Device for handling probe card

Abstract

Disclosed is a device for handling a probe card, the device, to automate distribution, allowing a probe card to be received in a probe card changer tray directly from an OHT and moved into a chamber. The device for handling a probe card according to an aspect of the present invention comprises: a probe chamber into which a probe card and a wafer are provided and in which tests are carried out with the probe card attached to an overhead test head; a main tray installed to allow forward and backward movement into and out of the probe chamber, the load center coinciding with the center of the probe card provided from an OHT when the main tray has been moved forward to a first position; and an upper plate that moves backward so as not to interfere with the downward movement of the probe card from the OHT when the main tray is at the first position.

Description

Probe card handling device

[0001] The present invention relates to a probe card handling device, and more particularly, to a probe card handling device capable of receiving a probe card directly from an OHT and moving it into a chamber on a probe card changer tray for logistics automation.

[0002] A prober is a device used to inspect wafers. In a prober, the wafer is placed against a corresponding probe card for inspection. The probe card is equipped with numerous pins or similar devices for wafer inspection. These devices apply current to each semiconductor chip on the wafer, the object of inspection, to verify proper functioning.

[0003] Therefore, in addition to the wafer, which is the object to be inspected, a corresponding probe card must be provided inside the prober.

[0004] A probe card holder is usually required to secure the probe card to the prober.

[0005] These probe cards are usually supplied by the prober manufacturer.

[0006] Probe cards are manufactured to the customer's specifications, which means that the shape of the card holder will vary.

[0007] In the case of direct docking, which is a method of directly providing and fixing a probe card, a probe card holder is not required, but a carrier or tray that can fix the probe card is required.

[0008] Referring to FIG. 1, in a probe card handling device according to the prior art, in order to move a probe card (1) by an AGV (Auto Guided Vehicle) (40), both the part where the probe card (1) is seated and the probe card semi-automatic card change tray (Probe card SACC (Semi-Auto Control Changer) tray) must be open, and when the tester head (11) is docked to the prober, both the part where the probe card (1) is seated and the probe card semi-automatic card change tray (Probe card SACC (Semi-Auto Control Changer) tray) must be open.

[0009] At this time, the size of the tester head cannot be controlled by the prober manufacturer.

[0010] Referring to Fig. 1, a probe card (1) is placed on the main tray (20) installed in the prober (10) by an AGV (40) or manually by a worker. When the probe card (1) is supplied to the main tray (20), it enters the probe chamber (12), and the main tray (20) rises to couple and fix the probe card (1) to the tester head (11). Thereafter, a wafer is supplied from a wafer cartridge into the probe chamber (12) by a loader (30), and a test is performed. On the side of the probe chamber (12), there is a hinge manipulator (relief device) (50) that can dock the tester head to the prober (10).

[0011] Ultimately, according to the prior art, whether the supply of the probe card is manual or semi-automatic, it is difficult to automatically supply the probe card and achieve rapid supply due to the various restrictions mentioned above.

[0012] The present invention is intended to solve the above problems, and the purpose of the present invention is to provide a probe card handling device that supplies a probe card using an existing OHT (Over Head Hoist Transport), which is one of semiconductor production facilities, and automatically provides it to a tester head in a probe chamber, thereby enabling full automation of probe card supply and thereby ensuring speed of testing.

[0013] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the description below.

[0014] According to one aspect of the present invention, a probe card handling device is provided, comprising: a probe chamber in which a probe card and a wafer are provided therein and a test is performed while the probe card is coupled to a test head at the top; a main tray which is installed in and outwardly and forwardly from the probe chamber and in which the center of the probe card provided from the OHT at the first forward position is aligned with the loading center; and an upper plate which moves backward so as not to interfere with the descent of the probe card descending from the OHT while the main tray is located at the first position.

[0015] At this time, when the upper plate is driven forward and backward, the test head may move upward to the upper plate and be separated.

[0016] At this time, the main tray can be coupled and fixed by pressing the test head into the upper plate when the probe card is supplied.

[0017] At this time, the probe chamber may include a door installed so as to be rotatable around a hinge, including a corner portion formed by the front and upper surfaces of the probe chamber.

[0018] At this time, the door is opened, the main tray is positioned at the first position, and the test head is separated from the upper plate and can be provided from the OHT to the main tray with the upper plate moved backward.

[0019] At this time, the main tray moves backward toward the inside of the probe chamber, the door is closed, the upper plate moves forward and returns, and the test head is coupled to the upper portion, and the main tray can be transported so that the probe card is coupled to the test head.

[0020] According to the above configuration, a probe card handling device according to one aspect of the present invention can perform semiconductor inspection in a fully automated manner by directly loading a probe card from an OHT installed in an existing semiconductor facility into a main tray and docking it to a tester head.

[0021] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

[0022] Fig. 1 is a plan schematic diagram of a probe card handling device according to the prior art.

[0023] FIG. 2 is a perspective view of a probe card handling device according to one embodiment of the present invention.

[0024] FIG. 3 is a perspective view of a probe card handling device according to one embodiment of the present invention with the test head separated.

[0025] FIG. 4 is a plan view of a probe card handling device according to one embodiment of the present invention, with the tray advanced to the first position.

[0026] FIG. 5 is a schematic diagram of a probe card handling device according to one embodiment of the present invention before the tray advances.

[0027] FIG. 6 is a schematic diagram of a state in which a probe card is supplied from an OHT in a probe card handling device according to one embodiment of the present invention.

[0028] Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts irrelevant to the description are omitted in the drawings, and the same reference numerals designate identical or similar components throughout the specification.

[0029] The words and terms used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, but should be interpreted in a way that is consistent with the technical idea of ​​the present invention, in accordance with the principles by which the inventor can define terms and concepts in order to best explain his or her invention.

[0030] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to a preferred embodiment of the present invention, and do not represent all of the technical ideas of the present invention, so there may be various equivalents and modified examples that can replace the configuration at the time of filing of the present invention.

[0031] In this specification, terms such as “include” or “have” are intended to describe the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but should be understood not to exclude in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0032] When a component is said to be "in front of," "behind," "above," or "below" another component, this includes not only being placed "in front of," "behind," "above," or "below" the other component in direct contact with it, but also if there is another component intervening therebetween. Furthermore, when a component is said to be "connected" to another component, this includes not only being directly connected to one another, but also being indirectly connected to one another, unless there are special circumstances.

[0033] Hereinafter, a probe card handling device according to an embodiment of the present invention will be described with reference to the drawings.

[0034] A prober according to one embodiment of the present invention may include a probe chamber (112), a test head (111), a loader (130), a main tray (140), and an OHT, as shown in FIGS. 2 to 6.

[0035] Referring to FIGS. 2 to 4, the above probe chamber (112) is tested internally. That is, a probe card and a wafer are provided inside the probe chamber, and testing can be performed with the probe card coupled to the upper test head.

[0036] At this time, the inside of the probe chamber (112) may be equipped with temperature control equipment that controls the semiconductor to a certain temperature range for so-called burn-in testing, etc.

[0037] At this time, an opening (113a) is formed on the upper plate (113) of the probe chamber (112), and a test head (111) is installed through this opening. The test head (111) tests a wafer, which is a target semiconductor, by supplying current to the probe card (1) while the probe card (1) is mounted. Therefore, as shown in Fig. 2, the size is slightly smaller than the probe chamber (112).

[0038] At this time, a stage for aligning a wafer is installed inside the probe chamber (112), and a chuck for fixing the wafer is installed on the stage.

[0039] At this time, the stage is designed to move in three directions and in the rotational direction to align the wafer. Therefore, when the wafer is supplied, it is aligned to the exact position.

[0040] Accordingly, a probe card (1) is supplied into the probe chamber (112) through the main tray (140), and the probe card (1) moves to the center and then rises to be docked and fixed to the test head (111). Then, a wafer is supplied from the wafer cassette to the loader (130), and the wafer is again provided to the chuck on the upper stage inside the probe chamber (112) and aligned. The aligned wafer is raised and brought into close contact with the probe card (1), and in that state, a test is performed by the test head (111). Of course, the temperature inside the probe chamber (112) is maintained within a controlled temperature range before the inspection.

[0041] The above loader (130), with reference to FIGS. 2 to 4, is installed on one side of the probe chamber (112) and can provide wafers to the probe chamber (112) through a communication path connected to the probe chamber (112). That is, the loader (130) can receive wafers from a wafer cassette and supply wafers normally, and the wafer cassette can be provided with various routes including OHT.

[0042] The above OHT (2) is adjacent to the loader (130) and can transport the probe card (1) by lifting it from the upper side. This OHT (2) is currently widely used in semiconductor facilities.

[0043] The above main tray (140) is installed so as to be able to move forward and backward inward and outward from the probe chamber (112), and in the first position advanced, the center of the probe card (1) provided from the OHT (2) coincides with the loading center, and in that state, the probe card (1) can be received from the OHT (2).

[0044] At this time, the probe chamber (112) includes an upper plate (113), and the upper plate (113) can move backward so as not to interfere with the descent of the probe card (1) descending from the OHT (2) while the main tray (140) is positioned at the first position. That is, the upper plate (113) can be moved forward toward the door (112a) from the upper portion of the probe chamber (112) by the driving unit or can be moved backward to the original position.

[0045] At this time, the upper plate (113) can be configured to move forward and backward using various driving systems and structures. The reason why the upper plate (113) moves forward and backward here is to resolve the interference that occurs when the OHT (2) descends and delivers the probe card (1) while the door (112a) of the probe chamber (112) is open due to interference caused by the OHT (2) getting caught on the front of the upper plate (113). In the past, even when manually delivering the probe card (1) to the main tray (140), the door (112a) was opened, one end of the probe card (1) was tilted so that it did not touch the front of the upper plate (113), and then it was horizontally provided back to the main tray (140). Therefore, in order for the probe card (1) to come down from above and be provided to the main tray (140), the upper plate (113) must move backward.

[0046] At this time, when the upper plate (113) is driven forward and backward, the test head (111) may move upward to the upper plate (113) and be separated.

[0047] At this time, when the probe card (1) is supplied, the main tray (140) is connected to the upper plate (113) and then the test head (111) is brought into close contact with the test head (111) and connected and fixed, after which testing can be performed.

[0048] At this time, the door (112a) of the probe chamber (112) can be installed so that the lower part, including the corner portion formed by the front and upper surface of the probe chamber (112), can be rotated around a hinge. That is, the door (112a) is installed so that it can be opened by rotating the hinge toward the front, including the front upper corner portion of the probe chamber (112).

[0049] At this time, the door (112a) is opened, the main tray (140) is positioned at the first position, and the test head (111) is separated from the upper plate (113) so that the upper plate (113) can be provided from the OHT (2) to the main tray (140) in a backward state.

[0050] In this case, the main tray (140) moves backward toward the inside of the probe chamber (112) and the door (112a) is closed, the upper plate (113) moves forward and returns, and the test head (111) is coupled to the upper portion, and the main tray (140) can transport the probe card (1) so that it is coupled to the test head (111).

[0051] Referring to FIG. 2, a perspective view of a probe card handling device according to one embodiment of the present invention is shown.

[0052] In the illustrated embodiment, the probe chamber (112) has an outer shape that is roughly box-shaped. A door (112a) is installed, including the front upper corner.

[0053] At this time, the door (112a) has a form that opens by rotating toward the front based on the hinge at the bottom. In this state where the front door (112a) is open, the main tray (140) comes out of the probe chamber (112), and the probe card (1) is supplied from the OHT (2) to the main tray (140), and then the main tray (140) transports the probe card (1) inside.

[0054] At this time, the door (112a) is closed, and the test is performed while the test head (111) is coupled to the probe chamber (112). Here, the probe card (1) is coupled to the test head (111), and the wafer provided through the loader (130) is aligned on the stage and maintained in a connected state to the probe card (1). In this state, temperature control is performed to satisfy the test temperature conditions, and the test can proceed.

[0055] Referring to FIG. 3, a perspective view of a probe card handling device according to one embodiment of the present invention is shown with a test head separated.

[0056] In the illustrated embodiment, the test head (111) is moved upward and separated from the probe chamber (112). Therefore, the interior of the chamber (112) is opened by the opening (113a) of the upper plate (113) of the probe chamber (112). In this state, the probe card (1) can be retrieved and provided.

[0057] Referring to FIG. 4, a plan view is shown of a probe card handling device according to one embodiment of the present invention, in which a tray has advanced to a first position.

[0058] In the illustrated embodiment, the door (112a) is open and the main tray (140) is advanced to the first position. In this state, the probe card (1) is provided from the OHT (2), but since a part of the upper plate (113) interferes when the probe card (1) is lowered, the upper plate (113) must be moved backward.

[0059] At this time, a wafer can be provided into the probe chamber (112) through a passage from the loader (130) on the side of the probe card (1), and a separate tray can also be operated to transport the wafer to the upper part of the stage.

[0060] Referring to FIG. 5, a schematic diagram is shown before the tray advances in a probe card handling device according to one embodiment of the present invention.

[0061] In the illustrated embodiment, the main tray (140) inside the probe chamber (112) is advanced to the first position. At this time, the OHT (2) is in a state where the holder (2a) holds the probe card (1), and the probe card (1) is positioned vertically above the first position together with the OHT (2).

[0062] At this time, when the door (112a) is opened and the probe card (1) is lowered in this state, some of it may interfere and get caught on the top plate (113). Therefore, the top plate (113) must be moved backward.

[0063] Referring to FIG. 6, a schematic diagram of a state in which a probe card is supplied from an OHT in a probe card handling device according to one embodiment of the present invention is illustrated.

[0064] In the illustrated embodiment, the door (112a) of the probe chamber (112) is hinged forward and opened. At this time, the door (112a) of the top plate (113) is moved backward a certain distance in the opposite direction. Of course, the test head (11) remains separated at this time.

[0065] In this state, OHT (2) lowers the holder (2a) to lower the probe card (1). When the probe card (1) is seated on the main tray (140), the holder (2a) is released to transfer the probe card (1) to the upper part of the main tray (140).

[0066] After that, the main tray (140) moves backward, the door (121a) closes, and the upper plate (113) moves forward and returns to its original position. Then, the test head (111) is lowered to the upper plate (113) and engaged, and the main tray (140) engages the probe card (1) in a state aligned with the test head (111).

[0067] Meanwhile, the target wafer in the wafer cassette is transferred to the stage by the loader (130), and the wafer, which is aligned by being combined with the chuck, is finally pressed against the probe card (1). Thereafter, the wafer is tested by the test head (111) while maintaining the internal temperature within the test temperature range.

[0068] By repeating this process, wafer testing continues, and when a different type of wafer is tested, a new probe card (1) can be provided again in the manner described above.

[0069] In this way, by using OHT (2) and the main tray (140), it is possible to configure the probe card (1) to be supplied to the probe chamber (112) completely automatically without actually providing it manually or by using an AGV, etc.

[0070] Although the embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification, and those skilled in the art who understand the spirit of the present invention will be able to easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same spirit, but this will also be considered to fall within the spirit of the present invention.

[0071] The present invention can be applied to equipment for inspecting semiconductor devices or wafers.

Claims

1. A probe chamber in which a probe card and a wafer are provided inside and testing is performed with the probe card coupled to the test head at the top; A main tray which is installed so as to be able to move forward and backward in and outward from the probe chamber, and in which the center of the probe card provided from the OHT at the first advanced position coincides with the loading center; and Including an upper plate that moves backwards so as not to interfere with the descent of a probe card descending from the OHT while the main tray is positioned at the first position; Probe card handling device.

2. In paragraph 1, When the above top plate is driven forward and backward, the test head moves upward to the top plate and is separated. Probe card handling device.

3. In paragraph 1, The above main tray is connected and fixed by pressing the test head into the upper plate when the probe card is supplied. Probe card handling device.

4. In paragraph 1, Including a door that is installed so as to be rotatable about a hinge at the lower end, including a corner portion formed by the front and upper surface of the probe chamber, Probe card handling device.

5. In paragraph 4, The door is opened, the main tray is positioned in the first position, the test head is separated from the top plate and the top plate is moved backwards, and is provided from the OHT to the main tray. Probe card handling device.

6. In paragraph 5, A probe card handling device, wherein the main tray moves backward toward the inside of the probe chamber, the door is closed, the upper plate moves forward and returns, and the test head is coupled to the upper part, and the main tray transports the probe card so as to be coupled to the test head.

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