Image sensor driving apparatus, optical apparatus, camera module and electronic device

Abstract

The embodiments of the present application belong to the technical field of cameras. Provided are an image sensor driving apparatus, an optical apparatus, a camera module and an electronic device. The image sensor driving apparatus comprises a fixing seat, a circuit board and an image sensor driving assembly. The circuit board comprises a fixed part, a flexible part and a movable part; the fixed part is connected to the fixing seat, and the fixed part is mechanically connected and electrically connected to the movable part by means of the flexible part; the movable part is used for mechanically connecting to the image sensor, and the movable part comprises a light-transmitting through hole and a connection interface, one end of the light-transmitting through hole being a light inlet, the other end thereof being a light outlet facing a photosensitive surface of the image sensor, and the connection interface being located on the same side of the movable part with the light outlet and being used for mechanically connecting and electrically connecting to the image sensor. The image sensor driving assembly is used for generating a driving force for driving the movable part to move relative to the fixing seat. The image sensor driving apparatus and the optical apparatus provided by the embodiments of the present application can reduce the size of camera modules, thereby helping to achieve miniaturization of electronic devices.

Description

Image sensor driver, optical device, camera module and electronic device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on February 2, 2024, with application number 202410157036.4 and application name “Image sensor driving device, optical device, camera module and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of camera technology, and in particular to an image sensor driving device, an optical device, a camera module, and an electronic device. Background Art

[0003] Electronic devices such as mobile phones and tablet computers are usually equipped with camera modules, which enable electronic devices to have functions such as taking photos and videos. In order to meet users' demand for multifunctional electronic devices and the design requirements of electronic devices to be lightweight and miniaturized, the installation space left for camera modules in electronic devices is limited. In related technologies, camera modules with large-size image sensors are used to meet users' demand for image quality. However, camera modules with large-size image sensors are relatively large in size and weight, so the camera modules will occupy a lot of space in electronic devices, which increases the difficulty of miniaturizing electronic devices. Therefore, how to miniaturize camera modules has become a problem that needs to be solved urgently. Summary of the Invention

[0004] The embodiments of the present application provide an image sensor driving device, an optical device, a camera module, and an electronic device, which can reduce the volume of the camera module and reduce the difficulty of miniaturization of the electronic device.

[0005] The first aspect of the present application provides an image sensor drive device, comprising a fixed seat, a circuit board, and an image sensor drive assembly. The circuit board comprises a fixed portion, a flexible portion, and a movable portion. The fixed portion is connected to the fixed seat. The fixed portion is mechanically and electrically connected to the movable portion via the flexible portion. The movable portion comprises a light-transmitting through hole and a connection interface. One end of the light-transmitting through hole is a light inlet, and the other end is a light outlet facing the photosensitive surface of the image sensor. The connection interface and the light outlet are located on the same side of the movable portion and are used to mechanically and electrically connect to the image sensor. The image sensor drive assembly comprises a stationary part and a first movable part. The stationary part is connected to the fixed seat. The first movable part is connected to the movable part. The first movable part is used to interact with the stationary part to generate a driving force to drive the movable part to move relative to the fixed seat, so that the movable part drives the image sensor to move relative to the fixed seat.

[0006] During operation of the image sensor driver, the fixed portion of the circuit board connects to the electronic device's mainboard to transmit signals generated by the image sensor to the processor on the mainboard. Furthermore, the movable portion of the circuit board receives the driving force generated by the image sensor driver assembly, causing the image sensor to move relative to the fixed base to achieve optical image stabilization.

[0007] Because the connection interface and light outlet are located on the same side of the movable portion, the photosensitive side of the image sensor is mechanically and electrically connected to the connection interface of the movable portion via a flip-chip mount. This reduces the size of the camera module perpendicular to the optical axis of the image sensor, further reducing the size of the camera module for miniaturization. Furthermore, the image sensor drive assembly generates a driving force that drives the movable portion to move the image sensor relative to the fixed base, enabling optical image stabilization. Therefore, the requirement for optical image stabilization can be met while reducing the size of the camera module.

[0008] In addition, since the image sensor is directly connected to the circuit board, there is no need to connect it to the circuit board through transition structures such as organic substrates and ceramic substrates, which reduces the number of components and assembly times of the camera module and can reduce the cost of the camera module.

[0009] In a possible embodiment, the movable portion is a multi-layer circuit board structure, so that the signal of the image sensor can be converted and sent to the processor of the electronic device.

[0010] In one possible embodiment, the movable portion and the flexible portion are integrally formed. This allows the movable portion and the flexible portion to be manufactured simultaneously through an integrated molding process, rather than being spliced ​​together through methods such as snap-fitting or welding. Furthermore, signal exchange and power supply are achieved through the wiring structure within the integral structure formed by the movable portion and the flexible portion, ensuring signal quality. Furthermore, the dimensions of the flexible portion and the movable portion perpendicular to the optical axis of the image sensor can be reduced, making the circuit board structure compact and conserving internal space within the image sensor driver.

[0011] In one possible embodiment, the circuit board is an integrated circuit board structure, wherein the integrated circuit board structure means that the circuit board is manufactured in one step through a circuit board manufacturing process, rather than being a combination of multiple circuit boards or a combination of a circuit board and other panels.

[0012] In this way, the integrated circuit board structure minimizes the size of the circuit board along the optical axis of the image sensor. Signal exchange between the image sensor and the processor in the electronic device, as well as powering up the image sensor driver components, can all be accomplished through the wiring structure arranged within the circuit board. Furthermore, transmitting both electrical and image signals through the wiring within the integrated circuit board structure ensures signal quality, reduces signal loss, and helps minimize external interference with the signal, thereby improving the camera module's imaging quality and efficiency.

[0013] In one possible embodiment, the image sensor driving device further includes a reinforcement plate connected to the movable portion, with the projection of the reinforcement plate along the optical axis of the image sensor not overlapping the light-transmitting hole. This improves the rigidity and / or flatness of the movable portion, ensuring that the photosensitive surface of the image sensor connected to the movable portion falls within an appropriate range, thereby ensuring image quality of the camera module.

[0014] In one possible implementation, a reinforcing plate is positioned on the side of the movable portion facing away from the connection interface. Along the optical axis of the image sensor, the reinforcing plate covers the overlapping area between the image sensor and the movable portion. This reinforcing plate can improve the flatness of the area on the movable portion that mechanically and electrically connects to the image sensor.

[0015] In a possible implementation, the movable portion contacts the fixing seat, so that the dimensions of the circuit board and the fixing seat in the optical axis direction of the image sensor can be reduced, which helps to miniaturize the camera module.

[0016] In a possible implementation, the movable portion is in rolling contact with the fixed seat, which can reduce the resistance of the movable portion to movement relative to the fixed seat, thereby reducing the power consumption of moving the movable portion.

[0017] In a possible embodiment, the image sensor driving device further includes a movable bracket and a ball bearing, wherein the movable bracket is connected to the movable portion, and the movable bracket is in rolling contact with the fixed seat via the ball bearing, thereby achieving rolling contact between the movable portion and the fixed seat.

[0018] In one possible embodiment, the contact point between the movable portion and the fixed base is located on the side of the movable portion facing away from the image sensor. This allows the space on the side of the circuit board facing away from the image sensor to accommodate the contact structure between the movable portion and the fixed base. This avoids increasing the size of the image sensor driver device along the optical axis of the image sensor, thereby contributing to miniaturization of the image sensor driver device.

[0019] In one possible embodiment, the image sensor drive device further includes a retaining structure configured to maintain contact between the movable portion and the fixed base. This ensures that the movable portion and the fixed base are in constant contact, ensuring that the image sensor does not move in the direction of the optical axis during movement, improving the smoothness of the image sensor's movement, and confining the image sensor's movement path to a stable plane. This prevents axial vibration or tilting of the image sensor during movement, thereby ensuring the quality and stability of the image data generated by the image sensor's movement. Furthermore, since the image sensor does not move in the direction of the optical axis, there is no need for a sensor to detect its position in the optical axis, thus reducing the cost of the image sensor drive device.

[0020] In one possible embodiment, the fixed portion and the flexible portion form a retaining structure. Because the flexible portion is elastic, the elastic force of the flexible portion acts on the movable portion to generate a retaining force, which ensures that the movable portion and the fixed base are in constant contact. Furthermore, utilizing the elastic force of the movable portion as a retaining force eliminates the need for additional retaining structures. This allows for enhanced retaining force while ensuring relative movement of the movable portion relative to the fixed portion, thereby facilitating miniaturization of the image sensor driver device.

[0021] In one possible embodiment, the image sensor driving device further includes a magnetic member and a magnetic attraction member, which together form a retaining structure. One of the magnetic member and the magnetic attraction member is disposed on the movable portion, and the other is disposed on the fixed base. In this manner, the magnetic attraction between the magnetic member and the magnetic attraction member acts as a retaining force, ensuring that the movable portion and the fixed base remain in contact at all times.

[0022] In one possible embodiment, the image sensor drive device further includes a movable bracket, wherein a first movable member is fixedly connected to the movable portion via the movable bracket. When the image sensor drive assembly generates driving force, the movable bracket drives the movable portion to move relative to the fixed base. In this solution, the movable bracket secures the first movable member to the movable portion, and the image sensor drive assembly can simultaneously drive the movable portion and the image sensor relative to the fixed base via the movable bracket. Furthermore, the movable bracket can also improve the rigidity and / or flatness of the movable portion, thereby also reinforcing the flatness and / or rigidity of the movable portion.

[0023] In one possible embodiment, the movable bracket and the movable portion are integrally formed. This allows the circuit board and the movable portion to be manufactured in an integrated manner, which helps reduce the dimensions of the movable portion and the movable bracket along the optical axis of the image sensor, making the image sensor driving device more compact.

[0024] In a possible embodiment, the movable bracket is further used to contact the fixed seat so that the fixed seat contacts the movable part. In this way, indirect contact between the movable part and the fixed seat can be achieved, which helps to reduce the difficulty of contact between the movable part and the fixed seat.

[0025] In one possible embodiment, the mounting base includes a mounting platform and a mounting frame. The mounting frame is connected to the edge of the mounting platform and defines a storage space with an opening. The opening is used to allow incident light to enter the storage space. The storage space is used to accommodate the image sensor driver assembly, the movable portion, and the image sensor. The mounting platform is spaced apart from the image sensor along the optical axis of the image sensor. This prevents the image sensor from contacting the mounting platform during movement, thereby preventing damage to the image sensor.

[0026] In one possible embodiment, the image sensor driver further includes an optical element. The optical element is disposed within the mounting base and connected to the side of the movable portion facing away from the image sensor. The optical element covers the light inlet. The optical element is connected to the movable portion, or the optical element is used to connect to the reinforcement plate. Integrating the optical element within the image sensor driver improves the internal space utilization of the mounting base, contributing to the miniaturization of the camera module.

[0027] In a possible implementation, the optical element is a filter.

[0028] A second aspect of the present application provides an optical device, comprising an image sensor and an image sensor driving device as described in any one of the first aspects, wherein the photosensitive surface of the image sensor covers the light outlet, and the connection interface between the image sensor and the movable part is mechanically and electrically connected.

[0029] In one possible embodiment, the optical device further includes a fan-out base, through which the image sensor is mechanically and electrically connected to the connection interface of the movable portion. By utilizing fan-out technology to rewire the conventional image sensor and then mechanically and electrically connecting it to the movable portion via the fan-out base, the connection area between the image sensor and the movable portion can be increased, thereby reducing the difficulty of connecting the movable portion and the image sensor.

[0030] In one possible embodiment, the optical device further includes a lens driving device, which is used to drive the lens assembly to move along the optical axis direction of the image sensor, and the image sensor driving device is used to drive the image sensor to move on a plane perpendicular to the optical axis direction of the image sensor, wherein: the lens driving device is arranged outside the fixing seat and connected to the fixing seat, or the lens driving device is arranged inside the fixing seat.

[0031] When the lens driving device is disposed outside the fixing seat, the lens driving device and the image sensor driving device are two independent module structures. The image sensor driving device can cooperate with different types of lens driving devices to form different driving schemes.

[0032] When the lens driving device is located inside the fixing seat, the number of parts of the optical device can be reduced, the compactness of the optical device can be improved, and the miniaturization of the optical device can be facilitated.

[0033] In one possible embodiment, the optical device further includes a second movable member disposed within the fixed base. The second movable member and the stationary member constitute a lens drive device disposed within the fixed base. This can reduce the number of components in the optical device, making the camera module more compact and reducing costs.

[0034] A third aspect of the present application provides an optical device, comprising a lens driving device and an image sensor driving device as described in any one of the first aspects, wherein the lens driving device is arranged outside a fixing seat of the image sensor driving device and connected to the fixing seat, the lens driving device is used to drive the lens assembly to move along the optical axis direction of the image sensor, and the image sensor driving device is used to drive the image sensor to move on a plane perpendicular to the optical axis direction of the image sensor.

[0035] A fourth aspect of the present application provides a camera module, comprising a lens driving device, a lens assembly, an image sensor, and an image sensor driving device as described in any one of the first aspects. The image sensor is arranged inside the image sensor driving device and is mechanically and electrically connected to a connection interface on a movable part of the image sensor driving device, and the photosensitive surface of the image sensor covers the light outlet of the movable part. The light outlet end of the lens assembly faces the light inlet of the movable part. The lens driving device is used to drive the lens assembly to move along the optical axis direction of the image sensor. The image sensor driving device is used to drive the image sensor to move on a plane perpendicular to the optical axis direction of the image sensor.

[0036] A fifth aspect of the present application provides an electronic device, comprising a mainboard and a camera module as in the fourth aspect, wherein the camera module is electrically connected to the mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] FIG1 is a cross-sectional view of a camera module in the related art;

[0038] FIG2 is a schematic structural diagram of an electronic device provided by an embodiment of the present application at a first viewing angle;

[0039] FIG3 is a schematic structural diagram of the electronic device in FIG2 at a second viewing angle;

[0040] FIG4 is a schematic diagram of the three-dimensional structure of a first camera module provided in an embodiment of the present application;

[0041] FIG5 is an exploded schematic diagram of the camera module in FIG4 at a first viewing angle;

[0042] FIG6 is a schematic diagram of an explosion of the camera module in FIG4 at a second viewing angle;

[0043] FIG7A is a schematic cross-sectional view of the camera module in FIG4 ;

[0044] FIG7B is a schematic diagram of the architecture of the camera module in FIG4 ;

[0045] FIG8 is a schematic diagram of the three-dimensional structure of the camera module in FIG4 without the lens driving device;

[0046] FIG9 is an exploded schematic diagram of the camera module in FIG4 with the lens driving device removed from the camera module at a first viewing angle;

[0047] FIG10 is a first cross-sectional schematic diagram of the camera module in FIG4 with the lens driving device removed;

[0048] FIG11 is a schematic diagram of the three-dimensional structure of the circuit board in FIG10;

[0049] FIG12 is an exploded schematic diagram of the camera module in FIG4 at a second viewing angle when the lens driving device is removed;

[0050] FIG13 is a schematic assembly diagram of the camera module in FIG4 without the lens driving device;

[0051] FIG14 is a cross-sectional schematic diagram of a camera module of a second architecture provided in an embodiment of the present application;

[0052] FIG15 is a cross-sectional schematic diagram of a camera module of a third architecture provided in an embodiment of the present application;

[0053] FIG16 is a cross-sectional schematic diagram of a camera module of the fourth architecture provided in an embodiment of the present application.

[0054] DESCRIPTION OF NUMERALS AND SIGNS: 100, image sensor driving device; 110, fixing seat; 111, fixing platform; 1111, inner platform; 1112, outer platform; 112, fixing frame; 1121, side frame; 1122, top plate; 113, storage space; 114, opening; 120, circuit board; 121, fixing portion; 122, flexible portion; 1221, annular body; 1222, first branch; 1223, second branch; 123, movable portion; 124, light-transmitting through hole; 1241, light inlet; 1242, light outlet; 125, connection interface; 130, image sensor driving assembly; 131, stationary member; 132, first movable member; 140, reinforcement plate; 141, light-inlet through hole; 150. Movable bracket; 160. Ball bearing; 170. Optical element; 180. Stop structure; 200. Image sensor; 300. Lens driving device; 310. Second movable part; 320. Fixing part; 330. Housing; 340. Lens driving assembly; 400. Lens assembly; 500. Adhesive; 1. Electronic device; 2. Optical device; 3. Camera module; 4. Fan-out seat; 101. Housing; 1011. Frame; 1012. Back cover; 1013. Rear camera hole; 1014. Flash hole; 102. Display screen; 1021. Front camera hole; 103. Front camera assembly; 104. Rear camera assembly; 1041. Flash module; 105. Mainboard; 106. Processor; 107. Memory; 108. Battery. DETAILED DESCRIPTION

[0055] FIG1 is a cross-sectional view of a camera module in the related art. In the related art, as shown in FIG1 , the camera module includes an image sensor 201, a substrate 202, a filter 203, a support base 204, leads 205, a housing 206, a reinforcement plate 207, a lens 208, a first drive unit 301, and a second drive unit 302. The substrate 202 has a receiving opening, and the image sensor 201 is mounted inside the receiving opening and electrically connected to the top surface of the substrate 202 via the leads 205. The filter 203 is mounted on the top surface of the substrate 202 via the support base 204, and the filter 203 covers the light incident surface of the image sensor 201. The reinforcement plate 207 is connected to the bottom surface of the substrate 202. The first drive unit 301 includes a first fixed member 3011 and a first movable member 3012. The first fixed member 3011 and the first movable member 3012 interact to generate a first driving force, which is used to drive the substrate 202 to move perpendicular to the optical axis of the lens 208, thereby achieving optical image stabilization (OIS). The second drive unit 302 includes a second fixed member 3021 and a second movable member 3022. The second fixed member 3021 and the second movable member 3022 interact to generate a second driving force, which is used to drive the lens 208 to move along its optical axis, thereby achieving automatic focus (AF).

[0056] However, as users' demands for image quality continue to grow, large-scale image sensors 201 are required to meet these demands. This, in turn, results in the camera module becoming larger and heavier, occupying more and more space within electronic devices, further increasing the difficulty of making electronic devices thinner and more compact. Furthermore, the required size of leads 205 and the thickness of support base 204 both limit the miniaturization of the camera module, further increasing the difficulty of miniaturization. Furthermore, the large number of components supported by substrate 202 increases the power consumption required to move substrate 202, which can reduce optical image stabilization performance.

[0057] In view of this, embodiments of the present application provide an image sensor driver, optical device, camera module, and electronic device that can reduce the size of the camera module, reduce the space required for its placement, and reduce the difficulty of making electronic devices thinner and more compact. Furthermore, they can improve optical image stabilization performance and reduce power consumption.

[0058] Electronic devices may include mobile phones, tablets, laptops, televisions, in-vehicle devices, wearable devices, video surveillance equipment, and other electronic products. Wearable devices may include smart bracelets, smart watches, wireless headphones, augmented reality (AR) glasses, augmented reality helmets, virtual reality (VR) glasses, and VR helmets. The present application embodiments illustrate the electronic device as a mobile phone.

[0059] FIG2 is a schematic structural diagram of an electronic device provided in an embodiment of the present application at a first viewing angle, and FIG3 is a schematic structural diagram of the electronic device in FIG2 at a second viewing angle.

[0060] 2 and 3 , the electronic device 1 includes a housing 101, a display screen 102, a front camera assembly 103, a rear camera assembly 104, a mainboard 105, a processor 106, a memory 107, and a battery 108. The display screen 102 is used to display images, and the display screen 102 may also have an integrated touch function. The display screen 102 is mounted on the housing 101. The housing 101 may include a frame 1011 and a back cover 1012. The display screen 102 and the back cover 1012 are respectively mounted on opposite sides of the frame 1011. In some implementations, in the external space of the electronic device 1, the space facing the display screen 102 is defined as the front of the electronic device 1, and the space facing the back cover 1012 is defined as the rear of the electronic device 1.

[0061] In some implementations, the front camera assembly 103 is located inside the housing 101 and below the display screen 102. As shown in FIG2 , the display screen 102 is provided with a front camera aperture 1021, through which the front camera assembly 103 captures light in front of the electronic device 1 to enable photography. The front camera assembly 103 may include the camera module 3 described in the possible implementations below, or may include a camera module 3 having other structures.

[0062] In some implementations, as shown in FIG3 , the back cover 1012 is provided with at least one rear camera hole 1013 . The rear camera assembly 104 is located inside the housing 101 , and the rear camera assembly 104 collects light from the rear of the electronic device 1 through the at least one rear camera hole 1013 to achieve photography. In the embodiment of the present application, “at least one” includes both one and multiple, multiple means more than two, and “more than” includes the number itself. The rear camera assembly 104 includes at least one camera module 3 , which may include, for example, one or more of a standard camera module, a telephoto camera module, a wide-angle camera module, an ultra-telephoto camera module, and an ultra-wide-angle camera module. Exemplarily, the rear camera assembly 104 includes a standard camera, a wide-angle camera, and a periscope telephoto camera. The camera module 3 of the rear camera assembly 104 may include the camera module 3 described in the possible implementations below, or may include a camera module 3 of other structures.

[0063] In some implementations, as shown in FIG3 , the rear camera assembly 104 may further include a flash module 1041. The rear cover 1012 is provided with a flash hole 1014. The flash module 1041 is located inside the housing 101 and emits light through the flash hole 1014.

[0064] In some implementations, as shown in FIG2 , a motherboard 105 is located inside the housing 101, and a processor 106 and a memory 107 are secured to the motherboard 105. The display screen 102, the front camera assembly 103, and the rear camera assembly 104 are coupled to the processor 106. The memory 107 is configured to store computer program code. Computer program code includes computer instructions. The processor 106 is configured to invoke computer instructions to cause the electronic device 1 to perform corresponding operations, such as causing the display screen 102 to display a target image, causing the front camera assembly 103 and the rear camera assembly 104 to capture a target image, and so on.

[0065] In some implementations, the battery 108 is electrically connected to the mainboard 105 for powering the electronic device 1 .

[0066] In some possible implementations, the embodiments of the present application also provide a camera module 3, which can be the front camera component 103 or the rear camera component 104 in the implementations shown in Figures 2 and 3. The camera module 3 is electrically connected to the processor 106 in the electronic device 1. Specifically, the processor 106 is electrically connected to the image sensor 200 in the camera module 3 and can process the image signal output by the image sensor 200.

[0067] Figure 4 is a schematic diagram of the three-dimensional structure of the first camera module provided in an embodiment of the present application, Figure 5 is an exploded schematic diagram of the camera module in Figure 4 at a first viewing angle, and Figure 6 is an exploded schematic diagram of the camera module in Figure 4 at a second viewing angle.

[0068] As shown in Figures 4 to 6 , the camera module 3 may include an image sensor driving device 100, an image sensor 200, a lens driving device 300, and a lens assembly 400. The image sensor driving device 100 is used to drive the image sensor 200 to move to achieve optical image stabilization. The lens driving device 300 is used to drive the lens assembly 400 to move to achieve optical focus, optical image stabilization, and aberration adjustment.

[0069] In some implementations, the image sensor 200 can move on a reference plane, which can be coplanar or parallel to the photosensitive surface of the image sensor 200. The reference plane can be a plane perpendicular to the extension direction of the optical axis. The optical axis can be understood as the optical axis of the image sensor 200, the optical axis of the lens assembly 400, or the optical axis of the camera module 3. In the camera module 3, the optical axis of the lens assembly 400 and the optical axis of the image sensor 200 can theoretically coincide. In the case of assembly errors or design tolerances, the optical axis of the lens assembly 400 and the optical axis of the image sensor 200 can also be relatively offset or tilted. However, regardless of whether they coincide or have an offset or tilt, the extension direction of the optical axis of the lens assembly 400 and the optical axis of the image sensor 200 is consistent (consistent extension direction can be understood as substantially the same direction, allowing for a small range of relative tilt), and can both be considered the optical axis of the camera module 3.

[0070] FIG7A is a schematic cross-sectional view of the camera module in FIG4 , and FIG7B is a schematic structural view of the camera module in FIG4 .

[0071] As shown in FIG7A , the image sensor driver device 100 includes a mounting base 110, a circuit board 120, and an image sensor driver assembly 130. The mounting base 110 is used to support the circuit board 120 and the stationary member 131 of the image sensor driver assembly 130. The circuit board 120 is disposed on the photosensitive side of the image sensor 200 and is mechanically and electrically connected to the image sensor 200. The circuit board 120 is electrically connected to the processor 106 on the mainboard 105 within the electronic device 1 to transmit signals collected by the image sensor 200 to the processor 106. The image sensor driver assembly 130 is used to drive the image sensor 200 to achieve optical image stabilization.

[0072] Among them, mechanical connection refers to the connection relationship in structural form, which can include direct connection or indirect connection. Direct connection can also be an integrated structure, for example, the connection between two parts of an integrated circuit board structure can be understood as a direct connection. Indirect connection refers to connection through other connection structures, such as connecting two board structures through solder balls. Electrical connection refers to the connection of signal traces, which can transmit image signals, electrical signals or other signals through electrical connections, such as electrical connection through traces within a circuit board or electrical connection through a flexible printed circuit (FPC), etc.

[0073] As shown in FIG7B , along the optical axis Z of the image sensor 200, the photosensitive surface of the image sensor 200 faces the back of the circuit board 120, and the front of the circuit board 120 faces the lens assembly 400, with the front and back of the circuit board 120 facing each other. Thus, it can be seen that the image sensor 200 is mechanically and electrically connected to the circuit board 120 via a flip-chip mounting arrangement. Thus, compared to the prior art shown in FIG1 , while the total track length (TTL) of the lens assembly 400 remains unchanged, the reinforcement plate 207 below the image sensor 201 in FIG1 can be removed, thereby reducing the size of the camera module 3 along the optical axis Z of the image sensor 200, thereby facilitating miniaturization of the camera module 3.

[0074] As shown in Figure 7B, the image sensor 200 is mechanically and electrically connected to the circuit board 120 in a flip-chip manner, so that the image sensor 200 does not need to be electrically connected to the circuit board 120 through the leads in the prior art, thereby reducing the size of the circuit board 120 in a direction perpendicular to the optical axis direction Z of the image sensor 200, and further reducing the size of the camera module 3 in a direction perpendicular to the optical axis direction Z of the image sensor 200, which helps to miniaturize the camera module 3.

[0075] Furthermore, the image sensor 200 is electrically connected to the circuit board 120, eliminating the need for conventional transition structures such as organic substrates or ceramic substrates to electrically connect the image sensor 200 to the circuit board 120. This reduces the number of components in the camera module 3, reduces the number of assembly steps required for the camera module 3, and improves the production efficiency of the camera module 3. By eliminating expensive transition structures such as organic substrates or ceramic substrates and utilizing the circuit board 120 for direct electrical connection to the image sensor 200, the cost of the camera module 3 can be significantly reduced.

[0076] In the embodiment of the present application, the image sensor driving assembly 130 serves as the power source of the image sensor driving device 100, and is used to generate a driving force that can drive the image sensor 200 to move relative to the fixed base 110 via the movable portion 123 of the circuit board 120. As shown in FIG7A , the image sensor driving assembly 130 includes a relatively movable stationary member 131 and a first movable member 132. The stationary member 131 is connected to the fixed base 110 (as shown in FIG10 ), and the first movable member 132 is connected to the movable portion 123 of the circuit board 120 via a movable bracket 150. The first movable member 132 is used to interact with the stationary member 131 to generate a driving force that drives the movable portion 123 to move relative to the fixed base 110. During the driving process of the image sensor driving assembly 130, the movable portion 123 drives the movable bracket 150 and the image sensor 200 to move relative to the fixed base 110, thereby achieving optical image stabilization.

[0077] As shown in FIG7A , the first movable member 132 is connected to the movable portion 123 of the circuit board 120 via the movable bracket 150. However, in some implementations, the first movable member 132 may be directly connected to the movable portion 213 of the circuit board 120. In other words, the first movable member 132 is connected to the movable portion 123 without passing through the movable bracket 150. Therefore, the first movable member 132 and the movable portion 123 of the circuit board 120 may be directly or indirectly connected.

[0078] As shown in FIG7A , in addition to supporting the image sensor 200 and the movable bracket 150, the circuit board 120 may also, in some implementations, support other components, such as an optical element 170 or electronic components such as resistors and capacitors. These electronic components may be located on the side of the circuit board 120 facing away from the image sensor 200, or on the side of the circuit board 120 facing the image sensor 200.

[0079] In some implementations, the circuit board 120 may also be electrically connected to the image sensor driver assembly 130 to control the image sensor driver assembly 130 to generate a driving force to drive the image sensor 200. The circuit board 120 and the image sensor driver assembly 130 may be electrically connected directly or indirectly.

[0080] Figure 8 is a schematic diagram of the three-dimensional structure of the camera module in Figure 4 without the lens driving device, Figure 9 is an exploded schematic diagram of the camera module in Figure 4 at a first perspective when the lens driving device is removed, Figure 10 is a first cross-sectional schematic diagram of the camera module in Figure 4 without the lens driving device, and Figure 11 is a schematic diagram of the three-dimensional structure of the circuit board in Figure 10.

[0081] As shown in Figure 11, the circuit board 120 includes a fixed portion 121, a flexible portion 122 and a movable portion 123. Among them, the fixed portion 121 is connected to the fixing seat 110 (as shown in Figure 10), and the fixed portion 121 is mechanically and electrically connected to the movable portion 123 through the flexible portion 122. The movable portion 123 is mechanically and electrically connected to the image sensor 200 (as shown in Figure 7 or Figure 10), thereby realizing the mechanical and electrical connection between the circuit board 120 and the image sensor 200. The movable portion 123 is arranged on the photosensitive side of the image sensor 200 (as shown in Figure 10), so that the image sensor 200 is mounted on the circuit board 120 in a flip-chip manner, thereby achieving the purpose of reducing the volume of the camera module 3.

[0082] As shown in Figure 10, after the first movable member 132 interacts with the stationary member 131 to generate a driving force, the first movable member 132 moves relative to the fixed base 110 under the action of the driving force, driving the movable portion 123 to move relative to the fixed base 110. Then, the movable portion 123 drives the image sensor 200 to move relative to the fixed base 110. During this process, the position of the fixed portion 121 remains unchanged, while the flexible portion 122 undergoes elastic deformation, ensuring that the movable portion 123 can move relative to the fixed portion 121, thereby achieving the purpose of moving the image sensor 200.

[0083] In the embodiment of the present application, as shown in FIG11 , the movable portion 123 is provided with a light-transmitting through hole 124 that passes through the movable portion 123. One end of the light-transmitting through hole 124 is a light inlet 1241 (as shown in FIG7B ) for receiving incident light passing through the lens assembly 400. The other end of the light-transmitting through hole 124 is a light outlet 1242 (as shown in FIG7B ) for directing the incident light from the interior of the light-transmitting through hole 124 to the photosensitive surface of the image sensor 200. The light inlet 1241 and the light outlet 1242 are arranged opposite each other in the axial direction of the light-transmitting through hole 124. Along the axial direction of the light-transmitting through hole 124, the photosensitive surface of the image sensor 200 covers the light outlet 1242 (as shown in FIG7A or FIG10 ). In this way, the photosensitive surface of the image sensor 200 can receive the incident light passing through the light outlet 1242 to output an image signal.

[0084] 7B , the movable portion 123 is provided with a connection interface 125 for mechanically and electrically connecting to the image sensor 200. In some implementations, the movable portion 123 may also be electrically connected to the image sensor 200 via the connection interface 125.

[0085] The connection interface 125 can be understood as a structure on the movable portion 123 for mechanical and electrical connection with the image sensor 200. The specific structure of the connection interface 125 is not limited herein. For example, when the image sensor 200 and the movable portion 123 are not connected, the connection interface 125 can be an exposed metal structure.

[0086] There are no limitations on how the connection interface 125 of the movable portion 123 is mechanically and electrically connected to the image sensor 200. In some possible implementations, the connection interface 125 can be mechanically and electrically connected to the image sensor 200 by soldering. Specifically, solder balls are disposed between the connection interface 125 and the image sensor 200. In other implementations, the connection interface 125 can also be mechanically and electrically connected to the image sensor 200 by bonding with conductive silver glue. Specifically, conductive silver glue is disposed between the connection interface 125 and the image sensor 200 and connected to the connection interface 125 and the image sensor 200, respectively.

[0087] In some possible implementations, in order to further improve the strength of the mechanical connection between the image sensor 200 and the movable part 123, the camera module 3 may also include an adhesive layer (not shown in the figure), which is arranged between the movable part 123 and the image sensor 200 and is bonded to the movable part 123 and the image sensor 200 respectively.

[0088] In the embodiment of the present application, the movable portion 123 is a multi-layer circuit board structure capable of signal conversion, thereby transmitting the signals generated by the image sensor 200 to the processor. In some implementations, the movable portion 123 may have a four-layer circuit board structure. In still other implementations, the movable portion 123 may have a six-layer circuit board structure. Of course, the movable portion 123 may also have a multi-layer circuit board structure with more or fewer layers than four or six.

[0089] In some possible implementations, the movable portion 123 and the flexible portion 122 are integrally structured and can be manufactured by integral molding, which helps to reduce the difficulty of connecting the movable portion 123 and the flexible portion 122. In addition, the wiring electrically connecting the flexible portion 122 and the movable portion 123 can be arranged inside the movable portion 123, without occupying the surface structure of the movable portion 123.

[0090] In some possible implementations, the circuit board 120 is an integrated circuit board structure, where the movable portion 123, the flexible portion 122, and the fixed portion 121 are integrally formed, with the periphery of the fixed portion 121 being electrically connected to the processor 106 in the electronic device 1. The integrated molding process of the circuit board 120 simplifies the manufacturing process, facilitates assembly, and improves structural stability, ensuring stable signal transmission and reducing signal loss. Furthermore, the integrated molding of the circuit board 120 can save space in the image sensor driver device 100 in the thickness direction, facilitating the design of a compact image sensor driver device 100 along the optical axis Z of the image sensor 200.

[0091] As shown in FIG10 , a portion of the fixing portion 121 is disposed outside the fixing base 110 , such that the fixing portion 121 can be electrically connected to the processor 106 within the electronic device 1 to transmit signals collected by the image sensor 200 to the processor 106. In some implementations, the fixing portion 121 can also be electrically connected to the processor 106 via a connector (not shown), which is used to electrically connect to the processor 106 in the electronic device 1 to transmit signals from the image sensor 200 to the processor 106. Exemplarily, the connector can be a flexible printed circuit board.

[0092] There is no specific limitation on how the fixing portion 121 is connected to the fixing base 110. In some implementations, as shown in FIG7A and FIG10 , the fixing base 110 includes a fixing platform 111 and a fixing frame 112. The fixing portion 121 can be connected between the fixing platform 111 and the fixing frame 112. Specifically, the fixing portion 121 is disposed between the outer platform 1112 and the side frame 1121 of the fixing platform 111. In some implementations, the fixing portion 121 can also be connected to the fixing frame 112, with the fixing portion 121 and the fixing platform 111 separated by at least a portion of the fixing frame 112.

[0093] While the image sensor driver assembly 130 drives the movable portion 123 to move, the fixed portion 121 remains in place, while the flexible portion 122 undergoes elastic deformation, ensuring that the first movable member 132 drives the movable portion 123 to move relative to the fixed base 110. Mechanically, the flexible portion 122 acts as an elastic structure, such as a spring or shrapnel, ensuring that the movable portion 123 can move relative to the fixed portion 121. Furthermore, electrically, the flexible portion 122 acts as a wiring structure for transmitting signals and current, establishing electrical connection between the movable portion 123 and the fixed portion 121.

[0094] As shown in Figure 11, the flexible portion 122 is a ring structure. The flexible portion 122 is arranged in the enclosed space surrounded by the movable portion 123 and the fixed portion 121. The opposite first end and second end of the flexible portion 122 are respectively connected to the movable portion 123, and the opposite third end and fourth end of the flexible portion 122 are respectively connected to the fixed portion 121.

[0095] The specific structure of the flexible portion 122 is not limited herein. In some implementations, the flexible portion 122 may include an annular body 1221, two first branches 1222, and two second branches 1223. The two first branches 1222 are disposed on the inner side of the annular body 1221 and are arranged opposite each other. The two first branches 1222 are respectively connected to the movable portion 123. The two second branches 1223 are disposed on the outer side of the annular body 1221 and are arranged opposite each other. The two second branches 1223 are respectively connected to the fixed portion 121.

[0096] In some possible implementations, in order to achieve mechanical and electrical connection between the fixed portion 121 and the movable portion 123, the flexible portion 122 may include a wire layer (not shown in the figure), an insulating layer (not shown in the figure), and a metal layer (not shown in the figure). The wire layer is used to set the wiring to achieve electrical connection between the movable portion 123 and the fixed portion 121. The metal layer may be a metal flexure structure, which is used to provide elastic deformation of the flexible portion 122. The presence of the metal layer ensures the flexibility and strength of the flexible portion 122, and enhances the elastic deformation capability of the flexible portion 122. The wire layer and the metal layer may be isolated by an insulating layer, which may specifically be a polyamide insulating material.

[0097] The fixing base 110 can serve as a mounting carrier and can also protect the image sensor driver assembly 130 and the circuit board 120. For example, as shown in FIG10 , the movable portion 123 of the image sensor driver assembly 130 and the circuit board 120 is disposed within the fixing base 110 and cannot be seen because it is obscured by the fixing base 110. In addition, the fixing base 110 can also serve as a structure for connecting the image sensor driver device 100 to other devices. For example, the image sensor driver device 100 can be connected to the middle frame of the electronic device 1 through the fixing base 110 to secure the image sensor driver device 100.

[0098] As can be seen from Figures 8 to 10, the fixing seat 110 includes a fixing platform 111 and a fixing frame 112. As shown in Figure 10, the fixing frame 112 is connected to the edge of the fixing platform 111, and the fixing frame 112 and the fixing platform 111 form a storage space 113 with an opening 114. The opening 114 is used to allow incident light passing through the lens assembly 400 to enter the storage space 113 and be collected by the image sensor 200, or it can also be used to install or accommodate an optical element 170 (such as an optical lens). The storage space 113 is used to accommodate at least part of the image sensor drive assembly 130, the image sensor 200 and the circuit board 120. For example, as shown in Figure 7A, the image sensor 200, the image sensor drive assembly 130 and the movable part 123 of the circuit board 120 are arranged inside the storage space 113.

[0099] As shown in FIG10 , the image sensor 200 is disposed within the storage space 113, and is disposed between the circuit board 120 and the fixed platform 111. Along the optical axis Z of the lens assembly 400, the image sensor 200 is spaced apart from the fixed platform 111. This prevents the image sensor 200 from contacting the fixed platform 111 and being damaged during movement relative to the fixing base 110.

[0100] As shown in FIG9 , the fixed frame 112 may include side frames 1121 and a top plate 1122. The top plate 1122 is disposed opposite the fixed platform 111 and surrounds the opening 114. As shown in FIG8 , the side frames 1121 are connected between the top plate 1122 and the fixed platform 111. Together, the side frames 1121, the top plate 1122, and the fixed platform 111 form a storage space 113.

[0101] In some implementations, the fixing frame 112 may be an integrally formed structure. For example, the top plate 1122 and the side frame 1121 may be formed into an integral structure through a double-injection molding process.

[0102] As shown in Figure 9, the fixing platform 111 includes an inner platform 1111 and an outer platform 1112. The outer platform 1112 is provided with a mounting opening that connects the interior and exterior of the fixing base 110. The image sensor 200 can be flip-mounted onto the circuit board 120 through the mounting opening (e.g., A in the figure). The inner platform 1111 is fixedly connected to the outer platform 1112 and seals the mounting opening. The fixing frame 112 is connected to the edge of the outer platform 1112.

[0103] The mounting opening may be a circular through hole, a square through hole, etc. In addition, the size of the mounting opening is larger than the size of the image sensor 200. On the one hand, this ensures that the image sensor 200 is placed inside the fixing base 110 through the mounting opening to achieve mechanical and electrical connection between the image sensor 200 and the connection interface 125. On the other hand, it provides an operating space for achieving mechanical and / or electrical connection of the image sensor 200. For example, when the image sensor 200 is mechanically and electrically connected to the circuit board 120 by welding, it provides a welding space for welding operations.

[0104] There is no specific limitation on the specific material of the fixing platform 111. In some implementations, the fixing platform 111 can be made of a metal material. In other implementations, the fixing platform 111 can also be made of a non-metallic material.

[0105] In some possible implementations, the contact between the fixed base 110 and the movable portion 123 can improve the smoothness of the movement of the image sensor 200, limit the movement path of the image sensor 200 to a fixed (stable) plane (e.g., a plane perpendicular to the optical axis direction Z of the image sensor 200), and prevent the image sensor 200 from vibrating or tilting along the optical axis direction Z of the image sensor 200 during movement. In addition, when the contact interface between the movable portion 123 and the fixed base 110 is perpendicular to the optical axis direction Z of the image sensor 200, the distance between the movable portion 123 and the fixed base 110 in the optical axis direction Z of the image sensor 200 can also be reduced, thereby contributing to the miniaturization of the camera module 3.

[0106] 10 , the contact position between the movable portion 123 and the fixed base 110 may be located on the side of the movable portion 123 facing away from the image sensor 200. In other implementations, the contact position between the movable portion 123 and the fixed base 110 may also be located on the side of the movable portion 123 facing the fixed platform 111 of the fixed base 110.

[0107] FIG12 is an exploded schematic diagram of the camera module in FIG4 at a second viewing angle when the lens driving device is removed.

[0108] The movable part 123 may be in direct or indirect contact with the fixed seat 110, and there is no specific limitation here. In some implementations, the movable part 123 may be in contact with the fixed seat 110 through an intermediary. For example, as shown in FIG12 , the intermediary includes a movable bracket 150 and a ball 160, and the movable part 123 may be in contact with the fixed frame 112 of the fixed seat 110 through the movable bracket 150 and the ball 160. In other implementations, the intermediary also includes a movable bracket 150, which is connected to the movable part 123, and the movable bracket 150 is in contact with the fixed seat 110, so that the fixed seat 110 is in contact with the movable part 123 through the movable bracket 150. In some other implementations, the movable part 123 may also be in direct contact with the fixed seat 110. For example, the movable part 123 may be in contact with the fixed platform 111 of the fixed seat 110.

[0109] The movable portion 123 and the fixed seat 110 may be in sliding contact or rolling contact, which is not specifically limited here. Specifically, when the movable portion 123 and the fixed seat 110 are in indirect contact with the fixed seat 110 via an intermediate member (not shown in the figure), the intermediate member (not shown in the figure) and the fixed seat 110 are in indirect sliding contact or rolling contact. For example, as shown in FIG10 , the movable portion 123 may be in indirect rolling contact with the fixed seat 110 via the movable bracket 150.

[0110] It should be noted that when there are multiple contact positions between the movable part 123 and the fixed seat 110, the contact form at the multiple contact positions between the movable part 123 and the fixed seat 110 can be sliding contact or rolling contact, or one part can be sliding contact and the other part can be rolling contact.

[0111] There is no specific limitation on how the movable bracket 150 is brought into rolling contact with the fixed base 110. In some implementations, as shown in FIG12 , the image sensor driving device 100 may further include a ball bearing 160 disposed between the movable bracket 150 and the fixed frame 112 of the fixed base 110 (as shown in FIG10 ). The movable bracket 150 is brought into rolling contact with the fixed frame 112 via the ball bearing 160, thereby causing the movable portion 123 to be brought into rolling contact with the fixed frame 112. In other implementations, the image sensor driving device 100 may also include a roller, and the movable bracket 150 may also be brought into rolling contact with the fixed frame 112 via the roller.

[0112] As shown in Figure 12 , the movable bracket 150 is provided with a rolling groove for accommodating the ball 160. The diameter of the ball is greater than the depth of the rolling groove, ensuring that the ball extends out of the rolling groove and rolls into contact with the fixed frame 112. As shown in Figure 10 , there are three rolling grooves, arranged in a triangular pattern, which further enhances the stability of the contact between the movable bracket 150 and the fixed frame 112. Of course, the number of rolling grooves may be more or less than three.

[0113] As shown in Figure 12, a plurality of balls arranged in an array are provided in the rolling groove. In some embodiments, a single ball may also be provided in the rolling groove.

[0114] In other possible implementations, when the movable portion 123 is in sliding contact with the fixed seat 110, the contact mode between the movable portion 123 and the fixed seat 110 may include but is not limited to the following: First, the contact mode between the fixed seat 110 and the movable portion 123 is contact between a plane and a plane. Second, the contact mode between the fixed seat 110 and the movable portion 123 is contact between a plane and an array of protrusions. At the contact position between the fixed portion 121 and the movable portion 123, the structural form of one of the fixed seat 110 and the movable portion 123 is a complete plane structure, and the structural form of the other is an array of protrusions. Third, the contact mode between the fixed seat 110 and the movable portion 123 is contact between a plane and multiple protrusions. At the contact position between the fixed portion 121 and the movable portion 123, the structural form of one of the fixed seat 110 and the movable portion 123 is a complete plane structure, and the structural form of the other is a multiple protrusion structure. Fourth, the contact between the fixed base 110 and the movable portion 123 is a plane-and-protruding rib structure. At the contact point between the fixed portion 121 and the movable portion 123, one of the fixed base 110 and the movable portion 123 has a completely plane structure, while the other has a protruding rib structure. Fifth, the contact between the fixed base 110 and the movable portion 123 is a protruding rib structure and a protruding rib structure. At the contact point between the fixed portion 121 and the movable portion 123, one of the fixed base 110 and the movable portion 123 has a protruding rib structure, while the other also has a protruding rib structure.

[0115] When the movable part 123 contacts the fixed seat 110, a friction interface is formed at the contact position between the two, and the friction coefficient of the friction interface is less than 0.3. Among them, the friction interface can be the contact surface between the movable part 123 and the fixed seat 110 (that is, the friction interface is in the form of a surface). The friction interface can also be a medium between the movable part 123 and the fixed seat 110, such as lubricating oil (that is, the friction interface is in the form of grease or paste). The friction interface can also be a layer structure between the movable part 123 and the fixed seat 110, for example, a friction interface is formed between the movable part 123 and the fixed seat 110 by providing a super-slip material layer (that is, the friction interface is in the form of a three-dimensional layer structure). In summary, a low friction coefficient of sliding friction can be obtained at the friction interface by providing a solid structural layer, a grease or paste-like lubricating layer, or surface treatment. By limiting the friction coefficient between the movable portion 123 and the fixed seat 110, the present application can ensure the smoothness of the movement of the image sensor 200 on the basis of limiting the moving plane of the image sensor 200, reduce the friction resistance during the movement of the image sensor 200, and improve the efficiency of driving the image sensor 200 to move.

[0116] It should be noted that when the movable part 123 indirectly contacts the fixed seat 110 through the intermediate piece (not shown in the figure), a friction interface is formed at the contact position between the fixed seat 110 and the intermediate piece (not shown in the figure), and the friction coefficient of the friction interface is less than 0.3.

[0117] In some possible implementations, at the position of the friction interface, at least one of the movable part 123 and the fixed seat 110 includes an ultra-slip material layer (not shown in the figure), and the ultra-slip material layer is a solid structure. The friction coefficient of the friction interface is less than 0.3 achieved by the ultra-slip material layer. In some implementations, an ultra-slip material layer is provided on the surface of the movable part 123 (not shown in the figure). In other implementations, an ultra-slip material layer is provided on the surface of the fixed seat 110 (not shown in the figure). In still other implementations, an ultra-slip material layer is provided on the surfaces of both the movable part 123 and the fixed seat 110 (not shown in the figure). The combination between the ultra-slip material layer of solid structure and the movable part 123 and the fixed seat 110 is easier to achieve, for example, it can be directly connected and fixed by an adhesive layer, which has the advantage of being simple and easy in terms of assembly process.

[0118] In some possible implementations, no super-slip material layer or lubricant may be provided between the movable portion 123 and the fixed base 110. Instead, the contact surface between the movable portion 123 and the fixed base 110 is treated to achieve a friction coefficient of less than 0.3 at the friction interface. The surface treatment methods may include surface modification techniques such as polishing; surface alloying techniques such as carburizing and nitriding; and surface conversion coating (a chemical reaction between an additive and a substrate to form a conversion coating). This surface treatment method forms a friction interface without the need for a super-slip material layer or lubricant layer, thereby achieving a smaller dimension along the optical axis Z.

[0119] In other implementations, a solid ultra-smooth material layer, grease or paste-like lubricant can be used in combination in the same implementation, or a solid ultra-smooth material layer and a surface obtained by a surface treatment manufacturing process can be used in the same implementation, or a grease or paste-like lubricant and a surface obtained by a surface treatment manufacturing process can be used in the same implementation.

[0120] In some possible implementations, the image sensor driving device 100 further includes a retaining structure (not shown in the figures), which is used to generate a retaining force, so that the movable portion 123 always maintains contact with the fixed seat 110, thereby improving the smoothness of the movement of the image sensor 200 and limiting the moving path of the image sensor 200 to a fixed (stable) plane (for example, a plane perpendicular to the optical axis direction Z of the image sensor 200), thereby ensuring the quality and stability of the image data obtained by the image sensor 200.

[0121] Specifically, by bringing the movable portion 123 into contact with the fixed seat 110, and providing a retaining force on the movable portion 123, the retaining force is used to maintain the contact state between the movable portion 123 and the fixed seat 110, and the direction of the retaining force is toward the contact surface between the movable portion 123 and the fixed seat 110, so that no matter what position or environment the image sensor driving device 100 is in, the retaining force can hold the movable portion 123 in contact with the fixed seat 110. The holding force needs to be greater than the sum of the gravity of the movable part 123 and all structures carried on the movable part 123. In this way, no matter how the camera module 3 is placed, the movable part 123 can move on a fixed plane in the process of driving the image sensor 200 to move, and the smooth movement of the image sensor 200 can be achieved, preventing the image sensor 200 from tilting or producing axial movement. This axial movement refers to the direction of the optical axis. It can be understood that the plane where the contact surface between the movable part 123 and the fixed seat 110 is located is a plane perpendicular to the optical axis. The lens driving device 300 provided in this application can drive the image sensor 200 to move on a plane perpendicular to the optical axis.

[0122] There is no limitation on the specific structure of the holding structure. In some implementations, the holding structure can be composed of a flexible portion 122 and a fixed portion 121, wherein the flexible portion 122 is connected to the movable portion 123, and the fixed portion 121 is fixedly connected to the fixed seat 110. The flexible portion 122 is an elastic structure, and the elastic force of the flexible portion 122 acts on the movable portion 123 to form a holding force. In this way, the elastic force of the flexible portion 122 is used as a holding force to ensure contact between the movable portion 123 and the fixed seat 110. The flexible portion 122 can not only ensure that the movable portion 123 moves under the driving force of the image sensor driving component 130, but also has the function of providing a holding force. The dual-function design of the flexible portion 122 is conducive to the miniaturization of the image sensor driving device 100.

[0123] In other implementations, the image sensor driving device 100 further includes a magnetic member (not shown) fixed to the movable portion 123 , and a portion of the fixing base 110 and the magnetic member form a retaining structure, and a retaining force is formed by the magnetic attraction between the magnetic member and the fixing base 110 .

[0124] The specific structure of the magnetic member is not limited here. In some implementations, the magnetic member may include a plurality of magnets in a point-like structure. In other implementations, the magnetic member may also include a plurality of magnetic strips in a strip-like structure.

[0125] In some other implementations, the retaining structure may also include a magnetic member (not shown in the figure) and a magnetic attraction member (not shown in the figure), one of the movable part 123 and the fixed seat 110 is provided with a magnetic member, and the other is provided with a magnetic attraction member, and the retaining force is formed by the magnetic attraction force between the magnetic member and the magnetic attraction member.

[0126] In some other implementations, the image sensor driving device 100 may further include an elastic member (not shown in the figure). The elastic member is arranged between the movable portion 123 and the fixed platform 111 and is respectively connected to the movable portion 123 and the fixed platform 111, or the elastic member may also be arranged between the movable portion 123 and the fixed frame 112 and is respectively connected to the movable portion 123 and the fixed frame 112. The elastic member is used to constitute at least a portion of the retaining structure. In the assembled state, the elastic member is in an elastically compressed state, and the elastic member applies an elastic force to the movable portion 123, and the elastic force is directed toward the contact surface between the movable portion 123 and the fixed seat 110, and the elastic force is at least a partial retaining force to ensure that the movable portion 123 is in contact with the fixed seat 110.

[0127] In some implementations, the elastic member, the flexible portion 122 and the fixed portion 121 together constitute a retaining structure, and the retaining force provided by the flexible portion 122 and the retaining force provided by the elastic member can make the contact between the interactive portion and the fixed seat 110 more stable.

[0128] It should be noted that the specific structure of the retaining structure may include, but is not limited to, the aforementioned structures, and may also include other structures. Furthermore, the number of retaining structures may be one or more. Furthermore, when the image sensor driving device 100 includes multiple retaining structures, at least one of the aforementioned retaining structures may be present.

[0129] In some possible implementations, as shown in FIG10 , the image sensor driver assembly 130 is disposed on the side of the circuit board 120 facing away from the image sensor 200, along the optical axis Z of the image sensor 200. In this case, the fixing member 320 is connected to the fixing frame 112, which can reduce the difficulty of arranging the image sensor driver assembly 130 within the fixing base 110. Furthermore, the space between the circuit board 120 and the fixing frame 112 can be utilized to arrange the image sensor driver assembly 130, which can reduce the size of the image sensor driver device 100 in a direction perpendicular to the optical axis Z of the image sensor 200, thereby contributing to the miniaturization of the camera module 3.

[0130] In other possible implementations, the image sensor driving assembly 130 may be disposed on the side of the circuit board 120 facing the image sensor 200. In other words, the image sensor driving assembly 130 may be disposed between the circuit board 120 and the fixed platform 111. In this case, the fixing member 320 is connected to the fixed platform 111. In still other implementations, the first movable member 132 may be disposed on the side of the circuit board 120 facing away from the image sensor 200, and the fixing member 320 may be disposed between the circuit board 120 and the fixed platform 111 and connected to the fixed platform 111.

[0131] In some implementations, the image sensor drive assembly 130 can be a magnetic structure motor, such as a VCM (voice coil motor). In this case, one of the stationary part 131 and the movable part is a magnetic drive part, and the other is a coil drive part. For example, in the implementation shown in Figure 9, the stationary part 131 is a magnetic drive part, and the movable part is a coil drive part. In another specific embodiment, the stationary part 131 is a coil drive part, and the movable part is a magnetic drive part. In other implementations, the image sensor drive assembly 130 can also be other types of drives, such as: SMA (shape memory alloy, shape memory alloy motor) or PIEZO (piezo motor, piezoelectric motor).

[0132] The first movable member 132 and the stationary member 131 of the image sensor driving assembly 130 can be two independent components (such as the coil and magnet in a magnetic structure motor), which generate a driving force when energized to move the image sensor 200. Alternatively, the first movable member 132 and the stationary member 131 of the image sensor driving assembly 130 can be an integrated structure, such as a shape memory alloy motor, which can be driven by changing the material's dimensions through electrical heating.

[0133] In some possible implementations, as shown in FIG10 , the image sensor driving device 100 may further include a reinforcing plate 140 connected to the movable portion 123. The reinforcing plate 140 is configured to increase the flatness of at least a portion of the movable portion 123. For example, the reinforcing plate 140 is configured to increase the flatness of the region where the movable portion 123 connects to the image sensor 200. Furthermore, the reinforcing plate 140 may also be configured to increase the rigidity of at least a portion of the movable portion 123.

[0134] For example, as shown in FIG10 , along the optical axis Z of the image sensor 200, the reinforcing plate 140 is disposed on a side of the movable portion 123 facing away from the image sensor 200 and is connected to the movable portion 123. In other words, the reinforcing plate 140 and the image sensor 200 are disposed on opposite sides of the movable portion 123. In some implementations, along the optical axis Z of the image sensor 200, the reinforcing plate 140 may also be disposed on a side of the movable portion 123 facing the image sensor 200, with the projection of the image sensor 200 and the projection of the reinforcing plate 140 not overlapping. In other words, the reinforcing plate 140 and the image sensor 200 are disposed on the same side of the movable portion 123 and in the same plane.

[0135] 7B , the reinforcing plate 140 covers the overlapping area between the image sensor 200 and the movable portion 123 along the optical axis Z of the image sensor 200 . In some implementations, the reinforcing plate 140 may also cover at least a portion of the movable portion 123 outside the overlapping area with the image sensor 200 .

[0136] As shown in FIG7B , the reinforcing plate 140 is provided with a light-inlet hole 141. The inner diameter of the light-inlet hole 141 can be greater than or equal to the inner diameter of the light-transmitting hole 124. The axes of the light-inlet hole 141 and the light-transmitting hole 124 coincide with each other, or the axes of the light-inlet hole 141 and the light-transmitting hole 124 can also be parallel.

[0137] There is no limitation on how the reinforcing plate 140 is connected to the movable portion 123. For example, the reinforcing plate 140 is connected to the movable portion 123 by bonding.

[0138] When the movable part 123 is used to carry an electronic device, if the electronic device and the reinforcing plate 140 are arranged on the same side of the movable part 123, in order to connect the movable part 123 with the electronic device, a through hole or notch for connecting the electronic device and the movable part 123 needs to be provided on the reinforcing plate 140.

[0139] It should be noted that, in addition to improving the flatness and / or rigidity of the movable part 123 by means of the reinforcement plate 140, in some possible implementations, the image sensor driving device 100 may further include a rigid layer (not shown in the figure), which is coated on the surface of the movable part 123 to increase the rigidity and / or flatness of the movable part 123. There is no restriction on the specific material of the rigid layer. For example, the rigid layer may be formed by high-strength glue coated on the movable part 123. In other possible implementations, the flatness and / or rigidity of the movable part 123 may also be improved by injection molding reinforcement. In still other possible implementations, the flatness and / or rigidity of the movable part 123 may also be improved by means of structural parts, which may include but are not limited to a movable bracket 150 for supporting the first movable part 132.

[0140] It should also be noted that the flatness and / or rigidity of the movable portion 123 can be improved by at least one of a rigid layer, a reinforcing plate 140 , injection molding reinforcement, a structural member, etc. For example, the structural member and the reinforcing plate 140 exist at the same time.

[0141] In some possible implementations, as shown in FIG10 , the image sensor driving device 100 may further include a movable bracket 150. The movable bracket 150 is disposed on a side of the movable portion 123 facing away from the image sensor 200 and is connected to the movable portion 123. The movable bracket 150 is configured to support the first movable member 132. In this case, the movable bracket 150 may also be configured to improve the flatness and / or rigidity of the movable portion 123.

[0142] As shown in FIG10 , a portion of the reinforcing plate 140 is disposed between the movable bracket 150 and the movable portion 123. The reinforcing plate 140 is connected to the movable bracket 150 and the movable portion 123, respectively. This allows the movable bracket 150 to be connected to the movable portion 123 via the reinforcing plate 140, thereby further connecting the first movable member 132 to the movable portion 123. In some implementations, the movable bracket 150 may be connected to the movable portion 123 without the reinforcing plate 140. In other words, the movable bracket 150 is directly connected to the movable portion 123.

[0143] The specific structure of movable bracket 150 is not limited herein. Along the optical axis Z of image sensor 200, the projection of movable bracket 150 does not overlap with light-transmitting aperture 124, ensuring that light-transmitting aperture 124 can receive incident light transmitted through lens assembly 400. For example, as shown in FIG9 , movable bracket 150 is annular in structure, with an inner diameter greater than that of light-transmitting aperture 124.

[0144] In some implementations, the movable bracket 150 and the movable portion 123 are separate structures, and the movable bracket 150 and the movable portion 123 can be indirectly connected, or the movable bracket 150 can be directly connected to the movable portion 123 by bonding, welding, etc. In other implementations, the movable bracket 150 and the movable portion 123 can also be an integrated structure, that is, the circuit board 120 and the movable bracket 150 are manufactured by integral molding.

[0145] In some implementations, the first movable member 132 can be mechanically and electrically connected to the movable portion 123 via the movable bracket 150, so that the movable portion 123 can send a signal to the first movable member 132 via the movable bracket 150, thereby allowing the first movable member 132 and the stationary member 131 to interact to generate a driving force. In other implementations, the first movable member 132 can also be mechanically connected to the movable portion 123 via the movable bracket 150.

[0146] In some possible implementations, as shown in FIG10 , the image sensor driving device 100 may further include an optical element 170. The optical element 170 is disposed within the fixing base 110 and is located on the side of the movable portion 123 facing away from the image sensor 200. The optical element 170 is connected to the movable portion 123 via a reinforcing plate 140. Along the optical axis Z of the image sensor 200, the optical element 170 covers the light-transmitting through hole 124. The light inlet 1241 is configured to receive incident light transmitted through the optical element 170. By disposing the optical element 170 within the fixing base 110, the compactness of the camera module 3 can be improved, contributing to miniaturization of the camera module 3.

[0147] In the embodiment of the present application, the optical element 170 is described as a filter. Of course, the optical element 170 can also be other elements, such as a lens.

[0148] The optical element 170 can be connected to the reinforcing plate 140 by bonding, so that the optical element 170 is indirectly connected to the movable portion 123 through the reinforcing plate 140. However, in some implementations, the optical element 170 can also be indirectly connected to the movable portion 123 without an indirect member such as the reinforcing plate 140. In this case, the optical element 170 is connected to the movable portion 123.

[0149] As shown in FIG10 , the optical element 170 is connected to the movable portion 123 via the reinforcing plate 140 , eliminating the conventional support base 204 (as shown in FIG1 ). This reduces the size of the camera module 3 in a direction perpendicular to the optical axis Z of the image sensor 200 , thereby contributing to the miniaturization of the camera module 3 . Furthermore, by combining the image sensor 200 with the movable portion 123 of the circuit board 120 , the size of the camera module 3 in a direction perpendicular to the optical axis Z of the image sensor 200 can be further reduced, further contributing to the miniaturization of the camera module 3 .

[0150] Furthermore, by mounting the optical element 170 on the movable portion 123 via the reinforcement plate 140, the reinforcement plate 207 (shown in FIG. 1 ) and the support base 204 (shown in FIG. 1 ) of the prior art can be eliminated. Furthermore, by attaching the image sensor 200 to the movable portion 123 via a flip-chip mounting arrangement, the weight borne by the movable portion 123 can be further reduced, making it easier to move the movable portion 123, thereby improving anti-shake performance and reducing power consumption.

[0151] In some possible implementations, as shown in FIG10 , the image sensor driving device 100 may further include a stopper structure 180 . The stopper structure 180 is disposed within the fixing base 110 , along the optical axis direction Z of the image sensor 200 . The first end of the stopper structure 180 is configured to abut against the circuit board 120 , and the second end of the stopper structure 180 is connected to the fixing base 110 , thereby positioning the relative positions of the circuit board 120 and the fixing base 110 along the optical axis direction Z of the image sensor 200 . Specifically, as shown in FIG10 , the first end of the stopper structure 180 may abut against the movable portion 123 of the circuit board 120 , and the second end of the stopper structure 180 is connected to the outer platform 1112 of the fixing base 110 .

[0152] In order to prevent the stopping structure 180 from interfering with the connection between the image sensor 200 and the movable portion 123 , as shown in FIG. 10 , along the optical axis direction Z of the image sensor 200 , the projection of the stopping structure 180 does not overlap with the image sensor 200 .

[0153] The specific structure of the stop structure 180 is not limited here. In some implementations, the stop structure 180 can be an annular integral structure. In other implementations, the stop structure 180 can also include a plurality of stop portions spaced apart along the circumference of the light-transmitting through hole 124.

[0154] As shown in FIG7A , the image sensor 200 and the image sensor driving device 100 are two independent structures. The image sensor driving device 100 can be connected to different types of image sensors 200. In some implementations, the image sensor 200 can be fixed to the image sensor driving device 100 so that the image sensor 200 and the image sensor driving device 100 are connected as a whole to form the optical device 2.

[0155] As shown in Figures 7A and 7B , the image sensor driving device 100 and the lens driving device 300 are two independent modular structures. The image sensor driving device 100 and the lens driving device 300 can constitute the optical device 2, as shown in Figure 7A . In this case, the image sensor driving device 100 can form different driving schemes with different types of lens driving devices 300. The image sensor driving device 100 provided in the embodiments of the present application can form different optical image stabilization schemes and has a wide range of adaptability.

[0156] The image sensor driving device 100 and the lens driving device 300 may be connected by bonding, snapping, etc. For example, as shown in FIG7A , the image sensor driving device 100 may be connected to the lens driving device 300 by an adhesive 500 .

[0157] In some possible implementations, as shown in FIG7A , the lens driving device 300 includes a housing 330 and a lens driving assembly 340. The housing 330 encloses a housing space and is configured to be fixedly connected to other functional modules (e.g., the image sensor driving device 100). The lens driving assembly 340 is housed within the housing space of the housing 330 and is configured to drive the movement of the lens assembly 400.

[0158] The lens driving assembly 340 is used to drive the lens assembly 400 to move or tilt in the axial direction (i.e., the direction in which the optical axis of the image sensor 200 extends), thereby achieving optical image stabilization, optical focus, and aberration adjustment. Furthermore, the lens driving device 300 can also be used to compensate for other optical parameters of the camera module 3, such as aberrations. The lens driving device 300 can be used to drive at least some of the lenses in the lens assembly 400 to move to compensate for aberrations.

[0159] 7A , the lens driving assembly 340 includes a fixed member 320 and a second movable member 310. The fixed member 320 is connected to the housing 330, and the second movable member 310 is connected to the lens assembly 400. The fixed member 320 and the second movable member 310 interact with each other to generate a driving force for driving the lens assembly 400 to move or tilt in the axial direction.

[0160] There is no specific limitation on how the fixed member 320 and the second movable member 310 generate the driving force. In some implementations, one of the fixed member 320 and the second movable member 310 may be a magnetic driving member and the other may be a coil driving member. When the coil driving member is energized, the coil driving member and the magnetic driving member couple to generate an electromagnetic driving force to move the lens assembly 400.

[0161] FIG13 is an assembly diagram of the camera module in FIG4 without the lens driving device.

[0162] In the above description, the image sensor driver device 100 and the image sensor 200 are two independent modules. Therefore, during the manufacturing process of the camera module 3, as shown in FIG13 , after the image sensor driver assembly 130 is assembled and tested at the motor factory, the image sensor 200 is flip-chip mounted on the side of the circuit board 120 facing away from the reinforcing plate 140, and the optical element 170 is also mounted on the reinforcing plate 140. Finally, the inner platform 1111 and the outer platform 1112 are connected to form the fixing base 110.

[0163] FIG14 is a cross-sectional schematic diagram of a camera module of the second architecture provided in an embodiment of the present application.

[0164] The difference between Figure 14 and Figure 7B is that the image sensor 200 is mechanically and electrically connected to the movable portion 123 via the fan-out base 4. Specifically, the existing image sensor 200 can be rewired and fanned out, and then mechanically and electrically connected to the movable portion 123. This eliminates the need to customize the image sensor 200 with a large connection pitch, reducing costs. Furthermore, the use of the fan-out base 4 for mechanical and electrical connection to the movable portion 123 increases the connection area between the image sensor 200 and the movable portion 123, reducing the difficulty of connecting the movable portion 123 to the image sensor 200.

[0165] In the above description, the image sensor driving device 100 and the lens driving device 300 are two independent modules. However, the image sensor driving device 100 and the lens driving device 300 may also be integrated into a single unit. The following describes the relationship between the image sensor driving device 100 and the lens driving device 300 when the image sensor driving device 100 and the lens driving device 300 are integrated into a single unit.

[0166] FIG15 is a cross-sectional schematic diagram of a camera module of the third architecture provided in an embodiment of the present application.

[0167] 15 is different from FIG. 7B in that the lens driving device 300 is disposed inside the fixing base 110 . In this case, the lens driving device 300 includes a fixing member 320 and a second movable member 310 . The fixing member 320 is connected to the fixing base 110 .

[0168] FIG16 is a cross-sectional schematic diagram of a camera module of the fourth architecture provided in an embodiment of the present application.

[0169] The difference between FIG16 and FIG14 is that the lens driving device 300 is disposed inside the fixing base 110. In this case, the lens driving device 300 includes a stationary component 131 and a second movable component 310. That is, the image sensor driving device 100 and the lens driving device 300 share the stationary component 131. For example, the stationary component 131 is a magnet, which can reduce the number of parts, make the camera module 3 more compact, and reduce costs.

[0170] It should be noted that, based on the image sensor 200 being mechanically and electrically connected to the movable portion 123 of the circuit board 120 via flip-chip technology, at least one of the following solutions can be combined: 1. The image sensor 200 can be mechanically and electrically connected to the movable portion 123 via fan-out technology. 2. The image sensor driver 100 and the lens driver 300 share a stationary part 131. 3. The lens driver 300 is disposed within the fixing base 110 and includes a fixing part 320 and a second movable part 310. 4. The lens driver 300 and the image sensor driver 100 are two independent module structures. 5. The image sensor 200 does not perform a fan-out operation.

[0171] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0172] In the embodiments of the present application, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0173] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0174] The term "plurality" in this document refers to two or more. The term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the related objects; in a formula, the character " / " indicates a "division" relationship between the related objects.

[0175] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0176] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An image sensor driving device, characterized in that: Includes a fixing seat, a circuit board and an image sensor driving assembly; The circuit board includes a fixed portion, a flexible portion, and a movable portion, wherein the fixed portion is connected to the fixing seat, and the fixed portion is mechanically and electrically connected to the movable portion via the flexible portion. The movable portion includes a light-transmitting through hole and a connection interface, wherein one end of the light-transmitting through hole is a light inlet and the other end is a light outlet for facing the photosensitive surface of the image sensor. The connection interface and the light outlet are located on the same side of the movable portion and are used for mechanical and electrical connection with the image sensor. The image sensor driving assembly includes a stationary part and a first movable part, the stationary part is connected to the fixed base, the first movable part is connected to the movable part, and the first movable part is used to interact with the stationary part to generate a driving force to drive the movable part to move relative to the fixed base, so that the movable part drives the image sensor to move relative to the fixed base.

2. The image sensor driving device according to claim 1, wherein: The movable part is a multi-layer circuit board structure.

3. The image sensor driving device according to claim 1 or 2, wherein: The movable portion and the flexible portion are an integrated structure.

4. The image sensor driving device according to any one of claims 1 to 3, wherein: The circuit board is an integrated circuit board structure.

5. The image sensor driving device according to any one of claims 1 to 4, wherein: The image sensor driving device further includes a reinforcing plate connected to the movable portion, wherein a projection of the reinforcing plate in the optical axis direction of the image sensor does not overlap with the light-transmitting through hole.

6. The image sensor driving device according to claim 5, wherein: The reinforcing plate is arranged on a side of the movable portion facing away from the connection interface, and along the optical axis direction of the image sensor, the reinforcing plate covers an overlapping area between the image sensor and the movable portion.

7. The image sensor driving device according to any one of claims 1 to 6, wherein: The movable portion contacts the fixing seat.

8. The image sensor driving device according to claim 7, wherein: The movable portion is in rolling contact with the fixed seat.

9. The image sensor driving device according to claim 8, wherein: The image sensor driving device further includes a movable bracket and a ball bearing, wherein the movable bracket is connected to the movable portion, and the movable bracket is in rolling contact with the fixed seat via the ball bearing; or, The contact position between the movable portion and the fixing seat is located on a side of the movable portion facing away from the image sensor.

10. The image sensor driving device according to any one of claims 7 to 9, wherein: The image sensor driving device further includes a holding structure, and the holding structure is used to keep the movable portion in contact with the fixing seat.

11. The image sensor driving device according to claim 10, wherein: The fixed portion and the flexible portion constitute the holding structure.

12. The image sensor driving device according to claim 10 or 11, wherein: The image sensor driving device further includes a magnetic member and a magnetic attraction member, which constitute the holding structure. One of the magnetic member and the magnetic attraction member is arranged on the movable portion, and the other is arranged on the fixing seat.

13. The image sensor driving device according to any one of claims 1 to 12, wherein: The image sensor driving device further includes a movable bracket, through which the first movable member is fixedly connected to the movable portion. When the image sensor driving assembly generates driving force, the movable bracket drives the movable portion to move relative to the fixed base.

14. The image sensor driving device according to claim 13, wherein: The movable bracket and the movable part are an integrated structure.

15. The image sensor driving device according to claim 13 or 14, wherein: The movable bracket is further used to contact the fixing seat so that the fixing seat contacts the movable part.

16. The image sensor driving device according to any one of claims 1 to 15, wherein: The fixing seat includes a fixing platform and a fixing frame. The fixing frame is connected to the edge of the fixing platform and encloses a storage space with an opening. The opening is used to allow incident light to enter the storage space. The storage space is used to accommodate the image sensor driving assembly, the movable part and the image sensor. Along the optical axis direction of the image sensor, the fixing platform and the image sensor are spaced apart.

17. The image sensor driving device according to any one of claims 1 to 16, wherein: The image sensor driving device further includes an optical element; The optical element is arranged inside the fixing seat and connected to the side of the movable portion facing away from the image sensor, and the optical element covers the light inlet; The optical element is connected to the movable part, or the optical element is used to be connected to the reinforcing plate.

18. The image sensor driving device according to claim 17, wherein: The optical element is a filter.

19. An optical device, characterized in that: The device comprises an image sensor and the image sensor driving device according to any one of claims 1 to 18, wherein the photosensitive surface of the image sensor covers the light outlet, and the image sensor is mechanically and electrically connected to the connection interface of the movable part.

20. The optical device according to claim 19, wherein The optical device further includes a fan-out seat, and the image sensor is mechanically and electrically connected to the connection interface of the movable part through the fan-out seat.

21. The optical device according to claim 19 or 20, characterized in that The optical device further includes a lens driving device, the lens driving device being used to drive the lens assembly to move along the optical axis direction of the image sensor, and the image sensor driving device being used to drive the image sensor to move on a plane perpendicular to the optical axis direction of the image sensor, wherein: The lens driving device is arranged outside the fixing seat and connected to the fixing seat, or the lens driving device is arranged inside the fixing seat.

22. The optical device according to claim 21, wherein The optical device further includes a second movable member, which is disposed inside the fixing seat. The second movable member and the stationary member constitute the lens driving device disposed inside the fixing seat.

23. An optical device, characterized in that: It comprises a lens driving device and an image sensor driving device as described in any one of claims 1 to 18, wherein the lens driving device is arranged outside the fixing seat of the image sensor driving device and is connected to the fixing seat, the lens driving device is used to drive the lens assembly to move along the optical axis direction of the image sensor, and the image sensor driving device is used to drive the image sensor to move on a plane perpendicular to the optical axis direction of the image sensor.

24. A camera module, characterized in that: comprising a lens driving device, a lens assembly, an image sensor, and the image sensor driving device according to any one of claims 1 to 18; The image sensor is disposed inside the image sensor driving device and is mechanically and electrically connected to a connection interface on a movable portion of the image sensor driving device, and a photosensitive surface of the image sensor covers a light outlet of the movable portion; The light emitting end of the lens assembly faces the light inlet of the movable part; The lens driving device is used to drive the lens assembly to move along the optical axis direction of the image sensor; The image sensor driving device is used to drive the image sensor to move on a plane perpendicular to the optical axis direction of the image sensor.

25. An electronic device, characterized in that: It comprises a main board and the camera module as claimed in claim 24, wherein the camera module is electrically connected to the main board.

Images