Inductance-based leveling apparatus and leveling method for 3D printer

Abstract

The present application relates to the technical field of 3D printing. Disclosed are an inductance-based leveling apparatus and leveling method for a 3D printer. The 3D printer comprises a hotend module for extrusion molding of consumables, wherein the hotend module has a nozzle. The inductance-based leveling apparatus comprises: a housing, a sensing module provided on the housing, a collection module connected to the sensing module, and a control module connected to the collection module, wherein during the process of following a hotend module to move along a preset leveling path, the sensing module forms an inductance with respect to a metal printing platform; the collection module collects an inductance signal and converts the inductance signal into data information; and the control module acquires the data information and calculates the distance between the sensing module and the metal printing platform on the basis of the data information, so as to obtain leveling data.

Description

Inductive leveling device and leveling method for 3D printer

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese Patent Application No. 202410089020.4 filed on January 22, 2024, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present application relates to the field of 3D printing technology, and in particular to an inductive leveling device and a leveling method for a 3D printer. Background Art

[0004] Traditional 3D printer leveling devices use a contact-type delayed leveling solution. Specifically, they employ contact sensors, which typically require contact distance measurement at multiple points (e.g., 25) on the PEI (Polyetherimide) plate of the printing platform. This requires the probe to move in the Z-axis direction for each distance measurement. After all points are measured, the printing platform is leveled based on the relevant height data. This results in low leveling accuracy and efficiency, and long-term wear and tear on the leveling device and printing platform.

[0005] Summary of the Invention

[0006] The present application provides an inductive leveling device and a leveling method for a 3D printer, which can improve leveling efficiency and printing effect.

[0007] To solve the above technical problems, the present application adopts a technical solution: providing an inductive leveling device for a 3D printer, wherein the 3D printer includes a nozzle module for extruding consumables, the nozzle module having a nozzle, and the inductive leveling device includes:

[0008] case;

[0009] A sensing module is provided on the housing, wherein the sensing module moves along a preset leveling path following the nozzle module and forms an inductance with the metal printing platform;

[0010] an acquisition module, connected to the sensing module, for acquiring an inductance signal and converting the inductance signal into data information;

[0011] A control module is connected to the acquisition module and is used to obtain the data information and calculate the distance between the sensing module and the metal printing platform according to the data information to obtain leveling data.

[0012] According to one or more embodiments of the present application, the sensing module includes a fixing bracket fixed to the bottom of the housing and an induction coil provided on the fixing bracket.

[0013] According to one or more embodiments of the present application, the nozzle is disposed at the center of one or more of the induction coils.

[0014] According to one or more embodiments of the present application, a plurality of the induction coils are provided on the fixing bracket, and the plurality of the induction coils are concentrically arranged.

[0015] According to one or more embodiments of the present application, a plurality of the induction coils are provided on the fixing bracket, and the plurality of the induction coils are evenly arranged around the nozzle with the nozzle as the center.

[0016] According to one or more embodiments of the present application, the induction coil is selected from any one of a triangular coil, a rectangular coil, and a toroidal coil.

[0017] According to one or more embodiments of the present application, the acquisition module includes a circuit board and a chip integrated on the circuit board and connected to the induction coil.

[0018] According to one or more embodiments of the present application, the control module includes a single-chip microcomputer and a host computer connected to the single-chip microcomputer, the single-chip microcomputer is used to obtain the data information and transmit the data information to the host computer, and the host computer is used to obtain the data information and calculate the distance between the sensing module and the metal printing platform based on the data information to obtain leveling data.

[0019] To solve the above technical problems, another technical solution adopted by the present application is to provide a leveling method for an inductive leveling device, comprising:

[0020] When the sensing module follows the nozzle module in moving along the preset leveling path, the acquisition module collects in real time the inductance signal of each acquisition point in the preset leveling path and converts the inductance signal into data information;

[0021] The data information is acquired through a control module, and the distance between the sensing module and the metal printing platform is calculated according to the data information to obtain leveling data.

[0022] According to one or more embodiments of the present application, the inductance signal includes at least one of an impedance, an inductance, and a quality factor of an induction coil in the sensing module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0024] FIG1 is a schematic diagram of a flow chart of an inductive leveling device for a 3D printer according to one or more embodiments of the present application;

[0025] FIG2 is a schematic diagram of the explosion structure of FIG1 ;

[0026] FIG3 is a schematic diagram of a preset leveling path according to one or more embodiments of the present application;

[0027] FIG4 is an equivalent circuit diagram of an inductive proximity sensor according to one or more embodiments of the present application;

[0028] FIG5 is a schematic structural diagram of a fixing bracket and an induction coil according to one or more embodiments of the present application;

[0029] FIG6 is a schematic structural diagram of a fixing bracket and an induction coil according to one or more embodiments of the present application;

[0030] FIG7 is a schematic structural diagram of a fixing bracket and an induction coil according to one or more embodiments of the present application;

[0031] FIG8 is a schematic structural diagram of a fixing bracket and an induction coil according to one or more embodiments of the present application;

[0032] FIG9 is a schematic structural diagram of a fixing bracket and an induction coil according to one or more embodiments of the present application;

[0033] FIG10 is a schematic structural diagram of a fixing bracket and an induction coil according to one or more embodiments of the present application;

[0034] FIG11 is a flow chart of a leveling method for an inductive leveling device according to one or more embodiments of the present application.

[0035] The meanings of the reference numerals in the accompanying drawings are:

[0036] 100 - inductive leveling device; 10 - housing; 101 - through hole; 20 - nozzle module; 21 - fixing member; 22 - nozzle; 30 - sensing module; 31 - fixing bracket; 32 - induction coil; 40 - heating ring; 50 - heat sink; 60 - connector; 200 - preset leveling path, 201 - collection point. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0038] The terms "first," "second," and "third" in this application are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of such features. In the description of this application, "multiple" means at least two, for example, two, three, etc., unless otherwise specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications also change accordingly. In addition, the terms "including" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products, or devices.

[0039] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0040] Figure 1 is a schematic diagram of the structure of an inductive leveling device for a 3D printer according to one embodiment of the present application, and Figure 2 is an exploded schematic diagram of Figure 1. As shown in Figures 1-2, the 3D printer includes a nozzle module 20 for extruding consumables. The nozzle module 20 has a nozzle 22. The inductive leveling device 100 includes a housing 10, a sensing module 30 disposed on the housing 10, an acquisition module (not shown) connected to the sensing module 30, and a control module (not shown) connected to the acquisition module. In this embodiment, the sensing module 30 forms an inductive interaction with a metal printing platform (not shown) as the nozzle module 20 moves along a preset leveling path. The acquisition module collects the inductive signal generated by the inductive interaction and converts it into data information. The control module obtains the data information and calculates the distance between the sensing module 30 and the metal printing platform based on the data information to obtain leveling data. This embodiment enables the nozzle module 20 to obtain leveling data without moving in the Z-axis direction, thereby improving leveling efficiency. It also enables real-time leveling without delay, thereby improving print quality.

[0041] Furthermore, as shown in FIG3 , the preset leveling path 200 may include multiple acquisition points 201 . The number and location of acquisition points 201 can be set based on actual conditions. When the sensing module 30 follows the nozzle module 20 through each acquisition point 201 , the acquisition module collects inductance signals and converts them into data. The control module then obtains the data and calculates the distance between the sensing module 30 and the metal printing platform based on the data to obtain leveling data at each acquisition point 201 .

[0042] In one feasible embodiment, as shown in Figures 1-2, the housing 10 is hollow and cylindrical, with a through-hole 101 defined at the bottom. The nozzle module 20 further includes a fixture 21 disposed within the housing 10. The nozzle 22 is connected to the fixture 21 and extends through the through-hole 101, emerging from the bottom of the housing 10. Furthermore, a heating ring 40 is sheathed around the fixture 21, and a heat sink 50 is provided at the top of the housing 10.

[0043] In a feasible embodiment, as shown in Figures 1-2 and 5-6, the sensing module 30 includes a fixed bracket 31 fixed to the bottom of the housing 10 and an induction coil 32 provided on the fixed bracket 31. The induction coil 32 forms an inductive effect with the metal printing platform. As part of the inductive proximity sensor, the induction coil 32 can measure the distance between the induction coil 32 and the metal printing platform, which is actually the distance between the nozzle 22 and the metal printing platform. The measurement principle is as follows. The equivalent circuit diagram of the inductive proximity sensor is shown in Figure 4. According to the transformer principle, the induction coil 32 is used as the primary side of the transformer, and the eddy current circuit of the metal printing platform to be measured is used as the secondary side of the transformer. U1 is the alternating voltage applied to both ends of the induction coil 32, R1 and R2 are the resistances of the induction coil 32 and the metal printing platform respectively, L1 and L2 are the inductances of the induction coil 32 and the metal printing platform respectively, and M is the mutual inductance between the induction coil 32 and the metal printing platform, which increases as the distance between the two decreases. According to Kirchhoff's voltage law, it can be obtained that:

[0044] Where j is the imaginary number sign, ω is the vibration angular frequency, I1 is the current generated by the induction coil 32, and I2 is the eddy current generated by the metal printing platform. From formula (1), we can get:

[0045] According to formula (2), the equivalent complex impedance Z of the induction coil 32 after being affected by the metal printing platform is:

[0046] According to formula (3), the equivalent resistance and equivalent inductance are:

[0047] The quality factor Q of the induction coil is:

[0048] in, Q1 is the quality factor of the induction coil 32 when there is no eddy current influence; Z2 is the impedance of the circular part that generates eddy current in the metal printing platform.

[0049] From the above calculations, it can be seen that changes in the distance between the induction coil 32 and the metal printing platform can cause changes in the impedance Z, inductance L, and quality factor Q of the induction coil 32. Therefore, any one of the parameters of the impedance Z, inductance L, and quality factor Q of the induction coil 32 can be selected and converted into an electrical signal for measurement to obtain the distance between the induction coil 32 and the metal printing platform and achieve leveling. Furthermore, the distance between the induction coil 32 and the metal printing platform is related to the mutual inductance M. The smaller the distance between the induction coil 32 and the metal printing platform, the larger the M value; conversely, the larger the distance between the induction coil 32 and the metal printing platform, the smaller the M value. In this embodiment, the inductance signal collected by the acquisition module includes at least one of the impedance, inductance, and quality factor of the induction coil 32 in the sensing module 30. In this way, the nozzle module 20 can obtain leveling data without moving in the Z-axis direction, thereby improving the leveling efficiency.

[0050] In one feasible embodiment, the nozzle 22 is made of a non-metallic material, such as a silicon nitride nozzle, which can avoid the nozzle 22 interfering with the induction coil 32 and affecting the measurement effect of the induction coil 32. The nozzle 22 is set at the center of one or more induction coils 32. When multiple induction coils 32 are provided on the fixed bracket 31, the multiple induction coils 32 are concentrically arranged. In this embodiment, the same acquisition point 201 can be measured by multiple induction coils 32, and the error can be reduced by taking the average value to improve the measurement accuracy. The induction coil 32 can be any one of a triangular coil, a rectangular coil or a toroidal coil. For example, as shown in Figure 5, the fixed bracket 31 and the induction coil 32 are both toroidal coils, and two induction coils 32 are provided, and the two induction coils 32 form a concentric toroidal structure with the fixed bracket 31. For example, as shown in Figure 6, the fixed bracket 31 and the induction coil 32 are both rectangular coils, and two induction coils 32 are provided, and the two induction coils 32 form a concentric rectangular structure with the fixed bracket 31. Exemplarily, as shown in FIG7 , the fixing bracket 31 and the induction coil 32 are both triangular coils, two induction coils 32 are provided, and both of the two induction coils 32 and the fixing bracket 31 form a concentric triangular structure.

[0051] In one feasible embodiment, the nozzle 22 can be made of metal. Multiple induction coils 32 are provided on the fixed bracket 31. These induction coils 32 are evenly arranged around the nozzle 22, centered on the nozzle 22. This embodiment allows measurement of the same acquisition point 201 using multiple induction coils 32, and by taking an average, reduces error and improves measurement accuracy. The induction coils 32 can be any of triangular, rectangular, or toroidal coils. Exemplarily, as shown in FIG8 , both the fixed bracket 31 and the induction coil 32 are toroidal coils, with multiple induction coils 32 provided, each centered on the nozzle 22 and evenly arranged around the nozzle 22. Exemplarily, as shown in FIG9 , both the fixed bracket 31 and the induction coil 32 are rectangular coils, with multiple induction coils 32 provided, each centered on the nozzle 22 and evenly arranged around the nozzle 22. Exemplarily, as shown in FIG10 , both the fixed bracket 31 and the induction coil 32 are triangular coils, with multiple induction coils 32 provided, each centered on the nozzle 22 and evenly arranged around the nozzle 22.

[0052] In one feasible embodiment, the acquisition module includes a circuit board and a chip integrated on the circuit board and connected to the induction coil 32. The induction coil 32 can be connected to the circuit board via a pin header. The chip is a 28-bit inductance-to-digital converter, with a supply voltage of 2.7V to 3.6V and a measurement resonant frequency range of 1kHz to 10MHz. The chip includes a built-in clock, which reduces the size and cost of the chip's peripheral circuitry. In one embodiment, to achieve device miniaturization, integration, and mass production, as well as to facilitate circuit board structural fixturing, the chip can be an inductance measurement chip, such as the LDC1612 / 1614.

[0053] In a feasible embodiment, the control module includes a single-chip microcomputer and a host computer connected to the single-chip microcomputer. The single-chip microcomputer is used to obtain data information and transmit the data information to the host computer. The host computer is used to obtain data information and calculate the distance between the sensing module 30 and the metal printing platform based on the data information to obtain leveling data. The single-chip microcomputer can be the single-chip microcomputer on the nozzle 22, and the single-chip microcomputer is connected to the external host computer through the connector 60, as shown in Figure 2. The single-chip microcomputer can also be an independent single-chip microcomputer. The data information includes real-time clock, temperature, signal frequency, etc. The host computer pre-stores a pre-configured formula for calculating the distance between the nozzle module 20 and the metal printing platform. The pre-configured formula can be a distance algorithm of the relevant technology, or a distance algorithm designed by a developer.

[0054] Subsequently, in one feasible embodiment, as the sensing module 30 follows the nozzle module 20 along a preset leveling path, each collection point 201 does not need to move downward or upward on the z-axis. The distance between the sensing module 30 and the metal printing platform at each collection point 201 is acquired in real time. This allows for the acquisition of distance data for more collection points 201 to be completed in a short period of time. The leveling method can utilize dense grid sampling to construct a scanning surface for the metal printing platform, thereby improving leveling accuracy. In another feasible embodiment, during the printing process, as the nozzle module 20 moves, the distance between the sensing module 30 and the metal printing platform is acquired in real time. Based on the acquired distance data, the distance between the z-axis nozzle module 20 and the metal printing platform is adjusted in real time to ensure that the nozzle 22 moves at the specified distance from the metal printing platform.

[0055] FIG11 is a flow chart of a leveling method for an inductive leveling device according to an embodiment of the present application. It should be noted that the method of the present application is not limited to the flow sequence shown in FIG11 if substantially the same result is achieved. As shown in FIG11 , the method includes the following steps:

[0056] Step S101: When the sensing module follows the nozzle module in moving along the preset leveling path, the acquisition module acquires inductance signals of each acquisition point in the preset leveling path in real time and converts the inductance signals into data information.

[0057] In step S101, as shown in FIG3 , the preset leveling path 200 may include multiple acquisition points 201 . The number and location of acquisition points 201 may be set based on actual conditions. As the sensing module follows the nozzle module through each acquisition point 201, the acquisition module collects an inductance signal and converts the inductance signal into data information. Because changes in the distance between the induction coil and the metal printing platform can cause changes in the impedance, inductance, and quality factor of the induction coil, any one of the impedance, inductance, and quality factor of the induction coil can be selected and converted into an electrical signal for measurement. That is, the inductance signal includes at least one of the impedance, inductance, and quality factor of the induction coil in the sensing module.

[0058] Step S102: acquiring data information through the control module, and calculating the distance between the sensing module and the metal printing platform according to the data information to obtain leveling data.

[0059] In step S102, the control module includes a single-chip microcomputer and a host computer connected to the single-chip microcomputer. The single-chip microcomputer is used to obtain data information and transmit the data information to the host computer. The host computer is used to obtain the data information and calculate the distance between the sensing module and the metal printing platform based on the data information to obtain leveling data. The single-chip microcomputer can be a single-chip microcomputer on the nozzle or a single-chip microcomputer used independently. The data information includes real-time clock, temperature, signal frequency, etc. The host computer pre-stores a pre-configured formula for calculating the distance between the sensing module and the metal printing platform. The pre-configured formula can be a distance algorithm of the relevant technology or a distance algorithm designed by the developer.

[0060] After step S102, the method further includes: subsequently, in one feasible embodiment, the sensing module follows the nozzle module along the preset leveling path, and each collection point does not need to move downward and upward on the z-axis. The distance between the sensing module and the metal printing platform at each collection point is obtained in real time, and the distance data of more collection points can be collected in a short time. The leveling method can select dense grid sampling to construct a scanning surface of the metal printing platform, thereby improving the leveling accuracy. In another feasible embodiment, during the printing process, as the nozzle module moves, the distance between the sensing module and the metal printing platform is collected in real time, and the distance between the Z-axis nozzle module and the metal printing platform is adjusted in real time based on the collected distance data to ensure that the nozzle and the metal printing platform move at a specified distance.

[0061] The leveling method of the inductive leveling device of one embodiment of the present application improves the leveling efficiency by enabling the nozzle module to obtain leveling data without moving in the Z-axis direction; and during the printing process, the distance between the sensing module and the metal printing platform is collected in real time, that is, the distance between the Z-axis nozzle module and the metal printing platform is adjusted in real time without delay, thereby improving the printing quality.

[0062] The above is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An inductive leveling device for a 3D printer, characterized in that: The 3D printer includes a nozzle module for extruding consumables, the nozzle module having a nozzle, and the inductive leveling device includes: case; A sensing module is provided on the housing, wherein the sensing module moves along a preset leveling path following the nozzle module and forms an inductance with the metal printing platform; an acquisition module, connected to the sensing module, for acquiring an inductance signal and converting the inductance signal into data information; A control module is connected to the acquisition module and is used to obtain the data information and calculate the distance between the sensing module and the metal printing platform according to the data information to obtain leveling data.

2. The inductive leveling device according to claim 1, characterized in that: The sensing module includes a fixing bracket fixed to the bottom of the shell and an induction coil arranged on the fixing bracket.

3. The inductive leveling device according to claim 2, characterized in that: The nozzle is disposed at the center of one or more of the induction coils.

4. The inductive leveling device according to claim 3, characterized in that: A plurality of induction coils are provided on the fixing bracket, and the plurality of induction coils are concentrically arranged.

5. The inductive leveling device according to claim 2, characterized in that: A plurality of the induction coils are provided on the fixing bracket, and the plurality of the induction coils are evenly arranged around the nozzle with the nozzle as the center.

6. The inductive leveling device according to any one of claims 2 to 5, characterized in that: The induction coil is selected from any one of a triangular coil, a rectangular coil or a ring coil.

7. The inductive leveling device according to claim 2, characterized in that: The acquisition module includes a circuit board and a chip integrated on the circuit board and connected to the induction coil.

8. The inductive leveling device according to claim 7, characterized in that: The control module includes a single-chip microcomputer and a host computer connected to the single-chip microcomputer. The single-chip microcomputer is used to obtain the data information and transmit the data information to the host computer. The host computer is used to obtain the data information and calculate the distance between the sensing module and the metal printing platform based on the data information to obtain leveling data.

9. A leveling method based on an inductive leveling device, characterized in that: The inductive leveling device is provided in a 3D printer, the 3D printer includes a nozzle module for extruding consumables, the nozzle module has a nozzle, the inductive leveling device includes a housing, a sensing module, a collection module and a control module, the sensing module is provided on the housing, the collection module is connected to the sensing module, and the control module is connected to the collection module; the leveling method includes: When the sensing module follows the nozzle module in moving along the preset leveling path, the acquisition module collects in real time the inductance signal of each acquisition point in the preset leveling path and converts the inductance signal into data information; The data information is acquired through a control module, and the distance between the sensing module and the metal printing platform is calculated according to the data information to obtain leveling data.

10. The leveling method according to claim 9, characterized in that: The inductance signal includes at least one of an impedance, an inductance, and a quality factor of an induction coil in the sensing module.

11. The leveling method according to claim 9, characterized in that: The sensing module includes a fixing bracket fixed to the bottom of the shell and an induction coil arranged on the fixing bracket.

12. The leveling method according to claim 11, characterized in that: The nozzle is disposed at the center of one or more of the induction coils.

13. The leveling method according to claim 12, characterized in that: A plurality of induction coils are provided on the fixing bracket, and the plurality of induction coils are concentrically arranged.

14. The leveling method according to claim 11, characterized in that: A plurality of the induction coils are provided on the fixing bracket, and the plurality of the induction coils are evenly arranged around the nozzle with the nozzle as the center.

15. The leveling method according to claim 11, characterized in that: The induction coil is selected from any one of a triangular coil, a rectangular coil or a ring coil.

16. The leveling method according to claim 12, characterized in that: The induction coil is selected from any one of a triangular coil, a rectangular coil or a ring coil.

17. The leveling method according to claim 13, characterized in that: The induction coil is selected from any one of a triangular coil, a rectangular coil or a ring coil.

18. The leveling method according to claim 14, characterized in that: The induction coil is selected from any one of a triangular coil, a rectangular coil or a ring coil.

19. The leveling method according to claim 11, characterized in that: The acquisition module includes a circuit board and a chip integrated on the circuit board and connected to the induction coil.

20. The leveling method according to claim 19, characterized in that: The control module includes a single-chip microcomputer and a host computer connected to the single-chip microcomputer. The data information is obtained by the single-chip microcomputer and transmitted to the host computer. The data information is obtained by the host computer and the distance between the sensing module and the metal printing platform is calculated based on the data information to obtain the leveling data.

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