Device for assembling battery module

Abstract

The present invention relates to a device for assembling a battery module. According to an aspect of the present invention, the device for assembling a battery module is used to assemble a circuit board to a sub-assembly of the battery module and may comprise: a fixing frame which may be fixed on one side of the sub-assembly; and a rotary frame rotatably connected to the fixing frame and capable of moving the circuit board, placed on one side, onto the outer surface of the sub-assembly.

Description

Battery module assembly device

[0001] Cross-citation with related applications

[0002] This application claims the benefit of priority from Korean Patent Application No. 10-2024-0003679, dated January 9, 2024, the entire contents of which are incorporated herein by reference.

[0003] Technology field

[0004] The present invention relates to a battery module assembly device, and more particularly, to a battery module assembly device for assembling a circuit board into a semi-assembly of a battery module.

[0005] Secondary batteries have been used in small applications such as mobile devices and laptops, but their research has recently expanded to medium- to large-scale applications. They are widely used in applications requiring high voltage and large capacity, such as energy storage systems (ESS) and electric vehicles (EVs). When multiple battery cells made of these secondary batteries are connected and combined in a specific manner, a battery module can be formed.

[0006] Meanwhile, a circuit board may be provided within the battery module. The circuit board may electrically connect different components of the battery module to each other or obtain electrical signals from other components to perform a specific function. For example, the circuit board may connect battery cells to a battery management system (BMS) or transmit electrical signals from the battery cells to other sensors. For this purpose, a flexible circuit board with a certain degree of flexibility is primarily used in the battery module.

[0007] Therefore, the battery module manufacturing process involves assembling circuit boards onto battery module subassemblies. Conventionally, workers manually assembled circuit boards onto battery module subassemblies. However, this manual assembly of circuit boards poses a risk of contamination from external sources.

[0008] For example, a battery module subassembly may have adhesive applied to areas where other components can be attached. When assembling a circuit board, a worker's hands may become contaminated with this adhesive. If the worker picks up the circuit board with these contaminated hands, the circuit board may become contaminated with the adhesive on their hands.

[0009] When contaminated circuit boards are assembled into a subassembly, defects or failures can occur in the final battery module. For example, if the area where the circuit board and battery cells are welded together becomes contaminated, a weld defect can occur between the circuit board and the battery cell, resulting in improper voltage or current measurements or failure of the battery cell to electrically connect to other components.

[0010] Accordingly, there has been an urgent need for the development of a battery module assembly device capable of assembling circuit boards onto battery module subassemblies while minimizing contact with potential sources of contamination.

[0011] The present invention has been devised to solve the above problems, and the object of the present invention is to provide a battery module assembly device capable of assembling a circuit board into a battery module subassembly while minimizing contact with potential sources of contamination.

[0012] The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the description below.

[0013] According to one aspect of the present invention, a battery module assembly device for assembling a circuit board into a semi-assembly of a battery module is provided, comprising: a fixed frame that can be fixed to one side of the semi-assembly; and a rotating frame that is rotatably coupled to the fixed frame and can move a circuit board placed on one side onto an outer surface of the semi-assembly.

[0014] At this time, the rotating frame may include a substrate support portion extending in any direction so that the circuit board can be placed.

[0015] At this time, the substrate support member may be provided with an adsorption member for adsorbing the circuit board.

[0016] At this time, the above adsorption portion may be provided in multiple numbers and spaced apart from each other along the extension direction of the substrate support portion.

[0017] At this time, the rotating frame may include a sub-support extending from the substrate support.

[0018] At this time, the sub-supports may be provided in pairs and provided at each end of the extended direction of the substrate support.

[0019] At this time, the rotating frame may further include a pin support provided on an extension side of the substrate support; and an assembly device-side guide pin that protrudes outward from the pin support and can be fitted into a joining hole formed in the circuit board.

[0020] At this time, the guide pins on the assembly device side may be provided in multiple numbers and spaced apart along the extension direction of the substrate support portion.

[0021] At this time, the guide pin on the assembly device side can be connected to the pin support member so as to be movable in the longitudinal direction.

[0022] At this time, the pin support member may be provided with an elastic member for elastically supporting the guide pin on the assembly device side.

[0023] At this time, the pin support can be connected to a side of the substrate support.

[0024] At this time, the substrate support portion is provided with a substrate support surface on which a portion of the circuit board can be placed in contact, and the pin support portion is provided with a pin support surface from which an end of the guide pin on the assembly device side protrudes, and the pin support surface and the substrate support surface may have different heights in the movement direction of the guide pin on the assembly device side.

[0025] At this time, a guide pin hole into which the assembly device-side guide pin is inserted is formed in the pin support portion, and the assembly device-side guide pin may have a shorter length than the guide pin hole.

[0026] At this time, the guide pin on the assembly device side may have at least a portion having a diameter larger than a section of the guide pin hole so as not to fall off from the pin support portion.

[0027] At this time, the guide pin may be configured to be pressed by a part of the semi-assembly as the rotating frame rotates and enter the inside of the guide pin hole.

[0028] At this time, the fixed frame may include a base portion extending in one direction so as to be arranged parallel to the side of the semi-assembly; and a fixing portion provided on each of the two sides of the base portion in the extension direction so as to be fixed to a corner portion of the semi-assembly.

[0029] At this time, the rotating frame may be configured to rotate around an axis that is parallel or parallel to the extension direction of the base portion.

[0030] At this time, the fixing member may have a clamp shape that can pick up or place a corner portion of the semi-assembled body.

[0031] At this time, the base portion may have a flat plate shape that can be arranged parallel to the side of the semi-assembly, and an assembly device-side connecting portion that can be connected in a shape-fitting manner with a portion of the semi-assembly may be provided on one surface of the base portion.

[0032] At this time, the assembly device side connecting portion may be provided in multiple numbers and spaced apart in the extension direction of the base portion.

[0033] According to one aspect of the present invention, a fixed frame that can be fixed to one side of a semi-assembly and a rotating frame that is rotatably coupled to the fixed frame are provided, so that the rotating frame can move the circuit board toward the semi-assembly to assemble it.

[0034] Accordingly, contact between the worker and the circuit board can be minimized during the process of assembling the circuit board into the subassembly, thereby preventing contamination of the circuit board by potential sources of contamination.

[0035] The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present invention pertains from this specification and the attached drawings.

[0036] FIG. 1 is a perspective view from above of a battery module assembly device according to one embodiment of the present invention, fixed to a semi-assembly of a battery module.

[0037] Figure 2 is a perspective view from above of the battery module subassembly and circuit board assembled together.

[0038] FIG. 3 is a perspective view of a battery module assembly device according to one embodiment of the present invention viewed from the rear.

[0039] FIG. 4 is a perspective view of a battery module assembly device according to one embodiment of the present invention viewed from the front.

[0040] Figure 5 is an enlarged view of part A of Figure 4.

[0041] FIG. 6 is a perspective view of a battery module assembly device according to one embodiment of the present invention, viewed from below.

[0042] FIG. 7 is a side view illustrating a state in which a rotating frame of a battery module assembly device according to one embodiment of the present invention rotates.

[0043] FIG. 8 is a perspective view of a battery module assembly device according to one embodiment of the present invention, viewed from above, showing a rotated state of a rotating frame.

[0044] FIG. 9 is a perspective view of a battery module assembly device according to one embodiment of the present invention, viewed from below, showing a rotated state of a rotating frame.

[0045] Figure 10 is an enlarged view of part B of Figure 4.

[0046] Fig. 11 is a cross-sectional view according to II of Fig. 10.

[0047] FIG. 12 is a drawing showing a state in which a circuit board is moved toward a semi-assembly side by a rotating frame of a battery module assembly device according to one embodiment of the present invention.

[0048] FIG. 13 is a drawing showing a state in which a circuit board is assembled into a semi-assembly by a rotating frame of a battery module assembly device according to one embodiment of the present invention.

[0049] Preferred embodiments of the present invention are described in detail so that those skilled in the art can easily implement them. However, the present invention may be implemented in various different forms and is not limited or restricted by the following examples.

[0050] In order to clearly explain the present invention, a detailed description of a part that is irrelevant to the description or a related known technology that may unnecessarily obscure the gist of the present invention has been omitted, and when adding reference signs to components of each drawing in this specification, the same or similar reference signs are attached to the same or similar components throughout the specification.

[0051] In addition, terms and words used in this specification and claims should not be interpreted as limited to their usual or dictionary meanings, but should be interpreted as meanings and concepts that conform to the technical idea of ​​the present invention based on the principle that the inventor can appropriately define the concept of the term to explain his or her own invention in the best way.

[0052] Fig. 1 is a perspective view from above of a battery module assembly device according to one embodiment of the present invention, wherein the device is secured to a battery module subassembly. Fig. 2 is a perspective view from above of a battery module subassembly and a circuit board assembled together.

[0053] FIGS. 1 and 2 disclose a battery module assembly device (1) (hereinafter referred to as an assembly device) according to one embodiment of the present invention. Referring to FIG. 1, the assembly device (1) according to one embodiment of the present invention may be a device for assembling a circuit board (5) into a semi-assembly (2).

[0054] Before describing an assembly device (1) according to one embodiment of the present invention, a semi-assembly (2) and a circuit board (5) assembled together by the assembly device (1) will be briefly described.

[0055] Referring to FIGS. 1 and 2, in the present disclosure, the subassembly (2) may be a subassembly for manufacturing a battery module. Although not specifically illustrated, the subassembly (2) may be composed of a plurality of battery cells and a module frame or module housing for supporting them.

[0056] As shown, the semi-assembly (2) may have an overall hexahedral shape. A semi-assembly-side guide pin (3) may be provided on the upper surface (2a) of the semi-assembly (2).

[0057] The semi-assembly side guide pin (3) may be a pin for guiding or joining the circuit board (5) described later so that it can be assembled on the upper surface (2a) of the semi-assembly (2). For this purpose, the semi-assembly side guide pin (3) may protrude upward from the upper surface (2a) of the semi-assembly (2).

[0058] Meanwhile, as illustrated, a plurality of guide pins (3) on the semi-assembly side may be provided and arranged on a portion of the upper surface (2a) of the semi-assembly (2). At this time, a portion of the upper surface (2a) of the semi-assembly (2) may be a portion where a circuit board (5) described later is assembled (hereinafter, referred to as an assembly portion).

[0059] As illustrated, the assembly portion may be a left (positive direction of the X-axis) edge portion on the upper surface (2a) of the sub-assembly (2), and a plurality of sub-assembly-side guide pins (3) may be spaced apart from each other along the left (positive direction of the X-axis) edge on the upper surface (2a). However, the sub-assembly (2) to be assembled by the assembly device (1) does not necessarily have to have the sub-assembly-side guide pins (3).

[0060] Referring to FIGS. 1 and 2, in the present disclosure, the circuit board (5) may be a board for electrically connecting battery cells of a battery module to each other, connecting battery cells and a battery management system (BMS) to each other, or connecting battery cells and other components such as sensors to each other. As an example, the circuit board (5) may be a flexible circuit board having a predetermined degree of flexibility, but is not limited thereto.

[0061] As illustrated, the circuit board (5) may include an extension portion (6), a pad portion (7), and a coupling hole forming portion (8). In the present embodiment, the extension portion (6) may be a portion of the circuit board (5) placed on the edge portion of the upper surface (2a) of the semi-assembly (2). The extension portion (6) may have a predetermined length in any one direction (Y-axis direction).

[0062] The extension portion (6) may be equipped with an electric circuit for connecting the pad portion (7) or connector (not shown) described later to each other. Accordingly, the components of the semi-assembly (2) can be electrically connected to each other.

[0063] The pad portion (7) may be a portion of the circuit board (5) that protrudes outward from the extension portion (6). The pad portion (7) may be a portion that can be joined to a battery cell, a bus bar, a sensor, or the like. As an example, the joining may be performed by a welding process. Therefore, the circuit board (5) must be free from contamination so that the welding can be performed smoothly.

[0064] At this time, the pad portion (7) may be provided in multiple pieces and spaced apart along the extension direction (Y-axis direction) of the extension portion (6). Through this, various components of the semi-assembly (2) may be electrically connected to each other.

[0065] The coupling hole forming portion (8) may be a portion of the circuit board (5) protruding outward from the extension portion (6). A coupling hole (9) may be formed in the coupling hole forming portion (8). The coupling hole (9) may be used to guide the relative positions between the circuit board (5) and the sub-assembly (2) during the process of assembling them together, or to couple the circuit board (5) and the sub-assembly (2). This will be described in detail later together with the assembly device (1).

[0066] At this time, the joining hole forming portions (8) are provided in multiple numbers and can be spaced apart along the extension direction (Y-axis direction) of the extension portion (6). Through this, the bonding force and assembling ability between the semi-assembly (2) and the circuit board (5) can be further increased.

[0067] Meanwhile, the semi-assembly (2) and circuit board (5) described above are merely examples of semi-assemblies and circuit boards that can be assembled by the assembly device (1) according to one embodiment of the present invention, and the assembly device (1) according to one embodiment of the present invention can be used to assemble semi-assemblies and circuit boards having various shapes or structures.

[0068] Hereinafter, an assembly device according to one embodiment of the present invention will be described in more detail with different drawings.

[0069] FIG. 3 is a perspective view of a battery module assembly device according to an embodiment of the present invention, viewed from the rear. FIG. 4 is a perspective view of a battery module assembly device according to an embodiment of the present invention, viewed from the front. FIG. 5 is an enlarged view of portion A of FIG. 4. FIG. 6 is a perspective view of a battery module assembly device according to an embodiment of the present invention, viewed from below. FIG. 7 is a side view illustrating a state in which a rotation frame of a battery module assembly device according to an embodiment of the present invention rotates. FIG. 8 is a perspective view of a rotation frame of a battery module assembly device according to an embodiment of the present invention, viewed from above, in a rotated state. FIG. 9 is a perspective view of a rotation frame of a battery module assembly device according to an embodiment of the present invention, viewed from below, in a rotated state. FIG. 10 is an enlarged view of portion B of FIG. 11 is a cross-sectional view according to II of FIG. 10. FIG. 12 is a view illustrating a state in which a circuit board is moved toward a semi-assembly by a rotation frame of a battery module assembly device according to an embodiment of the present invention. FIG. 13 is a drawing showing a state in which a circuit board is assembled into a semi-assembly by a rotating frame of a battery module assembly device according to one embodiment of the present invention.

[0070] Referring to FIGS. 1 to 4, an assembly device (1) according to one embodiment of the present invention may include a fixed frame (10). The fixed frame (10) may be a frame for fixing the assembly device (1) to a side of a semi-assembly (2). In the present embodiment, the fixed frame (10) may be fixed to a portion of the front side (positive direction of the X-axis) of the semi-assembly (2), but the position at which the assembly device (1) is fixed to the semi-assembly (2) is not particularly limited.

[0071] In this embodiment, the fixed frame (10) may include a base portion (12). As illustrated, the base portion (12) may have a plate shape extending in one direction (Y-axis direction). Accordingly, the base portion (12) may be arranged parallel to the side surface (2b) of the semi-assembly (2).

[0072] The shape of the base portion (12) may be appropriately modified as needed. For example, if the semi-assembly (2) has a curved shape, the base portion (12) may be formed to have at least one portion curved to correspond to the shape of the semi-assembly (2).

[0073] Referring to FIGS. 2, 3, and 6, the fixed frame (10) of the assembly device (1) according to one embodiment of the present invention may include an assembly device-side coupling portion (13). In this embodiment, the assembly device-side coupling portion (13) may be configured to increase the coupling force between the assembly device (1) and the semi-assembly (2), or to guide the relative position between the assembly device (1) and the semi-assembly (2).

[0074] In this embodiment, the assembly device-side coupling portion (13) may be provided on one side of the base portion (12). At this time, the one side of the base portion (12) may be a side facing the side surface (2b) of the semi-assembly (2). In the illustrated embodiment, the one side may be a rear surface facing the rear (negative direction of the X-axis).

[0075] In this embodiment, the assembly device-side connecting portion (13) may be configured to be shape-fitted with a portion of the semi-assembly (2). As illustrated, a semi-assembly-side connecting portion (4) may be provided on the side surface (2b) of the semi-assembly (2), and the assembly device-side connecting portion (13) may be configured to be shape-fitted with the semi-assembly-side connecting portion (4).

[0076] In this embodiment, the semi-assembly side coupling portion (4) may have a protrusion shape protruding toward the side surface (2b), and the assembly device side coupling portion (13) may be provided in the form of a groove or hole formed on the rear surface of the base portion (12). The semi-assembly side coupling portion (4) may be inserted and coupled into the inside of the assembly device side coupling portion (13).

[0077] Through this, the assembly device (1) can be more stably coupled and fixed to the side (2b) of the semi-assembly (2). Furthermore, in the process of fixing the assembly device (1) to the side of the semi-assembly (2), the aforementioned coupling parts (4, 13) can also perform the function of guiding the relative position between the assembly device (1) and the semi-assembly (2).

[0078] Meanwhile, in this embodiment, the assembly device side coupling part (13) is described as being provided in the form of a hole or groove and the semi-assembly side coupling part (4) has a protrusion shape. However, the assembly device side coupling part (13) may have a protrusion shape and the semi-assembly side coupling part (4) may be provided in the form of a hole or groove.

[0079] Meanwhile, in the present embodiment, the assembly device-side coupling portion (13) may be configured in multiple pieces. In addition, the multiple assembly device-side coupling portions (13) may be spaced apart from each other along the extension direction (Y-axis direction) of the base portion (12). Through this, the assembly device (1) can be more evenly fixed to the semi-assembly (2).

[0080] Referring to FIGS. 2 to 6, the fixed frame (10) of the assembly device (1) according to one embodiment of the present invention may include a fixing member (14). In this embodiment, the fixing member (14) may be configured to fix the assembly device (1) to the semi-assembly (2) by generating a predetermined fixing force or bonding force.

[0081] In this embodiment, the fixing member (14) may have a clamp shape that can pick up or place a corner portion of the semi-assembly (2). In this embodiment, the corner portion of the semi-assembly (2) may be a corner provided on one side in the longitudinal direction (Y-axis direction) of the side surface (2b). This corner may extend in the vertical direction (Z-axis direction).

[0082] At this time, in the present embodiment, the fixing portion (14) may be configured as a pair and may be provided on both sides of the base portion (12) in the extension direction (Y-axis direction). The pair of fixing portions (14) may respectively pick up or place corners provided on both sides of the longitudinal direction (Y-axis direction) of the side surface (2b) of the semi-assembly (2). As a result, the assembly device (1) may be more stably and evenly fixed on the side surface (2b) of the semi-assembly (2).

[0083] Referring to FIGS. 2 and 5 together, guide portions (12a, 12b) may be provided on a surface of the base portion (12) facing the outside of the semi-assembly (2). At this time, the surface of the base portion (12) may be a front surface facing the front (positive direction of the X-axis). In other words, the surface of the base portion (12) may be a front surface facing the rear surface of the base portion (12) on which the assembly device-side coupling portion (13) is provided.

[0084] In this embodiment, the guide portions (12a, 12b) may be configured to guide the movement of the fixed portion (14). The fixed portion (14) must be able to move in order to pick up or place a corner portion of the semi-assembly (2), and the guide portions (12a, 12b) can guide the movement of the fixed portion (14) in this manner.

[0085] In this embodiment, the guide portions (12a, 12b) may be provided as cylindrical members coupled to the front surface of the base portion (12). This may be to allow the guide rods (14b, 14c) of the fixed portion (14) described later to move while penetrating the guide portions (12a, 12b). These guide portions (12a, 12b) may extend parallel to the extension direction (Y-axis direction) of the base portion (12).

[0086] At this time, in the present embodiment, the guide portions (12a, 12b) may be formed of an upper guide portion (12a) and a lower guide portion (12b) spaced apart in the vertical direction (Z-axis direction). In other words, the upper guide portion (12a) and the lower guide portion (12b) may be spaced apart from each other in the width direction (Z-axis direction) of the base portion (12). This may be for guiding the upper guide rod (14b) and the lower guide rod (14c) described later, respectively.

[0087] Through this, the fixed part (14) can be stably moved in the longitudinal direction (Y-axis direction) of the side surface (2b) of the semi-assembly (2). In other words, the fixed part (14) can be moved in a balanced manner in the longitudinal direction (Y-axis direction) of the side surface (2b) of the semi-assembly (2) without being rotated in the height direction (Z-axis direction) of the side surface (2b) or in the direction perpendicular to the side surface (2b) (X-axis direction).

[0088] Meanwhile, the fixing part (14) of the assembly device (1) according to one embodiment of the present invention may include a fixing pad (14a) and a guide rod (14b, 14c). The fixing pad (14a) may be a pad for holding or placing a corner portion of the semi-assembly (2). The fixing pad (14a) may be provided as a square block-shaped member, but may be appropriately modified as needed.

[0089] The operation of the fixed part (14) is described in more detail as follows.

[0090] In this embodiment, when the fixing pads (14a) of the fixing portions (14) provided on both sides of the extension direction (Y-axis direction) of the base portion (12) are moved closer to each other, the fixing portions (14) can pick up the corners of the semi-assembly (2) placed therebetween. Accordingly, the fixing frame (10) can be coupled or fixed to the semi-assembly (2).

[0091] Conversely, when the fixing pads (14a) are moved away from each other, the fixing member (14) can place the edge of the semi-assembly (2) placed therebetween. Accordingly, the fixing frame (10) can be decoupled or de-anchored from the semi-assembly (2).

[0092] Meanwhile, in the present embodiment, the base portion (12) and the fixing pad (14a) may each be in surface contact with the side surface (2b) of the semi-assembly (2) and another side surface. At this time, the other side surface of the semi-assembly (2) may be a surface that intersects the side surface (2b) at a corner portion.

[0093] For this purpose, the fixing pad (14a) can be positioned inclined or perpendicular to the base portion (12). This configuration can increase the bonding or fixing force between the fixing frame (10) and the semi-assembly (2). Through this, the assembly device (1) can be more stably fixed and coupled to the semi-assembly (2).

[0094] Meanwhile, in the present embodiment, a buffer member (not shown) may be provided on the surface of the fixing pad (14a) that comes into contact with the semi-assembly (2). The buffer member may be made of a material with greater elasticity than the fixing pad (14a). This may be to prevent the semi-assembly (2) from being damaged by the fixing portion (14). For example, the buffer member may be made of rubber, but is not limited thereto.

[0095] Meanwhile, in the present embodiment, the guide rod (14b, 14c) of the fixed portion (14) may be a rod for guiding the movement of the fixed pad (14a). For this purpose, one end of the guide rod (14b, 14c) may be coupled to the fixed pad (14a).

[0096] And, in this embodiment, the guide rods (14b, 14c) can extend in a direction parallel to the extension direction (Y-axis direction) of the base portion (12). And, the guide rods (14b, 14c) can be movably coupled to the guide portions (12a, 12b) of the aforementioned base portion (12) in the extension direction (Y-axis direction). Accordingly, the fixing pad (14a) is guided by the guide portions (12a, 12b) and can be moved in the extension direction (Y-axis direction) of the base portion (12).

[0097] Meanwhile, in the present embodiment, the guide rods (14b, 14c) may be composed of an upper guide rod (14b) and a lower guide rod (14c). In addition, the upper guide rod (14b) and the lower guide rod (14c) may be connected to the upper guide portion (12a) and the lower guide portion (12b), respectively. As a result, the fixing pad (14a) can be moved stably and in a balanced manner without rotating.

[0098] Referring to FIGS. 2, 4, and 5, the fixed frame (10) of the assembly device (1) according to one embodiment of the present invention may include a lever portion (15). The lever portion (15) may be configured to operate the fixed portion (14) described above. The lever portion (15) may be manually operated by a worker, or may be automatically operated by being connected to a predetermined actuator.

[0099] At this time, in this embodiment, the lever portion (15) is configured as a pair and can be operatively coupled to a pair of fixing portions (14), respectively. As a result, the pair of fixing portions (14) can be individually operated.

[0100] In this embodiment, the lever portion (15) may include a connecting link (15a) and a lever link (15b). The lever link (15b) may be a link operated by an operator or an actuator, and the connecting link (15a) may be a link that transmits the operating force transmitted to the lever link (15b) to the aforementioned fixed portion (14).

[0101] In this embodiment, the connecting link (15a) may have a rod shape. In addition, one side of the connecting link (15a) may be coupled to one end of at least one of the upper guide rod (14b) and the lower guide rod (14c) of the fixed part (14).

[0102] As illustrated, one side of the connecting link (15a) can be coupled to one end of the lower guide rod (14c). In this embodiment, one end of the lower guide rod (14c) can be an end opposite to the end coupled to the fixing pad (14a).

[0103] And, in this embodiment, the other side of the connecting link (15a) can be coupled to the lever link (15b). At this time, in this embodiment, one side and the other side of the connecting link (15a) can be rotatably coupled to the lower guide rod (14c) and the lever link (15b), respectively. For this purpose, the connecting link (15a) and the lower guide rod (14c) can be coupled by a predetermined pin.

[0104] In this embodiment, the lever link (15b) can be rotatably coupled to the base portion (12) and the connecting link (15a), respectively. To this end, the lever link (15b) can be coupled to the base portion (12) and the connecting link (15a) by a predetermined pin.

[0105] And, in this embodiment, a portion of the lever link (15b) may extend outward from the base portion (12). This may be to provide a base that can be connected to an actuator or manually operated by an operator.

[0106] Referring again to FIGS. 3 and 4, the fixed frame (10) of the assembly device (1) according to one embodiment of the present invention may include a fixed frame-side rotational coupling member (16). The fixed frame-side rotational coupling member (16) may be configured to provide a base to which a rotational frame (20) described below is rotatably coupled.

[0107] In this embodiment, the fixed frame-side rotational coupling portion (16) may have a hinge shape provided on the upper edge portion of the base portion (12). However, the structure or position of the fixed frame-side rotational coupling portion (16) is not particularly limited as long as the rotational frame (20) can be rotatably coupled thereto.

[0108] Meanwhile, in the present embodiment, the fixed frame-side rotational coupling portion (16) may be configured in multiple units. Furthermore, the multiple fixed frame-side rotational coupling portions (16) may be spaced apart from each other in the extension direction (Y-axis direction) of the base portion (12). Through this, the fixed frame (10) will be able to support the rotational frame (20) more stably and in a balanced manner.

[0109] In one embodiment of the present invention, the fixed frame (10) of another assembly device (1) may include a gripping portion (18). The gripping portion (18) may have a handle shape that a worker can grasp to move the assembly device (1). For the convenience of the worker, a plurality of gripping portions (18) may be provided.

[0110] In this embodiment, the grip portion (18) may be provided on a surface of the base portion (12) facing the outside of the semi-assembly (2). At this time, the surface of the base portion (12) may be a front surface facing forward (positive direction of the X-axis). In other words, the surface of the base portion (12) may be a front surface facing the rear surface of the base portion (12) on which the assembly device-side coupling portion (13) is provided. This may be to prevent the grip portion (18) and the semi-assembly (2) from interfering with each other.

[0111] Referring to FIGS. 1 to 4, an assembly device (1) according to one embodiment of the present invention may include a rotating frame (20). In this embodiment, the rotating frame (20) may be a frame for moving a circuit board (5) toward a semi-assembly (2) and assembling it in an assembly area. To this end, a circuit board (5) may be placed on one side of the rotating frame (20), and the rotating frame (20) may be rotatably coupled to a fixed frame (10).

[0112] In this way, according to the assembly device (1) according to one embodiment of the present invention, since the circuit board (5) is moved toward the sub-assembly (2) by the rotating frame (20), contact between the worker and the circuit board (5) can be minimized. Through this, contamination of the circuit board (5) can be prevented during the assembly process of the circuit board (5) and the sub-assembly (2).

[0113] In this embodiment, the rotating frame (20) may include a substrate support (22). The substrate support (22) may be configured to support a circuit board (5). In this embodiment, the substrate support (22) may have a rod or bar shape extending in a direction parallel to the base (12) (Y-axis direction).

[0114] This may be because the circuit board (5) includes an extension portion (6) extending in one direction. The shape of the substrate support portion (22) may be appropriately modified to suit the shape of the circuit board (5), etc. For example, if the circuit board (5) has a curved shape, the substrate support portion (22) may be extended in a correspondingly curved manner at least in part.

[0115] Referring to FIGS. 3 and 4, a substrate support surface (23) may be provided on the extension side of the substrate support member (22). At this time, the side of the substrate support member (22) may refer to the upper side (positive direction of the Z-axis) of the substrate support member (22) with reference to FIGS. 3 and 4.

[0116] In this embodiment, the substrate support surface (23) may be an outer surface on which the extension portion (6) of the circuit board (5) is placed and contacts the substrate support portion (22). At this time, the substrate support surface (23) may be provided along the extension direction (Y-axis direction) of the substrate support portion (22) so as to more stably support the circuit board (5).

[0117] Meanwhile, in this embodiment, the substrate support surface (23) is configured as a flat plane. This may be because the extension portion (6) of the circuit board (5) is in the shape of a flat plate. Of course, the substrate support surface (23) may also be formed in a concave or convex portion as needed.

[0118] The rotating frame (20) of the assembly device (1) according to one embodiment of the present invention may include an adsorption part (24). The adsorption part (24) may be configured to adsorb a circuit board (5) placed on a substrate support part (22) and fix it to the rotating frame (20).

[0119] In this embodiment, the suction portion (24) may be provided in the form of an opening to which negative pressure is applied. To this end, a fluid circuit for applying negative pressure to the suction portion (24) may be formed inside the substrate support portion (22). At this time, the magnitude of the negative pressure applied to the suction portion (24) may be appropriately controlled to prevent damage, such as wrinkling, of the circuit board (5). As an example, the magnitude of the negative pressure may be controlled to 92 kPa.

[0120] At this time, in the present embodiment, the suction portion (24) is configured in multiple pieces and can be spaced apart along the extension direction (Y-axis direction) of the substrate support surface (23). The manner or position in which the multiple suction portions (24) are arranged can be appropriately modified to suit the shape of the area on which the circuit board (5) is placed on the substrate support surface (23).

[0121] Meanwhile, referring to FIGS. 2 to 4 and 7 to 9, in the present embodiment, the rotating frame (20) can be rotatably coupled to the fixed frame (10). This may be to move the circuit board (5) placed on the substrate support (22) to the assembly area provided on the upper surface (2a) of the semi-assembly (2).

[0122] To this end, the rotation frame (20) of the assembly device (1) according to one embodiment of the present invention may include a rotation frame-side rotation coupling portion (26). The rotation frame-side rotation coupling portion (26) may protrude outward from the substrate support portion (22) and be rotatably coupled to the fixed frame-side rotation coupling portion (16) of the fixed frame (10).

[0123] At this time, in the present embodiment, the rotating frame-side rotating joint (26) and the fixed frame-side rotating joint (16) may be formed with a hinge-type joint structure. However, the shape of the rotating frame-side rotating joint (26) is not particularly limited as long as it can be rotatably coupled to the fixed frame-side rotating joint (16).

[0124] At this time, in this embodiment, the rotational coupling part (16) on the rotational frame side can be coupled so that the rotational frame (20) rotates around a predetermined rotational axis (C) with respect to the fixed frame (10). Here, the rotational axis (C) can be an axis that is parallel or parallel to the extension direction (Y-axis direction) of the base part (12).

[0125] This may be to prevent the substrate support portion (22) and the base portion (12) from interfering with each other when the rotating frame (20) rotates. Furthermore, through this configuration, the assembly device (1) can be configured with a more compact and simple structure.

[0126] Meanwhile, in the present embodiment, the rotating frame-side rotating coupling portion (16) is configured in multiple pieces and can be spaced apart along the extension direction of the rotation axis (C). As a result, the rotating frame (20) can be supported more stably and in a balanced manner by the fixed frame (10).

[0127] By the configurations described above, the rotation frame (20) of the assembly device (1) according to one embodiment of the present invention can be rotated from a phase in which the substrate support surface (23) is arranged to face upward (positive direction of the Z-axis) as shown in FIGS. 3 and 4 to a phase in which the substrate support surface (23) is arranged to face downward (positive direction of the Z-axis) as shown in FIGS. 8 and 9.

[0128] The rotation of the rotating frame (20) can be performed as illustrated in Fig. 7. Accordingly, as illustrated in Figs. 1 and 2, the circuit board (5) can be moved to the upper surface (2a) of the semi-assembly (2) by the assembly device (1) and assembled in the assembly area.

[0129] Meanwhile, referring again to FIGS. 3, 4, 8 and 9, the rotation frame (20) of the assembly device (1) according to one embodiment of the present invention may include a sub-support (28). The sub-support (28) may extend outward from the substrate support (22).

[0130] At this time, the sub-support (28) may be configured as a pair and may be provided at each end of the substrate support (22) in the extension direction (Y-axis direction). In addition, the sub-support (28) may extend perpendicular to the extension direction (Y-axis direction) of the substrate support (22).

[0131] Such a sub-support (28) can perform various functions. For example, the sub-support (28) can perform a function of intuitively indicating the phase (or rotational state) of the rotating frame (20) to the outside. As another example, the sub-support (28) can perform a function of maintaining balance when the rotating frame (20) rotates.

[0132] The first of the above-mentioned exemplary functions will be described in more detail as follows.

[0133] As shown in FIGS. 3 and 4, if the end of the sub-support (28) is facing rearward (positive direction of the X-axis), it can be easily confirmed from the outside that the rotation frame (20) is arranged so that the substrate support surface (23) faces upward (positive direction of the Z-axis).

[0134] Conversely, as shown in FIGS. 7 and 8, if the end of the sub-support (28) is facing forward (in the negative direction of the X-axis), it can be easily confirmed from the outside that the rotation frame (20) is arranged so that the substrate support surface (23) faces downward (in the negative direction of the Z-axis).

[0135] Meanwhile, referring to FIGS. 2 to 4, 10 and 11, the rotation frame (20) of the assembly device (1) according to one embodiment of the present invention may include a pin support member (30) and an assembly device-side guide pin (36) supported by the pin support member (30).

[0136] In this embodiment, the pin support member (30) may be provided as a block-shaped member connected to the side of the substrate support member (22). However, the shape or structure of the pin support member (30) is not particularly limited as long as it can support the assembly device-side guide pin (36).

[0137] In this embodiment, the pin support portion (30) may be provided with a pin support surface (31). An assembly device-side guide pin (36) may protrude upward from the pin support surface (31). Accordingly, when the coupling hole forming portion (8) of the circuit board (5) is placed on the upper side of the pin support surface (31), the end of the assembly device-side guide pin (36) may be fitted into the coupling hole (9) of the coupling hole forming portion (8).

[0138] This configuration can prevent the circuit board (5) from being detached from the rotating frame (20) during the process of rotating the rotating frame (20) by increasing the bonding force between the rotating frame (20) and the circuit board (5).

[0139] Furthermore, the assembly device-side guide pin (36) may also function as a reference for guiding or adjusting the relative position between the circuit board (5) and the rotation frame (20). This is because, in order for the circuit board (5) to be placed on the board support surface (23), the assembly device-side guide pin (36) must be fitted into the joining hole (9) of the circuit board (5).

[0140] Meanwhile, in this embodiment, the pin support surface (31) can face in a direction parallel to the substrate support surface (23) of the substrate support member (22). With reference to Fig. 10, the pin support surface (31) can face upward (positive direction of the Z-axis).

[0141] And, in this embodiment, the substrate support surface (23) may be parallel to the pin support surface (31). This configuration may be because the circuit board (5) is provided in a flat plate shape.

[0142] As will be described in detail later, according to the present embodiment, the guide pin (36) on the assembly device side can move in a direction perpendicular to the pin support surface (31) (or, the substrate support surface (23)), and the substrate support surface (23) and the pin support surface (31) can be spaced apart from each other in the movement direction of the guide pin (36) on the assembly device side. Referring to FIGS. 9 and 10, the guide pin (36) on the assembly device side can move in the up-and-down direction (Z-axis direction).

[0143] At this time, in the present embodiment, the pin support surface (31) may be positioned rearward relative to the substrate support surface (23) when viewed in the direction of movement of the guide pin (36) on the assembly device side. Referring to FIGS. 9 and 10, the pin support surface (31) may be positioned lower (in the negative direction of the Z-axis) relative to the substrate support surface (23). This may be to increase the assembling efficiency between the circuit board (5), the rotation frame (20), and the semi-assembly (2).

[0144] Specifically, the joining hole forming portion (8) of the circuit board (5) can be bent to some extent in the space between the board support surface (23) and the pin support surface (31). Accordingly, the guide pin (36) on the assembly device side can be more easily fitted into the joining hole (9).

[0145] Alternatively, as illustrated in FIG. 13, a semi-assembly-side guide pin (3) may be formed on the upper surface (2a) of the semi-assembly (2), and the gap between the substrate support surface (23) and the pin support surface (31) may provide a free space for the semi-assembly-side guide pin (3).

[0146] Referring again to FIGS. 10 and 11, in the present embodiment, the guide pin (36) on the assembly device side can be movably coupled to the pin support member (30). To this end, a guide pin hole (33) can be formed inside the pin support member (30). The guide pin hole (33) can be a hole into which the guide pin (36) on the assembly device side can be movably inserted. The opening of the guide pin hole (33) can be located on the pin support surface (31).

[0147] In this embodiment, the guide pin hole (33) may have a first length (L1) in the direction of movement of the guide pin (36) on the assembly device side. This configuration will be described in detail later along with the length of the guide pin (36) on the assembly device side.

[0148] At this time, in the present embodiment, the guide pin hole (33) may include a first section (33a) and a second section (33b). The first section (33a) may be one section connected to the opening of the guide pin hole (33), and the second section (33b) may be another section connected to the opening of the guide pin hole (33) via the first section (33a).

[0149] At this time, in the present embodiment, the first section (33a) and the second section (33b) may have different diameters. As illustrated, the diameter of the first section (33a) may be smaller than the diameter of the second section (33b). Hereinafter, the diameter of the first section (33a) is referred to as the first diameter (D1). This configuration will be described in detail later along with the diameter of the guide pin (36) on the assembly device side.

[0150] In this embodiment, the assembly device-side guide pin (36) can be movably coupled to the guide pin hole (33) in the longitudinal direction. In other words, the assembly device-side guide pin (36) can be configured to slide along the guide pin hole (33).

[0151] Meanwhile, in the present embodiment, the length of the guide pin (36) on the assembly device side may have a second length (L2). At this time, the second length (L2) may be shorter than or equal to the first length (L1). Accordingly, the guide pin (36) on the assembly device side can fully enter the guide pin hole (33), and the coupling between the guide pin (36) on the assembly device side and the circuit board (5) can be released.

[0152] At this time, the fact that the guide pin (36) on the assembly device side is completely inserted into the guide pin hole (33) does not mean that the end of the guide pin (36) on the assembly device side is inserted into the guide pin hole (33), but may mean that the end of the guide pin (36) on the assembly device side is inserted to the extent that it comes out of the joining hole (9) of the circuit board (5).

[0153] In this way, when the negative pressure of the suction part (24) is released while the bond between the assembly device-side guide pin (36) and the circuit board (5) is released, the circuit board (5) can be detached (or separated) from the rotating frame (20) and placed on the upper surface (2a) of the semi-assembly (2). Accordingly, the semi-assembly (2) and the circuit board (5) can be assembled to each other.

[0154] Meanwhile, in the present embodiment, the guide pin (36) on the assembly device side may include a first portion (36a) and a second portion (36b) that extend in the longitudinal direction and are connected to each other. The first portion (36a) may be a portion that is positioned penetrating the first section (33a) of the guide pin hole (33), and the second portion (36b) may be a portion that is positioned in the second section (33b) of the guide pin hole (33).

[0155] At this time, in the present embodiment, the second portion (36b) may have a second diameter (D2). And, the second diameter (D2) may be larger than the first diameter (D1) of the first section (33a) described above. This may be to prevent the guide pin (36) on the assembly device side from falling out of the guide pin hole (33). This is because the second portion (36a) is caught on the inner wall of the guide pin hole (33) and cannot escape into the first section (33a).

[0156] Referring to FIG. 11, in the present embodiment, the rotating frame (20) may include an elastic member (34). The elastic member (34) may be a member for elastically supporting the guide pin (36) on the assembly device side. As an example, the elastic member (34) may be formed of a spring, but is not limited thereto.

[0157] In this embodiment, in a normal state where no external force is applied, the end of the guide pin (36) on the assembly device side can be positioned to protrude upward from the pin support surface (31) due to the elastic restoring force of the elastic member (34).

[0158] At this time, the fact that the end of the guide pin (36) on the assembly device side protrudes above the pin support surface (31) may mean that the end of the guide pin (36) on the assembly device side protrudes sufficiently to fit into the joining hole (9) of the circuit board (5) placed on the board support surface (23).

[0159] Meanwhile, when an external force is applied to the guide pin (36) on the assembly device side, the elastic member (34) is deformed, so that the guide pin (36) on the assembly device side can enter the guide pin hole (33). Accordingly, the guide pin (36) on the assembly device side comes out of the joining hole (9), so that the joining between them can be released.

[0160] Meanwhile, referring to FIGS. 3 and 4, in the present embodiment, the pin support portion (30) and the assembly device-side guide pin (36) are configured in multiple numbers and can be spaced apart along the extension direction (Y-axis direction) of the substrate support portion (22). At this time, the number of the pin support portion (30) and the assembly device-side guide pin (36) can correspond to the number of coupling holes of the circuit board.

[0161] By this operation, the relative position between the circuit board (5) and the subassembly (2) can be guided. Hereinafter, the above operation will be specifically described using different drawings.

[0162] Referring to FIGS. 1, 2, 11 and 12, when the rotation frame (20) is rotated toward the semi-assembly (2) while the assembly device (1) is fixed to the semi-assembly (2), the substrate support surface (23) and the pin support surface (31) can gradually come closer to each other while facing the upper surface (2a) of the semi-assembly (2).

[0163] Referring to FIGS. 12 and 13, when the substrate support (22) and the semi-assembly (2) are brought closer by a predetermined distance, the end of the assembly device-side guide pin (36) and the end of the semi-assembly-side guide pin (3) can be brought into contact with each other.

[0164] And, as the rotating frame (20) rotates further, when the semi-assembly side guide pin (3) presses the assembly device side guide pin (36), the elastic member (34) is deformed and the assembly device side guide pin (36) can enter the guide pin hole (33).

[0165] Accordingly, the end of the assembly device-side guide pin (36) comes out of the joining hole (9) of the circuit board (5), and the joining of the assembly device-side guide pin (36) and the circuit board (5) can be released.

[0166] In response, the semi-assembly side guide pin (3) provided in the semi-assembly (2) can be fitted into the joining hole (9) of the circuit board (5) instead of the assembly device side guide pin (36). As a result, the circuit board (5) can be joined to the upper surface (2a) of the semi-assembly (2).

[0167] And, when the negative pressure is released from the suction part (24), the extension part (6) of the circuit board (5) can be detached from the board support surface (23). As a result, the circuit board (5) can be separated from the rotation frame (20) and coupled to the upper surface (2a) of the sub-assembly (2). Thereafter, the rotation frame (20) can be rotated in the opposite direction to be separated from the sub-assembly (2) and the circuit board (5).

[0168] If the guide pins (3, 36) do not meet each other, it can be determined that the relative positions of the assembly device (1) and the sub-assembly (2) are not properly fixed. In this case, the relative positions of the assembly device (1) and the sub-assembly (2) need to be readjusted. Through the operation of the guide pin (36) on the assembly device side, the relative positions between the circuit board (5) and the sub-assembly (2) can be guided.

[0169] Although the present invention has been described above with reference to limited embodiments and drawings, the present invention is not limited thereto, and various embodiments are possible within the scope equivalent to the technical idea of ​​the present invention and the patent claims to be described below by a person having ordinary skill in the art to which the present invention pertains.

[0170] [Explanation of symbols]

[0171] 1: Battery module assembly device

[0172] 2: Semi-assembly

[0173] 5: Circuit board

[0174] 10: Fixed frame

[0175] 12: Bass section

[0176] 13: Assembly device side joint

[0177] 14: Fixed part

[0178] 15: Lever section

[0179] 16: Fixed frame side rotation joint

[0180] 18: The phage department

[0181] 20: Rotating frame

[0182] 22: Substrate support

[0183] 24: Adsorption part

[0184] 26: Rotating frame side rotating joint

[0185] 28: Sub-support

[0186] 30: Pin support

[0187] 34: Elastic member

[0188] 36: Guide pin

Claims

1. A battery module assembly device for assembling a circuit board into a battery module semi-assembly. A fixed frame that can be fixed to one side of the above semi-assembly; and A battery module assembly device comprising a rotating frame rotatably coupled to the fixed frame and capable of moving a circuit board placed on one side onto an outer surface of the semi-assembly.

2. In paragraph 1, The above rotating frame, A battery module assembly device comprising a substrate support member extending in any one direction so that the circuit board can be placed thereon.

3. In paragraph 2, A battery module assembly device, wherein the substrate support member is provided with a suction member for suctioning the circuit board.

4. In paragraph 3, A battery module assembly device, wherein the above adsorption parts are provided in multiple units and spaced apart from each other along the extension direction of the substrate support part.

5. In paragraph 2, The above rotating frame, A battery module assembly device comprising a sub-support member extending from the substrate support member.

6. In paragraph 5, A battery module assembly device, wherein the above sub-supports are provided in pairs and are respectively provided at opposite ends of the substrate support in the extension direction.

7. In paragraph 2, The above rotating frame, A pin support provided on the extension side of the substrate support; and A battery module assembly device further comprising an assembly device-side guide pin that protrudes outside the pin support portion and can be fitted into a joining hole formed in the circuit board.

8. In paragraph 7, A battery module assembly device, wherein the assembly device side guide pins are provided in multiple numbers and spaced apart along the extension direction of the substrate support portion.

9. In paragraph 7, A battery module assembly device, wherein the guide pin on the assembly device side is connected to the pin support member so as to be movable in the longitudinal direction.

10. In paragraph 9, A battery module assembly device, wherein the pin support member is provided with an elastic member for elastically supporting the guide pin on the assembly device side.

11. In clause 10, A battery module assembly device, wherein the pin support member is connected to a side of the substrate support member.

12. In paragraph 11, The above substrate support member is provided with a substrate support surface on which a portion of the circuit board can be placed in contact, The above pin support member is provided with a pin support surface from which the end of the guide pin on the assembly device side protrudes, A battery module assembly device, wherein the pin support surface and the substrate support surface have different heights in the movement direction of the guide pin on the assembly device side.

13. In paragraph 9, In the above pin support portion, a guide pin hole is formed into which the guide pin on the assembly device side is inserted, A battery module assembly device, wherein the guide pin on the assembly device side has a shorter length than the guide pin hole.

14. In paragraph 13, A battery module assembly device, wherein the guide pin on the assembly device side has at least a portion having a diameter larger than a section of the guide pin hole so as to prevent it from falling off from the pin support member.

15. In paragraph 13, A battery module assembly device, wherein the above guide pin is configured to be pressed by a part of the semi-assembly as the rotating frame rotates and enter the inside of the guide pin hole.

16. In paragraph 1, The above fixed frame, A base portion extending in one direction so as to be arranged parallel to the side of the above semi-assembly; and A battery module assembly device, comprising a fixing member provided on each of both sides of the base portion in the extension direction and capable of being fixed to a corner portion of the semi-assembly.

17. In paragraph 16, The above rotating frame, A battery module assembly device configured to rotate around an axis that is parallel or parallel to the extension direction of the base portion.

18. In paragraph 16, A battery module assembly device, wherein the above fixing member has a clamp shape capable of holding or placing a corner portion of the semi-assembled body.

19. In paragraph 16, The above base portion has a flat shape that can be arranged parallel to the side of the semi-assembly, A battery module assembly device, wherein an assembly device-side joining portion capable of being combined with a portion of the semi-assembly body in a shape-fitting manner is provided on one surface of the base portion.

20. In paragraph 19, A battery module assembly device, wherein the above assembly device side connecting parts are provided in multiple pieces and spaced apart in the extension direction of the base part.

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