Method for drilling circuit board back holes, and scanning method for circuit board through-hole vias

Abstract

The present invention is conceived in view of the fact that in the prior art, openings of through-hole vias of a circuit board are scanned one by one, resulting in the scanning process taking a considerable amount of time. Therefore, the present invention provides a method for drilling circuit board back holes. The method comprises: providing a drilling platform, which comprises a drilling tool and an image capture module, wherein the drilling tool is electrically connected to the image capture module; and the image capture module scanning a plurality of scanning areas of the upper surface of a circuit board in multiple instances, so as to obtain a plurality of target images, wherein each scanning area contains at least one through-hole via where a back hole is to be drilled, and not all of the plurality of scanning areas contain only one through-hole via where a back hole is to be drilled. In this way, the positions of openings of all the through-hole vias in the circuit board can be obtained in a relatively short working time. The present invention further provides a scanning method for circuit board through-hole vias.

Description

Circuit board back hole drilling method and circuit board through hole scanning method Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and more particularly to a circuit board back hole drilling method and a circuit board through hole scanning method that divides a circuit board into multiple scanning areas for scanning to calculate the drilling coordinates of each back hole. Background Art

[0002] Circuit boards are used to electrically connect electronic components or devices and transmit electronic signals between them. Conventional circuit boards consist of multiple layers of overlapping circuits. In addition to circuitry formed on the surface, each layer also forms its own circuit. Therefore, the circuit board is equipped with multiple through-holes connecting the various circuit layers. The through-hole walls are coated with metal, creating electrical connections between the various circuit layers.

[0003] For certain circuit layers where no electrical connection structure is intended to be formed, a back hole is usually formed on one side of the through hole so as to remove the metal plating on the wall of the through hole.

[0004] As described in Chinese utility model patent CN220191115U, due to the small diameter and high speed of the drill bit used to drill through holes in circuit boards, the drill bit is prone to bending during the drilling process for thick multilayer boards, causing the axis of the through hole to tilt relative to the circuit board surface. This can cause the through hole openings on both sides of the circuit board to become misaligned and offset. In this case, when the drill is used to drill the back hole from the center of the upper opening, the drill bit is biased toward one side of the through hole, resulting in different amounts of metal plating removed from the through hole wall. This leaves different lengths of metal plating along the through hole axis, which results in different impedances on both sides of the through hole, causing signal transmission distortion or attenuation. To address this issue, it is necessary to calculate the deviation of the through hole openings on both surfaces of the circuit board from the known set coordinates. This is used to determine the through hole slope. The deviation of the back hole center is then calculated by combining the predetermined depth of the back hole with the through hole slope to determine the actual drilled coordinates of the back hole.

[0005] However, to determine the deviation between the through-hole openings on the circuit board surface and the known set coordinates, the existing technology involves scanning each through-hole opening on the surface and then using image recognition technology to determine the opening positions. However, this method is quite time-consuming, especially when there are hundreds of through-holes, as the scanning process can take a considerable amount of time.

[0006] Summary of the Invention

[0007] The technical problem to be solved by the present invention is to provide a circuit board back hole drilling method and a circuit board through hole scanning method, which solves the problem of the prior art that the openings of the through holes must be scanned one by one, which is time-consuming.

[0008] According to the technical solution of the present invention, a circuit board through-hole scanning method is provided for scanning a circuit board having multiple through-holes, the circuit board having a lower surface and an upper surface, each of the through-holes having a lower opening on the lower surface and an upper opening on the upper surface. The circuit board through-hole scanning method includes: providing an image capture module, the image capture module is divided into multiple scanning areas of the upper surface of the circuit board to scan multiple target images, wherein the scanning area includes at least one through-hole, and not all of the scanning areas include only one through-hole.

[0009] According to another technical solution of the present invention, a circuit board back hole drilling method is provided, which is used for drilling back holes in a circuit board having multiple through holes, the circuit board having a lower surface and an upper surface, each of the through holes having a lower opening on the lower surface and an upper opening on the upper surface. The circuit board back hole drilling method includes: providing a drilling machine, which includes a drilling tool and an image capture module, the drilling tool is electrically connected to the image capture module; wherein the image capture module is divided into multiple scanning areas of the upper surface of the circuit board to obtain multiple target images, wherein the scanning area includes at least one through hole to be drilled for the back hole, and the scanning areas do not all include only one through hole to be drilled for the back hole.

[0010] According to the above technical features, each of the scanning areas includes a plurality of the through holes and / or a plurality of the through holes for drilling the back holes.

[0011] According to the above technical features, the circuit board back hole drilling method further includes: the drilling machine further includes an image recognition module and a computing control module, the drill tool and the image capture module are electrically connected to the computing control module, and the image recognition module is electrically connected or signal-connected to the computing control module; and the target images are transmitted to the computing control module, and the computing control module executes the image recognition module to identify the positions of the upper openings of the through holes to be drilled for the back holes.

[0012] According to the above technical features, the circuit board back hole drilling method further includes: the calculation control module obtains the maximum limit value and the minimum limit value of the first axis, and the other maximum limit value and the other minimum limit value of the second axis from the multiple upper opening setting coordinate values ​​of all the through holes to be drilled for back holes, and the upper opening setting coordinate value is the coordinate value of the center of the upper opening that is known and / or set; the calculation control module obtains a scanning range based on the maximum limit value and the minimum limit value of the first axis, and the other maximum limit value and the other minimum limit value of the second axis; and the calculation control module divides the scanning range into the scanning areas according to the image range that the image capture module can capture each time.

[0013] According to the above technical features, the circuit board back hole drilling method further includes: the calculation control module excludes the scanning area where no back hole needs to be drilled in the scanning areas.

[0014] According to the above technical features, the scanning areas are arranged in an array.

[0015] According to the above technical features, the circuit board back hole drilling method further includes: the calculation control module obtains the area with the largest number of the through holes to be drilled as the first scanning area from the multiple upper opening setting coordinate values ​​of the through holes to be drilled according to the image range that the image capture module can capture each time, and the upper opening setting coordinate value is the coordinate value of the center of the upper opening that has been set; the calculation control module excludes the upper opening setting coordinate values ​​in the first scanning area of ​​the previous scan, and checks whether there are still the through holes to be drilled that have not been assigned to the scanning area to which they belong; if there are still through holes to be drilled that have not been assigned to the scanning area to which they belong, then the area with the largest number of the through holes to be drilled is obtained as the second scanning area from the upper opening setting coordinate values ​​of all other through holes to be drilled according to the image range that the image capture module can capture each time.

[0016] According to the above technical features, the circuit board back hole drilling method further includes: the calculation control module sorts the through holes from multiple upper opening setting coordinate values ​​of all the through holes to be drilled, and the upper opening setting coordinate value is the coordinate value of the center of the upper opening that has been set; and the calculation control module uses the upper opening setting coordinate value of the through hole to be drilled as the center of the scanning area.

[0017] According to the above technical features, the circuit board back hole drilling method further includes: if the set coordinate value of the upper opening of a through hole is located within the previous scanning area, then excluding the scanning area centered on the through hole.

[0018] According to the above technical features, the image capture module includes a plurality of image capture elements, which are arranged into a one-dimensional array along a configuration direction, and the image capture module moves along a scanning direction to complete the scanning of the scanning area; or, the image capture elements are arranged into a two-dimensional array, and the image capture module aligns with each of the scanning areas to complete the scanning of the scanning area; and the target images are connected to obtain the image of the upper surface of the circuit board.

[0019] The present invention has the following beneficial effects:

[0020] The circuit board back hole drilling method and circuit board through hole scanning method of the present invention divide the upper surface of the circuit board into multiple scanning areas in different ways. The image capture module scans the multiple scanning areas respectively to capture the image of each scanning area. Each scanning area includes at least one through hole to be drilled for back hole drilling. Moreover, the scanning areas do not all include only one through hole to be drilled for back hole drilling. In fact, each scanning area may include multiple through holes and / or multiple through holes to be drilled for back hole drilling. In this way, the opening positions of all through holes on the circuit board can be obtained in a shorter working time, so as to quickly complete the back hole drilling. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] FIG1 is a front view of a drilling machine used in the circuit board back hole drilling method of the present invention.

[0022] FIG. 2 is a schematic diagram of the drilling machine shown in FIG. 1 drilling back holes on the upper surface of a circuit board.

[0023] FIG. 3 is a schematic diagram showing the distribution of upper openings of through holes on the upper surface of a circuit board and marking through holes where back vias are to be drilled.

[0024] FIG4 is a flow chart of a first embodiment of a circuit board back hole drilling method according to the present invention.

[0025] FIG. 5 is a flow chart of a second embodiment of a circuit board back hole drilling method according to the present invention.

[0026] 6 and 7 are schematic diagrams showing a circuit board divided into multiple scanning areas according to the first and second embodiments of the circuit board back hole drilling method of the present invention.

[0027] 8A and 8B are flow charts of a third embodiment of a circuit board back hole drilling method according to the present invention.

[0028] FIG9 is a schematic diagram showing a circuit board divided into multiple scanning areas according to a third embodiment of the circuit board back hole drilling method of the present invention.

[0029] 10A and 10B are flow charts of a fourth embodiment of a circuit board back hole drilling method according to the present invention.

[0030] FIG. 11 is a schematic diagram showing a circuit board divided into multiple scanning areas according to a fourth embodiment of the circuit board back hole drilling method of the present invention.

[0031] Explanation of the drawing numbers: A: Spindle AR11~AR44: Scanning areas AR1', AR2', AR3': Scanning areas AR1", AR3", AR4": Scanning area B: Bracket C: Image capture module D: Workbench E: Drilling tool F: Image recognition module G: Computing control module H, H1, H2, H3, H4: Through hole M: ​​Metal plating P: Circuit board 01: Lower opening 02: Upper opening P1, P2: Carrier board SD: Lower surface SU: Upper surface S1~S10: Step S41: Step S2', S3', S31', S32', S33', S34': Step. DETAILED DESCRIPTION

[0032] Please refer to Figures 1, 2, and 3, which respectively illustrate a side view of the drilling machine of the present invention, a schematic diagram of back-hole drilling, and a schematic diagram showing the locations of multiple through-holes on a circuit board indicating the locations of the back-holes to be drilled. As shown in Figure 1, the drilling machine of this embodiment includes a spindle A on which a drilling tool E is mounted, a bracket B capable of vertical movement in the Z-axis, an image capture module C mounted on bracket B, and a worktable D supporting a circuit board P. Spindle A and image capture module C are both mounted on bracket B. By allowing bracket B to move up and down in the Z-axis, the drilling tool E can drill a hole of a predetermined depth in the circuit board P, and the field of view of the image captured by the image capture module C can be changed. The worktable D is movable in the X and Y directions, allowing the circuit board P to be moved relative to the drilling tool E to the desired location for drilling.

[0033] As shown in FIG. 2 , a circuit board P comprises multiple layers of substrates P1 and P2. Each layer of substrates P1 and P2 is provided with circuitry. Therefore, the circuitry between the two substrates P1 and P2 relies on through-holes H to form an electrical connection. Through-holes H are drilled at predetermined locations on the circuit board P. Through-holes H penetrate the lower surface SD and the upper surface SU of the circuit board P, forming a lower opening O1 on the lower surface SD and an upper opening O2 on the upper surface SU. A metal coating M is then formed on the walls of the through-holes H during an electroplating process. The metal coating M then forms an electrical connection between the substrates P1 and P2. However, since the electroplating process will uniformly form a metal coating on all through holes H, for certain locations that are not conductive according to the circuit design, a back hole drilling process must be performed. The drill tool E is used to drill the through hole H at this location from the upper opening 02 of the upper surface SU to form a back hole. The aperture of the back hole is slightly larger than the original through hole H, but the depth can be smaller than the original through hole H. Therefore, part of the metal coating M can be removed to meet the needs of the part that is not desired to be conductive in the circuit design.

[0034] As shown in Figure 3, backholes are required at certain locations within all of the through-holes H. These locations are indicated by crosses in Figure 3. As previously described, due to drilling errors in the drill tool E, the upper opening O2 of the through-hole H on the upper surface SU may deviate from its originally set position. This deviation, or "deviation," occurs from the known coordinates of the originally set position. In other words, the through-hole H will tilt relative to the circuit board P. If the backhole is drilled directly according to the originally set position of the upper opening O2, different amounts of metal plating will be removed on either side of the backhole, resulting in different impedance values ​​on either side of the through-hole. As previously mentioned, to address this issue, the through-hole slope must be calculated based on the deviation of the upper opening O2 (also known as the upper opening coordinate deviation). Then, a correction for the backhole center position is calculated using the planned drilling depth and slope. This allows the drilled backhole to achieve similar impedance values ​​on both sides of the through-hole. For a detailed description, please refer to Chinese Utility Model Patent CN220191115U.

[0035] The deviation of the upper opening O2 is determined using image capture and recognition technology. As shown in Figure 1 , the drilling machine of the present invention is equipped with an image capture module C, which is electrically connected to a calculation and control module G and an image recognition module F. The image capture module C captures an image of the upper surface SU of the circuit board P, and the image recognition module F identifies the actual position of the upper opening O2 of the through hole H formed on the circuit board P. The calculation and control module G then calculates the deviation of the upper opening O2, thereby calculating the correction amount for the back hole drilling position.

[0036] The image capture module C includes multiple image capture elements, such as charge-coupled devices (CCDs). In one embodiment, the image capture elements are arranged in a one-dimensional array along a configuration direction. When scanning a scanning area, the image capture module C must move along the scanning direction to complete a two-dimensional scan of the scanning area.

[0037] The image capture module C includes a plurality of image capture elements, such as a charge coupled device (CCD). In another embodiment, the image capture elements are arranged in a two-dimensional array. The image capture module C can complete a two-dimensional scan of the scan area by aligning it with each scan area.

[0038] Please refer to Figure 4, which illustrates a first embodiment of the circuit board backhole via drilling method of the present invention. In step S1, a drilling machine is provided, comprising a drill, an image capture module, an image recognition module, and a computing control module. The drill and image capture module are electrically connected to the computing control module, and the image recognition module is electrically or signal-connected to the computing control module. The signal connection may be via wired or wireless transmission. The process then proceeds to step S2.

[0039] In step S2, the calculation control module obtains the maximum and minimum limits of the first axis and the maximum and minimum limits of the second axis from the upper opening setting coordinate values ​​of the upper openings of all through holes to be drilled as back holes. The upper opening setting coordinate value is the coordinate value of the center of the upper opening that is known and / or set. Each through hole to be drilled as a back hole has its corresponding upper opening setting coordinate value. As shown in Figure 6, the first axis is the X direction. The upper opening setting coordinate value of the through hole H1 to be drilled as a back hole on the left is the minimum limit of the first axis, and the upper opening setting coordinate value of the through hole H2 to be drilled as a back hole on the right is the maximum limit of the first axis. The second axis is the Y direction, which is perpendicular to the first axis. The upper opening setting coordinate value of the through hole H3 to be drilled as a back hole at the top is the maximum limit of the second axis, and the upper opening setting coordinate value of the through hole H4 to be drilled as a back hole at the bottom is the minimum limit of the second axis. Then, step S3 is entered.

[0040] In step S3, the calculation control module obtains the scanning range AR (see FIG6 ) based on the maximum limit value and the minimum limit value of the first axis and the maximum limit value and the minimum limit value of the second axis.

[0041] In step S4, as shown in Figure 7, the computing control module divides the scanning range into multiple scanning areas AR11 to AR44 based on the image range that the image capture module can capture at a time. In this embodiment, the multiple scanning areas are arranged into an array. The process then proceeds to step S5. Preferably, each scanning area includes at least one through-hole to be drilled for a back-via; more preferably, not all of the multiple scanning areas include only one through-hole to be drilled for a back-via. Of course, each scanning area may also include multiple through-holes and / or multiple through-holes to be drilled for a back-via.

[0042] In step S5, the image capture module scans multiple scanning areas on the upper surface of the circuit board multiple times to obtain multiple target images, and the multiple target images are connected to obtain an image of the upper surface of the circuit board. Then, step S6 is entered.

[0043] In step S6, the target image is transmitted to the computing control module, which executes the image recognition module to identify the position of the upper opening of the through hole to be drilled. Then, the process proceeds to step S7.

[0044] In step S7, the calculation control module compares the position of the upper opening with the upper opening set coordinate value, and then enters step S8.

[0045] In step S8, the calculation control module calculates a plurality of upper opening coordinate deviation values ​​of each upper opening of each back hole to be drilled, and then proceeds to step S9.

[0046] In step S9, the calculation control module calculates the coordinates of the back hole center position of each through hole to be drilled based on the upper opening coordinate deviation value and the predetermined depth value of the back hole. Then, the process proceeds to step S10.

[0047] In step S10, according to the upper opening coordinate deviation value, the calculation control module controls the circuit board to move the drill tool to align with the back hole center position coordinate to drill the back hole.

[0048] Please refer to FIG5 , which shows a second embodiment of the circuit board back hole drilling method of the present invention. The steps of this embodiment are partially the same as those of the first embodiment, so the same steps are represented by the same symbols and their descriptions are omitted. The difference between this embodiment and the first embodiment is that after step S4, step S41 is entered. In step S41, the calculation control module excludes areas in the scanning area that do not require back hole drilling. That is, if there are no through holes in the area where back holes are scheduled to be drilled, the calculation control module will first list the area as an area not to be scanned, such as the scanning area AR11 shown in FIG7 , in which no through holes require back hole drilling. When scanning multiple scanning areas in step S5, this scanning area AR11 will be skipped.

[0049] Please refer to Figures 8A and 8B , which illustrate a third embodiment of the circuit board backhole via drilling method of the present invention. The steps of this embodiment are partially identical to those of the first embodiment, so identical steps are denoted by the same reference numerals and their descriptions are omitted. The difference between this embodiment and the first embodiment lies in step S2' of this embodiment. The calculation control module, based on the image range that the image capture module can capture at a time, determines the area with the largest number of backhole vias to be drilled from the coordinates of all the upper openings of the backhole vias to be drilled, as the first scanning area, such as scanning area AR1' in Figure 9 . The process then proceeds to step S3'.

[0050] In step S3', after excluding the through-holes in the scanning area of ​​the previous scan, a check is performed to determine whether any through-holes to be drilled as back vias are still within an unassigned scanning area. If any through-holes to be drilled as back vias are still within an unassigned scanning area, step S2' is repeated, and the control module calculates the upper opening coordinate values ​​for the first scanning area, excluding the previous scan. Furthermore, the area with the largest number of through-holes to be drilled as the second scanning area is determined based on the image range that the image capture module can capture each time, such as scanning areas AR2', AR3', etc. in FIG9 . If all through-holes to be drilled as back vias have been assigned to the scanning area, the process proceeds to step S4.

[0051] In this embodiment, the algorithm for determining the region with the largest number of through-holes to be drilled as back vias may be, for example, to calculate the X-coordinate interval with the smallest 30% interval of the X-coordinate values ​​of the upper opening set coordinate values ​​of all the through-holes to be drilled as back vias, and then to calculate the Y-coordinate interval with the smallest 30% interval of the Y-coordinate values ​​of the upper opening set coordinate values ​​of all the through-holes to be drilled as back vias. The calculated X-coordinate interval and Y-coordinate interval are used to determine the region with the largest number of through-holes to be drilled as back vias.

[0052] Please refer to Figures 10A and 10B , which illustrate a fourth embodiment of the circuit board backhole via drilling method of the present invention. The steps of this embodiment are partially identical to those of the first embodiment, so identical steps are denoted by the same reference numerals and their descriptions are omitted. The difference between this embodiment and the first embodiment lies in step S2', in which the calculation control module sorts all through holes to be drilled backhole vias based on their upper opening coordinates. The process then proceeds to step S3'.

[0053] In step S3', the calculation control module selects the upper opening setting coordinate value of each through hole to be drilled, and then enters step S31'.

[0054] In step S31', it is checked whether the set coordinate value of the upper opening of the through hole is located within the previous scanning area. If the set coordinate value of the upper opening of the through hole is located within the previous scanning area, the process proceeds to step S32'. If the set coordinate value of the upper opening of the through hole is not located within the previous scanning area, the process proceeds to step S33'.

[0055] In step S32', a scanning area is formed with the upper opening coordinate value of the through hole as the center, for example, the scanning area AR1'' centered on the through hole H1, the scanning area AR3'' centered on the through hole H3, and the scanning area AR4'' centered on the through hole H4 in FIG. 11 . Then, step S34' is entered.

[0056] In step S33', the coordinate value of the upper opening of the through hole is not set as the center to form the scanning area. Then enter step S34'

[0057] In step S34', it is determined whether the upper opening coordinates of all through holes to be drilled as back holes have been selected. If all have been selected, the process proceeds to step S4. If there are still through holes to be drilled as back holes that have not been selected, the process returns to step S3'.

[0058] The circuit board back hole drilling method of the present invention divides the upper surface of the circuit board into multiple scanning areas in different ways. The image capture module scans the multiple scanning areas separately to capture an image of each scanning area. Preferably, each scanning area includes multiple through holes. In this way, the opening positions of all through holes on the circuit board can be obtained in a shorter working time, so that the back hole drilling can be completed quickly.

Claims

1. A method for drilling back holes of a circuit board, characterized in that, For drilling back holes in a circuit board having a plurality of through holes, the circuit board having a lower surface and an upper surface, each of the through holes having a lower opening on the lower surface and an upper opening on the upper surface, the method for drilling back holes in the circuit board comprising: Providing a drilling machine platform, which includes a drilling tool and an image capturing module, the drilling tool being electrically connected to the image capturing module; wherein, The image capturing module scans a plurality of scanning areas on the upper surface of the circuit board in multiple times to obtain a plurality of target images, wherein the scanning areas at least include one through hole for which a back hole is to be drilled, and not all of the scanning areas only include one through hole for which the back hole is to be drilled.

2. The method for drilling back holes of a circuit board according to claim 1, characterized in that, Wherein, Each of the scanning areas includes a plurality of the through holes and / or a plurality of the through holes for which the back hole is to be drilled.

3. The method for drilling back holes of a circuit board according to claim 2, wherein, It further includes: The drilling machine platform further includes an image recognition module and a calculation and control module, the drilling tool and the image capturing module being electrically connected to the calculation and control module, the image recognition module being electrically connected or signal-connected to the calculation and control module; and The target images are transmitted to the calculation and control module, and the calculation and control module executes the image recognition module to identify the positions of the upper openings of the through holes for which the back holes are to be drilled.

4. The method for drilling back holes of a circuit board according to claim 3, wherein It further includes: The calculation and control module obtains a maximum limit value and a minimum limit value in a first axis direction, and another maximum limit value and another minimum limit value in a second axis direction from the set coordinate values of the centers of the upper openings of the through holes for which the back holes are to be drilled, the set coordinate values of the upper openings being the coordinate values of the centers of the set upper openings; The calculation and control module obtains a scanning range according to the maximum limit value and the minimum limit value in the first axis direction, and the another maximum limit value and the another minimum limit value in the second axis direction; and The calculation and control module divides the scanning range into the scanning areas according to the image range that the image capturing module can capture each time.

5. The method for drilling back holes of a circuit board according to claim 4, wherein, It further includes: The calculation and control module excludes the scanning areas that do not need to be drilled with back holes from the scanning areas.

6. The method for drilling back holes of a circuit board according to claim 4, wherein Wherein the scanning areas are arranged in an array.

7. The method for drilling back holes of a circuit board according to claim 3, wherein It further includes: The calculation and control module obtains, according to the image range that the image capturing module can capture each time, the area with the largest number of through holes for which the back holes are to be drilled from the set coordinate values of the centers of the upper openings of the through holes for which the back holes are to be drilled as the first scanning area, the set coordinate values of the upper openings being the coordinate values of the centers of the set upper openings; The calculation and control module excludes the set coordinate values of the upper openings in the first scanning area scanned last time, and checks whether there are still through holes for which the back holes are to be drilled and for which the scanning areas have not been designated; If there are still through holes for which the back holes are to be drilled and for which the scanning areas have not been designated, then the area with the largest number of through holes for which the back holes are to be drilled is obtained from the set coordinate values of the centers of the upper openings of the remaining through holes for which the back holes are to be drilled according to the image range that the image capturing module can capture each time as the second scanning area.

8. The method for drilling back holes of a circuit board according to claim 3, wherein, It further includes: The calculation and control module sets and sorts the through holes according to the set coordinate values of the centers of the upper openings of the through holes for which the back holes are to be drilled, the set coordinate values of the upper openings being the coordinate values of the centers of the set upper openings; and The calculation control module uses the coordinate value set at the upper opening of the through hole for which the back hole is to be drilled as the center of the scanning area.

9. The method for drilling back holes of a circuit board according to claim 8, wherein, It further includes: If the coordinate value set at the upper opening of a through hole is located within the previous scanning area, the scanning area centered on the through hole is excluded.

10. The method for drilling back holes of a circuit board according to claim 3, characterized in that The image capturing module includes a plurality of image capturing elements, and these image capturing elements are arranged in a one-dimensional array along a configuration direction. The image capturing module moves along a scanning direction to complete the scanning of the scanning area; alternatively, these image capturing elements are arranged in a two-dimensional array, and the image capturing module aligns with each scanning area to complete the scanning of the scanning area; and these target images are connected to obtain the image of the upper surface of the circuit board.

11. A method for scanning through-holes of a circuit board, characterized in that, For scanning a circuit board having a plurality of through holes, the circuit board has a lower surface and an upper surface, each through hole has a lower opening on the lower surface and an upper opening on the upper surface. The circuit board through hole scanning method includes: providing an image capturing module, and the image capturing module scans multiple scanning areas on the upper surface of the circuit board in multiple times to obtain multiple target images, where the scanning area includes at least one through hole, and not all of these scanning areas only include one through hole.

Images