composition was applied on one surface of a copper metal substrate (surface roughness (Rz) 9.0 ㎛) with a thickness of 30 ㎛ by the gravure coating method, and then cured at 150°C for 2 minutes to produce a metal film having a silicone adhesive layer with a thickness of 10 ㎛ formed on one surface of the metal substrate.

[0168] Afterwards, the adhesive layer of the metal film was placed on one side of a glass substrate having a thickness of 2 mm, and then the metal film was bonded using a sheet to sheet method to laminate the metal layer.

[0169] Afterwards, a metal layer pattern was formed by patterning the metal layer using photolithography. The formed metal layer pattern was a narrow-pitch metal layer pattern, with a distance between patterns of 140 μm.

[0170] An organic layer was formed using solder resist on a portion of the adhesive layer where no metal layer pattern was formed, thereby manufacturing an optical laminate of Example I.1.

[0171] Specifically, the solder resist was prepared by mixing a monomer (ELVAROY TM, manufacturer: DOW), a binder (VORAMERTM, manufacturer: DOW), and a photoinitiator (Irugacure 907, manufacturer: Ciba Specialty Chemical (Co., Ltd.)) in a 5:3:2 ratio, and then mixing the PGMEA solvent and the monomer, binder, and photoinitiator mixture in a 5.5:4.5 ratio to prepare a liquid solution. This was uniformly applied to the top of the film and dried in an 85°C oven for 6 minutes to produce a transparent DFSR (Dry Film Solder Resist), which was then attached to the substrate. At this time, the thickness of the organic layer was 50 μm, and the organic layer was formed to cover 30% of the upper surface area of ​​the metal layer pattern from the corners.

[0172]

[0173] Afterwards, the above transparent DFSR was patterned using a photolithography method to form a pattern of the DFSR, and then, through the SMT (surface mount technology) process, a mask was placed on the area except for the area where solder paste was to be formed, and then solder paste was applied using a squeezer.

[0174]

[0175] Comparative Example I.1

[0176] An optical laminate was manufactured in the same manner as in Example I.1 above, except that the organic layer was not formed.

[0177]

[0178] Experimental Example I: Photographing the shape of an optical laminate

[0179] For the optical laminates of the examples and comparative examples, the shape was photographed after the mounted LED elements were removed and is shown in Fig. 4a.

[0180] Referring to FIGS. 4a and 4b, in the case of a comparative example in which a substrate was manufactured without an organic layer to protect the metal layer pattern, as shown in FIG. 4b, it can be confirmed that the metal layer pattern was significantly deformed and peeled off and damaged by an external force, as shown in FIG. 4a. Since solder paste reacts to heat, heat must be applied when replacing an LED element, and this affects the metal layer pattern, making it easy for the ends in particular to be deformed.

[0181] In the case of damage as in the comparative example, not only the LED element should be replaced, but also the metal layer pattern or substrate should be replaced. On the other hand, Fig. 4c is an example of applying the present invention, and in particular, it is manufactured to cover 30% of the metal layer pattern using a solder resist as an organic layer. As shown in the photo, since the transparent organic layer protects a portion of the metal layer pattern from the outer part to the inner part, it can be confirmed that the metal layer pattern is maintained without deformation or peeling even when the same impact is applied.

[0182]

[0183] Examples II.1 to II.5 and Comparative Examples II.1 to II.3

[0184] Example II.1 was manufactured in the same manner as Example I.1. Examples II.2 to II.5 and Comparative Examples II.1 to II.3 were manufactured in the same manner as Example II.1, except that the area where the organic layer covers the metal layer pattern was formed as shown in Table 1. At this time, the annular sealing portions of all Examples and Comparative Examples were formed so that the width from the outside of the ring to the inside of the ring was uniform.

[0185]

[0186] Area of ​​the organic layer covering the metal layer pattern (% of the metal layer pattern top surface area) Example II.130 Example II.220 Example II.310 Example II.45 Example II.535 Comparative Example II.10 Comparative Example II.250 Comparative Example II.340

[0187]

[0188] Experimental Example II. Evaluation of Metal Layer Pattern and Solder Paste Shear Strength

[0189] An LED measuring 1.2 X 1.2 X 0.7 mm is mounted on a fixed stage and fixed to a shear tester for a single lap shear test, and the LED is pushed on top at a speed of 200 μm / s to measure the force until it falls. The shear strength evaluation of the metal layer was performed according to the ISO 4587:2003 standard, and the shear strength evaluation of the solder paste was performed according to KEA CG-6818.

[0190] The solder paste is low-temperature solder, SBX02, SnBi0.4Ag alloy, powder size is Type 4, and residues are used within 5%.

[0191] Composition Metal Layer Shear Strength (kgf / mm²)Solder Paste Shear Strength (kgf / mm²)Example II.11.71.1Example II.21.551.28Example II.31.41.6Example II.41.11.7Example II.51.81.0Comparative Example II.10.31.8Comparative Example II.22.30.46Comparative Example II.31.90.6

[0192] According to Table 2 above, in the cases of Examples II.1 to II.5, the organic layer was manufactured so that the area covering the metal layer pattern was 5% or more and 35% or less, and in each case, the shear strength of the metal layer and the solder paste were both 1.0 or more, so that the fixing force of the metal layer pattern was excellent, and the contact area between the solder paste and the metal layer pattern was also sufficient, so that the fixing force of the solder paste was also excellent.

[0193] On the other hand, in the case of Comparative Examples II.2 and II.3, the shear strength was greatly reduced because the area where the organic layer covered the metal layer pattern exceeded 35%, resulting in insufficient contact area of ​​the solder paste, and in the case of Comparative Example II.1, the organic layer was formed so that there was no area where the metal layer pattern was covered, so that there was no sealing portion, and therefore the metal layer pattern was not physically fixed and protected, resulting in a greatly reduced shear strength, particularly at the level of 0.3 kgf / mm², at which point the device mounted on the metal layer pattern fell off the substrate, making replacement and repair impossible.

[0194] Meanwhile, in the case of Example II.5, the area where the organic layer covers the metal layer pattern was 35% or less, so the fixing force of the metal layer pattern and the fixing force of the solder paste were effective, but the solder paste shear strength showed a result somewhat lower than that of the example.

[0195]

[0196] The optical laminate and transparent display according to the present invention have the effect of significantly reducing the occurrence of short circuits and the defect rate during the manufacture of the optical laminate and display, since LED elements can be stably mounted on a metal layer pattern having a narrow pitch of 60 to 500 ㎛.

[0197] In addition, the optical laminate and transparent display according to the present invention significantly improve the fixing strength of the metal layer pattern by forming the organic layer with a desirable area and shape, thereby preventing deformation and interface peeling of the metal layer pattern during replacement or repair of a light-emitting diode (LED) element, thereby increasing the success rate of replacement and repair and the conversion rate of good products.

Claims

1. Glass substrate; An adhesive layer formed on the upper part of the substrate; A metal layer pattern positioned on the above adhesive layer; A light emitting diode (LED) positioned on the above metal layer pattern; A transparent cover positioned above the light emitting diode (LED); and On the above substrate, an organic layer is formed to cover a part of the metal layer pattern and to have a part open; An optical laminate wherein the opening opened by the organic layer is smaller than the metal layer pattern.

2. In claim 1, The above organic layer is an optical laminate formed with a solder resist.

3. In claim 2, The above solder resist is an optical laminate in solid form.

4. In claim 1, An optical laminate having a metal layer pattern including solder paste on top.

5. In claim 1, An optical laminate in which the organic layer is formed to cover 35% or less of the area of ​​the upper surface of the metal layer pattern.

6. In claim 1, An optical laminate in which the organic layer is formed to cover 5% to 30% of the area of ​​the upper surface of the metal layer pattern.

7. In claim 1, An optical laminate comprising a ring-shaped sealing portion, which is an organic layer formed in an area excluding an opening of the metal layer pattern.

8. In claim 7, An optical laminate, wherein the shortest width from the outside of the ring to the inside of the ring of the annular sealing portion is 1.25% or more of the length of one side of the metal layer pattern and one length selected from the major axis.

9. In claim 7, An optical laminate, wherein the length of the width measured in the inner direction of the ring from any point outside the ring of the above-mentioned annular sealing portion has a deviation of within 5%.

10. In claim 4, The above metal layer pattern has a shear strength of 1 kgf / mm² or more, The above solder paste is an optical laminate having a shear strength of 1 kgf / mm² or more.

11. In claim 1, An optical laminate comprising a metal layer pattern having a distance between the patterns of 60 to 500 μm.

12. In claim 1, An optical laminate, wherein the metal layer comprises at least one selected from the group consisting of copper (Cu), aluminum (Al), nickel (Ni), chromium (Cr), silver (Ag), iron (Fe), gold (Au), cobalt (Co), titanium (Ti), and tungsten (W).

13. A transparent display comprising an optical laminate according to any one of claims 1 to 12.

14. In claim 13, A transparent display, wherein the glass substrate and the transparent cover are each independently at least one selected from glass, quartz, borosilicate, aluminosilicate, non-alkali, soda lime glass, meshed glass, colored glass, magic mirror, and holographic glass.

15. In claim 13, A transparent display, wherein the transparent cover is made of glass, and further comprises at least one selected from mesh glass, colored glass, magic mirror, and holographic glass.

16. A step of preparing a metal film including an adhesive layer formed on one surface of a metal layer, a first protective film provided on one surface of the adhesive layer, and a second protective film provided on the other surface of the metal layer; A step of peeling off the first protective film of the above metal film; A step of bonding the metal film so that an adhesive layer is disposed on one surface of a glass substrate; A step of peeling off the second protective film of the above metal film; A step of forming a metal layer pattern by patterning the metal layer; and A method for manufacturing an optical laminate, comprising the step of forming an organic layer in a portion where the metal layer pattern is not formed.

17. In claim 16, the step of forming an organic layer in a portion where the metal layer pattern is not formed comprises a step of patterning a solder resist on a substrate, A method for manufacturing an optical laminate, comprising the step of applying solder paste to the metal layer pattern.

18. In claim 16, The step of forming the above metal layer pattern includes a step of forming a photoresist pattern on one surface of the metal layer; A step of etching the exposed area of ​​the metal layer by the above photoresist pattern; and A method for manufacturing an optical laminate, comprising: a step of peeling off the photoresist pattern.

19. In claim 17, A method for manufacturing an optical laminate, wherein, in a step of applying solder paste to the metal layer pattern, the solder paste applied on the metal layer pattern does not invade an adjacent metal layer pattern within 60 to 500 μm.

Images