Housing device, semiconductor manufacturing device, and cassette

Abstract

This housing device can be connected to a vacuum transfer module to which a plurality of process modules are connected. The housing device houses a substrate-like sensor. The housing device has a case and an exhaust part. The case houses the substrate-like sensor. The exhaust part discharges air from the inside of the case. The vacuum transfer module has a connection part for connecting the process modules. The case can be connected to the vacuum transfer module via the connection part.

Description

Storage device, semiconductor manufacturing equipment and cassette

[0001] The present disclosure relates to a storage device, a semiconductor manufacturing device, and a cassette.

[0002] The following Patent Document 1 discloses "a storage container for storing a substrate-like sensor, comprising: a container body having an opening; a support portion disposed within the container body and supporting the substrate-like sensor; contact pins disposed within the container body and capable of contacting terminal portions of the substrate-like sensor; a drive mechanism for driving the contact pins; a jack disposed outside the container body and electrically connected to the contact pins; and a lid capable of closing the opening to the container body."

[0003] Japanese Patent Application Laid-Open No. 2021-129024

[0004] The present disclosure provides a technique for suppressing a decrease in production efficiency when measurements are performed using a substrate-like sensor.

[0005] An accommodation device according to one aspect of the present disclosure is connectable to a vacuum transfer module to which multiple process modules are connected. The accommodation device accommodates a substrate-like sensor. The accommodation device has a case and an exhaust unit. The case accommodates the substrate-like sensor. The exhaust unit exhausts air from the inside of the case. The vacuum transfer module has a connection unit for connecting the process modules. The case is connectable to the vacuum transfer module via the connection unit.

[0006] According to the present disclosure, it is possible to suppress a decrease in production efficiency when performing measurements using a substrate-like sensor.

[0007] FIG. 1 is a plan view showing an example of a schematic configuration of a semiconductor manufacturing apparatus according to an embodiment. FIG. 2 is a diagram illustrating an example of a transfer path during conventional measurement. FIG. 3 is a schematic cross-sectional view showing the configuration of a storage module according to an embodiment. FIG. 4 is a schematic cross-sectional view showing the configuration of a storage module according to an embodiment. FIG. 5 is a schematic cross-sectional view showing the configuration of a storage module according to an embodiment. FIG. 6 is a schematic cross-sectional view showing the configuration of a storage module according to an embodiment. FIG. 7A is a diagram illustrating the flow of removing a substrate-like sensor from a storage module. FIG. 7B is a diagram illustrating the flow of removing a substrate-like sensor from a storage module. FIG. 8A is a diagram illustrating the flow of removing a substrate-like sensor from a storage module. FIG. 8B is a diagram illustrating the flow of removing a substrate-like sensor from a storage module. FIG. 9A is a diagram illustrating the flow of removing a substrate-like sensor from a storage module. FIG. 9B is a diagram illustrating the flow of removing a substrate-like sensor from a storage module. FIG. 10 is a diagram illustrating an example of a transfer path for a substrate-like sensor during measurement according to an embodiment. FIG. 11 is a diagram illustrating an example of the results of comparing measurement according to an embodiment with conventional measurement.

[0008] Hereinafter, embodiments of the storage device, semiconductor manufacturing apparatus, and cassette disclosed in the present application will be described in detail with reference to the drawings. Note that the disclosed storage device, semiconductor manufacturing apparatus, and cassette are not limited to the embodiments.

[0009] Conventionally, semiconductor manufacturing equipment has been known that performs substrate processing, such as film formation and etching, on substrates such as semiconductor wafers in a reduced-pressure environment to manufacture semiconductor devices on the substrates. Some such semiconductor manufacturing equipment includes multiple process modules, a vacuum transfer module, a load lock module, a loader module, and a load port. Each process module has a low-pressure environment inside and performs substrate processing on the substrate. The vacuum transfer module has a low-pressure environment inside and transfers substrates to each process module. The load lock module converts pressure between the vacuum transfer module and the loader module. The load port is provided in the loader module and is connected to a container that stores multiple substrates. The loader module transfers substrates between the container connected to the load port and the load lock module.

[0010] Semiconductor manufacturing equipment is required to reduce performance variations between process modules and between semiconductor manufacturing equipment. To this end, semiconductor manufacturing equipment has traditionally used substrate-like sensors, which have a shape similar to that of a substrate, to measure the performance of each process module. For example, a container containing a substrate-like sensor, instead of a substrate, is connected to a load port, and the substrate-like sensor is transported to the process module by a transport mechanism that transports substrates within the semiconductor manufacturing equipment to measure the inside of the process module. Using a substrate-like sensor allows information about the inside of the process module to be measured without opening the process module, thereby enabling quick, safe, and easy monitoring of the status within the process module.

[0011] However, in conventional measurement, the substrate-like sensor must be transported from the load port to the process module, which requires a long transport path, which can result in the transport mechanism being occupied by the substrate-like sensor, reducing the production efficiency of the semiconductor manufacturing equipment.

[0012] Therefore, there is a need for a technology that can prevent a decrease in production efficiency when measurements are performed using substrate-like sensors.

[0013] (Embodiment) (Semiconductor Manufacturing Apparatus 1) Next, an embodiment will be described. FIG. 1 is a plan view showing an example of a schematic configuration of a semiconductor manufacturing apparatus 1 according to an embodiment. The semiconductor manufacturing apparatus 1 includes a plurality of process modules PM1 to PM7, a vacuum transfer module 10, a loader module 20, and a storage module 50. In the embodiment, the storage module 50 corresponds to the storage apparatus of the present disclosure. The semiconductor manufacturing apparatus 1 also includes a plurality of load lock modules LLM1 to LLM2, a plurality of load ports LP1 to LP5, and a control unit 30.

[0014] 1 shows seven process modules PM1 to PM7, two load lock modules LLM1 and LLM2, and five load ports LP1 to LP5. However, the number of process modules PM, load lock modules LLM, and load ports LP included in the semiconductor manufacturing equipment 1 is not limited to those shown. Hereinafter, unless there is a particular need to distinguish between them, the seven process modules PM1 to PM7 will be collectively referred to as process modules PM. Similarly, the two load lock modules LLM1 to LLM2 will be collectively referred to as load lock modules LLM. Similarly, the five load ports LP1 to LP5 will be collectively referred to as load ports LP.

[0015] The process module PM processes a substrate W. For example, the process module PM is configured to be airtight, and the interior can be evacuated using an exhaust mechanism to create a reduced pressure inside. The process module PM performs substrate processing, such as plasma etching or film formation, on the substrate W in a reduced pressure environment where the interior is depressurized to a predetermined vacuum level suitable for substrate processing. The substrate W is, for example, a semiconductor wafer. Each process module PM includes a stage ST that supports the substrate W. The interior of the process module PM is maintained in a reduced pressure environment during substrate processing.

[0016] In this embodiment, the shape of the vacuum transfer module 10 in a plan view is a pentagon. The vacuum transfer module 10 has two substantially parallel side walls 10a and 10b, side walls 10c and 10d at one end of the side walls 10a and 10b, and a side wall 10e at the other end of the side walls 10a and 10b. The angle between the side wall 10a and the side wall 10c and the angle between the side wall 10b and the side wall 10d are both obtuse angles. The side walls 10c and 10d protrude outward. However, the shape of the vacuum transfer module 10 in a plan view is not limited to this. For example, the shape of the vacuum transfer module 10 in a plan view may be a triangle, a rectangle, a hexagon, or any polygon with more sides.

[0017] The vacuum transfer module 10 is provided with a connection portion to which the process modules PM can be connected. For example, the vacuum transfer module 10 is provided with gate valves GV on side walls 10a to 10e. The process modules PM are each connected to the vacuum transfer module 10 via a gate valve GV. For example, three gate valves GV are provided in a row on the side wall 10a, and the process modules PM1 to PM3 are connected thereto. Three gate valves GV are provided in a row on the side wall 10b, and the process modules PM4 to PM6 are connected thereto. One gate valve GV is provided on the side wall 10c, and the process module PM7 is connected thereto.

[0018] Load lock modules LLM1 and LLM2 are connected to the vacuum transfer module 10. For example, two gate valves GV are provided side by side on the side wall 10e, and the load lock modules LLM1 and LLM2 are connected to them.

[0019] The vacuum transfer module 10 is airtight, and its interior can be evacuated to a predetermined vacuum level using an exhaust mechanism. The vacuum transfer module 10 transports substrates W in a reduced-pressure environment. The vacuum transfer module 10 houses a transport robot for transporting the substrates W. For example, the vacuum transfer module 10 houses a first transport mechanism 15 for transporting the substrates W. The first transport mechanism 15 has an extendable robot arm. In this embodiment, the first transport mechanism 15 corresponds to the transport robot of the present disclosure. At least one first transport mechanism 15 is disposed within the vacuum transfer module 10 and includes at least one end effector. The first transport mechanism 15 according to this embodiment has a first arm 15a and a second arm 15b that can operate independently. The first arm 15a and the second arm 15b each have a substantially U-shaped pick at their tip, and are each capable of holding a substrate W. The first transport mechanism 15 transports substrates W between the process modules PM1 to PM7 and the load lock modules LLM1 and LLM2 by extending and retracting its robot arm. The substrates W are transported to each process module PM via the vacuum transport module 10. The substrates W processed in the process module PM are transported via the vacuum transfer module 10 to the process module PM where the next processing will be performed. After all processing has been completed, the substrates W are transported via the vacuum transfer module 10 to the load lock module LLM.

[0020] The load lock module LLM is configured to be airtight, and an exhaust mechanism can be used to switch between an atmospheric pressure environment where the inside is at atmospheric pressure and a reduced pressure environment where the inside is reduced to a predetermined vacuum level. A gate valve GV is provided on the side wall of the load lock module LLM opposite to the side connected to the vacuum transfer module 10, and the loader module 20 is connected to the gate valve GV.

[0021] The interior of the loader module 20 is maintained in an atmospheric pressure environment. A plurality of load lock modules LLM are arranged side by side on one side of the loader module 20. A plurality of load ports LP are arranged side by side on the other side of the loader module 20. A second transport mechanism 25 is disposed inside the loader module 20. The second transport mechanism 25 transports substrates W between the load lock modules LLM and the load ports LP. The second transport mechanism 25 has an arm 25a. The arm 25a is rotatably fixed on a base 25d. The base 25d is fixed near the load port LP3. A substantially U-shaped first pick 27a and a second pick 27b are rotatably connected to the tip of the arm 25a.

[0022] The load port LP is configured to allow attachment of a storage container (hereinafter also referred to as a Front Opening Unified Pod (FOUP)) that stores substrates W. The FOUP has an openable and closable lid (not shown). When the FOUP is placed on the load port LP, the lid of the FOUP engages with the door of the load port LP. In this state, opening the door of the load port LP moves the lid of the FOUP along with the door, opening the FOUP, and connecting the inside of the FOUP to the loader module 20 via the load port LP.

[0023] The process module PM, vacuum transfer module 10, first transfer mechanism 15, load lock module LLM, loader module 20, second transfer mechanism 25, and load port LP configured as described above are each connected to and controlled by the control unit 30.

[0024] The control unit 30 is an information processing device such as a computer. The control unit 30 is an information processing device such as a computer. The control unit 30 has a memory, a processor, an input / output interface, and a user interface. The control unit 30 displays the status of the semiconductor manufacturing equipment 1 on the user interface. Various instructions and information can be input to the control unit 30 through the user interface. Data such as recipes and programs are stored in the memory. The memory may be, for example, a random access memory (RAM), a read-only memory (ROM), a hard disk drive (HDD), or a solid state drive (SSD). The processor executes a program read from the memory to control each part of the semiconductor manufacturing equipment 1 via the input / output interface based on data such as recipes stored in the memory. The processor may be, for example, a central processing unit (CPU) or a digital signal processor (DSP).

[0025] Incidentally, there is a demand for reducing performance variations between the process modules PM and between the semiconductor manufacturing equipment 1. For this reason, in the semiconductor manufacturing equipment 1, the performance of each process module PM has conventionally been measured using a substrate-shaped sensor having a shape similar to that of the substrate W. For example, in conventional measurements, a FOUP containing a substrate-shaped sensor is connected to the load port LP instead of the substrate W, and the substrate-shaped sensor is transported to the process module PM by the first transport mechanism 15 and the second transport mechanism 25 to measure the inside of the process module PM.

[0026] FIG. 2 is a diagram illustrating an example of the transport path of the substrate-like sensor WS during conventional measurement. In FIG. 2, the transport path of the substrate-like sensor WS when measuring the state inside the process module PM2 is indicated by an arrow. In FIG. 2, a FOUP containing the substrate-like sensor WS is attached to the load port LP2. The second transport mechanism 25 removes the substrate-like sensor WS from the FOUP on the load port LP2 and transports it to the load lock module LLM1. The first transport mechanism 15 transports the substrate-like sensor WS from the load lock module LLM1 to the process module PM2. The substrate-like sensor WS measures the inside of the process module PM2. After measurement, the first transport mechanism 15 transports the substrate-like sensor WS from the process module PM2 to the load lock module LLM2. The second transport mechanism 25 transports the substrate-like sensor WS from the load lock module LLM1 to the FOUP on the load port LP2.

[0027] However, in conventional measurement, the transfer path is long because the substrate-like sensor WS is transferred from the load port LP to the process module PM, which can easily occupy the transfer mechanism for transferring the substrate-like sensor WS, resulting in a decrease in production efficiency of the semiconductor manufacturing equipment 1.

[0028] 1, the semiconductor manufacturing apparatus 1 according to the embodiment includes a storage module 50. The storage module 50 is configured to be connectable to a connection portion of the vacuum transfer module 10 that can connect to a process module PM. For example, a gate valve GV is provided on the side wall 10d as a connection portion that can connect to the process module PM. The storage module 50 is connected to the gate valve GV on the side wall 10d.

[0029] 3 and 4 are schematic cross-sectional views showing the configuration of the accommodating module 50 according to the embodiment. FIG. 3 shows a schematic cross-section of the accommodating module 50 taken along line A-A, which is perpendicular to the sidewall 10d shown in FIG. 1. FIG. 4 shows a schematic cross-section of the accommodating module 50 taken along line B-B, which is parallel to the sidewall 10d. FIG. 3 also shows the gate valve GV of the process module PM. Hereinafter, the direction along line A-A will be referred to as the A direction, and the direction along line B-B will be referred to as the B direction.

[0030] The storage module 50 has a case 51. The case 51 is box-shaped and has an airtight interior. The case 51 is supported by support columns 52. The support columns 52 are cylindrical, and there are four of them, which are connected to the bottom surface of the case 51 near the four ends.

[0031] The case 51 is connectable to the vacuum transfer module 10. For example, the case 51 is configured to be connectable to the vacuum transfer module 10 via a gate valve GV. The case 51 accommodates a substrate-like sensor WS, and is configured so that the first transfer mechanism 15 can transfer the substrate-like sensor WS between the inside of the case 51 and the vacuum transfer module 10 via the gate valve GV.

[0032] The gate valve GV has a gate 40 formed therein that is large enough to allow the substrate W to pass through, and the gate 40 can be opened and closed by raising and lowering a partition plate 41. The gate valve GV has a seal member provided at the contact point between the partition plate 41 and the gate 40, and the gate 40 is airtightly sealed by raising the partition plate 41.

[0033] The case 51 is formed with an opening 51a of a size corresponding to the gate 40 at a position corresponding to the gate 40, and is configured so that the gate 40 and the opening 51a can be airtightly connected. For example, the case 51 is provided with a seal member surrounding the opening 51a on the contact surface that comes into contact with the gate valve GV. By connecting the case 51 to the gate valve GV so that the gate 40 and the opening 51a are in communication with each other, the gate 40 and the opening 51a are in communication with each other, and the accommodation module 50 and the gate valve GV can be airtightly connected. In FIG. 4, the position of the opening 51a is indicated by a dotted line.

[0034] The accommodation module 50 has an exhaust unit that exhausts the inside of the case 51. The accommodation module 50 is configured to be switchable between an atmospheric pressure environment where the inside of the case 51 is at atmospheric pressure and a reduced-pressure environment where the pressure is reduced to a predetermined vacuum level. For example, the case 51 is formed with an exhaust port 51b and a gas supply port 51c. An exhaust line 53 is connected to the exhaust port 51b. The exhaust line 53 is connected to an exhaust system 54. The inside of the case 51 is exhausted from the exhaust port 51b via the exhaust line 53 by the exhaust system 54. A gas line 55 is connected to the gas supply port 51c. The gas line 55 is connected to a gas supply unit 56. In the embodiment, the exhaust port 51b, the exhaust line 53, and the exhaust system 54 correspond to the exhaust unit of the present disclosure. Also, in the embodiment, the exhaust port 51b, the gas supply port 51c, the exhaust line 53, the gas line 55, the exhaust system 54, and the gas supply unit 56 correspond to the switching unit of the present disclosure.

[0035] The gas supply unit 56 is capable of supplying an inert gas such as He gas, Ar gas, Ne gas, or nitrogen gas, or dry air. Note that the gas line 55 of the accommodation module 50 may be connected to a gas supply unit that supplies gas to each process module PM of the semiconductor manufacturing equipment 1, so that the accommodation module 50 may be supplied with an inert gas or dry air from the gas supply unit of the semiconductor manufacturing equipment 1.

[0036] The exhaust system 54 is capable of exhausting the inside of the case 51 via an exhaust line 53. The exhaust system 54 may include a pressure regulating valve and a vacuum pump. The pressure inside the case 51 is adjusted by the pressure regulating valve. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination of these. Note that the exhaust line 53 of the accommodation module 50 may be connected to an exhaust mechanism of the semiconductor manufacturing equipment 1 or an exhaust pipe provided in a factory, and the inside of the case 51 may be evacuated by the exhaust mechanism or exhaust pipe of the semiconductor manufacturing equipment 1.

[0037] The accommodating module 50 is capable of accommodating a plurality of substrate-like sensors WS. The accommodating module 50 has an accommodating section 60.

[0038] The storage module 50 has a lifter that raises and lowers the storage unit 60 within the case 51. For example, as shown in FIG. 3 , of the four support columns 52, two support columns 52a on one side in the B direction are provided with rods 52b that are extendable. The rods 52b penetrate the bottom of the case 51 and extend into the case 51. As shown in FIG. 4 , the storage unit 60 is supported by the upper side connected to the rods 52b of the two support columns 52a, and is raised and lowered by the extension and contraction of the rods 52b. FIGS. 5 and 6 are schematic cross-sectional views showing the configuration of the storage module 50 according to the embodiment. FIGS. 5 and 6 show the case where the rods 52b are extended to raise the storage unit 60. Note that the position of the opening 51a is indicated by a dotted line in FIG. 6 . In the embodiment, the rods 52b correspond to the lifting unit and lifter of the present disclosure.

[0039] The substrate-like sensor WS has a shape that allows it to be transported by the first transport mechanism 15, and includes a sensor and circuitry for controlling measurements by the sensor. The substrate-like sensor WS has a shape similar to that of the substrate W. For example, the substrate-like sensor WS has a sensor and circuit elements arranged on a substrate of the same size as the substrate W. Because the substrate-like sensor WS is transported in the same way as the substrate W, there are limitations (weight, size, operating time) on its transport in the semiconductor manufacturing equipment 1. For this reason, it is technically difficult to give a single substrate-like sensor WS the ability to perform multiple measurements, and therefore substrate-like sensors WS are prepared for each type of measurement.

[0040] The substrate-like sensor WS is provided with sensors corresponding to the type of measurement, various elements and circuits for controlling the sensors and performing wireless communication, and a battery for supplying power to the sensors and various elements and circuits, enabling wireless charging of the battery.

[0041] The housing section 60 is configured to house a plurality of substrate-like sensors WS at different heights.

[0042] The substrate-like sensors WS are housed in cassettes 70. The cassettes 70 are formed in a flat box shape and have a space inside that can house the substrate-like sensors WS. The cassettes 70 have a stage 71 on the bottom surface inside the cassette 70, on which the substrate-like sensors WS are placed. The temperature of the stage 71 can be adjusted. For example, the stage 71 has a heater inside, which allows the temperature of the substrate-like sensors WS to be adjusted. The cassettes 70 are also configured so that a power supply unit 72 that wirelessly charges the battery is located near the substrate-like sensors WS. For example, the cassettes 70 have the power supply unit 72 on the top surface inside the cassette 70, facing the stage 71. The case 51 has a communication unit 57 inside for wireless communication with the substrate-like sensors WS.

[0043] The storage unit 60 stores the cassettes 70 arranged one above the other. The cassettes 70 can be attached to and detached from the storage unit 60. For example, the interior of the storage unit 60 is divided into a plurality of spaces 62 by shelves 61. The spaces 62 are higher than the height of the cassettes 70 and have widths that are approximately the same as or slightly wider than the width of the cassettes 70. The storage unit 60 does not have side walls on either side in the A direction and is open in the A direction. The storage unit 60 can attach a cassette 70 by inserting the cassette 70 into the spaces 62 from the A direction side.

[0044] The cassette 70 is configured so that one side can be opened and closed. For example, the cassette 70 has an openable lid 73 on one side. When the cassette 70 is carried, the lid 73 is closed. The cassette 70 is attached to the space 62 of the storage unit 60 with the lid 73 open, from the lid 73 side. When the cassette 70 is attached to the space 62 of the storage unit 60, the side facing the opening 51a is open, allowing the substrate-like sensor WS to be removed from the opening 51a side. The cassette 70 may be configured so that the lid 73 automatically opens when attached to the space 62 of the storage unit 60 by engaging with the inner surface of the storage unit 60. The cassette 70 may also be provided with a drive mechanism that automatically opens the lid 73 when attached to the space 62 of the storage unit 60 and power is applied. The cassette 70 may also have an opening formed on one side. For example, the cassette 70 may have an opening on one side.

[0045] The accommodation unit 60 has a connector 63 provided on an inner wall on one side in direction B for each space 62. The cassette 70 has a connector 74 provided at a position corresponding to the connector 63 on the side wall that is on one side in direction B when the cassette 70 is attached to the space 62 of the accommodation unit 60. When the cassette 70 is attached to the space 62 of the accommodation unit 60, the connector 74 and the connector 63 are connected, and the cassette 70 is electrically connected to the accommodation unit 60. The accommodation unit 60 supplies power to the cassette 70 via the connectors 63 and 74. For example, the heater of the stage 71 and the power supply unit 72 are supplied with power via the connectors 63 and 74, respectively.

[0046] The case 51 has an opening 51d formed in a side wall different from the side wall in which the opening 51a is formed, for carrying the cassette 70 into and out of the case 51. In this embodiment, the case 51 has the opening 51d formed in the side wall opposite in the A direction from the side wall in which the opening 51a is formed. The opening 51d is formed to a size that allows the cassette 70 to pass through. For example, the opening 51d is formed to a size approximately the same as the side surface of the storage section 60 in the A direction. The opening 51d is sealed by a door 51e.

[0047] The accommodating module 50 includes a control unit 58. The control unit 58 is an information processing device such as a computer. The control unit 58 includes a memory, a processor, an input / output interface, and a user interface. The control unit 58 displays the status of the accommodating module 50 on the user interface. The control unit 58 is capable of inputting various instructions and information through the user interface. Various data, programs, etc. are stored in the memory. The processor executes programs read from the memory to control each component of the accommodating module 50 via the input / output interface. For example, the control unit 58 controls the extension and contraction of the rods 52b of the support columns 52a to control the elevation and lowering of the accommodating unit 60. The control unit 58 also controls the power supply to the heater of the stage 71 and the power supply unit 72 for each cassette 70 accommodated in the accommodating unit 60. The accommodating module 50 may be connected to the control unit 30 of the semiconductor manufacturing equipment 1, and the control unit 30 may control the accommodating module 50.

[0048] Next, a flow of connecting the accommodation module 50 to the semiconductor manufacturing equipment 1 will be briefly described.

[0049] In the semiconductor manufacturing apparatus 1, the gate valve GV connecting the accommodation module 50 is in a closed state, and the inside of the vacuum transfer module 10 is maintained in a reduced pressure environment.

[0050] The accommodation module 50 is transported with the opening 51 a sealed with a removable cover, and an inert gas or dry air supplied from the gas supply unit 56 to maintain the interior of the case 51 at atmospheric pressure. Then, the cover of the opening 51 a is removed, and the accommodation module 50 is connected to the gate valve GV on the side wall 10 d.

[0051] The accommodation module 50 is configured to be connectable to the gate valve GV of the semiconductor manufacturing equipment 1, and can be attached to and detached from the semiconductor manufacturing equipment 1 via the gate valve GV. Therefore, the accommodation module 50 only needs to be connected to the semiconductor manufacturing equipment 1 when measurements are performed, and can also be shared by multiple semiconductor manufacturing equipment 1.

[0052] Next, the procedure for inserting and removing the cassette 70 into and from the accommodation module 50 will be briefly described.

[0053] When cassette 70 is to be attached or detached, dry air is supplied from gas supply unit 56 to create an atmospheric pressure environment inside case 51 of storage module 50. Door 51e of case 51 is then opened, and cassette 70 is attached or detached to or from storage unit 60 through opening 51d. When cassette 70 is attached to space 62 of storage unit 60, connector 74 and connector 63 are connected, establishing electrical continuity with storage unit 60. After attachment or detachment of cassette 70 is complete, door 51e of case 51 is sealed.

[0054] Next, a flow of measurement inside the process module PM using the substrate-like sensor WS will be described.

[0055] The housing module 50 is previously evacuated by the exhaust system 54, and the inside of the case 51 is made into a reduced pressure environment.

[0056] The accommodation module 50 adjusts the temperature of the substrate-like sensor WS in each cassette 70 accommodated therein in advance. For example, the accommodation module 50 controls the power supply to the heater of the stage 71 of each cassette 70 to control the temperature of the substrate-like sensor WS accommodated in the cassette 70. For example, the control unit 58 controls the power supply to the heater so that the temperature of the substrate-like sensor WS accommodated in each cassette 70 corresponds to the temperature inside the process module PM. For example, the control unit 58 controls the power supply to the heater of the stage 71 of the cassette 70 to control the heater temperature, and controls the substrate-like sensor WS to a temperature approximately equal to the temperature inside the process module PM via the stage 71. The temperature inside the process module PM may be obtained from the semiconductor manufacturing equipment 1 or may be input via a user interface. Alternatively, the temperature inside the process module PM may be measured and set in advance.

[0057] When measuring inside the process module PM, the control unit 58 controls the extension and retraction of the rod 52b of the support column 52a so that the substrate-like sensor WS to be transported reaches a height corresponding to the gate valve GV. For example, in the accommodation module 50, a cassette 70 of the substrate-like sensor WS to be used for measurement is specified via a user interface of the control unit 58. The control unit 58 controls the extension and retraction of the rod 52b of the support column 52a so that the specified cassette 70 reaches a height corresponding to the gate valve GV.

[0058] The semiconductor manufacturing apparatus 1 opens the gate valve GV to which the accommodation module 50 is connected, and removes the substrate-like sensor WS from the accommodation module 50 using the first transfer mechanism 15 .

[0059] 7A to 9B are diagrams illustrating the process of removing the substrate-like sensor WS from the accommodating module 50. FIGS. 7A to 9B show the process of removing the substrate-like sensor WS from the lowest cassette 70 in the accommodating section 60. FIGS. 7A, 8A, and 9A show schematic cross sections of the accommodating module 50 taken along line A-A, which is perpendicular to the side wall 10d shown in FIG. 1. FIGS. 7B, 8B, and 9B show schematic cross sections of the accommodating module 50 taken along line B-B, which is parallel to the side wall 10d. The positions of the openings 51a are indicated by dotted lines in FIGS. 7B, 8B, and 9B.

[0060] The control unit 58 controls the extension and contraction of the rods 52b of the support columns 52a so that the lowest cassette 70 in the storage unit 60 reaches a height corresponding to the gate valve GV. As a result, as shown in Figures 7A and 7B, the storage unit 60 rises and the lowest cassette 70 reaches a height approximately the same as that of the gate valve GV.

[0061] The semiconductor manufacturing apparatus 1 opens the gate valve GV to which the accommodation module 50 is connected. The semiconductor manufacturing apparatus 1 then passes the first arm 15a of the first transfer mechanism 15 through the gate 40 and opening 51a of the gate valve GV, and moves the first arm 15a to the underside of the substrate-like sensor WS of the lowest cassette 70. Here, the cassette 70 is formed such that the width of the stage 71 in the direction B is narrower than the width of the picks of the first arm 15a and the second arm 15b. As shown in FIGS. 7A and 7B , the semiconductor manufacturing apparatus 1 moves the first arm 15a to a position where the stage 71 is located between the picks of the first arm 15a and is on the underside of the substrate-like sensor WS.

[0062] The control unit 58 slightly contracts the rods 52b of the support columns 52a to slightly lower the storage unit 60. As the storage unit 60 lowers, each cassette 70 also lowers, and the substrate-like sensor WS of the lowest cassette 70 is supported by the first arm 15a, as shown in Figures 8A and 8B.

[0063] The semiconductor manufacturing equipment 1 causes the first arm 15a supporting the substrate-like sensor WS to retract from the accommodating module 50. As a result, the substrate-like sensor WS in the lowest cassette 70 is removed from the accommodating module 50, as shown in Figures 9A and 9B. The semiconductor manufacturing equipment 1 transports the substrate-like sensor WS removed from the accommodating module 50 to the process module PM and measures the inside of the process module PM.

[0064] FIG. 10 is a diagram illustrating an example of the transport path of the substrate-like sensor WS during measurement in this embodiment. In FIG. 10, the transport path of the substrate-like sensor WS when measuring the state inside the process module PM2 is indicated by arrows. The vacuum transfer module 10 transports the substrate-like sensor WS between the case 51 and the vacuum transfer module 10 via the gate valve GV using the first transfer mechanism 15. In FIG. 10, the first transfer mechanism 15 removes the substrate-like sensor WS from the accommodation module 50 and transports it from the vacuum transfer module 10 to the process module PM2. The substrate-like sensor WS measures the inside of the process module PM2. After measurement, the first transfer mechanism 15 removes the substrate-like sensor WS from the process module PM2 and transports it from the vacuum transfer module 10 to the accommodation module 50. The substrate-like sensor WS is accommodated in the accommodation module 50 in the reverse order of removal.

[0065] 11A and 11B are diagrams showing an example of the results of comparing the measurement of the embodiment with the conventional measurement. Fig. 11A shows the progress of the conventional measurement and the temperature change of the substrate-like sensor WS. Fig. 11B shows the progress of the measurement of the embodiment and the temperature change of the substrate-like sensor WS.

[0066] In conventional measurements, the substrate-like sensor WS is removed from the load port LP and transported to the process module PM via the loader module 20, the load lock module LLM, and the vacuum transfer module 10 (LM → VTM). In conventional measurements, the substrate-like sensor WS is stored at room temperature. Meanwhile, the process module PM undergoes substrate processing, such as plasma processing, and its interior is heated to a high temperature. Immediately after being transported to the process module PM, the temperature of the substrate-like sensor WS changes significantly due to the temperature difference with the interior of the process module PM, causing the sensor and elements to become unstable. Therefore, in conventional measurements, a waiting time is required until the temperature of the substrate-like sensor WS stabilizes. Once the temperature of the substrate-like sensor WS stabilizes, the substrate-like sensor WS performs measurements. The substrate-like sensor WS is calibrated as necessary during measurements. After the measurement, in conventional measurements, the substrate-like sensor WS is removed from the process module PM and transported to the load port LP via the vacuum transfer module 10, the load lock module LLM, and the loader module 20 (VTM → LM). The temperature of the substrate-like sensor WS removed from the process module PM drops to room temperature. Thus, in conventional measurements, the substrate-like sensor WS must be transported to the process module PM, resulting in a long transport path. As a result, in conventional measurements, transport mechanisms such as the first transport mechanism 15 and the second transport mechanism 25 are often occupied by transporting the substrate-like sensor WS. Furthermore, in conventional measurements, a waiting time is required for the temperature to stabilize, lengthening the time from when the substrate-like sensor WS is transported to the process module PM to when measurement begins. As a result, conventional measurements can reduce the production efficiency of the semiconductor manufacturing equipment 1. Furthermore, in conventional measurements, there is a large temperature difference between the process module PM and the FOUP in which the substrate-like sensor WS is stored, resulting in large temperature changes in the substrate-like sensor WS with each measurement, placing a heavy load on the sensors and elements of the substrate-like sensor WS.

[0067] On the other hand, in the measurement of the embodiment, the substrate-like sensor WS is removed from the accommodation module 50 and transported to the process module PM via the vacuum transfer module 10 (VTM). Furthermore, in the measurement of the embodiment, the temperature of the substrate-like sensor WS is adjusted in advance to a temperature corresponding to the internal temperature of the process module PM. As a result, in the measurement of the embodiment, the measurement can be started promptly after the substrate-like sensor WS is transported to the process module PM. The substrate-like sensor WS is calibrated as necessary during the measurement. After the measurement, in the measurement of the embodiment, the substrate-like sensor WS is removed from the process module PM and transported to the accommodation module 50 via the vacuum transfer module 10 (VTM). In this way, in the measurement of the embodiment, the transport path for transporting the substrate-like sensor WS to the process module PM can be shortened. Furthermore, in the measurement of the embodiment, the measurement can be started promptly after the substrate-like sensor WS is transported to the process module PM. As a result, the measurement of the embodiment can suppress a decrease in production efficiency of the semiconductor manufacturing apparatus 1 when performing measurement using the substrate-like sensor WS. Furthermore, in the measurement of the embodiment, the substrate-like sensor WS is stored in a state in which its temperature is controlled in advance to correspond to the temperature inside the process module PM in the accommodation module 50. Therefore, in the measurement of the embodiment, no large temperature change occurs in the substrate-like sensor WS between measurements, and the load on the sensor and elements of the substrate-like sensor WS can be reduced.

[0068] In the measurement of the embodiment, the substrate-like sensor WS may be calibrated in the accommodation module 50 when its temperature is adjusted to a temperature corresponding to the temperature inside the process module PM. For example, the substrate-like sensor WS has a wireless communication element, transmits a signal indicating the temperature of the substrate-like sensor WS via wireless communication, and calibrates the sensor in response to an instruction via wireless communication. As described above, the case 51 has a communication unit 57 that wirelessly communicates with the substrate-like sensor WS. After the temperature of the substrate-like sensor WS reaches a temperature corresponding to the temperature inside the process module PM, the control unit 30 instructs the substrate-like sensor WS to calibrate the sensor via wireless communication. For example, when the control unit 30 receives a signal via the communication unit 57 indicating that the temperature of the substrate-like sensor WS corresponds to the temperature inside the process module PM, it instructs the control unit 30 to calibrate the sensor via wireless communication. The substrate-like sensor WS calibrates the sensor in response to the instruction. As a result, the substrate-like sensor WS is calibrated in the accommodation module 50 at a temperature corresponding to the temperature inside the process module PM, allowing accurate measurement without calibration inside the process module PM.

[0069] Furthermore, in the measurement of the embodiment, an example has been described in which the temperature of the substrate-like sensors WS in each cassette 70 housed in the housing module 50 is controlled. However, this is not limiting. It is also possible to control the temperature of only the substrate-like sensors WS used for measurement. For example, in the housing module 50, a cassette 70 containing the substrate-like sensors WS to be used for measurement is designated via a user interface of the control unit 58. The control unit 58 may control the power supply to the heater of the stage 71 of the designated cassette 70, thereby controlling the temperature of the substrate-like sensors WS housed in the designated cassette 70.

[0070] Furthermore, in the measurement of the embodiment, an example has been described in which the accommodating module 50 is connected to the gate valve GV of the vacuum transfer module 10. However, this is not limiting. The accommodating module 50 may also be provided with a gate valve GV at the opening 51a of the case 51. The gate valve GV of the vacuum transfer module 10 and the gate valve GV of the accommodating module 50 may then be connected. By closing the gate valve GV provided at the opening 51a, the accommodating module 50 can be attached to and detached from the vacuum transfer module 10 while maintaining the inside of the case 51 in a reduced pressure environment.

[0071] In the measurement of the embodiment, the case where the accommodation module 50 is connected to the process module gate valve GV that connects the process module PM of the vacuum transfer module 10 has been described as an example. However, this is not limited to this. The accommodation module 50 may be connected to any part of the vacuum transfer module 10 as long as the substrate-like sensor WS can be loaded and unloaded from the vacuum transfer module 10. For example, the accommodation module 50 may be connected to the load lock module gate valve GV that connects the load lock module LLM. Furthermore, for example, a separate accommodation module gate valve may be provided in the vacuum transfer module 10 in addition to the process module and load lock module gate valves GV, and the accommodation module 50 may be connected to the accommodation module gate valve.

[0072] As described above, the accommodation module 50 (accommodation device) according to the embodiment can be connected to the vacuum transfer module 10, to which multiple process modules PM are connected. The accommodation module 50 accommodates the substrate-like sensor WS. The accommodation module 50 has a case 51 and an exhaust unit (exhaust port 51b, exhaust line 53, and exhaust system 54). The case 51 is connectable to the vacuum transfer module 10 and accommodates the substrate-like sensor WS. The exhaust unit exhausts the interior of the case 51. The vacuum transfer module 10 has a connection unit (gate valve GV) that connects the process module PM. The case 51 can be connected to the vacuum transfer module 10 via the connection unit. This allows the accommodation module 50 to suppress a decrease in production efficiency when performing measurements using the substrate-like sensor WS. Furthermore, the accommodation module 50 can be connected to the connection unit of the vacuum transfer module 10 instead of the process module PM.

[0073] The vacuum transfer module 10 also houses a transfer robot (first transfer mechanism 15) that transfers the substrate W. The transfer robot transfers a substrate-like sensor WS between the case 51 and the process module PM via a connection portion. The substrate-like sensor WS has a shape that allows it to be transported by the transfer robot, and includes a sensor and circuitry for controlling measurement by the sensor. This allows the accommodation module 50 to measure the process module PM using the substrate-like sensor WS.

[0074] The storage module 50 further includes a storage unit 60, a lifter (rod 52b), and a control unit 30. The storage unit 60 is provided within the case 51 and stores multiple substrate-like sensors WS at different heights. The lifter raises and lowers the storage unit 60 within the case 51. The control unit 30 is configured to control the elevation of the lifter so that the substrate-like sensor WS to be transported by the transport robot is at a height corresponding to the connection point with the connection unit. This allows the transport robot to remove the substrate-like sensor WS to be transported via the connection unit.

[0075] The storage module 50 also includes a cassette 70. The cassette 70 stores the substrate-like sensor WS. The storage section 60 stores the cassettes 70 in a detachable manner, arranged vertically. The case 51 has an opening 51d on a side different from the side on which the connection points are provided, through which the cassette 70 can pass, and which is sealed by a door 51e. By storing the substrate-like sensor WS in the cassette 70 in this manner, contamination of the substrate-like sensor WS can be suppressed. The storage module 50 also allows replacement of the substrate-like sensor WS by opening the door 51e and replacing the cassette 70 in the storage section 60 through the opening 51d.

[0076] Furthermore, the cassette 70 has an opening formed on one side thereof, or one side thereof is configured to be openable and closable. The storage section 60 is configured to store the cassette 70 with one side thereof facing the connection portion. This allows the transfer robot to remove the substrate-like sensor WS stored in the cassette 70 through the connection portion.

[0077] The cassette 70 is also provided with a heater and has a stage 71 on which the substrate-like sensor WS is placed. The accommodation unit 60 is configured to be able to supply power to the heater. The control unit 30 controls the supply of power to the heater so that the temperature of the substrate-like sensor WS accommodated in the cassette 70 corresponds to the temperature inside the process module PM. This allows the accommodation module 50 to adjust the temperature of the substrate-like sensor WS accommodated in the cassette 70 to a temperature corresponding to the temperature inside the process module PM.

[0078] The substrate-like sensor WS also has a battery that supplies power to the sensor and circuitry and can be wirelessly charged. The cassette 70 has a power supply unit 72 that wirelessly charges the battery. The storage unit 60 has a connector 63 that supplies power to the power supply unit 72 of the stored cassette 70. This allows the storage module 50 to charge the battery of the substrate-like sensor WS stored in the cassette 70 while it is still stored in the cassette 70.

[0079] The substrate-like sensor WS also has a wireless communication element, transmits a signal indicating the temperature of the substrate-like sensor WS via wireless communication, and calibrates the sensor in response to instructions via wireless communication. The case 51 has a communication unit 57 that wirelessly communicates with the substrate-like sensor WS. The control unit 30 is configured to wirelessly instruct the sensor to be calibrated upon receiving a signal indicating that the temperature of the substrate-like sensor WS corresponds to the temperature inside the process module PM. This allows the substrate-like sensor WS to perform accurate measurements without having to be calibrated inside the process module PM.

[0080] The connection part also includes a gate valve GV. The case 51 is airtightly connected to the gate 40 of the gate valve GV. This allows the accommodation module 50 to transport the substrate-like sensor WS between the accommodation module 50 and the vacuum transport module 10 via the gate valve GV.

[0081] Furthermore, the accommodation module 50 (accommodation device) according to the embodiment can be connected to a vacuum transfer module 10 having sidewalls 10a-10e surrounding an internal space that is a reduced-pressure environment and connection ports (gate valves GV) formed in the sidewalls 10a-10e to which a process module PM that processes a substrate can be connected. The accommodation module 50 accommodates a substrate-like sensor WS. The accommodation module 50 has a case 51 and a switching unit (exhaust port 51b, gas supply port 51c, exhaust line 53, gas line 55, exhaust system 54, gas supply unit 56). The vacuum transfer module 10 has sidewalls 10a-10e surrounding an internal space that is a reduced-pressure environment and connection ports (gate valves GV) formed in the sidewalls 10a-10e to which a process module PM that processes a substrate can be connected. The case 51 can be connected to the connection ports of the vacuum transfer module 10 and accommodates the substrate-like sensor WS. The switching unit is configured to switch the interior of the case 51 to a reduced-pressure environment. This allows the accommodating module 50 to suppress a decrease in production efficiency when measurements are performed using the substrate-like sensor WS.

[0082] Although the embodiments have been described above, the disclosed embodiments should be considered to be illustrative in all respects and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the claims.

[0083] In addition, the following supplementary notes are disclosed regarding the above-described embodiment.

[0084] (Supplementary Note 1) An accommodation device comprising: a vacuum transport module whose interior is a reduced pressure environment reduced to a predetermined vacuum level and which has a transport mechanism for transporting substrates provided therein, wherein the case is connectable to a connection part of the vacuum transport module which is provided with a connection part to which a process module that performs substrate processing on the substrate can be connected, the case has a shape similar to the substrate, is provided with a sensor and an element for controlling measurement by the sensor, and accommodates a substrate-like sensor configured to enable measurement by the sensor inside the process module, and is configured to enable the transport mechanism to transport the substrate-like sensor between the interior and the vacuum transport module via the connection part; and a switching part configured to be able to switch between an atmospheric pressure environment where the inside of the case is at atmospheric pressure and the reduced pressure environment.

[0085] (Appendix 2) The storage device described in Appendix 1 further includes: a storage section provided within the case and configured to store multiple substrate-like sensors at different heights; a lifting section configured to raise and lower the storage section within the case; and a control section configured to control the raising and lowering of the lifting section so that the substrate-like sensor to be transported by the transport mechanism is at a height corresponding to the connection point with the connection section.

[0086] (Appendix 3) The substrate-like sensor is accommodated in a cassette, the accommodation section is configured to accommodate the cassettes arranged one above the other in a detachable manner, and the case is configured to have an opening on a side different from the side on which the connection points are provided, through which the cassette can pass, and which is sealed by a door, in the accommodation device described in Appendix 2.

[0087] (Supplementary Note 4) The cassette is configured such that one side surface thereof is open or can be opened and closed, and the storage section is configured to store the cassette with the one side surface facing the connection portion. The storage device described in Supplementary Note 3.

[0088] (Appendix 5) The cassette is configured such that a heater is provided on a stage on which the substrate-like sensor is placed, and the temperature of the stage is controllable; the storage unit is configured such that power can be supplied to the heater; and the control unit controls the power supply to the heater so that the temperature of the substrate-like sensor stored in the cassette becomes a temperature corresponding to the inside of the process module. This is the storage device described in Appendix 3 or 4.

[0089] (Appendix 6) The storage device described in any one of Appendices 1 to 5, wherein the substrate-like sensor is provided with a battery that supplies power to the sensor and the element and is configured to enable wireless charging of the battery, the cassette is configured so that a power supply unit that wirelessly charges the battery is positioned near the substrate-like sensor, and the storage unit is configured to supply power to the power supply unit of the stored cassette.

[0090] (Appendix 7) The substrate-like sensor is provided with an element that communicates wirelessly and is configured to enable wireless communication; the case is configured to have a communication unit therein that communicates wirelessly with the substrate-like sensor; and the control unit is configured to instruct calibration of the sensor via the wireless communication after the temperature of the substrate-like sensor reaches a temperature corresponding to the inside of the process module. This is the storage device described in Appendix 5.

[0091] (Supplementary Note 8) The storage device according to any one of Supplementary Notes 1 to 7, wherein the connection portion includes a gate valve, and the case has an opening of a size corresponding to the gate of the gate valve, and is configured to allow the gate and the opening to be airtightly connected.

[0092] (Supplementary Note 9) A semiconductor manufacturing apparatus comprising: a process module configured to perform substrate processing on a substrate; a vacuum transfer module having a connection part for connecting the process module, an interior of which is a reduced-pressure environment reduced to a predetermined vacuum level, and an interior of which is a transfer mechanism for transferring the substrate; a storage module having a case connectable to the connection part of the vacuum transfer module, having a shape similar to that of the substrate, and having a sensor and an element for controlling measurement by the sensor, and accommodating a substrate-like sensor configured to enable measurement by the sensor inside the process module, and configured to allow the substrate-like sensor to be transported by the transport mechanism via the connection part, and a switching part configured to switch between an atmospheric pressure environment where the inside of the case is at atmospheric pressure and the reduced-pressure environment; a loader module having an interior of which is set to the atmospheric pressure environment, and configured to transport the substrate from a storage container that accommodates the substrate; and a load lock module configured to perform pressure conversion between the vacuum transfer module and the load module.

[0093] (Supplementary Note 10) A cassette having: a cassette body configured to accommodate a substrate-like sensor configured to be attached to and detached from a storage section of a storage device whose interior is a reduced pressure environment reduced to a predetermined vacuum level, and which is connectable to a connection section that can connect a process module of a vacuum transport module having a transport mechanism for transporting substrates installed inside, the cassette body having a shape similar to that of the substrate, and which is provided with a sensor and an element for controlling measurement by the sensor, and which is configured to enable measurement by the sensor inside the process module; and a stage installed within the cassette body, on which the substrate-like sensor can be placed, which is provided with a heater, and which is configured to have a temperature controllable.

[0094] (Appendix 11) An accommodation device for accommodating a substrate-like sensor, which can be connected to a vacuum transfer module to which multiple process modules are connected, comprising: a case for accommodating the substrate-like sensor; and an exhaust section for evacuating the inside of the case, wherein the vacuum transfer module has a connection section for connecting the process modules, and the case can be connected to the vacuum transfer module via the connection section.

[0095] (Appendix 12) The storage device described in Appendix 11, wherein the vacuum transfer module has a transfer robot therein that transfers the substrate, the transfer robot transfers the substrate-like sensor between the case and the process module via the connection part, and the substrate-like sensor has a shape that can be transported by the transfer robot and has a sensor and a circuit that controls measurement by the sensor.

[0096] (Appendix 13) The storage device described in Appendix 12 further includes a storage section provided within the case for storing multiple substrate-like sensors at different heights; a lifter for raising and lowering the storage section within the case; and a control section configured to control the raising and lowering of the lifter so that the substrate-like sensor to be transported by the transport robot is at a height corresponding to the connection point with the connection section.

[0097] (Appendix 14) The storage device described in Appendix 13 further includes a cassette for storing the substrate-like sensor, wherein the storage section stores the cassettes in a detachable manner arranged one above the other, and the case has an opening formed on a side different from the side on which the connection point is provided, through which the cassette can pass and which is sealed by a door.

[0098] (Supplementary Note 15) The cassette is an accommodation device according to Supplementary Note 14, wherein an opening is formed on one side surface of the cassette or the one side surface is configured to be openable and closable, and the accommodation section accommodates the cassette with the one side surface facing the connection point.

[0099] (Appendix 16) The cassette is provided with a heater and has a stage on which the substrate-like sensor is placed, the storage unit is configured to be able to supply power to the heater, and the control unit controls the supply of power to the heater so that the temperature of the substrate-like sensor stored in the cassette becomes a temperature corresponding to the temperature inside the process module. This is the storage device described in Appendix 14 or Appendix 15.

[0100] (Appendix 17) The storage device described in Appendix 16, wherein the substrate-like sensor has a battery that supplies power to the sensor and the circuit and is capable of wireless charging, the cassette has a power supply unit that wirelessly charges the battery, and the storage unit has a connector that supplies power to the power supply unit of the stored cassette.

[0101] (Appendix 18) The substrate-like sensor has an element that communicates wirelessly, transmits a signal indicating the temperature of the substrate-like sensor via wireless communication, and calibrates the sensor in accordance with instructions via wireless communication; the case has a communication unit that communicates wirelessly with the substrate-like sensor; and the control unit is configured to instruct calibration of the sensor via wireless communication when it receives a signal via the communication unit indicating that the temperature of the substrate-like sensor is a temperature corresponding to the temperature inside the process module. This is the storage device described in Appendix 16 or Appendix 17.

[0102] (Supplementary Note 19) The storage device according to any one of Supplementary Notes 12 to 18, wherein the connection portion includes a gate valve, and the case is airtightly connected to the gate valve.

[0103] (Supplementary Note 20) A semiconductor manufacturing apparatus comprising: a process module; a vacuum transfer module having a connection part for connecting the process module; and an accommodation module connectable to the vacuum transfer module via the connection part, the accommodation module having a case for accommodating a substrate-like sensor and an exhaust part for exhausting the inside of the case.

[0104] (Appendix 21) A cassette comprising: a cassette body that is detachably attached to a storage section of a storage device that can be connected to a vacuum transport module and that stores a substrate-like sensor; and a stage that is provided within the cassette body and on which the substrate-like sensor is placed, the stage having a heater inside that heats the substrate-like sensor.

[0105] (Appendix 22) An accommodation device for accommodating a substrate-like sensor, which can be connected to a vacuum transport module having a side wall surrounding an internal space that is a reduced pressure environment and a connection port formed on the side wall to which a process module that processes a substrate can be connected, the accommodation device having: a case that can be connected to the connection port and that accommodates the substrate-like sensor; and a switching unit that is configured to be able to switch the inside of the case to a reduced pressure environment.

[0106] 1 Semiconductor manufacturing apparatus 10 Vacuum transfer module 10a, 10b, 10c, 10d, 10e Side wall 15 First transfer mechanism 15a First arm 15b Second arm 20 Loader module 25 Second transfer mechanism 25a Arm 27a First pick 27b Second pick 30 Control unit 40 Gate 50 Storage module 51 Case 51a Opening 51b Exhaust port 51c Gas supply port 51d Opening 52 Support column 52a Support column 52b Rod 53 Exhaust line 54 Exhaust system 55 Gas line 56 Gas supply unit 57 Communication unit 58 Control unit 60 Storage unit 62 Space 63 Connector 70 Cassette 71 Stage 72 Power supply unit 74 Connector GV Gate valve LLM, LLM1, LLM2 Load lock module LP, LP1 to LP5 Load port PM, PM1 to PM7 Process module ST Stage W Substrate WS Substrate-shaped sensor

Claims

1. A housing device for housing a substrate-shaped sensor that can be connected to a vacuum transfer module to which a plurality of process modules are connected, the housing device comprising: a case for housing the substrate-shaped sensor; and an exhaust unit for exhausting the inside of the case, wherein the vacuum transfer module has a connection unit for connecting the process modules, and the case is connectable to the vacuum transfer module via the connection unit.

2. The housing device according to claim 1, wherein the vacuum transfer module has a transfer robot for transferring a substrate inside thereof, and the transfer robot transfers the substrate-shaped sensor between the case and the process module via the connection unit, and the substrate-shaped sensor has a shape that can be transferred by the transfer robot and has a sensor and a circuit for controlling the sensor.

3. The housing device according to claim 2, further comprising: a housing unit provided in the case for housing a plurality of the substrate-shaped sensors at different heights; a lifter for raising and lowering the housing unit in the case; and a control unit configured to control the raising and lowering of the lifter so that the substrate-shaped sensor to be transferred by the transfer robot reaches a height corresponding to a connection location with the connection unit.

4. The housing device according to claim 3, further comprising a cassette for housing the substrate-shaped sensor, wherein the housing unit removably houses the cassettes arranged vertically, and the case has an opening formed on a side surface different from the side surface provided with the connection location, through which the cassette can pass and is sealed by a door.

5. The housing device according to claim 4, wherein the cassette has an opening formed on one side surface thereof, or one side surface is configured to be openable and closable, and the housing unit houses the cassette with the one side surface facing the connection location side.

6. The housing device according to claim 4 or 5, wherein the cassette is provided with a heater and has a stage on which the substrate-shaped sensor is placed, the housing unit is configured to be able to supply power to the heater, and the control unit controls the power supply to the heater so that the temperature of the substrate-shaped sensor housed in the cassette becomes a temperature corresponding to the temperature inside the process module.

7. The substrate-shaped sensor has a battery that supplies power to the sensor and the circuit and enables wireless charging. The cassette has a power supply unit that wirelessly charges the battery. The housing unit has a connector that supplies power to the power supply unit of the housed cassette. The housing device according to claim 6.

8. The substrate-shaped sensor has an element for wireless communication, transmits a signal indicating the temperature of the substrate-shaped sensor by wireless communication, and calibrates the sensor according to an instruction by wireless communication. The case has a communication unit that wirelessly communicates with the substrate-shaped sensor. The control unit is configured to instruct calibration of the sensor by wireless communication when receiving a signal that the temperature of the substrate-shaped sensor corresponds to the temperature inside the process module via the communication unit. The housing device according to claim 6.

9. The connection part includes a gate valve. The case is airtightly connected to the gate valve. The housing device according to any one of claims 2 to 5.

10. A semiconductor manufacturing apparatus comprising: a process module; a vacuum transfer module having a connection part for connecting the process module; and a housing module that can be connected to the vacuum transfer module via the connection part and has a case for housing a substrate-shaped sensor and an evacuation part for evacuating the inside of the case.

11. A cassette that is detachable from the housing part of a housing device connectable to a vacuum transfer module and houses a substrate-shaped sensor, the cassette having: a cassette body; and a stage provided in the cassette body for placing the substrate-shaped sensor, the stage having a heater for heating the substrate-shaped sensor inside the stage.

12. A housing device for housing a substrate-shaped sensor, the housing device being connectable to a vacuum transfer module having a side wall surrounding an internal space maintained in a reduced-pressure environment and a connection port formed in the side wall to which a process module for processing a substrate can be connected, the housing device having: a case that can be connected to the connection port and houses the substrate-shaped sensor; and a switching part configured to be able to switch the inside of the case to a reduced-pressure environment.

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