Plate structure and manufacturing method therefor, and electronic device

Abstract

Embodiments of the present application relate to the field of electronic devices, and provide a plate structure and a manufacturing method therefor, and an electronic device. The plate structure comprises a plate body and a boss which are connected into an integrally formed part; and a stepped hole is formed in the plate body. A second hole section of the stepped hole is at least partially formed in the boss and passes through the boss. The circumferential surface of a first hole section of the stepped hole transitions smoothly to a first surface of the plate body via a chamfer; and the radius of the chamfer is less than or equal to 0.3 mm. The minimum distance between the circumferential surface of the first hole section and the surface of the boss facing away from the plate body is greater than or equal to 0.3 mm. The plate structure is formed by performing hot stamping on a plate substrate on a base; the base has an abutting surface facing the plate substrate and a conical surface; and the distance between a stamping part and the abutting surface is 0.6-0.8 times the thickness of the plate body. The plate structure combines the advantages of aesthetic appeal and good mechanical properties.

Description

Board structure and preparation method thereof, and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on February 6, 2024, with application number 202410174727.5 and application name “Board structure and preparation method thereof, electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of electronic equipment, and in particular to a board structure and a preparation method thereof, and electronic equipment. Background Art

[0003] With the commercialization of electronic devices, competition in the market is becoming increasingly fierce. Numerous factors influence the market competitiveness of electronic devices, including their functionality, portability, and aesthetics. Among these, the mechanical properties of the electronic device casing directly impact its performance.

[0004] Summary of the Invention

[0005] The embodiments of the present application provide a plate structure and a preparation method thereof, and an electronic device, aiming to improve the mechanical properties of the plate structure.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions.

[0007] In a first aspect, an embodiment of the present application provides a plate structure comprising a plate body and a boss. The plate body has a stepped hole, a first surface and a second surface arranged opposite to each other along the thickness direction of the plate body, and the boss is connected to the second surface and connected to the plate body as an integrally formed part. The stepped hole comprises a first hole section and a second hole section that are interconnected, the opening of the first hole section is located on the first surface, and at least a portion of the second hole section is formed in the boss and passes through the boss along the thickness direction of the plate body; the inner diameter of the first hole section is larger than the inner diameter of the second hole section; the circumference of the first hole section and the first surface are smoothly transitioned by chamfering, and the radius of the chamfer is less than or equal to 0.3 mm; the minimum distance from the circumference of the first hole section to the surface of the boss facing away from the plate body is greater than or equal to 0.3 mm. Thus, when a user looks directly at the stepped hole, the chamfer of the circumference of the transition first hole section and the first surface, as well as the first surface, can all be within the user's field of vision. Because the chamfer radius is small, less than or equal to 0.3mm, the area of ​​the arc surface that transitions between the circumference of the first hole segment and the first surface is small, and the area of ​​the arc surface observed by the user is smaller, making the stepped hole more aesthetically pleasing. Furthermore, the minimum distance from the circumference of the first hole segment to the surface of the boss facing away from the plate body affects the bearing capacity of the boss. A greater distance increases the bearing capacity of the boss and improves the mechanical performance of the plate structure. The plate structure of the embodiment of the present application has a larger minimum distance and a smaller chamfer radius, achieving both aesthetically pleasing and mechanically sound plate structures.

[0008] In conjunction with the first aspect, in some practicable embodiments, the surface of the boss facing away from the first surface is a frustum; the frustum is connected to the second surface. The connection between the boss and the plate, where the third surface is a frustum, has a higher structural strength, thereby increasing the bearing capacity of the boss and preventing the boss and plate from tearing due to a large interaction force between the boss and the plate.

[0009] In combination with the first aspect, in some achievable embodiments, along the thickness direction of the plate body, the hole depth of the second hole segment is equal to the thickness of the plate body.

[0010] In conjunction with the first aspect, in some achievable embodiments, the depth of the first hole segment along the thickness direction of the plate is 0.6 to 0.8 times the thickness of the plate. The depth of the first hole segment and the thickness of the plate satisfy the aforementioned relationship, and the minimum distance from the circumference of the first hole segment to the surface of the boss facing away from the plate is greater than or equal to 0.3 mm. When this minimum distance is greater than or equal to 0.3 mm, the boss has a greater load-bearing capacity, the connection strength between the boss and the plate is greater, and the plate structure has excellent mechanical properties.

[0011] In conjunction with the first aspect, in some practicable embodiments, the first hole segment has a hole depth of 0.38 mm to 0.48 mm. The hole depth of the first hole segment is within the aforementioned range, and the minimum distance from the circumference of the first hole segment to the surface of the boss facing away from the plate body is greater than or equal to 0.3 mm. This increases the structural strength between the boss and the plate body, and improves the mechanical properties of the plate structure.

[0012] In conjunction with the first aspect, in some achievable manners, the thickness of the plate is less than or equal to 0.6 mm. Thus, the thickness of the plate is less than or equal to 0.6 mm, and the plate has the characteristics of small thickness and light weight.

[0013] In conjunction with the first aspect, in some practicable embodiments, the plate structure is made of a magnesium alloy. Magnesium alloy has advantages such as high strength, large elastic modulus, good heat dissipation, good shock absorption, and greater impact load bearing capacity than aluminum alloy.

[0014] In conjunction with the first aspect, in some achievable manners, the material of the plate structure is a plate material. The plate structure provided by the embodiment of the present application has the advantages of high raw material utilization and low manufacturing cost.

[0015] In conjunction with the first aspect, in some achievable embodiments, the distance between the axis of the first hole segment and the axis of the second hole segment is less than or equal to 0.1 mm. Thus, the smaller the distance between the axis of the first hole segment and the axis of the second hole segment, the higher the concentricity of the first hole segment and the second hole segment, and the more aesthetically pleasing the plate structure.

[0016] In a second aspect, an embodiment of the present application provides a method for preparing a plate structure. The method for preparing a plate structure comprises: installing a plate substrate on a base; the plate substrate has a first reference surface and a second reference surface arranged opposite to each other along the thickness direction of the plate substrate; the base has a supporting surface and a conical surface, both of which face the plate substrate; the supporting surface is in contact with the first reference surface, and there is a gap between the conical surface and the first reference surface. A stamping part is used to hot stamp the plate substrate and form a stepped hole and a boss on the plate substrate. In the direction perpendicular to the thickness direction of the plate substrate, the distance between the stamping part and the supporting surface is a. The stepped hole includes a first hole section and a second hole section that are interconnected. The opening of the first hole section is located on the first reference plane. At least a portion of the second stepped hole is formed in the boss and passes through the boss along the thickness direction of the plate body. The inner diameter of the first hole section is greater than the inner diameter of the second hole section. The peripheral surface of the first hole section and the first reference plane are smoothly transitioned by chamfering, and the chamfer radius is less than or equal to 0.3 mm. The thickness of the plate body is T. a is equal to (0.3 times - 0.5 times) T.

[0017] Thus, during the process of hot stamping the plate substrate by the stamping part, the plate substrate is deformed and moves close to the conical surface until the conical surface abuts against the plate substrate. As the stamping part continues to stamp the plate substrate, the conical surface and the stamping part squeeze the plate substrate together until a step hole and a boss are formed. Under the action of the conical surface and the stamping part, part of the material of the plate substrate is accumulated between the boss and the plate body, so that the area between the boss and the plate body is thickened. In this way, even if the distance a between the stamping part and the abutting surface is small, the area between the boss and the plate body can be made thicker, thereby ensuring that the bearing strength and mechanical properties of the plate structure are better. In addition, the distance a between the stamping part and the abutting surface is small relative to the thickness T of the plate body. The radius of the chamfer of the circumference of the transition first hole section and the first surface is made smaller. Therefore, the plate structure prepared by the method provided in the embodiment of the present application can take into account the advantages of excellent mechanical properties, small chamfer radius, and aesthetics.

[0018] In conjunction with the second aspect, in some achievable embodiments, the stamping temperature for hot stamping the plate substrate to form the stepped hole and the boss on the plate substrate using a stamping part is 200° C.-280° C. At this temperature, the plate substrate has good thermoplasticity and is easy to stamp.

[0019] In conjunction with the second aspect, in some possible implementations, the stamping part includes an outer cylinder and an inner column that are slidably connected; the outer cylinder and the inner column are coaxially arranged;

[0020] The method of using a stamping part to stamp the plate body and forming a stepped hole on the plate body comprises:

[0021] The outer cylinder is used to punch the plate base material to form the first hole section and the boss; and the inner column is used to punch the boss to form the second hole section.

[0022] In conjunction with the second aspect, in some achievable embodiments, the gap between the outer cylinder and the inner column is 0.010 mm to 0.020 mm. Thus, a gap between the outer cylinder and the inner column within the aforementioned range enables relative movement between the outer cylinder and the inner column and improves the concentricity of the first hole segment and the second hole segment.

[0023] In a third aspect, embodiments of the present application provide a plate structure, which is produced by any of the plate structure production methods provided in the second aspect. The plate structure produced by any of the plate structure production methods provided in the second aspect can have advantages such as excellent mechanical properties, a small chamfer radius, and aesthetics.

[0024] In a fourth aspect, an embodiment of the present application provides an electronic device comprising: a housing and a printed circuit board, the printed circuit board being located within the housing; the housing comprising any of the plate structures provided in the first aspect and a locking member, the locking member being located within and connected to the stepped hole. Because the plate structure can combine advantages such as excellent mechanical performance, a small chamfer radius, and aesthetics, a housing including this plate structure can also combine advantages such as excellent mechanical performance and aesthetics. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] FIG1a is a schematic structural diagram of an electronic device provided in an embodiment of the present application from one perspective.

[0026] FIG1 b is a schematic structural diagram of an electronic device provided in an embodiment of the present application from another perspective.

[0027] FIG2 is a schematic structural diagram of a plate structure provided in an embodiment of the present application.

[0028] FIG3 is a partial schematic diagram of a stepped hole provided in an embodiment of the present application.

[0029] FIG4 is a diagram showing a manufacturing process of a cover body with a stepped hole known to the applicant.

[0030] FIG5 a is a diagram showing a method for preparing a plate structure provided in an embodiment of the present application.

[0031] FIG5 b is a schematic diagram of the decomposition structure of executing S1 in FIG5 a .

[0032] FIG5c is a schematic diagram of the decomposition structure of executing S1 in FIG5a.

[0033] FIG6 is a schematic diagram of the internal structure of a stamping part provided in an embodiment of the present application.

[0034] In the figure: 100 - electronic device; 10 - first body; 21 - rotating shaft; 20 - second body; 11 - display screen; 12 - keyboard; 13 - printed circuit board; 30 - housing; 31 - rear housing; 32 - front housing; 110 - locking member; 120 - board structure; 121 - board body; 122 - boss; 101 - first surface; 102 - second surface; 130 - stepped hole; 131 - first hole section; 132 - second hole section; 103 -Third surface; 001-cover; 002-stepped hole; 003-plate; 004-convex portion; 005-punch; 006-base; 210-base; 211-supporting surface; 212-conical surface; 2121-first edge; 2122-second edge; 41-first reference plane; 42-second reference plane; 401-gap; 50-stamping part; 60-pressing plate; 61-through hole; 213-stamping hole; 214-column. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0036] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0037] In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0038] In addition, in the embodiments of the present application, connection / connected: can refer to a mechanical connection relationship or a physical connection relationship, that is, A and B are connected or A and B are connected, which can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or A and B are in contact with each other and A and B are difficult to separate.

[0039] The present application provides an electronic device, including but not limited to a mobile phone, a tablet computer, a desktop computer, a laptop computer, a PDA (personal digital assistant), a wearable device, a display device (such as a television), an information display device, or a smart home terminal. In the present application, the electronic device is described as a laptop computer.

[0040] Figure 1a is a schematic structural diagram of an electronic device 100 provided in an embodiment of the present application from one perspective. Referring to Figure 1a, the electronic device 100 includes a first body 10, a hinge 21, and a second body 20. The first body 10 and the second body 20 are both rotatably connected to the hinge 21 to allow for an adjustable angle between the first body 10 and the second body 20, thereby enabling the first body 10 and the second body 20 to open and close.

[0041] The electronic device 100 further includes a printed circuit board (PCB) 13 (as shown in FIG1 b ), a display screen 11 and a keyboard 12 . The display screen 11 is disposed on the first body 10 , the keyboard 12 is disposed on the second body 20 , and the printed circuit board 13 is disposed on the second body 20 .

[0042] The display screen 11 is used to display images. In some embodiments, the display screen 11 may be a liquid crystal display (LCD). To provide light for the LCD, the display screen 11 may further include a backlight unit (BLU) located on the backlight surface of the display screen 11. The BLU can provide light to the LCD, enabling each sub-pixel in the LCD to emit light to display an image.

[0043] In some embodiments, the display screen 11 may be an organic light emitting diode (OLED) display screen. Since the light-emitting device OLED in each sub-pixel in the OLED display screen has a light-emitting layer, the OLED display screen can be self-luminous after receiving the operating voltage. In this case, the display screen 11 having an OLED display screen does not need to be provided with the above-mentioned BLU. In some embodiments, the display screen 11 may be an active-matrix organic light emitting diode or active-matrix organic light emitting diode (AMOLED) display screen, a flexible light-emitting diode (FLED) display screen, a MiniLED display screen, a MicroLED display screen, a Micro-OLED display screen, a quantum dot light emitting diode (QLED) display screen, etc.

[0044] In some embodiments, the electronic device 100 may further include components such as a fan and a speaker, which are disposed on the second body 20 .

[0045] FIG1 b is a structural diagram of the electronic device 100 provided in another embodiment of the present application. Referring to FIG1 b , the second body 20 includes a housing 30 and a printed circuit board 13 , and the printed circuit board 13 is located in the housing 30 .

[0046] Exemplarily, the housing 30 includes a rear housing 31 and a front housing 32, which together enclose a housing space within which components such as the printed circuit board 13, a battery, and a fan are located. The keyboard 12 is disposed within the front housing 32, with the rear housing 31 being further away from the display screen 11 than the front housing 32.

[0047] The housing 30 may further include a locking member 110, which is connected to the housing 30. For example, both the rear housing 31 and the front housing 32 are connected to the locking member 110. The locking member 110 locks the housing 30 and limits the relative displacement between the rear housing 31 and the front housing 32. In some embodiments, the second body 20 may further include a middle plate, which is stacked with the rear housing 31, and the locking member 110 connects the middle plate and the rear housing 31. In some embodiments, the middle plate and the front housing 32 may be connected as an integrally formed part. In some embodiments, the middle plate and the front housing 32 may be connected by welding, bonding, or other connection methods.

[0048] As shown in Figure 1b , the surface of the locking member 110 facing away from the front housing 32 is located on the outer surface of the electronic device 100, and the surface of the rear housing 31 facing away from the front housing 32 is located on the outer surface of the electronic device 100. When a user is using the electronic device 100, the surface of the locking member 110 facing away from the front housing 32 and the surface of the rear housing 31 facing away from the front housing 32 are within the user's visual range. Therefore, the aesthetics of the surface of the locking member 110 facing away from the front housing 32 and the surface of the rear housing 31 facing away from the front housing 32 may affect the user's experience.

[0049] In addition, there is an interaction force between the locking member 110 and the rear housing 31, and the structural strength of the rear housing 31 directly affects the connection performance between the locking member 110 and the rear housing 31, thereby affecting the mechanical performance of the electronic device 100. Therefore, improving the structural strength of the rear housing 31 while making the surface of the rear housing 31 facing away from the front housing 32 more aesthetically pleasing can improve the user experience of the electronic device 100.

[0050] The embodiment of the present application does not limit the type of the locking member 110. For example, the locking member 110 may be a threaded member (such as a screw), or the locking member 110 may be a pin or other component.

[0051] In some embodiments, the rear housing 31 includes a plate structure 120. The appearance and performance of the plate structure 120 are factors that affect the appearance and mechanical properties of the rear housing 31. Therefore, providing an aesthetically pleasing and mechanically strong plate structure 120 can enhance the structural strength of the rear housing 31 and improve the appearance of the surface of the rear housing 31 facing away from the front housing 32.

[0052] Figure 2 is a schematic structural diagram of the plate structure 120 provided in an embodiment of the present application. Referring to Figure 2, the plate structure 120 includes a plate body 121 and a boss 122. The plate body 121 and the boss 122 are connected to form an integrally formed part. The plate body 121 has a first surface 101 and a second surface 102 that are arranged opposite to each other along the thickness direction of the plate body 121. The plate body 121 is also provided with a step hole 130. The step hole 130 passes through the first surface 101 and the second surface 102 along the thickness direction of the plate body 121. The first surface 101 is an appearance surface. In other words, when a user uses an electronic device, part of the first surface 101 or the entire first surface 101 is within the user's visual range.

[0053] For ease of description, the thickness direction of the plate 121 is defined as the z direction. The stepped hole 130 penetrates the plate 121 along the z direction. The plate 121 and the boss 122 are stacked along the z direction, and the boss 122 is connected to the second surface 102 of the plate 121.

[0054] Stepped hole 130 includes a first hole section 131 and a second hole section 132 that communicate with each other. The opening of first hole section 131 is located on first surface 101, and at least a portion of second hole section 132 is formed within boss 122 and penetrates boss 122 along the z-direction. In other words, second hole section 132 penetrates boss 122, and the entire second hole section 132 or a portion of second hole section 132 is formed within boss 122. The inner diameter of first hole section 131 is larger than the inner diameter of second hole section 132.

[0055] Figure 3 is a partial schematic diagram of a stepped hole 130 provided in an embodiment of the present application. Referring to Figure 3 , the perimeter of first hole segment 131 and first surface 101 are smoothly chamfered, with a radius R less than or equal to 0.3 mm. The minimum distance from the perimeter of first hole segment 131 to the surface of boss 122 facing away from plate body 121 is N, which is greater than or equal to 0.3 mm.

[0056] When using an electronic device, when a user looks directly at the stepped hole 130, the circumferential surface of the transitional first hole segment 131, the chamfer of the first surface 101, and the first surface 101 are all within the user's field of view. For example, when the user views the chamfer, the user's viewing angle is α. In the embodiment of the present application, because the chamfer radius R is relatively small, less than or equal to 0.3 mm, the area of ​​the circumferential surface of the transitional first hole segment 131 and the arcuate surface of the first surface 101 is relatively small. The user's viewing angle α is relatively small, and the area of ​​the arcuate surface observed by the user is relatively small, making the stepped hole 130 more aesthetically pleasing.

[0057] In addition, the minimum distance N from the circumference of the first hole section 131 to the surface of the boss 122 away from the plate body 121 will affect the load-bearing capacity of the boss 122. The larger N is, the greater the load-bearing capacity of the boss 122, and the higher the mechanical properties of the plate structure 120. Conversely, the smaller N is, the smaller the load-bearing capacity of the boss 122. At present, the technical solutions known to the applicant cannot take into account both the smaller chamfer radius R and the larger aforementioned minimum distance N. In the embodiment of the present application, the chamfer radius R can be taken into account as being less than or equal to 0.3 mm, and the aforementioned minimum distance N can be greater than or equal to 0.3 mm. In this way, the plate structure 120 provided in the embodiment of the present application takes into account the advantages of both aesthetics and good mechanical properties. Obviously, the rear shell 31 (as shown in FIG1b ) including the plate structure 120 also has the advantages of both aesthetics and good mechanical properties.

[0058] It can be understood that the chamfers in the smooth transition between the circumference of the first hole section 131 and the first surface 101 can allow for manufacturing errors.

[0059] For ease of description, the surface of the boss 122 facing away from the plate body 121 is defined as the third surface 103. The third surface 103 is connected to the second surface 102. The minimum distance N is the distance between the circumference of the first hole section 131 and the third surface 103.

[0060] Illustratively, the radius R of the chamfer may be, for example, 0.3 mm, 0.28 mm, 0.27 mm, 0.26 mm, 0.25 mm, 0.22 mm, 0.20 mm, 0.18 mm, 0.15 mm, 0.13 mm, 0.11 mm, 0.05 mm or 0.03 mm.

[0061] Illustratively, the aforementioned minimum distance N may be, for example, 0.3 mm, 0.31 mm, 0.32 mm, 0.33 mm, 0.34 mm, 0.35 mm, 0.36 mm, 0.38 mm, 0.4 mm, 0.42 mm, 0.45 mm, 0.48 mm, 0.49 mm or 0.5 mm, etc.

[0062] The aforementioned “the user looks directly at the stepped hole 130 ” means that the user's line of sight is perpendicular to the first surface 101 , or the user's line of sight is parallel to the circumference of the first hole segment 131 .

[0063] The present embodiment does not limit the shapes of the first surface 101 and the second surface 102. In some embodiments, the first surface 101 is a plane. In some embodiments, the first surface 101 can also be a curved surface or other shapes depending on the shape requirements of the rear housing 31. Similarly, the second surface 102 can be a plane or a curved surface.

[0064] The present embodiment of the present application does not limit the shape of the first hole segment 131. In some embodiments, the first hole segment 131 is a cylindrical hole, and the circumference of the first hole segment 131 is cylindrical. In some embodiments, the first hole segment 131 is a prismatic hole, and the circumference of the first hole segment 131 is prismatic. The present embodiment of the present application does not limit the shape of the second hole segment 132, and the second hole segment 132 can be, for example, a cylindrical hole or a prismatic hole.

[0065] Please return to Figure 2. In some embodiments of the present application, the surface of the boss 122 facing away from the plate body 121 (the third surface 103) is a frustum. The surface of the boss 122 facing away from the plate body 121 is not perpendicular to the first surface 101. The frustum is connected to the second surface 102. In this way, the third surface 103 is a frustum, which can make the structural strength of the connection between the boss 122 and the plate body 121 (such as area C in Figure 3) higher, and can improve the bearing capacity of the boss 122, and avoid the boss 122 and the plate body 121 from being torn due to the large interaction force between the boss 122 and the plate body 121.

[0066] For example, the third surface 103 is an inclined surface, in other words, the third surface 103 is not parallel to the second surface 102. For example, the tangent line of any point on the third surface 103 is not perpendicular to the axis of the second hole section 132.

[0067] In some embodiments, the bearing capacity of the boss 122 is greater than or equal to 15 kgf (kilogram force). For example, the bearing capacity of the boss 122 can be 15 kgf, 16 kgf, 17 kgf, 18 kgf, 19 kgf, 20 kgf, 22 kgf, 25 kgf, 26 kgf, or 30 kgf. The bearing capacity of the boss 122 is the minimum force required to cause a crack between the boss 122 and the plate 121.

[0068] In some embodiments of the present application, the bearing capacity of the boss 122 is measured by applying force to the boss 122 until a crack is generated between the boss 122 and the plate 121. For example, a force gauge is used to push the boss hole until a crack is generated between the boss 122 and the plate 121, and the force gauge reading is obtained.

[0069] As mentioned above, the inner diameter of the first hole section 131 is larger than the inner diameter of the second hole section 132. The embodiment of the present application does not limit the inner diameter of the first hole section 131 and the inner diameter of the second hole section 132. They can be set according to the aforementioned fasteners.

[0070] In some embodiments of the present application, the depth of the first hole segment 131 is 0.6 to 0.8 times the thickness of the plate body 121. In Figure 3, the hole depth of the first hole segment 131 is H1, and the thickness of the plate body 121 is T. H1 is 0.6 to 0.8 times T. For example, H1 is 0.6 times T, 0.61 times T, 0.62 times T, 0.63 times T, 0.64 times T, 0.65 times T, 0.66 times T, 0.67 times T, 0.69 times T, 0.7 times T, 0.72 times T, 0.75 times T, 0.78 times T, or 0.8 times T. The hole depth H1 of the first hole section 131 and the thickness T of the plate body 121 satisfy the aforementioned relationship, and the aforementioned minimum distance N is greater than or equal to 0.3 mm. The bearing capacity of the boss 122 is large, the connection strength between the boss 122 and the plate body 121 is large, and the plate structure 120 has excellent mechanical properties.

[0071] The hole depth H1 of the aforementioned first hole segment 131 refers to the dimension of the first hole segment 131 along the z-direction. The aforementioned thickness T of the plate body 121 refers to the dimension of the plate body 121 along the z-direction. The thickness of each region of the plate body 121 may be equal or unequal. In an embodiment where the thickness of each region of the plate body 121 is unequal, the aforementioned thickness T of the plate body 121 is: the thickness of the plate body 121 at the edge of the first hole segment 131. For example, the thickness T of the plate body 121 is: the average thickness of the plate body 121 within a range of less than 0.3 mm from the edge of the first hole segment 131.

[0072] In some embodiments of the present application, the hole depth H1 of the first hole section 131 is 0.38 mm to 0.48 mm. For example, the hole depth H1 of the first hole section 131 is 0.38 mm, 0.39 mm, 0.40 mm, 0.41 mm, 0.42 mm, 0.43 mm, 0.44 mm, 0.45 mm, 0.46 mm, 0.47 mm, or 0.48 mm. When the hole depth H1 of the first hole section 131 is within the aforementioned range and the aforementioned minimum distance N is greater than or equal to 0.3 mm, the structural strength between the boss 122 and the plate body 121 is increased, thereby improving the mechanical properties of the plate structure 120.

[0073] In some embodiments of the present application, the thickness T of the plate body 121 is less than or equal to 0.6 mm. For example, the thickness T of the plate body 121 can be 0.6 mm, 0.55 mm, 0.52 mm, 0.5 mm or 0.45 mm, etc. The greater the thickness T of the plate body 121, the larger the volume of the plate structure 120; and the greater the thickness T of the plate body 121, the heavier the plate structure 120. When the thickness T is less than or equal to 0.6 mm, the plate body 121 has the characteristics of small thickness and light weight. When the thickness of the plate body 121 is within the aforementioned range, and the aforementioned minimum distance N is greater than or equal to 0.3 mm, and the chamfer radius R is less than or equal to 0.3 mm, the plate structure 120 has multiple advantages such as light weight, small thickness, strong load-bearing capacity and beautiful appearance.

[0074] In addition, in an embodiment where the hole depth H1 of the first hole section 131 is 0.38 mm to 0.48 mm and the thickness T of the plate body 121 is less than or equal to 0.6 mm, the stepped hole 130 is formed on the thinner plate body 121, and the ratio of the hole depth H1 of the first hole section 131 to the thickness T of the plate body 121 is large, the plate structure 120 also has a better load-bearing capacity.

[0075] In some embodiments of the present application, the hole depth H2 of the second hole segment 132 is equal to the thickness T of the plate body 121. The hole depth H2 of the second hole segment 132 refers to the dimension of the second hole segment 132 along the z-direction. In embodiments of the present application, the difference between the hole depth H2 of the second hole segment 132 and the thickness T of the plate body 121 can allow for manufacturing errors. For example, the hole depth H2 of the second hole segment 132 can be equal to (T ± 0.02) mm.

[0076] In some embodiments of the present application, the third surface 103 of the boss 122 may be coated or plated to provide an anti-oxidation and decorative effect. Similarly, the first and second surfaces 101, 102 of the plate 121 may also be coated or plated to mitigate oxidation and provide a decorative effect.

[0077] In some embodiments of the present application, the distance between the axis of the first hole segment 131 and the axis of the second hole segment 132 is less than or equal to 0.1 mm. For example, the distance between the axis of the first hole segment 131 and the axis of the second hole segment 132 can be 0.1 mm, 0.09 mm, 0.08 mm, 0.07 mm, 0.06 mm, 0.05 mm, 0.04 mm, 0.03 mm, 0.02 mm, 0.01 mm, or 0 mm. The smaller the distance between the axis of the first hole segment 131 and the axis of the second hole segment 132, the higher the concentricity of the first hole segment 131 and the second hole segment 132, the more aesthetically pleasing the plate structure 120, and the more aesthetically pleasing the electronic device.

[0078] In some embodiments of the present application, the material of plate structure 120 includes magnesium alloy. Magnesium alloy has advantages such as high strength, high elastic modulus, good heat dissipation, good shock absorption, and greater impact load resistance than aluminum alloy. This makes plate structure 120 lightweight and mechanically strong. In some embodiments, the material of plate structure 120 may include copper and its alloys, aluminum and its alloys, titanium and its alloys, etc. Since boss 122 and plate body 121 are connected as an integrally formed part, boss 122 and plate body 121 are made of the same material.

[0079] In some embodiments of the present application, the plate structure 120 is made of sheet metal. The sheet metal can be, for example, a forged, rolled, or cast metal plate. Sheet metal differs from extruded materials, which are made from iron or steel through processes such as rolling, extrusion, and casting. The sheet metal used to form the plate structure 120 provided in the embodiments of the present application has the advantages of high raw material utilization and low manufacturing costs.

[0080] Furthermore, if profiles are to be used to form the plate structure 120 provided in the embodiments of the present application, computer numerical control (CNC) machining is required. CNC machining of profiles requires processes such as cutting and milling, which requires a large amount of raw materials, resulting in low raw material utilization and high manufacturing costs. Furthermore, the surface roughness of the profile after CNC machining is high, with machining marks on the surface. The surface of the plate structure 120 provided in the embodiments of the present application can be free of these marks, for example, having a smooth surface.

[0081] The aforementioned plate structure 120 cannot be produced by the processes known to the applicant.

[0082] FIG4 is a diagram showing a manufacturing process of a cover 001 having a stepped hole 002 known to the applicant. The manufacturing process in FIG4 includes:

[0083] S01: forming a protrusion 004 on the plate 003 by a hot stamping process.

[0084] The plate 003 is located between the punch 005 and the base 006 , and the distance between the punch 005 and the base 006 along the direction parallel to the plate 003 is e.

[0085] S02: A cold punching process is used to punch the protrusion 004 to form a stepped hole 002.

[0086] In the process of Figure 4, in order to ensure a higher connection strength between the protrusion 004 and the plate 003, the connection between the protrusion 004 and the plate 003 (for example, area D in Figure 4) needs to be larger in size; then the distance e between the punch 005 and the base 006 needs to be larger, for example, the distance e is equal to the thickness K of the plate 003, so as to avoid the weak connection strength between the protrusion 004 and the plate 003 due to the smaller thickness in area D.

[0087] The distance e between the punch 005 and the base 006 is one of the factors that influences the chamfer radius r between the circumference of the protrusion 004 and the surface of the plate 003. The larger the distance e between the punch 005 and the base 006, the larger the chamfer radius r. Conversely, to ensure a smaller chamfer radius r, the distance e between the punch 005 and the base 006 needs to be smaller. A smaller distance e results in a weaker connection strength between the protrusion 004 and the plate 003.

[0088] For example, in Figure 4 , in order for the bearing capacity of protrusion 004 to reach 15 kgf, the distance e between punch 005 and base 006 needs to be close to the thickness K of plate 003. Typically, if the thickness K of plate 003 is 0.6 mm, then the distance e between punch 005 and base 006 is 0.6 mm. The chamfer radius r is equal to the distance e, and at 0.6 mm, it is clear that the chamfer radius r is much larger than 0.3 mm. In other words, the process of Figure 4 cannot produce a cover 001 with a chamfer radius r less than or equal to 0.3 mm and a minimum dimension within region D greater than or equal to 0.3 mm.

[0089] In addition, in the example of FIG. 4 , the stepped hole 002 is formed by penetrating the convex portion 004 . During the penetrating process of the convex portion 004 , it is difficult to locate the axis of the convex portion 004 , resulting in poor concentricity of the stepped hole 002 .

[0090] Therefore, the embodiment of the present application provides a method for preparing a plate structure 120 .

[0091] FIG5a is a diagram illustrating a method for preparing the plate structure 120 according to an embodiment of the present application. Referring to FIG5a , the method for preparing the plate structure 120 includes:

[0092] S1. As shown in FIG5 b , the plate substrate 40 is mounted on the base 210 .

[0093] Fig. 5b is a schematic diagram of the exploded structure of the process of executing step S1 in Fig. 5a. During the process of executing step S1, the base 210 and the plate substrate 40 are stacked.

[0094] As shown in Figure 5b , the plate substrate 40 has a first reference surface 41 and a second reference surface 42 disposed opposite each other along the thickness direction of the plate substrate 40. The base 210 has a supporting surface 211 and a conical surface 212; both the supporting surface 211 and the conical surface 212 face the plate substrate 40. The supporting surface 211 is aligned with the first reference surface 41, and a gap 401 is defined between the conical surface 212 and the first reference surface 41.

[0095] In Figure 5b, the conical surface 212 has a first edge 2121 and a second edge 2122. The first edge 2121 is connected to the first reference plane 41, and the second edge 2122 is farther away from the first reference plane 41 than the first edge 2121. The radius of the first edge 2121 is greater than the radius of the second edge 2122.

[0096] The embodiment of the present application does not limit the size of the cone angle of the conical surface 212. Exemplarily, the cone angle is 20°-70°, and the cone angle can be, for example, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, 60°, 65°, or 70°.

[0097] In some embodiments, the conical surface 212 transitions to the first reference surface 41 through an arc. In other words, a chamfer is provided at the first edge 2121. The height of the conical surface 212 can be set according to the required height of the second hole section 132. In some embodiments, the first edge 2121 may not be chamfered.

[0098] S2. As shown in FIG. 5 c , a stamping part 50 is used to hot stamp the plate substrate 40 and form a stepped hole and a boss on the plate substrate 40 .

[0099] The structure after executing step S1 in Figure 5a is shown in Figure 2 , where the stepped hole 130 comprises a first hole segment 131 and a second hole segment 132, which are interconnected. The opening of the first hole segment 131 is located on the first surface 101, while at least a portion of the second hole segment 132 is formed within the boss 122 and extends through the boss 122 in the z-direction. The inner diameter of the first hole segment 131 is larger than that of the second hole segment 132; the peripheral surface of the first hole segment 131 and the first surface 101 are smoothly chamfered. The thickness T of the plate substrate 40 is equal to the thickness T of the plate body 121.

[0100] FIG5 c is a schematic diagram of the exploded structure of the step S1 in FIG5 a . Referring to FIG5 c , the distance between the stamping part 50 and the abutting surface 211 along a direction perpendicular to the thickness direction (z direction) of the plate substrate 40 is a. The thickness of the plate substrate 40 is T (as shown in FIG3 ); a is equal to (0.3 times - 0.5 times) T. For example, a is 0.3 times T, 0.31 times T, 0.32 times T, 0.33 times T, 0.34 times T, 0.35 times T, 0.36 times T, 0.38 times T, 0.40 times T, 0.42 times T, 0.45 times T, 0.48 times T, or 0.50 times T.

[0101] There is a gap 401 between the conical surface 212 and the first reference surface 41. During the process of hot stamping the plate substrate 40 by the stamping part 50, the plate substrate 40 is deformed and moves close to the conical surface 212 until the conical surface 212 abuts against the plate substrate 40. During the process of the stamping part 50 continuing to stamp the plate substrate 40, the conical surface 212 and the stamping part 50 squeeze the plate substrate 40 together until the stepped hole 130 (as shown in FIG. 3 ) and the boss 122 (as shown in FIG. 3 ) are formed. In addition, during the process of squeezing the conical surface 212 and the stamping part 50, an inclined surface (such as the third surface 103 in FIG. 3 ) can be formed on the surface of the boss 122 away from the plate body 121, and a high-strength joint can be formed between the boss 122 and the plate body 121.

[0102] Under the action of the conical surface 212 and the stamping part 50, part of the material of the plate substrate 40 is accumulated in the area C (as shown in Figure 3) between the boss 122 and the plate body 121 (as shown in Figure 3), so that the area C is thickened. In this way, even if the distance a between the stamping part 50 and the abutting surface 211 is small, the area C can be made thicker, which is conducive to increasing the minimum distance N as shown in Figure 3, thereby ensuring that the bearing strength and mechanical properties of the plate structure 120 are better. In addition, the distance a between the stamping part 50 and the abutting surface 211 is smaller than the thickness T of the plate body 121. The radius R of the chamfer of the circumference of the transition first hole section 131 and the first surface 101 is smaller, less than or equal to 0.3 mm. Therefore, the plate structure 120 prepared by the method provided in the embodiment of the present application can take into account the advantages of excellent mechanical properties, small chamfer radius R, and aesthetics.

[0103] Assuming that the base 210 is not provided with a conical surface 212, accordingly, the aforementioned gap 401 does not exist in the base 210. The distance a between the stamping part 50 and the abutting surface 211 is small (for example, a is 0.5 times T). During the process of hot stamping the plate substrate 40 by the stamping part 50, there is no space between the base 210 and the plate body 121 and the boss 122 to accommodate the material, and the thickness of the connection between the plate body 121 and the boss 122 is close to the distance a between the stamping part 50 and the abutting surface 211. Since the distance a is small, the thickness of the connection between the plate body 121 and the boss 122 is also small, resulting in a low connection strength between the plate body 121 and the boss 122, and the bearing capacity of the plate body 121 and the boss 122 is correspondingly reduced. On the contrary, assuming that the base 210 is not provided with a conical surface 212, the distance a between the stamping part 50 and the abutting surface 211 is large (for example, a is T). During the process of hot stamping the plate substrate 40 by the stamping part 50, the distance a between the stamping part 50 and the abutting surface 211 is relatively large, and the thickness at the connection between the plate body 121 and the boss 122 is also correspondingly large (close to T). The connection strength between the plate body 121 and the boss 122 is relatively large, but because the distance a is relatively large, the chamfer radius of the circumferential surface of the transition first surface 101 and the first hole section 131 is large, which affects the aesthetics.

[0104] The aforementioned “first reference surface 41 is in contact with the abutting surface 211” means that the first reference surface 41 and the abutting surface 211 have the same shape and abut against each other. During the stamping process, the first reference surface 41 deforms slightly or almost not at all.

[0105] The first reference surface 41 of the plate substrate 40 forms the second surface 102 shown in FIG3 after passing through S1 and S2 in FIG5a, and the second reference surface 42 forms the first surface 101 shown in FIG3 after passing through S1 and S2 in FIG5a. The thickness T of the plate substrate 40 is the thickness of the plate body 121.

[0106] The present embodiment does not limit the shape and material of the plate substrate 40. The structure of the plate substrate 40 can be configured according to the shape and material requirements of the plate structure 120. For example, the plate substrate 40 is a plate having a uniform thickness. The material of the plate substrate 40 can be, for example, magnesium alloy, copper and its alloys, aluminum and its alloys, titanium and its alloys, etc.

[0107] Illustratively, the hot stamping temperature in step S1 may be 200° C. to 280° C. For example, the hot stamping temperature may be 200° C., 210° C., 220° C., 230° C., 250° C., 260° C., 270° C., or 280° C. At these temperatures, the plate substrate 40 has good thermoplasticity, facilitating stamping. In embodiments where the plate substrate 40 is made of a magnesium alloy, the magnesium alloy has good plasticity at 200° C. to 280° C., facilitating hot stamping.

[0108] It is understood that in some embodiments of the present application, the base 210, stamping part 50, and plate substrate 40 can be heated separately before performing step S2 in FIG. 5a . For example, the plate substrate 40 can be heated separately, and the base 210 and stamping part 50 can be heated together. After the base 210 and plate substrate 40 are assembled, step S2 in FIG. 5a can be performed to perform stamping. This can save stamping time. In some embodiments of the present application, the base 210, stamping part 50, and plate substrate 40 can be heated together after assembly before performing stamping.

[0109] Returning to FIG. 5 c , in some embodiments, to prevent deformation of the substrate 40 during the stamping process, a pressure plate 60 is provided on the side of the substrate 40 facing away from the base 210. The pressure plate 60 is stacked with the substrate 40 and is in contact with the first reference surface 41. The contact between the pressure plate 60 and the first reference surface 41 prevents deformation of the first reference surface 41 during the stamping process.

[0110] Illustratively, a through hole 61 is provided on the pressing plate 60 . During the stamping process, the stamping part 50 applies a force to the plate substrate 40 through the through hole 61 , causing the plate substrate 40 to deform and form a stepped hole 130 (as shown in FIG. 2 ).

[0111] The base 210 may also be provided with a punching hole 213, which passes through the base 210 along the z-direction. The base 210 is also provided with a column 214. The column 214 is located in the punching hole 213. The column 214 and the punching hole 213 are slidably connected, and the outer diameter of the column 214 is the same as the inner diameter of the second hole section 132 (as shown in FIG2 ). During the stamping process, the stamping part 50 stamps the plate substrate 40, and the stamping part 50 moves along the z-direction toward the column 214 until the stamping part 50 abuts against the column 214 and forms the step hole 130 (as shown in FIG2 ) on the plate substrate 40.

[0112] The present embodiment does not limit the shape of the pressing plate 60, as long as the pressing plate 60 is aligned with the first reference surface 41. For example, the pressing plate 60 may be a circular plate or a square plate. For example, the hardness of the pressing plate 60 may be Rockwell hardness (HRC) 59±1, and the hardness of the pressing plate 60 may be, for example, HRC58, HRC59, or HRC60.

[0113] For example, the hardness of the column 214 may be HRC 59±1, such as HRC 58, HRC 59, or HRC 60. The hardness of the base 210 may be HRC 60±1, such as HRC 59, HRC 60, or HRC 61.

[0114] FIG6 is a schematic diagram of the internal structure of a stamping part 50 provided in an embodiment of the present application. Referring to FIG6 , the stamping part 50 (as shown in FIG5 c ) includes an outer cylinder 52 and an inner column 51. The outer cylinder 52 and the inner column 51 are coaxially arranged and slidably connected to each other.

[0115] In FIG5 a , S2 includes: using the outer cylinder 52 to punch the plate substrate 40 to form the first hole section 131 and the boss 122 , and then using the inner column 51 to punch the boss 122 to form the second hole section 132 .

[0116] Because the outer cylinder 52 and the inner column 51 are coaxially arranged, the distance between the axis of the first hole section 131 and the axis of the second hole section 132 is small and approaches zero. The concentricity of the first hole section 131 and the second hole section 132 is high.

[0117] The present embodiment of the present application does not limit the manner in which the outer cylinder 52 and the inner column 51 are slidably connected. For example, the outer cylinder 52 can be sleeved over the inner column 51, with a gap between the outer cylinder 52 and the inner column 51, allowing the outer cylinder 52 and the inner column 51 to slide relative to each other. Alternatively, the outer cylinder 52 and the inner column 51 can be slidably connected via a slide rail.

[0118] Exemplarily, the gap between the outer cylinder 52 and the inner column 51 is 0.010 mm to 0.020 mm. For example, it may be 0.010 mm, 0.015 mm, 0.020 mm, etc. A gap between the outer cylinder 52 and the inner column 51 within this range allows relative movement between the outer cylinder 52 and the inner column 51 and improves the concentricity of the first bore section 131 and the second bore section 132.

[0119] The embodiment of the present application does not limit the hardness of the outer cylinder 52 and the inner column 51, and can be set according to the plate substrate 40. For example, the hardness of the outer cylinder 52 and the inner column 51 can be Rockwell hardness (HRC) 70±1, for example, the hardness of the outer cylinder 52 and the inner column 51 is HRC69, HRC70, or HRC71.

[0120] Returning to FIG. 5a , in some embodiments, after executing S2 , the following steps may also be performed:

[0121] S3. Chemical treatment.

[0122] The chemical conversion treatment is a process of treating the metal surface chemically or electrochemically to obtain a coating of a metal compound.

[0123] In some embodiments, the chemical conversion treatment may include: polishing and cleaning, micro-arc oxidation treatment, and spraying treatment.

[0124] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0125] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A plate structure, characterized in that: The plate structure comprises: A plate body having a stepped hole, a first surface and a second surface oppositely disposed along a thickness direction of the plate body; a boss, the boss being connected to the second surface and connected to the plate body to form an integrally formed part; The stepped hole includes a first hole section and a second hole section that are connected, the opening of the first hole section is located on the first surface, and at least a portion of the second hole section is formed in the boss and passes through the boss along the thickness direction of the plate body; the inner diameter of the first hole section is larger than the inner diameter of the second hole section; the circumferential surface of the first hole section and the first surface are smoothly transitioned by chamfering, and the radius of the chamfer is less than or equal to 0.3 mm; the minimum distance from the circumferential surface of the first hole section to the surface of the boss facing away from the plate body is greater than or equal to 0.3 mm.

2. The plate structure according to claim 1, characterized in that The surface of the boss facing away from the first surface is a frustum; and the frustum is connected to the second surface.

3. The plate structure according to claim 1 or 2, characterized in that Along the thickness direction of the plate body, the hole depth of the second hole segment is equal to the thickness of the plate body.

4. The plate structure according to any one of claims 1 to 3, characterized in that: Along the thickness direction of the plate body, the hole depth of the first hole segment is 0.6 to 0.8 times the thickness of the plate body.

5. The plate structure according to any one of claims 1 to 4, characterized in that: The hole depth of the first hole section is 0.38 mm-0.48 mm.

6. The plate structure according to any one of claims 1 to 5, characterized in that: The thickness of the plate is less than or equal to 0.6 mm.

7. The plate structure according to any one of claims 1 to 6, characterized in that: The material of the plate structure includes a magnesium alloy.

8. The plate structure according to any one of claims 1 to 7, characterized in that: The material of the plate structure is a plate.

9. The plate structure according to any one of claims 1 to 8, characterized in that: The distance between the axis of the first hole segment and the axis of the second hole segment is less than or equal to 0.1 mm.

10. A method for preparing a plate structure, characterized in that: include: The plate substrate is mounted on a base; the plate substrate has a first reference surface and a second reference surface arranged opposite to each other along the thickness direction of the plate substrate; the base has a supporting surface and a conical surface, both of which face the plate substrate; The abutting surface is in contact with the first reference surface, and a gap exists between the conical surface and the first reference surface; Hot stamping the plate substrate using a stamping part to form a stepped hole and a boss on the plate substrate; Wherein, along the direction perpendicular to the thickness direction of the plate substrate, the distance between the stamping part and the abutting surface is a; The stepped hole includes a first hole segment and a second hole segment that are interconnected, the opening of the first hole segment is located at the first reference plane, and at least a portion of the second hole segment is formed in the boss and passes through the boss along the thickness direction of the plate substrate; the inner diameter of the first hole segment is larger than the inner diameter of the second hole segment; the peripheral surface of the first hole segment and the first reference plane are smoothly transitioned by chamfering, and the chamfer radius is less than or equal to 0.3 mm; the thickness of the plate substrate is T; and a is equal to (0.3 times - 0.5 times) T.

11. The method for preparing a plate structure according to claim 10, characterized in that: The stamping temperature for hot stamping the plate substrate to form the step hole and the boss on the plate substrate is 200° C.-280° C.

12. The method for preparing a plate structure according to claim 10 or 11, characterized in that: The stamping part includes an outer cylinder and an inner column that are slidably connected; The outer cylinder and the inner column are coaxially arranged; The step of punching the plate substrate with a punching part and forming a stepped hole on the plate substrate comprises: The outer cylinder is used to punch the plate substrate to form the first hole section and the boss; and the inner column is used to punch the boss to form the second hole section.

13. The method for preparing a plate structure according to claim 12, characterized in that: The gap between the outer cylinder and the inner column is 0.010mm-0.020mm.

14. A plate structure, characterized in that The plate structure is prepared by the plate structure preparation method according to any one of claims 10 to 13.

15. An electronic device, characterized in that: The electronic device includes: a shell and a printed circuit board, the printed circuit board is located in the shell, the shell includes a locking piece and the board structure according to any one of claims 1-9 or 14, the locking piece is located in the step hole and connected to the step hole.

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