Microstrip antenna and communication device

Abstract

A microstrip antenna (10), comprising: a metal ground layer (1), a first dielectric substrate (2) located on one side of the metal ground layer (1), a microstrip line (3) located on the side of the first dielectric substrate (2) facing away from the metal ground layer (1), a second dielectric substrate (4) located on the side of the microstrip line (3) facing away from the metal ground layer (1), a radiation patch (5) located on the side of the second dielectric substrate (4) facing away from the metal ground layer (1) and connected to the metal ground layer (1), a support layer (6) located on the side of the radiation patch (5) facing away from the metal ground layer (1), and a parasitic patch (7) supported on the side of the support layer (6) facing away from the metal ground layer (1). In embodiments of the present disclosure, the parasitic patch (7) and the metal ground layer (1) are provided on two sides of the radiation patch (5), so as to effectively increase the radiation area of the microstrip antenna (10), thereby increasing the gain, and reducing the power consumption of the microstrip antenna (10) while expanding a signal coverage range.

Description

Microstrip antennas and communication equipment Technical Field

[0001] The present disclosure relates to the field of antenna technology, and in particular to a microstrip antenna and a communication device. Background Art

[0002] With the advent of the 5G era, green antennas are attracting increasing attention and attention from scholars. For example, they offer a wider coverage range while maintaining lower power consumption. The higher the antenna gain, the farther the beam reaches. Furthermore, for every 1 decibel increase in antenna gain, the required power consumption can be reduced by 20% for the same coverage range. Therefore, increasing antenna gain to reduce power consumption has become a pressing issue.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field.

[0004] Summary of the Invention

[0005] The present invention aims to provide a microstrip antenna and a communication device that can improve signal coverage while reducing power consumption.

[0006] According to one aspect of the present disclosure, there is provided a microstrip antenna, comprising:

[0007] metallic formations;

[0008] a first dielectric substrate, located on one side of the metal stratum, and having a first metal via hole, wherein a first end of the first metal via hole is connected to the metal stratum;

[0009] a microstrip line located on a side of the first dielectric substrate facing away from the metal layer;

[0010] a second dielectric substrate, located on a side of the microstrip line away from the metal ground layer, and having a second metal via, wherein a first end of the second metal via is connected to a second end of the first metal via;

[0011] a radiation patch, located on a side of the second dielectric substrate facing away from the metal ground layer and connected to the second end of the second metal via;

[0012] a supporting layer, located on a side of the radiation patch facing away from the metal stratum;

[0013] The parasitic patch is supported on a side of the support layer away from the metal stratum, and has an overlapping area with the radiation patch in the thickness direction of the metal stratum.

[0014] According to any one of the microstrip antennas of the present disclosure, the microstrip antenna further comprises a third dielectric substrate and a feed layer, the third dielectric substrate being located on a side of the metal stratum facing away from the first dielectric substrate, and the feed layer being located on a side of the third dielectric substrate facing away from the metal stratum;

[0015] The feed layer includes a feed network, the third dielectric substrate has at least one third metal via, the first dielectric substrate further has a fourth metal via corresponding to each third metal via, and the metal layer has a first avoidance hole corresponding to each third metal via;

[0016] The third metal via is connected to the corresponding fourth metal via within the area surrounded by the corresponding first avoidance hole, and the third metal via and the fourth metal via are connected to the feeding network and the end of the microstrip line respectively.

[0017] According to any microstrip antenna described in the present disclosure, the microstrip line is a strip structure, the feeding network is a single-point feeding structure, and the feeding point of the single-point feeding structure is connected to one end of the microstrip line.

[0018] According to any one of the microstrip antennas described in the present disclosure, the microstrip line is a strip structure;

[0019] The feeding network is a one-to-two feeding structure, and there is a phase difference of 180 degrees between the two feeding points of the one-to-two feeding structure. The two feeding points are respectively connected to the two ends of the microstrip line.

[0020] According to any one of the microstrip antennas described in the present disclosure, the microstrip line is a cross-shaped structure and has four ends;

[0021] The feeding network includes two single-point feeding structures, and the feeding points of the two single-point feeding structures are respectively connected to two adjacent ends of the microstrip line.

[0022] According to any one of the microstrip antennas described in the present disclosure, the microstrip line is a cross-shaped structure and has four ends;

[0023] The feeding network includes two one-to-two feeding structures, the two feeding points of each one-to-two feeding structure have a phase difference of 180 degrees, and the two feeding points of each one-to-two feeding structure are respectively connected to two spaced ends of the microstrip line.

[0024] According to any one of the microstrip antennas described in the present disclosure, the two one-divide-two feeding structures are arranged in the same layer, and there is no overlapping area between the two one-divide-two feeding structures in the thickness direction of the metal layer.

[0025] According to any microstrip antenna described in the present disclosure, the supporting layer includes a plurality of supporting members, the plurality of supporting members are distributed at intervals along the circumference of the radiation patch, and the supporting members are respectively connected to the radiation patch and the parasitic patch.

[0026] According to any one of the microstrip antennas described in the present disclosure, the support member includes a plurality of support columns, and each of the support columns is connected to the radiation patch and the parasitic patch respectively.

[0027] According to any microstrip antenna described in the present disclosure, the material of the support column includes plastic or metal.

[0028] According to any microstrip antenna described in the present disclosure, the supporting layer is a fourth dielectric substrate.

[0029] According to any one of the microstrip antennas described in the present disclosure, the fourth dielectric substrate has a fifth metal via, and two ends of the fifth metal via are respectively connected to the radiation patch and the parasitic patch.

[0030] According to any microstrip antenna described in the present disclosure, the radiation patch has holes.

[0031] According to any microstrip antenna described in the present disclosure, the aperture is L-shaped, U-shaped or arc-shaped.

[0032] According to one aspect of the present disclosure, a communication device is provided, comprising the microstrip antenna described in the above aspect.

[0033] The embodiments of the present disclosure include at least the following technical effects:

[0034] In the disclosed embodiments, the microstrip line and the radiating patch can be fed via coupling. This improves the impedance matching between the microstrip line and the radiating patch to a certain extent, compared to the direct-connection feeding method used in related technologies, thereby enabling the microstrip antenna to have a wider bandwidth. Furthermore, by providing parasitic patches and metal ground planes on either side of the radiating patch, the radiation area of ​​the microstrip antenna is effectively increased, thereby effectively increasing the gain of the microstrip antenna, thereby improving the signal coverage range while reducing the power consumption of the microstrip antenna.

[0035] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0037] FIG1 is a schematic diagram of a top view of a microstrip antenna provided in an embodiment of the present disclosure.

[0038] FIG2 is a schematic diagram of an exploded structure of a microstrip antenna provided in an embodiment of the present disclosure.

[0039] FIG3 is a schematic diagram of an exploded structure of a microstrip antenna provided in an embodiment of the present disclosure.

[0040] FIG4 is a schematic diagram of an exploded structure of a microstrip antenna provided in an embodiment of the present disclosure.

[0041] FIG5 is a schematic diagram of the cross-sectional structure of a microstrip antenna provided in an embodiment of the present disclosure.

[0042] FIG6 is a schematic diagram of the cross-sectional structure of a microstrip antenna provided in an embodiment of the present disclosure.

[0043] FIG7 is a schematic diagram of an exploded structure of a microstrip antenna provided in an embodiment of the present disclosure.

[0044] FIG8 is a schematic diagram of an exploded structure of a microstrip antenna provided in an embodiment of the present disclosure.

[0045] FIG9 is a schematic diagram of the bottom-up structure of a microstrip antenna provided in an embodiment of the present disclosure.

[0046] FIG10 is a schematic diagram of the bottom-up structure of a microstrip antenna provided in an embodiment of the present disclosure.

[0047] FIG11 is a schematic diagram of an exploded structure of a microstrip antenna provided in an embodiment of the present disclosure.

[0048] FIG12 is a schematic diagram of the cross-sectional structure of a microstrip antenna provided in an embodiment of the present disclosure.

[0049] FIG13 is an antenna radiation diagram of a microstrip antenna provided in an embodiment of the present disclosure on the E-plane and the H-plane.

[0050] FIG14 is a return loss curve of two polarization signals of a dual-polarization microstrip antenna provided in an embodiment of the present disclosure.

[0051] Reference numerals:

[0052] 10. Microstrip antenna;

[0053] 1. Metal layer; 2. First dielectric substrate; 3. Microstrip line; 4. Second dielectric substrate; 5. Radiation patch; 6. Support layer; 7. Parasitic patch; 8. Third dielectric substrate; 9. Feed layer;

[0054] 11. First avoidance hole; 12. Second avoidance hole;

[0055] 21. First metal via; 22. Fourth metal via;

[0056] 41. Second metal via; 51. Hole;

[0057] 61. Support column; 62. Fourth dielectric substrate; 63. Fifth metal via;

[0058] 81. The third metal via;

[0059] 91. Single-point feeding structure; 92. One-to-two feeding structure. DETAILED DESCRIPTION

[0060] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Like reference numerals in the figures represent identical or similar structures, and thus their detailed descriptions will be omitted. Furthermore, the figures are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0061] Although relative terms such as "upper" and "lower" are used in this specification to describe the relationship of one illustrated component to another, these terms are used herein for convenience only, such as in accordance with the orientation of the illustrations in the accompanying drawings. It will be understood that if the illustrated device were flipped upside down, the component described as "upper" would become the component "lower." When a structure is referred to as "on" another structure, this may mean that the structure is integrally formed with the other structure, that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via the other structure.

[0062] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express open-ended inclusion and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.; the terms "first", "second" and "third" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0063] In related art, microstrip antennas include a dielectric substrate, a microstrip line, and a radiating patch disposed on the dielectric substrate, with the microstrip line connected to the radiating patch. This direct connection allows electromagnetic signals to propagate between the microstrip line and the radiating patch. However, the feeding method used in these microstrip antennas results in poor impedance matching between the two, leading to low gain. Furthermore, during use, the microstrip antennas were found to have a narrow bandwidth that satisfies user requirements. Therefore, a microstrip antenna with high gain and wide bandwidth is urgently needed.

[0064] FIG1 illustrates a schematic top view of a microstrip antenna 10 provided in an embodiment of the present disclosure, and FIG2 illustrates a schematic exploded view of a microstrip antenna 10 provided in an embodiment of the present disclosure. As shown in Figures 1 and 2, the microstrip antenna 10 includes: a metal layer 1, a first dielectric substrate 2, a microstrip line 3, a second dielectric substrate 4, a radiating patch 5, a supporting layer 6 and a parasitic patch 7. The first dielectric substrate 2 is located on one side of the metal layer 1 and has a first metal via 21, and the first end of the first metal via 21 is connected to the metal layer 1; the microstrip line 3 is located on the side of the first dielectric substrate 2 away from the metal layer 1; the second dielectric substrate 4 is located on the side of the microstrip line 3 away from the metal layer 1 and has a second metal via 41, and the first end of the second metal via 41 is connected to the second end of the first metal via 21; the radiating patch 5 is located on the side of the second dielectric substrate 4 away from the metal layer 1 and is connected to the second end of the second metal via 41; the supporting layer 6 is located on the side of the radiating patch 5 away from the metal layer 1; the parasitic patch 7 is supported on the side of the supporting layer 6 away from the metal layer 1, and has an overlapping area with the radiating patch 5 in the thickness direction of the metal layer 1.

[0065] In the disclosed embodiment, microstrip line 3 and radiating patch 5 can be fed via coupling. This improves the impedance matching between microstrip line 3 and radiating patch 5 to a certain extent, compared to direct-connection feeding in related art, thereby enabling microstrip antenna 10 to have a wider bandwidth. Furthermore, by providing parasitic patches 7 and metal ground layer 1 on either side of radiating patch 5, the radiation area of ​​microstrip antenna 10 is effectively increased, thereby effectively increasing the gain of microstrip antenna 10, thereby facilitating the improvement of signal coverage while reducing power consumption of microstrip antenna 10.

[0066] Among them, the first dielectric substrate 2 and the second dielectric substrate 4 can be plastic substrates, PCB substrates, etc., as long as they have insulating properties. The size of the parasitic patch 7 is slightly smaller than the radiating patch 5, and the parasitic patch 7 and the radiating patch 5 have an overlapping area in the thickness direction of the metal layer 1, so as to effectively ensure that the parasitic patch 7 increases the effective radiation area of ​​the microstrip antenna 10. Optionally, the line connecting the center point of the parasitic patch 7 and the center point of the radiating patch 5 is perpendicular to the metal layer 1, so that the edge of the positive projection of the radiating patch 5 on the second dielectric substrate 4 extends beyond the positive projection of the parasitic patch 7 on the second dielectric substrate 4, thereby improving the coupling effect between the parasitic patch 7 and the radiating patch 5. Of course, the center point of the parasitic patch 7 can also be set away from the center point of the radiating patch 5, as long as the parasitic patch 7 and the radiating patch 5 have an overlapping area in the thickness direction of the metal layer 1. The embodiments of the present disclosure are not limited to this.

[0067] In the embodiment of the present disclosure, when electromagnetic signals are radiated outward through the radiation patch 5, the radiation patch 5 can be a rectangular patch as shown in Figures 1 and 2; of course, the radiation patch 5 can also be a patch structure with holes 51 as shown in Figures 1 and 3.

[0068] In this way, by setting a hole 51 on the radiation patch 5, it is convenient to optimize the current path in the plane where the radiation patch 5 is located, so as to achieve tuning of the radiation patch 5, and then improve the impedance matching between the radiation patch 5 and the parasitic patch 7 while increasing the resonance point on the radiation patch 5, so as to widen the bandwidth of the microstrip antenna 10 and improve the antenna effect.

[0069] The apertures 51 on the radiating patch 5 are L-shaped, U-shaped, or arc-shaped, so that the current path on the radiating patch 5 can be changed according to the different shapes of the apertures 51 structures, thereby improving the blocking match between the radiating patch 5 and the parasitic patch 7. In addition, the radiating patch 5 can have multiple apertures 51 of the same shape. The shape and number of the apertures 51 on the radiating patch 5 can be set according to the tuning requirements of the radiating patch 5. For example, as shown in Figure 3, the radiating patch 5 has four L-shaped apertures 51, or the radiating patch 5 has four U-shaped apertures 51, or as shown in Figure 4, the radiating patch 5 has four arc-shaped apertures 51.

[0070] As for the specific distribution of the multiple holes 51 on the radiation patch 5, for example, the radiation patch 5 has two holes 51 of the same shape. At this time, the two holes 51 are symmetrically distributed along a direction parallel to the first side of the radiation patch 5, and the symmetry line of the two holes 51 is perpendicular to the second side of the radiation patch 5.

[0071] For example, the radiating patch 5 has four apertures 51 of the same shape. In this case, the four apertures 51 are arranged in an array and are symmetrically distributed along a direction parallel to one side of the radiating patch 5, and also symmetrically distributed along a direction parallel to another side of the radiating patch 5. As shown in FIG3 , when the apertures 51 are L-shaped, the corners of the four L-shaped apertures 51 all face away from the center of the radiating patch 5. When the apertures 51 are U-shaped, the openings of two opposing U-shaped apertures 51 in a direction parallel to the first side of the radiating patch 5 face each other. As shown in FIG4 , when the apertures 51 are arc-shaped, the notches of the four arc-shaped apertures 51 all face the center of the radiating patch 5.

[0072] In the disclosed embodiments, the microstrip antenna 10 can be a single-polarized antenna to achieve a linearly polarized antenna effect (e.g., horizontal polarization, vertical polarization, etc.), or a dual-polarized antenna to achieve a dual-polarized antenna effect (e.g., vertical polarization and horizontal polarization, 45-degree polarization and -45-degree polarization, circular polarization, etc.). For a single-polarized antenna, for example, the microstrip line 3 included in the microstrip antenna 10 is a strip-shaped structure, while for a dual-polarized microstrip antenna 10, for example, as shown in any of Figures 2 to 4, the microstrip line 3 included in the microstrip antenna 10 is a cross-shaped structure.

[0073] Optionally, for the microstrip line 3 with a strip structure, both ends of the microstrip line 3 may extend out of the radiation patch 5, and the line connecting the midpoint of the microstrip line 3 and the center point of the radiation patch 5 may be parallel to the thickness direction of the metal layer 1, so as to ensure the coupling effect between the microstrip line 3 and the radiation patch 5; and for the microstrip line 3 with a cross structure, all four ends of the microstrip line 3 may extend out of the radiation patch 5, and the line connecting the intersection of the microstrip line 3 and the center point of the radiation patch 5 may be parallel to the thickness direction of the metal layer 1, so as to ensure the coupling effect between the microstrip line 3 and the radiation patch 5.

[0074] Furthermore, due to the provision of metal ground layer 1, power feeding on microstrip line 3 can be achieved through direct connection. Of course, a metal layer coupled to microstrip line 3 can also be provided between microstrip line 3 and metal ground layer 1 to achieve coupled power feeding of microstrip line 3. Next, direct-connection power feeding of microstrip line 3 is explained.

[0075] In some embodiments, the microstrip line 3 can be fed by being directly connected to a coaxial line. That is, the microstrip antenna 10 includes a coaxial line, and a probe at the end of the coaxial line is connected to the end of the microstrip line 3. This simplifies the structure of the microstrip antenna 10 and reduces its complexity.

[0076] The coaxial line can be arranged in the same layer as the microstrip line 3 to achieve connection with the end of the microstrip line 3; or it can pass through the metal layer 1 and the first dielectric substrate 2 to achieve connection with the end of the microstrip line 3. When the coaxial line passes through the metal layer 1 and the first dielectric substrate 2 to connect with the microstrip line 3, as shown in Figure 5, the metal layer 1 has a second avoidance hole 12, and the first dielectric substrate 2 also has a through hole (not shown in the figure), so that the coaxial line can pass through the second avoidance hole 12 of the metal layer 1 and the through hole of the first dielectric substrate 2 in sequence to connect with the microstrip line 3, while preventing conduction between the coaxial line and the metal layer 1.

[0077] In combination with the shape of the microstrip line 3 described above, when the microstrip line 3 is a strip structure, the microstrip line 3 has two ends. In this case, the microstrip antenna 10 may include two coaxial lines, and the probes of the two coaxial lines are respectively connected to the two ends of the microstrip line 3. In this case, two electromagnetic signals of equal amplitude and 180 degrees phase difference can be fed into the two ends of the microstrip line 3 through the two coaxial lines.

[0078] The connection between the two coaxial lines and the two ends of the microstrip line 3 can be achieved by referring to the above-described coaxial line arrangement method. For example, when the coaxial lines pass through the metal layer 1 and the first dielectric substrate 2 to connect to the microstrip line 3, the first dielectric substrate 2 has two through-holes that are directly opposite the two ends of the microstrip line 3, and the metal layer 1 has two second avoidance holes 12 that correspond one-to-one with the two through-holes. Thus, the two coaxial lines can be passed through the two second avoidance holes 12 and the corresponding two through-holes to connect to the two ends of the microstrip line 3.

[0079] When the microstrip line 3 is a cross-shaped structure, the microstrip line 3 has four ends. In this case, the microstrip antenna 10 may include four coaxial lines, and the probes of the four coaxial lines are respectively connected to the four ends of the microstrip line 3. In this case, two electromagnetic signals of equal amplitude and 180 degrees phase difference can be fed through two coaxial lines connected to two ends separated from each other by the microstrip line 3.

[0080] The connection between the four coaxial lines and the four ends of the microstrip line 3 can be achieved by referring to the above-described coaxial line arrangement method. For example, when the coaxial lines pass through the metal layer 1 and the first dielectric substrate 2 to connect to the microstrip line 3, the first dielectric substrate 2 has four through-holes that are directly opposite the four ends of the microstrip line 3, and the metal layer 1 has four second avoidance holes 12 that correspond one-to-one with the four through-holes. Thus, the four coaxial lines can be passed through the four second avoidance holes 12 and the corresponding four through-holes to connect to the four ends of the microstrip line 3.

[0081] In other embodiments, as shown in Figures 6 and 7, the microstrip antenna 10 further includes a third dielectric substrate 8 and a feed layer 9, the third dielectric substrate 8 is located on the side of the metal layer 1 away from the first dielectric substrate 2, and the feed layer 9 is located on the side of the third dielectric substrate 8 away from the metal layer 1; the feed layer 9 includes a feed network, the third dielectric substrate 8 has at least one third metal via 81, the first dielectric substrate 2 further has a fourth metal via 22 corresponding to each third metal via 81, and the metal layer 1 has a first avoidance hole 11 corresponding to each third metal via 81; the third metal via 81 is connected to the corresponding fourth metal via 22 within the area surrounded by the corresponding first avoidance hole 11, and the third metal via 81 and the fourth metal via 22 are respectively connected to the feed network and the end of the microstrip line 3.

[0082] In this way, electromagnetic signals can be fed from the feed network to the microstrip line 3 by directly connecting the feed network circuit of the feed layer 9 to the microstrip line 3. Furthermore, the first avoidance hole 11 in the metal layer 1 can prevent the feed network from being connected to the metal layer 1, thereby ensuring the effective feeding of electromagnetic signals to the microstrip line 3. The third dielectric substrate 8 can be a plastic substrate, a PCB substrate, or the like, as long as it has insulating properties. Furthermore, by positioning the feed layer 9 on the side of the metal layer 1 facing away from the microstrip line 3, the feed layer 9 and the microstrip line 3 can share a single metal layer 1, thereby saving a layer of metal layer 1 and simplifying the structure of the microstrip antenna 10.

[0083] In combination with the shape of the microstrip line 3 described above, when the microstrip line 3 is a strip structure, the microstrip line 3 has two ends. In this case, the electromagnetic signal can be fed from one end of the microstrip line 3 or from both ends of the microstrip line 3.

[0084] Among them, the electromagnetic signal fed from one end of the microstrip line 3 can be a frequency-converted signal to ensure that the microstrip antenna 10 is used as a single-polarized antenna; for the electromagnetic signals fed from the two ends of the microstrip line 3, the two electromagnetic signals can be two frequency-converted signals with equal amplitude and a phase difference of 180 degrees to ensure that the microstrip antenna 10 is used as a single-polarized antenna.

[0085] In addition, when an electromagnetic signal is fed along one end of the microstrip line 3, the feeding network can be a single-point feeding structure 91, and the feeding point of the single-point feeding structure 91 is connected to one end of the microstrip line 3. In this way, a shorter feeding line can be used as the single-point feeding structure 91, thereby reducing the loss of the electromagnetic signal on the feeding line and facilitating the reduction of the power consumption of the microstrip antenna 10.

[0086] When electromagnetic signals are fed along the two ends of the microstrip line 3 , the feeding network may be a one-to-two feeding structure 92 , with two feeding points of the one-to-two feeding structure 92 connected to the two ends of the microstrip line 3 respectively.

[0087] The one-to-two feed structure 92 has a feed end and two feed points, so that an electromagnetic signal fed into the feed end can be split into two equal-amplitude electrical signals along the two feed points. To ensure that both ends of the microstrip line 3 are fed with electromagnetic signals of equal amplitude and a 180-degree phase difference, that is, to ensure that the phase difference of the electromagnetic signals at the two feed points of the one-to-two feed structure 92 is 180 degrees, the length of the branch path from the feed end of the one-to-two feed structure 92 to the two feed points can be adjusted. The difference in the length of the branch path from the feed end to the two feed points is specifically set and adjusted based on the phase difference.

[0088] In the case where the microstrip line 3 has a cross-shaped structure, the microstrip line 3 has four ends. In this case, the electromagnetic signal can be fed from two adjacent ends of the microstrip line 3 through the two feeding structures of the feeding layer 9 as shown in Figure 7, or the electromagnetic signal can be fed from the four ends of the microstrip line 3 through the two feeding structures of the feeding layer 9 as shown in Figure 8.

[0089] Among them, the electromagnetic signals fed from the two adjacent ends of the microstrip line 3 can be two frequency-converted signals with a phase difference of 90 degrees, so as to ensure that the microstrip antenna 10 achieves a dual-polarization effect; for the electromagnetic signals fed from the four ends of the microstrip line 3, the electromagnetic signals fed from the two adjacent ends can be frequency-converted signals with a phase difference of 90 degrees, and the electromagnetic signals fed from the two ends separated can be frequency-converted signals with equal amplitude and a phase difference of 180 degrees, so as to ensure that the microstrip antenna 10 achieves a dual-polarization effect.

[0090] In addition, when electromagnetic signals are fed along two adjacent ends of the microstrip line 3, as shown in Figures 7 and 9, the feeding network of the feed layer 9 can include two single-point feeding structures 91, and the feeding points of the two single-point feeding structures 91 are respectively connected to the two adjacent ends of the microstrip line 3. In this way, a shorter feed line can be used as the single-point feeding structure 91, thereby reducing the loss of electromagnetic signals on the feed line and facilitating the reduction of power consumption of the microstrip antenna 10.

[0091] When electromagnetic signals are fed along the four ends of the microstrip line 3, the feeding network of the feed layer 9 may include two one-to-two feeding structures 92 as shown in Figures 8 and 10. The two feeding points of each one-to-two feeding structure 92 are respectively connected to two separated ends of the microstrip line 3. In this way, polarization isolation of the two polarized electromagnetic signals can be achieved, ensuring the antenna effect of the microstrip antenna 10.

[0092] The one-to-two feed structure 92 has a feed end and two feed points, so that an electromagnetic signal fed into the feed end can be split into two equal-amplitude electrical signals along the two feed points. To ensure that both ends of the microstrip line 3 are fed with electromagnetic signals of equal amplitude and a 180-degree phase difference, that is, to ensure that the phase difference of the electromagnetic signals at the two feed points of the one-to-two feed structure 92 is 180 degrees, the length of the branch path from the feed end of the one-to-two feed structure 92 to the two feed points can be adjusted. The difference in the length of the branch path from the feed end to the two feed points is specifically set and adjusted based on the phase difference.

[0093] The two one-to-two feed structures 92 included in the feed network can be arranged in the same layer as shown in Figure 8. Of course, they can also be arranged in a stacked layer, which is not limited in the embodiments of the present disclosure. When the two one-to-two feed structures 92 are arranged in the same layer, there is no overlapping area between the two one-to-two feed structures 92 in the thickness direction of the metal layer 1. For example, the distribution of the two one-to-two feed structures 92 can be shown in Figure 10.

[0094] In the embodiment of the present disclosure, the supporting layer 6 is mainly used to support the parasitic patch 7 so that a certain gap is formed between the radiating patch 5 and the parasitic patch 7, so that the parasitic patch 7 forms an effective radiation surface when directly connected or coupled with the radiating patch 5, thereby facilitating the increase of the gain of the microstrip antenna 10.

[0095] In some embodiments, the support layer 6 includes a plurality of support members, which are spaced apart along the circumference of the radiating patch 5 and are respectively connected to the radiating patch 5 and the parasitic patch 7. Thus, the arrangement of the support members can form a certain gap between the parasitic patch 7 and the radiating patch 5.

[0096] For example, in combination with the above-mentioned case where the radiation patch 5 is a rectangular patch, the support layer 6 may include four support members, and the four support members are respectively arranged at the four corners of the radiation patch 5, so as to achieve effective support for the parasitic patch 7 while avoiding affecting the propagation of electromagnetic signals.

[0097] Each support member included in the support layer 6 may include only one support column 61 as shown in FIG. 2 , or may include multiple support columns 61 as shown in FIG. 11 .

[0098] Each support column 61 is respectively connected to the radiating patch 5 and the parasitic patch 7. Compared with the case where the parasitic patch 7 and the radiating patch 5 are connected via a single support column 61, when multiple support columns 61 included in each support member are connected to the radiating patch 5 and the parasitic patch 7, it is convenient to increase the control variables of the radiating patch 5, thereby further improving the impedance matching between the radiating patch 5 and the parasitic patch 7.

[0099] The support column 61 may be made of plastic, in which case the parasitic patch 7 and the radiating patch 5 are coupled to achieve electromagnetic signal propagation, thereby making the parasitic patch 7 an effective radiating surface, thereby increasing the effective radiation area of ​​the microstrip antenna 10. Of course, the support column 61 may also be made of metal, in which case the parasitic patch 7 and the radiating patch 5 are directly connected to achieve electromagnetic signal propagation, thereby making the parasitic patch 7 an effective radiating surface, thereby increasing the effective radiation area of ​​the microstrip antenna 10.

[0100] In other embodiments, as shown in Figure 12 , the support layer 6 is a fourth dielectric substrate 62. This allows the fourth dielectric substrate 62 to provide integral support for the parasitic patch 7, thereby increasing the support area for the parasitic patch 7 while ensuring the structural stability of the microstrip antenna 10. Furthermore, the provision of the fourth dielectric substrate 62 facilitates the integrated processing of the parasitic patch 7 during the fabrication of the microstrip antenna 10, simplifying the manufacturing process of the microstrip antenna 10.

[0101] The fourth dielectric substrate 62 can be a plastic substrate, a PCB substrate, or other materials, as long as it has insulating properties. In the microstrip antenna 10, the fourth dielectric substrate 62 can be used solely to support the parasitic patch 7. In this case, due to the insulating properties of the fourth dielectric substrate 62, electromagnetic signals can be transmitted via coupling between the parasitic patch 7 and the radiating patch 5, thereby making the parasitic patch 7 an effective radiating surface, thereby increasing the effective radiation area of ​​the microstrip antenna 10.

[0102] Furthermore, while the fourth dielectric substrate 62 is used to support the parasitic patch 7, as shown in FIG12 , the fourth dielectric substrate 62 may also have a fifth metal via 63, with both ends of the fifth metal via 63 connected to the radiating patch 5 and the parasitic patch 7, respectively. In this manner, the parasitic patch 7 can be directly connected to the radiating patch 5 via the fifth metal via 63, thereby enabling electromagnetic signal propagation through this direct connection, making the parasitic patch 7 an effective radiating surface, thereby increasing the effective radiation area of ​​the microstrip antenna 10.

[0103] In the disclosed embodiment, the aforementioned microstrip line 3, based on the coordination of the parasitic patch 7 and the metal ground layer 1, and in conjunction with the antenna patterns of the microstrip antenna 10 in the E and H planes shown in FIG13 , demonstrates that the gain of the microstrip antenna 10 reaches 10 decibels. Due to the coupling between the microstrip line 3 and the radiating patch 5, and the tuning of the aperture 51 in the radiating patch 5, the bandwidth of the microstrip antenna 10 can be expanded to greater than 16%. For example, the bandwidth of the microstrip antenna 10 can be expanded to 16%, 18%, 20%, 22%, and so on. For example, through simulation of the above-mentioned microstrip antenna 10, combined with the return loss curves of two polarization signals of a dual-polarization microstrip antenna shown in Figure 14, it can be seen that when the standing wave value is less than -15 decibels, the corresponding frequency band range is 2.3 GHz to 2.7 GHz. At this time, the degree of bandwidth expansion can be determined based on the bandwidth of the frequency band range (2.7 GHz-2.3 GHz) and the center value of the frequency band (half of the sum of 2.3 GHz and 2.7 GHz), that is, the bandwidth of the microstrip antenna 10 is widened by 16%.

[0104] The present disclosure also provides a communication device, which includes the microstrip antenna 10 described in the above embodiment. The communication device can be a satellite antenna, an electronic device, etc.

[0105] In combination with the microstrip antenna 10 described above, the setting of the parasitic patch 7 layers can effectively reduce the power consumption of the communication equipment, while increasing the coverage range of the electromagnetic signal, thereby improving the communication effect of the communication equipment; in addition, due to the coupling between the microstrip line 3 and the radiation patch 5, while increasing the bandwidth of the microstrip antenna 10, the frequency coverage range of the communication equipment is improved, thereby improving the communication effect of the communication equipment.

[0106] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

Claims

1. A microstrip antenna, wherein, Comprising: A metal ground layer; A first dielectric substrate located on one side of the metal ground layer and having a first metal via hole, with the first end of the first metal via hole connected to the metal ground layer; A microstrip line located on the side of the first dielectric substrate facing away from the metal ground layer; A second dielectric substrate located on the side of the microstrip line facing away from the metal ground layer and having a second metal via hole, with the first end of the second metal via hole connected to the second end of the first metal via hole; A radiation patch located on the side of the second dielectric substrate facing away from the metal ground layer and connected to the second end of the second metal via hole; A support layer located on the side of the radiation patch facing away from the metal ground layer; A parasitic patch supported on the side of the support layer facing away from the metal ground layer and having an overlapping area with the radiation patch in the thickness direction of the metal ground layer.

2. The microstrip antenna according to claim 1, wherein, The microstrip antenna further includes a third dielectric substrate and a feeding layer. The third dielectric substrate is located on the side of the metal ground layer facing away from the first dielectric substrate, and the feeding layer is located on the side of the third dielectric substrate facing away from the metal ground layer; The feeding layer includes a feeding network. The third dielectric substrate has at least one third metal via hole, the first dielectric substrate also has a fourth metal via hole corresponding to each third metal via hole, and the metal ground layer has a first avoidance hole corresponding to each third metal via hole; The third metal via hole is connected to the corresponding fourth metal via hole within the area surrounded by the corresponding first avoidance hole, and the third metal via hole and the fourth metal via hole are respectively connected to the feeding network and the end of the microstrip line.

3. The microstrip antenna according to claim 2, wherein, The microstrip line is a strip structure, the feeding network is a single-point feeding structure, and the feeding point of the single-point feeding structure is connected to one end of the microstrip line.

4. The microstrip antenna according to claim 2, wherein, The microstrip line is a strip structure; The feeding network is a one-to-two feeding structure, and the two feeding points of the one-to-two feeding structure have a 180-degree phase difference, and the two feeding points are respectively connected to the two ends of the microstrip line.

5. The microstrip antenna according to claim 2, wherein, The microstrip line is a cross-shaped structure and has four ends; The feeding network includes two single-point feeding structures, and the feeding points of the two single-point feeding structures are respectively connected to two adjacent ends of the microstrip line.

6. The microstrip antenna according to claim 2, wherein, The microstrip line is a cross-shaped structure and has four ends; The feeding network includes two one-to-two feeding structures. Each one-to-two feeding structure has a 180-degree phase difference between its two feeding points, and the two feeding points of each one-to-two feeding structure are respectively connected to two spaced-apart ends of the microstrip line.

7. The microstrip antenna according to claim 6, wherein, The two one-to-two feeding structures are arranged on the same layer, and the two one-to-two feeding structures do not have an overlapping area in the thickness direction of the metal ground layer.

8. The microstrip antenna according to any one of claims 1-7, wherein, The support layer includes a plurality of support members. The plurality of support members are spaced apart circumferentially along the radiation patch, and the support members are respectively connected to the radiation patch and the parasitic patch.

9. The microstrip antenna according to claim 8, wherein, The support member includes a plurality of support columns, and each support column is respectively connected to the radiation patch and the parasitic patch.

10. The microstrip antenna according to claim 9, characterized in that, The material of the support column includes plastic or metal.

11. The microstrip antenna according to any one of claims 1-7, characterized in that, The support layer is a fourth dielectric substrate.

12. The microstrip antenna according to claim 11, characterized in that, The fourth dielectric substrate has a fifth metal via hole, and two ends of the fifth metal via hole are respectively connected to the radiation patch and the parasitic patch.

13. The microstrip antenna according to claim 1, characterized in that, The radiation patch has a slot.

14. The microstrip antenna according to claim 13, characterized in that, The slot is L-shaped, U-shaped or arc-shaped.

15. A communication device, characterized in that, Comprising the microstrip antenna according to any one of claims 1-14.

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