Device for handling probe card

Abstract

Disclosed is a device for handling a probe card, the device, to automate distribution, allowing a probe card to be moved into a prober, leaving a probe card changer tray separately outside of the prober. The device for handling a probe card according to an aspect of the present invention comprises: a loader provided on one side of a probe chamber and providing a probe card to the probe chamber through a communication path connected thereto; an OHT which is adjacent to the loader to lift and transport a probe card from above; and a first probe card changer tray installed so as to allow entering and exiting the loader, and receiving a probe card at a first location on the transport line of the OHT.

Description

Probe card handling device

[0001] The present invention relates to a probe card handling device, and more particularly, to a probe card handling device capable of separately placing a probe card changer tray outside a prober and moving a probe card inside a prober for logistics automation.

[0002] A prober is a device used to inspect wafers. In a prober, the wafer is placed against a corresponding probe card for inspection. The probe card is equipped with numerous pins or similar devices for wafer inspection. These devices apply current to each semiconductor chip on the wafer, the object of inspection, to verify proper functioning.

[0003] Therefore, in addition to the wafer, which is the object to be inspected, a corresponding probe card must be provided inside the prober.

[0004] A probe card holder is usually required to secure the probe card to the prober.

[0005] These probe cards are usually supplied by the prober manufacturer.

[0006] Probe cards are manufactured to the customer's specifications, which means that the shape of the card holder will vary.

[0007] In the case of direct docking, which is a method of directly providing and fixing a probe card, a probe card holder is not required, but a carrier or tray that can fix the probe card is required.

[0008] Referring to FIG. 1, in a probe card handling device according to the prior art, in order to move a probe card (1) by an AGV (Auto Guided Vehicle) (40), both the part where the probe card (1) is seated and the probe card semi-automatic card change tray (Probe card SACC (Semi-Auto Control Changer) tray) must be open, and when the tester head (11) is docked to the prober, both the part where the probe card (1) is seated and the probe card semi-automatic card change tray (Probe card SACC (Semi-Auto Control Changer) tray) must be open.

[0009] At this time, the size of the tester head cannot be controlled by the prober manufacturer.

[0010] Referring to Fig. 1, a probe card (1) is placed on the main tray (20) installed in the prober (10) by an AGV (40) or manually by a worker. When the probe card (1) is supplied to the main tray (20), it enters the probe chamber (12), and the main tray (20) rises to couple and fix the probe card (1) to the tester head (11). Thereafter, a wafer is supplied from a wafer cartridge into the probe chamber (12) by a loader (30), and a test is performed. On the side of the probe chamber (12), there is a hinge manipulator (relief device) (50) that can dock the tester head to the prober (10).

[0011] Ultimately, according to the prior art, whether the supply of the probe card is manual or semi-automatic, it is difficult to automatically supply the probe card and achieve rapid supply due to the various restrictions mentioned above.

[0012] The present invention is intended to solve the above problems, and the purpose of the present invention is to provide a probe card handling device that supplies a probe card using an existing OHT (Over Head Hoist Transport), which is one of semiconductor production facilities, and automatically provides it to a tester head in a probe chamber, thereby enabling full automation of probe card supply and thereby ensuring speed of testing.

[0013] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the description below.

[0014] According to one aspect of the present invention, a probe card handling device is provided, including: a loader installed on one side of a probe chamber and providing a probe card to the probe chamber through a communication path connected to the probe chamber; an OHT adjacent to the loader for transporting the probe card by lifting it from the upper side; and a first probe card changer tray installed to be entered and exited from the loader and for loading the probe card at a first location disposed on a transport line of the OHT.

[0015] At this time, the first probe card changer tray can be transferred inside the loader and then provide the probe card to the probe chamber through the communication path.

[0016] At this time, a second probe card changer tray may be included that loads a probe card while entering and exiting the probe chamber and transports the probe card so that it is docked to the tester head inside the probe chamber.

[0017] At this time, an AGV is included that loads the probe card into the second probe card changer tray, and the AGV can load the probe card from the first probe card changer tray to the second probe card changer tray.

[0018] At this time, the loader can receive a wafer cassette from the OHT.

[0019] At this time, the wafer cassette can be provided by the OHT at a lower height of the first probe card changer tray while the first probe card changer tray is inserted into the loader.

[0020] According to the above configuration, a probe card handling device according to one aspect of the present invention can perform semiconductor inspection in a fully automated manner by loading a probe card from an OHT existing in a semiconductor facility and docking it to a tester head.

[0021] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

[0022] Fig. 1 is a plan schematic diagram of a probe card handling device according to the prior art.

[0023] FIG. 2 is a perspective view of a probe card handling device according to one embodiment of the present invention.

[0024] Figure 3 is a plan schematic diagram of a probe card handling device according to one embodiment of the present invention.

[0025] FIG. 4 is a side view of a probe card handling device according to one embodiment of the present invention.

[0026] FIG. 5 is a side view of a probe card handling device according to one embodiment of the present invention.

[0027] Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts irrelevant to the description are omitted in the drawings, and the same reference numerals designate identical or similar components throughout the specification.

[0028] The words and terms used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, but should be interpreted in a way that is consistent with the technical idea of ​​the present invention, in accordance with the principles by which the inventor can define terms and concepts in order to best explain his or her invention.

[0029] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to a preferred embodiment of the present invention, and do not represent all of the technical ideas of the present invention, so there may be various equivalents and modified examples that can replace the configuration at the time of filing of the present invention.

[0030] In this specification, terms such as “include” or “have” are intended to describe the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0031] When a component is said to be "in front of," "behind," "above," or "below" another component, this includes not only being placed "in front of," "behind," "above," or "below" the other component in direct contact with it, but also if there is another component intervening therebetween. Furthermore, when a component is said to be "connected" to another component, this includes not only being directly connected to one another, but also being indirectly connected to one another, unless there are special circumstances.

[0032] Hereinafter, a probe card handling device according to an embodiment of the present invention will be described with reference to the drawings.

[0033] A prober according to one embodiment of the present invention may include a probe chamber (112), a test head (111), a loader (130), a first probe card changer tray (140), a second probe card changer tray (120), an OHT, and an AGV (40), as shown in FIGS. 2 to 5.

[0034] As for the above probe chamber (112), testing is performed inside it, referring to FIGS. 2 and 3.

[0035] At this time, the inside of the probe chamber (112) may be equipped with temperature control equipment that controls the semiconductor to a certain temperature range for so-called burn-in testing, etc.

[0036] At this time, an opening (113a) is formed on the upper plate (113) of the probe chamber (112), and a test head (111) is installed through this opening. The test head (111) tests a wafer, which is a target semiconductor, by supplying current to the probe card (1) while the probe card (1) is mounted. Therefore, as shown in Fig. 2, the size is slightly smaller than the probe chamber (112).

[0037] At this time, a stage for aligning a wafer is installed inside the probe chamber (112), and a chuck for fixing the wafer is installed on the stage.

[0038] At this time, the stage is designed to move in three directions and in the rotational direction to align the wafer. Therefore, when the wafer is supplied, it is aligned to the exact position.

[0039] At this time, the probe card (1) can be manually or semi-automatically fed to the chuck on the upper part of the stage by the AGV (40) in the second probe card changer tray ()120. Of course, since this technology is a conventional technology, a detailed description thereof is omitted here.

[0040] At this time, the second probe card changer tray (120) can load the probe card (1) while entering and exiting the probe chamber (112) and transport the probe card (1) so that it is docked to the tester head (111) inside the probe chamber (112).

[0041] Accordingly, a probe card (1) is supplied into the probe chamber (112) through the second probe card changer tray (120), and the probe card (1) moves to the center and then rises to be docked and fixed to the test head (111). Then, a wafer is supplied from the wafer cassette to the loader (130), and the wafer is again provided to the chuck on the upper stage inside the probe chamber (112) and aligned. The aligned wafer is raised and brought into close contact with the probe card (1), and in that state, a test is performed by the test head (111). Of course, the temperature inside the probe chamber (112) is maintained within a controlled temperature range before the inspection.

[0042] Referring to FIGS. 4 and 5, the above loader (130) is installed on one side of the probe chamber (112) and can provide the probe card (1) to the probe chamber (112) through a communication path connected to the probe chamber (112). In the past, the loader (130) received the wafer from the wafer cassette and usually supplied the wafer, but here, not only the wafer but also the probe card (1) can be provided into the probe chamber (112) through the communication path.

[0043] At this time, the loader (130) can be provided with a wafer cassette from the OHT, and the wafer cassette can be provided by the OHT at a lower height of the first probe card changer tray (140) while the first probe card changer tray (140) is inserted into the loader (130).

[0044] At this time, the loader (140) may include a first probe card changer tray (140) that is installed to be entered from the loader (130) and loads the probe card (1) at a first position arranged on the transport line of the OHT.

[0045] At this time, the first probe card changer tray (140) can be transferred into the loader (130) and then provide the probe card (1) to the probe chamber (112) through the communication path.

[0046] At this time, an AGV (40) is included that loads the probe card (1) into the second probe card changer tray (120), and the AGV (40) can load the probe card (1) from the first probe card changer tray (140) to the second probe card changer tray (120).

[0047] That is, the AGV (40) can receive a probe card (1) from a manual or other probe card semi-automatic card replacement tray and then supply it to the first probe card changer tray (140), or can receive a probe card (1) from a second probe card changer tray (120) and then supply it to the first probe card changer tray (140).

[0048] The above OHT can transport the probe card (1) by lifting it from the upper side adjacent to the loader (130). This OHT is currently widely used in semiconductor facilities.

[0049] Referring to FIG. 2, a perspective view of a probe card handling device according to one embodiment of the present invention is shown.

[0050] In the illustrated embodiment, the probe chamber (112) has an outer shape that is roughly box-shaped. A door (112a) is installed, including the front upper corner.

[0051] At this time, the door (112a) has a form that opens by rotating toward the front based on the hinge at the bottom. In this state where the front door (112a) is open, when the second probe card changer tray (120) comes out of the probe chamber (112) and the probe card (1) is supplied to the second probe card changer tray (120), the second probe card changer tray (120) transfers the probe card (1) to the inside. Here, since the second probe card changer tray (120) does not come out completely from the probe chamber (112), it is difficult to transfer the probe card (1) from the top using OHT.

[0052] In the illustrated embodiment, the first probe card changer tray (140) of the loader (130) can receive the probe card (1) from the OHT by passing through the door (131) of the loader (130) when it is opened and moving forward. At this time, the probe card (1) can be delivered at a position where the center of the probe card (1) and the loading center of the first probe card changer tray (140) are aligned, and this position is the first position.

[0053] At this time, the first probe card changer tray (140) can receive the probe card (1) and then transfer the probe card (1) into the probe chamber (112) through the communication path by the driving unit (150) of the loader (130).

[0054] At this time, the first probe card changer tray (140) is positioned at the same vertical position as the position at which the wafer cassette is delivered from the OHT, and the first position may be positioned on the same vertical line as the position at which the wafer cassette is delivered. In other words, the delivery position of the probe card (1) and the delivery position of the wafer cassette may differ only in height, and their loading centers may be on the same vertical line.

[0055] In the illustrated embodiment, a test head (111) is docked to the upper portion of the probe chamber (1). The supplied probe card (1) is coupled and fixed to the test head (111), and a wafer aligned and coupled to the probe card (1) is inspected in that state.

[0056] Referring to FIG. 3, a planar schematic diagram of a probe card handling device according to one embodiment of the present invention is illustrated.

[0057] In the illustrated embodiment, the first position, which is the loading center of the first probe card changer tray (140), is located on the movement path of the OHT, so direct loading of the probe card (1) is possible. The loading center of the second probe card changer tray (120) is located off the movement path of the OHT, so direct loading is not possible.

[0058] Therefore, fully automating the transport of the probe card (1) is possible by using only the first probe card changer tray (140). That is, fully automating the transport of the probe card (1) is possible by receiving the probe card (1) from the OHT through the first probe card changer tray (140), passing it through the communication path by the drive unit (150) of the loader (130) to the upper part of the chuck on the upper part of the stage, and coupling it to the tester head (111).

[0059] At this time, when using the second probe card changer tray (120), the operation of the AGV (40) is required, as in the conventional technology described above. Here, if the AGV (40) transfers the probe card (1) between the first probe card changer tray (140) and the second probe card changer tray (120), unlike the conventional technology, the degree of freedom of movement of the probe card (1) can be increased, and thus productivity can be increased. In other words, the provision of the probe card (1) can be made to the first probe card changer tray (140), and the retrieval of the probe card (1) can be made toward the second probe card changer tray (120).

[0060] Additionally, when the loader (130) is busy handling wafers, the probe card (1) provided to the first probe card changer tray (140) may be provided to the second probe card changer tray (120) by the AGV (40) and supplied to the stage.

[0061] Referring to FIG. 4, a side view of a probe card handling device according to an embodiment of the present invention is illustrated, and referring to FIG. 5, a side configuration diagram of a probe card handling device according to an embodiment of the present invention is illustrated.

[0062] In the illustrated embodiment, the first probe card changer tray (140) is positioned higher than the position at which the wafer cassette is delivered. Therefore, when the probe card (1) is supplied from the OHT, the first probe card changer tray (140) may be in a state where it comes out of the loader (130) case, and when the wafer cassette is supplied from the OHT, the first probe card changer tray (140) may be in a state where it enters the loader (130) case.

[0063] In the illustrated embodiment, the first probe card changer tray (140) may be installed to be able to be lifted, moved left and right, and rotated by the drive unit (150) of the loader (130). This drive unit (150) may be used together with a drive unit for handling wafers from an existing wafer cassette. Of course, like the wafer, the probe card (140) may also be provided into the probe chamber (112) through a communication path.

[0064] Although the embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification, and those skilled in the art who understand the spirit of the present invention will be able to easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

[0065] The present invention can be used to inspect wafers and semiconductor devices.

Claims

1. A loader installed on one side of a probe chamber and providing a probe card to the probe chamber through a communication path connected to the probe chamber; An OHT that transports the probe card by lifting it from the upper side adjacent to the loader; A first probe card changer tray, which is installed to be entered from the loader and receives the probe card at a first location arranged on the transport line of the OHT; Probe card handling device.

2. In paragraph 1, The above first probe card changer tray is transferred into the loader and then provides the probe card to the probe chamber through the passage. Probe card handling device.

3. In paragraph 1, A second probe card changer tray, which loads a probe card while entering and exiting the probe chamber and transports the probe card so that it is docked to the tester head inside the probe chamber; Probe card handling device.

4. In paragraph 3, Including an AGV for loading the probe card into the second probe card changer tray, wherein the AGV loads the probe card from the first probe card changer tray to the second probe card changer tray. Probe card handling device.

5. In paragraph 1, The above loader is provided with a wafer cassette from the OHT. Probe card handling device.

6. In paragraph 5, The above wafer cassette is provided by the OHT at a lower height of the first probe card changer tray while the first probe card changer tray is inserted into the loader. Probe card handling device.

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