Fingerprint module and electronic device

Abstract

Provided in the embodiments of the present application are a fingerprint module and an electronic device. The fingerprint module comprises: an ultrasonic sensor, a circuit board and a buffer layer, wherein the ultrasonic sensor comprises a substrate and an ultrasonic module, the ultrasonic module being arranged on the substrate; the substrate is provided with a first electrical connection area, a second electrical connection area is provided on the circuit board, and the first electrical connection area is electrically connected to the second electrical connection area by means of a conductive bonding layer; the buffer layer is arranged between the ultrasonic sensor and a support structure on an electronic device; and the ultrasonic sensor is used for converting a received ultrasonic signal into an electrical signal and sending the electrical signal to a processing unit by means of the circuit board, such that the processing unit performs fingerprint recognition. By means of the fingerprint module provided by the present application, when an electronic device is subjected to external impact, the fingerprint module can be prevented from being broken due to relatively high stress.

Description

Fingerprint modules and electronic devices Technical Field

[0001] The embodiments of the present application relate to the technical field of fingerprint modules, and in particular to a fingerprint module and an electronic device. Background Art

[0002] There are two main publicly available under-screen fingerprint recognition solutions: optical and ultrasonic. The performance of optical fingerprint modules is significantly affected by the screen's light transmittance. With the increasing complexity of internal display wiring and the development of flexible screen solutions, the screen's optical transmittance has decreased, making optical fingerprint solutions no longer suitable for these applications. Ultrasonic fingerprint solutions, on the other hand, are independent of the screen's optical transmittance and offer a promising alternative.

[0003] The fingerprint module in the existing ultrasonic fingerprint solution is arranged between the screen and the supporting structure of the electronic device.

[0004] However, when the electronic device is subjected to external impact, the fingerprint module disposed between the screen and the supporting structure is subjected to high stress and is prone to breakage, resulting in damage to the fingerprint module.

[0005] Summary of the Invention

[0006] In view of this, embodiments of the present application provide a fingerprint module and an electronic device to at least partially solve the above problems.

[0007] According to a first aspect of an embodiment of the present application, a fingerprint module is provided, which is applied to an electronic device, and the fingerprint module includes: an ultrasonic sensor, a circuit board and a buffer layer; the ultrasonic sensor includes a substrate and an ultrasonic module, the ultrasonic module is arranged on the substrate, the substrate is provided with a first electrical connection area, and the circuit board is provided with a second electrical connection area, the first electrical connection area and the second electrical connection area are electrically connected through a conductive adhesive layer; the buffer layer is arranged between the ultrasonic sensor and a supporting structure on the electronic device; the circuit board is electrically connected to a processing unit of the electronic device, the ultrasonic module is used to transmit ultrasonic signals and receive ultrasonic signals reflected by external structures, the ultrasonic sensor is used to convert the ultrasonic signals received by the ultrasonic module into electrical signals, and send the electrical signals to the processing unit through the circuit board, so that the processing unit performs fingerprint recognition based on the electrical signals.

[0008] In a possible implementation, a projection of the ultrasonic module on the buffer layer along a direction perpendicular to the substrate is located within an edge of the buffer layer; and a projection of the second electrical connection area along a direction perpendicular to the substrate intersects with the buffer layer.

[0009] In a possible implementation manner, the buffer layer is in contact with the circuit board and the ultrasonic module in a direction perpendicular to the substrate.

[0010] In a possible implementation, in a direction perpendicular to the substrate, a first gap is provided between the buffer layer and the circuit board, and a second gap is provided between the buffer layer and the ultrasonic module.

[0011] In a possible implementation, a projection of the ultrasonic module on the buffer layer along a direction perpendicular to the substrate is located within an edge of the buffer layer; and a projection of the second electrical connection area along a direction perpendicular to the substrate does not intersect with the buffer layer.

[0012] In one possible implementation, the circuit board includes a substrate and the second electrical connection area arranged on the substrate. At one end of the circuit board close to the ultrasonic module, the substrate extends beyond the second electrical connection area, and the projection of the substrate in a direction perpendicular to the substrate intersects with the buffer layer.

[0013] In one possible implementation, the buffer layer includes a first buffer layer and a second buffer layer connected to each other, a projection of the first buffer layer on the substrate along a direction perpendicular to the substrate is located within the edge of the substrate in a first direction, the projection of the substrate along a direction perpendicular to the substrate intersects with the first buffer layer, and the projection of the ultrasonic module on the second buffer layer along a direction perpendicular to the substrate is located within the edge of the second buffer layer, wherein the first direction is perpendicular to the direction of the circuit board pointing to the ultrasonic module and is perpendicular to the substrate.

[0014] In a possible implementation manner, in a direction perpendicular to the substrate, the first buffer layer is in contact with the base material, and the second buffer layer is in contact with the ultrasonic module.

[0015] In a possible implementation, in a direction perpendicular to the substrate, a third gap is provided between the first buffer layer and the base material, and a fourth gap is provided between the second buffer layer and the ultrasonic wave transmission module.

[0016] In a possible implementation, projections of the circuit board and the conductive adhesive layer along a direction perpendicular to the substrate do not intersect with the buffer layer.

[0017] In a possible implementation manner, the buffer layer is in contact with the ultrasonic module in a direction perpendicular to the substrate.

[0018] In a possible implementation manner, a fifth gap is included between the buffer layer and the ultrasonic module in a direction perpendicular to the substrate.

[0019] In a possible implementation, the buffer layer includes a buffer foam, and the density of the buffer foam is in the range of [0.01 g / cm 3 ,0.5g / cm 3 ].

[0020] According to a second aspect of an embodiment of the present application, an electronic device is provided, comprising: a processing unit, a screen, a supporting structure, and a fingerprint module as described in the first aspect of the present application; the fingerprint module is arranged between the screen and the supporting structure, and the buffer layer in the fingerprint module is arranged between the ultrasonic sensor in the fingerprint module and the supporting structure, wherein the supporting structure includes a middle frame or a battery of the electronic device; the processing unit is electrically connected to the fingerprint module; the processing unit is used to perform fingerprint recognition based on the electrical signal transmitted by the fingerprint module.

[0021] According to the fingerprint module provided in the embodiment of the present application, the fingerprint module includes an ultrasonic sensor, a circuit board and a buffer layer. The buffer layer is arranged between the ultrasonic sensor and the supporting structure on the electronic device. Therefore, when the electronic device is subjected to external impact, the fingerprint module can be buffered by the buffer layer, thereby reducing the stress on the fingerprint module and preventing the fingerprint module from breaking when the electronic device is subjected to external impact, thereby preventing damage to the fingerprint module. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0023] FIG1 is a schematic diagram of a fingerprint module provided in an embodiment of the present application;

[0024] FIG2 is a schematic diagram of another fingerprint module provided in an embodiment of the present application;

[0025] FIG3 is a schematic top view of a fingerprint module provided in an embodiment of the present application;

[0026] FIG4 is a schematic diagram of another fingerprint module provided in an embodiment of the present application;

[0027] FIG5 is a schematic top view of another fingerprint module provided in an embodiment of the present application;

[0028] FIG6 is a schematic diagram of another fingerprint module provided in an embodiment of the present application;

[0029] FIG7 is a schematic diagram of another fingerprint module provided in an embodiment of the present application;

[0030] FIG8 is a schematic diagram of another fingerprint module provided in an embodiment of the present application;

[0031] FIG9 is a schematic top view of another fingerprint module provided in an embodiment of the present application;

[0032] FIG10 is a schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field should fall within the scope of protection of the embodiments of the present application.

[0034] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0035] It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0036] As previously mentioned, the fingerprint module in existing ultrasonic fingerprint solutions is placed between the screen and the supporting structure of the electronic device. However, when the electronic device is subjected to external impact (for example, mechanical shock or a fall), the fingerprint module placed between the screen and the supporting structure is subjected to high stress and is prone to fracture, resulting in damage to the fingerprint module. Therefore, the fingerprint module needs to be protected.

[0037] The present application provides a fingerprint module, which includes an ultrasonic sensor, a circuit board and a buffer layer. The buffer layer is arranged between the ultrasonic sensor and a supporting structure on an electronic device, so that the fingerprint module can be buffered by the buffer layer when the electronic device is subjected to external impact, thereby reducing the stress on the fingerprint module and preventing the fingerprint module from breaking when the electronic device is subjected to external impact, thereby preventing damage to the fingerprint module.

[0038] FIG1 is a schematic diagram of a fingerprint module provided in an embodiment of the present application. The fingerprint module is applied to an electronic device. As shown in FIG1 , the fingerprint module 100 includes an ultrasonic sensor 101, a circuit board 102, and a buffer layer 103. The ultrasonic sensor 101 includes a substrate 1011 and an ultrasonic module 1012. The ultrasonic module 1012 is disposed on the substrate 1011. The substrate 1011 is provided with a first electrical connection area 1013. The circuit board 102 is provided with a second electrical connection area 1021. The first electrical connection area 1013 and the second electrical connection area 1021 are electrically connected via a conductive adhesive layer 104. The buffer layer 103 is disposed between the ultrasonic sensor 101 and the support structure 201 of the electronic device.

[0039] The circuit board 102 is electrically connected to the processing unit of the electronic device. The ultrasonic module 1012 is used to transmit ultrasonic signals and receive ultrasonic signals reflected by external structures. The ultrasonic sensor 101 is used to convert the ultrasonic signals received by the ultrasonic module 1012 into electrical signals and send the electrical signals to the processing unit through the circuit board 102, so that the processing unit performs fingerprint recognition based on the electrical signals.

[0040] The fingerprint module 100 includes an ultrasonic sensor 101, a circuit board 102, and a buffer layer 103. The ultrasonic sensor 101 includes a substrate 1011 and an ultrasonic module 1012. A first electrical connection area 1013 is provided on the substrate 1011. The first electrical connection area 1013 and the ultrasonic module 1012 are located at different positions on the substrate 1011. The circuit board 102 includes a second electrical connection area 1021. The first electrical connection area 1013 and the second electrical connection area 1021 are electrically connected via a conductive adhesive layer 104. Optionally, the conductive adhesive layer 104 can be any conductive adhesive layer 104 structure, for example, conductive adhesive. In some optional embodiments, the conductive adhesive layer 104 can be an anisotropic conductive film (ACF).

[0041] The buffer layer 103 is arranged between the ultrasonic sensor 101 and the support structure 201 of the electronic device. When the electronic device is subjected to external impact, for example, the electronic device is subjected to mechanical impact or falls, the buffer layer 103 cushions the fingerprint module 100, reduces the stress on the fingerprint module 100, and prevents the fingerprint module 100 from being damaged.

[0042] In an embodiment of the present application, the fingerprint module 100 includes an ultrasonic sensor 101, a circuit board 102 and a buffer layer 103. The buffer layer 103 is arranged between the ultrasonic sensor 101 and the support structure 201 on the electronic device. Thus, when the electronic device is subjected to external impact, the fingerprint module 100 can be buffered by the buffer layer 103, thereby reducing the stress on the fingerprint module 100 and preventing the fingerprint module 100 from breaking when the electronic device is subjected to external impact, thereby preventing the fingerprint module 100 from being damaged.

[0043] In one possible implementation, as shown in Figure 1, the projection of the ultrasonic module 1012 on the buffer layer 103 along the direction perpendicular to the substrate 1011 is located within the edge of the buffer layer 103, and the projection of the second electrical connection area 1021 along the direction perpendicular to the substrate 1011 intersects with the buffer layer 103.

[0044] In a direction perpendicular to the substrate 1011 (i.e., perpendicular to the horizontal plane in FIG. 1 ), the projection of the ultrasonic module 1012 is located within the edge of the buffer layer 103. The buffer layer 103 is located between the ultrasonic module 1012 and the support structure 201 and is larger than the ultrasonic module 1012. In the structure shown in FIG. 1 , the left and right edges of the vertical projection of the ultrasonic module 1012 are located between the left and right edges of the buffer layer 103 and do not extend beyond the edge of the buffer layer 103. The projection of the second electrical connection area 1021 provided on the circuit board 102 in a direction perpendicular to the substrate 1011 (i.e., perpendicular to the horizontal plane in FIG. 1 ) intersects with the buffer layer 103. In other words, in the structure shown in FIG. 1 , the vertical projection of the second electrical connection area 1021 is at least partially located within the left edge of the buffer layer 103.

[0045] In an embodiment of the present application, a buffer layer 103 is provided between the circuit board 102 and the ultrasonic module 1012 and the support structure 201. Thus, when the electronic device is impacted, the buffer layer 103 can buffer the circuit board 102 and the ultrasonic module 1012 of the fingerprint module 100, thereby preventing the circuit board 102 and the ultrasonic module 1012 from being subjected to greater stress and causing damage to the fingerprint module 100.

[0046] In a possible implementation, as shown in FIG. 1 , the buffer layer 103 is in contact with the circuit board 102 and the ultrasonic module 1012 in a direction perpendicular to the substrate 1011 .

[0047] It should be understood that by setting the higher buffer layer 103 on the support structure 201, the circuit board 102 in the fingerprint module 100 applies a downward force to the buffer layer 103 to compact the buffer layer 103, and the ultrasonic module 1012 in the fingerprint module 100 applies a downward force to the buffer layer 103 to compact the buffer layer 103, thereby achieving contact between the buffer layer 103 and the circuit board 102 and the ultrasonic module 1012.

[0048] In an embodiment of the present application, the buffer layer 103 is in contact with the circuit board 102 and the ultrasonic module 1012 in a direction perpendicular to the substrate 1011, thereby protecting the circuit board 102 and the ultrasonic module 1012. When the electronic device is subjected to external impact, the circuit board 102 and the ultrasonic module 1012 can be buffered to prevent damage to the circuit board 102 and the ultrasonic module 1012, thereby effectively protecting the fingerprint module 100.

[0049] Figure 2 is a schematic diagram of another fingerprint module provided in an embodiment of the present application. As shown in Figure 2, in a direction perpendicular to the substrate 1011, a first gap is included between the buffer layer 103 and the circuit board 102, and a second gap is included between the buffer layer 103 and the ultrasonic module 1012.

[0050] In the embodiment of the present application, a first gap is included between the buffer layer 103 and the circuit board 102, and a second gap is included between the buffer layer 103 and the ultrasonic module 1012. Therefore, when the electronic device is subjected to an external impact, the force of the external impact can be absorbed by the first gap and the second gap, thereby reducing the force of the external impact transmitted to the circuit board 102 and the ultrasonic module 1012 in the fingerprint module 100, reducing the stress on the structure of the fingerprint module 100, preventing the fingerprint module 100 from being broken under the impact of external force, and preventing the circuit board 102 and the ultrasonic module 1012 from being damaged. Therefore, the fingerprint module 100 can be effectively protected. Moreover, since the buffer layer 103 does not contact the ultrasonic module 1012, the performance of the ultrasonic module 1012 in sending and receiving ultrasonic signals can be improved.

[0051] Figure 3 is a top view schematic diagram of a fingerprint module provided in an embodiment of the present application. As shown in Figure 3, corresponding to the fingerprint module 100 shown in Figures 1 and 2, the projection of the ultrasonic module 1012 on the buffer layer 103 along the direction perpendicular to the substrate 1011 is located within the edge of the buffer layer 103, and the projection of the second electrical connection area 1021 along the direction perpendicular to the substrate 1011 intersects with the buffer layer 103.

[0052] Figure 4 is a schematic diagram of another fingerprint module provided in an embodiment of the present application. As shown in Figure 4, the projection of the ultrasonic module 1012 on the buffer layer 103 along the direction perpendicular to the substrate 1011 is located within the edge of the buffer layer 103, and the projection of the second electrical connection area 1021 along the direction perpendicular to the substrate 1011 does not intersect with the buffer layer 103.

[0053] In a direction perpendicular to the substrate 1011 (i.e., perpendicular to the horizontal plane in FIG. 4 ), the projection of the ultrasonic module 1012 is located within the edge of the buffer layer 103. The buffer layer 103 is located between the ultrasonic module 1012 and the support structure 201 and is larger than the ultrasonic module 1012. In the structure shown in FIG. 4 , the left and right edges of the vertical projection of the ultrasonic module 1012 are located between the left and right edges of the buffer layer 103 and do not extend beyond the edge of the buffer layer 103. The projection of the second electrical connection area 1021 provided on the circuit board 102 in a direction perpendicular to the substrate 1011 (i.e., perpendicular to the horizontal plane in FIG. 4 ) does not intersect with the buffer layer 103. In other words, in the structure shown in FIG. 4 , the right edge of the vertical projection of the second electrical connection area 1021 is located outside the left edge of the buffer layer 103, and the vertical projection of the second electrical connection area 1021 is not located within the buffer layer 103.

[0054] In the embodiment of the present application, the projection of the ultrasonic module 1012 in the ultrasonic sensor 101 on the buffer layer 103 along a direction perpendicular to the substrate 1011 in the ultrasonic sensor 101 is located within the edge of the buffer layer 103, and the projection of the second electrical connection area 1021 set on the circuit board 102 along a direction perpendicular to the substrate 1011 does not intersect with the buffer layer 103. When the buffer layer 103 buffers the fingerprint module 100, it can protect the ultrasonic module 1012 while reducing the stress on the circuit board 102 in the fingerprint module 100, thereby preventing the circuit board 102 and the ultrasonic module 1012 in the fingerprint module 100 from being subjected to large stress at the same time when the buffer layer 103 buffers the fingerprint module 100, thereby preventing the fingerprint module 100 from being broken due to the simultaneous exposure of the circuit board 102 and the ultrasonic module 1012 in the fingerprint module 100. Therefore, the fingerprint module 100 can be effectively protected.

[0055] In one possible implementation, as shown in FIG4 , the circuit board 102 includes a substrate 1022 and a second electrical connection area 1021 disposed on the substrate 1022 . At one end of the circuit board 102 close to the ultrasonic module 1012 , the substrate 1022 extends beyond the second electrical connection area 1021 , and a projection of the substrate 1022 in a direction perpendicular to the substrate 1011 intersects with the buffer layer 103 .

[0056] The circuit board 102 includes a substrate 1022 and a second electrical connection area 1021 formed on the substrate 1022. In the structure shown in FIG4 , the right edge of the second electrical connection area 1021 is located to the left of the right edge of the substrate 1022. In a direction parallel to the substrate 1011, the end of the substrate 1022 near the ultrasonic module 1012 at least partially extends beyond the second electrical connection area 1021. That is, the projection of the second electrical connection area 1021 in a direction perpendicular to the substrate 1011 is located within the edge of the projection of the substrate 1022 in a direction perpendicular to the substrate 1011.

[0057] As shown in Figure 4, the right edge of the vertical projection of the substrate 1022 at least partially exceeds the left edge of the buffer layer 103, that is, the projection of the substrate 1022 in the direction perpendicular to the substrate 1011 intersects with the buffer layer 103. It should be understood that the right edge of the vertical projection of the substrate 1022 at least partially exceeds the left edge of the buffer layer 103, but the right edge of the vertical projection of the second electrical connection area 1021 is located to the left of the left edge of the buffer layer 103, that is, the projection of the second electrical connection area 1021 in the direction perpendicular to the substrate 1011 does not intersect with the buffer layer 103.

[0058] In the embodiment of the present application, the substrate 1022 included in the circuit board 102 intersects with the buffer layer 103 in its projection along a direction perpendicular to the substrate 1011. Therefore, when the electronic device is impacted, the circuit board 102 of the fingerprint module 100 can be buffered by the buffer layer 103, and the projection of the second electrical connection area 1021 along a direction perpendicular to the substrate 1011 does not intersect with the buffer layer 103. This can reduce the stress on the circuit board 102, and can prevent the fingerprint module 100 from breaking due to the high stress on the circuit board 102 and the ultrasonic module 1012 at the same time, while providing buffer protection for the circuit board 102.

[0059] Figure 5 is a top view schematic diagram of another fingerprint module provided by an embodiment of the present application. As shown in Figure 5, the buffer layer 103 includes a first buffer layer 1031 and a second buffer layer 1032 connected to each other. The projection of the first buffer layer 1031 on the substrate 1011 along a direction perpendicular to the substrate 1011 is located within the edge of the substrate 1011 in the first direction. The projection of the base material 1022 along a direction perpendicular to the substrate 1011 intersects with the first buffer layer 1031. The projection of the ultrasonic module 1012 on the second buffer layer 1032 along a direction perpendicular to the substrate 1011 is located within the edge of the second buffer layer 1032. The first direction is perpendicular to the direction of the circuit board 102 pointing to the ultrasonic module 1012, and is perpendicular to the substrate 1011.

[0060] As shown in Figure 5, the buffer layer 103 includes a first buffer layer 1031 and a second buffer layer 1032. The first buffer layer 1031 is connected to the second buffer layer 1032. The size of the first buffer layer 1031 is smaller than the size of the second buffer layer 1032, that is, the first buffer layer 1031 and the second buffer layer 1032 form a convex structure. The first buffer layer 1031 is projected onto the substrate 1011 in a direction perpendicular to the substrate 1011. In the first direction, it is within the edge of the substrate 1011. In the front view shown in Figure 4, the first direction is the direction from outside the image to inside the image. The first direction is perpendicular to the direction of the circuit board 102 pointing to the ultrasonic module 1012, and is perpendicular to the substrate 1011.

[0061] The projection of the base material 1022 in the circuit board 102 along the direction perpendicular to the substrate 1011 intersects with the first buffer layer 1031, that is, in the structure shown in FIG4 , the first buffer layer 1031 is at least partially located between the base material 1022 and the support structure 201, and the projection of the ultrasonic module 1012 on the second buffer layer 1032 along the direction perpendicular to the substrate 1011 is located within the edge of the second buffer layer 1032, that is, in the structure shown in FIG4 , the second buffer layer 1032 is located between the ultrasonic module 1012 and the support structure 201, and the size of the second buffer layer 1032 is larger than that of the ultrasonic module 1012. It should be understood that the projection of the ultrasonic module 1012 along the direction perpendicular to the substrate 1011 does not intersect with the first buffer layer 1031, that is, in the structure shown in FIG4 , the first buffer layer 1031 is not located between the ultrasonic module 1012 and the support structure 201.

[0062] In an embodiment of the present application, the buffer layer 103 includes a first buffer layer 1031 and a second buffer layer 1032 connected to each other. The projection of the first buffer layer 1031 on the substrate 1011 in a direction perpendicular to the substrate 1011 is located within the edge of the substrate 1011 in the first direction. The projection of the base material 1022 in a direction perpendicular to the substrate 1011 intersects with the first buffer layer 1031. The projection of the ultrasonic module 1012 on the second buffer layer 1032 in a direction perpendicular to the substrate 1011 is located within the edge of the second buffer layer 1032. This can avoid affecting the substrate 1011 while protecting the circuit board 102 in the fingerprint module 100. Since the first buffer layer 1031 avoids the edge of the substrate 1011, the edge of the substrate 1011 can be prevented from being subjected to large stress, and the electronic device can be prevented from being impacted by external force, causing the fingerprint module 100 to break. Therefore, the fingerprint module 100 can be effectively protected.

[0063] In a possible implementation, as shown in FIG. 4 , along a direction perpendicular to the substrate 1011 , the first buffer layer 1031 is in contact with the base material 1022 , and the second buffer layer 1032 is in contact with the ultrasonic module 1012 .

[0064] It should be understood that the buffer layer 103 composed of the first buffer layer 1031 and the second buffer layer 1032 is a convex polyhedron structure, and the first buffer layer 1031 and the second buffer layer 1032 have the same height in the direction perpendicular to the substrate 1011. By arranging the first buffer layer 1031 and the second buffer layer 1032 with higher heights on the support structure 201, the substrate 1022 in the circuit board 102 applies a downward force to the first buffer layer 1031 to compact the first buffer layer 1031, and the ultrasonic module 1012 in the fingerprint module 100 applies a downward force to the second buffer layer 1032 to compact the second buffer layer 1032, thereby achieving contact between the first buffer layer 1031 and the substrate 1022, and contact between the second buffer layer 1032 and the ultrasonic module 1012.

[0065] It should be noted that, as shown in Figure 4, since the first buffer layer 1031 and the second buffer layer 1032 are an integrated structure connected to each other, at least part of the first buffer layer 1031 and / or the second buffer layer 1032 is in contact with other structures formed on the substrate 1011 except the ultrasonic module 1012, which will not be repeated here.

[0066] In the embodiment of the present application, along the direction perpendicular to the substrate 1011, the first buffer layer 1031 is in contact with the base material 1022, and the second buffer layer 1032 is in contact with the ultrasonic module 1012, thereby protecting the circuit board 102 and the ultrasonic module 1012. When the electronic device is subjected to external impact, since the first buffer layer 1031 avoids the edge of the substrate 1011, it can prevent the edge of the substrate 1011 from being subjected to large stress, and prevent the fingerprint module 100 from being broken under the impact of external force. Moreover, since the first buffer layer 1031 is in contact with the base material 1022 and the second buffer layer 1032 is in contact with the ultrasonic module 1012, it is possible to buffer the circuit board 102 and the ultrasonic module 1012, and prevent damage to the circuit board 102 and the ultrasonic module 1012, thereby effectively protecting the fingerprint module 100.

[0067] FIG6 is a schematic diagram of another fingerprint module provided in an embodiment of the present application. As shown in FIG6 , along a direction perpendicular to the substrate 1011 , a third gap is included between the first buffer layer 1031 and the base material 1022 , and a fourth gap is included between the second buffer layer 1032 and the ultrasonic module 1012 .

[0068] In some optional embodiments, the first buffer layer 1031 and the second buffer layer 1032 are consistent in height along the direction perpendicular to the substrate 1011. It should be understood that since the heights of the circuit board 102 and the ultrasonic module 1012 are inconsistent, the heights of the third gap and the fourth gap are inconsistent in the direction perpendicular to the substrate 1011.

[0069] In the embodiment of the present application, a third gap is included between the first buffer layer 1031 and the substrate 1022, and a fourth gap is included between the second buffer layer 1032 and the ultrasonic module 1012. Therefore, when the electronic device is subjected to an external impact, the force of the external impact can be absorbed by the third gap and the fourth gap, thereby reducing the force of the external impact transmitted to the circuit board 102 and the ultrasonic module 1012 in the fingerprint module 100, reducing the stress on the structure of the fingerprint module 100, preventing the fingerprint module 100 from being broken under the impact of external force, and preventing the circuit board 102 and the ultrasonic module 1012 from being damaged. Therefore, the fingerprint module 100 can be effectively protected. Moreover, since the second buffer layer 1032 does not contact the ultrasonic module 1012, the performance of the ultrasonic module 1012 in transmitting and receiving ultrasonic signals can be improved.

[0070] FIG7 is a schematic diagram of another fingerprint module provided by an embodiment of the present application. As shown in FIG7 , the projections of the circuit board 102 and the conductive adhesive layer 104 along a direction perpendicular to the substrate 1011 do not intersect with the buffer layer 103 .

[0071] As shown in Figure 7, the buffer layer 103 can be located only between the ultrasonic module 1012 and the support structure 201. The projection of the ultrasonic module 1012 on the substrate 1011 in a direction perpendicular to the substrate 1011 is within the edge of the buffer layer 103. In the structure shown in Figure 7, there is no buffer layer 103 between the circuit board 102 and the conductive adhesive layer 104 and the support structure 201. Therefore, the projection of the circuit board 102 and the conductive adhesive layer 104 in a direction perpendicular to the substrate 1011 does not intersect with the buffer layer 103. The left edge of the projection of the ultrasonic module 1012 in a direction perpendicular to the substrate 1011 is located within the left edge of the buffer layer 103, and the right edge of the projection of the ultrasonic module 1012 in a direction perpendicular to the substrate 1011 is located within the right edge of the buffer layer 103.

[0072] In the embodiment of the present application, the projections of the circuit board 102 and the conductive adhesive layer 104 in a direction perpendicular to the substrate 1011 do not intersect with the buffer layer 103. This can prevent the circuit board 102 and the ultrasonic module 1012 of the fingerprint module 100 from being subjected to large stress at the same time when the electronic device is impacted by external force, resulting in a break in the fingerprint module 100 structure between the circuit board 102 and the ultrasonic module, thereby effectively protecting the fingerprint module 100.

[0073] In a possible implementation, as shown in FIG. 7 , the buffer layer 103 is in contact with the ultrasonic module 1012 along a direction perpendicular to the substrate 1011 .

[0074] As shown in Figure 7, the buffer layer 103 can be a cube or a rectangular parallelepiped structure. The buffer layer 103 is arranged on the support structure 201 of the electronic device. The ultrasonic module 1012 in the fingerprint module 100 applies a downward force to the buffer layer 103 to compact the buffer layer 103, so that the buffer layer 103 is in contact with the ultrasonic module 1012.

[0075] In the embodiment of the present application, the buffer layer 103 is in contact with the ultrasonic module 1012 along a direction perpendicular to the substrate 1011, so that the ultrasonic module 1012 can be wrapped by the buffer layer 103 to protect the ultrasonic module 1012. When the electronic device is subjected to external impact, the ultrasonic module 1012 can be protected from damage. Since the buffer layer 103 is not provided at the corresponding position of the circuit board 102, the circuit board 102 and the ultrasonic module 1012 can be prevented from being subjected to high stress at the same time, thereby avoiding the fingerprint module 100 from breaking, and thus the fingerprint module 100 can be effectively protected.

[0076] FIG8 is a schematic diagram of another fingerprint module provided by an embodiment of the present application. As shown in FIG8 , a fifth gap is included between the buffer layer 103 and the ultrasonic module 1012 along a direction perpendicular to the substrate 1011 .

[0077] In the structure shown in Figure 8, the buffer layer 103 can be a cube or a rectangular parallelepiped structure. The buffer layer 103 is arranged between the ultrasonic module 1012 and the support structure 201, and the projections of the circuit board 102 and the conductive adhesive layer 104 along the direction perpendicular to the substrate 1011 do not intersect with the buffer layer 103, that is, the buffer layer 103 is only arranged between the ultrasonic module 1012 and the support structure 201, the buffer layer 103 does not contact the ultrasonic module 1012, and a fifth gap is included between the buffer layer 103 and the ultrasonic module 1012.

[0078] Figure 9 is a top view schematic diagram of another fingerprint module provided in an embodiment of the present application. As shown in Figure 9, in the fingerprint module 100 shown in Figures 7 and 8, the buffer layer 103 is only arranged between the ultrasonic module 1012 and the support structure 201, and there is no buffer layer 103 between the substrate 1022, the second electrical connection area 1021 and the conductive adhesive layer 104 and the support structure 201.

[0079] In the embodiment of the present application, a fifth gap is included between the buffer layer 103 and the ultrasonic module 1012 in a direction perpendicular to the substrate 1011. The fifth gap absorbs the force of external impact, thereby reducing the external impact transmitted to the ultrasonic module 1012 in the fingerprint module 100, reducing the stress on the ultrasonic module 1012, and preventing damage to the ultrasonic module 1012. Since the buffer layer 103 is not provided at the corresponding position of the circuit board 102, the circuit board 102 and the ultrasonic module 1012 can be prevented from being subjected to high stress at the same time, thereby avoiding the fingerprint module 100 from breaking. Therefore, the fingerprint module 100 can be effectively protected. Since the buffer layer 103 does not contact the ultrasonic module 1012, the performance of the ultrasonic module 1012 in sending and receiving ultrasonic signals can be improved.

[0080] In a possible implementation, the buffer layer 103 includes buffer foam, and the density of the buffer foam is in the range of [0.01 g / cm 3 ,0.5g / cm 3 ].

[0081] In the embodiment of the present application, the buffer layer 103 includes a buffer foam, and the density of the buffer foam is in the range of [0.01 g / cm 3 ,0.5g / cm 3 ], thus the fingerprint module 100 can be buffered by the buffer layer 103. Since the density range of the buffer layer 103 is [0.01g / cm 3 ,0.5g / cm 3 ], which can prevent the buffer layer 103 from affecting the ultrasonic module 1012 in transmitting and receiving ultrasonic signals, and thus can be suitable for protecting the ultrasonic module 1012.

[0082] Figure 10 is a schematic diagram of an electronic device provided in an embodiment of the present application. As shown in Figure 10, the electronic device 200 includes a processing unit 203, a screen 202, a support structure 201, and the fingerprint module 100 in any of the above embodiments. The fingerprint module 100 is arranged between the screen 202 and the support structure 201. The buffer layer 103 in the fingerprint module 100 is arranged between the ultrasonic sensor in the fingerprint module 100 and the support structure 201. The processing unit 203 is electrically connected to the fingerprint module 100, and the processing unit 203 is used to perform fingerprint recognition based on the electrical signal transmitted by the fingerprint module 100.

[0083] In the embodiment of the present application, the fingerprint module 100 is arranged between the screen 202 and the support structure 201, and the buffer layer 103 in the fingerprint module 100 is arranged between the ultrasonic sensor in the fingerprint module 100 and the support structure 201. Therefore, when the electronic device 200 is subjected to external impact, the fingerprint module 100 can be protected by the buffer layer 103, and the structure of the fingerprint module 100 can be prevented from being subjected to greater stress when the buffer layer 103 buffers the fingerprint module 100, resulting in the fingerprint module 100 being broken. Therefore, the fingerprint module 100 can be effectively protected.

[0084] In a possible implementation, the support structure 201 includes a middle frame or a battery of the electronic device 200 .

[0085] In the embodiment of the present application, the support structure 201 of the electronic device 200 is the middle frame or battery of the electronic device 200, thereby enabling the fingerprint module 100 to be set between the screen 202 and the support structure 201, and the buffer layer 103 to be set on the support structure 201 to buffer the fingerprint module 100, thereby effectively protecting the fingerprint module 100.

[0086] It should be pointed out that, according to the needs of implementation, the various components / steps described in the embodiments of the present application can be split into more components / steps, or two or more components / steps or partial operations of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of the present application.

[0087] Those skilled in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of this application.

[0088] The above implementation methods are only used to illustrate the embodiments of the present application, and are not intended to limit the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of the present application, and the scope of patent protection of the embodiments of the present application should be defined by the claims.

Claims

1. A fingerprint module, applied to an electronic device, comprising: Ultrasonic sensor, circuit board and buffer layer; The ultrasonic sensor includes a substrate and an ultrasonic module, wherein the ultrasonic module is disposed on the substrate, the substrate is provided with a first electrical connection area, and the circuit board is provided with a second electrical connection area, wherein the first electrical connection area and the second electrical connection area are electrically connected via a conductive adhesive layer; The buffer layer is provided between the ultrasonic sensor and the supporting structure of the electronic device; The circuit board is electrically connected to the processing unit of the electronic device. The ultrasonic module is used to transmit ultrasonic signals and receive ultrasonic signals reflected by external structures. The ultrasonic sensor is used to convert the ultrasonic signals received by the ultrasonic module into electrical signals and send the electrical signals to the processing unit through the circuit board. The processing unit performs fingerprint recognition based on the electrical signals.

2. The fingerprint module according to claim 1, wherein: The projection of the ultrasonic module on the buffer layer in a direction perpendicular to the substrate is located within the edge of the buffer layer; A projection of the second electrical connection region along a direction perpendicular to the substrate intersects the buffer layer.

3. The fingerprint module according to claim 2, wherein: The buffer layer contacts the circuit board and the ultrasonic module in a direction perpendicular to the substrate.

4. The fingerprint module according to claim 2, wherein: In a direction perpendicular to the substrate, a first gap is formed between the buffer layer and the circuit board, and a second gap is formed between the buffer layer and the ultrasonic module.

5. The fingerprint module according to claim 1, wherein: The projection of the ultrasonic module on the buffer layer in a direction perpendicular to the substrate is located within the edge of the buffer layer; A projection of the second electrical connection region along a direction perpendicular to the substrate does not intersect with the buffer layer.

6. The fingerprint module according to claim 5, wherein: The circuit board includes a substrate and the second electrical connection area arranged on the substrate. At one end of the circuit board close to the ultrasonic module, the substrate extends beyond the second electrical connection area, and a projection of the substrate in a direction perpendicular to the substrate intersects with the buffer layer.

7. The fingerprint module according to claim 6, wherein: The buffer layer includes a first buffer layer and a second buffer layer connected to each other, wherein a projection of the first buffer layer on the substrate along a direction perpendicular to the substrate is located within an edge of the substrate in a first direction, a projection of the base material along a direction perpendicular to the substrate intersects with the first buffer layer, and a projection of the ultrasonic module on the second buffer layer along a direction perpendicular to the substrate is located within an edge of the second buffer layer, wherein the first direction is perpendicular to the direction of the circuit board pointing to the ultrasonic module and is perpendicular to the substrate.

8. The fingerprint module according to claim 7, wherein: In a direction perpendicular to the substrate, the first buffer layer is in contact with the base material, and the second buffer layer is in contact with the ultrasonic module.

9. The fingerprint module according to claim 7, wherein: In a direction perpendicular to the substrate, a third gap is formed between the first buffer layer and the base material, and a fourth gap is formed between the second buffer layer and the ultrasonic wave transmitting module.

10. The fingerprint module according to claim 5, wherein: Projections of the circuit board and the conductive adhesive layer along a direction perpendicular to the substrate do not intersect with the buffer layer.

11. The fingerprint module according to claim 10, wherein: The buffer layer contacts the ultrasonic module in a direction perpendicular to the substrate.

12. The fingerprint module according to claim 10, wherein: A fifth gap is provided between the buffer layer and the ultrasonic module in a direction perpendicular to the substrate.

13. The fingerprint module according to any one of claims 1 to 12, wherein: The buffer layer includes buffer foam, and the density of the buffer foam is in the range of [0.01g / cm 3 ,0.5g / cm 3 ].

14. An electronic device comprising: A processing unit, a screen, a supporting structure, and a fingerprint module according to any one of claims 1 to 13; The fingerprint module is arranged between the screen and the supporting structure, and the buffer layer in the fingerprint module is arranged between the ultrasonic sensor in the fingerprint module and the supporting structure, wherein the supporting structure includes the middle frame and / or battery of the electronic device; The processing unit is electrically connected to the fingerprint module; The processing unit is used to perform fingerprint recognition based on the electrical signal transmitted by the fingerprint module.

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