Substrate holder and plating device

Abstract

Provided is a substrate holder that can handle various types of substrates that have different power supply positions.　A substrate holder 210 includes a base plate and a face plate 230 for sandwiching and holding a substrate with the base plate. The face plate 230 has a central opening 234a and a frame member 234 that surrounds the central opening 234a. The substrate holder 210 includes a contact member 240 that has: a first busbar 242 that is attached to the frame member 234 so as to be capable of moving on the frame member 234; and a power supply contact 243 that is attached to the first busbar 242.

Description

Substrate holder and plating device

[0001] The present application relates to a substrate holder and a plating apparatus.

[0002] Patent Document 1 discloses a dip-type plating apparatus as an example of an electrolytic plating apparatus. In this plating apparatus, a substrate (e.g., a semiconductor wafer) is held in a substrate holder with its surface to be plated facing sideways and immersed in a plating solution, and a voltage is applied between the substrate (cathode) and an anode to deposit a conductive film on the surface of the substrate.

[0003] The substrate holder is generally configured to sandwich and hold a substrate between a base plate and a face plate, with the surface of the substrate to be plated exposed through a central opening formed in the face plate. The substrate holder also includes contact members provided on the face plate, and is configured to supply power to the substrate by bringing the contact members into contact with the substrate.

[0004] Patent No. 6335763

[0005] The substrate holder of the plating apparatus disclosed in Patent Document 1 does not take into consideration the ability to accommodate various types of substrates with different power supply positions.

[0006] In other words, there are various types of substrates to be plated, and the specifications of the power supply position also differ depending on the substrate. In this case, it is necessary to create a dedicated substrate holder for each substrate with a different power supply position, and the increased number of substrate holders makes the plating device configuration more complex.

[0007] Therefore, one object of the present application is to realize a substrate holder that can accommodate various types of substrates with different power supply positions.

[0008] According to one embodiment, a substrate holder is disclosed that includes: a base plate; a face plate for sandwiching and holding a substrate together with the base plate, the face plate having a central opening and a frame member surrounding the central opening; and a contact member having a first bus bar attached to the frame member so as to be movable relative to the frame member, and a power supply contact attached to the first bus bar.

[0009] FIG. 1 is a cross-sectional view showing the overall configuration of a plating apparatus according to one embodiment. FIG. 2 is a schematic perspective view of a substrate holder according to one embodiment. FIG. 3 is a schematic cross-sectional view of a locking mechanism for a substrate holder according to one embodiment. FIG. 4 is a schematic perspective view of a contact member according to one embodiment. FIG. 5 is an enlarged perspective view of a contact member according to one embodiment. FIG. 6 is an enlarged perspective view of a contact member according to one embodiment. FIG. 7 is an enlarged perspective view of a contact member according to one embodiment. FIG. 8 is an enlarged perspective view of a contact member according to one embodiment. FIG. 9 is an enlarged perspective view of a contact member according to one embodiment. FIG. 10 is an enlarged perspective view of a contact member according to one embodiment. FIG. 11 is a schematic perspective view of a position adjustment mechanism according to one embodiment. FIG. 12 is a schematic perspective view of a position adjustment mechanism according to one embodiment. FIG. 13 is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment. FIG. 14 is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment. FIG. 15 is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment. FIG. 16 is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment. FIG. 17 is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment. Fig. 18 is an enlarged perspective view of a contact member and a position adjustment mechanism according to an embodiment. Fig. 19 is an enlarged perspective view of a contact member according to an embodiment. Fig. 20 is a schematic perspective view of a contact member and a position adjustment jig according to an embodiment. Fig. 21 is a schematic perspective view of a contact member and a position adjustment jig according to an embodiment. Fig. 22 is a schematic perspective view of a contact member and a position adjustment jig according to an embodiment. Fig. 23 is a schematic perspective view of a contact member and a position adjustment jig according to an embodiment. Fig. 24 is a flowchart of a board mounting method according to an embodiment.

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals, and redundant description will be omitted.

[0011] 1 is a plan view showing the overall configuration of the plating apparatus of this embodiment. The plating apparatus 1000 includes a load port 100, a transfer robot 110, a load stage 120, an unload stage 130, a loader 140, a fixing module 200, a stocker module 300, a swap module 310, a holder cleaning module 320, a pre-wet module 400, a pre-soak module 500, a pre-soak cleaning module 510, a plating module 600, a plating cleaning module 700, a blow module 710, a temporary placement module 720, a cleaning module 800, a transport device 900, and a control module 950.

[0012] The load port 100 is a module for loading substrates WF stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000, and for unloading substrates WF from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of the load ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrates WF horizontally, and is configured to transfer substrates WF between the load port 100 and the load stage 120.

[0013] The load stage 120 is a stage for transferring the substrate WF before plating processing between the transport robot 110 and the loader 140. The unload stage 130 is a stage for transferring the substrate WF after plating processing between the transport robot 110 and the loader 140. The loader 140 is a robot for transferring the substrate WF horizontally, and is configured to transfer the substrate WF between the load stage 120, the unload stage 130, the fixing module 200, and the cleaning module 800.

[0014] The fixing module 200 is a module for attaching and detaching a substrate WF to and from the substrate holder 210. The stocker module 300 is a module for vertically storing the substrate holders 210. The swap module 310 is a module for temporarily storing a substrate holder 210 that requires replacement or maintenance, and is structured to allow the substrate holder 210 to be inserted and removed. The substrate holder 210 removed from the swap module 310 is maintained within the plating apparatus 1000 or removed outside the plating apparatus 1000 for maintenance, and the maintained substrate holder 210 or a new substrate holder 210 can be inserted into the swap module 310. The holder cleaning module 320 is a module for cleaning the substrate holder 210.

[0015] The pre-wet module 400 is a module for replacing air inside a pattern formed on the substrate surface with the processing liquid by wetting the surface to be plated of the substrate WF with a processing liquid such as pure water or degassed water before plating processing. The pre-wet module 400 is configured to perform a pre-wet processing that replaces the processing liquid inside the pattern with a plating liquid during plating, thereby making it easier to supply the plating liquid inside the pattern.

[0016] The presoak module 500 is configured to perform a presoak process in which an oxide film with high electrical resistance present on the surface of a seed layer formed on the surface to be plated of the substrate WF before plating is etched away with a treatment liquid such as sulfuric acid or hydrochloric acid to clean or activate the surface of the substrate to be plated. The presoak cleaning module 510 is a module for cleaning the substrate WF that has been subjected to the presoak process.

[0017] The plating module 600 is a module for plating the substrate WF. The plating cleaning module 700 is a module for cleaning the substrate WF to remove plating solution and the like remaining on the substrate WF after plating. In this embodiment, three plating modules 600 and three plating cleaning modules 700 are arranged horizontally, but the number and arrangement of the plating modules 600 and the plating cleaning modules 700 are optional. The blow module 710 is a module for drying the substrate WF after cleaning. The temporary storage module 720 is a module for temporarily storing the substrate holder 210 to which the substrate WF is attached so that the substrate holder 210 can be transferred between multiple transport devices 900. In this embodiment, the temporary storage module 720 stores one substrate holder 210, but the number can be optional.

[0018] The cleaning module 800 is a module for performing cleaning and drying processes on the substrate WF to remove plating solution and the like remaining on the substrate WF after plating processing that has been removed from the substrate holder 210. In this embodiment, two cleaning modules 800 are arranged horizontally side by side with the load stage 120 and the unload stage 130 between them, but the number and arrangement of the cleaning modules 800 are arbitrary. The transfer device 900 is a device for vertically transferring the substrate holder 210 between multiple modules in the plating apparatus 1000. In this embodiment, three transfer devices 900 are arranged side by side, but the number and arrangement of the transfer devices 900 are arbitrary.

[0019] The control module 950 is configured to control multiple modules of the plating apparatus 1000 and may be configured, for example, as a general computer or a dedicated computer with an input / output interface to and from an operator.

[0020] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate WF stored in a cassette is carried into the load port 100. Next, the transfer robot 110 removes the substrate WF from the cassette in the load port 100 and places the substrate WF on the load stage 120. The loader 140 receives the substrate WF from the load stage 120 and transfers it to the fixing module 200.

[0021] The fixing module 200 attaches the substrate WF to the substrate holder 210. The transport device 900 transports the substrate holder 210 with the substrate WF attached to it to the prewet module 400. The prewet module 400 performs a prewet process on the substrate WF. The transport device 900 transports the substrate holder 210 with the prewet-treated substrate WF attached to it to the presoak module 500. The presoak module 500 performs a presoak process on the substrate WF. The transport device 900 transports the substrate holder 210 with the presoak-treated substrate WF attached to it to the presoak cleaning module 510. The presoak cleaning module 510 cleans the substrate WF. The transport device 900 transports the substrate holder 210 with the cleaned substrate WF attached to it to the plating module 600. The plating module 600 performs a plating process on the substrate WF.

[0022] The transport device 900 transports the substrate holder 210, to which the plated substrate WF is attached, to the plating cleaning module 700. The plating cleaning module 700 performs a cleaning process on the substrate WF and the substrate holder 210. The transport device 900 transports the substrate holder 210, to which the cleaned substrate WF is attached, to the blow module 710. The blow module 710 performs a drying process on the substrate WF. The transport device 900 transports the substrate holder 210, to which the dried substrate WF is attached, to the temporary placement module 720, and another transport device 900 transports the substrate holder 210 from the temporary placement module 720 to the fixing module 200. The fixing module 200 removes the substrate WF from the substrate holder 210.

[0023] The loader 140 transports the plated substrate WF, which has been removed from the substrate holder 210, to the cleaning module 800. The cleaning module 800 performs cleaning and drying processes on the substrate WF. The loader 140 places the substrate WF, which has been cleaned and dried, on the unload stage 130. The transport robot 110 receives the substrate WF from the unload stage 130 and transports it to a cassette on the load port 100. Finally, the cassette containing the substrate WF is unloaded from the load port 100.

[0024] The substrate holder 210 from which the substrate WF has been removed in the fixing module 200 has the next substrate WF attached thereto or is returned to the stocker module 300 by the transport device 900. The substrate holder 210 not holding the substrate WF is cleaned in the holder cleaning module 320 as necessary.

[0025] Fig. 2 is a schematic perspective view of a substrate holder according to one embodiment. As shown in Fig. 2, the substrate holder 210 includes a base plate 220 and a face plate 230 for sandwiching and holding a substrate together with the base plate 220. The face plate 230 has a central opening 234a and a frame member 234 surrounding the central opening 234a. The central opening 234a is formed in a rectangular shape. While the present embodiment illustrates an example in which the central opening 234a is formed in a rectangular shape, the shape is not limited thereto, and the central opening 234a may be, for example, circular.

[0026] In addition, in this embodiment, an example in which a central opening is also formed in the base plate 220 is shown, but this is for plating both sides of the substrate. Therefore, if plating is to be performed on only one side of the substrate, the central opening does not need to be formed in the base plate 220. Furthermore, for convenience of explanation, the following description may be given using drawings in which the face plate 230 is positioned below and the base plate 220 is positioned above, but when handling the substrate holder 210 in the fixing module 200, the base plate 220 is positioned below and the face plate 230 is positioned above.

[0027] The substrate holder 210 includes an inner seal member 250 attached to the frame member 234 so as to surround the central opening 234a, and an outer seal member 260 attached to the frame member 234 at a distance from the inner seal member 250 so as to surround the outside of the inner seal member 250. The substrate holder 210 also includes a pair of contact members 240 attached to the frame member 234 on either side of the rectangular central opening 234a. The contact members 240 are disposed between the inner seal member 250 and the outer seal member 260. This seals the contact members 240 and the edge of the substrate from the plating solution when the substrate holder 210 is immersed in the plating solution. While the present embodiment illustrates an example in which the pair of contact members 240 are attached to the frame member 234 on either side of the rectangular central opening 234a, this is not limiting. The contact members 240 may also be attached to the four sides of the frame member 234 so as to surround the rectangular central opening 234a.

[0028] 2, the substrate holder 210 has a plurality of locking mechanisms 270 for locking and unlocking the base plate 220 and the face plate 230. The plurality of locking mechanisms 270 are provided along the outer peripheries of the base plate 220 and the face plate 230.

[0029] 3 is a schematic cross-sectional view of a substrate holder locking mechanism 270 according to one embodiment. As shown in FIG. 3 , the base plate 220 has a first lock opening 220a formed outside the outer seal member 260. Meanwhile, the face plate 230 has a second lock opening 230a formed outside the outer seal member 260 at a position corresponding to the first lock opening 220a. The locking mechanism 270 includes a holder plate 222 provided in the first lock opening 220a and a holder hook 224 protruding toward the face plate 230 through the first lock opening 220a. Meanwhile, the locking mechanism 270 includes a clamper plate 236 provided in the second lock opening 230a and a clamper hook 238 protruding toward the base plate 220 through the second lock opening 230a.

[0030] The holder hook 224 is configured to be rotatable about an axis 224a. The locking mechanism 270 is configured to lock the base plate 220 and the face plate 230 by engaging the holder hook 224 with the clamper hook 238 when the holder hook 224 is in the position indicated by the solid line. On the other hand, the locking mechanism 270 is configured to release the engagement between the holder hook 224 and the clamper hook 238 and unlock the base plate 220 and the face plate 230 when the holder hook 224 rotates to the position indicated by the dashed line. Note that while FIG. 2 shows an example in which multiple locking mechanisms 270 are provided along the outer peripheries of the base plate 220 and the face plate 230, this is not limiting. Furthermore, for convenience of explanation, illustration of the locking mechanisms 270 is omitted in the description from FIG. 4 onwards.

[0031] 4 to 7 are schematic perspective views of a contact member according to one embodiment. Fig. 4 shows the entire contact member 240, while Figs. 5 to 7 show enlarged views of a portion of the contact member 240. The contact members 240 are provided in pairs on either side of the central opening 234a on the frame member 234, but since both have the same configuration, only one of them will be described.

[0032] 4 to 7 , the contact member 240 includes a first bus bar 242 that extends along the frame member 234 and is attached to the frame member 234 so as to be movable relative to the frame member 234, and a power supply contact 243 that is attached to the first bus bar 242. More specifically, the contact member 240 includes a second bus bar 244 that extends along the frame member 234 and is fixed to the frame member 234. The first bus bar 242 is attached to the second bus bar 244 in a stacked manner so as to be movable relative to the second bus bar 244.

[0033] The base end of the power feed contact 243 is fixed to the first bus bar 242, and the tip of the power feed contact 243 protrudes toward the central opening 234a. The second bus bar 244 is connected to a power source (not shown). Power is supplied from the power source to the power feed contact 243 via the second bus bar 244 and the first bus bar 242. The power feed contact 243 is configured to supply power to the board when the tip of the power feed contact 243 comes into contact with the board.

[0034] First bus bar 242 is attached to second bus bar 244 so as to be movable in a first direction toward and away from central opening 234a. Second bus bar 244 has guide members 245 arranged on both ends in the extension direction of first bus bar 242. Guide members 245 are members for restricting the movement direction of first bus bar 242 to the first direction.

[0035] 5, first bus bar 242 has gripping holes 242a formed at both ends in the extension direction of first bus bar 242. Gripping holes 242a are cutouts for gripping first bus bar 242 when moving first bus bar 242 using a position adjustment mechanism and / or a jig, which will be described later.

[0036] 6 and 7 , first bus bar 242 has elongated holes 246 that are longer in the first direction than the extension direction of first bus bar 242. A plurality of elongated holes 246 are provided along the extension direction of first bus bar 242. Meanwhile, second bus bar 244 has first restricting members 247 that are arranged at positions corresponding to elongated holes 246. First restricting members 247 are members that restrict movement of first bus bar 242 in the first direction.

[0037] Specifically, first restricting member 247 has proximal end 247a that comes into contact with the edge of elongated hole 246 when first bus bar 242 moves in a direction away from central opening 234a. Also, first restricting member 247 has distal end 247b that comes into contact with the edge of elongated hole 246 when first bus bar 242 moves in a direction toward central opening 234a. In this embodiment, first restricting member 247 is a bolt fixed to the surface of second bus bar 244 that faces first bus bar 242, and the point of the bolt shank closest to central opening 234a is proximal end 247a, and the point of the bolt shank farthest from central opening 234a is distal end 247b.

[0038] The second bus bar 244 has a compression coil spring 248 for pressing the first bus bar 242 against the second bus bar 244. The compression coil spring 248 is disposed between the first bus bar 242 and the head of a bolt that is the first restricting member 247. Since the first restricting member 247 is fixed to the second bus bar 244, the compression coil spring 248 biases the first bus bar 242 against the second bus bar 244.

[0039] As shown in FIG. 7 , the first bus bar 242 has a protrusion 242b formed on the surface facing the second bus bar 244, extending along the first direction. The first bus bar 242 is pressed against the second bus bar 244 by the compression coil spring 248, causing the protrusion 242b to come into contact with the second bus bar 244. This ensures electrical continuity between the first bus bar 242 and the second bus bar 244. Furthermore, because the first restricting member 247 and the compression coil spring 248 are conductive members, electrical continuity between the first bus bar 242 and the second bus bar 244 is ensured via the first restricting member 247 and the compression coil spring 248. Note that, because the protrusion 242b extends along the first direction, the protrusion 242b does not hinder movement of the first bus bar 242 along the first direction.

[0040] In the above description, an example has been shown in which the compression coil spring 248 is used to press the first bus bar 242 against the second bus bar 244 to ensure electrical continuity between the first bus bar 242 and the second bus bar 244, but this is not limiting. Figures 8 to 10 are enlarged perspective views of a contact member according to an embodiment.

[0041] 8 to 10 , the second bus bar 244 may include a disc spring 249 arranged between the first bus bar 242 and the second bus bar 244 in the region where the first restricting member 247 is arranged, instead of the compression coil spring 248. The disc spring 249 biases the first bus bar 242 in a direction away from the second bus bar 244. In this way, the disc spring 249 presses the first bus bar 242 against the head of the bolt, which is the first restricting member 247.

[0042] Disc spring 249 is a conductive member, and electrical continuity between first bus bar 242 and second bus bar 244 is ensured via disc spring 249. First restricting member 247 is also a conductive member, and electrical continuity between first bus bar 242 and second bus bar 244 is ensured via first restricting member 247. Note that the contact surface of disc spring 249 with first bus bar 242 extends in the first direction, and therefore disc spring 249 does not hinder movement of first bus bar 242 along the first direction.

[0043] 11 and 12 are schematic perspective views of a position adjustment mechanism according to one embodiment. The plating apparatus 1000 includes a position adjustment mechanism 290 configured to adjust the position of the first bus bar 242 relative to the face plate 230. The position adjustment mechanism 290 is disposed in the fixing module 200. The position adjustment mechanism 290 includes an arm 292 for gripping the first bus bar 242, a first drive member 298 for moving the arm 292 in a first direction, and a second drive member 296 for moving the arm 292 in a second direction (vertical direction) perpendicular to the extension direction of the first bus bar 242 and the first direction. The first drive member 298 and the second drive member 296 can be realized by known mechanisms such as a motor or a cylinder. FIG. 11 shows a state in which the arm 292 does not grip the first bus bar 242, and FIG. 12 shows a state in which the arm 292 grips the first bus bar 242.

[0044] 13 to 18 are enlarged perspective views of the contact member and the position adjustment mechanism according to an embodiment. Fig. 19 is an enlarged perspective view of the contact member according to an embodiment. As shown in Fig. 13, the second bus bar 244 has a second restricting member 241. The second restricting member 241 is a member for restricting the movement of the first bus bar 242 in the first direction.

[0045] Specifically, second restricting member 241 has proximal restricting member 241a that restricts movement of first bus bar 242 toward central opening 234a when proximal end 247a of first restricting member 247 is in contact with the edge of elongated hole 246 ( FIG. 17 ). Second restricting member 241 also has distal restricting member 241b that restricts movement of first bus bar 242 away from central opening 234a when distal end 247b of first restricting member 247 is in contact with the edge of elongated hole 246 ( FIG. 15 ).

[0046] Proximal restricting member 241a and distal restricting member 241b are formed of leaf springs. Under normal conditions when no external force is applied, proximal restricting member 241a and distal restricting member 241b are present on the movement path of first bus bar 242 in the first direction and come into contact with first bus bar 242 to restrict its movement. On the other hand, when an external force is applied and proximal restricting member 241a and distal restricting member 241b are pressed toward second bus bar 244, they are configured to move out of the movement path of first bus bar 242 in the first direction and release the restriction on the movement of first bus bar 242.

[0047] Arm 292 includes a proximal pressing member 293 for pressing proximal restricting member 241a to release the restriction on the movement of first bus bar 242. Arm 292 also includes a distal pressing member 294 for pressing distal restricting member 241b to release the restriction on the movement of first bus bar 242. Arm 292 also includes a gripping portion 295 that fits into gripping hole 242a of first bus bar 242.

[0048] 15 shows a state in which the first bus bar 242 has moved to a position closest to the central opening 234a. In this state, the edge of the elongated hole 246 of the first bus bar 242 contacts the distal end 247b of the first restricting member 247, so that movement of the first bus bar 242 in a direction toward the central opening 234a is restricted. On the other hand, in this state, no external force is applied to the distal restricting member 241b of the second restricting member 241, and the distal restricting member 241b is present on the movement path of the first bus bar 242 in the first direction, so that movement of the first bus bar 242 in a direction away from the central opening 234a is restricted. As a result, the first bus bar 242 is fixed at a position closest to the central opening 234a.

[0049] 16 shows a state in which the arm 292 grips the first bus bar 242. In this state, the distal pressing member 294 of the arm 292 presses the distal restricting member 241b, thereby releasing the restriction on movement of the first bus bar 242 in a direction away from the central opening 234a. In addition, the gripping portion 295 of the arm 292 fits into the gripping hole 242a of the first bus bar 242. This allows the first driving member 298 of the position adjustment mechanism 290 to move the first bus bar 242 in a direction away from the central opening 234a.

[0050] 17 shows a state in which the first bus bar 242 has moved to a position farthest from the central opening 234a. In this state, the edge of the elongated hole 246 of the first bus bar 242 contacts the proximal end 247a of the first restricting member 247, so that movement of the first bus bar 242 in a direction away from the central opening 234a is restricted. On the other hand, in this state, no external force is applied to the proximal restricting member 241a of the second restricting member 241, and the proximal restricting member 241a is present on the movement path of the first bus bar 242 in the first direction, so that movement of the first bus bar 242 in a direction toward the central opening 234a is restricted. As a result, the first bus bar 242 is fixed at a position farthest from the central opening 234a.

[0051] As described above, according to this embodiment, the first bus bar 242 and the power supply contact 243 can be moved relative to the second bus bar 244 (frame member 234) and fixed to multiple positions, thereby realizing a substrate holder 210 that can accommodate various types of substrates with different power supply positions.

[0052] In the above description, an example has been shown in which the first bus bar 242 is moved using the position adjustment mechanism 290, but this is not limiting. Figures 20 to 23 are schematic perspective views of a contact member and a position adjustment jig according to an embodiment.

[0053] The position adjustment jig 280 includes a jig main body 281 extending along the first bus bar 242, a jig proximal pressing member 285 provided at an end of the jig main body 281 in the extension direction, and a jig distal pressing member 284 provided at an end of the jig main body 281 in the extension direction. The jig proximal pressing member 285 has the same function as the above-described proximal pressing member 293. That is, the jig proximal pressing member 285 is a member for pressing the proximal restricting member 241a to release the restriction on the movement of the first bus bar 242. The jig distal pressing member 284 has the same function as the above-described distal pressing member 294. That is, the jig distal pressing member 284 is a member for pressing the distal restricting member 241b to release the restriction on the movement of the first bus bar 242.

[0054] 20 and 21, the position adjustment jig 280 includes a first claw member 282 arranged on the side of the jig body 281 opposite the central opening 234a. In addition, as shown in Fig. 22, the position adjustment jig 280 includes a second claw member 283 arranged on the side of the jig body 281 opposite the central opening 234a.

[0055] Fig. 20 shows a state before the first claw member 282 is fitted into the gap between the first bus bar 242 and the second bus bar 244. Fig. 21 shows a state after the first claw member 282 has been fitted into the gap between the first bus bar 242 and the second bus bar 244. Fig. 22 shows a state after the second claw member 283 has been fitted into the gap between the first bus bar 242 and the second bus bar 244.

[0056] 23 , the first claw members 282 and the second claw members 283 are configured to slightly lift the first bus bar 242 from the second bus bar 244 when fitted into the gap between the first bus bar 242 and the second bus bar 244. That is, the position adjustment jig 280 of this embodiment is designed to bias the first bus bar 242 toward the second bus bar 244 by the compression coil spring 248 described above. As shown in FIG. 23 , the first bus bar 242 is slightly lifted from the second bus bar 244 by the first claw members 282 and the second claw members 283, thereby enabling smooth movement of the first bus bar 242 relative to the second bus bar 244. Note that the first claw members 282 and the second claw members 283 do not necessarily have to be provided. In particular, when the disc spring 249 is used instead of the compression coil spring 248, the first claw member 282 and the second claw member 283 do not need to be provided.

[0057] Next, a substrate mounting method will be described. Figure 24 is a flowchart of a substrate mounting method according to one embodiment. In the substrate mounting method, first, the substrate holder 210 is stored in the fixing module 200 (step S101). At this time, the substrate holder 210 is placed in the fixing module 200 so that the base plate 220 faces downward and the face plate 230 faces upward.

[0058] Next, the substrate mounting method unlocks the substrate holder 210 using the locking mechanism 270 (step S102). Next, the substrate mounting method lifts the faceplate 230 upward (step S103). Next, the substrate mounting method inserts the arm 292 of the position adjustment mechanism 290 between the baseplate 220 and the faceplate 230 (step S104).

[0059] Next, the substrate mounting method uses the arm 292 to grip the first bus bar 242 and move the first bus bar 242 (step S105). For example, in step S105, the first bus bar 242 is moved to a position closest to the central opening 234a or to a position farthest from the central opening 234a, depending on the specifications of the power supply position of the substrate WF. Next, the substrate mounting method retracts the arm 292 from between the base plate 220 and the face plate 230 (step S106).

[0060] Next, in the substrate mounting method, the substrate WF is placed on the upper surface of the base plate 220 (step S107). Next, in the substrate mounting method, the face plate 230 is lowered and the substrate WF is sandwiched between the base plate 220 and the face plate 230 (step S108).

[0061] Next, the substrate mounting method uses the locking mechanism 270 to lock the substrate holder 210 (step S109). As a result, the substrate WF is clamped by the substrate holder 210. Next, the substrate mounting method unloads the substrate holder 210 from the fixing module 200 (step S110).

[0062] According to the board mounting method of this embodiment, the first bus bar 242 and the power supply contact 243 can be moved relative to the second bus bar 244 (frame member 234) and fixed at multiple positions, making it possible to accommodate various types of boards with different power supply positions.

[0063] Although several embodiments of the present invention have been described above, the above-described embodiments of the present invention are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. Furthermore, any combination or omission of the components described in the claims and specification is possible within the scope of solving at least part of the above-described problems or achieving at least part of the effects.

[0064] In one embodiment, the present application discloses a substrate holder including: a base plate; a face plate for sandwiching and holding a substrate together with the base plate, the face plate having a central opening and a frame member surrounding the central opening; and a contact member having a first bus bar attached to the frame member so as to be movable relative to the frame member, and a power supply contact attached to the first bus bar.

[0065] Furthermore, the present application discloses, as one embodiment, a substrate holder in which the central opening is formed rectangular, and the contact elements are attached to the frame member in pairs on either side of the rectangular central opening, or are attached to the four sides of the frame member so as to surround the rectangular central opening.

[0066] Furthermore, as one embodiment, the present application discloses a substrate holder in which the contact member further includes a second bus bar fixed to the frame member, and the first bus bar is attached to the second bus bar so as to be movable relative to the second bus bar.

[0067] Furthermore, the present application discloses, as one embodiment, a substrate holder in which the first bus bar is configured to be movable in a first direction toward and away from the central opening, and the second bus bar has guide members arranged at both ends of the extension direction of the first bus bar, the guide members being for restricting the movement direction of the first bus bar to the first direction.

[0068] Furthermore, the present application discloses, as one embodiment, a substrate holder, in which the first bus bar has an elongated hole that is longer in the first direction than the extension direction of the first bus bar, and the second bus bar has a first regulating member arranged at a position corresponding to the elongated hole, the first regulating member having a proximal end that contacts the edge of the elongated hole when the first bus bar moves in a direction away from the central opening, and a distal end that contacts the edge of the elongated hole when the first bus bar moves in a direction approaching the central opening.

[0069] Furthermore, the present application discloses, as one embodiment, a substrate holder in which the second bus bar has a second restricting member having a proximal restricting member that restricts movement of the first bus bar in a direction toward the central opening when the proximal end of the first restricting member is in contact with the edge of the elongated hole, and a distal restricting member that restricts movement of the first bus bar in a direction away from the central opening when the distal end of the first restricting member is in contact with the edge of the elongated hole.

[0070] Furthermore, the present application discloses, as one embodiment, a plating apparatus including any of the substrate holders described above and a position adjustment mechanism configured to adjust the position of the first bus bar relative to the face plate.

[0071] Furthermore, the present application discloses, as one embodiment, a plating apparatus in which the position adjustment mechanism includes an arm for gripping the first bus bar, a first drive member for moving the arm in a first direction toward and away from the central opening, and a second drive member for moving the arm in a second direction perpendicular to the extension direction of the first bus bar and the first direction.

[0072] Furthermore, the present application discloses, as one embodiment, a plating apparatus in which the arm includes a proximal pressing member for pressing the proximal restricting member to release the restriction on movement of the first bus bar, and a distal pressing member for pressing the distal restricting member to release the restriction on movement of the first bus bar.

[0073] 200 Fixing module 210 Substrate holder 220 Base plate 230 Face plate 234 Frame member 234a Central opening 240 Contact member 241 Second restricting member 241a Proximal restricting member 241b Distal restricting member 242 First bus bar 242a Grip hole 243 Power supply contact 244 Second bus bar 245 Guide member 246 Slot 247 First restricting member 247a Proximal end 247b Distal end 250 Inner seal member 260 Outer seal member 270 Lock mechanism 290 Position adjustment mechanism 292 Arm 293 Proximal pressing member 294 Distal pressing member 295 Grip portion 296 Second drive member 298 First drive member 1000 Plating equipment WF substrate

Claims

1. A substrate holder comprising: a base plate; a face plate for sandwiching and holding a substrate together with the base plate, the face plate having a central opening and a frame member surrounding the central opening; and a contact member having a first bus bar attached to the frame member so as to be movable relative to the frame member, and a power supply contact attached to the first bus bar.

2. The substrate holder according to claim 1, wherein the central opening is formed in a rectangular shape, and the contact members are attached to the frame member in a pair on either side of the rectangular central opening, or are attached to the four sides of the frame member so as to surround the rectangular central opening.

3. The substrate holder according to claim 2, wherein the contact members further include a second bus bar fixed to the frame member, and the first bus bar is attached to the second bus bar so as to be movable relative to the second bus bar.

4. A substrate holder as described in claim 3, wherein the first bus bar is configured to be movable in a first direction toward and away from the central opening, and the second bus bar has guide members arranged at both ends of the extension direction of the first bus bar for restricting the movement direction of the first bus bar to the first direction.

5. A substrate holder as described in claim 4, wherein the first bus bar has a long hole that is longer in the first direction than the extension direction of the first bus bar, and the second bus bar has a first regulating member arranged at a position corresponding to the long hole, the first regulating member having a proximal end that contacts the edge of the long hole when the first bus bar moves in a direction away from the central opening, and a distal end that contacts the edge of the long hole when the first bus bar moves in a direction approaching the central opening.

6. A substrate holder as described in claim 5, wherein the second bus bar has a second regulating member having a proximal regulating member that regulates movement of the first bus bar in a direction approaching the central opening when the proximal end of the first regulating member is in contact with the edge of the long hole, and a distal regulating member that regulates movement of the first bus bar in a direction away from the central opening when the distal end of the first regulating member is in contact with the edge of the long hole.

7. A plating apparatus comprising the substrate holder according to any one of claims 1 to 6, and a position adjusting mechanism configured to adjust the position of the first bus bar with respect to the face plate.

8. The position adjusting mechanism of the plating apparatus according to claim 7, comprising an arm for gripping the first bus bar, a first driving member for moving the arm in a first direction approaching and moving away from the central opening, and a second driving member for moving the arm in a second direction orthogonal to the extending direction of the first bus bar and the first direction.

9. A plating apparatus comprising the substrate holder according to claim 6, and a position adjusting mechanism configured to adjust the position of the first bus bar with respect to the face plate, the position adjusting mechanism comprising an arm for gripping the first bus bar, a first driving member for moving the arm in a first direction approaching and moving away from the central opening, and a second driving member for moving the arm in a second direction orthogonal to the extending direction of the first bus bar and the first direction, the arm comprising a proximal pressing member for pressing the proximal restricting member to release the restriction on the movement of the first bus bar, and a distal pressing member for pressing the distal restricting member to release the restriction on the movement of the first bus bar.

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