Sensor, detection apparatus, wearable device, and ionic gel and preparation method

Abstract

The present application relates to the technical field of sensors, and provides a sensor, a detection apparatus, a wearable device, and an ionic gel and a preparation method therefor. The sensor comprises a support layer, a substrate layer, an electrode layer, an ionic gel layer, and a packaging layer. The electrode layer is arranged between the ionic gel layer and the substrate layer, the ionic gel layer is arranged between the electrode layer and the packaging layer, and the packaging layer is connected to the substrate layer by means of the support layer. The sensor is used for receiving a pressing force, so that the contact area between the ionic gel layer and the electrode layer changes. The sensor provided by the present application can measure a static force and a dynamic force.

Description

Sensor, detection device, wearable device, ion gel and preparation method

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 29, 2024, with application number 202410127044.4 and application name “Sensor, detection device, wearable device, ion gel and preparation method”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of sensor technology, and in particular to a sensor, a detection device, a wearable device, an ion gel, and a preparation method. Background Art

[0003] Currently, wearable devices such as smart bracelets and smart watches integrate functions such as blood pressure and heart rate measurement. These wearable devices include a pressure-applying mechanism and a piezoelectric pressure sensor. When the pressure-applying mechanism applies pressure to the wrist of the subject, the piezoelectric pressure sensor can detect changes in the pulse signal at the wrist. However, existing piezoelectric pressure sensors cannot detect static forces. The performance of sensors in wearable devices needs to be improved. Summary of the Invention

[0004] The present invention provides a sensor, a detection device, a wearable device, an ion gel, and a preparation method. The sensor can detect static and dynamic forces and helps improve the performance of wearable devices.

[0005] In a first aspect, the present application provides a sensor comprising a support layer, a substrate layer, an electrode layer, an ion gel layer, and an encapsulation layer. The electrode layer is disposed between the ion gel layer and the substrate layer, the ion gel layer is disposed between the electrode layer and the encapsulation layer, and the encapsulation layer is connected to the substrate layer via the support layer. The sensor is configured to receive a compressive force, causing the contact area between the ion gel layer and the electrode layer to change.

[0006] When the pressing force is static, the ion gel layer can contact the electrode layer, and the ion gel layer and the electrode layer form ion-electron pairs at the contact interface, allowing the sensor to output a capacitance value and achieve force detection. When the pressing force is dynamic, the contact area between the ion gel layer and the electrode layer changes with the change of the pressing force, causing the number of ion-electron pairs formed at the contact interface between the ion gel layer and the electrode layer to change, resulting in a change in the capacitance value output by the sensor, thereby achieving force detection. Therefore, the wearable device can detect static and dynamic forces through the sensor provided by this embodiment, and the pressure sensor for detecting static force can be removed. In addition, it helps to improve the performance of the wearable device.

[0007] Furthermore, compared to conventional flat-plate capacitive mechanical sensors, the capacitance output by the sensor provided by this application depends on the number of ion-electron pairs at the ion gel-electrode interface. Furthermore, because the spacing between ion-electron pairs is much smaller than the thickness of the dielectric layer in conventional flat-plate capacitors, the capacitance output by the sensor provided by this application is several orders of magnitude higher than that of flat-plate capacitors, increasing from pF to nF. This also improves the sensor's sensitivity and mechanical resolution by 10-100 times.

[0008] In a possible implementation, the ion gel layer and the electrode layer are spaced apart in a first direction, where the first direction is the thickness direction of the substrate layer.

[0009] In this way, when the sensor is pressed, the contact area between the ion gel layer and the electrode layer can be increased, the number of ion-electron pairs can be increased, and the capacitance value output by the sensor becomes larger, which helps to improve the sensitivity and mechanical resolution of the sensor.

[0010] In a possible embodiment, a surface of the ion gel layer facing the electrode layer is provided with a microstructure.

[0011] This increases the contact area between the ion gel layer and the electrode layer when the sensor is pressed, increasing the number of ion-electron pairs and the sensor's output capacitance, thereby improving the sensor's sensitivity and mechanical resolution. Furthermore, when the sensor is not pressed, the ion gel layer remains in contact with the electrode layer, further reducing the sensor's thickness across the substrate.

[0012] In one possible embodiment, the ion gel layer includes 1,4-butanediol vinyl ether, 2,2'-(1,2-ethanediyldioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl imide).

[0013] In this way, the ion gel layer is made of these materials, which can increase the number of ion-electron pairs formed when the ion gel layer contacts the electrode layer, and can further improve the sensitivity and mechanical resolution of the sensor.

[0014] In one possible embodiment, the ion gel layer is connected to the encapsulation layer through chemical bonding.

[0015] In this way, the ion gel layer and the encapsulation layer can be connected by chemical bonding, which can improve the firmness of the connection between the ion gel layer and the encapsulation layer. In addition, the thickness of the connection structure between the ion gel layer and the encapsulation layer can be reduced, thereby reducing the thickness of the sensor and achieving a thinner design.

[0016] In a possible embodiment, the sensor further includes a coupling agent layer, which is disposed between the ion gel layer and the encapsulation layer. The ion gel layer is connected to the coupling agent layer via chemical bonding, and the encapsulation layer is connected to the coupling agent layer via chemical bonding.

[0017] In this way, the ion gel layer and the packaging layer can be firmly connected, and the thickness of the sensor can be reduced, which helps to achieve a thinner design.

[0018] In a possible implementation manner, the support layer is provided with a through hole, and the ion gel layer and the electrode layer are arranged inside the through hole.

[0019] In this way, the support layer can protect the electrode layer and the ion gel layer, and when the sensor is pressed, the ion gel layer can contact the electrode layer to form ion-electron pairs.

[0020] In a possible implementation, the support layer includes a plurality of through holes arranged at intervals, and an ion gel layer and an electrode layer are disposed in each through hole.

[0021] In this way, the multiple ion gel layers and the multiple electrode layers are separated from each other by the support layer of the grid structure, so that the electrode layer and the ion gel layer in each through hole form a matrix point. Then, the support layer can separate adjacent matrix points. The ion gel layer-electrode layer combination in each matrix point can independently output a set of capacitance values ​​without affecting the capacitance values ​​of the ion gel layer-electrode layer combination in adjacent matrix points. Therefore, there is no crosstalk between the matrix points, ensuring the measurement accuracy.

[0022] In one possible embodiment, the encapsulation layer includes a first elastic layer and a second elastic layer, wherein the second elastic layer is disposed between the first elastic layer and the ion gel layer and fixedly connected to the ion gel layer. The elastic modulus of the first elastic layer is greater than or equal to 1 GPa, and the elastic modulus of the second elastic layer is less than or equal to 100 MPa, or the ratio of the elastic modulus of the first elastic layer to the elastic modulus of the second elastic layer is greater than or equal to 10.

[0023] Because the elastic modulus of the first elastic layer is greater than that of the second elastic layer, the first elastic layer is made of a high-modulus material, while the second elastic layer is made of a low-modulus material. The low-modulus material provides excellent stretchability, ensuring the sensor has excellent bending and stretching properties. Furthermore, the low-modulus material provides excellent water and oxygen insulation, protecting the ion gel layer from the effects of water and oxygen. The high-modulus material itself provides good resilience. Therefore, the composite structure of the first and second elastic layers can improve the stability of the sensor's performance.

[0024] In a possible implementation, at least one of the first elastic layer and the second elastic layer is provided with a groove structure.

[0025] By providing a groove structure in at least one of the first elastic layer and the second elastic layer, the stretchability in the discontinuous direction can be guaranteed to a certain extent, and the degree of irregular surface deformation of the packaging layer during bending will be reduced, which can further ensure the stability of the sensor performance.

[0026] A second aspect of the present application provides a detection device comprising a pressure member and a sensor according to any one of the first aspects. The pressure member is configured to apply pressure to a measurement site. The sensor is configured to measure a pulse wave signal at the measurement site, and the sensor is disposed between the pressure member and the measurement site.

[0027] A third aspect of the present application provides a wearable device comprising a watch body, a first watch strap, a second watch strap, and a sensor as described in any one of the first aspects. Opposite ends of the watch body are connected to one end of the first watch strap and one end of the second watch strap, respectively, and the sensor is connected to the first watch strap.

[0028] A fourth aspect of the present application provides an ion gel comprising an elastomeric polymer backbone and an ionic liquid disposed within the elastomeric polymer backbone. The elastomeric polymer backbone comprises 1,4-butanediol vinyl ether, 2,2'-(1,2-ethylenedioxy)bis(ethanediol), trimethylolpropane tris(3-mercaptopropionate), and benzoin dimethyl ether. The ionic liquid comprises 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl imide).

[0029] A fifth aspect of the present application provides a method for preparing an ion gel, comprising the following steps:

[0030] 2,2'-(1,2-ethylenedioxy)bis(ethanediol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, 1,4-butanediol vinyl ether and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt were mixed to obtain a precursor pre-curing liquid;

[0031] The precursor pre-curing liquid is placed under ultraviolet light to carry out polymerization reaction to obtain ion gel.

[0032] In one possible embodiment, 2,2'-(1,2-ethylenedioxy)bis(ethylenethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, 1,4-butanediol vinyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt are uniformly mixed to obtain a precursor pre-curing liquid, comprising the following steps:

[0033] Mixing 2,2'-(1,2-ethanediyldioxy)bis(ethanediol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl imide) until the benzoin dimethyl ether is completely dissolved to obtain a mixed liquid;

[0034] 1,4-Butanediol vinyl ether is added into the mixed liquid to obtain a precursor pre-curing liquid.

[0035] In one possible embodiment, the ratio of 2,2'-(1,2-ethanediyldioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide is 93:22:20:1.

[0036] In one possible embodiment, the ratio of 1,4-butanediol vinyl ether to benzoin dimethyl ether is 102:1. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] FIG1 is a schematic structural diagram of a wearable device provided in an embodiment of the present application;

[0038] FIG2 is a schematic structural diagram of a first sensor provided in an embodiment of the present application;

[0039] FIG3 is a schematic cross-sectional view of the sensor in FIG2 ;

[0040] FIG4 is a schematic structural diagram of the first supporting layer in FIG3 ;

[0041] FIG5 is a schematic structural diagram of a second supporting layer provided in an embodiment of the present application;

[0042] FIG6 is a cross-sectional schematic diagram of the sensor in FIG3 when it is bent;

[0043] FIG7 is a cross-sectional schematic diagram of a second sensor provided in an embodiment of the present application;

[0044] FIG8 is a schematic cross-sectional view of an encapsulation layer provided in an embodiment of the present application from a top view perspective;

[0045] FIG9 is a schematic cross-sectional view of another encapsulation layer provided in an embodiment of the present application, viewed from above;

[0046] FIG10 is a cross-sectional schematic diagram of a third sensor provided in an embodiment of the present application;

[0047] FIG11 is a cross-sectional schematic diagram of the ion gel layer in FIG10 connected to the encapsulation layer through the coupling agent layer;

[0048] FIG12 is a cross-sectional schematic diagram of a fourth sensor provided in an embodiment of the present application;

[0049] FIG13 is a cross-sectional schematic diagram of a fifth sensor provided in an embodiment of the present application;

[0050] FIG14 is a cross-sectional schematic diagram of a sixth sensor provided in an embodiment of the present application;

[0051] FIG15 is a cross-sectional schematic diagram of a seventh sensor provided in an embodiment of the present application;

[0052] FIG16 is a cross-sectional schematic diagram of the eighth sensor provided in an embodiment of the present application.

[0053] Explanation of the accompanying drawings: 100, sensor; 10, substrate layer; 20, electrode layer; 30, ion gel layer; 31, microstructure; 40, encapsulation layer; 41, first elastic layer; 411, strip portion; 412, columnar portion; 42, second elastic layer; 43, groove structure; 431, strip groove; 50, supporting layer; 51, through hole; 60, coupling agent layer; 70, adhesive layer; 200, pressure member; 210, first strap; 220, second strap; 230, airbag; 300, detection device; 400, watch body; 500, wearable device. DETAILED DESCRIPTION

[0054] In related technologies, wearable devices include a pressure-applying mechanism and a piezoelectric pressure sensor. When the pressure-applying mechanism applies pressure to the subject's wrist, the piezoelectric pressure sensor detects changes in the pulse signal at the wrist. However, because piezoelectric pressure sensors cannot detect static forces, a second static force sensor is required to implement blood pressure monitoring. Therefore, two pressure sensors are required to achieve blood pressure monitoring.

[0055] In view of this, the embodiments of the present application provide a sensor 100, a detection device 300, a wearable device 500, an ion gel and a preparation method. The sensor 100 realizes capacitance output through ion-electron pairs, which can not only detect dynamic force and static force, but also because the spacing between ion-electron pairs is much smaller than the thickness of the dielectric layer in the traditional flat-plate capacitor type mechanical sensor, the capacitance value output by the sensor 100 is several orders of magnitude higher than that of the flat-plate capacitor, from pF to nF, which also increases the sensitivity and mechanical resolution indicators of the sensor 100 by 10-100 times.

[0056] The sensor 100 provided in the embodiment of the present application can be used in the wearable device 500 or the detection device 300, without specific limitation here.

[0057] The wearable device 500 may include but is not limited to a smart bracelet, a smart watch, a watch, or a watch-type blood pressure monitor, etc. In the embodiment of the present application, a smart watch is taken as an example of the wearable device 500, as shown in FIG1 .

[0058] FIG1 is a schematic structural diagram of a wearable device provided in an embodiment of the present application.

[0059] As shown in FIG1 , a wearable device 500 according to an embodiment of the present application includes a watch body 400, a pressure member 200, and a sensor 100. The pressure member 200 includes a first strap 210, a second strap 220, and an airbag 230. The watch body 400 has two opposite ends connected to one end of the first strap 210 and one end of the second strap 220, respectively. The other end of the first strap 210 is detachably connected to the other end of the second strap 220. The sensor 100 is connected to the first strap 210, and the airbag 230 is disposed between the first strap 210 and the sensor 100.

[0060] The airbag 230 is used to apply pressure to the subject's measurement area. The sensor 100 is located between the measurement area and the airbag 230 and measures the pulse wave signal at the measurement area. The wearable device 500 obtains the subject's blood pressure and heart rate based on the pulse wave signal. The airbag 230 applies multiple different pressure values ​​to the measurement area, causing the envelope of the pulse wave signal to change. The blood pressure value can be calculated based on the envelope change. The airbag 230 applies a fixed pressure to the measurement area, calculates the frequency of the pulse wave signal, and calculates the heart rate value based on the frequency of the pulse wave signal.

[0061] The present invention also provides a detection device 300, which includes a pressure member 200 and a sensor 100. The pressure member 200 is used to apply pressure to a measurement site. The sensor 100 is used to measure a pulse wave signal at the measurement site and is disposed between the pressure member 200 and the measurement site.

[0062] The detection device 300 may be a blood pressure monitor, a pressure detection device, etc., and is not specifically limited here.

[0063] The specific structure of the pressure member 200 is not limited here. In some implementations, the pressure member 200 is a retractable watchband. In this case, the pressure member 200 can form an annular structure that surrounds the subject's measurement area. When pressure is applied to the subject's measurement area, the inner diameter of the pressure member 200 increases or decreases, thereby increasing or decreasing the force applied to the measurement area.

[0064] In other implementations, the pressurizing member 200 may also include an airbag 230, which is used to form an annular structure surrounding the measurement site of the subject. By inflating and deflating the airbag 230, pressure is applied to the measurement site.

[0065] In some other implementations, the pressure member 200 may also include a first strap 210, a second strap 220 and an airbag 230, one end of the first strap 210 is connected to one end of the second strap 220, the other end of the first strap 210 and the other end of the second strap 220 are detachably connected, and the airbag 230 is connected to the first strap 210.

[0066] The implementation of the sensor 100 provided in the embodiment of the present application is described below with reference to the accompanying drawings.

[0067] FIG2 is a schematic structural diagram of a first sensor provided in an embodiment of the present application, and FIG3 is a schematic cross-sectional diagram of the sensor in FIG2 .

[0068] 3 , the sensor 100 according to an embodiment of the present application includes a support layer 50, a substrate layer 10, an electrode layer 20, an ion gel layer 30, and an encapsulation layer 40. The electrode layer 20 is disposed between the ion gel layer 30 and the substrate layer 10, and the ion gel layer 30 is disposed between the electrode layer 20 and the encapsulation layer 40. The encapsulation layer 40 is connected to the substrate layer 10 via the support layer 50. The sensor 100 is configured to receive a compressive force, thereby changing the contact area between the ion gel layer 30 and the electrode layer 20, and thereby changing the ion-electron pairs formed at the contact interface between the ion gel layer 30 and the electrode layer 20.

[0069] During the process of the sensor 100 detecting the pulse wave signal, the packaging layer 40 contacts the measuring part of the subject, and the substrate layer 10 is connected to the pressure member 200. During the process of the pressure member 200 applying pressure to the measuring part of the subject, the contact area between the ion gel layer 30 and the electrode layer 20 changes, causing the number of ion-electron pairs formed at the contact interface between the ion gel layer 30 and the electrode layer 20 to change, and the capacitance value output by the sensor 100 to change, thereby being able to simultaneously detect static / dynamic load values.

[0070] When the pressing force is a static force, the ion gel layer 30 can contact the electrode layer 20, and the ion gel layer 30 and the electrode layer 20 form ion-electron pairs at the contact interface, so that the sensor 100 outputs a capacitance value to achieve force detection. When the pressing force is a dynamic force, the contact area between the ion gel layer 30 and the electrode layer 20 changes with the change of the pressing, so that the number of ion-electron pairs formed at the contact interface of the ion gel layer 30 and the electrode layer 20 changes, resulting in a change in the capacitance value output by the sensor 100, thereby achieving force detection. Therefore, the sensor 100 provided in the embodiment of the present application can detect static force and dynamic force, and the pressure sensor for detecting static force can be removed. It can help to reduce the cost of the wearable device 500, or it can help to achieve the miniaturization of the wearable device 500.

[0071] Furthermore, compared to conventional flat-plate capacitive mechanical sensors, the capacitance output by the sensor 100 provided in the present embodiment depends on the number of ion-electron pairs at the ion gel-electrode interface. Because the spacing between ion-electron pairs is much smaller than the thickness of the dielectric layer in conventional flat-plate capacitors, the capacitance output by the sensor 100 provided in the present embodiment is several orders of magnitude higher than that of a flat-plate capacitor, increasing from pF to nF. This also improves the sensitivity and mechanical resolution of the sensor 100 by 10-100 times.

[0072] In the embodiment of the present application, the substrate layer 10 is the base of the sensor 100, providing support for all sensing structures. The substrate layer 10 also provides packaging for the sensor 100. In addition, the substrate material may include, but is not limited to, polymer materials such as polyethylene naphthalate (PEN), polyethylene glycol terephthalate (PET), polyimide (PI), polystyrene (PS), polyvinyl chloride (PVC), and polydimethylsiloxane (PDMS).

[0073] In the embodiment of the present application, the material of the electrode layer 20 may include but is not limited to conductive materials such as gold (Au), silver (Ag), copper (Cu), aluminum (Al), graphite (C), and silver nanowires.

[0074] In some implementations, the electrode layer 20 may be integrated on the surface of the substrate layer 10 by surface lamination or deposition.

[0075] There is no limitation on the specific shape of the electrode layer 20. In some implementations, the electrode layer 20 may be a single sheet of electrodes. In other implementations, the electrode layer 20 may be a finger-shaped or comb-shaped interdigitated electrode.

[0076] In an embodiment of the present application, the material of the support layer 50 may include but is not limited to polymer materials such as polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyimide (PI), polystyrene (PS), polyvinyl chloride (PVC), and polydimethylsiloxane (PDMS).

[0077] In some possible implementations, as shown in Figure 3, the surface of the ion gel layer 30 facing the electrode layer 20 is provided with a microstructure 31. The microstructure 31 makes the surface of the ion gel layer 30 facing the electrode layer 20 rough (concave and convex). In other words, the surface of the ion gel layer 30 facing the electrode layer 20 is a non-smooth surface, so that when the sensor 100 is pressed, the contact area between the ion gel layer 30 and the electrode layer 20 can be increased, the number of ion-electron pairs can be increased, and the capacitance value output by the sensor 100 becomes larger, which helps to improve the sensitivity and mechanical resolution of the sensor 100.

[0078] The specific structure of microstructure 31 is not limited herein. In some implementations, as shown in FIG3 , microstructure 31 may be a sandpaper structure. In other implementations, microstructure 31 may also include a plurality of conical bump structures disposed on the surface of ion gel layer 30 facing electrode layer 20.

[0079] There is no limitation on how to form the microstructure 31 on the ion gel layer 30. In some implementations, the microstructure 31 on the surface of the ion gel layer 30 can be prepared by pouring a pre-curing liquid precursor for the ion gel layer 30 (see the description of the ion gel preparation process below) into a mold with a sandpaper structure. The mold has been pre-installed with a support layer 50 with a grid structure, so that the pre-curing liquid precursor for the ion gel layer 30 is distributed within independent "microwells (which can be understood as through-holes 51 in the support layer 50)." An encapsulation layer 40 with an adhesive modifier is then pressed onto the pre-curing liquid precursor for the ion gel layer 30. The pre-curing liquid precursor for the ion gel layer 30 is irradiated with an ultraviolet lamp to cure it, and the encapsulation layer 40 is then removed from the mold, resulting in an ion gel layer 30 bonded to the encapsulation layer 40 and having the sandpaper microstructure 31 on its surface.

[0080] It should be noted that, in addition to providing the microstructure 31 on the ion gel layer 30, in some implementations, the surface of the electrode layer 20 facing the ion gel layer 30 may also be provided with a microstructure 31 (not shown in the figures). In this way, the contact area between the electrode layer 20 and the ion gel layer 30 may also be increased. In addition, the microstructure 31 may be provided on at least one of the ion gel layer 30 and the electrode layer 20. For example, both the ion gel layer 30 and the electrode layer 20 may be provided with the microstructure 31, or only one of the ion gel layer 30 and the electrode layer 20 may be provided with the microstructure 31.

[0081] In some possible implementations, as shown in FIG3 , the ion gel layer 30 and the electrode layer 20 are spaced apart in a first direction Z, where the first direction Z is the thickness direction of the substrate layer 10. This increases the contact area between the ion gel layer 30 and the electrode layer 20 when the sensor 100 is pressed, which can increase the number of ion-electron pairs, thereby increasing the capacitance output by the sensor 100 and improving the sensitivity and mechanical resolution of the sensor 100.

[0082] Since the ion gel layer 30 is connected to the packaging layer 40, the electrode layer 20 is connected to the substrate layer 10, and the packaging layer 40 is connected to the substrate layer 10 through the support layer 50, in addition to connecting the substrate layer 10 and the packaging layer 40, the support layer 50 is also used to separate the ion gel layer 30 and the electrode layer 20. The electrode layer 20 only contacts the ion gel layer 30 when pressed, and the greater the pressing force, the larger the contact area between the electrode layer 20 and the ion gel layer 30, and the greater the capacitance value output by the sensor 100. Therefore, the presence of the support layer 50 can ensure the normal sensing performance of the sensor 100.

[0083] In some possible implementations, as shown in FIG3 , the support layer 50 is provided with a through hole 51 that penetrates the support layer 50 along a first direction Z. The axial direction of the through hole 51 is parallel to the first direction Z. The ion gel layer 30 and the electrode layer 20 are disposed within the through hole 51. In this way, the support layer 50 can protect the electrode layer 20 and the ion gel layer 30, and when the sensor 100 is pressed, the ion gel layer 30 can contact the electrode layer 20 to form ion-electron pairs.

[0084] There is no limitation on the specific shape of the through hole 51. In some implementations, the through hole 51 can be a circular through hole 51 (not shown in the figure). In other implementations, the through hole 51 can also be a square through hole (as shown in Figure 4).

[0085] FIG4 is a schematic structural diagram of the first supporting layer in FIG3 .

[0086] As shown in FIG4 , the support layer 50 includes a plurality of spaced through holes 51, forming a grid structure. As shown in FIG3 , each through hole 51 includes an ion gel layer 30 and an electrode layer 20. Therefore, there are multiple ion gel layers 30 and multiple electrode layers 20, and adjacent ion gel layers 30 and electrode layers 20 are separated by the support layer 50, respectively.

[0087] The ion gel layer 30 and electrode layer 20 within each through-hole 51 form a single lattice point, making the sensor 100 equivalent to an array of multiple lattice points. The grid structure of the support layer 50 ensures that each lattice point forms a "micro-well" structure (as shown in A in Figure 2), isolating the ion gel material therein. This ensures the proper sensing performance of the sensor 100 and effectively eliminates crosstalk between the lattice points.

[0088] One function of the support layer 50 is to separate the ion gel layer 30 from the electrode layer 20. Only when pressed by an external force does the ion gel layer 30 contact the electrode layer 20, generating a pressure-dependent capacitance change, thus ensuring the proper performance of the sensor 100. Another function is that the grid-like support layer 50 separates the array points from one another. Each ion gel layer 30-electrode layer 20 combination at a point can independently output a set of capacitance values ​​without affecting the capacitance values ​​of adjacent ion gel layer 30-electrode layer 20 combinations. Consequently, crosstalk between points is eliminated, ensuring measurement accuracy.

[0089] Since adjacent electrode layers 20 are separated by the support layer 50, there is a certain gap between adjacent electrode layers 20, and the wiring of the electrode layer 20 (not shown in the figure) can be arranged in the gap. In addition, the support layer 50 can also be connected to the substrate layer 10 through the gap.

[0090] The specific structure of the support layer 50 is not limited here. In some implementations, as shown in Figure 4, each of the plurality of through holes 51 is formed by four sidewalls. In other implementations, as shown in Figure 5, a portion of the plurality of through holes 51 is formed by four sidewalls, while another portion of the through holes 51 is formed by two or three sidewalls. Figure 5 is a schematic diagram of the structure of the second support layer provided in an embodiment of the present application.

[0091] In some implementations, as shown in FIG3 , the sensor 100 may further include an adhesive layer 70 , which is disposed between the support layer 50 and the substrate layer 10 , such that the support layer 50 is connected to the substrate layer 10 by adhesion.

[0092] As shown in FIG4 , since the support layer 50 is a grid structure, the adhesive layer 70 is also a grid structure, and the grid size of the adhesive layer 70 matches the grid size of the support layer 50 , ensuring that the support layer 50 and the adhesive layer 70 are connected.

[0093] The specific material of the adhesive layer 70 is not limited herein. For example, the adhesive layer 70 may be a double-sided tape. When the adhesive layer 70 is a double-sided tape, the double-sided tape and the support layer 50 may be bonded together beforehand, and then the double-sided tape and the support layer 50 may be processed to form a grid structure.

[0094] For example, the sheet-like support layer 50 and the double-sided tape can be ion-cleaned first, and then the support layer 50 and the double-sided tape can be pressed together. The connected support layer 50 and the double-sided tape are then placed in an oven and heated at a certain temperature for a certain time. After cooling, the grid-structured support layer 50 and the double-sided tape are cut out using a laser.

[0095] Among them, the grid size of the support layer 50 and the grid size of the double-sided tape are consistent with the gap size of the electrode layer 20, ensuring that the support layer 50 of the grid structure is distributed in the gap between the electrode layers 20, and ensuring that the double-sided tape of the grid structure is bonded to the substrate layer 10 through the gap between the electrode layers 20 to connect the support layer 50 to the substrate layer 10.

[0096] In the embodiment of the present application, there is no specific limitation on the specific material of the ion gel layer 30. The ion gel layer 30 can be made by mixing a variety of organic materials.

[0097] In some possible implementations, the ion gel layer 30 may include 1,4-butanediol vinyl ether, 2,2′-(1,2-ethanediyldioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide.

[0098] Specifically, the ion gel layer 30 is composed of 1,4-butanediol divinyl ether (BVB), 2,2'-(ethylenedioxy)diethanethiol (BMOE), and trimethylolpropane tris(3-mercaptopropionate) (TMPT) as monomers, 2,2-dimethoxy-2-phenylacetophenone (DMPA) as a photoinitiator, and an ionic liquid such as 1-ethyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide (EMIM[TFSI]) uniformly dispersed in the polymer backbone to undergo click polymerization. The sensor 100 uses the ion gel layer 30 made of these materials in contact with the electrode layer 20, which can increase the number of ion-electron pairs formed when the ion gel layer 30 contacts the electrode layer 20, and can further improve the sensitivity and mechanical resolution of the sensor 100.

[0099] It should be noted that, in addition to using the ion gel layer 30 made of these materials, the sensor 100 may also use the ion gel layer 30 made of other materials.

[0100] In the embodiment of the present application, the encapsulation layer 40 is used to provide the sensor 100 with anti-wear, waterproof, and oxygen-isolating functions.

[0101] In some possible implementations, as shown in FIG3 , the encapsulation layer 40 includes a first elastic layer 41 and a second elastic layer 42, wherein the second elastic layer 42 is disposed between the first elastic layer 41 and the ion gel layer 30 and is fixedly connected to the ion gel layer 30. The elastic modulus of the first elastic layer 41 is greater than or equal to 1 GPa, and the elastic modulus of the second elastic layer 42 is less than or equal to 100 MPa, or the ratio of the elastic modulus of the first elastic layer 41 to the elastic modulus of the second elastic layer 42 is greater than or equal to 10.

[0102] It should be noted that the relationship between the elastic modulus of the first elastic layer 41 and the elastic modulus of the second elastic layer 42 must satisfy at least one of the following two conditions: 1. The elastic modulus of the first elastic layer 41 is greater than or equal to 1 GPa, and the elastic modulus of the second elastic layer 42 is less than or equal to 100 MPa. 2. The ratio of the elastic modulus of the first elastic layer 41 to the elastic modulus of the second elastic layer 42 is greater than or equal to 10.

[0103] The first elastic layer 41 is made of a high-modulus material, which refers to a polymer material with an elastic modulus greater than or equal to 1 GPa, including but not limited to polyethylene terephthalate (PET) and polyethylene naphthalate (PEN). Materials with a high elastic modulus can quickly rebound when bending or pressing pressure is removed, meaning they have good creep resistance. This facilitates the basic functionality of the sensor 100: the encapsulation layer 40 and the ion gel layer 30 connected thereto undergo corresponding bending deformation under a certain pressure, thereby ensuring a corresponding contact area between the ion gel layer 30 and the electrode layer 20 and outputting a corresponding capacitance value. When pressure changes rapidly, for example, a rapid decrease in pressure, the high elastic modulus material in the encapsulation layer 40 quickly rebounds, reducing the corresponding bending deformation. This reduces the contact area between the ion gel layer 30 and the electrode layer 20, and the capacitance output by the sensor 100 decreases, thereby achieving signal sensing of a decrease in force.

[0104] The second elastic layer 42 is made of a low-modulus material. Low-modulus materials refer to polymer materials with an elastic modulus of less than or equal to 100 MPa, including but not limited to polydimethylsiloxane (PDMS), Ecoflex, and silicone. Low-modulus materials have excellent stretchability, ensuring that the sensor 100 has excellent bending and stretching properties. Furthermore, low-modulus materials provide excellent water and oxygen isolation, ensuring the stability of the ion gel layer 30. Furthermore, during the preparation of the sensor 100, the low-modulus material itself is plasma cleaned, and the oxygen side chains (-O-) on the side of the material near the ion gel layer 30 are converted to hydroxyl side chains (-OH), enabling bonding with the coupling agent layer 60 (see below), thereby ensuring a secure bond between the low-modulus material and the ion gel layer 30.

[0105] In summary, the encapsulation layer 40 is made of a low-elastic modulus material and a high-elastic modulus material. The low-modulus material provides excellent stretchability, ensuring that the sensor 100 has good bending and stretching properties. Furthermore, the low-modulus material provides excellent water and oxygen insulation, protecting the ion gel layer 30 from the effects of water and oxygen. The high-modulus material itself provides excellent resilience, which can improve the performance stability of the sensor 100. Therefore, the encapsulation layer 40, consisting of the first elastic layer 41 and the second elastic layer 42, ensures that the sensor 100 can respond quickly while also ensuring repeatable and stable sensing performance.

[0106] In some possible implementations, at least one of the first elastic layer 41 and the second elastic layer 42 may be provided with a groove structure 43 . For example, as shown in FIG. 3 , the first elastic layer 41 is provided with a groove structure 43 , while the second elastic layer 42 is not provided with a groove structure 43 .

[0107] Because the first elastic layer 41 is made of a high-elastic modulus material and the second elastic layer 42 is made of a low-elastic modulus material, the two materials with different elastic moduli tend to produce different bending states (different curvatures, different curvature distributions, etc.) when bent under force, which can easily cause irregular surface deformation and affect the performance of the sensor 100. Therefore, by providing a groove structure 43 on the first elastic layer 41 to pattern the first elastic layer 41, the irregular surface deformation can be reduced or eliminated, thereby ensuring the resilience and stretchability of the encapsulation layer 40.

[0108] Figure 6 is a schematic cross-sectional view of the sensor in Figure 3 when bent, and Figure 7 is a schematic cross-sectional view of a second sensor provided in an embodiment of the present application. The difference between Figure 7 and Figure 6 is that the first elastic layer 41 and the second elastic layer 42 in Figure 7 do not have the groove structure 43.

[0109] In some implementations, a portion of the first elastic layer 41 can be cut or etched away to form a strip-shaped grating structure or a stretchable grid structure, forming a patterned structure. The effect of this structure is that because the material of the first elastic layer 41 is a high elastic modulus material, it has good rebound properties in the continuous direction of the material. In the discontinuous direction of the material (the direction of the cut or etched), the material is stretchable. Because a portion is removed, when the material is bent and deformed, its internal stress is less than that of the whole piece of material without patterning. Therefore, its bending deformation is not as large as the deformation of the whole piece of material. When compounded with a low elastic modulus material, the degree of irregular surface deformation is reduced (as shown in Figure 6), which is clearly different from the large surface deformation shown in Figure 7. Therefore, this patterned structure can ensure the resilience and stretchability of the encapsulation layer 40, while reducing the irregular surface deformation between the two layers during bending deformation.

[0110] In this example of the present application, there is no specific limitation on the specific structure of the first elastic layer 41 having the groove structure 43 .

[0111] FIG8 is a schematic cross-sectional view of an encapsulation layer provided in an embodiment of the present application from a top view perspective, and FIG9 is a schematic cross-sectional view of another encapsulation layer provided in an embodiment of the present application from a top view perspective.

[0112] In some implementations, as shown in FIG8 , the first elastic layer 41 may include a plurality of strip portions 411 arranged side by side and at intervals along the second direction X, wherein the extension direction of each strip portion 411 is parallel to the third direction Y, and a groove structure 43 is formed between two adjacent strip portions 411 .

[0113] In other implementations, as shown in FIG9 , the first elastic layer 41 may include a plurality of spaced-apart columnar portions 412 , which are arrayed in the second direction X and the third direction Y, and the gaps between adjacent columnar portions 412 are used to form a groove structure 43 .

[0114] In some other implementations, the first elastic layer 41 may also include a main body and multiple strip portions 411, the main body is connected to the second elastic layer 42, the multiple strip portions 411 are arranged on the same side of the main body, the multiple strip portions 411 are arranged side by side and at intervals along the second direction X, each strip portion 411 extends along the third direction Y, and two adjacent strip portions 411 and the main body form a groove structure 43.

[0115] In the example of the present application, the first direction Z, the second direction X, and the third direction Y are perpendicular to each other. The first direction Z is the thickness direction of the substrate layer 10 .

[0116] It should be noted that, in addition to the groove structure 43 being provided on the first elastic layer 41, in some implementations, the groove structure 43 may also be provided on the second elastic layer 42, while the first elastic layer 41 may not be provided with the groove structure 43. In still other implementations, the groove structure 43 may also be provided on both the first elastic layer 41 and the second elastic layer 42.

[0117] When the second elastic layer 42 is provided with the groove structure 43, the groove structure 43 does not penetrate the second elastic layer 42 along the first direction Z. In other words, the groove structure 43 is not a through-groove structure. Alternatively, it can be understood that when the second elastic layer 42 is provided with the groove structure 43, the second elastic layer 42 remains a one-piece plate structure, rather than being composed of multiple discrete parts. This ensures that the second elastic layer 42 can be connected to the ion gel layer 30.

[0118] When the second elastic layer 42 is provided with a groove structure 43, the groove structure 43 is arranged on the side of the second elastic layer 42 facing the first elastic layer 41 along the first direction Z. At this time, part of the first elastic layer 41 can be arranged inside the groove structure 43 to increase the contact area between the first elastic layer 41 and the second elastic layer 42, which helps to improve the firmness of the connection between the first elastic layer 41 and the second elastic layer 42.

[0119] In the embodiment of the present application, the ion gel layer 30 can be connected to the encapsulation layer 40 by bonding. In some implementations, the ion gel layer 30 can be bonded to the encapsulation layer 40 by an adhesive such as double-sided tape, glue, or tape (not shown). In other implementations, the ion gel layer 30 can also be connected to the encapsulation layer 40 by chemical bonding, so that the ion gel layer 30 and the encapsulation layer 40 are chemically bonded, thereby forming an integrated structure.

[0120] Accordingly, the ion gel layer 30 is connected to the encapsulation layer 40 by adhesives or chemical bonding, which can ensure that there is sufficient adhesion between the ion gel layer 30 and the encapsulation layer 40, so that the ion gel layer 30 and the encapsulation layer 40 are fastened together and will not fall off during stretching or bending, thereby ensuring the stability of the sensor 100 during long-term use.

[0121] Because the adhesive is relatively thick in the first direction Z (typically on the order of hundreds of microns), it can affect the thickness and bendability of the sensor 100 in the first direction Z. However, when the ion gel layer 30 is chemically bonded to the encapsulation layer 40, the thickness of the chemical layer between the ion gel layer 30 and the encapsulation layer 40 can be controlled to a submicron thickness (less than μm), without affecting the thickness, tensile strength, and bendability of the sensor 100, allowing the sensor 100 to be made thinner in the first direction Z. Therefore, in the present example, the ion gel layer 30 is chemically bonded to the encapsulation layer 40 to form an integral structure.

[0122] FIG10 is a cross-sectional schematic diagram of the third sensor provided in an embodiment of the present application, and FIG11 is a cross-sectional schematic diagram of the ion gel layer in FIG10 connected to the encapsulation layer via a coupling agent layer.

[0123] In some possible implementations, as shown in FIG10 , the sensor 100 may further include a coupling agent layer 60 disposed between the ion gel layer 30 and the encapsulation layer 40. The ion gel layer 30 is chemically bonded to the coupling agent layer 60, and the encapsulation layer 40 is chemically bonded to the coupling agent layer 60. In this manner, the ion gel layer 30 can be chemically bonded to the encapsulation layer 40 via the coupling agent layer 60, ensuring sufficient adhesion between the encapsulation layer 40 and the ion gel layer 30. This also reduces the thickness of the sensor 100 in the first direction Z without affecting the bendability of the sensor 100.

[0124] There is no limitation on the specific type of coupling agent layer 60. For example, the ion gel layer 30 can be integrated with the encapsulation layer 40 by using a coupling agent with a thiol group, such as (3-mercaptopropyl)trimethoxysilane, and chemically bonded to the encapsulation layer 40 and the ion gel layer 30 by a dehydration / dealcoholization reaction and a click reaction, respectively, to achieve a strong connection between the encapsulation layer 40-coupling agent adhesive layer 70 (as shown in FIG. 11 ) and the gel layer-coupling agent adhesive layer 70 (as shown in FIG. 11 ), thereby fastening the ion gel layer 30 to the encapsulation layer 40 and preventing it from falling off during stretching or bending, thereby ensuring the stability of the sensor 100 during long-term use.

[0125] The coupling agent layer 60 is taken as (3-mercaptopropyl)trimethoxysilane as an example to illustrate how the coupling agent layer 60 bonds the ion gel layer 30 and the encapsulation layer 40 into an integrated structure.

[0126] As shown in FIG10 , the encapsulation layer 40 is composed of a first elastic layer 41 and a second elastic layer 42 . The second elastic layer 42 is connected to the ion gel layer 30 . The material of the second elastic layer 42 may include but is not limited to polymers with oxygen chains (-O-), such as PDMS, Ecoflex, and silicone.

[0127] During the preparation of the sensor 100, the encapsulation layer 40 is first cleaned with plasma to convert the oxygen side chains (-O-) on the second elastic layer 42 into hydroxyl side chains (-OH). The encapsulation layer 40 is then placed in a coupling agent treatment solution (mainly composed of (3-mercaptopropyl)trimethoxysilane + acetic acid) for 30 minutes. During this period, the dealcoholization reaction occurs as follows:

[0128] After the above processing steps, the encapsulation layer 40 and the coupling agent layer 60 are chemically bonded, forming a strong chemical bond between the two layers. Next, the coupling agent is chemically bonded to the monomers in the precursor pre-curing solution of the ion gel layer 30 using the principle of click chemistry, ensuring a tight connection between the ion gel layer 30 and the encapsulation layer 40 during curing.

[0129] During the preparation of the sensor 100, the encapsulation layer 40 with the coupling agent layer 60 is pressed onto the pre-curing liquid precursor of the ion gel layer 30, and then irradiated with ultraviolet light to cure the pre-curing liquid precursor of the ion gel layer 30. The click chemistry reaction that occurs during this process is:

[0130] As can be seen from the reaction formula, the thiol group (-SH) in the coupling agent layer 60 and the carbon-carbon double bond (C=C) in the pre-curing liquid monomer of the ion gel layer 30 undergo a click reaction to form a stable carbon-sulfur bond (CS), which tightly connects the coupling agent layer 60 and the ion gel layer 30.

[0131] In summary, due to the presence of the coupling agent layer 60, a stable bonding structure of the encapsulation layer 40-coupling agent layer 60-ion gel layer 30 is formed at the connection interface between the encapsulation layer 40 and the ion gel layer 30 (as shown in FIG11 ), thereby enabling the ion gel layer 30 to be firmly and stably fixed to the encapsulation layer 40.

[0132] FIG12 is a cross-sectional schematic diagram of the fourth sensor provided in an embodiment of the present application.

[0133] The difference between Figure 12 and Figure 3 is that encapsulation layer 40 is also composed of a first elastic layer 41 and a second elastic layer 42, and neither the first elastic layer 41 nor the second elastic layer 42 is provided with groove structure 43. With this arrangement, encapsulation layer 40 composed of high elastic modulus material and low elastic modulus material also allows sensor 100 to have good stretchability, bendability, and resilience, ensuring the stability of sensor 100's performance.

[0134] In the above description, encapsulation layer 40 has a two-layer structure and is composed of two materials with different elastic moduli. However, encapsulation layer 40 can also have a single-layer structure and be composed of a single elastic modulus material, as shown in Figure 13. Figure 13 is a cross-sectional schematic diagram of the fifth sensor provided in an embodiment of the present application.

[0135] In FIG. 13 , the encapsulation layer 40 may be bonded to the ion gel layer 30 via an adhesive or by chemical bonding.

[0136] FIG14 is a cross-sectional schematic diagram of the sixth sensor provided in an embodiment of the present application.

[0137] Figure 14 differs from Figure 3 in that the ion gel layer 30 contacts the electrode layer 20 along the first direction Z. Specifically, before the sensor 100 is pressed, the ion gel layer 30 maintains contact with the electrode layer 20. Because the surface of the ion gel layer 30 facing the electrode layer 20 is provided with microstructures 31, the contact area between the ion gel layer 30 and the electrode layer 20 can change when the sensor 100 is pressed. This causes a change in the number of ion-electron pairs formed at the contact cross-section between the ion gel layer 30 and the electrode layer 20, enabling force detection.

[0138] As shown in FIG. 14 , by making the ion gel layer 30 contact the electrode layer 20 , the thickness of the sensor 100 in the first direction Z can be further reduced, which contributes to a thinner design of the sensor 100 .

[0139] In the above description, the surface of the ion gel layer 30 facing the electrode layer 20 is provided with microstructures 31 (as shown in FIG3 or FIG14 ). However, the surface of the ion gel layer 30 facing the electrode layer 20 may not be provided with microstructures 31. In other words, the surface of the ion gel layer 30 facing the electrode layer 20 is a non-rough surface (or a flat surface), as shown in FIG15 . FIG15 is a schematic cross-sectional view of the seventh sensor provided in an embodiment of the present application.

[0140] It should be noted that when the microstructure 31 is not provided on the surface of the ion gel layer 30 facing the electrode layer 20, the ion gel layer 30 and the electrode layer 20 should be spaced apart in the first direction Z to ensure that the contact area between the ion gel layer 30 and the electrode layer 20 can change when the sensor 100 is pressed.

[0141] In the above description, the support layer 50 has a plurality of through holes 51, so that the support layer 50 has a grid structure. However, the support layer 50 may also be provided with a single through hole 51, as shown in FIG16 . FIG16 is a cross-sectional schematic diagram of the eighth sensor provided in an embodiment of the present application.

[0142] As shown in Figure 16, the support layer 50 is provided with one through hole 51, and the number of the electrode layer 20 and the number of the ion gel layer 30 are also one. In addition, when the number of the through hole 51 is one, the support layer 50 is equivalent to a tube structure with both ends through.

[0143] The present invention also provides an ion gel comprising an elastomeric polymer backbone and an ionic liquid disposed within the elastomeric polymer backbone. The elastomeric polymer backbone comprises 1,4-butanediol vinyl ether, 2,2'-(1,2-ethylenedioxy)bis(ethanediol), trimethylolpropane tris(3-mercaptopropionate), and benzoin dimethyl ether. The ionic liquid comprises 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide.

[0144] Specifically, the elastomeric polymer backbone is produced by a click polymerization reaction using 1,4-butanediol vinyl ether (BVB), 2,2'-(1,2-ethylenedioxy)bis(ethanediol)mercaptoethanol (BMOE), and trimethylolpropane tris(3-mercaptopropionate) (TMPT) as monomers and benzoin dimethyl ether (DMPA) as a photoinitiator.

[0145] The present invention also provides a method for preparing an ion gel, which specifically includes the following steps:

[0146] S1. Evenly mix 2,2'-(1,2-ethylenedioxy)bis(ethanediol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, 1,4-butanediol vinyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt to obtain a precursor pre-curing liquid. Specifically, the precursor pre-curing liquid can be obtained by the following steps.

[0147] S11. Mix 2,2'-(1,2-ethanediyldioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt until benzoin dimethyl ether is completely dissolved to obtain a mixed liquid.

[0148] In order to ensure that benzoin dimethyl ether is completely dissolved, a shaking device can be used to shake the mixed liquid of 2,2'-(1,2-ethanediyldioxy)bis(ethanethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt.

[0149] In the process of preparing the mixed liquid, there is no restriction on the ratio of 2,2'-(1,2-ethylenedioxy)bis(ethanediol)mercaptan, trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide. The ratio of 2,2'-(1,2-ethylenedioxy)bis(ethanediol)mercaptan, trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide refers to the mass ratio.

[0150] For example, the ratio of 2,2'-(1,2-ethylenedioxy)bis(ethanediol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl imide) can be 93:22:20:1, which can further improve the performance of the ion gel. Of course, the ratio of 2,2'-(1,2-ethylenedioxy)bis(ethanediol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl imide) can also be other ratios, for example, 92:22:20:1.

[0151] S12. Add 1,4-butanediol vinyl ether to the mixed liquid to obtain a precursor pre-curing liquid.

[0152] Specifically, in order to fully mix the 1,4-butanediol vinyl ether and the mixed liquid, an oscillating device can be used to shake for a certain period of time, and ultrasonic treatment can be performed to remove bubbles. For example, after the 1,4-butanediol vinyl ether and the mixed liquid are mixed, they are shaken for 60 seconds and ultrasonic treatment is performed for 60 seconds.

[0153] The ratio of 1,4-butanediol vinyl ether is not limited here. The ratio of 1,4-butanediol vinyl ether refers to the mass ratio. For example, the ratio of 1,4-butanediol vinyl ether to benzoin dimethyl ether can be 102:1. Of course, the ratio of 1,4-butanediol vinyl ether to benzoin dimethyl ether can also be other ratios, for example, 101:1.

[0154] S2. placing the precursor pre-curing liquid under ultraviolet light to perform polymerization reaction to obtain ion gel.

[0155] Specifically, the precursor pre-curing liquid can be irradiated with an ultraviolet lamp to cure the precursor pre-curing liquid to obtain the ion gel.

[0156] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0157] In the embodiments of the present application, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0158] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0159] The term "plurality" in this document refers to two or more. The term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the related objects; in a formula, the character " / " indicates a "division" relationship between the related objects.

[0160] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0161] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. A sensor, characterized in that: It includes a support layer, a substrate layer, an electrode layer, an ion gel layer and an encapsulation layer; The electrode layer is arranged between the ion gel layer and the substrate layer, the ion gel layer is arranged between the electrode layer and the packaging layer, and the packaging layer is connected to the substrate layer through the support layer; The sensor is used to receive a pressing force, so that the contact area between the ion gel layer and the electrode layer changes.

2. The sensor according to claim 1, characterized in that The ion gel layer and the electrode layer are spaced apart from each other in a first direction, where the first direction is the thickness direction of the substrate layer.

3. The sensor according to claim 1 or 2, characterized in that A microstructure is provided on the surface of the ion gel layer facing the electrode layer.

4. The sensor according to any one of claims 1 to 3, characterized in that The ion gel layer includes 1,4-butanediol vinyl ether, 2,2'-(1,2-ethylenedioxy)bis(ethanediol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl imide).

5. The sensor according to any one of claims 1 to 4, characterized in that The ion gel layer is connected to the encapsulation layer through chemical bonding.

6. The sensor according to claim 5, characterized in that The sensor further includes a coupling agent layer, which is arranged between the ion gel layer and the encapsulation layer. The ion gel layer is connected to the coupling agent layer through chemical bonding, and the encapsulation layer is connected to the coupling agent layer through chemical bonding.

7. The sensor according to any one of claims 1 to 6, characterized in that The support layer is provided with a through hole, and the ion gel layer and the electrode layer are arranged inside the through hole.

8. The sensor according to claim 7, characterized in that The support layer includes a plurality of through holes arranged at intervals, and each through hole is provided with an ion gel layer and an electrode layer.

9. The sensor according to any one of claims 1 to 8, characterized in that The encapsulation layer includes a first elastic layer and a second elastic layer, wherein the second elastic layer is disposed between the first elastic layer and the ion gel layer and is fixedly connected to the ion gel layer; The elastic modulus of the first elastic layer is greater than or equal to 1 GPa and the elastic modulus of the second elastic layer is less than or equal to 100 MPa, or the ratio of the elastic modulus of the first elastic layer to the elastic modulus of the second elastic layer is greater than or equal to 10.

10. The sensor according to claim 9, characterized in that At least one of the first elastic layer and the second elastic layer is provided with a groove structure.

11. A detection device, characterized in that: comprising a pressurizing member and a sensor according to any one of claims 1 to 10; The pressure member is used to apply pressure to the measuring part; The sensor is used to measure the pulse wave signal of the measurement site, and the sensor is arranged between the pressurizing member and the measurement site.

12. A wearable device, characterized in that: comprising a watch body, a first watch strap, a second watch strap, and a sensor as claimed in any one of claims 1 to 10; The opposite ends of the watch body are respectively connected to one end of the first watch band and one end of the second watch band, and the sensor is connected to the first watch band.

13. An ion gel, characterized in that comprising an elastomeric polymer backbone and an ionic liquid disposed in the elastomeric polymer backbone; The elastomeric polymer backbone comprises 1,4-butanediol vinyl ether, 2,2'-(1,2-ethylenedioxy)bis(ethylenethiol), trimethylolpropane tris(3-mercaptopropionate) and benzoin dimethyl ether; The ionic liquid includes 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt.

14. A method for preparing an ion gel, characterized in that: The following steps are involved: 2,2'-(1,2-ethylenedioxy)bis(ethanediol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, 1,4-butanediol vinyl ether and 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt were mixed to obtain a precursor pre-curing liquid; The precursor pre-curing liquid is placed under ultraviolet light to carry out polymerization reaction to obtain ion gel.

15. The preparation method according to claim 14, characterized in that The method comprises uniformly mixing 2,2'-(1,2-ethylenedioxy)bis(ethylenethiol), trimethylolpropane tris(3-mercaptopropionate), benzoin dimethyl ether, 1,4-butanediol vinyl ether and 1-ethyl-3-methylimidazole bis(trifluoromethanesulfonyl)imide salt to obtain a precursor pre-curing liquid, including the following steps: Mixing the 2,2'-(1,2-ethylenedioxy)bis(ethanediol), the trimethylolpropane tris(3-mercaptopropionate), the benzoin dimethyl ether, and the 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide salt until the benzoin dimethyl ether is completely dissolved to obtain a mixed liquid; The 1,4-butanediol vinyl ether is added to the mixed liquid to obtain the precursor pre-curing liquid.

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