Intelligent power module and electronic device thereof

Abstract

Disclosed in the present application are an intelligent power module and an electronic device thereof. The intelligent power module comprises: a plastic package body, a substrate and a plurality of power chips, a plurality of bonding pads being spaced apart from each other in the length direction of the substrate. The plurality of power chips comprise a plurality of first power chips and a plurality of second power chips, the plurality of second power chips and the plurality of first power chips being alternately arranged in the length direction of the substrate. In the width direction of the substrate, the minimum distance between the edge of the first power chips adjacent to the control side and the edge of the bonding pads adjacent to the control side is L1, and in the width direction of the substrate, the minimum distance between the edge of the second power chips adjacent to the control side and the edge of the bonding pads adjacent to the control side is L2, L1 and L2 satisfying L1≥1.0 mm and 0.35 mm≤L2≤0.65 mm. The intelligent power module of the present application can prevent a chip-pulling pin from interfering with a first power chip during plastic packaging, thereby reducing grid inductance, and further improving the current-carrying capacity and power of the intelligent power module.

Description

Intelligent power module and its electronic equipment

[0001] This application refers to Chinese patent application No. 2024101621559 filed on February 4, 2024 (entitled “Intelligent Power Module and Electronic Device Thereof”), which is incorporated herein by reference in its entirety. Technical Field

[0002] The present application relates to the technical field of power modules, and in particular to an intelligent power module and electronic equipment thereof. Background Art

[0003] During the plastic encapsulation process of the intelligent power module, in order to prevent a gap between the substrate and the mold from causing glue overflow on the substrate surface, a core-pulling needle is used to press the substrate before plastic encapsulation.

[0004] In the related art, a row of six power chips is usually set on the circuit wiring copper layer of the DBC. The top of the chip is flush and placed close to the IC driver frame. That is, the distance (C value) between the edge of the power chip and the edge of the circuit wiring copper layer needs to be as small as possible to reduce the length of the gold wire, avoid deformation, and reduce the gate inductance to avoid affecting the switching characteristics. At the same time, in order to press the DBC during the manufacturing process, the pressure claw must also be set in the above-mentioned area, so the minimum C is 0.7mm. In addition, in order to avoid interference between the power chip and the core pulling needle, space for the core pulling needle needs to be reserved at both ends of the length direction of the DBC, resulting in a smaller effective area on the circuit wiring copper layer where the power chip can be placed.

[0005] However, without changing the DBC size, when a larger power chip is required to improve the product's current flow capacity and power, the large power chip may interfere with the core pulling pin, making it impossible for the intelligent power module to simultaneously reduce the gate inductance, improve the product's current flow capacity, and avoid interference with the core pulling pin. Technical issues

[0006] Without changing the DBC size, when a larger power chip is required to improve the product's current flow capacity and power, the large power chip may interfere with the core pulling pin, making it impossible for the intelligent power module to simultaneously reduce gate inductance, improve product current flow capacity, and avoid interference with the core pulling pin. Technical Solutions

[0007] This application aims to propose an intelligent power module that can reduce gate inductance, improve product current capacity, and avoid interference with core pulling pins.

[0008] According to an embodiment of the present application, an intelligent power module includes: a plastic package; a substrate, the substrate being arranged in the plastic package, and one side surface of the substrate in the thickness direction is flush with the one side surface of the plastic package in the thickness direction, the substrate having a plurality of solder pads, the plurality of solder pads being spaced apart along the length direction of the substrate, and the two sides of the substrate in the width direction being a control side and a power side, respectively; a plurality of power chips, the plurality of power chips being respectively arranged on the plurality of solder pads, the plurality of power chips including a plurality of first power chips and a plurality of second power chips, the plurality of second power chips and the plurality of first power chips being staggered along the length direction of the substrate; the minimum distance between an edge of the first power chip adjacent to the control side in the width direction of the substrate and an edge of the solder pad adjacent to the control side is L1, and the minimum distance between an edge of the second power chip adjacent to the control side and an edge of the solder pad adjacent to the control side in the width direction of the substrate is L2, wherein L1 and L2 satisfy: L1 ≥ 1.0 mm, 0.35 mm ≤ L2 ≤ 0.65 mm.

[0009] According to the intelligent power module of the embodiment of the present application, by making the minimum distance L1 between the edge of the first power chip and the edge of the solder pad ≥1.0mm and the minimum distance L2 between the edge of the second power chip and the edge of the solder pad between 0.35mm and 0.65mm in the width direction of the substrate, on the one hand, the core pulling needle can be placed in the space between the edge of the first power chip and the solder pad during plastic packaging, avoiding interference between the core pulling needle and the first power chip, preventing damage to the first power chip, and the effective area for placing the power chip on the solder pad is large, which can increase the size of the power chip to improve the current capacity and power of the intelligent power module; on the other hand, the length of the connecting line between the driver chip and the power chip can be shortened, reducing the gate inductance.

[0010] According to some embodiments of the present application, the plurality of first power chips are located at both ends of the substrate in the length direction.

[0011] According to some embodiments of the present application, the minimum distance between the edge of the first power chip away from the center of the substrate and the edge of the pad away from the center of the substrate in the length direction of the substrate is L3, wherein L3 satisfies: 0.35mm≤L3≤0.45mm.

[0012] According to some embodiments of the present application, the plurality of pads include a first pad and a plurality of second pads, the first pad is located on one side of the length direction of the substrate, the first pad is provided with the first power chip, and the second pad is provided with the second power chip; the length of the side of the first pad adjacent to the control side in the length direction of the substrate is L4, and the length of the side of the second pad adjacent to the control side in the length direction of the substrate is L5, wherein L4 and L5 satisfy: L4=L5.

[0013] According to some embodiments of the present application, in the width direction of the substrate, a minimum distance L1' between an edge of the first power chip on the first pad adjacent to the control side and an edge of the first pad adjacent to the control side satisfies: 1.0mm≤L1'≤3.3mm.

[0014] According to some embodiments of the present application, the plurality of pads further include a third pad, which is located on the other side of the length direction of the substrate, and the first power chip and the second power chip are provided on the third pad. The length of the side of the third pad adjacent to the control side in the length direction of the substrate is L6, wherein L4 and L6 satisfy: L4<L6.

[0015] According to some embodiments of the present application, a first core-pulling pinhole and a second core-pulling pinhole are formed on the plastic package body, and the first core-pulling pinhole and the second core-pulling pinhole are spaced apart along the length direction of the substrate; the outermost corner of all corners of the first soldering pad adjacent to the control side is the first corner, and the center of the first core-pulling pinhole coincides with the vertex of the first corner on the projection surface in the thickness direction of the substrate; the outermost corner of all corners of the third soldering pad adjacent to the control side is the second corner, and the center of the second core-pulling pinhole coincides with the vertex of the second corner on the projection surface in the thickness direction of the substrate.

[0016] According to some embodiments of the present application, in the width direction of the substrate, the minimum distance L1'' between the edge of the first power chip on the third pad adjacent to the control side and the edge of the third pad adjacent to the control side satisfies: 1.0mm≤L1''≤1.65mm.

[0017] According to some embodiments of the present application, the third solder pad includes a first solder pad area and a second solder pad area arranged along the width direction of the substrate, the first power chip and the second power chip are both arranged in the first solder pad area, and the length of the first solder pad area is greater than the length of the second solder pad area in the length direction of the substrate; the minimum distance between the edge of the first power chip adjacent to the power side and the edge of the second solder pad area adjacent to the power side in the width direction of the substrate is L7, wherein L7 satisfies: L7>0.4mm.

[0018] According to some embodiments of the present application, the maximum distance between the first pad and the third pad in the length direction of the substrate is H, where H satisfies: 21.6 mm ≤ H ≤ 21.8 mm.

[0019] According to some embodiments of the present application, ends of the plurality of pads adjacent to the control side are aligned in the length direction of the substrate; and the plurality of second power chips are aligned in the length direction of the substrate.

[0020] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. Beneficial effects

[0021] It takes into account reducing gate inductance, improving product flow capacity, and avoiding interference with core pulling needles. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] FIG1 is a schematic diagram of an intelligent power module according to an embodiment of the present application;

[0024] FIG2 is a schematic diagram of a substrate of an intelligent power module according to an embodiment of the present application;

[0025] FIG3 is a cross-sectional view of an intelligent power module according to an embodiment of the present application;

[0026] FIG4 is a partial enlarged view of an intelligent power module according to an embodiment of the present application;

[0027] FIG5 is a cross-sectional view of an intelligent power module according to another embodiment of the present application.

[0028] Reference numerals:

[0029] 100: Intelligent power module;

[0030] 10: Plastic package; 11: Core pull pin sleeve hole; 12: First core pull pin hole; 13: Second core pull pin hole; 20: Substrate; 21: Control side; 22: Power side; 23: Solder pad; 24: First solder pad; 25: Second solder pad; 26: Third solder pad; 261: First solder pad area; 262: Second solder pad area; 27: Insulation layer; 28: Heat dissipation layer; 29: Insulation resin layer; 30: Power chip; 31: First power chip; 32: Second power chip; 40: Frame; 41: Base island; 42: Control pin; 43: Power pin; 50: First connecting wire; 60: Second connecting wire; 70: Third connecting wire; 80: Driver chip;

[0031] 200: core pulling needle. Modes for Carrying Out the Invention

[0032] The following describes an intelligent power module 100 according to an embodiment of the present application with reference to FIG1 to FIG5 .

[0033] As shown in Figures 1 to 5, an intelligent power module 100 according to an embodiment of the present application includes: a plastic package 10, a substrate 20, and a plurality of power chips 30. In the description of the present application, "plurality" means two or more.

[0034] Specifically, the substrate 20 is disposed within the plastic package 10. One surface of the substrate 20 in the thickness direction is flush with one surface of the plastic package 10 in the thickness direction. The substrate 20 has a plurality of solder pads 23 spaced apart along the length of the substrate 20. The two sides of the substrate 20 in the width direction (e.g., the vertical direction in FIG. 2 ) are respectively defined as a control side 21 and a power side 22. A plurality of power chips 30 are disposed on the plurality of solder pads 23. The plurality of power chips 30 include a plurality of first power chips 31 and a plurality of second power chips 32. The plurality of second power chips 32 and the plurality of first power chips 31 are arranged in a staggered manner along the length direction (e.g., the horizontal direction in FIG. 2 ) of the substrate 20.

[0035] For example, in the examples of Figures 1 and 2, the plastic package 10 is wrapped around the outer peripheral surface of the substrate 20, protecting the substrate 20 and preventing damage to the substrate 20 and the power chip 30. Six power chips 30 can be provided on one side of the thickness direction of the substrate 20 (for example, the up and down direction in Figure 3), two of the six power chips 30 are first power chips 31, and the remaining four are second power chips 32. The two first power chips 31 and the four second power chips 32 are staggered and spaced along the length direction of the substrate 20. It should be noted that the staggered arrangement means that at least one second power chip 32 can be provided between two adjacent first power chips 31, or at least one first power chip 31 can be provided between two adjacent second power chips 32.

[0036] 1 , the intelligent power module 100 further includes a frame 40 and multiple driver chips 80. The frame 40 includes a base island 41, control pins 42, and power pins 43. The base island 41 is disposed within the plastic package 10. The substrate 20 and the control pins 42 are both located on the control side 21. The power pins 43 are located on the power side 22. The power pins 43 are connected to the power chip 30 via first connecting wires 50. The multiple driver chips 80 are spaced apart along the length of the substrate 20 on the base island 41. Each driver chip 80 is connected to the control pin 42 via a second connecting wire 60, and each driver chip 80 is connected to the power chip 30 via a third connecting wire 70.

[0037] For example, in the example of FIG1 , there are nineteen control pins 42, spaced apart along the length of the substrate 20. One end of each control pin 42 extends into the plastic package 10, while the other end extends outside the plastic package 10. There are two base islands 41, also spaced apart along the length of the substrate 20. Each base island 41 is provided with a driver chip 80. The driver chip 80 can be electrically connected to the corresponding control pins 42 and power chip 30 via connecting wires of the same diameter (i.e., second connecting wires 60 and third connecting wires 70). There are seven power pins 43, also spaced apart along the length of the substrate 20. One end of each power pin 43 extends into the plastic package 10, while the other end extends outside the plastic package 10. Each power chip 30 is electrically connected to the corresponding power pin 43 via a connecting wire of thicker diameter (i.e., first connecting wires 50). Thus, the driving chip 80 is electrically connected to the power chip 30 and the control pin 42 , and the power chip 30 is electrically connected to the power pin 43 , so that the intelligent power module 100 can operate normally.

[0038] The minimum distance between the edge of the first power chip 31 adjacent to the control side 21 and the edge of the pad 23 adjacent to the control side 21 in the width direction of the substrate 20 is L1. The minimum distance between the edge of the second power chip 32 adjacent to the control side 21 and the edge of the pad 23 adjacent to the control side 21 in the width direction of the substrate 20 is L2. L1 and L2 satisfy the following conditions: L1 ≥ 1.0 mm, 0.35 mm ≤ L2 ≤ 0.4 mm. In other words, the first power chip 31 is closer to the base island than the second power chip 32 in the width direction of the substrate 20, resulting in a larger distance between the edge of the first power chip 31 and the edge of the pad 23.

[0039] 3 and 4 , a core puller sleeve hole 11 is formed in the plastic encapsulation body 10. The core puller sleeve hole 11 can be configured as a circular shape. The core puller hole 12 is formed on the inner circumference of the core puller sleeve hole 11, and the bottom wall of the core puller hole 12 is located on the side of the core puller sleeve hole 11 adjacent to the substrate 20. In other words, the core puller sleeve hole 11 and the core puller hole 12 together form a stepped hole. For example, the core puller 200 is a retractable ejector pin. During the plastic encapsulation process of the intelligent power module 100, when the resin is filled, the ejector pin extends through the core puller hole 12 and contacts the substrate 20 to secure the substrate 20, preventing the surface of the substrate 20 exposed in the plastic encapsulation body 10 from tilting. This process continues until the resin filling is completed and the plastic encapsulation body 10 is formed outside the substrate 20. Before the plastic encapsulation body 10 is fully cured, the core puller 200 is retracted to complete the entire plastic encapsulation process of the plastic encapsulation body 10, thereby allowing the substrate 20 to be tightly attached to the plastic encapsulation mold, thereby preventing glue overflow from the back of the substrate 20.

[0040] The core puller 200 consists of an ejector pin and a core puller sleeve. The ejector pin passes through the mold cavity and the core puller plate and is secured by a base plate. An oil circuit provides power to the ejector pin, which ejects the pin. When the oil circuit power is cut off, a return spring or reverse oil circuit resets the pin. Typically, the core puller sleeve and the core puller pin are reset higher than the mold cavity surface to prevent resin from filling the cavity's interior of the ejector pin and the core puller sleeve. This allows the core puller sleeve to fit within the core puller sleeve hole 11, facilitating the ejector pin's passage through the sleeve and into the core puller hole 12. This improves the accuracy of the ejector pin's vertical movement and further prevents glue overflow from the back of the substrate 20.

[0041] Among them, the radius of the conventional core pulling needle 200 is 0.6mm, and the radius of the safety line outside the core pulling needle 200 is the radius of the core pulling needle 200 plus 0.4mm. That is to say, in order to prevent the core pulling needle 200 from interfering with the power chip 30, the power chip 30 cannot be placed in the safety line, even if the power chip 30 is separated from the core pulling needle 200. During plastic sealing, at least one-quarter of the core pulling needle 200 is required to press against the substrate 20 so that the substrate 20 is completely fitted with the mold. When L1 is less than 1.0mm, in order to ensure that the core pulling needle 200 does not interfere with the power chip 30, it is necessary to increase the distance between the edge of the power chip 30 and the edge of the pad 23 in the length direction of the substrate 20, resulting in a reduction in the effective area of ​​the pad 23 for placing the power chip 30.

[0042] Therefore, by making L1 ≥ 1.0 mm, the distance between the edge of the first power chip 31 and the edge of the pad 23 adjacent to the control side 21 is increased, and the edge of the core pulling needle 200 can be spaced apart from the edge of the first power chip 31, that is, the core pulling needle 200 can be placed between the first power chip 31 and the control side 21 during plastic packaging, and one end of the core pulling needle 200 does not contact the first power chip 31, thereby avoiding glue overflow on the surface of the substrate 20 during plastic packaging, improving production efficiency, and increasing the placement area of ​​the pressure claw during the manufacturing process, that is, it is conducive to placing the pressure claw between the first power chip 31 and the edge of the pad 23 adjacent to the control side 21 to press the substrate 20 and ensure the stability of the substrate 20. At the same time, the distance between the edge of the first power chip 31 and the edge of the pad 23 in the length direction of the substrate 20 is set as small as possible, thereby increasing the effective area for placing the power chip 30 on the pad 23, and thus the size of the power chip 30 can be kept unchanged, or the size of the power chip 30 can be increased to improve the flow capacity and power of the intelligent power module 100.

[0043] The minimum distance (safety distance) between the edge of the power chip 30 adjacent to the control side 21 and the edge of the pad 23 adjacent to the control side 21 in the width direction of the substrate 20 must be greater than 0.35mm. This safety distance ensures that the power chip 30 can be soldered to the pad 23 while preventing the solder paste from melting and flowing outside the pad 23. When L2>0.65mm, the distance between the power chip 30 and the pad 23 is large, resulting in a longer length of the third connecting wire 70 connecting the gate of the power chip 30 and the driver chip 80, resulting in a larger gate inductance. Therefore, by ensuring that 0.35mm≤L2≤0.65mm, the second power chip 32 can be securely fixed to the pad 23, and the second power chip 32 is closer to the driver chip 80, which can shorten the length of the third connecting wire 70 and reduce the gate inductance.

[0044] According to the intelligent power module 100 of the embodiment of the present application, by making the minimum distance L1 between the edge of the first power chip 31 and the edge of the pad 23 ≥1.0mm and the minimum distance L2 between the edge of the second power chip 32 and the edge of the pad 23 between 0.35mm and 0.65mm in the width direction of the substrate 20, on the one hand, the core pulling needle 200 can be placed in the space between the edge of the first power chip 31 and the pad 23 during plastic packaging, avoiding interference between the core pulling needle 200 and the first power chip 31, preventing damage to the first power chip 31, and the effective area of ​​the pad 23 for placing the power chip 30 is large, which can increase the size of the power chip 30 to improve the current capacity and power of the intelligent power module 100; on the other hand, the length of the connecting line between the driving chip 80 and the power chip 30 can be shortened, reducing the gate inductance.

[0045] According to some embodiments of the present application, a plurality of first power chips 31 are located at both ends of the length direction of the substrate 20. Referring to Figure 1, two first power chips 31 are respectively located at both ends of the length direction of the substrate 20, and four second power chips 32 are located between the two first power chips 31. During plastic encapsulation, two core pulling pins 200 can be used, and the two core pulling pins 200 are respectively placed between the two first power chips 31 and the control side 21, that is, the two core pulling pins 200 are respectively located at both ends of the length direction of the substrate 20. Such an arrangement enables the substrate 20 to be evenly stressed, ensures that the substrate 20 is completely fitted with the mold, avoids the generation of a gap between the substrate 20 and the mold due to uneven stress, and further improves production efficiency.

[0046] According to some embodiments of the present application, at least one power chip 30 is provided on each pad area 23. For example, in the examples of Figures 1 and 2, one side of the substrate 20 in the thickness direction has four pad areas 23, and the four pad areas 23 are evenly spaced along the length of the substrate 20. Specifically, one power chip 30 may be provided on some of the pad areas 23, and multiple power chips 30 may be provided on the remaining pad areas 23 (as shown in Figure 1); alternatively, only one power chip 30 may be provided on each pad area 23 (not shown); or further alternatively, multiple power chips 30 may be provided on each pad area 23 (not shown).

[0047] FIG1 shows four pad areas 23 for illustrative purposes, but after reading the technical solution of the present application, ordinary technicians can obviously understand that the solution can be applied to technical solutions with other numbers of pad areas 23, which also falls within the scope of protection of the present application.

[0048] As shown in FIG1 , the minimum distance between the edge of the first power chip 31 away from the center of the substrate 20 and the edge of the pad 23 away from the center of the substrate 20 along the length direction of the substrate 20 is L3, where L3 satisfies the following: 0.35 mm ≤ L3 ≤ 0.45 mm. When L3 is less than 0.35 mm, the distance between the edge of the first power chip 31 and the edge of the pad 23 is small. Since the power chip 30 is soldered to the substrate 20 using solder paste, a small L3 may cause the solder paste to flow outside the pad 23 during soldering, resulting in two adjacent pads 23 being connected, affecting the normal operation of the intelligent power module 100. When L3 is greater than 0.45 mm, the distance between the edge of the first power chip 31 and the edge of the pad 23 is large, and the area of ​​the pad 23 is effective, resulting in an effective area for placing the first power chip 31, reducing the size of the first power chip 31, and thus reducing the current flow capacity of the intelligent power module 100. Therefore, by ensuring that 0.35mm≤L3≤0.45mm, the solder paste can be effectively prevented from flowing outside the pad area 23 during soldering of the power chip 30, thereby ensuring the normal operation of the intelligent power module 100. At the same time, a large-sized first power chip 31 can be arranged in the pad 23, thereby improving the current flow capacity of the intelligent power module 100.

[0049] Furthermore, the plurality of pads 23 include a first pad 24 and a plurality of second pads 25. The first pad 24 is located on one side in the longitudinal direction of the substrate 20. A first power chip 31 is provided on the first pad 24, and a second power chip 32 is provided on the second pad 25. Referring to Figures 1 and 2, the four pads 23 may include one first pad 24 and two second pads 25. Both second pads 25 are located on the same side of the first pad 24 in the longitudinal direction of the substrate 20. A first power chip 31 is provided on the first pad 24, and a second power chip 32 is provided on each second pad 25. During plastic encapsulation, a core puller 200 may be placed on the first pad 24.

[0050] The length of the first pad 24 adjacent to the control side 21 along the length of the substrate 20 is L4, and the length of the second pad 25 adjacent to the control side 21 along the length of the substrate 20 is L5. L4 and L5 satisfy the following relationship: L4 = L5. Thus, the width of one end of the first pad 24 along the length is the same as the width of one end of the second pad 25 along the length. This ensures that the areas where the power chip 30 is placed on the first and second pads 24 and 25 are roughly the same. This ensures a regular arrangement of the power chip 30 and pads 23, making the intelligent power module 100 more compact.

[0051] Furthermore, as shown in FIG1 , in the width direction of the substrate 20, the minimum distance L1' between the edge of the first power chip 31 on the first solder pad 24 adjacent to the control side 21 and the edge of the first solder pad 24 adjacent to the control side 21 satisfies the following conditions: 1.0 mm ≤ L1' ≤ 3.3 mm. When L1' is less than 1.0 mm, the distance between the edge of the first power chip 31 and the edge of the first solder pad 24 is small, and the core pulling needle 200 may interfere with the first power chip 31 during plastic encapsulation, causing glue overflow from the substrate 20. At the same time, the pressure claw may interfere with the first power chip 31 when pressing the substrate 20, causing damage to the first power chip 31. When L1' is greater than 3.3 mm, the distance between the edge of the first power chip 31 and the edge of the first solder pad 24 is large, which may increase the length of the connecting line between the driver chip 80 and the first power chip 31, resulting in a larger gate inductance. Therefore, by ensuring that L1' satisfies 1.0mm≤L1'≤3.3mm, it can be ensured that the core-pulling needle 200 does not interfere with the first power chip 31 during plastic packaging, and that the pressing claw does not interfere with the first power chip 31 when pressing the substrate 20 during the manufacturing process. At the same time, the length of the connecting line between the driving chip 80 and the first power chip 31 can be shortened (for example, the length of the connecting line can be less than 6mm), reducing the gate inductance and reducing costs.

[0052] Furthermore, the plurality of pads 23 further include a third pad 26, which is located on the other side of the substrate 20 in the longitudinal direction. The third pad 26 is provided with a first power chip 31 and a second power chip 32. As shown in Figures 1 and 2, there is one third pad 26, and the first pad 24 and the third pad 26 are respectively located at the two ends in the longitudinal direction of the substrate 20. Two second power chips 32 and one first power chip 31 are provided on the third pad 26, and the first power chip 31 is located on the side of the third pad 26 away from the second pad 25. This ensures that the first power chip 31 is provided at both ends in the longitudinal direction of the substrate 20, which facilitates the placement of core pulling needles 200 on both sides in the longitudinal direction of the substrate 20 to ensure balanced force on the substrate 20.

[0053] As shown in Figure 2 , the length of the third pad 26 adjacent to the control side 21 along the length direction of the substrate 20 is L6, where L4 and L6 satisfy the following relationship: L4 < L6. Since the three power chips 30 in the third pad 26 are used to connect to three-phase power, ensuring L4 < L6 facilitates the placement of power chips 30 performing the same function in the same area, making the intelligent power module 100 more compact.

[0054] According to some embodiments of the present application, referring to FIG1 and FIG4 , a first core-pulling pinhole 12 and a second core-pulling pinhole 13 are formed on the plastic package body 10, and the first core-pulling pinhole 12 and the second core-pulling pinhole 13 are spaced apart along the length direction of the substrate 20. The outermost corner of all corners of the first solder pad 24 adjacent to the control side 21 is a first corner, and the center of the first core-pulling pinhole 12 coincides with the vertex of the first corner on the projection plane in the thickness direction of the substrate 20. The outermost corner of all corners of the third solder pad 26 adjacent to the control side 21 is a second corner, and the center of the second core-pulling pinhole 13 coincides with the vertex of the second corner on the projection plane in the thickness direction of the substrate 20.

[0055] When the center of the core pulling needle 200 is at other positions, the area occupied by the core pulling needle 200 on the pad 23 is smaller, that is, the center of the core pulling needle 200 is outside the pad 23, and the core pulling needle 200 is easily unstable and tilted; when the center of the core pulling needle 200 is at other positions, the area occupied by the core pulling needle on the pad 23 is larger, which will reduce the effective area on the pad 23 for placing the power chip 30.

[0056] As shown in Figures 1, 3, and 4, during plastic encapsulation, two core puller pins 200, respectively, pass through the first core puller pin hole 12 and the second core puller pin hole 13 and contact the substrate 20. The center of the core puller pin 200 facing the first solder pad 24 corresponds to the vertex of the first corner of the first solder pad 24 on the surface of the substrate 20; the center of the core puller pin 200 facing the third solder pad 26 corresponds to the vertex of the second corner of the third solder pad 26 on the surface of the substrate 20. This arrangement ensures that the core puller pins 200 maintain a pressing effect on the substrate 20 while minimizing the area occupied by the core puller pins 200 on the solder pads 23 of the substrate 20 and providing a stable pressure on the substrate 20. This further increases the effective area for placing the power chip 30 on the first and third solder pads 24, 26, thereby improving the performance of the intelligent power module 100. Furthermore, the core puller pins 200 do not interfere with the power chip 30, thereby facilitating the normal operation of the power chip 30. According to some embodiments of the present application, in the width direction of the substrate 20, the minimum distance L1'' between the edge of the first power chip 31 adjacent to the control side 21 on the third pad 26 and the edge of the control side 21 of the third pad 26 satisfies: 1.0mm≤L1''≤1.65mm. When L1'' is less than 1.0mm, the distance between the edge of the first power chip 31 and the edge of the third pad 26 is small, and the core pulling needle 200 will interfere with the first power chip 31 during plastic packaging, causing glue overflow from the substrate 20. At the same time, the pressing claw will interfere with the first power chip 31 when pressing the substrate 20, causing damage to the first power chip 31. When L1'' is greater than 1.65mm, the distance between the edge of the first power chip 31 and the edge of the third pad 26 is large, which will increase the length of the connecting line between the driver chip 80 and the first power chip 31, resulting in a larger gate inductance. Therefore, by ensuring that L1'' satisfies 1.0mm≤L1''≤1.65mm, it can be ensured that the core-pulling needle 200 does not interfere with the first power chip 31 during plastic packaging, and that the pressing claw does not interfere with the first power chip 31 when pressing the substrate 20 during the manufacturing process. At the same time, the length of the connecting line between the driving chip 80 and the first power chip 31 can be shortened (for example, the length of the connecting line can be less than 6mm), the gate inductance can be reduced, and the cost can be reduced.

[0057] According to some embodiments of the present application, the third pad 26 includes a first pad area 261 and a second pad area 262 arranged along the width direction of the substrate 20. The first power chip 31 and the second power chip 32 are both located in the first pad area 261. The length of the first pad area 261 is greater than the length of the second pad area 262 in the length direction of the substrate 20. As shown in Figures 1 and 2, the shape of the first pad area 261 is generally pentagonal, and the length of the first pad area 261 gradually decreases toward the second pad area 262. The area of ​​the first pad area 261 is larger than the area of ​​the second pad area 262, which facilitates the placement of the power chip 30 in the first pad area 261.

[0058] The minimum distance between the edge of the first power chip 31 adjacent to the power side 22 and the edge of the second pad area 262 away from the power side 22 in the width direction of the substrate 20 is L7, where L7 satisfies the following requirement: L7 > 0.4 mm. This ensures a safe distance between the edge of the first power chip 31 and the edge of the second pad area 262, preventing the first power chip 31 from colliding with the edge of the first pad area 261 and preventing solder paste from flowing outside the first pad area 261.

[0059] Optionally, as shown in FIG1 , multiple power chips 30 are disposed adjacent to the control side 21. This arrangement can reduce the spacing between the power chips 30 and the driver chip 80, thereby shortening the length of the connection line connecting the driver chip 80 and the power chip 30, further reducing gate inductance, and lowering the cost of the intelligent power module 100.

[0060] According to some embodiments of the present application, the maximum distance between the first solder pad 24 and the third solder pad 26 along the length of the substrate 20 is H, where H satisfies the following: 21.6 mm ≤ H ≤ 21.8 mm. In other words, the length of the area on the substrate 20 where the solder pads 23 are located is between 21.6 mm and 21.8 mm. In this case, the length of each solder pad 23 along the length of the substrate 20 can be maximized, allowing for the placement of a large power chip 30 (e.g., a power chip 30 with a width of 2.56 mm) within the solder pad 23, thereby increasing the current flow capacity of the intelligent power module 100.

[0061] Optionally, both ends of the insulating layer of the substrate may protrude beyond the pads 23 in the length direction of the substrate 20 . For example, the length of the portions of both ends of the insulating layer protruding beyond the pads 23 is 0.5 mm.

[0062] According to some embodiments of the present application, referring to FIG1 , the ends of the plurality of solder pads 23 adjacent to the control side 21 are aligned along the length of the substrate 20. The plurality of second power chips 32 are aligned along the length of the substrate 20. This arrangement allows the solder pads 23 and the second power chips 32 to be neatly arranged on the substrate 20, ensuring the neatness of the intelligent power module 100.

[0063] Optionally, the first connecting wire 50 may be a thick aluminum wire, and the second connecting wire 60 and the third connecting wire 70 may be thin aluminum wires, copper wires, or gold wires, but the present invention is not limited thereto.

[0064] In some optional embodiments, the substrate 20 further includes an insulating layer 27 and a heat dissipation layer 28, and the solder pads 23 and the heat dissipation layer 28 are disposed on both sides of the insulating layer 27. For example, in the example of FIG3 , the solder pads 23 and the heat dissipation layer 28 are respectively disposed on both side surfaces of the insulating layer 27, and the first power chip 31 and the second power chip 32 are both disposed on the solder pads 23. The surface of the heat dissipation layer 28 away from the power chip 30 is flush with the bottom surface of the plastic package 10 and is exposed outside the plastic package 10. When the power chip 30 generates heat during operation, the heat can be transferred to the heat dissipation layer 28 through the solder pads 23 and the insulating layer 27. The heat dissipation layer 28 exchanges heat with the outside world to achieve heat dissipation of the intelligent power module 100. For example, the materials of the solder pads 23, the insulating layer 27, and the heat dissipation layer 28 can be set to copper layer, ceramic layer, and copper layer, respectively, to facilitate the normal use of the substrate 20.

[0065] In other optional embodiments, referring to FIG5 , the substrate 20 is connected to the power pin 43 . The side of the substrate 20 facing away from the power chip 30 can be connected to the heat dissipation layer 28 via an insulating resin layer 29 . The surface of the heat dissipation layer 28 facing away from the power chip 30 is flush with the bottom surface of the plastic package 10 and is exposed outside the plastic package 10 . The insulating resin layer 29 is provided between the substrate 20 and the heat dissipation layer 28 to separate the substrate 20 and the heat dissipation layer 28 and prevent electrical connection between the substrate 20 and the heat dissipation layer 28 . When the power chip 30 generates heat during operation, the heat can be transferred to the heat dissipation layer 28 via the substrate 20 and the insulating resin layer 29 . The heat dissipation layer 28 then exchanges heat with the outside world to dissipate heat from the intelligent power module 100 . Alternatively, the heat dissipation layer 28 can be a copper sheet, but is not limited thereto.

[0066] Other structures and operations of the intelligent power module 100 according to the embodiment of the present application are known to those skilled in the art and will not be described in detail here.

[0067] In the description of this application, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on this application.

[0068] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0069] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0070] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and purpose of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An intelligent power module, characterized in that: include: Plastic packaging; A substrate is disposed in the plastic package body, and one side surface of the substrate in the thickness direction is flush with one side surface of the plastic package body in the thickness direction. The substrate has a plurality of pads, and the plurality of pads are spaced apart along the length direction of the substrate. Two sides of the substrate in the width direction are a control side and a power side, respectively. a plurality of power chips, the plurality of power chips being respectively disposed on the plurality of pads, the plurality of power chips comprising a plurality of first power chips and a plurality of second power chips, the plurality of second power chips and the plurality of first power chips being staggered along the length direction of the substrate; The minimum distance between the edge of the first power chip adjacent to the control side and the edge of the pad adjacent to the control side in the width direction of the substrate is L1, and the minimum distance between the edge of the second power chip adjacent to the control side and the edge of the pad adjacent to the control side in the width direction of the substrate is L2, wherein L1 and L2 satisfy: L1 ≥ 1.0 mm, 0.35 mm ≤ L2 ≤ 0.65 mm.

2. The intelligent power module according to claim 1, characterized in that: The plurality of first power chips are located at both ends of the substrate in a length direction.

3. The intelligent power module according to claim 1, wherein: In the length direction of the substrate, a minimum distance between an edge of the first power chip away from the center of the substrate and an edge of the pad away from the center of the substrate is L3, where L3 satisfies: 0.35 mm ≤ L3 ≤ 0.45 mm.

4. The intelligent power module according to claim 1, wherein: The plurality of pads include a first pad and a second pad, the first pad is located on one side of the substrate in the length direction, the first pad is provided with the first power chip, and the second pad is provided with the second power chip; The length of the first pad adjacent to the control side in the length direction of the substrate is L4, and the length of the second pad adjacent to the control side in the length direction of the substrate is L5, wherein L4 and L5 satisfy: L4=L5.

5. The intelligent power module according to claim 4, characterized in that: In the width direction of the substrate, a minimum distance L1' between an edge of the first power chip adjacent to the control side on the first pad and an edge of the first pad adjacent to the control side satisfies: 1.0 mm ≤ L1' ≤ 3.3 mm.

6. The intelligent power module according to claim 4, characterized in that: The multiple pads also include a third pad, which is located on the other side of the length direction of the substrate. The first power chip and the second power chip are provided on the third pad. The length of the side of the third pad adjacent to the control side in the length direction of the substrate is L6, wherein L4 and L6 satisfy: L4<L6.

7. The intelligent power module according to claim 6, characterized in that: A first core-pulling pinhole and a second core-pulling pinhole are formed on the plastic packaging body, and the first core-pulling pinhole and the second core-pulling pinhole are spaced apart along the length direction of the substrate; The outermost corner of all corners of the first pad adjacent to the control side is a first corner, and the center of the first core-pulling pinhole coincides with the vertex of the first corner on the projection plane in the thickness direction of the substrate; The outermost corner of all corners of the third pad adjacent to the control side is the second corner, and the center of the second pinhole coincides with the vertex of the second corner on the projection surface in the thickness direction of the substrate.

8. The intelligent power module according to claim 6, characterized in that: In the width direction of the substrate, a minimum distance L1″ between an edge of the first power chip on the third pad adjacent to the control side and an edge of the third pad adjacent to the control side satisfies: 1.0mm≤L1″≤1.65mm.

9. The intelligent power module according to claim 6, characterized in that: The third pad includes a first pad area and a second pad area arranged along the width direction of the substrate, the first power chip and the second power chip are both provided in the first pad area, and the length of the first pad area in the length direction of the substrate is greater than the length of the second pad area; A minimum distance between an edge of the first power chip adjacent to the power side and an edge of the second pad area away from the power side in the width direction of the substrate is L7, where L7 satisfies: L7>0.4 mm.

10. The intelligent power module according to claim 6, characterized in that: A maximum distance between the first pad and the third pad in the length direction of the substrate is H, where H satisfies: 21.6 mm ≤ H ≤ 21.8 mm.

11. The intelligent power module according to any one of claims 4 to 10, characterized in that: One end of the plurality of pads adjacent to the control side is flush with the length direction of the substrate; The plurality of second power chips are aligned in a length direction of the substrate.

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