Photocurable composition, film, optical filter, solid-state imaging element, and image display device

Abstract

Provided is a photocurable composition containing: at least one compound A selected from compounds represented by any of formulae (A-1) to (A-6); a resin; and a photopolymerisation initiator, the content of compound A in the total solid content of the photocurable composition being 0.005 to 2 mass%. Further provided are: a film obtained using the aforementioned photocurable composition; an optical filter; a solid-state imaging element; and an image display device.

Description

Photocurable composition, film, optical filter, solid-state imaging device and image display device

[0001] The present invention relates to a photocurable composition. The present invention also relates to a film, an optical filter, a solid-state imaging device, and an image display device using the photocurable composition.

[0002] Solid-state imaging devices such as charge-coupled devices (CCDs) and complementary metal-oxide semiconductors (CMOSs) are used in video cameras, digital still cameras, and mobile phones with camera functions. The solid-state imaging devices are also equipped with optical filters such as color filters. Optical filters are manufactured using, for example, a photocurable composition containing a polymerizable compound and a photopolymerization initiator (see Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2020-181041

[0004] In recent years, progress has been made in miniaturizing the pattern size of optical filters used in solid-state imaging devices, etc. However, as the pattern size becomes finer, the adhesion to the support tends to become insufficient.

[0005] Furthermore, there is a demand for further improvement in the solvent resistance of films obtained using photocurable compositions.

[0006] The present inventors have studied the composition described in Patent Document 1 and found that there is room for further improvement in the solvent resistance of the resulting film and in the adhesion to the support.

[0007] Therefore, an object of the present invention is to provide a photocurable composition capable of forming a film having excellent adhesion and solvent resistance, and a film, an optical filter, a solid-state imaging device, and an image display device.

[0008] The present inventors have found through their investigations that the above object can be achieved by using a photocurable composition as described below, and have thus completed the present invention.

[0009] <1> A photocurable composition comprising at least one compound A selected from the compounds represented by any one of formulas (A-1) to (A-6), a resin, and a photopolymerization initiator, wherein the content of the compound A in the total solid content of the photocurable composition is 0.005 to 2 mass %; In the formula, R ａ１ ~R ａ１３ each independently represents a hydrogen atom or a methyl group. <2> The photocurable composition according to <1>, wherein the compound A is at least one selected from the group consisting of a compound represented by formula (A1-01), a compound represented by formula (A1-02), a compound represented by formula (A5-01), and a compound represented by formula (A5-02). <3> The photocurable composition according to <1> or <2>, further comprising a tri- to hexa-functional polymerizable compound having 3 to 6 ethylenically unsaturated bond-containing groups, the tri- to hexa-functional polymerizable compound having a structure different from that of Compound A. <4> The photocurable composition according to any one of <1> to <3>, wherein the resin comprises a resin having an ethylenically unsaturated bond-containing group. <5> The photocurable composition according to <4>, wherein the resin having an ethylenically unsaturated bond-containing group comprises a group represented by any one of Formulas (b-1) to (b-3). In formula (b-1), * represents a bond, and R ｂ１ represents a hydrogen atom or a methyl group, R ｂ２ represents a hydrogen atom or an organic group; in formula (b-2), * represents a bond, and R ｂ３ represents a hydrogen atom or a methyl group; in formula (b-3), * represents a bond, and R ｂ４ represents a hydrogen atom or a methyl group, R ｂ５ represents a hydrogen atom or an organic group. <6> The photocurable composition according to any one of <1> to <5>, further comprising a colorant. <7> The photocurable composition according to any one of <1> to <6>, further comprising a compound having a quaternary ammonium cation. <8> A film obtained using the photocurable composition according to any one of <1> to <7>. <9> An optical filter having the film according to <8>. <10> A solid-state imaging device having the film according to <8>. <11> An image display device having the film according to <8>.

[0010] According to the present invention, a photocurable composition capable of forming a film having excellent adhesion and solvent resistance can be provided. The present invention also provides a film, an optical filter, a solid-state imaging device, and an image display device.

[0011] The present invention will be described in detail below. In this specification, the term "to" is used to mean that the numerical values ​​before and after the term are included as the lower and upper limits. In the description of groups (atomic groups) in this specification, a term without specifying whether it is substituted or unsubstituted encompasses both unsubstituted groups (atomic groups) and substituted groups (atomic groups). For example, the term "alkyl group" encompasses not only unsubstituted alkyl groups (unsubstituted alkyl groups) but also substituted alkyl groups (substituted alkyl groups). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. Examples of light used for exposure include the bright line spectrum of a mercury lamp, far ultraviolet light typified by excimer lasers, extreme ultraviolet light (EUV light), X-rays, electron beams, and other actinic rays or radiation. As used herein, "(meth)acrylate" refers to either or both of acrylate and methacrylate, "(meth)acrylic" refers to either or both of acrylic and methacrylic, and "(meth)acryloyl" refers to either or both of acryloyl and methacryloyl. In the structural formulae herein, Me refers to a methyl group, Et refers to an ethyl group, Bu refers to a butyl group, and Ph refers to a phenyl group. As used herein, the weight-average molecular weight and number-average molecular weight are polystyrene-equivalent values ​​measured by GPC (gel permeation chromatography). As used herein, the term "total solids" refers to the total mass of all components of a composition excluding the solvent. As used herein, the term "pigment" refers to a coloring material that is difficult to dissolve in a solvent. As used herein, the term "process" refers not only to an independent process, but also to a process that cannot be clearly distinguished from other processes, as long as the intended effect of the process is achieved.

[0012] <Photocurable composition> The photocurable composition of the present invention is a photocurable composition comprising at least one compound A selected from the compounds represented by any one of formulas (A-1) to (A-6), a resin, and a photopolymerization initiator, and is characterized in that the content of compound A in the total solid content of the photocurable composition is 0.005 to 2 mass %.

[0013] The photocurable composition of the present invention can be used to form a film with excellent adhesion and solvent resistance. The reason for this effect is presumed to be as follows. Because Compound A contains two or three (meth)acryloyl groups per molecule and also contains an OH group or an NH group, it is presumed that the OH group or NH group possessed by these compounds allows it to function as a chain transfer agent while also being a radically polymerizable compound. This is presumed to further improve the radical polymerizability of the photocurable composition upon exposure. Furthermore, it is presumed that the OH group or NH group possessed by Compound A also functions as a hydrogen bond donor, thereby also forming pseudo-crosslinks in the film. Furthermore, it is presumed that the content of Compound A in the total solids content of the photocurable composition is 0.005 to 2 mass %, thereby achieving a well-balanced effect as described above. This is presumed to enable thorough curing to the bottom of the film upon exposure, thereby improving the solvent resistance and adhesion of the resulting film to the support.

[0014] Furthermore, when the photocurable composition of the present invention is used to form a pattern by photolithography to form pixels, the pixels can be formed with excellent rectangularity. Therefore, the photocurable composition of the present invention can be preferably used for pattern formation by photolithography.

[0015] The photocurable composition of the present invention is preferably used as a photocurable composition for an optical filter. Examples of the optical filter include a color filter, an infrared transmission filter, and an infrared cut filter, and a color filter is preferred.

[0016] Furthermore, when a photocurable composition containing a colorant is used, as the content of the colorant in the total solid content of the photocurable composition increases, the amount of materials other than the colorant decreases relatively. Therefore, photocurable compositions with a high colorant concentration tend to result in poor adhesion to the support and solvent resistance of the resulting film. Furthermore, the rectangularity of the resulting pixels also tends to be reduced. However, the photocurable composition of the present invention can form a film with excellent adhesion and solvent resistance even when the content of the colorant in the total solid content of the photocurable composition is increased. Furthermore, it can also form pixels with excellent rectangularity. Therefore, the photocurable composition of the present invention exhibits particularly remarkable effects when applied to photocurable compositions with a high colorant concentration (e.g., photocurable compositions in which the content of the colorant in the total solid content of the photocurable composition is 35% by mass or more, preferably 40% by mass or more, and more preferably 45% by mass or more).

[0017] The color filter may have colored pixels that transmit light of a specific wavelength. Examples of the colored pixels include red, green, blue, magenta, cyan, and yellow pixels. The colored pixels of the color filter may be formed using a photocurable composition containing a chromatic colorant.

[0018] The infrared cut filter preferably has a maximum absorption wavelength in the wavelength range of 700 to 1800 nm, more preferably in the wavelength range of 700 to 1300 nm, and even more preferably in the wavelength range of 700 to 1000 nm. The transmittance of the infrared cut filter over the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. The transmittance at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less. The ratio of the absorbance Amax at the infrared cut filter's maximum absorption wavelength to the absorbance A550 at a wavelength of 550 nm (absorbance Amax / absorbance A550) is preferably 20 to 500, more preferably 50 to 500, even more preferably 70 to 450, and particularly preferably 100 to 400. The infrared cut filter can be formed using a photocurable composition containing an infrared-absorbing colorant.

[0019] The infrared transmission filter is a filter that transmits at least a portion of infrared light. The infrared transmission filter is preferably a filter that blocks at least a portion of visible light and transmits at least a portion of infrared light. Examples of the infrared transmission filter include a filter that satisfies the spectral characteristics of a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1300 nm. The infrared transmission filter is preferably a filter that satisfies any one of the following spectral characteristics (1) to (5): (1): A filter that has a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 800 to 1500 nm. (2): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 750 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 900 to 1500 nm. (3): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 830 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1000 to 1500 nm. (4): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 950 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1500 nm. (5): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 1050 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1200 to 1500 nm.

[0020] The solids concentration of the photocurable composition of the present invention is preferably 5 to 30% by mass. The lower limit is preferably 7.5% by mass or more, more preferably 10% by mass or more. The upper limit is preferably 25% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less.

[0021] Each component used in the photocurable composition of the present invention will now be described.

[0022] <<Specific Compound (Compound A)>> The photocurable composition of the present invention contains at least one compound A selected from the compounds represented by any one of Formulas (A-1) to (A-6). Hereinafter, the compound represented by any one of Formulas (A-1) to (A-6) may also be referred to as the specific compound.

[0023] In the formula, R ａ１ ~R ａ１３ each independently represents a hydrogen atom or a methyl group.

[0024] Specific examples of the specific compound include the compounds shown below.

[0025] The specific compound is preferably at least one selected from the group consisting of compounds represented by formula (A1-01), (A1-02), (A5-01), and (A5-02). According to this embodiment, the adhesion and solvent resistance of the resulting film can be further improved.

[0026] The content of the specific compound in the total solid content of the photocurable composition is 0.005 to 2% by mass. The upper limit is preferably 1.5% by mass or less, and more preferably 1% by mass or less. The lower limit is preferably 0.01% by mass or more, and more preferably 0.05% by mass or more.

[0027] The photocurable composition of the present invention may contain only one specific compound or two or more specific compounds. When two or more specific compounds are contained, the total amount thereof falls within the above range.

[0028] <<Other Polymerizable Compounds>> The photocurable composition of the present invention preferably further contains a tri- to hexa-functional polymerizable compound (hereinafter also referred to as "other polymerizable compound") that is a compound having a structure different from the above-described specific compound and has 3 to 6 ethylenically unsaturated bond-containing groups. Examples of the ethylenically unsaturated bond-containing group contained in the other polymerizable compound include a vinyl group, a (meth)allyl group, and a (meth)acryloyl group. The other polymerizable compound is preferably a radically polymerizable compound.

[0029] The other polymerizable compound is preferably a monomer. The molecular weight of the other polymerizable compound is preferably 100 to 2500. The upper limit is preferably 2000 or less, more preferably 1500 or less. The lower limit is preferably 150 or more, more preferably 250 or more.

[0030] The ethylenically unsaturated bond-containing group value (hereinafter referred to as C═C value) of the other polymerizable compound is preferably 2 to 14 mmol / g from the viewpoint of the storage stability of the photocurable composition. The lower limit is preferably 3 mmol / g or more, more preferably 4 mmol / g or more, and even more preferably 5 mmol / g or more. The upper limit is preferably 12 mmol / g or less, more preferably 10 mmol / g or less, and even more preferably 8 mmol / g or less. The C═C value of the polymerizable compound is a value calculated by dividing the number of ethylenically unsaturated bond-containing groups contained in one molecule of the polymerizable compound by the molecular weight of the polymerizable compound.

[0031] Specific examples of other polymerizable compounds include the compounds described in paragraphs 0075 to 0083 of WO 2022 / 065215 and the compounds described in Taiwan Patent Application Publication No. 201832008.

[0032] Preferred examples of other polymerizable compounds include dipentaerythritol tri(meth)acrylate (commercially available product: KAYARAD D-330, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetra(meth)acrylate (commercially available product: KAYARAD D-320, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (commercially available product: KAYARAD D-310, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth)acrylate (commercially available products: KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., and NK Ester A-DPH-12E, manufactured by Shin-Nakamura Chemical Co., Ltd.), and compounds having a structure in which the (meth)acryloyl group is bonded via an ethylene glycol and / or propylene glycol residue (e.g., SR454, SR499, commercially available from Sartomer).Other polymerizable compounds include diglycerin EO (ethylene oxide) modified (meth)acrylate (commercially available product: M-460, manufactured by Toagosei Co., Ltd.), pentaerythritol tetraacrylate (NK Ester A-TMMT, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 1,6-hexanediol diacrylate (KAYARAD, manufactured by Nippon Kayaku Co., Ltd.). HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Toagosei Co., Ltd.), NK Oligo UA-7200 (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600, LINC-202UA (manufactured by Kyoeisha Chemical Co., Ltd.), 8UH-1 006, 8UH-1012 (all manufactured by Taisei Fine Chemical Co., Ltd.), Light Acrylate POB-A0 (manufactured by Kyoeisha Chemical Co., Ltd.), Aronix MT-3041, 3042 (manufactured by Toagosei Co., Ltd., polymerizable compounds containing amines), Aronix M-510, 520 (manufactured by Toagosei Co., Ltd., polymerizable compounds having an acidic group), Etercure 6361-100 (Eternal Materials, polymerizable compound having a hyperbranched structure), EBECRYL80 (amine-containing tetrafunctional monomer, manufactured by Daicel-Olknes Co., Ltd.), EBECRYL7100 (amine-containing bifunctional monomer, manufactured by Daicel-Olknes Co., Ltd.), CN371NS (amine-containing bifunctional monomer, manufactured by Arkema), HOA-MPL (2-acryloyloxyethyl-phthalic acid: manufactured by Kyoeisha Chemical Co., Ltd.), HOA-MPE (2-acryloyloxyethyl-2-hydroxyethyl-phthalic acid: manufactured by Kyoeisha Chemical Co., Ltd.), polymerizable compounds having a dendrimer structure or hyperbranched structure described in JP-A No. 2023-043479, and polymerizable compounds described in JP-A No. 2023-529984 can also be used.

[0033] The content of the other polymerizable compound in the total solid content of the photocurable composition is preferably 1 to 30% by mass. The upper limit is preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less. The lower limit is preferably 3% by mass or more, and more preferably 5% by mass or more.

[0034] The photocurable composition preferably contains 0.05 to 20 parts by mass of the specific compound described above per 100 parts by mass of the other polymerizable compounds. The upper limit is preferably 15 parts by mass or less, more preferably 10 parts by mass or less, and even more preferably 5 parts by mass or less. The lower limit is preferably 0.2 parts by mass or more, more preferably 0.5 parts by mass or more.

[0035] The photocurable composition of the present invention may contain only one type of other polymerizable compound or may contain two or more types. When two or more types of polymerizable compounds are contained, the total amount thereof is preferably within the above range.

[0036] <<Resin>> The photocurable composition of the present invention contains a resin. The resin is blended, for example, to disperse pigments and the like in the photocurable composition or as a binder. Note that resins used primarily to disperse pigments and the like in the photocurable composition are also called dispersants. However, these uses of resins are merely examples, and resins can also be used for purposes other than these uses.

[0037] The weight average molecular weight (Mw) of the resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, and more preferably 500,000 or less. The lower limit is preferably 4,000 or more, and more preferably 5,000 or more.

[0038] Examples of resins include (meth)acrylic resins, epoxy resins, (meth)acrylamide resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyamideimide resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, and siloxane resins. Further, as the resin, a resin described in paragraphs 0091 to 0099 of WO 2022 / 065215, a blocked polyisocyanate resin described in JP 2016-222891 A, a resin described in JP 2020-122052 A, a resin described in JP 2020-111656 A, a resin described in JP 2020-139021 A, a resin containing a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain described in JP 2017-138503 A, a resin described in paragraphs 0199 to 0233 of JP 2020-186373 A, an alkali metal acrylate resin described in JP 2020-186325 A Soluble resin, resin represented by formula 1 described in Korean Patent Publication No. 10-2020-0078339, copolymer containing epoxy groups and acid groups described in WO 2022 / 030445, resin described in JP 2018-135514 A, copolymer described in JP 2020-041046 A, resin described in JP 2023-033156 A, resin described in JP 2023-030386 A, resin described in JP 2023-027753 A, resin described in JP 2020-139021 A, resin described in JP 2023-074038 A, resin described in JP 2023-079666 A can also be used.

[0039] (Specific Resin) The photocurable composition of the present invention preferably contains a resin having an ethylenically unsaturated bond-containing group (hereinafter also referred to as specific resin).

[0040] Examples of the ethylenically unsaturated bond-containing group contained in the specific resin include a vinyl group, a (meth)allyl group, and a (meth)acryloyl group.

[0041] The weight average molecular weight of the specific resin is preferably 2,000 to 50,000. The upper limit is preferably 40,000 or less, more preferably 30,000 or less. The lower limit is preferably 3,000 or more, more preferably 5,000 or more.

[0042] The ethylenically unsaturated bond-containing group value (hereinafter referred to as C=C value) of the specific resin is preferably 0.1 to 2.5 mmol / g. The upper limit is preferably 2.0 mmol / g or less, more preferably 1.8 mmol / g or less. The lower limit is preferably 0.2 mmol / g or more, more preferably 0.3 mmol / g or more. The C=C value of the specific resin is a numerical value representing the molar amount of the ethylenically unsaturated bond-containing group value per 1 g of the solid content of the specific resin. When it can be calculated from the structural formula of the specific resin, the value calculated from the structural formula is used. Furthermore, when it cannot be calculated from the structural formula but can be calculated from the raw materials used in the synthesis of the specific resin, the value calculated from the raw materials used in the synthesis is used. Furthermore, when the ethylenically unsaturated bond-containing group value of the specific resin cannot be calculated from the raw materials used in the synthesis of the specific resin, a value measured using a hydrolysis method is used. Specifically, component (a) at the ethylenically unsaturated bond-containing group site is extracted from the specific resin by alkali treatment, its content is measured by high performance liquid chromatography (HPLC), and the value is calculated from the following formula: When component (a) cannot be extracted from the specific resin by alkali treatment, a value measured by NMR (nuclear magnetic resonance) is used. Ethylenically unsaturated bond-containing group value of specific resin [mmol / g] = (content of component (a) [ppm] / molecular weight of component (a) [g / mol]) / (weighed value of specific resin [g] × (solids concentration of specific resin [mass%] / 100) × 10

[0043] The specific resin preferably contains a group represented by any one of formulas (b-1) to (b-3), and more preferably contains a group represented by formula (b-1) or (b-3). According to this embodiment, a film having excellent adhesion to the support and solvent resistance can be formed. In formula (b-1), * represents a bond, and R ｂ１ represents a hydrogen atom or a methyl group, R ｂ２represents a hydrogen atom or an organic group; in formula (b-2), * represents a bond, and R ｂ３ represents a hydrogen atom or a methyl group; in formula (b-3), * represents a bond, and R ｂ４ represents a hydrogen atom or a methyl group, R ｂ５ represents a hydrogen atom or an organic group.

[0044] R in formula (b-1) ｂ２ and R in formula (b-3) ｂ５ Examples of the organic group represented by include an alkyl group, an aryl group, and a heteroaryl group. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include an alkoxy group, an aryloxy group, and -NR Ａ１１１ R Ａ１１２ , -SO ２ NR Ａ１１３ R Ａ１１４ , -COOR Ａ１１５ , -CONR Ａ１１６ R Ａ１１７ Examples include: Ａ１１１ ~R Ａ１１７ each independently represents an alkyl group or an aryl group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12, even more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent. Examples of the substituent include a halogen atom, a nitro group, a cyano group, an alkoxy group, an aryloxy group, and -NR Ａ１１１ R Ａ１１２ , -SO ２ NR Ａ１１３ R Ａ１１４ , -COOR Ａ１１５ , -CONR Ａ１１６ R Ａ１１７ Examples include: Ａ１１１ ~R Ａ１１７each independently represents an alkyl group or an aryl group. The heteroaryl group is preferably a 5- or 6-membered heteroaryl group. The heteroatoms contained in the heteroaryl group are preferably oxygen atoms, nitrogen atoms, and sulfur atoms. The number of heteroatoms contained in the heteroaryl group is preferably 1 to 3. The heteroaryl group may have a substituent. Examples of the substituent include a halogen atom, a nitro group, a cyano group, an alkoxy group, an aryloxy group, and -NR Ａ１１１ R Ａ１１２ , -SO ２ NR Ａ１１３ R Ａ１１４ , -COOR Ａ１１５ , -CONR Ａ１１６ R Ａ１１７ Examples include: Ａ１１１ ~R Ａ１１７ each independently represents an alkyl group or an aryl group.

[0045] R in formula (b-1) ｂ２ and R in formula (b-3) ｂ５ is preferably a hydrogen atom.

[0046] The specific resin is preferably a resin containing a repeating unit having an ethylenically unsaturated bond-containing group in a side chain. The repeating unit having an ethylenically unsaturated bond-containing group in a side chain is preferably a repeating unit represented by formula (B1-1).

[0047] In the formula, Y ｂ１１ represents a trivalent linking group, L ｂ１１ represents a single bond or a divalent linking group, A ｂ１１ represents an ethylenically unsaturated bond-containing group.

[0048] Y ｂ１１ Examples of the trivalent linking group represented by are a poly(meth)acrylic linking group, a polyalkyleneimine linking group, a polyester linking group, a polyurethane linking group, a polyurea linking group, a polyamide linking group, a polyether linking group, and a polystyrene linking group. A poly(meth)acrylic linking group or a polyalkyleneimine linking group is preferred, and a poly(meth)acrylic linking group is more preferred.

[0049] L ｂ１１ Examples of the divalent linking group represented by include an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms), -NH-, -SO-, -SO ２ Examples thereof include -, -CO-, -O-, -COO-, OCO-, -S- and groups combining two or more of these groups.

[0050] A ｂ１１ represents an ethylenically unsaturated bond-containing group. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a (meth)allyl group, a (meth)acryloyl group, and a group represented by any one of the above formulas (b-1) to (b-3), and the group represented by any one of the above formulas (b-1) to (b-3) is preferred, and it is more preferred to include a group represented by formula (b-1) or a group represented by formula (b-3).

[0051] The content of the repeating unit represented by formula (B1-1) is preferably 1 mol % or more, more preferably 1 to 80 mol %, of all repeating units in the specific resin. The upper limit is preferably 70 mol % or less, more preferably 60 mol % or less. The lower limit is preferably 2 mol % or more, more preferably 5 mol % or more.

[0052] The specific resin may contain a repeating unit having an acid group, such as a carboxy group, a sulfo group, or a phosphate group.

[0053] When the specific resin contains a repeating unit having an acid group, the content of the repeating unit having an acid group is preferably 1 to 80 mol %, more preferably 5 to 80 mol %, and even more preferably 10 to 80 mol %, of all repeating units of the specific resin.

[0054] When the specific resin contains a repeating unit having an acid group, the acid value of the specific resin is preferably 5 to 200 mgKOH / g. The upper limit is preferably 150 mgKOH / g or less, more preferably 100 mgKOH / g or less, and even more preferably 80 mgKOH / g or less. The lower limit is preferably 10 mgKOH / g or more, more preferably 15 mgKOH / g or more, and even more preferably 20 mgKOH / g or more.

[0055] The specific resin may contain a repeating unit having a graft chain. In this specification, a graft chain refers to a polymer chain that branches off from the main chain of the repeating unit. The graft chain preferably has 40 to 10,000 atoms excluding hydrogen atoms, more preferably 50 to 2,000 atoms excluding hydrogen atoms, and even more preferably 60 to 500 atoms excluding hydrogen atoms.

[0056] The graft chain preferably contains a repeating unit of at least one structure selected from the group consisting of a polyester structure, a polyether structure, a poly(meth)acrylic structure, a polystyrene structure, a polyurethane structure, a polyurea structure, and a polyamide structure, more preferably contains a repeating unit of at least one structure selected from the group consisting of a polyester structure, a polyether structure, a poly(meth)acrylic structure, and a polystyrene structure, even more preferably contains a repeating unit of at least one structure selected from the group consisting of a polyester structure, a polyether structure, and a poly(meth)acrylic structure, still more preferably contains a repeating unit of a polyester structure or a polyether structure, and particularly preferably contains a repeating unit of a polyester structure.

[0057] Examples of repeating units of polyester structures include repeating units of structures represented by the following formula (G-1), formula (G-4), or formula (G-5). Examples of repeating units of polyether structures include repeating units of structures represented by the following formula (G-2). Examples of repeating units of poly(meth)acrylic structures include repeating units of structures represented by the following formula (G-3). Examples of repeating units of polystyrene structures include repeating units of structures represented by the following formula (G-6).

[0058] In the above formula, R Ｇ１ and R Ｇ２ R each independently represents an alkylene group. Ｇ１ The number of carbon atoms in the alkylene group represented by R is preferably 1 to 20, more preferably 2 to 16, and even more preferably 2 to 12. The alkylene group is preferably linear or branched, and more preferably linear. Ｇ２ The number of carbon atoms in the alkylene group represented by is preferably 1 to 10, more preferably 1 to 5, even more preferably 2 to 5, and still more preferably 2 or 3. The alkylene group is preferably linear or branched, and more preferably linear.

[0059] In the above formula, R Ｇ３ represents a hydrogen atom or a methyl group, and Q Ｇ１ represents —O— or —NH—, L Ｇ１ represents a single bond or a divalent linking group, R Ｇ４ represents a hydrogen atom or a substituent. Ｇ１ Examples of the divalent linking group represented by include an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms), an alkyleneoxy group (preferably an alkyleneoxy group having 1 to 12 carbon atoms), an oxyalkylenecarbonyl group (preferably an oxyalkylenecarbonyl group having 1 to 12 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms), -NH-, -SO-, -SO ２ -, -CO-, -O-, -COO-, OCO-, -S-, and groups combining two or more of these. Ｇ４Examples of the substituent represented by include a hydroxy group, a carboxy group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, a heterocyclic oxy group, an alkylthioether group, an arylthioether group, and a heterocyclic thioether group.

[0060] R Ｇ５ represents a hydrogen atom or a methyl group, R Ｇ６ represents an aryl group. Ｇ６ The number of carbon atoms in the aryl group represented by R is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 12. Ｇ６ The aryl group represented by may have a substituent, such as a hydroxy group, a carboxy group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, a heterocyclic oxy group, an alkylthioether group, an arylthioether group, or a heterocyclic thioether group.

[0061] The terminal structure of the graft chain is not particularly limited. It may be a hydrogen atom or a substituent. Examples of the substituent include a hydroxy group, a carboxy group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, a heterocyclic oxy group, an alkylthioether group, an arylthioether group, and a heterocyclic thioether group. Among these, a group having a steric repulsion effect is preferred, and an alkyl group or an alkoxy group having 5 to 24 carbon atoms is preferred. The alkyl group and the alkoxy group may be linear, branched, or cyclic, and linear or branched groups are preferred.

[0062] The graft chain preferably has a structure represented by the following formula (G-1a), (G-2a), (G-3a), (G-4a), (G-5a) or (G-6a), and more preferably has a structure represented by formula (G-1a), (G-4a) or (G-5a).

[0063] In the above formula, R Ｇ１ and R Ｇ２ each represents an alkylene group, and R Ｇ３ represents a hydrogen atom or a methyl group, and Q Ｇ１ represents —O— or —NH—, L Ｇ１represents a single bond or a divalent linking group, R Ｇ４ represents a hydrogen atom or a substituent, R Ｇ５ represents a hydrogen atom or a methyl group, R Ｇ６ represents an aryl group; W １００ represents a hydrogen atom or a substituent, and n1 to n6 each independently represent an integer of 2 or more. Ｇ１ ~R Ｇ６ , Q Ｇ１ , L Ｇ１ Regarding the formula (G-1) to (G-6), Ｇ１ ~R Ｇ６ , Q Ｇ１ , L Ｇ１ The same applies to the preferred range.

[0064] In formulae (G-1a) to (G-6a), W １００ is preferably a substituent. Examples of the substituent include a hydroxy group, a carboxy group, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, a heterocyclic oxy group, an alkylthioether group, an arylthioether group, and a heterocyclic thioether group. Among these, a group having a steric repulsion effect is preferred, and an alkyl group or an alkoxy group having 5 to 24 carbon atoms is preferred. The alkyl group and the alkoxy group may be linear, branched, or cyclic, and linear or branched groups are preferred.

[0065] In formulae (G-1a) to (G-6a), n1 to n6 are each preferably an integer of 2 to 100, more preferably an integer of 2 to 80, and even more preferably an integer of 8 to 60.

[0066] In formula (G-1a), when n1 is 2 or more, R Ｇ１ may be the same or different. Ｇ１ In the case where the repeating unit has two or more different repeating units, the arrangement of the repeating units is not particularly limited and may be random, alternating, or block. The same applies to formulas (G-2a) to (G-6a). The graft chain has a structure represented by formula (G-1a), formula (G-4a), or formula (G-5a), and R Ｇ１It is also preferable that the repeating unit has a structure containing two or more different repeating units.

[0067] The weight-average molecular weight of the repeating unit having a graft chain is preferably 1,000 or more, more preferably 1,000 to 10,000, and even more preferably 1,000 to 7,500. In this specification, the weight-average molecular weight of the repeating unit having a graft chain is a value calculated from the weight-average molecular weight of the raw material monomers used in the polymerization of the repeating unit. For example, the repeating unit having a graft chain can be formed by polymerizing a macromonomer. Here, the macromonomer refers to a polymeric compound having a polymerizable group introduced at the polymer terminal. When the repeating unit having a graft chain is formed using a macromonomer, the weight-average molecular weight of the macromonomer corresponds to the repeating unit having a graft chain.

[0068] When the specific resin contains a repeating unit having a graft chain, the content of the repeating unit having a graft chain is preferably 1 to 60 mol % of all repeating units of the specific resin. The upper limit is preferably 50 mol % or less, more preferably 40 mol % or less. The lower limit is preferably 2 mol % or more, more preferably 5 mol % or more.

[0069] It is also preferable that the specific resin contains a repeating unit derived from a monomer component containing a compound represented by the following formula (ED1) and / or a compound represented by the following formula (ED2) (hereinafter, these compounds may be referred to as "ether dimers").

[0070]

[0071] In formula (ED1), R １ and R ２ each independently represents a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. In formula (ED2), R represents a hydrogen atom or an organic group having 1 to 30 carbon atoms. For details of formula (ED2), reference can be made to the description in JP-A-2010-168539, the contents of which are incorporated herein by reference.

[0072] Specific examples of ether dimers can be found in, for example, paragraph 0317 of JP-A-2013-029760, the contents of which are incorporated herein by reference.

[0073] The specific resin also preferably contains a repeating unit derived from a compound represented by the following formula (X). In formula (X), R １ represents a hydrogen atom or a methyl group, R ２ represents an alkylene group having 2 to 10 carbon atoms, and R ３ represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms which may contain a benzene ring, and n represents an integer of 1 to 15.

[0074] The specific resin is also preferably a resin containing a repeating unit represented by formula (Ac-2). In formula (Ac-2), Ar １０ represents a group containing an aromatic carboxy group, L １１ represents —COO— or —CONH—, L １２ represents a trivalent linking group, P １０ represents a polymer chain containing a repeating unit having an ethylenically unsaturated bond-containing group in the side chain.

[0075] Ar in formula (Ac-2) １０ Examples of the group containing an aromatic carboxy group represented by the formula (I) include a structure derived from an aromatic tricarboxylic acid anhydride, a structure derived from an aromatic tetracarboxylic acid anhydride, etc. Examples of the aromatic tricarboxylic acid anhydride and the aromatic tetracarboxylic acid anhydride include compounds having the following structures:

[0076] In the above formula, Q １ represents a single bond, -O-, -CO-, -COOCH ２ CH ２ OCO-, -SO ２ -, -C(CF ３ ) ２ -, a group represented by the following formula (Q-1) or a group represented by the following formula (Q-2).

[0077] Ar １０The group containing an aromatic carboxy group represented by Ar may have an ethylenically unsaturated bond-containing group. １０ Specific examples of the group containing an aromatic carboxy group represented by formula (Ar-11), a group represented by formula (Ar-12), a group represented by formula (Ar-13), etc.

[0078] In formula (Ar-11), n1 represents an integer of 1 to 4, preferably 1 or 2, and more preferably 2. In formula (Ar-12), n2 represents an integer of 1 to 8, preferably an integer of 1 to 4, more preferably 1 or 2, and even more preferably 2. In formula (Ar-13), n3 and n4 each independently represent an integer of 0 to 4, preferably an integer of 0 to 2, more preferably 1 or 2, and even more preferably 1. However, at least one of n3 and n4 is an integer of 1 or greater. In formula (Ar-13), Q １ represents a single bond, -O-, -CO-, -COOCH ２ CH ２ OCO-, -SO ２ -, -C(CF ３ ) ２ -, a group represented by the above formula (Q-1) or a group represented by the above formula (Q-2). １０ represents the bonding position with

[0079] L in formula (Ac-2) １１ represents —COO— or —CONH—, and is preferably —COO—.

[0080] L in formula (Ac-2) １２Examples of the trivalent linking group represented by include hydrocarbon groups, -O-, -CO-, -COO-, -OCO-, -NH-, -S-, and groups combining two or more of these. Examples of the hydrocarbon group include aliphatic hydrocarbon groups and aromatic hydrocarbon groups. The aliphatic hydrocarbon group preferably has 1 to 30 carbon atoms, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic. The aromatic hydrocarbon group preferably has 6 to 30 carbon atoms, more preferably 6 to 20, and even more preferably 6 to 10. The hydrocarbon group may have a substituent. Examples of the substituent include a hydroxy group. L １２ The trivalent linking group represented by formula (L12-1) is preferably a group represented by formula (L12-1), and more preferably a group represented by formula (L12-2).

[0081] In formula (L12-1), L １２ｂ represents a trivalent linking group, and X １ represents S, *1 represents L in formula (Ac-2). １１ *2 represents the bonding position of P in formula (Ac-2). １０ represents the bonding position with １２ｂ Examples of the trivalent linking group represented by the formula (I) include a hydrocarbon group; and a group in which a hydrocarbon group is combined with at least one selected from -O-, -CO-, -COO-, -OCO-, -NH-, and -S-, and a hydrocarbon group or a group in which a hydrocarbon group is combined with -O- is preferred.

[0082] In formula (L12-2), L １２ｃ represents a trivalent linking group, and X １ represents S, *1 represents L in formula (Ac-2). １１ *2 represents the bonding position of P in formula (Ac-2). １０ represents the bonding position with １２ｃ Examples of the trivalent linking group represented by the formula (I) include a hydrocarbon group; and a group formed by combining a hydrocarbon group with at least one selected from —O—, —CO—, —COO—, —OCO—, —NH—, and —S—, and a hydrocarbon group is preferred.

[0083] P in formula (Ac-2) １０represents a polymer chain containing a repeating unit having an ethylenically unsaturated bond-containing group in the side chain. １０ is preferably a polymer chain containing a repeating unit having a group represented by any one of formulas (b-1) to (b-3) at its side chain, and more preferably a polymer chain containing a repeating unit having a group represented by formula (b-1) or a group represented by formula (b-3) at its side chain.

[0084] P １０ Examples of the polymer chain represented by formula (G) include polymer chains containing a repeating unit of at least one structure selected from the group consisting of a polyester structure, a polyether structure, a poly(meth)acrylic structure, a polystyrene structure, a polyurethane structure, a polyurea structure, and a polyamide structure. Examples of the repeating unit of the polyester structure include a repeating unit of the structure represented by formula (G-1), formula (G-4), or formula (G-5) above. Examples of the repeating unit of the polyether structure include a repeating unit of the structure represented by formula (G-2) above. Examples of the repeating unit of the poly(meth)acrylic structure include a repeating unit of the structure represented by formula (G-3) above. Examples of the repeating unit of the polystyrene structure include a repeating unit of the structure represented by formula (G-6) above.

[0085] P １０ Examples of the repeating unit having an ethylenically unsaturated bond-containing group on the side chain that is contained in the polymer chain represented by formula (B1-1) include the repeating unit represented by formula (B1-1) above. １０ The proportion of repeating units having an ethylenically unsaturated bond-containing group in a side chain among all repeating units constituting the copolymer is preferably 1 mol % or more, more preferably 1 to 80 mol %. The upper limit is preferably 70 mol % or less, more preferably 60 mol % or less. The lower limit is preferably 2 mol % or more, more preferably 5 mol % or more.

[0086] P １０ The polymer chain represented by P preferably has a repeating unit containing an acid group. Examples of the acid group include a carboxy group, a phosphate group, a sulfo group, and a phenolic hydroxy group. １０When the polymer chain represented by contains a repeating unit having an acid group, P １０ The proportion of repeating units having an acid group in all repeating units constituting the formula (I) is preferably 1 to 80 mol %, more preferably 5 to 80 mol %, and even more preferably 10 to 80 mol %.

[0087] P １０ The weight average molecular weight of the polymer chain represented by is preferably 500 to 20,000. The lower limit is preferably 1,000 or more. The upper limit is preferably 10,000 or less, more preferably 5,000 or less, and even more preferably 3,000 or less.

[0088] The specific resin can be used as a binder or a dispersant.

[0089] (Other Resins) The photocurable composition of the present invention may further contain resins other than the specific resins described above (hereinafter also referred to as other resins).

[0090] As the other resin, it is preferable to use a resin having an acid group, such as a carboxy group, a phosphate group, a sulfo group, or a phenolic hydroxy group.

[0091] The acid value of the resin having acid groups is preferably 30 to 500 mgKOH / g. The lower limit is preferably 40 mgKOH / g or more, and more preferably 50 mgKOH / g or more. The upper limit is preferably 400 mgKOH / g or less, more preferably 300 mgKOH / g or less, and even more preferably 200 mgKOH / g or less. The weight average molecular weight (Mw) of the resin having acid groups is preferably 5,000 to 100,000, and more preferably 5,000 to 50,000. The number average molecular weight (Mn) of the resin having acid groups is preferably 1,000 to 20,000.

[0092] The resin having an acid group preferably contains a repeating unit having an acid group on a side chain, and more preferably contains 5 to 70 mol% of the repeating units having an acid group on a side chain based on all repeating units of the resin. The upper limit of the content of repeating units having an acid group on a side chain is preferably 50 mol% or less, more preferably 30 mol% or less. The lower limit of the content of repeating units having an acid group on a side chain is preferably 10 mol% or more, more preferably 20 mol% or more.

[0093] For resins having acid groups, please refer to the descriptions in paragraphs

[0558] to

[0571] of JP 2012-208494 A (corresponding to paragraphs

[0685] to

[0700] of U.S. Patent Application Publication No. 2012 / 0235099 A) and paragraphs

[0076] to

[0099] of JP 2012-198408 A, the contents of which are incorporated herein by reference. Alternatively, commercially available resins having acid groups can be used. There are no particular limitations on the method for introducing acid groups into the resin, and examples include the method described in Japanese Patent No. 6,349,629 A. Furthermore, examples of methods for introducing acid groups into the resin include a method in which an acid anhydride is reacted with a hydroxy group generated by a ring-opening reaction of an epoxy group to introduce the acid group.

[0094] As the other resin, a resin having a basic group can also be used. The resin having a basic group is preferably a resin containing a repeating unit having a basic group in the side chain, more preferably a copolymer having a repeating unit having a basic group in the side chain and a repeating unit not containing a basic group, and even more preferably a block copolymer having a repeating unit having a basic group in the side chain and a repeating unit not containing a basic group. The resin having a basic group can also be used as a dispersant. The amine value of the resin having a basic group is preferably 5 to 300 mgKOH / g. The lower limit is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more. The upper limit is preferably 200 mgKOH / g or less, more preferably 100 mgKOH / g or less.

[0095] Commercially available resins having basic groups include DISPERBYK-161, 162, 163, 164, 166, 167, 168, 174, 182, 183, 184, 185, 2000, 2001, 2050, 2150, 2163, 2164, and BYK-LPN6919 (all manufactured by BYK-Chemie), and Solsperse 112. 00, 13240, 13650, 13940, 24000, 26000, 28000, 32000, 32500, 32550, 32600, 33000, 34750, 35100, 35200, 37500, 38500, 39000, 53095, 56000, 7100 (all manufactured by The Lubrizol Group, Japan), Efka PX 4300, 4330, 4046, 4060, 4080 (all manufactured by BASF), and the like. In addition, the resin having a basic group may be the block copolymer (B) described in paragraphs 0063 to 0112 of JP-A-2014-219665, the block copolymer A1 described in paragraphs 0046 to 0076 of JP-A-2018-156021, or the vinyl resin having a basic group described in paragraphs 0150 to 0153 of JP-A-2019-184763, the contents of which are incorporated herein by reference.

[0096] It is also preferable to use a resin having an acid group and a resin having a basic group as the other resins. According to this embodiment, the storage stability of the photosensitive composition can be further improved. When a resin having an acid group and a resin having a basic group are used in combination, the content of the resin having a basic group is preferably 20 to 500 parts by mass, more preferably 30 to 300 parts by mass, and even more preferably 50 to 200 parts by mass, per 100 parts by mass of the resin having an acid group.

[0097] As the other resin, it is also preferable to use a resin having an aromatic carboxy group. In a resin having an aromatic carboxy group, the aromatic carboxy group may be contained in the main chain of the repeating unit or may be contained in the side chain of the repeating unit. The aromatic carboxy group is preferably contained in the main chain of the repeating unit. In this specification, an aromatic carboxy group refers to a group having a structure in which one or more carboxy groups are bonded to an aromatic ring. In the aromatic carboxy group, the number of carboxy groups bonded to the aromatic ring is preferably 1 to 4, and more preferably 1 to 2. Examples of resins having an aromatic carboxy group include the resins described in paragraphs 0082 to 0107 of WO 2021 / 166858.

[0098] The other resin is preferably at least one selected from the group consisting of graft polymers, star polymers, block copolymers, and resins in which at least one end of the polymer chain is capped with an acid group. Such resins are preferably used as dispersants.

[0099] Examples of graft polymers include resins having repeating units with graft chains. Examples of graft chains include graft chains containing at least one structure selected from a polyester structure, a polyether structure, a polystyrene structure, and a poly(meth)acrylic structure. The terminal structure of the graft chain is not particularly limited. It may be a hydrogen atom or a substituent. Examples of the substituent include an alkyl group, an alkoxy group, and an alkylthioether group. Of these, from the viewpoint of improving the dispersibility of the pigment, groups having a steric repulsion effect are preferred, and alkyl or alkoxy groups having 5 to 30 carbon atoms are preferred. The alkyl and alkoxy groups may be linear, branched, or cyclic, with linear or branched being preferred.

[0100] Specific examples of the graft polymer include the resins described in paragraphs 0025 to 0094 of JP-A-2012-255128, paragraphs 0022 to 0097 of JP-A-2009-203462, and paragraphs 0102 to 0166 of JP-A-2012-255128.

[0101] Examples of star polymers include resins having a structure in which multiple polymer chains are bonded to a core portion. Specific examples of star polymers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP 2013-043962 A.

[0102] The block copolymer is preferably a block copolymer of a polymer block having a repeating unit containing an acid group or a basic group (hereinafter also referred to as block A) and a polymer block having a repeating unit not containing an acid group or a basic group (hereinafter also referred to as block B). As the block copolymer, the block copolymer (B) described in paragraphs 0063 to 0112 of JP-A No. 2014-219665 and the block copolymer A1 described in paragraphs 0046 to 0076 of JP-A No. 2018-156021 can also be used, the contents of which are incorporated herein by reference.

[0103] The resin having at least one end of the polymer chain capped with an acid group includes a resin having a structure in which at least one end of the polymer chain containing at least one structure selected from a polyester structure, a polyether structure, and a poly(meth)acrylic structure is capped with an acid group. The acid group capping the end of the polymer chain includes a carboxy group, a sulfo group, and a phosphate group.

[0104] Other resins can also be used as dispersants. Examples of dispersants include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the term "acidic dispersant (acidic resin)" refers to a resin in which the amount of acid groups is greater than the amount of basic groups. As the acidic dispersant (acidic resin), a resin in which the amount of acid groups is 70 mol% or more is preferred when the total amount of the acid groups and the basic groups is 100 mol%. The acid group possessed by the acidic dispersant (acidic resin) is preferably a carboxy group. The acid value of the acidic dispersant (acidic resin) is preferably 10 to 105 mg KOH / g. Furthermore, the term "basic dispersant (basic resin)" refers to a resin in which the amount of basic groups is greater than the amount of acid groups. As the basic dispersant (basic resin), a resin in which the amount of basic groups is greater than 50 mol% is preferred when the total amount of the acid groups and the basic groups is 100 mol%. The basic group possessed by the basic dispersant is preferably an amino group.

[0105] Dispersants are also commercially available, and specific examples thereof include the Disperbyk series manufactured by BYK-Chemie (e.g., Disperbyk-111, 161, 2001, etc.), the Solsperse series manufactured by Lubrizol Japan Co., Ltd. (e.g., Solsperse 20000, 76500, etc.), the Ajisper series manufactured by Ajinomoto Fine-Techno Co., Ltd., A208F (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.), H-3606 (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.), and Sandet ET (manufactured by Sanyo Chemical Industries, Ltd.). In addition, the products described in paragraph 0129 of JP-A No. 2012-137564 and the products described in paragraph 0235 of JP-A No. 2017-194662 can also be used as dispersants.

[0106] The content of the resin in the total solid content of the photocurable composition is preferably 1 to 50% by mass, with the upper limit being preferably 40% by mass or less, and more preferably 30% by mass or less, and the lower limit being preferably 5% by mass or more, and more preferably 10% by mass or more.

[0107] The photocurable composition preferably contains 0.01 to 2 parts by mass of the specific compound per 100 parts by mass of the resin. The upper limit is preferably 1.5 parts by mass or less, more preferably 1.2 parts by mass or less, and even more preferably 1 part by mass or less. The lower limit is preferably 0.02 parts by mass or more, and more preferably 0.05 parts by mass or more.

[0108] The content of the above-described specific resin in the total solid content of the photocurable composition is preferably 1 to 50% by mass. The upper limit is preferably 40% by mass or less, and more preferably 30% by mass or less. The lower limit is preferably 5% by mass or more, and more preferably 10% by mass or more. The content of the above-described specific resin in the resin contained in the photocurable composition is preferably 2 to 100% by mass, more preferably 5 to 100% by mass, and even more preferably 10 to 100% by mass.

[0109] The photocurable composition preferably contains 0.01 to 2 parts by mass of the specific compound described above per 100 parts by mass of the specific resin described above. The upper limit is preferably 1.5 parts by mass or less, more preferably 1 part by mass or less, and even more preferably 0.5 parts by mass or less. The lower limit is preferably 0.02 parts by mass or more, and more preferably 0.05 parts by mass or more.

[0110] The photocurable composition of the present invention may contain only one resin or two or more resins. When two or more resins are contained, the total amount thereof is preferably within the above range.

[0111] <<Photopolymerization initiator>> The photocurable composition of the present invention contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, a compound that is photosensitive to light in the ultraviolet to visible region is preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

[0112] Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, α-aminoketone compounds, etc. From the viewpoint of exposure sensitivity, the photopolymerization initiator is preferably a trihalomethyltriazine compound, a benzyl dimethyl ketal compound, an α-hydroxyketone compound, an α-aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a hexaarylbiimidazole compound, an onium compound, a benzothiazole compound, a benzophenone compound, an acetophenone compound, a cyclopentadiene-benzene-iron complex, a halomethyloxadiazole compound, or a 3-aryl-substituted coumarin compound, more preferably a compound selected from an oxime compound, an α-hydroxyketone compound, an α-aminoketone compound, and an acylphosphine compound, and even more preferably an oxime compound. Further, as the photopolymerization initiator, compounds described in paragraphs 0065 to 0111 of JP-A-2014-130173, compounds described in Japanese Patent No. 6301489, compounds described in MATERIAL STAGE 37 to 60pp, vol. 19, No. 3,peroxide-based photopolymerization initiators described in WO 2019, photopolymerization initiators described in WO 2018 / 221177, photopolymerization initiators described in WO 2018 / 110179, photopolymerization initiators described in JP 2019-043864 A, photopolymerization initiators described in JP 2019-044030 A, peroxide-based initiators described in JP 2019-167313 A, aminoacetophenone-based initiators having an oxazolidine group described in JP 2020-055992 A, oxime-based photopolymerization initiators described in JP-A-2020-172619, polymers described in JP-A-2020-172619, compounds represented by formula 1 described in WO 2020 / 152120, compounds described in JP-A-2021-181406, photopolymerization initiators described in JP-A-2022-013379, compounds represented by formula (1) described in JP-A-2022-015747, fluorine-containing fluorene oxime ester-based photoinitiators described in JP-T-2021-507058, and those described in Chinese Patent Application Publication No. 110764367. Initiators described in JP-A-2022-518535, initiators described in WO 2021 / 175855, compounds described in Taiwan Patent Application Publication No. 202200534, compounds described in JP-A-2022-078550, compounds described in Korean Patent Publication No. 10-2017-0087330, compounds described in WO 2022 / 075452, oxime ester compounds described in Chinese Patent Application Publication No. 110066225, Korean Patent Publication No. 10-2022-0076157 Compounds described in WO 2019 / 013112, compounds having a triarylamine or N-arylcarbazole skeleton described in paragraphs 0042 to 0062, oxime ester photopolymerization initiators described in Japanese Patent No. 7219378, photopolymerization initiators described in Korean Patent Publication No. 10-2021-0146174, photopolymerization initiators described in WO 2019 / 013112, photopolymerization initiators described in JP 2023-033731, initiators described in JP 2022-515524, initiators described in JP 2023-517304, initiators described in Chinese Patent Publication No. 114149517, and the like.

[0113] Specific examples of the hexaarylbiimidazole compound include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-diphenyl-1,1'-biimidazole.

[0114] Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins B.V.), and Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF). Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (all manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, Irgacure 379EG (all manufactured by BASF), etc. Commercially available acylphosphine compounds include Omnirad 819, Omnirad TPO (all manufactured by IGM Resins B.V.), Irgacure 819, Irgacure TPO (all manufactured by BASF), etc.

[0115] Examples of the oxime compound include the compounds described in paragraph 0142 of WO 2022 / 085485, the compounds described in Japanese Patent No. 5430746, the compounds described in Japanese Patent No. 5647738, the compounds represented by the general formula (1) of JP-A-2021-173858, and the compounds described in paragraphs 0022 to 0024, and the compounds represented by the general formula (1) of JP-A-2021-170089 and the compounds described in paragraphs 0117 to 0120. Specific examples of the oxime compound include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyloxime), etc. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04, Irgacure OXE05, Irgacure OXE06, Irgacure OXE07, Irgacure OXE08, Irgacure OXE09, Irgacure OXE10, Irgacure OXE11, Irgacure OXE12, Irgacure OXE13, Irgacure OXE14, Irgacure OXE15, Irgacure OXE16, Irgacure OXE17, Irgacure OXE18, Irgacure OXE19, Irgacure OXE20, Irgacure OXE21, Irgacure OXE22, Irgacure OXE23, Irgacure OXE24, Irgacure OXE25, Irgacure OXE26, Irgacure OXE27, Irgacure OXE28, Irgacure OX OXE04 (all manufactured by BASF), TR-PBG-301, TR-PBG-304, TR-PBG-305, TR-PBG-309, TR-PBG-3054, TR-PBG-3057, TR-PBG-314, TR-PBG-327, TR-PBG-345, TR-PBG-346, TR- Examples of the oxime compound include PBG-358, TR-PBG-365, TR-PBG-380, TR-PBG-610, TR-PBG-A, and TR-PBG-B (all manufactured by TRONLY Corporation), and ADEKA OPTOMER N-1919 (manufactured by ADEKA Corporation; photopolymerization initiator 2 described in JP 2012-014052 A). In addition, it is also preferable to use, as the oxime compound, a compound that is not colorable or a compound that is highly transparent and does not easily discolor. Commercially available products include ADEKA ARCLES NCI-730, NCI-831, NCI-831E, and NCI-930 (all manufactured by ADEKA Corporation).

[0116] As the photopolymerization initiator, an oxime compound having a fluorene ring, an oxime compound having a skeleton in which at least one benzene ring of a carbazole ring is replaced with a naphthalene ring, an oxime compound having a fluorine atom, an oxime compound having a nitro group, an oxime compound having a benzofuran skeleton, an oxime compound in which a substituent having a hydroxy group is bonded to a carbazole skeleton, or a compound described in paragraphs 0143 to 0149 of WO 2022 / 085485 can also be used.

[0117] As the photopolymerization initiator, a compound represented by formula (OX-1) can also be used.

[0118] In formula (OX-1), X １ａ represents a divalent linking group containing at least one ring selected from the group consisting of an aromatic ring and a heterocyclic ring; １ａ represents a hydrogen atom or an acyl group; R ２ａ represents an alkyl group or an aryl group; R ３ａ and R ４ａ each independently represents a hydrogen atom or an alkyl group; Alk １ and Alk ２ each independently represents an alkyl group; R ３ａ and R ４ａ may be bonded to form a ring, Alk １ and Alk ２ may be bonded to form a ring, and n represents 0 or 1.

[0119] X in formula (OX-1) １ａ Examples of the divalent linking group represented by include a divalent aromatic ring group, a divalent heterocyclic group, a divalent group in which two or more aromatic rings are bonded via a single bond or a linking group, a divalent group in which two or more heterocycles are bonded via a single bond or a linking group, and a divalent group in which an aromatic ring and a heterocycle are bonded via a single bond or a linking group. Examples of the linking group that bonds the above-mentioned aromatic rings, heterocyclic groups, or aromatic rings and heterocycles include -CH ２ -, -O-, -CO-, -S-, -NR ｘ - and groups combining these. ｘrepresents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group.

[0120] X in formula (OX-1) １ａ is preferably a group represented by any one of formulas (X-1) to (X-13), more preferably a group represented by formula (X-1), formula (X-2), formula (X-4), formula (X-6) or formula (X-8), and further preferably a group represented by formula (X-2) or formula (X-6). In the formula R Ｘ１ ~R Ｘ９ each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group, and * represents a bond.

[0121] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, and more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0122] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkenyl group represented by is preferably 2 to 15, and more preferably 2 to 10. The alkenyl group may be linear, branched, or cyclic. The alkenyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0123] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkynyl group represented by is preferably 2 to 15, and more preferably 2 to 10. The alkynyl group may be linear, branched, or cyclic. The alkynyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0124] R Ｘ１ ~R Ｘ９The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group.

[0125] R Ｘ１ ~R Ｘ９ The heterocyclic group represented by is preferably a 5-membered or 6-membered ring. The heteroatoms contained in the heterocyclic group are preferably oxygen atoms, nitrogen atoms, and sulfur atoms. The number of heteroatoms contained in the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0126] R in formula (OX-1) １ａ represents a hydrogen atom or an acyl group, and is preferably an acyl group. １ａ The acyl group represented by is —C(O)—R １０１ It is preferable that R １０１ represents an aryl group or a heterocyclic group, and is preferably an aryl group.

[0127] R １０１ The number of carbon atoms in the aryl group represented by R is preferably 6 to 20, and more preferably 6 to 12. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group. １０１ The aryl group represented by is preferably a phenyl group, a methylphenyl group or a naphthyl group, more preferably a methylphenyl group or a naphthyl group.

[0128] R １０１ The heterocyclic group represented by is preferably a 5-membered or 6-membered ring. The heteroatoms contained in the heterocyclic group are preferably oxygen atoms, nitrogen atoms, and sulfur atoms. The number of heteroatoms contained in the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0129] R in formula (OX-1)２ａ represents an alkyl group or an aryl group, and is preferably an alkyl group because the reactivity of the generated radical is high. ２ａ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ２ａ The alkyl group represented by R is preferably an unsubstituted linear or branched alkyl group, and more preferably an unsubstituted linear alkyl group. ２ａ The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent, but is preferably an unsubstituted aryl group.

[0130] R in formula (OX-1) ３ａ and R ４ａ R each independently represents a hydrogen atom or an alkyl group, and is preferably a hydrogen atom. ３ａ and R ４ａ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ３ａ and R ４ａ may be bonded to form a ring. The ring formed is preferably a 5- or 6-membered ring, and more preferably a 5- or 6-membered aliphatic hydrocarbon ring.

[0131] Alk of formula (OX-1) １ and Alk ２each independently represents an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. Alk １ and Alk ２ may be bonded to form a ring, and preferably form a ring. The ring formed is preferably a 5- or 6-membered ring, more preferably a 5- or 6-membered aliphatic hydrocarbon ring, and more preferably a cyclopentane ring or a cyclohexane ring.

[0132] In formula (OX-1), n ​​represents 0 or 1, and is preferably 0.

[0133] Specific examples of the compound represented by formula (OX-1) include the compounds described in paragraphs 0092 to 0096 of JP-A No. 2012-113104 and the compound described in paragraph 0041 of JP-A No. 2012-189997.

[0134] As the photopolymerization initiator, a compound represented by formula (OX-2) can also be used.

[0135] In formula (OX-2), R １ｂ and R ２ｂ each independently represents a substituent, R ３ｂ ~R ７ｂ each independently represents a hydrogen atom or a substituent, Ar １ｂ represents an aromatic ring group or a heterocyclic group which may have a substituent; n represents 0 or 1;

[0136] R １ｂ and R ２ｂExamples of the substituent represented by include an alkyl group and an aryl group, and an alkyl group is preferred. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, an alkenyl group, an alkynyl group, and a heterocyclic group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms, even more preferably 6 to 10 carbon atoms, and particularly preferably 6 carbon atoms. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group.

[0137] R ３ｂ ~R ７ｂ Examples of the substituent represented by R include a halogen atom, an alkyl group, and an aryl group. Examples of the alkyl group and the aryl group include those described above. ３ｂ ~R ７ｂ is preferably a hydrogen atom.

[0138] Ar １ｂ represents an aromatic ring group or a heterocyclic group which may have a substituent, Ar １ｂ is preferably an aromatic ring group which may have a substituent. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group. Examples of the substituent include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an alkylthio group, an arylthio group, a nitro group, and an acyl group, and an acyl group is preferred. Examples of the acyl group include the acyl groups described above.

[0139] As the photopolymerization initiator, a compound represented by formula (OX-3) can also be used.

[0140] In formula (OX-3), Ar １ｃ represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group; Ar ２ｃ represents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group; R １ｃ ~R ３ｃeach independently represents a substituent; １ｃ is a single bond or CR １１ｃ R １２ｃ represents R １１ｃ and R １２ｃ each independently represents a hydrogen atom, an alkyl group, or an aryl group; １ｃ Ha-CH ２ represents --, --O-- or --S--; k represents 0 or 1; m represents an integer of 0 to 4; and n represents 0 or 1.

[0141] R １ｃ and R ２ｃ Examples of the substituent represented by include an alkyl group and an aryl group, and an alkyl group is preferred. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, an alkenyl group, an alkynyl group, and a heterocyclic group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms, even more preferably 6 to 10 carbon atoms, and particularly preferably 6 carbon atoms. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group. R ２ｃ is preferably an alkyl group having a branched or cyclic structure.

[0142] R ３ｃ Examples of the substituent represented by include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, and an acyl group, and an acyl group is preferred. Examples of the acyl group include the acyl groups described above.

[0143] L １ｃ is a single bond or CR １１ｃ R １２ｃ represents R １１ｃ and R １２ｃ R each independently represents a hydrogen atom, an alkyl group, or an aryl group. １１ｃ and R １２ｃ The alkyl group and aryl group in R １ｃ and R ２ｃWhen k is 1, L １ｃ is preferably a single bond.

[0144] X １ｃ is -CH ２ It represents -, -O- or -S-, and is preferably -O- or -S-.

[0145] Ar １ｃ represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group, and is preferably a (k+m+1)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0146] Ar ２ｃ represents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group, and is preferably a (k+2)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0147] k represents 0 or 1, and is preferably 0. m represents an integer of 0 to 4, and is preferably 0 or 1, and more preferably 1. n represents 0 or 1, and is preferably 0.

[0148] Specific examples of oxime compounds that can be preferably used in the present invention are shown below, but the present invention is not limited to these.

[0149]

[0150]

[0151]

[0152]

[0153] The oxime compound is preferably a compound having a maximum absorption wavelength in the wavelength range of 350 to 500 nm, and more preferably a compound having a maximum absorption wavelength in the wavelength range of 360 to 480 nm. Furthermore, from the viewpoint of sensitivity, the molar absorption coefficient of the oxime compound at a wavelength of 365 nm or 405 nm is preferably high, more preferably 1,000 to 300,000, even more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorption coefficient of the compound can be measured using a known method. For example, it is preferable to measure using a spectrophotometer (Varian Cary-5 spectrophotometer) at a concentration of 0.01 g / L using ethyl acetate as a solvent.

[0154] As the photopolymerization initiator, it is also preferable to use a combination of Irgacure OXE01 (manufactured by BASF) and / or Irgacure OXE02 (manufactured by BASF) and Omnirad 2959 (manufactured by IGM Resins B.V.).

[0155] As the photopolymerization initiator, a bifunctional or trifunctional or higher functional photoradical polymerization initiator may be used. By using such a photoradical polymerization initiator, two or more radicals are generated from one molecule of the photoradical polymerization initiator, thereby obtaining good sensitivity. Furthermore, when a compound with an asymmetric structure is used, crystallinity is reduced and solubility in solvents is improved, making it less likely to precipitate over time, thereby improving the storage stability of the photocurable composition. Specific examples of bifunctional or trifunctional or higher functional photoradical polymerization initiators include the compounds described in paragraph 0148 of WO 2022 / 065215.

[0156] The content of the photopolymerization initiator in the total solid content of the photocurable composition is preferably 0.1 to 20% by mass. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 1.5% by mass or more. The upper limit is preferably 15% by mass or less, more preferably 10% by mass or less.

[0157] The photocurable composition preferably contains 0.1 to 40 parts by mass of the specific compound per 100 parts by mass of the photopolymerization initiator. The upper limit is preferably 40 parts by mass or less, more preferably 20 parts by mass or less, and even more preferably 10 parts by mass or less. The lower limit is preferably 0.2 parts by mass or more, more preferably 0.5 parts by mass or more.

[0158] In the photocurable composition of the present invention, the photopolymerization initiator may be used alone or in combination with two or more types. When two or more types are used, the total amount thereof is preferably within the above range.

[0159] <<Colorant>> The photocurable composition of the present invention preferably contains a colorant. Examples of the colorant include a white colorant, a black colorant, a chromatic colorant, and an infrared-absorbing colorant. In the present invention, the white colorant includes not only pure white colorants but also light gray colorants close to white (e.g., off-white, light gray, etc.).

[0160] The coloring material may be a pigment or a dye. A pigment and a dye may be used in combination. The pigment may be either an inorganic pigment or an organic pigment, but is preferably an organic pigment from the viewpoints of a wide range of color variations, ease of dispersion, safety, etc. The coloring material preferably contains a pigment.

[0161] The average primary particle diameter of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. In this specification, the primary particle diameter of the pigment can be determined from a photograph obtained by observing the primary particles of the pigment with a transmission electron microscope. Specifically, the projected area of ​​the primary particles of the pigment is determined, and the corresponding circle-equivalent diameter is calculated as the primary particle diameter of the pigment.

[0162] The crystallite size of the pigment, determined from the half-width of a peak derived from any crystal plane in an X-ray diffraction spectrum obtained using CuKα radiation as an X-ray source, is preferably 0.1 to 100 nm, more preferably 0.5 to 50 nm, even more preferably 1 to 30 nm, and particularly preferably 5 to 25 nm.

[0163] The specific surface area of ​​the pigment is 1 to 300 m ２ / g. The lower limit is 10 m ２ / g or more, and ２ / g or more is more preferable. ２ / g or less, and ２ The value of the specific surface area can be determined according to the BET (Brunauer, Emmett and Teller) method in accordance with DIN 66131: Determination of the specific surface area of ​​solids by gas adsorption.

[0164] (Chromatic Colorant) Examples of chromatic colorants include colorants having a maximum absorption wavelength in the wavelength range of 400 to 700 nm, such as green colorants, red colorants, yellow colorants, purple colorants, blue colorants, and orange colorants.

[0165] Examples of the red colorant include a diketopyrrolopyrrole compound, an anthraquinone compound, an azo compound, a naphthol compound, an azomethine compound, a xanthene compound, a quinacridone compound, a perylene compound, and a thioindigo compound, and the like, preferably a diketopyrrolopyrrole compound, an anthraquinone compound, or an azo compound, and more preferably a diketopyrrolopyrrole compound. The red colorant is preferably a pigment (red pigment), and more preferably a diketopyrrolopyrrole pigment.

[0166] Specific examples of red colorants include C.I. (Color Index) Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, Examples of red pigments include 150,155,166,168,169,170,171,172,175,176,177,178,179,184,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246,254,255,264,269,270,272,279,291,294,295,296,297. In addition, as a red colorant, a compound described in paragraph number 0034 of WO 2022 / 085485, or a brominated diketopyrrolopyrrole compound described in JP-A-2020-085947 can also be used.

[0167] As the red colorant, C.I. Pigment Red 122, 177, 224, 254, 255, 264, 269, 272, and 291 are preferred, C.I. Pigment Red 254, 264, and 272 are more preferred, and C.I. Pigment Red 254 and 264 are even more preferred.

[0168] Examples of the green colorant include phthalocyanine compounds and squarylium compounds, and the phthalocyanine compounds are preferred. The green colorant is preferably a pigment (green pigment), and more preferably a phthalocyanine pigment.

[0169] Specific examples of green colorants include green pigments such as C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64, 65, and 66. Furthermore, halogenated zinc phthalocyanine pigments having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms per molecule can also be used as green colorants. Specific examples include the compounds described in WO 2015 / 118720. Furthermore, compounds described in paragraph 0029 of WO 2022 / 085485, aluminum phthalocyanine compounds described in JP-A 2020-070426, and diarylmethane compounds described in JP-A 2020-504758 can also be used as green colorants.

[0170] As the green colorant, C.I. Pigment Green 7, 36, 58, 62, and 63 are preferred.

[0171] Examples of orange colorants include diketopyrrolopyrrole compounds and azo compounds. The orange colorant is preferably a pigment (orange pigment). Specific examples of orange colorants include orange pigments such as C.I. Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, and 73.

[0172] Examples of the yellow colorant include an azo compound, an azomethine compound, an isoindoline compound, a pteridine compound, a quinophthalone compound, and a perylene compound. The yellow colorant is preferably a pigment (yellow pigment). Specific examples of the yellow colorant include C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125 , 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236 and the like.

[0173] As the yellow coloring material, an azobarbituric acid nickel complex having the following structure can also be used.

[0174] As the yellow colorant, the compounds described in paragraphs 0031 to 0033 of WO 2022 / 085485, the methine dyes described in JP-A 2019-073695, and the methine dyes described in JP-A 2019-073696 can be used.

[0175] Examples of the purple colorant include an oxazine compound, a quinacridone compound, a perylene compound, and an indigo compound, and the oxazine compound is preferred. The purple colorant is preferably a pigment (purple pigment). Specific examples of the purple colorant include purple pigments such as C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, and 61.

[0176] Examples of blue colorants include phthalocyanine compounds and squarylium compounds, with phthalocyanine compounds being preferred. The blue colorant is preferably a pigment (blue pigment). Specific examples of blue colorants include blue pigments such as C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, and 88. Furthermore, aluminum phthalocyanine compounds having phosphorus atoms can also be used as blue colorants. Specific examples include the compounds described in paragraphs 0022 to 0030 of JP-A No. 2012-247591 and paragraph 0047 of JP-A No. 2011-157478.

[0177] Dyes can also be used as chromatic colorants. There are no particular limitations on the dyes, and known dyes can be used. Examples include pyrazole azo dyes, anilino azo dyes, triarylmethane dyes, anthraquinone dyes, anthrapyridone dyes, benzylidene dyes, oxonol dyes, pyrazolotriazole azo dyes, pyridone azo dyes, cyanine dyes, phenothiazine dyes, pyrrolopyrazole azomethine dyes, xanthene dyes, phthalocyanine dyes, benzopyran dyes, indigo dyes, and pyrromethene dyes.

[0178] A dye polymer can also be used as a chromatic colorant. The dye polymer is preferably a dye dissolved in a solvent when used. The dye polymer may also form particles. When the dye polymer is particulate, it is typically used in a dispersed state in a solvent. A particulate dye polymer can be obtained, for example, by emulsion polymerization, and specific examples of the compounds and production methods described in JP-A 2015-214682 include those described in JP-A 2015-214682. The dye polymer has two or more dye structures in one molecule, preferably three or more dye structures. The upper limit is not particularly limited, but can be 100 or less. The multiple dye structures in one molecule may be the same dye structure or different dye structures. The weight-average molecular weight (Mw) of the dye polymer is preferably 2,000 to 50,000. The lower limit is more preferably 3,000 or more, and even more preferably 6,000 or more. The upper limit is more preferably 30,000 or less, and even more preferably 20,000 or less. As the dye multimer, compounds described in JP-A-2011-213925, JP-A-2013-041097, JP-A-2015-028144, JP-A-2015-030742, WO 2016 / 031442, etc. can also be used.

[0179] As chromatic colorants, triarylmethane dye polymers described in Korean Patent Publication No. 10-2020-0028160, xanthene compounds described in JP 2020-117638 A, phthalocyanine compounds described in WO 2020 / 174991 A, isoindoline compounds described in JP 2020-160279 A or salts thereof, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069442 A, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069730 A, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069070 A Compounds represented by the formula 1 described in Korean Patent Publication No. 10-2020-0069067, compounds represented by the formula 1 described in Korean Patent Publication No. 10-2020-0069062, halogenated zinc phthalocyanine pigments described in Japanese Patent No. 6809649, isoindoline compounds described in JP-A-2020-180176, phenothiazine compounds described in JP-A-2021-187913, halogenated zinc phthalocyanines described in WO 2022 / 004261, and halogenated zinc phthalocyanines described in WO 2021 / 250883 can be used. The chromatic colorant may be a rotaxane, and the dye skeleton may be used in the cyclic structure of the rotaxane, in the rod-shaped structure, or in both structures. As chromatic colorants, quinophthalone compounds represented by formula 1 in Korean Patent Publication No. 10-2020-0030759, polymer dyes described in Korean Patent Publication No. 10-2020-0061793, chromatic colorants described in JP-A-2022-029701, isoindoline compounds described in WO 2022 / 014635, aluminum phthalocyanine compounds described in WO 2022 / 024926, and JP-A-2022-045 Compounds described in Patent Publication No. 895, compounds described in WO 2022 / 050051, compounds described in JP 2020-090676, compounds described in JP 2020-055956, compounds described in JP 2021-031681, compounds described in JP 2022-056354, compounds described in US Patent Application Publication No. 2021 / 0355327, compounds described in WO 2022 / 065357,Compounds described in JP 2020-045436 A, compounds described in Korean Patent Publication No. 10-2021-0146726 A, compounds described in JP 2018-178039 A, compounds described in Chinese Patent Application Publication No. 113881244 A, compounds described in Chinese Patent Application Publication No. 113881245 A, compounds described in Chinese Patent Application Publication No. 113881246 A, compounds described in JP 2022-104822 A, compounds described in JP 2022-096701 A, compounds described in JP 2020- Compounds described in JP-A-023652, green pigments described on pages 80 to 84 of the Journal of the Color Materials Association (published in 2022), compounds described in JP-A-2022-143135, compounds described in JP-A-2022-140287, compounds described in WO 2022 / 136308, perylene compounds described in Chinese Patent Application Publication No. 113061349, cyan pigments described in Korean Patent Publication No. 10-2017-0018993, isoindoline compounds described in JP-A-2020-180176, Compounds described in JP-A-3-013209, compounds described in JP-A-2023-013166, xanthene compounds described in WO 2023 / 286526, compounds described in JP-A-2021-155746, compounds described in JP-A-2021-155747, compounds described in JP-A-2021-155748, compounds described in JP-A-2021-155749, compounds described in WO 2018 / 051876, compounds described in JP-A-2020-083981, JP-A-2023-05 Compounds described in JP-A-6463, compounds described in JP-T-2023-515473, dioxane compounds described in JP-T-2022-549530, pigment preparations described in JP-A-2022-061494, diketopyrrolopyrrole pigments described in JP-A-2023-057917, diketopyrrolopyrrole compounds described in JP-A-2023-061273, phthalocyanines described in JP-T-2023-519314, and quinophthalones described in JP-A-2023-080419 can also be used.

[0180] Two or more chromatic colorants may be used in combination. When two or more chromatic colorants are used in combination, the combination of the two or more chromatic colorants may form a black color. Examples of such combinations include the following embodiments (1) to (7). When the photocurable composition contains two or more chromatic colorants and exhibits a black color through the combination of the two or more chromatic colorants, the photocurable composition of the present invention can be preferably used as a photocurable composition for forming an infrared transmission filter. (1) An embodiment containing a red colorant and a blue colorant. (2) An embodiment containing a red colorant, a blue colorant, and a yellow colorant. (3) An embodiment containing a red colorant, a blue colorant, a yellow colorant, and a purple colorant. (4) An embodiment containing a red colorant, a blue colorant, a yellow colorant, a purple colorant, and a green colorant. (5) An embodiment containing a red colorant, a blue colorant, a yellow colorant, and a green colorant. (6) An embodiment containing a red color material, a blue color material, and a green color material. (7) An embodiment containing a yellow color material and a purple color material.

[0181] (White coloring material) Examples of the white coloring material include inorganic pigments such as titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silica, talc, mica, aluminum hydroxide, calcium silicate, aluminum silicate, and zinc sulfide. As the white coloring material, the white pigments described in paragraphs 0040 to 0043 of WO 2022 / 085485 can be used.

[0182] (Black Colorant) The black colorant is not particularly limited, and known materials can be used. The black colorant may be an inorganic black colorant or an organic black colorant. The black colorant is preferably a pigment. In this specification, the black colorant refers to a colorant that exhibits absorption over the entire wavelength range of 400 to 700 nm.

[0183] Examples of inorganic black colorants include carbon black, titanium black, graphite, etc., with carbon black and titanium black being preferred, and titanium black being more preferred. Titanium black is a black particle containing titanium atoms, and low-order titanium oxide or titanium oxynitride is preferred. As the titanium black, the titanium black described in paragraph 0044 of WO 2022 / 085485 can be used. As the inorganic black colorant, zirconium nitride powder described in JP 2023-048173 A can also be used.

[0184] Examples of organic black colorants include bisbenzofuranone compounds, azomethine compounds, perylene compounds, and azo compounds, with bisbenzofuranone compounds and perylene compounds being preferred. The organic black colorant may be a compound described in paragraph 0166 of International Publication No. 2022 / 065215. Furthermore, examples of organic black colorants include perylene black (such as Lumogen Black FK4280) described in paragraphs 0016 to 0020 of JP-A-2017-226821 and black azo pigments described in JP-A-2022-121935.

[0185] The black coloring material may be any of those described in pages 294 to 307 of the Journal of the Color Materials Association, Vol. 96, No. 9, 2023.

[0186] (Infrared absorbing colorant) The infrared absorbing colorant is preferably a compound having a maximum absorption wavelength longer than 700 nm. The infrared absorbing colorant is preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1800 nm, more preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1400 nm, even more preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1200 nm, and particularly preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1000 nm. In addition, the absorbance A of the infrared absorbing colorant at a wavelength of 500 nm is １ and absorbance A at the maximum absorption wavelength ２ Ratio A １ / A ２is preferably 0.08 or less, and more preferably 0.04 or less. The infrared absorbing colorant is preferably a pigment, and more preferably an organic pigment.

[0187] Examples of infrared absorbing colorants include pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, dithiolene metal complexes, metal oxides, metal borides, etc. Specific examples of these include the compounds described in paragraph 0114 of WO 2022 / 065215.Examples of infrared absorbing colorants include the compounds described in paragraph 0121 of WO 2022 / 065215, squarylium compounds described in JP 2020-075959 A, copper complexes described in Korean Patent Publication No. 10-2019-0135217, croconic acid compounds described in JP 2021-195515 A, infrared absorbing dyes described in JP 2022-022070 A, croconium compounds described in WO 2019 / 021767, compounds described in JP 2019-127549 A, compounds described in WO 2022 / 059619, and compounds described in JP Compounds described in JP-A-2022-151682, squarylium compounds described in JP-A-2022-188858, compounds described in JP-A-2022-184710, compounds described in JP-A-2022-189736, squarylium compounds described in JP-A-2023-004570, squarylium compounds described in WO 2019 / 230660, squarylium compounds described in WO 2020 / Compounds described in JP-A-2023-068643, diiminium compounds described in JP-A-2023-068643, squarylium compounds described in JP-A-2023-052770, phthalocyanine compounds described in Korean Patent Publication No. 10-2022-0163680, indigo monoboron complexes described in JP-A-2023-073064, phthalocyanine compounds described in JP-A-2023-066025 It is also possible to use the following compounds: phthalocyanine compounds described in JP 2020-041127 A; indigo compounds described in JP 2023-073064 A; indigo compounds described in Korean Patent Publication No. 10-2023-0016355 A; squarylium compounds described in WO 2019 / 230570 A; and diiminium compounds described in JP 2023-095824 A.

[0188] The content of the colorant in the total solid content of the photocurable composition is preferably 30 to 80% by mass. The upper limit is preferably 70% by mass or less, and more preferably 65% ​​by mass or less. The lower limit is preferably 35% by mass or more, more preferably 40% by mass or more, and even more preferably 45% by mass or more.

[0189] The content of the pigment in the total solid content of the photocurable composition is preferably 20 to 80% by mass. The upper limit is preferably 75% by mass or less, more preferably 65% ​​by mass or less, and even more preferably 63% by mass or less. The lower limit is preferably 25% by mass or more, more preferably 30% by mass or more, and even more preferably 35% by mass or more.

[0190] The content of the pigment in the coloring material is preferably 20 to 100% by mass, more preferably 50 to 100% by mass, and even more preferably 70 to 100% by mass.

[0191] In the photocurable composition of the present invention, only one coloring material may be used, or two or more coloring materials may be used. When two or more coloring materials are used, the total amount thereof is preferably within the above range.

[0192] <<Ammonium cation compound (compound having a quaternary ammonium cation)>> The photocurable composition of the present invention preferably contains a compound having a quaternary ammonium cation. According to this embodiment, the adhesion and solvent resistance of the obtained film can be further improved. Hereinafter, the compound having a quaternary ammonium cation is also referred to as an ammonium cation compound.

[0193] The ammonium cation compound may be a low molecular weight compound or a high molecular weight compound. A low molecular weight compound and a high molecular weight compound may be used in combination. When a low molecular weight compound and a high molecular weight compound are used in combination, the ratio is preferably 0.1 to 15 parts by mass of the low molecular weight compound per 100 parts by mass of the high molecular weight compound. The upper limit is preferably 12 parts by mass or less, and more preferably 10 parts by mass or less. The lower limit is preferably 0.5 parts by mass or more, and more preferably 1 part by mass or more.

[0194] When the ammonium cation compound is a low molecular weight compound, its molecular weight is preferably 600 or less, and more preferably 450 or less.

[0195] The ammonium cation compound, which is a low molecular weight compound, is preferably a salt of an ammonium cation and an anion.

[0196] The ammonium cation includes a cation represented by formula (Am-1). In formula (Am-1), R Ａｍ１ ~R Ａｍ４ each independently represents an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, or an aryl group, and the hydrogen atoms contained therein are not substituted with -OH, -OCO-CH=CH ２ or —OCO—CH═CHR ｂ In addition, between the carbon-carbon bonds of the alkyl group and the alkenyl group, there may be substituted with —O—, —S—, —CO—, —NH— or —NR ｂ - may be inserted. Ａｍ１ ~R Ａｍ４ may be bonded to each other to form a 3- to 10-membered heterocyclic ring containing a nitrogen atom. In this case, a hydrogen atom contained in the heterocyclic ring may be substituted by -R ｂ or may be substituted with —OH. ｂ represents an alkyl group having 1 to 10 carbon atoms.

[0197] Specific examples of ammonium cations include tetramethylammonium cation, tetraethylammonium cation, tetrapropylammonium cation, tetrabutylammonium cation, monoethyltrimethylammonium cation, monopropyltrimethylammonium cation, monobutyltrimethylammonium cation, monostearyltritylammonium cation, distearyldimethylammonium cation, tristearylmonomethylammonium cation, stearyltrimethylammonium cation, trioctylmethylammonium cation, dioctyldimethylammonium cation, monolauryltrimethylammonium cation, dilauryldimethylammonium cation, trilaurylmethylammonium cation, triamylbenzylammonium cation, trihexylbenzylammonium cation, trioctylbenzylammonium cation, trilaurylbenzylammonium chloride cation, benzyldimethylstearylammonium cation, benzyldimethyloctylammonium cation, dialkyl (alkyl is C14 to C18)dimethylammonium cation, and cations having the structure shown below.

[0198] Examples of anions that form salts with ammonium cations include halide anions, hydroxide anions, alkoxide anions, phenoxide anions, amide anions (including amides substituted with acyl groups or sulfonyl groups), imide anions (including imides substituted with acyl groups or sulfonyl groups), anilide anions (including anilides substituted with acyl groups or sulfonyl groups), thiolate anions, hydrogen carbonate anions, carboxylate anions, thiocarboxylate anions, dithiocarboxylate anions, hydrogen sulfate anions, sulfonate anions, dihydrogen phosphate anions, phosphoric acid diester anions, phosphonic acid monoester anions, hydrogen phosphonate anions, phosphinate anions, nitrogen-containing heterocyclic anions, nitrate anions, hypochlorite anions, cyanide anions, cyanate anions, isocyanate anions, thiocyanate anions, isothiocyanate anions, and azide anions.

[0199] The ammonium cation compound may be a compound having a betaine structure having a quaternary ammonium cation moiety and an anion moiety in the same molecule. Ａｍ－４ Examples of the anion moiety include a structure in which any hydrogen atom of the group represented by the following formula is substituted with an anion moiety. Examples of the anion moiety include the above-mentioned anions, and a carboxylate anion is preferred.

[0200] When the compound having a quaternary ammonium cation is a polymeric compound, its weight average molecular weight is preferably 2,000 to 50,000. The lower limit is preferably 3,000 or more, and more preferably 5,000 or more. The upper limit is preferably 40,000 or less, and more preferably 30,000 or less.

[0201] The ammonium cationic compound, which is a polymeric compound, is preferably a salt of a polymer having a quaternary ammonium cationic group and an anion. Such an ammonium cationic compound is also a material that corresponds to a resin.

[0202] Examples of the anion include those mentioned above.

[0203] The quaternary ammonium cationic group contained in the polymer is preferably a group represented by formula (Cat-1).

[0204] In the formula, R ｃａｔ１ ~R ｃａｔ３ each independently represents an alkyl group or an aryl group, and * represents a bond.

[0205] R ｃａｔ１ ~R ｃａｔ３ The number of carbon atoms in the alkyl group represented by R is preferably 1 to 20, more preferably 1 to 10, and even more preferably 1 to 5. ｃａｔ１ ~R ｃａｔ３ The alkyl group represented by R is preferably linear or branched, and more preferably linear. ｃａｔ１ ~R ｃａｔ３The aryl group represented by the formula (I) preferably has 6 to 20 carbon atoms, and more preferably has 6 to 12 carbon atoms.

[0206] R ｃａｔ１ ~R ｃａｔ３ are preferably each independently an alkyl group. ｃａｔ１ and R ｃａｔ２ are each independently preferably an alkyl group having 1 to 5 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, further preferably a methyl group or an ethyl group, and particularly preferably a methyl group. ｃａｔ３ is preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 5 carbon atoms, even more preferably an alkyl group having 1 to 3 carbon atoms, still more preferably a methyl group or an ethyl group, and particularly preferably a methyl group.

[0207] The polymer having a quaternary ammonium cationic group is preferably a polymer having a quaternary ammonium cationic group on the side chain.

[0208] The weight average molecular weight of the polymer having a quaternary ammonium cation group is preferably 2,000 to 50,000. The lower limit is preferably 3,000 or more, more preferably 5,000 or more. The upper limit is preferably 40,000 or less, more preferably 30,000 or less.

[0209] The content of the ammonium cationic compound in the total solid content of the photocurable composition is preferably 0.1 to 40% by mass. Furthermore, when the ammonium cationic compound is a low molecular weight compound, the content of the ammonium cationic compound in the total solid content of the photocurable composition is preferably 0.1 to 10% by mass. The upper limit is preferably 8% by mass or less, and more preferably 5% by mass or less. The lower limit is preferably 0.2% by mass or more, and more preferably 0.5% by mass or more. Furthermore, when the ammonium cationic compound is a polymeric compound, the content of the ammonium cationic compound in the total solid content of the photocurable composition is preferably 5 to 40% by mass. The upper limit is preferably 35% by mass or less, and more preferably 30% by mass or less. The lower limit is preferably 10% by mass or more, and more preferably 15% by mass or more.

[0210] In the photocurable composition of the present invention, the ammonium cation compound may be used alone or in combination with two or more kinds. When two or more kinds are used, it is preferable that the total amount thereof is in the above range.

[0211] <<Solvent>> The photocurable composition of the present invention preferably contains a solvent. Examples of the solvent include organic solvents. The type of solvent is basically not particularly limited as long as the solubility of each component and the coatability of the composition are satisfied. Examples of organic solvents include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. For details of these, please refer to paragraph

[0223] of WO 2015 / 166779, the contents of which are incorporated herein by reference. Furthermore, ester-based solvents substituted with a cyclic alkyl group and ketone-based solvents substituted with a cyclic alkyl group can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether ... Examples of suitable ethylene glycol monomethyl ether acetate include 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, gamma butyrolactone, sulfolane, anisole, 1,4-diacetoxybutane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, and isopropyl alcohol.However, it may be preferable to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents for environmental reasons (for example, the amount may be 50 ppm by mass (parts per million) or less, 10 ppm by mass or less, or 1 ppm by mass or less, relative to the total amount of organic solvents).

[0212] The metal content of the organic solvent is preferably low. The metal content of the organic solvent is preferably, for example, 10 parts per billion (ppb) by mass or less. If necessary, an organic solvent having a metal content of ppt (parts per trillion) by mass may be used, and such an organic solvent is provided, for example, by Toyo Gosei Co., Ltd. (The Chemical Daily, November 13, 2015).

[0213] Methods for removing impurities such as metals from organic solvents include, for example, distillation (molecular distillation, thin-film distillation, etc.) and filtration using a filter. The pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene, or nylon.

[0214] The organic solvent may contain isomers (compounds having the same number of atoms but different structures). The organic solvent may contain only one type of isomer or multiple types of isomers.

[0215] The organic solvent preferably has a peroxide content of 0.8 mmol / L or less, and more preferably contains substantially no peroxide.

[0216] The content of the solvent in the photocurable composition is preferably from 10 to 95% by mass, more preferably from 20 to 90% by mass, and even more preferably from 30 to 90% by mass.

[0217] From the viewpoint of environmental regulations, the photocurable composition of the present invention preferably does not substantially contain environmentally restricted substances. In the present invention, "substantially does not contain environmentally restricted substances" means that the content of environmentally restricted substances in the photocurable composition is 50 ppm by mass or less, preferably 30 ppm by mass or less, more preferably 10 ppm by mass or less, and particularly preferably 1 ppm by mass or less. Examples of environmentally restricted substances include benzene; alkylbenzenes such as toluene and xylene; and halogenated benzenes such as chlorobenzene. These substances are registered as environmentally restricted substances under the REACH (Registration Evaluation Authorization and Restriction of Chemicals) regulations, the PRTR (Pollutant Release and Transfer Register) Act, the VOC (Volatile Organic Compounds) regulations, etc., and their usage amounts and handling methods are strictly regulated. These compounds may be used as solvents when producing the components used in the photocurable composition, and may be mixed into the photocurable composition as residual solvents. From the viewpoints of human safety and environmental considerations, it is preferable to reduce these substances as much as possible. Examples of methods for reducing environmentally restricted substances include heating or reducing the pressure in the system to a temperature above the boiling point of the environmentally restricted substance, thereby distilling off the environmentally restricted substance from the system. Furthermore, when distilling off a small amount of environmentally regulated substances, it is useful to perform azeotropy with a solvent having a boiling point equivalent to that of the solvent in question in order to increase efficiency. Furthermore, when a radically polymerizable compound is contained, a polymerization inhibitor or the like may be added prior to distillation under reduced pressure to prevent intermolecular crosslinking due to the progress of a radical polymerization reaction during distillation under reduced pressure. These distillation methods can be used at any stage, such as the stage of raw materials, the stage of a product obtained by reacting the raw materials (e.g., a resin solution or a polyfunctional monomer solution after polymerization), or the stage of a photocurable composition prepared by mixing these compounds.

[0218] <<Pigment Derivative>> The photocurable composition of the present invention can contain a pigment derivative. The pigment derivative is used as a dispersing aid. A dispersing aid is a material that enhances the dispersibility of a colorant such as a pigment in a photocurable composition. Examples of the pigment derivative include compounds having at least one structure selected from the group consisting of a dye structure and a triazine structure, and an acid group or a basic group.

[0219] Examples of the dye structure include a quinoline dye structure, a benzimidazolone dye structure, a benzisoindole dye structure, a benzothiazole dye structure, an iminium dye structure, a squarylium dye structure, a croconium dye structure, an oxonol dye structure, a pyrrolopyrrole dye structure, a diketopyrrolopyrrole dye structure, an azo dye structure, an azomethine dye structure, a phthalocyanine dye structure, a naphthalocyanine dye structure, an anthraquinone dye structure, a quinacridone dye structure, a dioxazine dye structure, a perinone dye structure, a perylene dye structure, a thiazineindigo dye structure, a thioindigo dye structure, an isoindoline dye structure, an isoindolinone dye structure, a quinophthalone dye structure, a dithiol dye structure, a triarylmethane dye structure, and a pyrromethene dye structure.

[0220] Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, a boronic acid group, a carboxylic acid amide group, a sulfonamide group, an imidic acid group, and salts thereof. Examples of the atom or atomic group constituting the salt include an alkali metal ion (Li ＋ , Na ＋ , K. ＋ etc.), alkaline earth metal ions (Ca ２＋ , Mg ２＋ Examples of the carboxylic acid amide group include -NHCOR, ... Ｘ１ As the sulfonamide group, a group represented by -NHSO is preferred. ２ R Ｘ２ As the imide acid group, a group represented by -SO ２ NHSO ２ R Ｘ３ , -CONHSO ２ R Ｘ４, -CONHCOR Ｘ５ or -SO ２ NHCOR Ｘ６ A group represented by the formula: ２ NHSO ２ R Ｘ３ is more preferred. Ｘ１ ~R Ｘ６ R each independently represents an alkyl group or an aryl group. Ｘ１ ~R Ｘ６ The alkyl group and aryl group represented by may have a substituent. The substituent is preferably a halogen atom, more preferably a fluorine atom.

[0221] Examples of basic groups include amino groups, pyridinyl groups and their salts, ammonium salts, and phthalimidomethyl groups. Examples of atoms or atomic groups that constitute salts include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.

[0222] Specific examples of pigment derivatives include compounds described in paragraphs 0037 to 0054 of WO 2016 / 035695, compounds described in paragraphs 0061 to 0086 of WO 2017 / 146092, compounds described in paragraphs 0017 to 0068 of WO 2018 / 230387, compounds described in paragraphs 0085 to 0099 of WO 2020 / 054718, compounds described in paragraph 0099 of WO 2020 / 054718, compounds described in paragraph 0124 of WO 2022 / 085485, benzimidazolone compounds or salts thereof described in JP-A-2018-168244, and compounds having an isoindoline skeleton described in the general formula (1) of Japanese Patent No. 6996282.

[0223] The content of the pigment derivative is preferably 1 to 50 parts by mass relative to 100 parts by mass of the pigment. The lower limit is preferably 3 parts by mass or more, and more preferably 5 parts by mass or more. The upper limit is preferably 40 parts by mass or less, and more preferably 30 parts by mass or less. The photocurable composition may contain only one type of pigment derivative, or may contain two or more types. When two or more types are contained, the total amount thereof is preferably within the above range.

[0224] <<Polyalkyleneimine>> The photocurable composition of the present invention may also contain a polyalkyleneimine. The polyalkyleneimine is used, for example, as a dispersing aid for pigments. The polyalkyleneimine is a polymer obtained by ring-opening polymerization of an alkyleneimine. The polyalkyleneimine is preferably a polymer having a branched structure containing a primary amino group, a secondary amino group, and a tertiary amino group. The alkyleneimine preferably has 2 to 6 carbon atoms, more preferably 2 to 4 carbon atoms, even more preferably 2 or 3 carbon atoms, and particularly preferably 2 carbon atoms.

[0225] The molecular weight of the polyalkyleneimine is preferably 200 or more, more preferably 250 or more. The upper limit is preferably 100,000 or less, more preferably 50,000 or less, even more preferably 10,000 or less, and particularly preferably 2,000 or less. Regarding the molecular weight value of the polyalkyleneimine, if the molecular weight can be calculated from the structural formula, the molecular weight of the polyalkyleneimine is the value calculated from the structural formula. On the other hand, if the molecular weight of the specific amine compound cannot be calculated from the structural formula or calculation is difficult, the number average molecular weight value measured by the boiling point elevation method is used. If the number average molecular weight cannot be measured by the boiling point elevation method or is difficult to measure, the number average molecular weight value measured by the viscosity method is used. If the number average molecular weight cannot be measured by the viscosity method or is difficult to measure, the number average molecular weight value measured in terms of polystyrene by GPC (gel permeation chromatography) is used.

[0226] The amine value of the polyalkyleneimine is preferably 5 mmol / g or more, more preferably 10 mmol / g or more, and even more preferably 15 mmol / g or more.

[0227] Specific examples of alkyleneimines include ethyleneimine, propyleneimine, 1,2-butyleneimine, and 2,3-butyleneimine, with ethyleneimine or propyleneimine being preferred, and ethyleneimine being more preferred. It is particularly preferred that the polyalkyleneimine be polyethyleneimine. Furthermore, the polyethyleneimine preferably contains primary amino groups in an amount of 10 mol% or more, more preferably 20 mol% or more, and even more preferably 30 mol% or more, based on the total of primary amino groups, secondary amino groups, and tertiary amino groups. Commercially available polyethyleneimines include Epomin SP-003, SP-006, SP-012, SP-018, SP-200, and P-1000 (all manufactured by Nippon Shokubai Co., Ltd.).

[0228] The content of the polyalkyleneimine in the total solids content of the photocurable composition is preferably 0.1 to 5% by mass. The lower limit is preferably 0.2% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more. The upper limit is preferably 4.5% by mass or less, more preferably 4% by mass or less, and even more preferably 3% by mass or less. The content of the polyalkyleneimine is preferably 0.5 to 20 parts by mass per 100 parts by mass of the pigment. The lower limit is preferably 0.6 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 2 parts by mass or more. The upper limit is preferably 10 parts by mass or less, and even more preferably 8 parts by mass or less. Only one type of polyalkyleneimine may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount thereof is within the above range.

[0229] <<Compound Having a Cyclic Ether Group>> The photocurable composition of the present invention can contain a compound having a cyclic ether group. Examples of the cyclic ether group include an epoxy group and an oxetanyl group. The epoxy group may be an alicyclic epoxy group. The alicyclic epoxy group refers to a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are condensed. The compound having a cyclic ether group is preferably a compound having an epoxy group (hereinafter also referred to as an epoxy compound). Examples of epoxy compounds include compounds having one or more epoxy groups per molecule, and compounds having two or more epoxy groups are preferred. The epoxy compound is preferably a compound having 1 to 100 epoxy groups per molecule. The upper limit of the number of epoxy groups contained in the epoxy compound can be, for example, 10 or less, or 5 or less. The lower limit of the number of epoxy groups contained in the epoxy compound is preferably 2 or more.

[0230] Examples of compounds having a cyclic ether group include the compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, 0147 to 0156 of JP-A-2014-043556, and 0085 to 0092 of JP-A-2014-089408, and the compounds described in JP-A-2017-179172, the xanthene epoxy resins described in JP-A-2021-195421, and the xanthene epoxy resins described in JP-A-2021-195422 can be used.

[0231] The compound having a cyclic ether group may be a low molecular weight compound (for example, a molecular weight of less than 2000, or even less than 1000) or a high molecular weight compound (macromolecule) (for example, a molecular weight of 1000 or more, and in the case of a polymer, a weight average molecular weight of 1000 or more). The weight average molecular weight of the compound having a cyclic ether group is preferably 200 to 100,000, and more preferably 500 to 50,000. The upper limit of the weight average molecular weight is preferably 10,000 or less, more preferably 5,000 or less, and even more preferably 3,000 or less.

[0232] Commercially available examples of compounds having a cyclic ether group include EHPE3150 (manufactured by Daicel Corporation), EPICLON N-695 (manufactured by DIC Corporation), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, and G-01758 (all manufactured by NOF Corporation, epoxy group-containing polymers).

[0233] The content of the compound having a cyclic ether group in the total solid content of the photocurable composition is preferably 0.1 to 20% by mass. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is preferably 15% by mass or less, and more preferably 10% by mass or less. Only one type of compound having a cyclic ether group may be used, or two or more types may be used. When two or more types are used, the total amount thereof preferably falls within the above range.

[0234] <<Curing Accelerator>> The photocurable composition of the present invention may contain a curing accelerator. Examples of the curing accelerator include thiol compounds, methylol compounds, amine compounds, phosphonium salt compounds, amidine salt compounds, amide compounds, base generators, isocyanate compounds, alkoxysilane compounds, and onium salt compounds. Specific examples of the curing accelerator include the compounds described in paragraph 0164 of WO 2022 / 085485 and the compounds described in JP 2021-181406 A. The content of the curing accelerator in the total solids content of the photocurable composition is preferably 0.3 to 8.9% by mass, more preferably 0.8 to 6.4% by mass.

[0235] <<UV Absorber>> The photocurable composition of the present invention may contain an UV absorber. Examples of UV absorbers include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, triazine compounds, and dibenzoyl compounds. Specific examples of such compounds include the compound described in paragraph 0179 of WO 2022 / 085485, the reactive triazine UV absorber described in JP 2021-178918 A, the UV absorber described in JP 2022-007884 A, the compound described in Korean Patent Publication No. 10-2022-0014454, and the compound described in JP 2023-013321 A can also be used. The content of the UV absorber in the total solids content of the photocurable composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. The ultraviolet absorber may be used alone or in combination of two or more kinds. When two or more kinds are used, the total amount thereof is preferably in the above range.

[0236] <<Polymerization Inhibitor>> The photocurable composition of the present invention may contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-t-butylphenol), and N-nitrosophenylhydroxyamine salts (ammonium salts, cerous salts, etc.). Of these, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solids content of the photocurable composition is preferably 0.0001 to 5 mass%. One type of polymerization inhibitor may be used alone, or two or more types may be used. When two or more types are used, the total amount preferably falls within the above range.

[0237] <<Silane Coupling Agent>> The photocurable composition of the present invention may contain a silane coupling agent. Examples of the silane coupling agent include silane compounds having a hydrolyzable group, and preferably silane compounds having both a hydrolyzable group and another functional group. The hydrolyzable group refers to a substituent directly bonded to a silicon atom that can form a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, and an acyloxy group, with an alkoxy group being preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Examples of functional groups other than the hydrolyzable group include a vinyl group, a (meth)allyl group, a (meth)acryloyl group, a mercapto group, an epoxy group, an oxetanyl group, an amino group, a ureido group, a sulfide group, an isocyanate group, and a phenyl group, with an amino group, a (meth)acryloyl group, and an epoxy group being preferred. Specific examples of the silane coupling agent include the compound described in paragraph 0177 of WO 2022 / 085485 and the compound described in JP 2019-183020 A. The content of the silane coupling agent in the total solid content of the photocurable composition is preferably 0.1 to 15% by mass. The upper limit is preferably 10% by mass or less, more preferably 5% by mass or less. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more. Only one type of silane coupling agent may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount be in the above range.

[0238] <<Surfactant>> The photocurable composition of the present invention may contain a surfactant. As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant can be used. The surfactant is preferably a silicone-based surfactant or a fluorine-based surfactant, and more preferably a silicone-based surfactant. For details of the surfactant, reference can be made to the surfactants described in paragraphs 0238 to 0245 of WO 2015 / 166779, the contents of which are incorporated herein by reference.

[0239] As the fluorine-based surfactant, compounds described in paragraphs 0167 to 0173 of WO 2022 / 085485 can be used.

[0240] Examples of nonionic surfactants include the compounds described in paragraph 0174 of WO 2022 / 085485.

[0241] Silicone surfactants include DOWSIL SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, and SF 8419. OIL (all manufactured by Dow Toray Industries, Inc.), TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (all manufactured by BYK-Chemie). Furthermore, compounds having the following structure can also be used as the silicone surfactant.

[0242] The content of the surfactant in the total solid content of the photocurable composition is preferably 0.001% by mass to 5.0% by mass, more preferably 0.005% by mass to 3.0% by mass. Only one type of surfactant may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount is in the above range.

[0243] <<Antioxidant>> The photocurable composition of the present invention may contain an antioxidant. Examples of the antioxidant include phenolic antioxidants, amine antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants. Examples of the phenolic antioxidant include hindered phenol compounds. The phenolic antioxidant is preferably a compound having a substituent at the position adjacent to the phenolic hydroxy group (ortho position). The substituent is preferably a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms. The antioxidant is also preferably a compound having a phenol group and a phosphite ester group in the same molecule. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphepin-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphepin-2-yl)oxy]ethyl]amine, ethyl bis(2,4-di-tert-butyl-6-methylphenyl)phosphite, and tris(2,4-di-tert-butylphenyl)phosphite. Commercially available antioxidants include, for example, ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-50F, ADK STAB AO-60, ADK STAB AO-60G, ADK STAB AO-80, ADK STAB AO-330 (manufactured by ADEKA Corporation), and JP-650 (manufactured by Johoku Chemical Industry Co., Ltd.). Antioxidants include the compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, the compounds described in WO 2017 / 006600, the compounds described in WO 2017 / 164024, and the compounds described in Korean Patent Publication No. 10-2019-0059371. The content of the antioxidant in the total solid content of the photocurable composition is preferably 0.01 to 20 mass %, more preferably 0.3 to 15 mass %. Only one type of antioxidant may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount thereof is within the above range.

[0244] <<Other Components>> The photocurable composition of the present invention may contain, as necessary, a sensitizer, a plasticizer, and other auxiliaries (for example, conductive particles, fillers, antifoaming agents, flame retardants, leveling agents, peeling promoters, fragrances, surface tension modifiers, chain transfer agents, etc.). By appropriately incorporating these components, properties such as film physical properties can be adjusted. As these components, the compounds described in paragraph 0182 of WO 2022 / 085485 can be used.

[0245] The photocurable composition of the present invention may contain a metal oxide in order to adjust the refractive index of the resulting film. Examples of the metal oxide include TiO ２ , ZrO ２ , Al ２ O ３ , SiO ２ The primary particle size of the metal oxide is preferably 1 to 100 nm, more preferably 3 to 70 nm, and even more preferably 5 to 50 nm. The metal oxide may have a core-shell structure. In this case, the core may be hollow.

[0246] The photocurable composition of the present invention may contain a light resistance improver. Examples of the light resistance improver include the compounds described in paragraph 0183 of WO 2022 / 085485.

[0247] It is also preferable that the photocurable composition of the present invention is substantially free of terephthalic acid esters. Here, "substantially free" means that the content of terephthalic acid esters in the total amount of the photocurable composition is 1,000 ppb by mass or less, more preferably 100 ppb by mass or less, and particularly preferably zero.

[0248] In view of environmental regulations, the photocurable composition of the present invention preferably has a melamine content of 10,000 ppm by mass or less.

[0249] The photocurable composition of the present invention preferably has a free metal content of 100 ppm or less, more preferably 50 ppm or less. The free halogen content is preferably 100 ppm or less, more preferably 50 ppm or less. Methods for reducing the free metals and halogens in the photocurable composition include washing with ion-exchanged water, filtration, ultrafiltration, and purification with ion-exchange resins.

[0250] From the standpoint of environmental regulations, the use of perfluoroalkyl sulfonic acids and their salts, and perfluoroalkyl carboxylic acids and their salts may be restricted. When the content of the above-mentioned compounds in the photocurable composition of the present invention is reduced, the content of perfluoroalkyl sulfonic acids (particularly perfluoroalkyl sulfonic acids having a perfluoroalkyl group with 6 to 8 carbon atoms) and their salts, and perfluoroalkyl carboxylic acids (particularly perfluoroalkyl carboxylic acids having a perfluoroalkyl group with 6 to 8 carbon atoms) and their salts is preferably in the range of 0.01 ppb to 1000 ppb, more preferably in the range of 0.05 ppb to 500 ppb, and even more preferably in the range of 0.1 ppb to 300 ppb, relative to the total solids content of the photocurable composition. The photocurable composition of the present invention may be substantially free of perfluoroalkyl sulfonic acids and their salts, and perfluoroalkyl carboxylic acids and their salts. For example, by using a compound that can replace perfluoroalkyl sulfonic acid and its salt, and a compound that can replace perfluoroalkyl carboxylic acid and its salt, a photocurable composition that is substantially free of perfluoroalkyl sulfonic acid and its salt, and perfluoroalkyl carboxylic acid and its salt may be selected. Examples of compounds that can replace restricted compounds include compounds that are exempt from restrictions due to differences in the number of carbon atoms in the perfluoroalkyl group. However, the above does not preclude the use of perfluoroalkyl sulfonic acid and its salt, and perfluoroalkyl carboxylic acid and its salt. The photocurable composition of the present invention may contain perfluoroalkyl sulfonic acid and its salt, and perfluoroalkyl carboxylic acid and its salt, within the maximum allowable range.

[0251] The water content of the photocurable composition of the present invention is usually 3% by mass or less, preferably 0.01 to 1.5% by mass, and more preferably 0.1 to 1.0% by mass. The water content can be measured by the Karl Fischer method.

[0252] The photocurable composition of the present invention can be used by adjusting its viscosity for the purposes of adjusting the film surface state (flatness, etc.), film thickness, etc. The viscosity value can be appropriately selected as needed, but is preferably 0.3 mPa·s to 50 mPa·s, and more preferably 0.5 mPa·s to 20 mPa·s at 25°C. The viscosity can be measured, for example, using a cone-plate type viscometer at a temperature adjusted to 25°C.

[0253] <<Storage Container>> The container for storing the photocurable composition is not particularly limited, and any known container can be used. Furthermore, the container described in paragraph 0187 of WO 2022 / 085485 can be used as the storage container.

[0254] <Method for preparing photocurable composition> The photocurable composition of the present invention can be prepared by mixing the above-mentioned components. When preparing the photocurable composition, all components may be simultaneously dissolved and / or dispersed in a solvent to prepare the photocurable composition, or, if necessary, each component may be prepared as two or more appropriate solutions or dispersions, which are mixed at the time of use (application) to prepare the photocurable composition.

[0255] The preparation of the photocurable composition preferably includes a process for dispersing the pigment. In the process for dispersing the pigment, mechanical forces used to disperse the pigment include compression, squeezing, impact, shear, and cavitation. Specific examples of these processes include a bead mill, a sand mill, a roll mill, a ball mill, a paint shaker, a microfluidizer, a high-speed impeller, a sand grinder, a flow jet mixer, high-pressure wet atomization, and ultrasonic dispersion. Furthermore, when grinding the pigment in a sand mill (bead mill), it is preferable to use small-diameter beads, increase the bead packing ratio, or otherwise increase the grinding efficiency under such conditions. Furthermore, it is preferable to remove coarse particles after the grinding process by filtration, centrifugation, or the like. In addition, the process and disperser for dispersing pigments can be suitably used, for example, the process and disperser described in "Dispersion Technology Encyclopedia," published by Joho Kiko Co., Ltd., July 15, 2005, or "Dispersion Technology and Industrial Applications Focused on Suspension (Solid / Liquid Dispersion System) - Comprehensive Data Collection," published by the Management Development Center Publishing Department, October 10, 1978, and paragraph 0022 of JP 2015-157893 A. In addition, in the process for dispersing pigments, particle refinement may be performed in a salt milling process. For details on the materials, equipment, processing conditions, etc. used in the salt milling process, see, for example, JP 2015-194521 A and JP 2012-046629 A. Examples of materials for beads used in dispersion include zirconia, agate, quartz, titania, tungsten carbide, silicon nitride, alumina, stainless steel, and glass. The beads may also be made of an inorganic compound having a Mohs hardness of at least 2. The photocurable composition may contain 1 to 10,000 ppm of the beads.

[0256] When preparing the photocurable composition, it is preferable to filter the photocurable composition with a filter for the purpose of removing foreign matter, reducing defects, etc. Examples of the types of filters and filtration methods used for filtration include the filters and filtration methods described in paragraphs 0196 to 0199 of WO 2022 / 085485.

[0257] <Film> The film of the present invention is a film obtained from the photocurable composition of the present invention described above. The film of the present invention can be used in optical filters such as color filters, infrared transmission filters, and infrared cut filters.

[0258] The thickness of the film of the present invention can be adjusted appropriately depending on the purpose. For example, the thickness is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The lower limit of the thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, and even more preferably 0.3 μm or more.

[0259] When the film of the present invention is used as a color filter, the film of the present invention preferably has a green, red, blue, cyan, magenta, or yellow hue. The film of the present invention can also be preferably used as a color pixel of a color filter. Examples of the color pixel include a red pixel, a green pixel, a blue pixel, a magenta pixel, a cyan pixel, and a yellow pixel.

[0260] <Method for Producing Film> Next, a method for producing the film of the present invention will be described. The film of the present invention can be produced via a step of applying the photocurable composition of the present invention. The method for producing the film preferably further includes a step of forming a pattern (pixels). An example of a method for forming the pattern (pixels) is photolithography.

[0261] The pattern formation by the photolithography method preferably includes the steps of forming a composition layer on a support using the photocurable composition of the present invention, exposing the composition layer to light in a pattern, and developing and removing the unexposed areas of the composition layer to form a pattern (pixels). If necessary, a step of baking the composition layer (pre-baking step) and a step of baking the developed pattern (pixels) (post-baking step) may be provided.

[0262] In the step of forming a composition layer, a composition layer is formed on a support using the photocurable composition of the present invention. The support is not particularly limited and can be appropriately selected depending on the application. Examples include a glass substrate and a silicon substrate, with a silicon substrate being preferred. The silicon substrate may also be formed with a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), a transparent conductive film, or the like. A black matrix is ​​sometimes formed on the silicon substrate to isolate each pixel. The silicon substrate may also be provided with an underlayer to improve adhesion with an upper layer, prevent diffusion of substances, or flatten the substrate surface. The surface contact angle of the underlayer is preferably 20 to 70° when measured with diiodomethane. It is also preferably 30 to 80° when measured with water.

[0263] As the coating method of the photocurable composition, known methods can be used. For example, a dropping method (drop casting); a slit coating method; a spray method; a roll coating method; a rotary coating method (spin coating); a casting coating method; a slit and spin method; a pre-wetting method (for example, the method described in JP 2009-145395 A); inkjet (for example, an on-demand method, a piezo method, a thermal method), various printing methods such as nozzle jet ejection printing, flexographic printing, screen printing, gravure printing, reverse offset printing, metal mask printing; a transfer method using a mold or the like; a nanoimprint method, etc. can be mentioned. In addition, the coating method described in paragraph 0207 of WO 2022 / 085485 can also be used.

[0264] The composition layer formed on the support may be dried (prebaked). When a film is produced by a low-temperature process, prebaking may not be performed. When prebaking is performed, the prebaking temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. The lower limit can be, for example, 50°C or higher, or can also be 80°C or higher. The prebaking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and even more preferably 80 to 220 seconds. Prebaking can be performed using a hot plate, an oven, or the like.

[0265] Next, the composition layer is exposed to light in a pattern (exposure step). For example, the composition layer can be exposed to light in a pattern by using a stepper exposure machine, a scanner exposure machine, or the like, through a mask having a predetermined mask pattern. This allows the exposed portion to be cured.

[0266] Examples of radiation (light) that can be used for exposure include g-line and i-line. Light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light with a wavelength of 300 nm or less include KrF line (wavelength 248 nm) and ArF line (wavelength 193 nm), with KrF line (wavelength 248 nm) being preferred. Long-wave light sources of 300 nm or more can also be used.

[0267] The exposure may be performed by continuous irradiation with light or by pulsed irradiation (pulse exposure), which is an exposure method in which light irradiation and pauses are repeated in short cycles (e.g., milliseconds or less).

[0268] The irradiation amount (exposure amount) is, for example, 0.03 to 2.5 J / cm ２ is preferred, and 0.05 to 1.0 J / cm ２ The oxygen concentration during exposure can be appropriately selected. In addition to being performed in the atmosphere, exposure may be performed in a low-oxygen atmosphere with an oxygen concentration of 19% by volume or less (e.g., 15% by volume, 5% by volume, or substantially oxygen-free), or in a high-oxygen atmosphere with an oxygen concentration of more than 21% by volume (e.g., 22% by volume, 30% by volume, or 50% by volume). The exposure illuminance can be appropriately set, and is usually 1000 W / m ２ ~100000W / m ２ (For example, 5000 W / m ２ , 15000W / m ２ , or 35,000 W / m ２ The oxygen concentration and exposure illuminance may be appropriately combined. For example, an oxygen concentration of 10% by volume and an illuminance of 10,000 W / m ２ , oxygen concentration 35% by volume, illuminance 20,000 W / m２ etc.

[0269] Next, the unexposed portions of the composition layer are developed and removed to form a pattern (pixels). The unexposed portions of the composition layer can be developed and removed using a developer. As a result, the unexposed portions of the composition layer in the exposure step are dissolved into the developer, leaving only the photocured portions. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. In addition, to improve residue removability, the process of shaking off the developer every 60 seconds and then supplying fresh developer may be repeated several times.

[0270] Examples of the developer include organic solvents and alkaline developers, and alkaline developers are preferably used. Regarding the developer and the washing (rinsing) method after development, the developer and washing method described in paragraph 0214 of WO 2022 / 085485 can be used.

[0271] After development and drying, it is preferable to perform additional exposure treatment or heating treatment (post-baking). The additional exposure treatment or post-baking is a post-development curing treatment to ensure complete curing. The heating temperature in post-baking is, for example, preferably 100 to 300°C, more preferably 200 to 270°C. Post-baking can be performed continuously or batchwise using a heating means such as a hot plate, convection oven (hot air circulation dryer), or high-frequency heater to achieve the above conditions for the developed film. When additional exposure treatment is performed, it is preferable that the light used for exposure has a wavelength of 400 nm or less. The additional exposure treatment may also be performed by the method described in Korean Patent Publication No. 10-2017-0122130.

[0272] <Optical Filter> The film of the present invention can be used in an optical filter. Types of optical filters include color filters, infrared cut filters, and infrared transmission filters, and a color filter is preferred. The color filter preferably has the film of the present invention as its pixel, and more preferably has the film of the present invention as a colored pixel.

[0273] The optical filter may have a protective layer provided on the surface of the film of the present invention. By providing a protective layer, various functions can be imparted, such as oxygen blocking, low reflectivity, hydrophilicity / hydrophobicity, and blocking of light of specific wavelengths (ultraviolet rays, infrared rays, etc.). The thickness of the protective layer is preferably 0.01 to 10 μm, more preferably 0.1 to 5 μm. Methods for forming the protective layer include a method of applying a resin composition for forming the protective layer, a chemical vapor deposition method, and a method of attaching a molded resin with an adhesive. Components constituting the protective layer include (meth)acrylic resin, ene-thiol resin, polycarbonate resin, polyether resin, polyarylate resin, polysulfone resin, polyethersulfone resin, polyphenylene resin, polyarylene ether phosphine oxide resin, polyimide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin, melamine resin, urethane resin, aramid resin, polyamide resin, alkyd resin, epoxy resin, modified silicone resin, fluororesin, polyacrylonitrile resin, cellulose resin, Si, C, W, Al ２ O ３ , Mo, SiO ２ , Si ２ N ４ For example, in the case of a protective layer intended to block oxygen, the protective layer may contain a polyol resin and SiO ２ and Si ２ N ４ In the case of a protective layer intended to reduce reflection, the protective layer preferably contains a (meth)acrylic resin and a fluorine resin.

[0274] When forming a protective layer by applying a resin composition, known methods such as spin coating, casting, screen printing, and inkjet printing can be used as a method for applying the resin composition for forming the protective layer. Known organic solvents (e.g., propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used as the organic solvent contained in the resin composition for forming the protective layer. When forming the protective layer by chemical vapor deposition, known chemical vapor deposition methods (thermal chemical vapor deposition, plasma chemical vapor deposition, photochemical vapor deposition) can be used as the chemical vapor deposition method.

[0275] The protective layer may contain additives such as organic or inorganic fine particles, absorbers for light of specific wavelengths (e.g., ultraviolet light, infrared light, etc.), refractive index adjusters, antioxidants, adhesives, and surfactants, as needed. Examples of organic or inorganic fine particles include polymeric fine particles (e.g., silicone resin fine particles, polystyrene fine particles, and melamine resin fine particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, titanium nitride, titanium oxynitride, magnesium fluoride, hollow silica, silica, calcium carbonate, and barium sulfate. Known absorbers for light of specific wavelengths can be used. The content of these additives can be adjusted as appropriate, but is preferably 0.1 to 70% by mass, and more preferably 1 to 60% by mass, of the total mass of the protective layer.

[0276] As the protective layer, the protective layers described in paragraphs 0073 to 0092 of JP-A-2017-151176 can also be used.

[0277] The optical filter may have a structure in which each pixel is embedded in a space partitioned by partition walls, for example, in a grid pattern.

[0278] <Solid-state imaging device> The solid-state imaging device of the present invention has the above-described film of the present invention. The configuration of the solid-state imaging device is not particularly limited as long as it has the film of the present invention and functions as a solid-state imaging device, but examples thereof include the following configurations.

[0279] The substrate includes a plurality of photodiodes constituting a light-receiving area of ​​a solid-state imaging device (such as a CCD (charge-coupled device) image sensor or a CMOS (complementary metal-oxide semiconductor) image sensor) and transfer electrodes made of polysilicon or the like. A light-shielding film is formed on the photodiodes and transfer electrodes, with only the light-receiving portions of the photodiodes exposed. A device protection film made of silicon nitride or the like is formed on the light-shielding film so as to cover the entire light-shielding film and the light-receiving portions of the photodiodes. A color filter is also provided on the device protection film. Furthermore, the device protection film may include a light-collecting means (e.g., a microlens, etc.; the same applies hereinafter) below the color filter (on the side closer to the substrate), or on the color filter. The color filter may have a structure in which each color pixel is embedded in a space partitioned by partition walls, for example, in a grid pattern. In this case, the partition walls preferably have a lower refractive index than the color pixels. Examples of imaging devices having such a structure include those described in JP 2012-227478 A, JP 2014-179577 A, and WO 2018 / 043654 A. Furthermore, as shown in JP 2019-211559 A, an ultraviolet absorbing layer may be provided within the structure of the solid-state imaging element to improve light resistance. An imaging device equipped with the solid-state imaging element of the present invention can be used for digital cameras, electronic devices with imaging functions (such as mobile phones), as well as in-vehicle cameras and surveillance cameras.

[0280] <Image Display Device> The image display device of the present invention has the above-described film of the present invention. Examples of image display devices include liquid crystal display devices and organic electroluminescence display devices. Definitions of image display devices and details of each image display device are described, for example, in "Electronic Display Devices" (written by Akio Sasaki, published by Kogyo Chosakai Co., Ltd. in 1990) and "Display Devices" (written by Nobuaki Ibuki, published by Sangyo Tosho Co., Ltd. in 1989). Liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Display Technology" (edited by Tatsuo Uchida, published by Kogyo Chosakai Co., Ltd. in 1994). There are no particular limitations on the liquid crystal display device to which the present invention can be applied, and the present invention can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology."

[0281] The present invention will be specifically explained below with reference to examples. The materials, amounts used, ratios, treatment contents, treatment procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. Note that Ph in the structural formulas shown below is a phenyl group.

[0282] <Evaluation of Resin> (Weight Average Molecular Weight (Mw)) The weight average molecular weight (Mw) of the resin was calculated by GPC (Gel Permeation Chromatography) measurement under the following measurement conditions. Apparatus: HLC-8220GPC (Tosoh Corporation) Detector: Differential refractometer (RI detector) Precolumn: TSKGUARDCOLUMN MP(XL) 6 mm x 40 mm (Tosoh Corporation) Sample side column: The following four columns were directly connected (all manufactured by Tosoh Corporation): TSK-GEL Multipore-HXL-M 7.8 mm x 300 mm Reference side column: Same as sample side column Thermostatic bath temperature: 40°C Mobile phase: tetrahydrofuran Sample side mobile phase flow rate: 1.0 mL / min Reference side mobile phase flow rate: 0.3 mL / min Sample concentration: 0.1% by mass Sample injection volume: 100 μL Data collection time: 16 to 46 minutes after sample injection Sampling interval: 300 ms (milliseconds)

[0283] (Acid value) The acid value of the resin was determined by neutralization titration using an aqueous sodium hydroxide solution. Specifically, the obtained resin was dissolved in a solvent, and the solution was titrated with an aqueous sodium hydroxide solution using potentiometry to calculate the number of millimoles of acid contained in 1 g of the solid content of the resin, and then multiplied this value by the molecular weight of potassium hydroxide (KOH), which is 56.1.

[0284] (C═C Value (Ethylenically Unsaturated Bond-Containing Group Value)) The C═C value (ethylenically unsaturated bond-containing group value) of a resin was calculated from the raw materials used in the synthesis of the resin.

[0285] <Production of resin solution> [Production Example 1-1] Production of resin solution (B-1) A separable flask equipped with a cooling tube was prepared as a reaction vessel, and on the other hand, as a monomer dropping vessel, 162.38 parts by mass of benzyl methacrylate (hereinafter referred to as "BzMA"), 34.00 parts by mass of methacrylic acid (hereinafter referred to as "MAA"), 2,2'-azobis (2-methylpropionate) dimethyl (low metal grade) (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. "V-601HP") 6.06 parts by mass, 435 parts by mass of cyclohexanone, 5.33 parts by mass of n-dodecanethiol (hereinafter referred to as "n-DM") was prepared with thorough stirring and mixing. 49 parts by mass of cyclohexanone was charged into the reaction vessel, and after nitrogen substitution, the temperature of the reaction vessel was heated in an oil bath with stirring to 75 ° C. After the temperature of the reaction vessel stabilized at 75°C, dropwise addition from the monomer dropping vessel to the reaction vessel began. The dropwise addition was carried out over 150 minutes while maintaining the temperature at 75°C. 120 minutes after the end of the dropwise addition, the temperature was raised to 90°C and the reaction vessel was then cooled to room temperature. After maintaining 90°C for 2 hours, the reaction solution was cooled to room temperature. After the polymerization reaction was completed, 3.09 parts by mass of N,N-dimethyldodecylamine as an amine compound and 0.5 parts by mass of p-methoxyphenol as a polymerization inhibitor were added in air, followed by the addition of 37.43 parts by mass of glycidyl methacrylate (hereinafter referred to as "GMA") and 96 parts by mass of cyclohexanone. Thereafter, the temperature of the reaction solution was raised to 90°C and the reaction vessel was then heated to 90°C. After maintaining 90°C for 6 hours, the reaction solution was cooled to room temperature. The cooled reaction solution was poured into a mixture of 10,000 parts by weight of methanol and 2,500 parts by weight of water, and the precipitated solid (polymer) was collected by filtration. The collected solid was washed twice with 500 parts by weight of water. The washed solid was dried by blowing air at 50 ° C. for 18 hours to obtain resin B-1 having the following structure. The weight average molecular weight (Mw) of the obtained resin B-1 was 12,000, the acid value was 32 mg KOH / g, and the C = C value was 1.13 mmol / g. The resin B-1 obtained by the above procedure was added to propylene glycol monomethyl ether acetate (hereinafter referred to as "PGMEA"), and the resin concentration (solids concentration) of the finally obtained resin solution was adjusted to 30%, to produce a resin solution (B-1).

[0286] [Production Example 1-2] Production of resin solution (B-2) A separable flask equipped with a cooling tube was prepared as a reaction vessel, and on the other hand, as a monomer dropping vessel, 30.7 parts by mass of dimethyl-2,2'-[oxybis(methylene)]bis-2-propenoate, 43.1 parts by mass of MAA, 14.3 parts by mass of methyl methacrylate (hereinafter referred to as "MMA"), 113.5 parts by mass of BzMA, 4 parts by mass of benzoyl peroxide (hereinafter referred to as "PBO"), 60 parts by mass of diethylene glycol dimethyl ether (hereinafter referred to as "DMDG") was prepared by stirring and mixing, and as a chain transfer agent dropping vessel, 8 parts by mass of n-DM, 32 parts by mass of DMDG was prepared by stirring and mixing. 375 parts by mass of DMDG was charged into the reaction vessel, and after nitrogen substitution, the temperature of the reaction vessel was heated in an oil bath with stirring and raised to 90 ° C. After the temperature of the reaction vessel stabilized at 90°C, dropwise addition from the monomer dropping tank and the chain transfer agent dropping tank to the reaction vessel began. The dropwise addition was carried out over 135 minutes, while maintaining the temperature at 90°C. Sixty minutes after the end of the dropwise addition, the temperature was raised to 110°C. After maintaining 110°C for three hours, a gas inlet tube was attached to the separable flask, and bubbling of a 5 / 95 (v / v) oxygen / nitrogen mixed gas began. Next, 50.9 parts by mass of GMA, 0.4 parts by mass of 2,2'-methylenebis(4-methyl-6-t-butylphenol) (hereinafter referred to as "MBMTB"), and 0.8 parts by mass of triethylamine (hereinafter referred to as "TEA") were charged into the reaction vessel, and the mixture was allowed to react at 110°C for three hours. After confirming the completion of the reaction by measuring the acid value of the reaction solution, 155 parts by mass of DMDG was added to the reaction solution, and the mixture was cooled to room temperature. To the cooled reaction solution, 1000 parts by mass of water was added, and the precipitated solid (polymer) was filtered. The filtered solid was washed twice with 100 parts by mass of ethanol and once with 500 parts by mass of water to obtain Resin B-2 having the following structure. The weight average molecular weight (Mw) of the obtained Resin B-2 was 18,000, the acid value was 32 mg KOH / g, and the C=C value was 1.42 mmol / g. Resin B-2 obtained by the above procedure was added to PGMEA, and the resin concentration (solids concentration) of the finally obtained resin solution was adjusted to 30%, to produce Resin Solution (B-2).

[0287] [Production Example 1-3] Production of Resin Solution (B-3) A mixture was obtained by introducing 30.4 parts by mass of a macromonomer represented by the following formula (MM), 51 parts by mass of ω-carboxy-polycaprolactone monoacrylate (Aronix M-5300, manufactured by Toagosei Co., Ltd.), and PGMEA into a three-neck flask. The mixture was stirred while blowing in nitrogen. Next, while flowing nitrogen gas into the flask, the mixture was heated to 75°C. Next, 0.82 parts by mass of n-DM and then 0.43 parts by mass of 2,2'-azobis(methyl 2-methylpropionate) (V-601, manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) were added to the mixture to initiate the polymerization reaction. After heating the mixture at 75°C for 2 hours, an additional 0.43 parts by mass of 2,2'-azobis(methyl 2-methylpropionate) was added to the mixture. After 2 hours, an additional 0.43 parts by mass of 2,2'-azobis(methyl 2-methylpropionate) was added to the mixture. After reacting for another 2 hours, the mixture was heated to 90°C and stirred for 3 hours. The polymerization reaction was completed by the above operation. After the polymerization reaction was completed, 9.6 parts by mass of dimethyldodecylamine as an amine compound and 0.3 parts by mass of 2,2,6,6-tetramethylpiperidine-1-oxyl (TEMPO) as a polymerization inhibitor were added under air, followed by the dropwise addition of 9 parts by mass of 4-hydroxybutyl acrylate glycidyl ether (4HBAGE). After the dropwise addition, the reaction was continued under air at 90°C for 24 hours, after which the completion of the reaction was confirmed by acid value measurement, and the reaction solution was cooled to room temperature. 1,000 parts by mass of water was added to the cooled reaction solution, and the precipitated solid (polymer) was collected by filtration. The collected solid was washed twice with 100 parts by mass of ethanol and once with 500 parts by mass of water to obtain Resin B-3 having the following structure. The weight average molecular weight (Mw) of the resulting Resin B-3 was 17,200, the acid value was 70 mgKOH / g, and the C═C value was 0.50 mmol / g. Resin B-3 obtained by the above procedure was added to PGMEA, and the resin concentration (solid content concentration) of the finally obtained resin solution was adjusted to 30%, thereby producing a resin solution (B-3).

[0288] [Production Example 1-4] Production of resin solution (B-4) A reaction vessel equipped with a gas inlet tube, a thermometer, a condenser, and a stirrer was charged with 8 parts by mass of 3-mercapto-1,2-propanediol, 12 parts by mass of pyromellitic anhydride, 80 parts by mass of PGMEA, and 0.2 parts by mass of monobutyltin oxide as a catalyst. After purging with nitrogen gas, the reaction was carried out at 120 ° C. for 5 hours (first step). It was confirmed that 95% or more of the acid anhydride was half-esterified by measuring the acid value. Next, 30 parts by mass of methyl methacrylate, 10 parts by mass of t-butyl acrylate, 10 parts by mass of ethyl acrylate, 5 parts by mass of methacrylic acid, 10 parts by mass of benzyl methacrylate, and 35 parts by mass of 2-hydroxyethyl methacrylate were charged, and the reaction vessel was heated to 80 ° C., and 1 part by mass of 2,2'-azobis(2,4-dimethylvaleronitrile) was added, and the reaction was carried out for 12 hours (second step). It was confirmed by measuring the solid content that 95% had reacted. Then, the atmosphere in the flask was replaced with air, and 35.0 parts by mass of 2-methacryloyloxyethyl isocyanate and 0.1 parts by mass of hydroquinone were added, followed by a reaction at 70°C for 4 hours (third step). Infrared absorption spectroscopy revealed a peak at 2270 cm based on the isocyanate group. －１ After confirming that the peak had disappeared, the reaction solution was cooled to obtain Resin B-4 having the following structure: The acid value of the resulting Resin B-4 was 40 mg KOH / g, the weight average molecular weight was 12,000, and the C=C value was 1.44 mmol / g. In formula (B-4), either *1 or *2 is bonded to *5 or *6 to form a polyester main chain, and the other is bonded to *3 or *4 to form a polyester main chain. Either *3 or *4 is bonded to *1 or *2 to form a polyester main chain, and the other is bonded to an OH group to form a carboxylic acid. Either *5 or *6 is bonded to *1 or *2 to form a polyester main chain, and the other is bonded to an OH group to form a carboxylic acid.

[0289] Resin B-4 obtained by the above procedure was added to PGMEA, and the resin concentration (solid content concentration) of the finally obtained resin solution was adjusted to 30%, thereby producing resin solution (B-4).

[0290] [Production Example 1-5] Production of Resin Solution (B-5) Resin B-5 having the following structure was obtained according to the synthesis method for Resin (B3-1) solution described in paragraph 0350 of JP 2023-050814 A. The amine value of the obtained Resin B-5 was 170 mg KOH / g and the weight average molecular weight was 20,000. Resin B-5 obtained by the above procedure was added to PGMEA, and the resin concentration (solids concentration) of the finally obtained resin solution was adjusted to 30%, thereby producing Resin Solution (B-5).

[0291] <Production of Micronized Pigment> [Production Example 2-1] (Production of Micronized Pigment (PR254M)) 100 parts by mass of C.I. Pigment Red 254 ("B-CF" manufactured by BASF), 1,200 parts by mass of sodium chloride, and 120 parts by mass of diethylene glycol were charged into a stainless steel 1-gallon kneader (manufactured by Inoue Seisakusho Co., Ltd.) and kneaded for 4 hours at 60°C. The obtained kneaded composition was added to 3,000 parts by mass of warm water and stirred for 1 hour to form a slurry, which was then repeatedly filtered and washed with water to remove the sodium chloride and diethylene glycol, and then dried at 80°C for one day to obtain a micronized pigment (PR254M).

[0292] [Production Examples 2-2 to 2-14] Each finely divided pigment was obtained in the same manner as in Production Example 2-1, except that the pigment used in Production Example 2-1 was changed from Pigment Red 254 to the pigments shown in the table below.

[0293] <Production of Pigment Dispersions> [Production Examples 3-1 to 3-19] The materials listed in the table below were mixed and then dispersed for 3 hours in an Eiger mill ("Mini Model M-250 MKII" manufactured by Eiger Japan Co., Ltd.) using zirconia beads with a diameter of 0.5 mm. The resulting mixture was then filtered through a filter with a pore size of 5.0 μm to produce pigment dispersions.

[0294]

[0295] (Fine Pigments) PR254M, PR272M, PY139M, PY150M, PY185M, PG59M, PG58M, PG36M, PG7M, PB15:6M, PB15:4M, PB15:6M, PV23M, PPB001M, SQ001M: fine pigments produced in the above-mentioned Production Examples 2-1 to 2-14 TiB: titanium oxynitride particles (manufactured by Mitsubishi Materials Electronic Chemicals) CB: carbon black particles (manufactured by Cabot, average primary particle diameter 15 nm) ZrO ２ : Zirconium oxide particles (manufactured by Nippon Denko Co., Ltd., average primary particle diameter 20 nm) TiO ２ Titanium oxide particles (manufactured by Ishihara Sangyo Kaisha, Ltd., TTO-51(C), average primary particle diameter 10 to 30 nm, surface treated with alumina and stearic acid)

[0296] (Derivatives) Derivatives 1 to 4: Compounds having the following structures

[0297] (Resin solutions) B-3 to B-5: Resin solutions (B-3) to (B-5) produced in the above-mentioned Production Examples 1-3 to 1-5

[0298] (Solvent) S-1: Propylene glycol monomethyl ether acetate (PGMEA)

[0299] <Preparation of Photocurable Composition> The raw materials shown in the table below were mixed and stirred to a uniform consistency, and then filtered through a filter with a pore size of 1 μm to prepare a photocurable composition.

[0300]

[0301] In the table above, the abbreviations for various materials represent the following:

[0302] (Pigment dispersions) DisR01, DisR02, DisY01, DisY02, DisY03, DisG01, DisG02, DisG03, DisG04, DisB01, DisB02, DisB03, DisV01, DisIR01, DisIR02, DisK01, DisK02, DisW01, DisW02: pigment dispersions produced in the above-mentioned Production Examples 3-1 to 3-19

[0303] (Dye) Dye M01: Dye having the following structure (weight average molecular weight 10,400, acid value 69 mg KOH / g, m: 4, n: 2) Dye B01: Dye having the following structure (weight average molecular weight: 30,000) DyeIR01: dye having the following structure

[0304] (Resin solutions) B-1 to B-2: Resin solutions (B-1) to (B-2) produced in the above-mentioned Production Examples 1-1 and 1-2

[0305] (Specific compound) A compound having the following structure:

[0306] (Polymerizable Compounds) M-1: Aronix M-305 (manufactured by Toagosei Co., Ltd., a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate, the content of pentaerythritol triacrylate being 55% by mass to 63% by mass) M-2: KAYARAD RP-1040 (manufactured by Nippon Kayaku Co., Ltd., ethylene oxide-modified pentaerythritol tetraacrylate) M-3: Aronix M-510 (manufactured by Toagosei Co., Ltd., polybasic acid-modified acrylic oligomer)

[0307] (Photopolymerization initiator) I-1: Compound having the following structure I-2: ADEKA ARCLES NCI-730 (manufactured by ADEKA Corporation) I-3: Compound having the following structure

[0308] (Ultraviolet absorber) U-1: Uvinul 3050 (manufactured by BASF, benzophenone compound) U-2: Adeka STAB LA-F70 (manufactured by ADEKA Corporation, triazine compound) U-3: Adeka STAB LA-31RG (manufactured by ADEKA Corporation, benzotriazole compound)

[0309] (Polymerization inhibitor) IN-1: p-methoxyphenol IN-2: 2,2,6,6-tetramethylpiperidine 1-oxyl free radical IN-3: Adekastab AO-80 (manufactured by ADEKA Corporation)

[0310] (Surfactant) W-1: Compound having the following structure (silicone surfactant, number average molecular weight 1800) W-2: Megafac F-781F (manufactured by DIC Corporation, fluorine-based surfactant)

[0311] (Quaternary ammonium salt compound) AN-1: Compound having the following structure AN-2: Tetrabutylammonium bromide AN-3: (CH ３ ) ３ N ＋ CH ２ CO ２ －

[0312] (Solvents) S-1: Propylene glycol monomethyl ether acetate (PGMEA) S-2: 1-methoxy-2-propanol (PGME) S-3: Cyclopentanone

[0313] <Evaluation of Adhesion> Each photocurable composition was spin-coated onto an 8-inch (1 inch = 2.54 cm) silicon wafer onto which hexamethyldisilazane had been sprayed, so that the resulting film would have a thickness of 0.8 μm, and the wafer was heated at 100° C. for 2 minutes. Next, using a KrF scanner exposure machine, the wafer was exposed to light at an illuminance of 35,000 W / m through a mask having a 1.1 μm square island pattern. ２ , exposure dose 200 mJ / cm ２ The substrate was irradiated with KrF radiation at an exposure dose of 1000 kJ / cm. Next, puddle development was performed at 25°C for 40 seconds using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH). After rinsing with running water for 30 seconds, the substrate was spray-dried to form a pattern (pixel). The resulting pixels were observed from above using a scanning electron microscope (Hitachi, Ltd., S-9220) to measure the pixel pattern size. Furthermore, adhesion was evaluated using an optical microscope. The pattern size when all pixels were in close contact was evaluated on a 5-point scale according to the following evaluation criteria. -Evaluation Criteria- A: The pattern size was 0.9 μm or more and less than 1.0 μm, and all pixels were in close contact. B: The pattern size was 1.0 μm or more and less than 1.05 μm, and all pixels were in close contact. C: The pattern size was 1.05 μm or more and less than 1.1 μm, and all pixels were in close contact. D: The pattern size must be 1.1 μm or more to achieve complete adhesion.

[0314] <Evaluation of Solvent Resistance> An underlayer-forming composition (CT-4000L, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was applied to an 8-inch (20.32 cm) silicon wafer using a spin coater so that the thickness after post-baking would be 0.1 μm, and the wafer was heated at 220°C for 300 seconds using a hot plate to form an underlayer, thereby obtaining a silicon wafer (support) with an underlayer. Next, each photocurable composition was applied by spin coating so that the film thickness after post-baking would be 0.5 μm. Next, the wafer was heated at 100°C for 2 minutes using a hot plate. Next, the obtained composition layer was exposed to light (KrF radiation) with a wavelength of 248 nm at an illuminance of 35,000 W / m using a KrF scanner exposure machine. ２ , exposure dose 200 mJ / cm ２ The silicon wafer on which the exposed coating film was formed was placed on the horizontal rotating table of a spin-shower developer (DW-30 model, manufactured by Chemitronics Corporation) and puddled for 60 seconds at 23°C using a 60% diluted solution of CD-2000 (manufactured by Fujifilm Electronic Materials Co., Ltd.). The wafer was then fixed to the horizontal rotating table using a vacuum chuck. While the silicon wafer was rotated at 50 rpm using a rotating device, pure water was supplied in a shower from a spray nozzle above the center of rotation to perform a rinse treatment, and then spray-dried. A heat treatment (post-baking) was then performed for 300 seconds using a hot plate at 200°C to form a film. The spectrum of the film obtained above in the wavelength range of 400 to 1100 nm was measured using a Shimadzu UV-1800 spectrophotometer (spectrum A). This film was immersed in N-methylpyrrolidone for 30 minutes, washed with ion-exchanged water, air-dried, and then the spectrum was measured again (spectrum B). The amount of change in absorbance ΔAbs at each wavelength was calculated from the absolute value of the difference between spectrum A and spectrum B, and the maximum value of ΔAbs (ΔAbs_max) in the wavelength range of 400 to 1100 nm was used as an index for evaluating solvent resistance. The closer the value of ΔAbs_max is to 0, the more excellent the solvent resistance is. - Evaluation criteria - A: ΔAbs_max is less than 0.1 B: ΔAbs_max is 0.1 or more and less than 0.2 C: ΔAbs_max is 0.2 or more and less than 0.3 D: ΔAbs_max is 0.3 or more

[0315] <Evaluation of Rectangularity> An underlayer-forming composition (CT-4000L, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was applied to an 8-inch (20.32 cm) silicon wafer using a spin coater so that the thickness after post-baking would be 0.1 μm, and the wafer was heated on a hot plate at 220°C for 300 seconds to form an underlayer, thereby obtaining a silicon wafer (support) with an underlayer. Next, each photocurable composition was applied by spin coating so that the film thickness after post-baking would be 0.5 μm. Next, the wafer was heated on a hot plate at 100°C for 2 minutes. Next, the resulting composition layer was exposed to light (KrF radiation) with a wavelength of 248 nm at an illuminance of 35,000 W / m using a KrF scanner exposure machine through a mask having a 0.5 μm square pattern. ２ , exposure dose 200 mJ / cm ２ The silicon wafer on which the exposed coating film was formed was placed on the horizontal rotating table of a spin-shower developer (DW-30 model, manufactured by Chemitronics Corporation), and puddle development was performed for 60 seconds at 23°C using a 60% diluted solution of CD-2000 (manufactured by Fujifilm Electronic Materials Co., Ltd.), forming a pattern on the silicon wafer. The silicon wafer on which the pattern was formed was fixed to the horizontal rotating table using a vacuum chuck system, and while the silicon wafer was rotated at 50 rpm using a rotation device, pure water was supplied in a shower-like manner from a spray nozzle from above the center of rotation to perform a rinse treatment, followed by spray drying. Furthermore, a heat treatment (post-bake) was performed for 300 seconds using a hot plate at 200°C to form a pattern (pixel). The cross section of the fabricated pixel was observed with a scanning electron microscope, and the angle of the pixel sidewall relative to the silicon wafer surface was measured. The rectangularity was evaluated using the following evaluation criteria. -Evaluation criteria- A: The angle of the pixel sidewall is 80° or more and less than 100°. B: The angle of the pixel sidewall is 75° or more and less than 80°, or 100° or more and less than 105°. C: The angle of the pixel sidewall is 70° or more and less than 75°, or 105° or more and less than 110°. D: The angle of the pixel sidewall is less than 70°, or 110° or more.

[0316] The results of each evaluation are shown in the following table. In addition, in the following table, the content of the specific compound in the total solid content of the photocurable composition is shown in the column "Content of specific compound."

[0317] As shown in the above table, the Examples were superior to the Comparative Examples in the evaluation results of adhesion and solvent resistance.

[0318] For the photocurable compositions used in Examples 1 to 30, the exposure light source was changed from KrF rays to i-rays (wavelength 365 nm) and the adhesion, solvent resistance, and rectangularity were similarly evaluated. The results were equivalent to those obtained with KrF exposure.

Claims

1. A photocurable composition comprising at least one compound A selected from compounds represented by any one of formulas (A-1) to (A-6), a resin, and a photoinitiator, wherein the content of the compound A in the total solid content of the photocurable composition is 0.005 to 2% by mass; In the formula, R ａ１ to R ａ１３ each independently represents a hydrogen atom or a methyl group.

2. The photocurable composition according to claim 1, wherein the compound A is at least one selected from the group consisting of a compound represented by formula (A1-01), a compound represented by formula (A1-02), a compound represented by formula (A5-01), and a compound represented by formula (A5-02).

3. The photocurable composition according to claim 1 or 2, further comprising a 3- to 6-functional polymerizable compound having a structure different from that of the compound A and having 3 to 6 ethylenically unsaturated bond-containing groups.

4. The photocurable composition according to claim 1 or 2, wherein the resin comprises a resin having an ethylenically unsaturated bond-containing group.

5. The resin having an ethylenically unsaturated bond-containing group contains a group represented by any one of the formulas (b-1) to (b-3), and the photocurable composition according to claim 4; In formula (b-1), * represents a bond, and R ｂ１ represents a hydrogen atom or a methyl group, and R ｂ２ represents a hydrogen atom or an organic group; in formula (b-2), * represents a bond, and R ｂ３ represents a hydrogen atom or a methyl group; in formula (b-3), * represents a bond, and R ｂ４ represents a hydrogen atom or a methyl group, and R ｂ５ represents a hydrogen atom or an organic group.

6. The photocurable composition according to claim 1 or 2, further comprising a coloring material.

7. The photocurable composition according to claim 1 or 2, further comprising a compound having a quaternary ammonium cation.

8. A film obtained by using the photocurable composition according to claim 1 or 2.

9. An optical filter having the film according to claim 8.

10. A solid-state imaging device having the film according to claim 8.

11. An image display device having the film according to claim 8.

Images