Light-emitting substrate, driving motherboard, transfer substrate, light-emitting motherboard and preparation method therefor, and display device

Abstract

Provided is a light-emitting substrate, comprising a light-emitting region and a second peripheral region located on at least one side of the light-emitting region. The light-emitting substrate comprises: a substrate base; a plurality of pads which are arranged on the substrate base and located in the light-emitting region; a plurality of light-emitting devices which are arranged on the side of the plurality of pads away from the substrate base, and are arranged in the light-emitting region, wherein the light-emitting devices are connected to the pads on a one-to-one basis; and at least one support structure which is arranged on the substrate base and located in the second peripheral region, wherein the support structure and the light-emitting devices are located on the same side of the substrate base. In a first direction, there is at least one support structure having a dimension greater than or equal to the sum of the dimension of at least one pad and the dimension of the corresponding light-emitting device connected to the pad, the first direction being perpendicular to the substrate base.

Description

Luminescent substrate, driving motherboard, transfer substrate, luminescent motherboard and preparation method thereof and display device

[0001] This disclosure claims the benefit of patent application number PCT / CN2024 / 078430, filed on February 23, 2024, entitled “Driving motherboard, light-emitting motherboard and preparation method, light-emitting substrate,” and all disclosures of that application are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to the field of display technology, and in particular to a light-emitting substrate, a driving motherboard, a transfer substrate, a light-emitting motherboard, a preparation method thereof, and a display device. Background Art

[0003] Micro LEDs (Micro Light Emitting Diodes) or sub-millimeter LEDs (Mini LEDs) are gaining increasing attention due to their advantages, including high resolution, low power consumption, high brightness, high color saturation, fast response time, thinness, long lifespan, and splicing capabilities. Improving the bonding yield between LEDs and driver backplanes in Micro LED display products is a key research topic for researchers.

[0004] The above information disclosed in this section is only for understanding the background of the inventive concept of the present disclosure and therefore the above information may contain information that does not constitute prior art. Summary of the Invention

[0005] In one aspect, a light-emitting substrate is provided, comprising a light-emitting area and a second peripheral area located on at least one side of the light-emitting area, the light-emitting substrate comprising:

[0006] substrate;

[0007] a plurality of pads, disposed on the substrate and located in the light-emitting area;

[0008] a plurality of light-emitting devices, disposed on a side of the plurality of solder pads away from the substrate and in the light-emitting region, wherein one light-emitting device is connected to one solder pad; and

[0009] at least one supporting structure, disposed on the substrate and located in the second peripheral area, the supporting structure and the light-emitting device being located on the same side of the substrate,

[0010] Wherein, along a first direction, there is at least one support structure whose size is greater than or equal to the sum of the size of at least one pad and the size of the light-emitting device connected to the pad, and the first direction is perpendicular to the substrate.

[0011] According to some exemplary embodiments, the plurality of pads are arranged in multiple rows and multiple columns, at least one row includes a plurality of the pads arranged along a second direction, at least one column includes a plurality of the pads arranged along a third direction, and the second direction and the third direction intersect; and

[0012] The plurality of support structures are arranged in a row along the second direction, and / or the plurality of support structures are arranged in a column along the third direction.

[0013] According to some exemplary embodiments, the light emitting devices connected to the plurality of pads emit light of the same color, and the plurality of support structures include a plurality of support members;

[0014] The multiple solder pads and the multiple support members are arranged into multiple rows and columns, at least one row includes solder pads and support members arranged along the second direction; and / or, at least one column includes solder pads and support members arranged along a third direction; along the second direction and / or the third direction, the spacing between two adjacent solder pads is a first spacing, the spacing between two adjacent support members is a second spacing, and the spacing between adjacent solder pads and support members is a third spacing; the first spacing, the second spacing and the third spacing are equal.

[0015] According to some exemplary embodiments, a plurality of support members located on one side of the light-emitting area are connected to form a continuous whole-layer structure.

[0016] According to some exemplary embodiments, the plurality of light-emitting devices include a plurality of red light-emitting devices, a plurality of blue light-emitting devices, and a plurality of green light-emitting devices; the plurality of pads in the light-emitting area include a first pad, a plurality of second pads, and a plurality of third pads; the first pad is connected to the red light-emitting device, the second pad is connected to the blue light-emitting device, and the third pad is connected to the green light-emitting device;

[0017] The plurality of support structures include a plurality of support members; the plurality of support members include at least one of a plurality of first support members, a plurality of second support members, and a plurality of third support members.

[0018] According to some exemplary embodiments, each row includes the first pad, the second pad, and the third pad arranged along the second direction, and in an orthographic projection onto the substrate motherboard, a geometric center of the first pad, a geometric center of the second pad, and a geometric center of the third pad in each row are located on a first straight line;

[0019] The plurality of support members are arranged in multiple rows and columns, each row comprising the first support member, the second support member, and the third support member arranged along the second direction, and in an orthographic projection onto the substrate motherboard, the geometric centers of the first support member, the second support member, and the third support member in each row are located on a second straight line;

[0020] Here, at least one of the first straight lines coincides with one of the second straight lines and / or there is a distance between the first straight line and the second straight line.

[0021] According to some exemplary embodiments, at least one first straight line coincides with a second straight line;

[0022] Wherein, along the second direction, the distance between two adjacent first pads is equal to the distance between two adjacent first support members; and / or,

[0023] Along the second direction, the distance between two adjacent second pads is equal to the distance between two adjacent second support members; and / or,

[0024] Along the second direction, the distance between two adjacent third pads is equal to the distance between two adjacent third support members.

[0025] According to some exemplary embodiments, the geometric center of the orthographic projection of each column of the first pads on the substrate motherboard is located on a third straight line, and the geometric center of the orthographic projection of each column of the first support members on the substrate motherboard is located on a fourth straight line, wherein at least one of the third straight lines coincides with one of the fourth straight lines and / or there is a gap between the first straight line and the second straight line; and / or,

[0026] The geometric center of the orthographic projection of each column of the second solder pads on the substrate motherboard is located on a fifth straight line, and the geometric center of the orthographic projection of each column of the second support members on the substrate motherboard is located on a sixth straight line, wherein at least one of the fifth straight lines coincides with one of the sixth straight lines and / or there is a gap between the fifth straight line and the sixth straight line; and / or,

[0027] The geometric center of the positive projection of each column of the third solder pads on the substrate motherboard is located on the seventh straight line, and the geometric center of the positive projection of each column of the third support members on the substrate motherboard is located on the eighth straight line, wherein at least one of the seventh straight lines coincides with one of the eighth straight lines and / or there is a distance between the seventh straight line and the eighth straight line.

[0028] According to some exemplary embodiments, at least one third straight line coincides with a fourth straight line, and along the third direction, a distance between two adjacent first pads is equal to a distance between two adjacent first support members; and / or,

[0029] At least one fifth straight line coincides with one sixth straight line, and along the third direction, the distance between two adjacent second pads is equal to the distance between two adjacent second support members; and / or,

[0030] At least one seventh straight line coincides with one eighth straight line, and along the third direction, a distance between two adjacent third pads is equal to a distance between two adjacent third support members.

[0031] According to some exemplary embodiments, light-emitting devices connected to pads belonging to the same column emit the same color, and multiple support members belonging to the same column are connected to form a strip structure.

[0032] According to some exemplary embodiments, the support member is elastic, and a size of the support member is larger than a sum of a size of the solder pad and a size of the light emitting device connected to the solder pad.

[0033] According to some exemplary embodiments, the plurality of support structures include a plurality of support columns, the support columns are elastic, and surfaces of the support columns away from the substrate are farther away from the substrate than surfaces of the light emitting devices away from the substrate.

[0034] According to some exemplary embodiments, the plurality of supporting pillars include a plurality of first supporting pillars and a plurality of second supporting pillars, the first supporting pillars being farther away from the substrate than the second supporting pillars are from the substrate surface.

[0035] According to some exemplary embodiments, in a second peripheral area located on one side of the light-emitting area along the second direction, a plurality of the support columns are arranged into at least two columns of support columns, and in two adjacent columns of support columns, one column of support columns includes a plurality of the first support columns arranged in sequence along the third direction, and the other column of support columns includes a plurality of the second support columns arranged in sequence along the third direction; and / or

[0036] In a second peripheral area located on one side of the light-emitting area along the third direction, a plurality of the support columns are arranged into at least two rows of support columns. In two adjacent rows of support columns, one row of support columns includes a plurality of the first support columns arranged in sequence along the second direction, and the other row of support columns includes a plurality of the second support columns arranged in sequence along the second direction.

[0037] According to some exemplary embodiments, a distribution density of the plurality of second support pillars is greater than a distribution density of the plurality of first support pillars.

[0038] According to some exemplary embodiments, an area of ​​an orthographic projection of the second support pillar on the substrate is larger than an area of ​​an orthographic projection of the first support pillar on the substrate; and / or,

[0039] The distance between the second support pillars adjacent to each other along the second direction is smaller than the distance between the first support pillars adjacent to each other along the second direction; and / or,

[0040] A distance between adjacent second supporting columns along the third direction is smaller than a distance between adjacent first supporting columns along the third direction.

[0041] According to some exemplary embodiments, a dimension of the first supporting column along the second direction is greater than or equal to a dimension of the light emitting device along the second direction; and / or,

[0042] The dimension of the first supporting column along the third direction is greater than or equal to the dimension of the light emitting device along the third direction; and / or,

[0043] The size of the second supporting column along the second direction is greater than or equal to the size of the light emitting device along the second direction; and / or,

[0044] A dimension of the second supporting column along the third direction is greater than or equal to a dimension of the light emitting device along the third direction.

[0045] According to some exemplary embodiments, a distance between adjacent first support columns along the second direction is greater than or equal to a distance between adjacent light emitting devices along the second direction; and / or,

[0046] A distance between adjacent first support columns along the third direction is greater than or equal to a distance between adjacent light emitting devices along the third direction; and / or,

[0047] The distance between the second supporting columns adjacent to each other along the second direction is greater than or equal to the distance between the light emitting devices adjacent to each other along the second direction; and / or,

[0048] A distance between adjacent second supporting columns along the third direction is greater than or equal to a distance between adjacent light emitting devices along the third direction.

[0049] According to some exemplary embodiments, a distance between adjacent first support pillars along the second direction is equal to a distance between adjacent first support pillars along the third direction; and / or,

[0050] A distance between adjacent second supporting columns along the second direction is equal to a distance between adjacent second supporting columns along the third direction.

[0051] According to some exemplary embodiments, the plurality of light-emitting devices includes a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of third light-emitting devices, and the support column is farther away from the surface of the substrate than any of the first light-emitting devices, the second light-emitting devices, and the third light-emitting devices are away from the surface of the substrate.

[0052] According to some exemplary embodiments, the shape of the orthographic projection of the support pillar on the substrate includes a circle or a rectangle; and / or,

[0053] The size of the support pillar along the second direction is 20 μm-100 μm, and the size of the support pillar along the third direction is 20 μm-100 μm.

[0054] In another aspect, a driving motherboard is provided, wherein the driving motherboard has a plurality of light-emitting areas, and a spacer area is provided between two adjacent light-emitting areas; the driving motherboard comprises:

[0055] substrate motherboard;

[0056] A plurality of solder pads are provided on the substrate motherboard and in the light emitting area; the solder pads are configured to be connected to the light emitting device;

[0057] At least one supporting structure is arranged on the substrate motherboard and in the spacer area, and the supporting structure and the solder pad are located on the same side of the substrate motherboard; along a first direction, there is at least one supporting structure whose size is greater than or equal to the sum of the size of the solder pad and the size of the light-emitting device connected to the solder pad, and the first direction is perpendicular to the substrate motherboard.

[0058] According to some exemplary embodiments, the light-emitting motherboard further has a first peripheral area; the first peripheral area is arranged around the plurality of light-emitting areas, and at least one of the support structures is also arranged in the first peripheral area.

[0059] In another aspect, a light-emitting motherboard is provided, wherein the light-emitting motherboard has a plurality of light-emitting areas, and a spacer area is provided between two adjacent light-emitting areas. The light-emitting motherboard comprises:

[0060] substrate motherboard;

[0061] A plurality of pads are provided on the substrate motherboard and in the light emitting area;

[0062] A plurality of light-emitting devices are arranged on a side of the plurality of solder pads away from the substrate motherboard, and one light-emitting device is connected to one solder pad;

[0063] At least one supporting structure is provided on the substrate motherboard and is located in the spacer area, wherein the supporting structure and the light emitting device are located on the same side of the substrate motherboard,

[0064] Wherein, along a first direction, there is at least one support structure whose size is greater than or equal to the sum of the size of at least one pad and the size of the light-emitting device connected to the pad, and the first direction is perpendicular to the substrate.

[0065] In another aspect, a transfer substrate is provided, wherein the transfer substrate has a plurality of transfer areas, a support area is provided between two adjacent transfer areas, and the transfer substrate comprises:

[0066] Transferring the substrate;

[0067] A plurality of light-emitting devices are located on the transfer substrate, and the light-emitting devices are located in the transfer area;

[0068] at least one supporting structure located on the transfer substrate, the supporting structure located in the supporting area, and the supporting structure and the light emitting device located on the same side of the transfer substrate,

[0069] Wherein, a surface of at least one of the supporting structures away from the transfer substrate is further away from the transfer substrate than a surface of the light-emitting device away from the transfer substrate.

[0070] In another aspect, a method for preparing a light-emitting motherboard is provided, the method comprising:

[0071] A transfer substrate and a driving motherboard are provided; the driving motherboard has multiple light-emitting areas, with a spacer area between two adjacent light-emitting areas; the driving motherboard includes a base motherboard and multiple solder pads; the multiple solder pads are arranged on the base motherboard and arranged in the light-emitting areas; the transfer substrate includes a transfer substrate and multiple light-emitting devices; the multiple light-emitting devices are arranged on one side of the transfer substrate and connected to the transfer substrate; at least one of the transfer substrate and the driving motherboard includes at least one supporting structure;

[0072] connecting the light-emitting device on the transfer substrate to the pad on the driving motherboard; the transfer substrate and the driving motherboard are arranged opposite to each other, the support structure of one of the transfer substrate and the driving motherboard abuts against the other, and the support structure is located in the spacer area;

[0073] Remove the transfer substrate.

[0074] According to some exemplary embodiments, the driving motherboard includes at least one supporting structure; the at least one supporting structure is disposed on a side of the substrate motherboard close to the plurality of pads; and the supporting structure is disposed in the spacer area.

[0075] According to some exemplary embodiments, the transfer substrate has multiple transfer areas, and there is a support area between two adjacent transfer areas. When the transfer substrate and the driving motherboard are arranged relative to each other, the positive projection of the transfer area on the driving motherboard coincides with the light-emitting area; the transfer substrate includes a second substrate and at least one supporting structure; the at least one supporting structure is arranged on the second substrate; and the supporting structure is arranged in the supporting area.

[0076] In yet another aspect, a display device is provided, wherein the display device comprises the light-emitting substrate according to any one of the above items. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] Features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments of the present disclosure with reference to the accompanying drawings.

[0078] FIG1 is a structural diagram of a display device according to some embodiments;

[0079] FIG2 is another structural diagram of a display device according to some embodiments;

[0080] FIG3 is a cross-sectional view along the cutting line AA in FIG1 ;

[0081] FIG4 is another cross-sectional view along the cutting line AA in FIG1 ;

[0082] FIG5 is a structural diagram of a driving motherboard according to some embodiments;

[0083] FIG6 is a cross-sectional view along the cutting line BB in FIG5;

[0084] FIG7 is another cross-sectional view along the cutting line BB in FIG5;

[0085] FIG8 is a structural diagram of a support member, a pad, and a light emitting device according to some embodiments;

[0086] FIG9 is a structural diagram of a plurality of support members forming a continuous whole-layer structure according to some embodiments;

[0087] FIG10 is another structural diagram of a driving motherboard according to some embodiments;

[0088] FIG11 is a cross-sectional view along the cutting line CC in FIG10;

[0089] FIG12 is another cross-sectional view along the cutting line CC in FIG10;

[0090] FIG13 is another structural diagram of a light-emitting motherboard according to some embodiments;

[0091] FIG14 is a structural diagram of a plurality of support members forming a strip-shaped structure according to some embodiments;

[0092] FIG15 is a structural diagram of a light-emitting substrate according to some embodiments;

[0093] FIG16 is a cross-sectional view along the cutting line DD in FIG15;

[0094] FIG17 is another cross-sectional view along the cutting line DD in FIG15;

[0095] FIG18 is a structural diagram of a plurality of support members forming a continuous whole-layer structure according to some embodiments;

[0096] FIG19 is another structural diagram of a light-emitting substrate according to some embodiments;

[0097] FIG20 is another structural diagram of a light emitting substrate according to some embodiments;

[0098] FIG21 is another structural diagram of a light emitting substrate according to some embodiments;

[0099] FIG22 is another structural diagram of a light-emitting substrate according to some embodiments;

[0100] FIG23 is another structural diagram of a light-emitting substrate according to some embodiments;

[0101] FIG24 is a cross-sectional view along the cutting line EE in FIG23;

[0102] FIG25 is another cross-sectional view along the cutting line EE in FIG23;

[0103] FIG26 is another structural diagram of a light-emitting substrate according to some embodiments;

[0104] FIG27 is a structural diagram of a plurality of support members forming a strip-shaped structure according to some embodiments;

[0105] FIG28 is a flow chart of a method for preparing a light-emitting motherboard according to some embodiments;

[0106] FIG29 is a step diagram of a method for preparing a light-emitting motherboard according to some embodiments;

[0107] FIG30 is a diagram showing steps of another method for preparing a light-emitting motherboard according to some embodiments;

[0108] FIG31 is a flow chart of another method for preparing a light-emitting motherboard according to some embodiments;

[0109] FIG32 is a plan view of a driving motherboard according to some embodiments;

[0110] FIG33 is a cross-sectional view of a driving motherboard according to some embodiments, wherein FIG33 schematically shows a cross-sectional view taken along line FF in FIG32 .

[0111] FIG34 is a plan view of a light-emitting motherboard according to some embodiments;

[0112] FIG35 is a cross-sectional view of a light-emitting motherboard according to some embodiments, wherein FIG35 schematically shows a cross-sectional view taken along line GG in FIG34;

[0113] FIG36 is a plan view of a light-emitting motherboard according to some embodiments;

[0114] FIG37 is a cross-sectional view of a light-emitting motherboard according to some embodiments, wherein FIG37 schematically shows a cross-sectional view taken along line HH in FIG36;

[0115] FIG38 is a plan view of a transfer substrate according to some embodiments;

[0116] FIG39 is a cross-sectional view of a transfer substrate according to some embodiments, wherein FIG39 schematically shows a cross-sectional view taken along line II in FIG38 ;

[0117] FIG40 is a plan view of a transfer substrate according to some embodiments;

[0118] FIG41 is a cross-sectional view of a transfer substrate according to some embodiments, wherein FIG41 schematically shows a cross-sectional view taken along line JJ of FIG40 ;

[0119] FIG42 is a step diagram of a method for preparing a light-emitting motherboard according to some embodiments;

[0120] FIG43 is a step diagram of a method for preparing a light-emitting motherboard according to some embodiments;

[0121] FIG44 is a plan view of a light emitting substrate according to some embodiments;

[0122] FIG45 is a cross-sectional view of a light emitting substrate according to some embodiments, wherein FIG45 schematically shows a cross-sectional view taken along line KK of FIG44 ;

[0123] FIG46 is a plan view of a light emitting substrate according to some embodiments;

[0124] FIG47 is a cross-sectional view of a light emitting substrate according to some embodiments, wherein FIG47 schematically shows a cross-sectional view taken along line LL of FIG46 . DETAILED DESCRIPTION

[0125] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0126] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0127] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0128] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0129] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0130] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0131] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0132] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0133] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0134] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0135] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0136] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0137] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0138] It should be noted that the directional terms such as "upper" and "lower" described in the embodiments of the present application are described from the perspectives shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should be understood that when it is mentioned that an element is connected to another element "on" or "under", it can not only be directly connected to the other element "on" or "under", but also indirectly connected to the other element "on" or "under" through an intermediate element.

[0139] FIG. 1 is a structural diagram of a display device according to some embodiments; FIG. 2 is another structural diagram of a display device according to some embodiments.

[0140] As shown in FIG1 , some embodiments of the present disclosure provide a display device 1000 . The display device 1000 may be any device that displays either moving (eg, video) or fixed (eg, still image) content, and either text or images.

[0141] Exemplarily, the display device 1000 can be any product or component with a display function, such as a television, a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a wearable device, an augmented reality (AR) device, a virtual reality (VR) device, a vehicle display, or an aircraft display.

[0142] In some examples, as shown in FIG1 , the display device 1000 may be a portable display product, such as the mobile phone shown in FIG1 .

[0143] In some other examples, as shown in FIG2 , the display device 1000 may be a wearable device. For example, the display device 1000 may be a watch as shown in FIG2 .

[0144] FIG3 is a cross-sectional view along the cutting line AA in FIG1 ; FIG4 is another cross-sectional view along the cutting line AA in FIG1 .

[0145] In some embodiments, as shown in FIG. 3 and FIG. 4 , the display device 1000 includes a light emitting substrate 100 , a driving circuit board 200 , a housing 300 , and a cover plate 400 .

[0146] The cover plate 400 is disposed on the light-emitting side of the light-emitting substrate 100. The driving circuit board 200 is disposed on the non-light-emitting side of the light-emitting substrate 100 and is connected to the light-emitting substrate 100 to provide a light-emitting signal to the light-emitting substrate 100.

[0147] Among them, the light-emitting substrate 100 has a relative light-emitting side and a non-light-emitting side. The light-emitting side refers to the side of the light-emitting substrate 100 that can emit light (the upper side of the light-emitting substrate 100 in Figures 3 and 4), and the non-light-emitting side refers to the other side opposite to the light-emitting side (the lower side of the light-emitting substrate 100 in Figures 3 and 4).

[0148] In addition, the shell 300 can be a box-shaped structure with an opening, the light-emitting substrate 100 and the driving circuit board 200 can be arranged in the shell 300, and the cover plate 400 is arranged on the light-emitting side of the light-emitting substrate 100 and is located at the opening of the shell 300.

[0149] It is understandable that the display device 1000 may be a liquid crystal display (LCD) or a mini / micro light emitting display (MLED), which is not specifically limited in the embodiments of the present disclosure.

[0150] In some embodiments, as shown in FIG3 , the display device 1000 may be a liquid crystal display device. In this case, the light-emitting substrate 100 may serve as a backlight source in the liquid crystal display device, providing backlight for the display panel 500. The display panel 500 may adjust the intensity (grayscale) of light passing through the display panel 500 to display an image.

[0151] 3 , the display device 1000 further includes a display panel 500 and a plurality of optical films 600 . The display panel 500 is disposed on the light emitting side of the light emitting substrate 100 , and the plurality of optical films 600 are disposed between the display panel 500 and the light emitting substrate 100 .

[0152] The light-emitting substrate 100 can directly emit white light, which is then homogenized by the multiple optical films 600 and then emitted toward the display panel 500. Alternatively, the light-emitting substrate 100 can also emit light of other colors (e.g., blue light), which is then color-converted and homogenized by the multiple optical films 600 and then emitted toward the display panel 500.

[0153] In other embodiments, referring to FIG4 , the display device 1000 may be a micro-luminescent display device. In this case, the light-emitting substrate 100 may serve as the display panel of the micro-luminescent display device, directly providing a display. The light-emitting substrate 100 may emit light of multiple colors (e.g., red, blue, and green) to achieve full-color display.

[0154] The following uses the display device 1000 as a micro-luminescent display device as an example to exemplify some embodiments of the present disclosure, but the implementation of the present disclosure is not limited thereto, and any other display device can also be considered as long as the same technical concept is applied.

[0155] In order to reduce the preparation cost of the light-emitting substrate, currently, the light-emitting substrate is prepared by first preparing a light-emitting motherboard and then cutting the light-emitting motherboard into multiple light-emitting substrates (for example, four light-emitting substrates).

[0156] 5 is a structural diagram of a driving motherboard according to some embodiments; FIG. 6 is a cross-sectional view along the cutting line BB in FIG. 5 ; and FIG. 7 is another cross-sectional view along the cutting line BB in FIG. 5 .

[0157] In some embodiments, as shown in FIG. 5 , FIG. 6 and FIG. 7 , the light-emitting motherboard 10 includes a driving motherboard 11 and a plurality of light-emitting devices 12 .

[0158] In some embodiments, as shown in FIG5 , the driving motherboard 11 has a plurality of light-emitting areas 101, and the plurality of light-emitting areas 101 are arranged in a plurality of rows and columns, each row including at least two light-emitting areas 101 arranged along a second direction Y, and each column including at least two light-emitting areas 101 arranged along a third direction Z. The second direction Y and the third direction Z intersect, for example, the second direction Y and the third direction Z are perpendicular.

[0159] There is a spacer 102 between two adjacent light-emitting areas 101. Exemplarily, the size of the spacer 102 is 3 mm to 10 mm, for example, the size of the spacer 102 is 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm or 10 mm.

[0160] In some embodiments, the driving motherboard 11 includes a substrate motherboard 111 and a plurality of pads 112 .

[0161] The substrate motherboard 111 may be a flexible substrate motherboard 111 or a rigid substrate motherboard 111. The material used for the substrate motherboard 111 may include polymer resin or glass. For example, the substrate motherboard 111 may be flexible, and the material used for the substrate motherboard 111 includes a polymer resin, such as polyethersulfone (PES), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate two formal acid glycol ester (PEN), polyethylene terephthalate (PET), polyphenylene sulfide granula (PPS), polyimide (PI), polycarbonate (PC), and cellulose acetate propionate (CAP). For example, the substrate motherboard 111 may be rigid, and include a glass material containing SiO2 as a main component.

[0162] It should be noted that the substrate motherboard 111 can be a single-layer structure or a multi-layer structure. For example, in the case where the substrate motherboard 111 is a multi-layer structure, the substrate motherboard 111 can include a base and a buffer layer provided on the base. The buffer layer is provided on the base. The material used for the buffer layer can include inorganic insulating materials such as silicon nitride (SiNx, x>0), silicon oxynitride (SiON) and silicon oxide (SiOx, x>0). The buffer layer is used to provide a good foundation for the formation of the thin film when the thin film is formed on the substrate motherboard 111.

[0163] As shown in Figures 5, 6, and 7, a plurality of solder pads 112 are disposed on a substrate motherboard 111 and disposed in the light-emitting area 101. Exemplarily, the plurality of second solder pads 1122 are arranged in multiple rows and columns, with each row including at least two solder pads 112 disposed along the second direction Y, and each column including at least two solder pads 112 disposed along the third direction Z. Exemplarily, the distance between two adjacent solder pads is 20 μm to 30 μm. For example, the distance between two adjacent solder pads is 20 μm, 25 μm, or 30 μm.

[0164] The material of the pad 112 may include metal. For example, the material of the pad 112 includes copper or silver. In this case, the pad 112 has good conductivity and low resistance.

[0165] As shown in Figures 5, 6 and 7, multiple light emitting devices 12 are disposed on a side of multiple solder pads 112 away from the substrate motherboard 111. One light emitting device 12 is connected to one solder pad 112. Exemplarily, one light emitting device 12 is bonded to one solder pad 112.

[0166] The light emitting device 12 may include, for example, a Micro LED and / or a Mini LED. For example, the size (eg, length) of a Micro LED is less than 50 μm; the size (eg, length) of a Mini LED is 50 μm to 200 μm.

[0167] In related technologies, the light-emitting device can be transferred to the driving motherboard through the ODF mass bonding process and connected to the pad. The preparation method of the light-emitting motherboard including the ODF mass bonding process includes:

[0168] A transfer substrate and a driver motherboard are provided; the transfer substrate includes a transfer substrate and a plurality of light-emitting devices, and the plurality of light-emitting devices are disposed on the transfer substrate. The transfer substrate and the driver motherboard are bonded together. The transfer substrate and the driver motherboard are disposed opposite each other, with the plurality of light-emitting devices located between the transfer substrate and the driver motherboard. Air between the transfer substrate and the driver motherboard is extracted, and the light-emitting devices and the pads are bonded. The transfer substrate and the sealant are removed. The transfer substrate protrudes above the edge of the light-emitting area, resulting in a large distance between at least a portion of the plurality of pads at the edge of the light-emitting area and the light-emitting devices disposed opposite the pads. This prevents bonding between the pads and the light-emitting devices, resulting in a low bonding yield.

[0169] FIG8 is a structural diagram of a support member, a pad, and a light emitting device according to some embodiments.

[0170] To address the above technical issues, as shown in Figures 5, 6, and 7, some embodiments of the present disclosure provide a driver motherboard 11 that further includes at least one support member 113. For example, the driver motherboard 11 further includes one support member 113, ten support members 113, or one hundred support members 113. At least one support member 113 (or all support members 113) is disposed on a side of the substrate motherboard 111 near the plurality of pads 112, and the support member 113 is disposed in the spacer area 102.

[0171] In the first direction X, at least one support member 113 has a size greater than or equal to the sum of the size of the solder pad 112 and the size of the light-emitting device 12 connected to the solder pad 112. As shown in FIG8 , the size of the support member 113 refers to the distance h1 between the support member 113 and the surface of the substrate motherboard 111. The size of the solder pad 112 refers to the distance h2 between the solder pad 112 and the surface of the substrate motherboard 111. The size of the light-emitting device 12 refers to the distance h3 between the light-emitting device 12 and the surface of the substrate motherboard 111.

[0172] Based on this, in the process of bonding the light-emitting device 12 and the pad 112, the support member 113 can abut against the transfer substrate. The support member 113 is used to support the transfer substrate above the spacer area 102, thereby reducing the risk of the transfer substrate above the spacer area 102 being recessed, causing the transfer substrate above the edge of the light-emitting area 101 to bulge, reducing the distance between the pad 112 and the light-emitting device 12 arranged opposite to the pad 112, and helping to improve the bonding yield.

[0173] It should be noted that the transfer substrate includes a second substrate and a transfer block, and a plurality of transfer blocks are arranged on the second substrate. At least a portion of the transfer block is configured to be connected to the light emitting device. Exemplarily, the light emitting device and the transfer block are bonded.

[0174] In some examples, as shown in FIG6 , during the bonding process of the light-emitting device 12 and the pad 112, a support member 113 abuts against a transfer block, thereby supporting the transfer substrate above the spacer 102. At this time, along the first direction X, the size of the support member 113 is equal to the sum of the size of the pad 112 and the size of the light-emitting device 12 bonded to the pad 112.

[0175] For example, the material of the support member 113 may include an organic resin, for example, the material of the support member 113 includes polyimide. The material of the transfer block may include polydimethylsiloxane (English: Polydimethylsiloxane, abbreviated: PDMS).

[0176] In other examples, as shown in Figure 7, during the process of bonding the light-emitting device 12 and the pad 112, the support member 113 abuts against the second substrate, so that the support member 113 supports the transfer substrate above the spacer 102, and along the first direction X, the size of the support member 113 is equal to the sum of the size of the pad 112, the size of the light-emitting device 12 bonded to the pad 112, and the size of the transfer block, that is, the size of the support member 113 is larger than the sum of the size of the pad 112 and the size of the light-emitting device 12 bonded to the pad 112.

[0177] For example, the material of the support member 113 may include polystyrene (English: Polystyrene, abbreviated: PS).

[0178] In some embodiments, as shown in Figures 6 and 7, the driver motherboard 11 further includes a driver circuit stack 114. The driver circuit stack 114 is disposed between the substrate motherboard 111 and the plurality of solder pads 112. At least one support member 113 is disposed on a side of the driver circuit stack 114 away from the substrate motherboard 111 and connected to the driver circuit stack 114. The driver circuit stack 114 is connected to the plurality of solder pads 112. In this manner, the circuit board can provide signals to the plurality of light-emitting devices 12 via the driver circuit stack 114, thereby driving the light-emitting devices 12 to emit light.

[0179] In some embodiments, as shown in FIG. 5 and FIG. 6 , the light emitting devices 12 connected to the plurality of pads 112 emit the same light color.

[0180] In this case, the light-emitting substrate 100 formed by cutting the light-emitting motherboard 10 only emits light of one color. At this time, the light-emitting substrate 100 serves as a backlight source in the liquid crystal display device, and is used to provide backlight for the display panel 500 .

[0181] As shown in Figures 5, 6, and 7, the driver motherboard 11 includes multiple support members 113. The multiple solder pads 112 within the light-emitting area 101 and the multiple support members 113 in the spacer area 102 adjacent to the light-emitting area 101 are arranged in multiple rows and columns. At least one row includes solder pads 112 and support members 113 arranged along the second direction Y; and / or at least one column includes solder pads 112 and support members 113 arranged along the third direction Z.

[0182] Along the second direction Y and / or the third direction Z, the spacing between two adjacent pads 112 is a first spacing d1, the spacing between two adjacent support members 113 is a second spacing d2, and the spacing between adjacent pads 112 and support members 113 is a third spacing d3. The first spacing d1, the second spacing d2, and the third spacing d3 are substantially equal.

[0183] In this manner, the plurality of pads 112 and the plurality of support members 113 are arranged at equal intervals in the second direction Y. Furthermore, the plurality of pads 112 and the plurality of support members 113 are arranged at equal intervals in the third direction Z. This improves the force uniformity applied to the driving motherboard 11 and further enhances the bonding yield.

[0184] The first spacing d1 refers to the distance between the geometric centers of two adjacent pads 112. The second spacing d2 refers to the distance between the geometric centers of two adjacent support members 113. The third spacing d3 refers to the distance between the geometric centers of adjacent pads 112 and support members 113.

[0185] FIG. 9 is a structural diagram illustrating a plurality of support members forming a continuous whole-layer structure according to some embodiments.

[0186] In some embodiments, as shown in FIG9 , multiple support members 113 belonging to the same spacer 102 are connected to form a continuous layer structure. Arranged in this manner, the difficulty of preparing the support members 113 can be reduced.

[0187] It should be noted that a first connecting member 6 is provided between two adjacent supporting members 113, and the two adjacent supporting members 113 are connected by the first connecting member 6. The material of the first connecting member 6 is the same as that of the supporting members 113.

[0188] FIG10 is another structural diagram of a driving motherboard according to some embodiments; FIG11 is a cross-sectional view along the cutting line CC in FIG10; and FIG12 is another cross-sectional view along the cutting line CC in FIG10.

[0189] In some embodiments, as shown in Figures 10, 11, and 12, the multiple light-emitting devices 12 within the light-emitting area 101 include multiple red light-emitting devices 121, multiple blue light-emitting devices 122, and multiple green light-emitting devices 123. The red light-emitting devices 121 emit red, the blue light-emitting devices 122 emit blue, and the green light-emitting devices 123 emit green. Along a first direction X, the red light-emitting devices 121 are larger than the blue light-emitting devices 122, and the blue light-emitting devices 122 are equal to the green light-emitting devices 123. Exemplarily, the difference between the sizes of the red light-emitting devices 121 and the blue light-emitting devices 122 is 2.5 μm.

[0190] The plurality of pads 112 within the light-emitting area 101 include a plurality of first pads 1121, a plurality of second pads 1122, and a plurality of third pads 1123. The first pads 1121 are connected to the red light-emitting device 121, the second pads 1122 are connected to the blue light-emitting device 122, and the third pads 1123 are connected to the green light-emitting device 123. Along the first direction X, the sizes of the first pads 1121, the second pads 1122, and the third pads 1123 are equal.

[0191] In this way, the light-emitting substrate 100 formed by cutting the light-emitting motherboard 10 can emit light of multiple colors to achieve full-color display.

[0192] In this case, the driving circuit stack 114 may include a plurality of pixel circuits. The plurality of pixel circuits are located in the light-emitting area 101. The plurality of pixel circuits are arranged in multiple rows and columns, with each row including at least two pixel circuits arranged along the second direction Y, and each column including at least two pixel circuits arranged along the third direction Z.

[0193] The pixel circuit includes a plurality of thin-film transistors (TFTs) and at least one storage capacitor (C), wherein the plurality of transistors include at least one of amorphous silicon transistors, low-temperature polysilicon transistors, and oxide transistors.

[0194] The transistors used in the circuits provided in the embodiments of the present disclosure may be thin film transistors, field effect transistors, or other switching devices with the same characteristics.

[0195] 10 , the driving motherboard 11 includes a plurality of support members 113 . Along the second direction Y, the plurality of support members 113 in the spacer area 102 adjacent to the light emitting area 101 include a plurality of first support members 1131 , a plurality of second support members 1132 , and a plurality of third support members 1133 .

[0196] Along the first direction X, the size of the first support member 1131 is greater than or equal to the sum of the size of the first pad 1121 and the size of the red light-emitting device 121 connected to the first pad 1121. The size of the second support member 1132 is greater than or equal to the sum of the size of the second pad 1122 and the size of the blue light-emitting device 122 connected to the second pad 1122. The size of the third support member 1133 is greater than or equal to the sum of the size of the third pad 1123 and the size of the green light-emitting device 123 connected to the third pad 1123. The size of the first support member 1131 is greater than the size of the second support member 1132, and the size of the second support member 1132 is equal to the size of the third support member 1133.

[0197] In this way, the first support member 1131 is used to support the transfer substrate during the bonding process of the red light-emitting device 121. The second support member 1132 is used to support the transfer substrate during the bonding process of the blue light-emitting device 122. The third support member 1133 is used to support the transfer substrate during the bonding process of the green light-emitting device 123.

[0198] It should be understood that when the size of the support member 113 is equal to the sum of the size of the pad 112 and the size of the light-emitting device 12 connected to the pad 112, the size of the transfer block along the first direction X is greater than or equal to the size difference between the size of the red light-emitting device 121 and the size of the blue light-emitting device 122.

[0199] Exemplarily, the size difference between the red light emitting device 121 and the blue light emitting device 122 is 2.5 μm, and the size of the transfer block 2 is greater than 2.5 μm.

[0200] In this way, during the bonding process of the blue light-emitting device 122 or the green light-emitting device 123, a gap is created between the first support member 1131 and the transfer substrate. This reduces the risk of the transfer substrate protruding above the first support member 1131, thereby reducing the risk of the transfer substrate protruding above the edge of the light-emitting area 101. This also reduces the distance between the outermost second pads 1122 or third pads 1123 of the light-emitting area 101 and the light-emitting devices 12 connected thereto, thereby improving the bonding yield.

[0201] In the case where the size of the support member 113 is larger than the sum of the size of the pad 112 and the size of the light emitting device 12 connected to the pad 112 , the support member 113 has elasticity.

[0202] In this way, during the process of bonding the blue light-emitting device 122 or the green light-emitting device 123, the first support member 1131 can be deformed, enabling the second soldering pad 1122 or the third soldering pad 1123 to contact the light-emitting device 12 arranged opposite thereto, so that the second soldering pad 1122 or the third soldering pad 1123 and the light-emitting device 12 arranged opposite thereto are bonded, which can improve the bonding yield.

[0203] FIG. 13 is another structural diagram of a light-emitting motherboard according to some embodiments.

[0204] In some embodiments, as shown in FIG13 , the plurality of pads 112 of the light-emitting area 101 are arranged into multiple rows and columns, and each row includes a first pad 1121, a second pad 1122, and a third pad 1123 arranged along the second direction Y. In the orthographic projection onto the substrate motherboard 111, the geometric center of the first pad 1121, the geometric center of the second pad 1122, and the geometric center of the third pad 1123 in each row are located on the first straight line L1.

[0205] The multiple support members 113 of the spacing area 102 adjacent to the light-emitting area 101 are arranged in multiple rows and columns, and each row includes a first support member 1131, a second support member 1132 and a third support member 1133 arranged along the second direction Y. In the orthographic projection onto the substrate motherboard 111, the geometric center of the first support member 1131, the geometric center of the second support member 1132 and the geometric center of the third support member 1133 in each row are located on the second straight line L2.

[0206] Therein, at least one first straight line L1 coincides with one second straight line L2 and / or there is a distance between the first straight line L1 and the second straight line L2.

[0207] In some embodiments, at least one first straight line L1 coincides with a second straight line L2, that is, at least one row includes a first solder pad 1121, a second solder pad 1122, a third solder pad 1123, a first support member 1131, a second support member 1132 and a third support member 1133 arranged along the second direction Y, for example, one, five or ten first straight lines L1 coincide with a second straight line L2.

[0208] In some examples, along the second direction Y, the distance between two adjacent first pads 1121 is equal to the distance between two adjacent first support members 1131 .

[0209] Arranged in this manner, the force uniformity of the driving motherboard 11 when bonding the red light-emitting device 121 can be improved, which is beneficial to further improve the bonding yield of the red light-emitting device 121.

[0210] It should be noted that, along the second direction Y, the distance between two adjacent first pads 1121 may also be equal to the distance between adjacent first pads 1121 and the first support member 1131 .

[0211] In some other examples, along the second direction Y, the distance between two adjacent second pads 1122 is equal to the distance between two adjacent second support members 1132 .

[0212] Arranged in this manner, the force uniformity of the driving motherboard 11 when bonding the blue light-emitting device 122 can be improved, which is beneficial to further improve the bonding yield of the blue light-emitting device 122.

[0213] It should be noted that, along the second direction Y, the distance between two adjacent second pads 1122 may also be equal to the distance between adjacent second pads 1122 and the second support member 1132 .

[0214] In some other examples, along the second direction Y, the distance between two adjacent third pads 1123 is equal to the distance between two adjacent third support members 1133 .

[0215] Arranged in this manner, the force uniformity of the driving motherboard 11 when bonding the green light-emitting device 123 can be improved, which is beneficial to further improve the bonding yield of the green light-emitting device 123.

[0216] It should be noted that, along the second direction Y, the distance between two adjacent third pads 1123 may also be equal to the distance between adjacent third pads 1123 and the third support member 1133 .

[0217] In some embodiments, as shown in FIG13 , the geometric center of the orthographic projection of each column of first solder pads 1121 on the substrate motherboard 111 is located on the third straight line L3, and the geometric center of the orthographic projection of each column of first support members 1131 on the substrate motherboard 111 is located on the fourth straight line L4, wherein at least one third straight line L3 coincides with one fourth straight line L4 and / or there is a gap between the third straight line L3 and the second straight line L4.

[0218] Exemplarily, at least one third straight line L3 coincides with a fourth straight line L4, that is, at least one column includes the first pads 1121 and the first support members 1131 arranged along the third direction Z. For example, one, five or ten third straight lines L3 coincide with a fourth straight line L4.

[0219] In some examples, along the third direction Z, the distance between two adjacent first pads 1121 is equal to the distance between two adjacent first support members 1131 .

[0220] Arranged in this manner, the force uniformity of the driving motherboard 11 when bonding the red light-emitting device 121 can be improved, which is beneficial to further improve the bonding yield of the red light-emitting device 121.

[0221] It should be noted that, along the third direction Z, the distance between two adjacent first pads 1121 may also be equal to the distance between adjacent first pads 1121 and the first support member 1131 .

[0222] In some embodiments, as shown in FIG13 , the geometric center of the orthographic projection of each column of second solder pads 1122 on the substrate motherboard 111 is located on the fifth straight line L5, and the geometric center of the orthographic projection of each column of second support members 1132 on the substrate motherboard 111 is located on the sixth straight line L6, wherein at least one fifth straight line L5 coincides with one sixth straight line L6 and / or there is a gap between the fifth straight line L5 and the sixth straight line L6.

[0223] Exemplarily, at least one fifth straight line L5 coincides with one sixth straight line L6, that is, at least one column includes second pads 1122 and second support members 1132 arranged along the third direction Z. For example, one, five, or ten fifth straight lines L5 coincide with one sixth straight line L6.

[0224] In some examples, along the third direction Z, the distance between two adjacent second pads 1122 is equal to the distance between two adjacent second support members 1132 .

[0225] Arranged in this manner, the force uniformity of the driving motherboard 11 when bonding the blue light-emitting device 122 can be improved, which is beneficial to further improve the bonding yield of the blue light-emitting device 122.

[0226] It should be noted that, along the third direction Z, the distance between two adjacent second pads 1122 may also be equal to the distance between adjacent second pads 1122 and the second support member 1132 .

[0227] In some embodiments, as shown in FIG13 , the geometric center of the orthographic projection of each column of third solder pads 1123 on the substrate motherboard 111 is located on the seventh straight line L7, and the geometric center of the orthographic projection of each column of third support members 1133 on the substrate motherboard 111 is located on the eighth straight line L8, wherein at least one seventh straight line L7 coincides with one eighth straight line L8 and / or there is a gap between the seventh straight line L7 and the eighth straight line L8.

[0228] Exemplarily, at least one seventh straight line L7 coincides with one eighth straight line L8, that is, at least one column includes third pads 1123 and third support members 1133 arranged along the third direction Z. For example, one, five, or ten seventh straight lines L7 coincide with one eighth straight line L8.

[0229] In some examples, along the third direction Z, the distance between two adjacent third pads 1123 is equal to the distance between two adjacent third support members 1133 .

[0230] Arranged in this manner, the force uniformity of the driving motherboard 11 when bonding the green light-emitting device 123 can be improved, which is beneficial to further improve the bonding yield of the green light-emitting device 123.

[0231] It should be noted that, along the third direction Z, the distance between two adjacent third pads 1123 may also be equal to the distance between adjacent third pads 1123 and the third support member 1133 .

[0232] FIG. 14 is a structural diagram showing a plurality of support members forming a strip-shaped structure according to some embodiments.

[0233] In some embodiments, as shown in FIG14 , the light emitting devices 12 connected to the pads 112 in the same column emit the same color, and multiple support members 113 in the same column are connected to form a strip structure. This arrangement can reduce the difficulty of manufacturing the support members 113.

[0234] It should be noted that, along the third direction Z, a second connecting member 7 is provided between two adjacent support members 113 , and the two adjacent support members 113 are connected by the second connecting member 7 . The material of the second connecting member 7 is the same as that of the support members 113 .

[0235] In some embodiments, as shown in FIG. 5 , the driving motherboard 11 further has a first peripheral area 103 . The first peripheral area 103 is disposed around the plurality of light-emitting areas 101 , and the support member 113 is also disposed in the first peripheral area 103 .

[0236] In this manner, the support member 113 can support the transfer substrate above the first peripheral region 103 , thereby reducing the risk of the transfer substrate above the first peripheral region 103 being recessed and improving the bonding yield.

[0237] In some examples, as shown in Figure 5, multiple support members 113 located in the first peripheral area 103 are arranged into multiple rows and columns, each row includes at least two support members 113 arranged along the second direction Y, and each column includes at least two support members 113 arranged along the third direction Z.

[0238] In the orthographic projection onto the substrate motherboard 111 , the distance between the outermost support member 113 among the plurality of support members 113 arranged in the array and the plurality of light-emitting areas 101 is greater than or equal to 10 mm.

[0239] In this manner, a larger number of support members 113 can be provided in the first peripheral area 103 , thereby improving the force uniformity of the driving motherboard 11 located in the first peripheral area 103 and improving the bonding yield.

[0240] In some embodiments, as shown in FIG. 7 , the support member 113 is elastic. In the first direction X, the size of the support member 113 is larger than the sum of the size of the pad 112 and the size of the light emitting device 12 connected to the pad 112 .

[0241] In some embodiments, as shown in FIG5 , the driving motherboard 11 further includes a glue-coated area 104 disposed around the first peripheral area 103. The glue-coated area 104 is configured to be provided with a sealant. For example, the distance between the outer boundary of the glue-coated area 104 and the inner boundary of the glue-coated area 104 is greater than 5 mm.

[0242] In some embodiments, as shown in FIG. 5 , a plurality of cutting lines L are provided on the light-emitting motherboard 10 , and a cutting device can cut along the plurality of cutting lines to form a plurality of light-emitting substrates 100 .

[0243] For example, a cutter wheel cutting device or a laser cutting device can be used to cut the light-emitting motherboard 10 along a cutting line L to form the light-emitting substrate 100. The width of the cutter wheel and the diameter of the laser are generally 100 μm to 200 μm. The cutting line is located in the spacer region 102 and / or the first peripheral region 103, and the distance between the cutting line and the light-emitting region 101 is greater than 200 μm.

[0244] In this manner, during the process of forming the light-emitting substrate 100 , there is a gap between the cutter wheel or the laser and the light-emitting area 101 , which can reduce the risk of the cutter wheel or the laser cutting into the light-emitting area 101 .

[0245] The structure of the light emitting substrate 100 obtained by cutting is described below by way of example.

[0246] 15 is a structural diagram of a light-emitting substrate according to some embodiments; FIG16 is a cross-sectional view along the cutting line DD in FIG15 ; and FIG17 is another cross-sectional view along the cutting line DD in FIG15 .

[0247] As shown in Figures 15, 16 and 17, the light-emitting substrate 100 includes a light-emitting area 101 and a second peripheral area 1002 disposed on at least one side of the light-emitting area 101. Figure 15 illustrates an example in which the second peripheral area B surrounds the light-emitting area 101.

[0248] The second peripheral region 1002 includes the light-emitting region 101 and a spacing region 102 between the cutting lines L adjacent to the light-emitting region 101 .

[0249] As shown in FIG. 15 , FIG. 16 and FIG. 17 , the light emitting substrate 100 includes a substrate 110 , a plurality of pads 112 , a plurality of light emitting devices 12 and at least one support member 113 .

[0250] The material and structure of the substrate 110 are the same as those of the substrate motherboard 111 mentioned above, and are not described in detail here.

[0251] A plurality of pads 112 are disposed on the substrate 110 and disposed in the light emitting area 101. For example, the plurality of second pads 1122 are arranged in a plurality of rows and columns, each row including at least two pads 112 disposed along the second direction Y, and each column including at least two pads 112 disposed along the third direction Z.

[0252] The plurality of light emitting devices 12 are disposed on a side of the plurality of solder pads 112 away from the substrate 110 and in the light emitting region 101 , with one light emitting device 12 being connected to one solder pad 112 .

[0253] At least one support member 113 is disposed on a side of the substrate 110 near the plurality of pads 112 and in the second peripheral region 1002. Along a first direction X, at least one support member 113 has a size greater than or equal to the sum of the size of the pads 112 and the size of the light-emitting device 12 connected to the pads 112. The first direction X is perpendicular to the substrate 110.

[0254] In some embodiments, as shown in FIG. 15 , FIG. 16 , and FIG. 17 , the light emitting devices 12 connected to the plurality of pads 112 emit the same light color.

[0255] In this case, the light emitting substrate 100 only emits light of one color. At this time, the light emitting substrate 100 serves as a backlight source in the liquid crystal display device, and is used to provide backlight for the display panel 500 .

[0256] As shown in Figures 15, 16, and 17, the light-emitting substrate 100 includes a plurality of support members 113. The plurality of pads 112 and the plurality of support members 113 are arranged in multiple rows and columns. At least one row includes pads 112 and support members 113 arranged along the second direction Y; and / or at least one column includes pads 112 and support members 113 arranged along the third direction Z.

[0257] Along the second direction Y and / or the third direction Z, the spacing between two adjacent pads 112 is a first spacing d1, the spacing between two adjacent support members 113 is a second spacing d2, and the spacing between adjacent pads 112 and support members 113 is a third spacing d3. The first spacing d1, the second spacing d2 and the third spacing d3 are equal.

[0258] FIG. 18 is a structural diagram illustrating a plurality of support members forming a continuous, integral layer structure according to some embodiments.

[0259] In some embodiments, as shown in FIG18 , multiple support members 113 located on one side of the light-emitting area 101 are connected to form a continuous layer structure. This arrangement can reduce the difficulty of preparing the support members 113 .

[0260] It should be noted that a first connecting member 6 is provided between two adjacent supporting members 113, and the two adjacent supporting members 113 are connected by the first connecting member 6. The material of the first connecting member 6 is the same as that of the supporting members 113.

[0261] FIG19 is another structural diagram of a light-emitting substrate according to some embodiments; FIG20 is yet another structural diagram of a light-emitting substrate according to some embodiments; and FIG21 is yet another structural diagram of a light-emitting substrate according to some embodiments.

[0262] In some embodiments, as shown in Figures 19, 20, and 21, the plurality of light-emitting devices 12 include a plurality of red light-emitting devices 121, a plurality of blue light-emitting devices 122, and a plurality of green light-emitting devices 123. The red light-emitting devices 121 emit red, the blue light-emitting devices 122 emit blue, and the green light-emitting devices 123 emit green. In this way, the light-emitting substrate 100 formed by cutting the light-emitting motherboard 10 can emit light of multiple colors, achieving a full-color display. The plurality of solder pads 112 include a first solder pad 1121, a plurality of second solder pads 1122, and a plurality of third solder pads 1123. The first solder pad 1121 is connected to the red light-emitting device 121, the second solder pad 1122 is connected to the blue light-emitting device 122, and the third solder pad 1123 is connected to the green light-emitting device 123.

[0263] The light emitting substrate 100 includes a plurality of support members 113. The plurality of support members 113 includes at least one of a plurality of first support members 1131, a plurality of second support members 1132, and a plurality of third support members 1133.

[0264] 19 , the plurality of support members 113 include a plurality of first support members 1131. Along the second direction Y, the plurality of first support members 1131 are located on one side of the light emitting area 101. Along the third direction Z, the plurality of first support members 1131 are arranged at intervals.

[0265] 20 , the plurality of support members 113 include a plurality of third support members 1133. Along the second direction Y, the plurality of third support members 1133 are located on one side of the light emitting area 101. Along the third direction Z, the plurality of third support members 1133 are arranged at intervals.

[0266] In yet other examples, as shown in FIG21 , the plurality of support members 113 include a plurality of first support members 1131 and a plurality of second support members 1132. Along the second direction Y, the plurality of first support members 1131 and the plurality of second support members 1132 are located on one side of the light-emitting area 101. Along the third direction Z, the plurality of first support members 1131 are arranged at intervals, and the plurality of second support members 1132 are arranged at intervals. The plurality of first support members 1131 are located on the side of the plurality of second support members 1132 that is closer to the light-emitting area 101.

[0267] FIG. 22 is another structural diagram of a light-emitting substrate according to some embodiments.

[0268] In yet other examples, as shown in FIG22 , the plurality of support members 113 include a plurality of second support members 1132 and a plurality of third support members 1133. Along the second direction Y, the plurality of second support members 1132 and the plurality of third support members 1133 are located on one side of the light-emitting area 101. Along the third direction Z, the plurality of second support members 1132 are arranged at intervals, and the plurality of third support members 1133 are arranged at intervals. The plurality of second support members 1132 are located on a side of the plurality of third support members 1133 that is away from the light-emitting area 101.

[0269] 23 is another structural diagram of a light-emitting substrate according to some embodiments; FIG24 is a cross-sectional view along the cutting line EE in FIG23 ; and FIG25 is another cross-sectional view along the cutting line EE in FIG23 .

[0270] In still other examples, as shown in FIG. 23 , FIG. 24 , and FIG. 25 , the plurality of support members 113 include a plurality of first support members 1131 , a plurality of second support members 1132 , and a plurality of third support members 113 .

[0271] In some embodiments, as shown in FIG26 , the plurality of pads 112 of the light-emitting area 101 are arranged into multiple rows and columns, and each row includes a first pad 1121, a second pad 1122, and a third pad 1123 arranged along the second direction Y. In the orthographic projection onto the substrate motherboard 111, the geometric center of the first pad 1121, the geometric center of the second pad 1122, and the geometric center of the third pad 1123 in each row are located on the first straight line L1.

[0272] Multiple support members 113 are arranged in multiple rows and columns, each row includes a first support member 1131, a second support member 1132 and a third support member 1133 arranged along the second direction Y. In the orthographic projection onto the substrate motherboard 111, the geometric center of the first support member 1131, the geometric center of the second support member 1132 and the geometric center of the third support member 1133 in each row are located on the second straight line L2.

[0273] Therein, at least one first straight line L1 coincides with one second straight line L2 and / or there is a distance between the first straight line L1 and the second straight line L2.

[0274] In some embodiments, at least one first straight line L1 coincides with a second straight line L2, that is, at least one row includes a first solder pad 1121, a second solder pad 1122, a third solder pad 1123, a first support member 1131, a second support member 1132 and a third support member 1133 arranged along the second direction Y, for example, one, five or ten first straight lines L1 coincide with the second straight line L2.

[0275] In some examples, along the second direction Y, the distance between two adjacent first pads 1121 is equal to the distance between two adjacent first support members 1131 .

[0276] Arranged in this manner, the force uniformity of the light-emitting substrate 100 when bonding the red light-emitting device 121 can be improved, which is beneficial to further improve the bonding yield of the red light-emitting device 121.

[0277] It should be noted that, along the second direction Y, the distance between two adjacent first pads 1121 may also be equal to the distance between adjacent first pads 1121 and the first support member 1131 .

[0278] In some other examples, along the second direction Y, the distance between two adjacent second pads 1122 is equal to the distance between two adjacent second support members 1132 .

[0279] Arranged in this manner, the force uniformity of the light-emitting substrate 100 when bonding the blue light-emitting device 122 can be improved, which is beneficial to further improve the bonding yield of the blue light-emitting device 122.

[0280] It should be noted that, along the second direction Y, the distance between two adjacent second pads 1122 may also be equal to the distance between adjacent second pads 1122 and the second support member 1132 .

[0281] In some other examples, along the second direction Y, the distance between two adjacent third pads 1123 is equal to the distance between two adjacent third support members 1133 .

[0282] Arranged in this manner, the force uniformity of the light-emitting substrate 100 when bonding the green light-emitting device 123 can be improved, which is beneficial to further improve the bonding yield of the green light-emitting device 123.

[0283] It should be noted that, along the second direction Y, the distance between two adjacent third pads 1123 may also be equal to the distance between adjacent third pads 1123 and the third support member 1133 .

[0284] In some embodiments, as shown in FIG26 , the geometric center of the orthographic projection of each column of first solder pads 1121 on the substrate motherboard 111 is located on the third straight line L3, and the geometric center of the orthographic projection of each column of first support members 1131 on the substrate motherboard 111 is located on the fourth straight line L4, wherein at least one third straight line L3 coincides with one fourth straight line L4 and / or there is a gap between the third straight line L3 and the second straight line L4.

[0285] Exemplarily, at least one third straight line L3 coincides with a fourth straight line L4, that is, at least one column includes the first pads 1121 and the first support members 1131 arranged along the third direction Z. For example, one, five or ten third straight lines L3 coincide with a fourth straight line L4.

[0286] In some examples, along the third direction Z, the distance between two adjacent first pads 1121 is equal to the distance between two adjacent first support members 1131 .

[0287] Arranged in this manner, the force uniformity of the light-emitting substrate 100 when bonding the red light-emitting device 121 can be improved, which is beneficial to further improve the bonding yield of the red light-emitting device 121.

[0288] It should be noted that, along the third direction Z, the distance between two adjacent first pads 1121 may also be equal to the distance between adjacent first pads 1121 and the first support member 1131 .

[0289] In some embodiments, as shown in FIG26 , the geometric center of the orthographic projection of each column of second solder pads 1122 on the substrate motherboard 111 is located on the fifth straight line L5, and the geometric center of the orthographic projection of each column of second support members 1132 on the substrate motherboard 111 is located on the sixth straight line L6, wherein at least one fifth straight line L5 coincides with one sixth straight line L6 and / or there is a gap between the fifth straight line L5 and the sixth straight line L6.

[0290] Exemplarily, at least one fifth straight line L5 coincides with one sixth straight line L6, that is, at least one column includes second pads 1122 and second support members 1132 arranged along the third direction Z. For example, one, five, or ten fifth straight lines L5 coincide with one sixth straight line L6.

[0291] In some examples, along the third direction Z, the distance between two adjacent second pads 1122 is equal to the distance between two adjacent second support members 1132 .

[0292] Arranged in this manner, the force uniformity of the light-emitting substrate 100 when bonding the blue light-emitting device 122 can be improved, which is beneficial to further improve the bonding yield of the blue light-emitting device 122.

[0293] It should be noted that, along the third direction Z, the distance between two adjacent second pads 1122 may also be equal to the distance between adjacent second pads 1122 and the second support member 1132 .

[0294] FIG. 26 is another structural diagram of a light-emitting substrate according to some embodiments.

[0295] In some embodiments, as shown in FIG26 , the geometric center of the orthographic projection of each column of third solder pads 1123 on the substrate motherboard 111 is located on the seventh straight line L7, and the geometric center of the orthographic projection of each column of third support members 1133 on the substrate motherboard 111 is located on the eighth straight line L8, wherein at least one seventh straight line L7 coincides with one eighth straight line L8 and / or there is a gap between the seventh straight line L7 and the eighth straight line L8.

[0296] Exemplarily, at least one seventh straight line L7 coincides with one eighth straight line L8, that is, at least one column includes third pads 1123 and third support members 1133 arranged along the third direction Z. For example, one, five, or ten seventh straight lines L7 coincide with one eighth straight line L8.

[0297] In some examples, along the third direction Z, the distance between two adjacent third pads 1123 is equal to the distance between two adjacent third support members 1133 .

[0298] Arranged in this manner, the force uniformity of the light-emitting substrate 100 when bonding the green light-emitting device 123 can be improved, which is beneficial to further improve the bonding yield of the green light-emitting device 123.

[0299] It should be noted that, along the third direction Z, the distance between two adjacent third pads 1123 may also be equal to the distance between adjacent third pads 1123 and the third support member 1133 .

[0300] FIG. 27 is a structural diagram showing a plurality of support members forming a strip-shaped structure according to some embodiments.

[0301] In some embodiments, as shown in FIG27 , the light emitting devices 12 connected to the pads 112 in the same column emit the same color, and multiple support members 113 in the same column are connected to form a strip structure. This arrangement can reduce the difficulty of manufacturing the support members 113.

[0302] It should be noted that, along the third direction Z, a second connecting member 7 is provided between two adjacent support members 113 , and the two adjacent support members 113 are connected by the second connecting member 7 . The material of the second connecting member 7 is the same as that of the support members 113 .

[0303] In some embodiments, as shown in FIG. 25 , the support member 113 is elastic, and along the first direction X, the size of the support member 113 is larger than the sum of the size of the pad 112 and the size of the light emitting device 12 connected to the pad 112 .

[0304] In some embodiments, as shown in FIG23 , the second peripheral region 1002 is disposed around the light-emitting region 101 and includes a first boundary, a second boundary, a third boundary, and a fourth boundary that are sequentially connected. A row of support members 113 is disposed between the first boundary and the light-emitting region 101. Four rows of support members 113 are disposed between the third boundary and the light-emitting region 101. Three columns of support members 113 are disposed between the second boundary and the light-emitting region 101. Four columns of support members 113 are disposed between the fourth boundary and the light-emitting region 101.

[0305] Figure 28 is a flow chart of a method for preparing a light-emitting motherboard according to some embodiments; Figure 29 is a step chart of a method for preparing a light-emitting motherboard according to some embodiments; Figure 30 is a step chart of another method for preparing a light-emitting motherboard according to some embodiments; Figure 31 is a flow chart of another method for preparing a light-emitting motherboard according to some embodiments.

[0306] Some embodiments of the present disclosure further provide a method for preparing a light-emitting motherboard 10. As shown in FIG28 , the preparation method includes: S100 to S300.

[0307] As shown in FIG. 29 and FIG. 30 , S100 : providing a transfer substrate 5 and a driving motherboard 11 .

[0308] In the above steps, the driving motherboard 11 has multiple light-emitting areas 101, and there is a spacer 102 between two adjacent light-emitting areas 101. The driving motherboard 11 includes a substrate motherboard 111 and multiple pads 112. The multiple pads 112 are arranged on the substrate motherboard 111 and arranged in the light-emitting areas 101.

[0309] The transfer substrate 5 includes a transfer substrate 1 and a plurality of light-emitting devices 12. The light-emitting devices 12 are disposed on one side of the transfer substrate 1 and connected to the transfer substrate 1. For example, the transfer substrate 1 includes a second substrate 3 and a plurality of transfer blocks 2, which are disposed on the second substrate 3. The light-emitting devices 12 are disposed on a side of the transfer blocks 2 away from the second substrate 3, with each light-emitting device 12 bonded to each transfer block 2.

[0310] At least one of the transfer substrate 1 and the driving motherboard 11 includes at least one supporting member 113 .

[0311] As shown in FIG. 29 and FIG. 30 , S200 : connecting the light emitting device 12 on the transfer substrate 5 to the soldering pad 112 on the driving motherboard 11 .

[0312] In the above steps, the transfer substrate 5 and the driving motherboard 11 are disposed opposite to each other, and the support member 113 of one of the transfer substrate 1 and the driving motherboard 11 abuts against the other, and the support member is located in the spacer area 102 .

[0313] Exemplarily, as shown in FIG31 , S200 may include S210 to S230 .

[0314] S210 : Bonding the transfer substrate 5 and the driving motherboard 11 .

[0315] In the above steps, the transfer substrate 5 and the driver motherboard 11 are positioned opposite each other, a light-emitting device 12 is positioned opposite a soldering pad 112, and the sealant 8 is disposed between the transfer substrate 1 and adhered to the transfer substrate 5 and the transfer substrate 1. The sealant 8 surrounds the soldering pads 112 of the plurality of light-emitting regions 101 (all light-emitting regions 101) and the plurality of transfer blocks 2. The transfer substrate 5, the driver motherboard 11, and the sealant 8 form a first cavity.

[0316] S220 : extracting the air in the first cavity, and bonding the light emitting device 12 and the pad 112 .

[0317] In the above steps, one light emitting device 12 is bonded to one pad 112 , and the support member 113 abuts against the other of the transfer substrate 1 and the driving motherboard 11 .

[0318] S230: Peeling off the sealant 8.

[0319] In the above steps, the sealant 8 can be removed by at least one of laser debonding, thermal sliding debonding, chemical debonding, and mechanical debonding. For example, the sealant 8 can be debonded by laser, whereby the sealant 8 absorbs the laser light, thereby eroding the interface between the sealant 8 and the driver motherboard 11, thereby removing the sealant 8.

[0320] As shown in FIG. 29 and FIG. 30 , S300 : removing the transfer substrate 1 .

[0321] 29 , the driving motherboard 11 includes at least one support member 113 . The at least one support member 113 is disposed on a side of the substrate motherboard 111 close to the plurality of pads 112 , and the support member 113 is disposed in the spacer 102 .

[0322] In other embodiments, as shown in FIG30 , the transfer substrate 5 has multiple transfer regions 501, with a support region 502 between adjacent transfer regions 501. The transfer substrate 5 includes a second substrate 3 and at least one support member 113. The at least one support member 113 is disposed on the second substrate 3, and the support member 113 is disposed in the support region 502. When the transfer substrate 5 and the driver motherboard 11 are positioned relative to each other, the orthographic projection of the transfer region 501 on the driver motherboard 11 overlaps with the light-emitting region 101.

[0323] 32 is a plan view of a driving motherboard according to some embodiments; FIG. 33 is a cross-sectional view of the driving motherboard according to some embodiments, wherein FIG. 33 schematically shows a cross-sectional view taken along line FF in FIG. 32 .

[0324] 34 is a plan view of a light-emitting motherboard according to some embodiments; FIG. 35 is a cross-sectional view of a light-emitting motherboard according to some embodiments, wherein FIG. 35 schematically shows a cross-sectional view taken along line GG in FIG. 34 .

[0325] As shown in Figures 32 and 33, the driving motherboard 11 has multiple light-emitting areas 101, which are arranged in multiple rows and columns. Each row includes at least two light-emitting areas 101 arranged along the second direction Y, and each column includes at least two light-emitting areas 101 arranged along the third direction Z. A spacing area 102 is provided between two adjacent light-emitting areas 101.

[0326] The driver motherboard 11 includes a substrate motherboard 111 and a plurality of solder pads 112. The plurality of solder pads 112 are disposed on the substrate motherboard 111 and are located in the light-emitting area 101. For example, the plurality of second solder pads 1122 are arranged in multiple rows and columns, with each row including at least two solder pads 112 arranged along the second direction Y, and each column including at least two solder pads 112 arranged along the third direction Z. The side of the solder pads 112 facing away from the substrate motherboard 111 is configured for bonding to the light-emitting devices 12. The driver motherboard 11 connected to the plurality of light-emitting devices 12 constitutes the light-emitting motherboard 10 shown in Figures 34 and 35.

[0327] At least one support structure 115 is provided on the substrate motherboard 111. The support structure 115 is provided in the spacer area 102. The support structure 115, the solder pad 112, and the light-emitting device 12 are located on the same side of the substrate motherboard 111 (for example, all located on the upper side of the substrate motherboard 111 as shown in Figures 33 and 35). Along the first direction X, there is at least one support structure 115 whose size is greater than or equal to the sum of the size of the solder pad 112 and the size of the light-emitting device 12 connected to the solder pad 112. The size of the support structure 115 refers to the distance between the support structure 115 and the surface of the substrate motherboard 111. The size of the solder pad 112 refers to the distance between the solder pad 112 and the surface of the substrate motherboard 111. The size of the light-emitting device 12 refers to the distance between the light-emitting device 12 and the surface of the substrate motherboard 111.

[0328] Based on this, in the process of bonding the light-emitting device 12 and the pad 112, the support structure 115 can abut against the transfer substrate, and the support member 113 is used to support the transfer substrate above the spacer area 102, thereby reducing the risk of the transfer substrate above the spacer area 102 being recessed, causing the transfer substrate above the edge of the light-emitting area 101 to bulge, reducing the distance between the pad 112 and the light-emitting device 12 arranged opposite to the pad 112, and helping to improve the bonding yield.

[0329] In some embodiments, as shown in FIG32 and FIG34 , a plurality of solder pads 112 are arranged in multiple rows and columns, with at least one row including multiple solder pads 112 arranged along a second direction Y and at least one column including multiple solder pads 112 arranged along a third direction Z, where the second direction Y and the third direction Z intersect. Accordingly, a plurality of light-emitting devices 12 are arranged in multiple rows and columns, with at least one row including multiple light-emitting devices 12 arranged along the second direction Y and at least one column including multiple light-emitting devices 12 arranged along the third direction Z, where the second direction Y and the third direction Z intersect. A plurality of support structures 115 are arranged in a row along the second direction Y and / or a plurality of support structures 115 are arranged in a column along the third direction Z.

[0330] In some embodiments, as shown in Figures 33 and 35, the multiple support structures 115 include multiple support columns 116, the support columns 116 are elastic, and along the first direction X, there is at least one support column 116 whose size is greater than the sum of the size of the pad 112 and the size of the light-emitting device 12 connected to the pad 112, that is, the support column 116 is further away from the surface of the substrate motherboard 111 than the light-emitting device 12 is away from the surface of the substrate motherboard 111.

[0331] The elasticity of the support column 116 should be understood as the low elastic modulus of the support column 116, so that during the bonding process, under the bonding pressure, the support column 116 is compressed in the first direction X, and the size of the support column 116 in the first direction X is reduced to be equal to the sum of the size of the pad 112 and the size of the light-emitting device 12. At this time, the pad 112 and the light-emitting device 12 are bonded. At the same time, under the support of multiple support columns 116, the risk of the transfer substrate above the spacer area 102 being recessed and causing the transfer substrate above the edge of the light-emitting area 101 to bulge can be reduced, which is conducive to improving the bonding yield.

[0332] Exemplarily, the elastic modulus of the support column 116 is smaller than the elastic modulus of at least one of the light-emitting device 12 and the solder pad 112 , for example, the elastic modulus of the support column 116 is smaller than the elastic modulus of the light-emitting device 12 and the elastic modulus of the support column 116 is smaller than the elastic modulus of the solder pad 112 .

[0333] It should be noted that the support structure 115 may include a support column 116 , or the support structure 115 may also include the support member 113 described above.

[0334] In some embodiments, as shown in Figures 32, 33, 34 and 35, the multiple support columns 116 include multiple first support columns 1161 and multiple second support columns 1162. In the first direction X, the dimension h4 of the first support columns 1161 is greater than the dimension h5 of the second support columns 1162, that is, the first support columns 1161 are further away from the surface of the substrate motherboard 111 than the second support columns 1162 are away from the surface of the substrate motherboard 111.

[0335] In the process of bonding the driving motherboard 11 to the transfer substrate 5, the first support column 1161 first contacts the transfer substrate 5, and the second support column 1162 is spaced apart from the transfer substrate 5. Under the bonding pressure, the first support column 1161 is compressed, and the size of the first support column 1161 along the first direction X gradually decreases until it is equal to the size of the uncompressed second support column 1162. Then, the first support column 1161 and the second support column 1162 are both in contact with the transfer substrate 5. When the bonding pressure is constant, due to the increase in the total contact area, the pressure exerted on the first support column 1161 and the second support column 1162 is smaller, thereby controlling the lower limit of the deformation of the compressed support column 116, which is beneficial to improving the uniformity of the bonding pressure in the light-emitting area, and can further improve the bonding yield.

[0336] In some embodiments, as shown in FIG32 and FIG34 , in the spacing region 102 between two adjacent light-emitting regions 101 along the second direction Y, a plurality of support columns 116 are arranged into at least two columns of support columns 116. In the two adjacent columns of support columns 116, one column of support columns 116 includes a plurality of first support columns 1161 sequentially spaced apart along the third direction Z, and the other column of support columns 116 includes a plurality of second support columns 1162 sequentially spaced apart along the third direction Z. For example, the column of support columns 116 closest to the light-emitting region 101 includes a plurality of second support columns 1162 sequentially spaced apart along the third direction Z. As needed, the column of support columns 116 closest to the light-emitting region 101 may also be configured to include a plurality of first support columns 1161 sequentially spaced apart along the third direction Z.

[0337] In some embodiments, as shown in FIG32 and FIG34 , in a spacing region 102 located between two adjacent light-emitting regions 101 along a third direction Z, a plurality of support columns 116 are arranged into at least two rows of support columns 116. In two adjacent rows of support columns 116, one row of support columns 116 includes a plurality of first support columns 1161 sequentially spaced apart along the second direction Y, and the other row of support columns 116 includes a plurality of second support columns 1162 sequentially spaced apart along the second direction Y. For example, the row of support columns 116 closest to the light-emitting region 101 includes a plurality of second support columns 1162 sequentially spaced apart along the second direction Y. As needed, the row of support columns 116 closest to the light-emitting region 101 may also be configured to include a plurality of first support columns 1161 sequentially spaced apart along the second direction Y.

[0338] In some embodiments, as shown in Figures 32 and 34 , in two adjacent columns of support pillars 116, the multiple first support pillars 1161 in one column of support pillars 116 and the multiple second support pillars 1162 in the other column of support pillars 116 are staggered along the third direction Z. In two adjacent rows of support pillars 116, the multiple first support pillars 1161 in one row of support pillars 116 and the multiple second support pillars 1162 in the other row of support pillars 116 are staggered along the second direction Y. This arrangement further improves the uniformity of the bonding pressure within the light-emitting area, thereby further improving the bonding yield.

[0339] In some embodiments, as shown in Figures 32 and 34, the distribution density of the multiple second support columns 1162 is greater than the distribution density of the multiple first support columns 1161, that is, the total area of ​​the orthographic projections of the multiple second support columns 1162 on the substrate motherboard 111 per unit area is greater than the total area of ​​the orthographic projections of the multiple first support columns 1161 on the substrate motherboard 111.

[0340] The distribution density of the first support columns 1161 is set to be slightly smaller, so that the total area of ​​the multiple first support columns 1161 in contact with the transfer substrate during bonding is smaller, and the multiple first support columns 1161 are subjected to greater pressure, so that the first support columns 1161 are more easily compressed in the first direction X. The distribution density of the second support columns 1162 is set to be slightly larger. After the first support columns 1161 are compressed in the first direction X to be equal to the size of the second support columns 1162, the total area of ​​the first support columns 1161 and the second support columns 1162 in contact with the transfer substrate 5 is larger, and the rate at which the first support columns 1161 and the second support columns 1162 are further compressed is slowed down. Such a setting is conducive to further improving the uniformity of the bonding pressure in the light-emitting area, thereby further improving the bonding yield.

[0341] In some embodiments, as shown in Figures 32 and 34, the distribution density of the first support columns 1161 is 1 / 500-1 / 100. The distribution density of the first support columns 1161 should be understood as the ratio of the total area of ​​the positive projections of each first support column 1161 arranged in the spacer area 102 on the substrate motherboard 111 to the total area of ​​the spacer area 102.

[0342] For example, the distribution density of the first support columns 1161 is 1 / 500, 1 / 450, 1 / 400, 1 / 350, 1 / 300, 1 / 280, 1 / 240, 1 / 200, 1 / 150 or 1 / 100, etc.

[0343] In some embodiments, as shown in Figures 32 and 34, the distribution density of the second support columns 1162 is 0-1 / 120. The distribution density of the second support columns 1162 should be understood as the ratio of the total area of ​​the positive projections of each second support column 1162 arranged in the spacer area 102 on the substrate motherboard 111 to the total area of ​​the spacer area 102.

[0344] For example, the distribution density of the second support pillars 1162 is 1 / 400, 1 / 350, 1 / 300, 1 / 280, 1 / 240, 1 / 200, 1 / 150, or 1 / 120.

[0345] In some embodiments, as shown in FIG34 , a spacing g1 between adjacent first support pillars 1161 along the second direction Y is greater than or equal to a spacing g3 between adjacent light-emitting devices 12 along the second direction Y; and / or a spacing g4 between adjacent first support pillars 1161 along the third direction Z is greater than or equal to a spacing g6 between adjacent light-emitting devices 12 along the third direction Z. Distributing the first support pillars 1161 more sparsely than the light-emitting devices 12 can ensure a suitable distribution density of the first support pillars 1161.

[0346] In some embodiments, as shown in FIG34 , a spacing g2 between adjacent second support pillars 1162 along the second direction Y is greater than or equal to a spacing g3 between adjacent light-emitting devices 12 along the second direction Y; and / or a spacing g5 between adjacent second support pillars 1162 along the third direction Z is greater than or equal to a spacing g6 between adjacent light-emitting devices 12 along the third direction Z. The second support pillars 1162 are distributed more sparsely than the light-emitting devices 12, thereby ensuring a suitable distribution density of the second support pillars 1162.

[0347] In some embodiments, as shown in Figures 32 and 34, the area of ​​the orthographic projection of the second support column 1162 on the substrate motherboard 111 is larger than the area of ​​the orthographic projection of the first support column 1161 on the substrate motherboard 111, that is, the second support column 1162 can be set larger so that the distribution density of the second support column 1162 is greater than the distribution density of the first support column 1161.

[0348] In some embodiments, the spacing between adjacent second support pillars 1162 can be made smaller, thereby increasing the distribution density of the second support pillars 1162 relative to the distribution density of the first support pillars 1161. Specifically, the spacing between adjacent second support pillars 1162 along the second direction Y can be smaller than the spacing between adjacent first support pillars 1161 along the second direction Y; and / or the spacing between adjacent second support pillars 1162 along the third direction Z can be smaller than the spacing between adjacent first support pillars 1161 along the third direction Z.

[0349] In some embodiments, as shown in FIG34 , a dimension S1 of the first support pillar 1161 along the second direction Y is greater than or equal to a dimension S3 of the light-emitting device 12 along the second direction Y; and / or a dimension S4 of the first support pillar 1161 along the third direction Z is greater than or equal to a dimension S6 of the light-emitting device 12 along the third direction Z; and / or an orthographic projection area of ​​the first support pillar 1161 on the substrate motherboard 111 is greater than an orthographic projection area of ​​the light-emitting device 12 on the substrate motherboard 111. Providing a slightly larger area of ​​the first support pillar 1161 (referring to the area of ​​the orthographic projection of the first support pillar 1161 on the substrate motherboard 111) can help reduce the difficulty of the manufacturing process of the first support pillar 1161, improve the area uniformity of multiple first support pillars 1161, and further improve the uniformity of the bonding pressure within the light-emitting area, thereby further improving the bonding yield.

[0350] In some embodiments, as shown in FIG34 , a dimension S2 of the second support pillar 1162 along the second direction Y is greater than or equal to a dimension S3 of the light-emitting device 12 along the second direction Y; and / or a dimension S5 of the second support pillar 1162 along the third direction Z is greater than or equal to a dimension S6 of the light-emitting device 12 along the third direction Z; and / or an orthographic projection area of ​​the second support pillar 1162 on the substrate motherboard 111 is greater than an orthographic projection area of ​​the light-emitting device 12 on the substrate motherboard 111. Providing a slightly larger area of ​​the second support pillar 1162 (referring to the orthographic projection area of ​​the second support pillar 1162 on the substrate motherboard 111) helps reduce the difficulty of the manufacturing process of the second support pillar 1162, improves the area uniformity of multiple second support pillars 1162, and further improves the uniformity of the bonding pressure within the light-emitting area, thereby further improving the bonding yield.

[0351] In some embodiments, as shown in FIG. 32 , the shape of the orthographic projection of the support pillar 116 on the substrate motherboard 111 includes a circle, an ellipse, a square, a rectangle, or the like.

[0352] In some embodiments, as shown in Figure 34, the dimension S1 of the first support column 1161 along the second direction Y is 20μm-100μm, and the dimension S4 of the first support column 1161 along the third direction Z is 20μm-100μm; the dimension S2 of the second support column 1162 along the second direction Y is 20μm-100μm, and the dimension S5 of the second support column 1162 along the third direction Z is 20μm-100μm.

[0353] For example, the dimension S1 of the first support column 1161 along the second direction Y is 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm or 100μm, etc.; the dimension S4 of the first support column 1161 along the third direction Z is 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm or 100μm, etc.

[0354] For example, the dimension S2 of the second support column 1162 along the second direction Y is 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm or 100μm, etc.; the dimension S5 of the third support column 116 along the third direction Z is 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm or 100μm, etc.

[0355] In some embodiments, as shown in Figure 34, the first support columns 1161 are arranged at equal intervals in the second direction Y, the first support columns 1161 are arranged at equal intervals in the third direction Z, and the spacing g1 between adjacent first support columns 1161 along the second direction Y is equal to the spacing g4 between adjacent first support columns 1161 along the third direction Z. That is to say, multiple first support columns 1161 are evenly distributed in the spacing area 102, which is conducive to further improving the uniformity of the bonding pressure in the light-emitting area, thereby further improving the bonding yield.

[0356] In some embodiments, as shown in Figure 34, the second support columns 1162 are arranged at equal intervals in the second direction Y, the second support columns 1162 are arranged at equal intervals in the third direction Z, and the spacing g2 between adjacent second support columns 1162 along the second direction Y is equal to the spacing g5 between adjacent second support columns 1162 along the third direction Z. That is to say, multiple second support columns 1162 are evenly distributed in the spacing area 102, which is conducive to further improving the uniformity of the bonding pressure in the light-emitting area, thereby further improving the bonding yield.

[0357] In some embodiments, as shown in FIG35 , the plurality of light-emitting devices 12 emit light of the same color, and the plurality of light-emitting devices 12 have the same size in the first direction X. A height difference g7 between the first support column 1161 and the light-emitting device 12 is 0.5 μm-1 μm, and a height difference g8 between the second support column 1162 and the light-emitting device 12 is 0.1 μm-3 μm.

[0358] For example, the height difference g7 between the first supporting column 1161 and the light emitting device 12 is 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm or 1 μm.

[0359] For example, the height difference g8 between the second supporting column 1162 and the light emitting device 12 is 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, or 0.3 μm.

[0360] It should be noted that the height difference between the first support column 1161 and the light-emitting device 12 should be understood as: the distance between the first support column 1161 and the surface of the substrate motherboard 111 and the light-emitting device 12 in the first direction X; the height difference between the second support column 1162 and the light-emitting device 12 should be immediately understood as: the distance between the second support column 1162 and the surface of the substrate motherboard 111 and the light-emitting device 12 in the first direction X.

[0361] For example, all of the light-emitting devices 12 emit white light; or all of the light-emitting devices 12 emit red light; or all of the light-emitting devices 12 emit green light; or all of the light-emitting devices 12 emit blue light.

[0362] FIG36 is a plan view of a light-emitting motherboard according to some embodiments; FIG37 is a cross-sectional view of a light-emitting motherboard according to some embodiments, wherein FIG37 schematically shows a cross-sectional view taken along line HH in FIG36 .

[0363] 36 and 37 , the plurality of light-emitting devices 12 include a plurality of first light-emitting devices 121, a plurality of second light-emitting devices 122, and a plurality of third light-emitting devices 123. The support pillars 116 are further away from the surface of the substrate motherboard 111 than any of the first light-emitting devices 121, the second light-emitting devices 122, and the third light-emitting devices 123 are from the surface of the substrate motherboard 111. For example, the first light-emitting devices 121 may be red light-emitting devices, the second light-emitting devices 122 may be green light-emitting devices, and the third light-emitting devices 123 may be blue light-emitting devices.

[0364] Because the first light-emitting device 121, the second light-emitting device 122, and the third light-emitting device 123 have different light-emitting colors and their specific structures are different, the first light-emitting device 121, the second light-emitting device 122, and the third light-emitting device 123 have different sizes along the first direction X. For example, along the first direction X, the size of the first light-emitting device 121 is larger than the size of the second light-emitting device 122 and the size of the third light-emitting device 123.

[0365] In this case, a height difference between the first supporting column 1161 and the first light emitting device 121 is 0.5 μm-1 μm, and a height difference between the second supporting column 1162 and the first light emitting device 121 is 0.1 μm-3 μm.

[0366] For example, the height difference between the first supporting column 1161 and the first light emitting device 121 is 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, or 1 μm.

[0367] For example, the height difference between the second supporting column 1162 and the first light emitting device 121 is 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, or 0.3 μm.

[0368] In some embodiments, as shown in FIG. 32 , the driving motherboard 11 further has a first peripheral area 103 . The first peripheral area 103 is disposed around the plurality of light-emitting areas 101 , and at least one supporting column 116 is also disposed in the first peripheral area 103 .

[0369] In this manner, the support pillars 116 can support the transfer substrate above the first peripheral region 103 , thereby reducing the risk of the transfer substrate above the first peripheral region 103 being recessed and improving the bonding yield.

[0370] In some embodiments, as shown in FIG. 32 , the support pillars 116 located in the first peripheral region 103 may be arranged in the same manner as the support pillars 116 located in the spacer region 102 .

[0371] Specifically, in the first peripheral area 103 located on one side of the multiple light-emitting areas 101 along the second direction Y, multiple support columns 116 are arranged into at least two columns of support columns 116. In two adjacent columns of support columns 116, one column of support columns 116 includes a plurality of first support columns 1161 arranged in sequence along the third direction Z, and the other column of support columns 116 includes a plurality of second support columns 1162 arranged in sequence along the third direction Z.

[0372] In the first peripheral area 103 located on one side of the multiple light-emitting areas 101 along the third direction Z, multiple support columns 116 are arranged into at least two rows of support columns 116. In two adjacent rows of support columns 116, one row of support columns 116 includes a plurality of first support columns 1161 arranged in sequence along the second direction Y, and the other row of support columns 116 includes a plurality of second support columns 1162 arranged in sequence along the second direction Y.

[0373] In some embodiments, as shown in FIG32 , in the multiple columns of support columns 116 located between two adjacent light-emitting areas 101 along the second direction Y, the distribution width W1 of the multiple columns of support columns 116 along the second direction Y is greater than or equal to 8 mm, for example, can be 10 mm.

[0374] In some embodiments, as shown in FIG32 , in the multiple rows of support columns 116 located between two adjacent light-emitting areas 101 along the third direction Z, the distribution width W2 of the multiple rows of support columns 116 along the third direction Z is greater than or equal to 8 mm, for example, it can be 10 mm.

[0375] In some embodiments, as shown in FIG32 , in the multiple columns of support columns 116 located on one side of the multiple light-emitting areas 101 along the second direction Y, the distribution width W3 of the multiple columns of support columns 116 along the second direction Y is greater than or equal to 8 mm, for example, it can be 10 mm.

[0376] In some embodiments, as shown in FIG32 , in the multiple rows of support columns 116 located on one side of the multiple light-emitting areas 101 along the third direction Z, the distribution width W4 of the multiple rows of support columns 116 along the third direction Z is greater than or equal to 8 mm, for example, it can be 10 mm.

[0377] When the distribution width of the support column 116 along the second direction Y and along the third direction Z is large, it can provide a better support effect in the spacer area 102 and the first peripheral area 103, thereby effectively avoiding the depression of the transfer substrate 5 located in the area, making the bonding pressure of different areas in the light-emitting area 101 more uniform, thereby improving the bonding yield.

[0378] It should be noted that in FIG. 32 , only five rows of support columns 116 and five columns of support columns 116 are schematically shown in the spacing area 102 and the first peripheral area 103 . In an actual driving motherboard 11 , a greater number of support columns 116 may be provided.

[0379] In some embodiments, as shown in FIG32 , the driving motherboard 11 further has a glue coating area 104, which is disposed around the first peripheral area 103. The glue coating area 104 is configured to provide a sealant during bonding.

[0380] FIG38 is a plan view of a transfer substrate according to some embodiments; FIG39 is a cross-sectional view of a transfer substrate according to some embodiments, wherein FIG39 schematically shows a cross-sectional view taken along line II in FIG38 .

[0381] In some embodiments, as shown in Figures 38 and 39, the transfer substrate 5 has multiple transfer areas 501, and there is a support area 502 between two adjacent transfer areas 501. The transfer substrate 5 includes a transfer substrate 1 and multiple light-emitting devices 12 located on the transfer substrate 1, and the multiple light-emitting devices 12 are located in the multiple transfer areas 501.

[0382] Exemplarily, the transfer substrate 1 includes a second substrate 3 and a plurality of transfer blocks 2, wherein the plurality of transfer blocks 2 are disposed on the second substrate 3 and located in the transfer area 501. A plurality of light-emitting devices 12 are disposed on a side of the plurality of transfer blocks 2 away from the second substrate 3, with one light-emitting device 12 bonded to one transfer block 2.

[0383] It should be noted that the multiple light emitting devices 12 located on the same transfer substrate 5 have the same light emission color. When light emitting devices 12 of different colors need to be transfer-bonded, different transfer substrates 5 need to be used for transfer bonding in batches.

[0384] FIG40 is a plan view of a transfer substrate according to some embodiments; FIG41 is a cross-sectional view of a transfer substrate according to some embodiments, wherein FIG41 schematically shows a cross-sectional view taken along line JJ in FIG40 .

[0385] In some embodiments, as shown in Figures 40 and 41, the transfer substrate 5 has multiple transfer areas 501, and there is a support area 502 between two adjacent transfer areas 501. The transfer substrate 5 includes a transfer substrate 1 and multiple light-emitting devices 12 located on the transfer substrate 1, and the multiple light-emitting devices 12 are located in the multiple transfer areas 501.

[0386] At least one support structure 115 is also provided on the transfer substrate 5. This support structure 115 is located in the support area 502 and on the same side of the transfer substrate 1 as the light-emitting device 12. The surface of the support structure 115 facing away from the transfer substrate 1 is further away from the transfer substrate 1 than the surface of the light-emitting device 12 facing away from the transfer substrate 1. Relocating the support structure 115 described above from the driver motherboard 11 side to the transfer substrate 5 side can also improve bonding yield by providing support during the bonding process.

[0387] In some embodiments, as shown in Figures 40 and 41, the support structure 115 includes a plurality of support columns 116, and the support columns 116 may include a plurality of first support columns 1161 and a plurality of second support columns 1162. The arrangement, shape, size, etc. of the plurality of first support columns 1161 and the plurality of second support columns 1162 located on the transfer substrate 5 can refer to the first support columns 1161 and the plurality of second support columns 1162 set on the driving motherboard 11 in the previous text, and will not be repeated here.

[0388] In some embodiments, as shown in Figures 40 and 41, the transfer substrate 5 also includes a third peripheral area 503, which surrounds multiple transfer areas 501. Multiple support columns 116 are arranged in the third peripheral area 503. The multiple support columns 116 located in the third peripheral area 503 can be arranged in the same manner as the multiple support columns 116 located in the support area 502.

[0389] FIG42 is a step diagram of a method for preparing a light-emitting motherboard according to some embodiments, wherein FIG42 illustrates a process of preparing a light-emitting motherboard using the transfer substrate illustrated in FIG38 and FIG39 .

[0390] As shown in FIG. 28 and FIG. 42 , the method for preparing a light-emitting motherboard includes the following steps.

[0391] In step S100 , a transfer substrate 5 and a driving motherboard 11 are provided.

[0392] In the above steps, the driver motherboard 11 has multiple light-emitting areas 101, with a spacer area 102 between adjacent light-emitting areas 101. The driver motherboard 11 includes a substrate motherboard 111, multiple solder pads 112, and multiple support pillars 116. The multiple solder pads 112 are disposed on the substrate motherboard 111 and are located in the light-emitting areas 101. The multiple support pillars 116 are disposed on the substrate motherboard 111 and are located in the spacer area 102 and the first peripheral area 103. The multiple support pillars 116 include multiple first support pillars 1161 and multiple second support pillars 1162.

[0393] The transfer substrate 5 includes a transfer substrate 1 and a plurality of light-emitting devices 12. The light-emitting devices 12 are disposed on one side of the transfer substrate 1 and connected to the transfer substrate 1. For example, the transfer substrate 1 includes a second substrate 3 and a plurality of transfer blocks 2, which are disposed on the second substrate 3. The light-emitting devices 12 are disposed on a side of the transfer blocks 2 away from the second substrate 3, with each light-emitting device 12 bonded to each transfer block 2.

[0394] In step S200 , the light emitting device 12 on the transfer substrate 5 is connected to the pad 112 on the driving motherboard 11 .

[0395] In the above steps, the transfer substrate 5 and the driving motherboard 11 are arranged relative to each other, and the first support column 1161 located on the substrate motherboard 111 abuts against the second substrate 3. Under the bonding pressure, the first support column 1161 is compressed along the first direction X. When the size of the first support column 1161 along the first direction X is equal to that of the second support column 1162, the first support column 1161 and the second support column 1162 are both abutted against the second substrate 3 and are compressed together under the bonding pressure until the light-emitting device 12 contacts the pad 112 to achieve a bonding connection.

[0396] Exemplarily, as shown in FIG31 , S200 may include S210 to S230 .

[0397] S210 : Bonding the transfer substrate 5 and the driving motherboard 11 .

[0398] In the above steps, the transfer substrate 5 and the driver motherboard 11 are positioned opposite each other, a light-emitting device 12 is positioned opposite a soldering pad 112, and a sealant 8 is disposed between the driver motherboard 11 and the transfer substrate 5, bonding them to both. The sealant 8 is located in the adhesive coating area 104, surrounding the soldering pads 112 of the multiple light-emitting areas 101 (all light-emitting areas 101) and the multiple transfer blocks 2. The transfer substrate 5, the driver motherboard 11, and the sealant 8 form a first cavity.

[0399] S220 : extracting the air in the first cavity, and bonding the light emitting device 12 and the pad 112 .

[0400] In the above steps, one light emitting device 12 is bonded to one pad 112 .

[0401] S230: Peeling off the sealant 8.

[0402] In the above steps, the sealant 8 can be removed by at least one of laser debonding, thermal sliding debonding, chemical debonding, and mechanical debonding. For example, the sealant 8 can be debonded by laser, whereby the sealant 8 absorbs the laser light, thereby eroding the interface between the sealant 8 and the driver motherboard 11, thereby removing the sealant 8.

[0403] In step S300 , the transfer substrate 1 is removed.

[0404] It should be noted that when the transfer block 2 is set on the second substrate 3, the size of the support column 116 along the first direction X also needs to take into account the transfer block 2. Specifically, the size of the support column 116 along the first direction X needs to be greater than the sum of the sizes of the transfer block 2, the pad 112 and the light-emitting device 12 along the first direction X.

[0405] Of course, the transfer block 2 may not be provided or a transfer block 2 may be provided at the position corresponding to the support column 116. In this case, the size of the support column 116 along the first direction X needs to be larger than the sum of the sizes of the solder pad 112 and the light-emitting device 12 along the first direction X.

[0406] In addition, FIG42 illustrates the transfer bonding process when only one type of light-emitting device 12 is provided on the light-emitting motherboard 10. When only multiple types of light-emitting devices 12 are provided on the light-emitting motherboard 10, transfer bonding is performed independently for each type of light-emitting device 12 according to FIG42. In different transfer bonding processes, the support column 116 is compressed to different degrees according to the different sizes of different light-emitting devices 12 along the first direction X. That is, the support column 116 is compatible with the transfer bonding of light-emitting devices 12 of different sizes.

[0407] Furthermore, when multiple light-emitting devices 12 need to be transferred, the transfer bonding is performed in the order of the sizes of the light-emitting devices 12 along the first direction X from small to large.

[0408] FIG43 is a step diagram of a method for preparing a light-emitting motherboard according to some embodiments, wherein FIG43 illustrates a process of preparing a light-emitting motherboard using the transfer substrate illustrated in FIG40 and FIG41 .

[0409] As shown in FIG. 28 and FIG. 43 , the method for preparing a light-emitting motherboard includes the following steps.

[0410] In step S100 , a transfer substrate 5 and a driving motherboard 11 are provided.

[0411] In the above steps, the driving motherboard 11 has multiple light-emitting areas 101, and a spacer area 102 is provided between two adjacent light-emitting areas 101. The driving motherboard 11 includes a substrate motherboard 111 and multiple solder pads 112. The multiple solder pads 112 are provided on the substrate motherboard 111 and are provided in the light-emitting areas 101.

[0412] The transfer substrate 5 includes a transfer substrate 1, a plurality of light-emitting devices 12, and a plurality of support pillars 116. The plurality of light-emitting devices 12 are disposed on one side of the transfer substrate 1 and connected to the transfer substrate 1. For example, the transfer substrate 1 includes a second substrate 3 and a plurality of transfer blocks 2, which are disposed on the second substrate 3. The plurality of light-emitting devices 12 are disposed on a side of the plurality of transfer blocks 2 away from the second substrate 3, with each light-emitting device 12 bonded to each transfer block 2.

[0413] A plurality of support pillars 116 are disposed on the second substrate 3 and disposed in the support region 502 and the third peripheral region 503 . The plurality of support pillars 116 include a plurality of first support pillars 1161 and a plurality of second support pillars 1162 .

[0414] In step S200 , the light emitting device 12 on the transfer substrate 5 is connected to the pad 112 on the driving motherboard 11 .

[0415] In the above steps, the transfer substrate 5 and the driving motherboard 11 are arranged relative to each other, and the first support column 1161 located on the second substrate 3 is in contact with the substrate motherboard 111. Under the bonding pressure, the first support column 1161 is compressed along the first direction X. When the size of the first support column 1161 along the first direction X is equal to that of the second support column 1162, the first support column 1161 and the second support column 1162 are both in contact with the substrate motherboard 111 and are compressed together under the bonding pressure until the light-emitting device 12 contacts the pad 112 to achieve a bonding connection.

[0416] In step S300 , the transfer substrate 1 is removed.

[0417] The light-emitting motherboard 10 was prepared according to the preparation method shown in FIG. 42 , and the bonding yield was tested. The results are shown in Tables 1 and 2 below.

[0418] Table 1

[0419] Table 2

[0420] In each of the above embodiments, support pillars are provided in both the spacer region and the first peripheral region. The width of the support pillars is uniform across all locations, and is represented by the values ​​shown in the table. The distribution density represents the sum of the distribution densities of the first and second support pillars. The light-emitting area is divided into a first light-emitting area and a second light-emitting area surrounding the first light-emitting area. The internal yield is the bonding yield within the first light-emitting area, and the edge yield is the bonding yield within the second light-emitting area.

[0421] The data in Table 1 above shows that when the support pillar distribution width is 8 mm and the distribution density is less than or equal to 1 / 120, the edge yield is high, exceeding 99.5%. However, when the support pillar distribution density is further increased, for example to 1 / 9, the edge yield drops significantly. This indicates that when the support pillar distribution density is too high, it is not conducive to ensuring the bonding yield at the edge of the light-emitting area.

[0422] From the data in Table 2 above, when the support pillar distribution density is 1 / 120 and the distribution width is 8mm, the edge yield is high, reaching 99.80%. However, as the support pillar distribution width decreases, the edge yield gradually decreases, reaching only 46.02% when reduced to 2mm. This shows that when the support pillar distribution width is too small, it is not conducive to ensuring the bonding yield at the edge of the light-emitting area.

[0423] In some embodiments, a plurality of cutting lines are provided on the light-emitting motherboard, and a cutting device can cut along the plurality of cutting lines to form a plurality of light-emitting substrates. For example, a cutter wheel cutting device or a laser cutting device can be used to cut the light-emitting motherboard along the cutting lines to form the light-emitting substrates. The following describes an example of the structure of the light-emitting substrates formed by cutting.

[0424] 44 is a plan view of a light emitting substrate according to some embodiments; FIG45 is a cross-sectional view of a light emitting substrate according to some embodiments, wherein FIG45 schematically shows a cross-sectional view taken along line KK in FIG44 .

[0425] In some embodiments, as shown in FIG. 44 and FIG. 45 , the light-emitting substrate 100 includes a light-emitting area 101 and a second peripheral area 1002 located on at least one side of the light-emitting area 101 . Here, the second peripheral area 1002 surrounding the light-emitting area 101 is schematically illustrated.

[0426] The light emitting substrate 100 includes a substrate 110 , a plurality of pads 112 and a plurality of light emitting devices 12 . The plurality of pads 112 are disposed on the substrate 110 and in the light emitting area 101 . The plurality of light emitting devices 12 are connected to a side of the plurality of pads 112 away from the substrate 110 .

[0427] At least one support structure 115 is disposed on the substrate 110. The support structure 115 is disposed in the second peripheral region 1002. The support structure 115, the solder pad 112, and the light-emitting device 12 are located on the same side of the substrate 110 (for example, all located on the upper side of the substrate 110 as shown in Figures 33 and 35). Along the first direction X, at least one support structure 115 has a size greater than or equal to the sum of the size of the solder pad 112 and the size of the light-emitting device 12 connected to the solder pad 112.

[0428] In some embodiments, as shown in Figures 44 and 45, the plurality of second solder pads 1122 are arranged in multiple rows and columns, with each row including at least two solder pads 112 arranged along the second direction Y, and each column including at least two solder pads 112 arranged along the third direction Z. Correspondingly, the plurality of light-emitting devices 12 are arranged in multiple rows and columns, with each row including at least two light-emitting devices 12 arranged along the second direction Y, and each column including at least two light-emitting devices 12 arranged along the third direction Z. The plurality of support structures 115 are arranged in a row along the second direction Y, and / or the plurality of support structures 115 are arranged in a column along the third direction Z.

[0429] It should be noted that the number of support structures 115 located in the second peripheral area 1002 depends on the location of the cutting line. During the process of cutting the light-emitting motherboard into multiple light-emitting substrates 100, the closer the cutting line is to the light-emitting area 101, the fewer support structures 115 are retained. The number of support structures 115 located around the light-emitting area 101 can be the same or different. In the light-emitting substrate 100 illustrated in FIG44 , three columns of support structures 115 are retained on both sides of the light-emitting area 101 along the second direction Y, and three rows of support structures 115 are retained on both sides of the light-emitting area 101 along the third direction Z. This is merely for clarity of illustration of the arrangement of the support structures 115; in an actual light-emitting substrate 100, a greater number of support structures 115 may be retained.

[0430] In some embodiments, as shown in Figures 44 and 45, the multiple support structures 115 include multiple support columns 116, the support columns 116 are elastic, and along the first direction X, there is at least one support column 116 whose size is greater than the sum of the size of the pad 112 and the size of the light-emitting device 12 connected to the pad 112, that is, the support column 116 is farther away from the substrate 110 than the surface of the light-emitting device 12 is away from the substrate 110.

[0431] The elasticity of the support column 116 should be understood to mean that the support column 116 has a low elastic modulus and can deform under pressure. For example, the elastic modulus of the support column 116 is lower than the elastic modulus of at least one of the light-emitting device 12 and the solder pad 112. For example, the elastic modulus of the support column 116 is lower than the elastic modulus of the light-emitting device 12, and the elastic modulus of the support column 116 is lower than the elastic modulus of the solder pad 112.

[0432] In some embodiments, as shown in Figures 44 and 45, the multiple support columns 116 include multiple first support columns 1161 and multiple second support columns 1162. In the first direction X, the size of the first support columns 1161 is larger than that of the second support columns 1162, that is, the first support columns 1161 are farther away from the surface of the substrate 110 than the second support columns 1162 are away from the surface of the substrate 110.

[0433] In some embodiments, as shown in Figures 44 and 45, in the second peripheral area 1002 located on the side of the light-emitting area 101 along the second direction Y, a plurality of support columns 116 are arranged into at least two columns of support columns 116, and in two adjacent columns of support columns 116, one column of support columns 116 includes a plurality of first support columns 1161 arranged in sequence along the third direction Z, and the other column of support columns 116 includes a plurality of second support columns 1162 arranged in sequence along the third direction Z.

[0434] In some embodiments, as shown in Figures 44 and 45, in the second peripheral area 1002 located on the side of the light-emitting area 101 along the third direction Z, a plurality of support columns 116 are arranged into at least two rows of support columns 116, and in two adjacent rows of support columns 116, one row of support columns 116 includes a plurality of first support columns 1161 arranged in sequence along the second direction Y, and the other row of support columns 116 includes a plurality of second support columns 1162 arranged in sequence along the second direction Y.

[0435] 44 and 45 , in two adjacent columns of support pillars 116, the plurality of first support pillars 1161 in one column of support pillars 116 and the plurality of second support pillars 1162 in the other column of support pillars 116 are arranged alternately along the third direction Z. In two adjacent rows of support pillars 116, the plurality of first support pillars 1161 in one row of support pillars 116 and the plurality of second support pillars 1162 in the other row of support pillars 116 are arranged alternately along the second direction Y.

[0436] In some embodiments, as shown in Figures 44 and 45, the distribution density of the multiple second support columns 1162 is greater than the distribution density of the multiple first support columns 1161, that is, the total area of ​​the orthographic projections of the multiple second support columns 1162 on the substrate 110 is greater than the total area of ​​the orthographic projections of the multiple first support columns 1161 on the substrate 110.

[0437] In some embodiments, as shown in Figures 44 and 45, the distribution density of the first support columns 1161 is 1 / 500-1 / 100. The distribution density of the first support columns 1161 should be understood as the ratio of the total area of ​​the positive projections of each first support column 1161 arranged in the second peripheral area 1002 on the substrate 110 to the total area of ​​the second peripheral area 1002.

[0438] For example, the distribution density of the first support columns 1161 is 1 / 500, 1 / 450, 1 / 400, 1 / 350, 1 / 300, 1 / 280, 1 / 240, 1 / 200, 1 / 150 or 1 / 100, etc.

[0439] In some embodiments, as shown in Figures 44 and 45, the distribution density of the second support columns 1162 is 0-1 / 120. The distribution density of the second support columns 1162 should be understood as the ratio of the total area of ​​the positive projections of each second support column 1162 arranged in the second peripheral area 1002 on the substrate 110 to the total area of ​​the second peripheral area 1002.

[0440] For example, the distribution density of the second support pillars 1162 is 1 / 400, 1 / 350, 1 / 300, 1 / 280, 1 / 240, 1 / 200, 1 / 150, or 1 / 120.

[0441] In some embodiments, as shown in Figures 44 and 45 , the spacing between adjacent first support columns 1161 along the second direction Y is greater than or equal to the spacing between adjacent light-emitting devices 12 along the second direction Y; and / or the spacing between adjacent first support columns 1161 along the third direction Z is greater than or equal to the spacing between adjacent light-emitting devices 12 along the third direction Z. Distributing the first support columns 1161 more sparsely than the light-emitting devices 12 can ensure a suitable distribution density of the first support columns 1161.

[0442] In some embodiments, as shown in Figures 44 and 45 , the spacing between adjacent second support columns 1162 along the second direction Y is greater than or equal to the spacing between adjacent light-emitting devices 12 along the second direction Y; and / or the spacing between adjacent second support columns 1162 along the third direction Z is greater than or equal to the spacing between adjacent light-emitting devices 12 along the third direction Z. The second support columns 1162 are distributed more sparsely than the light-emitting devices 12, thereby ensuring a suitable distribution density of the second support columns 1162.

[0443] In some embodiments, as shown in Figures 44 and 45, the area of ​​the orthographic projection of the second support column 1162 on the substrate 110 is larger than the area of ​​the orthographic projection of the first support column 1161 on the substrate 110, that is, the distribution density of the second support column 1162 can be greater than the distribution density of the first support column 1161 by setting the second support column 1162 to be larger.

[0444] In some embodiments, the spacing between adjacent second support pillars 1162 can be made smaller, thereby increasing the distribution density of the second support pillars 1162 relative to the distribution density of the first support pillars 1161. Specifically, the spacing between adjacent second support pillars 1162 along the second direction Y can be smaller than the spacing between adjacent first support pillars 1161 along the second direction Y; and / or the spacing between adjacent second support pillars 1162 along the third direction Z can be smaller than the spacing between adjacent first support pillars 1161 along the third direction Z.

[0445] In some embodiments, as shown in Figures 44 and 45 , the dimension of the first support column 1161 along the second direction Y is greater than or equal to the dimension of the light-emitting device 12 along the second direction Y; and / or the dimension of the first support column 1161 along the third direction Z is greater than or equal to the dimension of the light-emitting device 12 along the third direction Z; and / or the area of ​​the orthographic projection of the first support column 1161 on the substrate 110 is greater than the area of ​​the orthographic projection of the light-emitting device 12 on the substrate 110. Providing a slightly larger area of ​​the first support column 1161 (referring to the area of ​​the orthographic projection of the first support column 1161 on the substrate 110) helps reduce the difficulty of the manufacturing process of the first support column 1161, improves the uniformity of the area of ​​multiple first support columns 1161, and further improves the uniformity of the bonding pressure within the light-emitting area, thereby further improving the bonding yield.

[0446] In some embodiments, as shown in Figures 44 and 45 , the dimension of the second support column 1162 along the second direction Y is greater than or equal to the dimension of the light-emitting device 12 along the second direction Y; and / or the dimension of the second support column 1162 along the third direction Z is greater than or equal to the dimension of the light-emitting device 12 along the third direction Z; and / or the area of ​​the orthographic projection of the second support column 1162 on the substrate 110 is greater than the area of ​​the orthographic projection of the light-emitting device 12 on the substrate 110. Providing a slightly larger area of ​​the second support column 1162 (referring to the area of ​​the orthographic projection of the second support column 1162 on the substrate 110) helps reduce the difficulty of the manufacturing process of the second support column 1162, improves the uniformity of the area of ​​multiple second support columns 1162, and further improves the uniformity of the bonding pressure within the light-emitting area, thereby further improving the bonding yield.

[0447] In some embodiments, as shown in FIG. 44 and FIG. 45 , the shape of the orthographic projection of the support pillar 116 on the substrate 110 includes a circle, an ellipse, a square, a rectangle, or the like.

[0448] In some embodiments, as shown in Figures 44 and 45, the size of the first support column 1161 along the second direction Y is 20μm-100μm, and the size of the first support column 1161 along the third direction Z is 20μm-100μm; the size of the second support column 1162 along the second direction Y is 20μm-100μm, and the size of the second support column 1162 along the third direction Z is 20μm-100μm.

[0449] For example, the size of the first support column 1161 along the second direction Y is 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm or 100μm, etc.; the size of the first support column 1161 along the third direction Z is 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm or 100μm, etc.

[0450] For example, the size of the second support column 1162 along the second direction Y is 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm or 100μm, etc.; the size of the third support column 116 along the third direction Z is 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm or 100μm, etc.

[0451] In some embodiments, as shown in Figures 44 and 45, the first support columns 1161 are arranged at equal intervals in the second direction Y, the first support columns 1161 are arranged at equal intervals in the third direction Z, and the spacing between adjacent first support columns 1161 along the second direction Y is equal to the spacing between adjacent first support columns 1161 along the third direction Z. That is to say, multiple first support columns 1161 are evenly distributed in the spacing area 102, which is conducive to further improving the uniformity of the bonding pressure in the light-emitting area, thereby further improving the bonding yield.

[0452] In some embodiments, as shown in Figures 44 and 45, the second support columns 1162 are arranged at equal intervals in the second direction Y, the second support columns 1162 are arranged at equal intervals in the third direction Z, and the spacing between adjacent second support columns 1162 along the second direction Y is equal to the spacing between adjacent second support columns 1162 along the third direction Z. That is to say, multiple second support columns 1162 are evenly distributed in the spacing area 102, which is conducive to further improving the uniformity of the bonding pressure in the light-emitting area, thereby further improving the bonding yield.

[0453] In some embodiments, as shown in Figures 44 and 45 , the plurality of light-emitting devices 12 emit light of the same color, and the plurality of light-emitting devices 12 have the same size in the first direction X. The height difference between the first support column 1161 and the light-emitting device 12 is 0.5 μm-1 μm, and the height difference between the second support column 1162 and the light-emitting device 12 is 0.1 μm-3 μm.

[0454] For example, the height difference between the first supporting column 1161 and the light emitting device 12 is 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm or 1 μm.

[0455] For example, the height difference between the second supporting column 1162 and the light emitting device 12 is 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, or 0.3 μm.

[0456] It should be noted that the height difference between the first support column 1161 and the light-emitting device 12 should be understood as: the distance between the first support column 1161 and the surface of the substrate 110 and the surface of the light-emitting device 12 and the substrate 110 in the first direction X; the height difference between the second support column 1162 and the light-emitting device 12 should be immediately understood as: the distance between the second support column 1162 and the surface of the substrate 110 and the surface of the light-emitting device 12 and the substrate 110 in the first direction X.

[0457] For example, all of the light-emitting devices 12 emit white light; or all of the light-emitting devices 12 emit red light; or all of the light-emitting devices 12 emit green light; or all of the light-emitting devices 12 emit blue light.

[0458] 46 is a plan view of a light emitting substrate according to some embodiments; and FIG. 47 is a cross-sectional view of a light emitting substrate according to some embodiments, wherein FIG. 47 schematically shows a cross-sectional view taken along line LL in FIG. 46 .

[0459] 46 and 47 , the plurality of light-emitting devices 12 include a plurality of first light-emitting devices 121, a plurality of second light-emitting devices 122, and a plurality of third light-emitting devices 123. The support pillars 116 are further away from the surface of the substrate 110 than the surface of any of the first light-emitting devices 121, the second light-emitting devices 122, and the third light-emitting devices 123 are further away from the substrate 110. For example, the first light-emitting devices 121 may be red light-emitting devices, the second light-emitting devices 122 may be green light-emitting devices, and the third light-emitting devices 123 may be blue light-emitting devices.

[0460] Because the first light-emitting device 121, the second light-emitting device 122, and the third light-emitting device 123 have different light-emitting colors and their specific structures are different, the first light-emitting device 121, the second light-emitting device 122, and the third light-emitting device 123 have different sizes along the first direction X. For example, along the first direction X, the size of the first light-emitting device 121 is larger than the size of the second light-emitting device 122 and the size of the third light-emitting device 123.

[0461] In this case, a height difference between the first supporting column 1161 and the first light emitting device 121 is 0.5 μm-1 μm, and a height difference between the second supporting column 1162 and the first light emitting device 121 is 0.1 μm-3 μm.

[0462] For example, the height difference between the first supporting column 1161 and the first light emitting device 121 is 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, or 1 μm.

[0463] For example, the height difference between the second supporting column 1162 and the first light emitting device 121 is 0.1 μm, 0.15 μm, 0.2 μm, 0.25 μm, or 0.3 μm.

[0464] At least some embodiments of the present disclosure also provide a display device, which includes the light-emitting substrate as described above. The display device may include any device or product with a display function. For example, the display device may be a smart phone, a mobile phone, an e-book reader, a desktop computer (PC), a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (such as a head-mounted device, an electronic clothing, an electronic bracelet, an electronic necklace, an electronic accessory, an electronic tattoo, or a smart watch), a television, etc. In the description of this specification, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0465] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A light-emitting substrate, wherein: The light-emitting substrate includes a light-emitting area and a second peripheral area located on at least one side of the light-emitting area, and the light-emitting substrate includes: substrate; a plurality of pads, disposed on the substrate and located in the light-emitting area; a plurality of light-emitting devices, disposed on a side of the plurality of solder pads away from the substrate and in the light-emitting region, wherein one light-emitting device is connected to one solder pad; and at least one supporting structure, disposed on the substrate and located in the second peripheral area, the supporting structure and the light-emitting device being located on the same side of the substrate, Wherein, along a first direction, there is at least one support structure whose size is greater than or equal to the sum of the size of at least one pad and the size of the light-emitting device connected to the pad, and the first direction is perpendicular to the substrate.

2. The light-emitting substrate according to claim 1, wherein The plurality of pads are arranged in a plurality of rows and columns, at least one row includes a plurality of pads arranged along a second direction, and at least one column includes a plurality of pads arranged along a third direction, and the second direction and the third direction intersect; as well as The plurality of support structures are arranged in a row along the second direction, and / or the plurality of support structures are arranged in a column along the third direction.

3. The light-emitting substrate according to claim 2, wherein The light emitting devices connected to the plurality of pads emit the same light color, and the plurality of support structures include a plurality of support members; The multiple solder pads and the multiple support members are arranged into multiple rows and columns, at least one row includes solder pads and support members arranged along the second direction; and / or, at least one column includes solder pads and support members arranged along a third direction; along the second direction and / or the third direction, the spacing between two adjacent solder pads is a first spacing, the spacing between two adjacent support members is a second spacing, and the spacing between adjacent solder pads and support members is a third spacing; the first spacing, the second spacing and the third spacing are equal.

4. The light-emitting substrate according to claim 2, wherein A plurality of support members located on one side of the light emitting area are connected to form a continuous whole-layer structure.

5. The light-emitting substrate according to claim 2, wherein The plurality of light-emitting devices include a plurality of red light-emitting devices, a plurality of blue light-emitting devices, and a plurality of green light-emitting devices; the plurality of pads in the light-emitting area include a first pad, a plurality of second pads, and a plurality of third pads; the first pad is connected to the red light-emitting device, the second pad is connected to the blue light-emitting device, and the third pad is connected to the green light-emitting device; The plurality of support structures include a plurality of support members; the plurality of support members include at least one of a plurality of first support members, a plurality of second support members, and a plurality of third support members. The light-emitting substrate according to claim 5 , wherein: Each row includes the first pad, the second pad, and the third pad arranged along the second direction, and in an orthographic projection onto the substrate motherboard, the geometric center of the first pad, the geometric center of the second pad, and the geometric center of the third pad in each row are located on a first straight line; The plurality of support members are arranged in multiple rows and columns, each row comprising the first support member, the second support member, and the third support member arranged along the second direction, and in an orthographic projection onto the substrate motherboard, the geometric centers of the first support member, the second support member, and the third support member in each row are located on a second straight line; Here, at least one of the first straight lines coincides with one of the second straight lines and / or there is a distance between the first straight line and the second straight line.

7. The light-emitting substrate according to claim 6, wherein At least one first straight line coincides with one second straight line; Wherein, along the second direction, the distance between two adjacent first pads is equal to the distance between two adjacent first support members; and / or, Along the second direction, the distance between two adjacent second pads is equal to the distance between two adjacent second support members; and / or, Along the second direction, the distance between two adjacent third pads is equal to the distance between two adjacent third support members.

8. The light-emitting substrate according to claim 6 or 7, wherein The geometric center of the orthographic projection of each column of the first pads on the substrate motherboard is located on a third straight line, and the geometric center of the orthographic projection of each column of the first support members on the substrate motherboard is located on a fourth straight line, wherein at least one of the third straight lines coincides with one of the fourth straight lines and / or there is a gap between the first straight line and the second straight line; and / or, The geometric center of the orthographic projection of each column of the second solder pads on the substrate motherboard is located on a fifth straight line, and the geometric center of the orthographic projection of each column of the second support members on the substrate motherboard is located on a sixth straight line, wherein at least one of the fifth straight lines coincides with one of the sixth straight lines and / or there is a gap between the fifth straight line and the sixth straight line; and / or, The geometric center of the positive projection of each column of the third solder pads on the substrate motherboard is located on the seventh straight line, and the geometric center of the positive projection of each column of the third support members on the substrate motherboard is located on the eighth straight line, wherein at least one of the seventh straight lines coincides with one of the eighth straight lines and / or there is a distance between the seventh straight line and the eighth straight line.

9. The light-emitting substrate according to claim 8, wherein At least one third straight line coincides with a fourth straight line, and along the third direction, the distance between two adjacent first pads is equal to the distance between two adjacent first support members; and / or, At least one fifth straight line coincides with one sixth straight line, and along the third direction, the distance between two adjacent second pads is equal to the distance between two adjacent second support members; and / or, At least one seventh straight line coincides with one eighth straight line, and along the third direction, a distance between two adjacent third pads is equal to a distance between two adjacent third support members.

10. The light-emitting substrate according to any one of claims 6 to 9, wherein: The light-emitting devices connected to the pads belonging to the same column emit the same color, and a plurality of support members belonging to the same column are connected to form a strip structure.

11. The light-emitting substrate according to any one of claims 2 to 10, wherein: The support member is elastic, and a size of the support member is larger than a sum of a size of the solder pad and a size of the light emitting device connected to the solder pad.

12. The light-emitting substrate according to claim 2, wherein The plurality of support structures include a plurality of support columns, each of which is elastic, and a surface of each of the support columns away from the substrate is farther away from the substrate than a surface of each of the light-emitting devices away from the substrate.

13. The light-emitting substrate according to claim 12, wherein: The plurality of support pillars include a plurality of first support pillars and a plurality of second support pillars, wherein the first support pillars are further away from the substrate than the second support pillars are from the substrate surface. The light-emitting substrate according to claim 13 , wherein: In a second peripheral area located on one side of the light-emitting area along the second direction, the plurality of support columns are arranged into at least two columns of support columns, and in two adjacent columns of support columns, one column of support columns includes a plurality of first support columns sequentially spaced and arranged along the third direction, and the other column of support columns includes a plurality of second support columns sequentially spaced and arranged along the third direction; and / or In a second peripheral area located on one side of the light-emitting area along the third direction, a plurality of the support columns are arranged into at least two rows of support columns. In two adjacent rows of support columns, one row of support columns includes a plurality of the first support columns arranged in sequence along the second direction, and the other row of support columns includes a plurality of the second support columns arranged in sequence along the second direction.

15. The light-emitting substrate according to claim 13 or 14, wherein The distribution density of the second support columns is greater than the distribution density of the first support columns. The light-emitting substrate according to claim 15 , wherein: The area of ​​the orthographic projection of the second support pillar on the substrate is larger than the area of ​​the orthographic projection of the first support pillar on the substrate; and / or, The distance between the second support pillars adjacent to each other along the second direction is smaller than the distance between the first support pillars adjacent to each other along the second direction; and / or, A distance between adjacent second supporting columns along the third direction is smaller than a distance between adjacent first supporting columns along the third direction.

17. The light-emitting substrate according to any one of claims 13 to 16, wherein: The dimension of the first supporting column along the second direction is greater than or equal to the dimension of the light emitting device along the second direction; and / or, The dimension of the first supporting column along the third direction is greater than or equal to the dimension of the light emitting device along the third direction; and / or, The size of the second supporting column along the second direction is greater than or equal to the size of the light emitting device along the second direction; and / or, A dimension of the second supporting column along the third direction is greater than or equal to a dimension of the light emitting device along the third direction.

18. The light-emitting substrate according to any one of claims 13 to 16, wherein: The distance between the first supporting columns adjacent to each other along the second direction is greater than or equal to the distance between the light emitting devices adjacent to each other along the second direction; and / or, The spacing between the first supporting columns adjacent to each other along the third direction is greater than or equal to the spacing between the light emitting devices adjacent to each other along the third direction; and / or, The distance between the second supporting columns adjacent to each other along the second direction is greater than or equal to the distance between the light emitting devices adjacent to each other along the second direction; and / or, A distance between adjacent second supporting columns along the third direction is greater than or equal to a distance between adjacent light emitting devices along the third direction.

19. The light-emitting substrate according to any one of claims 13 to 18, wherein: The spacing between the first support pillars adjacent to each other along the second direction is equal to the spacing between the first support pillars adjacent to each other along the third direction; and / or, A distance between adjacent second supporting columns along the second direction is equal to a distance between adjacent second supporting columns along the third direction.

20. The light-emitting substrate according to any one of claims 12 to 19, wherein: The plurality of light-emitting devices include a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of third light-emitting devices, and the support column is farther away from the surface of the substrate than any of the first light-emitting devices, the second light-emitting devices, and the third light-emitting devices are farther away from the surface of the substrate.

21. The light-emitting substrate according to any one of claims 12 to 19, wherein: The shape of the orthographic projection of the support pillar on the substrate includes a circle or a rectangle; and / or, The size of the support pillar along the second direction is 20 μm-100 μm, and the size of the support pillar along the third direction is 20 μm-100 μm.

22. A driving motherboard, wherein: The driving motherboard has a plurality of light-emitting areas, and a spacer area is provided between two adjacent light-emitting areas; the driving motherboard includes: substrate motherboard; A plurality of solder pads are provided on the substrate motherboard and in the light emitting area; the solder pads are configured to be connected to the light emitting device; At least one supporting structure is arranged on the substrate motherboard and in the spacer area, and the supporting structure and the solder pad are located on the same side of the substrate motherboard; along a first direction, there is at least one supporting structure whose size is greater than or equal to the sum of the size of the solder pad and the size of the light-emitting device connected to the solder pad, and the first direction is perpendicular to the substrate motherboard.

23. The driving motherboard according to claim 22, wherein: The light-emitting motherboard further has a first peripheral area; the first peripheral area is arranged around the plurality of light-emitting areas, and at least one supporting structure is also arranged in the first peripheral area.

24. A light-emitting motherboard, wherein: The light-emitting motherboard has a plurality of light-emitting areas, and a spacer area is provided between two adjacent light-emitting areas. The light-emitting motherboard includes: substrate motherboard; A plurality of pads are provided on the substrate motherboard and in the light emitting area; A plurality of light-emitting devices are arranged on a side of the plurality of solder pads away from the substrate motherboard, and one light-emitting device is connected to one solder pad; At least one supporting structure is provided on the substrate motherboard and is located in the spacer area, wherein the supporting structure and the light emitting device are located on the same side of the substrate motherboard, Wherein, along a first direction, there is at least one support structure whose size is greater than or equal to the sum of the size of at least one pad and the size of the light-emitting device connected to the pad, and the first direction is perpendicular to the substrate.

25. A transfer substrate, wherein: The transfer substrate has a plurality of transfer areas, and a support area is provided between two adjacent transfer areas. The transfer substrate includes: Transferring the substrate; A plurality of light-emitting devices are located on the transfer substrate, and the light-emitting devices are located in the transfer area; at least one supporting structure located on the transfer substrate, the supporting structure located in the supporting area, and the supporting structure and the light emitting device located on the same side of the transfer substrate, Wherein, a surface of at least one of the supporting structures away from the transfer substrate is further away from the transfer substrate than a surface of the light-emitting device away from the transfer substrate.

26. A method for preparing a light-emitting motherboard, wherein: The preparation method comprises: A transfer substrate and a driving motherboard are provided; the driving motherboard has multiple light-emitting areas, with a spacer area between two adjacent light-emitting areas; the driving motherboard includes a base motherboard and multiple solder pads; the multiple solder pads are arranged on the base motherboard and arranged in the light-emitting areas; the transfer substrate includes a transfer substrate and multiple light-emitting devices; the multiple light-emitting devices are arranged on one side of the transfer substrate and connected to the transfer substrate; at least one of the transfer substrate and the driving motherboard includes at least one supporting structure; connecting the light-emitting device on the transfer substrate to the pad on the driving motherboard; the transfer substrate and the driving motherboard are arranged opposite to each other, the support structure of one of the transfer substrate and the driving motherboard abuts against the other, and the support structure is located in the spacer area; Remove the transfer substrate.

27. The preparation method according to claim 26, wherein The driving motherboard includes at least one supporting structure; the at least one supporting structure is arranged on a side of the substrate motherboard close to the plurality of pads; and the supporting structure is arranged in the spacer area.

28. The preparation method according to claim 26, wherein The transfer substrate has a plurality of transfer areas, and a support area is provided between two adjacent transfer areas. When the transfer substrate and the driving motherboard are arranged opposite to each other, the orthographic projection of the transfer area on the driving motherboard coincides with the light-emitting area. The transfer substrate includes a second substrate and at least one supporting structure; The at least one supporting structure is disposed on the second substrate; the supporting structure is disposed in the supporting area.

29. A display device, wherein: The display device includes the light-emitting substrate according to any one of claims 1 to 21.

Images