Optical module, communication device, communication system, chip, and method

Abstract

The present application provides an optical module, a communication device, a communication system, a chip, and a method, which are used for reducing the layout space occupied by a single optical assembly on a line board, so that more optical assemblies can be integrated on a line board of a fixed size. A DSP chip in the optical module can not only be used for carrying out equalization processing on an electric signal and the like, but also, when the optical module is mounted on a line board and a DSP is directly connected to an electrical cross-connect board, the DSP can implement the function of a line-side framer, thus avoiding the need to mount a framer chip in each individual optical assembly of a line board. Thus, not only are the costs and power consumption of an OTN hardware device reduced, but the layout space occupied by a single optical assembly on the line board is also reduced, so that more optical assemblies can be integrated on a line board of a fixed size. Moreover, due to the fact that manufacturers can, by means of investing in a single DSP chip, implement the function of processing the electric signal and the function of the line-side framer, the manufacturers can reduce the overall research and development costs of chips, and reduce the research and development period of products.

Description

Optical module, communication device, communication system, chip and method

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on January 31, 2024, with application number 202410138297.1 and application name “Optical module, communication equipment, communication system, chip and method”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of optical communication technology, and in particular to an optical module, communication equipment, communication system, chip and method. Background Art

[0003] An optical transmission network (OTN) is a network structured at the optical layer, based on wavelength division multiplexing technology. OTN equipment uses OTN data frames (or simply OTN frames), which can carry a variety of service data and enable management and monitoring of service data.

[0004] OTN equipment with electrical cross-connect functionality typically includes multiple tributary boards, multiple line boards, and at least one electrical cross-connect board. Each tributary board and line board integrates multiple optical components. The optical components in the tributary board typically include service-side optical modules and tributary-side framer chips, while the optical components in the line board typically include line-side optical modules and line-side framer chips. The service-side optical modules receive optical signals carrying service data and perform optoelectronic conversion on the optical signals to generate electrical signals. The tributary-side framers frame the electrical signals to generate service data and map the service data into optical data units (ODUs). The electrical cross-connect board performs cross-connect scheduling on the optical data units received from the tributary-side framers, encapsulates the optical data units into cross-connect data units, and then sends the cross-connect data units to the destination line-side framer. The line-side framer receives the cross-connect data units, decapsulates the cross-connect data units to generate optical data units, maps and / or multiplexes the decapsulated optical data units into optical transmission units (OTUs), and frames the OTUs to generate electrical signals. The line-side optical modules perform electrical-to-optical conversion on the electrical signals to generate optical signals. The optical signal can be transmitted to other OTN devices in the OTN through optical fiber links.

[0005] The continuous increase in the transmission capacity of OTN equipment places higher demands on the integration of optical components on circuit boards. However, since circuit boards are generally of fixed size, how to integrate more optical components on a circuit board of fixed size has become an urgent problem that needs to be solved.

[0006] Summary of the Invention

[0007] The present application provides an optical module, communication equipment, communication system, chip and method for reducing the layout space occupied by a single optical component on a circuit board, thereby facilitating the integration of more optical components on a circuit board of fixed size.

[0008] Analysis revealed that equipment manufacturers typically invest in a single-chip solution to manufacture both tributary-side framer chips and line-side framer chips, reducing overall framer chip R&D costs and shortening product development cycles. Specifically, a single framer chip integrates not only the circuitry required to implement the line-side framer function (referred to as the line frame processing circuit) but also the circuitry required to implement the tributary-side framer function (referred to as the tributary frame processing circuit). However, when the framer chip is integrated into the optical components of a circuit board, the tributary frame processing circuitry in the framer chip remains unused. This circuitry not only generates significant static power consumption, increasing the power consumption of the circuit board, but also consumes significant layout and heat dissipation space on the board.

[0009] Based on the above analysis, it is found that, in the first aspect, the present application provides an optical module. The optical module may include an optical connector, an optical device, a digital signal processor DSP and an electrical connector. The DSP is used to receive data frames through the electrical connector, and when the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-board, the data frame is decapsulated to obtain an optical data unit, the decapsulated optical data unit is mapped and / or multiplexed into an optical transmission unit, and the obtained optical transmission unit is framed to obtain an electrical signal. The DSP is also used to process the obtained electrical signal. The optical device is used to convert the processed electrical signal into an optical signal and send the optical signal through the optical connector.

[0010] The optical module is generally integrated with a DSP chip, which is used to process the electrical signal received from the electrical connector. For example, the DSP is used to perform equalization processing and / or digital-to-analog conversion on the electrical signal. The DSP can send the processed electrical signal to the optical device to improve the signal quality. When the optical module is installed on the circuit board and the electrical connector is directly connected to the electrical cross-board, since the DSP can also realize the function of the line-side framer, this helps to avoid installing a framer chip in a single optical component of the circuit board. This not only helps to reduce the cost and power consumption of OTN hardware equipment, but also helps to reduce the layout space occupied by a single optical component on the circuit board, thereby facilitating the integration of more optical components on a circuit board of fixed size. In addition, since manufacturers can realize the functions of processing electrical signals and the line-side framer by investing in a single DSP chip solution, it helps manufacturers reduce the overall R&D costs of the chip and shorten the product R&D cycle.

[0011] In addition, since different chips generally communicate with each other through serializer / deserializer SerDes, compared with the DSP chip connected to the electrical cross-board via the framer chip, the DSP chip is directly connected to the electrical cross-board, which helps to reduce the number of SerDes that the data transmitted between the two goes through, thereby reducing the data transmission delay between the DSP and the electrical cross-board and reducing the power consumption of the OTN equipment.

[0012] Based on the above analysis, the present application proposes that an optical module suitable for a variety of application scenarios can be prepared, which is beneficial to reducing the overall R&D costs of optical communication equipment and shortening the product R&D cycle. Therefore, the present application proposes that, optionally, the DSP is also used to map the data frame into an optical data unit when the optical module is installed on the branch line integration board, map and / or multiplex the mapped optical data unit into an optical transmission unit, and frame the obtained optical transmission unit to obtain an electrical signal. The data frame can also be referred to as service data. And / or, the DSP is also used to frame the data frame to obtain an electrical signal when the optical module is installed on the circuit board and the electrical connector is directly connected to the framer on the circuit board. As previously described, the framer is used to decapsulate the cross data unit sent by the electrical cross board to obtain an optical data unit, map and / or multiplex the obtained optical data unit into an optical transmission unit, and send the obtained optical transmission unit to the electrical connector.

[0013] Analysis revealed that when the optical module is installed on the branch line integration board, the DSP performs some of the same functions as when the optical module is installed on the circuit board and the electrical connector is directly connected to the framer. These functions include, for example, mapping and / or multiplexing optical data units into optical transmission units and framing the resulting optical transmission units to produce electrical signals. This facilitates the reuse of the same circuitry within the DSP to implement these functions in different scenarios, allowing the DSP to be smaller and adaptable to a variety of application scenarios, saving layout space occupied by individual optical components on the circuit board, and improving the integration of optical components on the circuit board.

[0014] Optionally, a serializer / deserializer (SerDes) is integrated into the DSP. The SerDes rate is adjustable. For example, the SerDes is used to receive the data frame at a first data transmission rate when the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board; the SerDes is used to receive the data frame at a second data transmission rate when the optical module is installed on a branch line integration board and / or when the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board. The first data transmission rate may be greater than the second data transmission rate.

[0015] Optionally, the DSP is further configured to receive a configuration signal. When the configuration signal is at a first logic level, the DSP determines that the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical crossbar. When the configuration signal is at a second logic level, the DSP determines that the optical module is installed on a branch line integration board and / or that the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board.

[0016] Optionally, the optical module further includes a controller, which is used to send the configuration signal to the DSP; and / or the DSP is directly connected to a configuration pin of the electrical connector, which is used to receive the configuration signal.

[0017] Optionally, the optical module can be a color optical module, and the optical signal obtained by the optical device performing electrical-to-optical conversion on the electrical signal can be a color optical signal. Optionally, the color optical signal can be a coherent optical signal. This helps improve the signal quality of optical communication.

[0018] In a second aspect, the present application provides an optical module, comprising an optical connector, an optical device, a digital signal processor (DSP), and an electrical connector; the optical device is used to receive an optical signal through the optical connector and convert the optical signal into an electrical signal; the DSP is used to process the electrical signal; the DSP is also used to frame the electrical signal to obtain an optical transmission unit. When the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-board, the optical transmission unit is demapped and / or demultiplexed to obtain an optical data unit, the obtained optical data unit is encapsulated to obtain a data frame, and the obtained data frame is sent through the electrical connector.

[0019] Optionally, the DSP is also used to, when the optical module is installed on the branch line integration board, demap and / or demultiplex the optical transmission unit to obtain an optical data unit, demap the obtained optical data unit into a data frame, and send the obtained data frame through the electrical connector; and / or, the DSP is also used to, when the optical module is installed on the circuit board and the electrical connector is directly connected to the framer on the circuit board, send the optical transmission unit through the electrical connector, wherein the framer is used to demap and / or demultiplex the optical transmission unit into an optical data unit, encapsulate the obtained optical data unit into a cross data unit, and send the cross data unit to the electrical cross board.

[0020] Optionally, the DSP integrates a serializer / deserializer (SerDes). The SerDes is configured to transmit obtained data frames at a first data transmission rate when the optical module is mounted on a circuit board and the electrical connector is directly connected to an electrical cross-connect board. The SerDes is configured to transmit obtained data frames at a second data transmission rate when the electrical connector is mounted on a branch line integration board and / or when the electrical connector is mounted on a circuit board and directly connected to a framer on the circuit board. The first data transmission rate may be greater than the second data transmission rate.

[0021] Optionally, the DSP is also used to receive a configuration signal; when the configuration signal is at a first logic level, the DSP determines that the optical module is installed on the circuit board and the electrical connector is directly connected to the electrical cross-board; when the configuration signal is at a second logic level, the DSP determines that the optical module is installed on the branch line integration board, and / or, the optical module is installed on the circuit board and the electrical connector is directly connected to the framer on the circuit board.

[0022] Optionally, the optical module further includes a controller, which is used to send the configuration signal to the DSP; and / or the DSP is directly connected to a configuration pin of the electrical connector, which is used to receive the configuration signal.

[0023] Optionally, the DSP is used to perform equalization processing and / or analog-to-digital conversion on the electrical signal.

[0024] Optionally, the optical module can be a color optical module, and the optical signal obtained by the optical device performing electrical-to-optical conversion on the electrical signal can be a color optical signal. Optionally, the color optical signal can be a coherent optical signal. This helps improve the signal quality of optical communication.

[0025] The optical module provided in the second aspect differs from the optical module provided in the first aspect in that the optical module provided in the first aspect is used to transmit downlink data, while the optical module provided in the second aspect is used to transmit uplink data. Downlink data refers to data transmitted from the electrical connector of the optical module to the optical connector, and uplink data refers to data transmitted from the optical connector of the optical module to the electrical connector. The method performed by the optical module provided in the second aspect can be considered to be the reverse process of the method performed by the optical module provided in the first aspect. The beneficial effects of the second aspect can be understood by referring to the beneficial effects of the relevant content of the first aspect.

[0026] In a third aspect, the present application provides a communication device, comprising a mainboard and one or more optical modules mounted on the mainboard, wherein the one or more optical modules are optical modules as described in any one of the implementations described in the first aspect or the second aspect.

[0027] Optionally, the main board is a circuit board, and the communication device further includes an electrical cross-board, and the one or more optical modules are directly connected to the electrical cross-board respectively.

[0028] In a fourth aspect, the present application provides a communication system, which includes multiple communication devices and an optical transmission network, wherein the optical transmission network is used to transmit optical signals between different communication devices among the multiple communication devices, and the multiple communication devices include at least one communication device as described in any one of the third aspects.

[0029] Since the communication equipment provided by the third aspect and the communication system provided by the fourth aspect integrate the optical modules provided by the first aspect and / or the second aspect, the technical effects and technical details that can be obtained by the third aspect and the fourth aspect can refer to the corresponding contents of the first aspect and the second aspect mentioned above, and will not be repeated here.

[0030] In a fifth aspect, the present application provides a data transmission method, which is applied to an optical module, and the method includes: receiving a data frame through the electrical connector of the optical module; when the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-board, decapsulating the data frame to obtain an optical data unit, mapping and / or multiplexing the decapsulated optical data unit into an optical transmission unit, and framing the obtained optical transmission unit to obtain an electrical signal; processing the obtained electrical signal, and the processed electrical signal is used to convert it into an optical signal, and the optical signal is used to be emitted through the optical connector of the optical module.

[0031] Optionally, the method further includes: when the optical module is installed on the branch line integration board, mapping the data frame into an optical data unit, mapping and / or multiplexing the mapped optical data unit into an optical transmission unit, and framing the obtained optical transmission unit to obtain an electrical signal; and / or, when the optical module is installed on the circuit board and the electrical connector is directly connected to the framer on the circuit board, framing the data frame to obtain an electrical signal, wherein the framer is used to decapsulate the cross data unit sent by the electrical cross board to obtain an optical data unit, mapping and / or multiplexing the obtained optical data unit into an optical transmission unit, and sending the obtained optical transmission unit to the electrical connector.

[0032] Optionally, the optical module has a serializer / deserializer SerDes, and receiving the data frame through the electrical connector of the optical module includes: when the optical module is installed on the circuit board and the optical module is directly connected to the electrical cross-board, controlling the SerDes to use a first data transmission rate to receive the data frame; when the optical module is installed on the branch line integration board, and / or, the optical module is installed on the circuit board and the optical module is directly connected to the framer on the circuit board, controlling the SerDes to use a second data transmission rate to receive the data frame; wherein, the first data transmission rate may be greater than the second data transmission rate.

[0033] Optionally, the method further includes: receiving a configuration signal; when the configuration signal is at a first logic level, determining that the optical module is installed on a circuit board and the optical module is directly connected to an electrical cross-board; when the configuration signal is at a second logic level, determining that the optical module is installed on a branch line integration board, and / or that the optical module is installed on a circuit board and the optical module is directly connected to a framer on the circuit board.

[0034] Optionally, the processing of the obtained electrical signal includes: performing equalization processing and / or digital-to-analog conversion on the obtained electrical signal.

[0035] In a sixth aspect, the present application provides a data transmission method, which is applied to an optical module, and the method includes: processing an electrical signal, wherein the electrical signal is obtained after photoelectric conversion of an optical signal, and the optical signal is received through the optical connector of the optical module; framing the electrical signal to obtain an optical transmission unit; when the optical module is installed on a circuit board and the electrical connector of the optical module is directly connected to an electrical cross-board, demapping and / or demultiplexing the optical transmission unit to obtain an optical data unit, encapsulating the obtained optical data unit to obtain a data frame, and sending the obtained data frame through the electrical connector.

[0036] Optionally, the method further includes: when the optical module is installed on the branch line integration board, demapping and / or demultiplexing the optical transmission unit to obtain an optical data unit, demapping the obtained optical data unit into a data frame, and sending the obtained data frame through the electrical connector; and / or, when the optical module is installed on the circuit board and the electrical connector is directly connected to the framer on the circuit board, sending the optical transmission unit through the electrical connector, wherein the framer is used to demap and / or demultiplex the optical transmission unit into an optical data unit, encapsulate the obtained optical data unit into a cross data unit, and send the cross data unit to the electrical cross board.

[0037] Optionally, a serializer / deserializer SerDes is integrated in the optical module, and the data frames obtained by sending through the electrical connector include: when the optical module is installed on the circuit board and the electrical connector is directly connected to the electrical cross-board, controlling the SerDes to use a first data transmission rate to send the obtained data frames; when the electrical connector is installed on the branch line integration board, and / or the electrical connector is installed on the circuit board and directly connected to the framer on the circuit board, controlling the SerDes to use a second data transmission rate to send the obtained data frames; wherein, the first data transmission rate may be greater than the second data transmission rate.

[0038] Optionally, the method further includes: receiving a configuration signal; when the configuration signal is at a first logic level, determining that the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-board; when the configuration signal is at a second logic level, determining that the optical module is installed on a branch line integration board, and / or that the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board.

[0039] Optionally, the processing of the electrical signal includes: performing equalization processing and / or analog-to-digital conversion on the electrical signal.

[0040] The method provided in the fifth aspect can be performed by the optical module provided in the first aspect or the DSP in the optical module, or the optical communication device installed with the optical module provided in the first aspect. The method provided in the sixth aspect can be performed by the optical module provided in the second aspect or the DSP in the optical module, or the optical communication device installed with the optical module provided in the second aspect.

[0041] Since the optical module provided in the first aspect or the DSP in the optical module can execute the method provided in the fifth aspect, and the optical module provided in the second aspect or the DSP in the optical module can execute the method provided in the sixth aspect, the technical effects that can be obtained by each method and the technical details of implementing the above methods can refer to the corresponding contents of the first and second aspects mentioned above, and will not be repeated here.

[0042] In a seventh aspect, the present application provides a chip for integration into an optical module, the chip comprising a plurality of circuits, at least one of the plurality of circuits being configured to execute the method described in any one of the possible implementations of the fifth and sixth aspects. Optionally, the chip may be a DSP in the optical module provided in any one of the possible implementations of the first and second aspects. The beneficial effects of the chip provided in the seventh aspect may be referenced to the corresponding contents of the first and second aspects, and will not be further elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] FIG1 schematically shows a possible structure of a communication system;

[0044] FIG2 schematically shows a possible structure of the OTN equipment shown in FIG1 ;

[0045] FIG3 schematically shows another possible structure of the OTN device shown in FIG1 ;

[0046] Figures 4-1 and 4-2 schematically illustrate possible structures of an optical module.

[0047] Figure 5-1 schematically shows another possible structure of the optical module shown in Figure 4-1;

[0048] Figures 5-2 and 5-3 respectively show schematic diagrams of installing an optical module on a mainboard;

[0049] FIG6 schematically shows another possible structure of an OTN device;

[0050] FIG7 schematically illustrates a possible structure of a forwarding device integrated with an optical module;

[0051] FIG8-1 schematically illustrates another possible implementation of the service processing unit in FIG5-1;

[0052] Figure 8-2 schematically illustrates the functional units enabled by the service processing unit in various scenarios in the downlink data transmission direction;

[0053] Figure 8-3 schematically illustrates the functional units enabled by the service processing unit in various scenarios in the uplink data transmission direction;

[0054] Figure 8-4 schematically shows another possible implementation of the line frame processing subunit;

[0055] FIG9 schematically illustrates a possible structure of a rate-adjustable SerDes;

[0056] 10 to 12 schematically illustrate data transmission methods in scenarios 1 to 3, respectively. DETAILED DESCRIPTION

[0057] An optical transmission network (OTN) is a transmission network organized at the optical layer based on wavelength division multiplexing technology. It is widely used in access networks, metropolitan area networks, aggregation networks, data center networks, mobile networks, backbone networks, space optical communication networks, and power optical communication networks. Wavelength division multiplexing multiplexes optical signals of different wavelengths onto the same optical fiber for transmission.

[0058] An OTN network typically consists of multiple OTN devices connected by optical fiber links. Depending on specific needs, it can be organized into different topologies, such as linear, ring, and mesh. Figure 1 schematically illustrates a possible architecture for a communication system. The communication system shown in Figure 1 includes OTN network 1 and OTN network 2. These two OTN networks can be of the same type as described above, or different types. This application does not limit the number of OTN networks in a communication system; the communication system can include more or fewer OTN networks.

[0059] Figure 1 uses rectangles to represent OTN devices, and the connecting lines between the rectangles represent fiber links. As shown in Figure 1, each OTN network includes a certain number of OTN devices, and different OTN devices are connected by fiber links. Figure 1 uses OTN network 1, which includes OTN devices N1 through N4, and OTN network 2, which includes OTN devices N5 through N7, as examples. This application does not limit the number of OTN devices in an OTN network.

[0060] OTN equipment can have a rich set of interfaces. For example, it can be compatible with well-established traditional SDH interfaces and can also provide a wide range of data interfaces, such as Gigabit Ethernet. For example, it can support at least one of the following interfaces: Ethernet, STM-1 / 4 / 16 / 64, Multiprotocol Label Switching (MPLS), and data interfaces with speeds ranging from 100 Mbps to 5 Gbps. Accordingly, OTN equipment can carry a variety of service data (or client signals).

[0061] The data frame used by the OTN device may be an OTN data frame (or simply an OTN frame), which is used to carry service data and enable management and monitoring of service data. The OTN frame may be an optical data unit (ODU), such as ODUk, ODUCn, or ODUflex, or an optical transport unit (OTU), such as OTUk, OTUCn, or a flexible OTN (FlexO) frame. The OTN frame may also be other frame structures suitable for optical networks. This application does not limit the specific value of k, for example, k = 0 / 1 / 2 / 2e / 3 / 4 / C1 / 25 / 50, etc.

[0062] Traditional WDM equipment does not have switching functions, while OTN equipment provides a switching function solution for WDM equipment, enabling it to better support switched optical network functions.

[0063] Figure 2 schematically illustrates a possible structure of an OTN device. As shown in Figure 2, the OTN device may include multiple tributary boards, an electrical cross-connect board, multiple circuit boards, multiplexer / demultiplexer boards, and optical amplifier boards. In the figures of this application, dashed lines with arrows represent optical signals, and solid lines with arrows represent electrical signals.

[0064] The tributary board provides a client-side interface for accessing client-side service data. The tributary board can use service-side optical modules to receive service data carried by optical signals, perform optical-to-electrical (O / E) conversion, and then use a framer to map the service data into an optical channel data unit (ODU) k, which is then sent to the electrical cross-connect board for scheduling. Alternatively, the tributary board can be used to implement the reverse process described above.

[0065] This application does not limit the OTN frame structure used by the framer in the tributary board to ODUk; the framer can use other types of OTN frames. The tributary board can provide multiple types of client-side interfaces. For example, it can provide at least one of the following interfaces: an Ethernet interface, an STM-1 / 4 / 16 / 64 interface, a Multi-Protocol Label Switching (MPLS) interface, and a data interface with any rate from 100M to 5G. Accordingly, the service data can be the service data transmitted by the corresponding interface.

[0066] The electrical cross-connect board is used to schedule electrical signals between the tributary board and the line board. After receiving the ODUk from the tributary board, the cross-connect board can perform cross-connect scheduling on the ODUk, determine the path (or line board) selected for the ODUk, map the ODUk to a cross-connect data unit, and send the cross-connect data unit to the corresponding line board.

[0067] The circuit board provides a line-side interface, primarily processing line-side data frames. For example, the circuit board can use a framer to receive cross-connect data units dispatched by the electrical cross-connect board and demap the cross-connect data units into ODUk packets. The circuit board can then use line-side optical modules to map and / or multiplex the ODUk packets into optical transport units (OTUs), followed by electrical-to-optical (E / O) conversion. Alternatively, the circuit board can be used to reverse the aforementioned process.

[0068] This application does not limit the types of optical modules (or optical interfaces) in the tributary and circuit boards. For example, the service-side optical module can be a gray optical module, and the line-side optical module can be a color optical module. The wavelength of the optical signal received and transmitted by the gray optical module fluctuates within a wide range and has no standard wavelength, while the wavelength of the optical signal received and transmitted by the color optical module fluctuates within a narrow range around a central wavelength and has a standard wavelength. The color optical module can be a coherent optical module.

[0069] Optionally, the optical module in the tributary board may be replaced with an electrical interface, and accordingly, the tributary board receives service data through the electrical interface.

[0070] The M / D board is used to combine or demultiplex optical signals of different wavelengths. Its combining function is reflected in the downstream data transmission direction. The M / D board can multiplex multiple optical signals sent from multiple circuit boards into a single optical signal and transmit this single optical signal to other OTN devices. Its demultiplexing function is reflected in the upstream data transmission direction. The M / D board can demultiplex a single optical signal received from other OTN devices into multiple optical signals and transmit these multiple optical signals to multiple circuit boards. Optionally, OTN devices may not include M / D boards. For example, different circuit boards can transmit optical signals through different optical fibers.

[0071] The optical amplifier board can be equipped with an optical amplifier (OA) to amplify the power of optical signals (abbreviated as optical power). The OA amplifies the optical signals received by the OTN device from other OTN devices and / or the optical signals sent to other OTN devices. The OA is optional. For example, when optical signals need to be transmitted over long distances, the OTN device can use the OA to amplify the optical power. However, when optical signals are transmitted over short distances, the OTN device may not use the OA to amplify the optical power.

[0072] Depending on specific needs, the type and number of boards included in an OTN device may vary. For example, a network device serving as a core node may not have any tributary boards. A network device serving as an edge node may have multiple tributary boards. For example, an OTN device may include multiple electrical cross-connect boards, which can share the traffic load. If one of these boards fails, the traffic switching load can be evenly distributed across the remaining boards, thereby improving the reliability of the OTN device.

[0073] Optionally, the OTN device may further include a rack, the rack is provided with a plurality of slots, and the plurality of boards in the OTN device may be respectively provided in the plurality of slots of the rack.

[0074] The OTN equipment may also include other modules not shown in Figure 2. For example, OTN equipment may include fans, power supplies, auxiliary units, and system control and communication boards. The power supplies are used to power the OTN equipment and may include primary and backup power supplies. Fans are used to dissipate heat. Auxiliary boards provide auxiliary functions such as external alarms or access to external clocks. System control and communication boards implement system control and communication. Specifically, the backplane can collect information from different boards or send control commands to the corresponding boards.

[0075] Figure 1 uses a circuit board with a set of framers and line-side optical modules as an example. Multiple sets of framers and line-side optical modules can be installed on a single circuit board. Furthermore, as demands for data transmission rates in OTN equipment continue to increase, the number of framers and line-side optical modules integrated on circuit boards continues to increase, placing even higher demands on the circuit board's integration.

[0076] Equipment manufacturers typically invest in a single chip solution to manufacture the framer chips for tributary boards and line boards. This means that the framer chip not only has the client-side mapping function of the framer in the tributary board to perform mapping and demapping between service data and ODUk, but also has the line-side mapping function of the framer in the line board to perform mapping and demapping between ODU and OTU, and the line frame processing function to perform encapsulation and decapsulation between ODUk and cross data units. This not only helps reduce the overall R&D cost of the framer chip, but also helps shorten the product R&D cycle.

[0077] As the number of services handled by line-side framers and branch-side framers continues to increase, the size of framer chips continues to increase, occupying a larger layout and heat dissipation space in the circuit board. This restricts further improvement of circuit board integration and is not conducive to heat dissipation.

[0078] Analysis revealed that because the client-side mapping function requires mapping and demapping multiple service data to and from the ODUk, the scale of the logic circuitry in the framer chip implementing this function is typically much larger than that implementing the line-side mapping function. Taking a current 800G framer as an example, the power consumption and area ratios of the logic circuitry used to perform the line board framer function and the logic circuitry used to perform the tributary board framer function are approximately 1:3 and 1:3.5, respectively. When the framer chip is mounted on a circuit board, the circuitry used to implement the client-side mapping function remains unused. This means that a significant amount of the framer chip's circuitry is unused, resulting in significant static power consumption and occupying significant space on the circuit board for layout and heat dissipation.

[0079] In addition to the optical transmitter and optical receiver, the line-side optical module is generally also provided with a digital signal processor (DSP) chip. The DSP mentioned in this application can also be replaced by an optical digital signal processor (ODSP). This application does not limit the type of DSP chip. For example, the DSP can be an application specific integrated circuit (ASIC). The DSP chip can complete signal shaping, generate digital baseband signals, and complete the conversion between analog signals and digital signals. The DSP chip can also receive integrated coherent receiver (ICR) signals, complete the conversion from analog signals to digital signals, and then equalize / compensate the digital signals.

[0080] Based on the above findings, the present application proposes that the DSP can also complete a variety of service interfaces and processing. For example, a line frame processing subunit and a line side mapping subunit can be integrated into the DSP to respectively implement the line frame processing function and the line side mapping function. This is conducive to the direct connection of the optical module to the electrical cross-connect board, and the circuit board does not need to be equipped with an additional framer, thereby reducing the cost and power consumption of the OTN hardware equipment. Accordingly, the OTN equipment can be as shown in Figure 3. In addition, since the size of the circuit used to implement the line frame processing subunit and the line side mapping subunit is smaller than the size of the framer, even if a line frame processing subunit and a line side mapping subunit are newly added to the existing DSP chip, the increased size of the DSP chip is smaller than the size of the framer. This is conducive to saving layout and heat dissipation space on the circuit board, improving the integration of the circuit board, optimizing the layout of the circuit board in the OTN equipment, and ensuring heat dissipation.

[0081] Figure 4-1 schematically illustrates a possible structure of an optical module. Referring to Figure 4-1 , an optical module may integrate optical components and a DSP.

[0082] The optical device may integrate an optical transmitter and / or an optical receiver. Optionally, when the optical device is used to transmit coherent optical signals, it may also include a light source for generating an optical carrier. The optical transmitter can receive a digital electrical signal, apply the digital electrical signal to the amplitude or phase of an optical carrier using external modulation, and transmit the modulated optical carrier signal to a fiber channel. The optical receiver can receive the optical carrier signal from the fiber channel and output an electrical signal based on the optical carrier (as local oscillator light). The optical carriers underlying the optical transmitter and receiver can originate from the same or different light sources. The optical carrier can be wavelength-tunable, with a wavelength range including S, C, L, and O bands, and adjustable wavelength spacing, such as 37.5 GHz, 50 GHz, 100 GHz, or 150 GHz. The optical transmitter may include an electro-optical modulator to perform dual-polarization amplitude or phase modulation. If the modulator has a large Vpi, the telecommunications signal entering the modulator may be amplified to achieve sufficient output optical power and performance. Therefore, the signal output from the DSP generally needs to pass through an amplifier / driver to meet the input signal swing requirements of the modulator. The optical receiver primarily performs coherent reception, including coherent mixing of the optical carrier with the received signal, coherent demodulation, and optoelectronic conversion. Optionally, the optical transmitter and optical receiver can be co-packaged or integrated into a single chip as a functional unit. Optionally, the light source (e.g., a laser) used to generate the optical carrier can also be co-packaged or integrated into a single chip as a functional unit with the optical transmitter and optical receiver. Alternatively, the optical transmitter, optical receiver, and light source can all be independently packaged functional units.

[0083] The DSP can be used to directly connect to the electrical cross-connect board. In the downlink data transmission direction, the line frame processing subunit is used to receive the ODUk packets dispatched by the electrical cross-connect board, encapsulate them into cross-connect data units, and demap the cross-connect data units into ODUk packets. The line-side mapping subunit is then used to multiplex and / or map the ODUk packets to obtain FlexO packets. The optical transmitter is used to perform electrical-to-optical conversion on the electrical signals carrying the FlexO packets, obtaining and emitting optical signals. In the uplink data transmission direction, the optical receiver is used to receive the optical signals, perform optical-to-electrical conversion on the optical signals, obtaining electrical signals carrying the FlexO packets. The line-side mapping subunit is used to demultiplex and / or demap the FlexO packets to obtain ODUk packets. The line frame processing subunit is used to map the ODUk packets into cross-connect data units and transmit the cross-connect data units to the electrical cross-connect board.

[0084] By adding circuitry corresponding to the line-side framer to the existing DSP chip in the optical module to implement line frame processing, this eliminates the need to invest in a new chip solution, thereby minimizing overall equipment R&D costs and development cycles. Furthermore, analysis of the framer's logic circuitry revealed that the client-side framer's logic circuitry is significantly larger than that of the line-side framer. Therefore, by adding circuitry corresponding to the line-side framer (a subunit of the line frame processing) to the DSP, the DSP's increased size is significantly smaller than that of the framer. This reduces layout and heat dissipation space on the circuit board, increases the number of optical modules that can be integrated on a single board, and improves heat dissipation.

[0085] Alternatively, the optical device and DSP can be co-packaged or integrated into a single chip to form a functional unit. Alternatively, the optical transmitter, optical receiver, and DSP can be co-packaged or integrated into a single chip to form a functional unit, while the light source used to generate the optical carrier can be a different functional unit.

[0086] Optionally, a single optical module can support transmission of more channels / wavelengths. Accordingly, the optical module can integrate multiple optical components. As shown in Figure 4-2, an optical module can integrate an optical component for channel 1, an optical component for channel 2, and a DSP. The DSP connects the two optical components, which transmit data from different channels and can operate at different wavelengths. Optionally, an optical module can integrate more optical components to support transmission of optical signals with more channels / wavelengths.

[0087] The DSP shown in Figure 4-1 can have more functions and, accordingly, can be integrated with more functional units. Figure 5-1 schematically illustrates another possible structure of the optical module shown in Figure 4-1. As shown in Figure 5-1, the optical module can include a printed circuit board (PCB), and the optical components and DSP shown in Figure 4-1 can be integrated on this PCB. As shown in Figure 5-1, the PCB can also be mounted with optical connectors and gold fingers. The optical connector can be used to connect optical fibers, for transmitting downlink optical signals output by an optical transmitter into the optical fiber and / or for inputting uplink optical signals received from the optical fiber into the optical receiver. The gold fingers are used to match and install in the slots of the mainboard, thereby achieving an electrical connection between the optical module and the mainboard. This application does not limit the type of mainboard; examples will be provided later. Data streams for various services can be input and output through the gold fingers. Other components can also be integrated on the PCB, such as a power module and structural components. The structural components can be used for positioning, support, and protection, for example, the structural components can be the outer shell of the optical module.

[0088] Gold fingers can be designed into the PCB or installed by soldering. The gold fingers and structural components work together to ensure the pluggable and secure functions of the optical module. Accordingly, this optical module can be used in scenarios where pluggable or removable optical modules are required. As shown in Figure 5-2, the optical module can be installed on the edge of the motherboard using the gold fingers, parallel to the PCB, with the optical connector facing outward, allowing for plugging and unplugging of the optical module fiber.

[0089] The gold fingers can be replaced with other types of electrical connectors, and the optical module can be plugged into the motherboard in a non-parallel orientation to the PCB. As shown in Figure 5-3, the optical module's PCB can be equipped with an electrical connector (such as a high-speed connector), and the optical module can be mounted on the motherboard perpendicular to the PCB through this electrical connector. A vertical electrical connector can have more pins, facilitating greater transmission capacity and supporting both single-channel / wavelength implementations (as shown in Figure 4-1) and multi-channel / wavelength implementations (as shown in Figure 4-2).

[0090] As shown in Figure 5-1, the DSP can also integrate a serializer / deserializer (SerDes) interface. SerDes can perform high-speed data parallel-to-serial conversion or serial-to-parallel conversion, serial input and output, and realize business data transmission with upstream and downstream chips. SerDes can be used to directly connect to the electrical cross-connect board. As shown in Figure 5-1, SerDes can connect to one or more conductive contacts (or pins) of the gold finger. In the OTN equipment shown in Figure 3, assuming that the electrical cross-connect board is electrically connected to the pins of the slot on the circuit board through the traces in the circuit board, by matching the gold finger and installing it in the slot, the SerDes can be directly connected to the SerDes of the electrical cross-connect board.

[0091] In Figure 3, numbered rectangles represent SerDes. The DSP and electrical crossbar board can each be configured with SerDes1, and the DSP and electrical crossbar board communicate via a first-level SerDes.

[0092] In Figure 2, rectangles marked with letters represent SerDes. As shown in Figure 2, communication between the cross-connect board and the framer occurs via SerDesA, while communication between the framer and the coherent optical module occurs via SerDesB. In other words, data transmitted between the optical module and the cross-connect board must pass through two stages of SerDes. SerDes has significant latency and power consumption. Taking a 14nm CMOS process as an example, a single-stage 56G PAM4 SerDes interconnect increases signal latency by approximately 3µs for both transmit and receive, and increases power consumption by 0.5W per SerDes pair at 112Gbps.

[0093] Adding a new line frame processing subunit in the DSP facilitates direct connection of the DSP to the electrical cross-board, thereby facilitating communication between the DSP and the electrical cross-board through a first-level SerDes, thereby reducing the data transmission delay between the DSP and the electrical cross-board and reducing the power consumption of the OTN equipment.

[0094] Since the cross data unit is generally larger than the ODUk, in FIG2 , the transmission rate of the SerDesa used to transmit the cross data unit is higher than the transmission rate of the SerDesb used to transmit the ODUk.

[0095] In the OTN equipment shown in Figure 3, since cross-connect data units are transmitted between the line-side optical module and the electrical cross-connect board, the SerDes1 of the line-side optical module shown in Figure 3 must communicate with the electrical cross-connect board at a higher transmission rate than the SerDesb of the line-side optical module shown in Figure 2. For example, the transmission rate of the SerDes1 of the line-side optical module shown in Figure 3 is the same as the data transmission rate of the SerDessa of the electrical cross-connect board shown in Figure 2.

[0096] Optical communication transmission links are subject to a variety of impairments, primarily including various losses, dispersion, polarization rotation, nonlinear effects, and channel impairments introduced by various optoelectronic devices. In addition, there is frequency offset and phase noise in the lasers at the transceiver end. Optionally, referring to Figure 5-1 , the DSP may also be integrated with an optical port digital signal processing unit, which is used to compensate for various impairments in the electrical signal in the downlink and / or uplink data transmission directions. The electrical signal may be a digital electrical signal. For example, the optical port digital signal processing unit may perform equalization processing on the electrical signal, such as performing polarization multiplexing recovery, clock recovery, dispersion compensation and channel equalization, frequency offset estimation and compensation, carrier phase recovery and signal decision, demodulation, and at least one of various equalization processes, including compensation for optical fiber channel dispersion, polarization mode dispersion (PMD), state of polarization (SOP), and nonlinearity, in the digital signal domain.

[0097] Continuing with Figure 5-1, for optical modules with optical transmitters, the DSP can also integrate a digital-to-analog converter (DAC). In the downlink data transmission direction, the DAC is used to receive digital signals from the optical port digital signal processing unit, convert the digital signals into analog signals, and send the analog signals to the optical transmitter. For optical modules with optical receivers, the DSP can also integrate an analog-to-digital converter (ADC). In the uplink data transmission direction, the ADC is used to receive analog signals from the optical receiver, convert the analog signals into digital signals, and send the digital signals to the optical port digital signal processing unit.

[0098] As shown in Figure 5-1, this application refers to the logic unit in the DSP used for data processing between the SerDes and the optical port digital signal processing unit as a service processing unit. For example, the service processing unit is used to receive data from the SerDes, process the data, and then send it to the optical port digital signal processing unit. Alternatively, the service processing unit is used to receive data from the optical port digital signal processing unit, process the data, and then send it to the SerDes. Accordingly, the service processing unit can be considered to include the line frame processing subunit and line-side mapping subunit described above. The service processing unit can be used to process and convert OTN transport-related protocols.

[0099] The service processing unit may have multiple functions, and accordingly, the service processing unit may integrate multiple functional modules. For example, the service processing unit may include functional module 1 shown in FIG5-1, which has line frame processing function and line side mapping function.

[0100] To make the optical module shown in Figure 4-1 compatible with other application scenarios, as shown in Figure 5-1, the service processing unit can also integrate functional modules corresponding to other application scenarios. For example, at least one of functional modules 2 through 4 can be integrated. Different functional modules can be suitable for different application scenarios. Optionally, the service processing unit can also integrate functional modules other than functional modules 2 through 4 to make the optical module suitable for other application scenarios.

[0101] The DSP may also be integrated with a control unit, which is used to control one or more units in the DSP, for example, to control the service processing unit to process data using functional modules corresponding to the application scenario.

[0102] The present application does not limit the number and type of other functional modules of the service processing unit. The following examples introduce possible application scenarios of the line-side optical module provided by the present application and the corresponding functional modules used by the service processing unit.

[0103] Figure 6 schematically illustrates another possible structure of an OTN device. The OTN device shown in Figure 6 includes multiple branch-line muxponders. A branch-line muxponder is equivalent to combining the functions of a branch board and a line board. For example, in the downlink data transmission direction, a branch-line muxponder can use a service-side optical module to receive an optical signal carrying service data, perform O / E conversion on the optical signal, map the service data into ODUk using a line-side optical module, then map and / or multiplex the ODUk to obtain FlexO, carry the FlexO on an optical signal, and transmit it. In the uplink data transmission direction, a branch-line muxponder can use a line-side optical module to receive an optical signal carrying FlexO, perform O / E conversion on the optical signal, then demap and / or demultiplex the FlexO to obtain ODUk, demap the ODUk into service data, and use a service-side optical module to carry the service data on an optical signal and transmit it.

[0104] This application does not limit the types of optical modules in the branch line-in-one board. For example, the service-side optical module can be a gray optical module, and the line-side optical module can be a color optical module (such as a coherent optical module). Furthermore, the service-side optical module in the branch line-in-one board can optionally be replaced with an electrical interface to receive service data through the electrical interface. The service-side optical module can be an optical module with a DSP, an optical module with a CDR, or a linear-drive pluggable optics (LPO).

[0105] In the OTN equipment shown in Figure 6, it is assumed that the service-side optical module is electrically connected to the pins of the slot on the tributary line-in-one board through the traces in the tributary line-in-one board. By matching and installing the gold finger shown in Figure 5-1 in the slot, the SerDes can connect to the SerDes of the service-side optical module.

[0106] Unlike the OTN equipment shown in Figure 2, the OTN equipment shown in Figure 6 may not have electrical switching capabilities. The wavelength combiner / demultiplexer boards and optical amplifier boards in the OTN equipment can be understood by referring to the relevant content in the previous article and will not be repeated here.

[0107] In order to reduce the overall R&D costs and shorten the product R&D cycle, the service processing unit shown in Figure 5-1 can optionally be integrated with a functional module 2. Functional module 2 has a client-side mapping function and a line-side mapping function. When the optical module shown in Figure 5-1 is directly connected to the electrical cross-board (for example, used in the circuit board shown in Figure 3), the control unit is used to control the service processing unit to use functional module 1 to process data. When the optical module shown in Figure 5-1 is used as a line-side optical module in the branch line integration board, the service processing unit is controlled to use functional module 2 to process data. Functional module 2 can be used to map service data to ODUk, and then map and / or multiplex the ODUk to FlexO, and / or, after demapping and / or demultiplexing the FlexO to ODUk, demap the ODUk to service data.

[0108] In this way, equipment manufacturers can invest in a single optical module or DSP solution and apply it to the line-side optical module of the scenario shown in Figure 3 (referred to as Scenario 1) and the line-side optical module of the scenario shown in Figure 6 (referred to as Scenario 2). Scenario 1 can be an application scenario such as long-distance dense wavelength division multiplexing (DWDM) or metropolitan area DWDM. Scenario 2 can be an application scenario such as metropolitan area DWDM or data center (DC) or data center interconnection (DCI). The optical module provided in this application can be used as the core component of the branch line integration board, and the external service interface is a gray optical module or LPO.

[0109] To ensure forward compatibility with the circuit board shown in Figure 2, the DSP shown in Figure 5-1 can optionally integrate functional module 3, which can provide line-side transparent transmission. The control unit controls the service processing unit to use functional module 3 for data processing when the optical module is used in the line-side optical module scenario shown in Figure 2 (referred to as Scenario 3). Functional module 3 performs data processing other than OTN frame processing, or in other words, transparent transmission of OTN frames.

[0110] In this way, equipment manufacturers can invest in a single optical module or DSP solution and apply it to the line-side optical module in the scenario shown in Figure 3 (called Scenario 1) and the line-side optical module in the scenario shown in Figure 2 (called Scenario 3).

[0111] In the OTN device shown in FIG2 , it is assumed that the framer integrated on the circuit board is electrically connected to the pins of the slot on the circuit board through the traces in the circuit board. By matching the gold fingers and installing them in the slot, the SerDes can be connected to the SerDes of the framer.

[0112] In addition to being used in OTN equipment, optical modules can also be used in optical devices other than OTN (referred to as non-OTN optical devices). For example, as shown in Figure 7, this non-OTN optical device can be a forwarding device, such as a switch / router. Multiple optical modules are connected to the host of this forwarding device, and wavelength multiplexing / demultiplexing boards and optical amplifier boards can be installed in the optical paths of these modules. The forwarding device has a color optical interface, and the external service interface can be a switch. The optical module can be a color optical module (such as a coherent optical module). Optionally, a single optical module can be connected to the host, and accordingly, the wavelength multiplexing / demultiplexing board can be omitted from the optical path of the optical module. The optical module can be a gray optical module. Alternatively, although the optical module is used in OTN equipment, it is not used to process OTN frames. To apply the optical module shown in Figure 5-1 to scenarios where OTN frame processing is not required (referred to as Scenario 4), the DSP shown in Figure 5-1 can optionally be integrated with functional module 4. Functional module 4 is used to perform data processing other than OTN frame processing, or in other words, transparently transmit OTN frames. The control unit is used to control the service processing unit to use the functional module 4 to process data when the optical module shown in Figure 5-1 is applied to scenario 4.

[0113] In this way, equipment manufacturers can invest in a single optical module or DSP solution and apply it to the line-side optical module in the scenario shown in Figure 3 (called Scenario 1) and the line-side optical module in the scenario shown in Figure 7 (called Scenario 4).

[0114] In the forwarding device with an optical interface shown in Figure 7, it is assumed that the forwarding device is electrically connected to the pins of the slot on the PCB through the traces in the PCB shown in Figure 7. By matching and installing the gold fingers in the slot, the SerDes in the optical module can be connected to the SerDes of the forwarding device.

[0115] The module or unit division described in Figure 5-1 represents only one logical functional division; actual implementations may employ different divisions. For example, the logic circuits used to implement different functional modules can be different. Alternatively, the logic circuits used to implement different functional modules can be entirely or partially identical. In other words, a DCP can include at least one shared logic circuit that can be used to implement some or all of the functions of multiple functional modules. This helps reduce the logic scale of the DSP, the size of the optical module, and improve device integration.

[0116] Figure 8-1 schematically illustrates another possible implementation of the service processing unit in Figure 5-1. As shown in Figure 8-1, the service processing unit may include a client-side processing subunit, a line-side processing subunit, a line frame processing subunit, a line-side mapping subunit, and a client-side mapping subunit.

[0117] Each of the subunits shown in Figure 8-1, in whole or in part, may include multiple functional units. Figure 8-2 schematically illustrates the functional units enabled by the service processing unit in the downlink data transmission direction. Figure 8-3 schematically illustrates the functional units enabled by the service processing unit in the uplink data transmission direction.

[0118] When the optical module is used in scenario 1, the control unit can control the service processing unit to use the client-side processing subunit, line frame processing subunit, line-side mapping subunit, and line-side processing subunit to process data. For example, after the client-side processing subunit receives the electrical signal from the SerDes, it recovers the cross-link data unit from the electrical signal. The line frame processing subunit can process the cross-link data unit according to the interface protocol between the optical module and the electrical cross-link board, for example, demapping the cross-link data unit into ODUk. The line-side mapping subunit maps and / or multiplexes the ODUk into FlexO. The line-side processing subunit frames the FlexO to obtain a digital electrical signal, and then sends the digital electrical signal to the optical port digital signal processing unit shown in Figure 5-1. In scenario 1, the optical module is directly connected to the electrical cross-link board, which can support optical data unit cross-link services and electrical layer protection applications.

[0119] The following describes the processing performed by the service processing unit on data in the downlink data transmission direction in scenario 1 with reference to FIG8-2.

[0120] The SDSIF unit can receive electrical signals from SerDes (or SerDes input and output data) and process the data, including at least one of space division cross-linking, 1588 timestamp extraction, and clock domain conversion.

[0121] The physical medium attachment (PMA)_RX unit may perform at least one of distribution scheduling, AM locking, bit reordering (MSB / LSB), bit width conversion, and clock domain isolation processing on the data processed by the SDSIF unit.

[0122] The Reed-Solomon Forward Error Correction (RSFEC) unit may perform RS FEC decoding on the data processed by the PMA_RX unit.

[0123] The physical coding sublayer (PCS)_RX unit can perform cross-board interface sending direction processing on the data decoded by the RSFEC unit, including at least one of byte / CRC reordering, 64 / 66B encoding, scrambling, interface adaptation, and cross-connection.

[0124] The egress shared memory (ESM) unit can process the cells inserted from the electrical cross-board during the cross-data unit framing process. The present application does not limit the format of the cross-data unit. For example, the cross-data unit can be a data structure defined by the next generation switch fabric (NGSF) protocol. The cross-data unit can include a 16-byte control cell and 192 bytes or 384 bytes of data. The ESM unit can support the insertion of control cells defined by the NGSF protocol from the electrical cross-board, and supports functions such as adding a cyclic redundancy check (CRC) to the cell header and CRC8 error correction.

[0125] The EBM unit can perform downlink buffer processing based on the cells processed by the ESM, and can support at least one of sorting, symmetric processing of OTN service delay, intra-board multicast, and service bandwidth anomaly protection.

[0126] The OTN2SMDMP unit can support demapping of cross data units to OTN frames, for example, obtaining ODUk, or restoring cross data units to ODUk. The cross data units can also be called section monitor (SM) cells.

[0127] The ODU_RX unit can perform WTT reception processing on ODUk, for example, having at least one of the functions of framing, descrambling, overhead extraction, maintenance signal insertion, TCMi clearing and test signal detection.

[0128] The SWITCH unit can perform cross processing on the ODUk after ODU_RX processing and can support loopback.

[0129] The LODU unit can perform WTT transmission processing on the low-order ODUk / ODUCn, such as at least one of frame header insertion and tracking, overhead insertion (from OHP), maintenance signal insertion, delay measurement and test signal insertion.

[0130] The ODUCnMP unit can map the low-order ODUk into the line high-order ODUCn, and perform WTT transmission processing on the high-order ODUCn, such as frame header insertion and tracking, overhead insertion (from OHP), maintenance signal insertion, delay measurement and test signal insertion. At least one of the following is performed, for example, line-side transmission direction ODUCn processing is performed, such as including at least one of OA11 insertion, AIS insertion, LS scrambling and ODU scrambling.

[0131] The FLEXOM unit can complete the ODUC mapping to FLEXO.

[0132] The line-side processing subunit completes framing of downstream data (e.g., FLEXO). It then transmits the resulting digital electrical signal to the optical port digital signal processing unit. This subunit is also known as the FLEXF unit.

[0133] Next, the processing performed by the service processing unit on data in the uplink data transmission direction in scenario 1 is described with reference to FIG8-3.

[0134] The FLEXODF unit and the FLEXODM unit can perform at least one of FlexO overhead monitoring, demapping to ODUCn, ODUCn framing, and deskewing. For example, the FLEXODF unit can receive digital electrical signals from the optical port digital signal processing unit, deframe (or frame) the digital electrical signals, and obtain uplink data (e.g., FLEXO). The FLEXODM unit can demap FLEXO to ODUC.

[0135] The ODUCnDMP unit can perform line-side receive direction ODUCn processing on ODUC, including at least one of ODUC / 1-50 framing, LS descrambling, ODU descrambling, OA11 extraction, AIS detection and ODUCn alignment; and perform WTT receive processing on line high-order ODUCn, such as at least one of framing, descrambling, overhead extraction (output to OHP), maintenance signal insertion, TCMi clearing and test signal detection.

[0136] The LODUDMP unit can perform WTT reception processing on the low-order ODUCn, such as at least one of framing, descrambling, overhead extraction (output to OHP), maintenance signal insertion, TCMi clearing and test signal detection.

[0137] Optionally, the ODUCnDMP unit may also perform line demapping processing, for example, demapping ODUcn to ODUk / ODUflex. Correspondingly, the LODUDMP unit may perform WTT reception processing on the low-order ODUk / ODUflex.

[0138] The SWITCH unit can perform cross-processing on ODUk / flex and support loopback.

[0139] The ODU_TX unit can perform WTT transmission processing on the ODUk / ODUflex processed by the SWITCH unit, such as at least one of frame header insertion and tracking, overhead insertion, maintenance signal insertion, delay measurement and test signal insertion.

[0140] The OTN2SMDMP unit can support OTN to SM cell mapping processing.

[0141] The IBM unit can perform uplink buffer processing, such as supporting at least one of OTN data buffering, bandwidth supervision of scheduling, abnormal protection of service bandwidth, and time stamp processing.

[0142] The ingress shared memory (ISM) unit can perform cross-data unit framing processing and insert cells into the cross-data unit. This application does not limit the format of the cross-data unit. For example, the cross-data unit can be a data structure defined by the NGSF protocol, and the cross-data unit can include a 16-byte control cell and 192 bytes or 384 bytes of data. The ISM unit can support the insertion of control cells defined by the NGSF protocol, and supports functions such as adding a cyclic redundancy check (CRC) to the cell header and CRC8 error correction.

[0143] The PCS_TX unit may perform interface transmission direction processing on the data processed by the ISM unit, including at least one of byte / CRC reordering, 6466B encoding, scrambling, interface adaptation, and cross-talk.

[0144] The RSFEC_TX unit can perform RSFEC encoding on the data processed by the PCS_TX unit.

[0145] The PMA_TX unit may perform at least one of distribution scheduling, AM unlocking, bit reordering (MSB / LSB), bit width conversion, and clock domain isolation processing on the data encoded by the RSFEC_TX unit.

[0146] The SDSIF unit can perform SerDes input and output data processing on the data processed by the PMA_TX unit, including at least one of space division cross-linking, 1588 timestamp extraction, and clock domain conversion. The SDSIF unit can then send the obtained data to the SerDes.

[0147] When the optical module is used in scenario 2, the control unit can control the service processing unit to use the client-side processing subunit, the client-side mapping subunit, the line-side mapping subunit, and the line-side processing subunit to process data. For example, after receiving the electrical signal from the SerDes, the client-side processing subunit recovers the service data from the electrical signal. The client-side mapping subunit maps the service data into ODUk. The line-side mapping subunit maps and / or multiplexes the ODUk into FlexO. The line-side processing subunit frames the FlexO to obtain a digital electrical signal, and then sends the digital electrical signal to the optical port digital signal processing unit shown in Figure 5-1. The specific functions of the client-side processing subunit and the line-side processing subunit can be referred to the relevant description above and will not be repeated here. In scenario 2, the client side can be connected to switches / routers / third-party OTN equipment through standardized gray optical modules such as quad small form-factor pluggable (QSFP)28 / QSFP-DD. The client side supports access to Ethernet services such as 100GE / Flexible Ethernet (FlexE), 200GE / FlexE, 400GE / FlexE, 800GE, and future 1.6TE and 3.2TE. A hybrid of these services is also supported. It also supports OTU4 and client-side FlexO access, along with Ethernet (ETH) / FlexE high-precision 1588 features. The line side supports FlexO output and GMP / BMP mapping and / or demapping.

[0148] When the optical module is used in scenario 3, the control unit can control the service processing unit to use the client-side processing subunit and the line-side processing subunit to process data. For example, the line-side processing subunit interfaces with the optical digital signal processing unit. The client-side processing subunit receives the electrical signal sent by the framer chip via SerDes and recovers the FlexO from the electrical signal. The line-side processing subunit frames the FlexO to obtain a digital electrical signal, which it then sends to the optical digital signal processing unit shown in Figure 5-1. This is equivalent to the service processing unit transparently transmitting the FlexO. The specific functions of the client-side processing subunit and the line-side processing subunit can be found in the previous description and are not further elaborated here. In scenario 3, the client-side processing subunit interfaces with the framer chip shown in Figure 2, using a fiber optic interface connector (FOIC). The FOIC interface is designed to adapt to multi-channel parallel interfaces. For example, it can split the scrambled FlexO frame into four logical signals for transmission over four parallel physical links. The line-side processing subunit interfaces with the optical digital signal processing unit.

[0149] When the optical module is used in Scenario 4, the control unit can control the service processing unit to use the client-side processing subunit and the line-side processing subunit to process data. For example, after receiving the electrical signal from the SerDes, the client-side processing subunit recovers the FlexO-zr from the electrical signal. "zr" stands for "Ze best range," indicating a maximum distance of 80 km. The line-side processing subunit frames the FlexO-zr to obtain a digital electrical signal, which it then sends to the optical port digital signal processing unit shown in Figure 5-1. The specific functions of the client-side processing subunit and the line-side processing subunit can be found in the previous description and are not detailed here.

[0150] The functional module shown in Figure 5-1 may include more or fewer subunits than those shown in Figure 8-1. For example, in addition to the client-side processing subunit and the line-side processing subunit, functional module 3 shown in Figure 5-1 may also include a data regeneration subunit (see the dashed box in Figure 8-1). The data regeneration subunit is responsible for demapping and / or demultiplexing the FlexO obtained by the client-side processing subunit into ODUCn, and then mapping and / or multiplexing the ODUCn into FlexO. Optionally, the data regeneration subunit may also be responsible for performing overhead monitoring on the FlexO obtained by the client-side processing subunit and processing the ODUCn obtained by demapping and / or demultiplexing.

[0151] Figure 8-1 illustrates the implementation of the service processing unit. Functional modules 1 through 4 shown in Figure 5-1 can share data processing with the client-side processing subunit and the line-side processing subunit. Functional modules 1 and 2 also share the line-side mapping subunit. This means that, building on the DSP solution for the line-side optical module shown in Figure 6, by simply adding a line frame processing subunit, the line frame processing subunit and line-side mapping subunit can be integrated into the DSP. This allows the optical module to directly connect to the electrical cross-connect board and complete service transmission with the cross-connect board, eliminating the need for a separate framer on the circuit board. Because the circuitry used to implement the line frame processing subunit is much smaller than the framer, requiring less than 10% additional logic cells, adding the line frame processing subunit to the DSP chip significantly reduces the size of the DSP chip. This further reduces layout and heat dissipation space on the circuit board, increases the board's integration density, and ensures heat dissipation. By designing a single optical module to support multiple application scenarios, the line-side framer functionality can be integrated by simply adding 10% more logic gates, significantly reducing system power consumption and chip cost.

[0152] Figure 8-4 schematically illustrates another implementation of the line frame processing subunit. As shown in Figure 8-4, the line frame processing subunit includes an ISM unit, an IBM unit, a buffer management data mapper (BMDM) unit, a BPWTT unit, an ESM unit, and an EBM unit.

[0153] After the line frame processing subunit receives the downlink data from the client-side processing subunit, the ESM unit, EBM unit, BMDM unit and BPWTT unit can process the downlink data in sequence, wherein the processing of the downlink data by the ESM unit and the EBM unit can refer to the relevant introduction in the previous article. The ESM unit can complete the downlink processing of the data transmission protocol, and the EBM unit can complete the downlink (from the cross-board direction) cache, which is used to cache the ODU / SDH / OSU Cell and implement sorting cache, bandwidth supervision and three-level multicast processing. The BMDM unit can recover the ODU unit from the cross data unit, for example, it can include the OTN2SMDMP unit introduced above. The BPWTT unit can complete the overhead processing of the ODUk, for example, it can include at least one of the ODU_RX unit, SWITCH unit and LODU unit introduced above.

[0154] After the line frame processing subunit receives the uplink data from the line-side mapping subunit, the BPWTT unit, BMDM unit, IBM unit, and ISM unit can process the uplink data in sequence. Among them, the BPWTT unit can complete the overhead processing of ODUk, for example, it can include at least one of the LODUDMP unit, SWITCH unit, and ODU_TX unit introduced above. The BMDM unit can complete the slicing of ODU into cross-data units, for example, it can include the OTN2SMDMP unit introduced above. The processing of uplink data by the IBM unit and the ISM unit can refer to the relevant introduction above. The IBM unit can be used to complete the uplink (to the cross-board direction) cache, for caching ODU / SDH / OSU units (cells), etc., and the ISM unit can be used to complete the uplink processing of the data transmission protocol.

[0155] In the OTN equipment shown in Figure 3, the electrical port's uplink data transmission direction is from the optical module to the device to which the optical module is connected via the electrical port (such as a framer or electrical cross-connect board). The electrical port's downlink data transmission direction is from the device to which the optical module is connected via the electrical port (such as a framer or electrical cross-connect board) to the optical module. As mentioned earlier, the DSP's downlink data transmission direction refers to data transmission from the SerDes to the optical device, while the DSP's uplink data transmission direction refers to data transmission from the optical device to the SerDes. Uplink data refers to data transmitted in the uplink data transmission direction, and downlink data refers to data transmitted in the downlink data transmission direction.

[0156] For the specific functions and data processing procedures of the subunits and / or units described above, reference may be made to the relevant contents of the OTN interface standard G709 issued by the International Telecommunications Union-Telecommunication Standardization Sector (ITU-T).

[0157] The present application does not limit the error correction technology used by the service processing unit, and Reed-Solomon forward error correction (RSFEC) is used only as an example. The present application does not limit the type of cross-data unit received by the line frame processing sub-unit in the downlink data transmission direction, nor does it limit the type of cross-data unit sent by it in the uplink data transmission direction. The above text takes the cross-data unit as an example of the data structure defined by the NGSF protocol. The present application does not limit the type of service data received by the client-side mapping sub-unit in the downlink data transmission direction, nor does it limit the type of service data output in the uplink data transmission direction. The present application does not limit the type of OTN frame received by the line-side mapping sub-unit in the downlink data transmission direction, nor does it limit the type of OTN frame sent by it in the uplink data transmission direction. The above text takes the OTN frame as ODUk as an example. The present application does not limit the specific process or path of multiplexing and / or mapping of OTN frames performed by the line-side mapping subunit in the downlink data transmission direction, nor does it limit the specific process or path of demultiplexing and / or demapping of OTN frames performed by the line-side mapping subunit in the uplink data transmission direction. For example, the line-side mapping unit uses at least one of a generic mapping procedure (GMP), a bit-synchronous mapping procedure (BMP), and an asynchronous mapping procedure (AMP) to perform the above-mentioned process of OTN frames. The present application does not limit the type of OTN frame output by the line-side mapping subunit in the downlink data transmission direction, nor does it limit the type of OTN frame received by it in the uplink data transmission direction. The above article takes the OTN frame as FlexO format data as an example.

[0158] In different application scenarios, the service processing unit in the DSP generally involves different service processing methods, and different service processing methods generally need to be implemented in conjunction with different SerDes rates. Compared with integrating multiple SerDes with different rates in the DSP, the present application proposes integrating a rate-adjustable SerDes in the DSP, which is conducive to the SerDes in the DSP using different data transmission rates to transmit data in different application scenarios. Optionally, the control unit can control the SerDes to use the rate required by the application scenario to transmit data with the connected device. For example, in scenario 1, the control unit can control the SerDes to use rate 1 to transmit data with the electrical cross-board, in scenario 2, the control unit can control the SerDes to use rate 2 to transmit data with the service side optical module, in scenario 3, the control unit can control the SerDes to use rate 3 to transmit data with the framer on the circuit board, and in scenario 4, the control unit can control the SerDes to use rate 4 to transmit data with the forwarding device.

[0159] This application does not limit the data transmission rates of the SerDes required for different application scenarios to be different. For example, Rate 2 and Rate 3 can be the same. However, as mentioned above, the data transmission rate of SerDes1 shown in Figure 3 is generally higher than the data transmission rate of SerDesb shown in Figure 2. Therefore, Rate 1 is generally higher than Rate 3. This application may refer to Rate 1 as the high rate, and Rate 2 and Rate 3 as the low rates, respectively.

[0160] This application does not limit the implementation of the rate-adjustable SerDes. Figure 9 schematically illustrates a possible structure of a SerDes. As shown in Figure 9, the SerDes may include an M divider, a K divider, an N divider, a phase-frequency detector (PFD), a charge pump, a broadband voltage-controlled oscillator (VCO), and a SerDes core.

[0161] The M frequency divider is used to divide the input signal by M, and the frequency of the output signal is 1 / M of the input signal frequency. M is a positive integer. The N frequency divider is used to divide the carrier signal generated by the wideband VCO by N, where N is a positive integer. The PFD is used to compare the frequency and / or phase difference between the output signal of the M frequency divider and the output signal of the N frequency divider, and output an error signal, which can be a voltage indicating the magnitude of the difference. The charge pump is used to generate and output a control signal based on the error signal, where the voltage of the control signal is related to the voltage of the error signal. The wideband VCO is used to generate a carrier signal under the control of the control signal output by the charge pump. The carrier signal can be, for example, a sinusoidal signal, and the frequency of the carrier signal is related to the voltage of the control signal. The K frequency divider is used to divide the carrier signal output by the wideband VCO by K, where K is a positive integer. The carrier signal output by the K frequency divider can serve as a reference electrical signal (or clock electrical signal). The SerDes core is used to transmit a serial electrical signal based on the reference electrical signal and the data to be transmitted. The transmission rate of the serial electrical signal by the SerDes core is related to the frequency of the reference electrical signal. Therefore, the control unit can adjust the data transmission rate of the SerDes core by adjusting the size of at least one of M, N and K.

[0162] As described above, the control unit can control the business processing unit to use the functional modules corresponding to the application scenario to process data, and can also control the SerDes to use the rate required by the application scenario to transmit data. In addition, as described above, the optical module provided in this application can be installed on various types of motherboards. For example, in scenarios 1 and 3, the gold fingers of the optical module can be installed in the slots on the circuit board, in scenario 2, the gold fingers of the optical module can be installed in the slots on the branch line integration board, and in scenario 3, the gold fingers of the optical module can be installed in the slots on the optical interface PCB. As shown in Figure 5-1, the control unit can connect one or more pins in the gold fingers. For ease of distinction, this application refers to these one or more pins as configuration pins. After the optical module is connected to the mainboard through the gold fingers, the control unit can receive the configuration signal fed back by the mainboard through the configuration pins. The configuration signal fed back by the mainboard to the control unit through the configuration pins in different scenarios can be different. The configuration signal is used to instruct the control unit to control the functional modules used by the business processing unit, and can also instruct the control unit to control the data transmission rate used by the SerDes.

[0163] For example, when the optical module shown in Figure 5-1 is mounted on the circuit board shown in Figure 3 using a gold finger, the circuit board can send back configuration signal 1 to the control unit via the configuration pins in the gold finger. Based on configuration signal 1, the control unit can control the service processing unit to process data using function module 1 and can also control the SerDes to transmit data at rate 1. When the optical module shown in Figure 5-1 is mounted on the tributary-line-in-one board shown in Figure 6 using a gold finger, the tributary-line-in-one board can send back configuration signal 2 to the control unit via the configuration pins in the gold finger. Based on configuration signal 2, the control unit can control the service processing unit to process data using function module 2 and can also control the SerDes to transmit data at rate 2. When the optical module shown in Figure 5-1 is mounted on the circuit board shown in Figure 2 using a gold finger, the circuit board can send back configuration signal 3 to the control unit via the configuration pins in the gold finger. Based on configuration signal 3, the control unit can control the service processing unit to process data using function module 3 and can also control the SerDes to transmit data at rate 3. When the optical module shown in Figure 5-1 is mounted on the optical interface PCB shown in Figure 7 through the gold finger, the optical interface PCB can feed back configuration signal 4 to the control unit through the configuration pins in the gold finger. The control unit can control the service processing unit to use functional module 4 to process data according to configuration signal 4, and can also control the SerDes to use rate 4 to transmit data.

[0164] As shown in Figure 5-1, a module central processing unit (CPU) can also be provided in the optical module. The CPU is connected to one or more pins (called control pins) in the control unit and the gold finger, respectively. The CPU can communicate with the mainboard through the control pins and configure the DSP. For example, after the optical module is connected to the mainboard through the gold finger, the CPU can receive configuration information sent back by the mainboard through the control pins, and then send a configuration signal to the control unit based on the configuration information. The configuration signal is used to instruct the control unit to control the functional modules used by the service processing unit, and can also instruct the control unit to control the data transmission rate used by the SerDes. In different scenarios, the configuration information fed back by the mainboard to the CPU through the control pins can be different. Accordingly, the CPU can send different configuration signals to the control unit based on different configuration information.

[0165] For example, when the optical module shown in Figure 5-1 is mounted on the circuit board shown in Figure 3 via a gold finger, the circuit board can send configuration information 1 to the module's CPU via the control pins in the gold finger. The CPU then sends configuration signal 1 to the control unit based on configuration information 1. When the optical module shown in Figure 5-1 is mounted on the branch-line-in-one board shown in Figure 6 via a gold finger, the branch-line-in-one board can send configuration information 2 to the module's CPU via the control pins in the gold finger. The CPU then sends configuration signal 2 to the control unit based on configuration information 2. When the optical module shown in Figure 5-1 is mounted on the circuit board shown in Figure 2 via a gold finger, the circuit board can send configuration information 3 to the module's CPU via the control pins in the gold finger. The CPU then sends configuration signal 3 to the control unit based on configuration information 1. When the optical module shown in Figure 5-1 is mounted on the optical interface PCB shown in Figure 7 via a gold finger, the optical interface PCB can send configuration information 4 to the module's CPU via the control pins in the gold finger. The CPU then sends configuration signal 4 to the control unit based on configuration information 1. The functions of configuration signals 1 through 4 can be understood by referring to the relevant content described above. The logic levels of configuration signals 1 to 4 may be referred to in Table 1.

[0166] Table 1

[0167] The module's central processing unit can communicate with the mainboard by executing code stored in memory and sending control signals to the control unit based on configuration information received from the mainboard, thereby configuring the DSP. Therefore, this method of controlling the DSP can also be called software control. The control unit directly receives configuration signals fed back from the mainboard through the configuration pins in the gold finger to configure the DSP. This method of controlling the DSP can also be called hardware pin control.

[0168] In scenario 2, when the service-side optical module to which the optical module provided by the present application is connected is an LPO, the Serdes design of the optical module provided by the present application can be configured through registers to perform equalization and / or pre-emphasis adaptive adaptation when communicating with the Serdes of the connected LPO, thereby optimizing the transmission capacity when connected to the LPO optical module to the greatest extent. For example, the Serdes of the DSP enables the equalizer and / or pre-emphasis device to perform pre-emphasis processing on the electrical signal sent to the LPO and equalization processing on the electrical signal received from the LPO. Equalization is proposed with the goal of overcoming time dispersion, and there are generally two basic approaches, namely frequency domain equalization and time domain equalization. Pre-emphasis is a signal processing technology that is mainly used to improve the signal-to-noise ratio of electrical signals. It compensates for the high-frequency components of the input signal at the transmitting end to reduce the attenuation of the high-frequency signal during transmission due to line and equipment limitations.

[0169] In the foregoing, the optical module provided by the present application is used to be arranged in an OTN device as an example. Optionally, the optical module provided by the present application can also be used to be arranged in a wavelength division multiplexing (WDM) device.

[0170] The line board, branch board, branch line integrated board and electrical cross board mentioned in this application can be replaced by line units, branch units, branch line integrated units and electrical cross units (or cross units) respectively.

[0171] The following describes, with reference to Figure 10, a data transmission method in Scenario 1. Scenario 1 can be an application scenario such as long-haul OTN or metropolitan OTN. As shown in Figure 10, Scenario 1 includes OTN devices s1 and r1. OTN devices s1 and r1 can transmit service data using OTN frames. The optical module provided in this application can be installed on a circuit board as a core component. The method may include S1001 to S1009.

[0172] S1001, the gray optical module s1 receives the optical signal carrying service data;

[0173] Gray optical module s1 can receive optical signals carrying service data. This application does not limit the type of service data. As previously described, the service data can include at least one of Synchronous Digital Hierarchy (SDH) data, Synchronous Transfer Module (STM)-N data, Ethernet data, Asynchronous Transfer Mode (ATM) data, and Internet Protocol (IP) data.

[0174] S1002, the gray optical module s1 converts the optical signal into an electrical signal carrying the service data, and sends the electrical signal to the framer s1;

[0175] After receiving the optical signal, the gray optical module s1 may perform photoelectric conversion on the optical signal to obtain an electrical signal, and send the service data to the framer s1 via the electrical signal.

[0176] S1003: Framer S1 receives the electrical signal, maps the service data carried by the electrical signal to obtain an optical data unit, and sends the optical data unit to the electrical cross-connect board S1.

[0177] The framer S1 can receive an electrical signal, frame the electrical signal to obtain the service data, map the service data into an optical data unit, and then send the optical data unit to the electrical cross-connect board S1.

[0178] Optionally, the gray optical module S1 in the tributary board S1 can be replaced with an electrical interface, and the framer S1 can receive the electrical signal carrying the service data through the electrical interface. Accordingly, the method may not include S1001 and S1002.

[0179] S1004: The electrical cross-connect board s1 performs cross-connect scheduling on the optical data units, encapsulates the optical data units into cross-connect data units, and sends the cross-connect data units to the coherent optical module s1.

[0180] After receiving the optical data unit, the electrical cross-connect board s1 can perform cross-connect scheduling on it. Assuming that the output port selected by the electrical cross-connect board s1 for the optical data unit is directly connected to the coherent optical module s1 on the circuit board s1, the electrical cross-connect board s1 can encapsulate the optical data unit into a cross-connect data unit and then send the cross-connect data unit to the coherent optical module s1.

[0181] S1005. The coherent optical module s1 decapsulates the cross data unit to obtain an optical data unit, maps and / or multiplexes the decapsulated optical data unit into an optical transmission unit, and transmits an optical signal carrying the optical transmission unit through an optical connector.

[0182] The coherent optical module s1 can receive the electrical signal carrying the cross data unit through its own electrical connector. The coherent optical module s1 can receive the cross data unit, decapsulate the cross data unit to obtain the optical data unit, map and / or multiplex the decapsulated optical data unit into an optical transmission unit, and then frame the optical transmission unit to obtain the electrical signal. This process can be understood with reference to the relevant content of the functional module 1 introduced above. For example, the process of the optical module receiving the cross data unit can be understood with reference to the relevant description of the client-side processing subunit or the client-side processing subunit and SerDes above, the process of the optical module decapsulating the cross data unit to obtain the optical data unit can be understood with reference to the relevant description of the line frame processing subunit above, the process of the optical module mapping and / or multiplexing the decapsulated optical data unit into the optical transmission unit can be understood with reference to the relevant description of the line-side mapping subunit above, and the process of the optical module framing the optical transmission unit to obtain the electrical signal can be understood with reference to the relevant description of the line-side processing subunit above.

[0183] Afterwards, the coherent optical module s1 processes the obtained electrical signal. This process can be understood by referring to the above description of the optical port digital signal processing unit and / or DAC.

[0184] Afterwards, the coherent optical module s1 can perform electrical-to-optical conversion on the processed electrical signal to obtain an optical signal, and transmit the optical signal through the optical connector. This process can be understood by referring to the previous description of the optical transmitter.

[0185] S1006. The coherent optical module r1 converts the optical signal into an electrical signal, demaps and / or demultiplexes the optical transmission unit carried by the electrical signal into an optical data unit, encapsulates the optical data unit into a cross data unit, and sends the cross data unit to the electrical cross-connect board r1.

[0186] The coherent optical module r1 receives optical signals through its own optical connector and converts them into electrical signals. This process can be understood by referring to the previous description of the optical receiver.

[0187] The coherent optical module r1 can process the electrical signal. This process can be understood by referring to the above-mentioned coherent content of the ADC and / or the optical port digital signal processing unit.

[0188] Afterwards, the coherent optical module r1 can frame the processed electrical signal to obtain an optical transmission unit, demap and / or demultiplex the optical transmission unit to obtain an optical data unit, encapsulate the obtained optical data unit to obtain a data frame, and send the obtained data frame through the electrical connector. This process can be understood with reference to the relevant description of the functional module 1 in the previous text. The coherent optical module r1 frames the processed electrical signal to obtain an optical transmission unit, which can be understood with reference to the relevant description of the line-side processing subunit in the previous text. The process of the coherent optical module r1 demapping and / or demultiplexing the optical transmission unit to obtain an optical data unit can be understood with reference to the relevant description of the line-side mapping subunit in the previous text. The coherent optical module r1 encapsulates the obtained optical data unit to obtain an electrical cross-connect unit, which can be understood with reference to the relevant description of the line frame processing subunit in the previous text. The data frame sent by the coherent optical module r1 through the electrical connector can be understood with reference to the relevant description of the client-side processing subunit or the client-side processing subunit and SerDes in the previous text.

[0189] S1007: The electrical cross-connect board r1 decapsulates the cross-connect data unit to obtain an optical data unit, performs cross-connect scheduling on the optical data unit, and sends the optical data unit to the framer r1.

[0190] After receiving the cross-connect data unit, the electrical cross-connect board r1 can decapsulate the cross-connect data unit to obtain an optical data unit and perform cross-connect scheduling on the optical data unit. Assuming that the output port selected by the electrical cross-connect board r1 for the optical data unit is connected to the framer r1 on the tributary board r1, the electrical cross-connect board r1 can send the optical data unit to the framer r1.

[0191] S1008. Framer r1 demaps the optical data unit to obtain service data, frames the service data to obtain an electrical signal, and sends the electrical signal to gray optical module r1.

[0192] After receiving the optical data unit, the framer r1 may demap the optical data unit to obtain service data, frame the service data to obtain an electrical signal, and send the electrical signal to the gray optical module r1.

[0193] S1009 , the gray optical module r1 converts the electrical signal into an optical signal carrying service data, and sends the optical signal.

[0194] Optionally, the gray optical module r1 in the tributary board r1 may be replaced with an electrical interface, and the framer r1 may send an electrical signal carrying service data through the electrical interface. Accordingly, the method may not include S1009.

[0195] As previously mentioned, the OTN device shown in Figure 10 may not include a tributary board. For example, a network device serving as a core node may not have a tributary board. As previously mentioned, an OTN device may integrate more tributary boards and / or more circuit boards and / or more electrical cross-connect boards, and more optical modules may be integrated on the circuit boards. For example, the OTN device may be as shown in Figure 3. The optical fiber link between coherent optical module s1 and coherent optical module r1 may include not only optical fibers but also other optical transmission components, such as an optical cross-connect unit. Figure 10 uses the example of OTN device s1 transmitting an optical transmission unit to OTN device r1. Optionally, OTN device r1 may also transmit an optical transmission unit to OTN device s1. OTN device s1 and OTN device r1 may be any two OTN devices shown in Figure 1.

[0196] The following example, combined with Figure 11, describes the data transmission method in Scenario 2. As shown in Figure 11, Scenario 2 includes a branch line unification board s2 and a branch line unification board r2, which can transmit service data using OTN frames. Scenario 2 can be used in applications such as metropolitan DWDM, DC, or DCI. The coherent module serves as the core component of the branch line unification unit, and its external service interface is a gray optical module or LPO module. The method may include S1101 to S1105.

[0197] S1101, the gray optical module s2 receives the optical signal carrying service data;

[0198] Step S1101 can be understood with reference to step S1001 and will not be described again here.

[0199] S1102, the gray optical module s2 converts the electrical signal into an electrical signal carrying the service data, and sends the electrical signal to the coherent optical module s2;

[0200] After receiving the optical signal, the gray optical module s2 may perform photoelectric conversion on the optical signal to obtain an electrical signal, and send the service data to the coherent optical module s2 via the electrical signal.

[0201] Optionally, the gray optical module s2 in the branch line integration board s2 can be replaced with an electrical interface, and the coherent optical module s2 can receive the electrical signal carrying the service data through the electrical interface. Accordingly, the method may not include S1101 and S1102.

[0202] S1103. The coherent optical module s2 maps the data frame into optical data units, maps and / or multiplexes the mapped optical data units into optical transmission units, and transmits an optical signal carrying the optical transmission units through an optical connector.

[0203] The coherent optical module s2 can receive the electrical signal carrying the service data through its own electrical connector. The coherent optical module s2 can receive service data, map the service data into optical data units, map and / or multiplex the mapped optical data units into optical transmission units, and frame the obtained optical transmission units to obtain electrical signals. This process can be understood with reference to the relevant content of the functional module 2 introduced above. For example, the process of the optical module receiving service data can be understood with reference to the relevant description of the client-side processing subunit or the client-side processing subunit and SerDes introduced above, the process of the optical module mapping the service data into optical data units can be understood with reference to the relevant description of the client-side mapping subunit introduced above, the process of the optical module mapping and / or multiplexing the mapped optical data units into optical transmission units can be understood with reference to the relevant content of the line-side mapping subunit introduced above, and the process of the optical module framing the obtained optical transmission units to obtain electrical signals can be understood with reference to the relevant content of the line-side processing subunit introduced above.

[0204] After the coherent optical module receives the electrical signal, it can process the electrical signal. This process can be understood by referring to the previous description of the optical port digital signal processing unit and / or DAC.

[0205] Afterwards, the coherent optical module s2 can perform electrical-to-optical conversion on the processed electrical signal to obtain an optical signal, and transmit the optical signal through the optical connector. This process can be understood by referring to the description of the optical transmitter above.

[0206] S1104: The coherent optical module r2 converts the optical signal into an electrical signal, demaps and / or demultiplexes the optical transmission unit carried by the electrical signal to obtain an optical data unit, demaps the obtained optical data unit into service data, and sends the electrical signal carrying the service data to the gray optical module r2.

[0207] The coherent optical module r2 can receive optical signals through its own optical connector and convert them into electrical signals. This process can be understood by referring to the previous description of the optical receiver.

[0208] The coherent optical module r2 can process the electrical signal. This process can be understood by referring to the coherent content of the ADC and / or optical port digital signal processing unit mentioned above.

[0209] Afterwards, the coherent optical module r2 can frame the processed electrical signal to obtain an optical transmission unit, demap and / or demultiplex the optical transmission unit to obtain an optical data unit, demap the obtained optical data unit into service data, and send the obtained service data through the electrical connector. This process can be understood with reference to the relevant description of functional module 2 in the previous text. The process of the coherent optical module r2 framing the processed electrical signal to obtain an optical transmission unit can be understood with reference to the relevant description of the line-side processing subunit in the previous text. The process of the coherent optical module r2 demapping and / or demultiplexing the optical transmission unit to obtain an optical data unit can be understood with reference to the relevant description of the line-side mapping subunit in the previous text. The process of the coherent optical module r2 encapsulating the obtained optical data unit to obtain service data can be understood with reference to the relevant description of the client-side mapping subunit in the previous text. The process of the coherent optical module r2 sending the obtained service data through the electrical connector can be understood with reference to the relevant description of the client-side processing subunit or the client-side processing subunit and SerDes in the previous text.

[0210] S1105 , the gray optical module r2 converts the electrical signal into an optical signal carrying service data, and sends the optical signal.

[0211] After receiving the electrical signal, the gray optical module r2 may perform electrical-optical conversion on the electrical signal to obtain an optical signal carrying service data, and then transmit the optical signal.

[0212] Optionally, the gray optical module r2 in the branch line integration board r2 can be replaced with an electrical interface, and the coherent optical module can send an electrical signal carrying service data through the electrical interface. Accordingly, the method may not include S1105.

[0213] As previously mentioned, the tributary line-in-one board can be integrated with other tributary line-in-one boards in the same OTN device. For example, the OTN device can be as shown in Figure 6, and more optical modules can be integrated on the tributary line-in-one board. Figure 11 uses the example of tributary line-in-one board S2 transmitting an optical transmission unit to tributary line-in-one board R2. Optionally, tributary line-in-one board R2 can also transmit an optical transmission unit to tributary line-in-one board S2. The tributary line-in-one board S2 and the tributary line-in-one board R2 can be integrated into any two different OTN devices shown in Figure 1.

[0214] 12 , an example is given below to describe a data transmission method in scenario 3. As shown in FIG12 , the method may include S1201 to S1211.

[0215] S1201, the gray optical module s3 receives the optical signal carrying service data;

[0216] S1202, the gray light module s3 converts the electrical signal into an electrical signal carrying the service data, and sends the electrical signal to the framer s3;

[0217] S1203: Framer s3 frames the electrical signal to obtain service data, maps the service data to obtain an optical data unit, and sends the optical data unit to the electrical cross-connect board s3.

[0218] S1204: The electrical cross-connect board s3 performs cross-connect scheduling on the optical data units, encapsulates the optical data units into cross-connect data units, and sends the cross-connect data units to the framer s3.

[0219] S1201 to S1204 can be understood by referring to the relevant contents of S1001 to S1004 introduced above, and will not be repeated here.

[0220] S1205. Framer s3 decapsulates the cross data unit to obtain an optical data unit, maps and / or multiplexes the decapsulated optical data unit into an optical transmission unit, and sends an electrical signal carrying the optical transmission unit to coherent optical module s3.

[0221] Framer S3 functions not only as a tributary-side framer but also as a line-side framer. After receiving an electrical signal, Framer S3 extracts cross-link data units from the electrical signal, decapsulates the cross-link data units to obtain optical data units, maps and / or multiplexes the decapsulated optical data units into optical transmission units, frames the resulting optical transmission units into electrical signals, and transmits the electrical signals to coherent optical module S3.

[0222] S1206: The coherent optical module s3 processes the electrical signal, converts the processed electrical signal into an optical signal, and transmits the optical signal through the optical connector.

[0223] The coherent optical module s3 can receive the electrical signal carrying the optical transmission unit through its own electrical connector. The coherent optical module s3 can receive the optical transmission unit and frame the optical transmission unit to obtain the electrical signal. This process can be understood by referring to the relevant content of the functional module 3 introduced above. For example, the process of the optical module receiving the cross-data unit can be understood by referring to the relevant description of the client-side processing subunit or the client-side processing subunit and SerDes above. The process of the optical module framing the optical transmission unit to obtain the electrical signal can be understood by referring to the relevant description of the line-side processing subunit above.

[0224] Afterwards, the coherent optical module s3 processes the obtained electrical signal. This process can be understood by referring to the above description of the optical port digital signal processing unit and / or DAC.

[0225] Afterwards, the coherent optical module s3 can perform electrical-to-optical conversion on the processed electrical signal to obtain an optical signal, and transmit the optical signal through the optical connector. This process can be understood by referring to the previous description of the optical transmitter.

[0226] S1207, the coherent optical module r3 converts the optical signal into an electrical signal, processes the electrical signal, and then sends it to the framer r3;

[0227] The coherent optical module r3 can receive optical signals through its own optical connector and convert them into electrical signals. This process can be understood by referring to the previous description of the optical receiver.

[0228] The coherent optical module r3 can process the electrical signal. This process can be understood by referring to the coherent content of the ADC and / or optical port digital signal processing unit mentioned above.

[0229] Afterwards, the coherent optical module r3 can frame the processed electrical signal to obtain an optical transmission unit, and transmit the obtained optical transmission unit via the electrical connector. This process can be understood by referring to the previous description of functional module 3. The coherent optical module r3 frames the processed electrical signal to obtain an optical transmission unit, which can be understood by referring to the previous description of the line-side processing subunit. The coherent optical module r3 transmits the obtained optical transmission unit via the electrical connector, which can be understood by referring to the previous description of the client-side processing subunit or the client-side processing subunit and SerDes.

[0230] S1208. Framer r3 demaps and / or demultiplexes the optical transmission units carried by the electrical signals into optical data units, encapsulates the optical data units into cross-connect data units, and sends the cross-connect data units to electrical cross-connect board r3.

[0231] After receiving the electrical signal, the framer r3 can frame the electrical signal to obtain an optical transmission unit, demap and / or demultiplex the optical transmission unit to obtain an optical data unit, encapsulate the obtained optical data unit to obtain a cross data unit, and send the obtained cross data unit through the electrical connector.

[0232] S1209: The electrical cross-connect board r3 decapsulates the cross-connect data unit to obtain an optical data unit, performs cross-connect scheduling on the optical data unit, and sends the optical data unit to the framer r3.

[0233] S1210: Framer r3 demaps the optical data unit to obtain service data, frames the service data to obtain an electrical signal, and sends the electrical signal to gray optical module r3.

[0234] S1211 . The gray optical module r3 converts the electrical signal into an optical signal carrying service data, and sends the optical signal.

[0235] Steps S1209 to S1211 may be understood by referring to the relevant contents of S1007 to S1009 introduced above.

[0236] The coherent optical module s and the coherent optical module r shown in Figures 10 to 12 can be replaced with other types of optical modules, that is, the present application does not limit the optical module s and the optical module r to be used to send coherent light. The coherent optical module s and the coherent optical module r can be understood with reference to the optical modules shown in Figure 4-1 or Figure 5-1. The electrical connectors of the coherent optical module s and the coherent optical module can be understood with reference to the gold fingers shown in Figure 5-1. The present application does not limit the type of electrical connector. In addition to light, the optical fiber link between the coherent optical module s and the coherent optical module r can also include other optical transmission components, for example, an optical cross unit.

[0237] The coherent optical module s2 shown in Figure 11 and / or the coherent optical module s3 shown in Figure 12 can be the same optical module as the coherent optical module s1 shown in Figure 10 . For example, the coherent optical module s1 shown in Figure 10 , the coherent optical module s2 shown in Figure 11 , and the coherent optical module s3 shown in Figure 12 are the same optical module s. As described in Figure 5-1 , the optical module s can optionally include a serializer / deserializer (SerDes). In scenario 1 shown in Figure 10 , the SerDes can receive cross-link data units at rate 1. In scenario 2 shown in Figure 11 , the SerDes can receive service data at rate 2. In scenario 3 shown in Figure 12 , the SerDes can receive optical transmission units at rate 3. Rates 1 to 3 can be as shown in Table 1. Rate 1 can be greater than rate 2 and / or rate 3, and rate 2 and rate 3 can be the same or different.

[0238] The coherent optical module r2 shown in Figure 11 and / or the coherent optical module r3 shown in Figure 12 can be the same optical module as the coherent optical module r1 shown in Figure 10. For example, the coherent optical module r1 shown in Figure 10, the coherent optical module r2 shown in Figure 11, and the coherent optical module r3 shown in Figure 12 are the same optical module r. As described in Figure 5-1, the optical module r can optionally include a serializer / deserializer (SerDes). In scenario 1 shown in Figure 10, the SerDes can receive cross-link data units at rate 1. In scenario 2 shown in Figure 11, the SerDes can receive service data at rate 2. In scenario 3 shown in Figure 12, the SerDes can receive optical transmission units at rate 3. Rates 1 to 3 can be as shown in Table 1. Rate 1 can be greater than rate 2 and / or rate 3, and rate 2 and rate 3 can be the same or different.

[0239] The following describes how optical module r and / or optical module s determine their own application scenarios. As previously described, the optical module can receive a configuration signal. When the configuration signal is configuration signal 1 (e.g., the logic level is "00"), the optical module can determine that it is applied to scenario 1, i.e., it is installed on a circuit board and its own electrical connector is directly connected to the electrical cross-connect board. During the execution of S1005, the functional module 1 shown in FIG5-1 is enabled. When the configuration signal is configuration signal 2 (e.g., the logic level is "01"), the optical module can determine that it is applied to scenario 2, i.e., it is installed on a branch line integration board. During the execution of S1003, the functional module 2 shown in FIG5-1 is enabled. When the configuration signal is configuration signal 3 (e.g., the logic level is "10"), the optical module can determine that it is applied to scenario 3, i.e., it is installed on a circuit board and its own electrical connector is directly connected to the framer on the circuit board. During the execution of S1206, the functional module 3 shown in FIG5-1 is enabled.

[0240] As described above, optionally, as shown in FIG5-1, the optical module may further include a controller such as a module central processing unit, which is used to send the configuration signal to the DSP; and / or the DSP is directly connected to the configuration pin of the electrical connector, and the configuration pin is used to receive the configuration signal.

[0241] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method examples, and will not be repeated here. The "A and / or B" involved in the examples of this application can be understood to include the two schemes of "A and B" and "A or B". The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable where appropriate, and this is merely a way of distinguishing the objects of the same attributes when describing them in the examples of this application.

[0242] In the several examples provided in this application, it should be understood that the disclosed modules, devices, or equipment can be implemented in other ways. For example, the device examples described above are only schematic, and the division of the above-mentioned units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0243] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the protection scope of the technical solutions of the various embodiments of the present invention.

Claims

1. An optical module, characterized in that: Including optical connectors, optical devices, digital signal processors DSP and electrical connectors; The DSP is configured to receive data frames through the electrical connector, and when the optical module is mounted on a circuit board and the electrical connector is directly connected to an electrical cross-connect board, decapsulate the data frames to obtain optical data units, map and / or multiplex the decapsulated optical data units into optical transmission units, and frame the obtained optical transmission units to obtain electrical signals; The DSP is also used to process the obtained electrical signal; The optical device is used to convert the processed electrical signal into an optical signal and send the optical signal through the optical connector.

2. The optical module according to claim 1, wherein The DSP is configured to, when the optical module is mounted on a branch line-in-one board, map the data frame into an optical data unit, map and / or multiplex the mapped optical data unit into an optical transmission unit, and frame the obtained optical transmission unit to obtain an electrical signal; and / or, The DSP is used to frame the data frame to obtain an electrical signal when the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board, wherein the framer is used to decapsulate the cross-data unit sent by the electrical cross-board to obtain an optical data unit, map and / or multiplex the obtained optical data unit into an optical transmission unit, and send the obtained optical transmission unit to the electrical connector.

3. The optical module according to claim 2, wherein: The DSP is integrated with a serializer / deserializer SerDes; The SerDes is used to receive the data frame using a first data transmission rate when the optical module is installed on the circuit board and the electrical connector is directly connected to the electrical cross-connect board; The SerDes is configured to receive the data frame using a second data transmission rate when the optical module is mounted on a branch line-in-one board, and / or when the optical module is mounted on a circuit board and the electrical connector is directly connected to a framer on the circuit board; The first data transmission rate is greater than the second data transmission rate.

4. The optical module according to claim 3, wherein: The SerDes is used to receive the data frame using an equalizer when the optical module is installed on the branch line integration board and the electrical connector is directly connected to the linear drive pluggable optical module LPO.

5. The optical module according to any one of claims 2 to 4, characterized in that: The DSP is further configured to receive a configuration signal; When the configuration signal is at a first logic level, the DSP determines that the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical crossbar; When the configuration signal is at a second logic level, the DSP determines that the optical module is installed on a branch line integration board, and / or that the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board.

6. The optical module according to claim 5, characterized in that The optical module further includes a controller, and the controller is configured to send the configuration signal to the DSP; and / or, The DSP is directly connected to the configuration pin of the electrical connector, and the configuration pin is used to receive the configuration signal.

7. The optical module according to any one of claims 1 to 6, characterized in that: The DSP is used to perform equalization processing and / or digital-to-analog conversion on the obtained electrical signal.

8. An optical module, characterized in that: Including optical connectors, optical devices, digital signal processors DSP and electrical connectors; The optical device is used to receive an optical signal through the optical connector and convert the optical signal into an electrical signal; The DSP is used to process the electrical signal; The DSP is also used to frame the electrical signal to obtain an optical transmission unit. When the optical module is installed on the circuit board and the electrical connector is directly connected to the electrical cross-board, the optical transmission unit is demapped and / or demultiplexed to obtain an optical data unit, the obtained optical data unit is encapsulated to obtain a data frame, and the obtained data frame is sent through the electrical connector.

9. The optical module according to claim 8, wherein: The DSP is further configured to, when the optical module is mounted on the branch line-in-one board, demap and / or demultiplex the optical transmission unit to obtain an optical data unit, demap the obtained optical data unit into a data frame, and transmit the obtained data frame through the electrical connector; and / or, The DSP is also used to send the optical transmission unit through the electrical connector when the optical module is installed on the circuit board and the electrical connector is directly connected to the framer on the circuit board, wherein the framer is used to demap and / or demultiplex the optical transmission unit into optical data units, encapsulate the obtained optical data units into cross data units, and send the cross data units to the electrical cross board.

10. The optical module according to claim 9, wherein: The DSP is integrated with a serializer / deserializer SerDes; The SerDes is used to send the obtained data frame using a first data transmission rate when the optical module is installed on the circuit board and the electrical connector is directly connected to the electrical cross-connect board; The SerDes is configured to transmit the obtained data frame using the second data transmission rate when the electrical connector is mounted on a branch line integration board and / or when the electrical connector is mounted on a circuit board and directly connected to a framer on the circuit board; The first data transmission rate is greater than the second data transmission rate.

11. The optical module according to claim 10, wherein: The SerDes is used to send the obtained data frame using the pre-emphasis device when the optical module is installed on the branch line integration board and the electrical connector is directly connected to the linear drive pluggable optical module LPO.

12. The optical module according to any one of claims 9 to 11, characterized in that: The DSP is further configured to receive a configuration signal; When the configuration signal is at a first logic level, the DSP determines that the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical crossbar; When the configuration signal is at a second logic level, the DSP determines that the optical module is installed on a branch line integration board, and / or that the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board.

13. The optical module according to claim 12, wherein: The optical module further includes a controller, and the controller is configured to send the configuration signal to the DSP; and / or, The DSP is directly connected to the configuration pin of the electrical connector, and the configuration pin is used to receive the configuration signal.

14. The optical module according to any one of claims 8 to 13, characterized in that: The DSP is used to perform equalization processing and / or analog-to-digital conversion on the electrical signal.

15. The optical module according to any one of claims 1 to 14, characterized in that: The optical signal is a coherent optical signal.

16. A communication device, characterized in that: The communication device includes a mainboard and one or more optical modules mounted on the mainboard, wherein the one or more optical modules are as claimed in any one of claims 1 to 15.

17. The communication device according to claim 16, wherein: The main board is a circuit board, and the communication device further includes an electrical cross-board, and the one or more optical modules are directly connected to the electrical cross-board respectively.

18. A communication system, characterized in that: The communication system includes a plurality of communication devices and an optical transmission network, wherein the optical transmission network is used to transmit optical signals between different communication devices among the plurality of communication devices, and the plurality of communication devices include at least one communication device according to claim 16 or 17.

19. A data transmission method, characterized in that: The method is applied to an optical module, and the method includes: receiving a data frame via the electrical connector of the optical module; When the optical module is mounted on a circuit board and the electrical connector is directly connected to an electrical cross-connect board, the data frame is decapsulated to obtain an optical data unit, the decapsulated optical data unit is mapped and / or multiplexed into an optical transmission unit, and the obtained optical transmission unit is framed to obtain an electrical signal; The obtained electrical signal is processed, and the processed electrical signal is used to be converted into an optical signal, and the optical signal is used to be emitted through the optical connector of the optical module.

20. The method according to claim 19, characterized in that The method further comprises: When the optical module is installed on the branch line integration board, the data frame is mapped into an optical data unit, and the mapped optical data unit is mapped into an optical data unit. Mapping and / or multiplexing into optical transmission units, framing the obtained optical transmission units to obtain electrical signals; and / or, When the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board, the data frame is framed to obtain an electrical signal, wherein the framer is used to decapsulate the cross-data unit sent by the electrical cross-board to obtain an optical data unit, map and / or multiplex the obtained optical data unit into an optical transmission unit, and send the obtained optical transmission unit to the electrical connector.

21. The method according to claim 20, characterized in that The optical module has a serializer / deserializer (SerDes), and receiving a data frame through an electrical connector of the optical module includes: When the optical module is installed on the circuit board and the optical module is directly connected to the electrical cross-connect board, controlling the SerDes to use a first data transmission rate to receive the data frame; When the optical module is installed on a branch line integration board, and / or the optical module is installed on a circuit board and the optical module is directly connected to a framer on the circuit board, controlling the SerDes to use a second data transmission rate to receive the data frame; The first data transmission rate is greater than the second data transmission rate.

22. The method according to claim 21, characterized in that The receiving of the data frame through the electrical connector of the optical module includes: When the optical module is installed on the branch line integration board and the electrical connector is directly connected to the linear drive pluggable optical module LPO, the SerDes is controlled to use an equalizer to receive the data frame.

23. The method according to claims 20-22, characterized in that The method further comprises: receiving a configuration signal; When the configuration signal is at a first logic level, it is determined that the optical module is installed on a circuit board and the optical module is directly connected to an electrical cross-connect board; When the configuration signal is at a second logic level, it is determined that the optical module is installed on a branch line integration board, and / or the optical module is installed on a circuit board and is directly connected to a framer on the circuit board.

24. The method according to any one of claims 19 to 23, wherein: The processing of the obtained electrical signal includes: The obtained electrical signal is subjected to equalization processing and / or digital-to-analog conversion.

25. A data transmission method, characterized in that: The method is applied to an optical module, and the method includes: Processing an electrical signal, wherein the electrical signal is obtained by photoelectric conversion of an optical signal, wherein the optical signal is received through an optical connector of the optical module; framing the electrical signal to obtain an optical transmission unit; When the optical module is installed on a circuit board and the electrical connector of the optical module is directly connected to an electrical cross-board, the optical transmission unit is demapped and / or demultiplexed to obtain an optical data unit, the obtained optical data unit is encapsulated to obtain a data frame, and the obtained data frame is sent through the electrical connector.

26. The method according to claim 25, characterized in that The method further comprises: When the optical module is mounted on the branch line-in-one board, demapping and / or demultiplexing the optical transmission unit to obtain an optical data unit, demapping the obtained optical data unit into a data frame, and transmitting the obtained data frame through the electrical connector; and / or, When the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board, the optical transmission unit is sent through the electrical connector, wherein the framer is used to demap and / or demultiplex the optical transmission unit into optical data units, encapsulate the obtained optical data units into cross data units, and send the cross data units to the electrical cross board.

27. The method according to claim 26, characterized in that The optical module is integrated with a serializer / deserializer (SerDes), and the data frame obtained by sending through the electrical connector includes: When the optical module is installed on the circuit board and the electrical connector is directly connected to the electrical cross-connect board, controlling the SerDes to send the obtained data frame using a first data transmission rate; When the electrical connector is mounted on a branch line integration board, and / or the electrical connector is mounted on a circuit board and directly connected to a framer on the circuit board, controlling the SerDes to transmit the obtained data frame using a second data transmission rate; The first data transmission rate is greater than the second data transmission rate.

28. The method according to claim 27, characterized in that The data frame sent through the electrical connector includes: When the optical module is installed on the branch line integration board and the electrical connector is directly connected to the linear drive pluggable optical module LPO, the SerDes is controlled to use the pre-emphasis device to send the obtained data frame.

29. The method according to any one of claims 26 to 28, characterized in that The method further comprises: receiving a configuration signal; When the configuration signal is at a first logic level, determining that the optical module is installed on a circuit board and the electrical connector is directly connected to an electrical cross-connect board; When the configuration signal is at a second logic level, it is determined that the optical module is installed on a branch line integration board, and / or the optical module is installed on a circuit board and the electrical connector is directly connected to a framer on the circuit board.

30. The method according to any one of claims 25 to 29, characterized in that The processing of the electrical signal includes: Perform equalization processing and / or analog-to-digital conversion on the electrical signal.

31. A chip, characterized in that: The chip is used to be integrated into an optical module. The chip includes a plurality of circuits, and at least one circuit among the plurality of circuits is used to execute the method according to any one of claims 19 to 30.

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