Display panel and preparation method therefor, and display apparatus

Abstract

Provided in the present disclosure are a display panel and a preparation method therefor, and a display apparatus. The display panel comprises: a base substrate, which comprises a display area and a peripheral area surrounding the display area; an inorganic pattern structure, which is arranged along an edge of the base substrate in the peripheral area, the inorganic pattern structure comprising a plurality of first hollowed-out areas, which are arranged at intervals along the edge of the inorganic pattern structure away from the display area; and a first organic protective layer, which covers the inorganic pattern structure.

Description

Display panel and manufacturing method thereof, and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Current flexible display products typically use two layers of polyimide as a substrate, with a barrier layer positioned between them. Display panels are typically manufactured using laser cutting, which cuts wooden panels into individual panels. However, laser cutting creates a heat-affected zone, often leading to delamination between the substrate layers. This can affect the product's bending performance and the display's electrical properties, leading to display anomalies.

[0003] Summary of the Invention

[0004] An embodiment of the present disclosure provides a display panel, the display panel comprising:

[0005] A base substrate, comprising a display area and a peripheral area surrounding the display area;

[0006] An inorganic pattern structure is provided along an edge of the base substrate in the peripheral area; the inorganic pattern structure comprises: a plurality of first hollow areas spaced apart along an edge of the inorganic pattern structure away from the display area;

[0007] The first organic protective layer covers the inorganic pattern structure.

[0008] In some embodiments, in a direction perpendicular to an edge of the base substrate, a width of the first hollow region is smaller than a width of the inorganic pattern structure.

[0009] In some embodiments, in a direction perpendicular to the edge of the base substrate, a width of the first hollow region is equal to a width of the inorganic pattern structure.

[0010] In some embodiments, the orthographic projection of the first hollow area on the base substrate is a part of a rectangle or a circle.

[0011] In some embodiments, at an edge of the inorganic pattern structure away from the display area, the width of the first hollow area is greater than 1 micron, and the distance between two adjacent first hollow areas is greater than or equal to 3 microns and less than or equal to 100 microns;

[0012] In a direction perpendicular to an edge of the base substrate, a width of the first inorganic structure pattern is greater than or equal to 2 micrometers and less than or equal to 100 micrometers.

[0013] In some embodiments, the display panel includes two inorganic pattern structures; one of the two inorganic pattern structures is located between the first organic protective layer and the base substrate, and the other of the two inorganic pattern structures is located on a side of the first organic protective layer away from the base substrate.

[0014] In some embodiments, the shapes of the orthographic projections of the first hollow regions in the two layers of inorganic pattern structures on the base substrate are the same.

[0015] In some embodiments, the inorganic pattern structure further includes: a first sub-pattern located between two adjacent first hollow regions;

[0016] The orthographic projections of the first sub-patterns of the two inorganic pattern structures on the base substrate overlap.

[0017] In some embodiments, the orthographic projections of the first sub-patterns of the two inorganic pattern structures on the base substrate substantially overlap.

[0018] In some embodiments, the inorganic pattern structure further includes: a first sub-pattern located between two adjacent first hollow regions;

[0019] The orthographic projections of the first sub-patterns of the two layers of inorganic pattern structures on the base substrate do not overlap with each other.

[0020] In some embodiments, the display panel further comprises:

[0021] The first inorganic insulating layer is located on one side of the base substrate and extends from the display area to the peripheral area; the orthographic projection of the first inorganic structure pattern on the base substrate surrounds the orthographic projection of the first inorganic insulating layer on the base substrate, and the distance between the orthographic projection of the first inorganic structure pattern on the base substrate and the orthographic projection of the first inorganic insulating layer on the base substrate is greater than 0.

[0022] In some embodiments, the display panel further comprises:

[0023] The driving circuit layer is located on the side of the first inorganic insulating layer away from the base substrate; the driving circuit layer includes: multiple conductive layers and multiple second inorganic insulating layers; the second inorganic insulating layers and the conductive layers are alternately stacked;

[0024] The inorganic pattern structure and the first inorganic insulating layer or one of the multiple second inorganic insulating layers are formed by the same patterning process.

[0025] In some embodiments, the display panel further comprises:

[0026] A plurality of crack blocking structures are located in the peripheral area; the orthographic projections of the plurality of crack blocking structures on the base substrate are located on the side of the orthographic projection of the inorganic pattern structure on the base substrate facing the display area, and the orthographic projection of each of the plurality of crack blocking structures on the base substrate surrounds the display area; the plurality of crack blocking structures are arranged on the same layer as part of the inorganic insulating layer in the multi-layer second inorganic insulating layer.

[0027] In some embodiments, the first organic protection layer covers the crack-stop structure.

[0028] In some embodiments, the display panel further comprises: a second organic protection layer covering the crack blocking structure;

[0029] The orthographic projection of the second organic protective layer on the base substrate and the orthographic projection of the inorganic pattern structure on the base substrate do not overlap each other;

[0030] The orthographic projection of the first organic protective layer on the base substrate covers the orthographic projection of the second organic protective layer on the base substrate.

[0031] In some embodiments, the substrate includes: a first flexible substrate, a barrier layer, and a second flexible substrate arranged in a stacked manner;

[0032] The first inorganic structure pattern and the first inorganic insulating layer are located on a side of the second flexible substrate facing away from the barrier layer.

[0033] An embodiment of the present disclosure provides a method for manufacturing a display panel, comprising:

[0034] Providing a base substrate; the base substrate includes: a display area and a peripheral area surrounding the display area;

[0035] An inorganic pattern structure is formed on one side of the base substrate; a first inorganic insulating layer is provided in the peripheral region along the edge of the base substrate; the inorganic pattern structure comprises: a plurality of first hollow regions spaced apart along the edge of the inorganic pattern structure away from the display region;

[0036] A first organic protection layer is formed covering the first inorganic pattern structure.

[0037] In some embodiments, after forming the first organic protection layer covering the first inorganic pattern structure, the method further includes:

[0038] An inorganic pattern structure is formed again on the side of the first organic protective layer facing away from the base substrate.

[0039] In some embodiments, the method further comprises:

[0040] A pattern of a first inorganic insulating layer is formed on one side of the base substrate; the orthographic projection of the first inorganic structure pattern on the base substrate surrounds the orthographic projection of the first inorganic insulating layer on the base substrate, and the distance between the orthographic projection of the first inorganic structure pattern on the base substrate and the orthographic projection of the first inorganic insulating layer on the base substrate is greater than 0.

[0041] In some embodiments, after forming the pattern of the first inorganic insulating layer, the method further includes:

[0042] A pattern of a driving circuit layer is formed on the side of the first inorganic insulating layer facing away from the base substrate; the driving circuit layer includes: multiple conductive layers and multiple second inorganic insulating layers; the second inorganic insulating layers and the conductive layers are alternately stacked;

[0043] Forming an inorganic pattern structure, specifically comprising:

[0044] forming the inorganic pattern structure while forming the pattern of the first inorganic insulating layer; or,

[0045] The inorganic pattern structure is formed while patterning one second inorganic insulating layer among the multiple second inorganic insulating layers.

[0046] In some embodiments, forming the multi-layer second inorganic insulating layer further includes:

[0047] forming a pattern of a plurality of crack barrier structures in the peripheral region; wherein the orthographic projections of the plurality of crack barrier structures on the base substrate are located on a side of the orthographic projection of the inorganic pattern structure on the base substrate facing the display region, and the orthographic projection of each of the plurality of crack barrier structures on the base substrate surrounds the display region;

[0048] Forming a first organic protective layer covering the inorganic pattern structure specifically includes:

[0049] A first organic protection layer is formed covering the inorganic pattern structure and the plurality of crack blocking structures.

[0050] In some embodiments, forming the multi-layer second inorganic insulating layer further includes:

[0051] forming a pattern of a plurality of crack barrier structures in the peripheral region; wherein the orthographic projections of the plurality of crack barrier structures on the base substrate are located on a side of the orthographic projection of the inorganic pattern structure on the base substrate facing the display region, and the orthographic projection of each of the plurality of crack barrier structures on the base substrate surrounds the display region;

[0052] Before forming the first organic protective layer covering the inorganic pattern structure, the method further includes:

[0053] forming a second organic protection layer covering the plurality of crack-blocking structures;

[0054] Forming a first organic protective layer covering the inorganic pattern structure specifically includes:

[0055] A first organic protective layer is formed to cover the inorganic pattern structure and the second organic protective layer.

[0056] An embodiment of the present disclosure provides a display device, which includes the display panel provided by the embodiment of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0058] FIG1 is a schematic diagram of edge delamination of a display panel provided by the related art;

[0059] FIG2 is a schematic structural diagram of a display panel provided by an embodiment of the present disclosure;

[0060] FIG3 is a cross-sectional view along line BB′ in FIG2 provided by an embodiment of the present disclosure;

[0061] FIG4 is a cross-sectional view along CC′ in FIG2 provided by an embodiment of the present disclosure;

[0062] FIG5 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0063] FIG6 is a cross-sectional view along line EE′ in FIG5 provided by an embodiment of the present disclosure;

[0064] FIG7 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0065] FIG8 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0066] FIG9 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0067] FIG10 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0068] FIG11 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0069] FIG12 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0070] FIG13 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0071] FIG14 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0072] FIG15 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0073] FIG16 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0074] FIG17 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0075] FIG18 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0076] FIG19 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0077] FIG20 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0078] FIG21 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0079] FIG22 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0080] FIG23 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0081] FIG24 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0082] FIG25 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0083] FIG26 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0084] FIG27 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0085] FIG28 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0086] FIG29 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0087] FIG30 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0088] FIG31 is a schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0089] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. And in the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0090] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0091] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the present disclosure. The same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions.

[0092] In the related art, as shown in FIG1 , two layers of polyimide are usually used as the first flexible substrate 101 and the second flexible substrate 103 of the base substrate 1, respectively. The base substrate 1 also includes a first barrier layer located between the two layers of polyimide, and the first barrier layer is the barrier layer 102. An inorganic buffer layer is also required to be provided on the base substrate 1. During the production process of the display panel, laser cutting is usually used to cut the motherboard into individual display panels. In order to ensure that the cracks caused by laser cutting do not extend to the display area AA of the display panel, as shown in FIG1 , a plurality of crack blocking structures 5 are usually provided in the peripheral area NA of the display panel. The plurality of crack blocking structures 5 are discontinuous, thereby preventing the cracks from spreading to the display area AA. The crack blocking structure 5 is usually an inorganic material, and an organic material needs to be coated on its surface to form an organic protective layer 7 to increase the strength and prevent cracking. To prevent initial cracks during the laser cutting process, the inorganic buffer layer above the second flexible substrate 103 near the cutting line is typically removed, leaving only the first flexible substrate 101, barrier layer 102, second flexible substrate 103, and organic protective layer 7 near the cutting line. However, analysis of defective products reveals that the laser-cut cross-section can be divided into three regions, with barrier layer 102 as the boundary: a single organic layer corresponding to the first flexible substrate 101, a single inorganic layer corresponding to the barrier layer 102, and an organic continuous phase corresponding to the second flexible substrate 103 and the organic protective layer. Laser cutting typically generates temperatures exceeding 1000 degrees Celsius (°C). The materials at the cutting site expand and contract, and the thermal expansion coefficients of the three regions differ significantly. The thermal expansion coefficients of polyimide are typically 5 parts per million (ppm / K) to 10 ppm / K, the thermal expansion coefficient of the barrier layer 102 is 3 ppm / K, and the thermal expansion coefficient of the organic protective layer is 30 ppm / K to 40 ppm / K. Since the second flexible substrate 103 and the organic protective layer form a continuous organic layer, the thermal expansion coefficient of the continuous phase lies between the thermal expansion coefficients of the second flexible substrate 103 and the organic protective layer, but significantly greater than the thermal expansion coefficient of the barrier layer 102. Therefore, the region with the greatest thermal expansion coefficient difference at the cutting site is between the barrier layer 102 and the continuous phase. As shown in Figure 1, delamination is likely to occur between the barrier layer 102 and the second flexible substrate 103 in region F. Furthermore, this significant difference in thermal expansion coefficients can lead to misalignment caused by dimensional mismatch at high temperatures, which can cause cracks. Further crack expansion can cause display abnormalities or mechanical failure.

[0093] An embodiment of the present disclosure provides a display panel, as shown in FIG2 to FIG6 , the display panel includes:

[0094] The base substrate 1 includes a display area AA and a peripheral area NA surrounding the display area AA;

[0095] The inorganic pattern structure 2 is arranged along the edge of the base substrate 1 in the peripheral area NA, that is, the orthographic projection of the inorganic pattern structure 2 on the base substrate 1 surrounds the display area AA, and the edge of the inorganic pattern structure 2 away from the display area AA has an overlapping area with the edge of the base substrate 1; the inorganic pattern structure 2 includes: a plurality of first hollow areas 202 arranged at intervals along the edge of the inorganic pattern structure 2 away from the display area AA;

[0096] The first organic protective layer 3 covers the inorganic pattern structure 2 .

[0097] The display panel provided by the embodiments of the present disclosure includes an inorganic pattern structure at the edge of the base substrate, between the base substrate and the first organic protective layer, thereby preventing delamination of the base substrate. Furthermore, because the inorganic pattern structure includes multiple first hollow regions, i.e., the edge of the inorganic pattern structure away from the display area is not continuously arranged, the strain caused by thermal expansion of the inorganic pattern structure during the cutting process can be absorbed by the organic film layer, thereby preventing cracking of the film layer caused by extrusion due to thermal expansion of the continuous inorganic film layer and avoiding the occurrence of initial cracks at the edge caused by cutting.

[0098] In a specific implementation, when forming the inorganic pattern structure, a complete inorganic film layer can be formed in the edge area of ​​the base substrate, and then a graphic process is performed to remove the inorganic film layer in the first hollow area to form an inorganic pattern structure including multiple first hollow areas.

[0099] It should be noted that FIG3 is a cross-sectional view taken along line BB′ in FIG2 , FIG4 is a cross-sectional view taken along line CC′ in FIG2 , and FIG6 is a cross-sectional view taken along line EE′ in FIG5 .

[0100] In some embodiments, as shown in FIG3 and FIG4 , the substrate 1 includes: a first flexible substrate 101 , a barrier layer 102 , and a second flexible substrate 103 that are stacked;

[0101] The inorganic pattern structure 2 and the first inorganic insulating layer 6 are located on a side of the second flexible substrate 103 facing away from the barrier layer 102 .

[0102] Specifically, the first flexible substrate and the second flexible substrate are organic film layers, and the barrier layer is an inorganic film layer.

[0103] In the display substrate provided by the embodiment of the present disclosure, an inorganic pattern structure is provided between the second flexible substrate and the first organic protective layer in the area at the edge of the base substrate, thereby preventing the second flexible substrate and the first organic protective layer from forming a continuous organic phase at the edge, and avoiding the large difference in thermal expansion coefficient between the inorganic barrier layer and the continuous organic phase, which leads to delamination of the second flexible substrate and the barrier layer during the cutting process.

[0104] 2 and 5 , the inorganic pattern structure 2 further includes a first sub-pattern 201 located between two adjacent first hollow regions 202 . In a direction perpendicular to the edge of the base substrate 1 , a width h4 of the first hollow region 202 is equal to a width of the first sub-pattern 201 .

[0105] In some embodiments, as shown in FIG2 , in a direction perpendicular to the edge of the base substrate 1 , the width h4 of the first hollowed-out region 202 is equal to the width h3 of the inorganic pattern structure 2. That is, the orthographic projection of the inorganic pattern structure on the base substrate is a discontinuous pattern. The width h3 of the inorganic pattern structure 2 is equal to the width of the first sub-pattern 201.

[0106] Alternatively, in some embodiments, as shown in FIG5 , in a direction perpendicular to the edge of the base substrate 1, the width h4 of the first hollow region 202 is less than the width h3 of the inorganic pattern structure 2. That is, the orthographic projection of the inorganic pattern structure on the base substrate is a continuous pattern. The inorganic pattern structure 2 further includes a connecting pattern 203 located on the side of the first sub-pattern 201 and the first hollow region 202 facing the display area, and connected to the first sub-pattern 201.

[0107] In some embodiments, as shown in FIG. 2 and FIG. 5 , the orthographic projection of the first hollow area 202 on the base substrate 1 is a rectangle.

[0108] In the display panel provided by the embodiment of the present disclosure, the shape of the positive projection of the first hollow area on the base substrate is a rectangle, that is, the corners of the edge of the inorganic pattern structure left after removing the inorganic film layer of the first hollow area on the edge of the substrate are right angles, and there are no sharp corners, which can reduce stress and further reduce the possibility of cracks.

[0109] In some embodiments, as shown in FIG. 7 , the orthographic projection of the first hollow area 202 on the base substrate 1 is a portion of a circle.

[0110] In the display panel provided by the embodiment of the present disclosure, the shape of the orthographic projection of the first hollow area on the base substrate is a part of a circle. In this way, the edge of the inorganic pattern structure left after removing the inorganic film layer of the first hollow area on the edge of the substrate is curved and has no sharp corners, which can further reduce stress and cracks.

[0111] It should be noted that FIG7 only shows a partial region of the inorganic pattern structure 2 .

[0112] Of course, in a specific implementation, the shape of the orthographic projection of the first hollow area 202 on the base substrate 1 may also be a triangle as shown in Figure 8 or a trapezoid as shown in Figure 9. Figures 8 and 9 only show a partial area of ​​the inorganic pattern structure 2.

[0113] In some embodiments, as shown in FIG3 , at the edge of the inorganic pattern structure 2 away from the display area AA, the width h2 of the first hollow area 202 is greater than 1 micron, and the distance h1 between two adjacent first hollow areas 202 is greater than or equal to 3 microns and less than or equal to 100 microns;

[0114] As shown in FIG. 2 , in a direction perpendicular to the edge of the base substrate 1 , a width h3 of the inorganic pattern structure 2 is greater than or equal to 2 micrometers and less than or equal to 100 micrometers.

[0115] In the display substrate provided by the disclosed embodiments, h2 is greater than 1 micron, and h1 is greater than or equal to 3 microns and less than or equal to 100 microns. This prevents delamination of the second flexible substrate and the barrier layer during the laser cutting process due to a significant difference in thermal expansion coefficients between the inorganic barrier layer and the continuous organic phase, while ensuring that the inorganic pattern structure expands through the second flexible substrate and the first organic protective layer to release stress. Furthermore, the maximum size of the heat-affected zone during laser cutting is typically 100 microns, and the width h3 of the inorganic pattern structure does not exceed 100 microns. This prevents delamination of the second flexible substrate and the barrier layer while also avoiding excessive increases in the size of the peripheral area.

[0116] In some embodiments, as shown in Figures 10 to 12, the display panel includes two layers of inorganic pattern structures 2; one of the two layers of inorganic pattern structures 2 is located between the first organic protective layer 3 and the base substrate 1, and the other of the two layers of inorganic pattern structures 2 is located on a side of the first organic protective layer 3 away from the base substrate 1. Specifically, the two layers of inorganic pattern structures 2 are a first inorganic pattern structure 2-1 and a second inorganic pattern structure 2-2; the first inorganic pattern structure 2-1 is located between the first organic protective layer 3 and the base substrate 1, and the second inorganic pattern structure 2-2 is located on a side of the first organic protective layer 3 away from the base substrate 1.

[0117] In the display panel provided by the embodiment of the present disclosure, an inorganic pattern structure is also provided on the side of the first organic protective layer facing away from the base substrate. Compared with the case where the inorganic pattern structure is not provided, the thermal expansion coefficient can be reduced and delamination of the first organic protective layer can be avoided.

[0118] In a specific implementation, the shapes of the orthographic projections of the two layers of inorganic pattern structures on the base substrate may be the same or different.

[0119] In some embodiments, as shown in FIG. 10 and FIG. 11 , the orthographic projection shapes of the first hollow regions 202 in the two-layer inorganic pattern structures 2 on the base substrate 1 are the same.

[0120] It should be noted that, in FIG. 10 and FIG. 11 , the orthographic projection of the first hollow area 202 on the base substrate 1 is a rectangle as an example for illustration.

[0121] Of course, in a specific implementation, the shapes of the orthographic projections of the first hollow areas in the two-layer inorganic pattern structures on the base substrate may also be different.

[0122] In some embodiments, as shown in FIG. 10 , the orthographic projections of the first sub-patterns 201 of the two layers of inorganic pattern structures 2 on the base substrate 1 overlap.

[0123] The display panel provided by the embodiment of the present disclosure has an overlapping area in the orthographic projection of the first sub-pattern of the two-layer inorganic pattern structure on the base substrate, that is, there is an area where inorganic film layer / organic film layer / inorganic film layer are alternately stacked at the edge above the base substrate, which is more conducive to avoiding film layer stratification.

[0124] In some embodiments, as shown in FIG. 10 , the orthographic projections of the first sub-patterns 201 of the two layers of inorganic pattern structures 2 on the base substrate 1 are substantially overlapped.

[0125] It should be noted that the orthographic projections of the first sub-patterns of the two-layer inorganic pattern structures on the substrate roughly overlap means that when the difference between the edges of the orthographic projections of the first sub-patterns of the two-layer inorganic pattern structures on the substrate is less than or equal to the error range, it is considered that the orthographic projections of the first sub-patterns of the two-layer inorganic pattern structures on the substrate roughly overlap.

[0126] In some embodiments, as shown in FIG12 , the orthographic projections of the two layers of inorganic pattern structures 2 on the base substrate 1 substantially overlap. That is, the orthographic projections of the two layers of inorganic pattern structures on the base substrate are considered to substantially overlap when the difference between the edges of the orthographic projections of the two layers of inorganic pattern structures on the base substrate is less than or equal to the error range.

[0127] In some embodiments, as shown in FIG11 , the orthographic projections of the first sub-patterns 201 of the two inorganic pattern structures 2 on the base substrate 1 do not overlap; the orthographic projections of the first hollow regions 202 of the two inorganic pattern structures 2 on the base substrate 1 do not overlap.

[0128] Specifically, the orthographic projection of the first hollowed-out area 202 of the first inorganic pattern structure 2-1 on the substrate 1 and the orthographic projection of the first sub-pattern 201 of the second inorganic pattern structure 2-2 on the substrate 1 substantially overlap, and the orthographic projection of the first sub-pattern 201 of the first inorganic pattern structure 2-1 on the substrate 1 and the orthographic projection of the first hollowed-out area 202 of the second inorganic pattern structure 2-2 on the substrate 1 substantially overlap. Since there are inorganic film layers at each position in the horizontal direction, during the cutting process, the film layers of the display panel expand less when heated at the cutting location.

[0129] In some embodiments, as shown in FIG3 to FIG4, FIG6, and FIG10 to FIG12, the display panel further includes:

[0130] The first inorganic insulating layer 6 is located on one side of the base substrate 1 and extends from the display area to the peripheral area; the orthographic projection of the inorganic pattern structure 2 on the base substrate 1 surrounds the orthographic projection of the first inorganic insulating layer 6 on the base substrate 1, and the distance between the orthographic projection of the inorganic pattern structure 2 on the base substrate 1 and the orthographic projection of the first inorganic insulating layer 6 on the base substrate 1 is greater than 0.

[0131] In a specific implementation, as shown in Figures 3 to 4, 6, and 10 to 12, the inorganic pattern structure 2 covered by the first organic protective layer 3, i.e., the first inorganic pattern structure 2-1 and the first inorganic insulating layer 6, are both arranged on the side of the second flexible substrate 103 away from the barrier layer 102, i.e., the first inorganic pattern structure 2-1 and the first inorganic insulating layer 6 are both in contact with the second flexible substrate 103, and the distance between the inorganic pattern structure 2, especially the orthographic projection of the first inorganic pattern structure 2-1 on the base substrate 1 and the orthographic projection of the first inorganic insulating layer 6 on the base substrate 1 is greater than 0, so that the first inorganic insulating layer 6 and the first inorganic pattern structure 2-1 are disconnected from each other, thereby preventing cracks from extending to the first inorganic insulating layer 6.

[0132] In some embodiments, as shown in FIG13 and FIG14 , the display panel further includes:

[0133] The driving circuit layer 8 is located on the side of the first inorganic insulating layer 6 facing away from the base substrate 1. The driving circuit layer 8 includes: multiple conductive layers 9 and multiple second inorganic insulating layers 10. The second inorganic insulating layers 10 and the conductive layers 9 are alternately stacked.

[0134] The inorganic pattern structure 2 and the first inorganic insulating layer 6 or one of the multiple second inorganic insulating layers 10 are formed by the same patterning process.

[0135] In the display panel provided by the embodiment of the present disclosure, the inorganic pattern structure and the first inorganic insulating layer or one of the multiple second inorganic insulating layers are formed using the same graphic process. The inorganic pattern structure does not need to be set up separately, and there is no need to add an additional graphic process mask plate, thereby simplifying the process flow and saving costs.

[0136] It should be noted that as shown in Figures 3 to 4 and 6, the display panel includes a single-layer inorganic pattern structure 2, and the inorganic pattern structure 2 and the first inorganic insulating layer 6 are formed using the same patterning process. Alternatively, as shown in Figures 15, 16 and 17, the display panel includes a single-layer inorganic pattern structure 2, and the inorganic pattern structure 2 and one of the second inorganic insulating layers 10 are formed using the same patterning process. As shown in Figures 10 to 12, the display panel includes two layers of inorganic pattern structures 2, the first inorganic pattern structure 2-1 and the first inorganic insulating layer 6 are formed using the same patterning process, and the second inorganic pattern structure 2-2 and one of the second inorganic insulating layers 10 are formed using the same patterning process. Alternatively, as shown in Figures 18 and 19, the display panel includes two layers of inorganic pattern structures 2, and the two layers of inorganic pattern structures 2 are formed using the same patterning process with different second inorganic insulating layers 10.

[0137] In some embodiments, as shown in FIG13 and FIG14 , the driving circuit layer 8 specifically includes a plurality of thin film transistors 801 ; the thin film transistor 801 includes an active layer 8011 , a gate G, a source S, and a drain D;

[0138] The multi-layer conductive layer 9 includes: a first conductive layer 901 and a second conductive layer 902 located on a side of the first conductive layer 901 facing away from the substrate 1; the first conductive layer 901 includes a gate G, and the second conductive layer 902 includes a source S and a drain D;

[0139] The multi-layer second inorganic insulating layer 10 includes: a first gate insulating layer 1001 located between the first conductive layer 901 and the active layer 8011 , and an interlayer insulating layer 1002 located between the first conductive layer 901 and the second conductive layer 902 .

[0140] It should be noted that Figures 13 and 14 illustrate thin-film transistor 801 having a top-gate structure, i.e., gate G is located on the side of active layer 8011 facing away from substrate 1. Source electrode S and drain electrode D are electrically connected to active layer 8011 via vias penetrating interlayer insulating layer 1002 and first gate insulating layer 1001, respectively. Of course, in a specific implementation, the thin-film transistor may also have a bottom-gate structure, i.e., the gate is located on the side of the active layer facing the substrate.

[0141] In some embodiments, as shown in FIG13 and FIG14 , the display panel further includes: a first planarization layer 14 located on a side of the driving circuit layer 8 facing away from the base substrate 1 , a light-emitting device 11 and a pixel definition layer 12 located on a side of the first planarization layer 14 facing away from the base substrate 1 , and an encapsulation layer 13 located on a side of the light-emitting device 11 facing away from the base substrate 1 ;

[0142] The pixel definition layer 12 has a plurality of opening areas. The light emitting device 11 includes an anode 1101 , a light emitting functional layer 1102 , and a cathode 1103 stacked in the opening area 1201 . The pixel definition layer 12 covers the edge of the anode 1101 .

[0143] In some embodiments, the light-emitting functional layer includes an organic light-emitting layer. The light-emitting functional layer may further include at least one of the following: an electron transport layer, a hole blocking layer, a hole injection layer, a hole transport layer, and an electron blocking layer.

[0144] In some embodiments, as shown in FIG. 13 , the anode 1101 is electrically connected to the drain D through a via hole penetrating the first planarization layer 14 .

[0145] Alternatively, in some embodiments, as shown in FIG. 14 , the display panel further includes: a second planarization layer 17 located between the third conductive layer 903 and the passivation layer 1003 .

[0146] In some embodiments, as shown in FIG14 , the multilayer conductive layer 9 further includes a third conductive layer 903 , and the multilayer second inorganic insulating layer 10 further includes a passivation layer 1003 located between the second conductive layer 902 and the third conductive layer 903 ;

[0147] The third conductive layer 903 includes a plurality of connection electrodes 9031 . The connection electrodes 9031 are electrically connected to the drain D through the second planarization layer 17 and via holes penetrating the passivation layer 1003 . The anode 1101 is electrically connected to the connection electrodes 9031 through via holes penetrating the first planarization layer 14 .

[0148] It should be noted that FIG15 illustrates an example in which the inorganic pattern structure 2 and the first gate insulating layer 1001 are formed using the same patterning process when the display panel includes a single-layer inorganic pattern structure 2. FIG16 illustrates an example in which the inorganic pattern structure 2 and the interlayer insulating layer 1002 are formed using the same patterning process when the display panel includes a single-layer inorganic pattern structure 2. FIG17 illustrates an example in which the inorganic pattern structure 2 and the passivation layer 1003 are formed using the same patterning process when the display panel includes a single-layer inorganic pattern structure 2. FIG12, FIG18, and FIG19 illustrate an example in which the second inorganic pattern structure 2-2 and the passivation layer 1003 are formed using the same patterning process. FIG18 illustrates an example in which the first inorganic pattern structure 2-2 and the first gate insulating layer 1001 are formed using the same patterning process. FIG19 illustrates an example in which the first inorganic pattern structure 2-2 and the interlayer insulating layer 1002 are formed using the same patterning process.

[0149] In some embodiments, the encapsulation layer includes an inorganic encapsulation layer, an organic encapsulation layer, and an inorganic encapsulation layer that are stacked.

[0150] In some embodiments, as shown in FIG. 2 , FIG. 4 , FIG. 5 to FIG. 6 , FIG. 12 , and FIG. 15 to FIG. 19 , the display panel further includes:

[0151] Multiple crack blocking structures 5 are located in the peripheral area NA and on the side of the first inorganic insulating layer 6 facing away from the base substrate 1; the orthographic projections of the multiple crack blocking structures 5 on the base substrate 1 are located on the side of the orthographic projection of the inorganic pattern structure 2 on the base substrate 1 facing the display area AA, and the orthographic projection of each of the multiple crack blocking structures 5 on the base substrate 1 surrounds the display area AA; the multiple crack blocking structures 5 are arranged in the same layer as part of the inorganic insulating layer in the multi-layer second inorganic insulating layer 10.

[0152] In some embodiments, as shown in Figures 2 and 5, the display panel includes three crack blocking structures 5, which are a first crack blocking structure 501, a second crack blocking structure 502, and a third crack blocking structure 503 arranged in sequence in the direction from the peripheral area NA to the side of the display area AA.

[0153] In some embodiments, as shown in Figures 4, 6, 12, and 15 to 19, the plurality of crack-blocking structures 5 include a first sub-portion 5-1 disposed in the same layer as the first gate insulating layer 1001, and a second sub-portion 5-2 disposed in the same layer as the interlayer insulating layer 1002. The crack-blocking structure 5 closest to the display area is disconnected from the first gate insulating layer 1001 and the interlayer insulating layer 1002.

[0154] In some embodiments, as shown in FIG. 4 , FIG. 6 , FIG. 12 , and FIG. 15 to FIG. 19 , the first organic protection layer 3 covers the crack blocking structure 5 .

[0155] In the display panel provided by the embodiments of the present disclosure, the first organic protective layer also covers the crack-blocking structure. Thus, the first organic protective layer envelops the crack-blocking structure, thereby increasing strength and preventing cracking of the crack-blocking structure. Furthermore, the organic protective layer covering the inorganic patterned structure and the organic protective layer enveloping the crack-blocking structure do not need to be separately provided, thus streamlining the process and reducing costs.

[0156] Alternatively, in some embodiments, as shown in FIG. 20 to FIG. 25 , the display panel further includes: a second organic protection layer 4 covering the crack blocking structure 5 ;

[0157] The orthographic projection of the second organic protective layer 4 on the base substrate 1 and the orthographic projection of the inorganic pattern structure 2 on the base substrate 1 do not overlap each other;

[0158] The orthographic projection of the first organic protective layer 3 on the base substrate 1 covers the orthographic projection of the second organic protective layer 4 on the base substrate 1 .

[0159] The display panel provided by the embodiment of the present disclosure can increase the strength and prevent the crack-blocking structure from cracking by covering the crack-blocking structure with the second organic protective layer. In addition, the first organic protective layer covers the second organic protective layer, which can further improve the protection effect.

[0160] It should be noted that, FIG20 to FIG23 take the display panel including a single-layer inorganic pattern structure 2 as an example for illustration, wherein, in FIG20, the inorganic pattern structure 2 and the first inorganic insulating layer 6 are formed by the same patterning process; in FIG21, the inorganic pattern structure 2 and the first gate insulating layer 1001 are formed by the same patterning process; in FIG22, the inorganic pattern structure 2 and the interlayer insulating layer 1002 are formed by the same patterning process; in FIG23, the inorganic pattern structure 2 and the passivation layer 1003 are formed by the same patterning process; FIG24 to FIG25 take the display panel including a double-layer inorganic pattern structure 2 as an example for illustration, wherein In Figure 24, the first inorganic pattern structure 2-1 and the first inorganic insulating layer 6 are formed by the same patterning process, and the second inorganic pattern structure 2-2 and the passivation layer 1003 are formed by the same patterning process; in Figure 25, the first inorganic pattern structure 2-1 and the first gate insulating layer 1001 are formed by the same patterning process, and the second inorganic pattern structure 2-2 and the passivation layer 1003 are formed by the same patterning process; in Figure 26, the first inorganic pattern structure 2-1 and the interlayer insulating layer 1002 are formed by the same patterning process, and the second inorganic pattern structure 2-2 and the passivation layer 1003 are formed by the same patterning process.

[0161] In some embodiments, as shown in Figure 27, the multilayer conductive layer 9 further includes a fourth conductive layer 904, and the multilayer second inorganic insulating layer 10 further includes a second gate insulating layer 1004; the second gate insulating layer 1004 is located on the side of the gate G away from the substrate 1, and the fourth conductive layer 904 is located between the second gate insulating layer 1004 and the interlayer insulating layer 1002.

[0162] In a specific implementation, the inorganic pattern structure and the second gate insulating layer may be formed by adopting the same patterning process.

[0163] In a specific implementation, the driving circuit layer further includes a plurality of capacitors. For example, the first conductive layer further includes one electrode of the capacitor, and the fourth conductive layer includes another electrode of the capacitor.

[0164] In some embodiments, as shown in FIG. 28 , the crack blocking structure 5 further includes a third sub-portion 5 - 2 disposed in the same layer as the second gate insulating layer 1004 .

[0165] In some embodiments, as shown in FIG29 , the display panel further includes a plurality of retaining walls 16 located in the peripheral area NA; the orthographic projections of the plurality of retaining walls 16 on the base substrate 1 are located on the side of the orthographic projection of the crack blocking structure 5 on the base substrate 1 facing the display area AA.

[0166] In a specific implementation, as shown in FIG30 , the retaining wall 16 is used to block the encapsulation layer 13. In the display panel provided by the embodiment of the present disclosure, the orthographic projections of the plurality of retaining walls 16 on the base substrate 1 are located on the side of the orthographic projection of the crack-blocking structure 5 on the base substrate 1 that faces the display area AA. This prevents the encapsulation layer 13 from extending into the area where the crack-blocking structure 5 is located, thereby preventing cracks from extending along the encapsulation layer 13 and causing encapsulation failure.

[0167] In some embodiments, as shown in FIG29 , the orthographic projection of the retaining wall 16 on the base substrate 1 surrounds the display area AA; the plurality of retaining walls 16 include: a first retaining wall 1601 , and a second retaining wall 1602 located on the side of the first retaining wall 1601 facing the display area AA.

[0168] In some embodiments, as shown in FIG. 30 , in a direction perpendicular to the base substrate 1 , the thickness of the first retaining wall 1601 is greater than the thickness of the second retaining wall 1602 .

[0169] In a specific implementation, the first retaining wall and the second retaining wall include, for example, a portion disposed in the same layer as the first planarization layer and a portion disposed in the same layer as the pixel definition layer.

[0170] In some embodiments, the orthographic projections of the first flexible substrate and the second flexible substrate substantially overlap, and the distances between the edge of the barrier layer and the edges of the first flexible substrate and the second flexible substrate are greater than 0. Thus, the first flexible substrate contacts the second flexible substrate at the edge of the substrate substrate, thereby preventing delamination of the second flexible substrate and the barrier layer at the edge.

[0171] In some embodiments, the material of the first flexible substrate and the material of the second flexible substrate are polyimide.

[0172] In some embodiments, the materials of the inorganic pattern structure, the first inorganic insulating layer, and the second inorganic insulating layer include one or a combination of the following: silicon nitride, silicon oxide, and silicon oxynitride.

[0173] In some embodiments, the barrier layer comprises a plurality of inorganic sub-layers arranged in a stacked manner.

[0174] For example, the materials of the multiple inorganic sub-layers sequentially arranged on the first flexible substrate are silicon oxynitride, silicon oxide, and amorphous silicon respectively.

[0175] Based on the same inventive concept, an embodiment of the present disclosure further provides a method for manufacturing a display panel, as shown in FIG31 , comprising:

[0176] S101, providing a base substrate; the base substrate includes: a display area and a peripheral area surrounding the display area;

[0177] S102, forming an inorganic pattern structure on one side of the base substrate; a first inorganic insulating layer is disposed in the peripheral region along an edge of the base substrate; the inorganic pattern structure includes: a plurality of first hollow regions spaced apart along an edge of the inorganic pattern structure away from the display region;

[0178] S103 , forming a first organic protective layer covering the inorganic pattern structure.

[0179] The display panel manufacturing method provided by the embodiments of the present disclosure first forms an inorganic pattern structure on the edge of the base substrate, and then forms a first organic protective layer covering the inorganic pattern structure, thereby preventing delamination of the base substrate. Furthermore, because the inorganic pattern structure includes multiple first hollow areas, i.e., the edge of the inorganic pattern structure away from the display area is not continuously arranged, the strain caused by the thermal expansion of the inorganic pattern structure during the cutting process can be absorbed by the organic film layer, thereby preventing the continuous inorganic film layer from being squeezed and cracked due to thermal expansion, and avoiding the initial cracks caused by cutting at the edge.

[0180] In some embodiments, after forming the first organic protection layer covering the inorganic pattern structure, the method further includes:

[0181] An inorganic pattern structure is formed again on the side of the first organic protective layer facing away from the base substrate.

[0182] The method for preparing a display panel provided by an embodiment of the present disclosure forms an inorganic pattern structure again on the side of the first organic protective layer facing away from the base substrate. Compared with the case where the inorganic pattern structure is not provided, the thermal expansion coefficient can be further reduced, thereby avoiding delamination of the first organic protective layer.

[0183] In some embodiments, the method for manufacturing a display panel provided by the embodiments of the present disclosure further includes:

[0184] A pattern of a first inorganic insulating layer is formed on one side of the base substrate; the orthographic projection of the first inorganic structure pattern on the base substrate surrounds the orthographic projection of the first inorganic insulating layer on the base substrate, and the distance between the orthographic projection of the first inorganic structure pattern on the base substrate and the orthographic projection of the first inorganic insulating layer on the base substrate is greater than 0.

[0185] In some embodiments, after forming the pattern of the first inorganic insulating layer, the method further includes:

[0186] A driving circuit layer pattern is formed on the side of the first inorganic insulating layer away from the base substrate; the driving circuit layer includes: multiple conductive layers and multiple second inorganic insulating layers; the second inorganic insulating layers and the conductive layers are alternately stacked.

[0187] In some embodiments, forming an inorganic pattern structure specifically includes:

[0188] The inorganic pattern structure is formed while the pattern of the first inorganic insulating layer is formed.

[0189] Alternatively, in some embodiments,

[0190] Forming an inorganic pattern structure, specifically comprising:

[0191] The inorganic pattern structure is formed while patterning one second inorganic insulating layer among the multiple second inorganic insulating layers.

[0192] In some embodiments, forming the multi-layer second inorganic insulating layer further includes:

[0193] A pattern of multiple crack blocking structures is formed in the peripheral area; the orthographic projections of the multiple crack blocking structures on the base substrate are located on the side of the orthographic projection of the inorganic pattern structure on the base substrate facing the display area, and the orthographic projection of each of the multiple crack blocking structures on the base substrate surrounds the display area.

[0194] In some embodiments, the multilayer conductive layer includes a first conductive layer and a second conductive layer, and the multilayer second inorganic insulating layer includes a first gate insulating layer and an interlayer insulating layer; and a pattern of a driving circuit layer is formed on a side of the first inorganic insulating layer facing away from the base substrate, specifically comprising:

[0195] forming a pattern of an active layer on a side of the first inorganic insulating layer facing away from the base substrate;

[0196] forming a first gate insulating layer on a side of the active layer facing away from the substrate;

[0197] A pattern of a first conductive layer on a side of the first gate insulating layer facing away from the substrate; the first conductive layer includes a gate electrode of a thin film transistor;

[0198] forming an interlayer insulating layer on a side of the first conductive layer facing away from the substrate;

[0199] Performing a patterning process on the interlayer insulating layer and the first gate insulating layer to form a pattern of a crack blocking structure and a pattern of a via hole;

[0200] A second conductive layer pattern is formed on the side of the interlayer insulating layer away from the substrate; the second conductive layer includes a source and a drain of the thin film transistor; the source and the drain are electrically connected to the active layer through vias penetrating the interlayer insulating layer and the first gate insulating layer.

[0201] In some embodiments, before forming the interlayer insulating layer, the method further includes:

[0202] forming a second gate insulating layer;

[0203] A pattern of a fourth conductive layer is formed on a side of the second gate insulating layer facing away from the substrate; the fourth conductive layer includes an electrode of a capacitor.

[0204] In some embodiments, forming a first organic protective layer covering the inorganic pattern structure specifically includes:

[0205] A first organic protection layer is formed covering the inorganic pattern structure and the plurality of crack blocking structures.

[0206] In a specific implementation, when the inorganic pattern structure is provided in the same layer as the first inorganic insulating layer or the first gate insulating layer or the interlayer insulating layer, the first organic protective layer is formed before forming the second conductive layer.

[0207] In some embodiments, the multi-layer conductive layer further includes a third conductive layer, and the multi-layer second inorganic insulating layer further includes a passivation layer; after forming the second conductive layer, the method further includes:

[0208] forming a passivation layer on a side of the second conductive layer facing away from the substrate;

[0209] forming a second planarization layer on a side of the passivation layer facing away from the substrate;

[0210] A pattern of a third conductive layer is formed on the side of the second planarization layer facing away from the substrate; the third conductive layer includes a connecting electrode; the connecting electrode is electrically connected to the drain through a via hole penetrating the second planarization layer and the passivation layer.

[0211] In a specific implementation, when the inorganic pattern structure and the passivation layer are provided in the same layer, the first organic protective layer is formed after the passivation layer is formed and before the third conductive layer is formed.

[0212] Alternatively, in some embodiments, before forming the first organic protection layer covering the inorganic pattern structure, the method further includes:

[0213] forming a second organic protection layer covering the plurality of crack-blocking structures;

[0214] Forming a first organic protective layer covering the inorganic pattern structure specifically includes:

[0215] A first organic protective layer is formed to cover the inorganic pattern structure and the second organic protective layer.

[0216] In some embodiments, a second organic protective layer is formed after forming the crack stop structure and before forming the second conductive layer. When the inorganic pattern structure is disposed in the same layer as the first inorganic insulating layer, the first gate insulating layer, or the interlayer insulating layer, the first organic protective layer is formed after forming the second organic protective layer. When the inorganic pattern structure is disposed in the same layer as the passivation layer, the first organic protective layer is formed after forming the passivation layer and before forming the third conductive layer.

[0217] In some embodiments, after forming the pattern of the driving circuit layer, the method further includes:

[0218] forming a first planarization layer on a side of the driving circuit layer facing away from the base substrate;

[0219] forming an anode pattern on a side of the first planarization layer facing away from the substrate;

[0220] A pixel definition layer pattern is formed on a side of the anode facing away from the substrate, wherein the pixel definition layer has a plurality of opening areas exposing the anode;

[0221] forming a light-emitting functional layer on a side of the pixel definition layer facing away from the substrate;

[0222] forming a cathode on a side of the light-emitting functional layer facing away from the substrate;

[0223] An encapsulation layer is formed on a side of the cathode facing away from the substrate.

[0224] In some embodiments, a substrate is provided, specifically comprising:

[0225] A first flexible substrate, a barrier layer, and a second flexible substrate are sequentially formed on a rigid substrate.

[0226] In some embodiments, before forming the second flexible substrate, the method further includes: performing a patterning process on the barrier layer to remove the barrier layer at its edges.

[0227] In some embodiments, the method for preparing a display panel provided by the embodiments of the present disclosure is to first prepare a motherboard including a plurality of display panels, and then cut the motherboard to obtain a plurality of display panels.

[0228] In some embodiments, the base substrate includes: a plurality of display panel areas and a cutting and removing area surrounding the display panel areas; the display panel area includes: a display area and a peripheral area surrounding the display area;

[0229] After the encapsulation layer is formed, it also includes:

[0230] A cutting process is performed to remove the cutting removal area to obtain a display panel corresponding to the display panel.

[0231] Next, the method for manufacturing a display panel provided by the embodiment of the present disclosure is described by taking the inorganic pattern structure and the first inorganic insulating layer as an example. The method for manufacturing a display panel includes:

[0232] S201, forming a polyimide layer on a hard substrate such as a glass substrate as a first flexible substrate;

[0233] S202, forming silicon oxynitride, silicon oxide, and amorphous silicon as barrier layers in sequence on a side of the first flexible substrate facing away from the glass substrate;

[0234] S203, forming a polyimide layer as a second flexible substrate on a side of the barrier layer facing away from the glass substrate;

[0235] S204, depositing silicon oxide to form an inorganic pattern structure and a film layer where the first inorganic insulating layer is located;

[0236] S205, sequentially depositing silicon nitride, a silicon oxide buffer layer, and an amorphous silicon layer, dehydrogenating at high temperature, and then using an excimer laser annealing process to convert the amorphous silicon into polycrystalline silicon to form an active layer;

[0237] S206, performing a patterning process such as exposure and etching on the active layer to form a pattern of the active layer; performing ion doping on a part of the active layer;

[0238] S207, depositing a first gate insulating layer;

[0239] S208, depositing a metal layer and performing a patterning process to form a pattern of the first conductive layer;

[0240] S209, depositing a second gate insulating layer;

[0241] S210, depositing a metal layer and performing a patterning process to form a pattern of a fourth conductive layer;

[0242] S211, depositing an interlayer insulating layer; for example, sequentially depositing a substrate, namely silicon nitride and silicon oxide, as the interlayer insulating layer;

[0243] S212, forming a pattern of a crack barrier structure using a graphic process;

[0244] S213, etching to form an inorganic pattern structure and a pattern of the first inorganic insulating layer using a patterning process;

[0245] S214, forming a first organic insulating layer covering the inorganic pattern structure and the crack blocking structure;

[0246] S215, depositing a metal layer and performing a patterning process to form a pattern of a second conductive layer;

[0247] S216, depositing a passivation layer;

[0248] S217, forming a pattern of a second planarization layer;

[0249] S218, depositing a metal layer and performing a patterning process to form a pattern of a third conductive layer;

[0250] S219, forming a pattern of a first planarization layer;

[0251] S220, forming a pattern of an anode;

[0252] S221, forming a pattern of a pixel definition layer;

[0253] S222, forming a light-emitting functional layer and a cathode in sequence by using an evaporation process;

[0254] S223, forming an encapsulation layer;

[0255] S224, attaching a protective film to the side of the encapsulation layer facing away from the glass substrate, removing the motherboard from the glass substrate using a laser process, and then performing a laser cutting process to remove the cutting removal area to obtain multiple display panels.

[0256] Next, the method for manufacturing a display panel provided by the embodiment of the present disclosure is described by taking the inorganic pattern structure and the passivation layer as an example. The method for manufacturing a display panel includes:

[0257] S301, forming a polyimide layer on a hard substrate such as a glass substrate as a first flexible substrate;

[0258] S302, forming silicon oxynitride, silicon oxide, and amorphous silicon as barrier layers in sequence on a side of the first flexible substrate facing away from the glass substrate;

[0259] S303, forming a polyimide layer as a second flexible substrate on a side of the barrier layer facing away from the glass substrate;

[0260] S304, depositing silicon oxide to form a first inorganic insulating layer;

[0261] S305, sequentially depositing silicon nitride, silicon oxide buffer layer and amorphous silicon layer, dehydrogenating at high temperature, and then using excimer laser annealing process to convert amorphous silicon into polycrystalline silicon to form an active layer;

[0262] S306, performing a patterning process such as exposure and etching on the active layer to form a pattern of the active layer; performing ion doping on a part of the active layer;

[0263] S307, depositing a first gate insulating layer;

[0264] S308, depositing a metal layer and performing a patterning process to form a pattern of the first conductive layer;

[0265] S309, depositing a second gate insulating layer;

[0266] S310, depositing a metal layer and performing a patterning process to form a pattern of a fourth conductive layer;

[0267] S311, depositing an interlayer insulating layer; for example, sequentially depositing a substrate, namely silicon nitride and silicon oxide, as the interlayer insulating layer;

[0268] S312, forming a pattern of a crack barrier structure using a graphic process;

[0269] S313, etching to form a pattern of the first inorganic insulating layer using a patterning process;

[0270] S314, forming a second organic insulating layer covering the crack blocking structure;

[0271] S315, depositing a metal layer and performing a patterning process to form a pattern of a second conductive layer;

[0272] S316, depositing a passivation layer; and performing a patterning process to form an inorganic pattern structure;

[0273] S317, forming a first organic insulating layer covering the inorganic pattern structure;

[0274] S318, forming a pattern of a second planarization layer;

[0275] S319, depositing a metal layer and performing a patterning process to form a pattern of a third conductive layer;

[0276] S320, forming a pattern of a first planarization layer;

[0277] S321, forming a pattern of an anode;

[0278] S322, forming a pattern of a pixel definition layer;

[0279] S323, sequentially forming a light-emitting functional layer and a cathode by using an evaporation process;

[0280] S324, forming an encapsulation layer;

[0281] S325, attaching a protective film to the side of the encapsulation layer facing away from the glass substrate, removing the motherboard from the glass substrate using a laser process, and then performing a laser cutting process to remove the cutting removal area to obtain multiple display panels.

[0282] An embodiment of the present disclosure provides a display device, which includes the display panel provided by the embodiment of the present disclosure.

[0283] The display device provided in the embodiments of the present disclosure is any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system. Other essential components of the display device are readily understood by those skilled in the art and are not described here in detail, nor should they be construed as limitations of the present disclosure. The implementation of the display device can be referenced to the above-described display panel embodiments, and any repetitive details will not be repeated.

[0284] In summary, the display panel, its preparation method, and display device provided by the embodiments of the present disclosure include an inorganic pattern structure disposed at the edge of the substrate, between the substrate and the first organic protective layer, thereby preventing delamination of the substrate. Furthermore, because the inorganic pattern structure includes multiple first hollow regions, i.e., the edge of the inorganic pattern structure away from the display area is not continuously disposed, the strain of the inorganic pattern structure after thermal expansion during the cutting process can be absorbed by the organic film layer, thereby preventing cracking of the film layer caused by extrusion due to thermal expansion of the continuous inorganic film layer and avoiding the occurrence of initial cracks at the edge caused by cutting.

[0285] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0286] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if such changes and modifications of the embodiments of the present invention fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A display panel, wherein: The display panel includes: A base substrate, comprising a display area and a peripheral area surrounding the display area; An inorganic pattern structure is arranged along the edge of the base substrate in the peripheral area; the inorganic pattern structure comprises: a plurality of first hollow areas spaced apart along the edge of the inorganic pattern structure away from the display area; A first organic protective layer covers the inorganic pattern structure.

2. The display panel according to claim 1, wherein: In a direction perpendicular to the edge of the base substrate, a width of the first hollow area is smaller than a width of the inorganic pattern structure.

3. The display panel according to claim 1, wherein: In a direction perpendicular to the edge of the base substrate, the width of the first hollow area is equal to the width of the inorganic pattern structure.

4. The display panel according to any one of claims 1 to 3, wherein: The orthographic projection of the first hollow area on the base substrate is a part of a rectangle or a circle.

5. The display panel according to any one of claims 1 to 4, wherein: At an edge of the inorganic pattern structure away from the display area, the width of the first hollow area is greater than 1 micron, and the distance between two adjacent first hollow areas is greater than or equal to 3 microns and less than or equal to 100 microns; In a direction perpendicular to the edge of the base substrate, a width of the first inorganic structure pattern is greater than or equal to 2 micrometers and less than or equal to 100 micrometers.

6. The display panel according to any one of claims 1 to 5, wherein: The display panel includes two layers of the inorganic pattern structure; one of the two layers of the inorganic pattern structure is located between the first organic protective layer and the base substrate, and the other layer of the two layers of the inorganic pattern structure is located on a side of the first organic protective layer away from the base substrate.

7. The display panel according to claim 6, wherein: The orthographic projection shapes of the first hollow areas on the base substrate in the two layers of the inorganic pattern structures are the same.

8. The display panel according to claim 6 or 7, wherein: The inorganic pattern structure further includes: a first sub-pattern located between two adjacent first hollow areas; The orthographic projections of the two layers of the first sub-patterns of the inorganic pattern structure on the base substrate overlap.

9. The display panel according to claim 8, wherein: The orthographic projections of the first sub-patterns of the two layers of the inorganic pattern structure on the base substrate substantially overlap.

10. The display panel according to claim 6 or 7, wherein: The inorganic pattern structure further includes: a first sub-pattern located between two adjacent first hollow areas; The orthographic projections of the two layers of the first sub-patterns of the inorganic pattern structure on the base substrate do not overlap with each other.

11. The display panel according to any one of claims 1 to 10, wherein: The display panel further includes: A first inorganic insulating layer is located on one side of the base substrate and extends from the display area to the peripheral area; the orthographic projection of the first inorganic structure pattern on the base substrate surrounds the orthographic projection of the first inorganic insulating layer on the base substrate, and the distance between the orthographic projection of the first inorganic structure pattern on the base substrate and the orthographic projection of the first inorganic insulating layer on the base substrate is greater than 0.

12. The display panel according to claim 11, wherein: The display panel further includes: a driving circuit layer located on a side of the first inorganic insulating layer away from the base substrate; the driving circuit layer comprising: a plurality of conductive layers and a plurality of second inorganic insulating layers; the second inorganic insulating layers and the conductive layers are alternately stacked; The inorganic pattern structure and the first inorganic insulating layer or one of the multiple second inorganic insulating layers are formed by a same patterning process.

13. The display panel according to claim 12, wherein: The display panel further includes: A plurality of crack blocking structures are located in the peripheral area; the orthographic projections of the plurality of crack blocking structures on the base substrate are located on the side of the orthographic projection of the inorganic pattern structure on the base substrate facing the display area, and the orthographic projection of each of the plurality of crack blocking structures on the base substrate surrounds the display area; the plurality of crack blocking structures are arranged in the same layer as part of the inorganic insulating layer in the multi-layer second inorganic insulating layer.

14. The display panel according to claim 13, wherein: The first organic protection layer covers the crack blocking structure.

15. The display panel according to claim 13, wherein: The display panel further includes: a second organic protection layer covering the crack blocking structure; The orthographic projection of the second organic protective layer on the base substrate and the orthographic projection of the inorganic pattern structure on the base substrate do not overlap with each other; The orthographic projection of the first organic protective layer on the base substrate covers the orthographic projection of the second organic protective layer on the base substrate.

16. The display panel according to any one of claims 1 to 15, wherein: The substrate comprises: a first flexible substrate, a barrier layer, and a second flexible substrate that are stacked; The first inorganic structure pattern and the first inorganic insulating layer are located on a side of the second flexible substrate facing away from the barrier layer.

17. A method for preparing a display panel, wherein: The method comprises: Providing a base substrate; the base substrate comprises: a display area and a peripheral area surrounding the display area; An inorganic pattern structure is formed on one side of the base substrate; the first inorganic insulating layer is disposed along the edge of the base substrate in the peripheral area; the inorganic pattern structure comprises: a plurality of first hollow areas spaced apart along the edge of the inorganic pattern structure away from the display area; A first organic protection layer is formed to cover the inorganic pattern structure.

18. The method according to claim 17, wherein: After forming a first organic protective layer covering the inorganic pattern structure, the method further includes: The inorganic pattern structure is formed again on the side of the first organic protective layer facing away from the base substrate.

19. The method according to claim 17 or 18, wherein The method further comprises: A pattern of a first inorganic insulating layer is formed on one side of the base substrate; the orthographic projection of the first inorganic structure pattern on the base substrate surrounds the orthographic projection of the first inorganic insulating layer on the base substrate, and the distance between the orthographic projection of the first inorganic structure pattern on the base substrate and the orthographic projection of the first inorganic insulating layer on the base substrate is greater than 0.

20. The method according to claim 19, wherein After forming the pattern of the first inorganic insulating layer, the method further includes: A pattern of a driving circuit layer is formed on the side of the first inorganic insulating layer facing away from the base substrate; the driving circuit layer includes: multiple conductive layers and multiple second inorganic insulating layers; the second inorganic insulating layers and the conductive layers are alternately stacked; Forming an inorganic pattern structure, specifically comprising: The inorganic pattern structure is formed while forming the pattern of the first inorganic insulating layer; or, The inorganic pattern structure is formed while forming the pattern of one of the multiple second inorganic insulating layers.

21. The method according to claim 20, wherein While forming the multi-layer second inorganic insulating layer, the method further comprises: forming a pattern of a plurality of crack blocking structures in the peripheral area; wherein the orthographic projections of the plurality of crack blocking structures on the base substrate are located on a side of the orthographic projection of the inorganic pattern structure on the base substrate facing the display area, and each of the plurality of crack blocking structures surrounds the display area on the orthographic projection of the base substrate; Forming a first organic protective layer covering the inorganic pattern structure specifically includes: A first organic protection layer is formed to cover the inorganic pattern structure and the plurality of crack blocking structures.

22. The method according to claim 20, wherein While forming the multi-layer second inorganic insulating layer, the method further comprises: forming a pattern of a plurality of crack blocking structures in the peripheral area; wherein the orthographic projections of the plurality of crack blocking structures on the base substrate are located on a side of the orthographic projection of the inorganic pattern structure on the base substrate facing the display area, and each of the plurality of crack blocking structures surrounds the display area on the orthographic projection of the base substrate; Before forming the first organic protective layer covering the inorganic pattern structure, the method further includes: forming a second organic protection layer covering the plurality of crack-blocking structures; Forming a first organic protective layer covering the inorganic pattern structure specifically includes: The first organic protective layer is formed to cover the inorganic pattern structure and the second organic protective layer.

23. A display device, wherein: The display device includes the display panel according to any one of claims 1 to 16.

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