Electronic device comprising heat dissipation member

Abstract

The present disclosure relates to an electronic device. The electronic device according to one embodiment of the disclosure comprises: a first substrate including a first surface and a second surface oriented in the opposite direction of the first surface; a second substrate including a third surface facing the first surface, and a fourth surface oriented in the opposite direction of the third surface; at least one interposer arranged between the first surface and the third surface; a first electronic component arranged on the fourth surface; and a heat dissipation member which is solid at room temperature, and which is arranged in a space defined by the first substrate, the second substrate and the at least one interposer, so as to overlap the first electronic component when viewed in the direction perpendicular to the fourth surface.

Description

Electronic devices including heat dissipation elements

[0001] The present disclosure relates to electronic devices, and for example, to electronic devices including heat dissipation structures for electronic components.

[0002] Electronic devices can refer to devices that perform specific functions based on their embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or in-vehicle navigation systems. For example, these electronic devices can output stored information as audio or video.

[0003] As the integration of electronic devices increases and ultra-high-speed and / or high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now incorporate a variety of functions. For example, in addition to communication functions, entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions such as mobile banking, and even calendar management or electronic wallet functions are being integrated into a single electronic device. These electronic devices are also becoming smaller for convenient portability.

[0004] An electronic device according to one embodiment of the present disclosure may include a first substrate including a first surface and a second surface facing in an opposite direction to the first surface, a second substrate including a third surface facing the first surface and a fourth surface facing in an opposite direction to the third surface, an interposer disposed between the first surface and the third surface, a first electronic component disposed on the fourth surface, and a heat dissipation member disposed in a space defined by the first substrate, the second substrate, and the interposer so as to overlap the first electronic component when viewed in a direction perpendicular to the fourth surface and which is solid at room temperature.

[0005] An electronic device according to one embodiment of the present disclosure may include a first substrate including a first surface and a second surface facing in an opposite direction to the first surface, a second substrate including a third surface facing the first surface and a fourth surface facing in an opposite direction to the third surface, an interposer disposed between the first surface and the third surface, a first electronic component disposed on the second surface, and a heat dissipation member disposed in a space defined by the first substrate, the second substrate, and the interposer so as to overlap the first electronic component when viewed in a direction perpendicular to the second surface and which is solid at room temperature.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2 is a perspective view of an electronic device showing a front side of the electronic device according to one embodiment of the present disclosure.

[0008] FIG. 3 is an exploded perspective view of an electronic device showing a front side of the electronic device according to one embodiment of the present disclosure.

[0009] FIG. 4 is a cross-sectional view of a substrate assembly according to one embodiment of the present disclosure taken along the AA` cut line illustrated in FIG. 3.

[0010] FIG. 5 is a plan view of a substrate assembly according to one embodiment of the present disclosure.

[0011] FIG. 6 illustrates a first substrate included in the substrate assembly illustrated in FIG. 5 and components arranged on the first substrate.

[0012] FIG. 7 illustrates a second substrate included in the substrate assembly illustrated in FIG. 5 and configurations arranged on the second substrate.

[0013] FIG. 8 is a drawing for explaining the composition of a heat dissipation member according to one embodiment of the present disclosure, showing materials included in the heat dissipation member.

[0014] FIG. 9 illustrates a heat dissipation member being placed on a substrate according to one embodiment of the present disclosure.

[0015] Fig. 10 is a cross-sectional view of a substrate on which a heat dissipation member is arranged according to the process illustrated in Fig. 9.

[0016] FIG. 11 is a graph showing a temperature profile in a reflow soldering process according to one embodiment of the present disclosure.

[0017] Fig. 12 is a cross-sectional view showing a heat dissipation member on a gel in the soldering section shown in Fig. 11.

[0018] FIG. 13 is a cross-sectional view of a heat dissipation member and an adhesive member according to one embodiment of the present disclosure.

[0019] FIG. 14 is a cross-sectional view showing a heat dissipation member softened in a reflow soldering process according to another embodiment of the present disclosure.

[0020] FIG. 15 illustrates an assembled substrate assembly in a soldering section of reflow soldering according to another embodiment of the present disclosure.

[0021] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0022] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0023] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0024] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0025] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0026] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0027] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0028] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0029] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0030] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0031] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0032] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0033] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0034] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0036] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0038] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0039] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0040] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0041] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0042] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0043] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0044] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0045] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0046] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0047] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0048] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0049] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0050] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0051] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0052] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0053] FIG. 2 is a perspective view of an electronic device (101) illustrating a front side (210A) of the electronic device (101) according to one embodiment of the present disclosure.

[0054] Referring to FIG. 2, an electronic device (101) according to one embodiment of the present disclosure may include a first surface (or front surface) (210A), a second surface (or back surface) (not shown), and a third surface (or side surface) (210C) surrounding a space between the first surface (210A) and the second surface (210B, see FIG. 3).

[0055] According to one embodiment of the present disclosure, the first surface (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate comprising various coating layers). The second surface (or back surface, 210B) may be formed by a back plate (not shown) that is substantially opaque. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is joined to the front plate (202) and the back plate (211) and comprises metal and / or polymer.

[0056] According to one embodiment of the present disclosure, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204), a key input device (217), a light emitting element (206), and a connector hole (208, 209).

[0057] According to one embodiment of the present disclosure, the display (220) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (220) may be formed to be substantially identical to the adjacent outer shape of the front plate (202).

[0058] According to one embodiment of the present disclosure, the audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sounds, and in one embodiment, one or more microphones may be disposed therein to detect the direction of sounds. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0059] According to one embodiment of the present disclosure, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) (e.g., a display (220)) of the housing (210) as well as the second surface (not shown) or side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0060] According to one embodiment of the present disclosure, a camera device (205) may be disposed on a first surface (210A) of an electronic device (101). The camera device (205) may include one or more lenses, an image sensor, and / or an image signal processor.

[0061] According to one embodiment of the present disclosure, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220).

[0062] According to one embodiment of the present disclosure, the light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0063] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0064] FIG. 3 is an exploded perspective view of an electronic device (101) showing the front side of the electronic device (101) according to one embodiment of the present disclosure.

[0065] Referring to FIG. 3, an electronic device (101) according to one embodiment of the present disclosure may include a side structure (231), a first support member (232) (e.g., a bracket), a display (220), at least one printed circuit board (or board assembly) (240a, 240b), a battery (250), a second support member (260), an antenna, a camera assembly (214), and a back plate (211). When including one or more printed circuit boards (240a, 240b), the electronic device (101) may include at least one flexible printed circuit board (240c) to electrically connect different printed circuit boards. For example, the printed circuit board (240a, 240b) may include a first substrate assembly (240a) disposed on one side (e.g., upper side or Y direction) of the battery (250) and a second substrate assembly (240b) disposed on the other side (e.g., lower side or -Y direction) of the battery (250), and the first substrate assembly (240a) and the second substrate assembly (240b) may be electrically connected by a flexible printed circuit board (240c).

[0066] According to one embodiment of the present disclosure, the first support member (232) may be provided in at least a portion in a flat shape. In one embodiment, the first support member (232) may be disposed inside the electronic device (101) and connected to the side structure (231), or may be formed integrally with the side structure (231). The first support member (232) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When the first support member (232) is at least partially formed of a metallic material, the side structure (231) or a portion of the first support member (232) may function as an antenna. The first support member (232) may have a display (220) coupled to one surface (e.g., in the Z direction) and a substrate assembly (240a, 240b) coupled to the other surface (e.g., in the −Z direction). The substrate assembly (240a, 240b) may include, for example, an interposer, a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0067] According to one embodiment of the present disclosure, the front plate (202) may be coupled to the support member (232) via an adhesive member. The front plate (202) may be referred to as a "cover" or a "front cover." The rear plate (211) may be referred to as a "cover" or a "rear cover." The edge of the cover (211) may be supported by the support member (232).

[0068] According to one embodiment of the present disclosure, the first support member (232) and the side structure (231) may be combined to form a front case or housing (230). The housing (230) may also be referred to as a frame (230). According to one embodiment, the housing (230) may accommodate a substrate assembly (240a, 240b) or a battery (250).

[0069] In one embodiment of the present disclosure, the housing (230) may form at least a portion of the exterior of the electronic device (101). The housing (230) may include a side structure (231), a first support member (232), a front plate (202), and a rear plate (211). In one embodiment of the present disclosure, the 'front or rear of the housing (230)' may refer to the front plate (202) or the rear cover (211). In one embodiment, the first support member (232) is disposed between the front plate (202) and the rear plate (211), and may function as a structure for arranging electrical / electronic components, such as a substrate assembly (240a, 240b) or a camera assembly (214).

[0070] According to one embodiment of the present disclosure, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0071] According to one embodiment of the present disclosure, the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround the substrate assembly (240a, 240b) (e.g., the first substrate assembly (240a)) together with a portion of the first support member (232). For example, the upper support member (260a) of the second support member (260) may be arranged to face the first support member (232) with the first substrate assembly (240a) therebetween.

[0072] In one embodiment of the present disclosure, the lower support member (260b) of the second support member (260) may be disposed to face the first support member (232) with the second substrate assembly (240b) therebetween. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical / electronic components may be disposed on the printed circuit boards (240a, 240b), and according to an embodiment, the printed circuit boards (240a, 240b) may be provided with an electromagnetic shielding environment from the second support member (260). In one embodiment, the lower support member (260b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be disposed.

[0073] In one embodiment of the present disclosure, electrical / electronic components such as a speaker module, interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). For example, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another portion of the first support member (232).

[0074] According to one embodiment of the present disclosure, a battery (250) is a device for supplying power to at least one component of an electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, a printed circuit board (240a, 240b). The battery (250) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0075] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (260), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (211) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (231) and / or a portion or a combination of the first support member (232).

[0076] According to one embodiment of the present disclosure, the electronic device (101) may include a heat dispersion member (V). As an example, the heat dispersion member (V) may be disposed on the first support member (232). Heat generated inside the electronic device (101) may be dispersed through the heat dispersion member (V) or released to the outside of the electronic device (101). For example, heat generated in the first substrate assembly (240a) may be transferred to the battery (250) through the heat dispersion member. For example, the heat dispersion member may include a vapor chamber or a heat pipe.

[0077] FIG. 4 is a cross-sectional view of a substrate assembly (300) according to one embodiment of the present disclosure, taken along the line AA` illustrated in FIG. 3. The substrate assembly (300) described with reference to FIGS. 4 to 16 may be included in the substrate assembly (240a) described with reference to FIG. 3.

[0078] The coordinate axes illustrated in FIG. 4 may correspond to the coordinate axes illustrated in FIGS. 2 and 3. For example, the direction in which the +Z-axis illustrated in FIG. 4 faces may be the same as the direction of the Z-axis illustrated in FIGS. 2 and 3, and the direction in which the -Z-axis illustrated in FIG. 4 faces may be the same as the direction opposite to the direction of the Z-axis illustrated in FIGS. 2 and 3. Similarly, the direction in which the +X-axis illustrated in FIG. 4 faces may be the same as the direction in which the X-axis illustrated in FIG. 2 and 3, and the direction in which the -X-axis illustrated in FIG. 4 faces may be the same as the direction opposite to the direction of the X-axis illustrated in FIGS. 2 and 3. This may also be equally applied to FIGS. 12, 13, 15, and 16 described below.

[0079] Referring to FIG. 4, a substrate assembly (300) according to one embodiment of the present disclosure may include a first substrate (310). The first substrate (310) may include a first surface (311) and a second surface (312) facing in an opposite direction to the first surface (311). As an example, the first substrate (310) may be a printed circuit board having at least one electrical element (e.g., a third electronic component (E3)) mounted on the first surface (311) and the second surface (312).

[0080] According to one embodiment of the present disclosure, a substrate assembly (300) may include a second substrate (320). The second substrate (320) may include a third surface (321) facing with a first surface (311) of the first substrate (310). The second substrate (320) may include a fourth surface (322) facing in an opposite direction to the third surface (321). As an example, the second substrate (320) may be a printed circuit board having at least one electrical component (e.g., a second electronic component (E2) or a fourth electronic component (E4)) mounted on the third surface (321) and the fourth surface (322).

[0081] According to one embodiment of the present disclosure, the substrate assembly (300) may include an interposer (330) disposed between a first surface (311) of a first substrate (310) and a third surface (321) of a second substrate (320). The first substrate (310) and the second substrate (320) may be electrically connected through the interposer (330). The interposer (330) may be electrically connected to the first substrate (310) through a first solder (361). The interposer (330) may be electrically connected to the second substrate (320) through a second solder (362). As an example, the interposer (330) may be electrically connected to the first substrate (310) and the second substrate (320) through vias positioned at the edges of the first substrate (310) and / or the second substrate (320).

[0082] According to one embodiment of the present disclosure, the interposer (330) may surround the heat dissipation member (350). As an example, the interposer (330) may extend annularly along the edge of the first substrate (310) and / or the second substrate (320). According to another embodiment of the present disclosure (not shown), the interposer (330) may partially surround the heat dissipation member (350). As an example, the interposer (330) may entirely surround the heat dissipation member (350) together with another structure (e.g., a structure protruding from the first surface (311) of the first substrate (310).

[0083] According to one embodiment of the present disclosure, the substrate assembly (300) may include a first surface (311) of the first substrate (310), a third surface (321) of the second substrate (320), and an internal space (331) at least partially surrounded, or at least partially defined, by the interposer (330). The internal space (331) may be referred to as the internal space (331) of the substrate assembly (300).

[0084] According to one embodiment of the present disclosure, the electronic device (101) may include an electronic component (E1) disposed on a fourth surface (322) of a second substrate (320). As an example, the electronic component (E1) may include an application processor (e.g., the processor (130) of FIG. 1) including multiple processing cores. Heat generated during the operation of the electronic component (E1) may be transferred from the electronic component (E1) to a surrounding structure (e.g., the second substrate (320) and / or the heat dissipation member (350)).

[0085] According to one embodiment of the present disclosure, the electronic device (101) may include a second electronic component (E2) disposed on a third surface (321) of a second substrate (320). The second electronic component (E2) may be in contact with a heat dissipation member (350). The heat dissipation member (350) may cover the second electronic component (E2). The heat dissipation member (350) may partially surround the second electronic component (E2).

[0086] According to one embodiment of the present disclosure, the second electronic component (E2) may include a component that performs a function independent of the first electronic component (E1), or a component that is operatively connected to the first electronic component (E1). As an example, the second electronic component (E2) may include at least one decoupling capacitor that is electrically connected to the first electronic component (E1) through the second substrate (320) and configured to stabilize power supplied to the first electronic component (E1).

[0087] According to one embodiment of the present disclosure, the electronic device (101) may include a third electronic component (E3) disposed on a first surface (311) of a first substrate (310). The third electronic component (E3) may be positioned at an edge of a heat dissipation member (350). The third electronic component (E3) may be at least partially covered by the heat dissipation member (350).

[0088] According to one embodiment of the present disclosure, the electronic device (101) may include a fourth electronic component (E4) disposed on a fourth surface (322) of a second substrate (320). The fourth electronic component (E4) may be positioned around the first electronic component (E1). For example, the fourth electronic component (E4) may include an electrical element (e.g., a capacitor, etc.) or an integrated circuit.

[0089] According to one embodiment of the present disclosure, the electronic device (101) may include a heat dissipation member (350) disposed in an internal space (331). The heat dissipation member (350) may be disposed in the internal space (331). The heat dissipation member (350) may contact a third surface (321) of a second substrate (320). Heat generated in the first electronic component (E1) may be discharged to the outside of the first electronic component (E1) through the heat dissipation member (350) contacting the third surface (321).

[0090] According to one embodiment of the present disclosure, the heat dissipation member (350) may include, for example, a contact portion (350c) positioned between a plurality of second electronic components (E2) and in contact with a third surface (321). The heat dissipation member (350) may include one or more contact portions (350c). The contact portion (350c) may contact at least one of the second electronic component (E2) and / or the third surface (321). As an example, the contact portion (350c) may be positioned between the plurality of decoupling capacitors and may contact an area of ​​the third surface (321) overlapping with the first electronic component (E1) (e.g., area 321a of FIG. 7).

[0091] According to one embodiment of the present disclosure, the heat dissipation member (350) may be supported by the first surface (311) of the first substrate (310). As an example, the heat dissipation member (350) may be bonded to the first surface (311). The heat dissipation member (350) may be bonded to the first surface (311) by an adhesive member (370, see FIG. 14) disposed between the first surface (311) and the heat dissipation member (350). The heat dissipation member (350) may be fixed to the first substrate (310) by the adhesive member (370). The adhesive member (370) will be described in detail later with reference to FIG. 14. As another example, the heat dissipation member (350) may be in direct contact with the first surface (311).

[0092] FIG. 5 is a plan view of a substrate assembly (300) according to one embodiment of the present disclosure. FIG. 6 illustrates a first substrate (310) included in the substrate assembly (300) illustrated in FIG. 5 and components disposed on the first substrate (310). FIG. 7 illustrates a second substrate (320) included in the substrate assembly (300) illustrated in FIG. 5 and components disposed on the second substrate (320).

[0093] The coordinate axes illustrated in FIG. 5 may correspond to the coordinate axes illustrated in FIGS. 2 and 3. For example, the direction in which the +Y-axis illustrated in FIG. 5 faces may be the same as the direction in which the Y-axis illustrated in FIGS. 2 and 3 faces, and the direction in which the -Y-axis illustrated in FIG. 5 faces may be the same as the direction opposite to the Y-axis illustrated in FIGS. 2 and 3. Similarly, the direction in which the +X-axis illustrated in FIG. 5 faces may be the same as the direction in which the X-axis illustrated in FIG. 2 and 3 faces, and the direction in which the -X-axis illustrated in FIG. 5 faces may be the same as the direction opposite to the X-axis illustrated in FIGS. 2 and 3. This may also be applied to FIGS. 6 and 7.

[0094] Referring to FIGS. 5 to 7, according to one embodiment of the present disclosure, a heat dissipation member (350) may be disposed in an internal space (331) so as to overlap with a first electronic component (E1) when viewed from above the fourth surface (322) (e.g., when viewed in a direction perpendicular to the fourth surface (322)). Heat generated in the first electronic component (E1) may be effectively dissipated through an area of ​​the heat dissipation member (350) that overlaps with the first electronic component (E1).

[0095] According to one embodiment of the present disclosure, the electronic device (101) may include a plurality of heat dissipation members (351, 352). The plurality of heat dissipation members (351, 352) may include a first heat dissipation member (351) and a second heat dissipation member (352). The first heat dissipation member (351) and the second heat dissipation member (352) may have different shapes.

[0096] According to one embodiment of the present disclosure, the second electronic component (E2) may be positioned in an area (321a) that overlaps the first electronic component (E1) when viewed in a direction perpendicular to the third surface (321). The second electronic component (E2) may be positioned between the heat dissipation member (350) and the first electronic component (E1). In addition, the second electronic component (E2) may be positioned in an area that does not overlap the first electronic component (E1) when viewed in a direction perpendicular to the third surface (321).

[0097] According to one embodiment of the present disclosure, a plurality of vias may be arranged on an edge (311e) of a first surface (311). The interposer (330) may include a plurality of vias. The first substrate (310) and the second substrate (320) may be electrically connected through the plurality of vias of the interposer (330).

[0098] According to one embodiment of the present disclosure, the interposer (330) may be elongated along an edge (311e) of a first surface (311) of a first substrate (310). The interposer (330) may at least partially surround a heat dissipation member (350). The heat dissipation member (350) may be spaced apart from the edge (311e) of the first surface (311) of the first substrate (310). When the heat dissipation member (350) is viewed from above the first surface (311) (when viewed in a direction perpendicular to the first substrate (310), the heat dissipation member (350) may be positioned on the inner side of the edge (311e) of the first substrate (310).

[0099] According to one embodiment of the present disclosure, during the manufacturing process of the substrate assembly (300, see FIG. 4), solder paste (361a, see FIG. 10) may be applied to an edge (311e) of a first surface (311) of a first substrate (310). The heat dissipation member (350) may be spaced apart from the edge (311e) of the first surface (311) on which the solder paste (361a) is applied, thereby preventing a bonding defect that may occur during the process in which the interposer (330) and the first substrate (310) are connected through soldering.

[0100] FIG. 8 is a drawing illustrating materials included in a heat dissipation member (350) to explain the composition of the heat dissipation member (350) according to one embodiment of the present disclosure.

[0101] Referring to FIG. 8, the heat dissipation member (350) may include heat dissipation particles. The heat dissipation particles may have insulating properties and / or high thermal conductivity. As an example, the heat dissipation particles may include a ceramic-based material such as alumina (Al2O3) or aluminum nitride (AlN), carbon fiber, graphene, boron nitride (BN), silicon carbide (SiC), magnesium oxide (MgO), manganese oxide (ZnO), or a combination thereof.

[0102] According to one embodiment of the present disclosure, the heat dissipation member (350) may exhibit thermally responsive behavior, in which properties such as phase or thermal conductivity change in response to temperature. For example, the heat dissipation member (350) may be in a solid state at room temperature, but may transition to a gel phase when heated by absorbing ambient heat. This phase transition may improve the heat dissipation efficiency of the heat dissipation member (350). The heat dissipation member (350) may include a heat dissipation material, a phase change material, and a matrix material. A more detailed description of the materials included in the heat dissipation member (350) will be described below.

[0103] According to one embodiment of the present disclosure, the heat dissipation member (350) may include a phase change material. The phase change material may include a heat-responsive material or a thermoplastic polymer. As an example, the phase change material may include an organic material having a glass transition temperature or melting point of 40 to 60 degrees Celsius, such as a paraffin-based material, polyethylene glycol, and / or a salt hydrate, or a combination thereof.

[0104] According to one embodiment of the present disclosure, the heat dissipation member (350) may include a matrix material configured to maintain the heat dissipation member (350) in a gel phase. The matrix material may include a thermoplastic organic material. For example, the matrix material may include a rubber-based material having elasticity, and more specifically, may include EVA (ethylene vinyl acetate) and / or SEBS (styrene ethylene butylene styrene).

[0105] According to one embodiment of the present disclosure, the heat dissipation member (350) including the phase change material and the matrix material may be in a solid phase at room temperature (e.g., 25 degrees Celsius). The heat dissipation member (350) may soften as the temperature increases. The temperature at which softening of the heat dissipation member (350) begins may be referred to as a softening temperature or a softening point.

[0106] According to one embodiment of the present disclosure, when the heat dissipation member (350) is in a solid state, the transportation and placement of the heat dissipation member (350) can be easier compared to when it is in a liquid or gel state. In addition, when the heat dissipation member (350) is in a solid state, it has a certain level of rigidity, so that defects such as dents or pressures of the heat dissipation member (350) that may occur during the assembly and transportation process can be reduced. Accordingly, deformation of the shape of the heat dissipation member (350) can be prevented, and dispersion of the heat dissipation performance of the heat dissipation member (350) can be minimized.

[0107] According to one embodiment of the present disclosure, when the temperature of the heat dissipation member (350) increases, the heat dissipation member (350) may at least partially change into a gel phase. For example, when the electronic component (E1) operates and generates heat, the heat dissipation member (350) that has absorbed the heat generated from the electronic component (E1) may change into a gel phase that is softer compared to when it is in a solid state at room temperature. The heat dissipation member (350) may at least partially be in a gel phase in a temperature range higher than a softening point that is higher than room temperature (Tr).

[0108] According to one embodiment of the present disclosure, the matrix material can maintain the heat dissipation member (350) in a gel phase at a temperature higher than the melting point (or glass transition temperature) of the phase change material. When the temperature of the heat dissipation member (350) reaches the softening point, the flowability of the phase change material increases, but the shape of the heat dissipation member (350) can be substantially maintained by the matrix material.

[0109] According to one embodiment of the present disclosure, the heat dissipation member (350) may include about 75 to 90 wt% (weight percentage) of the heat dissipation particles, about 5 to 15 wt% of the matrix material, and / or about 5 to 15 wt% of the phase change material. The composition ratio of the heat dissipation particles, the matrix material, and / or the phase change material included in the heat dissipation member (350) is not limited to the above examples.

[0110] According to one embodiment of the present disclosure, the heat dissipation member (350) may include a tackifier configured to provide tack. The tackifier may provide tack to the phase change material. The tackifier may inhibit the flowability of the phase change material, which increases as the temperature increases. The tackifier may include at least one functional group different from the functional group of the matrix material. As an example, the tackifier may include a hydrogenated hydrocarbon.

[0111] According to one embodiment of the present disclosure, the adhesive material may have a glass transition temperature higher than the melting point (or glass transition temperature) of the phase change material. Accordingly, the heat dissipation member (350) including the phase change material and the adhesive material may have a glass transition temperature (or softening temperature) higher than the melting point (or glass transition temperature) of the phase change material.

[0112] According to one embodiment of the present disclosure, the heat dissipation member (350) may include about 80 wt% to 86 wt% of the heat dissipation particles, about 1 wt% to 3 wt% of the phase change material, about 1 wt% to 3 wt% of the adhesive material, and about 8 wt% to 12.5 wt% of the matrix material. The composition ratio of the heat dissipation particles, the matrix material, the phase change material, and the adhesive material included in the heat dissipation member (350) is not limited to the above examples.

[0113] According to one embodiment of the present disclosure, the weight ratio (wt%) of the phase change material and the adhesive material included in the heat dissipation member (350) may be about 1:1. The phase change material can increase the heat dissipation performance of the heat dissipation member (350) through phase change. The adhesive material can suppress the flowability of the phase change material by imparting adhesiveness to the phase change material. Therefore, by forming the phase change material and the adhesive material at a weight ratio of about 1:1, high heat dissipation performance of the heat dissipation member (350) can be secured and excessive shape deformation can be prevented.

[0114] FIG. 9 illustrates a state in which a heat dissipation member (350) is placed on a substrate (e.g., a first substrate (310)) according to one embodiment of the present disclosure. FIG. 10 is a cross-sectional view of a substrate (e.g., a first substrate (310)) on which a heat dissipation member (350) is placed according to the process illustrated in FIG. 9. Hereinafter, for convenience of explanation, when the heat dissipation member (350) is solid, the reference numeral 350S is used, and when the heat dissipation member (350) is gel, the reference numeral 350G is used.

[0115] Referring to FIGS. 9 and 10 , a room temperature solid heat dissipation member (350S) according to one embodiment of the present disclosure can be placed on a first surface (311) of a first substrate (310) through SMT (surface mount technology). The heat dissipation member (350S) can be adsorbed to a nozzle (N) and placed at a predetermined position (e.g., the first portion (311a)) of the first surface (311). Accordingly, the solid heat dissipation member (350S) can be easily positioned at a position that is easy to dissipate heat from a component with a high heat generation amount (e.g., an application processor), for example, at a position overlapping with or adjacent to a component with a high heat generation amount. Accordingly, the component with a high heat generation amount can effectively dissipate heat.

[0116] According to one embodiment of the present disclosure, the first substrate (310) may include a first portion (311a) and a second portion (311b). The first portion (311a) and the second portion (311b) may be partitioned based on a predetermined boundary (B). A heat dissipation member (350S) may be disposed in the first portion (311a). A solder paste (361a) for bonding the interposer (330, see FIG. 4) to the first substrate (310) may be disposed in the second portion (311b). The solder paste (361a) may correspond to the first solder (361, see FIG. 4) of the substrate assembly (300). As an example, the conductive material may include a SAC (silver, aluminum, copper) solder paste having a melting point of 217 degrees Celsius to 221 degrees Celsius.

[0117] FIG. 11 is a graph showing a temperature profile in a reflow soldering process according to one embodiment of the present disclosure. FIG. 12 is a cross-sectional view showing a heat dissipation member (350G) on a gel in the soldering section (S) shown in FIG. 11.

[0118] Referring to FIGS. 11 and 12, a substrate assembly (300, see FIG. 4 ) according to one embodiment of the present disclosure may be manufactured through a reflow soldering process. The reflow soldering process may include a soldering section (S). The temperature in the soldering section (S) may be referred to as a soldering temperature (Ts) or a soldering temperature range (Ts). As an example, the soldering temperature (Ts) may be between 220 degrees Celsius and 245 degrees Celsius.

[0119] According to one embodiment of the present disclosure, in the soldering section (S), the solder paste (361a) may be in a liquid state. In the soldering section (S), the heat dissipation member (350G) may maintain a gel phase. The soldering temperature (Ts) may be higher than the softening temperature of the heat dissipation member (350). By the matrix material included in the heat dissipation member (350), the shape of the heat dissipation member (350G) in a gel phase may be substantially maintained in the soldering section (S). By the adhesive material included in the heat dissipation member (350), the shape of the heat dissipation member (350G) in a gel phase may be substantially maintained in the soldering section (S).

[0120] According to one embodiment of the present disclosure, the amount of vaporization of the phase change material in the soldering section (S) can be reduced by the adhesive material. Even if the fluidity of the phase change material included in the heat dissipation member (350) increases due to the high temperature in the soldering section (S), the phase change material can be adhered to the adhesive material by the adhesive force of the adhesive material. Therefore, by reducing the loss amount of the phase change material, the heat dissipation performance of the heat dissipation member (350) can be prevented from being deteriorated. In addition, damage (e.g., mass loss) to the heat dissipation member (350) that may occur in the process of arranging the heat dissipation member (350) in the internal space (331) of the substrate assembly (300, see FIG. 4) can be minimized.

[0121] According to one embodiment of the present disclosure, the shape of the gel-shaped heat dissipation member (350G) in the soldering section (S) can be substantially maintained by the matrix material and / or the adhesive material. Accordingly, the problem of the gel-shaped heat dissipation member (350G) flowing down to the area where the solder paste (361a) is applied, thereby causing a bonding defect of the interposer (330), can be prevented.

[0122] Referring to FIGS. 4 and 10 to 12, a substrate assembly (300) can be assembled in a soldering section (S). According to one embodiment of the present disclosure, the substrate assembly (300) can be manufactured according to the step of arranging a heat dissipation member (350) described with reference to FIGS. 9 and 10 (hereinafter, a first step), the step of softening a heat dissipation member (350) described with reference to FIGS. 11 and 12 (hereinafter, a second step), the step of assembling the substrate assembly (300) as in the substrate assembly (300) illustrated in FIG. 4 (hereinafter, a third step), and the step of cooling the substrate assembly (300) (hereinafter, a fourth step).

[0123] Referring to FIGS. 4 and 12, the second to fourth steps will be described in detail. In the soldering section (S), the solder paste (361a) applied to the edge of the first surface (311) of the first substrate (310) (e.g., the edge (311e) of FIG. 6) may be liquid, and the heat dissipation member (350) arranged on the first surface (311) may be gel-like. Thereafter, when the pre-bonded interposer (330) and the second substrate (320) are pressed to come closer to the first substrate (310), the soft gel-like heat dissipation member (350G) may be compressed. Then, the compressed gel-like heat dissipation member (350G) may be introduced between components (e.g., the second electronic component (E2)) arranged on the third surface (321) of the second substrate (320) and may come into contact with the third surface (321). Afterwards, when the substrate assembly (300) is sufficiently cooled, the gel-like heat dissipation member (350S) placed in the internal space (331) can be transferred to a solid state.

[0124] FIG. 13 is a cross-sectional view of a heat dissipation member (350) and an adhesive member (370) according to one embodiment of the present disclosure.

[0125] Referring to FIG. 13, according to one embodiment of the present disclosure, a heat dissipation member (350) may be bonded to a first substrate (310, see FIG. 4) by an adhesive member (370). The adhesive member (370) may be positioned between the heat dissipation member (350) and the first substrate (310). Accordingly, since the heat dissipation member (350) is stably fixed on the first substrate (310), problems such as warping or lifting may be reduced.

[0126] According to one embodiment of the present disclosure, the adhesive member (370) may include a first adhesive layer (371) that is adhered to a first surface (311) of a first substrate (310). As an example, the first adhesive layer (371) may include an acrylic adhesive.

[0127] According to one embodiment of the present disclosure, the adhesive member (370) may include a second adhesive layer (372) disposed between the heat dissipation member (350) and the first adhesive layer (371). The second adhesive layer (372) may include an adhesive different from the first adhesive layer (371). The second adhesive layer (372) may include a hot melt adhesive.

[0128] According to one embodiment of the present disclosure, the second adhesive layer (372) including a hot melt adhesive may be in a solid state at room temperature (e.g., 25 degrees Celsius). Since the second adhesive layer (372) in a solid state provides rigidity to the heat dissipation member (350), the heat dissipation member (350) may be placed by SMT (surface mount technology) as described with reference to FIG. 9.

[0129] Fig. 14 is a cross-sectional view showing a softened state of a heat dissipation member (350) in a reflow soldering process according to another embodiment of the present disclosure. Fig. 15 shows a state in which a substrate assembly (300) is assembled in a soldering section (S, see Fig. 10) of reflow soldering according to another embodiment of the present disclosure. The description of the reflow soldering process described with reference to Fig. 10 can be equally applied to the reflow soldering process described with reference to Figs. 14 and 15.

[0130] The description of the components described with reference to FIG. 4 (e.g., the first electronic component (E1) and / or the fourth electronic component (E4)) can be substantially identically applied to the components of the same name described with reference to FIG. 14 and FIG. 15 (e.g., the first electronic component (E01) and / or the fourth electronic component (E04)) to the extent that they are not arranged with each other.

[0131] The descriptions of the second step, the third step, and the fourth step described with reference to FIGS. 4 and 10 to 12 can be substantially identically applied to the following description with reference to FIGS. 14 and 15, to the extent that they do not conflict with each other. The description of the second step can be substantially identically applied to the description of FIG. 14. The descriptions of the third step and the fourth step can be substantially identically applied to the description of FIG. 15.

[0132] Referring to FIGS. 14 and 15, according to another embodiment of the present disclosure, a first electronic component (E01) and a fourth electronic component (E04) may be disposed on a second surface (312) of a first substrate (310). A heat dissipation member (350) may be in contact with the first surface (311) of the first substrate (310). The heat dissipation member (350) may be disposed in an internal space (331) so as to overlap with the first electronic component (E01) when viewed in a direction perpendicular to the second surface (322). The heat dissipation member (350) may provide a heat transfer path through which heat generated in the first electronic component (E01) is dissipated.

[0133] As electronic components (e.g., application processors) become more integrated and their performance improves, their heat generation increases. This heat generation can impact the performance of electronic devices (e.g., performance degradation due to throttling). Consequently, extensive research is being conducted on heat dissipation structures for electronic components.

[0134] A problem to be solved in the present disclosure may be to provide a heat dissipation structure for effectively dissipating heat from an electronic component (e.g., an application processor).

[0135] A problem to be solved in the present disclosure may be to provide an easy method for arranging a heat dissipation member at a specific location inside a substrate assembly.

[0136] A problem to be solved in the present disclosure may be minimizing mass loss of a heat dissipation member including a phase change material.

[0137] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0138] An electronic device according to various embodiments of the present disclosure may effectively dissipate heat from an electronic component by arranging a solid heat dissipation member of the electronic component at a location where heat dissipation of the electronic component is easy.

[0139] An electronic device according to various embodiments of the present disclosure can provide a method for easily arranging a heat dissipation member inside a substrate assembly by assembling the substrate assembly after arranging the solid heat dissipation member on the substrate.

[0140] Electronic devices according to various embodiments of the present disclosure can minimize loss of a phase change material included in a heat dissipation member by including an adhesive material that provides adhesiveness to the heat dissipation member.

[0141] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0142] An electronic device (101) according to one embodiment of the present disclosure may include a first substrate (310) including a first side (311) and a second side (312) facing in an opposite direction of the first side (311).

[0143] An electronic device (101) according to one embodiment of the present disclosure may include a second substrate (320) including a third surface (321) facing the first surface (311) and a fourth surface (322) facing in an opposite direction of the third surface (321).

[0144] An electronic device (101) according to one embodiment of the present disclosure may include an interposer (330) disposed between the first surface (311) and the third surface (321).

[0145] An electronic device (101) according to one embodiment of the present disclosure may include a first electronic component (E1) disposed on the fourth surface (322).

[0146] An electronic device (101) according to one embodiment of the present disclosure may include a heat dissipation member (350) that is solid at room temperature (Tr).

[0147] According to one embodiment of the present disclosure, the heat dissipation member (350) may be placed in a space (331) defined by the first substrate (310), the second substrate (320), and the interposer (330) so as to overlap with the first electronic component (E1) when viewed in a direction perpendicular to the fourth surface (322).

[0148] According to one embodiment of the present disclosure, the heat dissipation member (350) may be at least partially in a gel phase at a temperature range higher than a softening point higher than room temperature (Tr).

[0149] According to one embodiment of the present disclosure, the device may further include a solder (361, 362) electrically connecting the first substrate (310) or the second substrate (320) and the interposer (330).

[0150] According to one embodiment of the present disclosure, the heat dissipation member (350) may be configured to maintain a gel phase at a melting point of the solder (350) higher than the softening point.

[0151] According to one embodiment of the present disclosure, the second substrate (320) may further include at least one second electronic component (E2) disposed on the third surface (321).

[0152] According to one embodiment of the present disclosure, the heat dissipation member (350) may include a contact portion (350c) that contacts at least one of the second electronic component (E2) or the third surface (321).

[0153] According to one embodiment of the present disclosure, the second electronic component (E2) may be positioned between the heat dissipation member (350) and the first electronic component (E1).

[0154] According to one embodiment of the present disclosure, the second electronic component (E2) may include a plurality of decoupling capacitors electrically connected to the first electronic component (E1) through the second substrate (320).

[0155] According to one embodiment of the present disclosure, the contact portion (350c) of the heat dissipation member (350) is located between the plurality of decoupling capacitors and can contact the third surface (321).

[0156] According to one embodiment of the present disclosure, the third electronic component (E3) may be further included, which is disposed on the first surface (311) of the first substrate (310) and at least part of which is covered by the heat dissipation member (350).

[0157] According to one embodiment of the present disclosure, the heat dissipation member (350) may include a phase change material having a melting point of 40 degrees Celsius to 60 degrees Celsius.

[0158] According to one embodiment of the present disclosure, the heat dissipation member (350) may include a matrix material configured to maintain the heat dissipation member in a gel phase at a temperature higher than the melting point of the phase change material.

[0159] According to one embodiment of the present disclosure, the heat dissipation member (350) may further include a tackifier configured to provide tack to the phase change material.

[0160] According to one embodiment of the present disclosure, the matrix material may include a thermoplastic organic material.

[0161] According to one embodiment of the present disclosure, the adhesive material may include a petroleum resin-based hydrocarbon.

[0162] According to one embodiment of the present disclosure, the adhesive material may have at least one functional group different from the functional group of the matrix material.

[0163] According to one embodiment of the present disclosure, the adhesive material may have a glass transition temperature higher than a melting point of the phase change material.

[0164] According to one embodiment of the present disclosure, the weight ratio of the phase change material and the adhesive material may be 1:1.

[0165] According to one embodiment of the present disclosure, an adhesive member (370) may be further included between the first surface (311) of the first substrate (310) and the heat dissipation member (350).

[0166] According to one embodiment of the present disclosure, the adhesive member (370) may include a first adhesive layer (371) adhered to a first surface (311) of the first substrate (310).

[0167] According to one embodiment of the present disclosure, the adhesive member (370) is disposed between the first adhesive layer (371) and the heat dissipation member (350), and may include a second adhesive layer (372) including a hot melt adhesive.

[0168] According to one embodiment of the present disclosure, the heat dissipation member (350) can be bonded to the first surface (311) of the first substrate (310) by the adhesive member (370) and can be in contact with the third surface (321) of the second substrate (320).

[0169] According to one embodiment of the present disclosure, the heat dissipation member (350) can contact an area (321a) of the third surface (321) that overlaps the first electronic component (E1) when viewed in a direction perpendicular to the fourth surface (322).

[0170] According to one embodiment of the present disclosure, the interposer (330) extends along an edge (311e) of the first surface (311) of the first substrate (310) to at least partially surround the heat dissipation member (350), and can electrically connect the first substrate (310) and the second substrate (320).

[0171] According to one embodiment of the present disclosure, the electronic device (101) may include an electronic component (E01) disposed on the second surface (312).

[0172] According to one embodiment of the present disclosure, the heat dissipation member (350) may be placed in a space (331) defined by the first substrate (310), the second substrate (320), and the interposer (330) so as to overlap with the first electronic component (E01) when viewed in a direction perpendicular to the second surface (322).

[0173] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In electronic devices, A first substrate (310) including a first side (311) and a second side (312) facing in an opposite direction to the first side (311); A second substrate (320) including a third surface (321) facing the first surface (311) and a fourth surface (322) facing in an opposite direction to the third surface (321); At least one interposer (330) disposed between the first surface (311) and the third surface (321) and electrically connecting the first substrate (310) and the second substrate (320); A first electronic component (E1) arranged on the fourth surface (322); and An electronic device comprising a heat dissipation member (350) that is solid at room temperature (Tr) and is arranged in a space (331) defined by the first substrate (310), the second substrate (320), and the at least one interposer (330) so as to overlap the first electronic component (E1) when viewed in a direction perpendicular to the fourth surface (322).

2. In paragraph 1, The above heat dissipation member (350) is An electronic device that is at least partially in a gel phase at a temperature range above its softening point (Tr) above room temperature (Tr).

3. In paragraph 2, It further includes a solder (361, 362) that electrically connects the first substrate (310) or the second substrate (320) and the at least one interposer (330), The above heat dissipation member (350) An electronic device configured to maintain a gel phase at a melting point of the solder (350) higher than the softening point.

4. In any one of paragraphs 1 to 3, It further includes at least one second electronic component (E2) arranged on the third surface (321) of the second substrate (320), The above heat dissipation member (350) is An electronic device comprising a contact portion (350c) that contacts at least one of the third surface (321) or the at least one second electronic component (E2).

5. In paragraph 4, At least one second electronic component (E2) is, It includes a plurality of decoupling capacitors positioned between the heat dissipation member (350) and the first electronic component (E1) and electrically connected to the first electronic component (E1) through the second substrate (320). The contact portion (350c) of the above heat dissipation member (350) is An electronic device positioned between the plurality of decoupling capacitors and in contact with the third surface (321).

6. In either paragraph 4 or paragraph 5, An electronic device further comprising a third electronic component (E3) disposed on a first surface (311) of the first substrate (310) and at least a portion of which is covered by the heat dissipation member (350).

7. In any one of paragraphs 1 to 6, The above heat dissipation member (350) is: Phase change materials having a melting point of 40 degrees Celsius to 60 degrees Celsius; and An electronic device comprising a matrix material configured to maintain the heat dissipation member in a gel phase at a temperature higher than the melting point of the phase change material.

8. In paragraph 7, The above heat dissipation member (350) is An electronic device further comprising a tackifier configured to provide tack to the phase change material.

9. In paragraph 8, The above matrix material comprises a thermoplastic organic material, The above adhesive material is an electronic device containing a petroleum resin-based hydrocarbon.

10. In paragraph 9, An electronic device wherein the adhesive material comprises at least one functional group different from the functional group of the matrix material.

11. In any one of clauses 8 to 10, The above adhesive material is, An electronic device having a glass transition temperature higher than the melting point of the above phase change material.

12. In paragraph 11, An electronic device wherein the weight ratio of the phase change material and the adhesive material is 1:

1.

13. In any one of paragraphs 1 to 12, An electronic device further comprising an adhesive member (370) disposed between the first surface (311) of the first substrate (310) and the heat dissipation member (350).

14. In paragraph 13, The above adhesive member (370): A first adhesive layer (371) disposed on the first surface (311) of the first substrate (310); and A second adhesive layer (372) is disposed between the first adhesive layer (371) and the heat dissipation member (350) and includes a hot melt adhesive. The above heat dissipation member (350) is An electronic device that is adhered to the first surface (311) of the first substrate (310) through the adhesive member (370) and comes into contact with the third surface (321) of the second substrate (320).

15. In any one of paragraphs 1 to 14, The above heat dissipation member (350) is An electronic device that contacts an area (321a) of the third surface (321) that overlaps the first electronic component (E1) when viewed in a direction perpendicular to the fourth surface (322).

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