Soundproof flooring

Abstract

A soundproof flooring, comprising a surface treatment layer (10), a protective layer (11), a decorative layer (12), a first carrier (13), a first buffer layer (14) and a second carrier (15). The surface treatment layer (10) is arranged on a side of the protective layer (11); the decorative layer (12) is arranged on the other side of the protective layer (11); the first carrier (13) is arranged between the decorative layer (12) and the first buffer layer (14); the first buffer layer (14) is arranged between the first carrier (13) and the second carrier (15); the first buffer layer (14) is a porous structure and / or a mesh structure. The flooring provided with the first buffer layer (14) having a porous and / or honeycomb structure reflects and refracts noise multiple times within the porous or honeycomb structure, so as to attenuate sound and extend a propagation path of sound waves, thus achieving the effect of more effectively reducing noise transmission.

Description

A silent floor Technical Field

[0001] The utility model relates to the technical field of floors, in particular to a sound-proof floor. Background Art

[0002] Existing flooring consists of a wear-resistant layer, a decorative layer, a carrier layer, and a buffer layer, all designed to meet the requirements for strength, wear resistance, decorative effect, and comfort. Currently, adding a sound-absorbing mat to the bottom of the floor reduces noise transmission. However, this approach has limited effectiveness. Therefore, there is a need for a sound-absorbing flooring that can further reduce noise transmission.

[0003] Utility Model Content

[0004] Based on this, a floor is provided to solve the problem of limited reduction of noise transmission.

[0005] A soundproof floor comprises a surface treatment layer, a protective layer, a decorative layer, a first carrier, a first buffer layer, and a second carrier;

[0006] The surface treatment layer is arranged on one side of the protective layer, the decorative layer is arranged on the other side of the protective layer, the first carrier is arranged between the decorative layer and the first buffer layer, the first buffer layer is arranged between the first carrier and the second carrier, and the first buffer layer is a porous structure and / or a mesh structure.

[0007] Furthermore, the porous structure includes a closed-cell porous structure, a semi-closed-cell porous structure and an open-cell porous structure.

[0008] Furthermore, the porous structural material is one or more of polyolefin foam, expanded polystyrene, expanded polypropylene, expanded rubber, expanded ethylene vinyl acetate, expanded ethylene, expanded polyethylene, ethylene-vinyl acetate copolymer, radiation cross-linked polyethylene, polypropylene, compressible natural material, and polystyrene.

[0009] Furthermore, the network structure includes a honeycomb structure and a network stacking structure.

[0010] Furthermore, the mesh structure material is one or more of ethylene-vinyl acetate copolymer, radiation cross-linked polyethylene, expanded polypropylene, and expanded polystyrene.

[0011] Furthermore, the first carrier is one or more of a high-density fiberboard layer, a wood-plastic composite material layer, a polyvinyl chloride resin layer, a high-end vinyl material layer, a polyethylene terephthalate layer, a polypropylene resin layer or a polyethylene terephthalate-1,4-cyclohexanedimethanol layer.

[0012] Furthermore, the first carrier includes at least one reinforcement layer, and the reinforcement layer is located inside the first carrier.

[0013] Further, the reinforcement layer comprises a net or a mesh.

[0014] Further, the net or mesh comprises fiberglass, jute and / or cotton.

[0015] Furthermore, a second buffer layer is included, and the second buffer layer is arranged on a side of the second carrier away from the first buffer layer.

[0016] Beneficial effects of the utility model:

[0017] The present application provides a floor with a first buffer layer having a porous and / or honeycomb structure, so that the noise undergoes multiple reflections and refractions in the porous or honeycomb structure, thereby attenuating the sound and extending the sound wave propagation path, thereby achieving a more effective effect of reducing noise propagation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0019] FIG1 is a schematic diagram of the overall structure of a soundproof floor in one embodiment;

[0020] FIG2 is a schematic diagram of the overall structure of a soundproof floor in another embodiment;

[0021] FIG3 is a schematic cross-sectional view of a porous structure of a first buffer layer in one embodiment;

[0022] FIG4 is a schematic cross-sectional view of a mesh structure of a first buffer layer in one embodiment;

[0023] FIG5 is a schematic structural diagram of a first carrier in one embodiment;

[0024] FIG6 is a schematic structural diagram of a first carrier in another embodiment;

[0025] FIG7 is a perspective view of a first buffer groove formed on one side of a soundproof floor according to an embodiment;

[0026] FIG8 is a cross-sectional view of a first buffer groove formed on one side of a soundproof floor according to an embodiment;

[0027] FIG9 is an assembly diagram of a soundproof floor having a first buffer groove formed on one side thereof in one embodiment;

[0028] FIG10 is a perspective view of another embodiment of a soundproof floor having a second buffer groove formed on the end surface thereof;

[0029] FIG11 is a cross-sectional view of another embodiment of a soundproof floor having a second buffer groove formed on the end surface thereof;

[0030] FIG. 12 is an assembly diagram of another embodiment in which a second buffer groove is provided on the end surface of the soundproof floor.

[0031] The names and serial numbers of the components in the figure are: 10-surface treatment layer; 11-protective layer; 12-decorative layer; 13-first carrier; 132-reinforcement layer; 14-first buffer layer; 15-second carrier; 16-second buffer layer; 17-first buffer groove, 18-second buffer groove.

[0032] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0035] In addition, the descriptions of "first", "second", etc. in this utility model are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features specified as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, "and / or" in the full text includes three solutions. Taking A and / or B as an example, it includes technical solution A, technical solution B, and technical solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0036] Referring to Figures 1, 3 and 4, Example 1 provides a soundproof floor, which includes, from top to bottom, a surface treatment layer 10, a protective layer 11, a decorative layer 12, a first carrier 13, a first buffer layer 14 and a second carrier 15. The surface treatment layer 10 is arranged on one side of the protective layer 11, the decorative layer 12 is arranged on the other side of the protective layer 11, the first carrier 13 is arranged between the decorative layer 12 and the first buffer layer 14, and the first buffer layer 14 is arranged between the first carrier 13 and the second carrier 15. The first buffer layer 14 has a porous and / or mesh structure.

[0037] The first buffer layer 14 with a porous and / or mesh structure provided in the present application can cause noise to undergo multiple reflections and refractions in the porous or honeycomb structure, thereby attenuating the sound and extending the sound wave propagation path, thereby effectively reducing the effect of noise propagation. At the same time, the first buffer layer 14 with a porous and / or mesh structure is compressible, and can also alleviate the impact of contact between the layers of the floor and between the floor and the ground, thereby reducing the effect of noise propagation.

[0038] Specifically, the porous structure includes a closed-cell porous structure, a semi-closed-cell porous structure, and an open-cell porous structure; the reticular structure includes a honeycomb structure and a reticular stacking structure. The material of the porous structure is one or more of polyolefin foam, expanded polystyrene, expanded polypropylene, expanded rubber, expanded ethylene vinyl acetate, expanded ethylene, expanded polyethylene, ethylene-vinyl acetate copolymer (EVA), radiation-crosslinked polyethylene (IXPE), polypropylene (PP), compressible natural materials, and expanded polystyrene (XPS); the material of the reticular structure is one or more of ethylene-vinyl acetate copolymer (EVA), radiation-crosslinked polyethylene (IXPE), expanded polypropylene (XPP), and expanded polystyrene (XPS). It can be understood that the porous structure and the reticular structure can cause noise to be reflected and refracted multiple times, attenuating the sound and extending the sound wave propagation path, thereby reducing the propagation of noise.

[0039] Referring to Figure 2 , in another embodiment, the soundproof floor further comprises a second buffer layer 16, based on the first embodiment. The second buffer layer 16 is disposed on a side of the second carrier 15 away from the first buffer layer 14. The second buffer layer provides a sound-absorbing effect to the floor, absorbing and reducing the energy of sound waves transmitted during use.

[0040] Specifically, the second buffer layer 16 is a sound-absorbing layer made of at least one polymer material or non-woven fiber, such as but not limited to polyurethane, which can further optimize the acoustic properties of the floor. The second buffer layer 16 can be composed of a foam layer of ethylene-vinyl acetate copolymer (EVA), radiation cross-linked polyethylene (IXPE), expanded polypropylene (XPP) and / or expanded polystyrene (XPS); the second buffer layer 16 can also be made of non-woven fibers, such as polyethylene terephthalate (PET). The second buffer layer 16 can also be a compressible natural material, such as felt, cotton, wool, mycelium, hemp, cork and / or the like. The interior of cork is composed of many small holes or bubbles, which are called "air chambers". This structure of cork gives it good temperature, sound and vibration insulation properties, and can effectively isolate external noise and vibration. The optional density range of the second buffer layer 16 is 65kg / m 3 ~300kg / m 3 , especially 80kg / m 3 ~150kg / m 3 It is understood that the floor comprises at least one adhesive layer on the bottom surface of the second carrier 15, or when a second buffer layer 16 is used, comprises at least one adhesive layer on the second buffer layer 16, and the adhesive layer may be a conductive adhesive layer or a conductive glue layer.

[0041] In other embodiments, the first buffer layer 14 can be selected from the following materials: closed-cell flexible foam, compressible foam, flexible polymer, elastomer, compressible natural material and / or any combination of the foregoing. Optionally, the first buffer layer 14 includes at least 50% closed-cell flexible foam and / or compressible foam; optionally, the first buffer layer 14 includes at least 80% closed-cell flexible foam material. The first buffer layer 14 can be a compressible foam with a closed-cell porous structure, which can achieve sufficient compressible behavior while being strong enough to support the load applied by the top layer of the surface treatment layer. The first buffer layer 14 can also be a compressible foam with a semi-closed-cell porous structure or an open-cell porous structure. It can be understood that the open-cell porous structure or the semi-closed-cell porous structure has the advantage of improved sound absorption. Alternatively, the first buffer layer 14 is a foamed layer. In this case, the foam pore size and porosity of the foamed material of the first buffer layer 14 can be controlled by a foaming reaction, specifically by adjusting the amount of a foaming catalyst, to achieve open, semi-open, and closed cells. Alternatively, the first buffer layer 14 can also be a substantially solid non-foamed layer. In this case, the best results are achieved using a material selected from the group consisting of flexible polymers and elastomers, such as rubber, latex, acrylic elastic epoxy resin, cis-polyisoprene (natural rubber, NR), cis-polybutadiene (butadiene rubber, BR), nitrile rubber (NBR), styrene-butadiene rubber (SBR), rubber, latex, and / or ethylene-propylene monomer (EPM). When the first buffer layer 14 comprises a compressible natural material, the material can be selected from materials such as felt, cotton, wool, mycelium, hemp, cork, and / or the like. The interior of cork is composed of many small pores or cells, which are called "air cells." This structure of cork gives it excellent temperature, sound, and vibration insulation properties, effectively isolating it from external noise and vibration. These examples are non-limiting, and any similar foam material with equivalent material properties can be used. The thickness of the first buffer layer 14 is generally in the range of 0.8 mm to 4 mm, and more particularly in the range of 0.8 mm to 2 mm. In a further embodiment, the first buffer layer 14 has a thickness in the range of 0.75 mm to 1.25 mm in the uncompressed state.

[0042] Referring to Figure 5 , in this embodiment, the first carrier 13 includes at least one reinforcement layer 132, which is located within the first carrier 13. The thickness of the reinforcement layer 132 is less than the thickness of the first carrier, preferably less than half the thickness of the first carrier. Referring to Figure 6 , in another embodiment, the first carrier 13 includes at least two reinforcement layers 132, one of which is located near the upper surface of the first carrier 13, at a distance less than half the thickness of the first carrier 13, and the other is located near the lower surface of the first carrier 13, at a distance less than half the thickness of the first carrier 13. By adding reinforcement layers 132 within the first carrier 13, the overall strength of the first carrier is increased, the dimensional stability of the first carrier at high temperatures is improved, and shrinkage is reduced.

[0043] Specifically, the first carrier 13 is one or more of a high-density fiberboard layer, a wood-plastic composite material layer, a polyvinyl chloride resin layer, a high-end vinyl material layer (LVT substrate layer), a polyethylene terephthalate layer (PET substrate layer), a polypropylene resin layer (PP substrate layer) or a polyethylene terephthalate-1,4-cyclohexanedimethanol layer (PETG substrate layer).

[0044] The polyvinyl chloride resin layer includes a foamed polyvinyl chloride base material layer or a hard polyvinyl chloride base material layer.

[0045] Specifically, the reinforcing layer 132 includes a net or mesh, the net or mesh includes glass fiber, jute and / or cotton, the first carrier 13 is one or more of a high-density fiberboard (HDF) layer, a wood-plastic composite material layer (WPC substrate layer), a polyvinyl chloride resin layer, a high-end vinyl material layer (LVT substrate layer), a polyethylene terephthalate layer (PET substrate layer), a polypropylene resin layer (PP substrate layer) or a polyethylene terephthalate-1,4-cyclohexanedimethanol ester layer (PETG substrate layer), wherein the polyvinyl chloride resin layer includes a hair When the first carrier 13 is missing, the decorative layer 12 is difficult to directly adhere to the first buffer layer 14, and the adhesion is not firm. When the feet fall on the floor in use, the feeling of wooden feet cannot be simulated. When the hardness of the decorative layer 12 is low, a more obvious depression will appear on the top of the floor. The setting of the first carrier 13 can improve the mechanical properties of the top of the floor without adversely affecting the overall flexibility of the floor, so that the top layer of the floor simulates the hard texture of the wooden floor, does not cause depression on the top, and facilitates the adhesion of the decorative layer 12.

[0046] In this embodiment, the surface treatment layer 10 is a surface layer having surface properties such as antibacterial, anti-slip, water-resistant, scratch-resistant, and anti-aging functions, such as an ultraviolet curing coating (UV) layer or a paint layer. In addition, the surface treatment layer 10 has convex patterns.

[0047] In this embodiment, the protective layer 11 is a wear-resistant layer or a scratch-resistant layer. The wear-resistant layer may include one or more transparent layers of thermoplastic or thermosetting resins. Non-limiting examples of thermoplastic or thermosetting materials that can be used are polyvinyl chloride (PVC), polystyrene (PS), polyethylene (PE), polyurethane (PU), acrylonitrile-butadiene-styrene (ABS), polypropylene (PP), polyethylene terephthalate (PET), phenolic resin and / or melamine resin or formaldehyde resin. Fillers such as aluminum oxide and metallic color powder may also be used. The wear-resistant layer may also be in liquid or paste form made of thermosetting resin, such as but not limited to phenolic resin and / or melamine resin or formaldehyde resin. In addition, the wear-resistant layer may also include an inherently scratch-resistant thermosetting resin impregnated with a carrier layer such as paper or wood cellulose, or may be essentially composed of an inherently scratch-resistant thermosetting resin impregnated with a carrier layer such as paper or wood cellulose. The advantage of the latter embodiment (the embodiment consisting essentially of the inherently scratch resistant thermosetting resin described above) is that the urea-formaldehyde also acts relatively scratch resistant. Typically, the thickness of the wear layer structure is in the range of 0.1 mm to 2.0 mm.

[0048] Specifically, the second carrier 15 is a high-density fiberboard (HDF) layer, a wood-plastic composite (WPC) layer, a polyvinyl chloride resin layer, a high-end vinyl flooring (LVT) layer, a polyethylene terephthalate (PET) layer, a polypropylene resin (PP) layer, or a polyethylene terephthalate-1,4-cyclohexanedimethanol (PETG) layer. The presence of the second carrier 15 can further contribute to the acoustic performance of the floor, providing better strength and stability.

[0049] In this embodiment, the first buffer layer 14 has a Shore A hardness of 80 to 100, the first carrier 13 has an elastic modulus in the range of 100 MPa to 500 MPa, and the second carrier 15 has an elastic modulus in the range of 2000 MPa to 7000 MPa. In another optional embodiment, the first carrier 13 has an elastic modulus in the range of 100 MPa to 300 MPa. Compared to the prior art silent flooring, the first buffer layer is too soft, and the first carrier is a harder SPC substrate. The first buffer layer of the present invention is harder and has better elasticity. The first carrier uses a high-end vinyl flooring (LVT) layer, which is softer and more easily deformed than the SPC substrate. In this case, when a person steps on the first carrier and the first buffer layer, the degree of deformation is large, and when the foot is removed, the first buffer layer and the first carrier as a whole have the best rebound, resulting in a better silent effect.

[0050] The polyvinyl chloride resin layer includes a foamed polyvinyl chloride substrate layer or a rigid polyvinyl chloride substrate layer. When the second carrier 15 is a foamed polyvinyl chloride substrate layer, it has an elastic modulus in the range of 2000 MPa to 3000 MPa. When the second carrier 15 is a rigid polyvinyl chloride substrate layer, it has an elastic modulus in the range of 3000 MPa to 7000 MPa.

[0051] Specifically, the decorative layer can be composed of multiple impregnated layers, which can be made of one or more of wood cellulose, wood veneer, thermoplastic plastic layer, stone veneer, and veneer layer. The veneer is preferably wood veneer, cork veneer, bamboo veneer, etc.; the veneer can also be made of other materials, such as ceramic tile or porcelain, real stone veneer, rubber veneer, decorative plastic or vinyl, linoleum, and laminated decorative thermoplastic material in the form of foil or film, which thermoplastic material can be polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), etc. The design of the decorative layer can be selected from a design database, which includes digitally processed designs, traditional patterns, pictures or image files, customized digital artwork, random image patterns, abstract art, wood grain images, ceramic or concrete style images, or user-defined patterns. The decorative layer can be printed or reproduced using a laser printer, inkjet printer, or any other digital printing technology including conventional printing methods, which can also use various types of inks to meet the design requirements of the decorative layer. Preferably, the ink used in the printing method includes, but is not limited to, properties such as waterproof, lightfast, acid-free, metallic, glossy, iridescent, or deep black. Furthermore, the decorative layer can be a substantially transparent coating to achieve a better visual effect. The decorative layer can also have a pattern, which can be produced by digital printing, inkjet printing, rotogravure printing, electronic spool (ELS) rotogravure printing, automatic plastic printing, offset printing, flexographic printing, or rotary printing. The thickness of the decorative layer ranges from 0.05 mm to 0.10 mm, for example, 0.07 mm.

[0052] Another embodiment of the present invention, with reference to Figures 7 to 9, provides a soundproof floor. A first buffer layer 14 is provided with a buffer groove (17, 18) on at least one side surface. The buffer groove (17, 18) extends to both ends of the side surface. The notches of the buffer groove (17, 18) face the outside of the side surface of the floor. The width of the widest part of the buffer groove is less than or equal to the thickness of the first buffer layer 14. When in use, the upper part of the floor is subjected to force. The first buffer layer will expand toward the side of the floor when squeezed. By providing the buffer groove in the first buffer layer 14, the protrusion formed by the expansion of the first buffer layer 14 can be accommodated. Although the first buffer layer 14 expands, it does not form a protrusion toward the side surface of the floor, thereby avoiding the formation of a seam at the joint of the two floor panels, the expansion of the seam, or the unevenness of the joint of the two floor panels. The soundproof floor has better installation and use effects. Specifically, the silent floor comprises, from top to bottom, a surface treatment layer 10, a protective layer 11, a decorative layer 12, a first carrier 13, a first buffer layer 14, and a second carrier 15. The surface treatment layer 10 is disposed on one side of the protective layer 11, the decorative layer 12 is disposed on the other side of the protective layer 11, the first carrier 13 is disposed between the decorative layer 12 and the first buffer layer 14, and the first buffer layer 14 is disposed between the first carrier 13 and the second carrier 15. The first buffer layer 14 has a porous and / or mesh structure. A first buffer groove 17 is provided on at least one side of the silent floor. The first buffer groove 17 is provided in the first buffer layer 14 and extends to and through both ends of the silent floor. Referring to Figures 10 and 11, another alternative embodiment of the silent floor is provided with a second buffer groove 18 on at least one end surface. The second buffer groove 18 is provided in the first buffer layer 14 and extends to and through both sides of the silent floor. Specifically, the two side surfaces of the soundproof floor are respectively provided with a first buffer groove 17, and the two end surfaces are respectively provided with a second buffer groove 18. The cross-sectional shape of the first buffer groove 17 and the second buffer groove 18 is a semicircular shape, and can also be other arc-shaped or triangular shapes. The slot width of the first buffer groove 17 and the second buffer groove 18 is less than or equal to the thickness of the first buffer layer 14. It should be noted that the first buffer groove 17 extends and passes through the two ends of the soundproof floor, and the second buffer groove 18 extends and passes through the two sides of the soundproof floor is a preferred embodiment. Under the premise of meeting the aforementioned mounting and use effects, the first buffer groove 17 and the second buffer groove 18 do not need to be completely passed through. The first buffer groove 17 and the second buffer groove 18 have sufficient length. The groove walls of smaller thickness at both ends of the first buffer groove 17 and the second buffer groove 18 do not affect the technical effect of the present invention and also fall within the protection scope of this application.

[0053] Example 1

[0054] The surface treatment layer 10 is made of ultraviolet light curing paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first buffer layer 14 is made of IXPP, a closed-cell flexible foam, the second carrier 15 is made of a rigid polyvinyl chloride material layer, the second buffer layer 16 is made of IXPE, and the first carrier 13 includes a reinforcing layer 132, the reinforcing layer 132 is made of glass fiber, and the glass fiber of the reinforcing layer 132 is located inside the first carrier.

[0055] Example 2

[0056] The surface treatment layer 10 is made of ultraviolet light curing paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first buffer layer 14 is made of IXPP, a closed-cell flexible foam, the second carrier 15 is made of a rigid polyvinyl chloride material layer, the second buffer layer 16 is made of IXPE, and the first carrier 13 includes a reinforcing layer 132, the reinforcing layer 132 is made of glass fiber, and the glass fiber of the reinforcing layer 132 is located inside the first carrier.

[0057] Example 3

[0058] The surface treatment layer 10 uses ultraviolet light curing paint, the protective layer 11 uses polyvinyl chloride material, the decorative layer 12 uses polyvinyl chloride material, high-end vinyl flooring (LVT), the first buffer layer 14 uses IXPP, a closed-cell flexible foam, the second carrier 15 uses a foamed polyvinyl chloride material layer, the second buffer layer 16 uses IXPE, and the first carrier 13 includes a reinforcing layer 132, the reinforcing layer 132 uses glass fiber, and the glass fiber of the reinforcing layer 132 is located inside the first carrier.

[0059] Example 4

[0060] The surface treatment layer 10 uses ultraviolet light curing paint, the protective layer 11 uses polyvinyl chloride material, the decorative layer 12 uses polyvinyl chloride material, the first carrier 13 uses high-density fiberboard (HDF), the first buffer layer 14 uses IXPP, a closed-cell flexible foam, the second carrier 15 uses a foamed polyvinyl chloride material layer, the second buffer layer 16 uses IXPE, and the first carrier 13 includes a reinforcing layer 132, the reinforcing layer 132 uses glass fiber, and the glass fiber of the reinforcing layer 132 is located inside the first carrier.

[0061] Comparative Example 1

[0062] The surface treatment layer 10 uses ultraviolet light curing paint, the protective layer 11 uses polyvinyl chloride material, the decorative layer 12 uses polyvinyl chloride material, the first carrier 13 uses high-end vinyl flooring (LVT), the first buffer layer 14 uses IXPP, a closed-cell flexible foam, the second carrier 15 uses a rigid polyvinyl chloride material layer, the second buffer layer 16 uses IXPE, and the first carrier 13 does not include a reinforcement layer 132.

[0063] Comparative Example 2

[0064] The surface treatment layer 10 uses ultraviolet light curing paint, the protective layer 11 uses polyvinyl chloride material, the decorative layer 12 uses polyvinyl chloride material, high-end vinyl flooring (LVT), the first buffer layer 14 uses IXPP, closed-cell flexible foam, the second carrier 15 uses a foamed polyvinyl chloride material layer, the second buffer layer 16 uses IXPE, and the first carrier 13 does not include a reinforcement layer 132.

[0065] Comparative Example 3

[0066] The surface treatment layer 10 is made of ultraviolet light curing paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first buffer layer 14 is made of IXPP, a closed-cell flexible foam, the second carrier 15 is made of a rigid polyvinyl chloride material layer, the second buffer layer 16 is made of IXPE, and the glass fiber of the reinforcement layer 132 is located under the first carrier.

[0067] Comparative Example 4

[0068] The surface treatment layer 10 is made of ultraviolet light curing paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, high-end vinyl flooring (LVT), the first buffer layer 14 is made of IXPP, a closed-cell flexible foam, the second carrier 15 is made of a foamed polyvinyl chloride material layer, the second buffer layer 16 is made of IXPE, and the glass fiber of the reinforcement layer 132 is located under the first carrier.

[0069] Comparative Example 5

[0070] The surface treatment layer 10 is made of ultraviolet light curing paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, the first carrier 13 is made of high-end vinyl flooring (LVT), the first buffer layer 14 is made of IXPP, a closed-cell flexible foam, the second carrier 15 is made of a rigid polyvinyl chloride material layer, the second buffer layer 16 is made of IXPE, and the glass fiber of the reinforcement layer 132 is located above the first carrier.

[0071] Comparative Example 6

[0072] The surface treatment layer 10 is made of ultraviolet light curing paint, the protective layer 11 is made of polyvinyl chloride material, the decorative layer 12 is made of polyvinyl chloride material, high-end vinyl flooring (LVT), the first buffer layer 14 is made of IXPP, a closed-cell flexible foam, the second carrier 15 is made of a foamed polyvinyl chloride material layer, the second buffer layer 16 is made of IXPE, and the glass fiber of the reinforcement layer 132 is located above the first carrier.

[0073] The floors of Examples 1, 2, 3, and 4 and the floors of Comparative Examples 1-6 were baked in an oven at 80° C. for 6 hours and compared and analyzed. The results are shown in Table 1:

[0074] Table 1 Heat resistance test results

[0075] It can be seen from Table 1 above that compared with the floors prepared in Comparative Examples 1-6, the floors prepared in Examples 1-4 have significantly better heat resistance, better dimensional stability at high temperatures (less warping), and lower shrinkage due to the provision of an extremely strong layer in the first carrier.

[0076] The above are only preferred embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the utility model concept, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A silent floor, characterized in that, It includes a surface treatment layer, a protective layer, a decorative layer, a first carrier, a first buffer layer, and a second carrier; The surface treatment layer is provided on one side of the protective layer, the decorative layer is provided on the other side of the protective layer, the first carrier is disposed between the decorative layer and the first buffer layer, the first buffer layer is provided between the first carrier and the second carrier, and the first buffer layer is a porous structure and / or a mesh structure.

2. The silent floor according to claim 1, characterized in that, The porous structure includes a closed-cell porous structure, a semi-closed-cell porous structure, and an open-cell porous structure.

3. The silent floor according to claim 2, characterized in that, The porous structure material is one or more of polyolefin foam, expanded polystyrene, expanded polypropylene, expanded rubber, expanded ethylene vinyl acetate, expanded ethylene, expanded polyethylene, ethylene-vinyl acetate copolymer, irradiated cross-linked polyethylene, polypropylene, compressible natural material, and polystyrene.

4. The silent floor according to claim 1, characterized in that, The mesh structure includes a honeycomb structure and a mesh packing structure.

5. The silent floor according to claim 4, wherein, The mesh structure material is one or more of ethylene-vinyl acetate copolymer, irradiated cross-linked polyethylene, foamed polypropylene, and foamed polystyrene.

6. The silent floor according to claim 1, wherein The first carrier is one or more of a high-density fiberboard layer, a wood-plastic composite layer, a polyvinyl chloride resin layer, a high-end vinyl material layer, a polyethylene terephthalate layer, a polypropylene resin layer, or a polyethylene terephthalate-1,4-cyclohexanedimethanol ester layer.

7. The silent floor according to claim 1, characterized in that, The first carrier includes at least one reinforcing layer, and the reinforcing layer is located inside the first carrier.

8. The silent floor according to claim 7, characterized in that, The reinforcing layer includes a net or a mesh.

9. The silent floor according to claim 8, characterized in that, The net or the mesh includes glass fiber, jute, and / or cotton.

10. The silent floor according to claim 1, characterized in that, It further includes a second buffer layer, and the second buffer layer is provided on the side of the second carrier away from the first buffer layer.

11. The silent floor according to claim 1, characterized in that, At least one side surface of the first buffer layer is provided with a buffer groove, and the buffer groove extends to both ends of the side surface.

12. The silent floor according to claim 11, characterized in that, The notch of the buffer groove faces the outside of the side of the floor.

13. The silent floor according to claim 11, characterized in that, The width of the buffer groove is less than or equal to the thickness of the first buffer layer.

14. The silent floor according to claim 1, characterized in that, The first buffer layer has a Shore A hardness of 80 to 100, the first carrier has a modulus of elasticity in the range of 100 Mpa to 500 MPa, and the second carrier has a modulus of elasticity in the range of 2000 Mpa to 7000 MPa.

15. The silent floor according to claim 14, characterized in that, The first carrier has a modulus of elasticity in the range of 100 Mpa to 300 MPa, and when the second carrier is a foamed vinyl chloride substrate layer, it has a modulus of elasticity in the range of 2000 Mpa to 3000 MPa.

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