Perovskite solar cell assembly packaging structure and packaging method thereof

Abstract

Provided are a perovskite solar cell assembly packaging structure and a packaging method thereof. The packaging structure comprises a transparent conductive substrate (10), a perovskite solar cell assembly (20) and a packaging assembly (30) which are sequentially stacked; the packaging assembly (30) comprises an encapsulation layer and a glass cover plate (35) located above the encapsulation layer; and the encapsulation layer has a structure in which at least one polyolefin thermoplastic elastomer layer and at least one inorganic layer are alternately stacked. Due to the good complementary effect and excellent bonding performance between the polyolefin thermoplastic elastomer layer and the inorganic layer, a perovskite cell can be better wrapped by the packaging structure, have a very low water vapor permeability, reducing corrosion of water and / or oxygen to the perovskite cell, have higher tolerance to potential induced degradation, thus have longer service life and better stability, and can be applied to high-humidity environments such as seaside and ponds.

Description

A packaging structure and method for perovskite solar cell modules Technical Field

[0001] The present invention belongs to the technical field of photovoltaic modules, and relates to a packaging structure and method for perovskite solar cell modules. Background Art

[0002] Perovskite solar cells are solar cells that use perovskite-type organometallic halide semiconductors as light-absorbing materials. They mainly consist of a transparent conductive layer, a hole transport layer, a perovskite light-absorbing layer, an electron transport layer, and a back electrode. As a new type of solar cell, they have the advantages of high photoelectric conversion efficiency and low production cost.

[0003] However, during the process of perovskite materials contacting air, they will be affected by moisture and oxygen in the air and decompose, resulting in a significant reduction in the photoelectric conversion efficiency of perovskite cells. Therefore, perovskite cells need to be packaged before actual use. However, the traditional module packaging technology cannot meet the requirements of perovskite solar cells in terms of waterproof performance, and high-temperature operations are often required during the packaging process, which will inevitably affect the performance of perovskite solar cells. This undoubtedly poses higher technical requirements for module packaging technology.

[0004] In view of this, the present invention is specifically proposed. Summary of the Invention

[0005] The purpose of the present invention is to overcome the above-mentioned disadvantages of the prior art, and provide a packaging structure and method for perovskite solar cell modules to enhance the barrier properties of perovskite solar cells to water and / or oxygen, thereby improving the service life of perovskite cells.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] On the one hand, the present invention provides a packaging structure for perovskite solar cell modules, including a transparent conductive substrate, a perovskite solar cell module, and a packaging module stacked in sequence from bottom to top;

[0008] The packaging module includes a encapsulation layer and a glass cover plate located above it; the encapsulation layer has a structure in which at least one layer of polyolefin thermoplastic elastomer layer and at least one layer of inorganic layer are alternately stacked.

[0009] Furthermore, the polyolefin thermoplastic elastomer layer includes at least one of an ethylene-vinyl acetate copolymer (EVA) layer, a polyolefin elastomer (POE) layer, a coextruded POE film (EPE) layer, and a polyvinyl butyral (PVB) layer. Preferably, it is a POE layer to improve the adhesion between the polyolefin thermoplastic elastomer layer, the inorganic layer, and the perovskite solar cell module.

[0010] Furthermore, the POE layer is composed of a first POE layer and a second POE layer, and the inorganic layer is a first inorganic layer. The encapsulation layer adopts a structure of "first POE layer-first inorganic layer-second POE layer", and the positions of the first POE layer and the second POE layer can be swapped;

[0011] Alternatively, the inorganic layer consists of a first inorganic layer and a second inorganic layer, and the POE layer is a first POE layer. The encapsulation layer adopts a "first inorganic layer-POE layer-second inorganic layer" structure, and the positions of the first inorganic layer and the second inorganic layer can be swapped.

[0012] Furthermore, the POE layer is a copolymer of ethylene and octene, and the degree of polymerization of the POE layer is 2500 to 4000, which can effectively improve the etching ability of the POE layer on the inorganic layer during the preparation process.

[0013] Furthermore, the inorganic layer has the effect of supplementing the POE layer. The inorganic layer can be prepared from an inorganic material with excellent light transmittance and moisture and / or oxygen barrier properties: the inorganic layer can include metals; non-metals; compounds or alloys of at least two metals; compounds or alloys of at least two non-metals; oxides of metals or non-metals; fluorides of metals or non-metals; nitrides of metals or non-metals; carbides of metals or non-metals; nitrogen oxides of metals or non-metals; borides of metals or non-metals; oxyborides of metals or non-metals; silicides of metals or non-metals; or mixtures thereof. Metals may include, but are not limited to, aluminum (Al), zinc (Zn), antimony (Sb), indium (In), germanium (Ge), tin (Sn), bismuth (Bi), transition metals, and lanthanide metals; non-metals may include, but are not limited to, silicon (Si), selenium (Se), etc. Specifically, the inorganic layer may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiO x N y ), zinc selenide (ZnSe), zinc oxide (ZnO), antimony trioxide (Sb2O3), aluminum oxide (AlO x ), indium oxide (In2O3) or tin oxide (SnO2).

[0014] Furthermore, the inorganic layer may be deposited by a plasma process or vacuum process such as sputtering, chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), evaporation, sublimation, electron cyclotron resonance-plasma enhanced chemical vapor deposition (ECR-PECVD), and combinations thereof.

[0015] Furthermore, the thickness of the inorganic layer is 5nm to 10μm; the thickness of the POE layer is 5μm to 100μm. When the inorganic layer and the POE layer are within this thickness range, they have a better complementary effect. The POE layer has higher uniformity and better coverage of the perovskite solar cell, which can better achieve a water vapor barrier effect and better buffer stress, thereby having a positive effect on improving the stability of the perovskite cell.

[0016] It should be noted that the thickness of the POE layer can be adaptively prepared according to actual packaging requirements, and the optional thickness is 5μm, 10μm, 25μm, 35μm, 45μm, 55μm, 65μm, 75μm, 85μm, 95μm, 100μm, etc., which are not listed one by one; the thickness of the inorganic layer can be adaptively prepared according to actual packaging requirements, and the optional thickness is 5nm, 20nm, 40nm, 80nm, 100nm, 300nm, 500nm, 700nm, 900nm, 1000nm, 2μm, 4μm, 6μm, 8μm, 10μm, etc., which are not listed one by one.

[0017] Furthermore, the glass cover is made of a transparent glass material; specifically, any one of ultra-clear low-iron tempered glass, low-iron embossed tempered glass, semi-tempered glass, coated glass, TPT glass, TPE glass and PET glass can be selected.

[0018] Furthermore, the packaging method of the packaging component is lamination, the lamination temperature is 100°C to 140°C, and the lamination time is 5min to 40min; when the lamination temperature and time are within the above numerical range, the inorganic layer and the POE layer have better uniformity, a large water vapor barrier rate, and the perovskite battery has good stability after packaging.

[0019] Furthermore, the packaging component may also include a sealant, which is a PIB sealant; the thickness of the sealant is 0.2mm~1.5mm, and the thickness of the sealant can be adaptively prepared according to actual packaging requirements. The optional thickness is 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, etc., which are not listed one by one.

[0020] On the other hand, the present invention also provides a packaging method for a perovskite solar cell module packaging structure, the specific steps of which are as follows:

[0021] Step 1: applying a POE film on the surface of the perovskite solar cell module to form a first POE layer;

[0022] Step 2: coating an inorganic layer material on the surface of the first POE layer to form an inorganic layer;

[0023] Step 3: Then lay the POE film on the surface of the inorganic layer to form a second POE layer;

[0024] Step 4: Apply sealant around the glass cover plate, and then cover the glass cover plate on top of the second POE layer to obtain a packaged component;

[0025] Step 5: Then place the package component into a laminator for lamination packaging to obtain the perovskite solar cell component packaging structure.

[0026] The materials and thicknesses of the first POE layer and the second POE layer may be the same or different, and the size of the second POE layer cannot exceed the sealant around the cover glass, otherwise gaps may occur in the package.

[0027] Furthermore, when the packaged components are placed in a laminator for lamination packaging, the specific process is as follows: first, vacuuming and inflation are performed, and then vacuuming and inflation are performed multiple times.

[0028] Furthermore, the edge of the glass cover plate is larger than the edge of the sealant.

[0029] Furthermore, the perovskite solar cell assembly includes a conductive substrate, an electron transport layer, a perovskite light absorption layer, a hole transport layer and a metal electrode.

[0030] Among them, the electron transport layer, perovskite light absorbing layer, hole transport layer and metal electrode can be formed layer by layer on the conductive substrate: for example, the perovskite solar cell module of the present invention can be stacked from bottom to top in the order of "conductive substrate-electron transport layer-perovskite light absorbing layer-hole transport layer-metal electrode"; or, the perovskite solar cell module of the present invention can also be stacked from bottom to top in the order of "conductive substrate-hole transport layer-perovskite light absorbing layer-electron transport layer-metal electrode".

[0031] It should be noted that:

[0032] The present invention is not particularly limited to the conductive substrate; any conductive substrate known in the art can be used, as long as the objectives of the present invention can be achieved. For example, the conductive substrate can include a flexible conductive substrate or a conductive glass substrate. The flexible conductive substrate can be a fluorine-doped tin oxide (FTO) flexible conductive substrate or an indium-doped tin oxide (ITO) flexible conductive substrate. The conductive glass substrate can be a rigid transparent substrate, such as an FTO conductive glass substrate or an ITO conductive glass substrate.

[0033] The present invention has no particular restrictions on the material of the electron transport layer, which can be a material or a combination thereof known to those skilled in the art. For example, it can be selected from a titanium dioxide (TiO2) electron transport layer, a tin dioxide (SnO2) electron transport layer, or a zinc oxide (ZnO) electron transport layer, etc.; and the present invention has no particular restrictions on the thickness of the electron transport layer, as long as the purpose of the present invention can be achieved. For example, the thickness of the electron transport layer can be 20nm to 100nm. The present invention has no particular restrictions on the preparation process of the electron transport layer. For example, a solution spin coating method, a solution blade coating method, a solution spraying method, a slit coating method or a hydrothermal growth method can be used. In some embodiments of the present invention, the preparation method of the electron transport layer is a slit coating method.

[0034] The present invention has no particular restrictions on the hole transport layer, which can be a material or a combination thereof known to those skilled in the art, for example, it can be any one of the layered structures prepared by nickel oxide, doped nickel oxide, cuprous iodide, cuprous thiocyanate, poly [bis (4-phenyl) (2,4,6-trimethylphenyl) amine] (PTAA), PEDOT:PSS or Spiro-OMeTAD; and the present invention has no particular restrictions on the thickness of the hole transport layer, as long as the purpose of the present invention can be achieved, for example, the thickness of the hole transport layer can be 10nm to 100nm; the present invention has no particular restrictions on the preparation process of the hole transport layer, for example, solution spin coating, solution blade coating, slit coating or vapor phase method can be used. In some embodiments of the present invention, the preparation method of the hole transport layer is slit coating.

[0035] The present invention has no particular limitation on the perovskite light absorbing layer, and it can be a material or a combination thereof known to those skilled in the art. For example, the perovskite light absorbing layer includes a perovskite material having an ABO3 structure, and the perovskite material is selected from CH3NH3PbBr3, CH3NH3PbI3, CH3NH3PbI2Cl, CH3NH3Pb(I 1-x Br x ) 3, wherein 0≤x≤1. The present invention has no particular limitation on the preparation process of the perovskite absorber layer. For example, a solution spin coating method, a solution blade coating method, a slit coating method, or a steam method can be used. In some embodiments of the present invention, the perovskite absorber layer is prepared by a slit coating method.

[0036] The present invention has no particular restrictions on the material of the metal electrode, which can be a material or a combination thereof known to those skilled in the art, for example, any one of a gold (Au) electrode, a silver (Ag) electrode, an aluminum (Al) electrode, or a copper (Cu) electrode; and the present invention has no particular restrictions on the thickness of the metal electrode, as long as the purpose of the present invention can be achieved. For example, the thickness of the metal electrode can be 50nm to 100nm, and the electrode thickness within this range can achieve better results. Of course, those skilled in the art can select a suitable metal electrode thickness as needed. The present invention has no particular restrictions on the preparation process of the metal electrode, for example, a thermal evaporation method can be used.

[0037] The perovskite solar cell of the present invention may further include other layers, such as a passivation layer, as needed.

[0038] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0039] The encapsulation layer of the present invention adopts a structure in which at least one polyolefin thermoplastic elastomer layer and at least one inorganic layer are alternately stacked. The good complementary effect and excellent bonding performance between the polyolefin thermoplastic elastomer layer and the inorganic layer enable the perovskite battery to be better wrapped by the packaging structure, have a very low water vapor permeability, can reduce the corrosion of water and / or oxygen to the perovskite battery, and at the same time have a high tolerance to potential induced decay. Therefore, it has a long service life and good stability, and can be used in high-humidity environments such as sleeping, seaside, and ponds. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The accompanying drawings are incorporated in and constitute a part of this specification and, together with the description, serve to explain the principles of the invention.

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0042] FIG1 is a diagram showing the packaging structure of a titanium ore solar cell module provided in Example 1 of the present invention;

[0043] FIG2 is a diagram showing the packaging structure of a titanium ore solar cell module provided in Example 2 of the present invention;

[0044] FIG3 is a diagram showing the packaging structure of a titanium ore solar cell module provided in Example 3 of the present invention;

[0045] FIG4 is a curve showing the change in normalized efficiency of the titanium ore solar cell module packaging structure provided in Examples 1 to 4 of the present invention and Comparative Example 1 over time.

[0046] Among them: 10. Transparent conductive substrate; 20. Perovskite solar cell module; 30. Packaging module; 31. First POE layer; 32. First inorganic layer; 33. Second POE layer; 34. Sealant; 35. Glass cover; 36. Second inorganic layer. DETAILED DESCRIPTION

[0047] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present invention. Instead, they are merely examples consistent with certain aspects of the present invention as detailed in the appended claims.

[0048] The perovskite solar cell module packaging structure provided by the present invention comprises a transparent conductive substrate 10, a perovskite solar cell module 20 and a packaging module 30 stacked in sequence;

[0049] The packaging component 30 includes an encapsulation layer and a glass cover 35 ; the encapsulation layer has a structure in which at least one polyolefin thermoplastic elastomer layer and at least one inorganic layer are alternately stacked.

[0050] Preferably, the inorganic layer is at least one of a metal, a metal oxide, a metal fluoride, a metal nitride, a metal oxynitride, a metal boride, a metal boron oxide, or a metal silicide. The metal may further include at least one selected from aluminum, zinc, antimony, indium, germanium, tin, bismuth, a transition metal, and a lanthanide metal.

[0051] Preferably, the non-metal may include silicon, selenium and other non-metals.

[0052] Furthermore, the packaging component 30 further includes a sealant 34. Preferably, the sealant 34 is PIB sealant; and the thickness of the sealant 34 is 0.2 mm to 1.5 mm.

[0053] The packaging method of the above-mentioned perovskite solar cell module packaging structure provided by the present invention is as follows: first, an encapsulation layer is prepared on the surface of the perovskite solar cell module 20 in a manner of "alternating stacking of polyolefin thermoplastic elastomer layers and inorganic layers"; then a glass cover plate 35 is covered on top of the encapsulation layer to obtain a packaging component 30; finally, the packaging component 30 is placed in a laminator for lamination packaging.

[0054] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention is described in further detail below with reference to the accompanying drawings and embodiments.

[0055] Example 1

[0056] The perovskite solar cell module packaging structure provided in this embodiment includes a transparent conductive substrate, a perovskite solar cell module and a packaging component stacked in sequence;

[0057] The packaging component includes an encapsulation layer and a glass cover plate; as shown in Figure 1, the encapsulation layer adopts the structure of "first POE layer 31-first inorganic layer 32-second POE layer 33", and the materials of the first POE layer 31 and the second POE layer 33 are the same, both of which are pure POE-P507 from Shanghai Haiyouwei New Materials Co., Ltd. The thickness of the first POE layer 31 is 51μm, and the thickness of the second POE layer 33 is 38μm; the material of the first inorganic layer 32 is silicon nitride, and the thickness of the first inorganic layer 32 is 500nm.

[0058] The preparation process of the packaging component 30 is as follows:

[0059] First, the first POE layer 31 (diaphragm) is applied to the surface of the perovskite solar cell assembly 20, and then the material of the first inorganic layer 32 is coated on the surface of the first POE layer 31 by PECVD (plasma enhanced chemical vapor deposition). Then, the second POE layer 33 is applied to the surface of the first inorganic layer 32. The glass cover 35 is surrounded by PIB sealant (thickness of 0.5 mm) and then covered on top of the second POE layer 35 to obtain a component to be packaged;

[0060] Then the component to be packaged is placed in a laminator, and a layer of cloth is provided above and below the component to be packaged to prevent the component to be packaged from direct contact with the laminator. The lamination temperature is set to 120°C and the lamination time is 10 minutes. The specific lamination process is as follows: first, vacuum is performed for 300 seconds, and then the upper cover is inflated, followed by the first vacuuming for 10 seconds and then inflation; the second vacuuming for 10 seconds and then inflation; the third vacuuming for 300 seconds and then inflation; after taking out the packaged packaged component, it is placed to cool, and the preparation of the packaged component 30 is completed.

[0061] The perovskite solar cell assembly 20 includes a transparent conductive substrate 10, an electron transport layer, a perovskite absorption layer, a hole transport layer, and a metal electrode layer. The conductive substrate is an ITO conductive glass substrate. The preparation process of each layer is as follows:

[0062] <Preparation of Conductive Substrate>

[0063] Use ITO cleaning agent, water, ethanol and acetone mixture (V 乙醇 :V 丙酮 =1:1), ultrasonically clean the ITO conductive glass substrate with water, blow dry it with a nitrogen gun, and then treat it with UV-ozone for 10 minutes.

[0064] <Preparation of Electron Transport Layer>

[0065] An ethanol solution of mesoporous titanium dioxide was prepared (the mass fraction ratio of titanium dioxide slurry to ethanol was 1:5), and ultrasonicated for 30 minutes to obtain a precursor solution. 100 μL of the precursor solution was spin-coated on the surface of an ITO conductive glass substrate, and then transferred to a hot oven and heated at 70°C for 30 minutes, and then annealed at 180°C for 30 minutes, and naturally cooled to room temperature to obtain an electron transport layer.

[0066] <Preparation of perovskite light-absorbing layer>

[0067] 760.65 mg of lead iodide (PbI2), 246.9 mg of formamidine hydroiodide (FAI), 12.5 mg of methylammonium bromide (MABr), 18.72 mg of cesium iodide (CsI) and 21.95 mg of methylammonium chloride were mixed and dissolved in 1 mL of a mixed solution of dimethylformamide and dimethyl sulfoxide (V 二甲基甲酰胺 :V 二甲基亚砜 =4:1) and stirred for 3 h to prepare a perovskite precursor liquid, which was then spin-coated on the titanium dioxide electron transport layer at a speed of 2000 rpm and a time of 10 s. 250 μL of chlorobenzene was added dropwise as an anti-solvent 10 s before the end of the spin coating. The mixture was then pre-annealed at 100° C. for 10 min and then annealed at 150° C. for 15 min. 250 μL of phenylpropylammonium iodide (PPAI) was then spin-coated as a passivation layer at a speed of 5000 rpm and a time of 30 s. The mixture was cured to form a film, thereby completing the preparation of the perovskite light absorbing layer.

[0068] <Preparation of Hole Transport Layer>

[0069] 90 mg of Spiro-OMeTAD, 28.5 μL of tributyl phosphate, 17.8 μL of a mixed solution of lithium bis(trifluoromethanesulfonyl)imide and acetonitrile (520 mg / mL lithium bis(trifluoromethanesulfonyl)imide dissolved in acetonitrile), and 20 μL of a mixed solution of FK209 and acetonitrile (200 mg / mL FK209 dissolved in acetonitrile) were added to 1 mL of chlorobenzene and stirred for 5 hours to prepare a Spiro-OMeTAD precursor solution. Then, 28 μL of the prepared Spiro-OMeTAD precursor solution was spin-coated on the passivation layer (PPAI) at a spin coating speed of 3000 rpm and a spin coating time of 30 seconds. No annealing treatment was required to obtain a hole transport layer.

[0070] <Preparation of Metal Electrode Layer>

[0071] The Au electrode was deposited on the hole transport layer by thermal evaporation with an evaporation current of 120A. Evaporation rate to 10nm, then Evaporation: 40nm, thickness: 50nm.

[0072] Example 2

[0073] On the basis of Example 1, the difference from Example 1 is that the glass cover plate 35 adopts a groove structure, and the packaging component 30 does not include the sealant 34. As shown in Figure 2, the packaging of the perovskite solar cell component packaging structure can also be completed.

[0074] Example 3

[0075] Based on Example 1, the difference from Example 1 is that: the encapsulation layer adopts the structure of "first inorganic layer 32-first POE layer 31-second inorganic layer 36", the glass cover plate 35 adopts a groove structure, and the packaging component 30 does not include sealant 34, as shown in Figure 3; the thickness of the first inorganic layer 32 is 5nm, and the thickness of the second inorganic layer 36 is 10μm.

[0076] The materials of the first inorganic layer 32 and the second inorganic layer 36 are both silicon nitride, which can be prepared by a chemical vapor deposition (CVD) process.

[0077] Example 4

[0078] Based on Example 1, the difference from Example 1 is that in the preparation of the packaging component 30, the material of the first inorganic layer 32 is silicon oxynitride.

[0079] Example 5

[0080] On the basis of Example 1, the difference from Example 1 is that: in the preparation of the packaging component, the materials of the first POE layer 31 and the second POE layer 33 are the same, both of which are KT-606P from Baixing Group Co., Ltd., the thickness of the first POE layer 31 is 30 μm, and the thickness of the second POE layer 33 is 70 μm; the lamination temperature is set to 140°C, and the lamination time is 5 minutes.

[0081] Example 6

[0082] On the basis of Example 1, the difference from Example 1 is that: in the preparation of the packaging component, the materials of the first POE layer 31 and the second POE layer 33 are the same, both of which are KT-606P from Baixing Group Co., Ltd., the thickness of the first POE layer 31 is 80 μm, and the thickness of the second POE layer 33 is 25 μm; the lamination temperature is set to 100°C, and the lamination time is 35 minutes.

[0083] Comparative Example 1

[0084] In the packaging structure of Comparative Example 1, there is only one POE layer, and the thickness of the POE layer is 89 μm; the rest is the same as that of Example 1.

[0085] Performance Testing

[0086] In order to verify the effectiveness of the technical solution provided by the present invention, standard performance tests were performed on the perovskite battery components disclosed in Examples 1 to 4 and the perovskite battery component provided in Comparative Example 1. The specific test process is as follows:

[0087] The PCE-t curve (normalized efficiency versus time) was plotted using a solar simulator with a light intensity of 100 mA / cm 2 ,The experimental conditions were light at atmospheric pressure, temperature 20℃, and humidity 30%.

[0088] Figure 4 shows the normalized efficiency curves of the titanium ore solar cell module packaging structures provided in Examples 1 to 4 of the present invention and Comparative Example 1 over time. As shown in Figure 4, after 1800 hours, the normalized efficiency of the titanium ore solar cell module packaging structure provided in Comparative Example 1 only maintained approximately 65% ​​of its initial efficiency. Examples 3 and 4 were able to maintain over 85% of the initial efficiency of the titanium ore solar cell module, and Examples 1 and 2 were still able to maintain over 90% of the initial efficiency of the titanium ore solar cell module. Therefore, over time, the normalized efficiency of the titanium ore solar cell module packaging structures provided in Examples 1 to 4 is superior to the normalized efficiency of the titanium ore solar cell module packaging structure in Comparative Example 1.

[0089] The foregoing description is intended only to provide specific embodiments of the present invention, which will enable those skilled in the art to understand and implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention.

[0090] It should be understood that the present invention is not limited to the above description and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A perovskite solar cell module packaging structure, characterized in that: It comprises a transparent conductive substrate (10), a perovskite solar cell assembly (20) and a packaging assembly (30) stacked in sequence; The packaging component (30) comprises an encapsulation layer and a glass cover plate (35); the encapsulation layer has a structure in which at least one polyolefin thermoplastic elastomer layer and at least one inorganic layer are alternately stacked.

2. The perovskite solar cell module packaging structure according to claim 1, characterized in that: The polyolefin thermoplastic elastomer layer includes at least one of an ethylene-vinyl acetate copolymer layer, a polyolefin elastomer layer, a co-extruded POE film layer, and a polyvinyl butyral layer.

3. The perovskite solar cell module packaging structure according to claim 2, characterized in that: The polyolefin elastomer layer is a copolymer of ethylene and octene.

4. The perovskite solar cell module packaging structure according to claim 3, characterized in that: The polymerization degree of the copolymer of ethylene and octene is 2500-4000.

5. The perovskite solar cell module packaging structure according to claim 1, characterized in that: The inorganic layer comprises at least one of the following substances: Metal; non-metal; compound or alloy of at least two metals; compound or alloy of at least two non-metals; oxide of a metal or non-metal; fluoride of a metal or non-metal; nitride of a metal or non-metal; carbide of a metal or non-metal; oxynitride of a metal or non-metal; boride of a metal or non-metal; oxyboride of a metal or non-metal; silicide of a metal or non-metal.

6. The perovskite solar cell module packaging structure according to claim 1, characterized in that: The thickness of the inorganic layer is 5 nm to 10 μm.

7. The perovskite solar cell module packaging structure according to claim 1, characterized in that: The thickness of the polyolefin thermoplastic elastomer layer is 5 μm to 100 μm.

8. The perovskite solar cell module packaging structure according to claim 1, characterized in that: The packaging method of the packaging component (30) is lamination, the lamination temperature is 100° C. to 140° C., and the lamination time is 5 minutes to 40 minutes.

9. The perovskite solar cell module packaging structure according to claim 1, characterized in that: The packaging assembly (30) also includes a sealant (34).

10. A packaging method for the perovskite solar cell module packaging structure according to any one of claims 1 to 9, characterized in that: The details are as follows: first, an encapsulation layer is prepared on the surface of a perovskite solar cell component (20) in a manner of "alternating stacking of polyolefin thermoplastic elastomer layers and inorganic layers"; then, a glass cover plate (35) is covered on top of the encapsulation layer to obtain a packaging component (30); finally, the packaging component (30) is placed in a laminator for lamination and packaging.

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